WO2018216076A1 - Board working machine - Google Patents

Board working machine Download PDF

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Publication number
WO2018216076A1
WO2018216076A1 PCT/JP2017/019050 JP2017019050W WO2018216076A1 WO 2018216076 A1 WO2018216076 A1 WO 2018216076A1 JP 2017019050 W JP2017019050 W JP 2017019050W WO 2018216076 A1 WO2018216076 A1 WO 2018216076A1
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WO
WIPO (PCT)
Prior art keywords
jet nozzle
molten solder
substrate
lead
jet
Prior art date
Application number
PCT/JP2017/019050
Other languages
French (fr)
Japanese (ja)
Inventor
石川　信幸
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to PCT/JP2017/019050 priority Critical patent/WO2018216076A1/en
Priority to JP2019519819A priority patent/JP6732122B2/en
Publication of WO2018216076A1 publication Critical patent/WO2018216076A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the present invention relates to a substrate working machine that applies molten solder to leads of lead components inserted into a substrate.
  • Patent Document 1 there is a technique of applying molten solder to leads of lead components inserted into a substrate (for example, Patent Document 1).
  • molten solder is sprayed from the nozzle of the molten solder tank toward the lead inserted into the through hole of the substrate, so that the molten solder is applied to the lead. Solder to the board.
  • this soldering device adjusts the liquid level of the molten solder bath.
  • the soldering apparatus includes an arm that conveys the substrate to the molten solder bath. This arm is provided with a continuity sensor. When adjusting the height of the liquid level, the arm moves above the nozzle and descends to a position corresponding to the height of the liquid level set by the user.
  • the continuity sensor contacts the liquid level of the molten solder jetted from the nozzle of the molten solder tank and detects that the liquid level has reached a predetermined height.
  • the soldering device adjusts the height of the liquid level of the solder tank based on the detection information of the continuity sensor.
  • the operation when the molten solder is pulled away from the substrate or the lead is important for the soldering quality.
  • the quality of soldering referred to here is, for example, the degree of solder rise and the presence or absence of bubbles in the solder.
  • the quality of the soldering is deteriorated. For this reason, how to separate the molten solder from the substrate and the leads to improve the soldering quality is a problem.
  • an object of the present application is to provide an on-board working machine that can improve the soldering quality by changing the operation when the molten solder is pulled away from the board or the lead.
  • the present application is directed to a substrate holding device that holds a substrate having a penetrating portion and a lead component in which a lead is inserted into the penetrating portion, and the molten solder is jetted from a jet nozzle to be inserted into the penetrating portion.
  • an operation changing unit that changes the operation of the jet nozzle in the coating operation.
  • the operation changing unit includes a moving distance of the jet nozzle, a moving direction of the jet nozzle, and a moving speed of the jet nozzle. And changing the state of the molten solder applied to the leads by changing at least one of the operating conditions of movement acceleration of the jet nozzle It discloses a work machine.
  • the operation changing unit changes at least one of the four operating conditions such as the moving distance of the jet nozzle.
  • substrate or a lead can be changed, and the quality of soldering can be improved.
  • molten solder is applied collectively to two leads, and is a schematic view showing a state of an application operation as viewed from the upper surface of the circuit substrate. It is the schematic of the pattern which makes it approach again after separating a jet nozzle once, and pulling away molten solder after that. It is the schematic of the pattern which accelerates when separating a jet nozzle from a circuit base material, and pulls away molten solder. It is the schematic of the pattern which moves a jet nozzle in steps.
  • FIG. 1 shows a component mounter 10 according to this embodiment.
  • the component mounter 10 is a device for performing a component mounting operation on the circuit substrate 12.
  • the component mounting machine 10 includes an apparatus main body 20, a substrate conveyance holding device 22, a component mounting device 24, a mark camera 26, a parts camera 28, a component supply device 30, a loose component supply device 32, and a soldering device 36 (see FIG. 3). And a control device 38 (see FIG. 4).
  • Examples of the circuit base material 12 include a circuit board and a three-dimensional base material. Examples of the circuit board include a printed wiring board and a printed circuit board.
  • the apparatus main body 20 includes a frame portion 40 and a beam portion 42 that is overlaid on the frame portion 40.
  • the substrate conveyance holding device 22 is disposed in the center of the frame portion 40 in the front-rear direction, and includes a conveyance device 50 and a clamp device 52.
  • the transport device 50 is a device that transports the circuit substrate 12.
  • the clamp device 52 is a device that holds the circuit substrate 12. Thereby, the substrate conveyance holding device 22 conveys the circuit substrate 12 and holds the circuit substrate 12 at a predetermined work position. In the following description, the conveyance direction of the circuit substrate 12 shown in FIG.
  • X direction 1 is referred to as an X direction
  • a horizontal direction perpendicular to the X direction is referred to as a Y direction
  • a direction perpendicular to the X direction and the Y direction is referred to as Z direction.
  • Z direction a direction perpendicular to the X direction and the Y direction.
  • Z direction a direction perpendicular to the X direction and the Y direction.
  • Z direction This will be described as a direction.
  • the width direction of the component mounter 10 is the X direction.
  • the front-rear direction of the component mounter 10 is the Y direction.
  • the component mounting device 24 is disposed in the beam portion 42 and includes two work heads 60 and 62 and a work head moving device 64. As shown in FIG. 2, suction nozzles 66 are provided on the lower end surfaces of the work heads 60 and 62. Each of the work heads 60 and 62 sucks and holds the component by the suction nozzle 66. Further, the work head moving device 64 has an X direction moving device 68, a Y direction moving device 70, and a Z direction moving device 72. Then, the two working heads 60 and 62 are integrally moved to arbitrary positions on the frame portion 40 by the X-direction moving device 68 and the Y-direction moving device 70.
  • the work heads 60 and 62 are detachably attached to the sliders 74 and 76, respectively.
  • the Z-direction moving device 72 moves the sliders 74 and 76 individually in the vertical direction. That is, the work heads 60 and 62 are individually moved in the vertical direction by the Z-direction moving device 72.
  • the mark camera 26 is attached to the slider 74 while facing downward, and is moved together with the work head 60 in the X direction, the Y direction, and the Z direction. As a result, the mark camera 26 images an arbitrary position on the frame unit 40. As shown in FIG. 1, the parts camera 28 is disposed between the base material conveyance holding device 22 and the component supply device 30 on the frame portion 40 so as to face upward. Thereby, the parts camera 28 images the parts sucked and held by the suction nozzles 66 of the work heads 60 and 62.
  • the component supply device 30 is disposed at one end (front side) of the frame portion 40 in the front-rear direction.
  • the component supply device 30 includes, for example, a tray-type component supply device 78 and a feeder-type component supply device 80 (see FIG. 4).
  • the tray-type component supply device 78 is a device that supplies components placed on the tray.
  • the feeder-type component supply device 80 is a device that supplies components by a tape feeder or a stick feeder (not shown).
  • the bulk component supply device 32 is disposed at the end portion on the other side (rear side) of the frame portion 40 in the front-rear direction.
  • the separated component supply device 32 is a device for aligning a plurality of components scattered in a separated state and supplying the components in an aligned state. That is, it is an apparatus that aligns a plurality of components in an arbitrary posture into a predetermined posture and supplies the components in a predetermined posture.
  • Examples of components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components, power module components, and the like.
  • electronic circuit parts there are parts having leads (radial parts and axial parts), parts having no leads, and the like.
  • the soldering device 36 is disposed below the transfer device 50, and includes a jet device 100 and a jet device moving device 102 as shown in FIG.
  • the jet device 100 includes a soldering iron 106, a jet nozzle 108, and a nozzle cover 110.
  • the solder rod 106 has a generally rectangular parallelepiped shape, and molten solder is stored therein.
  • the jet nozzle 108 is erected on the upper surface of the soldering iron 106. Then, by the operation of a pump (not shown), the molten solder is pumped up from the soldering iron 106, and the molten solder jets upward from the upper end portion of the jet nozzle 108.
  • the nozzle cover 110 is generally cylindrical and is disposed on the upper surface of the soldering iron 106 so as to surround the jet nozzle 108. Then, the molten solder jetted from the upper end portion of the jet nozzle 108 passes between the outer peripheral surface of the jet nozzle 108 and the inner peripheral surface of the nozzle cover 110 and returns to the inside of the solder rod 106.
  • the jet device moving device 102 includes a slider 112, an X direction moving device 114, a Y direction moving device 116, and a Z direction moving device 118.
  • the slider 112 is generally plate-shaped.
  • a jet device 100 is disposed on the upper surface of the slider 112.
  • the X-direction moving device 114 moves the slider 112 in the conveyance direction of the circuit base material 12 by the conveyance device 50, that is, in the X direction.
  • the Y direction moving device 116 moves the slider 112 in the Y direction.
  • the Z-direction moving device 118 moves the slider 112 in the Z direction, that is, the up-down direction. Accordingly, the jet device 100 moves to an arbitrary position below the transport device 50 by the operation of the jet device moving device 102.
  • the control device 38 includes a controller 152, a plurality of drive circuits 154, an image processing device 156, and a storage device 157.
  • the plurality of drive circuits 154 include the transport device 50, the clamp device 52, the work heads 60 and 62, the work head moving device 64, the tray-type component supply device 78, the feeder-type component supply device 80, the bulk component supply device 32, the jet flow. It is connected to the apparatus 100, the jet apparatus moving apparatus 102, and the display operation part 159 mentioned later.
  • the controller 152 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 154.
  • the controller 152 is also connected to the image processing device 156.
  • the image processing device 156 processes image data obtained by the mark camera 26 and the part camera 28.
  • the controller 152 acquires various information from the image data of the mark camera 26 and the part camera 28.
  • the storage device 157 includes, for example, a hard disk and a memory.
  • the controller 152 of the present embodiment reads the control data D1 stored in the storage device 157 and executes a component mounting operation on the circuit substrate 12.
  • the control data D1 for example, data such as the type of circuit base 12 to be produced, the type of parts to be mounted, the mounting position of the parts on the circuit base 12 and the like are set.
  • data of a plurality of types of patterns are stored as operation patterns of the jet nozzle 108 in a molten solder application operation described later.
  • the controller 152 changes the operation of the jet nozzle 108 in the coating operation according to the type of pattern.
  • the component mounter 10 includes a display operation unit 159 as shown in FIG.
  • the display operation unit 159 is disposed on the rear end surface of the bulk component supply device 32.
  • the display operation unit 159 is, for example, a touch panel, and includes a liquid crystal panel, a light source such as an LED that emits light from the back side of the liquid crystal panel, a contact sensing film bonded to the surface of the liquid crystal panel, and the like.
  • the user can select the pattern type for changing the operation of the jet nozzle 108 by operating the display operation unit 159. For example, the user can confirm the degree of solder rise of the circuit base material 12 that has been mounted by the component mounter 10 and can change the pattern as necessary.
  • the controller 152 may be configured to accept only whether or not to change the operation (pattern) of the jet nozzle 108 instead of accepting selection from the user as to which of the patterns is to be executed. In this case, for example, when the display operation unit 159 receives an operation for changing the pattern being executed, the controller 152 may change the pattern in accordance with a preset order. Thereby, the user can change the operation of the jet nozzle 108 only by giving an instruction to change the pattern.
  • the component mounter 10 of the present embodiment performs a component mounting operation on the circuit substrate 12 held by the substrate conveyance holding device 22 with the above-described configuration.
  • the component mounter 10 can mount various components on the circuit base 12, but in the following description, a component having a lead (hereinafter may be abbreviated as “lead component”). The case where it mounts
  • the transport device 50 carries the circuit base material 12 into the component mounter 10 from, for example, a device upstream of the production line based on the control of the controller 152.
  • the conveyance device 50 conveys the circuit substrate 12 to the work position.
  • the clamp device 52 holds the circuit substrate 12 at this working position.
  • the mark camera 26 moves above the circuit base 12 based on the control of the controller 152 and images the circuit base 12. Thereby, the information regarding the holding position etc. of the circuit base material 12 is obtained. Further, the component supply device 30 or the bulk component supply device 32 supplies lead components at a predetermined supply position. Then, one of the work heads 60 and 62 moves above the lead component supply position, and the lead component is held by the suction nozzle 66.
  • FIG. 5 shows a state in which the lead 144 of the lead component 140 sucked and held by the suction nozzle 66 is inserted into the through hole 148 of the circuit substrate 12.
  • FIG. 5 shows a state where the molten solder 150 is jetted from the jet nozzle 108 toward the lead 144 inserted in the through hole 148.
  • the lead component 140 includes, for example, a component main body 142 and two leads 144 extending from the bottom surface 142A of the component main body 142.
  • the lead component 140 is suction-held by the suction nozzle 66 on the upper surface 142B of the component main body 142 opposite to the bottom surface 142A to which the lead 144 is attached.
  • FIG. 5 shows a state in which the lead component 140 is viewed from the side, and only one of the two leads 144 and the two through holes 148 is illustrated.
  • a case where the molten solder 150 is applied to only one lead 144 will be described as an example.
  • the case where the molten solder 150 is applied to the plurality of leads 144 will be described later.
  • the work heads 60 and 62 move to above the parts camera 28 while holding the lead component 140 after the lead component 140 is sucked by the suction nozzle 66 at the supply position.
  • the parts camera 28 images the lead component 140 held by the suction nozzle 66. Thereby, information on the holding position of the lead component 140 and the like is obtained.
  • the work heads 60 and 62 holding the lead component 140 move above the circuit substrate 12.
  • the controller 152 corrects an error in the holding position of the circuit base 12, an error in the holding position of the lead component 140, and the like while the work heads 60 and 62 are moving.
  • the lead 144 of the lead component 140 sucked and held by the suction nozzle 66 is inserted into the through hole 148 formed in the circuit substrate 12.
  • the insertion amount of the lead 144 is set in the control data D1 for each type of the lead component 140. Specifically, for example, in the lead component 140 in which the lead 144 is inserted into the through-hole 148 until the bottom surface 142A of the component main body 142 comes into contact with the base material top surface 12A of the circuit base material 12, the insertion amount is large. In addition, in the lead component 140 in which the lead 144 is inserted into the through hole 148 so that the bottom surface 142A of the component main body 142 and the substrate top surface 12A of the circuit substrate 12 are maintained apart, the insertion amount is small. . As described above, the insertion amount of the lead 144 is set in the control data D1 for each type of the lead component 140.
  • the lead 144 is inserted into the through-hole 148 so that the bottom surface 142A of the component main body 142 and the substrate top surface 12A of the circuit substrate 12 are maintained apart from each other will be described. To do. In this case, the lead 144 is inserted into the through hole 148 in a state where the component main body 142 of the lead component 140 is lifted from the circuit substrate 12.
  • the jet device 100 When the working heads 60 and 62 described above move above the circuit base 12 and insert the leads 144 into the through holes 148 of the circuit base 12, the jet device 100 is located below the circuit base 12 (through holes 148). Has moved to.
  • the jet device 100 is disposed below the circuit base 12, causes the molten solder 150 to jet from the jet nozzle 108 toward the base lower surface 12 ⁇ / b> B of the circuit base 12, and is inserted into the lead 144.
  • a molten solder 150 is applied to the substrate.
  • the controller 152 of the present embodiment operates the jet nozzle 108 in the coating operation in accordance with the pattern data selected by the user among the plurality of patterns set in the control data D1. Change the contents. An example of each pattern will be described below.
  • FIG. 6 shows a pattern in which the jet nozzle 108 and the lead 144 are separated from each other at the central portion of the molten solder 150 and the molten solder 150 is separated.
  • a direction X direction or the like
  • the lead 144 of the lead component 140 sucked and held by the suction nozzle 66 is inserted into the through hole 148 formed in the circuit substrate 12.
  • the jet device 100 located below the through-hole 148 is directed toward the circuit substrate 12 along the Z direction. Moving upward, the jet nozzle 108 of the jet device 100 is brought close to the tip of the lead 144 inserted into the through hole 148.
  • the approach speed along the Z direction of the jet nozzle 108 at this time that is, the moving speed for raising the jet apparatus 100 (jet nozzle 108) is set in the pattern data of the control data D1.
  • the movement acceleration of the jet nozzle 108 may be set in the control data D1.
  • the jet device 100 starts jetting the molten solder 150 from the tip of the jet nozzle 108 when the jet device 100 moves below the circuit substrate 12, for example. For this reason, when the jet device 100 is raised by a predetermined distance, the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144.
  • the ascending moving direction for example, the Z direction
  • the moving distance for moving in the Z direction are set in the pattern data of the control data D1.
  • the jet device 100 stops when it rises to a predetermined height, for example, and maintains its height (position in the Z direction) and stops. At the raised position, the molten solder 150 is jetted from the suction nozzle 66 toward the lead 144, and the molten solder 150 is applied to the leading end portion of the lead 144 and the through hole 148 of the circuit substrate 12.
  • FIG. 7 schematically shows the state of the application work as seen from the substrate upper surface 12A of the circuit substrate 12.
  • the center portion of the molten solder 150 jetted from the jet nozzle 108 (see FIG. 6) is aligned with the position of the lead 144. It has become.
  • the diameter L1 of the molten molten solder 150 shown in FIG. 7 is, for example, 6 mm to 10 mm.
