WO2018008599A1 - Film conducteur photosensible, procédé de formation de motif conducteur, substrat à motif conducteur et capteur d'écran tactile - Google Patents

Film conducteur photosensible, procédé de formation de motif conducteur, substrat à motif conducteur et capteur d'écran tactile Download PDF

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Publication number
WO2018008599A1
WO2018008599A1 PCT/JP2017/024373 JP2017024373W WO2018008599A1 WO 2018008599 A1 WO2018008599 A1 WO 2018008599A1 JP 2017024373 W JP2017024373 W JP 2017024373W WO 2018008599 A1 WO2018008599 A1 WO 2018008599A1
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Prior art keywords
conductive
photosensitive
substrate
resin layer
film
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PCT/JP2017/024373
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English (en)
Japanese (ja)
Inventor
智紀 寺脇
奏美 中村
味岡　芳樹
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日立化成株式会社
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Publication of WO2018008599A1 publication Critical patent/WO2018008599A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Definitions

  • the present invention relates to a photosensitive conductive film, a conductive pattern manufacturing method, a conductive pattern substrate, and a touch panel sensor.
  • Liquid crystal display elements and touch panel sensors are used in large electronic devices such as personal computers and televisions and small electronic devices such as car navigation systems, mobile phones, and electronic dictionaries.
  • a plurality of X electrodes and a plurality of Y electrodes orthogonal to the X electrodes form a two-layer structure in order to express two-dimensional coordinates by the X axis and the Y axis. is doing.
  • the electrode is formed from a transparent conductive film material.
  • ITO Indium-Tin-Oxide
  • indium oxide Indium oxide
  • tin oxide Tin oxide
  • the like has been used as a transparent conductive film material because of its high transmittance for visible light.
  • Patent Document 1 proposes a method for forming a conductive pattern using a photosensitive conductive film having a conductive film containing conductive fibers. If this technique is used, a conductive pattern can be easily formed directly on various substrates by a photolithography process.
  • a conductive pattern formed by a photosensitive conductive film having a conductive film containing conductive fibers is used as, for example, a touch panel sensor, sunlight, xenon lamp, or the like is applied to the conductive pattern for a long time.
  • the touch panel sensor may not operate normally.
  • the present inventors have found that an increase in the resistance value of the conductive pattern due to application of light such as sunlight or a xenon lamp is a cause of malfunction of the touch panel sensor.
  • the main object of the present invention is to provide a photosensitive conductive film capable of forming a conductive pattern that is unlikely to cause malfunction of the touch panel sensor even under long-term light irradiation with sunlight, a xenon lamp, or the like. .
  • One aspect of the present invention is a photosensitive conductive film including a photosensitive resin layer provided with a conductive network using conductive fibers on one main surface side, and the thickness of the photosensitive resin layer is 27 ⁇ m or more.
  • a photosensitive conductive film is provided.
  • the oxygen permeability after curing by light irradiation may be 8.0 ⁇ 10 5 fm / s ⁇ Pa or less.
  • the conductive fiber may contain silver fiber.
  • the photosensitive resin layer may contain a binder polymer, a photopolymerizable compound, and a photopolymerization initiator.
  • the present invention includes a step of irradiating the photosensitive resin layer of the photosensitive conductive film disposed on the substrate with an actinic ray in a pattern, and a part of the photosensitive resin layer and the conductive network.
  • a method for producing a conductive pattern comprising a step of forming a conductive pattern by removing the conductive pattern in this order.
  • the present invention provides a conductive pattern substrate comprising a substrate and a conductive pattern provided on the substrate.
  • the conductive pattern includes a resin cured product layer having a pattern and a conductive network provided on a surface opposite to the substrate of the resin cured product layer and using conductive fibers.
  • the cured resin layer is a cured product of a photosensitive resin.
  • the thickness of the conductive pattern is 27 ⁇ m or more.
  • the present invention provides a touch panel sensor including the conductive pattern substrate.
  • the photosensitive conductive film of the present invention it is possible to form a conductive pattern that is unlikely to cause malfunction of the touch panel sensor even under long-term light irradiation with sunlight, a xenon lamp, or the like.
  • FIG. 7 is a schematic cross-sectional view along the line VII-VII in FIG. 6.
  • FIG. 7 is a schematic diagram subsequent to FIG.
  • FIG. 9 is a schematic cross-sectional view along the line IX-IX in FIG. 8.
  • FIG. 6 is a partial cross-sectional view taken along the line a-a ′ shown in FIG. 5.
  • FIG. 6 is a partial cross-sectional view taken along the line b-b ′ shown in FIG. 5.
  • It is a schematic plan view of the out-cell type
  • FIG. 13 is a schematic cross-sectional view taken along line XIII-XIII in FIG.
  • (meth) acrylate means “acrylate” or “methacrylate” corresponding thereto.
  • (meth) acrylic acid means “acrylic acid” or “methacrylic acid”
  • (meth) acryloyl group means “acryloyl group” or “methacryloyl group”.
  • the numerical ranges indicated using “to” include the numerical values described before and after “to” as the minimum value and the maximum value, respectively.
  • the photosensitive conductive film 7 includes a photosensitive resin layer 3 provided with a conductive network 2 using conductive fibers on one main surface side.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of a photosensitive conductive film.
  • a photosensitive conductive film 10 with a support film shown in FIG. 1 is a support film 1, a photosensitive resin layer 3 provided on the support film 1, and a conductive material provided on one main surface side of the photosensitive resin layer 3.
  • a network 2 is provided.
  • the thickness t of the photosensitive resin layer 3 is 27 ⁇ m or more.
  • the photosensitive resin layer 3 may be configured to have the conductive network 2 on the side opposite to the support film 1.
  • the boundary between the conductive network 2 and the photosensitive resin layer 3 is not necessarily clear.
  • the conductive network 2 only needs to have conductivity in the surface direction of the photosensitive resin layer 3.
  • the conductive network 2 includes, for example, (1) a state where the photosensitive resin layer 3 is impregnated, and (2) a state where the photosensitive resin layer 3 is impregnated, and a part of the conductive network 2 protrudes from the main surface of the photosensitive resin layer 3. State (3) It may exist in a state where a layer is formed on the main surface of the photosensitive resin layer 3.
