CN106206549A - Chip and electronic equipment - Google Patents
Chip and electronic equipment Download PDFInfo
- Publication number
- CN106206549A CN106206549A CN201610375785.XA CN201610375785A CN106206549A CN 106206549 A CN106206549 A CN 106206549A CN 201610375785 A CN201610375785 A CN 201610375785A CN 106206549 A CN106206549 A CN 106206549A
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- China
- Prior art keywords
- chip
- storage circuit
- conducting piece
- sensing
- nude film
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- 230000005611 electricity Effects 0.000 claims abstract description 16
- 230000003068 static effect Effects 0.000 claims abstract description 9
- 230000004888 barrier function Effects 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 14
- 238000005538 encapsulation Methods 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 abstract description 14
- 238000010276 construction Methods 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 description 14
- 230000008859 change Effects 0.000 description 5
- 208000031481 Pathologic Constriction Diseases 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 210000001215 vagina Anatomy 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000008280 blood Substances 0.000 description 2
- 210000004369 blood Anatomy 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000010247 heart contraction Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000006213 oxygenation reaction Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/4917—Crossed wires
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
The invention discloses a kind of chip and electronic equipment.This chip includes storing circuit and electrostatic conducting piece.This storage circuit is used for storing data.Described electrostatic conducting piece is arranged on above described storage circuit, for static electricity discharge, thus avoids electrostatic that this storage circuit causes damage or damage, and this electrostatic conducting piece simple in construction, and the cost of material is low.Correspondingly, the electronic equipment with this chip can avoid electrostatic that this storage circuit causes damage or damage, and this electrostatic conducting piece simple in construction equally, and the cost of material is low.
Description
Technical field
The present invention relates to technical field of semiconductors, particularly relate to a kind of chip and electronic equipment.
Background technology
At present, chip, such as biosensing device have been increasingly becoming electronic equipment, have particularly moved eventually
The standard configuration of end.Biosensing device, such as fingerprint sensing devices, when performing bio information sensing,
User is needed to contact or close to biosensing device, in order to biosensing device can obtain sufficiently strong sense
Survey signal.
But, in user's contact or during close to biosensing device, static electricity on human body can be to biosensor
Being used in part stores the storage circuit of data and causes damage or damage, causes biosensing device identification
Rate reduces or lost efficacy.
Summary of the invention
For solving above-mentioned technical problem, the present invention provides one to be prevented from electrostatic and causes storage circuit
The chip damaged or damage and electronic equipment.
The present invention provides a kind of chip, it is characterised in that: described chip includes:
Storage circuit, is used for storing data；With
Electrostatic conducting piece, is arranged on above storage circuit, for static electricity discharge.
In some embodiments, described electrostatic conducting piece is wire.
In some embodiments, described chip includes the sensing face receiving user's input, described electrostatic
Conducting piece is arranged between described sensing face and described storage circuit.
In some embodiments, described electrostatic conducting piece is used for being connected directly or indirectly to ground, to let out
Electrostatic discharge is to ground.
In some embodiments, described storage circuit is the memorizer of ultraviolet light erasable.
In some embodiments, described storage circuit is one-time programmable memory or muptiple-use
Programmable memory.
In some embodiments, described electrostatic conducting piece is positioned partially or entirely in described storage circuit
Surface.
In some embodiments, described chip includes that nude film, described storage circuit are arranged on described naked
In sheet, described electrostatic conducting piece is positioned partially or entirely in the top of described nude film.
In some embodiments, when described electrostatic conducting piece is wire, the two ends of described wire are equal
It is positioned on described nude film；Or, one end of described wire is positioned on described nude film, and the other end is positioned at described
The side of nude film；Or, the two ends of described wire are arranged on relative two sides of described nude film.
In some embodiments, described nude film farther include substrate, pad, the first insulating barrier,
With the second insulating barrier, described storage circuit, described pad are respectively provided with over the substrate, and described first
Insulating barrier and described second insulating barrier are arranged on described storage circuit, and described pad is arranged on described
On one insulating barrier, described first insulating barrier between described storage circuit and described pad, described
Two insulating barriers are arranged on described first insulating barrier, and the position of corresponding described pad is provided with through hole,
Described electrostatic conducting piece is connected with described pad by described through hole.
In some embodiments, described chip farther includes packaging body, is used for encapsulating described nude film
With described electrostatic conducting piece, fill the gap between described nude film and described electrostatic conducting piece.
In some embodiments, described chip include capacitive sensing chip, optical profile type sensing chip,
One or more in ultrasonic type sensing chip.
The present invention also provides for a kind of electronic equipment, including the chip described in above-mentioned any one embodiment.
In some embodiments, described chip is for sensing the bio information of user's input, described electricity
Subset controls whether the function performing to preset according to the bio information correspondence that described chip is sensed.
Owing to the electrostatic conducting piece in chip of the present invention is arranged on the top of storage circuit, it is used for releasing quiet
Electricity, thus avoid electrostatic that described storage circuit causes damage or damage, and this electrostatic conducting piece structure
Simply, the cost of material is low.Correspondingly, the electronic equipment with described chip can avoid electrostatic pair equally
Described storage circuit causes damage or damage, and this electrostatic conducting piece simple in construction, and the cost of material is low.
