WO2018157476A1 - 一种三维功率放大器的散热*** - Google Patents

一种三维功率放大器的散热*** Download PDF

Info

Publication number
WO2018157476A1
WO2018157476A1 PCT/CN2017/084813 CN2017084813W WO2018157476A1 WO 2018157476 A1 WO2018157476 A1 WO 2018157476A1 CN 2017084813 W CN2017084813 W CN 2017084813W WO 2018157476 A1 WO2018157476 A1 WO 2018157476A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
power amplifier
heat dissipation
dimensional power
heat sink
Prior art date
Application number
PCT/CN2017/084813
Other languages
English (en)
French (fr)
Inventor
贾鹏程
Original Assignee
广州程星通信科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 广州程星通信科技有限公司 filed Critical 广州程星通信科技有限公司
Publication of WO2018157476A1 publication Critical patent/WO2018157476A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Definitions

  • the present invention relates to a heat dissipation system, and more particularly to a heat dissipation system that can be applied to a miniaturized three-dimensional power amplifier.
  • a three-dimensional power amplifier can be understood as a planar power amplifier that is rolled up to form a three-dimensional cylindrical shape, and the power amplifier device in the original planar power amplifier is distributed in the outer surface of the cylinder.
  • this three-dimensional power synthesis method it has more and more applications due to its higher synthesis efficiency and smaller size.
  • the problem faced by the internal power device is that since the heat source for generating heat is three-dimensionally distributed around the circumference of the cylinder, that is, the heat source distribution is three-dimensionally distributed, an effective heat dissipation method is required.
  • the heat from the heat source can be dissipated.
  • the heat sink is installed on the outer surface of the power amplifier for heat dissipation.
  • the disadvantage is that the three-dimensional heat dissipation method requires the heat sink to be mounted on the upper, lower, left and right surfaces of the power amplifier. This leads to an increase in the size and weight of the installed machine and increases the assembly complexity.
  • the three-dimensional heat dissipation method is too large to meet the requirements of small size and heat dissipation.
  • an object of the present invention is to provide a heat dissipation system that can be applied to a miniaturized three-dimensional power amplifier, which not only satisfies the heat dissipation requirement, but also has a small size and can greatly save installation space.
  • the technical solution adopted by the present invention is: a heat dissipation system of a three-dimensional power amplifier, comprising two C-type heat sinks which are disposed symmetrically around the periphery of the three-dimensional power amplifier, and the outer surface of the C-type heat sink is embedded There are a plurality of first heat pipes, each of which is C-shaped and disposed along a C-shaped profile of the C-type heat sink.
  • a planar heat sink is further disposed, and a plurality of second heat pipes are embedded on the heat conducting plane of the planar heat sink, and the two C-type heat sinks are disposed on a heat conducting plane of the planar heat sink.
  • the inner walls of the two C-type heat sinks are covered with a graphite sheet or an indium sheet.
  • the two C-type heat sinks are symmetrically arranged left and right and then spliced into a cubic heat sink.
  • a graphite sheet or a thermal grease layer is disposed between the bottom of the two C-type heat sinks and the heat transfer plane of the planar heat sink.
  • an outer surface of the first heat pipe is flush with an outer surface of the C-type heat sink.
  • the body of the C-type heat sink is made of aluminum or copper.
  • the first heat pipe is made of a heat equalizing plate.
  • the body of the planar heat sink is made of aluminum or copper.
  • the second heat pipe is made of a soaking plate.
  • the invention has the beneficial effects that the heat dissipation system of the invention comprises two C-type heat sinks which can be disposed around the periphery of the three-dimensional power amplifier after being symmetrically disposed, so that the heat cannot be conducted due to the direct gap of the C-type heat sink.
  • the outer surface of the C-type heat sink is embedded with a plurality of first heat pipes, and each of the first heat pipes is C-shaped and disposed along the C-shaped profile of the C-type heat sink, so the heat of the three-dimensional power amplifier Along the outer surface of the cylinder, heat is conducted to the bottom of the C-type heat sink through the first heat pipe on the C-type heat sinks on both sides, and the heat at the bottom of the C-type heat sink is radiated through the heat dissipation plane in the communication system.
  • the heat dissipation system of the invention not only has a small size, is easy to assemble, meets heat dissipation requirements, but is also applicable to a communication system capable of only radiating heat in a single plane, and does not need to be used for a communication system. Large changes, easy to implement, application compatibility and flexibility.
  • 1 is a schematic diagram of the principle of a conventional three-dimensional power amplifier
  • FIG. 2 is a schematic structural view of a heat dissipation system of a three-dimensional power amplifier according to the present invention
  • FIG. 3 is a schematic exploded view showing the structure of a C-type heat sink in a heat dissipation system of a three-dimensional power amplifier according to the present invention
  • FIG. 4 is a schematic exploded view showing the structure of a planar heat sink in a heat dissipation system of a three-dimensional power amplifier according to the present invention
  • FIG. 5 is a schematic structural view of a specific embodiment of a heat dissipation system of a three-dimensional power amplifier according to the present invention.
  • a heat dissipation system for a three-dimensional power amplifier includes two C-type heat sinks disposed symmetrically around the periphery of the three-dimensional power amplifier, and a plurality of first heat pipes are embedded on the outer surface of the C-type heat sink.
