WO2017145808A1 - シリコン含有組成物を用いた半導体基板の平坦化方法 - Google Patents
シリコン含有組成物を用いた半導体基板の平坦化方法 Download PDFInfo
- Publication number
- WO2017145808A1 WO2017145808A1 PCT/JP2017/004918 JP2017004918W WO2017145808A1 WO 2017145808 A1 WO2017145808 A1 WO 2017145808A1 JP 2017004918 W JP2017004918 W JP 2017004918W WO 2017145808 A1 WO2017145808 A1 WO 2017145808A1
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- WIPO (PCT)
- Prior art keywords
- group
- polysiloxane
- coating
- methyl
- mol
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 95
- 239000000758 substrate Substances 0.000 title claims abstract description 87
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 32
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 28
- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 239000010703 silicon Substances 0.000 title abstract description 24
- -1 polysiloxane Polymers 0.000 claims abstract description 574
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 255
- 238000000576 coating method Methods 0.000 claims abstract description 226
- 239000011248 coating agent Substances 0.000 claims abstract description 223
- 229910000077 silane Inorganic materials 0.000 claims abstract description 82
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 75
- 125000005372 silanol group Chemical group 0.000 claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 claims abstract description 19
- 239000007859 condensation product Substances 0.000 claims abstract description 10
- 150000004756 silanes Chemical class 0.000 claims abstract description 9
- 125000000217 alkyl group Chemical group 0.000 claims description 43
- 125000003118 aryl group Chemical group 0.000 claims description 42
- 230000007062 hydrolysis Effects 0.000 claims description 40
- 238000006460 hydrolysis reaction Methods 0.000 claims description 40
- 239000002994 raw material Substances 0.000 claims description 23
- 238000005530 etching Methods 0.000 claims description 19
- 125000005843 halogen group Chemical group 0.000 claims description 16
- 125000003545 alkoxy group Chemical group 0.000 claims description 15
- 125000003342 alkenyl group Chemical group 0.000 claims description 13
- 125000004423 acyloxy group Chemical group 0.000 claims description 12
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 12
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 11
- 125000004171 alkoxy aryl group Chemical group 0.000 claims description 11
- 125000003700 epoxy group Chemical group 0.000 claims description 11
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 11
- 230000003301 hydrolyzing effect Effects 0.000 claims description 9
- 125000000962 organic group Chemical group 0.000 claims description 8
- 229910018540 Si C Inorganic materials 0.000 claims description 7
- 125000004429 atom Chemical group 0.000 claims description 7
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 7
- 238000009833 condensation Methods 0.000 claims description 6
- 230000005494 condensation Effects 0.000 claims description 6
- 238000010304 firing Methods 0.000 abstract 2
- 239000007858 starting material Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 56
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 52
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 44
- 238000006243 chemical reaction Methods 0.000 description 44
- 239000002253 acid Substances 0.000 description 43
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 42
- 125000005595 acetylacetonate group Chemical group 0.000 description 40
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 33
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 32
- 150000001875 compounds Chemical class 0.000 description 30
- 229920000642 polymer Polymers 0.000 description 30
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 27
- 239000003054 catalyst Substances 0.000 description 26
- 239000007787 solid Substances 0.000 description 25
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 24
- WVYWICLMDOOCFB-UHFFFAOYSA-N 4-methyl-2-pentanol Chemical compound CC(C)CC(C)O WVYWICLMDOOCFB-UHFFFAOYSA-N 0.000 description 23
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 22
- 125000004432 carbon atom Chemical group C* 0.000 description 22
- 238000010438 heat treatment Methods 0.000 description 22
- 229920002120 photoresistant polymer Polymers 0.000 description 22
- 229910052719 titanium Inorganic materials 0.000 description 22
- 239000010936 titanium Substances 0.000 description 22
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 21
- 229910052726 zirconium Inorganic materials 0.000 description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 20
- 150000001450 anions Chemical class 0.000 description 19
