WO2018198169A1 - Electronic apparatus - Google Patents

Electronic apparatus Download PDF

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Publication number
WO2018198169A1
WO2018198169A1 PCT/JP2017/016209 JP2017016209W WO2018198169A1 WO 2018198169 A1 WO2018198169 A1 WO 2018198169A1 JP 2017016209 W JP2017016209 W JP 2017016209W WO 2018198169 A1 WO2018198169 A1 WO 2018198169A1
Authority
WO
WIPO (PCT)
Prior art keywords
case
electronic circuit
lid
electronic
insulating fluid
Prior art date
Application number
PCT/JP2017/016209
Other languages
French (fr)
Japanese (ja)
Inventor
健太 吉田
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP2017559887A priority Critical patent/JP6301035B1/en
Priority to PCT/JP2017/016209 priority patent/WO2018198169A1/en
Priority to CN201780011027.2A priority patent/CN109121470B/en
Publication of WO2018198169A1 publication Critical patent/WO2018198169A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers

Definitions

  • This invention relates to the electronic device which accommodated the electronic circuit in the case.
  • the electronic circuit housed in the case is covered with a resin material, and the resin material is solidified and sealed. It is common. However, since it is difficult to take out the electronic circuit from the case after the resin material is solidified, it becomes difficult to analyze the cause of the failure and repair it when the failure occurs.
  • packing is used without sealing with a resin material in order to enable failure analysis and disassembly repair, but there is a problem that waterproof performance and heat dissipation performance are lowered due to aging of the packing.
  • the solidified resin material may be cut to expose the internal electronic circuit, but the electronic circuit may be accidentally damaged when the resin material is cut. If the electronic circuit is damaged and a new failure occurs, the cause of the original failure cannot be analyzed.
  • Patent Document 1 discloses an electronic device having a structure in which a hard resin layer is provided on a gel-like resin layer for sealing an electronic circuit.
  • the present invention has been made in view of the above, and an object thereof is to obtain an electronic device that can be easily taken out without damaging an electronic circuit housed in a case.
  • the present invention has a case in which the top surface is opened, an electronic circuit accommodated in the case, and has insulation and fluidity, and is filled in the case. And an insulating fluid covering the electronic circuit.
  • the present invention includes a lid placed on the insulating fluid, and a resin layer that is provided in a gap between the lid and the case and closes the top surface of the case together with the lid.
  • the electronic device according to the present invention has an effect that it can be easily taken out without damaging the electronic circuit housed in the case.
  • FIG. 5 is a diagram illustrating a procedure for taking out an electronic circuit of the electronic device according to the first embodiment.
  • FIG. 5 is a diagram illustrating a procedure for taking out an electronic circuit of the electronic device according to the first embodiment.
  • FIG. 5 is a diagram illustrating a procedure for taking out an electronic circuit of the electronic device according to the first embodiment.
  • FIG. 5 is a diagram illustrating a procedure for taking out an electronic circuit of the electronic device according to the first embodiment.
  • FIG. FIG. 9 is a diagram showing a procedure for taking out an electronic circuit of an electronic apparatus according to the second embodiment.
  • FIG. 9 is a diagram showing a procedure for taking out an electronic circuit of an electronic apparatus according to the second embodiment.
  • FIG. 9 is a diagram showing a procedure for taking out an electronic circuit of an electronic apparatus according to the second embodiment.
  • FIG. 9 is a diagram showing a procedure for taking out an electronic circuit of an electronic apparatus according to the second embodiment.
  • FIG. 9 is a diagram showing a procedure for taking out an electronic circuit of an electronic apparatus according to the second embodiment.
  • the figure which shows the procedure of the reconstruction of the electronic device which concerns on Embodiment 2 The figure which shows the procedure of the reconstruction of the electronic device which concerns on Embodiment 2
  • the figure which shows the procedure of the reconstruction of the electronic device which concerns on Embodiment 2 The figure which shows the structure of the electronic device which concerns on Embodiment 3 of this invention.
  • FIG. 1 is a diagram showing the structure of an electronic device according to Embodiment 1 of the present invention.
  • FIG. 2 is a perspective view of the electronic apparatus according to the first embodiment.
  • the slave device 51 that is the electronic device according to the first embodiment is a device that operates in response to a command from the programmable logic controller.
  • the slave device 51 includes a case 1 whose top surface 1a is opened, an electronic circuit 2 accommodated in the case 1, an insulating fluid 3 filled in the case 1 and covering the electronic circuit 2, and an insulating flow. It has a lid 8 placed on the body 3 and a resin layer 4 that closes the top surface 1 a of the case 1 together with the lid 8.
  • the lid 8 is smaller than the top surface 1 a of the case 1.
  • case 1 has a rectangular parallelepiped shape, but the shape of case 1 is not limited to a rectangular parallelepiped. Plastic can be used as the material for the case 1 and the lid 8.
  • the electronic circuit 2 has a substrate 5 and a plurality of electronic components 6 mounted on the front and back of the substrate 5.
  • a waterproof connector 9 that is electrically connected to the electronic component 6 is mounted on the surface of the substrate 5 that faces the bottom surface 11 of the case 1.
  • the waterproof connector 9 is press-fitted into a through-hole 12 formed in the bottom surface 11 of the case 1, and the gap between the case 1 and the waterproof connector 9 is kept watertight. Since the waterproof connector 9 protrudes outside the case 1, the connection between the electronic component 6 mounted on the substrate 5 and the external device can be easily performed outside the case 1.
  • the insulating fluid 3 covers the entire electronic circuit 2 without a gap.
  • the substrate 5 is fixed to the case 1 by a fastening member (not shown).
  • the fastening member that fixes the substrate 5 to the case 1 can be exemplified by a screw and a pin, but is not limited thereto. Any one of sol, gel, and liquid can be applied to the insulating fluid 3. In the case where a gel is used for the insulating fluid 3, a silicone gel can be applied, but is not limited thereto. In the following description, it is assumed that the insulating fluid 3 is a gel.
  • the resin layer 4 is a solid layer and prevents the insulating fluid 3 from leaking out of the case 1. For the resin layer 4, a resin material that does not mix with the insulating fluid 3 that is a gel even when filled in the case 1 in a state before solidification can be applied.
  • the resin material applicable to the resin layer 4 examples include, but are not limited to, a thermosetting resin, a thermoplastic resin, an ultraviolet curable resin, and a two-component mixed resin.
  • a thermosetting resin is applied to the resin layer 4
  • a resin material that can be solidified at a temperature lower than the heat resistant temperature of the electronic circuit 2 is selected.
  • a thermoplastic resin is applied to the resin layer 4
  • a resin material that is plasticized at a temperature lower than the heat resistant temperature of the electronic circuit 2 is selected.
  • Specific examples of the resin material applicable to the resin layer 4 include an epoxy resin and a polyurethane resin.
  • FIG. 4, FIG. 5 and FIG. 6 are diagrams showing the manufacturing procedure of the electronic apparatus according to the first embodiment.
  • the electronic circuit 2 is arranged in the case 1 from the top surface 1 a side, and the waterproof connector 9 is press-fitted into the through hole 12.
  • the insulating fluid 3 is filled into the case 1 from the top surface 1a side, and the electronic circuit 2 is sealed with the insulating fluid 3 as shown in FIG.
  • the lid 8 is placed on the insulating fluid 3.
  • a resin material applied to the resin layer 4 is disposed between the lid 8 and the side surface 1 b of the case 1 to close the top surface 1 a of the case 1.
  • FIG.1 and FIG.2 the slave apparatus 51 shown in FIG.1 and FIG.2 is completed by solidifying the resin layer 4.
  • FIG. The electronic circuit 2 is entirely covered with an insulating fluid 3, and the insulating fluid 3 is further sealed with a lid 8 and a resin layer 4. With such a structure, the electronic circuit 2 is not exposed to the outside of the resin layer 4, so that the electronic circuit 2 is prevented from being damaged.
  • One or more through holes for venting air are formed in the lid 8, and after the lid 8 is placed on the insulating fluid 3, the resin layer 4 is also formed on the through holes. Also good. By forming a through hole for venting air in the lid 8, it becomes difficult for air to remain between the insulating fluid 3 and the lid 8. Yield is improved.
  • FIG. 7, 8 and 9 are diagrams showing a procedure for taking out an electronic circuit of the electronic device according to the first embodiment.
  • the resin layer 4 is removed by moving the tool 7 so as to trace the outer periphery of the lid 8.
