WO2017206035A1 - Biosensing module, biosensing chip, and electronic device - Google Patents

Biosensing module, biosensing chip, and electronic device Download PDF

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Publication number
WO2017206035A1
WO2017206035A1 PCT/CN2016/083980 CN2016083980W WO2017206035A1 WO 2017206035 A1 WO2017206035 A1 WO 2017206035A1 CN 2016083980 W CN2016083980 W CN 2016083980W WO 2017206035 A1 WO2017206035 A1 WO 2017206035A1
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WO
WIPO (PCT)
Prior art keywords
pad
biosensor
sub
biosensing
disposed
Prior art date
Application number
PCT/CN2016/083980
Other languages
French (fr)
Chinese (zh)
Inventor
李问杰
Original Assignee
深圳信炜科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳信炜科技有限公司 filed Critical 深圳信炜科技有限公司
Priority to PCT/CN2016/083980 priority Critical patent/WO2017206035A1/en
Priority to CN201680000455.0A priority patent/CN106062951B/en
Publication of WO2017206035A1 publication Critical patent/WO2017206035A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints

Definitions

  • the present invention relates to the field of biometrics, and in particular, to a biosensor module, a biosensor chip, and an electronic device.
  • Biosensing devices such as fingerprint sensor devices, require the user to touch or access the biosensor device after performing biometric sensing so that the biosensor device can obtain a sufficiently strong sensing signal.
  • the human body static electricity may damage or damage the storage circuit for storing data in the biosensor device, resulting in a decrease or failure of the biosensor device identification rate.
  • the present invention provides a biosensor module, a biosensor chip, and an electronic device capable of preventing damage or damage to a memory circuit by static electricity.
  • a biosensing module comprising:
  • a sensing unit configured to sense biological information that the target object approaches or contacts the defect
  • the electrostatic conducting member is disposed above the storage circuit for discharging static electricity.
  • the electrostatically conductive member is wholly or partially located directly above the storage circuit.
  • the biosensing module further includes a pad, the electrostatic conduction member is coupled to the pad, and the electrostatic conduction member discharges static electricity to the ground through the pad.
  • the biosensing module further includes a pad for direct or indirect connection to ground, the electrostatic conductive member being coupled to the pad.
  • the pad includes a first sub-pad and a second sub-pad, wherein two ends of the electrostatic conductive member and the first sub-pad, respectively The two sub-pads are electrically connected.
  • the first sub-pad and the second sub-pad are respectively disposed on the storage circuit Both sides are such that the electrostatic conduction member straddles the storage circuit.
  • the first sub-pad and the second sub-pad are symmetrically disposed on two sides of the storage circuit; or, the first sub-pad and the second sub-pad Provided in the diagonal of the memory circuit, in some embodiments, the first sub-pad and the second sub-pad are spaced apart from the memory circuit
  • the electrostatically conductive member is a wire.
  • the electrostatically conductive member has a raised portion that is higher than the storage circuit.
  • the raised portions above the storage circuit are formed by wire bonding.
  • the raised portion has a pointed shape or an arc shape.
  • the electrostatic conductive member is one or more, and when the electrostatic conductive member is a plurality of turns, the plurality of electrostatic conductive members are spaced apart.
  • the memory circuit is a one-time programmable memory or a multi-time programmable memory.
  • the present invention also provides a biosensor chip comprising the biosensor module of any of the above embodiments.
  • the biosensor core comprises one or more of a fingerprint sensing core, a blood oxygen sensing core, and a heartbeat sensing core.
  • the biosensor chip includes a biosensing die, the biosensing die including the sensing unit, the memory circuit, and the pad;
  • the biosensing die further includes a substrate, a first insulating layer, and a second insulating layer;
  • the memory circuit is disposed on the substrate;
  • the first insulating layer and the second insulating layer are disposed on a storage circuit;
  • the storage circuit is located between the substrate and the first insulating layer;
  • the pad is disposed on the first insulating layer;
  • the second insulating layer is disposed on the first insulating layer And a through hole is disposed at a position corresponding to the pad; the electrostatic conductive member is connected to the pad through the through hole.
  • the biosensor chip further includes a circuit board and a package, the biosensing die is disposed on the circuit board, and the package encapsulates the biosensing bare The sheet and the electrostatically conductive member are within the biosensor chip.
  • the number of the pads is multiple, the pads are either disposed on the biosensing die, or a portion of the pads are disposed on the biosensing die. A part of the pad is disposed on the circuit board.
  • the present invention provides an electronic device comprising the biosensor chip of any of the above embodiments.
  • the static electricity is damaged or damaged by the static electricity
  • the electrostatic conductive member has a simple structure and a material cost.
  • the biosensor chip and the electronic device having the biosensor module can also avoid damage or damage to the storage circuit caused by static electricity, and the electrostatic conductive member has a simple structure and a low material cost.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of a biosensor module of the present invention.
  • FIG. 2 is a schematic cross-sectional view showing another embodiment of the biosensor module of the present invention.
  • FIG. 2a is a top plan view of an embodiment of a pad distribution mode of the biosensor module of the present invention.
  • 2b is a top plan view of another embodiment of a pad distribution pattern of the biosensor module of the present invention.
  • 2c is a top plan view of another embodiment of a pad distribution pattern of the biosensor module of the present invention.
  • 2d is a top plan view of another embodiment of a pad distribution manner of the biosensor module of the present invention.
  • FIG. 3 is a schematic cross-sectional view showing another embodiment of the biosensor module of the present invention.
  • FIG. 3a is a top plan view of an embodiment of an electrostatic conduction member of the biosensor module of the present invention.
  • FIG. 3b is a top plan view of another embodiment of an electrostatic conduction member arrangement of the biosensing module of the present invention.
  • FIG. 4 is a schematic cross-sectional view showing an embodiment of a biosensor chip of the present invention.
  • 5 is a schematic cross-sectional view showing another embodiment of the biosensor chip of the present invention.
  • 6 is a cross-sectional view showing still another embodiment of the biosensor chip of the present invention.
  • FIG. 7 is a perspective view of an electronic device of the present invention.
  • Example embodiments will now be described more fully with reference to the appended drawings.
  • the example embodiments can be embodied in many forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete,
  • the thickness and size of each layer shown in the drawings may be exaggerated, omitted or schematically illustrated and the number of related elements may be schematically illustrated for convenience or clarity.
  • the size of the elements in the drawings does not fully reflect the actual size, and the number of related components does not fully reflect the actual number.
  • the same reference numerals in the drawings denote the same or similar structures.
  • the components indicated by broken lines in the drawings are components inside the solid body, and the present invention is drawn to facilitate the description of the corresponding technical solution, and actually the dotted line component is seen as an invisible component from the outside.
  • connection may be a plurality of embodiments such as an electrical connection, a mechanical connection, a coupling, a direct connection, and an indirect connection, and is not particularly limited unless specifically described below.
  • first and second appearing in each component name are not intended to limit the order in which the components appear, but to facilitate the naming of the components and to clearly distinguish the components, so that the description is more concise.
  • the orientation or positional relationship of the “bottom”, “inside”, “outside” and the like is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the indicated device. Or the components must have a particular orientation, are constructed and operated in a particular orientation, and are therefore not to be construed as limiting the invention.
  • the biosensor module provided by the present invention is used to sense biological information input by a target object.
  • the biosensor modules are all formed in a biosensor chip.
  • the biosensor chip includes a biosensing die (Die) and an electrostatic conducting member.
  • the biosensing die includes a memory circuit for storing data.
  • the data is, for example, initialization data of a circuit in the biosensor chip, a model number of the product, and the like.
  • the electrostatically conductive member is partially or wholly located on the biosensing die.
  • the electrostatic conducting member is located directly above the storage circuit, and a protrusion or a tip is formed above the storage circuit and directly or indirectly connected to the ground to discharge static electricity.
  • the biosensor chip further includes a package for encapsulating the biosensing die and the electrostatic conductive member.
  • the electrostatic conducting member is located between the biosensing die and the package.
  • the package fills a gap between the electrostatic conduction member and the biosensing die.
  • One side surface of the package body is a side surface of the biosensor chip receiving the user input, and a surface defining the side of the package body receiving the user input is a sensing surface.
  • the electrostatically conductive member is closer to the sensing surface than the memory circuit. When the user approaches or contacts the sensing surface, the electrostatic conducting member discharges static electricity to the user to prevent damage or damage to the storage circuit caused by static electricity.
  • the electrostatic conduction member is, for example, a wire, and the convex portion or the tip end is formed by wire bonding.
  • the static conductive member is not limited to the wires described herein, but may be other shapes of conductive members.
  • the storage circuit is, for example, an ultraviolet erasable memory.
  • the ultraviolet erasable memory is, for example, a One Time Program (OTP) memory or/and a Multi Time Program (MTP) memory.
  • OTP One Time Program
  • MTP Multi Time Program
  • OTP One Time Program
  • the ultraviolet erasable memory is another suitable type of memory.
  • the storage circuit is generally disposed in the fingerprint sensing die (Die) of the fingerprint sensing chip, in order to prevent static electricity from being stored.
  • the circuit causes damage or damage
  • the fingerprint sensing chip is provided with an electrostatic conducting member above the position corresponding to the storage circuit to absorb static electricity flowing to the storage circuit.
  • the electrostatic conductive member is, for example, a metal conductive member, and is not limited to the metal conductive member.
  • the memory circuit is an ultraviolet (Ultraviolet Rays) erasable memory, here
  • the OTP memory is described as an example. After the fingerprint sensing die is returned, the fingerprint sensing die needs to be tested before being packaged into the fingerprint sensing chip, wherein the number of OTP memory writes needs to be written. According to the test of its good or bad, after testing the OTP memory as a qualified product, the data written to the OTP memory is tested before being erased by ultraviolet rays. Since the fingerprint sensing die is tested, ultraviolet light is required to erase the OTP memory. Therefore, the fingerprint sensing die itself cannot be provided with a metal component above the position corresponding to the OTP memory.
  • the fingerprint sensing die package is a fingerprint sensing chip (it is required that the electrostatic conductive member is not disposed in the fingerprint sensing chip), when the user approaches or contacts the After the fingerprint sensor chip performs fingerprint information sensing, the top of the OTP memory is more susceptible to damage or damage caused by static electricity of the human body due to the absence of shielding of the metal component, thereby causing the fingerprint sensing chip to be scrapped.
  • the present invention proposes that after the fingerprint sensing die is tested, the encapsulating fingerprint sensing die is a fingerprint sensing chip, and an electrostatic conducting member is formed above the fingerprint sensing die.
  • the encapsulating fingerprint sensing die is a fingerprint sensing chip, and an electrostatic conducting member is formed above the fingerprint sensing die.
  • the electrostatic conducting member is located directly above the OTP memory or across the OTP memory.
  • the electrostatic conductive member and the biosensing die are packaged in a package to form a biosensor chip.
  • the electrostatic conducting member absorbs static electricity introduced by the user to the OTP memory, thereby preventing static electricity from damaging or damaging the OTP memory.
  • both ends of the wire are formed on the biosensing die.
  • one end of the two ends of the wire is formed on the biosensing die
  • the other end is formed on one side of the biosensing die.
  • both ends of the wire are respectively formed on both sides of the biosensing die.
  • two ends of the wire are respectively formed on opposite sides of the biosensing die. That is, the wire spans the biosensing die.
  • the biosensor chip when one or both ends of the wire are formed on one side or both sides of the biosensing die, one or both ends of the wire are not formed on the biosensing die.
  • the biosensor chip when the biosensor chip uses a Ball Grid Array Package (BGA), the biosensor chip further includes a circuit board, and the biosensing die is formed on the electrostatic conductive member. Between the circuit board and the package. One or both ends of the wire may form the circuit board.
  • BGA Ball Grid Array Package
  • the biosensor chip has various packaging methods, for example, a Quad Flat No-lead Package (QFN), correspondingly, the biosensor chip may not include the circuit board. Instead, a lead frame (Fram e ) is formed around the biosensing die.
  • QFN Quad Flat No-lead Package
  • the biosensor module includes one of a fingerprint sensing module, a blood oxygen sensing module, a heartbeat sensing module, a pressure sensing module, a humidity sensing module, a temperature sensing module, and an iris sensing module.
  • the biological information includes fingerprint information, blood oxygen information, heartbeat information, pressure information, and humidity information.
  • One or more of temperature information, iris information is provided.
  • the target object such as a user's finger
  • suitable types of objects it is not limited to the human body.
  • the biosensor module may be partially formed in the biosensor chip and partially formed outside the biosensor chip.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of a biosensor module of the present invention.
