WO2017148050A1 - Dispositif de refroidissement d'armoire de centre de traitement de l'information, armoire, et système de refroidissement - Google Patents

Dispositif de refroidissement d'armoire de centre de traitement de l'information, armoire, et système de refroidissement Download PDF

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Publication number
WO2017148050A1
WO2017148050A1 PCT/CN2016/086409 CN2016086409W WO2017148050A1 WO 2017148050 A1 WO2017148050 A1 WO 2017148050A1 CN 2016086409 W CN2016086409 W CN 2016086409W WO 2017148050 A1 WO2017148050 A1 WO 2017148050A1
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WO
WIPO (PCT)
Prior art keywords
pipe
heat
cooling device
cabinet
heat exchanger
Prior art date
Application number
PCT/CN2016/086409
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English (en)
Chinese (zh)
Inventor
唐虎
谭显光
陈国峰
张炳华
张家军
Original Assignee
北京百度网讯科技有限公司
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Application filed by 北京百度网讯科技有限公司 filed Critical 北京百度网讯科技有限公司
Publication of WO2017148050A1 publication Critical patent/WO2017148050A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades

Definitions

  • the present application relates to the field of computer technologies, and in particular to the field of computer data center technologies, and in particular, to a cooling device, a cabinet, and a cooling system for a data center cabinet.
  • the purpose of the present application is to propose an improved cooling device, cabinet and cooling system for a data center cabinet to solve the technical problems mentioned in the background section above.
  • the present application provides a cooling device for a data center cabinet, comprising: a heat pipe, an evaporation end is disposed on a heat source surface of the server in the cabinet, and a condensation end is inserted into a heat pipe jack of the heat exchange tube in the heat exchanger;
  • the heat exchanger is disposed on the back plate of the cabinet, and has a liquid refrigerant input pipe at the bottom and a gaseous refrigerant output pipe at the top, the liquid refrigerant
  • the heat exchange tube is longitudinally connected between the input pipe and the gaseous refrigerant output pipe, and the heat pipe jack is disposed on the heat exchange pipe.
  • the present application provides a cabinet including a cabinet body and a cooling device as described above.
  • the present application provides a cooling system comprising: a cooling device as described above; a liquid supply pipe, a liquid refrigerant output pipe connecting the liquid refrigerant input pipe of the cooling device and a cooler; and a return air pipe; a gas refrigerant outlet pipe of the cooling device and a gas refrigerant input pipe of the cooler; the cooler for cooling a gaseous refrigerant input from the gas refrigerant input pipe and cooling and outputting from the liquid state
  • the tube outputs a liquid refrigerant.
  • the cooling device, the cabinet and the cooling system for the data center cabinet provided by the present application are provided with a heat pipe, and the evaporation end of the heat pipe is disposed on the heat source surface of the server in the cabinet, and the condensation end is inserted into the heat pipe of the heat exchange tube in the heat exchanger.
  • the heat exchange tube of the longitudinal communication is arranged, and the heat pipe jack is arranged on the heat exchange tube, so that the heat dissipated by the heat source is quickly introduced into the heat exchanger through the heat pipe, and then the refrigerant in the heat exchanger is vaporized and cooled, so that the heat can be quickly exported.
  • the heat dissipated by the heat source in the server improves the heat dissipation efficiency of the high heat dissipation device or the high density device.
  • FIG. 1 is an exemplary structural diagram of a cooling device for a data center cabinet in accordance with an embodiment of the present application
  • FIG. 2 is an exemplary structural view of a heat exchanger according to an embodiment of the present application.
  • FIG. 3 is an exemplary structural diagram of a cooling system according to an embodiment of the present application.
  • the cooling device 100 of the data center cabinet may include, but is not limited to, a heat pipe 110 and a heat exchanger 120.
  • the heat pipe 110 has an evaporation end 111 disposed on the heat source surface of the server 140 in the cabinet 130, and a condensation end 112 inserted into the heat pipe socket of the heat exchange tube in the heat exchanger 120.
  • the heat pipe 110 is a heat transfer element, which fully utilizes the principle of heat conduction and the rapid heat transfer property of the phase change medium, and the heat of the heat radiating object is quickly transmitted to the heat source through the heat pipe, and the heat conductivity thereof exceeds any known metal. Thermal conductivity.
  • the heat pipe is composed of a casing, a wick, and an end cover. The inside of the heat pipe is drawn into a negative pressure state and filled with a suitable liquid which has a low boiling point and is easily volatilized.
  • the tube wall has a wick which is composed of a capillary porous material.
  • One end of the heat pipe is an evaporation end, and the other end is a condensation end.
  • a heat source is a device that can dissipate high heat in a server and can include one or more of the following: a central processing unit CPU, a graphics processor GPU, a field programmable gate array FPGA chip, a variable logic control CPLD chip, and a digital signal processing technology.
  • Chip DSP processor ARM, memory, printed circuit board PCB and power supply.
  • the number of heat pipe jacks can be determined according to the number of heat sources using the heat pipes;
  • the shape of the heat pipe jack can be adapted to the shape of the heat pipe.
  • the connection of the heat pipe to the heat pipe socket can be welded or radially sealed to improve the sealing performance of the connection.
  • the heat exchanger 120 is disposed on the back plate of the cabinet 130, and has a liquid refrigerant input pipe at the bottom, a gas refrigerant output pipe at the top, and a longitudinal communication between the liquid refrigerant input pipe and the gas refrigerant output pipe.
  • the heat exchange tube and the heat exchange tube are provided with a heat pipe jack.
  • the heat exchanger 120 is a device for transferring part of the heat of the hot fluid to the cold fluid, which is also called a heat exchanger, and can be arranged one by one corresponding to the server; or the heat exchanger is arranged correspondingly to the cabinet, that is, a heat exchanger is arranged in one cabinet. Device.
  • the heat of the heat source surface can be quickly transferred to the liquid refrigerant in the heat exchanger 120, so that the liquid refrigerant absorbs heat and vaporizes thereby