- 238000011156 evaluation Methods 0.000 description 19
- 239000000460 chlorine Substances 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 18
- 239000002904 solvent Substances 0.000 description 18
- 239000011259 mixed solution Substances 0.000 description 17
- 239000007983 Tris buffer Substances 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 16
- 239000003921 oil Substances 0.000 description 15
- 238000003786 synthesis reaction Methods 0.000 description 14
- IUVCFHHAEHNCFT-INIZCTEOSA-N 2-[(1s)-1-[4-amino-3-(3-fluoro-4-propan-2-yloxyphenyl)pyrazolo[3,4-d]pyrimidin-1-yl]ethyl]-6-fluoro-3-(3-fluorophenyl)chromen-4-one Chemical compound C1=C(F)C(OC(C)C)=CC=C1C(C1=C(N)N=CN=C11)=NN1[C@@H](C)C1=C(C=2C=C(F)C=CC=2)C(=O)C2=CC(F)=CC=C2O1 IUVCFHHAEHNCFT-INIZCTEOSA-N 0.000 description 13
- 239000008199 coating composition Substances 0.000 description 13
- 238000010992 reflux Methods 0.000 description 13
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 13
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- 229910052801 chlorine Inorganic materials 0.000 description 12
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 12
- 239000007789 gas Substances 0.000 description 12
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 12
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 11
- 239000004793 Polystyrene Substances 0.000 description 11
- 230000003287 optical effect Effects 0.000 description 11
- 229920002223 polystyrene Polymers 0.000 description 11
- 239000003513 alkali Substances 0.000 description 10
- 238000004090 dissolution Methods 0.000 description 10
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 10
- 150000004820 halides Chemical class 0.000 description 10
- 229910052736 halogen Inorganic materials 0.000 description 10
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 10
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 10
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 9
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 9
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 9
- 229910052794 bromium Inorganic materials 0.000 description 9
- 239000006227 byproduct Substances 0.000 description 9
- 229910052740 iodine Inorganic materials 0.000 description 9
- 239000011630 iodine Substances 0.000 description 9
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 9
- 239000004094 surface-active agent Substances 0.000 description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 8
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 8
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 8
- 239000011230 binding agent Substances 0.000 description 8
- 150000007942 carboxylates Chemical class 0.000 description 8
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 8
- 229940093499 ethyl acetate Drugs 0.000 description 8
- 235000019439 ethyl acetate Nutrition 0.000 description 8
- 150000003871 sulfonates Chemical class 0.000 description 8
- 238000011161 development Methods 0.000 description 7
- 230000018109 developmental process Effects 0.000 description 7
- 238000010894 electron beam technology Methods 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- 150000007524 organic acids Chemical class 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 6
- GZUXJHMPEANEGY-UHFFFAOYSA-N bromomethane Chemical compound BrC GZUXJHMPEANEGY-UHFFFAOYSA-N 0.000 description 6
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 6
- RWRIWBAIICGTTQ-UHFFFAOYSA-N difluoromethane Chemical compound FCF RWRIWBAIICGTTQ-UHFFFAOYSA-N 0.000 description 6
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 6
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 6
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 6
- NGAZZOYFWWSOGK-UHFFFAOYSA-N heptan-3-one Chemical compound CCCCC(=O)CC NGAZZOYFWWSOGK-UHFFFAOYSA-N 0.000 description 6
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 6
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 6
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 6
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 6
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 5
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 5
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 5
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 5
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 5
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 239000013522 chelant Substances 0.000 description 5
- 239000013065 commercial product Substances 0.000 description 5
- 238000001312 dry etching Methods 0.000 description 5
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 5
- 229940093858 ethyl acetoacetate Drugs 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 5
