WO2018141621A3 - Power module - Google Patents

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Publication number
WO2018141621A3
WO2018141621A3 PCT/EP2018/051816 EP2018051816W WO2018141621A3 WO 2018141621 A3 WO2018141621 A3 WO 2018141621A3 EP 2018051816 W EP2018051816 W EP 2018051816W WO 2018141621 A3 WO2018141621 A3 WO 2018141621A3
Authority
WO
WIPO (PCT)
Prior art keywords
contact piece
power module
electric component
frame
contact
Prior art date
Application number
PCT/EP2018/051816
Other languages
German (de)
French (fr)
Other versions
WO2018141621A2 (en
Inventor
Michael Kaspar
Kai Kriegel
Stefan Stegmeier
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2018141621A2 publication Critical patent/WO2018141621A2/en
Publication of WO2018141621A3 publication Critical patent/WO2018141621A3/en

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    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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Abstract

The invention relates to a power module comprising at least one electric component (10, 90) having a contact surface (50, 95), wherein the electric component (10, 90) is electrically contacted by means of the contact surface (50, 95) on at least one contact piece (100), formed from an open-pore material, of the power module and the at least one electric component (10, 90) and the at least one contact piece (100) are fixed relative to each other at least in a positive fit, at least in directions of the flat extensions of the at least one contact surface (50, 95), in particular using a frame of the power module (70, 300) which comprises, preferably in the direction of the flat extensions, openings extending through the contact surfaces (50, 95). The frame (70) can comprise projections (80) which extend transversely, preferably perpendicularly, to the contact surfaces (50, 95) of the at least one electrical component (10, 90) and form in particular guiding means by means of which the electric component (10, 90) and/or the contact piece (100) can be guided or are guided relative to each other in any position in which the contact piece (100) and the electric component (10, 90) are fixed relative to each other. Alternatively, the frame (300) can be formed by means of frame plates which are cut out from a wafer, together with the power components (90) in the form of projecting frames which form the frame plates (300) after embedding individual power components (90) in a mould wafer (302). Said frame plates (300) are set in, for example cast, with the edge areas in lateral walls (305) of a housing of the claimed power module. Advantageously, in the claimed power module, the claimed open-pored material of the at least one contact piece (100) for guiding the coolant, in particular the cooling liquid, is particularly suitable due to its pores. In particular, the material of the at least one contact piece (100) has an open cell structure. In this way, in particular, a coolant or a cooling liquid can be guided through the contact piece (100) and thus at least one power component is efficiently heated.
PCT/EP2018/051816 2017-02-06 2018-01-25 Power module WO2018141621A2 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
DE102017201821 2017-02-06
DE102017201821.6 2017-02-06
DE102017001249 2017-02-09
DE102017001249.0 2017-02-09
DE102017203132.8A DE102017203132A1 (en) 2017-02-06 2017-02-27 power module
DE102017203132.8 2017-02-27

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WO2018141621A3 true WO2018141621A3 (en) 2018-10-25

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TWI719517B (en) * 2019-06-27 2021-02-21 立昌先進科技股份有限公司 Package method for attached single small size and array type of chip semiconductor component
DE102020134563A1 (en) 2020-12-22 2022-06-23 Danfoss Silicon Power Gmbh Power module and method of manufacturing a power module
DE102021209482A1 (en) * 2021-08-30 2023-03-02 Robert Bosch Gesellschaft mit beschränkter Haftung Electronic module with at least one power semiconductor and method for its production

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