DE102017203132A1 - power module - Google Patents

power module Download PDF

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Publication number
DE102017203132A1
DE102017203132A1 DE102017203132.8A DE102017203132A DE102017203132A1 DE 102017203132 A1 DE102017203132 A1 DE 102017203132A1 DE 102017203132 A DE102017203132 A DE 102017203132A DE 102017203132 A1 DE102017203132 A1 DE 102017203132A1
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Germany
Prior art keywords
power module
electrical component
module according
contact piece
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102017203132.8A
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German (de)
Inventor
Michael Kaspar
Kai Kriegel
Stefan Stegmeier
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Siemens AG
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Siemens AG
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Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to PCT/EP2018/051816 priority Critical patent/WO2018141621A2/en
Publication of DE102017203132A1 publication Critical patent/DE102017203132A1/en
Withdrawn legal-status Critical Current

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Abstract

Das Leistungsmodul weist mindestens ein elektrisches Bauteil mit einer Kontaktfläche auf, wobei welchem das elektrische Bauteil mittels der Kontaktfläche an mindestens ein mit offenporigem Material gebildetes Kontaktstück des Leistungsmoduls elektrisch kontaktiert ist und das zumindest eine elektrische Bauteil und das zumindest eine Kontaktstück, zumindest in Richtungen der flächigen Erstreckungen der mindestens einen Kontaktfläche, relativ zueinander zumindest formschlüssig festgelegt sind.The power module has at least one electrical component with a contact surface, wherein the electrical component is electrically contacted by means of the contact surface to at least one formed with open-pored material contact piece of the power module and the at least one electrical component and the at least one contact piece, at least in the directions of the flat Extent of the at least one contact surface are fixed relative to each other at least form-fitting.

Description

Die Erfindung betrifft ein Leistungsmodul.The invention relates to a power module.

In der Leistungselektronik werden passive Bauteile wie etwa Widerstände sowie Halbleiterbauteile wie beispielsweise IGBTs, Dioden, MOSFETS, LEDs und Substrate wie etwa FR4, DCB(Direct copper bonded), AMB (Active metal braze) und Leadframes elektrisch mittels einer Aufbau- und Verbindungstechnik miteinander verbunden.In power electronics, passive components such as resistors as well as semiconductor devices such as IGBTs, diodes, MOSFETs, LEDs and substrates such as FR4, DCB (direct copper bonded), AMB (Active Metal Braze) and leadframes are electrically interconnected by means of a packaging and packaging technique ,

Hierzu sind eine Vielzahl von Verbindungstechniken bekannt. Insbesondere substratferne elektrische Kontaktierungen unterliegen regelmäßig besonderen Anforderungen an die Verbindungstechnik. Je nach Einsatzzweck sollen robuste Kontaktierungen mit hoher Lebensdauer realisierbar sein, welche allerdings möglichst unaufwändig und kostengünstig fertigbar sein sollen.For this purpose, a variety of connection techniques are known. In particular, substrate-distant electrical contacts are regularly subject to special requirements of the connection technology. Depending on the intended use, robust contacts with a long service life should be able to be realized, which, however, should be as inexpensive and manufacturable as possible.

Ferner bedingen insbesondere in der Leistungselektronik das Schalten und das Leiten von Strömen in Halbleiterbauelementen, insbesondere IGBTs, Dioden, MOSFETs etc., Verlustleistungen. Solche Verlustleistungen müssen von einem Kühler aufgenommen werden, so dass sich solche Halbleiterbauelemente nicht zu stark erhitzen und ein effizienter Betrieb sichergestellt ist. Es ist bekannt, Leistungsbauelemente unterseitig durch lunkerfreies Löten, Diffusionslöten oder Sintern auf ein Substrat (DCB, AMB etc.) aufzubringen, wobei das Substrat seinerseits flächig an einen Kühler angebunden ist. Häufig ist die Kühlung dabei jedoch nicht effizient. Die daraus resultierende Erhitzung solcher Leistungsbauelemente hat regelmäßig eine erhöhte Ausfallrate der Leistungsbauelemente sowie ein frühzeitiges Versagen von Isolationsmaterial infolge thermischer Degradation zur Folge. Oberseitig ist eine Kühlung von Leistungsbauelementen häufig besonders schwierig, da aufgrund der oft eingesetzten Drahtbond- oder Bändchenbond-Technologie zur elektrischen Isolation ein Material vergossen wird, welches eine thermische Energieabfuhr behindert.Furthermore, in particular in power electronics, the switching and the conduction of currents in semiconductor components, in particular IGBTs, diodes, MOSFETs, etc., cause power losses. Such power losses must be absorbed by a cooler so that such semiconductor devices do not overheat and ensure efficient operation. It is known to apply power components on the underside by cavitation free soldering, diffusion soldering or sintering on a substrate (DCB, AMB etc.), wherein the substrate in turn is connected flat to a radiator. However, cooling is often not efficient. The resulting heating of such power devices regularly results in an increased failure rate of the power devices as well as premature failure of insulation material due to thermal degradation. On the upper side, cooling of power devices is often particularly difficult, because due to the often used wire bond or Bändchenbond technology for electrical insulation, a material is cast, which hinders thermal energy dissipation.

Vor diesem Hintergrund ist es daher Aufgabe der Erfindung, ein Leistungsmodul bereitzustellen, bei dem einerseits eine elektrische Kontaktierung und damit die Fertigung des Leistungsmoduls robust und unaufwändig möglich sind. Ferner soll eine Kühlung von Bauelementen auf verbesserte Weise möglich sein. Zudem soll ein Verfahren zur Herstellung eines solchen Leistungsmoduls angegeben werden.Against this background, it is therefore an object of the invention to provide a power module in which on the one hand an electrical contact and thus the production of the power module are robust and inexpensive. Furthermore, a cooling of components should be possible in an improved manner. In addition, a method for producing such a power module is to be specified.

Diese Aufgabe der Erfindung wird mit einem Leistungsmodul mit den in Anspruch 1 angegebenen Merkmalen sowie mit einem Verfahren mit den in Anspruch 12 angegebenen Merkmalen gelöst. Bevorzugte Weiterbildungen der Erfindung ergeben sich aus den zugehörigen Unteransprüchen, der nachfolgenden Beschreibung und der Zeichnung.This object of the invention is achieved with a power module having the features specified in claim 1 and with a method having the features specified in claim 12. Preferred embodiments of the invention will become apparent from the accompanying dependent claims, the following description and the drawings.