  • the controller 152 moves the jet nozzle 108 in a direction away from the circuit substrate 12 with the position of the lead 144 aligned with the central portion (see S2 in FIG. 6). For example, the controller 152 lowers the jet nozzle 108 along the Z direction without changing the positions in the X direction and the Y direction (S2).
  • the molten solder 150 when the molten solder 150 is pulled away from the circuit substrate 12 or the lead 144, the central portion of the molten solder 150 jetted from the jet nozzle 108, that is, the apex portion of the molten solder 150 jetted from the jet nozzle 108.
  • the molten solder 150 can be pulled away from the lead 144 and the circuit substrate 12.
  • the molten solder 150 jetted from the tip of the jet nozzle 108 moves upward and then falls scattered around (in the X direction and the Y direction) to lower the jet nozzle 108. It flows between the outer peripheral surface and the inner peripheral surface of the nozzle cover 110 and returns to the inside of the soldering iron 106 (see FIG. 3). Therefore, in the central portion (vertex portion) of the molten solder 150 in a plan view shown in FIG. 7, the molten solder 150 jetted upward from the jet nozzle 108 rises to the highest position in the Z direction. Moreover, since the moving direction of the molten solder 150 turns from the upper side to the lower side in the central portion, the convection speed of the molten solder 150 is likely to be slow.
  • the molten solder 150 scattered and descending moves in the X direction and the Y direction, and moves in a direction away from the circuit substrate 12 (downward in the Z direction) according to gravity acceleration or the like. .
  • the molten solder 150 jetted from the jet nozzle 108 is likely to increase the speed of convection as it moves away from the center in the X direction or the Y direction.
  • the convection velocity is likely to be higher in the end portions in the X direction and the Y direction than in the central portion (upper end portion in the Z direction).
  • the central portion is closer to the tip of the jet nozzle 108, that is, the opening of the jet nozzle 108, compared to the molten solder 150 scattered and descending around. For this reason, the temperature of the molten solder 150 is high in the central portion, and is likely to decrease as it is scattered around and away from the center. In other words, there is a high possibility that the temperature of the molten solder 150 that is scattered and scattered around the periphery, that is, the molten solder 150 at the end portion in the X direction or the Y direction, becomes low.
  • the controller 152 of this embodiment can improve the soldering quality by changing the positional relationship among the jet nozzle 108, the molten solder 150, and the lead 144.
  • the soldering quality refers to, for example, the degree of solder rising and the presence or absence of bubbles in the molten solder 150 after soldering. For example, it is whether or not the shape of the molten solder 150 after soldering is a taper shape downward from the substrate lower surface 12B of the circuit substrate 12 (see FIG. 9). Alternatively, it is whether or not the molten solder 150 is sufficiently filled in the through hole 148. Further, whether or not bubbles are generated in the molten solder 150 filled in the through holes 148 is determined.
  • the quality of such soldering varies depending on the type of molten solder 150, room temperature, humidity, and the like, but also varies greatly depending on the operation when the molten solder 150 is pulled away from the lead 144 and the circuit substrate 12 during the coating operation. To do. Therefore, the controller 152 of the present embodiment can switch the plurality of patterns, change the operation when separating them, and improve the soldering quality.
  • the time for stopping the jet device 100 at the position where the jet device 100 is raised is set in the pattern data of the control data D1.
  • the controller 152 measures, for example, the time from reaching the ascending position until the jet nozzle 108 is separated from the circuit substrate 12, that is, the time for applying the molten solder 150 to the lead 144, and is set in the pattern data. After a lapse of time, the jet nozzle 108 (jet device 100) starts to descend. Therefore, the controller 152 can also improve the quality of soldering by changing the stop time at the raised position. Note that the controller 152 may immediately lower the jet nozzle 108 without stopping it at the raised position.
  • the controller 152 continues the jet of the molten solder 150 from the jet nozzle 108 even when the jet device 100 is lowered in S2 of FIG. Thereby, the molten solder 150 and the lead 144 that are jetted are separated at the above-described central portion, and the application of the molten solder 150 to the lead 144 is completed.
  • the moving speed for lowering the jet device 100 (jet nozzle 108) is set in the pattern data of the control data D1. Further, instead of the downward movement speed or in addition to the movement speed, the movement acceleration of the jet nozzle 108 may be set in the control data D1.
  • the controller 152 of the present embodiment maintains the suction holding of the lead component 140 by the suction nozzle 66 even after the operation of applying the molten solder 150 to the lead 144 is finished.
  • the controller 152 releases the holding of the lead component 140 by the suction nozzle 66.
  • the controller 152 may release the suction holding of the lead component 140 by the suction nozzle 66 after inserting the lead 144 into the through hole 148, that is, before applying the molten solder 150.
  • the controller 152 may change the timing of releasing the suction of the lead component 140 according to the required mounting accuracy of the lead component 140, for example. Therefore, the controller 152 can improve the soldering quality also by changing the state of the suction holding.
  • the lead component 140 is mounted on the circuit substrate 12 in a state where the component main body 142 is lifted from the circuit substrate 12.
  • the mounted lead component 140 is soldered to the circuit substrate 12.
  • the lead 144 and the circuit base 12 are electrically connected to each other. A circuit is formed.
  • FIG. 10 shows a pattern in which the jet nozzle 108 and the lead 144 are separated from each other at the end portion of the molten solder 150 and the molten solder 150 is pulled away.
  • the jet device 100 located below the through-hole 148 moves upward toward the circuit substrate 12 along the Z direction and is inserted into the through-hole 148.
  • the jet nozzle 108 of the jet device 100 is brought close to the tip of the lead 144.
  • the jet device 100 is raised by a predetermined distance, the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144.
  • FIG. 8 schematically shows the state of the application work as viewed from the substrate upper surface 12 ⁇ / b> A of the circuit substrate 12. As shown in FIG. 8, in this pattern, when the circuit substrate 12 is viewed in plan, first, the central portion of the molten solder 150 that is jetted from the jet nozzle 108 is aligned with the position of the lead 144. .
  • the controller 152 moves the jet nozzle 108 in a direction away from the circuit base material 12 with the position of the lead 144 aligned with the end portion (S6 in FIG. 10). For example, the controller 152 lowers the jet nozzle 108 along the Z direction without changing the positions in the X direction and the Y direction (S6).
  • the molten solder 150 when the molten solder 150 is pulled away from the circuit substrate 12 or the lead 144, the molten solder 150 can be pulled away from the lead 144 or the like at the end portion of the molten solder 150 jetted from the jet nozzle 108. That is, the molten solder 150 can be pulled away from the lead 144 or the like at a portion that moves (drops) in a direction away from the circuit substrate 12 after being jetted from the jet nozzle 108 toward the circuit substrate 12. As described above, the end portion has a high convection speed of the molten solder 150, and the temperature of the molten solder 150 is likely to be low. In this way, by changing the position to be separated and changing the state of the molten solder 150, improvement in soldering quality can be expected.
  • the controller 152 continues the jet of the molten solder 150 from the jet nozzle 108 even when the jet device 100 is lowered in S6. Thereby, the molten solder 150 and the lead 144 are separated from each other at the end portion described above, and the application of the molten solder 150 to the lead 144 is completed.
  • the lead component 140 is mounted on the circuit substrate 12 in a state where the component main body 142 is lifted from the circuit substrate 12.
  • the soldering quality is changed.
  • the desired quality cannot be obtained with the pattern separated at the center portion described above
  • the user can obtain the desired quality by changing the pattern to be separated at the end portion.
  • the desired quality cannot be obtained with the pattern separated at the end portion
  • the user can obtain the desired quality by changing to the pattern separated at the center portion.
  • the user can select the type of pattern for changing the operation of the jet nozzle 108 by operating the display operation unit 159. It was verified that this pattern is likely to improve the soldering quality among various patterns that change the operating conditions such as the moving distance, moving direction, moving speed, and moving acceleration of the jet nozzle 108. It is a pattern. In this case, the user can improve the soldering quality by changing the operating condition simply by selecting one of a plurality of verified highly reliable patterns. Further, the user need not verify the contents of the operating conditions. Note that the above-described pattern is not limited to a pattern verified by a manufacturer or the like, and may be a pattern with a track record of improving soldering quality in use by a user, for example.
  • the soldering device 36 is in the X and Y directions (plane direction) parallel to the plane of the circuit substrate 12 and the Z direction (orthogonal direction) orthogonal to the plane of the circuit substrate 12.
  • the jet nozzle 108 (jet device 100) is configured to be movable. According to this, for example, by restricting the moving direction of the jet nozzle 108 that is the target of changing the operating condition to two directions of X, Y direction (plane direction) and Z direction (orthogonal direction), the operating condition It is possible to simplify the control contents for changing the processing load of the controller 152 in the application work.
  • FIG. 11 shows a case where the molten solder 150 is applied to the two leads 144 together.
  • FIG. 12 schematically shows the state of the application work when the molten solder 150 is applied to the two leads 144 and viewed from the substrate upper surface 12 ⁇ / b> A of the circuit substrate 12.
  • the width of the jet nozzle 108 in the X direction that is, the diameter L1 (see FIG. 12) of the jetted molten solder 150 is compared with the pitch L2 (see FIG. 12) of the two leads 144. Is large enough.
  • the central portion of the molten solder 150 that is jetted from the jet nozzle 108 is aligned with the positions of the two leads 144. Can do.
  • the molten solder 150 can be pulled away from the two leads 144 at the central portion of the molten solder 150 jetted from the jet nozzle 108.
  • FIG. 13 schematically shows the state of the application work when the molten solder 150 is applied to the two leads 144 and viewed from the upper surface 12 ⁇ / b> A of the circuit substrate 12.
  • the end portion of the molten solder 150 jetted from the jet nozzle 108 is set to the position of the two leads 144 at the raised position.
  • the jet nozzle 108 is the other edge part from the position which match
  • FIG. 14 shows a pattern in which the jet nozzle 108 is once separated and then approached again, and then the molten solder 150 is pulled away.
  • the jet device 100 located below the through-hole 148 moves upward toward the circuit substrate 12 along the Z direction and is inserted into the through-hole 148.
  • the jet nozzle 108 of the jet device 100 is brought close to the tip of the lead 144.
  • the jet device 100 is raised by a predetermined distance, the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144.
  • the jet device 100 rises to a height close to the tip of the lead 144 and then descends by a predetermined distance (S11). For example, the jet device 100 moves downward by a predetermined distance along the Z direction while fixing the positions in the X direction and the Y direction. For example, when the jet device 100 is lowered by a predetermined distance, the molten solder 150 jetted from the jet nozzle 108 reaches the tip of the lead 144. That is, the molten solder 150 is applied to the lead 144 even at the position where the predetermined distance is set to a short distance and lowered in S11.
  • the molten solder 150 jetted from the jet nozzle 108 does not have to reach the tip of the lead 144. That is, the molten solder 150 and the lead 144 may be separated as S12 descends. In this case, the molten solder 150 once separated is applied to the same lead 144 again.
  • the lowered jet device 100 is raised again toward the circuit substrate 12 (S12).
  • the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144.
  • the jet device 100 moves upward by a predetermined distance along the Z direction while fixing the positions in the X direction and the Y direction.
  • the predetermined distance in S12 is, for example, the same distance as S11. That is, the jet flow device 100 is raised at S12 by the distance lowered at S11.
  • the jet device 100 may be lifted at S12 by a short moving distance compared to the moving distance lowered at S11. In this case, the jet device 100 that has been lifted in S12 has a lower position than the position that has been lifted in S11.
  • the controller 152 raises the jet device 100 again in S12, and then moves the jet device 100 (jet nozzle 108) in a direction away from the circuit substrate 12 (S13). For example, the controller 152 lowers the jet nozzle 108 along the Z direction without changing the positions in the X direction and the Y direction (S13).
  • the controller 152 continues the jet of the molten solder 150 from the jet nozzle 108 even when the jet device 100 is lowered in S13. Thereby, the molten solder 150 and the lead 144 are separated from each other at the above-described central portion, and the application of the molten solder 150 to the lead 144 is completed.
  • the controller 152 executes the descending of S11 and the ascending of S12 once, but may be performed a plurality of times. That is, the jet nozzle 108 may be moved up and down a plurality of times. Thereby, the further improvement of the solder rising condition, etc. can be expected. Further, the controller 152 may control the jet device 100 (soldering device 36) so that the molten solder 150 and the lead 144 are separated at the end portion in the above-described rising pattern. The controller 152 may change the moving speed and moving acceleration of the jet device 100 (jet nozzle 108) in each of S10 to S13 described above to different speeds.
  • FIG. 15 shows a pattern in which the jet nozzle 108 is accelerated when being separated from the circuit substrate 12 and the molten solder 150 is separated from the leads 144 and the like.
  • the jet device 100 located below the through-hole 148 moves upward toward the circuit substrate 12 along the Z direction and is inserted into the through-hole 148.
  • the jet nozzle 108 of the jet device 100 is brought close to the tip of the lead 144.
  • the jet device 100 is raised by a predetermined distance, the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144.
  • the jet device 100 maintains its height (position in the Z direction) after rising to a predetermined height.
  • the jet device 100 starts moving in a direction away from the circuit substrate 12.
  • the jet device 100 descends along the Z direction while fixing the positions in the X direction and the Y direction.
  • the controller 152 slowly lowers the jet nozzle 108 (jet device 100) at the initial stage of lowering (S16).
  • the controller 152 lowers the jet nozzle 108 at a slow speed (S16), and then increases the speed at which the jet nozzle 108 descends. That is, the controller 152 increases the movement speed in the later period (S17) as compared to the movement speed in the initial stage (S16) in the descent.
  • the jet device 100 descends and the upper end of the molten solder 150 to be jetted approaches the tip (lower end) of the lead 144, the jet device 100 increases the descending speed. Accordingly, when the upper end (vertex) of the molten solder 150 and the tip of the lead 144 are separated, they can be quickly separated. As a result, as shown in FIG. 9, the shape of the molten solder 150 applied to the lead 144 is tapered from the lower surface 12B of the substrate toward the lower side, that is, a shape standing upright from the lower surface 12B of the substrate. it can. Therefore, improvement in soldering quality can be expected.
  • controller 152 continues the jet of the molten solder 150 from the jet nozzle 108 also when lowering the jet apparatus 100 in S17. Thereby, the molten solder 150 and the lead 144 are separated from each other, and the application of the molten solder 150 to the lead 144 is completed.
  • the controller 152 may change the movement acceleration instead of the movement speed of the jet nozzle 108 or in addition to the movement speed. For example, the controller 152 may increase the movement acceleration in S17 compared to the movement acceleration in S16. Moreover, the controller 152 may make the moving speed of S17 slower than the moving speed of S16. That is, the movement speed in the latter period may be made slower than the initial movement speed of the descent. Thereby, the upper end of the molten solder 150 and the tip of the lead 144 can be slowly separated. As a result, improvement in soldering quality can be expected by changing the operation of the jet nozzle 108. Further, the controller 152 shifts from S16 to S17 and accelerates by one step, but may accelerate by a plurality of steps. Further, the controller 152 may control the jet device 100 so that the molten solder 150 and the lead 144 are separated at the end portion shown in FIG.
  • FIG. 16 shows a pattern in which the jet nozzle 108 is moved stepwise.
  • the jet device 100 located below the through-hole 148 moves upward toward the circuit substrate 12 along the Z direction and is inserted into the through-hole 148.
  • the jet nozzle 108 of the jet device 100 is brought close to the tip of the lead 144.
  • the jet device 100 is raised by a predetermined distance, the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144.
  • the jet device 100 moves up to a predetermined height, and then moves by a predetermined distance along the X direction while maintaining the height (position in the Z direction) (S20). Furthermore, after moving in the X direction, the jet device 100 descends along the Z direction by a predetermined distance (S20).
  • the controller 152 causes the jet device 100 to repeatedly execute the movement in the X direction and the movement in the Z direction. As shown in FIG. 16, the jet device 100 moves away from the circuit substrate 12 while descending stepwise.
  • the single movement in each of the X direction and the Z direction is executed within a range where the molten solder 150 and the lead 144 are not separated.
  • the one-time movement distance in the X direction is set, for example, as a distance between the center and the end of the jetted molten solder 150 in a plan view shown in FIG. 7, that is, a distance obtained by dividing a half (radius) of the diameter L1. it can.
  • the jet nozzle 108 moves by changing the position where the lead 144 and the molten solder 150 are in contact from the center of the molten solder 150 toward the end in a plurality of stages.
  • the one-time movement distance in the Z direction is, for example, between the position of the upper end where the jet apparatus 100 is raised in S19 and the position where the jet apparatus 100 is lowered until the lead 144 and the molten solder 150 are separated.
  • a distance obtained by dividing the distance can be set.
  • the jet nozzle 108 moves in a plurality of stages from the position where the molten solder 150 is applied to the lead 144 to the position where the lead 144 and the molten solder 150 are separated.
  • the controller 152 separates the molten solder 150 and the lead 144 while moving the jet nozzle 108 (jet device 100) stepwise.
  • the controller 152 moves the jet nozzle 108 in the X direction (plane direction) parallel to the plane of the circuit substrate 12 and the Z direction (orthogonal direction) orthogonal to the plane of the circuit substrate 12.
