WO2018216076A1 - Machine de traitement de carte - Google Patents

Machine de traitement de carte Download PDF

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Publication number
WO2018216076A1
WO2018216076A1 PCT/JP2017/019050 JP2017019050W WO2018216076A1 WO 2018216076 A1 WO2018216076 A1 WO 2018216076A1 JP 2017019050 W JP2017019050 W JP 2017019050W WO 2018216076 A1 WO2018216076 A1 WO 2018216076A1
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WO
WIPO (PCT)
Prior art keywords
jet nozzle
molten solder
substrate
lead
jet
Prior art date
Application number
PCT/JP2017/019050
Other languages
English (en)
Japanese (ja)
Inventor
石川　信幸
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to JP2019519819A priority Critical patent/JP6732122B2/ja
Priority to PCT/JP2017/019050 priority patent/WO2018216076A1/fr
Publication of WO2018216076A1 publication Critical patent/WO2018216076A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the present invention relates to a substrate working machine that applies molten solder to leads of lead components inserted into a substrate.
  • Patent Document 1 there is a technique of applying molten solder to leads of lead components inserted into a substrate (for example, Patent Document 1).
  • molten solder is sprayed from the nozzle of the molten solder tank toward the lead inserted into the through hole of the substrate, so that the molten solder is applied to the lead. Solder to the board.
  • this soldering device adjusts the liquid level of the molten solder bath.
  • the soldering apparatus includes an arm that conveys the substrate to the molten solder bath. This arm is provided with a continuity sensor. When adjusting the height of the liquid level, the arm moves above the nozzle and descends to a position corresponding to the height of the liquid level set by the user.
  • the continuity sensor contacts the liquid level of the molten solder jetted from the nozzle of the molten solder tank and detects that the liquid level has reached a predetermined height.
  • the soldering device adjusts the height of the liquid level of the solder tank based on the detection information of the continuity sensor.
  • the operation when the molten solder is pulled away from the substrate or the lead is important for the soldering quality.
  • the quality of soldering referred to here is, for example, the degree of solder rise and the presence or absence of bubbles in the solder.
  • the quality of the soldering is deteriorated. For this reason, how to separate the molten solder from the substrate and the leads to improve the soldering quality is a problem.
  • an object of the present application is to provide an on-board working machine that can improve the soldering quality by changing the operation when the molten solder is pulled away from the board or the lead.
  • the present application is directed to a substrate holding device that holds a substrate having a penetrating portion and a lead component in which a lead is inserted into the penetrating portion, and the molten solder is jetted from a jet nozzle to be inserted into the penetrating portion.
  • an operation changing unit that changes the operation of the jet nozzle in the coating operation.
  • the operation changing unit includes a moving distance of the jet nozzle, a moving direction of the jet nozzle, and a moving speed of the jet nozzle. And changing the state of the molten solder applied to the leads by changing at least one of the operating conditions of movement acceleration of the jet nozzle It discloses a work machine.
  • the operation changing unit changes at least one of the four operating conditions such as the moving distance of the jet nozzle.
  • substrate or a lead can be changed, and the quality of soldering can be improved.
  • molten solder is applied collectively to two leads, and is a schematic view showing a state of an application operation as viewed from the upper surface of the circuit substrate. It is the schematic of the pattern which makes it approach again after separating a jet nozzle once, and pulling away molten solder after that. It is the schematic of the pattern which accelerates when separating a jet nozzle from a circuit base material, and pulls away molten solder. It is the schematic of the pattern which moves a jet nozzle in steps.
  • FIG. 1 shows a component mounter 10 according to this embodiment.
  • the component mounter 10 is a device for performing a component mounting operation on the circuit substrate 12.
  • the component mounting machine 10 includes an apparatus main body 20, a substrate conveyance holding device 22, a component mounting device 24, a mark camera 26, a parts camera 28, a component supply device 30, a loose component supply device 32, and a soldering device 36 (see FIG. 3). And a control device 38 (see FIG. 4).
  • Examples of the circuit base material 12 include a circuit board and a three-dimensional base material. Examples of the circuit board include a printed wiring board and a printed circuit board.
  • the apparatus main body 20 includes a frame portion 40 and a beam portion 42 that is overlaid on the frame portion 40.
  • the substrate conveyance holding device 22 is disposed in the center of the frame portion 40 in the front-rear direction, and includes a conveyance device 50 and a clamp device 52.
  • the transport device 50 is a device that transports the circuit substrate 12.
  • the clamp device 52 is a device that holds the circuit substrate 12. Thereby, the substrate conveyance holding device 22 conveys the circuit substrate 12 and holds the circuit substrate 12 at a predetermined work position. In the following description, the conveyance direction of the circuit substrate 12 shown in FIG.
  • X direction 1 is referred to as an X direction
  • a horizontal direction perpendicular to the X direction is referred to as a Y direction
  • a direction perpendicular to the X direction and the Y direction is referred to as Z direction.
  • Z direction a direction perpendicular to the X direction and the Y direction.
  • Z direction a direction perpendicular to the X direction and the Y direction.
  • Z direction This will be described as a direction.
  • the width direction of the component mounter 10 is the X direction.
  • the front-rear direction of the component mounter 10 is the Y direction.