Das erfindungsgemäße Leistungsmodul weist mindestens ein elektrisches Bauteil mit einer Kontaktfläche auf. Bei dem erfindungsgemäßen Leistungsmodul ist das zumindest eine elektrische Bauteil mittels der zumindest einen Kontaktfläche an mindestens ein Kontaktstück offenporigen Materials des Leistungsmoduls elektrisch kontaktiert und das zumindest eine elektrische Bauteil und das zumindest eine Kontaktstück sind, zumindest in Richtungen der flächigen Erstreckungen der mindestens einen Kontaktfläche, relativ zueinander, und vorzugsweise zudem relativ zu mindestens einem weiteren Bauteil des Leistungsmoduls, zumindest formschlüssig festgelegt. D.h. eine relative Bewegung von elektrischem Bauteil und Kontaktstück ist in Richtung der flächigen Erstreckungen der Kontaktfläche mittels Formschlusses verhindert. Bevorzugt ist das ggf. vorhandene zumindest eine weitere Bauteil ein Bauteil, welches elektrisch an das Kontaktstück kontaktiert ist. Das erfindungsgemäße Leistungsmodul lässt sich zum einen sehr einfach herstellen, da die relative Anordnung von elektrischem Bauteil und Kontaktstück oder ggf. die relative Anordnung von elektrischem Bauteil und Kontaktstück mit einem oder mehreren weiteren Bauteilen des Leistungsmoduls durch formschlüssige Festlegung äußerst unaufwändig ist. Insbesondere lässt sich eine dauerhafte, robuste und zuverlässige Kontaktierung von elektrischem Bauteil und Kontaktstück miteinander sowie ggf. eine zuverlässige elektrische Kontaktierung des elektrischen Bauteils und/oder des Kontaktstücks mit einem oder mehreren weiteren Bauteilen des Leistungsmoduls mittels der formschlüssigen Festlegung, d.h. mittels des Formschlusses, sicherstellen. Das erfindungsgemäße Leistungsmodul lässt sich folglich einfach und zuverlässig realisieren. Vorteilhaft ist aufgrund des Formschlusses zudem ein robuster und zuverlässiger Betrieb sichergestellt, da eine elektrische Kontaktierung, die etwa mittels Galvanisierens bewerkstelligt ist, nicht allein die möglicherweise während des Betriebes auftretende mechanische Last tragen muss. Insbesondere kann eine solche Last etwa aus einer Umströmung des Leistungsbauteils oder einer Umströmung und/oder Durchströmung des Kontaktstücks mit Kühlfluid resultieren.The power module according to the invention has at least one electrical component with a contact surface. In the power module according to the invention, the at least one electrical component is electrically contacted by means of the at least one contact surface on at least one contact piece of open-pored material of the power module and the at least one electrical component and the at least one contact piece are relatively, at least in directions of the planar extensions of the at least one contact surface to each other, and preferably also relative to at least one further component of the power module, fixed at least positively. That a relative movement of electrical component and contact piece is prevented in the direction of the planar extensions of the contact surface by means of positive locking. Preferably, the optionally present at least one further component is a component which is electrically contacted to the contact piece. On the one hand, the power module according to the invention can be produced very simply because the relative arrangement of the electrical component and contact piece or, if appropriate, the relative arrangement of the electrical component and contact piece with one or more further components of the power module is extremely uncomplicated due to positive locking. In particular, a permanent, robust and reliable contacting of the electrical component and the contact piece with one another and possibly reliable electrical contacting of the electrical component and / or the contact piece with one or more further components of the power module can be achieved by means of the positive locking, i. by means of the positive connection, make sure. The power module according to the invention can consequently be implemented simply and reliably. A robust and reliable operation is also advantageously ensured due to the positive connection, since an electrical contact, which is accomplished approximately by means of electroplating, not alone must bear the possibly occurring during operation mechanical load. In particular, such a load may result, for example, from a flow around the power component or from a flow around and / or throughflow of the contact piece with cooling fluid.

Zweckmäßig ist unter „offenporig“ im Sinne dieser Anmeldung zu verstehen, dass Poren des Materials des zumindest einen Kontaktstücks an deren Oberfläche Einlässe bilden, durch welche von außen insbesondere Fluid, etwa ein in einem Kühlkanal geführtes Kühlfluid, ins Kontaktstück eindringen kann. Gerade zur Arretierung eines solchen Kontaktstücks ist der Formschluss besonders geeignet, da das Kontaktstück regelmäßig zur insbesondere flächigen elektrischen Kontaktierung eingesetzt wird.Expediently, "open-pore" in the sense of this application means that pores of the material of the at least one contact piece form inlets on the surface thereof, through which fluid, for example a cooling fluid guided in a cooling channel, can enter the contact piece from outside. Especially for locking such a contact piece of the positive locking is particularly suitable because the contact piece is used regularly for particular flat electrical contacting.

Zweckmäßigerweise sind bei dem erfindungsgemäßen Leistungsmodul das erfindungsgemäß vorgesehene offenporige Material des zumindest einen Kontaktstücks zur Leitung von Kühlfluid, insbesondere Kühlflüssigkeit, durch seine Poren besonders geeignet. Insbesondere weist das Material des zumindest einen Kontaktstücks eine offenzellige Struktur auf. Auf diese Weise kann durch das Kontaktstück insbesondere ein Kühlfluid oder eine Kühlflüssigkeit hindurch geleitet werden und somit das zumindest eine Leistungsbauteil effizient entwärmt werden. Expediently, in the case of the power module according to the invention, the open-pore material of the at least one contact piece provided according to the invention for conducting cooling fluid, in particular cooling fluid, is particularly suitable through its pores. In particular, the material of the at least one contact piece has an open-cell structure. In this way, in particular a cooling fluid or a cooling liquid can be passed through the contact piece and thus the at least one power component can be efficiently cooled.

Vorzugsweise weist das erfindungsgemäße Leistungsmodul ein Substrat auf, wobei das Substrat des Leistungsmoduls das elektrische Bauteil des Leistungsmoduls bildet. Das erfindungsgemäße Leistungsmodul lässt sich in dieser Weiterbildung der Erfindung besonders unaufwändig und robust herstellen, da das Kontaktstück an das Substrat mittels Formschlusses einfach festgelegt werden kann und, insbesondere anschließend, einfach elektrisch, vorzugsweise galvanisch, d.h. mittels Galvanisierens, kontaktiert werden kann. Erfindungsgemäß ist somit auch eine substratferne elektrische Kontaktierung mit äußerst geringem Aufwand möglich.The power module according to the invention preferably has a substrate, wherein the substrate of the power module forms the electrical component of the power module. The power module according to the invention can be produced particularly inexpensively and robustly in this embodiment of the invention, since the contact piece can be easily fixed to the substrate by means of positive locking and, in particular subsequently, simply electrically, preferably galvanically, i. by electroplating, can be contacted. According to the invention, a substrate-distant electrical contacting is thus possible with extremely little effort.

Alternativ oder zusätzlich und ebenfalls bevorzugt bildet ein Leistungsbauteil das elektrische Bauteil. Idealerweise steht bei dem erfindungsgemäßen Leistungsmodul das Leistungsbauteil mittels des Kontaktstücks mit einem Substrat des Leistungsmoduls in elektrischem Kontakt, wobei Substrat, Kontaktstück und Leistungsmodul jeweils relativ zueinander festgelegt sind.Alternatively or additionally and also preferably, a power component forms the electrical component. Ideally, in the case of the power module according to the invention, the power component is in electrical contact with a substrate of the power module by means of the contact piece, the substrate, contact piece and power module being respectively fixed relative to one another.

In einer vorteilhaften Weiterbildung des erfindungsgemäßen Leistungsmoduls ist das mindestens eine Kontaktstück mit, insbesondere aus, einem Metallschwamm und/oder einem Metallschaum und/oder mit einer gewebeartigen und/oder netzartigen Struktur gebildet.In an advantageous development of the power module according to the invention, the at least one contact piece is formed with, in particular, a metal sponge and / or a metal foam and / or with a fabric-like and / or net-like structure.

Vorzugsweise ist bei dem erfindungsgemäßen Leistungsmodul das mindestens eine Kontaktstück mit, insbesondere aus, einer gewebeartigen und/oder schaumartigen und/oder netzartigen Struktur, insbesondere einer als Metallnetz gebildeten Struktur, gebildet. In dieser Weiterbildung lässt sich die Offenporigkeit von erstem und/oder zweiten Kontaktstück leicht gewährleisten.In the case of the power module according to the invention, the at least one contact piece is preferably formed with, in particular, a fabric-like and / or foam-like and / or net-like structure, in particular a structure formed as a metal net. In this development, the open porosity of the first and / or second contact piece can be easily ensured.

Geeigneterweise ist das zumindest eine Kontaktstück aus oder mit Metall, insbesondere Kupfer und/oder Silber und/oder Nickel und/oder Gold und/oder Silber und/oder Zinn, gebildet.Suitably, the at least one contact piece is formed from or with metal, in particular copper and / or silver and / or nickel and / or gold and / or silver and / or tin.