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 5
- 239000011976 maleic acid Substances 0.000 description 5
- 239000012528 membrane Substances 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 5
- 229910021642 ultra pure water Inorganic materials 0.000 description 5
- 239000012498 ultrapure water Substances 0.000 description 5
- FYGHSUNMUKGBRK-UHFFFAOYSA-N 1,2,3-trimethylbenzene Chemical compound CC1=CC=CC(C)=C1C FYGHSUNMUKGBRK-UHFFFAOYSA-N 0.000 description 4
- OJVAMHKKJGICOG-UHFFFAOYSA-N 2,5-hexanedione Chemical compound CC(=O)CCC(C)=O OJVAMHKKJGICOG-UHFFFAOYSA-N 0.000 description 4
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 4
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 4
- 239000005711 Benzoic acid Substances 0.000 description 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- PGMYKACGEOXYJE-UHFFFAOYSA-N anhydrous amyl acetate Natural products CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 238000004380 ashing Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 235000010233 benzoic acid Nutrition 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- NMJJFJNHVMGPGM-UHFFFAOYSA-N butyl formate Chemical compound CCCCOC=O NMJJFJNHVMGPGM-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 230000010354 integration Effects 0.000 description 4
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- TZIHFWKZFHZASV-UHFFFAOYSA-N methyl formate Chemical compound COC=O TZIHFWKZFHZASV-UHFFFAOYSA-N 0.000 description 4
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 4
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 4
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 3
- DMFAHCVITRDZQB-UHFFFAOYSA-N 1-propoxypropan-2-yl acetate Chemical compound CCCOCC(C)OC(C)=O DMFAHCVITRDZQB-UHFFFAOYSA-N 0.000 description 3
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 3
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 3
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 3
- QMYGFTJCQFEDST-UHFFFAOYSA-N 3-methoxybutyl acetate Chemical compound COC(C)CCOC(C)=O QMYGFTJCQFEDST-UHFFFAOYSA-N 0.000 description 3
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 3
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 3
- OMSXLDKDBUFAFW-UHFFFAOYSA-M C(C)CC(CC(=O)[O-])=O.[Ti+] Chemical compound C(C)CC(CC(=O)[O-])=O.[Ti+] OMSXLDKDBUFAFW-UHFFFAOYSA-M 0.000 description 3
- WWZKQHOCKIZLMA-UHFFFAOYSA-N Caprylic acid Natural products CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 3
- QMMFVYPAHWMCMS-UHFFFAOYSA-N Dimethyl sulfide Chemical compound CSC QMMFVYPAHWMCMS-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 3
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 3
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 3
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Images
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- C—CHEMISTRY; METALLURGY
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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- H01L21/31055—Planarisation of the insulating layers involving a dielectric removal step the removal being a chemical etching step, e.g. dry etching
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- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
Definitions
- the present invention relates to a method for flatly coating a semiconductor substrate using a silicon-containing composition. More specifically, the present invention is particularly suitable for forming a flat film having a good coverage with respect to a resist pattern formed on a substrate to be processed and having a difference in height and density of the resist pattern. Regarding the method.
- a technique for forming a fine pattern on a substrate and etching the substrate in accordance with this pattern to process the substrate is widely used in the field of semiconductor manufacturing.
- a pattern inversion method as one of the pattern forming techniques.
- a resist pattern is formed on the semiconductor substrate, and the resist pattern is covered with a silicon coating solution.
- the silicon-based coating liquid is filled between the resist patterns, and then baked to form a coating film.
- the upper part of the silicon-containing coating is etched back with a fluorine-based gas to expose the upper part of the resist pattern, and the gas is changed to remove the resist pattern with an oxygen-based etching gas.
- a silicon-based pattern derived from the film remains and the pattern is inverted.
- the reverse pattern is transferred to form a pattern on the substrate.
- a material using a polysiloxane and an ether solvent obtained by cohydrolysis of a silane having a group or an aryl group and tetraethoxysilane see Patent Document 1.
