WO2017159661A1 - Montage de fixation pour transport - Google Patents

Montage de fixation pour transport Download PDF

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Publication number
WO2017159661A1
WO2017159661A1 PCT/JP2017/010140 JP2017010140W WO2017159661A1 WO 2017159661 A1 WO2017159661 A1 WO 2017159661A1 JP 2017010140 W JP2017010140 W JP 2017010140W WO 2017159661 A1 WO2017159661 A1 WO 2017159661A1
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WO
WIPO (PCT)
Prior art keywords
adhesive
carbon nanotube
adhesive layer
fixing jig
base material
Prior art date
Application number
PCT/JP2017/010140
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English (en)
Japanese (ja)
Inventor
将太郎 増田
智昭 市川
前野　洋平
義治 畠山
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2017046313A external-priority patent/JP2017175126A/ja
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to US16/084,628 priority Critical patent/US11420832B2/en
Priority to EP17766660.9A priority patent/EP3432350A4/fr
Priority to KR1020187026540A priority patent/KR20180124870A/ko
Priority to CN201780018295.7A priority patent/CN108886011A/zh
Publication of WO2017159661A1 publication Critical patent/WO2017159661A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Definitions

  • the present invention relates to a conveyance fixing jig.
  • the workpieces When transporting materials, intermediate products, products, etc. (hereinafter also referred to as workpieces) in the manufacturing process of semiconductor elements, etc., the workpieces are transported using a transport base such as a movable arm or a movable table. (For example, refer to Patent Documents 1 and 2).
  • a transport base such as a movable arm or a movable table.
  • the member (conveyance fixing jig) on which the workpiece is placed is required to have a strong grip force so that the workpiece does not shift during conveyance.
  • a demand is increasing year by year together with a demand for speeding up the manufacturing process.
  • the conventional conveyance fixing jig has a problem that the workpiece is held by an elastic material such as a resin, and the elastic material is likely to adhere and remain on the workpiece.
  • an elastic material such as a resin has a problem that heat resistance is low, and grip force is reduced under a high temperature environment.
  • the conveyance fixture composed of such a material has a problem that the gripping force is essentially low and the workpiece cannot be sufficiently held even at room temperature.
  • a method of holding the workpiece under a high temperature environment there are a method of suctioning under reduced pressure, a method of fixing the workpiece by the shape of the conveyance fixing jig (for example, chucking, counterboring, etc.) and the like.
  • the method of adsorbing under reduced pressure is effective only under an air atmosphere and cannot be employed under vacuum in a CVD process or the like.
  • the method of fixing the workpiece by the shape of the conveyance fixing jig there is a problem that the workpiece is damaged or particles are generated due to contact between the workpiece and the conveyance fixing jig.
  • An object of the present invention is to provide a conveyance fixing jig which has a high grip force, hardly contaminates a workpiece (conveyed object) and is excellent in heat resistance.
  • the conveyance fixture of the present invention includes a first base material, a carbon nanotube aggregate, and an adhesive layer disposed between the first base material and the carbon nanotube aggregate.
  • 1 substrate and the aggregate of carbon nanotubes are bonded via the adhesive layer, and the ratio of the linear expansion coefficient of the first substrate to the linear expansion coefficient of the adhesive layer (adhesive layer / Base material) is 0.7 to 1.8.
  • the aggregate of carbon nanotubes is formed on a second base material, and the first base material and the second base material are bonded via the adhesive layer.
  • the adhesive constituting the adhesive layer is an inorganic adhesive or a carbon adhesive.
  • the inorganic adhesive is a ceramic adhesive.
  • the elastic modulus change of the adhesive layer is 50% or less when the conveyance fixture is left at 450 ° C. for 1 hour.
  • the adhesive layer has a linear expansion coefficient of 5 ppm / ° C. to 12 ppm / ° C.
  • the material which comprises the said 1st base material is an alumina.
  • the coefficient of static friction at 23 ° C. with respect to the glass surface of the carbon nanotube aggregate surface is 1 to 50. According to another situation of this invention, the manufacturing method of the said conveyance fixing jig is provided.
  • an adhesive is applied on a first substrate to form an application layer, an aggregate of carbon nanotubes is disposed on the application layer, the application layer is cured, and an adhesive layer is formed. Forming and bonding the first substrate and the aggregate of carbon nanotubes via the adhesive layer, the linear expansion coefficient of the first substrate, and the line of the adhesive layer
  • the ratio of the expansion coefficient is 0.7 to 1.8.
  • the conveyance fixing jig of the present invention includes a carbon nanotube aggregate disposed on the first base material, and the workpiece can be fixed by the carbon nanotube aggregate. High, difficult to contaminate work piece (conveyed object) and excellent in heat resistance.