  • the lid 8 is merely placed on the insulating fluid 3 and is not fixed.
  • the lid 8 is removed by holding the lid 8 and using an insulating fluid as shown in FIG.
  • the waterproof connector 9 is pulled out from the through hole 12 and the electronic circuit 2 is taken out from the insulating fluid 3.
  • the electronic circuit 2 can be taken out of the insulating fluid 3 even when the insulating fluid 3 exists in the case 1. Then, the insulating fluid 3 attached to the electronic circuit 2 taken out from the insulating fluid 3 is removed by a method such as air blowing or alcohol cleaning. In the case where the insulating fluid 3 is liquid, sol or highly fluid gel and the waterproof fluid 9 leaks from the through hole 12 when the waterproof connector 9 is pulled out from the through hole 12, the electronic circuit 2 The insulating fluid 3 may be removed prior to taking out the liquid.
  • the same procedure as the manufacturing procedure may be performed after removing the insulating fluid 3 remaining in the case 1.
  • the insulating fluid 3 remaining in the case 1 can be removed by suction or can be removed by scraping with a tool.
  • a resin material having no conductivity to the resin layer 4
  • the insulating fluid 3 is exposed by removing the resin layer 4, and thus the electronic circuit 2 can be taken out from the insulating fluid 3. Since the insulating fluid 3 covering the electronic circuit 2 has fluidity, the electronic circuit 2 is not damaged when the electronic circuit 2 is taken out from the insulating fluid 3.
  • the slave device 51 according to Embodiment 1 can easily take out the electronic circuit 2 from the insulating fluid 3 by removing the resin layer 4. Therefore, even when a plurality of failures are found due to a lot defect, it is easy to confirm whether or not the causes of failure are all the same.
  • the insulating fluid 3 has a higher thermal conductivity than air.
  • the slave device 51 according to the first embodiment has higher heat dissipation performance than the slave device in which the insulating fluid 3 is not filled in the case 1. Therefore, the slave device 51 according to the first embodiment is less likely to increase the temperature of the electronic component 6 as compared with the slave device in which the inside of the case 1 is not filled with the insulating fluid 3. Thereby, even in a high temperature environment in which heat dissipation from the case 1 to the atmosphere is difficult to occur, the electronic component 6 is less likely to accumulate heat, and thermal runaway of the electronic component 6 is less likely to occur.
  • the slave device 51 according to the first embodiment is filled with the insulating fluid 3 inside the case 1, when the electronic component 6 is vibrated together with the substrate 5 due to the external force, the substrate 5 and the electronic device The stress applied to the joint portion with the component 6 is relieved. Therefore, the slave device 51 according to the first embodiment can have higher vibration resistance than the case where the case 1 is hollow.
  • the insulation between the electronic components 6 is compared with the case where the case 1 is hollow. Yield can be increased.
  • the slave device 51 according to the first embodiment only needs to provide the resin layer 4 between the lid 8 and the side surface 1b of the case 1, the amount of the resin material applied to the resin layer 4 can be reduced. it can. Further, in the slave device 52 according to the first embodiment, since the resin layer 4 that needs to be removed when the electronic circuit 2 is taken out is only a portion around the lid 8, the top surface 1a of the case 1 is entirely covered. Compared with the case where the entire resin layer 4 to be covered is removed by the tool 7, the time required for the removal work of the resin layer 4 can be shortened. Further, in the slave device 51 according to the first embodiment, since the lid 8 removed when the electronic circuit 2 is taken out can be reused, the amount of waste generated at the time of failure cause analysis can be reduced.
  • the case 1 and the lid 8 may be formed of a conductive material, and a conductive plastic may be applied to the resin layer 4.
  • a conductive plastic may be applied to the resin layer 4.
  • the slave device 51 according to the first embodiment has a low possibility of damaging the electronic circuit 2 when the electronic circuit 2 is taken out, it is possible to prevent the failure cause from being identified due to the damage of the electronic circuit 2. Therefore, the slave device 51 according to the first embodiment can meet the user's request for analyzing the cause of the failure.
  • FIG. FIG. 10 is a diagram showing the structure of the electronic device according to the second embodiment of the present invention.
  • the electronic circuit 21 and the electronic circuit 22 are accommodated in the case 1. That is, a plurality of electronic circuits are accommodated in the case 1 of the slave device 52.
  • the electronic circuit 21 and the electronic circuit 22 are connected by board-to-board connectors 91 and 92. Further, a lid 81 and a lid 82 are placed on the insulating fluid 3 covering the electronic circuit 21 and the electronic circuit 22, and between the lid 81 and the side surface 1 b of the case 1, the lid 82 and the case 1.
  • the resin layer 4 is provided between the side surface 1 b and between the lid 81 and the lid 82.
  • the insulating fluid 3 is sol or gel.
  • the other points are the same as those of the slave device 51 according to the first embodiment.
  • the lid 81 is disposed above the electronic circuit 21, and the lid 82 is disposed above the electronic circuit 22. That is, the lids 81 and 82 are individually placed on the insulating fluid 3 for each of the plurality of electronic circuits 21 and 22.
  • One of the board-to-board connectors 91 and 92 is male and the other is female. Therefore, the board-to-board connectors 91 and 92 can be connected by end-butting.
  • FIG. 11, FIG. 12, FIG. 13 and FIG. 14 are diagrams showing a procedure for manufacturing the electronic apparatus according to the second embodiment.
  • the electronic circuit 21 and the electronic circuit 22 are arranged in the case 1 from the top surface 1 a side, and the waterproof connector 9 is press-fitted into the through hole 12. Connections are made with board-to-board connectors 91 and 92.
  • the electronic circuit 21 and the electronic circuit 22 may be arranged in the case 1 after the electronic circuit 21 and the electronic circuit 22 are connected by the inter-board connectors 91 and 92.
  • the insulating fluid 3 is filled into the case 1 from the top surface 1a side, and the electronic circuit 21 and the electronic circuit 22 are sealed with the insulating fluid 3 as shown in FIG.
  • lids 81 and 82 are placed on the insulating fluid 3 as shown in FIG. And as shown in FIG. 14, the resin material applied to the resin layer 4 between the lid 81 and the side surface 1b of the case 1, between the lid 82 and the side surface 1b of the case 1, and between the lid 81 and the lid 82. And the top surface 1a of the case 1 is closed. Then, by solidifying the resin layer 4, the slave device 52 shown in FIG. 10 is completed.
  • FIG. 16, FIG. 17, FIG. 18 and FIG. 19 are diagrams showing a procedure for taking out an electronic circuit of the electronic apparatus according to the second embodiment.
  • a procedure for taking out only the electronic circuit 21 will be described.
  • the resin layer 4 around the lid 81 is removed by moving the tool 7 so as to trace the outer periphery of the lid 81.
  • the lid 81 is merely placed on the insulating fluid 3 and is not fixed.
  • the lid 81 is removed by lifting the lid 81 as shown in FIG.
  • the insulating fluid 3 remaining in the region where the electronic circuit 21 has been installed is removed.
  • the inter-board connectors 91 and 92 are removed as shown in FIG. 18, and the electronic circuit 21 and the electronic circuit 22 are separated.
  • the waterproof connector 9 is pulled out from the through hole 12 and the electronic circuit 21 is taken out from the case 1.
  • the insulating fluid 3 adhering to the extracted electronic circuit 21 is removed by a method such as air blowing or alcohol cleaning.
  • FIG. 21 and FIG. 22 are diagrams illustrating a procedure for reconstructing an electronic device according to the second embodiment.
  • the end of the inter-board connector 92 on the electronic circuit 22 side is cleaned with alcohol, and the insulating fluid 3 attached to the end of the inter-board connector 92 is removed.
  • the insulating fluid 3 may be removed by air blowing the end of the inter-board connector 92.
  • the electronic circuit 21 is disposed in the case 1 in the region where the insulating fluid 3 is removed.
  • the slave device 52 When the electronic circuit 21 is disposed in the case 1, the slave device 52 is in the state shown in FIG. Next, the electronic circuit 21 and the electronic circuit 22 are connected by the board-to-board connectors 91 and 92. When the electronic circuit 21 and the electronic circuit 22 are connected by the board-to-board connectors 91 and 92, the slave device 52 is in the state shown in FIG. Then, the insulating fluid 3 is filled into the portion where the electronic circuit 21 is arranged from the top surface 1 a side, and the entire electronic circuit 21 is covered with the insulating fluid 3. When the electronic circuit 21 is covered with the insulating fluid 3, the slave device 52 is in the state shown in FIG. Then, a lid 81 is disposed on the insulating fluid 3.
