WO2017206035A1 - Module biocapteur, puce de biocapteur et dispositif électronique - Google Patents

Module biocapteur, puce de biocapteur et dispositif électronique Download PDF

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Publication number
WO2017206035A1
WO2017206035A1 PCT/CN2016/083980 CN2016083980W WO2017206035A1 WO 2017206035 A1 WO2017206035 A1 WO 2017206035A1 CN 2016083980 W CN2016083980 W CN 2016083980W WO 2017206035 A1 WO2017206035 A1 WO 2017206035A1
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WO
WIPO (PCT)
Prior art keywords
pad
biosensor
sub
biosensing
disposed
Prior art date
Application number
PCT/CN2016/083980
Other languages
English (en)
Chinese (zh)
Inventor
李问杰
Original Assignee
深圳信炜科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳信炜科技有限公司 filed Critical 深圳信炜科技有限公司
Priority to PCT/CN2016/083980 priority Critical patent/WO2017206035A1/fr
Priority to CN201680000455.0A priority patent/CN106062951B/zh
Publication of WO2017206035A1 publication Critical patent/WO2017206035A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints

Definitions

  • the present invention relates to the field of biometrics, and in particular, to a biosensor module, a biosensor chip, and an electronic device.
  • Biosensing devices such as fingerprint sensor devices, require the user to touch or access the biosensor device after performing biometric sensing so that the biosensor device can obtain a sufficiently strong sensing signal.
  • the human body static electricity may damage or damage the storage circuit for storing data in the biosensor device, resulting in a decrease or failure of the biosensor device identification rate.
  • the present invention provides a biosensor module, a biosensor chip, and an electronic device capable of preventing damage or damage to a memory circuit by static electricity.
  • a biosensing module comprising:
  • a sensing unit configured to sense biological information that the target object approaches or contacts the defect
  • the electrostatic conducting member is disposed above the storage circuit for discharging static electricity.
  • the electrostatically conductive member is wholly or partially located directly above the storage circuit.
  • the biosensing module further includes a pad, the electrostatic conduction member is coupled to the pad, and the electrostatic conduction member discharges static electricity to the ground through the pad.
  • the biosensing module further includes a pad for direct or indirect connection to ground, the electrostatic conductive member being coupled to the pad.
  • the pad includes a first sub-pad and a second sub-pad, wherein two ends of the electrostatic conductive member and the first sub-pad, respectively The two sub-pads are electrically connected.
  • the first sub-pad and the second sub-pad are respectively disposed on the storage circuit Both sides are such that the electrostatic conduction member straddles the storage circuit.
  • the first sub-pad and the second sub-pad are symmetrically disposed on two sides of the storage circuit; or, the first sub-pad and the second sub-pad Provided in the diagonal of the memory circuit, in some embodiments, the first sub-pad and the second sub-pad are spaced apart from the memory circuit
  • the electrostatically conductive member is a wire.
  • the electrostatically conductive member has a raised portion that is higher than the storage circuit.
  • the raised portions above the storage circuit are formed by wire bonding.
  • the raised portion has a pointed shape or an arc shape.
  • the electrostatic conductive member is one or more, and when the electrostatic conductive member is a plurality of turns, the plurality of electrostatic conductive members are spaced apart.
  • the memory circuit is a one-time programmable memory or a multi-time programmable memory.
  • the present invention also provides a biosensor chip comprising the biosensor module of any of the above embodiments.
  • the biosensor core comprises one or more of a fingerprint sensing core, a blood oxygen sensing core, and a heartbeat sensing core.
  • the biosensor chip includes a biosensing die, the biosensing die including the sensing unit, the memory circuit, and the pad;
  • the biosensing die further includes a substrate, a first insulating layer, and a second insulating layer;
  • the memory circuit is disposed on the substrate;
  • the first insulating layer and the second insulating layer are disposed on a storage circuit;
  • the storage circuit is located between the substrate and the first insulating layer;
  • the pad is disposed on the first insulating layer;
  • the second insulating layer is disposed on the first insulating layer And a through hole is disposed at a position corresponding to the pad; the electrostatic conductive member is connected to the pad through the through hole.