  • the biosensor module 100 includes a sensing unit 10, a storage circuit 20, a pad 30, and an electrostatic conduction member 40.
  • the sensing unit 10 is configured to sense biological information that the target object approaches or contacts the sputum.
  • the storage circuit 20 is for storing data.
  • the data includes, for example, initialization data of a circuit of the biosensor module 100, a product model, and the like.
  • the pad 30 is used to connect directly or indirectly to ground.
  • the pad 30 is located, for example, around the memory circuit 20, and may also be located above the memory circuit 20. In the present embodiment, the pad 30 is disposed above the memory circuit 20 and outside the memory circuit 20.
  • the electrostatic conduction member 40 is connected to the pad 30.
  • the electrostatic conduction member 10 is for discharging static electricity to the ground.
  • the ground or device ground such as the electronic device 400 (see Figure 7) to which the biosensing module 100 is applied, is typically loaded with a voltage of 0 volts.
  • the pad 30 is indirectly grounded, for example, by a modulation circuit grounded, or by a power supply ground.
  • the manner of extending the electrostatic conducting member 40 is not limited to that shown in FIG. 1 : after the electrical connection pad 30 extends from the pad 30 to the storage circuit 20 , the electrostatic conducting member 40 The extension may also be such that the pads 30 extend vertically upward after the electrical connection pads 30. In addition, the extension of the electrostatic conducting member 40 can also be other suitable extensions.
  • the electrostatic conductive member 40 is a wire, and the wire is a metal wire.
  • the material of the metal wire is, for example, gold, copper or aluminum. Of course, other suitable materials may also be used.
  • the wire has a simple structure and a small amount of materials. Reduce material costs.
  • the electrostatic conducting member 40 is also limited to a wire, and may also be other suitable shapes of conductive elements.
  • the wire has a raised portion 41 higher than the storage circuit 20.
  • the raised portion 41 higher than the storage circuit 20 is formed by wire bonding.
  • the convex portion 41 has a pointed shape or an arc shape to guide the user to discharge static electricity to the convex portion 41 by using a lightning rod principle, and then the electrostatic arch I is grounded through the pad 30 to prevent static electricity. Damage or damage to the storage circuit 20.
  • the pads 30 may be one or more.
  • the material of the pad 30 includes, for example, one or more of aluminum, copper, gold, silver, platinum, palladium, nickel, and the like. Of course, the pad 30 material may also be other suitable materials.
  • the memory circuit 20 is an ultraviolet (Ultraviolet Rays) erasable memory.
  • the ultraviolet erasable memory is, for example, a One Time Program (OTP) memory or/and a Multi-Mode Programmable (MTP) memory.
  • OTP One Time Program
  • MTP Multi-Mode Programmable
  • the storage circuit 20 may be other suitable types of memories.
  • the ultraviolet erasable memory is another suitable type of memory.
  • the biosensor module 100 may further include a first insulating layer 50 disposed above the memory circuit 20 and the sensing unit 10.
  • the pad 30 is disposed above the first insulating layer 50.
  • the first insulating layer 50 may also be disposed above one of the memory circuit 20 and the sensing unit 10. Still alternatively, the first insulating layer 50 is omitted, and the pad 30 is disposed around the memory circuit 20.
  • FIG. 2 is a schematic cross-sectional view showing another embodiment of the biosensor module of the present invention.
  • Fig. 2a is a plan view showing an embodiment of a pad distribution mode of the biosensor module of the present invention.
  • Figure 2b is a top plan view of another embodiment of the pad distribution of the biosensor module of the present invention.
  • Figure 2c is a top plan view of another embodiment of the pad distribution pattern of the biosensing module of the present invention.
  • Fig. 2d is a plan view showing another embodiment of the pad distribution method of the biosensor module of the present invention.
  • the pad 30 includes a first sub-pad 31 and a second sub-pad 32 disposed around the memory circuit 20 for receiving a ground signal. Both ends of the electrostatic conduction member 40 are electrically connected to the first sub-pad 31 and the second sub-pad 32, respectively.
  • the manner in which the first sub-pad 31 and the second sub-pad 32 are used for grounding may be the first sub-pad 31.
  • One or both of the second sub-pads 32 directly serve as a ground terminal, or may be one or both of the first sub-pad 31 and the second sub-pad 32.
  • the storage circuit 20 or the grounding end of the sensing unit 10 is electrically connected, and may also be one of the first sub-pad 31 and the second sub-pad 32 or both. connection.
  • the grounding manner of the first sub-pad 31 and the second sub-pad 32 of the present invention is not limited to the manner of grounding listed herein, and may be other suitable grounding methods.
  • the first sub-pad 31 and the second sub-pad 32 are respectively disposed on any two sides of the storage circuit 20 such that the electrostatic conduction member 40 straddles the storage circuit 20,
  • the first sub-pad 31 and the second sub-pad 32 are respectively disposed on two sides or opposite sides of the storage circuit 20 and the like.
  • the first sub-pad 31 and the second sub-pad 32 are respectively disposed on two adjacent sides of the storage circuit 20 to cause the electrostatic conduction member 40 to cross
  • the storage circuit 20 is described.
  • the first sub-pad 31 and the second sub-pad 32 are symmetrically disposed on both sides of the memory circuit 20 to cause the electrostatic conduction member 40 to straddle the memory circuit 20.
  • the first sub-pad 31 and the second sub-pad 32 may be respectively disposed at opposite corners of the memory circuit 20.
  • the first sub-pad 31 and the second sub-pad 32 may be spaced apart from one side of the memory circuit 20, and need not be separately disposed in the Both sides of the storage circuit 20.
  • the first sub-pad 31 may be disposed at a corner of the storage circuit 20, and the second sub-pad 32 may be disposed at the storage circuit 20.
  • the first sub-pad 31 is disposed between the memory circuit 20 and the sensing unit 10, and may be modified.
  • the first sub-pad 31 The sub-pad 31 may also be disposed above the memory circuit 20 or the sensing unit 10.
  • the distribution manner of the first sub-pad 31 and the second sub-pad 32 of the present invention is not limited to the above-mentioned distribution manner, and may be other suitable distribution manners, for example, every two or three.
  • the first sub-pad 31 and the second sub-pad 32 are respectively disposed on both sides of the circuit.
  • the two or three circuits are respectively provided with an electrostatic conducting member 40 to respectively correspond to the first sub-pad 31 and the second sub-pad 32.
  • contours of the biosensor module 100, the storage circuit 20, and the sensing unit 10 are not limited to the rectangles shown in FIG. 2a to FIG. 2d, and may also be square, six.
  • a regular shape such as a side shape, an octagonal shape, or the like may also be an irregular shape or other suitable shape.
  • the first child The pad 31 and the second sub-pad 32 are also not limited to the circular shape shown in FIGS. 2a to 2d, and may also be square.
  • Regular shapes such as rectangles may also be irregular shapes or other suitable shapes.
  • FIG. 3 is a schematic cross-sectional view showing another embodiment of the biosensor module of the present invention.
  • Fig. 3a is a plan view showing an embodiment of an electrostatic conduction member of the biosensor module of the present invention.
  • Figure 3b is a top plan view of another embodiment of an electrostatic conduction member arrangement of a biosensing module of the present invention.
  • the electrostatic conduction member 40 may be one or more. When the electrostatic conductive member 40 is a plurality of turns, the plurality of electrostatic conductive members 40 are spaced apart.
  • the interval may be an interval on a vertical plane or an interval on a horizontal plane.
  • the projections of the plurality of electrostatic conductive members 40 on the vertical plane are spaced apart; as shown in FIG. 3a, the projections of the plurality of electrostatic conductive members 40 in the horizontal plane are spaced apart.
  • each of the electrostatic conductive members 40 in FIG. 3 has a different height from the storage circuit 20, however, the shape and size thereof may be the same, and may of course be different.
  • Each of the electrostatic conductive members 40 in Fig. 3a has the same length projected on a horizontal plane, however, the actual length, shape, size, and height may be the same or different.
  • the plurality of electrostatic conducting members 40 may be arranged in an array, such as a matrix arrangement. Of course, it can also be arranged in other rules or irregular ways. However, as can be modified, as shown in Fig. 3b, the plurality of electrostatic conducting members 40 can also be staggered.
  • the electrostatic conducting member 40 in FIG. 3-3b is only two examples.
  • the plurality of electrostatic conducting members 40 are not limited to two, and may be two or more. Accordingly, the number of the first sub-pad 31 and the second sub-pad 32 is correspondingly increased.
  • the manner in which the electrostatic conducting member 40 of the present invention is disposed is not limited to the above-described arrangement, and may be other suitable arrangements.
  • FIG. 4 is a schematic cross-sectional view of the biosensor chip of the present invention.
  • the present invention provides a biosensor chip 300.
  • the biosensor chip 300 includes the biosensor module 100 of the above embodiment.
  • the biosensor chip 300 includes a biosensing die 200 and the electrostatic conduction member 40.
  • the electrostatically conductive member 40 is disposed on the biosensing die 200.
  • the biosensing die 200 includes a memory circuit 20.
  • the electrostatic conducting member 40 is partially or entirely disposed directly above the storage circuit 20 for discharging static electricity to the ground.
  • the biosensing die 200 further includes a substrate 310, a sensing unit 10, a first insulating layer 50, and a second The insulating layer 60, and the pad 30.
  • the memory circuit 20 is disposed on the substrate 310.
  • the first insulating layer 50 and the second insulating layer 60 are disposed on the memory circuit 20.
  • the memory circuit 20 is located between the substrate 310 and the first insulating layer 50.
  • the pad 30 is disposed on the first insulating layer 50.
  • the second insulating layer 60 is disposed on the first insulating layer 50, and is provided with a through hole H at a position corresponding to the pad 30.
  • the electrostatic conduction member 40 is connected to the pad 30 through the through hole H.
  • the substrate 310 is, for example, a semiconductor substrate, such as a silicon substrate.
  • the substrate 310 can, for example, also be another suitable type of substrate, such as an insulating substrate.
  • the second insulating layer 60 covers the memory circuit 20.
  • the second insulating layer 60 may cover only the memory circuit 20, and may continue to extend above the sensing unit 10 to be the same. Covering the sensing unit 10, this prevents the biosensing die 200 from causing mechanical or chemical damage during packaging into the biosensor chip 300.
  • the biosensor chip 300 of the present invention may include a single die, and may also include a plurality of dies.
  • the memory circuit 20 is formed in the biosensing die 200; when the biosensor chip 300 includes a plurality of die, The storage circuit 20 can form a storage die separately and is disposed outside the bio-sensing die 200. Accordingly, the first insulating layer 50 and the second insulating layer 60 are not disposed on the storage die 30.
  • a pad 30 may be formed on the biosensing die 200, a pad formed on the circuit board 330 (described later) and located on the left side of the memory die, the electrostatic conduction member 40 spanning the storage Above the die, or alternatively, pads 30 on either side of the memory die are formed on the circuit board 330.
  • the number and formation of the dies included in the biosensor chip 300 are not limited to the above-mentioned number and formation manner, and may be other suitable numbers and formation manners, for example, when The biosensor chip 300 includes two die dies.
  • the memory circuit 20 can also be formed in a control die (not shown) for controlling the performance of the biosensing die 200. Test function.
  • biosensor module 100 in the biosensor chip 300 of the present invention can be changed to the biosensor module 100 described in any of the above embodiments, and is not limited to the above embodiment of FIG. The biosensor module 100 is described.
  • the biosensor chip 300 may further include a circuit board 330 and a package body 320.
  • the biosensing die 200 is disposed on the circuit board 330.
  • the package 320 encapsulates the biometric
  • the sensation die 200 and the electrostatic conduction member 30 are in the biosensor chip 300.
  • the package body 306 fills a gap between the electrostatic conductive member 30 and the bio-sensing die 200 such that the electrostatic conductive member 40 is fixed in the package body 30.
  • the material of the package 320 is, for example, an epoxy resin material or other insulating material.
  • the circuit board 330 is, for example, a printed circuit board.
  • the packaging step of the bio-sensing chip 300 is, for example, electrically connecting the bio-sensing die 200 to the circuit board 330; then, the two ends of the electrostatic conducting member 40 are connected by wire bonding. Connecting the two pads 30; placing the circuit board 320 carrying the biosensor chip 300 in an injection mold containing an epoxy resin material; and finally clamping the biosensor chip 300 in the mold cavity. Plastically sealed.
  • the packaging step of the biosensor chip 300 of the present invention is not limited to the steps described herein, but may be other suitable packaging steps.
