TWI628986B - Electronic device structure and assembly method thereof - Google Patents

Abstract

一種電子裝置結構及其組裝方法，其中電子裝置結構包括一外殼、一 電路板、一密封膠及一灌膠。外殼開設有一穿孔。電路板包含電性耦接複數電子元件及相對穿孔設置的一電性連接端。密封膠設置於電路板與穿孔之間。灌膠填充於外殼與電路板之間。藉此，使製程簡化且不會產生溢膠的問題，進而提升電子裝置的品質。 An electronic device structure and an assembly method thereof, wherein the electronic device structure comprises a casing and a casing Circuit board, a sealant and a potting glue. The housing has a perforation. The circuit board includes an electrical connector electrically coupled to the plurality of electronic components and disposed opposite to the via. The sealant is disposed between the circuit board and the perforation. The glue is filled between the outer casing and the circuit board. Thereby, the process is simplified and the problem of overflowing glue is not generated, thereby improving the quality of the electronic device.

Description

電子裝置結構及其組裝方法 Electronic device structure and assembly method thereof

本發明是有關一種電子裝置，尤指一種製程簡化且不會產生溢膠問題的電子裝置結構及其組裝方法。 The present invention relates to an electronic device, and more particularly to an electronic device structure and an assembly method thereof that are simplified in process and do not cause overflow problems.

如圖1及圖2所示，以傳統的電子裝置結構而言，例如具有電壓轉換功能的變壓器或轉接器等。電子裝置1主要包括一殼體2與電路板3組裝構成。電路板3組裝於殼體2之前，會事先將各電子元件31定位於電路板3上再進行組裝。此時，連接器4才定位於電路板3的各孔洞32上，如此將連接器4與具有各電子元件31的電路板3過錫爐(圖略)，以將各電子元件31與連接器4焊接固定於電路板3上。以例如快速膠等灌膠5於電路板3的底面，待其凝固後再與固定座6固定，以完成電子裝置1的組裝作業。 As shown in FIGS. 1 and 2, in the case of a conventional electronic device structure, for example, a transformer or an adapter having a voltage conversion function. The electronic device 1 mainly includes a casing 2 and a circuit board 3 assembled. Before the circuit board 3 is assembled in the casing 2, the electronic components 31 are previously positioned on the circuit board 3 and assembled. At this time, the connector 4 is positioned on each hole 32 of the circuit board 3, so that the connector 4 and the circuit board 3 having the electronic components 31 are passed through the tin furnace (not shown) to connect the electronic components 31 and the connector. 4 soldering is fixed on the circuit board 3. The bottom surface of the circuit board 3 is filled with a glue such as a quick glue. After it is solidified, it is fixed to the fixing base 6 to complete the assembly work of the electronic device 1.

也就是說，請一併參考圖3所示，步驟10中，將複數電子元件電性耦接於一電路板；步驟20，將該電路板組裝於開設有一穿孔的一外殼；步驟30，從該穿孔電性耦接一連接器於該電路板，以形成一半成品；步驟40，將該半成品過一錫爐以將各該電子元件及該連接器焊固於該電路板上；步驟50，塗佈一灌膠於該電路板的底面，以完成現有電子裝置的組裝作業。 That is, as shown in FIG. 3 together, in step 10, the plurality of electronic components are electrically coupled to a circuit board; in step 20, the circuit board is assembled to a casing having a through hole; step 30, The through hole is electrically coupled to the connector to form a half of the finished product; in step 40, the semi-finished product is passed through a tin furnace to solder the electronic components and the connector to the circuit board; A potting glue is applied to the bottom surface of the circuit board to complete the assembly work of the existing electronic device.

然而上述的組裝方式中，連接器4與電路板3之間會產生餘隙7，且電路板3上的各孔洞32與連接器4的接腳(圖略)因製造公差等因素也會產生間隙，因此灰塵、水氣等雜質容易從所述餘隙7或間隙滲入電路板3內，使電子元件31受損進而影響電子裝置1的使用壽命。此外，在步驟40中，過錫爐的製程對電路板3也會造成損害，且有溢膠等污染的問題，使整體電子裝置1的品質降低。 However, in the above assembly manner, a gap 7 is generated between the connector 4 and the circuit board 3, and the holes 32 of the circuit board 3 and the pins of the connector 4 (not shown) may also be generated due to manufacturing tolerances and the like. The gap is so that impurities such as dust, moisture, and the like easily permeate into the circuit board 3 from the clearance 7 or the gap, thereby damaging the electronic component 31 and affecting the service life of the electronic device 1. Further, in the step 40, the process of the tin furnace causes damage to the circuit board 3, and there is a problem of contamination such as overflow of glue, which degrades the quality of the entire electronic device 1.