Vorzugsweise ist oder sind bei dem erfindungsgemäßen Leistungsmodul das zumindest eine elektrische Bauteil und/oder zumindest eine Kontaktstück sowohl formschlüssig als auch stoffschlüssig festgelegt. Stoffschlüssig ist das elektrische Bauteil und/oder das Kontaktstück vorzugsweise mittels Um- oder Anspritzens oder mittels Gießens oder Spritzgießens oder Galvanisierens oder mittels Klebens oder Lötens festgelegt.Preferably, in the power module according to the invention, the at least one electrical component and / or at least one contact piece are or are fixed both in a form-fitting manner and in a materially bonded manner. Cohesively, the electrical component and / or the contact piece is preferably fixed by means of transfer molding or molding or by casting or injection molding or electroplating or by gluing or soldering.

Bevorzugt ist bei dem erfindungsgemäßen Leistungsmodul das zumindest eine elektrische Bauteil und/oder zumindest eine Kontaktstück mittels eines Rahmens festgelegt, welcher vorzugsweise in Richtung der flächigen Erstreckungen der Kontaktfläche des elektrischen Bauteils durchführende Durchbrechungen aufweist. Alternativ oder zusätzlich und ebenfalls bevorzugt streckt sich der Rahmen von einem wie oben beschreiben bevorzugt vorhandenen Substrat fort. Insbesondere kann mittels der Durchbrechungen des Rahmens Kühlfluid, zweckmäßig Kühlflüssigkeit, durch den Rahmen und folglich durch das Kontaktstück hindurch und/oder an Kontaktstück und/oder elektrischem Bauteil entlang geführt werden.In the case of the power module according to the invention, the at least one electrical component and / or at least one contact piece is preferably fixed by means of a frame, which preferably has openings in the direction of the planar extensions of the contact surface of the electrical component. Alternatively or additionally, and also preferably, the frame extends from a preferably present substrate as described above. In particular, by means of the openings of the frame, cooling fluid, advantageously coolant, can be passed through the frame and consequently through the contact piece and / or along the contact piece and / or electrical component.

Zweckmäßig weist bei dem erfindungsgemäßen Leistungsmodul der Rahmen Vorsprünge auf, welche sich zumindest quer, vorzugsweise senkrecht, zur Kontaktfläche des zumindest einen elektrischen Bauteils, erstrecken.Expediently, in the power module according to the invention, the frame has projections which extend at least transversely, preferably perpendicular, to the contact surface of the at least one electrical component.

In einer bevorzugten Weiterbildung des erfindungsgemäßen Leistungsmoduls ist der Rahmen mittels zumindest eines Teils eines Moldwafers gebildet.In a preferred development of the power module according to the invention, the frame is formed by means of at least one part of a mold wafer.

Besonders bevorzugt weist das erfindungsgemäße Leistungsmodul einen Kühlstrompfad auf, der zur Führung eines Kühlfluids entlang einer Kühlstromrichtung ausgebildet ist. Geeigneterweise erstreckt sich die Kühlstromrichtung zumindest entlang einer Richtung der flächigen Erstreckung der Kontaktfläche des mindestens einen Leistungsbauteils. Geeigneterweise weicht die Kühlstromrichtung um höchstens 30 Grad, zweckmäßig höchstens 15 Grad, bevorzugt 5 Grad und idealerweise höchstens um 3 Grad von der Ebene der flächigen Erstreckungen der KOntaktfläche des zumindest einen Leistungsbauteils ab. In dieser Weiterbildung der Erfindung strömt das Kühlfluid beim erfindungsgemäßen Leistungsmodul gewissermaßen tangential an der Kontaktfläche und/oder einer Flachseite des zumindest einen Leistungsbauteils entlang, sodass die Effizienz der Entwärmung des Leistungsbauteils maximiert ist. Geeigneterweise führt der Kühlstrompfad durch das Kontaktstück hindurch.The power module according to the invention particularly preferably has a cooling-flow path, which is designed to guide a cooling fluid along a cooling-flow direction. Suitably, the cooling flow direction extends at least along a direction of the planar extent of the contact surface of the at least one power component. Suitably, the cooling flow direction deviates by at most 30 degrees, advantageously at most 15 degrees, preferably 5 degrees, and ideally at most 3 degrees from the plane of the planar extensions of the contact surface of the at least one power component. In this development of the invention, the cooling fluid in the power module according to the invention flows, as it were, tangentially along the contact surface and / or a flat side of the at least one power component, so that the efficiency of the heat dissipation of the power component is maximized. Suitably, the cooling flow path passes through the contact piece.

Vorzugsweise ist bei dem erfindungsgemäßen Leistungsmodul der Rahmen zur Fassung eines rechteckigen Kontaktstücks und/oder eines rechteckigen Leistungsbauteils ausgebildet.In the case of the power module according to the invention, the frame is preferably designed for mounting a rectangular contact piece and / or a rectangular power component.

Besonders zweckmäßig weist das erfindungsgemäße Leistungsmodul ein Führungsmittel, insbesondere zur Linear- und/oder Gleitführung, auf, mittels welchem das elektrische Bauteil und/oder das Kontaktstück in diejenige relative Stellung zueinander führbar ist oder sind, in welcher Kontaktstück und elektrisches Bauteil relativ zueinander festgelegt sind. Particularly suitably, the power module according to the invention has a guide means, in particular for linear and / or sliding, on, by means of which the electrical component and / or the contact piece in that relative position to each other can be guided or are in which contact piece and electrical component are fixed relative to each other ,

Bei dem erfindungsgemäßen Verfahren zur Herstellung eines erfindungsgemäßen Leistungsmoduls wie oben beschrieben wird zumindest ein Leistungsbauteil mit einer Kontaktfläche herangezogen. Das zumindest eine Leistungsbauteil und/oder das zumindest eine Kontaktstück wird oder werden, zumindest in Richtungen der flächigen Erstreckungen der mindestens einen Kontaktfläche, mittels einer Arretiervorrichtung, insbesondere mittels eines Rahmens, relativ zueinander oder gegenüber mindestens einem weiteren Bauteil des Leistungsmoduls zumindest formschlüssig, vorzugsweise mittels eines Führungsmittels, festgelegt. Bei dem erfindungsgemäßen Verfahren wird das Leistungsbauteil mittels mindestens eines mit offenporigem Material gebildeten Kontaktstücks elektrisch kontaktiert. In the method according to the invention for producing a power module according to the invention as described above, at least one power component with a contact surface is used. The at least one power component and / or the at least one contact piece becomes or become at least form-fitting, preferably by means of a locking device, in particular by means of a frame, relative to one another or at least one further component of the power module, at least in directions of the planar extensions of the at least one contact surface of a management tool. In the method according to the invention, the power component is electrically contacted by means of at least one contact piece formed with open-pored material.

Das Kontaktieren und das Festlegen können im Sinne dieser Erfindung gleichzeitig oder in jeder der möglichen Reihenfolgen aufeinanderfolgend durchgeführt werden.For the purposes of this invention, the contacting and setting can be carried out simultaneously or in any of the possible sequences in succession.