Although disclosing multiple embodiment, change including it, but by illustrate and describing the present invention
The following detailed description of disclosed explanation embodiment, other embodiments disclosed by the invention will be to affiliated neck
The technical staff in territory is apparent.Can be various obvious sides it will be recognized that the present invention is open
Face is revised, and all modifications is all without departing from the spirit and scope of the present invention.Correspondingly, accompanying drawing is with detailed
Describe and substantially should be considered illustrative and not restrictive.
Accompanying drawing explanation
Describing its example embodiment in detail by referring to accompanying drawing, the further feature of the present invention and advantage will
Become readily apparent from.
Fig. 1 is the generalized section of bio-sensing module one embodiment of the present invention.
Fig. 2 is the generalized section of bio-sensing another embodiment of module of the present invention.
Fig. 2 a is the top view of pin distribution mode one embodiment of bio-sensing module of the present invention.
Fig. 2 b is the top view of pin another embodiment of distribution mode of bio-sensing module of the present invention.
Fig. 2 c is the top view of pin another embodiment of distribution mode of bio-sensing module of the present invention.
Fig. 2 d is the top view of pin another embodiment of distribution mode of bio-sensing module of the present invention.
Fig. 3 is the generalized section of bio-sensing another embodiment of module of the present invention.
Fig. 3 a is bowing of an embodiment of the electrostatic conducting piece set-up mode of bio-sensing module of the present invention
View.
Fig. 3 b is the vertical view of another embodiment of the electrostatic conducting piece setting of bio-sensing module of the present invention
Figure.
Fig. 4 is the generalized section of an embodiment of bio-sensing chip of the present invention.
Fig. 5 is the generalized section of another embodiment of bio-sensing chip of the present invention.
Fig. 6 is the generalized section of the another embodiment of bio-sensing chip of the present invention.
Fig. 7 is the axonometric chart of electronic equipment of the present invention.
Detailed description of the invention
It is described more fully with example embodiment referring now to accompanying drawing.But, example embodiment energy
Enough implement in a variety of forms, and be not understood as limited to embodiment set forth herein.On the contrary, carry
Make the present invention will fully and completely for these embodiments, and by comprehensive for the design of example embodiment
Convey to those skilled in the art.For convenience or clear, may exaggerate, omit or schematically
It is shown in the thickness of every layer shown in accompanying drawing and size and schematically illustrates the quantity of related elements.So
And, in accompanying drawing, the size of element not exclusively reflects actual size, and the quantity of related elements is incomplete
Reaction actual quantity.The most identical reference represents same or similar structure.In accompanying drawing
The parts being represented by dashed line are the parts within entity, and the present invention is for convenience of describing corresponding technical scheme
And drawn, actually this dashed component is from the appearance for the parts can't see.
In describing the invention, it is to be understood that: " multiple " are defined as two and two or more,
Unless otherwise expressly limited specifically, accordingly, this definition is applicable to " multiple ", " a plurality of " etc.
Term." connecting " can be to electrically connect, be mechanically connected, couple, be directly connected to and be indirectly connected with
Numerous embodiments, unless the following special instruction of the present invention, otherwise and be not particularly limited.It addition,
The words such as " first ", " second " occurred in each element title are not to limit the elder generation that element occurs
Rear order, but name for convenience of element, clearly distinguish each element so that describe more succinct.
In the present invention, term " thickness ", " on ", D score, "front", "rear", " left ",
" right ", " vertically ", " level ", " top ", " end ", " interior ", " outward " etc. indicate
Orientation or position relationship be based on orientation shown in the drawings or position relationship, be for only for ease of description
The present invention and simplification describe rather than indicate or imply that the device of indication or element must have specifically
Orientation, with specific azimuth configuration and operation, be therefore not considered as limiting the invention.
Additionally, described feature, structure can be combined in one or more in any suitable manner
In embodiment.In the following description, it is provided that many details thus provide the reality to the present invention
Execute fully understanding of mode.But, one of ordinary skill in the art would recognize that there is no described specific detail
In one or more, or use other structure, constituent element etc., it is also possible to put into practice the skill of the present invention
Art scheme.In other cases, known features or operation are not shown in detail or describe to avoid obscuring
The present invention.
The chip that the present invention provides includes storing circuit, and in particular, described storage circuit is ultraviolet
(Ultraviolet Rays) erasable memorizer.The memorizer of described ultraviolet light erasable for example, one
Secondary property (One Time Program, OTP) able to programme memorizer, and the electronics with described chip sets
For operationally, user needs contact or close to described chip.Correspondingly, at described chip package
Time, such as by routing formed the electrostatic conducting piece of ground connection in the surface of described storage circuit or
Stride across the top of described storage circuit, with absorb flow to when user contacts the top of described chip described in deposit
The electrostatic of storage circuit.
Citing ground, described chip includes the input face receiving user's input, and described electrostatic conducting piece is arranged
Between described input face and described storage circuit.