  • the first base material and the carbon nanotube aggregate are joined via an adhesive layer, and the ratio of the linear expansion coefficient of the first base material to the linear expansion coefficient of the adhesive layer (adhesive layer / By setting the base material to a specific range, the aggregate of carbon nanotubes is hardly detached even at high temperatures, and the work piece (conveyed object) can be fixed well.
  • A. Overview Figure 1 of the transport fixture is a schematic cross-sectional view of the transport fixture according to one embodiment of the present invention.
  • the conveyance fixture 100 includes a first base material 10, a carbon nanotube aggregate 31, and an adhesive layer 20 disposed between the first base material 10 and the carbon nanotube aggregate 31.
  • the first base material 10 and the carbon nanotube aggregate 31 are bonded via the adhesive layer 20.
  • the carbon nanotube aggregate 31 may be provided on the entire surface of the first base material 10 or may be provided on a part of the surface of the first base material 10.
  • the carbon nanotube aggregate 31 is composed of a plurality of carbon nanotubes 32.
  • the carbon nanotubes 32 are oriented in the direction of the length L, and the carbon nanotube aggregate 31 is configured as a fibrous columnar structure.
  • the carbon nanotubes 32 are preferably oriented in a substantially vertical direction with respect to the first base material 10.
  • the “substantially perpendicular direction” means that the angle with respect to the surface of the substrate 20 is preferably 90 ° ⁇ 20 °, more preferably 90 ° ⁇ 15 °, and further preferably 90 ° ⁇ 10 °. And particularly preferably 90 ° ⁇ 5 °.
  • FIG. 2 is a schematic cross-sectional view of a conveyance fixing jig according to another embodiment of the present invention.
  • the carbon nanotube aggregate 31 is formed on the second base material 33.
  • the adhesive layer 20 is disposed on the side of the second base material 33 where the carbon nanotube aggregate 31 is not formed.
  • the first base material 10 and the second base material 32 are joined via the adhesive layer 20.
  • the conveyance fixing jig of the present invention can be suitably used in, for example, a semiconductor element manufacturing process, an optical member manufacturing process, and the like. More specifically, the conveyance fixing jig of the present invention is a material, an intermediate product, a product, etc. (specifically, a semiconductor material, a wafer) between processes in a semiconductor element manufacturing process or within a predetermined process. , Chips, films, etc.). Moreover, it can be used for transferring a glass substrate or the like between processes in manufacturing an optical member or within a predetermined process.
  • materials, intermediate products, products, and the like that can be transported by the transport apparatus of the present invention may be referred to as workpieces or transported objects.
  • the coefficient of static friction at 23 ° C. with respect to the glass surface of the carbon nanotube assembly side surface of the conveyance fixture is preferably 1.0 or more.
  • the upper limit value of the static friction coefficient is preferably 50. If it is such a range, the conveyance fixing jig excellent in grip property can be obtained. In addition, it cannot be overemphasized that the said conveyance fixing jig with a large friction coefficient with respect to the glass surface can express strong grip property also to the mounted object (for example, semiconductor wafer) comprised from materials other than glass.
  • the said 1st base material functions as a conveyance base material at the time of conveying a semiconductor material, an electronic material, etc.
  • Examples of the form of the first base material include a transport arm, a transport table, a transport ring, a transport guide rail, a storage cassette, a hook, and a transport frame.
  • the size and shape of the first substrate can be appropriately selected according to the purpose.
  • the first substrate may be a part of a transfer arm, a transfer table, a transfer ring, a transfer guide rail, a storage cassette, a hook, a transfer frame, and the like.
  • An example of the case where the first substrate is a transfer arm is shown in the schematic perspective view of FIG.
  • a carbon nanotube aggregate 31 is disposed at one end of the first base material 10 as a transport arm.
  • FIG. 1 described above is a cross-sectional view taken along the line II of the conveyance fixing jig 100.
  • any appropriate material can be adopted as the material constituting the first base material.
  • a ceramic material such as alumina or silicon nitride; a heat resistant material such as stainless steel is used as a material constituting the conveyance base material.
  • alumina is used.
  • the linear expansion coefficient of the first base material is preferably 2 ppm / ° C. to 12 ppm / ° C., more preferably 3 ppm / ° C. to 12 ppm / ° C., further preferably 5 ppm / ° C. to 12 ppm / ° C., More preferably, it is 6 ppm / ° C. to 9 ppm / ° C. If it is such a range, the conveyance fixing jig which can function satisfactorily also under high temperature can be obtained.