Nachfolgend wird die Erfindung anhand eines in der Zeichnung dargestellten Ausführungsbeispiels näher erläutert. Es zeigen:

  • 1 ein erstes Substrat eines ersten Ausführungsbeispiels eines erfindungsgemäßen Leistungsmoduls und ein daran angebundener Rahmen des Leistungsmoduls schematisch im Längsschnitt,
  • 2 das erste Substrat mit dem Rahmen des ersten Ausführungsbeispiels des erfindungsgemäßen Leistungsmoduls gem. 1 schematisch in einer Draufsicht,
  • 3 das erfindungsgemäße Leistungsmodul mit dem Substrat und mit dem Rahmen gem. 1 und 2 mit Leistungsbauteilen und Kontaktstücken offenporigen Materials schematisch im Längsschnitt,
  • 4 das erfindungsgemäße Leistungsmodul gem. 3 mit einem zweiten Substrat schematisch im Längsschnitt,
  • 5 ein zweites Ausführungsbeispiel eines erfindungsgemäßen Leistungsmoduls mit einem Rahmen schematisch im Längsschnitt,
  • 5a das Substrat des zweiten Ausführungseispiels des erfindungsgemäßen Leistungsmoduls gem. 5 schematisch in einer Draufsicht,
  • 6 einen Rahmen mit einem Leistungsbauteil eines dritten Ausführungsbeispiels eines erfindungsgemäßen Leistungsmoduls schematisch in einer Draufsicht, sowie
  • 7 das dritte Ausführungsbeispiel des erfindungsgemäßen Leistungsmoduls mit dem an Seitenwände eines Kühlkanals des erfindungsgemäßen Leistungsmoduls angebunden Rahmen mit dem Leistungsbauteil gem. 6 schematisch im Querschnitt.
The invention will be explained in more detail with reference to an embodiment shown in the drawing. Show it:
  • 1 a first substrate of a first embodiment of a power module according to the invention and an associated frame of the power module schematically in longitudinal section,
  • 2 the first substrate with the frame of the first embodiment of the power module according to the invention. 1 schematically in a plan view,
  • 3 the power module according to the invention with the substrate and the frame gem. 1 and 2 with power components and contact pieces open-pored material schematically in longitudinal section,
  • 4 the power module according to the invention. 3 with a second substrate schematically in longitudinal section,
  • 5 A second embodiment of a power module according to the invention with a frame schematically in longitudinal section,
  • 5a the substrate of the second embodiment example of the power module according to the invention. 5 schematically in a plan view,
  • 6 a frame with a power component of a third embodiment of a power module according to the invention schematically in a plan view, and
  • 7 the third embodiment of the power module according to the invention with the attached to side walls of a cooling channel of the power module according to the invention frame with the power component according to. 6 schematically in cross section.

Das erfindungsgemäße Leistungsmodul umfasst in einem ersten Ausführungsbeispiel zunächst wie in 1 dargestellt in an sich bekannter Weise ein Substrat 10.The power module according to the invention comprises in a first embodiment, first as in 1 represented in a conventional manner, a substrate 10 ,

Das Substrat 10 ist als Flachteil ausgebildet, welches zwei zueinander parallele Flachseiten 20, 30 aufweist, die sich jeweils horizontal und senkrecht zur Zeichenebene erstrecken.The substrate 10 is formed as a flat part, which two parallel flat sides 20 . 30 has, each extending horizontally and perpendicular to the plane of the drawing.

Das Substrat 10 weist in an sich bekannter Weise Durchkontaktierungen 40 in Gestalt von metallgefüllten Vias auf, welche einander abgewandte Kontaktflächen 50, 60 an den Flachseiten 20, 30 des Substrats 10 miteinander leitend verbinden.The substrate 10 has vias in a conventional manner 40 in the form of metal-filled vias, which contact surfaces facing away from each other 50 . 60 on the flat sides 20 . 30 of the substrate 10 interconnect with each other.

An eine Flachseite 20 des Substrats 10 ist jede der Kontaktflächen 50 teilumfänglich von einem Rahmen 70 umgeben, der an der Flachseite 20 angebunden ist und sich senkrecht von der Flachseite 20 fortstreckt. Grundsätzlich kann sich der Rahmen 70 in weiteren, nicht eigens in der Zeichnung dargestellten Ausführungsbeispielen auch von der Kontaktfläche 50 fortstrecken. In weiteren, nicht eigens abgebildeten Ausführungsbeispielen können sich Rahmen 70 auch an der Flachseite 30 vom Substrat 10 und/oder an der Kontaktfläche 60 vom Substrat 10 fortstrecken.On a flat side 20 of the substrate 10 is each of the contact surfaces 50 partly from a frame 70 surrounded, on the flat side 20 Tailed and perpendicular from the flat side 20 continued stretching. Basically, the frame 70 in other, not specifically illustrated in the drawings embodiments of the contact surface 50 continuous stretch. In further, not specifically illustrated embodiments may frame 70 also on the flat side 30 from the substrate 10 and / or at the contact surface 60 from the substrate 10 continuous stretch.

Mittels dieser Rahmen 70 sind Leistungsbauteile (siehe weitere Beschreibung dieses Ausführungsbeispiels) relativ zu den Kontaktflächen 50 in den Richtungen der flächigen Erstreckungen der Kontaktflächen 50 (und somit - gleichbedeutend - den flächigen Erstreckungen der Flachseite 20) des Substrats 10 festlegbar. Dazu sind die Leistungsbauteile in Richtung der flächigen Erstreckungen der Flachseiten 20, 30 von Kühlfluid, im hier gezeigten Ausführungsbeispiel von Kühlflüssigkeit, umströmbar angeordnet. Zur Umströmung mit Kühlflüssigkeit wird mittels des Substrats 10 und weiterer Bestandteilen des erfindungsgemäßen Leistungsmoduls ein Kühlkanal gebildet, wie in der weiteren Beschreibung des Ausführungsbeispiels erläutert werden wird.By means of these frames 70 are power components (see further description of this embodiment) relative to the contact surfaces 50 in the directions of the planar extensions of the contact surfaces 50 (and thus - synonymous - the flat extensions of the flat side 20 ) of the substrate 10 fixable. These are the power components in the direction of the flat extensions of the flat sides 20 . 30 of cooling fluid, arranged in the embodiment shown here of cooling liquid, flow around. To flow around with coolant is by means of the substrate 10 and further components of the power module according to the invention, a cooling channel is formed, as will be explained in the further description of the embodiment.

Der Rahmen 70 besteht wie in 2 dargestellt jeweils aus vier allgemeinen senkrechten Zylindern 80 (im mathematischen Sinne, d.h. senkrechte Zylinder mit nicht notwendigerweise kreisförmiger Grundfläche) mit L-förmiger Grundfläche, wobei sich die Mantelflächen der senkrechten Zylinder 80 senkrecht von der Flachseite 20 fortstrecken (aus Übersichtsgründen sind in 2 keine Kontaktflächen dargestellt).The frame 70 exists as in 2 represented in each case by four general vertical cylinders 80 (in the mathematical sense, ie vertical cylinder with not necessarily circular Base) with L-shaped base, with the lateral surfaces of the vertical cylinder 80 perpendicular from the flat side 20 continue (for clarity, in 2 no contact surfaces shown).

Die L-förmigen Grundflächen sind derart relativ zueinander orientiert und angeordnet, dass die Schenkel der Zylinder 80 mit L-förmiger Grundflächen außen an solchen Seitenabschnitten eines gedachten Rechtecks anliegen, welche die Ecken des gedachten Rechtecks beinhalten. D.h. ein Flachteil mit rechteckiger Längsschnittsfläche ist mit seinen Ecken mit den Scheiteln der Zylinder 80 zur Anlage bringbar und somit formschlüssig in Richtung der flächigen Erstreckungen der Flachseite 20 des Substrats 10 und somit in Richtungen der flächigen Erstreckungen der Kontaktfläche 50 festlegbar.The L-shaped base surfaces are oriented and arranged relative to each other such that the legs of the cylinder 80 with L-shaped bases on the outside of such side portions of an imaginary rectangle, which include the corners of the imaginary rectangle. That is, a flat part with rectangular longitudinal sectional area is with its corners with the apexes of the cylinder 80 can be brought to the plant and thus positively in the direction of the flat extensions of the flat side 20 of the substrate 10 and thus in directions of the planar extensions of the contact surface 50 fixable.