  • the thickness t of the photosensitive resin layer 3 is a thickness including a part of the conductive network impregnated in the photosensitive resin layer.
  • FIG. 2 is a partially cutaway perspective view showing a photosensitive conductive film 10 with a support film as an embodiment of the photosensitive conductive film. As shown in FIG. 2, the conductive network 2 is formed using conductive fibers.
  • the conductive network 2 includes a plurality of conductive fibers.
  • the conductive network is, for example, (1) a state where the conductive fibers are separated from each other in a conductive range, (2) a state where the conductive fibers are in contact with each other, or (3) a state where the conductive fibers are in contact with each other. It can be a fiber assembly in a fused state.
  • the fiber refers to a substance having a fiber diameter of 1 to 100 nm and a fiber length of 200 nm or more.
  • the conductive fibers included in the conductive network 2 include metal fibers such as gold, silver, copper, and platinum, or carbon fibers such as carbon nanotubes. These can be used alone or in combination of two or more. Silver fibers are preferably used because the conductivity of the conductive network can be easily adjusted.
  • the metal fiber can be prepared by, for example, a method of reducing metal ions with a reducing agent such as NaBH 4 or a polyol method.
  • the fiber diameter of the conductive fiber is preferably 1 to 50 nm, more preferably 2 to 20 nm, and further preferably 3 to 10 nm. When the fiber diameter of the conductive fiber is 1 nm or more, durability tends to be further improved. When the fiber diameter of the conductive fiber is 50 nm or less, the optical properties such as an increase in haze due to light scattering tend to be excellent.
  • the fiber length of the conductive fiber is preferably 1 to 100 ⁇ m, more preferably 2 to 50 ⁇ m, and even more preferably 3 to 10 ⁇ m. When the fiber length of the conductive fiber is 1 ⁇ m or more, sufficient conductivity tends to be obtained. When the fiber length of the conductive fibers is 100 ⁇ m or less, the formation of aggregates tends to be suppressed when the conductive network is formed.
  • the fiber diameter and fiber length of the conductive fibers can be measured with a scanning electron microscope.
  • the conductive network 2 may include an organic conductor. Although it does not restrict
  • the conductive network 2 is, for example, a conductive dispersion obtained by adding water and / or an organic solvent and a dispersion stabilizer such as a surfactant to the above-described conductive fiber or organic conductor on the support film 1. After coating, it can be formed by drying.
  • Coating can be performed by a known method such as a roll coating method, a comma coating method, a gravure coating method, an air knife coating method, a die coating method, a bar coating method, or a spray coating method.
  • the drying can be performed at 30 to 150 ° C. for about 1 to 30 minutes with a hot air convection dryer or the like.
  • the conductive fiber, the organic conductor, etc. may coexist with the surfactant, the dispersion stabilizer and the like.
  • a metal additive, an amine additive and the like can be added as necessary.
  • a metal additive, an amine additive, etc. can be contained in the conductive pattern including the conductive network formed by applying and drying the conductive dispersion.
  • the thickness of the conductive network 2 varies depending on the use of the conductive pattern and the required conductivity, but is preferably 1 ⁇ m or less, more preferably 0.001 to 0.5 ⁇ m, and more preferably 0.005 to 0.00. More preferably, it is 1 ⁇ m.
  • the thickness of the conductive network 2 is 1 ⁇ m or less, the light transmittance in the wavelength region of 450 to 650 nm is high, the pattern formation is excellent, and it is particularly suitable for the production of a transparent electrode.
  • the thickness of the conductive network 2 refers to a value measured by a scanning electron micrograph.
  • the photosensitive resin layer 3 can be formed from a photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound, and (C) a photopolymerization initiator. When the photosensitive resin layer 3 contains these components, the adhesiveness and patterning property between the substrate and the conductive pattern can be further improved.
  • Binder polymer As a binder polymer, for example, obtained by reaction of acrylic resin, styrene resin, epoxy resin, amide resin, amide epoxy resin, alkyd resin, phenol resin, ester resin, urethane resin, epoxy resin and (meth) acrylic acid Examples thereof include epoxy acrylate resins, acid-modified epoxy acrylate resins obtained by reaction of epoxy acrylate resins and acid anhydrides, and the like. These resins can be used alone or in combination of two or more.
  • acrylic resin from the viewpoint of excellent alkali developability and film formability. It is more preferable that the acrylic resin has a polymerizable monomer derived from (meth) acrylic acid and (meth) acrylic acid alkyl ester as a constituent unit.
  • acrylic resin means a polymer derived from a polymerizable monomer having a (meth) acryloyl group.
  • the acrylic resin is produced, for example, by radical polymerization of a polymerizable monomer having a (meth) acryloyl group.
  • Such acrylic resins can be used alone or in combination of two or more.
  • Examples of the polymerizable monomer having a (meth) acryloyl group include acrylamide such as diacetone acrylamide; (meth) acrylic acid alkyl ester, 2-hydroxyalkyl (meth) acrylate, (meth) acrylic acid tetrahydrofurfuryl ester, (Meth) acrylic acid dimethylaminoethyl ester, (meth) acrylic acid diethylaminoethyl ester, (meth) acrylic acid glycidyl ester, 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetra (Meth) acrylic acid esters such as fluoropropyl (meth) acrylate; (meth) acrylic acid, ⁇ -bromo (meth) acrylic acid, ⁇ -chloro (meth) acrylic acid, ⁇ -furyl (meth) acrylic acid, ⁇ - (Meth) acrylic such as styryl (meth) acrylic acid Such as acid, and
  • the acrylic resin includes, for example, esters of vinyl alcohol such as styrene derivatives, acrylonitrile, vinyl-n-butyl ether, maleic acid, maleic anhydride, monomethyl maleate , Maleic acid monoesters such as monoethyl maleate and monoisopropyl maleate, fumaric acid, cinnamic acid, ⁇ -cyanocinnamic acid, itaconic acid, crotonic acid, etc. It may be polymerized.
  • esters of vinyl alcohol such as styrene derivatives, acrylonitrile, vinyl-n-butyl ether, maleic acid, maleic anhydride, monomethyl maleate .