有鑒於此，本發明人遂針對上述現有技術，特潛心研究並配合學理的運用，盡力解決上述之問題點，即成為本發明人改良之目標。 In view of the above, the inventors of the present invention have made great efforts to solve the above problems in view of the above-mentioned prior art, and have made great efforts to solve the above problems, which has become the object of improvement of the present inventors.

本發明目的之一，在於提供一種製程簡化且不會產生溢膠的問題，進而提升電子裝置品質的電子裝置結構及其組裝方法。 One of the objects of the present invention is to provide an electronic device structure and an assembly method thereof that are simplified in process and do not cause overfilling, thereby improving the quality of the electronic device.

為達上述目的，本創作提供一種電子裝置結構，包括一外殼、一電路板、一密封膠及一灌膠。外殼開設有至少一穿孔。電路板包含電性耦接複數電子元件及相對至少一穿孔設置的至少一電性連接端。密封膠設置於電路板與穿孔之間。灌膠填充於外殼與電路板之間。 To achieve the above objective, the present invention provides an electronic device structure including a casing, a circuit board, a sealant and a potting glue. The outer casing is provided with at least one perforation. The circuit board includes electrically coupled plurality of electronic components and at least one electrical connection end disposed opposite the at least one through hole. The sealant is disposed between the circuit board and the perforation. The glue is filled between the outer casing and the circuit board.

為達上述目的，本發明還提供一種電子裝置的組裝方法，其步驟包括：a)將至少一電性連接端與複數電子元件電性耦接於一電路板上；b)組裝該電路板於開設有至少一穿孔的一外殼，使該電性連接端穿過該穿孔；c)塗佈一密封膠於該電路板與該穿孔之間；以及d)塗佈一灌膠於該電路板的底面。 To achieve the above object, the present invention further provides an electronic device assembly method, the method comprising: a) electrically coupling at least one electrical connection end to a plurality of electronic components on a circuit board; b) assembling the circuit board Opening an outer casing with at least one perforation, passing the electrical connection end through the perforation; c) applying a sealant between the circuit board and the perforation; and d) applying a glue to the circuit board Bottom surface.

本發明還具有以下優點，由於電路板已經焊固各電子元件與電性連接端(例如電性接腳、電子線或連接器)，因此不須經過錫爐的焊接製程，即 不須經過二次焊接的加工程序。電路板及其上的各電子元件不會因高溫而產生熔毀的現象。此外，塗佈於電路板與穿孔之間的密封膠以及填充於容置空間與間隙的灌膠也不會產生溢膠等污染的問題，使本發明的電子裝置不會產生任何的餘隙或間隙，水氣及灰塵等不會其從中進入，進而提升電子裝置結構的品質和使用壽命。 The invention also has the following advantages: since the circuit board has been soldered to the electronic components and the electrical connection terminals (such as electrical pins, electronic wires or connectors), it is not necessary to pass the soldering process of the tin furnace, that is, There is no need to go through the secondary welding process. The circuit board and the electronic components on it do not melt down due to high temperatures. In addition, the sealant applied between the circuit board and the perforation and the glue filled in the accommodating space and the gap do not cause the problem of contamination such as overflow glue, so that the electronic device of the present invention does not generate any clearance or Gap, moisture, dust, etc. do not enter from it, thereby improving the quality and service life of the electronic device structure.