Described electrostatic conducting piece is used for absorbing user's contact or flows to described core during close to described input face
The electrostatic of sheet.
Described chip for example, capacitive sensing chip, optical profile type sensing chip, ultrasonic type sensing core
One or more in sheet.Described capacitive sensing chip, optical profile type sensing chip, ultrasonic type pass
The most above-mentioned bio-sensing chip of sense chip.So, described chip be confined to herein listed sensing
Chip, it is possible to for the chip of other suitable type.
Below, illustrate as a example by bio-sensing module, bio-sensing chip.
The bio-sensing module that the present invention provides is for sensing the bio information of target object input.Preferably
Ground, described bio-sensing module is entirely formed in a bio-sensing chip (Chip).Specifically, institute
State bio-sensing chip and include bio-sensing nude film (Die) and electrostatic conducting piece.Described bio-sensing nude film
Including storage circuit, described storage circuit is used for storing data.The most described biological biography of described data
The initialization data of the circuit in sense chip, the model etc. of product.Described electrostatic conducting piece part or
It is entirely located on described bio-sensing nude film.It is preferred that described electrostatic conducting piece is positioned at described storage electricity
The surface on road, forms lobe or tip above storage circuit, and is connected directly or indirectly to
Ground, with static electricity discharge.
Further, described bio-sensing chip farther includes packaging body, is used for encapsulating described biology
Sensing nude film and electrostatic conducting piece.Described electrostatic conducting piece is positioned at described bio-sensing nude film and described envelope
Between dress body.Between described packaging body is filled between described electrostatic conducting piece and described bio-sensing nude film
Gap.
One side surface of described packaging body thing sensing chip of making a living receives a side surface of user's input, fixed
It is sensing face that the described packaging body of justice receives a side surface of user's input.Described electrostatic conducting piece compared to
Described storage circuit is closer to described sensing face.When user is near to or in contact with described sensing face, described
Electrostatic conducting piece is released user's electrostatic, prevents electrostatic from storage circuit is caused damage or damage.
Described electrostatic conducting piece for example, wire, described lobe or most advanced and sophisticated for be formed by routing.So,
Described electrostatic conducting piece is not limited thereto the wire described in place, it is possible to for other shapes of conducting element.
The memorizer of described storage circuit for example, ultraviolet light erasable.Depositing of described ultraviolet light erasable
Reservoir for example, One Time Programmable (One Time Program, OTP) memorizer or/and muptiple-use can
Programming (Multi Time Program, MTP) memorizer.So, it is not limited to this, described storage electricity
Road is alternatively the memorizer of other suitable type.The memorizer of described ultraviolet light erasable is that other is suitable
The memorizer of type.
In the present invention, with bio-sensing chip as fingerprint sensor as a example by (Chip), store circuit
It is generally placed in the fingerprint sensing nude film (Die) of fingerprint sensor, in order to prevent electrostatic to storage
Circuit causes damage or damage, and fingerprint sensor is provided above electrostatic in the position of corresponding storage circuit
Conducting piece, to absorb the electrostatic flowing to storage circuit.Wherein, described electrostatic conducting piece for example, metal
Conducting element, so, is not limited to metallic conductive element.
In particular, it is ultraviolet (Ultraviolet Rays) erasable memorizer for storage circuit,
This illustrates as a example by sentencing otp memory, after fingerprint sensing nude film flow is returned, at quilt
Before being packaged into fingerprint sensor, need fingerprint sensing nude film is tested, wherein it is desired to right
Otp memory write data test its quality, when test otp memory is qualified product
Afterwards, the data of otp memory are write before utilizing ultraviolet erasing during test.Due to finger
When stricture of vagina sensing nude film is tested, need ultraviolet that otp memory is wiped, therefore, refer to
Stricture of vagina sensing nude film originally can not be provided with hardware above the position of corresponding otp memory.
When described fingerprint sensing nude film is encapsulated into fingerprint sensor (it should be noted that this place
In the fingerprint sensor said and be not provided with described electrostatic conducting piece) after, when user is near to or in contact with institute
State fingerprint sensor carry out finger print information sensing time, owing to not having above described otp memory
Blocking of hardware and be relatively vulnerable to damage or the damage that static electricity on human body causes, thus cause described finger
Stricture of vagina sensing chip is scrapped.
For above-mentioned technical problem, the present invention propose when fingerprint sensing nude film tested qualified after,
When encapsulating fingerprint sensing nude film and being fingerprint sensor, above fingerprint sensing nude film, form electrostatic pass
Guiding element.It is preferred that described electrostatic conducting piece is positioned at the surface of otp memory or strides across OTP
Memorizer.It follows that utilize packaging body encapsulate described electrostatic conducting piece and described bio-sensing nude film in
In Yi Ti, form bio-sensing chip.Thus, when user's contact or close to having electrostatic conducting piece
During bio-sensing chip, electrostatic conducting piece can absorb the electrostatic flowing to otp memory that user introduces,
Thus prevent electrostatic from otp memory causing damage or damage.