  • Maleic acid monoesters such as monoethyl maleate and monoisopropyl maleate, fumaric acid, cinnamic acid, ⁇ -cyanocinnamic acid, itaconic acid, crotonic acid, etc. It may be polymerized.
  • Examples of (meth) acrylic acid alkyl esters include (meth) acrylic acid methyl ester, (meth) acrylic acid ethyl ester, (meth) acrylic acid propyl ester, (meth) acrylic acid butyl ester, (meth) acrylic acid hexyl ester. (Meth) acrylic acid heptyl ester, (meth) acrylic acid octyl ester, (meth) acrylic acid 2-ethylhexyl ester, (meth) acrylic acid nonyl ester, and the like. These can be used alone or in combination of two or more.
  • the binder polymer preferably has a carboxyl group from the viewpoint of improving alkali developability.
  • Examples of the polymerizable monomer having a carboxyl group include (meth) acrylic acid as described above.
  • the ratio of the carboxyl group in the binder polymer is 10 to 50% by mass as the ratio of the polymerizable monomer having a carboxyl group to the total polymerizable monomer used for obtaining the binder polymer.
  • it is 12 to 40% by mass, more preferably 12 to 30% by mass, and particularly preferably 12 to 25% by mass.
  • the content is preferably 10% by mass or more, and in terms of excellent alkali resistance, it is preferably 50% by mass or less.
  • the weight average molecular weight of the binder polymer is preferably 5000 to 300000, more preferably 20000 to 150,000, and more preferably 30000 to 100,000 from the viewpoint of balancing the mechanical strength and alkali developability. Further preferred. In terms of excellent developer resistance, the weight average molecular weight is preferably 5000 or more. Further, from the viewpoint of development time, it is preferably 300000 or less.
  • the weight average molecular weight in the present invention is a value measured by a gel permeation chromatography method (GPC) and converted by a calibration curve prepared using standard polystyrene.
  • Photopolymerizable compound (B) It is preferable that a photopolymerizable compound has an ethylenically unsaturated bond.
  • Examples of the photopolymerizable compound having an ethylenically unsaturated bond include 2,2-bis (4-((meth) acryloxypolyethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxy).
  • Bisphenol A di (meth) acrylate compounds such as polypropoxy) phenyl) propane and 2,2-bis (4-((meth) acryloxypolyethoxypolypropoxy) phenyl) propane; polyethylene glycol di (meth) acrylate, polypropylene glycol Poly (alkylene glycol) di (meth) acrylate such as di (meth) acrylate and polyethylene polypropylene glycol di (meth) acrylate; trimethylolpropane di (meth) acrylate, trimethylolpropane tri (meth) acrylate, trimethylolpropane Trimethylolpropane (meth) acrylate such as toxitri (meth) acrylate, trimethylolpropane triethoxytri (meth) acrylate, ditrimethylolpropane tetraacrylate; tetramethylolmethane tri (meth) acrylate, tetramethylolmethane tetra (
  • Tetrapentylol methane (meth) acrylate dipentaerythritol (meth) acrylate such as dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, urethane monomer, and the like.
  • the content of the photopolymerizable compound is preferably 30 to 80 parts by mass, more preferably 35 to 70 parts by mass with respect to 100 parts by mass in total of the binder polymer and the photopolymerizable compound. . In terms of excellent photocurability and coating properties on the formed conductive network, it is preferably 30 parts by mass or more, and in terms of excellent storage stability when wound as a film, 80 parts by mass or less. It is preferable that
  • the photoinitiator can select suitably what matches the light wavelength of the exposure machine to be used, and the wavelength required for function expression.
  • the photopolymerization initiator include benzophenone, N, N, N ′, N′-tetramethyl-4,4′-diaminobenzophenone (Michler ketone), N, N, N ′, N′-tetraethyl-4,4 '-Diaminobenzophenone, 4-methoxy-4'-dimethylaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2-methyl-1- [4- (methylthio) Aromatic ketones such as phenyl] -2-morpholino-propanone-1; benzoin ether compounds such as benzoin methyl ether, benzoin ethyl ether and benzoin phenyl ether; benzoin compounds such as benzoin compounds such as benzoin methyl
  • the content ratio of the photopolymerization initiator is preferably 0.1 to 20 parts by mass, and preferably 1 to 15 parts by mass with respect to 100 parts by mass in total of the binder polymer and the photopolymerizable compound. More preferably, it is 4 to 12 parts by mass. In terms of excellent photosensitivity, it is preferably 0.1 parts by mass or more, and in terms of excellent photocurability, it is preferably 20 parts by mass or less.
  • the photosensitive resin composition may contain other components in addition to (A) the binder polymer, (B) the photopolymerizable compound, and (C) the photopolymerization initiator.
  • Other components include, for example, metal additives, amine additives, leveling agents, adhesion promoters, polymerization inhibitors, pigments, rust inhibitors, metal complexes, and the like.
  • the content thereof may be 0.01 to 5 parts by mass with respect to 100 parts by mass in total of the binder polymer and the photopolymerizable compound.
  • the photosensitive resin layer 3 is formed on the conductive network 2 with a solvent such as methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N, N-dimethylformamide, propylene glycol monomethyl ether, or a mixture thereof. It can form by apply
  • the amount of the remaining organic solvent in the photosensitive resin layer after drying is preferably 2% by mass or less in order to prevent the organic solvent from diffusing in the subsequent step.
  • the photosensitive conductive film 7 or the photosensitive conductive film 10 with the support film may have another layer interposed between the photosensitive resin layer 3 and the conductive network 2.
  • the photosensitive resin layer 3 can be applied by a known method such as a roll coating method, a comma coating method, a gravure coating method, an air knife coating method, a die coating method, a bar coating method, or a spray coating method. After coating, drying to remove the organic solvent and the like can be performed at 70 to 150 ° C. for about 5 to 30 minutes with a hot air convection dryer or the like.
  • the sheet resistance value of the conductive resin layer 3 or the conductive pattern formed using the photosensitive resin layer 3 is preferably 2000 ⁇ / ⁇ or less, and preferably 1000 ⁇ / ⁇ or less, from the viewpoint that it can be effectively used as a transparent electrode. More preferably, it is 500 ⁇ / ⁇ or less.
