WO2017148050A1 - 用于数据中心机柜的冷却装置、机柜和冷却*** - Google Patents

用于数据中心机柜的冷却装置、机柜和冷却*** Download PDF

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WO2017148050A1
WO2017148050A1 PCT/CN2016/086409 CN2016086409W WO2017148050A1 WO 2017148050 A1 WO2017148050 A1 WO 2017148050A1 CN 2016086409 W CN2016086409 W CN 2016086409W WO 2017148050 A1 WO2017148050 A1 WO 2017148050A1
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pipe
heat
cooling device
cabinet
heat exchanger
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PCT/CN2016/086409
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English (en)
French (fr)
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唐虎
谭显光
陈国峰
张炳华
张家军
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北京百度网讯科技有限公司
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Publication of WO2017148050A1 publication Critical patent/WO2017148050A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades

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  • the present application relates to the field of computer technologies, and in particular to the field of computer data center technologies, and in particular, to a cooling device, a cabinet, and a cooling system for a data center cabinet.
  • the purpose of the present application is to propose an improved cooling device, cabinet and cooling system for a data center cabinet to solve the technical problems mentioned in the background section above.
  • the present application provides a cooling device for a data center cabinet, comprising: a heat pipe, an evaporation end is disposed on a heat source surface of the server in the cabinet, and a condensation end is inserted into a heat pipe jack of the heat exchange tube in the heat exchanger;
  • the heat exchanger is disposed on the back plate of the cabinet, and has a liquid refrigerant input pipe at the bottom and a gaseous refrigerant output pipe at the top, the liquid refrigerant
  • the heat exchange tube is longitudinally connected between the input pipe and the gaseous refrigerant output pipe, and the heat pipe jack is disposed on the heat exchange pipe.
  • the present application provides a cabinet including a cabinet body and a cooling device as described above.
  • the present application provides a cooling system comprising: a cooling device as described above; a liquid supply pipe, a liquid refrigerant output pipe connecting the liquid refrigerant input pipe of the cooling device and a cooler; and a return air pipe; a gas refrigerant outlet pipe of the cooling device and a gas refrigerant input pipe of the cooler; the cooler for cooling a gaseous refrigerant input from the gas refrigerant input pipe and cooling and outputting from the liquid state
  • the tube outputs a liquid refrigerant.
  • the cooling device, the cabinet and the cooling system for the data center cabinet provided by the present application are provided with a heat pipe, and the evaporation end of the heat pipe is disposed on the heat source surface of the server in the cabinet, and the condensation end is inserted into the heat pipe of the heat exchange tube in the heat exchanger.
  • the heat exchange tube of the longitudinal communication is arranged, and the heat pipe jack is arranged on the heat exchange tube, so that the heat dissipated by the heat source is quickly introduced into the heat exchanger through the heat pipe, and then the refrigerant in the heat exchanger is vaporized and cooled, so that the heat can be quickly exported.
  • the heat dissipated by the heat source in the server improves the heat dissipation efficiency of the high heat dissipation device or the high density device.
  • FIG. 1 is an exemplary structural diagram of a cooling device for a data center cabinet in accordance with an embodiment of the present application
  • FIG. 2 is an exemplary structural view of a heat exchanger according to an embodiment of the present application.
  • FIG. 3 is an exemplary structural diagram of a cooling system according to an embodiment of the present application.
  • the cooling device 100 of the data center cabinet may include, but is not limited to, a heat pipe 110 and a heat exchanger 120.
  • the heat pipe 110 has an evaporation end 111 disposed on the heat source surface of the server 140 in the cabinet 130, and a condensation end 112 inserted into the heat pipe socket of the heat exchange tube in the heat exchanger 120.
  • the heat pipe 110 is a heat transfer element, which fully utilizes the principle of heat conduction and the rapid heat transfer property of the phase change medium, and the heat of the heat radiating object is quickly transmitted to the heat source through the heat pipe, and the heat conductivity thereof exceeds any known metal. Thermal conductivity.