In a detailed description of the invention, the two ends of described wire are both formed on described bio-sensing nude film.
In still another embodiment, the one end in the two ends of described wire is formed at described biological biography
On sense nude film, the other end is formed at the side of described bio-sensing nude film.
In still another embodiment, it is naked that the two ends of described wire are respectively formed at described bio-sensing
The both sides of sheet.It is preferred that the two ends of described wire are respectively formed at the relative of described bio-sensing nude film
Both sides.That is, described wire strides across described bio-sensing nude film.
It should be noted that when the one or both ends of wire are formed at the side or two of bio-sensing nude film
During side, the one or both ends of described wire are not to be formed on described bio-sensing nude film.Such as,
When bio-sensing chip uses BGA Package (Ball Grid Array Package is called for short BGA),
Described bio-sensing chip farther includes a circuit board, and described bio-sensing nude film passes with described electrostatic
Guiding element is formed between described circuit board and described packaging body.The one or both ends of described wire can be formed
On described circuit board.
Owing to the packaged type of bio-sensing chip has multiple, such as, quad flat non-pin package
(Quad Flat No-lead Package is called for short QFN), accordingly, described bio-sensing chip can not
Including described circuit board, but it is formed around lead frame (Frame) at bio-sensing nude film.
Described bio-sensing module include fingerprint sensing module, blood oxygen sensing module, heart beating sensing module,
One in pressure sensor block, humidity sensor module, temperature sensing module, iris sensing module or
Multiple.Correspondingly, described bio information includes finger print information, blood oxygenation information, heartbeat message, pressure
One or more in information, humidity information, temperature information, iris information.
Described target object is as the finger of user, it is possible to for the other parts of user's body, as eyes,
Heart beating, palm, toe, ear etc., or be the combination of any several parts on aforementioned user's body,
Even it is alternatively the object of other suitable type, and is not limited to human body.
Below, incorporated by reference to accompanying drawing, the most specifically to understand the present invention.
Refer to the generalized section that Fig. 1, Fig. 1 are bio-sensing module one embodiments of the present invention.Institute
State bio-sensing module 100 and include sensing unit 10, storage circuit 20, pad 30 and electrostatic
Conducting piece 40.
Described sensing unit 10 for sense target object near to or in contact with time bio information.Described
Storage circuit 20 is used for storing data.Described data such as include the circuit of bio-sensing module 100
Initialization data, product type etc..Described pad 30 is used for being connected directly or indirectly to ground.
Described pad 30 is such as positioned at described storage circuit 20 around, it is possible to be positioned at described storage circuit
The top of 20.In the present embodiment, described pad 30 is located at the top of described storage circuit 20,
It is positioned at the outside of described storage circuit 20.Described electrostatic conducting piece 40 is connected with described pad 30.
Described electrostatic conducting piece 10 is for static electricity discharge extremely.For example, apply described bio-sensing describedly
The electronic equipment 400 (see Fig. 7) of module 100 systematically or equipment ground, be generally loaded as 0V (volt)
Voltage.When described pad 30 is indirect earthed, such as, can pass through modulation circuit ground connection, or by supplying
Electricity power ground etc..
The extension mode of described electrostatic conducting piece 40 is not limited to as shown in Figure 1: at electrical connection pad
Extended above from described pad 30 toward described storage circuit 20 after 30, described electrostatic conducting piece 40
Extension mode can be also to be extended vertically upwards by described pad 30 after electrical connection pad 30.It addition,
The extension mode of described electrostatic conducting piece 40 is alternatively other suitable extension mode.
Described electrostatic conducting piece 40 is wire, and described wire is metal wire, the material example of this metal wire
As for gold, copper or aluminum etc., it is, of course, also possible to be other suitable material.Described conductor structure is simple,
Material usage is few, reduces material cost.It addition, described electrostatic conducting piece 40 also and is limited as wire,
It is alternatively the conducting element of other suitable shape.
Further, described wire has the lobe 41 higher than described storage circuit 20.This is higher than
The lobe 41 of described storage circuit 20 is formed by routing.Described lobe 41 in pointed shape or
Arc, to utilize discharging rod principle to guide user to described lobe 41 release electrostatic, then passes through
This electrostatic is introduced ground end by described pad 30, thus prevents electrostatic from described storage circuit 20 is caused damage
Wound or damage.
Described pad 30 can be one or more.The material of described pad 30 such as include aluminum, copper,
One or more in Au Ag Pt Pd, nickel etc..Certainly, described pad 30 material is also
It can be other suitable material.
In the present embodiment, described storage circuit 20 is that ultraviolet (Ultraviolet Rays) is erasable
Memorizer.The memorizer of described ultraviolet light erasable for example, One Time Programmable (One Time
Program, OTP) memorizer or/and muptiple-use (Multi Time Program, MTP) able to programme storage
Device.So, it is not limited to this, described storage circuit 20 is alternatively the memorizer of other suitable type.
The memorizer of described ultraviolet light erasable is the memorizer of other suitable type.