  • the slave device 52 When the lid 81 is disposed on the insulating fluid 3, the slave device 52 is in the state shown in FIG. And the resin material applied to the resin layer 4 is arrange
  • the slave device 52 according to the second embodiment can take out only a part of a plurality of electronic circuits and can reconstruct it after taking out only some of the electronic circuits. Therefore, it is not necessary to take out an electronic circuit that is clearly unrelated to the cause of the failure from the case, and the work of taking out the electronic circuit and reconstructing the slave device 52 can be simplified. In addition, since only a part of the plurality of electronic circuits can be replaced, the cost of repair by replacing the electronic circuit can be reduced as compared with the case where the electronic circuit is not divided into a plurality of parts.
  • the slave device 52 according to the second embodiment can prevent the electronic circuits 21 and 22 from being damaged when being taken out from the case 1, and can improve heat dissipation performance and resistance. It is possible to improve the vibration characteristics and the dielectric strength.
  • FIG. FIG. 23 is a diagram showing the structure of an electronic device according to Embodiment 3 of the present invention.
  • the electronic circuit 22 is not an object of failure cause analysis, and is entirely covered with the resin layer 4.
  • the electronic circuit 21 can be an object of failure cause analysis, and is entirely covered with the insulating fluid 3.
  • a lid 81 is placed on the insulating fluid 3, but no lid is placed on the resin layer 4 on the electronic circuit 22. The rest is the same as that of the slave device 52 according to the second embodiment.
  • the slave device 53 according to the third embodiment only the electronic circuit 21 that can be a target of failure cause analysis is covered with the insulating fluid 3. That is, only the electronic circuit 21 that is a part of the electronic circuits 21 and 22 is covered with the insulating fluid 3. Therefore, the slave device 53 according to Embodiment 3 can reduce the amount of the insulating fluid 3 used at the time of manufacture.
  • the slave device 53 may be configured to include three or more electronic circuits.
  • the structure in which the resin layer 4 is provided on the electronic circuit 21 covered with the insulating fluid 3 to block the top surface 1a of the case 1 has been described.
  • a lid may be disposed and the resin layer 4 may be provided in the gap between the lid and the side surface 1 b of the case 1.
  • the resin layer 4 may be provided in the gap between the lids.
  • the slave device 53 according to the third embodiment can prevent the electronic circuit 21 from being damaged when being taken out from the case 1, and can improve heat dissipation performance and vibration resistance. And improvement of dielectric strength can be realized.
  • the configuration described in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and can be combined with other configurations without departing from the gist of the present invention. It is also possible to omit or change the part.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

This slave device (51) is provided with: a box-like case (1) the top surface (1a) of which is open; an electronic circuit (2) having a substrate (5) on which electronic components (6) are mounted, and contained inside the case (1); an insulating fluid (3) which exhibits insulating and fluid properties, and which is filled inside the case (1) and covers the electronic circuit (2); a lid (8) placed over the insulating fluid (3); and resin layers (4) which are provided in spaces between the lid (8) and side surfaces (1b) of the case (1), and close the top surface (1a) of the case (1) with the lid (8).

Description

電子機器Electronics
　本発明は、ケース内に電子回路を収容した電子機器に関する。 This invention relates to the electronic device which accommodated the electronic circuit in the case.
　プログラマブルロジックコントローラから指令を受けて動作するスレーブ装置といった電子機器では、防水性能及び放熱性能確保の観点から、ケースに収容した電子回路を樹脂材料で覆い、樹脂材料を固化して封止することが一般的である。しかしながら、樹脂材料が固化した後ではケース内から電子回路を取り出すことが難しいため、故障発生時に故障原因を解析すること及び分解修理することが困難になる。故障原因の解析及び分解修理を可能とするために、樹脂材料で封止せずにパッキンを用いる構造があるが、パッキンの経年劣化で防水性能及び放熱性能が低下する問題がある。 In an electronic device such as a slave device that operates in response to a command from a programmable logic controller, from the viewpoint of ensuring waterproof performance and heat dissipation performance, the electronic circuit housed in the case is covered with a resin material, and the resin material is solidified and sealed. It is common. However, since it is difficult to take out the electronic circuit from the case after the resin material is solidified, it becomes difficult to analyze the cause of the failure and repair it when the failure occurs. There is a structure in which packing is used without sealing with a resin material in order to enable failure analysis and disassembly repair, but there is a problem that waterproof performance and heat dissipation performance are lowered due to aging of the packing.
　故障原因の解析及び分解修理を実施するにあたり、固化した樹脂材料を切削し、内部の電子回路を露出させる場合もあるが、樹脂材料切削の際に誤って電子回路を傷つけてしまう恐れがある。もし、電子回路を傷つけて新たに故障箇所が発生した場合、当初の故障原因は解析不能になってしまう。 When analyzing the cause of failure and performing disassembly repair, the solidified resin material may be cut to expose the internal electronic circuit, but the electronic circuit may be accidentally damaged when the resin material is cut. If the electronic circuit is damaged and a new failure occurs, the cause of the original failure cannot be analyzed.
　特許文献１には、電子回路を封止するゲル状樹脂層の上に硬質樹脂層を設けた構造の電子機器が開示されている。 Patent Document 1 discloses an electronic device having a structure in which a hard resin layer is provided on a gel-like resin layer for sealing an electronic circuit.
特開昭６０－１０３６４９号公報JP 60-103649 A
　特許文献１に開示される発明では、電子回路の一部である端子は、固化した硬質樹脂層から飛び出している。したがって、特許文献１に開示される発明では、硬質樹脂層から飛び出している端子を傷つけてしまうと故障原因を解析することができなくなってしまう。 In the invention disclosed in Patent Document 1, a terminal that is a part of an electronic circuit protrudes from a solidified hard resin layer. Therefore, in the invention disclosed in Patent Document 1, if the terminal protruding from the hard resin layer is damaged, the cause of the failure cannot be analyzed.
　本発明は、上記に鑑みてなされたものであって、ケースに収容した電子回路に傷をつけることなく容易に取り出すことのできる電子機器を得ることを目的とする。 The present invention has been made in view of the above, and an object thereof is to obtain an electronic device that can be easily taken out without damaging an electronic circuit housed in a case.
　上述した課題を解決し、目的を達成するために、本発明は、天面が開放されたケースと、ケース内に収容された電子回路と、絶縁性及び流動性を有し、ケース内に充填されて電子回路を覆う絶縁性流動体とを備える。本発明は、絶縁性流動体の上に載置された蓋と、蓋とケースとの隙間に設けられて、蓋とともにケースの天面を塞ぐ樹脂層とを備える。 In order to solve the above-described problems and achieve the object, the present invention has a case in which the top surface is opened, an electronic circuit accommodated in the case, and has insulation and fluidity, and is filled in the case. And an insulating fluid covering the electronic circuit. The present invention includes a lid placed on the insulating fluid, and a resin layer that is provided in a gap between the lid and the case and closes the top surface of the case together with the lid.
　本発明に係る電子機器は、ケースに収容した電子回路を傷つけることなく容易に取り出すことができるという効果を奏する。 The electronic device according to the present invention has an effect that it can be easily taken out without damaging the electronic circuit housed in the case.