  • the first heat pipe is C-shaped and is disposed along the C-profile of the C-type heat sink.
  • the working principle is: when assembling, the three-dimensional power amplifier with the heat dissipation system of the invention is placed on the heat dissipation plane of the communication system, and the heat of the three-dimensional power amplifier is along the outer surface of the cylinder, and passes through both sides.
  • the first heat pipe on the C-type heat sink conducts heat to the bottom of the C-type heat sink, and the heat at the bottom is dissipated through the heat dissipation plane of the communication system.
  • the heat dissipation system of the present invention is a miniaturized space-to-plane heat dissipation system, and the heat sink is not required to be installed on the upper, lower, left and right surfaces at the same time, and the volume is small, and the heat dissipation requirement can also be met, and the utility model can also be applied to only the heat dissipation requirement.
  • the single-plane heat dissipation communication system there is no need to make major changes to the communication system, and the compatibility and flexibility of operations and applications are high.
  • a planar heat sink is further disposed, and a plurality of second heat pipes are embedded on the heat conduction plane of the planar heat sink, and the two C-type heat sinks are disposed on a heat conduction plane of the planar heat sink. That is, the bottom of the two C-type heat sinks is provided with a flat heat sink. The heat at the bottom of the two C-type heat sinks is transmitted to the entire planar heat sink through the planar heat sink mounted on the bottom, which increases the heat dissipation area between the three-dimensional power amplifier and the communication system and improves the heat dissipation performance.
  • the C-type heat sink 1 is a C-type average temperature heat sink
  • the planar heat sink 3 is a planar average temperature heat sink.
  • a heat dissipation system of a three-dimensional power amplifier includes a planar heat sink 3 and two C-type heat sinks 1 which are disposed symmetrically around the periphery of the three-dimensional power amplifier 6, and the type C a plurality of first heat pipes 2 are embedded in the outer surface of the heat sink 1, and each of the first heat pipes 2 is C-shaped and disposed along a C-shaped profile of the C-type heatsink 1;
  • a plurality of second heat pipes 4 are embedded in the heat conducting plane of the planar heat sink 3, and the two C-type heat sinks 1 are disposed on a heat conducting plane of the planar heat sink.
  • the two C-type heat sinks 1 are symmetrically disposed on both sides of the three-dimensional power amplifier 6 and then spliced into a cubic heat sink, and the cube heat sink is disposed on the heat conducting plane of the planar heat sink 3.
  • the C-type heat sink 1 can preferably be realized by using a C-type aluminum structure heat sink, which can further reduce the weight of the heat dissipation system, or can be realized by using a copper material, thereby further improving the thermal conductivity. Improve heat dissipation performance;
  • the outer surface thereof is flush with the outer surface of the C-type heat sink 1, and it may be Copper heat pipe made of soaking plate;
  • planar heat sink 3 it can be preferably realized by using an aluminum structure heat dissipating member, which can further reduce the weight of the system, or can be realized by using a copper material, thereby further improving the thermal conductivity and improving the heat dissipation performance;
  • the second heat pipe 4 may be a copper heat pipe made of a soaking plate.
  • the inner walls of the two C-type heat sinks 1 are covered with a graphite sheet or an indium sheet 5, and the bottoms of the two C-type heat sinks 1 and the heat conducting plane of the planar heat sink 3 are disposed. It is provided with a graphite sheet or a thermal grease layer. That is, when assembling, the two C-type heat sinks 1 are symmetrically mounted on both sides of the cylindrical three-dimensional power amplifier 6, and the contact between the C-type heat sink 1 and the three-dimensional power amplifier 6 is improved by providing graphite sheets or indium sheets 5.
  • three-dimensional power amplifier 6 with a C-type heat sink on both sides is installed on the heat conduction plane of the planar heat sink 3, at this time, the bottom of the cube heat sink and the planar heat sink 3
  • a graphite sheet or a thermal grease layer is provided to improve the thermal resistance of the contact surface, and finally is integrally mounted on the heat dissipation plane of the system.
  • planar heat sink 3 and the planar heat sink in the system can be directly formed into an integrated design during design, which can reduce the space between the three-dimensional power amplifier 6 and the system heat sink.
  • the thermal resistance also reduces volume and weight.
  • the heat dissipation system of the present invention has advantages including:
  • the heat dissipation system of the invention is processed by an aluminum substrate, and the heat dissipation performance is ensured while reducing the weight of the entire heat dissipation system, and the product having strict requirements on weight such as air load can be satisfied;
  • the heat dissipation system of the present invention makes the three-dimensional power amplifier no longer limited to the three-dimensional heat dissipation mode, but can also be directly applied to the planar heat dissipation system of the traditional communication system, so that the three-dimensional power amplifier can be directly applied to more traditional communication systems. No major changes are required, and compatibility and flexibility are high;
  • the heat dissipation system of the present invention has a smaller installation volume size than the conventional three-dimensional heat dissipation method, and can make the installation of the three-dimensional power amplifier more flexible.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Amplifiers (AREA)