  • the linear expansion coefficient can be measured by a thermomechanical analyzer (TMA).
  • the volume expansion coefficient of the first base material is preferably 15 ppm / ° C. to 36 ppm / ° C., more preferably 18 ppm / ° C. to 27 ppm / ° C. If it is such a range, the conveyance fixing jig which can function satisfactorily also under high temperature can be obtained.
  • the ratio of the linear expansion coefficient of the first base material to the linear expansion coefficient of the adhesive layer (adhesive layer / base material) is 0.7 to 1.8.
  • the ratio of the linear expansion coefficients in such a range, the aggregate of carbon nanotubes is hardly detached even at a high temperature (for example, 450 ° C.), and the workpiece (conveyed object) is A conveyance fixing jig that can be fixed satisfactorily can be obtained.
  • the carbon nanotube aggregate By using the carbon nanotube aggregate, it is possible to improve the tackiness and cleanliness at high temperature, and further, as described above, the linear expansion coefficient of the adhesive layer (ratio to the linear expansion coefficient of the first substrate) It is a great achievement of the present invention that the carbon nanotube aggregate, which is an aggregate of fibrous materials, can be satisfactorily bonded to the first base material by appropriately adjusting.
  • the ratio of the linear expansion coefficient of the first base material to the linear expansion coefficient of the adhesive layer (adhesive layer / base material) is preferably 0.8 to 1.7. If it is such a range, the said effect will become more remarkable.
  • the adhesive layer can be composed of any appropriate adhesive.
  • an inorganic adhesive or a carbon adhesive is preferably used as the adhesive constituting the adhesive layer. These adhesives are preferable in terms of excellent heat resistance. Among these, an inorganic adhesive or a carbon adhesive is preferable.
  • Examples of the inorganic adhesive include ceramic adhesive and silica adhesive.
  • Ceramic adhesive is an adhesive that can exhibit adhesiveness by curing a curing component such as alkali metal silicate, phosphate, and metal alkoxide.
  • a ceramic adhesive containing an alkali metal silicate or phosphate eg, aluminum phosphate is used as the curing component.
  • the silica-based adhesive is an adhesive that can exhibit adhesiveness by curing silica-based curing components such as silicic acid fine particles having silanol groups on the particle surface and organopolysiloxane.
  • silica-based curing component for example, fused silica, ultrafine silica (for example, particle size: 10 nm to 100 nm), silicone-based materials such as organopolysiloxane, silane compound, and organosilicon compound can be used.
  • the ceramic adhesive and the silica-based adhesive may further include a curing agent (curing accelerator) and / or a filler (filler).
  • the ceramic adhesive can also include any suitable dispersion medium.
  • Examples of the curing agent (curing accelerator) used in combination with the alkali metal silicate in the ceramic adhesive include oxides or hydroxides such as zinc, magnesium, and calcium; And phosphates such as aluminum and zinc; borate salts such as calcium, barium and magnesium; and the like.
  • Examples of the curing agent (curing accelerator) used in combination with the above phosphate include oxides or hydroxides such as magnesium, calcium, zinc, and aluminum; silicates such as magnesium and calcium; Group II boric acid Salt; and the like.
  • filler examples include alumina, silica, zirconia, and magnesium oxide.
  • the linear expansion coefficient of the adhesive layer is adjusted by one embodiment, the type and / or addition amount of the filler (filler).
  • any appropriate solvent is used as the dispersion medium.
  • an aqueous solvent or an organic solvent may be used.
  • the aqueous solvent is preferable in that it can form a higher heat-resistant adhesive layer.
  • an organic solvent is preferable at the point which is excellent in affinity with a carbon nanotube aggregate.
  • the components in the ceramic adhesive can be appropriately selected according to the material constituting the first substrate, the material constituting the second substrate, the desired heat-resistant temperature, and the like.
  • a metal alkoxide is used as a curing component
  • alumina is used as a filler
  • an alcohol such as methanol is used as a dispersion medium.
  • the carbon-based adhesive includes a binder, a carbon-based filler, and a solvent.
  • the binder include alkali metal silicate, phosphate, metal alkoxide and the like, and alkali metal silicate is preferable.
  • the carbon filler include graphite powder and carbon black, and carbon black is preferable.
  • the solvent include water.
  • the carbon-based adhesive may include a predetermined resin and a carbon-based filler.
  • a resin that becomes non-graphitizable carbon by heating can be used.
  • examples of such a resin include a phenol resin and a polycarbodiimide resin.
  • Examples of the carbon filler include graphite powder and carbon black.
  • the carbon-based adhesive may contain any appropriate solvent. Examples of the solvent contained in the carbon-based adhesive include water, phenol, formaldehyde, ethanol, and the like.