  • the side surface S of the package body 320 facing away from the storage circuit 20 is for receiving a touch or proximity input of a target object, and the surface S is defined as a sensing surface.
  • the electrostatic conducting member 40 is closer to the sensing surface S than the memory circuit 20. Since the electrostatic conduction member 40 is disposed between the storage circuit 20 and the package body 32 0, when the target object introduces an electrostatic enthalpy, static electricity is introduced to the ground through the electrostatic conduction member 40, thereby avoiding static electricity to the storage circuit 20 Cause damage or damage.
  • the biosensor chip 300 is packaged in a BGA package, and the biosensor chip 300 includes the circuit board 330.
  • the biosensor chip 300 may not include the circuit board 330, but instead includes a lead frame disposed around the biosensing die 200.
  • FIG. 5 is a schematic cross-sectional view showing another embodiment of the biosensor chip of the present invention.
  • One end of the electrostatic conducting member 40 is disposed on the biosensing die 200, and the other end is disposed on the circuit board 330.
  • the electrostatic conduction member 40 spans over the storage circuit 20.
  • the number of the pads 30 is a plurality of turns, and a part of the pads 30 may be disposed on the biosensing die 200, and a part of the pads 30 are disposed on the circuit board 330.
  • the electrostatic conduction member 40 is connected to the pad 30.
  • the pads 300 disposed on the circuit board 330 may be replaced with lead frames.
  • FIG. 6 is a cross-sectional view showing still another embodiment of the biosensor chip of the present invention.
  • the two ends of the electrostatic conducting member 40 are disposed on opposite sides of the biosensing die 200.
  • the two ends of the electrostatic conducting member 40 are respectively disposed on opposite sides of the biosensing die 200.
  • the electrostatically conductive member 40 spans the biosensing die 200.
  • the portion of the electrostatic conduction member 40 is located directly above the storage circuit 20.
  • the circuit board 330 is provided with pads 30 connected to the electrostatic conductive member 40.
  • the pad is connected directly or indirectly to ground.
  • the pads 300 disposed on the circuit board 330 may be replaced with lead frames.
  • the technical idea of the present invention is not limited to the bio-sensing module 100 and the bio-sensing chip 300 described in the above embodiments, and may be applied to other suitable types of chips, including the storage.
  • the circuit 20, in particular, the memory circuit 20 is an ultraviolet erasable memory, and the electronic device having the chip is in operation, and the user needs to contact or approach the chip.
  • the electrostatic conduction member 40 is formed directly above the storage circuit 20 or across the storage circuit 20, for example, by wire bonding to absorb the user's contact with the chip.
  • the upper side of the ⁇ flows to the static electricity of the storage circuit 20.
  • the chip is, for example, one or more of a capacitive sensor chip, an optical sensor chip, and an ultrasonic sensor chip.
  • FIG. 7 is a perspective view of the electronic device of the present invention.
  • the present invention provides an electronic device 400 comprising the biometric identification chip 300 of any of the above embodiments.
  • the electronic device 400 is a mobile phone.
  • the electronic device 400 of the present invention may be a portable electronic product, a home electronic product, or an in-vehicle electronic product.
  • the electronic device is not limited to the listed electronic products, but may be other suitable electronic products.
  • the portable electronic product is, for example, a mobile terminal, such as a mobile terminal, a tablet computer, a notebook computer, a wearable product, or the like.
  • the home-based electronic products are, for example, smart home locks, televisions, refrigerators, desktop computers, and the like, suitable home-based electronic products.
  • the in-vehicle electronic products are, for example, suitable in-vehicle electronic products such as an in-vehicle display, a driving recorder, a navigator, and a car refrigerator.

Abstract

A biosensing module (100), a biosensing chip (300), and an electronic device (400). The biosensing module (100) comprises a sensing unit (10), a storage circuit (20), and a static electricity conduction member (40). The sensing unit (10) is used for sensing biological information of a target object when the target object is close to or in contact with the unit. The storage circuit (20) is used for storing data. The static electricity conduction member (40) is located above the storage circuit (20), and is used for discharging static electricity. In this way, the storage circuit (20) is prevented from being damaged or destroyed by static electricity; the static electricity conduction member (40) has a simple structure and low material cost. Correspondingly, the biosensing chip (300) provided with the biosensing module (100) as well as the electronic device (400) can also prevent static electricity from damaging or destroying the storage circuit (20); and the static electricity conduction member (40) has a simple structure and low material cost.

Description

发明名称：生物传感模块、 生物传感芯片及电子设备  Title of Invention: Biosensing Module, Biosensing Chip and Electronic Equipment
[0001] 技术领域  [0001] Technical Field
[0002] 本发明涉及生物识别技术领域， 尤其涉及一种生物传感模块、 生物传感芯片、 以及电子设备。  [0002] The present invention relates to the field of biometrics, and in particular, to a biosensor module, a biosensor chip, and an electronic device.
[0003] 背景技术 BACKGROUND
[0004] 目前， 生物传感器件已逐渐成为电子设备、 特别是移动终端的标配。 生物传感 器件， 例如指纹传感器件， 在执行生物信息感测吋， 需要用户接触或接近生物 传感器件， 以便生物传感器件能获得足够强的感测信号。  [0004] Currently, biosensor devices have gradually become standard equipment for electronic devices, particularly mobile terminals. Biosensing devices, such as fingerprint sensor devices, require the user to touch or access the biosensor device after performing biometric sensing so that the biosensor device can obtain a sufficiently strong sensing signal.
[0005] 然而， 在用户接触或接近生物传感器件吋， 人体静电会对生物传感器件中的用 于存储数据的存储电路造成损伤或损毁， 导致生物传感器件识别率降 ί氐或失效  [0005] However, when the user touches or approaches the biosensor device, the human body static electricity may damage or damage the storage circuit for storing data in the biosensor device, resulting in a decrease or failure of the biosensor device identification rate.
[0006] 发明内容 SUMMARY OF THE INVENTION
[0007] 为解决上述技术问题， 本发明提供一种能够防止静电对存储电路造成损伤或损 毁的生物传感模块、 生物传感芯片以及电子设备。  In order to solve the above technical problems, the present invention provides a biosensor module, a biosensor chip, and an electronic device capable of preventing damage or damage to a memory circuit by static electricity.
[0008] 一种生物传感模块， 包括： [0008] A biosensing module comprising:
[0009] 传感单元， 用于感测目标物体接近或接触吋的生物信息；  [0009] a sensing unit, configured to sense biological information that the target object approaches or contacts the defect;
[0010] 存储电路， 用于存储数据； 和 [0010] a storage circuit for storing data; and
[0011] 静电传导件， 设置在存储电路的上方， 用于泄放静电。  [0011] The electrostatic conducting member is disposed above the storage circuit for discharging static electricity.
[0012] 在某些实施方式中， 所述静电传导件全部或部分位于所述存储电路的正上方。  [0012] In some embodiments, the electrostatically conductive member is wholly or partially located directly above the storage circuit.
[0013] 在某些实施方式中， 所述生物传感模块进一步包括焊盘， 所述静电传导件与所 述焊盘连接， 所述静电传导件通过所述焊盘将静电泄放至地。 [0013] In some embodiments, the biosensing module further includes a pad, the electrostatic conduction member is coupled to the pad, and the electrostatic conduction member discharges static electricity to the ground through the pad.
[0014] 在某些实施方式中， 所述生物传感模块进一步包括焊盘， 所述焊盘用于直接或 间接连接到地， 所述静电传导件与所述焊盘连接。 [0014] In some embodiments, the biosensing module further includes a pad for direct or indirect connection to ground, the electrostatic conductive member being coupled to the pad.
[0015] 在某些实施方式中， 所述焊盘包括第一子焊盘和第二子焊盘， 其中， 所述静电 传导件的两端分别与所述第一子焊盘、 所述第二子焊盘电连接。 [0015] In some embodiments, the pad includes a first sub-pad and a second sub-pad, wherein two ends of the electrostatic conductive member and the first sub-pad, respectively The two sub-pads are electrically connected.
[0016] 在某些实施方式中， 所述第一子焊盘和所述第二子焊盘分别设于所述存储电路 的两侧以使所述静电传导件跨过所述存储电路。 [0016] In some embodiments, the first sub-pad and the second sub-pad are respectively disposed on the storage circuit Both sides are such that the electrostatic conduction member straddles the storage circuit.
在某些实施方式中， 所述第一子焊盘和所述第二子焊盘对称设于所述存储电路 的两侧； 或， 所述第一子焊盘和所述第二子焊盘分别设于所述存储电路的对角 在某些实施方式中， 所述第一子焊盘和所述第二子焊盘间隔设于所述存储电路  In some embodiments, the first sub-pad and the second sub-pad are symmetrically disposed on two sides of the storage circuit; or, the first sub-pad and the second sub-pad Provided in the diagonal of the memory circuit, in some embodiments, the first sub-pad and the second sub-pad are spaced apart from the memory circuit
[0019] 在某些实施方式中, 所述静电传导件为导线。 [0019] In some embodiments, the electrostatically conductive member is a wire.
[0020] 在某些实施方式中, 所述静电传导件具有高于所述存储电路的凸起部。  [0020] In some embodiments, the electrostatically conductive member has a raised portion that is higher than the storage circuit.
[0021] 在某些实施方式中, 高于所述存储电路的凸起部通过打线形成。  [0021] In some embodiments, the raised portions above the storage circuit are formed by wire bonding.
[0022] 在某些实施方式中, 所述凸起部呈尖角形或弧形。  [0022] In some embodiments, the raised portion has a pointed shape or an arc shape.
[0023] 在某些实施方式中, 所述静电传导件为一条或多条， 当所述静电传导件为多条 吋， 所述多条静电传导件间隔设置。  [0023] In some embodiments, the electrostatic conductive member is one or more, and when the electrostatic conductive member is a plurality of turns, the plurality of electrostatic conductive members are spaced apart.
[0024] 在某些实施方式中， 所述存储电路为一次性可编程的存储器或多次性可编程的 存储器。  [0024] In some embodiments, the memory circuit is a one-time programmable memory or a multi-time programmable memory.
[0025] 本发明还提供一种生物传感芯片， 所述生物传感芯片包括上述中任意一实施方 式所述的生物传感模块。  [0025] The present invention also provides a biosensor chip comprising the biosensor module of any of the above embodiments.
[0026] 在某些实施方式中， 所述生物传感芯包括指纹传感芯、 血氧传感芯、 心跳传感 芯中的一种或多种。 In some embodiments, the biosensor core comprises one or more of a fingerprint sensing core, a blood oxygen sensing core, and a heartbeat sensing core.
[0027] 在某些实施方式中， 所述生物传感芯片包括生物传感裸片， 所述生物传感裸片 包括所述传感单元、 所述存储电路、 和所述焊盘； 所述生物传感裸片进一步包 括衬底、 第一绝缘层、 和第二绝缘层； 所述存储电路设置在所述衬底上； 所述 第一绝缘层和所述第二绝缘层设置在所述存储电路上； 所述存储电路位于所述 衬底与所述第一绝缘层之间； 所述焊盘设置在第一绝缘层上； 所述第二绝缘层 设置在所述第一绝缘层上， 并在对应焊盘的位置设置有通孔； 所述静电传导件 通过所述通孔与所述焊盘连接。  [0027] In some embodiments, the biosensor chip includes a biosensing die, the biosensing die including the sensing unit, the memory circuit, and the pad; The biosensing die further includes a substrate, a first insulating layer, and a second insulating layer; the memory circuit is disposed on the substrate; the first insulating layer and the second insulating layer are disposed on a storage circuit; the storage circuit is located between the substrate and the first insulating layer; the pad is disposed on the first insulating layer; the second insulating layer is disposed on the first insulating layer And a through hole is disposed at a position corresponding to the pad; the electrostatic conductive member is connected to the pad through the through hole.
[0028] 在某些实施方式中， 所述生物传感芯片进一步包括电路板和封装体， 所述生物 传感裸片设置在所述电路板上， 所述封装体封装所述生物传感裸片和所述静电 传导件于所述生物传感芯片内。 [0029] 在某些实施方式中， 所述焊盘的数量为多个， 所述焊盘或者均设置在所述生物 传感裸片上， 或者， 部分焊盘设置在所述生物传感裸片上， 部分焊盘设置在所 述电路板上。 [0028] In some embodiments, the biosensor chip further includes a circuit board and a package, the biosensing die is disposed on the circuit board, and the package encapsulates the biosensing bare The sheet and the electrostatically conductive member are within the biosensor chip. [0029] In some embodiments, the number of the pads is multiple, the pads are either disposed on the biosensing die, or a portion of the pads are disposed on the biosensing die. A part of the pad is disposed on the circuit board.