  • the biosensor chip further includes a circuit board and a package, the biosensing die is disposed on the circuit board, and the package encapsulates the biosensing bare The sheet and the electrostatically conductive member are within the biosensor chip.
  • the number of the pads is multiple, the pads are either disposed on the biosensing die, or a portion of the pads are disposed on the biosensing die. A part of the pad is disposed on the circuit board.
  • the present invention provides an electronic device comprising the biosensor chip of any of the above embodiments.
  • the static electricity is damaged or damaged by the static electricity
  • the electrostatic conductive member has a simple structure and a material cost.
  • the biosensor chip and the electronic device having the biosensor module can also avoid damage or damage to the storage circuit caused by static electricity, and the electrostatic conductive member has a simple structure and a low material cost.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of a biosensor module of the present invention.
  • FIG. 2 is a schematic cross-sectional view showing another embodiment of the biosensor module of the present invention.
  • FIG. 2a is a top plan view of an embodiment of a pad distribution mode of the biosensor module of the present invention.
  • 2b is a top plan view of another embodiment of a pad distribution pattern of the biosensor module of the present invention.
  • 2c is a top plan view of another embodiment of a pad distribution pattern of the biosensor module of the present invention.
  • 2d is a top plan view of another embodiment of a pad distribution manner of the biosensor module of the present invention.
  • FIG. 3 is a schematic cross-sectional view showing another embodiment of the biosensor module of the present invention.
  • FIG. 3a is a top plan view of an embodiment of an electrostatic conduction member of the biosensor module of the present invention.
  • FIG. 3b is a top plan view of another embodiment of an electrostatic conduction member arrangement of the biosensing module of the present invention.
  • FIG. 4 is a schematic cross-sectional view showing an embodiment of a biosensor chip of the present invention.
  • 5 is a schematic cross-sectional view showing another embodiment of the biosensor chip of the present invention.
  • 6 is a cross-sectional view showing still another embodiment of the biosensor chip of the present invention.
  • FIG. 7 is a perspective view of an electronic device of the present invention.
  • Example embodiments will now be described more fully with reference to the appended drawings.
  • the example embodiments can be embodied in many forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete,
  • the thickness and size of each layer shown in the drawings may be exaggerated, omitted or schematically illustrated and the number of related elements may be schematically illustrated for convenience or clarity.
  • the size of the elements in the drawings does not fully reflect the actual size, and the number of related components does not fully reflect the actual number.
  • the same reference numerals in the drawings denote the same or similar structures.
  • the components indicated by broken lines in the drawings are components inside the solid body, and the present invention is drawn to facilitate the description of the corresponding technical solution, and actually the dotted line component is seen as an invisible component from the outside.
  • connection may be a plurality of embodiments such as an electrical connection, a mechanical connection, a coupling, a direct connection, and an indirect connection, and is not particularly limited unless specifically described below.
  • first and second appearing in each component name are not intended to limit the order in which the components appear, but to facilitate the naming of the components and to clearly distinguish the components, so that the description is more concise.
  • the orientation or positional relationship of the “bottom”, “inside”, “outside” and the like is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the indicated device. Or the components must have a particular orientation, are constructed and operated in a particular orientation, and are therefore not to be construed as limiting the invention.
  • the biosensor module provided by the present invention is used to sense biological information input by a target object.
  • the biosensor modules are all formed in a biosensor chip.
  • the biosensor chip includes a biosensing die (Die) and an electrostatic conducting member.
  • the biosensing die includes a memory circuit for storing data.
  • the data is, for example, initialization data of a circuit in the biosensor chip, a model number of the product, and the like.
  • the electrostatically conductive member is partially or wholly located on the biosensing die.