Abstract

一种三维功率放大器（6）的散热***，包括两个左右对称设置后可围设在三维功率放大器（6）外周的C型散热器（1），所述C型散热器（1）的外表面嵌装有若干个第一热管（2），各所述第一热管（2）为C字型并沿C型散热器（1）的C型轮廓设置。该散热***不仅体积尺寸小，易于装配，满足散热要求，而且还能适用于仅能单平面散热的通信***中，还无需对通信***做较大的改动，易于实现操作，应用兼容性和灵活性高。该三维功率放大器（6）的散热***可广泛应用于通讯领域中。

Description

一种三维功率放大器的散热***
技术领域
本发明涉及散热***，尤其涉及一种可适用于小型化三维功率放大器的散热***。
背景技术
在通信领域中，为了实现高功率输出，需要对多路放大器进行功率合成。传统的平面功率合成方式占用较大的面积，而采用三维功率放大器的设计可以大大减少功率放大器所占的面积。如图1所示，三维功率放大器可以理解为将平面功率放大器卷起来，形成一个立体的圆柱形，而原先平面功率放大器中的功率放大器器件则分布在该圆柱体的外表内。而对于这种三维功率合成方式，由于其具有更高的合成效率及更小的体积尺寸，因此其得到越来越多的应用。
对于上述三维功率放大器，其所面临的问题在于内部的功率器件，由于其产生热量的热源是呈三维分布于圆柱体的周边，即其热源分布是立体分布的，这样则需要有效的散热方式，才能将热源的热量散出。针对这一问题，目前采用在功率放大器的外表面都安装散热器进行散热这一方式来解决，但是其缺点是这种三维散热方式需要在功率放大器的上下左右表面同时安装散热器，这样则会导致装机的体积尺寸及重量增大，同时会增加装配复杂度。而且对于仅能单平面散热及对装机体积尺寸有严格要求的通信***而言，这种三维立体散热的方式显得过于庞大，无法同时满足小体积尺寸与散热的要求。
发明内容
为了解决上述技术问题，本发明的目的是提供一种可适用于小型化三维功率放大器的散热***，不仅能满足散热要求，而且其体积尺寸小，能大大节省安装摆放空间。
本发明所采用的技术方案是：一种三维功率放大器的散热***，包括两个左右对称设置后可围设在三维功率放大器外周的C型散热器，所述C型散热器的外表面嵌装有若干个第一热管，各所述第一热管为C字型并沿C型散热器的C型轮廓设置。
进一步，还包括平面散热器，所述平面散热器的导热平面上嵌装有若干个第二热管，所述两个C型散热器设置在平面散热器的导热平面上。
进一步，所述两个C型散热器的内壁上覆盖设置有石墨片或铟片。
进一步，所述两个C型散热器左右对称设置后拼接成立方体散热器。
进一步，所述两个C型散热器的底部与平面散热器的导热平面之间设有石墨片或导热硅脂层。
进一步，所述第一热管的外表面与C型散热器的外表面齐平。
进一步，所述C型散热器的主体材质为铝或铜。
进一步，所述第一热管由均热板制作而成。
进一步，所述平面散热器的主体材质为铝或铜。
进一步，所述第二热管由均热板制作而成。
本发明的有益效果是：本发明的散热***包括有两个左右对称设置后可围设在三维功率放大器外周的C型散热器，这样则不会因C型散热器直接的缝隙导致热量无法传导，同时，所述C型散热器的外表面嵌装有若干个第一热管，且各所述第一热管为C字型并沿C型散热器的C型轮廓设置，因此三维功率放大器的热量沿着其圆柱体外表面，会通过两侧的C型散热器上的第一热管将热量传导到C型散热器的底部，而C型散热器底部的热量会通过通信***中的散热平面散发出去，这样相较于传统的三维空间散热方法，本发明的散热***不仅体积尺寸小，易于装配，满足散热要求，而且还能适用于仅能单平面散热的通信***中，还无需对通信***做较大的改动，易于实现操作，应用兼容性和灵活性高。
附图说明
图1是传统三维功率放大器的原理示意图；
图2是本发明一种三维功率放大器的散热***的结构示意图；
图3是本发明一种三维功率放大器的散热***中C型散热器的结构分解示意图；
图4是本发明一种三维功率放大器的散热***中平面散热器的结构分解示意图；
图5是本发明一种三维功率放大器的散热***的一具体实施例结构示意图。
1、C型散热器；2、第一热管；3、平面散热器；4、第二热管；5、石墨片或铟片；6、三维功率放大器。
具体实施方式