  • the heat pipe is cooled to quickly derive the heat dissipated from the heat source, thereby improving the heat dissipation efficiency of the high heat dissipation device or the high density device.
  • a fan is disposed on a side of the heat exchanger away from the server; or a fan is disposed between the heat exchanger and the server to pass heat generated by the device having low heat generation in the server through the flowing air. Passed to the heat exchanger to further increase the cooling efficiency of the server.
  • the material of the heat exchanger should have good thermal conductivity to cool the hot air flowing through the heat exchanger.
  • the fan and the heat exchanger can be arranged one-to-one, thereby increasing the air flow contacted by the single heat exchanger, and further improving the utilization efficiency of the heat exchanger.
  • the liquid refrigerant input pipe and the gaseous refrigerant output pipe may extend to the top end of the cabinet.
  • the liquid supply pipe and the return pipe of the communication cooler may be disposed at the top of the data center room to be reasonable. Take advantage of the room space and reduce the footprint of the cooling unit in the machine room.
  • the heat pipe described above may be a loop heat pipe.
  • the loop heat pipe (LHP) relies on the heat exchange between the evaporation end and the condensation end of the working fluid in the closed circuit tube (the medium that converts thermal energy and mechanical energy) to achieve heat transfer. Heat is transferred from the evaporation end to the working medium, and the working medium is turned into a gas. When the gas flows through the condensation end, it is condensed into a liquid, and the micron-sized porous capillary structure inside the evaporation end can bring the condensed liquid back by capillary force. At the evaporation end, the fluid circulation is completed and the heat transfer is achieved.
  • FIG. 2 illustrates an exemplary structural diagram of a heat exchanger 120 in accordance with an embodiment of the present application.
  • a longitudinally connected heat exchange tube 123 is disposed between the liquid refrigerant input pipe 121 of the heat exchanger 120 and the gaseous refrigerant output pipe 122, and the heat exchange pipe 123 is disposed.
  • a heat pipe jack 124 is disposed, and a liquid-cooled flat tube 125 is vertically disposed between the liquid refrigerant input pipe 121 of the heat exchanger 120 and the gas refrigerant output pipe 122.
  • the air-cooled flat pipe 125 is provided with air-cooled fins. Slice 126.
  • the device having a low heat-generating density can be dissipated through the airflow output to the heat exchanger, and the heat is exchanged.
  • the cooled airflow can again participate in the cycle to absorb heat, thereby improving the heat dissipation efficiency of the heat sink member having a low heat generation density.
  • the heat radiated from the heat source with large heat dissipation and high heat generation is quickly transmitted to the heat exchanger through the heat pipe, and at the same time, the heat dissipation of the device with low heat generation is realized by the heat conduction of the air by means of the fan and the heat exchanger, and then Heat is transferred to the outside through a cooler connected to the heat exchanger, so that different heat dissipation schemes are adopted for different heat generating heat sinks in the server, so that all devices are under the same environmental stress, and the device life of the entire server is maintained.
  • the surface of the heat exchange tube may further be provided with air-cooled fins at a gap of the heat pipe insertion hole.
  • the heat exchange tube can further improve the efficiency of cooling the flowing air while cooling the heat pipe, thereby improving the utilization efficiency of the heat exchange tubes.
  • the present application also provides a cabinet including a cabinet body and the above-described cooling device. It should be understood that the above description of the cooling device is also applicable to the cooling device in the present cabinet, and details are not described herein again.
  • the present application also provides a cooling system 150 comprising: the above-described cooling device 100 (including at least the above-mentioned heat pipe 110 and heat exchanger 120); a liquid supply pipe 151, a liquid refrigerant input pipe connecting the cooling device and a cooler a liquid refrigerant output pipe; a return gas pipe 152, a gaseous refrigerant output pipe of the cooling device and a gas refrigerant input pipe of the cooler; and a cooler 153 for cooling the gaseous refrigerant input from the gas refrigerant input pipe and from the liquid state
  • the refrigerant output pipe outputs a liquid refrigerant.
  • liquid refrigerant input pipe and the gaseous refrigerant output pipe extend to the top end of the cabinet, part of the liquid supply pipe and part of the back The air pipe can be placed at the top of the machine room where the cabinet is located. It should be understood that the above description for the cooling device is also applicable to the cooling device in the present cooling system.
  • the cooler may be a device capable of cooling a gaseous refrigerant and outputting a liquid refrigerant, such as a heat exchanger or a refrigerator.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dispositif de refroidissement d'armoire de centre de traitement de l'information, une armoire et un système de refroidissement. Un mode de réalisation spécifique du dispositif de refroidissement comprend : des caloducs, des extrémités d'évaporation étant agencées sur la surface d'une source de chaleur d'un serveur dans une armoire, et des extrémités de condensation étant insérées dans des trous d'insertion de caloduc de tuyaux d'échange de chaleur dans un échangeur de chaleur ; et l'échangeur de chaleur, disposé sur une plaque arrière de l'armoire, un tuyau d'entrée de fluide frigorigène à l'état liquide étant disposé au fond de l'échangeur de chaleur, un tuyau de sortie de fluide frigorigène à l'état gazeux étant disposé au sommet de l'échangeur de chaleur, les tuyaux d'échange de chaleur, en communication longitudinalement, étant disposés entre le tuyau d'entrée de fluide frigorigène à l'état liquide et le tuyau de sortie de fluide frigorigène à l'état gazeux, et les trous d'insertion de caloduc étant disposés sur les tuyaux d'échange de chaleur. Le mode de réalisation permet d'exporter rapidement la chaleur dissipée à partir d'une source de chaleur dans un serveur, ce qui améliore l'efficacité de dissipation de chaleur d'un dispositif à capacité élevée de dissipation de chaleur ou d'un dispositif à haute densité.
PCT/CN2016/086409 2016-02-29 2016-06-20 Dispositif de refroidissement d'armoire de centre de traitement de l'information, armoire, et système de refroidissement WO2017148050A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610112960.6 2016-02-29
CN201610112960.6A CN105682422A (zh) 2016-02-29 2016-02-29 用于数据中心机柜的冷却装置、机柜和冷却***