[0030] 本发明提供一种电子设备， 其包括上述任意一实施方式所述的生物传感芯片。  [0030] The present invention provides an electronic device comprising the biosensor chip of any of the above embodiments.
[0031] 由于本发明生物传感模块中的静电传导件设置在存储电路上方， 用于泄放静电 [0031] Since the electrostatic conduction member in the biosensor module of the present invention is disposed above the storage circuit for discharging static electricity
, 从而避免静电对所述存储电路造成损伤或损毁， 且该静电传导件结构简单， 材料成本 ί氐。 相应地， 具有生物传感模块的生物传感芯片以及电子设备同样可 避免静电对所述存储电路造成损伤或损毁， 且该静电传导件结构简单， 材料成 本低。  Therefore, the static electricity is damaged or damaged by the static electricity, and the electrostatic conductive member has a simple structure and a material cost. Correspondingly, the biosensor chip and the electronic device having the biosensor module can also avoid damage or damage to the storage circuit caused by static electricity, and the electrostatic conductive member has a simple structure and a low material cost.
[0032] 尽管公幵了多个实施例， 包括其变化， 伹是通过示出并描述了本发明公幵的说 明实施例的下列详细描述， 本发明公幵的其他实施例将对所属领域的技术人员 显而易见。 将认识到， 本发明公幵能够在各种显而易见的方面修改， 所有修改 都不会偏离本发明的精神和范围。 相应地， 附图和详细描述本质上应被视为说 明性的， 而不是限制性的。  [0032] While various embodiments are included, including variations thereof, in the following detailed description of the illustrated embodiments of the present disclosure, other embodiments of the present disclosure will be The technician is obvious. It will be appreciated that the invention may be modified in various obvious forms, and all modifications may be made without departing from the spirit and scope of the invention. The drawings and detailed description are to be regarded as illustrative rather
[0033] 附图说明  BRIEF DESCRIPTION OF THE DRAWINGS
[0034] 通过参照附图详细描述其示例实施方式， 本发明的其它特征及优点将变得更加 明显。  Other features and advantages of the present invention will become more apparent from the detailed description of exemplary embodiments.
[0035] 图 1是本发明生物传感模块一实施例的剖面示意图。  1 is a schematic cross-sectional view showing an embodiment of a biosensor module of the present invention.
[0036] 图 2是本发明生物传感模块另一实施例的剖面示意图。  2 is a schematic cross-sectional view showing another embodiment of the biosensor module of the present invention.
[0037] 图 2a是本发明生物传感模块的焊盘分布方式一实施例的俯视图。  2a is a top plan view of an embodiment of a pad distribution mode of the biosensor module of the present invention.
[0038] 图 2b是本发明生物传感模块的焊盘分布方式另一实施例的俯视图。  2b is a top plan view of another embodiment of a pad distribution pattern of the biosensor module of the present invention.
[0039] 图 2c是本发明生物传感模块的焊盘分布方式另一实施例的俯视图。  2c is a top plan view of another embodiment of a pad distribution pattern of the biosensor module of the present invention.
[0040] 图 2d是本发明生物传感模块的焊盘分布方式另一实施例的俯视图。  2d is a top plan view of another embodiment of a pad distribution manner of the biosensor module of the present invention.
[0041] 图 3是本发明生物传感模块另一实施例的剖面示意图。  3 is a schematic cross-sectional view showing another embodiment of the biosensor module of the present invention.
[0042] 图 3a是本发明生物传感模块的静电传导件设置方式的一实施例的俯视图。  [0042] FIG. 3a is a top plan view of an embodiment of an electrostatic conduction member of the biosensor module of the present invention.
[0043] 图 3b是本发明生物传感模块的静电传导件设置的另一实施例的俯视图。  [0043] FIG. 3b is a top plan view of another embodiment of an electrostatic conduction member arrangement of the biosensing module of the present invention.
[0044] 图 4是本发明生物传感芯片的一实施例的剖面示意图。  4 is a schematic cross-sectional view showing an embodiment of a biosensor chip of the present invention.
[0045] 图 5是本发明生物传感芯片的另一实施例的剖面示意图。 [0046] 图 6是本发明生物传感芯片的又一实施例的剖面示意图。 5 is a schematic cross-sectional view showing another embodiment of the biosensor chip of the present invention. 6 is a cross-sectional view showing still another embodiment of the biosensor chip of the present invention.
[0047] 图 7是本发明电子设备的立体图。 7 is a perspective view of an electronic device of the present invention.
[0048] 具体实施方式 DETAILED DESCRIPTION
[0049] 现在将参考附图更全面地描述示例实施方式。 然而， 示例实施方式能够以多种 形式实施， 且不应被理解为限于在此阐述的实施方式。 相反， 提供这些实施方 式使得本发明将全面和完整， 并将示例实施方式的构思全面地传达给本领域的 技术人员。 为了方便或清楚， 可能夸大、 省略或示意地示出在附图中所示的每 层的厚度和大小和示意地示出相关元件的数量。 然而， 附图中元件的大小不完 全反映实际大小， 以及相关元件的数量不完全反应实际数量。 在附图中相同的 附图标记表示相同或类似的结构。 附图中用虚线表示的部件为实体内部的部件 , 本发明为方便描述对应的技术方案而将其画出， 实际上该虚线部件从外观看 为看不到的部件。  Example embodiments will now be described more fully with reference to the appended drawings. However, the example embodiments can be embodied in many forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, The thickness and size of each layer shown in the drawings may be exaggerated, omitted or schematically illustrated and the number of related elements may be schematically illustrated for convenience or clarity. However, the size of the elements in the drawings does not fully reflect the actual size, and the number of related components does not fully reflect the actual number. The same reference numerals in the drawings denote the same or similar structures. The components indicated by broken lines in the drawings are components inside the solid body, and the present invention is drawn to facilitate the description of the corresponding technical solution, and actually the dotted line component is seen as an invisible component from the outside.
[0050] 在本发明的描述中， 需要理解的是： "多个 "定义为两个和两个以上， 除非另 有明确具体的限定， 对应地， 该定义适用于 "多种"、 "多条 "等术语。 "连接 "可 为电连接、 机械连接、 耦接、 直接连接以及间接连接等多种实施方式， 除非本 发明下述特别说明， 否则并不做特别限制。 另外， 各元件名称中出现的"第一" 、 "第二"等词语并不是限定元件出现的先后顺序， 而是为方便元件命名， 清楚 区分各元件， 使得描述更简洁。  [0050] In the description of the present invention, it is to be understood that "a plurality" is defined as two or more, unless explicitly and specifically defined, correspondingly, the definition applies to "multiple", "multiple" Article "and other terms. The "connection" may be a plurality of embodiments such as an electrical connection, a mechanical connection, a coupling, a direct connection, and an indirect connection, and is not particularly limited unless specifically described below. In addition, the words "first" and "second" appearing in each component name are not intended to limit the order in which the components appear, but to facilitate the naming of the components and to clearly distinguish the components, so that the description is more concise.
[0051] 在本发明中， 术语"厚度"、 "上"、 "下"、 "前"、 "后"、 "左"、 "右"、 "竖直"、 "水平"、 "顶"、 "底"、 "内"、 "外"等指示的方位或位置关系为基于附图所示的 方位或位置关系， 仅是为了便于描述本发明和简化描述， 而不是指示或暗示所 指的装置或元件必须具有特定的方位、 以特定的方位构造和操作， 因此不能理 解为对本发明的限制。  [0051] In the present invention, the terms "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", The orientation or positional relationship of the "bottom", "inside", "outside" and the like is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the indicated device. Or the components must have a particular orientation, are constructed and operated in a particular orientation, and are therefore not to be construed as limiting the invention.
[0052] 此外， 所描述的特征、 结构可以以任 1可合适的方式结合在一个或更多实施方 式中。 在下面的描述中， 提供许多具体细节从而给出对本发明的实施方式的充 分理解。 然而， 本领域技术人员应意识到， 没有所述特定细节中的一个或更多 , 或者采用其它的结构、 组元等， 也可以实践本发明的技术方案。 在其它情况 下， 不详细示出或描述公知结构或者操作以避免模糊本发明。 [0053] 本发明提供的生物传感模块用于感测目标物体输入的生物信息。 较佳地， 所述 生物传感模块全部形成在一生物传感芯片 (Chip)中。 具体地， 所述生物传感芯片 包括生物传感裸片 (Die)和静电传导件。 所述生物传感裸片包括存储电路， 所述 存储电路用于存储数据。 所述数据例如为所述生物传感芯片中的电路的初始化 数据、 产品的型号等等。 所述静电传导件部分或全部位于所述生物传感裸片上 。 较佳地， 所述静电传导件位于所述存储电路的正上方， 在存储电路的上方形 成凸起部或尖端， 并直接或间接连接至地， 以泄放静电。 Furthermore, the described features, structures may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are set forth However, those skilled in the art will appreciate that the technical solution of the present invention may be practiced without one or more of the specific details or other structures, components, and the like. In other instances, well-known structures or operations are not shown or described in detail to avoid obscuring the invention. [0053] The biosensor module provided by the present invention is used to sense biological information input by a target object. Preferably, the biosensor modules are all formed in a biosensor chip. Specifically, the biosensor chip includes a biosensing die (Die) and an electrostatic conducting member. The biosensing die includes a memory circuit for storing data. The data is, for example, initialization data of a circuit in the biosensor chip, a model number of the product, and the like. The electrostatically conductive member is partially or wholly located on the biosensing die. Preferably, the electrostatic conducting member is located directly above the storage circuit, and a protrusion or a tip is formed above the storage circuit and directly or indirectly connected to the ground to discharge static electricity.
[0054] 进一步地， 所述生物传感芯片进一步包括封装体， 用于封装所述生物传感裸片 和静电传导件。 所述静电传导件位于所述生物传感裸片与所述封装体之间。 所 述封装体填充所述静电传导件与所述生物传感裸片之间的间隙。  [0054] Further, the biosensor chip further includes a package for encapsulating the biosensing die and the electrostatic conductive member. The electrostatic conducting member is located between the biosensing die and the package. The package fills a gap between the electrostatic conduction member and the biosensing die.
[0055] 所述封装体的一侧表面为生物传感芯片接收用户输入的一侧表面， 定义所述封 装体接收用户输入的一侧表面为感测面。 所述静电传导件相较于所述存储电路 更接近所述感测面。 当用户接近或接触所述感测面吋， 所述静电传导件泄放用 户静电， 防止静电对存储电路造成损伤或损毁。  [0055] One side surface of the package body is a side surface of the biosensor chip receiving the user input, and a surface defining the side of the package body receiving the user input is a sensing surface. The electrostatically conductive member is closer to the sensing surface than the memory circuit. When the user approaches or contacts the sensing surface, the electrostatic conducting member discharges static electricity to the user to prevent damage or damage to the storage circuit caused by static electricity.
[0056] 所述静电传导件例如为导线， 所述凸起部或尖端为通过打线形成。 然， 所述静 电传导件并不局限于此处所述的导线， 也可为其它形状的导电元件。  [0056] The electrostatic conduction member is, for example, a wire, and the convex portion or the tip end is formed by wire bonding. However, the static conductive member is not limited to the wires described herein, but may be other shapes of conductive members.
[0057] 所述存储电路例如为紫外线可擦除的存储器。 所述紫外线可擦除的存储器例如 为一次性可编程（One Time Program, OTP)存储器或 /和多次性可编程 (Multi Time Program, MTP)存储器。 然， 并不局限于此， 所述存储电路也可为其它合 适类型的存储器。 所述紫外线可擦除的存储器为其它合适类型的存储器。  [0057] The storage circuit is, for example, an ultraviolet erasable memory. The ultraviolet erasable memory is, for example, a One Time Program (OTP) memory or/and a Multi Time Program (MTP) memory. However, it is not limited thereto, and the storage circuit may be other suitable types of memory. The ultraviolet erasable memory is another suitable type of memory.
[0058] 在本发明中， 以生物传感芯片为指纹传感芯片 (Chip)为例， 存储电路一般被设 置在指纹传感芯片的指纹传感裸片 (Die)中， 为了防止静电对存储电路造成损伤 或损毁， 指纹传感芯片在对应存储电路的位置上方设置静电传导件， 以吸收流 向存储电路的静电。 其中， 所述静电传导件例如为金属导电元件， 然， 不局限 于金属导电元件。  [0058] In the present invention, taking the biosensor chip as a fingerprint sensing chip (Chip) as an example, the storage circuit is generally disposed in the fingerprint sensing die (Die) of the fingerprint sensing chip, in order to prevent static electricity from being stored. The circuit causes damage or damage, and the fingerprint sensing chip is provided with an electrostatic conducting member above the position corresponding to the storage circuit to absorb static electricity flowing to the storage circuit. Wherein, the electrostatic conductive member is, for example, a metal conductive member, and is not limited to the metal conductive member.