  • the jet device 100 is controlled so as to alternately repeat the movement of the jet nozzle 108 in the direction away from the circuit substrate 12 (downward). According to this, when the molten solder 150 is pulled away from the circuit substrate 12 or the lead 144, the jet nozzle 108 can be moved stepwise in a direction away from the circuit substrate 12. As a result, improvement in soldering quality can be expected by changing the operation at the time of separating the lead 144 and the molten solder 150.
  • the controller 152 of the control apparatus 38 has the application part 160, the operation
  • the application unit 160 is a functional unit for performing an application operation of applying the molten solder 150 to the lead 144 inserted into the through hole 148 by the jet device 100.
  • the operation changing unit 162 is a functional unit for changing the operation of the jet nozzle 108 in the application operation of the application unit 160.
  • the receiving unit 164 is a functional unit for receiving which pattern data of the plurality of patterns of data (control data D1) for changing the operation of the jet nozzle 108 is to be executed by the operation changing unit 162.
  • the component mounting machine 10 is an example of a substrate working machine.
  • the through hole 148 is an example of a through part.
  • the circuit base 12 is an example of a substrate.
  • the substrate conveyance holding device 22 is an example of a substrate holding device.
  • the soldering device 36 is an example of a jet device.
  • the controller 152 (application unit 160) of the control device 38 causes the molten solder 150 to jet from the jet nozzle 108 of the jet device 100 to the lead 144 inserted into the through hole 148 (through portion) of the circuit base 12 (substrate). Apply.
  • the controller 152 (operation change unit 162) changes the operation of the jet nozzle 108 in the application work by the application unit 160.
  • the operation changing unit 162 changes at least one of the four operating conditions of the moving distance, moving direction, moving speed, and moving acceleration of the jet nozzle 108. Thereby, the operation
  • the component mounting apparatus 10 that includes the component mounting device 24 and mounts the lead component 140 on the circuit base 12 by the work heads 60 and 62 is employed as the substrate working machine of the present application.
  • the substrate working machine of the present application may have a configuration in which, for example, the molten solder 150 is simply applied without performing the mounting operation of the lead component 140.
  • the substrate working machine may be configured to carry in the circuit base material 12 on which the lead component 140 has already been mounted and to perform only the soldering.
  • the substrate work machine may not include the component mounting device 24 and the component supply device 30.
  • the control data D1 data for changing at least one of the operating conditions of the moving distance, moving direction, moving speed, and moving acceleration of the jet nozzle 108 is set in a plurality of patterns.
  • the control data D1 may have a configuration having only one pattern to be changed.
  • control data D1 does not have to have data of a preset pattern.
  • the control device 38 may be configured such that the control data D1 can be changed by the user.
  • the user does not select the pattern but directly changes the control data D1, that is, by changing the length of the moving distance of the jet nozzle 108, the magnitude of the moving speed, and the like. It becomes possible to change the operation.
  • the controller 152 moves the jet nozzle 108 in a plane direction (X direction, Y direction) parallel to the plane of the circuit substrate 12 and an orthogonal direction (Z direction) orthogonal to the plane, but this is not limitative. Absent.
  • the controller 152 may move the jet nozzle 108 in an oblique direction that forms a predetermined angle with respect to the plane of the circuit substrate 12. Also in this case, the operation of pulling the molten solder 150 away from the lead 144 is changed, and improvement in soldering quality can be expected.
  • the lead component 140 is mounted on the circuit substrate 12 with the component body 142 floating from the circuit substrate 12, but the component body 142 is in contact with the circuit substrate 12. The lead component 140 may be attached to the circuit substrate 12.
  • the through-hole 148 was employ
  • the penetration part should just penetrate the circuit base material 12 in the up-down direction, and a notch etc. may be sufficient as it.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

The present invention provides a board working machine, which can change an operation when separating molten solder from a board or a lead and which can improve soldering quality. According to the present invention, a control device has: a coating part for performing coating work for coating molten solder onto a lead inserted into a penetration part by means of a jetting device; and an operation changing part for changing the operation of a jetting nozzle in the coating work. The operation changing part changes at least one operation condition among operation conditions including the movement distance, the movement direction, the movement speed, and the movement acceleration of the jetting nozzle, and changes the state of the molten solder coated onto the lead.

Description

対基板作業機Board work machine
　本発明は、基板に挿入されたリード部品のリードに溶融はんだを塗布する対基板作業機に関するものである。 The present invention relates to a substrate working machine that applies molten solder to leads of lead components inserted into a substrate.
　従来、基板に挿入されたリード部品のリードに溶融はんだを塗布する技術がある（例えば、特許文献１など）。特許文献１に記載されたはんだ付け装置では、基板の貫通孔に挿入されたリードに向かって、溶融はんだ槽のノズルから溶融はんだを噴流させることで、リードに溶融はんだを塗布し、リード部品を基板にはんだ付けする。 Conventionally, there is a technique of applying molten solder to leads of lead components inserted into a substrate (for example, Patent Document 1). In the soldering apparatus described in Patent Document 1, molten solder is sprayed from the nozzle of the molten solder tank toward the lead inserted into the through hole of the substrate, so that the molten solder is applied to the lead. Solder to the board.
　また、このはんだ付け装置は、溶融はんだ槽の液面の高さを調整する。はんだ付け装置は、基板を溶融はんだ槽まで搬送するアームを備える。このアームには導通センサが設けられている。液面の高さを調整する場合、アームは、ノズルの上方に移動し、ユーザによって設定された液面の高さに対応した位置まで下降する。導通センサは、溶融はんだ槽のノズルから噴流される溶融はんだの液面に接触し液面が所定の高さに到達したことを検出する。はんだ付け装置は、導通センサの検出情報に基づいて、はんだ槽の液面の高さを調整する。 Also, this soldering device adjusts the liquid level of the molten solder bath. The soldering apparatus includes an arm that conveys the substrate to the molten solder bath. This arm is provided with a continuity sensor. When adjusting the height of the liquid level, the arm moves above the nozzle and descends to a position corresponding to the height of the liquid level set by the user. The continuity sensor contacts the liquid level of the molten solder jetted from the nozzle of the molten solder tank and detects that the liquid level has reached a predetermined height. The soldering device adjusts the height of the liquid level of the solder tank based on the detection information of the continuity sensor.
国際公開第２０１０／１３１７５２号International Publication No. 2010/131752
　ところで、上記したような噴流させた溶融はんだを基板の一部に接触させてはんだ付けする、いわゆるポイントフローはんだ付けでは、基板やリードから溶融はんだを引き離す際の作動がはんだ付けの品質にとって重要となる。ここで言うはんだ付けの品質とは、例えば、はんだの上がり具合や、はんだ内の気泡の有無などである。換言すれば、溶融はんだを基板やリードから引き離す際の作動が適切でない場合、はんだ付けの品質の低下に繋がる。このため、基板やリードからいかに溶融はんだを引き離し、はんだ付けの品質を向上させるかが課題となる。 By the way, in the so-called point flow soldering, in which the molten solder jetted as described above is brought into contact with a part of the substrate and soldered, the operation when the molten solder is pulled away from the substrate or the lead is important for the soldering quality. Become. The quality of soldering referred to here is, for example, the degree of solder rise and the presence or absence of bubbles in the solder. In other words, if the operation at the time of separating the molten solder from the substrate or the lead is not appropriate, the quality of the soldering is deteriorated. For this reason, how to separate the molten solder from the substrate and the leads to improve the soldering quality is a problem.
　そこで、本願は、基板やリードから溶融はんだを引き離す際の作動を変更し、はんだ付けの品質を向上できる対基板作業機を提供することを目的とする。 Therefore, an object of the present application is to provide an on-board working machine that can improve the soldering quality by changing the operation when the molten solder is pulled away from the board or the lead.
　本願は、貫通部を形成された基板を保持する基板保持装置と、前記貫通部にリードを挿入されたリード部品に対し、噴流ノズルから溶融はんだを噴流させ、前記貫通部に挿入された前記リードに前記溶融はんだを塗布する噴流装置と、制御装置と、を備え、前記制御装置は、前記貫通部に挿入された前記リードに、前記噴流装置によって前記溶融はんだを塗布する塗布作業を実行する塗布部と、前記塗布作業における前記噴流ノズルの作動を変更する作動変更部と、を有し、前記作動変更部は、前記噴流ノズルの移動距離、前記噴流ノズルの移動方向、前記噴流ノズルの移動速度、及び前記噴流ノズルの移動加速度の作動条件のうち、少なくとも１つの作動条件を変更し、前記リードに塗布される前記溶融はんだの状態を変更する、対基板作業機を開示する。 The present application is directed to a substrate holding device that holds a substrate having a penetrating portion and a lead component in which a lead is inserted into the penetrating portion, and the molten solder is jetted from a jet nozzle to be inserted into the penetrating portion. A jet device for applying the molten solder to the lead, and a control device, the control device performing an application operation for applying the molten solder to the lead inserted into the through-hole by the jet device. And an operation changing unit that changes the operation of the jet nozzle in the coating operation. The operation changing unit includes a moving distance of the jet nozzle, a moving direction of the jet nozzle, and a moving speed of the jet nozzle. And changing the state of the molten solder applied to the leads by changing at least one of the operating conditions of movement acceleration of the jet nozzle It discloses a work machine.
　本願の対基板作業機によれば、作動変更部は、噴流ノズルの移動距離等の４つの作動条件のうち、少なくとも１つの作動条件を変更する。これにより、基板やリードから溶融はんだを引き離す際の作動を変更でき、はんだ付けの品質を向上できる。 According to the substrate working machine of the present application, the operation changing unit changes at least one of the four operating conditions such as the moving distance of the jet nozzle. Thereby, the operation | movement at the time of pulling away molten solder from a board | substrate or a lead can be changed, and the quality of soldering can be improved.
実施形態の部品実装機を示す斜視図である。It is a perspective view which shows the component mounting machine of embodiment. 部品装着装置を示す斜視図である。It is a perspective view which shows a component mounting apparatus. はんだ付け装置を示す斜視図である。It is a perspective view which shows a soldering apparatus. 制御装置を示すブロック図である。It is a block diagram which shows a control apparatus. 回路基材の貫通孔に挿入されているリードに向かって溶融はんだが噴流されている状態を示す概略図である。It is the schematic which shows the state in which the molten solder is jetted toward the lead inserted in the through-hole of a circuit base material. 溶融はんだの中央部分で噴流ノズルとリードとを離間させ、溶融はんだを引き離すパターンの概略図である。It is the schematic of the pattern which spaces apart a jet nozzle and a lead in the center part of molten solder, and separates molten solder. 回路基材の基材上面から見た塗布作業の状態を示す模式図である。It is a schematic diagram which shows the state of the application | coating operation | work seen from the base material upper surface of the circuit base material. 回路基材の基材上面から見た塗布作業の状態を示す模式図である。It is a schematic diagram which shows the state of the application | coating operation | work seen from the base material upper surface of the circuit base material. はんだ付け後の状態を示す概略図である。It is the schematic which shows the state after soldering. 溶融はんだの端部部分で噴流ノズルとリードとを離間させ、溶融はんだを引き離すパターンの概略図である。It is the schematic of the pattern which spaces apart a jet nozzle and a lead in the edge part part of a molten solder, and pulls away a molten solder. ２つのリードにまとめて溶融はんだを塗布する場合の概略図である。It is the schematic in the case of apply | coating a molten solder collectively to two leads. ２つのリードにまとめて溶融はんだを塗布する場合であって、回路基材の基材上面から見た塗布作業の状態を示す模式図である。It is a case where molten solder is applied collectively to two leads, and is a schematic view showing a state of an application operation as viewed from the upper surface of the circuit substrate. ２つのリードにまとめて溶融はんだを塗布する場合であって、回路基材の基材上面から見た塗布作業の状態を示す模式図である。It is a case where molten solder is applied collectively to two leads, and is a schematic view showing a state of an application operation as viewed from the upper surface of the circuit substrate. 噴流ノズルを一度離間させた後に再度接近させ、その後に溶融はんだを引き離すパターンの概略図である。It is the schematic of the pattern which makes it approach again after separating a jet nozzle once, and pulling away molten solder after that. 噴流ノズルを回路基材から離間させる際に加速させ、溶融はんだを引き離すパターンの概略図である。It is the schematic of the pattern which accelerates when separating a jet nozzle from a circuit base material, and pulls away molten solder. 噴流ノズルを階段状に移動させるパターンの概略図である。It is the schematic of the pattern which moves a jet nozzle in steps.
　以下、本願の対基板作業機を部品実装機に具体化した一実施形態について、図を参照しつつ詳しく説明する。 Hereinafter, an embodiment in which the substrate working machine of the present application is embodied as a component mounting machine will be described in detail with reference to the drawings.
　（部品実装機の構成）
　図１に、本実施形態の部品実装機１０を示す。部品実装機１０は、回路基材１２に対する部品の実装作業を実行するための装置である。部品実装機１０は、装置本体２０、基材搬送保持装置２２、部品装着装置２４、マークカメラ２６、パーツカメラ２８、部品供給装置３０、ばら部品供給装置３２、はんだ付け装置３６（図３参照）、制御装置３８（図４参照）を備えている。なお、回路基材１２としては、回路基板、三次元構造の基材等が挙げられる。また、回路基板としては、プリント配線板、プリント回路板等が挙げられる。 (Component mounter configuration)
FIG. 1 shows a component mounter 10 according to this embodiment. The component mounter 10 is a device for performing a component mounting operation on the circuit substrate 12. The component mounting machine 10 includes an apparatus main body 20, a substrate conveyance holding device 22, a component mounting device 24, a mark camera 26, a parts camera 28, a component supply device 30, a loose component supply device 32, and a soldering device 36 (see FIG. 3). And a control device 38 (see FIG. 4). Examples of the circuit base material 12 include a circuit board and a three-dimensional base material. Examples of the circuit board include a printed wiring board and a printed circuit board.
　装置本体２０は、フレーム部４０と、そのフレーム部４０に上架されたビーム部４２とを有している。基材搬送保持装置２２は、フレーム部４０の前後方向の中央に配設されており、搬送装置５０と、クランプ装置５２とを有している。搬送装置５０は、回路基材１２を搬送する装置である。クランプ装置５２は、回路基材１２を保持する装置である。これにより、基材搬送保持装置２２は、回路基材１２を搬送するとともに、所定の作業位置において、回路基材１２を保持する。なお、以下の説明では、図１に示す回路基材１２の搬送方向をＸ方向と称し、そのＸ方向に直角な水平の方向をＹ方向と称し、Ｘ方向及びＹ方向に直角な方向をＺ方向と称して説明する。この場合、部品実装機１０の幅方向は、Ｘ方向である。また、部品実装機１０の前後方向は、Ｙ方向である。 The apparatus main body 20 includes a frame portion 40 and a beam portion 42 that is overlaid on the frame portion 40. The substrate conveyance holding device 22 is disposed in the center of the frame portion 40 in the front-rear direction, and includes a conveyance device 50 and a clamp device 52. The transport device 50 is a device that transports the circuit substrate 12. The clamp device 52 is a device that holds the circuit substrate 12. Thereby, the substrate conveyance holding device 22 conveys the circuit substrate 12 and holds the circuit substrate 12 at a predetermined work position. In the following description, the conveyance direction of the circuit substrate 12 shown in FIG. 1 is referred to as an X direction, a horizontal direction perpendicular to the X direction is referred to as a Y direction, and a direction perpendicular to the X direction and the Y direction is referred to as Z direction. This will be described as a direction. In this case, the width direction of the component mounter 10 is the X direction. The front-rear direction of the component mounter 10 is the Y direction.
　部品装着装置２４は、ビーム部４２に配設されており、２台の作業ヘッド６０，６２と、作業ヘッド移動装置６４とを有している。各作業ヘッド６０，６２の下端面には、図２に示すように、吸着ノズル６６が設けられている。各作業ヘッド６０，６２は、吸着ノズル６６によって部品を吸着保持する。また、作業ヘッド移動装置６４は、Ｘ方向移動装置６８と、Ｙ方向移動装置７０と、Ｚ方向移動装置７２とを有している。そして、Ｘ方向移動装置６８とＹ方向移動装置７０とによって、２台の作業ヘッド６０，６２は、一体的にフレーム部４０上の任意の位置に移動させられる。また、各作業ヘッド６０，６２は、スライダ７４，７６に着脱可能に装着されている。Ｚ方向移動装置７２は、スライダ７４，７６を個別に上下方向に移動させる。つまり、作業ヘッド６０，６２は、Ｚ方向移動装置７２によって、個別に上下方向に移動させられる。 The component mounting device 24 is disposed in the beam portion 42 and includes two work heads 60 and 62 and a work head moving device 64. As shown in FIG. 2, suction nozzles 66 are provided on the lower end surfaces of the work heads 60 and 62. Each of the work heads 60 and 62 sucks and holds the component by the suction nozzle 66. Further, the work head moving device 64 has an X direction moving device 68, a Y direction moving device 70, and a Z direction moving device 72. Then, the two working heads 60 and 62 are integrally moved to arbitrary positions on the frame portion 40 by the X-direction moving device 68 and the Y-direction moving device 70. The work heads 60 and 62 are detachably attached to the sliders 74 and 76, respectively. The Z-direction moving device 72 moves the sliders 74 and 76 individually in the vertical direction. That is, the work heads 60 and 62 are individually moved in the vertical direction by the Z-direction moving device 72.