  • the linear expansion coefficient of the adhesive layer is preferably 5 ppm / ° C. to 12 ppm / ° C., more preferably 6 ppm / ° C. to 9 ppm / ° C. Within such a range, it is possible to obtain a conveyance fixing jig in which the aggregate of carbon nanotubes is not easily detached even at high temperatures.
  • the linear expansion coefficient of an adhesive bond layer is a linear expansion coefficient after hardening an adhesive agent.
  • the volume expansion coefficient of the adhesive layer is preferably 15 ppm / ° C. to 36 ppm / ° C., more preferably 18 ppm / ° C. to 27 ppm / ° C. Within such a range, it is possible to obtain a conveyance fixing jig in which the aggregate of carbon nanotubes is not easily detached even at high temperatures.
  • the volume expansion coefficient of the adhesive layer is a volume expansion coefficient after the adhesive is cured.
  • the agent layer elastic modulus is preferably 50% or less, more preferably 30% or less.
  • the measurement conditions of the single indentation measurement by a nano indenter are as follows. Apparatus: Hysitron Inc. Made by Triboindenter Working indenter: Berkovich (triangular pyramid type) Measuring method: Single indentation measurement Measuring temperature: 25 ° C (room temperature) Pushing depth setting: 5 ⁇ m
  • the thickness of the adhesive layer is preferably 0.1 ⁇ m to 100 ⁇ m, more preferably 0.5 ⁇ m to 50 ⁇ m, and further preferably 1.0 ⁇ m to 20 ⁇ m. If it is such a range, a carbon nanotube aggregate or a 2nd base material and a 1st base material can be firmly joined via this adhesive bond layer.
  • Carbon nanotube aggregate The carbon nanotube aggregate is composed of a plurality of carbon nanotubes.
  • the length of the carbon nanotube is preferably 50 ⁇ m to 3000 ⁇ m, more preferably 200 ⁇ m to 2000 ⁇ m, still more preferably 300 ⁇ m to 1500 ⁇ m, particularly preferably 400 ⁇ m to 1000 ⁇ m, and most preferably 500 ⁇ m to 1000 ⁇ m. is there. Within such a range, it is possible to form a conveyance fixing jig that has a high grip force and that hardly contaminates the object to be conveyed.
  • the aggregate of carbon nanotubes can take, for example, embodiments described later (first embodiment and second embodiment).
  • the first embodiment of the aggregate of carbon nanotubes includes a plurality of carbon nanotubes, the carbon nanotubes have a plurality of layers, the distribution width of the number distribution of the carbon nanotubes is 10 or more, and the number distribution of the carbon nanotubes The relative frequency of the mode value is 25% or less.
  • the distribution width of the number distribution of carbon nanotubes is preferably 10 or more, more preferably 10 to 30 layers, still more preferably 10 to 25 layers, and particularly preferably. Is 10 to 20 layers.
  • the “distribution width” of the number distribution of carbon nanotubes refers to the difference between the maximum number and the minimum number of carbon nanotube layers. By adjusting the distribution width of the number distribution of the carbon nanotubes within the above range, the carbon nanotubes can have excellent mechanical properties and a high specific surface area, and further, the carbon nanotubes have excellent adhesive properties. It can be the carbon nanotube aggregate shown.
  • the number of carbon nanotube layers and the number distribution of the carbon nanotubes may be measured by any appropriate apparatus. Preferably, it is measured by a scanning electron microscope (SEM) or a transmission electron microscope (TEM). For example, at least 10, preferably 20 or more carbon nanotubes may be taken out from the aggregate of carbon nanotubes and measured by SEM or TEM to evaluate the number of layers and the number distribution of the layers.
  • SEM scanning electron microscope
  • TEM transmission electron microscope
  • the maximum number of carbon nanotube layers is preferably 5 to 30 layers, more preferably 10 to 30 layers, and even more preferably 15 to 30 layers. Particularly preferred are 15 to 25 layers.
  • the minimum number of carbon nanotube layers is preferably 1 to 10 layers, and more preferably 1 to 5 layers.
  • the carbon nanotubes can have excellent mechanical properties and a high specific surface area.
  • the carbon nanotubes can be a carbon nanotube aggregate exhibiting excellent adhesive properties.
  • the relative frequency of the mode value of the number distribution of the carbon nanotubes is preferably 25% or less, more preferably 1% to 25%, and further preferably 5% to 25%. Yes, particularly preferably 10% to 25%, most preferably 15% to 25%.
  • the carbon nanotubes can have excellent mechanical properties and a high specific surface area. It can be an aggregate of carbon nanotubes exhibiting excellent adhesive properties.