[0059] 尤其地， 对于存储电路为紫外线 (Ultraviolet Rays)可擦除的存储器， 此处以 [0059] In particular, for the memory circuit is an ultraviolet (Ultraviolet Rays) erasable memory, here
OTP存储器为例进行说明， 在指纹传感裸片流片回来之后， 在被封装成指纹传 感芯片之前， 需要对指纹传感裸片进行测试， 其中， 需要对 OTP存储器写入数 据来测试其的好坏， 当测试 OTP存储器为合格的产品之后， 利用紫外线擦除之 前测试吋写入 OTP存储器的数据。 由于在对指纹传感裸片进行测试吋， 需要紫 外线对 OTP存储器进行擦除， 因此， 指纹传感裸片本身在对应 OTP存储器的位 置上方不能设置有金属元件。 The OTP memory is described as an example. After the fingerprint sensing die is returned, the fingerprint sensing die needs to be tested before being packaged into the fingerprint sensing chip, wherein the number of OTP memory writes needs to be written. According to the test of its good or bad, after testing the OTP memory as a qualified product, the data written to the OTP memory is tested before being erased by ultraviolet rays. Since the fingerprint sensing die is tested, ultraviolet light is required to erase the OTP memory. Therefore, the fingerprint sensing die itself cannot be provided with a metal component above the position corresponding to the OTP memory.
[0060] 当所述指纹传感裸片封装成为指纹传感芯片 (需要说明的是， 该处所说的指纹 传感芯片中并未设置所述静电传导件)后， 当用户接近或接触所述指纹传感芯片 进行指纹信息感测吋， 所述 OTP存储器上方由于并未有金属元件的遮挡而较易 受到人体静电造成的损伤或损毁， 从而导致所述指纹传感芯片报废。  [0060] when the fingerprint sensing die package is a fingerprint sensing chip (it is required that the electrostatic conductive member is not disposed in the fingerprint sensing chip), when the user approaches or contacts the After the fingerprint sensor chip performs fingerprint information sensing, the top of the OTP memory is more susceptible to damage or damage caused by static electricity of the human body due to the absence of shielding of the metal component, thereby causing the fingerprint sensing chip to be scrapped.
[0061] 针对上述技术问题， 本发明提出在当指纹传感裸片被测试合格之后， 在封装指 纹传感裸片为指纹传感芯片吋， 在指纹传感裸片上方形成静电传导件。 较佳地 [0061] In view of the above technical problem, the present invention proposes that after the fingerprint sensing die is tested, the encapsulating fingerprint sensing die is a fingerprint sensing chip, and an electrostatic conducting member is formed above the fingerprint sensing die. Preferably
, 所述静电传导件位于 OTP存储器的正上方或者跨过 OTP存储器。 接下来， 利 用封装体封装所述静电传导件和所述生物传感裸片于一体中， 形成生物传感芯 片。 从而， 当用户接触或接近具有静电传导件的生物传感芯片吋， 静电传导件 会吸收用户引入的流向 OTP存储器的静电， 从而防止静电对 OTP存储器造成损 伤或损毁。 The electrostatic conducting member is located directly above the OTP memory or across the OTP memory. Next, the electrostatic conductive member and the biosensing die are packaged in a package to form a biosensor chip. Thus, when the user touches or approaches the biosensor chip having the electrostatic conducting member, the electrostatic conducting member absorbs static electricity introduced by the user to the OTP memory, thereby preventing static electricity from damaging or damaging the OTP memory.
[0062] 在一具体实施方式中， 所述导线的两端均形成在所述生物传感裸片上。  [0062] In a specific embodiment, both ends of the wire are formed on the biosensing die.
[0063] 在又一具体实施方式中， 所述导线的两端中的一端形成在所述生物传感裸片上  [0063] In still another embodiment, one end of the two ends of the wire is formed on the biosensing die
, 另一端形成在所述生物传感裸片的一侧。  The other end is formed on one side of the biosensing die.
[0064] 在又一具体实施方式中， 所述导线的两端分别形成在所述生物传感裸片的两侧 。 较佳地， 所述导线的两端分别形成在所述生物传感裸片的相对两侧。 即， 所 述导线跨过所述生物传感裸片。  In another embodiment, both ends of the wire are respectively formed on both sides of the biosensing die. Preferably, two ends of the wire are respectively formed on opposite sides of the biosensing die. That is, the wire spans the biosensing die.
[0065] 需要说明的是， 当导线的一端或两端形成在生物传感裸片的一侧或两侧吋， 所 述导线的一端或两端并不是形成在所述生物传感裸片上。 例如， 当生物传感芯 片采用球栅阵列封装 (Ball Grid Array Package,简称 BGA)吋， 所述生物传感芯 片进一步包括一电路板， 所述生物传感裸片与所述静电传导件形成在所述电路 板与所述封装体之间。 所述导线的一端或两端可形成所述电路板上。  [0065] It should be noted that when one or both ends of the wire are formed on one side or both sides of the biosensing die, one or both ends of the wire are not formed on the biosensing die. For example, when the biosensor chip uses a Ball Grid Array Package (BGA), the biosensor chip further includes a circuit board, and the biosensing die is formed on the electrostatic conductive member. Between the circuit board and the package. One or both ends of the wire may form the circuit board.
[0066] 由于生物传感芯片的封装方式有多种， 例如， 方形扁平无引脚封装 (Quad Flat No-lead Package，简称 QFN) , 对应地， 所述生物传感芯片可不包括所述电路板 , 而是在生物传感裸片周围形成有引线框 (Frame)。 [0066] Since the biosensor chip has various packaging methods, for example, a Quad Flat No-lead Package (QFN), correspondingly, the biosensor chip may not include the circuit board. Instead, a lead frame (Fram e ) is formed around the biosensing die.
[0067] 所述生物传感模块包括指纹传感模块、 血氧传感模块、 心跳传感模块、 压力传 感模块、 湿度传感模块、 温度传感模块、 虹膜传感模块中的一种或多种。 相应 地， 所述生物信息包括指纹信息、 血氧信息、 心跳信息、 压力信息、 湿度信息[0067] the biosensor module includes one of a fingerprint sensing module, a blood oxygen sensing module, a heartbeat sensing module, a pressure sensing module, a humidity sensing module, a temperature sensing module, and an iris sensing module. A variety. Correspondingly, the biological information includes fingerprint information, blood oxygen information, heartbeat information, pressure information, and humidity information.
、 温度信息、 虹膜信息中的一种或多种。 One or more of temperature information, iris information.
[0068] 所述目标物体如为用户的手指， 也可为用户身体的其它部分， 如眼睛、 心跳、 手掌、 脚趾、 耳朵等， 或者为前述用户身体上的任意几部分的组合， 甚至也可 为其它合适类型的物体， 而并不局限为人体。 [0068] The target object, such as a user's finger, may also be other parts of the user's body, such as eyes, heartbeat, palms, toes, ears, etc., or a combination of any part of the aforementioned user's body, or even For other suitable types of objects, it is not limited to the human body.
[0069] 可变更地， 所述生物传感模块也可为部分形成在生物传感芯片中， 部分形成在 生物传感芯片外。 [0069] Alternatively, the biosensor module may be partially formed in the biosensor chip and partially formed outside the biosensor chip.
[0070] 下面， 请结合附图， 来进一步具体理解本发明。 [0070] Hereinafter, the present invention will be further specifically understood in conjunction with the accompanying drawings.
[0071] 请参阅图 1 , 图 1是本发明生物传感模块一实施例的剖面示意图。 所述生物传感 模块 100包括传感单元 10、 存储电路 20、 焊盘 30、 以及静电传导件 40。  Please refer to FIG. 1. FIG. 1 is a schematic cross-sectional view showing an embodiment of a biosensor module of the present invention. The biosensor module 100 includes a sensing unit 10, a storage circuit 20, a pad 30, and an electrostatic conduction member 40.
[0072] 所述传感单元 10用于感测目标物体接近或接触吋的生物信息。 所述存储电路 20 用于存储数据。 所述数据例如包括生物传感模块 100的电路的初始化数据、 产品 型号等等。 所述焊盘 30用于直接或间接连接至地。 所述焊盘 30例如位于所述存 储电路 20的周围， 也可位于所述存储电路 20的上方。 在本实施方式中， 所述焊 盘 30设于所述存储电路 20的上方， 位于所述存储电路 20的外侧。 所述静电传导 件 40与所述焊盘 30连接。 所述静电传导件 10用于泄放静电至地。 所述地例如为 应用所述生物传感模块 100的电子设备 400(见图 7)的***地或设备地， 通常加载 为 0V (伏)电压。 所述焊盘 30间接接地吋， 例如可通过调制电路接地， 或者通过 供电电源接地等。  [0072] The sensing unit 10 is configured to sense biological information that the target object approaches or contacts the sputum. The storage circuit 20 is for storing data. The data includes, for example, initialization data of a circuit of the biosensor module 100, a product model, and the like. The pad 30 is used to connect directly or indirectly to ground. The pad 30 is located, for example, around the memory circuit 20, and may also be located above the memory circuit 20. In the present embodiment, the pad 30 is disposed above the memory circuit 20 and outside the memory circuit 20. The electrostatic conduction member 40 is connected to the pad 30. The electrostatic conduction member 10 is for discharging static electricity to the ground. The ground or device ground, such as the electronic device 400 (see Figure 7) to which the biosensing module 100 is applied, is typically loaded with a voltage of 0 volts. The pad 30 is indirectly grounded, for example, by a modulation circuit grounded, or by a power supply ground.
[0073] 所述静电传导件 40的延伸方式不局限于如图 1所示： 在电连接焊盘 30后由所述 焊盘 30往所述存储电路 20上方延伸， 所述静电传导件 40的延伸方式还可为在电 连接焊盘 30后由所述焊盘 30垂直向上延伸。 另外， 所述静电传导件 40的延伸方 式也可为其它合适的延伸方式。  [0073] The manner of extending the electrostatic conducting member 40 is not limited to that shown in FIG. 1 : after the electrical connection pad 30 extends from the pad 30 to the storage circuit 20 , the electrostatic conducting member 40 The extension may also be such that the pads 30 extend vertically upward after the electrical connection pads 30. In addition, the extension of the electrostatic conducting member 40 can also be other suitable extensions.
[0074] 所述静电传导件 40为导线， 所述导线为金属线， 该金属线的材料例如为金、 铜 或铝等， 当然， 还可以为其它合适的材料。 所述导线结构简单， 材料用量少， 减少材料成本。 另外， 所述静电传导件 40也并局限为导线， 也可为其它合适形 状的导电元件。 [0074] The electrostatic conductive member 40 is a wire, and the wire is a metal wire. The material of the metal wire is, for example, gold, copper or aluminum. Of course, other suitable materials may also be used. The wire has a simple structure and a small amount of materials. Reduce material costs. In addition, the electrostatic conducting member 40 is also limited to a wire, and may also be other suitable shapes of conductive elements.
[0075] 进一步地， 所述导线具有高于所述存储电路 20的凸起部 41。 该高于所述存储电 路 20的凸起部 41通过打线形成。 所述凸起部 41呈尖角形或弧形， 以利用避雷针 原理弓 I导用户向所述凸起部 41释放静电， 然后通过所述焊盘 30将该静电弓 I进地 端， 从而防止静电对所述存储电路 20造成损伤或损毁。  Further, the wire has a raised portion 41 higher than the storage circuit 20. The raised portion 41 higher than the storage circuit 20 is formed by wire bonding. The convex portion 41 has a pointed shape or an arc shape to guide the user to discharge static electricity to the convex portion 41 by using a lightning rod principle, and then the electrostatic arch I is grounded through the pad 30 to prevent static electricity. Damage or damage to the storage circuit 20.
[0076] 所述焊盘 30可以为一个或多个。 所述焊盘 30的材料例如包括铝、 铜、 金、 银、 铂、 钯、 镍等中的一种或两种以上。 当然， 所述焊盘 30材料还可以为其它合适 的材料。  [0076] The pads 30 may be one or more. The material of the pad 30 includes, for example, one or more of aluminum, copper, gold, silver, platinum, palladium, nickel, and the like. Of course, the pad 30 material may also be other suitable materials.