　マークカメラ２６は、下方を向いた状態でスライダ７４に取り付けられており、作業ヘッド６０とともに、Ｘ方向、Ｙ方向及びＺ方向に移動させられる。これにより、マークカメラ２６は、フレーム部４０上の任意の位置を撮像する。パーツカメラ２８は、図１に示すように、フレーム部４０上の基材搬送保持装置２２と部品供給装置３０との間に、上を向いた状態で配設されている。これにより、パーツカメラ２８は、作業ヘッド６０，６２の吸着ノズル６６に吸着保持された部品を撮像する。 The mark camera 26 is attached to the slider 74 while facing downward, and is moved together with the work head 60 in the X direction, the Y direction, and the Z direction. As a result, the mark camera 26 images an arbitrary position on the frame unit 40. As shown in FIG. 1, the parts camera 28 is disposed between the base material conveyance holding device 22 and the component supply device 30 on the frame portion 40 so as to face upward. Thereby, the parts camera 28 images the parts sucked and held by the suction nozzles 66 of the work heads 60 and 62.
　図１に示すように、部品供給装置３０は、フレーム部４０の前後方向における一方側（前方側）の端部に配設されている。部品供給装置３０は、例えば、トレイ型部品供給装置７８と、フィーダ型部品供給装置８０（図４参照）とを有している。トレイ型部品供給装置７８は、トレイ上に載置された状態の部品を供給する装置である。フィーダ型部品供給装置８０は、テープフィーダ、スティックフィーダ（図示省略）によって部品を供給する装置である。 As shown in FIG. 1, the component supply device 30 is disposed at one end (front side) of the frame portion 40 in the front-rear direction. The component supply device 30 includes, for example, a tray-type component supply device 78 and a feeder-type component supply device 80 (see FIG. 4). The tray-type component supply device 78 is a device that supplies components placed on the tray. The feeder-type component supply device 80 is a device that supplies components by a tape feeder or a stick feeder (not shown).
　ばら部品供給装置３２は、フレーム部４０の前後方向における他方側（後方側）の端部に配設されている。ばら部品供給装置３２は、ばらばらに散在された状態の複数の部品を整列させて、整列させた状態で部品を供給する装置である。つまり、任意の姿勢の複数の部品を、所定の姿勢に整列させて、所定の姿勢の部品を供給する装置である。なお、部品供給装置３０及びばら部品供給装置３２によって供給される部品としては、例えば、電子回路部品，パワーモジュールの構成部品等が挙げられる。また、電子回路部品としては、リードを有する部品（ラジアル部品やアキシャル部品）、リードを有さない部品等が有る。 The bulk component supply device 32 is disposed at the end portion on the other side (rear side) of the frame portion 40 in the front-rear direction. The separated component supply device 32 is a device for aligning a plurality of components scattered in a separated state and supplying the components in an aligned state. That is, it is an apparatus that aligns a plurality of components in an arbitrary posture into a predetermined posture and supplies the components in a predetermined posture. Examples of components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components, power module components, and the like. In addition, as electronic circuit parts, there are parts having leads (radial parts and axial parts), parts having no leads, and the like.
　はんだ付け装置３６は、搬送装置５０の下方に配設されており、図３に示すように、噴流装置１００と、噴流装置移動装置１０２とを有している。噴流装置１００は、はんだ漕１０６と、噴流ノズル１０８と、ノズルカバー１１０とを有する。はんだ漕１０６は、概して直方体形状をなし、内部に溶融はんだが貯留されている。噴流ノズル１０８は、はんだ漕１０６の上面に立設されている。そして、ポンプ（図示省略）の作動により、はんだ漕１０６から溶融はんだが汲み上げられ、噴流ノズル１０８の上端部から上方に向かって、溶融はんだが噴流する。また、ノズルカバー１１０は、概して、円筒状をなし、噴流ノズル１０８を囲うように、はんだ漕１０６の上面に配設されている。そして、噴流ノズル１０８の上端部から噴流された溶融はんだが、噴流ノズル１０８の外周面とノズルカバー１１０の内周面との間を通って、はんだ漕１０６の内部に還流する。 The soldering device 36 is disposed below the transfer device 50, and includes a jet device 100 and a jet device moving device 102 as shown in FIG. The jet device 100 includes a soldering iron 106, a jet nozzle 108, and a nozzle cover 110. The solder rod 106 has a generally rectangular parallelepiped shape, and molten solder is stored therein. The jet nozzle 108 is erected on the upper surface of the soldering iron 106. Then, by the operation of a pump (not shown), the molten solder is pumped up from the soldering iron 106, and the molten solder jets upward from the upper end portion of the jet nozzle 108. The nozzle cover 110 is generally cylindrical and is disposed on the upper surface of the soldering iron 106 so as to surround the jet nozzle 108. Then, the molten solder jetted from the upper end portion of the jet nozzle 108 passes between the outer peripheral surface of the jet nozzle 108 and the inner peripheral surface of the nozzle cover 110 and returns to the inside of the solder rod 106.
　噴流装置移動装置１０２は、スライダ１１２と、Ｘ方向移動装置１１４と、Ｙ方向移動装置１１６と、Ｚ方向移動装置１１８とを有している。スライダ１１２は、概して板状をなしている。スライダ１１２の上面には、噴流装置１００が配設されている。また、Ｘ方向移動装置１１４は、搬送装置５０による回路基材１２の搬送方向、つまり、Ｘ方向に、スライダ１１２を移動させる。Ｙ方向移動装置１１６は、スライダ１１２をＹ方向に移動させる。さらに、Ｚ方向移動装置１１８は、スライダ１１２を、Ｚ方向、つまり、上下方向に移動させる。これにより、噴流装置１００は、搬送装置５０の下方において、噴流装置移動装置１０２の作動により、任意の位置に移動する。 The jet device moving device 102 includes a slider 112, an X direction moving device 114, a Y direction moving device 116, and a Z direction moving device 118. The slider 112 is generally plate-shaped. A jet device 100 is disposed on the upper surface of the slider 112. The X-direction moving device 114 moves the slider 112 in the conveyance direction of the circuit base material 12 by the conveyance device 50, that is, in the X direction. The Y direction moving device 116 moves the slider 112 in the Y direction. Further, the Z-direction moving device 118 moves the slider 112 in the Z direction, that is, the up-down direction. Accordingly, the jet device 100 moves to an arbitrary position below the transport device 50 by the operation of the jet device moving device 102.
　また、制御装置３８は、図４に示すように、コントローラ１５２、複数の駆動回路１５４、画像処理装置１５６、記憶装置１５７を備えている。複数の駆動回路１５４は、上記した搬送装置５０、クランプ装置５２、作業ヘッド６０，６２、作業ヘッド移動装置６４、トレイ型部品供給装置７８、フィーダ型部品供給装置８０、ばら部品供給装置３２、噴流装置１００、噴流装置移動装置１０２、及び後述する表示操作部１５９に接続されている。コントローラ１５２は、ＣＰＵ，ＲＯＭ，ＲＡＭ等を備え、コンピュータを主体とするものであり、複数の駆動回路１５４に接続されている。これにより、基材搬送保持装置２２、部品装着装置２４等の作動が、コントローラ１５２によって制御される。また、コントローラ１５２は、画像処理装置１５６にも接続されている。画像処理装置１５６は、マークカメラ２６及びパーツカメラ２８によって得られた画像データを処理するものである。コントローラ１５２は、マークカメラ２６及びパーツカメラ２８の画像データから各種情報を取得する。 As shown in FIG. 4, the control device 38 includes a controller 152, a plurality of drive circuits 154, an image processing device 156, and a storage device 157. The plurality of drive circuits 154 include the transport device 50, the clamp device 52, the work heads 60 and 62, the work head moving device 64, the tray-type component supply device 78, the feeder-type component supply device 80, the bulk component supply device 32, the jet flow. It is connected to the apparatus 100, the jet apparatus moving apparatus 102, and the display operation part 159 mentioned later. The controller 152 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 154. As a result, the operations of the substrate conveyance holding device 22 and the component mounting device 24 are controlled by the controller 152. The controller 152 is also connected to the image processing device 156. The image processing device 156 processes image data obtained by the mark camera 26 and the part camera 28. The controller 152 acquires various information from the image data of the mark camera 26 and the part camera 28.
　記憶装置１５７は、例えば、ハードディスクやメモリ等を備えている。本実施形態のコントローラ１５２は、記憶装置１５７に保存された制御データＤ１を読み込んで、回路基材１２に対する部品の実装作業を実行する。制御データＤ１は、例えば、生産する回路基材１２の種類、装着する部品の種類、回路基材１２における部品の装着位置等のデータが設定されている。また、本実施形態の制御データＤ１には、後述する溶融はんだの塗布作業における噴流ノズル１０８の作動のパターンとして複数の種類のパターンのデータが保存されている。コントローラ１５２は、パターンの種類に応じて、塗布作業での噴流ノズル１０８の作動を変更する。 The storage device 157 includes, for example, a hard disk and a memory. The controller 152 of the present embodiment reads the control data D1 stored in the storage device 157 and executes a component mounting operation on the circuit substrate 12. In the control data D1, for example, data such as the type of circuit base 12 to be produced, the type of parts to be mounted, the mounting position of the parts on the circuit base 12 and the like are set. Further, in the control data D1 of the present embodiment, data of a plurality of types of patterns are stored as operation patterns of the jet nozzle 108 in a molten solder application operation described later. The controller 152 changes the operation of the jet nozzle 108 in the coating operation according to the type of pattern.
　また、部品実装機１０は、図１に示すように、表示操作部１５９を備える。表示操作部１５９は、ばら部品供給装置３２の後方側の端面に配設されている。表示操作部１５９は、例えば、タッチパネルであり、液晶パネル、液晶パネルの背面側から光を照射するＬＥＤ等の光源、液晶パネルの表面に貼り合わされた接触感知膜等を備えている。ユーザは、表示操作部１５９を操作することで、上記した噴流ノズル１０８の作動を変更するパターンの種類を選択できる。ユーザは、例えば、部品実装機１０で実装作業を行った回路基材１２のはんだの上がり具合などを確認し、必要に応じてパターンを変更することができる。なお、コントローラ１５２は、パターンの何れを実行するのかについてユーザから選択を受け付けるのではなく、噴流ノズル１０８の作動（パターン）を変更するか否かだけを受け付ける構成でもよい。この場合、コントローラ１５２は、例えば、実行中のパターンを変更する旨の操作を、表示操作部１５９に対して受け付けると、予め設定された順番に従ってパターンを変更してもよい。これにより、ユーザは、パターンの変更の指示を行うだけで、噴流ノズル１０８の作動を変更できる。 Also, the component mounter 10 includes a display operation unit 159 as shown in FIG. The display operation unit 159 is disposed on the rear end surface of the bulk component supply device 32. The display operation unit 159 is, for example, a touch panel, and includes a liquid crystal panel, a light source such as an LED that emits light from the back side of the liquid crystal panel, a contact sensing film bonded to the surface of the liquid crystal panel, and the like. The user can select the pattern type for changing the operation of the jet nozzle 108 by operating the display operation unit 159. For example, the user can confirm the degree of solder rise of the circuit base material 12 that has been mounted by the component mounter 10 and can change the pattern as necessary. The controller 152 may be configured to accept only whether or not to change the operation (pattern) of the jet nozzle 108 instead of accepting selection from the user as to which of the patterns is to be executed. In this case, for example, when the display operation unit 159 receives an operation for changing the pattern being executed, the controller 152 may change the pattern in accordance with a preset order. Thereby, the user can change the operation of the jet nozzle 108 only by giving an instruction to change the pattern.
　（部品実装機の作動）
　本実施形態の部品実装機１０は、上記した構成によって、基材搬送保持装置２２に保持された回路基材１２に対して部品の実装作業を行う。部品実装機１０は、種々の部品を回路基材１２に実装することが可能であるが、以下の説明では、リードを有する部品（以下、「リード部品」と略して記載する場合がある）を回路基材１２に装着する場合について説明する。 (Operation of component mounter)
The component mounter 10 of the present embodiment performs a component mounting operation on the circuit substrate 12 held by the substrate conveyance holding device 22 with the above-described configuration. The component mounter 10 can mount various components on the circuit base 12, but in the following description, a component having a lead (hereinafter may be abbreviated as “lead component”). The case where it mounts | wears with the circuit base material 12 is demonstrated.
　具体的には、まず、搬送装置５０は、コントローラ１５２の制御に基づいて、例えば生産ラインの上流の装置から部品実装機１０内へ回路基材１２を搬入する。搬送装置５０は、作業位置まで回路基材１２を搬送する。クランプ装置５２は、この作業位置において回路基材１２を保持する。 Specifically, first, the transport device 50 carries the circuit base material 12 into the component mounter 10 from, for example, a device upstream of the production line based on the control of the controller 152. The conveyance device 50 conveys the circuit substrate 12 to the work position. The clamp device 52 holds the circuit substrate 12 at this working position.
　次に、マークカメラ２６は、コントローラ１５２の制御に基づいて、回路基材１２の上方に移動し、回路基材１２を撮像する。これにより、回路基材１２の保持位置等に関する情報が得られる。また、部品供給装置３０若しくは、ばら部品供給装置３２は、所定の供給位置において、リード部品を供給する。そして、作業ヘッド６０，６２の何れかが、リード部品の供給位置の上方に移動し、吸着ノズル６６によってリード部品を保持する。 Next, the mark camera 26 moves above the circuit base 12 based on the control of the controller 152 and images the circuit base 12. Thereby, the information regarding the holding position etc. of the circuit base material 12 is obtained. Further, the component supply device 30 or the bulk component supply device 32 supplies lead components at a predetermined supply position. Then, one of the work heads 60 and 62 moves above the lead component supply position, and the lead component is held by the suction nozzle 66.
　図５は、吸着ノズル６６に吸着保持されたリード部品１４０のリード１４４を、回路基材１２の貫通孔１４８に挿入した状態を示している。また、図５は、貫通孔１４８に挿入されているリード１４４に向かって、噴流ノズル１０８から溶融はんだ１５０を噴流している状態を示している。リード部品１４０は、例えば、部品本体部１４２と、部品本体部１４２の底面１４２Ａから延び出す２本のリード１４４とを有する。リード部品１４０は、部品本体部１４２におけるリード１４４を取り付けた底面１４２Ａとは反対側の上面１４２Ｂを、吸着ノズル６６によって吸着保持されている。なお、図５は、リード部品１４０を側方から見た状態であり、２つのリード１４４、及び２つの貫通孔１４８のうち、１つのみを図示している。以下の説明では、一例として、１つのリード１４４のみに溶融はんだ１５０を塗布する場合について説明する。複数のリード１４４に溶融はんだ１５０を塗布する場合については後述する。 FIG. 5 shows a state in which the lead 144 of the lead component 140 sucked and held by the suction nozzle 66 is inserted into the through hole 148 of the circuit substrate 12. FIG. 5 shows a state where the molten solder 150 is jetted from the jet nozzle 108 toward the lead 144 inserted in the through hole 148. The lead component 140 includes, for example, a component main body 142 and two leads 144 extending from the bottom surface 142A of the component main body 142. The lead component 140 is suction-held by the suction nozzle 66 on the upper surface 142B of the component main body 142 opposite to the bottom surface 142A to which the lead 144 is attached. 5 shows a state in which the lead component 140 is viewed from the side, and only one of the two leads 144 and the two through holes 148 is illustrated. In the following description, a case where the molten solder 150 is applied to only one lead 144 will be described as an example. The case where the molten solder 150 is applied to the plurality of leads 144 will be described later.
　作業ヘッド６０，６２は、供給位置においてリード部品１４０を吸着ノズル６６により吸着した後、リード部品１４０を保持した状態で、パーツカメラ２８の上方に移動する。パーツカメラ２８は、吸着ノズル６６に保持されたリード部品１４０を撮像する。これにより、リード部品１４０の保持位置等に関する情報が得られる。 The work heads 60 and 62 move to above the parts camera 28 while holding the lead component 140 after the lead component 140 is sucked by the suction nozzle 66 at the supply position. The parts camera 28 images the lead component 140 held by the suction nozzle 66. Thereby, information on the holding position of the lead component 140 and the like is obtained.
　次に、リード部品１４０を保持した作業ヘッド６０，６２が、回路基材１２の上方に移動する。コントローラ１５２は、作業ヘッド６０，６２の移動中に、回路基材１２の保持位置の誤差や、リード部品１４０の保持位置の誤差等を補正する。そして、図５に示すように、吸着ノズル６６により吸着保持されたリード部品１４０のリード１４４が、回路基材１２に形成された貫通孔１４８に挿入される。 Next, the work heads 60 and 62 holding the lead component 140 move above the circuit substrate 12. The controller 152 corrects an error in the holding position of the circuit base 12, an error in the holding position of the lead component 140, and the like while the work heads 60 and 62 are moving. Then, as shown in FIG. 5, the lead 144 of the lead component 140 sucked and held by the suction nozzle 66 is inserted into the through hole 148 formed in the circuit substrate 12.