  • the electrostatic conducting member is located directly above the storage circuit, and a protrusion or a tip is formed above the storage circuit and directly or indirectly connected to the ground to discharge static electricity.
  • the biosensor chip further includes a package for encapsulating the biosensing die and the electrostatic conductive member.
  • the electrostatic conducting member is located between the biosensing die and the package.
  • the package fills a gap between the electrostatic conduction member and the biosensing die.
  • One side surface of the package body is a side surface of the biosensor chip receiving the user input, and a surface defining the side of the package body receiving the user input is a sensing surface.
  • the electrostatically conductive member is closer to the sensing surface than the memory circuit. When the user approaches or contacts the sensing surface, the electrostatic conducting member discharges static electricity to the user to prevent damage or damage to the storage circuit caused by static electricity.
  • the electrostatic conduction member is, for example, a wire, and the convex portion or the tip end is formed by wire bonding.
  • the static conductive member is not limited to the wires described herein, but may be other shapes of conductive members.
  • the storage circuit is, for example, an ultraviolet erasable memory.
  • the ultraviolet erasable memory is, for example, a One Time Program (OTP) memory or/and a Multi Time Program (MTP) memory.
  • OTP One Time Program
  • MTP Multi Time Program
  • OTP One Time Program
  • the ultraviolet erasable memory is another suitable type of memory.
  • the storage circuit is generally disposed in the fingerprint sensing die (Die) of the fingerprint sensing chip, in order to prevent static electricity from being stored.
  • the circuit causes damage or damage
  • the fingerprint sensing chip is provided with an electrostatic conducting member above the position corresponding to the storage circuit to absorb static electricity flowing to the storage circuit.
  • the electrostatic conductive member is, for example, a metal conductive member, and is not limited to the metal conductive member.
  • the memory circuit is an ultraviolet (Ultraviolet Rays) erasable memory, here
  • the OTP memory is described as an example. After the fingerprint sensing die is returned, the fingerprint sensing die needs to be tested before being packaged into the fingerprint sensing chip, wherein the number of OTP memory writes needs to be written. According to the test of its good or bad, after testing the OTP memory as a qualified product, the data written to the OTP memory is tested before being erased by ultraviolet rays. Since the fingerprint sensing die is tested, ultraviolet light is required to erase the OTP memory. Therefore, the fingerprint sensing die itself cannot be provided with a metal component above the position corresponding to the OTP memory.
  • the fingerprint sensing die package is a fingerprint sensing chip (it is required that the electrostatic conductive member is not disposed in the fingerprint sensing chip), when the user approaches or contacts the After the fingerprint sensor chip performs fingerprint information sensing, the top of the OTP memory is more susceptible to damage or damage caused by static electricity of the human body due to the absence of shielding of the metal component, thereby causing the fingerprint sensing chip to be scrapped.
  • the present invention proposes that after the fingerprint sensing die is tested, the encapsulating fingerprint sensing die is a fingerprint sensing chip, and an electrostatic conducting member is formed above the fingerprint sensing die.
  • the encapsulating fingerprint sensing die is a fingerprint sensing chip, and an electrostatic conducting member is formed above the fingerprint sensing die.
  • the electrostatic conducting member is located directly above the OTP memory or across the OTP memory.
  • the electrostatic conductive member and the biosensing die are packaged in a package to form a biosensor chip.
  • the electrostatic conducting member absorbs static electricity introduced by the user to the OTP memory, thereby preventing static electricity from damaging or damaging the OTP memory.
  • both ends of the wire are formed on the biosensing die.
  • one end of the two ends of the wire is formed on the biosensing die
  • the other end is formed on one side of the biosensing die.
  • both ends of the wire are respectively formed on both sides of the biosensing die.
  • two ends of the wire are respectively formed on opposite sides of the biosensing die. That is, the wire spans the biosensing die.