  • the sheet resistance value can be adjusted to the above range depending on, for example, the types of conductive fibers and organic conductors included in the conductive network 2, or the concentration or coating amount of the conductive dispersion. Also, the sheet resistance value can be varied by adjusting the surface state of the conductive fibers or the contact state between the conductive fibers.
  • the minimum light transmittance in the wavelength region of 450 to 650 nm of the photosensitive resin layer 3 is preferably 80% or more, and more preferably 85% or more. When the photosensitive resin layer 3 satisfies such conditions, it is easy to increase the brightness in a display panel or the like.
  • the thickness t (thickness after drying) of the photosensitive resin layer 3 is 27 ⁇ m or more.
  • the thickness t of the photosensitive resin layer 3 varies depending on the application, but is preferably 27 to 50 ⁇ m, more preferably 27 to 40 ⁇ m, and further preferably 27 to 35 ⁇ m.
  • the thickness t may be 30 ⁇ m or more.
  • the thickness t is 50 ⁇ m or less, the light transmission sensitivity is sufficient, and the photosensitive resin layer tends to be easily cured.
  • the oxygen permeability of the photosensitive resin layer 3 after curing by light irradiation is 1.7 ⁇ 10 6 fm / s ⁇ Pa (1.5 ⁇ 10 7 cc / m 2 ⁇ 24 h ⁇ atm) or less, more preferably 1.1 ⁇ 10 6 fm / s ⁇ Pa (1.0 ⁇ 10 7 cc / m 2 ⁇ 24 h ⁇ atm) or less, and 8.0 ⁇ 10 5. It is more preferable that it is below fm / s * Pa (7.0 * 10 ⁇ 6 > cc / m ⁇ 2 > * 24h * atm).
  • the support film 1 examples include polymer films having heat resistance and solvent resistance such as polyethylene terephthalate film, polyethylene film, polypropylene film, and polycarbonate film. Among these, a polyethylene terephthalate film (PET film) is preferable from the viewpoint of transparency and heat resistance. In addition, these polymer films may be subjected to a release treatment so that peeling from the photosensitive resin layer 3 is facilitated later.
  • polymer films having heat resistance and solvent resistance such as polyethylene terephthalate film, polyethylene film, polypropylene film, and polycarbonate film.
  • PET film polyethylene terephthalate film
  • these polymer films may be subjected to a release treatment so that peeling from the photosensitive resin layer 3 is facilitated later.
  • the thickness of the support film 1 is preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, and further preferably 15 ⁇ m or more from the viewpoint of mechanical strength.
  • the thickness of the support film 1 is preferably 300 ⁇ m or less, and preferably 200 ⁇ m or less. More preferably, it is more preferably 100 ⁇ m or less. From the above viewpoint, the thickness of the support film 1 is preferably 5 to 300 ⁇ m, more preferably 10 to 200 ⁇ m, and further preferably 15 to 100 ⁇ m.
  • the haze value of the support film 1 is preferably from 0.01 to 5.0%, more preferably from 0.01 to 3.0%, from the viewpoint of improving sensitivity and resolution. It is more preferably from 2.0% to 2.0%, particularly preferably from 0.01% to 1.0%.
  • the haze value can be measured according to JIS K 7375 (established in 2008). It can also be measured with a commercially available turbidimeter such as NDH-1001DP (trade name, manufactured by Nippon Denshoku Industries Co., Ltd.).
  • the photosensitive conductive film of one embodiment may include a protective film that is provided so as to be in close contact with a surface opposite to the main surface including the conductive network 2 of the photosensitive resin layer 3.
  • the polymer film exemplified as the above-mentioned support film can be used similarly.
  • the adhesive force between the protective film and the photosensitive resin layer may be smaller than the adhesive force between the photosensitive resin layer 3 and the support film 1 in order to facilitate the peeling of the protective film from the photosensitive resin layer. preferable.
  • the thickness of the protective film is preferably 1 to 100 ⁇ m, more preferably 5 to 50 ⁇ m, still more preferably 5 to 30 ⁇ m, and particularly preferably 15 to 30 ⁇ m.
  • the thickness of the protective film is 1 ⁇ m or more, the protective film tends to be difficult to tear during lamination, and when it is 100 ⁇ m or less, the price tends to be suppressed.
  • a method for producing a conductive pattern includes a step of laminating the photosensitive conductive film with a support film on a substrate so that the photosensitive resin layer is in close contact with the substrate, and the substrate on which the support film is attached. A step of irradiating a predetermined portion of the photosensitive resin layer with actinic rays, a step of peeling the support film, and a step of forming a conductive pattern by developing the exposed photosensitive resin layer. Through these steps, a conductive pattern substrate having a conductive pattern patterned on the substrate is obtained.
  • an example of a method for producing a conductive pattern will be described with reference to the drawings.
  • the photosensitive conductive film 10 with the supporting film having the supporting film 1, the conductive network 2, and the photosensitive resin layer 3 is placed on the substrate 20 so that the photosensitive resin layer 3 is in close contact with the substrate 20.
  • the photosensitive resin layer 3 is irradiated with an actinic ray L in a pattern shape through the mask pattern 5 ((b) in FIG. 3), and a part of the photosensitive resin layer 3 and the conductive network 2 (not yet) is developed by development.
  • a cured resin layer 3b having a pattern and a conductive network 2a disposed on the cured resin layer 3b is obtained.
  • a conductive pattern 30 is formed (FIG. 3C). Note that in this specification, the pattern includes a stripe shape, a shape in which diamond shapes are connected in series, and the like.
  • the thickness of the conductive network 2 a and the cured resin layer 3 b is a step Hb between the substrate 20 and the conductive pattern 30.
  • the level difference Hb is large, it becomes difficult to obtain the smoothness required for a display or the like.
  • the conductive pattern 30 is easily visually recognized. For this reason, the method shown in FIG. 3 and the method shown in FIG.
  • the method for producing a conductive pattern includes a first exposure step (FIG. 4B) of irradiating a predetermined portion of the photosensitive resin layer 3 with an actinic ray, and then peeling the support film 1. Then, in the presence of oxygen, a second exposure step ((c) in FIG. 4) for irradiating a part or all of the exposed portion and the unexposed portion in the first exposure step with active light. It may be.