　なお、リード１４４の挿入量は、リード部品１４０の種類毎に、制御データＤ１に設定されている。具体的には、例えば、部品本体部１４２の底面１４２Ａが回路基材１２の基材上面１２Ａに接触するまで、リード１４４を貫通孔１４８に挿入するリード部品１４０では、挿入量が大きくなる。また、部品本体部１４２の底面１４２Ａと回路基材１２の基材上面１２Ａとが離間した状態で維持されるように、リード１４４を貫通孔１４８に挿入するリード部品１４０では、挿入量が小さくなる。このように、リード部品１４０の種類毎にリード１４４の挿入量が制御データＤ１に設定されている。 The insertion amount of the lead 144 is set in the control data D1 for each type of the lead component 140. Specifically, for example, in the lead component 140 in which the lead 144 is inserted into the through-hole 148 until the bottom surface 142A of the component main body 142 comes into contact with the base material top surface 12A of the circuit base material 12, the insertion amount is large. In addition, in the lead component 140 in which the lead 144 is inserted into the through hole 148 so that the bottom surface 142A of the component main body 142 and the substrate top surface 12A of the circuit substrate 12 are maintained apart, the insertion amount is small. . As described above, the insertion amount of the lead 144 is set in the control data D1 for each type of the lead component 140.
　以下の説明では、一例として、部品本体部１４２の底面１４２Ａと回路基材１２の基材上面１２Ａとが離間した状態で維持されるように、リード１４４が貫通孔１４８に挿入される場合について説明する。この場合、リード部品１４０の部品本体部１４２が回路基材１２から浮いた状態で、リード１４４が貫通孔１４８に挿入される。 In the following description, as an example, a case where the lead 144 is inserted into the through-hole 148 so that the bottom surface 142A of the component main body 142 and the substrate top surface 12A of the circuit substrate 12 are maintained apart from each other will be described. To do. In this case, the lead 144 is inserted into the through hole 148 in a state where the component main body 142 of the lead component 140 is lifted from the circuit substrate 12.
　上記した作業ヘッド６０，６２が回路基材１２の上方に移動し、回路基材１２の貫通孔１４８にリード１４４を挿入する際、噴流装置１００は、回路基材１２（貫通孔１４８）の下方に移動している。そして、噴流装置１００は、回路基材１２の下方に配置され、回路基材１２の基材下面１２Ｂに向かって、噴流ノズル１０８から溶融はんだ１５０を噴流させ、貫通孔１４８に挿入されたリード１４４に溶融はんだ１５０を塗布する。ここで、上記したように、本実施形態のコントローラ１５２は、制御データＤ１に設定された複数のパターンのうち、ユーザによって選択されたパターンのデータに応じて、塗布作業での噴流ノズル１０８の作動内容を変更する。以下に各パターンの一例を説明する。 When the working heads 60 and 62 described above move above the circuit base 12 and insert the leads 144 into the through holes 148 of the circuit base 12, the jet device 100 is located below the circuit base 12 (through holes 148). Has moved to. The jet device 100 is disposed below the circuit base 12, causes the molten solder 150 to jet from the jet nozzle 108 toward the base lower surface 12 </ b> B of the circuit base 12, and is inserted into the lead 144. A molten solder 150 is applied to the substrate. Here, as described above, the controller 152 of the present embodiment operates the jet nozzle 108 in the coating operation in accordance with the pattern data selected by the user among the plurality of patterns set in the control data D1. Change the contents. An example of each pattern will be described below.
（溶融はんだ１５０の中央部分で引き離すパターン）
　まず、溶融はんだ１５０の中央部分で引き離すパターンについて説明する。詳述すると、図６は、溶融はんだ１５０の中央部分で噴流ノズル１０８とリード１４４とを離間させ、溶融はんだ１５０を引き離すパターンを示している。なお、説明を分かり易くするため、図６や後述する図１０等に方向（Ｘ方向など）の一例を図示するが、この方向は、一例であり、貫通孔１４８の配置等に応じて適宜変更される。 (Pattern separated at the center of the molten solder 150)
First, a pattern that is separated at the center of the molten solder 150 will be described. More specifically, FIG. 6 shows a pattern in which the jet nozzle 108 and the lead 144 are separated from each other at the central portion of the molten solder 150 and the molten solder 150 is separated. In order to make the explanation easy to understand, an example of a direction (X direction or the like) is shown in FIG. 6 or FIG. 10 to be described later. Is done.
　図６に示すように、吸着ノズル６６により吸着保持されたリード部品１４０のリード１４４が、回路基材１２に形成された貫通孔１４８に挿入される。また、図６のステップ（以下、単に「Ｓ」と記載する）１に示すように、貫通孔１４８の下方に位置している噴流装置１００は、Ｚ方向に沿って回路基材１２に向かって上方へ移動し、貫通孔１４８に挿入されたリード１４４の先端部に、噴流装置１００の噴流ノズル１０８を接近させる。この際の噴流ノズル１０８のＺ方向に沿った接近速度、即ち、噴流装置１００（噴流ノズル１０８）を上昇させる移動速度は、制御データＤ１のパターンのデータに設定されている。なお、移動速度に代えて、あるいは移動速度に加えて噴流ノズル１０８の移動加速度を、制御データＤ１に設定してもよい。 As shown in FIG. 6, the lead 144 of the lead component 140 sucked and held by the suction nozzle 66 is inserted into the through hole 148 formed in the circuit substrate 12. Moreover, as shown in step (hereinafter, simply referred to as “S”) 1 in FIG. 6, the jet device 100 located below the through-hole 148 is directed toward the circuit substrate 12 along the Z direction. Moving upward, the jet nozzle 108 of the jet device 100 is brought close to the tip of the lead 144 inserted into the through hole 148. The approach speed along the Z direction of the jet nozzle 108 at this time, that is, the moving speed for raising the jet apparatus 100 (jet nozzle 108) is set in the pattern data of the control data D1. Instead of the movement speed or in addition to the movement speed, the movement acceleration of the jet nozzle 108 may be set in the control data D1.
　噴流装置１００は、例えば、回路基材１２の下方に移動した際に、噴流ノズル１０８の先端部から溶融はんだ１５０の噴流を開始する。このため、噴流装置１００が所定距離だけ上昇すると、噴流ノズル１０８の先端部から噴流されている溶融はんだ１５０は、リード１４４の先端部に塗布される。この上昇する移動方向（例えばＺ方向）やＺ方向に移動する移動距離は、制御データＤ１のパターンのデータに設定されている。 The jet device 100 starts jetting the molten solder 150 from the tip of the jet nozzle 108 when the jet device 100 moves below the circuit substrate 12, for example. For this reason, when the jet device 100 is raised by a predetermined distance, the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144. The ascending moving direction (for example, the Z direction) and the moving distance for moving in the Z direction are set in the pattern data of the control data D1.
　噴流装置１００は、例えば、所定の高さまで上昇した時点で停止し、その高さ（Ｚ方向における位置）を維持し停止する。上昇位置において、吸着ノズル６６からリード１４４に向かって溶融はんだ１５０が噴流され、リード１４４の先端部及び、回路基材１２の貫通孔１４８に溶融はんだ１５０が塗布される。 The jet device 100 stops when it rises to a predetermined height, for example, and maintains its height (position in the Z direction) and stops. At the raised position, the molten solder 150 is jetted from the suction nozzle 66 toward the lead 144, and the molten solder 150 is applied to the leading end portion of the lead 144 and the through hole 148 of the circuit substrate 12.
　図７は、回路基材１２の基材上面１２Ａから見た塗布作業の状態を模式的に示している。図７に示すように、このパターンでは、回路基材１２を平面視した場合に、噴流ノズル１０８（図６参照）から噴流する溶融はんだ１５０の中央部分を、リード１４４の位置に合わせた状態となっている。因みに、図７に示す噴流した溶融はんだ１５０の直径Ｌ１は、例えば、６ｍｍ～１０ｍｍである。そして、コントローラ１５２は、この中央部分にリード１４４の位置を合わせた状態で、噴流ノズル１０８を回路基材１２から離間する方向へ移動させる（図６のＳ２参照）。例えば、コントローラ１５２は、Ｘ方向及びＹ方向の位置を変えずに、Ｚ方向に沿って噴流ノズル１０８を下降させる（Ｓ２）。 FIG. 7 schematically shows the state of the application work as seen from the substrate upper surface 12A of the circuit substrate 12. As shown in FIG. 7, in this pattern, when the circuit substrate 12 is viewed in plan, the center portion of the molten solder 150 jetted from the jet nozzle 108 (see FIG. 6) is aligned with the position of the lead 144. It has become. Incidentally, the diameter L1 of the molten molten solder 150 shown in FIG. 7 is, for example, 6 mm to 10 mm. Then, the controller 152 moves the jet nozzle 108 in a direction away from the circuit substrate 12 with the position of the lead 144 aligned with the central portion (see S2 in FIG. 6). For example, the controller 152 lowers the jet nozzle 108 along the Z direction without changing the positions in the X direction and the Y direction (S2).
　これによれば、回路基材１２やリード１４４から溶融はんだ１５０を引き離す際に、噴流ノズル１０８から噴流させた溶融はんだ１５０の中央部分、即ち、噴流ノズル１０８から噴流された溶融はんだ１５０の頂点部分で、リード１４４や回路基材１２から溶融はんだ１５０を引き離すことができる。 According to this, when the molten solder 150 is pulled away from the circuit substrate 12 or the lead 144, the central portion of the molten solder 150 jetted from the jet nozzle 108, that is, the apex portion of the molten solder 150 jetted from the jet nozzle 108. Thus, the molten solder 150 can be pulled away from the lead 144 and the circuit substrate 12.
　ここで、図６に示すように、噴流ノズル１０８の先端部から噴流された溶融はんだ１５０は、上方へ移動した後、周囲に（Ｘ方向やＹ方向に）散らばって下降し、噴流ノズル１０８の外周面とノズルカバー１１０の内周面との間を通ってはんだ漕１０６（図３参照）の内部に還流する。このため、図７に示す平面視における溶融はんだ１５０の中央部分（頂点部分）において、噴流ノズル１０８から上方に噴流された溶融はんだ１５０は、Ｚ方向における最も高い位置まで上昇する。また、中央部分において、溶融はんだ１５０の移動方向が上方から下方に転じるため、溶融はんだ１５０の対流の速度は、遅くなる可能性が高い。 Here, as shown in FIG. 6, the molten solder 150 jetted from the tip of the jet nozzle 108 moves upward and then falls scattered around (in the X direction and the Y direction) to lower the jet nozzle 108. It flows between the outer peripheral surface and the inner peripheral surface of the nozzle cover 110 and returns to the inside of the soldering iron 106 (see FIG. 3). Therefore, in the central portion (vertex portion) of the molten solder 150 in a plan view shown in FIG. 7, the molten solder 150 jetted upward from the jet nozzle 108 rises to the highest position in the Z direction. Moreover, since the moving direction of the molten solder 150 turns from the upper side to the lower side in the central portion, the convection speed of the molten solder 150 is likely to be slow.
　換言すれば、周囲に散らばって下降する溶融はんだ１５０は、Ｘ方向やＹ方向に移動しつつ、回路基材１２から離間する方向（Ｚ方向の下方）に向かって重力加速度等に応じて移動する。このため、回路基材１２を平面視した場合、噴流ノズル１０８から噴流される溶融はんだ１５０は、中央からＸ方向やＹ方向に離れるのに従って、対流の速度が速くなる可能性が高い。そして、対流の速度は、Ｘ方向やＹ方向の端部部分において、中央部分（Ｚ方向の上端部）に比べて速くなる可能性が高い。 In other words, the molten solder 150 scattered and descending moves in the X direction and the Y direction, and moves in a direction away from the circuit substrate 12 (downward in the Z direction) according to gravity acceleration or the like. . For this reason, when the circuit substrate 12 is viewed in plan, the molten solder 150 jetted from the jet nozzle 108 is likely to increase the speed of convection as it moves away from the center in the X direction or the Y direction. The convection velocity is likely to be higher in the end portions in the X direction and the Y direction than in the central portion (upper end portion in the Z direction).
　また、中央部分は、周囲に散らばって下降していく溶融はんだ１５０に比べて、噴流ノズル１０８の先端部、即ち、噴流ノズル１０８の開口に近くなる。このため、溶融はんだ１５０の温度は、中央部分において高くなり、周囲に散らばって中央から離れるに従って低下する可能性が高い。換言すれば、周囲に散らばって下降する溶融はんだ１５０、即ち、Ｘ方向やＹ方向における端部部分の溶融はんだ１５０の温度は、低くなる可能性が高い。本実施形態のコントローラ１５２は、このような噴流ノズル１０８、溶融はんだ１５０、リード１４４の位置関係を変更することによって、はんだ付けの品質の向上を図ることが可能となっている。 Also, the central portion is closer to the tip of the jet nozzle 108, that is, the opening of the jet nozzle 108, compared to the molten solder 150 scattered and descending around. For this reason, the temperature of the molten solder 150 is high in the central portion, and is likely to decrease as it is scattered around and away from the center. In other words, there is a high possibility that the temperature of the molten solder 150 that is scattered and scattered around the periphery, that is, the molten solder 150 at the end portion in the X direction or the Y direction, becomes low. The controller 152 of this embodiment can improve the soldering quality by changing the positional relationship among the jet nozzle 108, the molten solder 150, and the lead 144.
　ここで言うはんだ付けの品質とは、例えば、はんだの上がり具合や、はんだ付け後の溶融はんだ１５０内の気泡の有無などである。例えば、はんだ付け後の溶融はんだ１５０の形状が、回路基材１２の基材下面１２Ｂから下方に向かって先細りの形状となっているか否かである（図９参照）。あるいは、貫通孔１４８内に溶融はんだ１５０が十分に充填されているか否かである。また、貫通孔１４８内に充填された溶融はんだ１５０に気泡が発生しているか否かである。このようなはんだ付けの品質は、溶融はんだ１５０の種類、室温、湿度などに応じて変動するが、塗布作業において溶融はんだ１５０をリード１４４や回路基材１２から引き離す際の作動によっても、大きく変動する。そこで、本実施形態のコントローラ１５２は、複数のパターンを切り替えて、引き離す際の作動を変更し、はんだ付けの品質の向上を図ることが可能となっている。 Here, the soldering quality refers to, for example, the degree of solder rising and the presence or absence of bubbles in the molten solder 150 after soldering. For example, it is whether or not the shape of the molten solder 150 after soldering is a taper shape downward from the substrate lower surface 12B of the circuit substrate 12 (see FIG. 9). Alternatively, it is whether or not the molten solder 150 is sufficiently filled in the through hole 148. Further, whether or not bubbles are generated in the molten solder 150 filled in the through holes 148 is determined. The quality of such soldering varies depending on the type of molten solder 150, room temperature, humidity, and the like, but also varies greatly depending on the operation when the molten solder 150 is pulled away from the lead 144 and the circuit substrate 12 during the coating operation. To do. Therefore, the controller 152 of the present embodiment can switch the plurality of patterns, change the operation when separating them, and improve the soldering quality.
　また、噴流装置１００を上昇させた位置において噴流装置１００を停止させる時間は、制御データＤ１のパターンのデータに設定されている。コントローラ１５２は、例えば、上昇位置に到達してから噴流ノズル１０８を回路基材１２から離間させるまでの時間、即ち、リード１４４に溶融はんだ１５０を塗布する時間を計測し、パターンのデータに設定された時間だけ経過すると、噴流ノズル１０８（噴流装置１００）の下降を開始する。従って、コントローラ１５２は、このような上昇位置での停止時間を変更することによっても、はんだ付けの品質の向上を図ることが可能となっている。なお、コントローラ１５２は、噴流ノズル１０８を上昇位置で停止させずに、直ぐに下降させも良い。 The time for stopping the jet device 100 at the position where the jet device 100 is raised is set in the pattern data of the control data D1. The controller 152 measures, for example, the time from reaching the ascending position until the jet nozzle 108 is separated from the circuit substrate 12, that is, the time for applying the molten solder 150 to the lead 144, and is set in the pattern data. After a lapse of time, the jet nozzle 108 (jet device 100) starts to descend. Therefore, the controller 152 can also improve the quality of soldering by changing the stop time at the raised position. Note that the controller 152 may immediately lower the jet nozzle 108 without stopping it at the raised position.
　コントローラ１５２は、図６のＳ２において、噴流装置１００を下降させる際にも、噴流ノズル１０８から溶融はんだ１５０の噴流を継続させる。これにより、噴流する溶融はんだ１５０とリード１４４とが上記した中央部分で引き離され、リード１４４への溶融はんだ１５０の塗布が終了する。なお、噴流装置１００（噴流ノズル１０８）を下降させる移動速度は、制御データＤ１のパターンのデータに設定されている。また、下降の移動速度に代えて、あるいは移動速度に加えて噴流ノズル１０８の移動加速度を、制御データＤ１に設定してもよい。 The controller 152 continues the jet of the molten solder 150 from the jet nozzle 108 even when the jet device 100 is lowered in S2 of FIG. Thereby, the molten solder 150 and the lead 144 that are jetted are separated at the above-described central portion, and the application of the molten solder 150 to the lead 144 is completed. The moving speed for lowering the jet device 100 (jet nozzle 108) is set in the pattern data of the control data D1. Further, instead of the downward movement speed or in addition to the movement speed, the movement acceleration of the jet nozzle 108 may be set in the control data D1.