本発明の実施の形態１に係る電子機器の構造を示す図The figure which shows the structure of the electronic device which concerns on Embodiment 1 of this invention. 実施の形態１に係る電子機器の斜視図The perspective view of the electronic device which concerns on Embodiment 1 実施の形態１に係る電子機器の製造手順を示す図The figure which shows the manufacture procedure of the electronic device which concerns on Embodiment 1. FIG. 実施の形態１に係る電子機器の製造手順を示す図The figure which shows the manufacture procedure of the electronic device which concerns on Embodiment 1. FIG. 実施の形態１に係る電子機器の製造手順を示す図The figure which shows the manufacture procedure of the electronic device which concerns on Embodiment 1. FIG. 実施の形態１に係る電子機器の製造手順を示す図The figure which shows the manufacture procedure of the electronic device which concerns on Embodiment 1. FIG. 実施の形態１に係る電子機器の電子回路の取り出し手順を示す図FIG. 5 is a diagram illustrating a procedure for taking out an electronic circuit of the electronic device according to the first embodiment. 実施の形態１に係る電子機器の電子回路の取り出し手順を示す図FIG. 5 is a diagram illustrating a procedure for taking out an electronic circuit of the electronic device according to the first embodiment. 実施の形態１に係る電子機器の電子回路の取り出し手順を示す図FIG. 5 is a diagram illustrating a procedure for taking out an electronic circuit of the electronic device according to the first embodiment. 本発明の実施の形態２に係る電子機器の構造を示す図The figure which shows the structure of the electronic device which concerns on Embodiment 2 of this invention. 実施の形態２に係る電子機器の製造手順を示す図The figure which shows the manufacture procedure of the electronic device which concerns on Embodiment 2. FIG. 実施の形態２に係る電子機器の製造手順を示す図The figure which shows the manufacture procedure of the electronic device which concerns on Embodiment 2. FIG. 実施の形態２に係る電子機器の製造手順を示す図The figure which shows the manufacture procedure of the electronic device which concerns on Embodiment 2. FIG. 実施の形態２に係る電子機器の製造手順を示す図The figure which shows the manufacture procedure of the electronic device which concerns on Embodiment 2. FIG. 実施の形態２に係る電子機器の電子回路の取り出し手順を示す図FIG. 9 is a diagram showing a procedure for taking out an electronic circuit of an electronic apparatus according to the second embodiment. 実施の形態２に係る電子機器の電子回路の取り出し手順を示す図FIG. 9 is a diagram showing a procedure for taking out an electronic circuit of an electronic apparatus according to the second embodiment. 実施の形態２に係る電子機器の電子回路の取り出し手順を示す図FIG. 9 is a diagram showing a procedure for taking out an electronic circuit of an electronic apparatus according to the second embodiment. 実施の形態２に係る電子機器の電子回路の取り出し手順を示す図FIG. 9 is a diagram showing a procedure for taking out an electronic circuit of an electronic apparatus according to the second embodiment. 実施の形態２に係る電子機器の電子回路の取り出し手順を示す図FIG. 9 is a diagram showing a procedure for taking out an electronic circuit of an electronic apparatus according to the second embodiment. 実施の形態２に係る電子機器の再構築の手順を示す図The figure which shows the procedure of the reconstruction of the electronic device which concerns on Embodiment 2 実施の形態２に係る電子機器の再構築の手順を示す図The figure which shows the procedure of the reconstruction of the electronic device which concerns on Embodiment 2 実施の形態２に係る電子機器の再構築の手順を示す図The figure which shows the procedure of the reconstruction of the electronic device which concerns on Embodiment 2 本発明の実施の形態３に係る電子機器の構造を示す図The figure which shows the structure of the electronic device which concerns on Embodiment 3 of this invention.
　以下に、本発明の実施の形態に係る電子機器を図面に基づいて詳細に説明する。なお、この実施の形態によりこの発明が限定されるものではない。 Hereinafter, an electronic apparatus according to an embodiment of the present invention will be described in detail based on the drawings. Note that the present invention is not limited to the embodiments.
実施の形態１．
　図１は、本発明の実施の形態１に係る電子機器の構造を示す図である。図２は、実施の形態１に係る電子機器の斜視図である。実施の形態１に係る電子機器であるスレーブ装置５１は、プログラマブルロジックコントローラから指令を受けて動作する装置である。スレーブ装置５１は、天面１ａが開放されたケース１と、ケース１内に収容された電子回路２と、ケース１内に充填されて電子回路２を覆う絶縁性流動体３と、絶縁性流動体３の上に載置された蓋８と、蓋８とともにケース１の天面１ａを塞ぐ樹脂層４とを有する。蓋８は、ケース１の天面１ａよりも小さい。樹脂層４は、蓋８とケース１の側面１ｂとの間に設けられている。実施の形態１において、ケース１は直方体状であるが、ケース１の形状は直方体に限定されない。ケース１及び蓋８の材料にはプラスチックを適用できる。 Embodiment 1 FIG.
FIG. 1 is a diagram showing the structure of an electronic device according to Embodiment 1 of the present invention. FIG. 2 is a perspective view of the electronic apparatus according to the first embodiment. The slave device 51 that is the electronic device according to the first embodiment is a device that operates in response to a command from the programmable logic controller. The slave device 51 includes a case 1 whose top surface 1a is opened, an electronic circuit 2 accommodated in the case 1, an insulating fluid 3 filled in the case 1 and covering the electronic circuit 2, and an insulating flow. It has a lid 8 placed on the body 3 and a resin layer 4 that closes the top surface 1 a of the case 1 together with the lid 8. The lid 8 is smaller than the top surface 1 a of the case 1. The resin layer 4 is provided between the lid 8 and the side surface 1 b of the case 1. In Embodiment 1, case 1 has a rectangular parallelepiped shape, but the shape of case 1 is not limited to a rectangular parallelepiped. Plastic can be used as the material for the case 1 and the lid 8.
　電子回路２は、基板５と、基板５の表裏に実装された複数の電子部品６とを有する。基板５のケース１の底面１１と対向する側の面には、電子部品６と電気的に接続された防水コネクタ９が実装されている。防水コネクタ９は、ケース１の底面１１に形成された貫通孔１２に圧入されており、ケース１と防水コネクタ９との隙間は水密性が保たれている。防水コネクタ９は、ケース１の外に突出しているため、基板５に実装された電子部品６と外部装置との接続は、ケース１の外で容易に行える。絶縁性流動体３は、電子回路２全体を隙間無く覆っている。基板５は、不図示の締結部材によってケース１に固定される。基板５をケース１に固定する締結部材は、ねじ及びピンを例示できるが、これに限定はされない。絶縁性流動体３には、ゾル、ゲル及び液体のいずれかを適用できる。絶縁性流動体３にゲルを用いる場合には、シリコーンゲルを適用できるが、これに限定はされない。以下の説明では、絶縁性流動体３は、ゲルであるとする。樹脂層４は、固体の層であり、絶縁性流動体３がケース１内から漏れ出すことを防止する。樹脂層４は、固化前の状態でケース１内に充填してもゲルである絶縁性流動体３と混ざることがない樹脂材料を適用可能である。樹脂層４に適用可能な樹脂材料には、熱硬化性樹脂、熱可塑性樹脂、紫外線硬化性樹脂及び二液混合樹脂を例示できるが、これらに限定されない。樹脂層４に熱硬化性樹脂を適用する場合には、電子回路２の耐熱温度以下の温度で固化可能な樹脂材料を選定する。また、樹脂層４に熱可塑性樹脂を適用する場合には、電子回路２の耐熱温度以下の温度で可塑化する樹脂材料を選定する。樹脂層４に適用可能な樹脂材料の具体例には、エポキシ樹脂及びポリウレタン樹脂を挙げることができる。 The electronic circuit 2 has a substrate 5 and a plurality of electronic components 6 mounted on the front and back of the substrate 5. A waterproof connector 9 that is electrically connected to the electronic component 6 is mounted on the surface of the substrate 5 that faces the bottom surface 11 of the case 1. The waterproof connector 9 is press-fitted into a through-hole 12 formed in the bottom surface 11 of the case 1, and the gap between the case 1 and the waterproof connector 9 is kept watertight. Since the waterproof connector 9 protrudes outside the case 1, the connection between the electronic component 6 mounted on the substrate 5 and the external device can be easily performed outside the case 1. The insulating fluid 3 covers the entire electronic circuit 2 without a gap. The substrate 5 is fixed to the case 1 by a fastening member (not shown). The fastening member that fixes the substrate 5 to the case 1 can be exemplified by a screw and a pin, but is not limited thereto. Any one of sol, gel, and liquid can be applied to the insulating fluid 3. In the case where a gel is used for the insulating fluid 3, a silicone gel can be applied, but is not limited thereto. In the following description, it is assumed that the insulating fluid 3 is a gel. The resin layer 4 is a solid layer and prevents the insulating fluid 3 from leaking out of the case 1. For the resin layer 4, a resin material that does not mix with the insulating fluid 3 that is a gel even when filled in the case 1 in a state before solidification can be applied. Examples of the resin material applicable to the resin layer 4 include, but are not limited to, a thermosetting resin, a thermoplastic resin, an ultraviolet curable resin, and a two-component mixed resin. When a thermosetting resin is applied to the resin layer 4, a resin material that can be solidified at a temperature lower than the heat resistant temperature of the electronic circuit 2 is selected. When a thermoplastic resin is applied to the resin layer 4, a resin material that is plasticized at a temperature lower than the heat resistant temperature of the electronic circuit 2 is selected. Specific examples of the resin material applicable to the resin layer 4 include an epoxy resin and a polyurethane resin.