<習知技術> <Practical Technology>

1‧‧‧電子裝置 1‧‧‧Electronic device

2‧‧‧外殼 2‧‧‧ Shell

3‧‧‧電路板 3‧‧‧Circuit board

31‧‧‧電子元件 31‧‧‧Electronic components

32‧‧‧孔洞 32‧‧‧ holes

4‧‧‧連接器 4‧‧‧Connector

41‧‧‧接腳 41‧‧‧ pins

5‧‧‧灌膠 5‧‧‧Glue

6‧‧‧固定座 6‧‧‧ Fixed seat

7‧‧‧餘隙 7‧‧‧ clearance

10、20、30、40、50‧‧‧步驟 10, 20, 30, 40, 50 ‧ ‧ steps

<本發明> <present invention>

100‧‧‧電子裝置 100‧‧‧Electronic devices

110‧‧‧外殼 110‧‧‧Shell

120‧‧‧穿孔 120‧‧‧Perforation

130‧‧‧凸緣 130‧‧‧Flange

132‧‧‧定位孔 132‧‧‧Positioning holes

134‧‧‧隔板 134‧‧ ‧ partition

140‧‧‧凸殼 140‧‧‧ convex hull

150‧‧‧容置空間 150‧‧‧ accommodating space

160‧‧‧電路板 160‧‧‧ boards

162‧‧‧電子元件 162‧‧‧Electronic components

170‧‧‧電性連接端 170‧‧‧Electrical connection

180‧‧‧密封膠 180‧‧‧Sealant

190‧‧‧灌膠 190‧‧‧Glue

200‧‧‧底板 200‧‧‧floor

210‧‧‧間隙 210‧‧‧ gap

220‧‧‧彈性扣勾 220‧‧‧Flexible buckle

222‧‧‧側板 222‧‧‧ side panels

a、b、c、d‧‧‧步驟 a, b, c, d‧‧‧ steps

圖1為繪示習知電子裝置結構的分解圖。 1 is an exploded view showing the structure of a conventional electronic device.

圖2為繪示習知電子裝置結構的組合透視圖。 2 is a combined perspective view showing the structure of a conventional electronic device.

圖3為繪示習知電子裝置組裝方法的流程圖。 3 is a flow chart showing a method of assembling a conventional electronic device.

圖4為繪示本發明電子裝置結構的分解圖。 4 is an exploded view showing the structure of an electronic device of the present invention.

圖5為繪示本發明電子裝置結構的組合透視圖。 Figure 5 is a perspective view showing the combination of the structure of the electronic device of the present invention.

圖6為繪示本發明電子裝置結構的剖視圖。 Figure 6 is a cross-sectional view showing the structure of an electronic device of the present invention.

圖7為繪示本發明電子裝置結構的另一剖視圖。 Figure 7 is another cross-sectional view showing the structure of the electronic device of the present invention.

圖8為繪示本發明電子裝置的組裝方法的流程圖。 FIG. 8 is a flow chart showing a method of assembling an electronic device of the present invention.

有關本發明之詳細說明及技術內容，配合圖式說明如下，然而所附圖式僅提供參考與說明用，並非用來對本發明加以限制者。 The detailed description and technical content of the present invention are set forth in the accompanying drawings.

如圖4至圖7所示，本發明提供一種電子裝置結構，包括一外殼110、一電路板160、一密封膠180及一灌膠190。在此所述的電子裝置100較佳包含但不限於電壓器、電源轉換器等相關的電子裝置。 As shown in FIG. 4 to FIG. 7 , the present invention provides an electronic device structure including a housing 110 , a circuit board 160 , a sealant 180 , and a potting compound 190 . The electronic device 100 described herein preferably includes, but is not limited to, a voltage device, a power converter, and the like.

外殼110開設有至少一穿孔120，其可為塑膠、金屬、金屬合金或其組合所製成。外殼110還具有二凸緣130、設置於二凸緣130之間的一凸殼140及位於凸殼140內的一容置空間150。電路板160包含電性耦接複數電子元件162及相對至少一穿孔120設置的至少一電性連接端170。在本實施例中，外殼110較佳開設有二相對應的穿孔120，電路板160相對二穿孔120則包含二個電性連接端170。在此所指的電性連接端170較佳是指一連接器；然而在其他不同的實施例中，電性連接端170亦可為若干電性接腳、一電子線或其他適合的電性連接元件，並不限定。有關各電子元件162的種類及數量視不同的電子裝置100而改變，因此在此不另贅述。 The outer casing 110 is provided with at least one perforation 120 which may be made of plastic, metal, metal alloy or a combination thereof. The housing 110 further has two flanges 130, a convex shell 140 disposed between the two flanges 130, and an accommodating space 150 located in the convex shell 140. The circuit board 160 includes electrically coupled plurality of electronic components 162 and at least one electrical connection end 170 disposed opposite the at least one through hole 120. In this embodiment, the outer casing 110 is preferably provided with two corresponding through holes 120, and the circuit board 160 includes two electrical connecting ends 170 opposite to the two through holes 120. The electrical connection end 170 is preferably a connector; however, in other different embodiments, the electrical connection end 170 may also be a plurality of electrical pins, an electronic wire or other suitable electrical properties. Connecting components are not limited. The type and number of the electronic components 162 vary depending on the electronic device 100, and therefore will not be further described herein.