  • the component mounting device 24 is disposed in the beam portion 42 and includes two work heads 60 and 62 and a work head moving device 64. As shown in FIG. 2, suction nozzles 66 are provided on the lower end surfaces of the work heads 60 and 62. Each of the work heads 60 and 62 sucks and holds the component by the suction nozzle 66. Further, the work head moving device 64 has an X direction moving device 68, a Y direction moving device 70, and a Z direction moving device 72. Then, the two working heads 60 and 62 are integrally moved to arbitrary positions on the frame portion 40 by the X-direction moving device 68 and the Y-direction moving device 70.
  • the work heads 60 and 62 are detachably attached to the sliders 74 and 76, respectively.
  • the Z-direction moving device 72 moves the sliders 74 and 76 individually in the vertical direction. That is, the work heads 60 and 62 are individually moved in the vertical direction by the Z-direction moving device 72.
  • the mark camera 26 is attached to the slider 74 while facing downward, and is moved together with the work head 60 in the X direction, the Y direction, and the Z direction. As a result, the mark camera 26 images an arbitrary position on the frame unit 40. As shown in FIG. 1, the parts camera 28 is disposed between the base material conveyance holding device 22 and the component supply device 30 on the frame portion 40 so as to face upward. Thereby, the parts camera 28 images the parts sucked and held by the suction nozzles 66 of the work heads 60 and 62.
  • the component supply device 30 is disposed at one end (front side) of the frame portion 40 in the front-rear direction.
  • the component supply device 30 includes, for example, a tray-type component supply device 78 and a feeder-type component supply device 80 (see FIG. 4).
  • the tray-type component supply device 78 is a device that supplies components placed on the tray.
  • the feeder-type component supply device 80 is a device that supplies components by a tape feeder or a stick feeder (not shown).
  • the bulk component supply device 32 is disposed at the end portion on the other side (rear side) of the frame portion 40 in the front-rear direction.
  • the separated component supply device 32 is a device for aligning a plurality of components scattered in a separated state and supplying the components in an aligned state. That is, it is an apparatus that aligns a plurality of components in an arbitrary posture into a predetermined posture and supplies the components in a predetermined posture.
  • Examples of components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components, power module components, and the like.
  • electronic circuit parts there are parts having leads (radial parts and axial parts), parts having no leads, and the like.
  • the soldering device 36 is disposed below the transfer device 50, and includes a jet device 100 and a jet device moving device 102 as shown in FIG.
  • the jet device 100 includes a soldering iron 106, a jet nozzle 108, and a nozzle cover 110.
  • the solder rod 106 has a generally rectangular parallelepiped shape, and molten solder is stored therein.
  • the jet nozzle 108 is erected on the upper surface of the soldering iron 106. Then, by the operation of a pump (not shown), the molten solder is pumped up from the soldering iron 106, and the molten solder jets upward from the upper end portion of the jet nozzle 108.
  • the nozzle cover 110 is generally cylindrical and is disposed on the upper surface of the soldering iron 106 so as to surround the jet nozzle 108. Then, the molten solder jetted from the upper end portion of the jet nozzle 108 passes between the outer peripheral surface of the jet nozzle 108 and the inner peripheral surface of the nozzle cover 110 and returns to the inside of the solder rod 106.
  • the jet device moving device 102 includes a slider 112, an X direction moving device 114, a Y direction moving device 116, and a Z direction moving device 118.
  • the slider 112 is generally plate-shaped.
  • a jet device 100 is disposed on the upper surface of the slider 112.
  • the X-direction moving device 114 moves the slider 112 in the conveyance direction of the circuit base material 12 by the conveyance device 50, that is, in the X direction.
  • the Y direction moving device 116 moves the slider 112 in the Y direction.
  • the Z-direction moving device 118 moves the slider 112 in the Z direction, that is, the up-down direction. Accordingly, the jet device 100 moves to an arbitrary position below the transport device 50 by the operation of the jet device moving device 102.
  • the control device 38 includes a controller 152, a plurality of drive circuits 154, an image processing device 156, and a storage device 157.
  • the plurality of drive circuits 154 include the transport device 50, the clamp device 52, the work heads 60 and 62, the work head moving device 64, the tray-type component supply device 78, the feeder-type component supply device 80, the bulk component supply device 32, the jet flow. It is connected to the apparatus 100, the jet apparatus moving apparatus 102, and the display operation part 159 mentioned later.
  • the controller 152 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 154.
  • the controller 152 is also connected to the image processing device 156.
  • the image processing device 156 processes image data obtained by the mark camera 26 and the part camera 28.
  • the controller 152 acquires various information from the image data of the mark camera 26 and the part camera 28.
  • the storage device 157 includes, for example, a hard disk and a memory.
  • the controller 152 of the present embodiment reads the control data D1 stored in the storage device 157 and executes a component mounting operation on the circuit substrate 12.
  • the control data D1 for example, data such as the type of circuit base 12 to be produced, the type of parts to be mounted, the mounting position of the parts on the circuit base 12 and the like are set.
  • data of a plurality of types of patterns are stored as operation patterns of the jet nozzle 108 in a molten solder application operation described later.
  • the controller 152 changes the operation of the jet nozzle 108 in the coating operation according to the type of pattern.
  • the component mounter 10 includes a display operation unit 159 as shown in FIG.
  • the display operation unit 159 is disposed on the rear end surface of the bulk component supply device 32.