[0077] 在本实施方式中， 所述存储电路 20为紫外线 (Ultraviolet Rays)可擦除的存储器 。 所述紫外线可擦除的存储器例如为一次性可编程（One Time Program, OTP) 存储器或 /和多次性可编程 (MuW Time Program, MTP)存储器。 然， 并不局限于 此， 所述存储电路 20也可为其它合适类型的存储器。 所述紫外线可擦除的存储 器为其它合适类型的存储器。  In the present embodiment, the memory circuit 20 is an ultraviolet (Ultraviolet Rays) erasable memory. The ultraviolet erasable memory is, for example, a One Time Program (OTP) memory or/and a Multi-Mode Programmable (MTP) memory. However, it is not limited thereto, and the storage circuit 20 may be other suitable types of memories. The ultraviolet erasable memory is another suitable type of memory.
[0078] 所述生物传感模块 100可进一步包括第一绝缘层 50, 该第一绝缘层 50设置在所 述存储电路 20和传感单元 10的上方。 所述焊盘 30设于第一绝缘层 50的上方。 然 , 在其它实施方式中， 所述第一绝缘层 50也可设置在所述存储电路 20和传感单 元 10中之一者的上方。 又或者， 所述第一绝缘层 50省略， 所述焊盘 30设置在存 储电路 20的周围。 [0078] The biosensor module 100 may further include a first insulating layer 50 disposed above the memory circuit 20 and the sensing unit 10. The pad 30 is disposed above the first insulating layer 50. However, in other embodiments, the first insulating layer 50 may also be disposed above one of the memory circuit 20 and the sensing unit 10. Still alternatively, the first insulating layer 50 is omitted, and the pad 30 is disposed around the memory circuit 20.
[0079] 请一并参阅图 2-图 2d, 图 2是本发明生物传感模块另一实施例的剖面示意图。  Please refer to FIG. 2 to FIG. 2d together. FIG. 2 is a schematic cross-sectional view showing another embodiment of the biosensor module of the present invention.
图 2a是本发明生物传感模块的焊盘分布方式一实施例的俯视图。 图 2b是本发明 生物传感模块的焊盘分布方式另一实施例的俯视图。 图 2c是本发明生物传感模 块的焊盘分布方式另一实施例的俯视图。 图 2d是本发明生物传感模块的焊盘分 布方式另一实施例的俯视图。  Fig. 2a is a plan view showing an embodiment of a pad distribution mode of the biosensor module of the present invention. Figure 2b is a top plan view of another embodiment of the pad distribution of the biosensor module of the present invention. Figure 2c is a top plan view of another embodiment of the pad distribution pattern of the biosensing module of the present invention. Fig. 2d is a plan view showing another embodiment of the pad distribution method of the biosensor module of the present invention.
[0080] 如图 2所示， 所述焊盘 30包括设置在所述存储电路 20的周围的第一子焊盘 31和 第二子焊盘 32, 以用于接收接地信号。 所述静电传导件 40的两端分别与所述第 一子焊盘 31、 所述第二子焊盘 32电连接。  As shown in FIG. 2, the pad 30 includes a first sub-pad 31 and a second sub-pad 32 disposed around the memory circuit 20 for receiving a ground signal. Both ends of the electrostatic conduction member 40 are electrically connected to the first sub-pad 31 and the second sub-pad 32, respectively.
[0081] 所述第一子焊盘 31、 所述第二子焊盘 32用于接地的方式可以是所述第一子焊盘 31、 所述第二子焊盘 32中的一者或两者直接作为接地端， 也可以是所述第一子 焊盘 31、 所述第二子焊盘 32中的一者或两者与所述存储电路 20或所述传感单元 1 0的接地端电连接， 还可以是所述第一子焊盘 31、 所述第二子焊盘 32中的一者或 两者与***地电连接。 本发明所述第一子焊盘 31、 所述第二子焊盘 32的接地方 式并不局限此处所列接地的方式， 还可为其它合适的接地的方式。 [0081] The manner in which the first sub-pad 31 and the second sub-pad 32 are used for grounding may be the first sub-pad 31. One or both of the second sub-pads 32 directly serve as a ground terminal, or may be one or both of the first sub-pad 31 and the second sub-pad 32. The storage circuit 20 or the grounding end of the sensing unit 10 is electrically connected, and may also be one of the first sub-pad 31 and the second sub-pad 32 or both. connection. The grounding manner of the first sub-pad 31 and the second sub-pad 32 of the present invention is not limited to the manner of grounding listed herein, and may be other suitable grounding methods.
[0082] 所述第一子焊盘 31和所述第二子焊盘 32分别设于所述存储电路 20的任意两侧以 使所述静电传导件 40跨过所述存储电路 20的上方， 例如， 所述第一子焊盘 31和 所述第二子焊盘 32分别设于所述存储电路 20相邻的两侧或相对的两侧等。 举例 地， 如图 2a所示， 所述第一子焊盘 31和所述第二子焊盘 32分别设于所述存储电 路 20相邻的两侧以使所述静电传导件 40跨过所述存储电路 20。 如图 2b所示， 所 述第一子焊盘 31和所述第二子焊盘 32对称设于所述存储电路 20的两侧以使所述 静电传导件 40横跨所述存储电路 20。  [0082] The first sub-pad 31 and the second sub-pad 32 are respectively disposed on any two sides of the storage circuit 20 such that the electrostatic conduction member 40 straddles the storage circuit 20, For example, the first sub-pad 31 and the second sub-pad 32 are respectively disposed on two sides or opposite sides of the storage circuit 20 and the like. For example, as shown in FIG. 2a, the first sub-pad 31 and the second sub-pad 32 are respectively disposed on two adjacent sides of the storage circuit 20 to cause the electrostatic conduction member 40 to cross The storage circuit 20 is described. As shown in FIG. 2b, the first sub-pad 31 and the second sub-pad 32 are symmetrically disposed on both sides of the memory circuit 20 to cause the electrostatic conduction member 40 to straddle the memory circuit 20.
[0083] 如图 2c所示， 可变更地， 所述第一子焊盘 31和所述第二子焊盘 32还可以分别设 于所述存储电路 20的对角。  [0083] As shown in FIG. 2c, the first sub-pad 31 and the second sub-pad 32 may be respectively disposed at opposite corners of the memory circuit 20.
[0084] 如图 2d所示， 可变更地， 所述第一子焊盘 31和所述第二子焊盘 32也可以间隔设 于所述存储电路 20的一侧， 无需分别设于所述存储电路 20的两侧。  [0084] As shown in FIG. 2d, the first sub-pad 31 and the second sub-pad 32 may be spaced apart from one side of the memory circuit 20, and need not be separately disposed in the Both sides of the storage circuit 20.
[0085] 可变更地， 在其它实施例中， 也可以将所述第一子焊盘 31设于所述存储电路 20 中的一角， 所述第二子焊盘 32设于所述存储电路 20的一侧。 在图 2、 图 2b、 图 2c 中， 所述第一子焊盘 31设于所述存储电路 20与所述传感单元 10之间， 可变更地 , 在其它实施例中， 所述第一子焊盘 31也可设置在正对所述存储电路 20或所述 传感单元 10的上方。  [0085] Alternatively, in other embodiments, the first sub-pad 31 may be disposed at a corner of the storage circuit 20, and the second sub-pad 32 may be disposed at the storage circuit 20. One side. In FIG. 2, FIG. 2b, and FIG. 2c, the first sub-pad 31 is disposed between the memory circuit 20 and the sensing unit 10, and may be modified. In other embodiments, the first sub-pad 31 The sub-pad 31 may also be disposed above the memory circuit 20 or the sensing unit 10.
[0086] 本发明的所述第一子焊盘 31、 所述第二子焊盘 32的分布方式并不局限上述的分 布方式， 还可为其它合适的分布方式， 例如每两个或三个电路的两侧分别设置 所述第一子焊盘 31和所述第二子焊盘 32。 对应地， 所述两个或三个电路均对应 设置一条静电导电件 40以分别与所述第一子焊盘 31和所述第二子焊盘 32。  [0086] The distribution manner of the first sub-pad 31 and the second sub-pad 32 of the present invention is not limited to the above-mentioned distribution manner, and may be other suitable distribution manners, for example, every two or three. The first sub-pad 31 and the second sub-pad 32 are respectively disposed on both sides of the circuit. Correspondingly, the two or three circuits are respectively provided with an electrostatic conducting member 40 to respectively correspond to the first sub-pad 31 and the second sub-pad 32.
[0087] 需要说明的是， 生物传感模块 100、 所述存储电路 20以及所述传感单元 10的轮 廓不局限为在图 2a-图 2d中所示的长方形， 其也可以为正方形、 六边形、 八边形 等规则的形状， 还可以是不规则的形状或其它合适的形状。 另外， 所述第一子 焊盘 31、 所述第二子焊盘 32也不局限图 2a-图 2d中所示的圆形， 也可以是正方形[0087] It should be noted that the contours of the biosensor module 100, the storage circuit 20, and the sensing unit 10 are not limited to the rectangles shown in FIG. 2a to FIG. 2d, and may also be square, six. A regular shape such as a side shape, an octagonal shape, or the like may also be an irregular shape or other suitable shape. In addition, the first child The pad 31 and the second sub-pad 32 are also not limited to the circular shape shown in FIGS. 2a to 2d, and may also be square.
、 长方形等规则的形状， 还可以是不规则的形状或其它合适的形状。 Regular shapes such as rectangles may also be irregular shapes or other suitable shapes.
[0088] 请一并参阅图 3-图 3b, 图 3是本发明生物传感模块另一实施例的剖面示意图。 [0088] Please refer to FIG. 3 to FIG. 3b together. FIG. 3 is a schematic cross-sectional view showing another embodiment of the biosensor module of the present invention.
图 3a是本发明生物传感模块的静电传导件设置方式的一实施例的俯视图。 图 3b 是本发明生物传感模块的静电传导件设置的另一实施例的俯视图。  Fig. 3a is a plan view showing an embodiment of an electrostatic conduction member of the biosensor module of the present invention. Figure 3b is a top plan view of another embodiment of an electrostatic conduction member arrangement of a biosensing module of the present invention.
[0089] 所述静电传导件 40可以为一条或多条。 当所述静电传导件 40为多条吋， 所述 多条静电传导件 40间隔设置。 该间隔可以是垂直面上的间隔， 也可以是水平面 上的间隔。 举例地， 如图 3为多条静电传导件 40在垂直面的投影形成间隔设置； 如图 3a为多条静电传导件 40在水平面的投影形成间隔设置。 需要说明的是， 图 3 中的每条所述静电传导件 40相对所述存储电路 20的高度不同， 然而， 其形状、 大小可以相同， 当然也可以不相同。 图 3a中的每条所述静电传导件 40在水平面 上投影的长度相同， 然而， 其实际长度、 形状、 大小、 高度可以是相同， 也可 以是不相同。 [0089] The electrostatic conduction member 40 may be one or more. When the electrostatic conductive member 40 is a plurality of turns, the plurality of electrostatic conductive members 40 are spaced apart. The interval may be an interval on a vertical plane or an interval on a horizontal plane. For example, as shown in FIG. 3, the projections of the plurality of electrostatic conductive members 40 on the vertical plane are spaced apart; as shown in FIG. 3a, the projections of the plurality of electrostatic conductive members 40 in the horizontal plane are spaced apart. It should be noted that each of the electrostatic conductive members 40 in FIG. 3 has a different height from the storage circuit 20, however, the shape and size thereof may be the same, and may of course be different. Each of the electrostatic conductive members 40 in Fig. 3a has the same length projected on a horizontal plane, however, the actual length, shape, size, and height may be the same or different.
[0090] 所述多条静电传导件 40可呈阵列式排布， 如矩阵式排布。 当然， 也可呈其它规 则方式或非规则方式排布。 然而， 可变更地， 如图 3b所示， 所述多条静电传导 件 40还可以交错设置。  [0090] The plurality of electrostatic conducting members 40 may be arranged in an array, such as a matrix arrangement. Of course, it can also be arranged in other rules or irregular ways. However, as can be modified, as shown in Fig. 3b, the plurality of electrostatic conducting members 40 can also be staggered.
[0091] 需要说明的是， 图 3-3b中的所述静电传导件 40仅仅画两条作为举例， 实际中多 条静电传导件 40并不局限两条， 也可以是两条以上。 相应地， 第一子焊盘 31和 第二子焊盘 32的数量对应增加。 另外， 本发明所述静电传导件 40设置方式也并 不局限上述的设置方式， 还可为其它合适的设置方式。  [0091] It should be noted that the electrostatic conducting member 40 in FIG. 3-3b is only two examples. In practice, the plurality of electrostatic conducting members 40 are not limited to two, and may be two or more. Accordingly, the number of the first sub-pad 31 and the second sub-pad 32 is correspondingly increased. In addition, the manner in which the electrostatic conducting member 40 of the present invention is disposed is not limited to the above-described arrangement, and may be other suitable arrangements.