在如圖5及圖6中，各電子元件162較佳分別容置於容置空間150內，容置空間150還填充有灌膠190，因此灌膠190能夠有效地將電路板160及其焊固的各電子元件162凝固定位。穿孔120形成於凸緣130，使較佳例如為連接器的電性連接端170從穿孔120穿出並外露於凸殼140之外。穿孔120的二側還分別連接有一隔板134，各隔板134兩側分別連接凸緣130與凸殼140的側壁，以進一步限制電性連接端170的位移。 As shown in FIG. 5 and FIG. 6 , the electronic components 162 are preferably respectively accommodated in the accommodating space 150 , and the accommodating space 150 is also filled with the glue filling 190 , so that the filling 190 can effectively solder the circuit board 160 and the same. The solid electronic components 162 are solidified and positioned. The through hole 120 is formed in the flange 130 such that the electrical connection end 170, which is preferably a connector, for example, passes through the through hole 120 and is exposed outside the convex case 140. A partition 134 is further connected to the two sides of the through hole 120. The two sides of each of the partitions 134 are respectively connected to the flange 130 and the side wall of the convex shell 140 to further limit the displacement of the electrical connecting end 170.

密封膠180設置於各電路板130與各穿孔120之間。換言之，當密封膠180塗佈於電路板130與各穿孔120之間後，例如為連接器的電性連接端170即可插設穿孔120並定位於二隔板134之間，如此使水氣、灰塵等雜質不會從穿孔120滲入，避免電路板130上的各電子元件162損壞或故障，進而提升電子裝置100的使用壽命。 The sealant 180 is disposed between each of the circuit boards 130 and each of the through holes 120. In other words, after the sealant 180 is applied between the circuit board 130 and each of the through holes 120, for example, the electrical connection end 170 of the connector can be inserted into the through hole 120 and positioned between the two partitions 134, thus making the water vapor Impurities such as dust do not penetrate from the perforations 120, and the electronic components 162 on the circuit board 130 are prevented from being damaged or broken, thereby increasing the service life of the electronic device 100.

底板200與電路板160之間還包含一間隙210，灌膠190更填充於間隙210中。因此當灌膠190填充於所述間隙210時，同樣具有將電路板160穩定 的固定於底板200的效果，且使水氣、灰塵等雜質不會從底板200的縫隙(圖略)滲入。底板200可為塑膠、金屬、金屬合金或其組合所製成，灌膠190凝固後可固化形成例如防水墊或防水墊片等基質，以達到防水與固定的功效。 A gap 210 is further included between the bottom plate 200 and the circuit board 160, and the glue filling 190 is further filled in the gap 210. Therefore, when the glue 190 is filled in the gap 210, the circuit board 160 is also stabilized. The effect of being fixed to the bottom plate 200 is such that impurities such as moisture, dust, and the like do not infiltrate from the gap (not shown) of the bottom plate 200. The bottom plate 200 can be made of plastic, metal, metal alloy or a combination thereof, and the glue 190 can be solidified to form a substrate such as a waterproof pad or a waterproof gasket to achieve waterproof and fixing effects.

此外，底板200的至少相對兩側還包含一側板222及於側板222設置的一彈性扣勾220。外殼110的二凸緣130還分別開設有一定位孔132，供與各彈性扣勾220卡合。在如圖4至圖6所示的實施例中，底板200較佳設有四個相應的側板222，且每一側板222均設有所述彈性扣勾220，以與相應的各定位孔132卡合。如此能夠增加底板200與外殼110卡合的穩定性與可靠性。 In addition, at least opposite sides of the bottom plate 200 further include a side plate 222 and a resilient buckle 220 disposed on the side plate 222. The two flanges 130 of the outer casing 110 further define a positioning hole 132 for engaging with each elastic buckle 220. In the embodiment shown in FIG. 4 to FIG. 6 , the bottom plate 200 is preferably provided with four corresponding side plates 222 , and each of the side plates 222 is provided with the elastic buckles 220 for corresponding positioning holes 132 . Engage. This can increase the stability and reliability of the engagement of the bottom plate 200 with the outer casing 110.