  • the second exposure step is preferably performed in air, for example. Conditions with increased oxygen concentration may be used.
  • the surface layer portion of the photosensitive resin layer 3 exposed in the second exposure step that has not been sufficiently cured is removed.
  • the surface layer portion including the conductive network 2 that is not sufficiently cured that is, the surface layer portion of the photosensitive resin layer 3 is removed by the wet phenomenon.
  • the conductive pattern 32 comprised from the resin cured material layer 3a which has the pattern from which the surface layer part was removed, and the electroconductive network 2a which has a pattern which covers a part of main surface of the resin cured material layer 3a is formed. Is done.
  • the conductive pattern substrate 42 having the conductive pattern 32 the conductive pattern 3a is compared with the step (for example, the step Hb in FIG. 3) when the cured resin layer 3a has the same pattern as the conductive network 2a.
  • the level difference Ha due to can be further reduced.
  • the substrate examples include a glass substrate and a plastic substrate such as polycarbonate.
  • the substrate preferably has a minimum light transmittance of 80% or more in a wavelength region of 450 to 650 nm.
  • the photosensitive conductive film with a support film can be laminated to the substrate by removing the protective film and then pressing the photosensitive resin layer side to the substrate while heating.
  • This operation is preferably performed under reduced pressure from the viewpoint of adhesion and followability.
  • the photosensitive resin layer and / or the substrate is preferably heated to 70 to 130 ° C., and the pressure is about 0.1 to 1.0 MPa (1 to 10 kgf / cm). it is preferably about 2), but not particularly limited to these conditions. If the photosensitive resin layer is heated to 70 to 130 ° C. as described above, it is not necessary to pre-heat the substrate in advance, but it is also possible to pre-heat the substrate in order to further improve the stackability.
  • the exposure method is an image of the active ray through a negative or positive mask pattern called artwork.
  • An irradiation method mask exposure method
  • a known light source is used as the active light source.
  • the amount of exposure in the exposure step varies depending on the apparatus used and the composition of the photosensitive resin composition, but is preferably 5 to 1000 mJ / cm 2 , more preferably 10 to 200 mJ / cm 2 . In terms of excellent photocurability, it is preferably 10 mJ / cm 2 or more, and in terms of resolution, it is preferably 200 mJ / cm 2 or less.
  • the exposure process may be performed in two steps, and the first step may be performed at the exposure amount described above, and then the second step may be performed at 100 to 10,000 mJ / cm 2 .
  • the wet development is performed by a known method such as spraying, rocking immersion, brushing, or scrubbing using a developer such as an alkaline aqueous solution, an aqueous developer, or an organic solvent developer corresponding to the photosensitive resin to be used.
  • a developer such as an alkaline aqueous solution, an aqueous developer, or an organic solvent developer corresponding to the photosensitive resin to be used.
  • a safe and stable aqueous solution such as an alkaline aqueous solution
  • alkali hydroxides such as lithium, sodium or potassium hydroxide, alkali carbonates such as lithium, sodium, potassium or ammonium carbonate or bicarbonate; potassium phosphate, sodium phosphate, etc.
  • Alkali metal phosphates; alkali metal pyrophosphates such as sodium pyrophosphate and potassium pyrophosphate, and alkali metal borates such as sodium tetraborate are used.
  • alkaline aqueous solution used for development a sodium carbonate aqueous solution, a potassium carbonate aqueous solution, a sodium hydroxide aqueous solution, a sodium tetraborate aqueous solution and the like are preferable.
  • concentration of the alkaline aqueous solution is usually 0.1 to 5% by mass.
  • the pH of the alkaline aqueous solution is preferably in the range of 9 to 11, and the temperature is adjusted according to the developability of the photosensitive resin layer.
  • a surfactant, an antifoaming agent, a small amount of an organic solvent for accelerating development, and the like may be mixed.
  • an aqueous developer composed of water or an aqueous alkaline solution and one or more organic solvents
  • the base contained in the alkaline aqueous solution in addition to the above-mentioned bases, borax, sodium metasilicate, tetramethylammonium hydroxide, ethanolamine, ethylenediamine, diethylenetriamine, 2-amino-2-hydroxymethyl-1,3 -Propanediol, 1,3-diamino-2-propanol, morpholine and the like.
  • organic solvent examples include acetone, ethyl acetate, alkoxyethanol having an alkoxy group having 1 to 4 carbon atoms, ethyl alcohol, isopropyl alcohol, butyl alcohol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, and the like.
  • the aqueous developer preferably has an organic solvent concentration of 2 to 90% by mass, and the temperature can be adjusted according to the developability. Furthermore, the pH of the aqueous developer is preferably as low as possible within a range where the resist can be sufficiently developed, preferably pH 8-12, and more preferably pH 9-10. In addition, a small amount of a surfactant, an antifoaming agent, or the like can be added to the aqueous developer.
  • organic solvent developer examples include 1,1,1-trichloroethane, N-methyl-2-pyrrolidone, N, N-dimethylformamide, cyclohexanone, methyl isobutyl ketone, and ⁇ -butyrolactone. These organic solvents are preferably added with water in the range of 1 to 20% by mass in order to prevent ignition.
  • Developers may be used in combination of two or more as required.
  • the conductive pattern is further cured by performing heating at about 60 to 250 ° C. or exposure at about 0.2 to 10 J / cm 2 as necessary after development. Also good.
  • a transparent conductive pattern can be easily formed on a substrate such as glass or plastic without forming an etching resist like an inorganic film such as ITO. It is.
  • a conductive pattern substrate includes a substrate and a conductive pattern provided on the substrate.
  • the conductive pattern has a resin cured product layer having a pattern and a conductive network provided on the surface side opposite to the substrate of the resin cured product layer and using conductive fibers, and the resin cured product layer is It is a cured product of a photosensitive resin, and the thickness of the conductive pattern is 27 ⁇ m or more.
  • the thickness of the conductive pattern is the total thickness of the cured resin layer and the conductive network.
  • the conductive pattern substrate according to one embodiment is obtained, for example, by the above-described conductive pattern manufacturing method.