一种三维功率放大器的散热***，包括两个左右对称设置后可围设在三维功率放大器外周的C型散热器，所述C型散热器的外表面嵌装有若干个第一热管，各所述第一热管为C字型并沿C型散热器的C型轮廓设置。
对于上述散热***，其工作原理为：装配时，将带有本发明散热***的三维功率放大器放置在通信***的散热平面上，三维功率放大器的热量沿着其圆柱体外表面，会通过两侧的C型散热器上的第一热管将热量传导到C型散热器的底部，而该底部的热量则会通过该通信***的散热平面散发出去。由此可得，本发明的散热***为一种小型化空间转平面的散热***，无需在其上下左右表面同时安装散热器，体积小，同时也能满足散热要求，而且还能适用于仅能单平面散热的通信***中，还无需对通信***做较大的改动，操作和应用的兼容性、灵活性都很高。
进一步作为本实施例的优选方式，还包括平面散热器，所述平面散热器的导热平面上嵌装有若干个第二热管，所述两个C型散热器设置在平面散热器的导热平面上，即两个C型散热器的底部设置有平面散热器。两个C型散热器底部的热量通过安装在底部的平面散热器，从而将热量快速传导至整个平面散热器上，这样能增大三维功率放大器与通信***之间的散热面积，提高散热性能。
本发明一具体实施例
在本实施例中，所述C型散热器1为C型均温散热器，所述平面散热器3为平面均温散热器。
如图2至图4所示，一种三维功率放大器的散热***，包括平面散热器3和两个左右对称设置后可围设在三维功率放大器6外周的C型散热器1，所述C型散热器1的外表面嵌装有若干个第一热管2，各所述第一热管2为C字型并沿C型散热器1的C型轮廓设置；
所述平面散热器3的导热平面上嵌装有若干个第二热管4，所述两个C型散热器1设置在平面散热器的导热平面上。其中，如图所示，所述两个C型散热器1左右对称设置在三维功率放大器6两侧后拼接成立方体散热器，所述立方体散热器设置在平面散热器3的导热平面上。
优选地，对于上述的C型散热器1，其可优选采用C型铝结构散热件来实现，这样能进一步地减轻散热***的重量，又或者可采用铜材料来实现，从而进一步地提高导热率，提高散热性能；
对于上述的第一热管2，其沿C型散热器1的C型轮廓设置在C型散热器1的外表面后，其外表面与C型散热器1的外表面齐平，并且其可为铜热管，由均热板制作而成；
对于上述的平面散热器3，其可优选采用铝结构散热件来实现，这样能进一步地减轻***的重量，又或者可采用铜材料来实现，从而进一步地提高导热率，提高散热性能；
对于上述的第二热管4，其可为铜热管，由均热板制作而成。
如图5所示，所述两个C型散热器1的内壁上覆盖设置有石墨片或铟片5，而所述两个C型散热器1的底部与平面散热器3的导热平面之间设有石墨片或导热硅脂层。即装配时，将两个C型散热器1左右对称地安装在圆柱体形三维功率放大器6的两侧，C型散热器1与三维功率放大器6之间通过设置石墨片或铟片5来改善接触面热阻，提高散热性能；然后将整个两侧设有C型散热器的三维功率放大器6安装设置在平面散热器3的导热平面上，此时，立方体散热器的底部与平面散热器3之间设置有石墨片或导热硅脂层，来改善接触面热阻，最后再整体安装在***的散热平面上。
另外优选地，对于仅能平面散热的通信***，在设计制作时，可将平面散热器3与***中的平面散热器直接制作成一体化设计，这样能减少三维功率放大器6与***散热器间的热阻，同时也能减小体积及重量。
由上述可得，本发明散热***具有的优点包括有：
1、本发明的散热***采用铝基材加工，在保证散热性能同时也减小整个散热***重量，可以满足机载等对重量有严格要求的产品；
2、本发明的散热***使三维功率放大器不再局限于三维立体的散热方式，而还可以直接适用于传统通信***的平面散热***中，使三维功率放大器可以直接应用在更多传统通信***上而不需要做较大的改动，兼容性和灵活性高；
3、本发明的散热***对比传统三维立体散热方式有更小的安装体积尺寸，可以使三维功率放大器的安装更加灵活。
以上是对本发明的较佳实施进行了具体说明，但本发明创造并不限于所述实施例，熟悉本领域的技术人员在不违背本发明精神的前提下还可做作出种种的等同变形或替换，这些等同的变形或替换均包含在本申请权利要求所限定的范围内。