請一併參考圖8所示，為繪示本發明電子裝置的組合方法的流程圖。前述電子裝置100結構，能夠以下製法得到，其步驟包括：a)將至少一電性連接端與複數電子元件電性耦接於一電路板上。b)組裝該電路板於開設有至少一穿孔的一外殼，使該電性連接端穿過該穿孔。c)塗佈一密封膠於該電路板與該穿孔之間。d)填充一灌膠於外殼與電路板之間。 Please refer to FIG. 8 together for a flowchart of a method for combining the electronic devices of the present invention. The structure of the electronic device 100 can be obtained by the following method. The steps include: a) electrically coupling at least one electrical connection end to the plurality of electronic components on a circuit board. b) assembling the circuit board with an outer casing having at least one perforation, such that the electrical connection end passes through the perforation. c) applying a sealant between the circuit board and the perforation. d) filling a potting glue between the outer casing and the circuit board.

在步驟b)中，當電性連接端插設或穿過穿孔時，還包含將各電子元件容置於外殼的一凸殼內，使電性連接端外露於凸殼之外。由於電性連接端已事先與電路板焊固，不須再經錫爐焊固，因此電性連接端與電路板之間不會產生餘隙。塗佈密封膠與灌膠的製程，也不會因此而產生溢膠等污染的問題。 In step b), when the electrical connection end is inserted or passed through the through hole, the electronic component is further received in a convex case of the outer casing, and the electrical connection end is exposed outside the convex case. Since the electrical connection end has been soldered to the circuit board in advance, it does not need to be soldered through the tin furnace, so there is no gap between the electrical connection end and the circuit board. The process of applying the sealant and the potting glue does not cause the problem of contamination such as overflow glue.

在步驟d)中，更包含以一底板將該電路板組裝於該外殼上，如此以保護電路板於底板與外殼之間，底板與電路板之間的一間隙。進一步而言，灌膠係填充形成於底板與電路板之間的間隙中，例如以快速膠、低壓注塑膠或其他適合的膠體填充於該電路板的上下空間中，待灌膠冷卻凝固後，即形成一防水墊或一防水墊片，以防止水氣、灰塵等雜質侵入電路板的間隙內，使電路 板上的各電子元件及電性連接端不易損壞，進而使電子裝置的品質與使用壽命增加。 In the step d), the circuit board is assembled on the outer casing by a bottom plate, so as to protect the circuit board between the bottom plate and the outer casing, and a gap between the bottom plate and the circuit board. Further, the filling of the glue is formed in the gap between the bottom plate and the circuit board, for example, filling the upper and lower spaces of the circuit board with a quick glue, a low pressure injection glue or other suitable glue, and after the glue is cooled and solidified, That is, a waterproof pad or a waterproof gasket is formed to prevent moisture, dust and the like from intruding into the gap of the circuit board, so that the circuit The electronic components and the electrical connection terminals on the board are not easily damaged, thereby increasing the quality and service life of the electronic device.

此外，當外殼組裝電路板並固定底板時，還包含以複數固定元件(未標示)，例如螺絲等從外殼穿過底板再施以灌膠填充其中，以增加本發明電子裝置結構結合的穩固性。 In addition, when the outer casing assembles the circuit board and fixes the bottom plate, it also includes a plurality of fixing elements (not labeled), such as screws, etc., from the outer casing through the bottom plate and then filled with glue to increase the stability of the structural combination of the electronic device of the present invention. .

因此，本發明電路板160已經焊固各電子元件162與例如為連接器或其他適合元件的電性連接端170，因此不須經過錫爐的焊接製程，即不須經過二次焊接的加工程序，電路板160及其上的各電子元件162不會因高溫產生熔毀的現象。此外，塗佈於電路板130與穿孔120之間的密封膠180以及填充於容置空間150與間隙210的灌膠190也不會產生溢膠等污染的問題，使本發明的電子裝置100不會產生任何的餘隙或間隙，水氣及灰塵等不會其從中進入，進而提升電子裝置100的品質和使用壽命。 Therefore, the circuit board 160 of the present invention has soldered the electronic components 162 to the electrical connection terminals 170, such as connectors or other suitable components, so that the soldering process of the soldering furnace is not required, that is, the processing procedure without secondary soldering is required. The circuit board 160 and the electronic components 162 thereon are not melted by high temperature. In addition, the sealant 180 applied between the circuit board 130 and the through hole 120 and the glue filling 190 filled in the accommodating space 150 and the gap 210 do not cause any problem such as overflow of the glue or the like, so that the electronic device 100 of the present invention does not Any clearance or gap will be generated, and moisture, dust, and the like will not enter from it, thereby improving the quality and service life of the electronic device 100.