Die Zylinder 80 bilden lineare Gleitführungen für Flachteile mit reckteckiger Längsschnittsfläche in diejenige Stellung, in welcher die Flachteile festgelegt sind. Die Zylinder 80 erlauben folglich eine besonders einfache erfindungsgemäße Fertigung des erfindungsgemäßen Leistungsmoduls.The cylinders 80 form linear sliding guides for flat parts with reckteckiger longitudinal sectional area in that position in which the flat parts are fixed. The cylinders 80 consequently allow a particularly simple production according to the invention of the power module according to the invention.

Die Zylinder 80 des Rahmens 70 sind im gezeigten Ausführungsbeispiel an das Substrat 10 angespritzt. In weiteren, nicht eigens dargestellten Ausführungsbeispielen können die Rahmen 70 grundsätzlich auch mit einer anderen Gestalt ausgebildet sein, etwa können die Rahmen 70 die Kontaktflächen 50 vollumfänglich umgebend ausgebildet sein und mittels Durchführungen für Kühlflüssigkeit durchlässig ausgebildet sein.The cylinders 80 of the frame 70 are in the embodiment shown to the substrate 10 molded. In further, not specifically illustrated embodiments, the frame 70 may in principle also be formed with a different shape, such as the frame 70 the contact surfaces 50 be formed circumferentially surrounding and be designed to be permeable by means of passages for cooling liquid.

In weiteren, nicht eigens gezeigten Ausführungsbeispielen kann der Rahmen 70 auf andere Weise an das Substrat 10 angebunden sein, beispielsweise an das Substrat 10 3D-gedruckt oder geklebt oder gelötet oder gesintert oder lediglich festgedrückt sein. Weiterhin können in in weiteren Ausführungsbeispielen weitere 3D-Verfahren zum Einsatz kommen, insbesondere SLS (selektives Lasersintern) und/oder SLA (Stereolithografie) und/oder Polygrafie und/oder Fused Deposition Modeling (FDM) und/oder 3DP (3D Printing) und/oder Vakuumguss und/oder weitere VerfahrenIn further, not specifically shown embodiments of the frame 70 in a different way to the substrate 10 be connected, for example, to the substrate 10 3D printed or glued or soldered or sintered or simply pressed. Furthermore, further 3D methods may be used in further exemplary embodiments, in particular SLS (selective laser sintering) and / or SLA (stereolithography) and / or polygraphy and / or fused deposition modeling (FDM) and / or 3DP ( 3D Printing) and / or vacuum casting and / or other methods

Wie in 3 dargestellt, und oben bereits kurz skizziert, weist das erfindungsgemäße Leistungsmodul Leistungsbauteile 90 auf, welche ihrerseits Flachteile mit Flachseiten 92 bilden. Die Leistungsbauteile 90 weisen an diesen Flachseiten 92 elektrische Flächenkontakte 95 zur elektrischen Kontaktierung auf. Die Leistungsbauteile 90 weisen zudem rechteckige Längsschnittsflächen auf und sind in den Rahmen 70 mit ihren Längsschnittsflächen parallel zu den flächigen Erstreckungen der Flachseite 20 eingebracht. Die Leistungsbauteile 90 sind von den Kontaktflächen 50 an dem Substrat 10 sowie von dem Substrat 10 selbst beabstandet und mittels elektrisch leitender Kontaktstücke 100 mit rechteckiger Längsschnittsfläche an die Kontaktflächen 50 oder an weitere Bestandteile des erfindungsgemäßen Leistungsmoduls elektrisch leitend angebunden. Die Kontaktstücke 100 sind ebenfalls mit ihrer rechteckigen Längsschnittsfläche in die Rahmen 70 eingebracht.As in 3 shown, and already briefly outlined above, the power module according to the invention power components 90, which in turn flat parts with flat sides 92 form. The power components 90 show on these flat sides 92 electrical surface contacts 95 for electrical contact on. The power components 90 also have rectangular longitudinal sectional areas and are in the frame 70 with their longitudinal sectional areas parallel to the flat extensions of the flat side 20 brought in. The power components 90 are from the contact surfaces 50 on the substrate 10 as well as from the substrate 10 self-spaced and by means of electrically conductive contacts 100 with rectangular longitudinal section surface on the contact surfaces 50 or connected to other components of the power module according to the invention electrically conductive. The contact pieces 100 are also with their rectangular longitudinal sectional area in the frame 70 brought in.

Erfindungsgemäß wird das erfindungsgemäße Leistungsmodul derart hergestellt, dass das zunächst Kontaktstücke 100 in einen Rahmen 70 in Richtung auf das Substrat 10 zu eingebracht werden und mittels der Zylinder 80 in Richtung auf die Flachseite 20 des Substrats zu gleitend geführt werden und in Richtungen der flächigen Erstreckungen der Flachseite 20 und folglich in Richtung der flächigen Erstreckungen der Kontaktflächen 50 festgelegt werden und nachfolgend beispielsweise mittels Galvanisierens an die Kontaktflächen 50 des Substrats 10 elektrisch kontaktiert werden. Dabei werden geeigneterweise sämtliche Kontaktstücke zugleich in einem einzigen Arbeitsgang mittels Galvanisierens angebunden. Nachfolgend werden Leistungsbauteile 90 in Richtung auf das Substrat 10 zu in einige der Rahmen 70 eingebracht und mittels der Zylinder 80 auf das Substrat 10 zu geführt ebenfalls in Richtung der flächigen Erstreckungen der Flachseite 20 festgelegt. Das Leistungsbauteil 90 wird seinerseits mit dem Kontaktstück 100 mittels Galvanisierens elektrisch kontaktiert. Grundsätzlich können Kontaktstück 100 und Leistungsbauteil 90 und Substrat 10 in einem weiteren Ausführungsbeispiel des erfindungsgemäßen Verfahrens auch in einem einzigen Arbeitsgang mittels Galvanisierens elektrisch kontaktiert werden.According to the invention, the power module according to the invention is produced such that the first contact pieces 100 in a frame 70 towards the substrate 10 to be introduced and by means of the cylinder 80 towards the flat side 20 of the substrate are slidably guided and in directions of the flat extensions of the flat side 20 and consequently be set in the direction of the planar extensions of the contact surfaces 50 and subsequently, for example, by means of electroplating to the contact surfaces 50 of the substrate 10 are electrically contacted. In this case, suitably all contacts are connected at the same time in a single operation by means of electroplating. The following are power components 90 towards the substrate 10 to in some of the frames 70 introduced and by means of the cylinder 80 on the substrate 10 to led also in the direction of the flat extensions of the flat side 20 established. The power component 90 is in turn with the contact piece 100 electrically contacted by electroplating. Basically, contact piece 100 and power component 90 and substrate 10 are electrically contacted in a further embodiment of the method according to the invention in a single operation by means of electroplating.

Die Leistungsbauteile 90 sind Bipolartransistoren mit isolierter Gate-Elektrode (englisch: „Insulated-Gate Bipolar Transistor“: IGBT) und weisen jeweils einander abgewandte Flachseiten 92 auf. Entlang Flachseiten 92 erstrecken sich dünnschichtartige Flächenkontakte 95 der Leistungsbauteile 90, welche als flächige Chipmetallisierungen ausgebildet sind. Im dargestellten Ausführungsbeispiel bestehen die Flächenkontakte 95 der Leistungsbauteile 90 jeweils aus Kupfer. Grundsätzlich können Flächenkontakte 95 auch sämtlich oder zum Teil aus oder mit Silber oder aus oder mit AlSiCu, sonstigen Metallen oder anderen elektrisch leitenden Materialien gebildet sein.The power components 90 are Insulated Gate Bipolar Transistor (IGBT) bipolar transistors and each have facing flat sides 92 on. Along flat sides 92 thin-film surface contacts extend 95 the power components 90, which are designed as areal chip metallizations. In the illustrated embodiment, the surface contacts 95 the power components 90 each made of copper. Basically, surface contacts 95 also all or partly made of or with silver or made of or with AlSiCu, other metals or other electrically conductive materials.