  • the mode value of the number distribution of carbon nanotubes preferably exists in the number of layers 2 to 10 and more preferably in the number of layers 3 to 10.
  • the carbon nanotubes can have excellent mechanical properties and a high specific surface area, and the carbon nanotubes have excellent adhesive properties. It can become the carbon nanotube aggregate which shows.
  • the shape of the carbon nanotube it is sufficient that its cross section has any appropriate shape.
  • the cross section may be substantially circular, elliptical, n-gonal (n is an integer of 3 or more), and the like.
  • the length of the carbon nanotube is preferably 50 ⁇ m or more, more preferably 100 ⁇ m to 3000 ⁇ m, still more preferably 300 ⁇ m to 1500 ⁇ m, still more preferably 400 ⁇ m to 1000 ⁇ m, and particularly preferably. Is 500 ⁇ m to 1000 ⁇ m.
  • the carbon nanotubes can have excellent mechanical properties and a high specific surface area, and the carbon nanotubes can exhibit excellent adhesion properties. It can be a body.
  • the diameter of the carbon nanotube is preferably 0.3 nm to 2000 nm, more preferably 1 nm to 1000 nm, and further preferably 2 nm to 500 nm.
  • the carbon nanotubes can have excellent mechanical properties and a high specific surface area.
  • the carbon nanotube aggregates exhibit excellent adhesive properties. Can be.
  • the specific surface area and density of the carbon nanotubes can be set to any appropriate values.
  • the second embodiment of the aggregate of carbon nanotubes includes a plurality of carbon nanotubes, the carbon nanotubes have a plurality of layers, and the mode of the number distribution of the carbon nanotubes is present in the number of layers of 10 or less.
  • the relative frequency of the mode value is 30% or more.
  • the distribution width of the number distribution of carbon nanotubes is preferably 9 or less, more preferably 1 to 9 layers, still more preferably 2 to 8 layers, and particularly preferably. Is 3 to 8 layers.
  • the maximum number of carbon nanotube layers is preferably 1 to 20 layers, more preferably 2 to 15 layers, and further preferably 3 to 10 layers.
  • the minimum number of carbon nanotube layers is preferably 1 to 10 layers, and more preferably 1 to 5 layers.
  • the carbon nanotubes can have excellent mechanical properties and a high specific surface area.
  • the carbon nanotubes can be a carbon nanotube aggregate exhibiting excellent adhesive properties.
  • the relative frequency of the mode value of the number distribution of the carbon nanotubes is preferably 30% or more, more preferably 30% to 100%, and further preferably 30% to 90%. Particularly preferably 30% to 80%, most preferably 30% to 70%.
  • the carbon nanotubes can have excellent mechanical properties and a high specific surface area. It can be an aggregate of carbon nanotubes exhibiting excellent adhesive properties.
  • the mode value of the number distribution of carbon nanotubes is preferably present in the number of layers of 10 or less, more preferably in the number of layers from 1 to 10, and more preferably in the number of layers.
  • the number of layers is from 2 to 8 and particularly preferably from 2 to 6 layers.
  • the cross section may have any appropriate shape.
  • the cross section may be substantially circular, elliptical, n-gonal (n is an integer of 3 or more), and the like.
  • the length of the carbon nanotube is preferably 50 ⁇ m or more, more preferably 550 ⁇ m to 3000 ⁇ m, still more preferably 600 ⁇ m to 2000 ⁇ m, still more preferably 650 ⁇ m to 1000 ⁇ m, and particularly preferably. Is 700 ⁇ m to 1000 ⁇ m.
  • the carbon nanotubes can have excellent mechanical properties and a high specific surface area, and the carbon nanotubes can exhibit excellent adhesion properties. It can be a body.
  • the diameter of the carbon nanotube is preferably 0.3 nm to 2000 nm, more preferably 1 nm to 1000 nm, and further preferably 2 nm to 500 nm.
  • the carbon nanotubes can have excellent mechanical properties and a high specific surface area.
  • the carbon nanotube aggregates exhibit excellent adhesive properties. Can be.
  • the specific surface area and density of the carbon nanotubes can be set to any appropriate values.
  • At least a portion including the tip of the carbon nanotube is coated with an inorganic material.
  • the “part including at least the tip” as used herein means a portion including at least the tip of the carbon nanotube, that is, the tip of the carbon nanotube opposite to the first substrate.
  • All of the above carbon nanotubes may be covered with an inorganic material at least at a portion including the tip, or a portion thereof may be covered with an inorganic material at least a portion including the tip.