綜上所述，本文於此所揭示的實施例應被視為用以說明本發明，而非用以限制本發明。本發明的範圍應由後附申請專利範圍所界定，並涵蓋其合法均等物，並不限於先前的描述。 In the above, the embodiments disclosed herein are to be considered as illustrative of the invention and not to limit the invention. The scope of the present invention is defined by the scope of the appended claims, and the legal equivalents thereof are not limited to the foregoing description.

Claims (8)

一種電子裝置結構，包括：一外殼，包含至少一穿孔、二凸緣、設置於該二凸緣之間的一凸殼及分別連接該凸緣和該凸殼的二隔板，各該隔板分別位於該穿孔二側；一電路板，包含電性耦接複數電子元件及相對該至少一穿孔設置的至少一電性連接端，其中該電性連接端為一電性接腳、一電子線或一連接器，該電性連接端定位於該二隔板之間並外露於該凸殼之外；一密封膠，設置於該電路板與該穿孔之間；以及一灌膠，填充於該外殼與該電路板之間。 An electronic device structure comprising: an outer casing comprising at least one perforation, two flanges, a convex shell disposed between the two flanges, and two partitions respectively connecting the flange and the convex shell, each of the partitions The circuit board is electrically connected to the plurality of electronic components and the at least one electrical connection terminal disposed opposite to the at least one through hole, wherein the electrical connection end is an electrical pin and an electronic wire. Or a connector, the electrical connection end is positioned between the two partitions and exposed outside the convex shell; a sealant is disposed between the circuit board and the perforation; and a potting filler is filled in the Between the outer casing and the circuit board. 如請求項1所述的電子裝置結構，更包含組裝該電路板並定位於該外殼的一底板，該底板的至少相對兩側還包含一側板及於該側板設置的一彈性扣勾。 The electronic device structure of claim 1, further comprising a circuit board that is assembled and positioned on the bottom plate, and at least two opposite sides of the bottom plate further comprise a side plate and a resilient hook disposed on the side plate. 如請求項1所述的電子裝置結構，其中該外殼還位於該凸殼內的一容置空間，該容置空間還填充該灌膠。 The electronic device structure of claim 1, wherein the housing is further located in an accommodating space in the convex housing, and the accommodating space further fills the filling material. 如請求項3所述的電子裝置結構，其中各該電子元件分別容置於該容置空間內且該穿孔形成於該凸緣。 The electronic device structure of claim 3, wherein each of the electronic components is respectively received in the accommodating space and the through hole is formed in the flange. 一種電子裝置的組裝方法，其步驟包括：a)將至少一電性連接端與複數電子元件電性耦接於一電路板上；b)組裝該電路板於開設有至少一穿孔的一外殼，使該電性連接端穿過該穿孔，當該電性連接端插設或穿過該穿孔時，該電性連接端定位於二隔板之間並外露於該凸殼之外；c)塗佈一密封膠於該電路板與該穿孔之間；以及d)填充一灌膠於該外殼與該電路板之間。 An electronic device assembly method includes the steps of: a) electrically coupling at least one electrical connection end to a plurality of electronic components on a circuit board; b) assembling the circuit board to an outer casing having at least one perforation; Passing the electrical connection end through the through hole, when the electrical connection end is inserted or passed through the through hole, the electrical connection end is positioned between the two partition plates and exposed outside the convex case; c) coating a sealant between the circuit board and the perforation; and d) filling a potting between the outer casing and the circuit board. 如請求項5所述的電子裝置的組裝方法，其中在步驟b)中，當該電性連接端插設或穿過該穿孔時，還包含將各該電子元件容置於該外殼的一凸殼內。 The method of assembling an electronic device according to claim 5, wherein in step b), when the electrical connection end is inserted or passed through the through hole, the method further comprises: receiving a convex portion of each of the electronic components Inside the shell. 如請求項5所述的電子裝置的組裝方法，其中在步驟d)中，更包含以一底板將該電路板組裝於該外殼上。 The method of assembling an electronic device according to claim 5, wherein in the step d), the circuit board is further assembled on the outer casing by a bottom plate. 如請求項7所述的電子裝置的組裝方法，其中該灌膠係填充形成於該底板與該電路板之間的一間隙中。 The method of assembling an electronic device according to claim 7, wherein the filling compound is filled in a gap formed between the bottom plate and the circuit board.