Die Kontaktstücke 100 sind jeweils aus offenporigem und offenzelligem Material gefertigt und als elektrisch leitfähige Kupferschwämme realisiert. Aufgrund der offenzelligen und offenporigen Struktur der Kontaktstücke 100 sind die Kontaktstücke 100 mit Kühlfluid, beispielsweise Kühlflüssigkeit oder auch Luft, durchströmbar. Es versteht sich, dass in weiteren, nicht eigens dargestellten Ausführungsbeispielen, welche im Übrigen den anhand der Figuren erläuterten Ausführungsbeispielen entsprechen, die offenporigen Kontaktstücke 100 auch aus sonstigen offenporigen und elektrisch leitfähigen Materialien bestehen können, etwa aus Geweben oder Netzen oder sonstigen porösen Strukturen gebildete Aluminium- oder Titankontaktstücke oder aus oder mit sonstigen Metallen gebildete Kontaktstücke. Beispielsweise können auch mit leitfähigen Materialien bereichsweise beschichtete oder mit leitfähigen Partikeln versetzte Polymerschwämme als Kontaktstücke 100 dienen.The contact pieces 100 are each made of open-cell and open-cell material and realized as electrically conductive copper sponges. Due to the open-cell and open-pore structure of the contact pieces 100 are the contact pieces 100 with cooling fluid, such as coolant or air, flowed through. It is understood that in other, not specifically illustrated Embodiments, which otherwise correspond to the embodiments explained with reference to the figures, the open-pore contact pieces 100 may also consist of other open-cell and electrically conductive materials, such as aluminum or titanium contact pieces formed from fabrics or nets or other porous structures or formed from or with other metals contacts. For example, polymer sponges coated in some areas with conductive materials or with conductive particles may also act as contact pieces 100 serve.

Die Kontaktstücke 100 sind im dargestellten Ausführungsbeispiel galvanisch und bei der Herstellung des erfindungsgemäßen Leistungsmoduls unter Verwendung eines Elektrolytbades an Flächenkontakte 95 der Leistungsbauteile 90 sowie an die elektrische Kontaktflächen 50 des Substrats 10 angebunden. Dabei ist galvanisch Kupfer an der Anlagefläche von Kontaktstücken 100 und Kontaktflächen 50 des Substrats 10 oder Flächenkontakten weiterer Bestandteile des erfindungsgemäßen Leistungsmoduls sowie der Kontaktstücke 100 und den Flächenkontakten 95 der Leistungsbauteile 90 abgeschieden, sodass die Kontaktstücke 100 jeweils stoffschlüssig und elektrisch leitend an die Kontaktflächen 50 des Substrats 10 und/oder weiterer Bestandteile des erfindungsgemäßen Leistungsmoduls und/oder der Flächenkontakte 95 der Leistungsbauteile 90 angebunden sind. Sämtliche Kontaktstücke 100 sind mit den jeweiligen Flächenkontakten 95 und/oder Kontaktflächen 50 verbunden, an welchen sie jeweils anliegen.The contact pieces 100 are galvanic in the illustrated embodiment and in the manufacture of the power module according to the invention using an electrolyte bath of surface contacts 95 the power components 90 as well as to the electrical contact surfaces 50 of the substrate 10 tethered. It is galvanic copper on the contact surface of contact pieces 100 and contact surfaces 50 of the substrate 10 or surface contacts of other components of the power module according to the invention and the contact pieces 100 and the surface contacts 95 the power components 90 deposited so that the contact pieces 100 in each case cohesively and electrically conductive to the contact surfaces 50 of the substrate 10 and / or further components of the power module according to the invention and / or the surface contacts 95 the power components 90 are connected. All contacts 100 are with the respective surface contacts 95 and / or contact surfaces 50 connected, to which they each lie.

In weiteren, nicht eigens gezeigten Ausführungsbeispielen, welche im Übrigen dem dargestellten Ausführungsbeispiel entsprechen, sind die Kontaktstücke 100 nicht galvanisch angebunden, sondern mittels Sintern oder Löten oder Diffusionslöten oder Pressen oder Klemmen oder Kleben angebunden.In other, not specifically shown embodiments, which otherwise correspond to the illustrated embodiment, are the contact pieces 100 not galvanically connected, but connected by sintering or soldering or diffusion soldering or pressing or clamping or gluing.

Die Rahmen 70 können dabei wie in 4 dargestellt und oben beschrieben voneinander beabstandet sein. In einem weiteren, in 5 und 5a dargestellten Ausführungsbeispiel können benachbarte Rahmen 70 auch miteinander stoffschlüssig verbunden sein, etwa einstückig ausgebildet sein oder mit einstückigen Zylindern gebildet sein, welche jeweils zugleich zu benachbarten Rahmen gehören. Beispielsweise kann anstelle zweier benachbarter L-förmiger gerader Zylinder, welche zu benachbarten Rahmen 70 gehören, lediglich ein einziger gerader Zylinder 115 vorhanden sein. Dieser einzige gerade Zylinder weist eine Grundfläche mit T-Form auf, wobei der zentrale Steg 116 der T-Form gegenüber dem Balken 118 der T-Form verbreitert ist. Somit lässt sich die Verbreiterung des zentralen Stegs 116 gewissermaßen als ausgefüllter Zwischenraum zwischen zwei L-förmigen Zylindern ansehen.The frames 70 can do it like in 4 shown and spaced apart from each other described above. In another, in 5 and 5a illustrated embodiment, adjacent frame 70 Also be materially connected to each other, be about integrally formed or be formed with one-piece cylinders, which at the same time belong to adjacent frame. For example, instead of two adjacent L-shaped straight cylinders, which may be adjacent frames 70 belong, just a single straight cylinder 115 to be available. This single straight cylinder has a base with T-shape, with the central web 116 the T-shape opposite the beam 118 the T-shape is widened. Thus, the broadening of the central bridge can be 116 sort of as a filled gap between two L-shaped cylinders view.

Im in 6 und 7 dargestellten Ausführungsbeispiel sind nicht notwendigerweise die Kontaktstücke 100 in Rahmen 70 arretiert. Stattdessen sind in diesem Ausführungsbeispiel die Leistungsbauteile 90 mit einem vollumfänglichen Rahmenplättchen 300 umgeben, welcher die Leistungsbauteile 90 zumindest formschlüssig festlegt.Im in 6 and 7 illustrated embodiment are not necessarily the contacts 100 in frame 70 locked. Instead, in this embodiment, the power components 90 with a full frame slide 300 surrounded, which the power components 90 at least form-fitting determines.

Zusätzlich zur formschlüssigen Arretierung sind die leistungsbauteile 90 zudem stoffschlüssig mit dem Rahmenplättchen verbunden, im dargestellten Falle ist das Leistungsbauteil 90 in das Rahmenplättchen 300 eingegossen, d.h. das Leistungsbauteil ist zumindest teilweise derart in das Rahmenplättchen 300 eingelassen, dass das Rahmenplättchen das Leistungsbauteil 90 in Richtung senkrecht zu dessen Flachseiten überlappt.In addition to the positive locking, the power components 90 are also materially connected to the frame plate, in the case illustrated is the power component 90 in the frame tile 300 cast, ie the power component is at least partially embedded in the frame plate 300, that the frame plate the power component 90 overlaps in the direction perpendicular to its flat sides.