Described bio-sensing module 100 can farther include the first insulating barrier 50, this first insulating barrier
50 are arranged on described storage circuit 20 and the top of sensing unit 10.Described pad 30 is located at first
The top of insulating barrier 50.So, in other embodiments, described first insulating barrier 50 may also set up
Above one of described storage circuit 20 and sensing unit 10 person.Or, described first exhausted
Edge layer 50 is omitted, and described pad 30 is arranged on storage circuit 20 around.
Seeing also Fig. 2-Fig. 2 d, Fig. 2 is cuing open of bio-sensing another embodiment of module of the present invention
Face schematic diagram.Fig. 2 a is the vertical view of pad distribution mode one embodiment of bio-sensing module of the present invention
Figure.Fig. 2 b is the top view of pad another embodiment of distribution mode of bio-sensing module of the present invention.
Fig. 2 c is the top view of pad another embodiment of distribution mode of bio-sensing module of the present invention.Fig. 2 d
It it is the top view of pad another embodiment of distribution mode of bio-sensing module of the present invention.
As in figure 2 it is shown, described pad 30 includes being arranged on the first of the surrounding of described storage circuit 20
Sub-pad 31 and the second sub-pad 32, for receiving ground signalling.Described electrostatic conducting piece 40
Two ends electrically connect with described first sub-pad 31, described second sub-pad 32 respectively.
Described first sub-pad 31, described second sub-pad 32 can be described for the mode of ground connection
One or both in first sub-pad 31, described second sub-pad 32 is directly as earth terminal, also
Can be that the one or both in described first sub-pad 31, described second sub-pad 32 is deposited with described
The earth terminal electrical connection of storage circuit 20 or described sensing unit 10, it is also possible to be described first sub-pad
31, the one or both in described second sub-pad 32 with systematically electrically connect.Of the present invention
One sub-pad 31, the earthing mode of described second sub-pad 32 do not limit to the side of listed ground connection herein
Formula, can be also the mode of other suitable ground connection.
Described first sub-pad 31 and described second sub-pad 32 are respectively arranged on described storage circuit 20
Any both sides so that described electrostatic conducting piece 40 strides across the top of described storage circuit 20, such as,
It is adjacent that described first sub-pad 31 and described second sub-pad 32 are respectively arranged on described storage circuit 20
Both sides or relative both sides etc..Citing ground, as shown in Figure 2 a, described first sub-pad 31 and institute
State the second sub-pad 32 and be respectively arranged on the adjacent both sides of described storage circuit 20 so that described electrostatic conducts
Part 40 strides across described storage circuit 20.As shown in Figure 2 b, described first sub-pad 31 and described
Two sub-pads 32 are symmetrically set in the both sides of described storage circuit 20 so that described electrostatic conducting piece 40 is horizontal
Across described storage circuit 20.
As shown in Figure 2 c, ground, described first sub-pad 31 and described second sub-pad 32 are changed
The diagonal angle of described storage circuit 20 can also be respectively arranged on.
As shown in Figure 2 d, ground, described first sub-pad 31 and described second sub-pad 32 are changed
The side being located at described storage circuit 20 can also be spaced, it is not necessary to be respectively arranged on described storage circuit 20
Both sides.
Change ground, in other embodiments, it is also possible to be located at by described first sub-pad 31 described
In storage circuit 20 one jiao, described second sub-pad 32 is located at the side of described storage circuit 20.
In Fig. 2, Fig. 2 b, Fig. 2 c, described first sub-pad 31 is located at described storage circuit 20 and institute
Stating between sensing unit 10, change ground, in other embodiments, described first sub-pad 31 is also
May be provided at just to described storage circuit 20 or the top of described sensing unit 10.
The described first sub-pad 31 of the present invention, the distribution mode not office of described second sub-pad 32
Limit above-mentioned distribution mode, can be also other suitable distribution mode, such as each two or three circuit
Both sides be respectively provided with described first sub-pad 31 and described second sub-pad 32.Accordingly, described
Two or three circuit be all correspondingly arranged an electrostatic electric-conductor 40 with respectively with described first sub-pad
31 and described second sub-pad 32.
It should be noted that bio-sensing module 100, described storage circuit 20 and described sensing
The profile of unit 10 is not limited to the rectangle shown in Fig. 2 a-Fig. 2 d, and it can also be square
The shape of the rule such as shape, hexagon, octagon, it is also possible to be irregular shape or other is suitable
Shape.It addition, described first sub-pad 31, described second sub-pad 32 the most do not limit to Fig. 2 a-figure
Circle shown in 2d, it is also possible to be the shape of the rules such as square, rectangle, it is also possible to be not
The shape of rule or other suitable shape.
Seeing also Fig. 3-Fig. 3 b, Fig. 3 is cuing open of bio-sensing another embodiment of module of the present invention
Face schematic diagram.Fig. 3 a is an enforcement of the electrostatic conducting piece set-up mode of bio-sensing module of the present invention
The top view of example.Fig. 3 b is another enforcement of the electrostatic conducting piece setting of bio-sensing module of the present invention
The top view of example.