  • the display operation unit 159 is, for example, a touch panel, and includes a liquid crystal panel, a light source such as an LED that emits light from the back side of the liquid crystal panel, a contact sensing film bonded to the surface of the liquid crystal panel, and the like.
  • the user can select the pattern type for changing the operation of the jet nozzle 108 by operating the display operation unit 159. For example, the user can confirm the degree of solder rise of the circuit base material 12 that has been mounted by the component mounter 10 and can change the pattern as necessary.
  • the controller 152 may be configured to accept only whether or not to change the operation (pattern) of the jet nozzle 108 instead of accepting selection from the user as to which of the patterns is to be executed. In this case, for example, when the display operation unit 159 receives an operation for changing the pattern being executed, the controller 152 may change the pattern in accordance with a preset order. Thereby, the user can change the operation of the jet nozzle 108 only by giving an instruction to change the pattern.
  • the component mounter 10 of the present embodiment performs a component mounting operation on the circuit substrate 12 held by the substrate conveyance holding device 22 with the above-described configuration.
  • the component mounter 10 can mount various components on the circuit base 12, but in the following description, a component having a lead (hereinafter may be abbreviated as “lead component”). The case where it mounts
  • the transport device 50 carries the circuit base material 12 into the component mounter 10 from, for example, a device upstream of the production line based on the control of the controller 152.
  • the conveyance device 50 conveys the circuit substrate 12 to the work position.
  • the clamp device 52 holds the circuit substrate 12 at this working position.
  • the mark camera 26 moves above the circuit base 12 based on the control of the controller 152 and images the circuit base 12. Thereby, the information regarding the holding position etc. of the circuit base material 12 is obtained. Further, the component supply device 30 or the bulk component supply device 32 supplies lead components at a predetermined supply position. Then, one of the work heads 60 and 62 moves above the lead component supply position, and the lead component is held by the suction nozzle 66.
  • FIG. 5 shows a state in which the lead 144 of the lead component 140 sucked and held by the suction nozzle 66 is inserted into the through hole 148 of the circuit substrate 12.
  • FIG. 5 shows a state where the molten solder 150 is jetted from the jet nozzle 108 toward the lead 144 inserted in the through hole 148.
  • the lead component 140 includes, for example, a component main body 142 and two leads 144 extending from the bottom surface 142A of the component main body 142.
  • the lead component 140 is suction-held by the suction nozzle 66 on the upper surface 142B of the component main body 142 opposite to the bottom surface 142A to which the lead 144 is attached.
  • FIG. 5 shows a state in which the lead component 140 is viewed from the side, and only one of the two leads 144 and the two through holes 148 is illustrated.
  • a case where the molten solder 150 is applied to only one lead 144 will be described as an example.
  • the case where the molten solder 150 is applied to the plurality of leads 144 will be described later.
  • the work heads 60 and 62 move to above the parts camera 28 while holding the lead component 140 after the lead component 140 is sucked by the suction nozzle 66 at the supply position.
  • the parts camera 28 images the lead component 140 held by the suction nozzle 66. Thereby, information on the holding position of the lead component 140 and the like is obtained.
  • the work heads 60 and 62 holding the lead component 140 move above the circuit substrate 12.
  • the controller 152 corrects an error in the holding position of the circuit base 12, an error in the holding position of the lead component 140, and the like while the work heads 60 and 62 are moving.
  • the lead 144 of the lead component 140 sucked and held by the suction nozzle 66 is inserted into the through hole 148 formed in the circuit substrate 12.
  • the insertion amount of the lead 144 is set in the control data D1 for each type of the lead component 140. Specifically, for example, in the lead component 140 in which the lead 144 is inserted into the through-hole 148 until the bottom surface 142A of the component main body 142 comes into contact with the base material top surface 12A of the circuit base material 12, the insertion amount is large. In addition, in the lead component 140 in which the lead 144 is inserted into the through hole 148 so that the bottom surface 142A of the component main body 142 and the substrate top surface 12A of the circuit substrate 12 are maintained apart, the insertion amount is small. . As described above, the insertion amount of the lead 144 is set in the control data D1 for each type of the lead component 140.
  • the lead 144 is inserted into the through-hole 148 so that the bottom surface 142A of the component main body 142 and the substrate top surface 12A of the circuit substrate 12 are maintained apart from each other will be described. To do. In this case, the lead 144 is inserted into the through hole 148 in a state where the component main body 142 of the lead component 140 is lifted from the circuit substrate 12.
  • the jet device 100 When the working heads 60 and 62 described above move above the circuit base 12 and insert the leads 144 into the through holes 148 of the circuit base 12, the jet device 100 is located below the circuit base 12 (through holes 148). Has moved to.
  • the jet device 100 is disposed below the circuit base 12, causes the molten solder 150 to jet from the jet nozzle 108 toward the base lower surface 12 ⁇ / b> B of the circuit base 12, and is inserted into the lead 144.
  • a molten solder 150 is applied to the substrate.
  • the controller 152 of the present embodiment operates the jet nozzle 108 in the coating operation in accordance with the pattern data selected by the user among the plurality of patterns set in the control data D1. Change the contents. An example of each pattern will be described below.
  • FIG. 6 shows a pattern in which the jet nozzle 108 and the lead 144 are separated from each other at the central portion of the molten solder 150 and the molten solder 150 is separated.