  • the heat pipe is composed of a casing, a wick, and an end cover. The inside of the heat pipe is drawn into a negative pressure state and filled with a suitable liquid which has a low boiling point and is easily volatilized.
  • the tube wall has a wick which is composed of a capillary porous material.
  • One end of the heat pipe is an evaporation end, and the other end is a condensation end.
  • a heat source is a device that can dissipate high heat in a server and can include one or more of the following: a central processing unit CPU, a graphics processor GPU, a field programmable gate array FPGA chip, a variable logic control CPLD chip, and a digital signal processing technology.
  • Chip DSP processor ARM, memory, printed circuit board PCB and power supply.
  • the number of heat pipe jacks can be determined according to the number of heat sources using the heat pipes;
  • the shape of the heat pipe jack can be adapted to the shape of the heat pipe.
  • the connection of the heat pipe to the heat pipe socket can be welded or radially sealed to improve the sealing performance of the connection.
  • the heat exchanger 120 is disposed on the back plate of the cabinet 130, and has a liquid refrigerant input pipe at the bottom, a gas refrigerant output pipe at the top, and a longitudinal communication between the liquid refrigerant input pipe and the gas refrigerant output pipe.
  • the heat exchange tube and the heat exchange tube are provided with a heat pipe jack.
  • the heat exchanger 120 is a device for transferring part of the heat of the hot fluid to the cold fluid, which is also called a heat exchanger, and can be arranged one by one corresponding to the server; or the heat exchanger is arranged correspondingly to the cabinet, that is, a heat exchanger is arranged in one cabinet. Device.
  • the heat of the heat source surface can be quickly transferred to the liquid refrigerant in the heat exchanger 120, so that the liquid refrigerant absorbs heat and vaporizes thereby
  • the heat pipe is cooled to quickly derive the heat dissipated from the heat source, thereby improving the heat dissipation efficiency of the high heat dissipation device or the high density device.
  • a fan is disposed on a side of the heat exchanger away from the server; or a fan is disposed between the heat exchanger and the server to pass heat generated by the device having low heat generation in the server through the flowing air. Passed to the heat exchanger to further increase the cooling efficiency of the server.
  • the material of the heat exchanger should have good thermal conductivity to cool the hot air flowing through the heat exchanger.
  • the fan and the heat exchanger can be arranged one-to-one, thereby increasing the air flow contacted by the single heat exchanger, and further improving the utilization efficiency of the heat exchanger.
  • the liquid refrigerant input pipe and the gaseous refrigerant output pipe may extend to the top end of the cabinet.
  • the liquid supply pipe and the return pipe of the communication cooler may be disposed at the top of the data center room to be reasonable. Take advantage of the room space and reduce the footprint of the cooling unit in the machine room.
  • the heat pipe described above may be a loop heat pipe.
  • the loop heat pipe (LHP) relies on the heat exchange between the evaporation end and the condensation end of the working fluid in the closed circuit tube (the medium that converts thermal energy and mechanical energy) to achieve heat transfer. Heat is transferred from the evaporation end to the working medium, and the working medium is turned into a gas. When the gas flows through the condensation end, it is condensed into a liquid, and the micron-sized porous capillary structure inside the evaporation end can bring the condensed liquid back by capillary force. At the evaporation end, the fluid circulation is completed and the heat transfer is achieved.
  • FIG. 2 illustrates an exemplary structural diagram of a heat exchanger 120 in accordance with an embodiment of the present application.
  • a longitudinally connected heat exchange tube 123 is disposed between the liquid refrigerant input pipe 121 of the heat exchanger 120 and the gaseous refrigerant output pipe 122, and the heat exchange pipe 123 is disposed.
  • a heat pipe jack 124 is disposed, and a liquid-cooled flat tube 125 is vertically disposed between the liquid refrigerant input pipe 121 of the heat exchanger 120 and the gas refrigerant output pipe 122.
  • the air-cooled flat pipe 125 is provided with air-cooled fins. Slice 126.
  • the device having a low heat-generating density can be dissipated through the airflow output to the heat exchanger, and the heat is exchanged.