  • the sheet resistance value of the conductive network or conductive pattern is preferably 2000 ⁇ / ⁇ or less, more preferably 1000 ⁇ / ⁇ or less, and 500 ⁇ / ⁇ or less. Further preferred.
  • the conductive pattern substrate or conductive pattern preferably has a minimum light transmittance of 80% or more in a wavelength region of 450 to 650 nm, and more preferably 85% or more.
  • a touch panel sensor includes the conductive pattern substrate.
  • FIG. 5 is a schematic top view showing an example of a capacitive touch panel sensor.
  • the touch panel sensor 200 shown in FIG. 5 detects the capacitance change provided in the area of the touch screen 102 for detecting the touch position of the transparent substrate 101 and one side of the transparent substrate 101, and the X position coordinate.
  • a transparent electrode 104 having Y position coordinates.
  • These transparent electrodes 103 and 104 are provided with a lead wiring 105 for connecting to a driver element circuit for controlling an electrical signal as a touch panel, and a connection electrode 106 for connecting the lead wiring 105 and the transparent electrodes 103 and 104.
  • a connection terminal 107 connected to the driver element circuit is disposed at the end of the lead-out wiring 105 opposite to the connection electrode 106.
  • FIG. 6, FIG. 7, FIG. 8 and FIG. 9 are schematic views showing an example of a manufacturing method of the touch panel sensor 200 shown in FIG. 7 is a schematic cross-sectional view taken along the line VII-VII in FIG. 6, and FIG. 9 is a schematic cross-sectional view taken along the line IX-IX in FIG.
  • the transparent electrodes 103 and 104 are formed by the conductive pattern forming method according to the embodiment.
  • a transparent electrode 103 (X position coordinates) is formed on a transparent substrate 101.
  • the photosensitive conductive film 10 with a support film is laminated so that the photosensitive resin layer 3 is provided on the transparent substrate 101.
  • the laminated photosensitive resin layer 3 is irradiated with actinic rays in a desired shape through a light shielding mask in a pattern (first exposure step). Thereafter, the light shielding mask is removed, the support film is further peeled off, and the photosensitive resin layer 3 is irradiated with actinic rays (second exposure step).
  • a part of the conductive network 2 is removed together with the photosensitive resin layer 3 that is not sufficiently cured, and a conductive pattern is formed.
  • a transparent electrode 103 for detecting the X position coordinate is formed by this conductive pattern (FIG. 7).
  • a transparent electrode (Y position coordinate) 104 is formed as shown in FIG.
  • a transparent conductive substrate 10 provided with the transparent electrode 103 formed by the above process is further laminated with a photosensitive conductive film 10 with a support film so that the photosensitive resin layer 3 is in close contact, and the same operation as described above is performed.
  • a transparent electrode 104 for detecting coordinates is formed (FIG. 9). Even when the transparent electrode 104 is formed on the transparent electrode 103 by forming the transparent electrode 104 by the method for forming a conductive pattern according to an embodiment, the step can be made sufficiently small and the entrainment of bubbles is sufficient. A touch panel sensor with high smoothness can be produced.
  • a lead wire 105 for connecting to an external circuit and a connection electrode 106 for connecting the lead wire and the transparent electrodes 103 and 104 are formed.
  • the lead-out wiring 105 and the connection electrode 106 are formed after the formation of the transparent electrodes 103 and 104, but they may be formed at the same time as each transparent electrode is formed.
  • the lead wiring 105 can be formed at the same time as the connection electrode 106 is formed by using a screen printing method using a conductive paste material containing flaky silver, for example.
  • FIGS. 10 and 11 are partial cross-sectional views taken along a-a 'and b-b' shown in FIG. 5, respectively. These indicate the intersections of the transparent electrodes at the XY position coordinates.
  • the transparent electrode is formed by the method for forming a conductive pattern according to the present invention, so that a touch panel sensor with small steps and high smoothness can be obtained.
  • the reaction solution was allowed to stand at 30 ° C. or lower and then diluted 10 times with acetone.
  • the diluted solution of the reaction solution was centrifuged at 2000 rpm for 20 minutes using a centrifuge, and the supernatant was removed by decantation.
  • Acetone was added to the precipitate, and after stirring, the mixture was centrifuged under the same conditions as described above, and acetone was removed by decantation. Then, it centrifuged twice similarly using distilled water, and obtained the silver fiber.
  • the fiber diameter (diameter) was 40 nm and the fiber length was 4 ⁇ m.
  • the properties of the produced binder polymer were measured by the following method.
  • Weight average molecular weight The weight average molecular weight (Mw) was measured by gel permeation chromatography (GPC), and was derived by conversion using a standard polystyrene calibration curve. The GPC conditions are shown below.
  • the acid value was measured by the neutralization titration method based on JIS K0070 as shown below. First, the binder polymer solution was heated at 130 ° C. for 1 hour to remove volatile components, thereby obtaining a solid content. Then, after accurately weighing 1 g of the solid binder polymer, 30 g of acetone was added to the binder polymer, and this was uniformly dissolved to obtain a resin solution. Next, an appropriate amount of an indicator, phenolphthalein, was added to the resin solution, and neutralization titration was performed using a 0.1 mol / L potassium hydroxide aqueous solution. And the acid value was computed by following Formula.
  • Acid value 0.1 ⁇ V ⁇ f 1 ⁇ 56.1 / (Wp ⁇ I / 100)
  • V is a titration amount (mL) of a 0.1 mol / L potassium hydroxide aqueous solution used for titration
  • f 1 is a factor (concentration conversion factor) of a 0.1 mol / L potassium hydroxide aqueous solution
  • Wp is the mass (g) of the measured resin solution
  • I shows the ratio (mass%) of the non volatile matter in the measured said resin solution.
  • the binder polymer solution is uniformly applied onto a polyethylene terephthalate film (product name “Purex A53” manufactured by Teijin DuPont Films Ltd.) and dried for 10 minutes with a hot air convection dryer at 90 ° C. A film made of a binder polymer having a thickness of 40 ⁇ m was formed. Next, using an exposure machine having a high-pressure mercury lamp (trade name “EXM-1201” manufactured by Oak Manufacturing Co., Ltd.), the irradiation energy amount is 400 mJ / cm 2 (measured value at i-line (wavelength 365 nm)). The film was exposed. The exposed film was heated on a hot plate at 65 ° C.