　図３、図４、図５及び図６は、実施の形態１に係る電子機器の製造手順を示す図である。まず、図３に示すように、ケース１内に天面１ａ側から電子回路２を配置し、防水コネクタ９を貫通孔１２に圧入する。続いて、ケース１内に天面１ａ側から絶縁性流動体３を充填し、図４に示すように、電子回路２を絶縁性流動体３で封止する。次に、図５に示すように、絶縁性流動体３の上に蓋８を載置する。そして、図６に示すように、蓋８とケース１の側面１ｂとの間に樹脂層４に適用する樹脂材料を配置してケース１の天面１ａを塞ぐ。そして、樹脂層４を固化させることにより、図１及び図２に示したスレーブ装置５１が完成する。電子回路２は、全体が絶縁性流動体３で覆われており、さらに絶縁性流動体３は蓋８及び樹脂層４で封止されている。このような構造によって、電子回路２は樹脂層４の外に露出しないため、電子回路２が破損することは防止される。 3, FIG. 4, FIG. 5 and FIG. 6 are diagrams showing the manufacturing procedure of the electronic apparatus according to the first embodiment. First, as shown in FIG. 3, the electronic circuit 2 is arranged in the case 1 from the top surface 1 a side, and the waterproof connector 9 is press-fitted into the through hole 12. Subsequently, the insulating fluid 3 is filled into the case 1 from the top surface 1a side, and the electronic circuit 2 is sealed with the insulating fluid 3 as shown in FIG. Next, as shown in FIG. 5, the lid 8 is placed on the insulating fluid 3. Then, as shown in FIG. 6, a resin material applied to the resin layer 4 is disposed between the lid 8 and the side surface 1 b of the case 1 to close the top surface 1 a of the case 1. And the slave apparatus 51 shown in FIG.1 and FIG.2 is completed by solidifying the resin layer 4. FIG. The electronic circuit 2 is entirely covered with an insulating fluid 3, and the insulating fluid 3 is further sealed with a lid 8 and a resin layer 4. With such a structure, the electronic circuit 2 is not exposed to the outside of the resin layer 4, so that the electronic circuit 2 is prevented from being damaged.
　なお、蓋８に空気抜き用の貫通穴を一つ以上形成しておき、絶縁性流動体３の上に蓋８を載せた後で、貫通穴の部分にも樹脂層４を形成するようにしてもよい。蓋８に空気抜き用の貫通穴を形成しておくことにより、絶縁性流動体３と蓋８との間に空気が残留しにくくなり、スレーブ装置５１を製造する際の歩留まり及び再構築する際の歩留まりが向上する。 One or more through holes for venting air are formed in the lid 8, and after the lid 8 is placed on the insulating fluid 3, the resin layer 4 is also formed on the through holes. Also good. By forming a through hole for venting air in the lid 8, it becomes difficult for air to remain between the insulating fluid 3 and the lid 8. Yield is improved.
　図７、図８及び図９は、実施の形態１に係る電子機器の電子回路の取り出し手順を示す図である。まず、図７に示すように、蓋８の外周をなぞるように工具７を移動させることで樹脂層４を除去する。樹脂層４を除去することにより、蓋８は絶縁性流動体３の上に載っているだけで固定されていない状態となる。樹脂層４を除去した後に、図８に示すように、蓋８を持ち上絶縁性流動体ことによって、蓋８を取り外す。蓋８を取り外した後、図９に示すように、防水コネクタ９を貫通孔１２から引き抜いて絶縁性流動体３の中から電子回路２を取り出す。絶縁性流動体３は流動性を有しているため、ケース１内に絶縁性流動体３が存在する状態でも電子回路２を絶縁性流動体３から取り出すことが可能である。そして、絶縁性流動体３から取り出した電子回路２に付着している絶縁性流動体３は、エアブロー又はアルコール洗浄といった方法で除去する。なお、絶縁性流動体３が液体、ゾル又は流動性の高いゲルであり、防水コネクタ９を貫通孔１２から引き抜くと、絶縁性流動体３が貫通孔１２から漏れ出る場合には、電子回路２を取り出すのに先だって絶縁性流動体３を除去すればよい。 7, 8 and 9 are diagrams showing a procedure for taking out an electronic circuit of the electronic device according to the first embodiment. First, as shown in FIG. 7, the resin layer 4 is removed by moving the tool 7 so as to trace the outer periphery of the lid 8. By removing the resin layer 4, the lid 8 is merely placed on the insulating fluid 3 and is not fixed. After removing the resin layer 4, the lid 8 is removed by holding the lid 8 and using an insulating fluid as shown in FIG. After removing the lid 8, as shown in FIG. 9, the waterproof connector 9 is pulled out from the through hole 12 and the electronic circuit 2 is taken out from the insulating fluid 3. Since the insulating fluid 3 has fluidity, the electronic circuit 2 can be taken out of the insulating fluid 3 even when the insulating fluid 3 exists in the case 1. Then, the insulating fluid 3 attached to the electronic circuit 2 taken out from the insulating fluid 3 is removed by a method such as air blowing or alcohol cleaning. In the case where the insulating fluid 3 is liquid, sol or highly fluid gel and the waterproof fluid 9 leaks from the through hole 12 when the waterproof connector 9 is pulled out from the through hole 12, the electronic circuit 2 The insulating fluid 3 may be removed prior to taking out the liquid.
　スレーブ装置５１を再構築する際には、ケース１内に残っている絶縁性流動体３を除去した後に、製造手順と同じ手順を行えばよい。ケース１内に残っている絶縁性流動体３は、吸引によって除去することもできるし、工具を使って掻き出して除去することもできる。なお、樹脂層４に導電性のない樹脂材料を適用する場合は、樹脂層４を工具７で除去した際に生じた樹脂層４の破片がケース１又は電子回路２に付着していても、再構築したスレーブ装置５１に不具合が生じる恐れはない。 When the slave device 51 is reconstructed, the same procedure as the manufacturing procedure may be performed after removing the insulating fluid 3 remaining in the case 1. The insulating fluid 3 remaining in the case 1 can be removed by suction or can be removed by scraping with a tool. In addition, when applying a resin material having no conductivity to the resin layer 4, even if the fragments of the resin layer 4 generated when the resin layer 4 is removed with the tool 7 are attached to the case 1 or the electronic circuit 2, There is no fear that the reconstructed slave device 51 has a problem.
　実施の形態１に係るスレーブ装置５１は、樹脂層４を除去することにより絶縁性流動体３が露出するため、絶縁性流動体３の中から電子回路２を取り出すことができる。電子回路２を覆う絶縁性流動体３は流動性を有するため、絶縁性流動体３から電子回路２を取り出す際に電子回路２が破損することはない。 In the slave device 51 according to the first embodiment, the insulating fluid 3 is exposed by removing the resin layer 4, and thus the electronic circuit 2 can be taken out from the insulating fluid 3. Since the insulating fluid 3 covering the electronic circuit 2 has fluidity, the electronic circuit 2 is not damaged when the electronic circuit 2 is taken out from the insulating fluid 3.
　実施の形態１に係るスレーブ装置５１は、樹脂層４を除去すれば、絶縁性流動体３の中から容易に電子回路２を取り出すことができる。したがって、ロット不良によって複数台の故障が見つかった場合でも、故障原因が全て同じであるか否かを確認することは容易である。 The slave device 51 according to Embodiment 1 can easily take out the electronic circuit 2 from the insulating fluid 3 by removing the resin layer 4. Therefore, even when a plurality of failures are found due to a lot defect, it is easy to confirm whether or not the causes of failure are all the same.
　絶縁性流動体３は、空気よりも熱伝導率が高い。このため、実施の形態１に係るスレーブ装置５１は、ケース１の内部に絶縁性流動体３が充填されていないスレーブ装置と比較して放熱性能が高くなる。したがって、実施の形態１に係るスレーブ装置５１は、ケース１の内部に絶縁性流動体３が充填されていないスレーブ装置と比較して電子部品６の温度が上昇しにくくなる。これにより、ケース１から雰囲気中への放熱が起こりにくい高温環境下においても電子部品６に熱がこもりにくくなり、電子部品６の熱暴走が発生しにくくなる。 The insulating fluid 3 has a higher thermal conductivity than air. For this reason, the slave device 51 according to the first embodiment has higher heat dissipation performance than the slave device in which the insulating fluid 3 is not filled in the case 1. Therefore, the slave device 51 according to the first embodiment is less likely to increase the temperature of the electronic component 6 as compared with the slave device in which the inside of the case 1 is not filled with the insulating fluid 3. Thereby, even in a high temperature environment in which heat dissipation from the case 1 to the atmosphere is difficult to occur, the electronic component 6 is less likely to accumulate heat, and thermal runaway of the electronic component 6 is less likely to occur.