  • the cooled airflow can again participate in the cycle to absorb heat, thereby improving the heat dissipation efficiency of the heat sink member having a low heat generation density.
  • the heat radiated from the heat source with large heat dissipation and high heat generation is quickly transmitted to the heat exchanger through the heat pipe, and at the same time, the heat dissipation of the device with low heat generation is realized by the heat conduction of the air by means of the fan and the heat exchanger, and then Heat is transferred to the outside through a cooler connected to the heat exchanger, so that different heat dissipation schemes are adopted for different heat generating heat sinks in the server, so that all devices are under the same environmental stress, and the device life of the entire server is maintained.
  • the surface of the heat exchange tube may further be provided with air-cooled fins at a gap of the heat pipe insertion hole.
  • the heat exchange tube can further improve the efficiency of cooling the flowing air while cooling the heat pipe, thereby improving the utilization efficiency of the heat exchange tubes.
  • the present application also provides a cabinet including a cabinet body and the above-described cooling device. It should be understood that the above description of the cooling device is also applicable to the cooling device in the present cabinet, and details are not described herein again.
  • the present application also provides a cooling system 150 comprising: the above-described cooling device 100 (including at least the above-mentioned heat pipe 110 and heat exchanger 120); a liquid supply pipe 151, a liquid refrigerant input pipe connecting the cooling device and a cooler a liquid refrigerant output pipe; a return gas pipe 152, a gaseous refrigerant output pipe of the cooling device and a gas refrigerant input pipe of the cooler; and a cooler 153 for cooling the gaseous refrigerant input from the gas refrigerant input pipe and from the liquid state