　また、本実施形態のコントローラ１５２は、リード１４４への溶融はんだ１５０の塗布作業を終了させた後も、吸着ノズル６６によるリード部品１４０の吸着保持を維持する。コントローラ１５２は、所定の時間だけ経過すると、吸着ノズル６６によるリード部品１４０の保持を解除する。なお、コントローラ１５２は、リード１４４を貫通孔１４８に挿入した後、即ち、溶融はんだ１５０の塗布前に、吸着ノズル６６によるリード部品１４０の吸着保持を解除してもよい。あるいは、コントローラ１５２は、例えば、要求されるリード部品１４０の装着精度等に応じて、リード部品１４０の吸着を解除するタイミングを変更してもよい。従って、コントローラ１５２は、このような吸着保持の状態を変更することによっても、はんだ付けの品質の向上を図ることが可能となっている。 In addition, the controller 152 of the present embodiment maintains the suction holding of the lead component 140 by the suction nozzle 66 even after the operation of applying the molten solder 150 to the lead 144 is finished. When a predetermined time has elapsed, the controller 152 releases the holding of the lead component 140 by the suction nozzle 66. The controller 152 may release the suction holding of the lead component 140 by the suction nozzle 66 after inserting the lead 144 into the through hole 148, that is, before applying the molten solder 150. Alternatively, the controller 152 may change the timing of releasing the suction of the lead component 140 according to the required mounting accuracy of the lead component 140, for example. Therefore, the controller 152 can improve the soldering quality also by changing the state of the suction holding.
　以上の作業により、図９に示すように、部品本体部１４２を回路基材１２から浮かせた状態で、リード部品１４０は、回路基材１２に装着される。装着されたリード部品１４０は、回路基材１２にはんだ付けされる。貫通孔１４８に挿入されたリード１４４及び、回路基材１２のリード１４４が挿入された箇所に溶融はんだ１５０が塗布されることで、リード１４４と回路基材１２とが電気的に接続され、電気回路が形成される。 Through the above operation, as shown in FIG. 9, the lead component 140 is mounted on the circuit substrate 12 in a state where the component main body 142 is lifted from the circuit substrate 12. The mounted lead component 140 is soldered to the circuit substrate 12. By applying the molten solder 150 to the lead 144 inserted into the through hole 148 and the location where the lead 144 of the circuit base 12 is inserted, the lead 144 and the circuit base 12 are electrically connected to each other. A circuit is formed.
（溶融はんだ１５０の端部部分で引き離すパターン）
　次に、溶融はんだ１５０の端部部分で引き離すパターンについて説明する。なお、以下の説明では、上記した中央部分で引き離すパターンと同様の内容については、その説明を適宜省略する。図１０は、溶融はんだ１５０の端部部分で噴流ノズル１０８とリード１４４とを離間させ、溶融はんだ１５０を引き離すパターンを示している。 (Pattern separated at the end of the molten solder 150)
Next, a pattern to be separated at the end portion of the molten solder 150 will be described. In the following description, the description of the same contents as those of the pattern separated at the central portion will be omitted as appropriate. FIG. 10 shows a pattern in which the jet nozzle 108 and the lead 144 are separated from each other at the end portion of the molten solder 150 and the molten solder 150 is pulled away.
　まず、図１０のＳ４に示すように、貫通孔１４８の下方に位置している噴流装置１００は、Ｚ方向に沿って回路基材１２に向かって上方へ移動し、貫通孔１４８に挿入されたリード１４４の先端部に、噴流装置１００の噴流ノズル１０８を接近させる。噴流装置１００が所定距離だけ上昇すると、噴流ノズル１０８の先端部から噴流されている溶融はんだ１５０は、リード１４４の先端部に塗布される。 First, as shown in S4 of FIG. 10, the jet device 100 located below the through-hole 148 moves upward toward the circuit substrate 12 along the Z direction and is inserted into the through-hole 148. The jet nozzle 108 of the jet device 100 is brought close to the tip of the lead 144. When the jet device 100 is raised by a predetermined distance, the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144.
　噴流装置１００は、例えば、所定の高さまで上昇した後、その高さ（Ｚ方向における位置）を維持しつつ、Ｘ方向に沿って移動する（Ｓ５）。図８は、回路基材１２の基材上面１２Ａから見た塗布作業の状態を模式的に示している。図８に示すように、このパターンでは、回路基材１２を平面視した場合に、まず、噴流ノズル１０８から噴流する溶融はんだ１５０の中央部分を、リード１４４の位置に合わせた状態となっている。 For example, after the jet device 100 has risen to a predetermined height, the jet device 100 moves along the X direction while maintaining the height (position in the Z direction) (S5). FIG. 8 schematically shows the state of the application work as viewed from the substrate upper surface 12 </ b> A of the circuit substrate 12. As shown in FIG. 8, in this pattern, when the circuit substrate 12 is viewed in plan, first, the central portion of the molten solder 150 that is jetted from the jet nozzle 108 is aligned with the position of the lead 144. .
　次に、図８のＳ５に示すように、噴流ノズル１０８のＸ方向への移動にともなって、Ｘ方向におけるリード１４４に対する溶融はんだ１５０の位置が変更される。回路基材１２を平面視した場合に、噴流ノズル１０８から噴流する溶融はんだ１５０の端部部分が、リード１４４の位置となる。そして、コントローラ１５２は、この端部部分にリード１４４の位置を合わせた状態で、噴流ノズル１０８を回路基材１２から離間する方向へ移動させる（図１０のＳ６）。例えば、コントローラ１５２は、Ｘ方向及びＹ方向の位置を変えずに、Ｚ方向に沿って噴流ノズル１０８を下降させる（Ｓ６）。 Next, as shown in S5 of FIG. 8, as the jet nozzle 108 moves in the X direction, the position of the molten solder 150 with respect to the lead 144 in the X direction is changed. When the circuit substrate 12 is viewed in plan, the end portion of the molten solder 150 jetted from the jet nozzle 108 becomes the position of the lead 144. Then, the controller 152 moves the jet nozzle 108 in a direction away from the circuit base material 12 with the position of the lead 144 aligned with the end portion (S6 in FIG. 10). For example, the controller 152 lowers the jet nozzle 108 along the Z direction without changing the positions in the X direction and the Y direction (S6).
　これによれば、回路基材１２やリード１４４から溶融はんだ１５０を引き離す際に、噴流ノズル１０８から噴流させた溶融はんだ１５０の端部部分で、リード１４４等から溶融はんだ１５０を引き離すことができる。即ち、噴流ノズル１０８から回路基材１２に向けて噴流された後、回路基材１２から離間する方向へ移動（落下）する部分で、リード１４４等から溶融はんだ１５０を引き離すことができる。この端部部分は、上記したように溶融はんだ１５０の対流の速度が早く、溶融はんだ１５０の温度が低くなる可能性が高い。このように、引き離す位置を変更し、溶融はんだ１５０の状態を変更することによって、はんだ付けの品質の向上が期待できる。 According to this, when the molten solder 150 is pulled away from the circuit substrate 12 or the lead 144, the molten solder 150 can be pulled away from the lead 144 or the like at the end portion of the molten solder 150 jetted from the jet nozzle 108. That is, the molten solder 150 can be pulled away from the lead 144 or the like at a portion that moves (drops) in a direction away from the circuit substrate 12 after being jetted from the jet nozzle 108 toward the circuit substrate 12. As described above, the end portion has a high convection speed of the molten solder 150, and the temperature of the molten solder 150 is likely to be low. In this way, by changing the position to be separated and changing the state of the molten solder 150, improvement in soldering quality can be expected.
　コントローラ１５２は、Ｓ６において、噴流装置１００を下降させる際にも、噴流ノズル１０８から溶融はんだ１５０の噴流を継続させる。これにより、溶融はんだ１５０とリード１４４とが上記した端部部分で引き離され、リード１４４への溶融はんだ１５０の塗布が終了する。 The controller 152 continues the jet of the molten solder 150 from the jet nozzle 108 even when the jet device 100 is lowered in S6. Thereby, the molten solder 150 and the lead 144 are separated from each other at the end portion described above, and the application of the molten solder 150 to the lead 144 is completed.
　以上の作業により、図９に示すように、部品本体部１４２を回路基材１２から浮かせた状態で、リード部品１４０は、回路基材１２に装着される。一方、噴流ノズル１０８の作動をパターンに応じて変更したため、はんだ付けの品質が変更される。ユーザは、例えば、上記した中央部分で引き離すパターンで所望の品質を得られない場合に、端部部分で引き離すパターンに変更することで、所望の品質を得ることができる。また、逆に、ユーザは、例えば、端部部分で引き離すパターンで所望の品質を得られない場合に、中央部分で引き離すパターンに変更することで、所望の品質を得ることができる。 Through the above operation, as shown in FIG. 9, the lead component 140 is mounted on the circuit substrate 12 in a state where the component main body 142 is lifted from the circuit substrate 12. On the other hand, since the operation of the jet nozzle 108 is changed according to the pattern, the soldering quality is changed. For example, when the desired quality cannot be obtained with the pattern separated at the center portion described above, the user can obtain the desired quality by changing the pattern to be separated at the end portion. On the other hand, for example, when the desired quality cannot be obtained with the pattern separated at the end portion, the user can obtain the desired quality by changing to the pattern separated at the center portion.
　また、ユーザは、上記したように、表示操作部１５９を操作することで、噴流ノズル１０８の作動を変更するパターンの種類を選択できる。このパターンは、例えば、噴流ノズル１０８の移動距離、移動方向、移動速度、及び移動加速度などの作動条件を変更する様々なパターンのうち、はんだ付けの品質を向上できる可能性が高い事を検証したパターンである。この場合、ユーザは、検証済の信頼性の高い複数のパターンの何れかを選択するだけで作動条件を変更し、はんだ付けの品質を向上できる。また、ユーザは、作動条件の内容を検証等する必要がなくなる。なお、上記したパターンは、メーカー等で検証したパターンに限らず、例えば、ユーザの使用においてはんだ付けの品質を向上できた実績のあるパターンでもよい。 Further, as described above, the user can select the type of pattern for changing the operation of the jet nozzle 108 by operating the display operation unit 159. It was verified that this pattern is likely to improve the soldering quality among various patterns that change the operating conditions such as the moving distance, moving direction, moving speed, and moving acceleration of the jet nozzle 108. It is a pattern. In this case, the user can improve the soldering quality by changing the operating condition simply by selecting one of a plurality of verified highly reliable patterns. Further, the user need not verify the contents of the operating conditions. Note that the above-described pattern is not limited to a pattern verified by a manufacturer or the like, and may be a pattern with a track record of improving soldering quality in use by a user, for example.
　また、はんだ付け装置３６は、上記したように、回路基材１２の平面と平行なＸ、Ｙ方向（平面方向）、及び回路基材１２の平面に対して直交するＺ方向（直交方向）に噴流ノズル１０８（噴流装置１００）を移動可能に構成されている。これによれば、例えば、作動条件を変更する対象である噴流ノズル１０８の移動方向を、Ｘ、Ｙ方向（平面方向）、及びＺ方向（直交方向）の２方向に限定することで、作動条件を変更する制御内容を簡素化して、塗布作業でのコントローラ１５２の処理負荷を軽減できる。 Further, as described above, the soldering device 36 is in the X and Y directions (plane direction) parallel to the plane of the circuit substrate 12 and the Z direction (orthogonal direction) orthogonal to the plane of the circuit substrate 12. The jet nozzle 108 (jet device 100) is configured to be movable. According to this, for example, by restricting the moving direction of the jet nozzle 108 that is the target of changing the operating condition to two directions of X, Y direction (plane direction) and Z direction (orthogonal direction), the operating condition It is possible to simplify the control contents for changing the processing load of the controller 152 in the application work.
（複数のリード１４４に溶融はんだ１５０を塗布する場合）
　ここで、上記した２つのパターンの例では、１つのリード１４４のみに溶融はんだ１５０を塗布する場合について説明したが、複数のリード１４４に溶融はんだ１５０を塗布する場合についても同様に実施することができる。図１１は、２つのリード１４４にまとめて溶融はんだ１５０を塗布する場合を示している。図１２は、２つのリード１４４にまとめて溶融はんだ１５０を塗布する場合であって回路基材１２の基材上面１２Ａから見た塗布作業の状態を模式的に示している。 (When applying molten solder 150 to a plurality of leads 144)
Here, in the example of the two patterns described above, the case where the molten solder 150 is applied to only one lead 144 has been described, but the case where the molten solder 150 is applied to a plurality of leads 144 may be similarly performed. it can. FIG. 11 shows a case where the molten solder 150 is applied to the two leads 144 together. FIG. 12 schematically shows the state of the application work when the molten solder 150 is applied to the two leads 144 and viewed from the substrate upper surface 12 </ b> A of the circuit substrate 12.
　図１１及び図１２に示す例では、噴流ノズル１０８のＸ方向における幅、即ち、噴流した溶融はんだ１５０の直径Ｌ１（図１２参照）が、２つのリード１４４のピッチＬ２（図１２参照）に比べて十分大きくなっている。この場合には、図１２に示すように、回路基材１２を平面視した場合に、噴流ノズル１０８から噴流する溶融はんだ１５０の中央部分を、２つのリード１４４の位置に合わせた状態とすることができる。そして、２つのリード１４４から溶融はんだ１５０を引き離す際に、噴流ノズル１０８から噴流させた溶融はんだ１５０の中央部分で、２つのリード１４４から溶融はんだ１５０を引き離すことができる。 In the example shown in FIGS. 11 and 12, the width of the jet nozzle 108 in the X direction, that is, the diameter L1 (see FIG. 12) of the jetted molten solder 150 is compared with the pitch L2 (see FIG. 12) of the two leads 144. Is large enough. In this case, as shown in FIG. 12, when the circuit substrate 12 is viewed in plan, the central portion of the molten solder 150 that is jetted from the jet nozzle 108 is aligned with the positions of the two leads 144. Can do. When the molten solder 150 is pulled away from the two leads 144, the molten solder 150 can be pulled away from the two leads 144 at the central portion of the molten solder 150 jetted from the jet nozzle 108.
　また、図１３は、２つのリード１４４にまとめて溶融はんだ１５０を塗布する場合であって回路基材１２の基材上面１２Ａから見た塗布作業の状態を模式的に示している。図１３に示す場合では、例えば、まず、上昇位置において、噴流ノズル１０８から噴流する溶融はんだ１５０の端部部分を、２つのリード１４４の位置に合わせた状態とする。そして、図１３のＳ８に示すように、噴流ノズル１０８は、Ｘ方向で対向する２つの端部部分のうち、一方の端部部分を２つのリード１４４に合わせた位置から、他方の端部部分を２つのリード１４４に合わせた位置までＸ方向に沿って移動する。 FIG. 13 schematically shows the state of the application work when the molten solder 150 is applied to the two leads 144 and viewed from the upper surface 12 </ b> A of the circuit substrate 12. In the case shown in FIG. 13, for example, first, the end portion of the molten solder 150 jetted from the jet nozzle 108 is set to the position of the two leads 144 at the raised position. And as shown to S8 of FIG. 13, the jet nozzle 108 is the other edge part from the position which match | combined one edge part with the two lead 144 among the two edge parts which oppose in X direction. Is moved along the X direction to a position aligned with the two leads 144.
　即ち、図１３に示す例では、図８の場合とは異なり、溶融はんだ１５０の端部部分でリード１４４への塗布を開始し、端部部分で溶融はんだ１５０とリード１４４との引き離しを実行している。このような作動のパターンにおいても、溶融はんだ１５０を引き離す状態を変更することによって、はんだ付けの品質の向上が期待できる。 That is, in the example shown in FIG. 13, unlike the case of FIG. 8, application to the lead 144 is started at the end portion of the molten solder 150, and the molten solder 150 and the lead 144 are separated from each other at the end portion. ing. Even in such an operation pattern, improvement in soldering quality can be expected by changing the state of separating the molten solder 150.
（離間する方向へ移動した後に戻るパターン）
　次に、噴流ノズル１０８を回路基材１２から離間する方向に移動させた後、再度、回路基材１２（リード１４４）に接近する方向へ移動させるパターンについて説明する。なお、以下の説明では、上記した各パターンと同様の内容については、その説明を適宜省略する。図１４は、噴流ノズル１０８を一度離間させた後に再度接近させ、その後に溶融はんだ１５０を引き離すパターンを示している。 (Pattern that returns after moving away)
Next, a pattern in which the jet nozzle 108 is moved in a direction away from the circuit substrate 12 and then moved again in a direction approaching the circuit substrate 12 (lead 144) will be described. In the following description, the description of the same contents as the above-described patterns is omitted as appropriate. FIG. 14 shows a pattern in which the jet nozzle 108 is once separated and then approached again, and then the molten solder 150 is pulled away.