Die Rahmenplättchen 300 sind dabei derart gebildet, dass die aus einem Wafer vereinzelten Leistungsbauteile 90 in an sich bekannter Weise in einen Moldwafer 302 eingegossen werden, aus welchem dann die Leistungsbauteile 90 jeweils gemeinsam mit einem überstehenden Rahmen, welcher das Rahmenplättchen 300 bildet, aus dem Moldwafer 302 ausgeschnitten werden. Diese Rahmenplättchen 300 sind mit ihren Randbereichen wie in 7 dargestellt in Seitenwände 305 eines Gehäuses des erfindungsgemäßen Leistungsmoduls eingelassen, beispielsweise eingegossen. Da das Rahmenplättchen 300 das Leistungsbauteil 90 in dessen Dickenrichtung, also senkrecht zu dessen Flachseiten 92 überlappt, sind die beiden Flachseiten mittels des Rahmenplättchens 300 zuverlässig elektrisch isoliert. Damit ist das Rahmenplättchens 300 gegenüber unterschiedlichen Potentialen, mit welchen das Leistungsbauteil 90 leitend in Kontakt steht, hinreichend durchschlagsfest, sodass eine zusätzliche Isolierung grundsätzlich entbehrlich ist.The frame tiles 300 are formed such that the isolated from a wafer power components 90 in a conventional manner in a mold wafer 302 be cast from which then the power components 90 each together with a protruding frame, which forms the frame plate 300, from the mold wafer 302 be cut out. These frame tiles 300 are with their border areas like in 7 shown in side walls 305 a housing of the power module according to the invention embedded, for example cast. Because the frame tile 300 the power component 90 in its thickness direction, that is perpendicular to its flat sides 92 overlaps, are the two flat sides by means of the frame plate 300 reliably electrically isolated. This is the frame tile 300 against different potentials with which the power component 90 conductive contact, sufficiently puncture resistant, so that an additional insulation is basically unnecessary.

Grundsätzlich kann das Halbleiterbauteil in weiteren, nicht eigens dargestellten Ausführungsbeispielen das Leistungsbauteil 90 auch beispielsweise derart in Rahmenplättchen eigefasst werden, dass die Rahmenplättchen aus zwei Halbschalen gebildet sind, in welche das Leistungsbauteil 90 eingelegt und vorzugsweise festgeklebt wird.Basically, the semiconductor device in other, not specifically illustrated embodiments, the power device 90 Also, for example, be in such a way bordered in frame tiles that the frame plates are formed of two half-shells, in which the power device 90 inserted and preferably glued.

Die in der Zeichnung dargestellten Komponenten des erfindungsgemäßen Leistungsmoduls sind mittels eines an sich bekannten Bestückungsprozesses zu einem erfindungsgemäßen Leistungsmodul zusammengefügt: Die Komponenten des Leistungsmoduls umfassen zum einen das Gehäuse mit sich (hinsichtlich der 1 bis 5) parallel zur Zeichenebene erstreckenden Seitenwänden 305 (das Ausführungsbeispiel gem. 7 ist im Querschnitt dargestellt, d.h. die Seitenwände 305 sind hier im Querschnitt explizit zu sehen). Zwischen diesen Seitenwänden 305 ist einerseits das Substrat 10 sowie ein weiteres Substrat 310 angeordnet. Das weitere Substrat 310 ist gleichartig dem Substrat 10 ausgebildet und bildet ein Flachteil mit zwei einander abgewandten Flachseiten 320, 330, welche parallel zu den Flachseiten 20, 30 des Substrats 10 orientiert sind. Die Flachseiten 320, 330 tragen ebenfalls mittels metallgefüllter Durchkontaktierungen elektrisch leitend verbundene Kontaktflächen 350.The components of the power module according to the invention shown in the drawing are assembled by means of a known per se Beschückungsprozesses to form a power module according to the invention: The components of the power module comprise on the one hand the housing with it (in terms of 1 to 5 ) parallel to the plane extending side walls 305 (The embodiment acc. 7 is shown in cross-section, ie the side walls 305 are explicitly shown here in cross section). Between these side walls 305 on the one hand is the substrate 10 as well as another substrate 310 arranged. The further substrate 310 is similar to the substrate 10 formed and forms a flat part with two facing flat sides 320 . 330 , which are parallel to the flat sides 20 . 30 of the substrate 10 are oriented. The flat sides 320 . 330 also carry metal-filled vias electrically conductive contact surfaces 350 ,

Gemeinsam mit den Seitenwänden 305 begrenzen die Substrate 10, 310 einen Kühlkanal 360 des Leistungsmoduls für ein Kühlfluid eines Kühlkreislaufes des Leistungsmoduls. Im in den 6 und 7 dargestellten Ausführungsbeispiel können die Kontaktstücke 100 den zwischen den Seitenwänden 305 befindlichen Zwischenraum in der ganzen Breite ausfüllen, wobei die Leistungsbauteile 90 mittels der Rahmenplättchen 300 relativ zu den Kontaktstücken 100 formschlüssig arretiert sind, während im Ausführungsbeispiel gem. 1 bis 5 die Kontaktstücke 100 gemeinsam mit den Leistungsbauteilen 90 in Rahmen 70 eingefasst sind. Grundsätzlich können die beiden Ausführungsbeispiele aber auch in ein und demselben Leistungsmodul kombiniert sein. Grundsätzlich kann der Aufbau gem. 7 auch in vertikaler Richtung ein- oder mehrfach wiederholt werden, indem jeweils das Substrat 310 wiederum an die Stelle des Substrats 10 tritt. Auf diese Weise lässt sich eine Reihenschaltung von Leistungsbauteilen 90 realisieren.Together with the side walls 305 limit the substrates 10, 310 a cooling channel 360 the power module for a cooling fluid of a cooling circuit of the power module. Im in the 6 and 7 illustrated embodiment, the contact pieces 100 between the side walls 305 filling the gap in the entire width, the power components 90 by means of the frame tiles 300 relative to the contact pieces 100 are positively locked, while in the embodiment acc. 1 to 5 the contact pieces 100 together with the power components 90 in frame 70 are enclosed. In principle, however, the two embodiments can also be combined in one and the same power module. Basically, the structure gem. 7 be repeated one or more times in the vertical direction, in each case by the substrate 310 again in place of the substrate 10 occurs. This allows a series connection of power components 90 realize.

Aufgrund der offenzelligen und offenporigen Struktur der Kontaktstücke 100 sowie der Druchbrechungen der Rahmen 70 sind die Kontaktstücke 100 mit Kühlflüssigkeit durchströmbar.Due to the open-cell and open-pore structure of the contact pieces 100 as well as the breaking of the frame 70 are the contact pieces 100 perfused with cooling liquid.

In dargestellten Ausführungsbeispiel übernimmt eine später durch den Kühlkanal 360 geleitete Kühlflüssigkeit gleichzeitig die Isolationseigenschaften, d.h. die Kühlflüssigkeit ist selbst nicht elektrisch leitend. In weiteren, nicht eigens dargestellten Ausführungsbeispielen ist die Kühlflüssigkeit Kühlwasser und Kontaktstücke 100 sind geeignet elektrisch isoliert, beispielsweise mittels Kunststoffs, der durch Dispenskanäle durch die Substrate 10, 310 hindurch zu den Kontaktstücken 100 gegeben wird (nicht in der Zeichnung dargestellt) .In the illustrated embodiment, one takes over later by the cooling channel 360 at the same time the insulating properties, ie the cooling liquid is not electrically conductive itself. In further, not specifically illustrated embodiments, the cooling liquid is cooling water and contact pieces 100 are suitably electrically isolated, for example by means of plastic, through dispensing channels through the substrates 10 . 310 through to the contact pieces 100 is given (not shown in the drawing).

Bei dem derart bereitgestellten Leistungsmodul sind nun die Leistungsbauteile 90 direkt im Kühlkanal 360 befindlich. Durch den Kühlkanal 360 geleitetes Kühlfluid kann nun die Leistungsbauteile 90 beidseitig oder sogar allseits umströmen. Eine Wärmeabfuhr ist folglich besonders effizient möglich.In the thus provided power module are now the power components 90 directly in the cooling channel 360 located. Through the cooling channel 360 Guided cooling fluid can now the power components 90 flow around on both sides or even on all sides. A heat dissipation is therefore particularly efficient.