  • the refrigerant output pipe outputs a liquid refrigerant.
  • liquid refrigerant input pipe and the gaseous refrigerant output pipe extend to the top end of the cabinet, part of the liquid supply pipe and part of the back The air pipe can be placed at the top of the machine room where the cabinet is located. It should be understood that the above description for the cooling device is also applicable to the cooling device in the present cooling system.
  • the cooler may be a device capable of cooling a gaseous refrigerant and outputting a liquid refrigerant, such as a heat exchanger or a refrigerator.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本申请公开了用于数据中心机柜的冷却装置、机柜和冷却***。所述冷却装置的一具体实施方式包括：热管，蒸发端设于机柜中服务器的热源表面，冷凝端***换热器中换热管的热管插孔；所述换热器，设于所述机柜的背板上，底部设有液态制冷剂输入管，顶部设有气态制冷剂输出管，所述液态制冷剂输入管和气态制冷剂输出管之间设有纵向联通的所述换热管，所述换热管上设有所述热管插孔。该实施方式可以将服务器中的热源散发的热量快速导出，提高了高散热量器件或高密器件的散热效率。

Description

用于数据中心机柜的冷却装置、机柜和冷却***
相关申请的交叉引用
本申请要求于2016年2月29日提交的中国专利申请号为“201610112960.6”的优先权，其全部内容作为整体并入本申请中。
技术领域
本申请涉及计算机技术领域，具体涉及计算机数据中心技术领域，尤其涉及用于数据中心机柜的冷却装置、机柜和冷却***。
背景技术
随着大规模云计算数据中心在全球范围内的广泛部署，互联网数据中心机房内的高密度机柜不断增加，设备的处理能力日益增强，随之而来的问题在于如何对机房内的高散热量设备进行有效的降温。
在相关技术中，很多数据中心采用水冷空调为机房中的服务器降温，并且为了进一步提高降温能效，逐渐由传统的地板下送风等形式转变为水冷散热器更靠近热源的形式为数据中心的机柜降温，例如采用风扇墙、背板换热器和水冷背板等形式为数据中心的机柜降温。
然而，上述的用于数据中心的机柜的降温方式，服务器中所有器件的冷却方式一致，但高散热量器件或高密器件的散热效率较低。
发明内容
本申请的目的在于提出一种改进的用于数据中心机柜的冷却装置、机柜和冷却***，来解决以上背景技术部分提到的技术问题。
第一方面，本申请提供了一种用于数据中心机柜的冷却装置，包括：热管，蒸发端设于机柜中服务器的热源表面，冷凝端***换热器中换热管的热管插孔；所述换热器，设于所述机柜的背板上，底部设有液态制冷剂输入管，顶部设有气态制冷剂输出管，所述液态制冷剂 输入管和气态制冷剂输出管之间设有纵向联通的所述换热管，所述换热管上设有所述热管插孔。
第二方面，本申请提供了一种机柜，包括机柜本体和如上所述的冷却装置。
第三方面，本申请提供了一种冷却***，包括：如上所述的冷却装置；供液管，联通所述冷却装置的液态制冷剂输入管与冷却器的液态制冷剂输出管；回气管，联通所述冷却装置的气态制冷剂输出管与冷却器的气态制冷剂输入管；所述冷却器，用于冷却从所述气态制冷剂输入管输入的气态制冷剂并从所述液态制冷及输出管输出液态制冷剂。
本申请提供的用于数据中心机柜的冷却装置、机柜和冷却***，通过设置热管，并将热管的蒸发端设于机柜中服务器的热源表面，冷凝端***换热器中换热管的热管插孔，以及于机柜的背板上设置换热器，在换热器的底部设有液态制冷剂输入管，顶部设有气态制冷剂输出管，液态制冷剂输入管和气态制冷剂输出管之间设置纵向联通的换热管，并在换热管上设有热管插孔，使得热源散发的热量通过热管快速导入换热器,再通过换热器中的制冷剂气化制冷,从而可以快速导出服务器中热源散发的热量，提高了高散热量器件或高密器件的散热效率。
附图说明
通过阅读参照以下附图所作的对非限制性实施例所作的详细描述，本申请的其它特征、目的和优点将会变得更明显：
图1是根据本申请实施例的用于数据中心机柜的冷却装置的示例性结构图；