  • the biosensor chip when one or both ends of the wire are formed on one side or both sides of the biosensing die, one or both ends of the wire are not formed on the biosensing die.
  • the biosensor chip when the biosensor chip uses a Ball Grid Array Package (BGA), the biosensor chip further includes a circuit board, and the biosensing die is formed on the electrostatic conductive member. Between the circuit board and the package. One or both ends of the wire may form the circuit board.
  • BGA Ball Grid Array Package
  • the biosensor chip has various packaging methods, for example, a Quad Flat No-lead Package (QFN), correspondingly, the biosensor chip may not include the circuit board. Instead, a lead frame (Fram e ) is formed around the biosensing die.
  • QFN Quad Flat No-lead Package
  • the biosensor module includes one of a fingerprint sensing module, a blood oxygen sensing module, a heartbeat sensing module, a pressure sensing module, a humidity sensing module, a temperature sensing module, and an iris sensing module.
  • the biological information includes fingerprint information, blood oxygen information, heartbeat information, pressure information, and humidity information.
  • One or more of temperature information, iris information is provided.
  • the target object such as a user's finger
  • suitable types of objects it is not limited to the human body.
  • the biosensor module may be partially formed in the biosensor chip and partially formed outside the biosensor chip.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of a biosensor module of the present invention.
  • the biosensor module 100 includes a sensing unit 10, a storage circuit 20, a pad 30, and an electrostatic conduction member 40.
  • the sensing unit 10 is configured to sense biological information that the target object approaches or contacts the sputum.
  • the storage circuit 20 is for storing data.
  • the data includes, for example, initialization data of a circuit of the biosensor module 100, a product model, and the like.
  • the pad 30 is used to connect directly or indirectly to ground.
  • the pad 30 is located, for example, around the memory circuit 20, and may also be located above the memory circuit 20. In the present embodiment, the pad 30 is disposed above the memory circuit 20 and outside the memory circuit 20.
  • the electrostatic conduction member 40 is connected to the pad 30.
  • the electrostatic conduction member 10 is for discharging static electricity to the ground.
  • the ground or device ground such as the electronic device 400 (see Figure 7) to which the biosensing module 100 is applied, is typically loaded with a voltage of 0 volts.
  • the pad 30 is indirectly grounded, for example, by a modulation circuit grounded, or by a power supply ground.
  • the manner of extending the electrostatic conducting member 40 is not limited to that shown in FIG. 1 : after the electrical connection pad 30 extends from the pad 30 to the storage circuit 20 , the electrostatic conducting member 40 The extension may also be such that the pads 30 extend vertically upward after the electrical connection pads 30. In addition, the extension of the electrostatic conducting member 40 can also be other suitable extensions.
  • the electrostatic conductive member 40 is a wire, and the wire is a metal wire.
  • the material of the metal wire is, for example, gold, copper or aluminum. Of course, other suitable materials may also be used.
  • the wire has a simple structure and a small amount of materials. Reduce material costs.
  • the electrostatic conducting member 40 is also limited to a wire, and may also be other suitable shapes of conductive elements.
  • the wire has a raised portion 41 higher than the storage circuit 20.
  • the raised portion 41 higher than the storage circuit 20 is formed by wire bonding.
  • the convex portion 41 has a pointed shape or an arc shape to guide the user to discharge static electricity to the convex portion 41 by using a lightning rod principle, and then the electrostatic arch I is grounded through the pad 30 to prevent static electricity. Damage or damage to the storage circuit 20.
  • the pads 30 may be one or more.
  • the material of the pad 30 includes, for example, one or more of aluminum, copper, gold, silver, platinum, palladium, nickel, and the like. Of course, the pad 30 material may also be other suitable materials.
  • the memory circuit 20 is an ultraviolet (Ultraviolet Rays) erasable memory.
  • the ultraviolet erasable memory is, for example, a One Time Program (OTP) memory or/and a Multi-Mode Programmable (MTP) memory.