　また、実施の形態１に係るスレーブ装置５１は、ケース１の内部に絶縁性流動体３が充填されているため、外力を受けて基板５とともに電子部品６が振動する際に、基板５と電子部品６との接合部分に加わる応力が緩和される。したがって、実施の形態１に係るスレーブ装置５１は、ケース１が中空である場合と比較して耐振動性を高くできる。 Further, since the slave device 51 according to the first embodiment is filled with the insulating fluid 3 inside the case 1, when the electronic component 6 is vibrated together with the substrate 5 due to the external force, the substrate 5 and the electronic device The stress applied to the joint portion with the component 6 is relieved. Therefore, the slave device 51 according to the first embodiment can have higher vibration resistance than the case where the case 1 is hollow.
　また、実施の形態１に係るスレーブ装置５１は、ケース１の内部に絶縁性流動体３が充填されているため、ケース１が中空である場合と比較して、電子部品６同士の間の絶縁耐力を高めることができる。 Further, in the slave device 51 according to the first embodiment, since the insulating fluid 3 is filled in the case 1, the insulation between the electronic components 6 is compared with the case where the case 1 is hollow. Yield can be increased.
　実施の形態１に係るスレーブ装置５１は、蓋８とケース１の側面１ｂとの間だけに樹脂層４を設ければよいため、樹脂層４に適用する樹脂材料の使用量を低減することができる。また、実施の形態１に係るスレーブ装置５２では、電子回路２を取り出す際に除去する必要がある樹脂層４は蓋８の周囲の部分のみであるため、ケース１の天面１ａを全面的に覆う樹脂層４全体を工具７で除去する場合と比較して、樹脂層４の除去作業に要する時間を短縮できる。また、実施の形態１に係るスレーブ装置５１では、電子回路２を取り出す際に取り外した蓋８を再利用可能であるため、故障原因の解析時に発生する廃棄物の量を低減できる。 Since the slave device 51 according to the first embodiment only needs to provide the resin layer 4 between the lid 8 and the side surface 1b of the case 1, the amount of the resin material applied to the resin layer 4 can be reduced. it can. Further, in the slave device 52 according to the first embodiment, since the resin layer 4 that needs to be removed when the electronic circuit 2 is taken out is only a portion around the lid 8, the top surface 1a of the case 1 is entirely covered. Compared with the case where the entire resin layer 4 to be covered is removed by the tool 7, the time required for the removal work of the resin layer 4 can be shortened. Further, in the slave device 51 according to the first embodiment, since the lid 8 removed when the electronic circuit 2 is taken out can be reused, the amount of waste generated at the time of failure cause analysis can be reduced.
　なお、実施の形態１に係るスレーブ装置５１は、ケース１及び蓋８を導電性材料で形成するとともに、樹脂層４に、導電性プラスチックを適用してもよい。導電性を有するケース１、蓋８及び樹脂層４で電子回路２を囲むことにより、電子回路２で発生するノイズがスレーブ装置５１の外に漏れ出すことを防止できる。実施の形態１に係るスレーブ装置５１は、蓋８とケース１の側面１ｂとの間にだけ樹脂層４が存在するため、樹脂層４を工具７で除去する際に生じる樹脂層４の破片の量は、ケース１の天面１ａを全面的に覆う樹脂層４全体を工具７で除去する場合と比較して低減される。したがって、樹脂層４の破片がケース１又は電子回路２に付着することに起因して、再構築したスレーブ装置５１に不具合が生じる可能性を低減できる。 In the slave device 51 according to the first embodiment, the case 1 and the lid 8 may be formed of a conductive material, and a conductive plastic may be applied to the resin layer 4. By surrounding the electronic circuit 2 with the conductive case 1, the lid 8 and the resin layer 4, it is possible to prevent the noise generated in the electronic circuit 2 from leaking out of the slave device 51. In the slave device 51 according to the first embodiment, since the resin layer 4 exists only between the lid 8 and the side surface 1b of the case 1, fragments of the resin layer 4 generated when the resin layer 4 is removed by the tool 7 are used. The amount is reduced compared to the case where the entire resin layer 4 covering the entire top surface 1a of the case 1 is removed with the tool 7. Therefore, it is possible to reduce the possibility that the reconstructed slave device 51 is defective due to the fragments of the resin layer 4 adhering to the case 1 or the electronic circuit 2.
　ファクトリーオートメーションの分野で用いられる装置は、同じ原因による故障を再度発生させないために、故障原因を解析することをユーザが強く要望する傾向が高い。実施の形態１に係るスレーブ装置５１は、電子回路２を取り出す際に、電子回路２を破損させる可能性が低いため、電子回路２の破損により故障原因を特定できなくなることを防止できる。よって、実施の形態１に係るスレーブ装置５１は、故障原因を解析することに対してのユーザの要望に応えることができる。 Equipment used in the field of factory automation has a high tendency that the user strongly demands to analyze the cause of the failure so that the failure due to the same cause does not occur again. Since the slave device 51 according to the first embodiment has a low possibility of damaging the electronic circuit 2 when the electronic circuit 2 is taken out, it is possible to prevent the failure cause from being identified due to the damage of the electronic circuit 2. Therefore, the slave device 51 according to the first embodiment can meet the user's request for analyzing the cause of the failure.
実施の形態２．
　図１０は、本発明の実施の形態２に係る電子機器の構造を示す図である。実施の形態２に係る電子機器であるスレーブ装置５２は、ケース１内に電子回路２１及び電子回路２２が収容されている。すなわち、スレーブ装置５２のケース１内には、複数の電子回路が収容されている。電子回路２１と電子回路２２とは、基板間コネクタ９１，９２で接続されている。また、電子回路２１及び電子回路２２を覆う絶縁性流動体３の上には、蓋８１及び蓋８２が載置されており、蓋８１とケース１の側面１ｂとの間、蓋８２とケース１の側面１ｂとの間及び蓋８１と蓋８２との間に樹脂層４が設けられている。実施の形態２において、絶縁性流動体３は、ゾル又はゲルである。この他の点は、実施の形態１に係るスレーブ装置５１と同様である。なお、蓋８１は、電子回路２１の上方に配置されており、蓋８２は、電子回路２２の上方に配置されている。すなわち、複数の電子回路２１，２２ごとに、絶縁性流動体３の上に個別に蓋８１，８２が載置されている。基板間コネクタ９１，９２は、一方が雄型で他方が雌型である。したがって、基板間コネクタ９１，９２は、端部突き合わせることで接続可能である。 Embodiment 2. FIG.
FIG. 10 is a diagram showing the structure of the electronic device according to the second embodiment of the present invention. In the slave device 52 which is an electronic apparatus according to the second embodiment, the electronic circuit 21 and the electronic circuit 22 are accommodated in the case 1. That is, a plurality of electronic circuits are accommodated in the case 1 of the slave device 52. The electronic circuit 21 and the electronic circuit 22 are connected by board-to- board connectors 91 and 92. Further, a lid 81 and a lid 82 are placed on the insulating fluid 3 covering the electronic circuit 21 and the electronic circuit 22, and between the lid 81 and the side surface 1 b of the case 1, the lid 82 and the case 1. The resin layer 4 is provided between the side surface 1 b and between the lid 81 and the lid 82. In Embodiment 2, the insulating fluid 3 is sol or gel. The other points are the same as those of the slave device 51 according to the first embodiment. The lid 81 is disposed above the electronic circuit 21, and the lid 82 is disposed above the electronic circuit 22. That is, the lids 81 and 82 are individually placed on the insulating fluid 3 for each of the plurality of electronic circuits 21 and 22. One of the board-to- board connectors 91 and 92 is male and the other is female. Therefore, the board-to- board connectors 91 and 92 can be connected by end-butting.