  • the formed cured film was peeled off from the polyethylene terephthalate film, and the thermal expansion coefficient of the cured film was measured when the temperature was increased at a rate of temperature increase of 5 ° C./min using TMA / SS6000 manufactured by Seiko Instruments Inc. The inflection point obtained from the curve was determined as the glass transition temperature Tg.
  • Example 1 Production of photosensitive conductive film V1 with support film [Production of conductive network W1]
  • the silver fiber dispersion obtained in Production Example 1 was uniformly applied at 25 g / m 2 on a support film (polyethylene terephthalate film, manufactured by Teijin Ltd., trade name “G2-50”) having a thickness of 50 ⁇ m, and 100 ° C.
  • the hot air convection dryer was dried for 3 minutes to form a conductive network W1.
  • the thickness of the conductive network after drying was 0.1 ⁇ m.
  • the solution X1 of the photosensitive resin composition was uniformly applied on the conductive network W1 formed on the support film, and dried for 10 minutes with a hot air convection dryer at 100 ° C. to form a photosensitive resin layer. Thereafter, the photosensitive resin layer was covered with a protective film (polyethylene film, manufactured by Tamapoly Co., Ltd., trade name “NF-13”) to obtain a photosensitive conductive film V1 with a support film.
  • the thickness of the photosensitive resin layer after drying was 30 ⁇ m.
  • Lamination was performed using a laminator (manufactured by Hitachi Chemical Co., Ltd., trade name: HLM-3000 type) under conditions of a roll temperature of 110 ° C., a substrate feed rate of 1 m / min, and a pressure bonding pressure (cylinder pressure) of 4 ⁇ 10 5 Pa. .
  • a laminator manufactured by Hitachi Chemical Co., Ltd., trade name: HLM-3000 type
  • the support film side (the main surface side having the conductive network of the photosensitive conductive film) From above) was irradiated with ultraviolet rays at an exposure amount of 40 mJ / cm 2 . Thereafter, the support film is removed, and further, ultraviolet rays are irradiated from above the main surface side having the conductive network at an exposure amount of 100 mJ / cm 2 to obtain a laminate having a cured product of the photosensitive conductive film on the entire surface of the filter paper. It was.
  • EXM1201 manufactured by Oak Manufacturing Co., Ltd.
  • Lamination was performed using a laminator (manufactured by Hitachi Chemical Co., Ltd., trade name: HLM-3000 type) under conditions of a roll temperature of 110 ° C., a substrate feed rate of 1 m / min, and a pressure bonding pressure (cylinder pressure) of 4 ⁇ 10 5 Pa. .
  • a laminator manufactured by Hitachi Chemical Co., Ltd., trade name: HLM-3000 type
  • the supporting film side (mainly having a conductive network of photosensitive conductive film).
  • the photosensitive resin layer was cured by irradiating with light at an exposure amount of 1 J / cm 2 from above the surface side. Thereafter, the support film was peeled off.
  • Lamination was performed using a laminator (manufactured by Hitachi Chemical Co., Ltd., trade name: HLM-3000 type) under conditions of a roll temperature of 110 ° C., a substrate feed rate of 1 m / min, and a pressure bonding pressure (cylinder pressure) of 4 ⁇ 10 5 Pa. .
  • a laminator manufactured by Hitachi Chemical Co., Ltd., trade name: HLM-3000 type
  • the support film side (main surface having a conductive network of the photosensitive conductive film) UV light was irradiated from above (on the side) at an exposure amount of 40 mJ / cm 2 .
  • the support film was removed, and ultraviolet rays were irradiated from above the main surface side having the conductive network at an exposure amount of 100 mJ / cm 2 to obtain a laminate having the cured photosensitive conductive film on the entire surface of the resin substrate.
  • the sheet resistance value of the obtained laminate was measured with a non-contact resistance measuring instrument (manufactured by Napson Co., Ltd., EC-80P) and found to be 50 ⁇ 5 ⁇ / ⁇ .
  • an optical adhesive sheet (manufactured by Hitachi Chemical Co., Ltd., trade name TE-5000H, thickness 100 ⁇ m) was prepared. After peeling off the separator on one side of the OCA, the laminate is laminated so that the cured product of the photosensitive conductive film is in close contact with the adhesive layer of the OCA, and the cured product of the photosensitive conductive film and the OCA are formed on the resin substrate. A laminated body in which was stacked.
  • Laminate, laminator (Hitachi Chemical Co., Ltd., trade name HLM-3000 type) was used to roll temperature room (20 ⁇ 30 ° C.), the substrate feed rate 1 m / min, crimped pressure (cylinder pressure) 4 ⁇ 10 5 Pa It went on condition of.
  • the laminate was divided into an OCA adhesive layer and a glass substrate (length 6 cm ⁇ width 6 cm, thickness 1 mm).
  • a laminate in which a cured product of a photosensitive conductive film, OCA and glass were laminated in this order on a resin substrate was produced.
  • the structure of this laminate (resin substrate / cured product of photosensitive conductive film / OCA / glass) is referred to as an out-cell laminate.
  • Laminate, laminator (Hitachi Chemical Co., Ltd., trade name HLM-3000 type) was used to roll temperature room (20 ⁇ 30 ° C.), the substrate feed rate 1 m / min, crimped pressure (cylinder pressure) 4 ⁇ 10 5 Pa It went on condition of.
  • FIGS. 12 and 13 A schematic plan view and a cross-sectional view of an out-cell type sample for light resistance test are shown in FIGS. 12 and 13, respectively.
  • the out-cell type sample includes a resin substrate 310, a photosensitive conductive film cured product 4a, an OCA 210, and a glass substrate 300, which are stacked in this order.
  • the glass substrate 300 is covered with one-third of the entire surface by a black tape (light shielding portion) 301.
  • the sheet resistance value of the sample for light resistance test was measured from the resin substrate surface of the sample for light resistance test using a non-contact resistance meter (manufactured by Napson Corporation, EC-80P). The sheet resistance value is measured at two locations of the light irradiation portion 401 (region where the black tape is not attached) and the light shielding portion end portion 402 (boundary portion between the region where the black tape is attached and the region where the black tape is not attached). (See FIG. 9). The sheet resistance value was 55 ⁇ 5 ⁇ for both the light irradiation part and the light shielding part end, and this sheet resistance value was taken as the initial value (R0) before the light resistance test.