Claims (10)

  1. 一种三维功率放大器的散热***，其特征在于：包括两个左右对称设置后可围设在三维功率放大器外周的C型散热器，所述C型散热器的外表面嵌装有若干个第一热管，各所述第一热管为C字型并沿C型散热器的C型轮廓设置。
  2. 根据权利要求1所述一种三维功率放大器的散热***，其特征在于：还包括平面散热器，所述平面散热器的导热平面上嵌装有若干个第二热管，所述两个C型散热器设置在平面散热器的导热平面上。
  3. 根据权利要求1所述一种三维功率放大器的散热***，其特征在于：所述两个C型散热器的内壁上覆盖设置有石墨片或铟片。
  4. 根据权利要求1所述一种三维功率放大器的散热***，其特征在于：所述两个C型散热器左右对称设置后拼接成立方体散热器。
  5. 根据权利要求2所述一种三维功率放大器的散热***，其特征在于：所述两个C型散热器的底部与平面散热器的导热平面之间设有石墨片或导热硅脂层。
  6. 根据权利要求1-5任一项所述一种三维功率放大器的散热***，其特征在于：所述第一热管的外表面与C型散热器的外表面齐平。
  7. 根据权利要求1-5任一项所述一种三维功率放大器的散热***，其特征在于：所述C型散热器的主体材质为铝或铜。
  8. 根据权利要求1-5任一项所述一种三维功率放大器的散热***，其特征在于：所述第一热管由均热板制作而成。
  9. 根据权利要求2或5所述一种三维功率放大器的散热***，其特征在于：所述平面散热器的主体材质为铝或铜。
  10. 根据权利要求2或5所述一种三维功率放大器的散热***，其特征在于：所述第二热管由均热板制作而成。
PCT/CN2017/084813 2017-03-02 2017-05-18 一种三维功率放大器的散热*** WO2018157476A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710121463.7A CN106879230B (zh) 2017-03-02 2017-03-02 一种三维功率放大器的散热***
CN201710121463.7 2017-03-02

Publications (1)

Publication Number Publication Date
WO2018157476A1 true WO2018157476A1 (zh) 2018-09-07

Family

ID=59169375

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/084813 WO2018157476A1 (zh) 2017-03-02 2017-05-18 一种三维功率放大器的散热***

Country Status (2)