  • OTP One Time Program
  • MTP Multi-Mode Programmable
  • the storage circuit 20 may be other suitable types of memories.
  • the ultraviolet erasable memory is another suitable type of memory.
  • the biosensor module 100 may further include a first insulating layer 50 disposed above the memory circuit 20 and the sensing unit 10.
  • the pad 30 is disposed above the first insulating layer 50.
  • the first insulating layer 50 may also be disposed above one of the memory circuit 20 and the sensing unit 10. Still alternatively, the first insulating layer 50 is omitted, and the pad 30 is disposed around the memory circuit 20.
  • FIG. 2 is a schematic cross-sectional view showing another embodiment of the biosensor module of the present invention.
  • Fig. 2a is a plan view showing an embodiment of a pad distribution mode of the biosensor module of the present invention.
  • Figure 2b is a top plan view of another embodiment of the pad distribution of the biosensor module of the present invention.
  • Figure 2c is a top plan view of another embodiment of the pad distribution pattern of the biosensing module of the present invention.
  • Fig. 2d is a plan view showing another embodiment of the pad distribution method of the biosensor module of the present invention.
  • the pad 30 includes a first sub-pad 31 and a second sub-pad 32 disposed around the memory circuit 20 for receiving a ground signal. Both ends of the electrostatic conduction member 40 are electrically connected to the first sub-pad 31 and the second sub-pad 32, respectively.
  • the manner in which the first sub-pad 31 and the second sub-pad 32 are used for grounding may be the first sub-pad 31.
  • One or both of the second sub-pads 32 directly serve as a ground terminal, or may be one or both of the first sub-pad 31 and the second sub-pad 32.
  • the storage circuit 20 or the grounding end of the sensing unit 10 is electrically connected, and may also be one of the first sub-pad 31 and the second sub-pad 32 or both. connection.
  • the grounding manner of the first sub-pad 31 and the second sub-pad 32 of the present invention is not limited to the manner of grounding listed herein, and may be other suitable grounding methods.
  • the first sub-pad 31 and the second sub-pad 32 are respectively disposed on any two sides of the storage circuit 20 such that the electrostatic conduction member 40 straddles the storage circuit 20,
  • the first sub-pad 31 and the second sub-pad 32 are respectively disposed on two sides or opposite sides of the storage circuit 20 and the like.
  • the first sub-pad 31 and the second sub-pad 32 are respectively disposed on two adjacent sides of the storage circuit 20 to cause the electrostatic conduction member 40 to cross
  • the storage circuit 20 is described.
  • the first sub-pad 31 and the second sub-pad 32 are symmetrically disposed on both sides of the memory circuit 20 to cause the electrostatic conduction member 40 to straddle the memory circuit 20.
  • the first sub-pad 31 and the second sub-pad 32 may be respectively disposed at opposite corners of the memory circuit 20.
  • the first sub-pad 31 and the second sub-pad 32 may be spaced apart from one side of the memory circuit 20, and need not be separately disposed in the Both sides of the storage circuit 20.
  • the first sub-pad 31 may be disposed at a corner of the storage circuit 20, and the second sub-pad 32 may be disposed at the storage circuit 20.
  • the first sub-pad 31 is disposed between the memory circuit 20 and the sensing unit 10, and may be modified.
  • the first sub-pad 31 The sub-pad 31 may also be disposed above the memory circuit 20 or the sensing unit 10.
  • the distribution manner of the first sub-pad 31 and the second sub-pad 32 of the present invention is not limited to the above-mentioned distribution manner, and may be other suitable distribution manners, for example, every two or three.
  • the first sub-pad 31 and the second sub-pad 32 are respectively disposed on both sides of the circuit.
  • the two or three circuits are respectively provided with an electrostatic conducting member 40 to respectively correspond to the first sub-pad 31 and the second sub-pad 32.
  • contours of the biosensor module 100, the storage circuit 20, and the sensing unit 10 are not limited to the rectangles shown in FIG. 2a to FIG. 2d, and may also be square, six.