　まず、図１４のＳ１０に示すように、貫通孔１４８の下方に位置している噴流装置１００は、Ｚ方向に沿って回路基材１２に向かって上方へ移動し、貫通孔１４８に挿入されたリード１４４の先端部に、噴流装置１００の噴流ノズル１０８を接近させる。噴流装置１００が所定距離だけ上昇すると、噴流ノズル１０８の先端部から噴流されている溶融はんだ１５０は、リード１４４の先端部に塗布される。 First, as shown in S <b> 10 of FIG. 14, the jet device 100 located below the through-hole 148 moves upward toward the circuit substrate 12 along the Z direction and is inserted into the through-hole 148. The jet nozzle 108 of the jet device 100 is brought close to the tip of the lead 144. When the jet device 100 is raised by a predetermined distance, the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144.
　次に、噴流装置１００は、リード１４４の先端部に接近した高さまで上昇した後、所定の距離だけ下降する（Ｓ１１）。噴流装置１００は、例えば、Ｘ方向及びＹ方向における位置を固定したまま、Ｚ方向に沿って下方へ所定距離だけ移動する。例えば、噴流装置１００を所定距離だけ下げた場合、噴流ノズル１０８から噴流される溶融はんだ１５０は、リード１４４の先端に到達している。即ち、所定距離を短い距離に設定し、Ｓ１１で下降させた位置においても、溶融はんだ１５０は、リード１４４に塗布される。 Next, the jet device 100 rises to a height close to the tip of the lead 144 and then descends by a predetermined distance (S11). For example, the jet device 100 moves downward by a predetermined distance along the Z direction while fixing the positions in the X direction and the Y direction. For example, when the jet device 100 is lowered by a predetermined distance, the molten solder 150 jetted from the jet nozzle 108 reaches the tip of the lead 144. That is, the molten solder 150 is applied to the lead 144 even at the position where the predetermined distance is set to a short distance and lowered in S11.
　なお、Ｓ１１において噴流装置１００を所定距離だけ下げた場合、噴流ノズル１０８から噴流される溶融はんだ１５０は、リード１４４の先端に到達していなくとも良い。即ち、Ｓ１２の下降にともなって溶融はんだ１５０とリード１４４とを引き離しても良い。この場合、一度引き離された溶融はんだ１５０が、再度同じリード１４４に塗布されることとなる。 When the jet device 100 is lowered by a predetermined distance in S11, the molten solder 150 jetted from the jet nozzle 108 does not have to reach the tip of the lead 144. That is, the molten solder 150 and the lead 144 may be separated as S12 descends. In this case, the molten solder 150 once separated is applied to the same lead 144 again.
　次に、下降させた噴流装置１００を、再び回路基材１２に向けて上昇させる（Ｓ１２）。噴流ノズル１０８の先端部から噴流されている溶融はんだ１５０は、リード１４４の先端部に塗布される。噴流装置１００は、例えば、Ｘ方向及びＹ方向における位置を固定したまま、Ｚ方向に沿って上方へ所定距離だけ移動する。Ｓ１２の所定距離は、例えば、Ｓ１１と同一距離である。即ち、噴流装置１００は、Ｓ１１で下降した距離だけ、Ｓ１２で上昇する。なお、噴流装置１００は、Ｓ１１で下降した移動距離に比べて短い移動距離だけＳ１２で上昇してもよい。この場合、Ｓ１２で上昇した噴流装置１００は、Ｓ１１で上昇した位置に比べて下方の位置となる。 Next, the lowered jet device 100 is raised again toward the circuit substrate 12 (S12). The molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144. For example, the jet device 100 moves upward by a predetermined distance along the Z direction while fixing the positions in the X direction and the Y direction. The predetermined distance in S12 is, for example, the same distance as S11. That is, the jet flow device 100 is raised at S12 by the distance lowered at S11. The jet device 100 may be lifted at S12 by a short moving distance compared to the moving distance lowered at S11. In this case, the jet device 100 that has been lifted in S12 has a lower position than the position that has been lifted in S11.
　そして、コントローラ１５２は、Ｓ１２で噴流装置１００を再度上昇させた後、噴流装置１００（噴流ノズル１０８）を回路基材１２から離間する方向へ移動させる（Ｓ１３）。例えば、コントローラ１５２は、Ｘ方向及びＹ方向の位置を変えずに、Ｚ方向に沿って噴流ノズル１０８を下降させる（Ｓ１３）。 Then, the controller 152 raises the jet device 100 again in S12, and then moves the jet device 100 (jet nozzle 108) in a direction away from the circuit substrate 12 (S13). For example, the controller 152 lowers the jet nozzle 108 along the Z direction without changing the positions in the X direction and the Y direction (S13).
　このパターンでは、噴流ノズル１０８を一度、回路基材１２から離間させた後に、噴流ノズル１０８を再び回路基材１２側へ移動させることで、下降前に塗布した溶融はんだ１５０を上昇しながら貫通孔１４８内へ押し込むことが可能となる。これにより、はんだの上がり具合の向上や、貫通孔１４８に充填された溶融はんだ１５０における気泡の発生の低減が期待できる。 In this pattern, after the jet nozzle 108 is once separated from the circuit base material 12, the jet nozzle 108 is moved again to the circuit base material 12 side, so that the molten solder 150 applied before the lowering is lifted and the through hole is lifted. It can be pushed into 148. As a result, it is possible to expect an improvement in the degree of solder rising and a reduction in the generation of bubbles in the molten solder 150 filled in the through holes 148.
　コントローラ１５２は、Ｓ１３において、噴流装置１００を下降させる際にも、噴流ノズル１０８から溶融はんだ１５０の噴流を継続させる。これにより、溶融はんだ１５０とリード１４４とが上記した中央部分で引き離され、リード１４４への溶融はんだ１５０の塗布が終了する。 The controller 152 continues the jet of the molten solder 150 from the jet nozzle 108 even when the jet device 100 is lowered in S13. Thereby, the molten solder 150 and the lead 144 are separated from each other at the above-described central portion, and the application of the molten solder 150 to the lead 144 is completed.
　なお、上記したパターンでは、コントローラ１５２は、Ｓ１１の下降と、Ｓ１２の上昇とをそれぞれ１回実行したが、複数回実行してもよい。即ち、噴流ノズル１０８を複数回上下動させてもよい。これにより、はんだの上がり具合のさらなる向上等が期待できる。また、コントローラ１５２は、上記した再度上昇するパターンにおいて、溶融はんだ１５０とリード１４４とを端部部分で引き離すように噴流装置１００（はんだ付け装置３６）を制御してもよい。また、コントローラ１５２は、上記したＳ１０～Ｓ１３の各々における噴流装置１００（噴流ノズル１０８）の移動速度や移動加速度を異なる速度等に変更しても良い。 In the above-described pattern, the controller 152 executes the descending of S11 and the ascending of S12 once, but may be performed a plurality of times. That is, the jet nozzle 108 may be moved up and down a plurality of times. Thereby, the further improvement of the solder rising condition, etc. can be expected. Further, the controller 152 may control the jet device 100 (soldering device 36) so that the molten solder 150 and the lead 144 are separated at the end portion in the above-described rising pattern. The controller 152 may change the moving speed and moving acceleration of the jet device 100 (jet nozzle 108) in each of S10 to S13 described above to different speeds.
（引き離す際に加速するパターン）
　次に、溶融はんだ１５０をリード１４４や回路基材１２から引き離す際に、噴流ノズル１０８の移動速度や移動加速度を速くするパターンについて説明する。なお、以下の説明では、上記した各パターンと同様の内容については、その説明を適宜省略する。図１５は、噴流ノズル１０８を回路基材１２から離間させる際に加速させ、溶融はんだ１５０をリード１４４等から引き離すパターンを示している。 (Pattern that accelerates when pulling apart)
Next, a pattern for increasing the moving speed and moving acceleration of the jet nozzle 108 when the molten solder 150 is pulled away from the lead 144 and the circuit substrate 12 will be described. In the following description, the description of the same contents as the above-described patterns is omitted as appropriate. FIG. 15 shows a pattern in which the jet nozzle 108 is accelerated when being separated from the circuit substrate 12 and the molten solder 150 is separated from the leads 144 and the like.
　まず、図１５のＳ１５に示すように、貫通孔１４８の下方に位置している噴流装置１００は、Ｚ方向に沿って回路基材１２に向かって上方へ移動し、貫通孔１４８に挿入されたリード１４４の先端部に、噴流装置１００の噴流ノズル１０８を接近させる。噴流装置１００が所定距離だけ上昇すると、噴流ノズル１０８の先端部から噴流されている溶融はんだ１５０は、リード１４４の先端部に塗布される。 First, as shown in S15 of FIG. 15, the jet device 100 located below the through-hole 148 moves upward toward the circuit substrate 12 along the Z direction and is inserted into the through-hole 148. The jet nozzle 108 of the jet device 100 is brought close to the tip of the lead 144. When the jet device 100 is raised by a predetermined distance, the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144.
　噴流装置１００は、例えば、所定の高さまで上昇した後、その高さ（Ｚ方向における位置）を維持する。次に、噴流装置１００は、回路基材１２から離間する方向への移動を開始する。噴流装置１００は、例えば、Ｘ方向及びＹ方向における位置を固定したまま、Ｚ方向に沿って下降する。この際、コントローラ１５２は、下降の初期において噴流ノズル１０８（噴流装置１００）をゆっくりと下降させる（Ｓ１６）。そして、コントローラ１５２は、ゆっくりとした速度で噴流ノズル１０８を下降させた後（Ｓ１６）、噴流ノズル１０８の下降する速度を速くする。即ち、コントローラ１５２は、下降における初期（Ｓ１６）の移動速度に比べて、後期（Ｓ１７）の移動速度を速くする。 The jet device 100, for example, maintains its height (position in the Z direction) after rising to a predetermined height. Next, the jet device 100 starts moving in a direction away from the circuit substrate 12. For example, the jet device 100 descends along the Z direction while fixing the positions in the X direction and the Y direction. At this time, the controller 152 slowly lowers the jet nozzle 108 (jet device 100) at the initial stage of lowering (S16). The controller 152 lowers the jet nozzle 108 at a slow speed (S16), and then increases the speed at which the jet nozzle 108 descends. That is, the controller 152 increases the movement speed in the later period (S17) as compared to the movement speed in the initial stage (S16) in the descent.
　これによれば、噴流装置１００が下降し、噴流される溶融はんだ１５０の上端とリード１４４の先端（下端）とが近づいてくると、噴流装置１００は、下降する速度を速くする。従って、溶融はんだ１５０の上端（頂点）とリード１４４の先端とを引き離す際に素早く引き離すことができる。その結果、図９に示すように、リード１４４に塗布された溶融はんだ１５０の形状を、基材下面１２Ｂから下方に向かうに従って先細りした形状、即ち、基材下面１２Ｂから山形に立設した形状にできる。従って、はんだ付けの品質の向上が期待できる。 According to this, when the jet device 100 descends and the upper end of the molten solder 150 to be jetted approaches the tip (lower end) of the lead 144, the jet device 100 increases the descending speed. Accordingly, when the upper end (vertex) of the molten solder 150 and the tip of the lead 144 are separated, they can be quickly separated. As a result, as shown in FIG. 9, the shape of the molten solder 150 applied to the lead 144 is tapered from the lower surface 12B of the substrate toward the lower side, that is, a shape standing upright from the lower surface 12B of the substrate. it can. Therefore, improvement in soldering quality can be expected.
　そして、コントローラ１５２は、Ｓ１７において、噴流装置１００を下降させる際にも、噴流ノズル１０８から溶融はんだ１５０の噴流を継続させる。これにより、溶融はんだ１５０とリード１４４とが引き離され、リード１４４への溶融はんだ１５０の塗布が終了する。 And the controller 152 continues the jet of the molten solder 150 from the jet nozzle 108 also when lowering the jet apparatus 100 in S17. Thereby, the molten solder 150 and the lead 144 are separated from each other, and the application of the molten solder 150 to the lead 144 is completed.
　なお、コントローラ１５２は、噴流ノズル１０８の移動速度に代えて、あるいは移動速度に加えて移動加速度を変更してもよい。例えば、コントローラ１５２は、Ｓ１６の移動加速度に比べて、Ｓ１７の移動加速度を速くしてもよい。また、コントローラ１５２は、Ｓ１６の移動速度に比べて、Ｓ１７の移動速度を遅くしてもよい。即ち、下降の初期の移動速度に比べて、後期の移動速度を遅くしてもよい。これにより、溶融はんだ１５０の上端とリード１４４の先端とをゆっくりと引き離すことができる。その結果、噴流ノズル１０８の作動の変更により、はんだ付けの品質の向上が期待できる。また、コントローラ１５２は、Ｓ１６からＳ１７へと移行し、１段階だけ加速したが、複数段階加速してもよい。また、コントローラ１５２は、上記した加速するパターンにおいて、溶融はんだ１５０とリード１４４とを図１０に示す端部部分で引き離すように噴流装置１００を制御してもよい。 Note that the controller 152 may change the movement acceleration instead of the movement speed of the jet nozzle 108 or in addition to the movement speed. For example, the controller 152 may increase the movement acceleration in S17 compared to the movement acceleration in S16. Moreover, the controller 152 may make the moving speed of S17 slower than the moving speed of S16. That is, the movement speed in the latter period may be made slower than the initial movement speed of the descent. Thereby, the upper end of the molten solder 150 and the tip of the lead 144 can be slowly separated. As a result, improvement in soldering quality can be expected by changing the operation of the jet nozzle 108. Further, the controller 152 shifts from S16 to S17 and accelerates by one step, but may accelerate by a plurality of steps. Further, the controller 152 may control the jet device 100 so that the molten solder 150 and the lead 144 are separated at the end portion shown in FIG.
（階段状に移動するパターン）
　次に、噴流ノズル１０８を下降させる際に階段状に移動させ、リード１４４や回路基材１２から溶融はんだ１５０を引き離すパターンについて説明する。なお、以下の説明では、上記した各パターンと同様の内容については、その説明を適宜省略する。図１６は、噴流ノズル１０８を階段状に移動させるパターンを示している。 (Pattern that moves in a staircase pattern)
Next, a pattern in which the molten solder 150 is moved away from the lead 144 and the circuit substrate 12 when the jet nozzle 108 is lowered will be described. In the following description, the description of the same contents as the above-described patterns is omitted as appropriate. FIG. 16 shows a pattern in which the jet nozzle 108 is moved stepwise.
　まず、図１６のＳ１９に示すように、貫通孔１４８の下方に位置している噴流装置１００は、Ｚ方向に沿って回路基材１２に向かって上方へ移動し、貫通孔１４８に挿入されたリード１４４の先端部に、噴流装置１００の噴流ノズル１０８を接近させる。噴流装置１００が所定距離だけ上昇すると、噴流ノズル１０８の先端部から噴流されている溶融はんだ１５０は、リード１４４の先端部に塗布される。 First, as shown in S <b> 19 of FIG. 16, the jet device 100 located below the through-hole 148 moves upward toward the circuit substrate 12 along the Z direction and is inserted into the through-hole 148. The jet nozzle 108 of the jet device 100 is brought close to the tip of the lead 144. When the jet device 100 is raised by a predetermined distance, the molten solder 150 jetted from the tip of the jet nozzle 108 is applied to the tip of the lead 144.
　噴流装置１００は、例えば、所定の高さまで上昇した後、その高さ（Ｚ方向における位置）を維持しつつ、Ｘ方向に沿って所定距離だけ移動する（Ｓ２０）。さらに、噴流装置１００は、Ｘ方向に移動した後、所定距離だけＺ方向に沿って下降する（Ｓ２０）。コントローラ１５２は、このＸ方向への移動と、Ｚ方向への移動とを繰り返し噴流装置１００に実行させる。噴流装置１００は、図１６に示すように、階段状に下降しながら回路基材１２から離間する。 The jet device 100, for example, moves up to a predetermined height, and then moves by a predetermined distance along the X direction while maintaining the height (position in the Z direction) (S20). Furthermore, after moving in the X direction, the jet device 100 descends along the Z direction by a predetermined distance (S20). The controller 152 causes the jet device 100 to repeatedly execute the movement in the X direction and the movement in the Z direction. As shown in FIG. 16, the jet device 100 moves away from the circuit substrate 12 while descending stepwise.
　Ｘ方向及びＺ方向のそれぞれの１回の移動は、溶融はんだ１５０とリード１４４とが引き離されない範囲内で実行される。Ｘ方向の１回の移動距離は、例えば、図７に示す平面視における噴流した溶融はんだ１５０の中心と端部との間の距離、即ち、直径Ｌ１の半分（半径）を分割した距離を設定できる。これにより、噴流ノズル１０８は、リード１４４と溶融はんだ１５０とが接触する位置を、溶融はんだ１５０の中心から端部に向かって複数の段階に変更して移動する。 The single movement in each of the X direction and the Z direction is executed within a range where the molten solder 150 and the lead 144 are not separated. The one-time movement distance in the X direction is set, for example, as a distance between the center and the end of the jetted molten solder 150 in a plan view shown in FIG. 7, that is, a distance obtained by dividing a half (radius) of the diameter L1. it can. As a result, the jet nozzle 108 moves by changing the position where the lead 144 and the molten solder 150 are in contact from the center of the molten solder 150 toward the end in a plurality of stages.