  • a direction X direction or the like
  • the lead 144 of the lead component 140 sucked and held by the suction nozzle 66 is inserted into the through hole 148 formed in the circuit substrate 12.
  • the jet device 100 located below the through-hole 148 is directed toward the circuit substrate 12 along the Z direction. Moving upward, the jet nozzle 108 of the jet device 100 is brought close to the tip of the lead 144 inserted into the through hole 148.
  • the approach speed along the Z direction of the jet nozzle 108 at this time that is, the moving speed for raising the jet apparatus 100 (jet nozzle 108) is set in the pattern data of the control data D1.
  • the movement acceleration of the jet nozzle 108 may be set in the control data D1.
  • the jet device 100 starts jetting the molten solder 150 from the tip of the jet nozzle 108 when the jet device 100 moves below the circuit substrate 12, for example. For this reason, when the jet device 100 is raised by a predetermined distance, the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144.
  • the ascending moving direction for example, the Z direction
  • the moving distance for moving in the Z direction are set in the pattern data of the control data D1.
  • the jet device 100 stops when it rises to a predetermined height, for example, and maintains its height (position in the Z direction) and stops. At the raised position, the molten solder 150 is jetted from the suction nozzle 66 toward the lead 144, and the molten solder 150 is applied to the leading end portion of the lead 144 and the through hole 148 of the circuit substrate 12.
  • FIG. 7 schematically shows the state of the application work as seen from the substrate upper surface 12A of the circuit substrate 12.
  • the center portion of the molten solder 150 jetted from the jet nozzle 108 (see FIG. 6) is aligned with the position of the lead 144. It has become.
  • the diameter L1 of the molten molten solder 150 shown in FIG. 7 is, for example, 6 mm to 10 mm.
  • the controller 152 moves the jet nozzle 108 in a direction away from the circuit substrate 12 with the position of the lead 144 aligned with the central portion (see S2 in FIG. 6). For example, the controller 152 lowers the jet nozzle 108 along the Z direction without changing the positions in the X direction and the Y direction (S2).
  • the molten solder 150 when the molten solder 150 is pulled away from the circuit substrate 12 or the lead 144, the central portion of the molten solder 150 jetted from the jet nozzle 108, that is, the apex portion of the molten solder 150 jetted from the jet nozzle 108.
  • the molten solder 150 can be pulled away from the lead 144 and the circuit substrate 12.
  • the molten solder 150 jetted from the tip of the jet nozzle 108 moves upward and then falls scattered around (in the X direction and the Y direction) to lower the jet nozzle 108. It flows between the outer peripheral surface and the inner peripheral surface of the nozzle cover 110 and returns to the inside of the soldering iron 106 (see FIG. 3). Therefore, in the central portion (vertex portion) of the molten solder 150 in a plan view shown in FIG. 7, the molten solder 150 jetted upward from the jet nozzle 108 rises to the highest position in the Z direction. Moreover, since the moving direction of the molten solder 150 turns from the upper side to the lower side in the central portion, the convection speed of the molten solder 150 is likely to be slow.
  • the molten solder 150 scattered and descending moves in the X direction and the Y direction, and moves in a direction away from the circuit substrate 12 (downward in the Z direction) according to gravity acceleration or the like. .
  • the molten solder 150 jetted from the jet nozzle 108 is likely to increase the speed of convection as it moves away from the center in the X direction or the Y direction.
  • the convection velocity is likely to be higher in the end portions in the X direction and the Y direction than in the central portion (upper end portion in the Z direction).
  • the central portion is closer to the tip of the jet nozzle 108, that is, the opening of the jet nozzle 108, compared to the molten solder 150 scattered and descending around. For this reason, the temperature of the molten solder 150 is high in the central portion, and is likely to decrease as it is scattered around and away from the center. In other words, there is a high possibility that the temperature of the molten solder 150 that is scattered and scattered around the periphery, that is, the molten solder 150 at the end portion in the X direction or the Y direction, becomes low.
  • the controller 152 of this embodiment can improve the soldering quality by changing the positional relationship among the jet nozzle 108, the molten solder 150, and the lead 144.
  • the soldering quality refers to, for example, the degree of solder rising and the presence or absence of bubbles in the molten solder 150 after soldering. For example, it is whether or not the shape of the molten solder 150 after soldering is a taper shape downward from the substrate lower surface 12B of the circuit substrate 12 (see FIG. 9). Alternatively, it is whether or not the molten solder 150 is sufficiently filled in the through hole 148. Further, whether or not bubbles are generated in the molten solder 150 filled in the through holes 148 is determined.
  • the quality of such soldering varies depending on the type of molten solder 150, room temperature, humidity, and the like, but also varies greatly depending on the operation when the molten solder 150 is pulled away from the lead 144 and the circuit substrate 12 during the coating operation. To do. Therefore, the controller 152 of the present embodiment can switch the plurality of patterns, change the operation when separating them, and improve the soldering quality.
  • the time for stopping the jet device 100 at the position where the jet device 100 is raised is set in the pattern data of the control data D1.
  • the controller 152 measures, for example, the time from reaching the ascending position until the jet nozzle 108 is separated from the circuit substrate 12, that is, the time for applying the molten solder 150 to the lead 144, and is set in the pattern data. After a lapse of time, the jet nozzle 108 (jet device 100) starts to descend. Therefore, the controller 152 can also improve the quality of soldering by changing the stop time at the raised position. Note that the controller 152 may immediately lower the jet nozzle 108 without stopping it at the raised position.