  • the sample for light resistance test was irradiated with light by a xenon lamp using a light resistance tester (manufactured by Atlas Material Technology, SUNTEST XLS +).
  • the test conditions were: black panel temperature 60 ° C., irradiation intensity 60 W / m 2 (integrated value of spectral irradiance at a wavelength of 300 nm to 400 nm), test chamber temperature 45 ° C., humidity 15% RH, test time 300 hours. Tested. Wavelength 365nm illumination of the xenon lamp in the above test conditions were 0.8 W / m 2. Light irradiation was performed from the surface of the light tape test surface of the sample for light resistance test.
  • the sheet After the light resistance test, the sheet was allowed to stand at room temperature for 1 hour, and then the sheet resistance values of the light irradiation part and the light shielding part end were measured again. This resistance value was defined as the sheet resistance value (R1) after the light resistance test.
  • the ratio Rr of R1 to R0 (R1 / R0) is calculated from the sheet resistance values R0 and R1 before and after the light resistance test, and A (good) when Rr is 1.2 or less (resistance increase rate is 20% or less).
  • the light resistance was evaluated as B (defect) when Rr exceeded 1.2.
  • Example 2 A photosensitive conductive film was prepared in the same manner as in Example 1 except that the components and blending amounts of Example 1 were changed to the components and blending amounts of Example 2 shown in Table 2. The oxygen transmission rate, thickness and light resistance were evaluated. The results are shown in Table 2.
  • Comparative Example 1 A photosensitive conductive film was prepared in the same manner as in Example 1 except that the thickness after drying of the photosensitive resin layer (the thickness of the photosensitive resin layer including the portion impregnated in the conductive network) was 5 ⁇ m. After curing, The oxygen transmission rate, thickness, and light resistance of the photosensitive conductive film were evaluated. The results are shown in Table 2.
  • a sensor electrode (conductive pattern) is formed that is less likely to cause an increase in resistance value or malfunction of a touch panel sensor even under long-term light irradiation with sunlight, a xenon lamp, or the like. be able to.
  • the photosensitive conductive film which concerns on this invention can be used for formation of the conductive pattern used as electrode wiring of apparatuses, such as flat panel displays, such as a liquid crystal display element, a touch panel sensor, a solar cell, and illumination especially.
  • SYMBOLS 1 Support film 2, 2a ... Conductive network, 3 ... Photosensitive resin layer, 3a, 3b ... Resin hardened material layer, 4a ... Hardened

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Abstract

L'invention concerne un film conducteur photosensible pourvu d'une couche de résine photosensible comprenant un réseau conducteur formé au moyen de fibres conductrices sur un côté surface primaire dudit réseau, l'épaisseur de la couche de résine photosensible étant de 27 µm ou supérieure.
PCT/JP2017/024373 2016-07-05 2017-07-03 Film conducteur photosensible, procédé de formation de motif conducteur, substrat à motif conducteur et capteur d'écran tactile WO2018008599A1 (fr)

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JP2016133538A JP2019148611A (ja) 2016-07-05 2016-07-05 感光性導電フィルム、導電パターンの製造方法、導電パターン基板及びタッチパネルセンサ
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Citations (6)

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Publication number Priority date Publication date Assignee Title
JP2009252493A (ja) * 2008-04-04 2009-10-29 Konica Minolta Holdings Inc 透明導電性フィルムその製造方法及び有機エレクトロルミネッセンス素子
JP2011070821A (ja) * 2009-09-24 2011-04-07 Panasonic Electric Works Co Ltd 透明異方導電性フィルム
WO2011155412A1 (fr) * 2010-06-07 2011-12-15 日立化成工業株式会社 Composition de résine photosensible, élément photosensible comprenant la composition, procédé de formation d'un septum pour un dispositif d'affichage d'image, procédé de fabrication d'un dispositif d'affichage d'image et dispositif d'affichage d'image
JP2012162601A (ja) * 2011-02-03 2012-08-30 Hitachi Chemical Co Ltd オーバーコート用光硬化性樹脂組成物、オーバーコート用光硬化性エレメント、導電膜基板の製造方法及び導電膜基板
JP2014178465A (ja) * 2013-03-14 2014-09-25 Hitachi Chemical Co Ltd 配線の形成方法、導電パターン基板、タッチパネルセンサ及び感光性導電フィルム
WO2015056445A1 (fr) * 2013-10-16 2015-04-23 日立化成株式会社 Fibre conductrice contenant un stratifié, film conducteur photosensible, procédé de fabrication de tracé conducteur, substrat de tracé conducteur et écran tactile

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009252493A (ja) * 2008-04-04 2009-10-29 Konica Minolta Holdings Inc 透明導電性フィルムその製造方法及び有機エレクトロルミネッセンス素子
JP2011070821A (ja) * 2009-09-24 2011-04-07 Panasonic Electric Works Co Ltd 透明異方導電性フィルム
WO2011155412A1 (fr) * 2010-06-07 2011-12-15 日立化成工業株式会社 Composition de résine photosensible, élément photosensible comprenant la composition, procédé de formation d'un septum pour un dispositif d'affichage d'image, procédé de fabrication d'un dispositif d'affichage d'image et dispositif d'affichage d'image
JP2012162601A (ja) * 2011-02-03 2012-08-30 Hitachi Chemical Co Ltd オーバーコート用光硬化性樹脂組成物、オーバーコート用光硬化性エレメント、導電膜基板の製造方法及び導電膜基板
JP2014178465A (ja) * 2013-03-14 2014-09-25 Hitachi Chemical Co Ltd 配線の形成方法、導電パターン基板、タッチパネルセンサ及び感光性導電フィルム
WO2015056445A1 (fr) * 2013-10-16 2015-04-23 日立化成株式会社 Fibre conductrice contenant un stratifié, film conducteur photosensible, procédé de fabrication de tracé conducteur, substrat de tracé conducteur et écran tactile

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