  • the content ratio of the carbon nanotube in which at least the portion including the tip of the carbon nanotube is coated with an inorganic material is preferably 50 wt% to 100 wt%, more preferably 60 wt% to 100 wt%. % By weight, more preferably 70% by weight to 100% by weight, further preferably 80% by weight to 100% by weight, particularly preferably 90% by weight to 100% by weight, and most preferably substantially 100% by weight. If it is such a range, the conveyance fixing jig
  • the thickness of the coating layer is preferably 1 nm or more, more preferably 3 nm or more, further preferably 5 nm or more, further preferably 7 nm or more, particularly preferably 9 nm or more, and most preferably 10 nm. That's it.
  • the upper limit of the thickness of the coating layer is preferably 50 nm, more preferably 40 nm, still more preferably 30 nm, particularly preferably 20 nm, and most preferably 15 nm. Within such a range, it is possible to form a conveyance fixing jig that has a high grip force and that hardly contaminates the object to be conveyed.
  • the length of the coating layer is preferably 1 nm to 1000 nm, more preferably 5 nm to 700 nm, still more preferably 10 nm to 500 nm, particularly preferably 30 nm to 300 nm, and most preferably 50 nm to 100 nm. is there. If it is such a range, the conveyance fixing jig
  • inorganic material arbitrary appropriate inorganic materials can be employ
  • examples of such inorganic materials include SiO 2 , Al 2 O 3 , Fe 2 O 3 , TiO 2 , MgO, Cu, Ag, and Au.
  • Any appropriate method can be adopted as a method for producing a carbon nanotube aggregate.
  • a method for producing a carbon nanotube aggregate for example, a chemical vapor phase is formed in which a catalyst layer is formed on a flat plate, a carbon source is filled in a state where the catalyst is activated by heat, plasma, etc., and carbon nanotubes are grown.
  • a method of producing an aggregate of carbon nanotubes oriented substantially vertically from a flat plate by a growth method (Chemical Vapor Deposition: CVD method).
  • any appropriate flat plate can be adopted as a flat plate that can be used in the method for producing a carbon nanotube aggregate.
  • the material which has smoothness and the high temperature heat resistance which can endure manufacture of a carbon nanotube is mentioned.
  • examples of such materials include quartz glass, silicon (such as a silicon wafer), and a metal plate such as aluminum.
  • any appropriate apparatus can be adopted as an apparatus for producing the carbon nanotube aggregate.
  • a thermal CVD apparatus as shown in FIG. 4, a hot wall type configured by surrounding a cylindrical reaction vessel with a resistance heating type electric tubular furnace, and the like can be mentioned.
  • a heat-resistant quartz tube is preferably used as the reaction vessel.
  • Any suitable catalyst can be used as a catalyst (catalyst layer material) that can be used in the production of the carbon nanotube aggregate.
  • metal catalysts such as iron, cobalt, nickel, gold, platinum, silver, copper, are mentioned.
  • an alumina / hydrophilic film may be provided between the flat plate and the catalyst layer as necessary.
  • any appropriate method can be adopted as a method for producing the alumina / hydrophilic film.
  • it can be obtained by forming a SiO 2 film on a flat plate, depositing Al, and then oxidizing it by raising the temperature to 450 ° C.
  • Al 2 O 3 interacts with the SiO 2 film hydrophilic, different Al 2 O 3 surface particle diameters than those deposited Al 2 O 3 directly formed.
  • Al is heated up to 450 ° C. and oxidized without forming a hydrophilic film on a flat plate, Al 2 O 3 surfaces having different particle diameters may not be formed easily.
  • Al 2 O 3 surfaces having different particle diameters may not be easily formed.
  • the thickness of the catalyst layer that can be used in the production of the carbon nanotube aggregate is preferably 0.01 nm to 20 nm, more preferably 0.1 nm to 10 nm in order to form fine particles.
  • the formed carbon nanotubes can have both excellent mechanical properties and a high specific surface area. It can be a carbon nanotube aggregate exhibiting excellent adhesive properties.
  • Any appropriate method can be adopted as a method for forming the catalyst layer.
  • a method of depositing a metal catalyst by EB (electron beam), sputtering, or the like, a method of applying a suspension of metal catalyst fine particles on a flat plate, and the like can be mentioned.
  • any appropriate carbon source can be used as the carbon source that can be used for the production of the carbon nanotube aggregate.
  • hydrocarbons such as methane, ethylene, acetylene, and benzene
  • alcohols such as methanol and ethanol
  • Arbitrary appropriate temperature can be employ
  • the temperature is preferably 400 ° C to 1000 ° C, more preferably 500 ° C to 900 ° C, and further preferably 600 ° C to 800 ° C. .