Wie bereits oben erläutert ist eine zusätzliche Isolierung von Kontaktstücken 100 bei einer hinreichend hohen Durchschlagfestigkeit der Rahmenplättchen 300 nicht zwingend notwendig.As already explained above, an additional insulation of contact pieces 100 at a sufficiently high dielectric strength of the frame plate 300 not mandatory.

Claims (12)

Leistungsmodul, aufweisend mindestens ein elektrisches Bauteil (10, 90) mit einer Kontaktfläche (50, 95), bei welchem das elektrische Bauteil (10, 90) mittels der Kontaktfläche (50, 95) an mindestens ein mit offenporigem Material gebildetes Kontaktstück (100) des Leistungsmoduls elektrisch kontaktiert ist und das zumindest eine elektrische Bauteil (10, 90) und das zumindest eine Kontaktstück (100), zumindest in Richtungen der flächigen Erstreckungen der mindestens einen Kontaktfläche (50, 95), relativ zueinander, und vorzugsweise zudem gegenüber mindestens einem weiteren Bauteil des Leistungsmoduls, zumindest formschlüssig festgelegt sind.Power module, comprising at least one electrical component (10, 90) having a contact surface (50, 95), in which the electrical component (10, 90) by means of the contact surface (50, 95) to at least one contact piece (100) formed with open-pored material of the power module is electrically contacted and the at least one electrical component (10, 90) and the at least one contact piece (100), at least in directions of the planar extensions of the at least one contact surface (50, 95), relative to each other, and preferably also opposite at least one another component of the power module, at least fixed form fit. Leistungsmodul nach dem vorhergehenden Anspruch, welches ein Substrat (10) und/oder Leistungsbauteil (90) aufweist, wobei das Substrat (10) und/oder Leistungsbauteil (90) des Leistungsmoduls das mindestens eine elektrische Bauteil (90) des Leistungsmoduls bildet oder bilden.Power module according to the preceding claim, comprising a substrate (10) and / or power component (90), wherein the substrate (10) and / or power component (90) of the power module forms or form the at least one electrical component (90) of the power module. Leistungsmodul nach einem der vorhergehenden Ansprüche, bei welchem das Kontaktstück (100) mit offenzelligem Material gebildet und/oder an das elektrische Bauteil (10, 90) mittels Galvanisierens angebunden ist.Power module according to one of the preceding claims, in which the contact piece (100) is formed with open-cell material and / or is connected to the electrical component (10, 90) by means of electroplating. Leistungsmodul nach einem der vorhergehenden Ansprüche, bei welchem das mindestens eine Kontaktstück (100) mit einem Metallschwamm und/oder einem Metallschaum gebildet ist.Power module according to one of the preceding claims, wherein the at least one contact piece (100) is formed with a metal sponge and / or a metal foam. Leistungsmodul nach einem der vorhergehenden Ansprüche, bei welchem das zumindest eine elektrische Bauteil (10, 90) und/oder zumindest eine Kontaktstück (100) sowohl formschlüssig als auch stoffschlüssig festgelegt sind.Power module according to one of the preceding claims, wherein the at least one electrical component (10, 90) and / or at least one contact piece (100) are fixed both positively and cohesively. Leistungsmodul nach einem der vorhergehenden Ansprüche, bei welchem das zumindest eine elektrische Bauteil (10, 90) und zumindest eine Kontaktstück (100) mittels eines Rahmens des Leistungsmoduls (70, 300) festgelegt ist, welcher vorzugsweise in Richtung der flächigen Erstreckungen der Kontaktfläche (50, 95) durchführende Durchbrechungen aufweist.Power module according to one of the preceding claims, wherein the at least one electrical component (10, 90) and at least one contact piece (100) by means of a frame of the power module (70, 300) is fixed, which preferably in the direction of the planar extensions of the contact surface (50 , 95) has through openings. Leistungsmodul nach einem der vorhergehenden Ansprüche, bei welchem der Rahmen (70) Vorsprünge (80) aufweist, welche sich zumindest quer, vorzugsweise senkrecht, zur Kontaktfläche (50, 95) des zumindest einen elektrischen Bauteils (10, 90), erstrecken.Power module according to one of the preceding claims, in which the frame (70) has projections (80) which extend at least transversely, preferably perpendicular, to the contact surface (50, 95) of the at least one electrical component (10, 90). Leistungsmodul nach einem der vorhergehenden Ansprüche, bei welchem der Rahmen (300) mittels zumindest eines Teils eines Moldwafers (302) gebildet ist. Power module according to one of the preceding claims, in which the frame (300) is formed by means of at least a part of a mold wafer (302). Leistungsmodul nach einem der vorhergehenden Ansprüche, welches einen Kühlstrompfad (360), ausgebildet zur Führung eines Kühlfluids entlang einer Kühlstromrichtung, aufweist, dessen Kühlstromrichtung sich zumindest entlang einer Richtung der flächigen Erstreckung der Flachseite (20, 92) des mindestens einen Leistungsbauteils erstreckt.Power module according to one of the preceding claims, which has a cooling flow path (360), designed to guide a cooling fluid along a cooling flow direction, the cooling flow direction extends at least along a direction of the flat extent of the flat side (20, 92) of the at least one power component. Leistungsmodul nach einem der vorhergehenden Ansprüche, bei welchem der Rahmen (70, 300) zur Fassung eines Kontaktstücks (100) mit rechteckiger Längsschnittsfläche und/oder eines elektrischen Bauteils (90) mit rechteckiger Längsschnittsfläche ausgebildet ist.Power module according to one of the preceding claims, in which the frame (70, 300) is designed to mount a contact piece (100) with a rectangular longitudinal sectional area and / or an electrical component (90) with a rectangular longitudinal sectional area. Leistungsmodul nach einem der vorhergehenden Ansprüche, welches ein Führungsmittel aufweist, mittels welchem das elektrische Bauteil (10, 90) und/oder das Kontaktstück (100) in diejenige relative Stellung zueinander führbar ist oder sind, in welcher Kontaktstück (100) und elektrisches Bauteil (10, 90) relativ zueinander festgelegt sind.Power module according to one of the preceding claims, which has a guide means, by means of which the electrical component (10, 90) and / or the contact piece (100) can be guided in the relative position to each other, in which contact piece (100) and electrical component ( 10, 90) are fixed relative to each other. Verfahren zur Herstellung eines Leistungsmoduls nach einem der vorhergehenden Ansprüche, bei welchem zumindest ein elektrisches Bauteil (10, 90) mit einer Kontaktfläche (50, 95) herangezogen wird und bei welchem das elektrische Bauteil (10, 90) mittels der Kontaktfläche (50, 95) an mindestens ein mit offenporigem Material gebildetes Kontaktstück (100) elektrisch kontaktiert wird und das zumindest eine elektrische Bauteil (10, 90) und das zumindest eine Kontaktstück (100), zumindest in Richtungen der flächigen Erstreckungen der mindestens einen Kontaktfläche (50, 95), mittels einer Festlegvorrichtung, insbesondere mittels eines Rahmens (70, 300), relativ zueinander, und vorzugsweise zudem relativ zu mindestens einem weiteren Bauteil des Leistungsmoduls zumindest formschlüssig und vorzugsweise mittels eines Führungsmittels (80) festgelegt werden.Method for producing a power module according to one of the preceding claims, in which at least one electrical component (10, 90) having a contact surface (50, 95) is used, and in which the electrical component (10, 90) is formed by means of the contact surface (50, 95 ) is electrically contacted with at least one contact piece (100) formed with open-pore material, and the at least one electrical component (10, 90) and the at least one contact piece (100), at least in directions of the planar extensions of the at least one contact surface (50, 95). , by means of a fixing device, in particular by means of a frame (70, 300), relative to each other, and preferably also relative to at least one further component of the power module at least form-fitting and preferably by means of a guide means (80) are fixed.
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