图2是根据本申请实施例的换热器的一种示例性结构图；
图3是根据本申请实施例的冷却***的示例性结构图。
附图标记：100-冷却装置；110-热管；111-蒸发端；112-冷凝端；120-换热器；121-液态制冷剂输入管；122-气态制冷剂输出管；123- 换热管；124-热管插孔；125-风冷扁管；126-风冷翅片；130-机柜；140-服务器；150-冷却***；151-供液管；152-回气管；153-冷却器。
具体实施方式
下面结合附图和实施例对本申请作进一步的详细说明。可以理解的是，此处所描述的具体实施例仅仅用于解释相关发明，而非对该发明的限定。另外还需要说明的是，为了便于描述，附图中仅示出了与有关发明相关的部分。
需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。下面将参考附图并结合实施例来详细说明本申请。
示例性的，数据中心机柜的冷却装置100如图1所示，可以包括但不限于热管110和换热器120。
其中，热管110，其蒸发端111设于机柜130中服务器140的热源表面，其冷凝端112***换热器120中换热管的热管插孔。
在这里，热管110是一种传热元件，它充分利用了热传导原理与相变介质的快速热传递性质，透过热管将散热物体的热量迅速传递到热源外，其导热能力超过任何已知金属的导热能力。一般热管由管壳、吸液芯和端盖组成。热管内部是被抽成负压状态，充入适当的液体，这种液体沸点低，容易挥发。管壁有吸液芯，其由毛细多孔材料构成。热管一端为蒸发端，另外一端为冷凝端，当热管一端受热时，毛细管中的液体迅速汽化，蒸气在热扩散的动力下流向另外一端，并在冷凝端冷凝释放出热量，液体再沿多孔材料靠毛细作用流回蒸发端，如此循环不止，直到热管两端温度相等(此时蒸汽热扩散停止)。这种循环是快速进行的，热量可以被源源不断地传导开来。
热源是指服务器中可以散发高热的器件，可以包括以下一项或多项：中央处理器CPU、图形处理器GPU、现场可编程门阵列FPGA芯片、可变逻辑控制CPLD芯片、实现数字信号处理技术的芯片DSP、处理器ARM、内存、印制电路板PCB和电源。
在这里，热管插孔的数量，可以根据使用热管的热源的数量确定； 热管插孔的形状，可以与热管的形状相适应。热管与热管插口的连接可以采用焊接或径向密封，以提高连接的密封性能。
换热器120，设于机柜130的背板上，底部设有液态制冷剂输入管，顶部设有气态制冷剂输出管，液态制冷剂输入管和气态制冷剂输出管之间设有纵向联通的换热管，换热管上设有热管插孔。
换热器120，是将热流体的部分热量传递给冷流体的设备，又称热交换器，可以与服务器一一对应设置；或换热器与机柜对应设置，也即一个机柜设置一个换热器。
通过在换热器120中设置换热管和热管插孔与热管110相配合，可将热源表面的热量快速传导至换热器120中的液态制冷剂中，使得液态制冷剂吸收热量气化从而冷却热管，从而快速导出热源散发的热量，提高了高散热量器件或高密器件的散热效率。
在一些可选的实现方式中，换热器远离服务器的一侧设有风扇；或换热器与服务器之间设有风扇，以便将服务器中发热密度不高的器件散发的热量通过流动的空气传递给换热器，从而进一步提高对服务器的冷却效率。在这里，换热器的材质应具有良好的热传导性能，以便对流经换热器的热空气的冷却。
在一些可选的实现方式中，风扇与换热器可以一一对应设置，从而提高单个换热器所接触的空气流量，进一步提高对换热器的利用效率。
在一些可选的实现方式中，液态制冷剂输入管和气态制冷剂输出管可以延伸至机柜的顶端，此时可以在数据中心机房的顶部设置联通冷却器的供液管和回气管，以合理利用机房空间并减少冷却装置在机房的占地面积。
在一些可选的实现方式中，上述的热管可以为回路式热管。回路式热管(LHP)依靠封闭式回路管内的工质(实现热能和机械能相互转化的媒介物质)在蒸发端与冷凝端的热交换而达成热量传递。热量从蒸发端传递给工质，使工质变成气体，当气体流经冷凝端时，其被冷凝成液体，而蒸发端内部的微米级多孔性毛细结构可利用毛细力将冷凝液体带回蒸发端，如此即可完成流体循环，达成热量的传递。
进一步参考图2，图2示出了根据本申请实施例的换热器120的一种示例性结构图。
如图2所示，当冷却装置中设有风扇时，换热器120的液态制冷剂输入管121和气态制冷剂输出管122之间设有纵向联通的换热管123，换热管123上设有热管插孔124，换热器120的液态制冷剂输入管121和气态制冷剂输出管122之间还设有纵向联通的风冷扁管125，风冷扁管125上设有风冷翅片126。
在本实施例中，通过在液态制冷剂输入管121和气态制冷剂输出管122之间设置风冷扁管，可以对发热密度不高的器件通过输出至换热器的气流散热，经换热器冷却后的气流可以再次参与循环以吸收热量，从而提高了的发热密度不高的散热器件的散热效率。