  • the second base material may be a flat plate used when forming the carbon nanotube aggregate. That is, the conveyance fixing jig provided with the second base material is obtained by laminating the flat plate on which the carbon nanotube aggregate is formed as it is on the first base material.
  • the conveyance fixing jig can be manufactured by any appropriate method.
  • the adhesive constituting the adhesive layer is applied on the first substrate, the carbon nanotube aggregate is disposed on the applied layer formed by the application, and then the applied layer is cured. Thereby, an adhesive bond layer can be formed and a conveyance fixing jig can be obtained.
  • the method of arranging the carbon nanotube aggregate on the coating layer include a method of transferring the carbon nanotube aggregate to the coating layer from the flat plate with the carbon nanotube aggregate obtained by the method described in the above section D. It is done.
  • a flat plate in which an adhesive constituting an adhesive layer is applied on a first substrate, and an aggregate of carbon nanotubes is formed on the coating layer formed by the application. ), And then the coating layer is cured to obtain a transport fixture.
  • any appropriate method can be adopted as an adhesive application method.
  • the application method include application using a comma coater or a die coater, application using a dispenser, application using a squeegee, and the like.
  • a method for curing the adhesive application layer may be adopted.
  • a method of curing by heating is preferably used.
  • the curing temperature can be appropriately set according to the type of adhesive.
  • the curing temperature is, for example, 90 ° C. to 400 ° C.
  • when a carbon-based adhesive is used as the adhesive it is baked at a high temperature after curing.
  • the firing temperature is preferably higher than the use temperature of the adhesive, for example, 350 ° C. to 3000 ° C.
  • an Fe thin film was further formed as a catalyst layer (sputtering gas: Ar, gas pressure: 0.75 Pa, growth rate: 0) using a sputtering apparatus (trade name “CFS-4ES” manufactured by Shibaura Mechatronics). .012 nm / sec, thickness: 1.0 nm). Thereafter, this flat plate was placed in a 30 mm ⁇ quartz tube, and a mixed gas of helium / hydrogen (105/80 sccm) maintained at a moisture content of 700 ppm was allowed to flow through the quartz tube for 30 minutes to replace the inside of the tube. Thereafter, the inside of the tube was heated to 765 ° C.
  • Example 1 An adhesive (manufactured by Three Bond, trade name “TB3732”, binder: metal alkoxide, filler: alumina) was applied onto the first base material (manufactured by Ceramics; linear expansion coefficient: 8 ppm / ° C.) using a squeegee. .
  • the carbon nanotube aggregate obtained in Production Example 1 was collected from the flat plate and placed on the adhesive coating layer. At this time, it arrange
  • a weight is placed on the opposite side of the carbon nanotube aggregate from the adhesive coating layer through a clean wafer, and a load of 50 g / cm 2 is applied for 1 minute to bring the carbon nanotube aggregate and the adhesive coating layer into close contact with each other. I let you.
  • the laminate obtained as described above was placed at room temperature for 1 hour and further in an environment of 100 ° C. for 30 minutes to cure the adhesive.
  • a conveyance fixing jig composed of the first base material / adhesive layer (thickness: 10 ⁇ m) / carbon nanotube aggregate was obtained.
  • Example 2 instead of adhesive (trade name “TB3732” manufactured by ThreeBond Co., Ltd., binder: metal alkoxide, filler: alumina), adhesive (trade name “G7716” manufactured by EM Japan Co., Ltd., binder: silicate, filler: carbon) A laminate was obtained in the same manner as in Example 1 except that was used. The laminate is placed at room temperature for 2 hours and further in an environment of 100 ° C. for 2 hours to cure the adhesive, and from the first substrate / adhesive layer (thickness: 10 ⁇ m) / carbon nanotube aggregate A configured transport fixture was obtained.
  • adhesive trade name “TB3732” manufactured by ThreeBond Co., Ltd., binder: metal alkoxide, filler: alumina
  • adhesive trade name “G7716” manufactured by EM Japan Co., Ltd., binder: silicate, filler: carbon
  • Example 3 instead of adhesive (trade name “TB3732”, manufactured by ThreeBond Co., Ltd., binder: metal alkoxide, filler: alumina), adhesive (trade name “RG-57-2-3”, manufactured by Ein Co., Ltd.); binder: organopolysiloxane
  • a laminate was obtained in the same manner as in Example 1 except that filler: silicon dioxide (silica), titanium dioxide (titania), potassium titanate, solvent: ethylene glycol dibutyl ether was used.
  • the laminate is placed in an environment at 80 ° C. for 30 minutes, further in an environment at 150 ° C. for 30 minutes, and further in an environment at 400 ° C. for 2 hours to cure and fire the adhesive.