  • the controller 152 continues the jet of the molten solder 150 from the jet nozzle 108 even when the jet device 100 is lowered in S2 of FIG. Thereby, the molten solder 150 and the lead 144 that are jetted are separated at the above-described central portion, and the application of the molten solder 150 to the lead 144 is completed.
  • the moving speed for lowering the jet device 100 (jet nozzle 108) is set in the pattern data of the control data D1. Further, instead of the downward movement speed or in addition to the movement speed, the movement acceleration of the jet nozzle 108 may be set in the control data D1.
  • the controller 152 of the present embodiment maintains the suction holding of the lead component 140 by the suction nozzle 66 even after the operation of applying the molten solder 150 to the lead 144 is finished.
  • the controller 152 releases the holding of the lead component 140 by the suction nozzle 66.
  • the controller 152 may release the suction holding of the lead component 140 by the suction nozzle 66 after inserting the lead 144 into the through hole 148, that is, before applying the molten solder 150.
  • the controller 152 may change the timing of releasing the suction of the lead component 140 according to the required mounting accuracy of the lead component 140, for example. Therefore, the controller 152 can improve the soldering quality also by changing the state of the suction holding.
  • the lead component 140 is mounted on the circuit substrate 12 in a state where the component main body 142 is lifted from the circuit substrate 12.
  • the mounted lead component 140 is soldered to the circuit substrate 12.
  • the lead 144 and the circuit base 12 are electrically connected to each other. A circuit is formed.
  • FIG. 10 shows a pattern in which the jet nozzle 108 and the lead 144 are separated from each other at the end portion of the molten solder 150 and the molten solder 150 is pulled away.
  • the jet device 100 located below the through-hole 148 moves upward toward the circuit substrate 12 along the Z direction and is inserted into the through-hole 148.
  • the jet nozzle 108 of the jet device 100 is brought close to the tip of the lead 144.
  • the jet device 100 is raised by a predetermined distance, the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144.
  • FIG. 8 schematically shows the state of the application work as viewed from the substrate upper surface 12 ⁇ / b> A of the circuit substrate 12. As shown in FIG. 8, in this pattern, when the circuit substrate 12 is viewed in plan, first, the central portion of the molten solder 150 that is jetted from the jet nozzle 108 is aligned with the position of the lead 144. .
  • the controller 152 moves the jet nozzle 108 in a direction away from the circuit base material 12 with the position of the lead 144 aligned with the end portion (S6 in FIG. 10). For example, the controller 152 lowers the jet nozzle 108 along the Z direction without changing the positions in the X direction and the Y direction (S6).
  • the molten solder 150 when the molten solder 150 is pulled away from the circuit substrate 12 or the lead 144, the molten solder 150 can be pulled away from the lead 144 or the like at the end portion of the molten solder 150 jetted from the jet nozzle 108. That is, the molten solder 150 can be pulled away from the lead 144 or the like at a portion that moves (drops) in a direction away from the circuit substrate 12 after being jetted from the jet nozzle 108 toward the circuit substrate 12. As described above, the end portion has a high convection speed of the molten solder 150, and the temperature of the molten solder 150 is likely to be low. In this way, by changing the position to be separated and changing the state of the molten solder 150, improvement in soldering quality can be expected.
  • the controller 152 continues the jet of the molten solder 150 from the jet nozzle 108 even when the jet device 100 is lowered in S6. Thereby, the molten solder 150 and the lead 144 are separated from each other at the end portion described above, and the application of the molten solder 150 to the lead 144 is completed.
  • the lead component 140 is mounted on the circuit substrate 12 in a state where the component main body 142 is lifted from the circuit substrate 12.
  • the soldering quality is changed.
  • the desired quality cannot be obtained with the pattern separated at the center portion described above
  • the user can obtain the desired quality by changing the pattern to be separated at the end portion.
  • the desired quality cannot be obtained with the pattern separated at the end portion
  • the user can obtain the desired quality by changing to the pattern separated at the center portion.
  • the user can select the type of pattern for changing the operation of the jet nozzle 108 by operating the display operation unit 159. It was verified that this pattern is likely to improve the soldering quality among various patterns that change the operating conditions such as the moving distance, moving direction, moving speed, and moving acceleration of the jet nozzle 108. It is a pattern. In this case, the user can improve the soldering quality by changing the operating condition simply by selecting one of a plurality of verified highly reliable patterns. Further, the user need not verify the contents of the operating conditions. Note that the above-described pattern is not limited to a pattern verified by a manufacturer or the like, and may be a pattern with a track record of improving soldering quality in use by a user, for example.
  • the soldering device 36 is in the X and Y directions (plane direction) parallel to the plane of the circuit substrate 12 and the Z direction (orthogonal direction) orthogonal to the plane of the circuit substrate 12.
  • the jet nozzle 108 (jet device 100) is configured to be movable. According to this, for example, by restricting the moving direction of the jet nozzle 108 that is the target of changing the operating condition to two directions of X, Y direction (plane direction) and Z direction (orthogonal direction), the operating condition It is possible to simplify the control contents for changing the processing load of the controller 152 in the application work.