Described electrostatic conducting piece 40 can be one or more.When described electrostatic conducting piece 40 is a plurality of
Time, described a plurality of electrostatic conducting piece 40 interval is arranged.This interval can be the interval on vertical,
It can also be the interval on horizontal plane.Citing ground, if Fig. 3 is that a plurality of electrostatic conducting piece 40 is vertically
The projection in face forms interval and arranges；If Fig. 3 a is a plurality of electrostatic conducting piece 40 projection shape at horizontal plane
Arrange at interval.It should be noted that every described electrostatic conducting piece 40 in Fig. 3 is relatively described
The height of storage circuit 20 is different, but, its shape, size can be identical, naturally it is also possible to no
Identical.The length that every described electrostatic conducting piece 40 in Fig. 3 a projects in the horizontal plane is identical, so
And, its physical length, shape, size, highly can be identical, it is also possible to be to differ.
Described a plurality of electrostatic conducting piece 40 can be arranged in array, as matrix form is arranged.Certainly, also
Can in Else Rule mode or non-regular arrangement.But, with changing, as shown in Figure 3 b,
Described a plurality of electrostatic conducting piece 40 can also be crisscross arranged.
It should be noted that the described electrostatic conducting piece 40 in Fig. 3-3b only draw two as an example,
In reality, a plurality of electrostatic conducting piece 40 does not limit to two, it is also possible to be more than two.Correspondingly,
First sub-pad 31 is corresponding with the quantity of the second sub-pad 32 to be increased.It addition, electrostatic of the present invention
Conducting piece 40 set-up mode does not the most limit to above-mentioned set-up mode, can be also that other is suitably arranged
Mode.
See also the generalized section that Fig. 2 and Fig. 4, Fig. 4 are bio-sensing chips of the present invention.
The present invention provides a kind of bio-sensing chip 300.Described bio-sensing chip 300 includes above-mentioned enforcement
The bio-sensing module 100 of mode.
Described bio-sensing chip 300 includes bio-sensing nude film 200 and described electrostatic conducting piece 40.
Described electrostatic conducting piece 40 is arranged on described bio-sensing nude film 200.
Described bio-sensing nude film 200 includes storing circuit 20.It is preferred that described electrostatic conducting piece
40 surfaces being partly or entirely arranged on described storage circuit 20, for static electricity discharge to ground.
Described bio-sensing nude film 200 farther includes substrate 310, sensing unit 10, first insulate
Layer the 50, second insulating barrier 60 and pad 30.Described storage circuit 20 is arranged on described substrate 310
On.Described first insulating barrier 50 and described second insulating barrier 60 are arranged on described storage circuit 20.
Described storage circuit 20 is between described substrate 310 and described first insulating barrier 50.Described pad
30 are arranged on the first insulating barrier 50.Described second insulating barrier 60 is arranged on described first insulating barrier
On 50, and the position of corresponding pad 30 is provided with through hole H.Described electrostatic conducting piece 40 passes through
Described through hole H is connected with described pad 30.Described substrate 310 for example, Semiconductor substrate, described
Semiconductor substrate is such as silicon substrate.Described substrate 310 is such as alternatively the substrate of other suitable type,
For example, dielectric substrate.
Described second insulating barrier 60 covers described storage circuit 20, citing ground, this second insulating barrier 60
Can only cover described storage circuit 20, it is also possible to continue toward described sensing unit 10 extend above with
Cover described sensing unit 10 simultaneously, bio-sensing nude film 200 now can be prevented to be packaged into biology
Cause during sensing chip 300 and mechanically or chemically injure.
The described bio-sensing chip 300 of the present invention can include single nude film, it is possible to include many naked
Sheet.Citing ground, when described bio-sensing chip 300 includes single nude film, described storage circuit
20 are formed in described bio-sensing nude film 200；When described bio-sensing chip 300 includes many
During nude film, described storage circuit 20 may be separately formed a storage nude film, and is arranged on described biology
Outside sensing nude film 200, correspondingly, storage nude film 30 can be not provided with the first insulating barrier 50 and the
Two insulating barriers 60, a pad 30 may be formed on bio-sensing nude film 200, and a pad is formed at electricity
On road plate 330 (seeing below), and being positioned at the left side of described storage nude film, electrostatic conducting piece 40 strides across
The top of described storage nude film, or, the pad 30 being positioned at storage nude film both sides is both formed in electricity
On road plate 330.
A number and the generation type of the nude film included by described bio-sensing chip 300 are not limited to above-mentioned
A cited number and generation type, it is also possible to be other suitable number and generation type, such as,
When described bio-sensing chip 300 includes two nude films, described storage circuit 20 also can be formed at
One controls in nude film (not shown), and described control nude film is used for controlling described bio-sensing nude film 200 and holds
Row sensing function.
It should be noted that the bio-sensing module 100 in bio-sensing chip 300 of the present invention can
It is changed to the bio-sensing module 100 described in above-mentioned any one embodiment, is not limited to above-mentioned Fig. 2 real
Execute the described bio-sensing module 100 of example.