　図１１、図１２、図１３及び図１４は、実施の形態２に係る電子機器の製造手順を示す図である。まず、図１１に示すように、ケース１内に天面１ａ側から電子回路２１及び電子回路２２を配置して防水コネクタ９を貫通孔１２に圧入するとともに、電子回路２１と電子回路２２とを基板間コネクタ９１，９２で接続する。なお、基板間コネクタ９１，９２で電子回路２１と電子回路２２とを接続しておいてから、ケース１内に電子回路２１及び電子回路２２を配置してもよい。次に、ケース１内に天面１ａ側から絶縁性流動体３を充填し、図１２に示すように、電子回路２１及び電子回路２２を絶縁性流動体３で封止する。電子回路２１，２２を絶縁性流動体３で封止した後、図１３に示すように、絶縁性流動体３の上に蓋８１，８２を載置する。そして、図１４に示すように、蓋８１とケース１の側面１ｂとの間、蓋８２とケース１の側面１ｂとの間及び蓋８１と蓋８２との間に樹脂層４に適用する樹脂材料を配置し、ケース１の天面１ａを塞ぐ。そして、樹脂層４を固化させることにより、図１０に示したスレーブ装置５２が完成する。 11, FIG. 12, FIG. 13 and FIG. 14 are diagrams showing a procedure for manufacturing the electronic apparatus according to the second embodiment. First, as shown in FIG. 11, the electronic circuit 21 and the electronic circuit 22 are arranged in the case 1 from the top surface 1 a side, and the waterproof connector 9 is press-fitted into the through hole 12. Connections are made with board-to- board connectors 91 and 92. The electronic circuit 21 and the electronic circuit 22 may be arranged in the case 1 after the electronic circuit 21 and the electronic circuit 22 are connected by the inter-board connectors 91 and 92. Next, the insulating fluid 3 is filled into the case 1 from the top surface 1a side, and the electronic circuit 21 and the electronic circuit 22 are sealed with the insulating fluid 3 as shown in FIG. After the electronic circuits 21 and 22 are sealed with the insulating fluid 3, lids 81 and 82 are placed on the insulating fluid 3 as shown in FIG. And as shown in FIG. 14, the resin material applied to the resin layer 4 between the lid 81 and the side surface 1b of the case 1, between the lid 82 and the side surface 1b of the case 1, and between the lid 81 and the lid 82. And the top surface 1a of the case 1 is closed. Then, by solidifying the resin layer 4, the slave device 52 shown in FIG. 10 is completed.
　図１５、図１６、図１７、図１８及び図１９は、実施の形態２に係る電子機器の電子回路の取り出し手順を示す図である。ここでは、電子回路２１のみを取り出す手順について説明する。まず、図１５に示すように、蓋８１の外周をなぞるように工具７を移動させることで蓋８１の周囲の樹脂層４を除去する。蓋８１の周囲の樹脂層４を除去することにより、蓋８１は絶縁性流動体３の上に載っているだけで固定されていない状態となる。蓋８１の周囲の樹脂層４を除去した後に、図１６に示すように蓋８１を持ち上げることによって、蓋８１を取り外す。蓋８１を取り外した後は、図１７に示すように、電子回路２１が設置されていた領域に残っている絶縁性流動体３を除去する。電子回路２１が設置されていた領域に残っている絶縁性流動体３を除去したら、図１８に示すように基板間コネクタ９１，９２を外し、電子回路２１と電子回路２２とを分離する。電子回路２１，２２を分離した後、図１９に示すように、防水コネクタ９を貫通孔１２から引き抜いてケース１から電子回路２１を取り出す。取り出した電子回路２１に付着している絶縁性流動体３は、エアブロー又はアルコール洗浄といった方法で除去する。 15, FIG. 16, FIG. 17, FIG. 18 and FIG. 19 are diagrams showing a procedure for taking out an electronic circuit of the electronic apparatus according to the second embodiment. Here, a procedure for taking out only the electronic circuit 21 will be described. First, as shown in FIG. 15, the resin layer 4 around the lid 81 is removed by moving the tool 7 so as to trace the outer periphery of the lid 81. By removing the resin layer 4 around the lid 81, the lid 81 is merely placed on the insulating fluid 3 and is not fixed. After removing the resin layer 4 around the lid 81, the lid 81 is removed by lifting the lid 81 as shown in FIG. After removing the lid 81, as shown in FIG. 17, the insulating fluid 3 remaining in the region where the electronic circuit 21 has been installed is removed. When the insulating fluid 3 remaining in the region where the electronic circuit 21 has been installed is removed, the inter-board connectors 91 and 92 are removed as shown in FIG. 18, and the electronic circuit 21 and the electronic circuit 22 are separated. After separating the electronic circuits 21 and 22, as shown in FIG. 19, the waterproof connector 9 is pulled out from the through hole 12 and the electronic circuit 21 is taken out from the case 1. The insulating fluid 3 adhering to the extracted electronic circuit 21 is removed by a method such as air blowing or alcohol cleaning.
　次に、電子回路２２が設置済のケース１に電子回路２１を配置して再構築する手順について説明する。図２０、図２１及び図２２は、実施の形態２に係る電子機器の再構築の手順を示す図である。まず、電子回路２２側の基板間コネクタ９２の端部をアルコール洗浄し、基板間コネクタ９２の端部に付着している絶縁性流動体３を除去する。なお、基板間コネクタ９２の端部をエアブローして絶縁性流動体３を除去してもよい。基板間コネクタ９２の端部に付着している絶縁性流動体３を除去した後、ケース１内の絶縁性流動体３が除去されている領域に電子回路２１を配置する。ケース１内に電子回路２１を配置した時点では、スレーブ装置５２は、図１８に示した状態となる。次に、電子回路２１と電子回路２２とを基板間コネクタ９１，９２で接続する。電子回路２１と電子回路２２とを基板間コネクタ９１，９２で接続した時点では、スレーブ装置５２は、図１７に示した状態となる。そして、電子回路２１を配置した部分に天面１ａ側から絶縁性流動体３を充填し、電子回路２１全体を絶縁性流動体３で覆う。電子回路２１を絶縁性流動体３で覆った時点では、スレーブ装置５２は、図２０に示した状態となる。そして、絶縁性流動体３の上に蓋８１を配置する。絶縁性流動体３の上に蓋８１を配置した時点では、スレーブ装置５２は、図２１に示した状態となる。そして、蓋８１とケース１の側面１ｂとの間、及び蓋８１と蓋８２との間に樹脂層４に適用する樹脂材料を配置し、ケース１の天面１ａを塞ぐ。樹脂層４に適用する樹脂材料を配置した時点では、スレーブ装置５２は、図２２に示した状態となる。そして、樹脂層４を固化させることにより、図１０に示したスレーブ装置５２が再構成される。 Next, a procedure for arranging and reconstructing the electronic circuit 21 in the case 1 in which the electronic circuit 22 has been installed will be described. 20, FIG. 21 and FIG. 22 are diagrams illustrating a procedure for reconstructing an electronic device according to the second embodiment. First, the end of the inter-board connector 92 on the electronic circuit 22 side is cleaned with alcohol, and the insulating fluid 3 attached to the end of the inter-board connector 92 is removed. Note that the insulating fluid 3 may be removed by air blowing the end of the inter-board connector 92. After the insulating fluid 3 adhering to the end of the inter-board connector 92 is removed, the electronic circuit 21 is disposed in the case 1 in the region where the insulating fluid 3 is removed. When the electronic circuit 21 is disposed in the case 1, the slave device 52 is in the state shown in FIG. Next, the electronic circuit 21 and the electronic circuit 22 are connected by the board-to- board connectors 91 and 92. When the electronic circuit 21 and the electronic circuit 22 are connected by the board-to- board connectors 91 and 92, the slave device 52 is in the state shown in FIG. Then, the insulating fluid 3 is filled into the portion where the electronic circuit 21 is arranged from the top surface 1 a side, and the entire electronic circuit 21 is covered with the insulating fluid 3. When the electronic circuit 21 is covered with the insulating fluid 3, the slave device 52 is in the state shown in FIG. Then, a lid 81 is disposed on the insulating fluid 3. When the lid 81 is disposed on the insulating fluid 3, the slave device 52 is in the state shown in FIG. And the resin material applied to the resin layer 4 is arrange | positioned between the lid | cover 81 and the side surface 1b of the case 1, and between the lid | cover 81 and the lid | cover 82, and the top | upper surface 1a of the case 1 is plugged up. At the time when the resin material to be applied to the resin layer 4 is arranged, the slave device 52 is in the state shown in FIG. Then, by solidifying the resin layer 4, the slave device 52 shown in FIG. 10 is reconfigured.