[0092] 请一并参阅图 2和图 4, 图 4是本发明生物传感芯片的剖面示意图。 本发明提供 一种生物传感芯片 300。 所述生物传感芯片 300包括上述实施方式的生物传感模 块 100。  [0092] Please refer to FIG. 2 and FIG. 4 together. FIG. 4 is a schematic cross-sectional view of the biosensor chip of the present invention. The present invention provides a biosensor chip 300. The biosensor chip 300 includes the biosensor module 100 of the above embodiment.
[0093] 所述生物传感芯片 300包括生物传感裸片 200和所述静电传导件 40。 所述静电传 导件 40设置在所述生物传感裸片 200上。  [0193] The biosensor chip 300 includes a biosensing die 200 and the electrostatic conduction member 40. The electrostatically conductive member 40 is disposed on the biosensing die 200.
[0094] 所述生物传感裸片 200包括存储电路 20。 较佳地， 所述静电传导件 40部分或全 部设置在所述存储电路 20的正上方， 用于泄放静电至地。 [0094] The biosensing die 200 includes a memory circuit 20. Preferably, the electrostatic conducting member 40 is partially or entirely disposed directly above the storage circuit 20 for discharging static electricity to the ground.
[0095] 所述生物传感裸片 200进一步包括衬底 310、 传感单元 10、 第一绝缘层 50、 第二 绝缘层 60、 和焊盘 30。 所述存储电路 20设置在所述衬底 310上。 所述第一绝缘层 50和所述第二绝缘层 60设置在所述存储电路 20上。 所述存储电路 20位于所述衬 底 310与所述第一绝缘层 50之间。 所述焊盘 30设置在第一绝缘层 50上。 所述第二 绝缘层 60设置在所述第一绝缘层 50上， 并在对应焊盘 30的位置设置有通孔 H。 所 述静电传导件 40通过所述通孔 H与所述焊盘 30连接。 所述衬底 310例如为半导体 衬底， 所述半导体衬底如为硅衬底。 所述衬底 310例如也可为其它合适类型的衬 底， 例如为绝缘衬底。 [0095] The biosensing die 200 further includes a substrate 310, a sensing unit 10, a first insulating layer 50, and a second The insulating layer 60, and the pad 30. The memory circuit 20 is disposed on the substrate 310. The first insulating layer 50 and the second insulating layer 60 are disposed on the memory circuit 20. The memory circuit 20 is located between the substrate 310 and the first insulating layer 50. The pad 30 is disposed on the first insulating layer 50. The second insulating layer 60 is disposed on the first insulating layer 50, and is provided with a through hole H at a position corresponding to the pad 30. The electrostatic conduction member 40 is connected to the pad 30 through the through hole H. The substrate 310 is, for example, a semiconductor substrate, such as a silicon substrate. The substrate 310 can, for example, also be another suitable type of substrate, such as an insulating substrate.
[0096] 所述第二绝缘层 60覆盖所述存储电路 20, 举例地， 该第二绝缘层 60可以仅覆盖 所述存储电路 20, 也可以继续往所述传感单元 10上方延伸以同吋覆盖所述传感 单元 10, 此吋可防止生物传感裸片 200在封装成生物传感芯片 300期间造成机械 或化学伤害。  [0096] The second insulating layer 60 covers the memory circuit 20. For example, the second insulating layer 60 may cover only the memory circuit 20, and may continue to extend above the sensing unit 10 to be the same. Covering the sensing unit 10, this prevents the biosensing die 200 from causing mechanical or chemical damage during packaging into the biosensor chip 300.
[0097] 本发明的所述生物传感芯片 300可以包括单颗裸片， 也可包括多颗裸片。 举例 地， 当所述生物传感芯片 300包括单颗裸片吋， 所述存储电路 20形成于所述生物 传感裸片 200中； 当所述生物传感芯片 300包括多颗裸片吋， 所述存储电路 20可 单独形成一颗存储裸片， 并设置在所述生物传感裸片 200之外， 相应地， 存储裸 片 30上可不设置第一绝缘层 50和第二绝缘层 60, —焊盘 30可形成在生物传感裸 片 200上， 一焊盘形成在电路板 330 (见后述）上， 并位于所述存储裸片的左侧， 静电传导件 40跨过所述存储裸片的上方， 又或者， 位于存储裸片两侧的焊盘 30 均形成在电路板 330上。  [0097] The biosensor chip 300 of the present invention may include a single die, and may also include a plurality of dies. For example, when the biosensor chip 300 includes a single die, the memory circuit 20 is formed in the biosensing die 200; when the biosensor chip 300 includes a plurality of die, The storage circuit 20 can form a storage die separately and is disposed outside the bio-sensing die 200. Accordingly, the first insulating layer 50 and the second insulating layer 60 are not disposed on the storage die 30. a pad 30 may be formed on the biosensing die 200, a pad formed on the circuit board 330 (described later) and located on the left side of the memory die, the electrostatic conduction member 40 spanning the storage Above the die, or alternatively, pads 30 on either side of the memory die are formed on the circuit board 330.
[0098] 所述生物传感芯片 300所包括的裸片的颗数和形成方式不局限上述所列举的颗 数和形成方式， 还可以是其它合适的颗数和形成方式， 例如， 当所述生物传感 芯片 300包括两颗裸片吋， 所述存储电路 20也可形成于一控制裸片 (图未示)中， 所述控制裸片用于控制所述生物传感裸片 200执行感测功能。  [0098] The number and formation of the dies included in the biosensor chip 300 are not limited to the above-mentioned number and formation manner, and may be other suitable numbers and formation manners, for example, when The biosensor chip 300 includes two die dies. The memory circuit 20 can also be formed in a control die (not shown) for controlling the performance of the biosensing die 200. Test function.
[0099] 需要说明的是， 在本发明生物传感芯片 300中的生物传感模块 100可变更为上述 任意一实施例所述的生物传感模块 100, 不局限于上述图 2实施例的所述生物传 感模块 100。  [0099] It should be noted that the biosensor module 100 in the biosensor chip 300 of the present invention can be changed to the biosensor module 100 described in any of the above embodiments, and is not limited to the above embodiment of FIG. The biosensor module 100 is described.
[0100] 请继续参阅图 4, 所述生物传感芯片 300可进一步包括电路板 330和封装体 320。  [0100] With continued reference to FIG. 4, the biosensor chip 300 may further include a circuit board 330 and a package body 320.
所述生物传感裸片 200设置在所述电路板 330上。 所述封装体 320封装所述生物传 感裸片 200和所述静电传导件 30于所述生物传感芯片 300中。 其中， 所述封装体 3 20填充所述静电传导件 30与所述生物传感裸片 200之间的间隙， 使得所述静电传 导件 40固定在所述封装体 30中。 The biosensing die 200 is disposed on the circuit board 330. The package 320 encapsulates the biometric The sensation die 200 and the electrostatic conduction member 30 are in the biosensor chip 300. The package body 306 fills a gap between the electrostatic conductive member 30 and the bio-sensing die 200 such that the electrostatic conductive member 40 is fixed in the package body 30.
[0101] 所述封装体 320的材料例如为环氧树脂类材料或其它绝缘材料。 所述电路板 330 例如为印刷电路板。 [0101] The material of the package 320 is, for example, an epoxy resin material or other insulating material. The circuit board 330 is, for example, a printed circuit board.
[0102] 所述生物传感芯片 300的封装步骤例如为： 先将所述生物传感裸片 200电连接于 所述电路板 330; 然后通过打线方式将所述静电传导件 40的两端连接二焊盘 30之 间； 再将承载所述生物传感芯片 300的电路板 320放置在装有环氧树脂类材料的 注塑模具中； 最后合模以对模具腔体内的生物传感芯片 300进行塑封。 然而， 本 发明所述生物传感芯片 300的封装步骤不局限此处所述的步骤， 还可以是其它合 适的封装步骤。  [0102] The packaging step of the bio-sensing chip 300 is, for example, electrically connecting the bio-sensing die 200 to the circuit board 330; then, the two ends of the electrostatic conducting member 40 are connected by wire bonding. Connecting the two pads 30; placing the circuit board 320 carrying the biosensor chip 300 in an injection mold containing an epoxy resin material; and finally clamping the biosensor chip 300 in the mold cavity. Plastically sealed. However, the packaging step of the biosensor chip 300 of the present invention is not limited to the steps described herein, but may be other suitable packaging steps.
[0103] 所述封装体 320背对所述存储电路 20的一侧表面 S用于接收目标物体的触摸或接 近输入， 定义所述表面 S为感测面。 所述静电传导件 40相较于所述存储电路 20接 近所述感测面 S。 由于所述静电传导件 40设置在所述存储电路 20与所述封装体 32 0之间， 因此， 当目标物体引进静电吋， 静电通过静电传导件 40导入到地， 从而 避免静电对存储电路 20造成损伤或损毁。  [0103] The side surface S of the package body 320 facing away from the storage circuit 20 is for receiving a touch or proximity input of a target object, and the surface S is defined as a sensing surface. The electrostatic conducting member 40 is closer to the sensing surface S than the memory circuit 20. Since the electrostatic conduction member 40 is disposed between the storage circuit 20 and the package body 32 0, when the target object introduces an electrostatic enthalpy, static electricity is introduced to the ground through the electrostatic conduction member 40, thereby avoiding static electricity to the storage circuit 20 Cause damage or damage.
[0104] 另外， 所述生物传感芯片 300采用 BGA封装方式吋， 所述生物传感芯片 300包括 所述电路板 330。 当所述生物传感芯片采用 QFN封装方式吋， 所述生物传感芯片 300可不包括电路板 330 , 而是包括设置在生物传感裸片 200周围的引线框。  [0104] In addition, the biosensor chip 300 is packaged in a BGA package, and the biosensor chip 300 includes the circuit board 330. When the biosensor chip is in a QFN package, the biosensor chip 300 may not include the circuit board 330, but instead includes a lead frame disposed around the biosensing die 200.
[0105] 请参阅图 5 , 图 5是本发明生物传感芯片的另一实施例的剖面示意图。 可变更地  Please refer to FIG. 5. FIG. 5 is a schematic cross-sectional view showing another embodiment of the biosensor chip of the present invention. Alterably
, 所述静电传导件 40的一端设置在生物传感裸片 200上， 另一端设置在电路板 33 0上。 所述静电传导件 40跨过所述存储电路 20的上方。  One end of the electrostatic conducting member 40 is disposed on the biosensing die 200, and the other end is disposed on the circuit board 330. The electrostatic conduction member 40 spans over the storage circuit 20.
[0106] 相应地， 所述焊盘 30的数量为多个吋， 可以部分焊盘 30设置在所述生物传感裸 片 200上， 部分焊盘 30设置在所述电路板 330上。 所述静电传导件 40与所述焊盘 3 0连接。  Correspondingly, the number of the pads 30 is a plurality of turns, and a part of the pads 30 may be disposed on the biosensing die 200, and a part of the pads 30 are disposed on the circuit board 330. The electrostatic conduction member 40 is connected to the pad 30.
[0107] 当所述生物传感芯片 300采用 QFN封装方式吋， 设置在电路板 330上的焊盘 300 可以替换为引线框。  [0107] When the biosensor chip 300 is packaged in a QFN package, the pads 300 disposed on the circuit board 330 may be replaced with lead frames.
[0108] 请参阅图 6, 图 6是本发明生物传感芯片的又一实施例的剖面示意图。 可变更地 , 所述静电传导件 40的两端设置在生物传感裸片 200的两侧， 较佳地， 所述静电 传导件 40的两端分别设置在生物传感裸片 200的相对两侧。 相应地， 所述静电传 导件 40跨过所述生物传感裸片 200。 所述静电传导件 40部分位于所述存储电路 20 的正上方。 Please refer to FIG. 6. FIG. 6 is a cross-sectional view showing still another embodiment of the biosensor chip of the present invention. Alterably The two ends of the electrostatic conducting member 40 are disposed on opposite sides of the biosensing die 200. Preferably, the two ends of the electrostatic conducting member 40 are respectively disposed on opposite sides of the biosensing die 200. Accordingly, the electrostatically conductive member 40 spans the biosensing die 200. The portion of the electrostatic conduction member 40 is located directly above the storage circuit 20.
[0109] 在本实施方式中， 所述电路板 330上设置有与静电传导件 40相连接的焊盘 30。  [0109] In the present embodiment, the circuit board 330 is provided with pads 30 connected to the electrostatic conductive member 40.