　また、Ｚ方向の１回の移動距離は、例えば、Ｓ１９で噴流装置１００を上昇させた上端の位置と、リード１４４と溶融はんだ１５０とが引き離されるまで噴流装置１００を下降させた位置との間の距離を分割した距離を設定できる。これにより、噴流ノズル１０８は、上昇してリード１４４に溶融はんだ１５０を塗布した位置から、リード１４４と溶融はんだ１５０とが引き離される位置まで、複数の段階に分けて移動する。 The one-time movement distance in the Z direction is, for example, between the position of the upper end where the jet apparatus 100 is raised in S19 and the position where the jet apparatus 100 is lowered until the lead 144 and the molten solder 150 are separated. A distance obtained by dividing the distance can be set. As a result, the jet nozzle 108 moves in a plurality of stages from the position where the molten solder 150 is applied to the lead 144 to the position where the lead 144 and the molten solder 150 are separated.
　図１６のＳ２０に示すように、噴流ノズル１０８のＸ方向への移動にともなって、Ｘ方向におけるリード１４４に対する溶融はんだ１５０の位置が変更される。また、噴流ノズル１０８のＺ方向への移動にともなって、溶融はんだ１５０の上端の位置は、リード１４４の基端側（基材下面１２Ｂ側）から先端側に向かって移動する。そして、コントローラ１５２は、噴流ノズル１０８（噴流装置１００）を階段状に移動させながら、溶融はんだ１５０とリード１４４とを引き離す。 16, as the jet nozzle 108 moves in the X direction, the position of the molten solder 150 relative to the lead 144 in the X direction is changed. Further, as the jet nozzle 108 moves in the Z direction, the position of the upper end of the molten solder 150 moves from the base end side (base material lower surface 12B side) of the lead 144 toward the front end side. Then, the controller 152 separates the molten solder 150 and the lead 144 while moving the jet nozzle 108 (jet device 100) stepwise.
　上記したように、コントローラ１５２は、回路基材１２の平面と平行なＸ方向（平面方向）への噴流ノズル１０８の移動と、回路基材１２の平面に対して直交するＺ方向（直交方向）で且つ回路基材１２から離間する方向（下方）への噴流ノズル１０８の移動とを交互に繰り返すように噴流装置１００を制御する。これによれば、回路基材１２やリード１４４から溶融はんだ１５０を引き離す際に、噴流ノズル１０８を回路基材１２から離間する方向へ階段状に移動させることができる。その結果、リード１４４と溶融はんだ１５０とを引き離す際の作動を変更することで、はんだ付けの品質の向上が期待できる。 As described above, the controller 152 moves the jet nozzle 108 in the X direction (plane direction) parallel to the plane of the circuit substrate 12 and the Z direction (orthogonal direction) orthogonal to the plane of the circuit substrate 12. In addition, the jet device 100 is controlled so as to alternately repeat the movement of the jet nozzle 108 in the direction away from the circuit substrate 12 (downward). According to this, when the molten solder 150 is pulled away from the circuit substrate 12 or the lead 144, the jet nozzle 108 can be moved stepwise in a direction away from the circuit substrate 12. As a result, improvement in soldering quality can be expected by changing the operation at the time of separating the lead 144 and the molten solder 150.
　なお、制御装置３８のコントローラ１５２は、図４に示すように、塗布部１６０と、作動変更部１６２と、受付部１６４とを有している。この塗布部１６０は、貫通孔１４８に挿入されたリード１４４に、噴流装置１００によって溶融はんだ１５０を塗布する塗布作業を実行するための機能部である。作動変更部１６２は、塗布部１６０の塗布作業における噴流ノズル１０８の作動を変更するための機能部である。受付部１６４は、噴流ノズル１０８の作動を変更するデータ（制御データＤ１）の複数のパターンのうち、何れのパターンのデータを作動変更部１６２に実行させるのかを受け付けるための機能部である。 In addition, the controller 152 of the control apparatus 38 has the application part 160, the operation | movement change part 162, and the reception part 164, as shown in FIG. The application unit 160 is a functional unit for performing an application operation of applying the molten solder 150 to the lead 144 inserted into the through hole 148 by the jet device 100. The operation changing unit 162 is a functional unit for changing the operation of the jet nozzle 108 in the application operation of the application unit 160. The receiving unit 164 is a functional unit for receiving which pattern data of the plurality of patterns of data (control data D1) for changing the operation of the jet nozzle 108 is to be executed by the operation changing unit 162.
　因みに、上記実施形態において、部品実装機１０は、対基板作業機の一例である。貫通孔１４８は、貫通部の一例である。回路基材１２は、基板の一例である。基材搬送保持装置２２は、基板保持装置の一例である。はんだ付け装置３６は、噴流装置の一例である。 Incidentally, in the above-described embodiment, the component mounting machine 10 is an example of a substrate working machine. The through hole 148 is an example of a through part. The circuit base 12 is an example of a substrate. The substrate conveyance holding device 22 is an example of a substrate holding device. The soldering device 36 is an example of a jet device.
　以上、上記した本実施形態では、以下の効果を奏する。
　制御装置３８のコントローラ１５２（塗布部１６０）は、回路基材１２（基板）の貫通孔１４８（貫通部）に挿入されたリード１４４に、噴流装置１００の噴流ノズル１０８から溶融はんだ１５０を噴流させ塗布する。コントローラ１５２（作動変更部１６２）は、この塗布部１６０による塗布作業における噴流ノズル１０８の作動を変更する。作動変更部１６２は、噴流ノズル１０８の移動距離、移動方向、移動速度、及び移動加速度の４つの作動条件のうち、少なくとも１つの作動条件を変更する。これにより、回路基材１２やリード１４４から溶融はんだ１５０を引き離す際の作動を変更でき、はんだ付けの品質を向上できる。 As described above, the above-described embodiment has the following effects.
The controller 152 (application unit 160) of the control device 38 causes the molten solder 150 to jet from the jet nozzle 108 of the jet device 100 to the lead 144 inserted into the through hole 148 (through portion) of the circuit base 12 (substrate). Apply. The controller 152 (operation change unit 162) changes the operation of the jet nozzle 108 in the application work by the application unit 160. The operation changing unit 162 changes at least one of the four operating conditions of the moving distance, moving direction, moving speed, and moving acceleration of the jet nozzle 108. Thereby, the operation | movement at the time of pulling away the molten solder 150 from the circuit base material 12 or the lead 144 can be changed, and the quality of soldering can be improved.
　なお、本願は、上記実施形態に限定されるものではなく、当業者の知識に基づいて種々の変更、改良を施した種々の態様で実施することが可能である。
　例えば、上記実施形態では、本願の対基板作業機として、部品装着装置２４を備え、作業ヘッド６０，６２によってリード部品１４０を回路基材１２に装着する部品実装機１０を採用したが、これに限らない。本願の対基板作業機は、例えば、リード部品１４０の装着作業を実施せず、溶融はんだ１５０を塗布するだけの構成でも良い。例えば、対基板作業機は、既にリード部品１４０を装着した回路基材１２を搬入し、はんだ付けのみを実施する構成でも良い。この場合、対基板作業機は、部品装着装置２４や部品供給装置３０を備えなくとも良い。
　また、制御データＤ１には、噴流ノズル１０８の移動距離、移動方向、移動速度、及び移動加速度の作動条件のうち、少なくとも１つの作動条件を変更するデータが、複数のパターン設定されていた。しかしながら、制御データＤ１は、変更するパターンを１つだけ有する構成でもよい。 In addition, this application is not limited to the said embodiment, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art.
For example, in the above-described embodiment, the component mounting apparatus 10 that includes the component mounting device 24 and mounts the lead component 140 on the circuit base 12 by the work heads 60 and 62 is employed as the substrate working machine of the present application. Not exclusively. The substrate working machine of the present application may have a configuration in which, for example, the molten solder 150 is simply applied without performing the mounting operation of the lead component 140. For example, the substrate working machine may be configured to carry in the circuit base material 12 on which the lead component 140 has already been mounted and to perform only the soldering. In this case, the substrate work machine may not include the component mounting device 24 and the component supply device 30.
In the control data D1, data for changing at least one of the operating conditions of the moving distance, moving direction, moving speed, and moving acceleration of the jet nozzle 108 is set in a plurality of patterns. However, the control data D1 may have a configuration having only one pattern to be changed.
　また、制御データＤ１は、予め設定されたパターンのデータを有しなくとも良い。例えば、制御装置３８は、ユーザによって制御データＤ１を変更可能な構成でもよい。この場合、ユーザは、パターンを選択するのではなく、制御データＤ１を直接変更する、即ち、噴流ノズル１０８の移動距離の長さや、移動速度の大きさなどを変更することで、噴流ノズル１０８の作動を変更することが可能となる。 Further, the control data D1 does not have to have data of a preset pattern. For example, the control device 38 may be configured such that the control data D1 can be changed by the user. In this case, the user does not select the pattern but directly changes the control data D1, that is, by changing the length of the moving distance of the jet nozzle 108, the magnitude of the moving speed, and the like. It becomes possible to change the operation.
　また、コントローラ１５２は、噴流ノズル１０８を、回路基材１２の平面に平行な平面方向（Ｘ方向、Ｙ方向）、及び平面に直交する直交方向（Ｚ方向）に移動させたが、これに限らない。例えば、コントローラ１５２は、回路基材１２の平面に対して所定の角度をなす斜め方向に噴流ノズル１０８を移動させてもよい。この場合にも、溶融はんだ１５０をリード１４４から引き離す作動を変更し、はんだ付けの品質向上が期待できる。
　また、上記実施形態では、部品本体部１４２が回路基材１２から浮いた状態でリード部品１４０が回路基材１２に装着されているが、部品本体部１４２が回路基材１２に接触した状態でリード部品１４０が回路基材１２に装着されてもよい。
　また、上記実施形態では、本願の貫通部として、貫通孔１４８を採用したが、これに限らない。貫通部は、回路基材１２を上下方向に貫いていればよく、切欠きなどでも良い。 In addition, the controller 152 moves the jet nozzle 108 in a plane direction (X direction, Y direction) parallel to the plane of the circuit substrate 12 and an orthogonal direction (Z direction) orthogonal to the plane, but this is not limitative. Absent. For example, the controller 152 may move the jet nozzle 108 in an oblique direction that forms a predetermined angle with respect to the plane of the circuit substrate 12. Also in this case, the operation of pulling the molten solder 150 away from the lead 144 is changed, and improvement in soldering quality can be expected.
In the above embodiment, the lead component 140 is mounted on the circuit substrate 12 with the component body 142 floating from the circuit substrate 12, but the component body 142 is in contact with the circuit substrate 12. The lead component 140 may be attached to the circuit substrate 12.
Moreover, in the said embodiment, although the through-hole 148 was employ | adopted as a penetration part of this application, it is not restricted to this. The penetration part should just penetrate the circuit base material 12 in the up-down direction, and a notch etc. may be sufficient as it.
　１０　部品実装機（対基板作業機）、１２　回路基材（基板）、２２　基材搬送保持装置（基板保持装置）、３６　はんだ付け装置（噴流装置）、３８　制御装置、１０８　噴流ノズル、１４０　リード部品、１４４　リード、１４８　貫通孔（貫通部）、１５０　溶融はんだ、１６０　塗布部、１６２　作動変更部、１６４　受付部。 10 component mounting machine (to board work machine), 12 circuit base material (board), 22 base material transport and holding device (board holding device), 36 soldering device (jet device), 38 control device, 108 jet nozzle, 140 lead Parts, 144 lead, 148 through hole (penetration part), 150 molten solder, 160 application part, 162 operation change part, 164 reception part.

Claims (8)

  1. 　貫通部を形成された基板を保持する基板保持装置と、
    　前記貫通部にリードを挿入されたリード部品に対し、噴流ノズルから溶融はんだを噴流させ、前記貫通部に挿入された前記リードに前記溶融はんだを塗布する噴流装置と、
    　制御装置と、を備え、
    　前記制御装置は、
    　前記貫通部に挿入された前記リードに、前記噴流装置によって前記溶融はんだを塗布する塗布作業を実行する塗布部と、
    　前記塗布作業における前記噴流ノズルの作動を変更する作動変更部と、
    を有し、
    　前記作動変更部は、前記噴流ノズルの移動距離、前記噴流ノズルの移動方向、前記噴流ノズルの移動速度、及び前記噴流ノズルの移動加速度の作動条件のうち、少なくとも１つの作動条件を変更し、前記リードに塗布される前記溶融はんだの状態を変更する、対基板作業機。     A substrate holding device for holding the substrate on which the penetrating portion is formed;
    A jet device that jets molten solder from a jet nozzle to a lead component having a lead inserted in the penetrating portion, and applies the molten solder to the lead inserted in the penetrating portion;
    A control device,
    The control device includes:
    An application unit that performs an application operation of applying the molten solder to the leads inserted into the penetration part by the jet device;
    An operation changing unit for changing the operation of the jet nozzle in the coating operation;
    Have
    The operation changing unit changes at least one of the operating conditions of the moving distance of the jet nozzle, the moving direction of the jet nozzle, the moving speed of the jet nozzle, and the moving acceleration of the jet nozzle, A substrate working machine that changes a state of the molten solder applied to the lead.
  2. 　前記制御装置は、
    　前記作動条件のうち、少なくとも１つの作動条件を変更するデータを複数のパターン有する制御データと、
    　複数の前記パターンのうち、何れのパターンのデータを前記作動変更部に実行させるのかを受け付ける受付部を有する、請求項１に記載の対基板作業機。     The control device includes:
    Control data having a plurality of patterns of data for changing at least one of the operating conditions, and
    The work apparatus for a substrate according to claim 1, further comprising a receiving unit that receives which pattern of the plurality of patterns is to be executed by the operation changing unit.
  3. 　前記噴流装置は、前記基板の平面と平行な平面方向、及び前記基板の平面に対して直交する直交方向に前記噴流ノズルを移動可能に構成される、請求項１又は請求項２に記載の対基板作業機。 3. The pair according to claim 1, wherein the jet device is configured to be able to move the jet nozzle in a plane direction parallel to a plane of the substrate and an orthogonal direction orthogonal to the plane of the substrate. Board work machine.
  4. 　前記作動変更部は、前記基板を平面視した場合に、前記噴流ノズルから噴流する前記溶融はんだの中央部分を前記リードの位置に合わせた状態で、前記噴流ノズルを前記基板から離間する方向へ移動させるように前記作動条件を変更する、請求項１乃至請求項３の何れかに記載の対基板作業機。 The operation changing unit moves the jet nozzle away from the substrate in a state where the central portion of the molten solder jetted from the jet nozzle is aligned with the position of the lead when the substrate is viewed in plan. The substrate working machine according to any one of claims 1 to 3, wherein the operating condition is changed so as to cause the operation to be performed.
  5. 　前記作動変更部は、前記基板を平面視した場合に、前記噴流ノズルから噴流する前記溶融はんだの端部部分を前記リードの位置に合わせた状態で、前記噴流ノズルを前記基板から離間する方向へ移動させるように前記作動条件を変更する、請求項１乃至請求項３の何れかに記載の対基板作業機。 The operation changing unit is configured to move the jet nozzle away from the substrate in a state where the end portion of the molten solder jetted from the jet nozzle is aligned with the position of the lead when the substrate is viewed in plan. The substrate working machine according to any one of claims 1 to 3, wherein the operating condition is changed so as to be moved.
  6. 　前記作動変更部は、前記噴流ノズルを前記基板から離間する方向へ移動させた後に、前記噴流ノズルを再び前記基板に接近する方向へ移動させるように前記作動条件を変更する、請求項１乃至請求項５の何れかに記載の対基板作業機。 The said operation change part changes the said operation condition so that the said jet nozzle may be moved to the direction which approaches the said board | substrate again after moving the said jet nozzle in the direction which leaves | separates from the said board | substrate. Item 6. The substrate work machine according to any one of Items 5 to 6.
  7. 　前記作動変更部は、前記噴流ノズルを前記基板から離間させ前記リードと噴流する前記溶融はんだとを引き離す際に、前記噴流ノズルの前記移動速度及び前記移動加速度のうち少なくとも一方を速くする、請求項１乃至請求項６の何れかに記載の対基板作業機。 The operation changing unit increases at least one of the moving speed and the moving acceleration of the jet nozzle when the jet nozzle is separated from the substrate and the lead and the molten solder jetted are separated. The substrate work machine in any one of Claim 1 thru | or 6.
  8. 　前記作動変更部は、前記基板の平面と平行な平面方向への前記噴流ノズルの移動と、前記基板の平面に対して直交する直交方向で且つ前記基板から離間する方向への前記噴流ノズルの移動とを交互に繰り返すように前記作動条件を変更する、請求項１乃至請求項５の何れかに記載の対基板作業機。 The operation changing unit moves the jet nozzle in a plane direction parallel to the plane of the substrate, and moves the jet nozzle in a direction orthogonal to the plane of the substrate and away from the substrate. The substrate working machine according to claim 1, wherein the operating condition is changed so as to alternately repeat.
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