- the present invention uses a specific silicon-containing composition that can be satisfactorily embedded between resist patterns with respect to a stepped substrate having a difference in height or density in a resist pattern formed on a substrate to be processed, and steps according to a specific procedure.
- a method for flatly coating a substrate is provided.
- the present invention includes the following. [1] A first step of forming a first polysiloxane coating film by applying and baking a first coating polysiloxane composition containing a first coating polysiloxane on a stepped substrate, and further a first polysiloxane coating.
- a second step of forming a second polysiloxane coating film by applying and baking a second coating polysiloxane composition containing a second coating polysiloxane different from the first coating polysiloxane on the coating film A process for producing a polysiloxane-coated substrate manufactured through The iso-dense bias of the second polysiloxane coating film is 50 nm or less, Hydrolysis condensation of a hydrolyzable silane raw material containing the first hydrolyzable silane having 4 hydrolyzable groups per molecule in a proportion of 0 to 100 mol% in all silanes.
- the first coating polysiloxane is Formula (1): (In Formula (1), R 1 represents an alkyl group, an aryl group, a halogenated alkyl group, a halogenated aryl group, an alkoxyaryl group, an alkenyl group, or an epoxy group, an acryloyl group, a methacryloyl group, a mercapto group, or a cyano group.
- R 2 represents an alkoxy group, an acyloxy group, or a halogen group
- a represents an integer of 0 to 2.
- the second coating polysiloxane has the formula (1): (In Formula (1), R 1 represents an alkyl group, an aryl group, a halogenated alkyl group, a halogenated aryl group, an alkoxyaryl group, an alkenyl group, or an epoxy group, an acryloyl group, a methacryloyl group, a mercapto group, or a cyano
- a hydrolyzable silane represented by R 2 is an alkoxy group, an acyloxy group, or a halogen group, and a is 1.
- the second coating polysiloxane is 100 to 50 mol%, preferably 95 to 50 mol% of a hydrolyzable silane represented by the above formula (1) and a being 1;
- the hydrolyzable silane represented by the above formula (1) and a being 2 is 0 to 50 mol%, preferably 5 to 50 mol%.
- the second coating polysiloxane is a modified polysiloxane capped with a silanol group of a polysiloxane obtained by hydrolyzing and condensing a hydrolyzable silane raw material, the modified polysiloxane having a silanol group with respect to an Si atom.
- the modified polysiloxane has the formula (1): (In Formula (1), R 1 represents an alkyl group, an aryl group, a halogenated alkyl group, a halogenated aryl group, an alkoxyaryl group, an alkenyl group, or an epoxy group, an acryloyl group, a methacryloyl group, a mercapto group, or a cyano group. R 2 represents an alkoxy group, an acyloxy group, or a halogen group, and a is 0 to 100 mol of hydrolyzable silane.
- a method of planarizing a polysiloxane film on a stepped substrate [7] A first step of forming a first polysiloxane coating film by applying and baking a first coating polysiloxane composition containing a first coating polysiloxane on an organic pattern substrate, and further for the first coating A second polysiloxane coating film is formed by applying and baking a second coating polysiloxane composition on a first polysiloxane coating film containing a second coating polysiloxane different from the polysiloxane.
- a method for manufacturing a semiconductor device comprising: a step of etching back a polysiloxane-coated substrate manufactured through the steps to expose an organic pattern; and a step of etching and removing the organic pattern to invert the pattern.
- the coating polysiloxane composition of the present invention is coated on the patterned organic underlayer film without mixing with the patterned organic underlayer film formed on the substrate to be processed. It is possible to embed (fill) well between the patterns. In the present invention, by using a specific low silanol / low viscosity material, it becomes possible to embed a flat pattern without any difference in film thickness in various patterns.
- the coating polysiloxane composition is cured to form a polysiloxane composition film, and a flat surface can be formed later by etching back by etching (gas etching).
- the organic underlayer film can be removed by ashing (ashing treatment)
- the pattern of the organic underlayer film can be reversed to the pattern of the polysiloxane composition film formed by filling the coating polysiloxane composition.