  • a conveyance fixing jig composed of a material / adhesive layer (thickness: 20 ⁇ m) / carbon nanotube aggregate was obtained.
  • Example 4 The first base material (made of ceramics; linear expansion coefficient: 3 ppm / ° C.) was used instead of the first base material (made of ceramics; linear expansion coefficient: 8 ppm / ° C.), and an adhesive (Three Bond Co., Ltd.) Manufactured, trade name “TB3732”, binder: metal alkoxide, filler: alumina, adhesive (trade name “RG-12-6-2, manufactured by Ein Co., Ltd.); binder: organopolysiloxane, filler: silicon dioxide A laminate was obtained in the same manner as in Example 1 except that (silica), titanium dioxide (titania), solvent: ethylene glycol monobutyl ether) were used.
  • the laminate is placed in an environment at 80 ° C. for 30 minutes, further in an environment at 150 ° C. for 30 minutes, and further in an environment at 400 ° C. for 2 hours to cure and fire the adhesive.
  • a conveyance fixing jig composed of a material / adhesive layer (thickness: 20 ⁇ m) / carbon nanotube aggregate was obtained.
  • thermomechanical analyzer manufactured by Shimadzu Corporation, "TMA-60"

Abstract

L'invention concerne un montage de fixation pour transport qui présente une excellente force de serrage, ne contamine pas aisément une pièce (objet en cours de transport), et présente une résistance exceptionnelle à la chaleur. Ce montage de fixation pour transport comporte un premier élément de socle, un ensemble de nanotubes en carbone et une couche adhésive disposée entre le premier élément de socle et l'ensemble de nanotubes en carbone. Le premier élément de socle et l'ensemble de nanotubes en carbone sont collés à la couche adhésive interposée entre eux, et le rapport entre le coefficient de dilatation linéaire du premier élément de socle et le coefficient de dilatation linéaire de la couche adhésive (couche adhésive/élément de socle) est de 0,7 à 1,8.
PCT/JP2017/010140 2016-03-18 2017-03-14 Montage de fixation pour transport WO2017159661A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US16/084,628 US11420832B2 (en) 2016-03-18 2017-03-14 Transport fixing jig
EP17766660.9A EP3432350A4 (fr) 2016-03-18 2017-03-14 Montage de fixation pour transport
KR1020187026540A KR20180124870A (ko) 2016-03-18 2017-03-14 반송 고정 지그
CN201780018295.7A CN108886011A (zh) 2016-03-18 2017-03-14 输送固定夹具

Applications Claiming Priority (4)

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JP2016055245 2016-03-18
JP2016-055245 2016-03-18
JP2017-046313 2017-03-10
JP2017046313A JP2017175126A (ja) 2016-03-18 2017-03-10 搬送固定治具

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US11390525B2 (en) * 2016-10-03 2022-07-19 Nitto Denko Corporation Carbon nanotube aggregate comprising a non-aligned portion

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JP2004127737A (ja) * 2002-10-03 2004-04-22 Hitachi Zosen Corp カーボンナノチューブ導電性材料およびその製造方法
JP2013208881A (ja) * 2012-03-30 2013-10-10 Nippon Zeon Co Ltd グラフェン層含有多層フィルムとその製造方法、接着性グラフェン膜／金属箔積層体
JP2014116562A (ja) * 2012-12-12 2014-06-26 Hitachi High-Technologies Corp 半導体製造装置および半導体製造装置における基板の除電方法
WO2016027600A1 (fr) * 2014-08-21 2016-02-25 日東電工株式会社 Élément de support de semi-conducteur et élément de fixation de semi-conducteur

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Publication number Priority date Publication date Assignee Title
JP2004127737A (ja) * 2002-10-03 2004-04-22 Hitachi Zosen Corp カーボンナノチューブ導電性材料およびその製造方法
JP2013208881A (ja) * 2012-03-30 2013-10-10 Nippon Zeon Co Ltd グラフェン層含有多層フィルムとその製造方法、接着性グラフェン膜／金属箔積層体
JP2014116562A (ja) * 2012-12-12 2014-06-26 Hitachi High-Technologies Corp 半導体製造装置および半導体製造装置における基板の除電方法
WO2016027600A1 (fr) * 2014-08-21 2016-02-25 日東電工株式会社 Élément de support de semi-conducteur et élément de fixation de semi-conducteur

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See also references of EP3432350A4 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11390525B2 (en) * 2016-10-03 2022-07-19 Nitto Denko Corporation Carbon nanotube aggregate comprising a non-aligned portion

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