Please continue to refer to Fig. 4, described bio-sensing chip 300 can farther include circuit board 330 He
Packaging body 320.Described bio-sensing nude film 200 is arranged on described circuit board 330.Described encapsulation
Body 320 encapsulates described bio-sensing nude film 200 and described electrostatic conducting piece 30 in described bio-sensing
In chip 300.Wherein, described packaging body 320 fills described electrostatic conducting piece 30 and described biology
Gap between sensing nude film 200 so that described electrostatic conducting piece 40 is fixed on described packaging body 30
In.
The material of described packaging body 320 for example, epoxy resin material or other insulant.Described
Circuit board 330 for example, printed circuit board (PCB).
The encapsulation step of described bio-sensing chip 300 is for example: first by described bio-sensing nude film
200 are electrically connected to described circuit board 330；Then by routing mode by described electrostatic conducting piece 40
Two ends connect between two pads 30；The circuit board 320 of described bio-sensing chip 300 will be carried again
It is placed in the injection mold equipped with epoxy resin material；Last matched moulds is with to the life in cavity body of mould
Thing sensing chip 300 carries out plastic packaging.But, the encapsulation step of bio-sensing chip 300 of the present invention
Suddenly step described herein is not limited to, it is also possible to be other suitable encapsulation step.
Described packaging body 320 is used for receiving object back to a side surface S of described storage circuit 20
The touch of body or close input, defining described surface S is sensing face.Described electrostatic conducting piece 40 phase
Compared with described storage circuit 20 close to described sensing face S.Owing to described electrostatic conducting piece 40 is arranged on
Between described storage circuit 20 and described packaging body 320, therefore, when target object introduces electrostatic,
Electrostatic imports to ground by electrostatic conducting piece 40, thus avoids electrostatic that storage circuit 20 is caused damage
Or damage.
During it addition, described bio-sensing chip 300 uses BGA package mode, described bio-sensing
Chip 300 includes described circuit board 330.When described bio-sensing chip uses QFN packaged type
Time, described bio-sensing chip 300 may not include circuit board 330, but includes being arranged on biological biography
Lead frame around sense nude film 200.
Refer to the generalized section that Fig. 5, Fig. 5 are another embodiments of bio-sensing chip of the present invention.
Changing ground, one end of described electrostatic conducting piece 40 is arranged on bio-sensing nude film 200, another
End is arranged on circuit board 330.Described electrostatic conducting piece 40 strides across the top of described storage circuit 20.
Correspondingly, when the quantity of described pad 30 is multiple, can be arranged on described by part pad 30
On bio-sensing nude film 200, part pad 30 is arranged on described circuit board 330.Described electrostatic
Conducting piece 40 is connected with described pad 30.
When described bio-sensing chip 300 uses QFN packaged type, it is arranged on circuit board 330
On pad 300 could alternatively be lead frame.
Refer to the generalized section that Fig. 6, Fig. 6 are the another embodiments of bio-sensing chip of the present invention.
Changing ground, the two ends of described electrostatic conducting piece 40 are arranged on the both sides of bio-sensing nude film 200,
It is preferred that the two ends of described electrostatic conducting piece 40 are separately positioned on the relative of bio-sensing nude film 200
Both sides.Correspondingly, described electrostatic conducting piece 40 strides across described bio-sensing nude film 200.Described quiet
Electrical conduction 40 part is positioned at the surface of described storage circuit 20.
In the present embodiment, described circuit board 330 is provided with it is connected with electrostatic conducting piece 40
Pad 30.Described pad is connected directly or indirectly to ground.
When described bio-sensing chip 300 uses QFN packaged type, it is arranged on circuit board 330
On pad 300 could alternatively be lead frame.
The technological thought of the present invention is also not limited to apply the biological biography described in embodiment of above
In sense module 100, bio-sensing chip 300, it is possible to apply in the chip of other suitable type,
Described chip includes storing circuit 20, and in particular, described storage circuit 20 is ultraviolet light erasable
Memorizer, and there is the electronic equipment of described chip operationally, user needs contact or close to described
Chip.Correspondingly, described chip package when, such as, form described electrostatic by routing and pass
Guiding element 40 is in the surface of described storage circuit 20 or strides across above described storage circuit 20,
The electrostatic of described storage circuit 20 is flowed to when contacting the top of described chip with absorption user.
Described chip for example, capacitive sensing chip, optical profile type sensing chip, ultrasonic type sensing core
One or more in sheet.
Refer to the axonometric chart that Fig. 7, Fig. 7 are electronic equipments of the present invention.The present invention provides a kind of electronics
Equipment 400, it includes the bio-identification chip 300 described in above-mentioned any one embodiment.In this enforcement
In mode, described electronic equipment 400 is mobile phone.
It should be noted that the electronic equipment 400 of the present invention can be portable electronic product, household
Formula electronic product or vehicle electronics product.But, described electronic equipment does not limit to listed electronics and produces
Product, it is also possible to be other suitable electronic product.Described portable electronic product for example, mobile terminal,
Described mobile terminal for example, mobile phone, panel computer, notebook computer, Wearable product etc. are suitable
Mobile terminal.Described household formula electronic product for example, intelligent door lock, TV, refrigerator, desktop computer
Etc. suitable household formula electronic product.Described vehicle electronics product for example, Vehicular display device, driving note
The suitably vehicle electronics product such as record instrument, navigator, car refrigerator.