  • a regular shape such as a side shape, an octagonal shape, or the like may also be an irregular shape or other suitable shape.
  • the first child The pad 31 and the second sub-pad 32 are also not limited to the circular shape shown in FIGS. 2a to 2d, and may also be square.
  • Regular shapes such as rectangles may also be irregular shapes or other suitable shapes.
  • FIG. 3 is a schematic cross-sectional view showing another embodiment of the biosensor module of the present invention.
  • Fig. 3a is a plan view showing an embodiment of an electrostatic conduction member of the biosensor module of the present invention.
  • Figure 3b is a top plan view of another embodiment of an electrostatic conduction member arrangement of a biosensing module of the present invention.
  • the electrostatic conduction member 40 may be one or more. When the electrostatic conductive member 40 is a plurality of turns, the plurality of electrostatic conductive members 40 are spaced apart.
  • the interval may be an interval on a vertical plane or an interval on a horizontal plane.
  • the projections of the plurality of electrostatic conductive members 40 on the vertical plane are spaced apart; as shown in FIG. 3a, the projections of the plurality of electrostatic conductive members 40 in the horizontal plane are spaced apart.
  • each of the electrostatic conductive members 40 in FIG. 3 has a different height from the storage circuit 20, however, the shape and size thereof may be the same, and may of course be different.
  • Each of the electrostatic conductive members 40 in Fig. 3a has the same length projected on a horizontal plane, however, the actual length, shape, size, and height may be the same or different.
  • the plurality of electrostatic conducting members 40 may be arranged in an array, such as a matrix arrangement. Of course, it can also be arranged in other rules or irregular ways. However, as can be modified, as shown in Fig. 3b, the plurality of electrostatic conducting members 40 can also be staggered.
  • the electrostatic conducting member 40 in FIG. 3-3b is only two examples.
  • the plurality of electrostatic conducting members 40 are not limited to two, and may be two or more. Accordingly, the number of the first sub-pad 31 and the second sub-pad 32 is correspondingly increased.
  • the manner in which the electrostatic conducting member 40 of the present invention is disposed is not limited to the above-described arrangement, and may be other suitable arrangements.
  • FIG. 4 is a schematic cross-sectional view of the biosensor chip of the present invention.
  • the present invention provides a biosensor chip 300.
  • the biosensor chip 300 includes the biosensor module 100 of the above embodiment.
  • the biosensor chip 300 includes a biosensing die 200 and the electrostatic conduction member 40.
  • the electrostatically conductive member 40 is disposed on the biosensing die 200.
  • the biosensing die 200 includes a memory circuit 20.
  • the electrostatic conducting member 40 is partially or entirely disposed directly above the storage circuit 20 for discharging static electricity to the ground.
  • the biosensing die 200 further includes a substrate 310, a sensing unit 10, a first insulating layer 50, and a second The insulating layer 60, and the pad 30.
  • the memory circuit 20 is disposed on the substrate 310.
  • the first insulating layer 50 and the second insulating layer 60 are disposed on the memory circuit 20.
  • the memory circuit 20 is located between the substrate 310 and the first insulating layer 50.
  • the pad 30 is disposed on the first insulating layer 50.
  • the second insulating layer 60 is disposed on the first insulating layer 50, and is provided with a through hole H at a position corresponding to the pad 30.
  • the electrostatic conduction member 40 is connected to the pad 30 through the through hole H.
  • the substrate 310 is, for example, a semiconductor substrate, such as a silicon substrate.
  • the substrate 310 can, for example, also be another suitable type of substrate, such as an insulating substrate.
  • the second insulating layer 60 covers the memory circuit 20.
  • the second insulating layer 60 may cover only the memory circuit 20, and may continue to extend above the sensing unit 10 to be the same. Covering the sensing unit 10, this prevents the biosensing die 200 from causing mechanical or chemical damage during packaging into the biosensor chip 300.