- the substrate to be processed can be processed by these reversal patterns.
- the pattern can be reversed using a stepped substrate having a larger aspect ratio than the photoresist pattern on the substrate to be processed, and as a result, a reversed pattern having a high aspect ratio can be obtained.
- an organic underlayer film having a large aspect ratio can be embedded between patterns, coating with a specific polysiloxane composition is effective.
- a method of embedding (filling) a polysiloxane composition between photoresist patterns is difficult to perform ashing or the like because an organic film exists in the lower layer, and may be performed by gas etching. Many.
- the organic underlayer film on the substrate to be processed or on the oxide film can be reversed with the polysiloxane composition, it is cured after embedding the polysiloxane composition. The pattern can be easily reversed by the ashing process.
- the step can be completely flattened, and the super flatness of the coating film can be realized.
- a high etch resistance material for the first application not only the flatness of the coating film can be improved, but also high etching resistance can be realized.
- flattening is a coated coating in which a portion where a resist pattern exists (line portion) and a portion where a pattern does not exist (space portion) are present on the top when applied to a resist pattern. This means that there is little difference in film thickness.
- step difference board said to this invention, the wafer for semiconductor devices or a MEMS device is mentioned, for example.
- the semiconductor device manufacturing method including the method for planarizing a semiconductor substrate of the present invention usually includes a step (1) of applying a resist on the substrate, a step (2) of exposing and developing the resist, and a resist pattern during or after development.
- the step (3) is performed on the stepped substrate, The first step of applying and baking the first coating polysiloxane composition containing the first coating polysiloxane to form the first polysiloxane coating film, and the first polysiloxane coating film on the first polysiloxane coating film, A second step of forming a second polysiloxane coating film by applying and baking a second coating polysiloxane composition containing a second coating polysiloxane different from the coating polysiloxane Than is.
- the composition is coated on a resist pattern having a rough and dense
- the photoresist used in the step (1) is not particularly limited as long as it is sensitive to light used for exposure. Either a negative photoresist or a positive photoresist can be used.
- a positive photoresist comprising a novolac resin and 1,2-naphthoquinonediazide sulfonic acid ester, a chemically amplified photoresist comprising a binder having a group that decomposes with an acid to increase the alkali dissolution rate and a photoacid generator, an acid
- a chemically amplified photoresist comprising a low-molecular compound that decomposes to increase the alkali dissolution rate of the photoresist, an alkali-soluble binder, and a photoacid generator, and a binder having a group that decomposes with an acid to increase the alkali dissolution rate
- Examples include trade name APEX-E manufactured by Shipley, trade name PAR710 manufactured by Sumitomo Chemical Co., Ltd., and trade name SEPR430 manufactured by Shin-Etsu Chemical Co., Ltd. Also, for example, Proc. SPIE, Vol. 3999, 330-334 (2000), Proc. SPIE, Vol. 3999, 357-364 (2000), Proc. SPIE, Vol. 3999, 365-374 (2000), and fluorine-containing polymer-based photoresists.
- Chemically amplified resist comprising a binder having a group that decomposes with an acid generator and an acid to change the alkali dissolution rate, a low molecular weight compound that decomposes with an alkali-soluble binder, an acid generator and an acid to change the alkali dissolution rate of the resist
- a chemically amplified resist comprising: a binder having a group that decomposes with an acid generator and an acid to change the alkali dissolution rate; and a chemically amplified resist comprising a low-molecular compound that decomposes with an acid to change the alkali dissolution rate of the resist,
- non-chemically amplified resists composed of a binder having a group that changes the alkali dissolution rate by being decomposed by an electron beam and non-chemically amplified resists composed of a binder having a portion that is cut by an electron beam to change the alkali dis
- the resist solution is applied and then subjected to a baking temperature of 70 to 150 ° C. and a baking time of 0.5 to 5 minutes.