所述焊盘直接或间接连接至地。  The pad is connected directly or indirectly to ground.
[0110] 当所述生物传感芯片 300采用 QFN封装方式吋， 设置在电路板 330上的焊盘 300 可以替换为引线框。 [0110] When the biosensor chip 300 is packaged in a QFN package, the pads 300 disposed on the circuit board 330 may be replaced with lead frames.
[0111] 本发明的技术思想也并不局限于应用在以上实施方式所述的生物传感模块 100 、 生物传感芯片 300中， 也可应用在其它合适类型的芯片中， 所述芯片包括存储 电路 20, 尤其地， 所述存储电路 20为紫外线可擦除的存储器， 且具有所述芯片 的电子设备在工作吋， 用户需要接触或接近所述芯片的。 相应地， 在所述芯片 封装的吋候， 例如通过打线形成所述静电传导件 40在所述存储电路 20的正上方 或者跨过所述存储电路 20的上方， 以吸收用户接触所述芯片的上方吋流向所述 存储电路 20的静电。  [0111] The technical idea of the present invention is not limited to the bio-sensing module 100 and the bio-sensing chip 300 described in the above embodiments, and may be applied to other suitable types of chips, including the storage. The circuit 20, in particular, the memory circuit 20 is an ultraviolet erasable memory, and the electronic device having the chip is in operation, and the user needs to contact or approach the chip. Correspondingly, at the time of the chip package, the electrostatic conduction member 40 is formed directly above the storage circuit 20 or across the storage circuit 20, for example, by wire bonding to absorb the user's contact with the chip. The upper side of the 吋 flows to the static electricity of the storage circuit 20.
[0112] 所述芯片例如为电容式传感芯片、 光学式传感芯片、 超声波式传感芯片中的一 种或多种。  [0112] The chip is, for example, one or more of a capacitive sensor chip, an optical sensor chip, and an ultrasonic sensor chip.
[0113] 请参阅图 7, 图 7是本发明电子设备的立体图。 本发明提供一种电子设备 400, 其包括上述任意一实施例所述的生物识别芯片 300。 在本实施方式中， 所述电子 设备 400为手机。  Please refer to FIG. 7, FIG. 7 is a perspective view of the electronic device of the present invention. The present invention provides an electronic device 400 comprising the biometric identification chip 300 of any of the above embodiments. In the embodiment, the electronic device 400 is a mobile phone.
[0114] 需要说明的是， 本发明的电子设备 400可以为可携式电子产品、 家居式电子产 品、 或车载电子产品。 然而， 所述电子设备不局限所列的电子产品， 还可以是 其它合适的电子产品。 所述可携式电子产品例如为移动终端， 所述移动终端例 如为手机、 平板电脑、 笔记本电脑、 穿戴式产品等合适的移动终端。 所述家居 式电子产品例如为智能门锁、 电视、 冰箱、 台式电脑等合适的家居式电子产品 。 所述车载电子产品例如为车载显示器、 行车记录仪、 导航仪、 车载冰箱等合 适的车载电子产品。  [0114] It should be noted that the electronic device 400 of the present invention may be a portable electronic product, a home electronic product, or an in-vehicle electronic product. However, the electronic device is not limited to the listed electronic products, but may be other suitable electronic products. The portable electronic product is, for example, a mobile terminal, such as a mobile terminal, a tablet computer, a notebook computer, a wearable product, or the like. The home-based electronic products are, for example, smart home locks, televisions, refrigerators, desktop computers, and the like, suitable home-based electronic products. The in-vehicle electronic products are, for example, suitable in-vehicle electronic products such as an in-vehicle display, a driving recorder, a navigator, and a car refrigerator.
[0115] 尽管是参考各实施例来描述本公幵， 伹是可以理解， 这些实施例是说明性的， 并且本发明的范围不仅限于它们。 许多变化、 修改、 添加、 以及改进都是可能 的。 更一般而言， 根据本发明公幵的各实施例是在特定实施例的上下文中描述 的。 功能可以在本发明公幵的各实施例中在过程中以不同的方式分离或组合， 或利用不同的术语来描述。 这些及其他变化、 修改、 添加、 以及改进可以在如 随后的权利要求书所定义的本发明公幵的范围内。 [0115] Although the present disclosure has been described with reference to various embodiments, it will be understood that these embodiments are illustrative, And the scope of the invention is not limited to them. Many changes, modifications, additions, and improvements are possible. More generally, embodiments of the present disclosure are described in the context of particular embodiments. The functions may be separated or combined in different ways in the various embodiments of the present disclosure, or may be described using different terms. These and other variations, modifications, additions, and improvements may be made within the scope of the present invention as defined by the following claims.
技术问题 technical problem
问题的解决方案 Problem solution
发明的有益效果 Advantageous effects of the invention

Claims

权利要求书 Claim
一种生物传感模块， 其特征在于： 所述生物传感模块包括： 传感单元， 用于感测目标物体接近或接触吋的生物信息； A biosensing module, comprising: a sensing unit, configured to sense biological information that a target object approaches or contacts a defect;
存储电路， 用于存储数据； 和 a storage circuit for storing data; and
静电传导件， 设置在存储电路的上方， 用于泄放静电。 An electrostatic conducting member is disposed above the storage circuit for discharging static electricity.
根据权利要求 1所述的生物传感模块， 其特征在于： 所述静电传导件 全部或部分位于所述存储电路的正上方。 The biosensor module according to claim 1, wherein: said electrostatic conduction member is wholly or partially located directly above said storage circuit.
根据权利要求 1所述的生物传感模块， 其特征在于： 所述生物传感模 块进一步包括焊盘， 所述静电传导件与所述焊盘连接， 所述静电传导 件通过所述焊盘将静电泄放至地。 The biosensor module according to claim 1, wherein: the biosensor module further comprises a pad, the electrostatic conduction member is connected to the pad, and the electrostatic conduction member passes through the pad Static electricity is discharged to the ground.
根据权利要求 1所述的生物传感模块， 其特征在于： 所述生物传感模 块进一步包括焊盘， 所述焊盘用于直接或间接连接到地， 所述静电传 导件与所述焊盘连接。 The biosensor module according to claim 1, wherein: said biosensor module further comprises a pad for directly or indirectly connected to ground, said electrostatic conducting member and said pad connection.
根据权利要求 3或 4所述的生物传感模块， 其特征在于： 所述焊盘包括 第一子焊盘和第二子焊盘， 其中， 所述静电传导件的两端分别与所述 第一子焊盘、 所述第二子焊盘电连接。 The biosensor module according to claim 3 or 4, wherein: the pad comprises a first sub-pad and a second sub-pad, wherein two ends of the electrostatic conductive member are respectively A sub-pad and the second sub-pad are electrically connected.
根据权利要求 5所述的生物传感模块， 其特征在于： 所述第一子焊盘 和所述第二子焊盘分别设于所述存储电路的两侧以使所述静电传导件 跨过所述存储电路。 The biosensor module according to claim 5, wherein: the first sub-pad and the second sub-pad are respectively disposed on two sides of the storage circuit to cause the electrostatic conduction member to cross The storage circuit.
根据权利要求 5所述的生物传感模块， 其特征在于： 所述第一子焊盘 和所述第二子焊盘对称设于所述存储电路的两侧； 或， 所述第一子焊 盘和所述第二子焊盘分别设于所述存储电路的对角。 The biosensor module according to claim 5, wherein: the first sub-pad and the second sub-pad are symmetrically disposed on two sides of the storage circuit; or, the first sub-weld The disk and the second sub-pad are respectively disposed at opposite corners of the storage circuit.
根据权利要求 5所述的生物传感模块， 其特征在于， 所述第一子焊盘 和所述第二子焊盘间隔设于所述存储电路的一侧。 The biosensor module according to claim 5, wherein the first sub-pad and the second sub-pad are spaced apart from one side of the memory circuit.
根据权利要求 1所述的生物传感模块， 其特征在于： 所述静电传导件 为导线。 The biosensor module according to claim 1, wherein: said electrostatic conductive member is a wire.
根据权利要求 9所述的生物传感模块， 其特征在于： 所述静电传导件 具有高于所述存储电路的凸起部。 根据权利要求 10所述的生物传感模块， 其特征在于： 高于所述存储电 路的凸起部通过打线形成。 The biosensor module according to claim 9, wherein: said electrostatic conduction member has a convex portion higher than said storage circuit. The biosensor module according to claim 10, wherein the convex portion higher than the storage circuit is formed by wire bonding.
根据权利要求 10所述的生物传感模块， 其特征在于： 所述凸起部呈尖 角形或弧形。 The biosensor module according to claim 10, wherein the convex portion has a pointed shape or an arc shape.
根据权利要求 9所述的生物传感模块， 其特征在于： 所述静电传导件 为一条或多条， 当所述静电传导件为多条吋， 所述多条静电传导件间 隔设置。 The biosensor module according to claim 9, wherein: the plurality of electrostatic conductive members are one or more, and when the electrostatic conductive member is a plurality of turns, the plurality of electrostatic conductive members are spaced apart.
根据权利要求 1所述的生物传感模块， 其特征在于： 所述存储电路为 一次性可编程的存储器或多次性可编程的存储器。 The biosensor module of claim 1, wherein: said storage circuit is a one-time programmable memory or a multi-time programmable memory.
一种生物传感芯片， 其特征在于： 所述生物传感芯片包括权利要求 1- 14中任意一项所述的生物传感模块。 A biosensor chip, characterized in that the biosensor chip comprises the biosensor module according to any one of claims 1 to 14.
根据权利要求 15所述的生物传感芯片， 其特征在于： 所述生物传感芯 包括指纹传感芯、 血氧传感芯、 心跳传感芯中的一种或多种。 The biosensor chip according to claim 15, wherein: said biosensor core comprises one or more of a fingerprint sensor core, a blood oxygen sensor core, and a heartbeat sensor core.
根据权利要求 15所述的生物传感芯片， 其特征在于： 所述生物传感芯 片包括生物传感裸片， 所述生物传感裸片包括所述传感单元、 所述存 储电路、 和所述焊盘； 所述生物传感裸片进一步包括衬底、 第一绝缘 层、 和第二绝缘层； 所述存储电路设置在所述衬底上； 所述第一绝缘 层和所述第二绝缘层设置在所述存储电路上； 所述存储电路位于所述 衬底与所述第一绝缘层之间； 所述焊盘设置在第一绝缘层上； 所述第 二绝缘层设置在所述第一绝缘层上， 并在对应焊盘的位置设置有通孔 ； 所述静电传导件通过所述通孔与所述焊盘连接。 The biosensor chip according to claim 15, wherein: said biosensor chip comprises a biosensing die, said biosensing die comprising said sensing unit, said storage circuit, and said a pad; the biosensing die further comprising a substrate, a first insulating layer, and a second insulating layer; the memory circuit is disposed on the substrate; the first insulating layer and the second An insulating layer is disposed on the memory circuit; the memory circuit is located between the substrate and the first insulating layer; the pad is disposed on the first insulating layer; and the second insulating layer is disposed at the On the first insulating layer, a through hole is disposed at a position corresponding to the pad; and the electrostatic conductive member is connected to the pad through the through hole.
根据权利要求 17所述的生物传感芯片， 其特征在于： 所述生物传感芯 片进一步包括电路板和封装体， 所述生物传感裸片设置在所述电路板 上， 所述封装体封装所述生物传感裸片和所述静电传导件于所述生物 传感芯片内。 The biosensor chip according to claim 17, wherein: the biosensor chip further comprises a circuit board and a package, the biosensor die is disposed on the circuit board, and the package is packaged The biosensing die and the electrostatically conductive member are within the biosensor chip.
根据权利要求 18所述的生物传感芯片， 其特征在于： 所述焊盘的数量 为多个， 所述焊盘或者均设置在所述生物传感裸片上， 或者， 部分焊 盘设置在所述生物传感裸片上， 部分焊盘设置在所述电路板上。 [权利要求 20] —种电子设备， 其特征在于： 所述电子设备包括权利要求 15-19中任 意一项所述的生物传感芯片。 The biosensor chip according to claim 18, wherein: the number of the pads is plural, and the pads are both disposed on the biosensing die, or a part of the pads are disposed in the On the biosensing die, a portion of the pads are disposed on the circuit board. [Claim 20] An electronic device, comprising: the biosensor chip according to any one of claims 15-19.
PCT/CN2016/083980 2016-05-30 2016-05-30 Biosensing module, biosensing chip, and electronic device WO2017206035A1 (en)

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