　上記の説明においては、説明の簡略化のために電子回路を二つケース内に配置した構成を示したが、三つ以上の電子回路をケース内に配置することも可能である。 In the above description, for simplification of description, the configuration in which two electronic circuits are arranged in the case is shown. However, three or more electronic circuits can be arranged in the case.
　実施の形態２に係るスレーブ装置５２は、複数の電子回路の一部のみを取り出すこと、及び一部の電子回路のみを取り出した後で再構築することが可能である。したがって、故障原因と関係が無いことが明らかな電子回路をケースから取り出す必要がなく、電子回路の取り出し及びスレーブ装置５２を再構築する作業を簡略化できる。また、複数の電子回路の一部のみを交換することが可能であるため、電子回路が複数に分割されていない場合と比較すると、電子回路の交換による修理のコストを低減できる。 The slave device 52 according to the second embodiment can take out only a part of a plurality of electronic circuits and can reconstruct it after taking out only some of the electronic circuits. Therefore, it is not necessary to take out an electronic circuit that is clearly unrelated to the cause of the failure from the case, and the work of taking out the electronic circuit and reconstructing the slave device 52 can be simplified. In addition, since only a part of the plurality of electronic circuits can be replaced, the cost of repair by replacing the electronic circuit can be reduced as compared with the case where the electronic circuit is not divided into a plurality of parts.
　実施の形態２に係るスレーブ装置５２は、実施の形態１に係るスレーブ装置５１と同様に、ケース１から取り出す際に電子回路２１，２２が破損することを防止できるとともに、放熱性能の向上、耐振動性の向上及び絶縁耐力の向上を実現できる。 Similarly to the slave device 51 according to the first embodiment, the slave device 52 according to the second embodiment can prevent the electronic circuits 21 and 22 from being damaged when being taken out from the case 1, and can improve heat dissipation performance and resistance. It is possible to improve the vibration characteristics and the dielectric strength.
実施の形態３．
　図２３は、本発明の実施の形態３に係る電子機器の構造を示す図である。実施の形態３に係る電子機器であるスレーブ装置５３において、電子回路２２は、故障原因の解析の対象とならないことが既知であり、全体が樹脂層４で覆われている。一方、電子回路２１は、故障原因の解析の対象となりうるものであり、全体が絶縁性流動体３で覆われている。絶縁性流動体３の上には蓋８１が載置されているが、電子回路２２の上の樹脂層４には、蓋は載置されていない。この他は、実施の形態２に係るスレーブ装置５２と同様である。 Embodiment 3 FIG.
FIG. 23 is a diagram showing the structure of an electronic device according to Embodiment 3 of the present invention. In the slave device 53 which is an electronic device according to the third embodiment, it is known that the electronic circuit 22 is not an object of failure cause analysis, and is entirely covered with the resin layer 4. On the other hand, the electronic circuit 21 can be an object of failure cause analysis, and is entirely covered with the insulating fluid 3. A lid 81 is placed on the insulating fluid 3, but no lid is placed on the resin layer 4 on the electronic circuit 22. The rest is the same as that of the slave device 52 according to the second embodiment.
　実施の形態３に係るスレーブ装置５３は、故障原因の解析の対象となりうる電子回路２１のみが絶縁性流動体３で覆われている。すなわち、電子回路２１，２２のうちの一部分である電子回路２１のみが絶縁性流動体３で覆われている。したがって、実施の形態３に係るスレーブ装置５３は、製造時の絶縁性流動体３の使用量を減らすことができる。 In the slave device 53 according to the third embodiment, only the electronic circuit 21 that can be a target of failure cause analysis is covered with the insulating fluid 3. That is, only the electronic circuit 21 that is a part of the electronic circuits 21 and 22 is covered with the insulating fluid 3. Therefore, the slave device 53 according to Embodiment 3 can reduce the amount of the insulating fluid 3 used at the time of manufacture.
　上記の説明においては、二つの電子回路２１，２２を備えた構造について説明したが、スレーブ装置５３は、三つ以上の電子回路を備える構成であってもよい。また、絶縁性流動体３で覆った電子回路２１の上に樹脂層４を設けてケース１の天面１ａを塞ぐ構造について説明したが、絶縁性流動体３で覆った電子回路２１の上に蓋を配置して、蓋とケース１の側面１ｂとの隙間に樹脂層４を設けてもよい。絶縁性流動体３の上に蓋を複数設置する場合には、蓋同士の隙間にも樹脂層４を設ければよい。 In the above description, the structure including the two electronic circuits 21 and 22 has been described. However, the slave device 53 may be configured to include three or more electronic circuits. Further, the structure in which the resin layer 4 is provided on the electronic circuit 21 covered with the insulating fluid 3 to block the top surface 1a of the case 1 has been described. A lid may be disposed and the resin layer 4 may be provided in the gap between the lid and the side surface 1 b of the case 1. When a plurality of lids are provided on the insulating fluid 3, the resin layer 4 may be provided in the gap between the lids.
　実施の形態３に係るスレーブ装置５３は、実施の形態１に係るスレーブ装置５１と同様に、ケース１から取り出す際に電子回路２１が破損することを防止できるとともに、放熱性能の向上、耐振動性の向上及び絶縁耐力の向上を実現できる。 Similarly to the slave device 51 according to the first embodiment, the slave device 53 according to the third embodiment can prevent the electronic circuit 21 from being damaged when being taken out from the case 1, and can improve heat dissipation performance and vibration resistance. And improvement of dielectric strength can be realized.
　以上の実施の形態に示した構成は、本発明の内容の一例を示すものであり、別の公知の技術と組み合わせることも可能であるし、本発明の要旨を逸脱しない範囲で、構成の一部を省略、変更することも可能である。 The configuration described in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and can be combined with other configurations without departing from the gist of the present invention. It is also possible to omit or change the part.
　１　ケース、１ａ　天面、１ｂ　側面、２，２１，２２　電子回路、３　絶縁性流動体、４　樹脂層、５　基板、６　電子部品、７　工具、８，８１，８２　蓋、９　防水コネクタ、１１　底面、１２　貫通孔、５１，５２，５３　スレーブ装置、９１，９２　基板間コネクタ。 1 case, 1a top surface, 1b side surface, 2,21, 22 electronic circuit, 3 insulating fluid, 4 resin layer, 5 substrate, 6 electronic components, 7 tools, 8, 81, 82 lid, 9 waterproof connector, 11 Bottom surface, 12 through holes, 51, 52, 53 slave device, 91, 92 inter-board connector.

Claims (3)

  1. 　天面が開放されたケースと、
    　前記ケース内に収容された電子回路と、
    　絶縁性及び流動性を有し、前記ケース内に充填されて前記電子回路を覆う絶縁性流動体と、
    　前記絶縁性流動体の上に載置された蓋と、
    　前記蓋と前記ケースとの隙間に設けられて、前記蓋とともに前記ケースの天面を塞ぐ樹脂層とを備えることを特徴とする電子機器。     A case where the top is open,
    An electronic circuit housed in the case;
    An insulating fluid having insulating properties and fluidity, filled in the case and covering the electronic circuit;
    A lid placed on the insulating fluid;
    An electronic apparatus comprising: a resin layer provided in a gap between the lid and the case and closing the top surface of the case together with the lid.
  2. 　前記電子回路を複数有し、
    　前記蓋は、複数の前記電子回路ごとに、前記絶縁性流動体の上に個別に載置されており、
    　前記樹脂層は、前記ケースの天面の前記蓋同士の間の部分を塞いでいることを特徴とする請求項１に記載の電子機器。     A plurality of the electronic circuits;
    The lid is individually placed on the insulating fluid for each of the plurality of electronic circuits,
    The electronic device according to claim 1, wherein the resin layer covers a portion between the lids on the top surface of the case.
  3. 　前記電子回路は、電子部品が実装された基板を有し、
    　前記基板は、前記ケースの底面と対向する側の面に防水コネクタが実装されており、
    　前記ケースは、底面に貫通孔が形成されており、
    　前記防水コネクタは、前記貫通孔に圧入されて前記ケースの外に突出していることを特徴とする請求項１又は２に記載の電子機器。     The electronic circuit has a substrate on which electronic components are mounted,
    The board has a waterproof connector mounted on the surface facing the bottom surface of the case,
    The case has a through hole formed on the bottom surface,
    The electronic device according to claim 1, wherein the waterproof connector is press-fitted into the through hole and protrudes outside the case.
PCT/JP2017/016209 2017-04-24 2017-04-24 Electronic apparatus WO2018198169A1 (en)

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