Despite with reference to each embodiment, the disclosure is described, it will be appreciated that these embodiments are to say
Bright property, and the scope of the present invention is not limited only to them.Many change, revise, add and
It is all possible for improving.More generally, it is at particular implementation according to each embodiment disclosed by the invention
Described in the context of example.Function can be during the course with not in each embodiment disclosed by the invention
Same mode separately or in combination, or utilizes different terms to describe.These and other change, amendment,
Adding and improve can be in scope disclosed by the invention as defined in subsequent claim.
Claims (13)
1. a chip, it is characterised in that: described chip includes:
Storage circuit, is used for storing data；With
Electrostatic conducting piece, is arranged on above storage circuit, for static electricity discharge.
Chip the most according to claim 1, it is characterised in that: described electrostatic conducting piece is wire.
Chip the most according to claim 1, it is characterised in that: described chip includes receiving user's input
Sensing face, described electrostatic conducting piece is arranged between described sensing face and described storage circuit.
Chip the most according to claim 1, it is characterised in that: described electrostatic conducting piece for directly or
It is indirectly connected to ground, with static electricity discharge to ground.
Chip the most according to claim 1, it is characterised in that: described storage circuit is ultraviolet erasable
The memorizer removed.
Chip the most according to claim 5, it is characterised in that: described storage circuit is for disposably can compile
The memorizer of journey or muptiple-use programmable memory.
Chip the most according to claim 1, it is characterised in that: described electrostatic conducting piece is part or all of
It is positioned at the surface of described storage circuit.
8. according to the chip described in any one in claim 1-7, it is characterised in that: described chip includes
Nude film, described storage circuit is arranged in described nude film, and described electrostatic conducting piece is positioned partially or entirely in
The top of described nude film.
Chip the most according to claim 8, it is characterised in that: when described electrostatic conducting piece is wire,
The two ends of described wire are respectively positioned on described nude film；Or, one end of described wire is positioned on described nude film,
The other end is positioned at the side of described nude film；Or, the two ends of described wire are arranged on the relative of described nude film
Two sides.
Chip the most according to claim 8, it is characterised in that: described nude film farther include substrate,
Pad, the first insulating barrier and the second insulating barrier, described storage circuit, described pad are arranged at institute
Stating on substrate, described first insulating barrier and described second insulating barrier are arranged on described storage circuit, institute
Stating pad to be arranged on described first insulating barrier, described first insulating barrier is positioned at described storage circuit and institute
Stating between pad, described second insulating barrier is arranged on described first insulating barrier, and in corresponding described weldering
The position of dish is provided with through hole, and described electrostatic conducting piece is connected with described pad by described through hole.
11. chips according to claim 10, it is characterised in that: described chip farther includes encapsulation
Body, is used for encapsulating described nude film and described electrostatic conducting piece, fills described nude film and the conduction of described electrostatic
Gap between part.
12. chips according to claim 1, it is characterised in that: described chip includes capacitive sensing
One or more in chip, optical profile type sensing chip, ultrasonic type sensing chip.
13. 1 kinds of electronic equipments, including the chip described in any one in claim 1-12.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610375785.XA CN106206549B (en) | 2016-05-30 | 2016-05-30 | Chip and electronic equipment |
| PCT/CN2017/086646 WO2017206911A1 (en) | 2016-05-30 | 2017-05-31 | Chip and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610375785.XA CN106206549B (en) | 2016-05-30 | 2016-05-30 | Chip and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106206549A true CN106206549A (en) | 2016-12-07 |
| CN106206549B CN106206549B (en) | 2019-06-28 |
Family
ID=57453262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610375785.XA Active CN106206549B (en) | 2016-05-30 | 2016-05-30 | Chip and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106206549B (en) |
| WO (1) | WO2017206911A1 (en) |
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| WO2017206911A1 (en) * | 2016-05-30 | 2017-12-07 | 深圳信炜科技有限公司 | Chip and electronic device |
| WO2017206035A1 (en) * | 2016-05-30 | 2017-12-07 | 深圳信炜科技有限公司 | Biosensing module, biosensing chip, and electronic device |
| WO2019090749A1 (en) * | 2017-11-11 | 2019-05-16 | 深圳信炜科技有限公司 | Contact sensor and electronic device |
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| WO2017206911A1 (en) | 2017-12-07 |
| CN106206549B (en) | 2019-06-28 |
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Effective date of registration: 20210524 Address after: 545000 No.108, 2nd floor, building 2, 29 Xinliu Avenue, Liuzhou City, Guangxi Zhuang Autonomous Region Patentee after: Liuzhou Zibo Technology Co.,Ltd. Address before: 518055 Shenzhen, Nanshan District, Guangdong Xili Street Honghua Ling Industrial Zone 2 District 1 District 5 Building (Xi Bian) Patentee before: SHENZHEN XINWEI TECHNOLOGY Co.,Ltd. |