  • FIG. 11 shows a case where the molten solder 150 is applied to the two leads 144 together.
  • FIG. 12 schematically shows the state of the application work when the molten solder 150 is applied to the two leads 144 and viewed from the substrate upper surface 12 ⁇ / b> A of the circuit substrate 12.
  • the width of the jet nozzle 108 in the X direction that is, the diameter L1 (see FIG. 12) of the jetted molten solder 150 is compared with the pitch L2 (see FIG. 12) of the two leads 144. Is large enough.
  • the central portion of the molten solder 150 that is jetted from the jet nozzle 108 is aligned with the positions of the two leads 144. Can do.
  • the molten solder 150 can be pulled away from the two leads 144 at the central portion of the molten solder 150 jetted from the jet nozzle 108.
  • FIG. 13 schematically shows the state of the application work when the molten solder 150 is applied to the two leads 144 and viewed from the upper surface 12 ⁇ / b> A of the circuit substrate 12.
  • the end portion of the molten solder 150 jetted from the jet nozzle 108 is set to the position of the two leads 144 at the raised position.
  • the jet nozzle 108 is the other edge part from the position which match
  • FIG. 14 shows a pattern in which the jet nozzle 108 is once separated and then approached again, and then the molten solder 150 is pulled away.
  • the jet device 100 located below the through-hole 148 moves upward toward the circuit substrate 12 along the Z direction and is inserted into the through-hole 148.
  • the jet nozzle 108 of the jet device 100 is brought close to the tip of the lead 144.
  • the jet device 100 is raised by a predetermined distance, the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144.
  • the jet device 100 rises to a height close to the tip of the lead 144 and then descends by a predetermined distance (S11). For example, the jet device 100 moves downward by a predetermined distance along the Z direction while fixing the positions in the X direction and the Y direction. For example, when the jet device 100 is lowered by a predetermined distance, the molten solder 150 jetted from the jet nozzle 108 reaches the tip of the lead 144. That is, the molten solder 150 is applied to the lead 144 even at the position where the predetermined distance is set to a short distance and lowered in S11.
  • the molten solder 150 jetted from the jet nozzle 108 does not have to reach the tip of the lead 144. That is, the molten solder 150 and the lead 144 may be separated as S12 descends. In this case, the molten solder 150 once separated is applied to the same lead 144 again.
  • the lowered jet device 100 is raised again toward the circuit substrate 12 (S12).
  • the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144.
  • the jet device 100 moves upward by a predetermined distance along the Z direction while fixing the positions in the X direction and the Y direction.
  • the predetermined distance in S12 is, for example, the same distance as S11. That is, the jet flow device 100 is raised at S12 by the distance lowered at S11.
  • the jet device 100 may be lifted at S12 by a short moving distance compared to the moving distance lowered at S11. In this case, the jet device 100 that has been lifted in S12 has a lower position than the position that has been lifted in S11.
  • the controller 152 raises the jet device 100 again in S12, and then moves the jet device 100 (jet nozzle 108) in a direction away from the circuit substrate 12 (S13). For example, the controller 152 lowers the jet nozzle 108 along the Z direction without changing the positions in the X direction and the Y direction (S13).
  • the controller 152 continues the jet of the molten solder 150 from the jet nozzle 108 even when the jet device 100 is lowered in S13. Thereby, the molten solder 150 and the lead 144 are separated from each other at the above-described central portion, and the application of the molten solder 150 to the lead 144 is completed.
  • the controller 152 executes the descending of S11 and the ascending of S12 once, but may be performed a plurality of times. That is, the jet nozzle 108 may be moved up and down a plurality of times. Thereby, the further improvement of the solder rising condition, etc. can be expected. Further, the controller 152 may control the jet device 100 (soldering device 36) so that the molten solder 150 and the lead 144 are separated at the end portion in the above-described rising pattern. The controller 152 may change the moving speed and moving acceleration of the jet device 100 (jet nozzle 108) in each of S10 to S13 described above to different speeds.
  • FIG. 15 shows a pattern in which the jet nozzle 108 is accelerated when being separated from the circuit substrate 12 and the molten solder 150 is separated from the leads 144 and the like.
  • the jet device 100 located below the through-hole 148 moves upward toward the circuit substrate 12 along the Z direction and is inserted into the through-hole 148.
  • the jet nozzle 108 of the jet device 100 is brought close to the tip of the lead 144.
  • the jet device 100 is raised by a predetermined distance, the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144.
  • the jet device 100 maintains its height (position in the Z direction) after rising to a predetermined height.
  • the jet device 100 starts moving in a direction away from the circuit substrate 12.
  • the jet device 100 descends along the Z direction while fixing the positions in the X direction and the Y direction.
  • the controller 152 slowly lowers the jet nozzle 108 (jet device 100) at the initial stage of lowering (S16).
  • the controller 152 lowers the jet nozzle 108 at a slow speed (S16), and then increases the speed at which the jet nozzle 108 descends. That is, the controller 152 increases the movement speed in the later period (S17) as compared to the movement speed in the initial stage (S16) in the descent.
  • the jet device 100 descends and the upper end of the molten solder 150 to be jetted approaches the tip (lower end) of the lead 144, the jet device 100 increases the descending speed. Accordingly, when the upper end (vertex) of the molten solder 150 and the tip of the lead 144 are separated, they can be quickly separated. As a result, as shown in FIG. 9, the shape of the molten solder 150 applied to the lead 144 is tapered from the lower surface 12B of the substrate toward the lower side, that is, a shape standing upright from the lower surface 12B of the substrate. it can. Therefore, improvement in soldering quality can be expected.