Country Link
CN (1) CN106879230B (zh)
WO (1) WO2018157476A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107567266A (zh) * 2017-10-25 2018-01-09 北京无线电测量研究所 一种天线的冷却***及天线
CN109471228A (zh) * 2018-11-27 2019-03-15 武汉光迅科技股份有限公司 一种同轴封装光器件的散热结构
CN111836519A (zh) * 2020-07-07 2020-10-27 广州程星通信科技有限公司 用于功率器件的散热装置
CN113382613B (zh) * 2021-06-25 2022-10-25 深圳安科高技术股份有限公司 一种探测器模块组件和探测器
CN114841108A (zh) * 2022-03-25 2022-08-02 中国电子科技集团公司第二十九研究所 一种功放产品三维集成设计方法及功放产品

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060076458A1 (en) * 2004-02-19 2006-04-13 Eads Astrium Ltd. Payload module
CN201278625Y (zh) * 2008-08-28 2009-07-22 中兴通讯股份有限公司 一种功率放大器散热装置
CN102315506A (zh) * 2010-07-06 2012-01-11 杨健 使用波导空间合成的高功率放大器的集成散热***
CN204756557U (zh) * 2015-07-22 2015-11-11 高增军 嵌入式热管散热***及使用其的led灯具
CN105650613A (zh) * 2016-03-01 2016-06-08 王念忠 一种散热装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000040891A (ja) * 1998-07-24 2000-02-08 Fujikura Ltd ヒートパイプ付きヒートシンク
US7215220B1 (en) * 2004-08-23 2007-05-08 Cap Wireless, Inc. Broadband power combining device using antipodal finline structure
CN2777753Y (zh) * 2005-01-19 2006-05-03 富准精密工业(深圳)有限公司 散热装置
CN101466244B (zh) * 2007-12-21 2012-06-20 鸿富锦精密工业（深圳）有限公司 散热器
CN203350795U (zh) * 2013-06-08 2013-12-18 北京立华莱康平台科技有限公司 散热器及具有该散热器的主机

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060076458A1 (en) * 2004-02-19 2006-04-13 Eads Astrium Ltd. Payload module
CN201278625Y (zh) * 2008-08-28 2009-07-22 中兴通讯股份有限公司 一种功率放大器散热装置
CN102315506A (zh) * 2010-07-06 2012-01-11 杨健 使用波导空间合成的高功率放大器的集成散热***
CN204756557U (zh) * 2015-07-22 2015-11-11 高增军 嵌入式热管散热***及使用其的led灯具
CN105650613A (zh) * 2016-03-01 2016-06-08 王念忠 一种散热装置

Also Published As

Publication number Publication date
CN106879230A (zh) 2017-06-20
CN106879230B (zh) 2019-09-17

Similar Documents

Publication Publication Date Title
WO2018157476A1 (zh) 一种三维功率放大器的散热***
WO2017091997A1 (zh) 散热***及具有散热***的飞行器
WO2020118629A1 (zh) 电子设备
US20180235073A1 (en) Mobile display device
WO2016161699A1 (zh) 保护套
TW201425854A (zh) 散熱模組
US10790215B1 (en) Heat dissipation device
WO2017020392A1 (zh) 一种led灯散热器
WO2019242697A1 (zh) 具有温度梯度的一体式散热器
WO2019200990A1 (zh) 一种阵列led封装用的石墨烯强化导热金属pcb板
WO2013139222A1 (zh) 一种兼顾导热与绝缘耐压的装置
CN210432265U (zh) 一种高发热石墨烯的散热结构
CN209563078U (zh) 可调换散热鳍片的服务器用散热片
CN210226051U (zh) 一种复合型嵌入式散热片
WO2017198029A1 (zh) 一种散热装置及投影设备
US20210136957A1 (en) Heat dissipation device
CN206042641U (zh) 电子装置
CN216357923U (zh) 一种高效散热的电子设备壳体
CN214316025U (zh) 散热结构
TWI812169B (zh) 散熱裝置及電子設備
CN221465975U (zh) 一种计算机处理器废热回收辅助散热装置
CN215336210U (zh) 一种紧凑型led光源基板
CN210986869U (zh) 一种散热机构及电器设备
CN216721894U (zh) 一种具有散热结构的车载功放
WO2018157316A1 (zh) 热水器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17899087

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17899087

Country of ref document: EP

Kind code of ref document: A1