在上述实施例中，通过热管将散热量大、发热密度高的热源散发的热量快速传导至换热器，同时借助风扇及换热器，通过空气导热实现发热量不高的器件的散热，再通过换热器外接的冷却器将热量传递到室外，从而对于服务器中不同发热量的散热器件采取不同的散热方案，使所有器件处于相同的环境应力下，维持了整个服务器的器件寿命的一致性。
可选地，上述换热管的表面还可以在热管插孔的间隙处设有风冷翅片。在换热管的表面加设风冷翅片后，换热管可以在冷却热管的同时，进一步提高冷却流动空气的效率，从而提高了换热管的利用效率。
本申请还提供了一种机柜，包括机柜本体和上述的冷却装置。应当理解，上述针对冷却装置的描述也适用于本机柜中的冷却装置，在此不再赘述。
本申请还提供了一种冷却***150，包括：上述的冷却装置100(至少包括上述的热管110和换热器120)；供液管151，联通冷却装置的液态制冷剂输入管与冷却器的液态制冷剂输出管；回气管152，联通冷却装置的气态制冷剂输出管与冷却器的气态制冷剂输入管；冷却器153，用于冷却从气态制冷剂输入管输入的气态制冷剂并从液态制冷剂输出管输出液态制冷剂。在一些实现方式中，当液态制冷剂输入管和气态制冷剂输出管延伸至机柜的顶端时，部分供液管和部分回 气管可以设置于机柜所在的机房的顶部。应当理解，上述针对冷却装置的描述也适用于本冷却***中的冷却装置。
其中，冷却器可以为能够实现冷却气态制冷剂并输出液态制冷剂的器件，例如换热器或制冷机等。
以上描述仅为本申请的较佳实施例以及对所运用技术原理的说明。本领域技术人员应当理解，本申请中所涉及的发明范围，并不限于上述技术特征的特定组合而成的技术方案，同时也应涵盖在不脱离所述发明构思的情况下，由上述技术特征或其等同特征进行任意组合而形成的其它技术方案。例如上述特征与本申请中公开的(但不限于)具有类似功能的技术特征进行互相替换而形成的技术方案。

Claims (13)

  1. 一种用于数据中心机柜的冷却装置，其特征在于，包括：
    热管，蒸发端设于机柜中服务器的热源表面，冷凝端***换热器中换热管的热管插孔；
    所述换热器，设于所述机柜的背板上，底部设有液态制冷剂输入管，顶部设有气态制冷剂输出管，所述液态制冷剂输入管和气态制冷剂输出管之间设有纵向联通的所述换热管，所述换热管上设有所述热管插孔。
  2. 根据权利要求1所述的冷却装置，其特征在于，所述换热器远离所述服务器的一侧设有风扇；或
    所述换热器与所述服务器之间设有风扇。
  3. 根据权利要求2所述的冷却装置，其特征在于，所述液态制冷剂输入管和气态制冷剂输出管之间还设有纵向联通的风冷扁管，所述风冷扁管上设有风冷翅片。
  4. 根据权利要求2或3所述的冷却装置，其特征在于，
    所述换热管的表面设有风冷翅片，所述风冷翅片位于所述热管插孔的间隙处。
  5. 根据权利要求4所述的冷却装置，其特征在于，所述风扇与所述换热器一一对应设置。
  6. 根据权利要求5所述的冷却装置，其特征在于，所述换热器与所述服务器一一对应设置；或
    所述换热器与所述机柜对应设置。
  7. 根据权利要求6所述的冷却装置，其特征在于，所述液态制冷 剂输入管和所述气态制冷剂输出管延伸至所述机柜的顶端。
  8. 根据权利要求7所述的冷却装置，其特征在于，所述热管与所述热管插口的连接采用焊接或径向密封。
  9. 根据权利要求8所述的冷却装置，其特征在于，所述热管为回路式热管。
  10. 根据权利要求9所述的冷却装置，其特征在于，所述热源包括以下一项或多项：中央处理器CPU、图形处理器GPU、现场可编程门阵列FPGA芯片、可变逻辑控制CPLD芯片、实现数字信号处理技术的芯片DSP、处理器ARM、内存、印制电路板PCB和电源。
  11. 一种机柜，其特征在于，包括机柜本体和如权利要求1-10任意一项所述的冷却装置。
  12. 一种冷却***，其特征在于，包括：
    如权利要求1-10任意一项所述的冷却装置；
    供液管，联通所述冷却装置的液态制冷剂输入管与冷却器的液态制冷剂输出管；
    回气管，联通所述冷却装置的气态制冷剂输出管与冷却器的气态制冷剂输入管；
    所述冷却器，用于冷却从所述气态制冷剂输入管输入的气态制冷剂并从所述液态制冷剂输出管输出液态制冷剂。
  13. 根据权利要求12所述的冷却***，其特征在于，当所述液态制冷剂输入管和所述气态制冷剂输出管延伸至所述机柜的顶端时，部分所述供液管和部分所述回气管设置于所述机柜所在的机房的顶部。
PCT/CN2016/086409 2016-02-29 2016-06-20 用于数据中心机柜的冷却装置、机柜和冷却*** WO2017148050A1 (zh)

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