  • controller 152 continues the jet of the molten solder 150 from the jet nozzle 108 also when lowering the jet apparatus 100 in S17. Thereby, the molten solder 150 and the lead 144 are separated from each other, and the application of the molten solder 150 to the lead 144 is completed.
  • the controller 152 may change the movement acceleration instead of the movement speed of the jet nozzle 108 or in addition to the movement speed. For example, the controller 152 may increase the movement acceleration in S17 compared to the movement acceleration in S16. Moreover, the controller 152 may make the moving speed of S17 slower than the moving speed of S16. That is, the movement speed in the latter period may be made slower than the initial movement speed of the descent. Thereby, the upper end of the molten solder 150 and the tip of the lead 144 can be slowly separated. As a result, improvement in soldering quality can be expected by changing the operation of the jet nozzle 108. Further, the controller 152 shifts from S16 to S17 and accelerates by one step, but may accelerate by a plurality of steps. Further, the controller 152 may control the jet device 100 so that the molten solder 150 and the lead 144 are separated at the end portion shown in FIG.
  • FIG. 16 shows a pattern in which the jet nozzle 108 is moved stepwise.
  • the jet device 100 located below the through-hole 148 moves upward toward the circuit substrate 12 along the Z direction and is inserted into the through-hole 148.
  • the jet nozzle 108 of the jet device 100 is brought close to the tip of the lead 144.
  • the jet device 100 is raised by a predetermined distance, the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144.
  • the jet device 100 moves up to a predetermined height, and then moves by a predetermined distance along the X direction while maintaining the height (position in the Z direction) (S20). Furthermore, after moving in the X direction, the jet device 100 descends along the Z direction by a predetermined distance (S20).
  • the controller 152 causes the jet device 100 to repeatedly execute the movement in the X direction and the movement in the Z direction. As shown in FIG. 16, the jet device 100 moves away from the circuit substrate 12 while descending stepwise.
  • the single movement in each of the X direction and the Z direction is executed within a range where the molten solder 150 and the lead 144 are not separated.
  • the one-time movement distance in the X direction is set, for example, as a distance between the center and the end of the jetted molten solder 150 in a plan view shown in FIG. 7, that is, a distance obtained by dividing a half (radius) of the diameter L1. it can.
  • the jet nozzle 108 moves by changing the position where the lead 144 and the molten solder 150 are in contact from the center of the molten solder 150 toward the end in a plurality of stages.
  • the one-time movement distance in the Z direction is, for example, between the position of the upper end where the jet apparatus 100 is raised in S19 and the position where the jet apparatus 100 is lowered until the lead 144 and the molten solder 150 are separated.
  • a distance obtained by dividing the distance can be set.
  • the jet nozzle 108 moves in a plurality of stages from the position where the molten solder 150 is applied to the lead 144 to the position where the lead 144 and the molten solder 150 are separated.
  • the controller 152 separates the molten solder 150 and the lead 144 while moving the jet nozzle 108 (jet device 100) stepwise.
  • the controller 152 moves the jet nozzle 108 in the X direction (plane direction) parallel to the plane of the circuit substrate 12 and the Z direction (orthogonal direction) orthogonal to the plane of the circuit substrate 12.
  • the jet device 100 is controlled so as to alternately repeat the movement of the jet nozzle 108 in the direction away from the circuit substrate 12 (downward). According to this, when the molten solder 150 is pulled away from the circuit substrate 12 or the lead 144, the jet nozzle 108 can be moved stepwise in a direction away from the circuit substrate 12. As a result, improvement in soldering quality can be expected by changing the operation at the time of separating the lead 144 and the molten solder 150.
  • the controller 152 of the control apparatus 38 has the application part 160, the operation
  • the application unit 160 is a functional unit for performing an application operation of applying the molten solder 150 to the lead 144 inserted into the through hole 148 by the jet device 100.
  • the operation changing unit 162 is a functional unit for changing the operation of the jet nozzle 108 in the application operation of the application unit 160.
  • the receiving unit 164 is a functional unit for receiving which pattern data of the plurality of patterns of data (control data D1) for changing the operation of the jet nozzle 108 is to be executed by the operation changing unit 162.
  • the component mounting machine 10 is an example of a substrate working machine.
  • the through hole 148 is an example of a through part.
  • the circuit base 12 is an example of a substrate.
  • the substrate conveyance holding device 22 is an example of a substrate holding device.
  • the soldering device 36 is an example of a jet device.
  • the controller 152 (application unit 160) of the control device 38 causes the molten solder 150 to jet from the jet nozzle 108 of the jet device 100 to the lead 144 inserted into the through hole 148 (through portion) of the circuit base 12 (substrate). Apply.
  • the controller 152 (operation change unit 162) changes the operation of the jet nozzle 108 in the application work by the application unit 160.
  • the operation changing unit 162 changes at least one of the four operating conditions of the moving distance, moving direction, moving speed, and moving acceleration of the jet nozzle 108. Thereby, the operation
  • the component mounting apparatus 10 that includes the component mounting device 24 and mounts the lead component 140 on the circuit base 12 by the work heads 60 and 62 is employed as the substrate working machine of the present application.