  • the biosensor chip 300 of the present invention may include a single die, and may also include a plurality of dies.
  • the memory circuit 20 is formed in the biosensing die 200; when the biosensor chip 300 includes a plurality of die, The storage circuit 20 can form a storage die separately and is disposed outside the bio-sensing die 200. Accordingly, the first insulating layer 50 and the second insulating layer 60 are not disposed on the storage die 30.
  • a pad 30 may be formed on the biosensing die 200, a pad formed on the circuit board 330 (described later) and located on the left side of the memory die, the electrostatic conduction member 40 spanning the storage Above the die, or alternatively, pads 30 on either side of the memory die are formed on the circuit board 330.
  • the number and formation of the dies included in the biosensor chip 300 are not limited to the above-mentioned number and formation manner, and may be other suitable numbers and formation manners, for example, when The biosensor chip 300 includes two die dies.
  • the memory circuit 20 can also be formed in a control die (not shown) for controlling the performance of the biosensing die 200. Test function.
  • biosensor module 100 in the biosensor chip 300 of the present invention can be changed to the biosensor module 100 described in any of the above embodiments, and is not limited to the above embodiment of FIG. The biosensor module 100 is described.
  • the biosensor chip 300 may further include a circuit board 330 and a package body 320.
  • the biosensing die 200 is disposed on the circuit board 330.
  • the package 320 encapsulates the biometric
  • the sensation die 200 and the electrostatic conduction member 30 are in the biosensor chip 300.
  • the package body 306 fills a gap between the electrostatic conductive member 30 and the bio-sensing die 200 such that the electrostatic conductive member 40 is fixed in the package body 30.
  • the material of the package 320 is, for example, an epoxy resin material or other insulating material.
  • the circuit board 330 is, for example, a printed circuit board.
  • the packaging step of the bio-sensing chip 300 is, for example, electrically connecting the bio-sensing die 200 to the circuit board 330; then, the two ends of the electrostatic conducting member 40 are connected by wire bonding. Connecting the two pads 30; placing the circuit board 320 carrying the biosensor chip 300 in an injection mold containing an epoxy resin material; and finally clamping the biosensor chip 300 in the mold cavity. Plastically sealed.
  • the packaging step of the biosensor chip 300 of the present invention is not limited to the steps described herein, but may be other suitable packaging steps.
  • the side surface S of the package body 320 facing away from the storage circuit 20 is for receiving a touch or proximity input of a target object, and the surface S is defined as a sensing surface.
  • the electrostatic conducting member 40 is closer to the sensing surface S than the memory circuit 20. Since the electrostatic conduction member 40 is disposed between the storage circuit 20 and the package body 32 0, when the target object introduces an electrostatic enthalpy, static electricity is introduced to the ground through the electrostatic conduction member 40, thereby avoiding static electricity to the storage circuit 20 Cause damage or damage.
  • the biosensor chip 300 is packaged in a BGA package, and the biosensor chip 300 includes the circuit board 330.
  • the biosensor chip 300 may not include the circuit board 330, but instead includes a lead frame disposed around the biosensing die 200.
  • FIG. 5 is a schematic cross-sectional view showing another embodiment of the biosensor chip of the present invention.
  • One end of the electrostatic conducting member 40 is disposed on the biosensing die 200, and the other end is disposed on the circuit board 330.
  • the electrostatic conduction member 40 spans over the storage circuit 20.
  • the number of the pads 30 is a plurality of turns, and a part of the pads 30 may be disposed on the biosensing die 200, and a part of the pads 30 are disposed on the circuit board 330.
  • the electrostatic conduction member 40 is connected to the pad 30.
  • the pads 300 disposed on the circuit board 330 may be replaced with lead frames.
  • FIG. 6 is a cross-sectional view showing still another embodiment of the biosensor chip of the present invention.
  • the two ends of the electrostatic conducting member 40 are disposed on opposite sides of the biosensing die 200.