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WO2017148050A1 true WO2017148050A1 (fr) 2017-09-08

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Cited By (4)

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Publication number Priority date Publication date Assignee Title
CN107979962A (zh) * 2018-01-09 2018-05-01 无锡巨日电子科技有限公司 水冷式线路板散热装置
CN108668508A (zh) * 2018-06-08 2018-10-16 浙江大学山东工业技术研究院 机柜的冷却装置及机柜
CN113551551A (zh) * 2021-08-23 2021-10-26 北京百度网讯科技有限公司 一种制冷方法和制冷***
CN115379741A (zh) * 2022-09-19 2022-11-22 沈阳澳蓝节能科技有限公司 一种基于分体热管的数据中心用冷却***

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CN105682422A (zh) * 2016-02-29 2016-06-15 北京百度网讯科技有限公司 用于数据中心机柜的冷却装置、机柜和冷却***
CN106028745B (zh) * 2016-06-16 2019-04-30 北京纳源丰科技发展有限公司 一种基于二级热管的服务器机柜的散热结构
CN107015613A (zh) * 2017-03-15 2017-08-04 北京百度网讯科技有限公司 服务器冷却***和服务器
CN107072118B (zh) * 2017-05-08 2022-08-12 广东工业大学 一种机柜抽屉隔板式热管散热装置
CN107249282B (zh) * 2017-07-10 2023-09-05 中国科学院广州能源研究所 一种减小数据中心机架服务器垂直温差的热管换热装置
US10806056B2 (en) * 2017-07-19 2020-10-13 Hewlett Packard Enterprise Development Lp Cooling system for high-performance computer
CN107728761A (zh) * 2017-11-27 2018-02-23 浪潮天元通信信息***有限公司 一种散热器及其业务实现方法、散热***
CN110678045A (zh) * 2019-09-30 2020-01-10 联想(北京)有限公司 一种散热***
CN110582189B (zh) * 2019-10-15 2024-05-21 南京工业大学 一种应用热管作为导热元件的热管式温度控制机柜
CN111093351B (zh) * 2020-01-12 2021-11-23 苏州浪潮智能科技有限公司 一种直通式散热机柜

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CN107979962A (zh) * 2018-01-09 2018-05-01 无锡巨日电子科技有限公司 水冷式线路板散热装置
CN107979962B (zh) * 2018-01-09 2024-02-20 无锡巨日电子科技有限公司 水冷式线路板散热装置
CN108668508A (zh) * 2018-06-08 2018-10-16 浙江大学山东工业技术研究院 机柜的冷却装置及机柜
CN108668508B (zh) * 2018-06-08 2024-03-26 浙江大学山东工业技术研究院 机柜的冷却装置及机柜
CN113551551A (zh) * 2021-08-23 2021-10-26 北京百度网讯科技有限公司 一种制冷方法和制冷***
CN115379741A (zh) * 2022-09-19 2022-11-22 沈阳澳蓝节能科技有限公司 一种基于分体热管的数据中心用冷却***

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