  • the substrate working machine of the present application may have a configuration in which, for example, the molten solder 150 is simply applied without performing the mounting operation of the lead component 140.
  • the substrate working machine may be configured to carry in the circuit base material 12 on which the lead component 140 has already been mounted and to perform only the soldering.
  • the substrate work machine may not include the component mounting device 24 and the component supply device 30.
  • the control data D1 data for changing at least one of the operating conditions of the moving distance, moving direction, moving speed, and moving acceleration of the jet nozzle 108 is set in a plurality of patterns.
  • the control data D1 may have a configuration having only one pattern to be changed.
  • control data D1 does not have to have data of a preset pattern.
  • the control device 38 may be configured such that the control data D1 can be changed by the user.
  • the user does not select the pattern but directly changes the control data D1, that is, by changing the length of the moving distance of the jet nozzle 108, the magnitude of the moving speed, and the like. It becomes possible to change the operation.
  • the controller 152 moves the jet nozzle 108 in a plane direction (X direction, Y direction) parallel to the plane of the circuit substrate 12 and an orthogonal direction (Z direction) orthogonal to the plane, but this is not limitative. Absent.
  • the controller 152 may move the jet nozzle 108 in an oblique direction that forms a predetermined angle with respect to the plane of the circuit substrate 12. Also in this case, the operation of pulling the molten solder 150 away from the lead 144 is changed, and improvement in soldering quality can be expected.
  • the lead component 140 is mounted on the circuit substrate 12 with the component body 142 floating from the circuit substrate 12, but the component body 142 is in contact with the circuit substrate 12. The lead component 140 may be attached to the circuit substrate 12.
  • the through-hole 148 was employ
  • the penetration part should just penetrate the circuit base material 12 in the up-down direction, and a notch etc. may be sufficient as it.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

La présente invention concerne une machine de traitement de carte, pouvant modifier un fonctionnement lors de la séparation de brasure fondue d'une carte ou d'un conducteur, et pouvant améliorer la qualité de brasage. Selon la présente invention, un dispositif de commande comprend : une partie revêtement permettant d'effectuer un travail de revêtement de façon à revêtir d'une brasure fondue un fil inséré dans une partie de pénétration au moyen d'un dispositif de projection; et une partie de modification de fonctionnement permettant de modifier le fonctionnement d'une buse de projection dans le travail de revêtement. La partie de modification de fonctionnement modifie au moins une condition de fonctionnement parmi des conditions de fonctionnement comprenant la distance de déplacement, la direction de déplacement, la vitesse de déplacement et l'accélération de déplacement de la buse de projection, et modifie l'état de la brasure fondue revêtue sur le fil.
PCT/JP2017/019050 2017-05-22 2017-05-22 Machine de traitement de carte WO2018216076A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019519819A JP6732122B2 (ja) 2017-05-22 2017-05-22 対基板作業機
PCT/JP2017/019050 WO2018216076A1 (fr) 2017-05-22 2017-05-22 Machine de traitement de carte

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/019050 WO2018216076A1 (fr) 2017-05-22 2017-05-22 Machine de traitement de carte

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WO2018216076A1 true WO2018216076A1 (fr) 2018-11-29

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JP (1) JP6732122B2 (fr)
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011228635A (ja) * 2010-03-31 2011-11-10 Panasonic Corp ポイント半田ｎｃデータ作成方法と自動半田装置
JP2013254888A (ja) * 2012-06-08 2013-12-19 Sensbey Co Ltd 選択はんだ付けシステム
WO2016135891A1 (fr) * 2015-02-25 2016-09-01 富士機械製造株式会社 Appareil de brasage
JP2016178283A (ja) * 2015-03-20 2016-10-06 古河電気工業株式会社 波長可変レーザ素子およびレーザモジュール

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JP6076046B2 (ja) * 2012-11-07 2017-02-08 ヤマハ発動機株式会社 電子部品実装装置、演算装置および実装方法
JP5945697B2 (ja) * 2012-11-19 2016-07-05 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装方法
JP5945699B2 (ja) * 2012-12-25 2016-07-05 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装方法
EP3076776B1 (fr) * 2013-11-29 2019-10-23 FUJI Corporation Procédé de mise à jour de données pour système de travail de substrat de circuit et système de travail de substrat de circuit
JP6280833B2 (ja) * 2014-08-01 2018-02-14 ヤマハ発動機株式会社 制御パラメータ設定方法、制御装置及びプログラム
JP5867645B1 (ja) * 2015-03-20 2016-02-24 富士ゼロックス株式会社 ノズル先端部材、ノズル、はんだ付け装置、基板装置の製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011228635A (ja) * 2010-03-31 2011-11-10 Panasonic Corp ポイント半田ｎｃデータ作成方法と自動半田装置
JP2013254888A (ja) * 2012-06-08 2013-12-19 Sensbey Co Ltd 選択はんだ付けシステム
WO2016135891A1 (fr) * 2015-02-25 2016-09-01 富士機械製造株式会社 Appareil de brasage
JP2016178283A (ja) * 2015-03-20 2016-10-06 古河電気工業株式会社 波長可変レーザ素子およびレーザモジュール

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JPWO2018216076A1 (ja) 2019-12-12

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