  • the two ends of the electrostatic conducting member 40 are respectively disposed on opposite sides of the biosensing die 200.
  • the electrostatically conductive member 40 spans the biosensing die 200.
  • the portion of the electrostatic conduction member 40 is located directly above the storage circuit 20.
  • the circuit board 330 is provided with pads 30 connected to the electrostatic conductive member 40.
  • the pad is connected directly or indirectly to ground.
  • the pads 300 disposed on the circuit board 330 may be replaced with lead frames.
  • the technical idea of the present invention is not limited to the bio-sensing module 100 and the bio-sensing chip 300 described in the above embodiments, and may be applied to other suitable types of chips, including the storage.
  • the circuit 20, in particular, the memory circuit 20 is an ultraviolet erasable memory, and the electronic device having the chip is in operation, and the user needs to contact or approach the chip.
  • the electrostatic conduction member 40 is formed directly above the storage circuit 20 or across the storage circuit 20, for example, by wire bonding to absorb the user's contact with the chip.
  • the upper side of the ⁇ flows to the static electricity of the storage circuit 20.
  • the chip is, for example, one or more of a capacitive sensor chip, an optical sensor chip, and an ultrasonic sensor chip.
  • FIG. 7 is a perspective view of the electronic device of the present invention.
  • the present invention provides an electronic device 400 comprising the biometric identification chip 300 of any of the above embodiments.
  • the electronic device 400 is a mobile phone.
  • the electronic device 400 of the present invention may be a portable electronic product, a home electronic product, or an in-vehicle electronic product.
  • the electronic device is not limited to the listed electronic products, but may be other suitable electronic products.
  • the portable electronic product is, for example, a mobile terminal, such as a mobile terminal, a tablet computer, a notebook computer, a wearable product, or the like.
  • the home-based electronic products are, for example, smart home locks, televisions, refrigerators, desktop computers, and the like, suitable home-based electronic products.
  • the in-vehicle electronic products are, for example, suitable in-vehicle electronic products such as an in-vehicle display, a driving recorder, a navigator, and a car refrigerator.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Multimedia (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)

Abstract

L'invention concerne un module biocapteur (100), une puce de biocapteur (300) et un dispositif électronique (400). Le module biocapteur (100) comprend une unité de détection (10), un circuit de stockage (20) et un élément de conduction d'électricité statique (40). L'unité de détection (10) est utilisée pour détecter des informations biologiques d'un objet cible lorsque l'objet cible est proche de l'unité ou en contact avec elle. Le circuit de stockage (20) est utilisé pour stocker des données. L'élément de conduction d'électricité statique (40) est situé au-dessus du circuit de stockage (20), et est utilisé pour décharger de l'électricité statique. De cette manière, le circuit de stockage (20) ne peut pas être endommagé ni détruit par l'électricité statique; l'élément de conduction d'électricité statique (40) présente une structure simple et un faible coût de matériau. De ce fait, la puce de biocapteur (300) pourvue du module biocapteur (100) ainsi que le dispositif électronique (400) peuvent également empêcher que l'électricité statique n'endommage ou ne détruise le circuit de stockage (20); et l'élément de conduction d'électricité statique (40) présente une structure simple et un faible coût de matériau.
PCT/CN2016/083980 2016-05-30 2016-05-30 Module biocapteur, puce de biocapteur et dispositif électronique WO2017206035A1 (fr)

Priority Applications (2)

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PCT/CN2016/083980 WO2017206035A1 (fr) 2016-05-30 2016-05-30 Module biocapteur, puce de biocapteur et dispositif électronique
CN201680000455.0A CN106062951B (zh) 2016-05-30 2016-05-30 生物传感模块、生物传感芯片及电子设备

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PCT/CN2016/083980 WO2017206035A1 (fr) 2016-05-30 2016-05-30 Module biocapteur, puce de biocapteur et dispositif électronique

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