- the resist film thickness is obtained in the range of 10 to 1000 nm.
- the resist solution, the developer, and the coating materials shown below can be coated by spin coating, dipping, spraying, or the like, but the spin coating method is particularly preferable.
- the resist is exposed through a predetermined mask.
- a KrF excimer laser (wavelength 248 nm), an ArF excimer laser (wavelength 193 nm), EUV light (wavelength 13.5 nm), an electron beam, or the like can be used.
- post-exposure heating PEB: Post Exposure Bake
- the post-exposure heating is appropriately selected from a heating temperature of 70 ° C. to 150 ° C. and a heating time of 0.3 to 10 minutes.
- a step (1-1) of forming a resist underlayer film on the substrate can be included.
- the resist underlayer film has antireflection and organic hard mask functions.
- the formation of the resist in the step (1) can be performed by a step (1-1) in which a resist underlayer film is formed on the semiconductor substrate and a resist is formed thereon.
- a resist underlayer film is formed on a semiconductor substrate, a silicon hard mask is formed thereon, and a resist can be formed thereon.
- the resist underlayer film used in the above step (1-1) is for preventing irregular reflection during exposure of the upper layer resist, and is used for the purpose of improving adhesion with the resist.
- an acrylic resin or the like A novolac resin can be used.
- the resist underlayer film can form a film having a thickness of 1 to 1,000 nm on the semiconductor substrate.
- the resist underlayer film used in the above step (1-1) is a hard mask using an organic resin, and a material having a high carbon content and a low hydrogen content is used.
- a material having a high carbon content and a low hydrogen content is used.
- polyvinyl naphthalene resin, carbazole novolak resin, phenol novolak resin, naphthol novolak resin, and the like can be given. These can form a film with a film thickness of 5 to 1,000 nm on a semiconductor substrate.
- As the silicon hard mask used in the above step (1-1) polysiloxane obtained by hydrolyzing hydrolyzable silane can be used.
- polysiloxane obtained by hydrolyzing tetraethoxysilane, methyltrimethoxysilane, and phenyltriethoxysilane can be exemplified. These can form a film with a film thickness of 5 to 200 nm on the resist underlayer film.
- Step (2) exposure is performed through a predetermined mask.
- a KrF excimer laser (wavelength 248 nm), an ArF excimer laser (wavelength 193 nm), EUV (wavelength 13.5 nm), or the like can be used.
- post-exposure bake can be performed as necessary.
- the post-exposure heating is performed under conditions appropriately selected from a heating temperature of 70 ° C. to 150 ° C. and a heating time of 0.3 to 10 minutes.
- development is performed with a developer.
- a developer for example, when a positive photoresist is used, the exposed portion of the photoresist is removed, and a photoresist pattern is formed.
- Developers include aqueous solutions of alkali metal hydroxides such as potassium hydroxide and sodium hydroxide, aqueous solutions of quaternary ammonium hydroxides such as tetramethylammonium hydroxide, tetraethylammonium hydroxide and choline, ethanolamine, propylamine, An alkaline aqueous solution such as an aqueous amine solution such as ethylenediamine can be mentioned as an example. Further, a surfactant or the like can be added to these developers.
- the development conditions are appropriately selected from a temperature of 5 to 50 ° C. and a time of 10 to 600 seconds.
- an organic solvent can be used as the developer.
- development is performed with a developer (solvent). As a result, for example, when a positive photoresist is used, the unexposed portion of the photoresist is removed, and a photoresist pattern is formed.
- Developers include, for example, methyl acetate, butyl acetate, ethyl acetate, isopropyl acetate, amyl acetate, isoamyl acetate, ethyl methoxyacetate, ethyl ethoxy acetate, propylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl Ether acetate, ethylene glycol monobutyl ether acetate, ethylene glycol monophenyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monopropyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monophenyl ether acetate, diethylene glycol monobutyl ether acetate, diethylene glycol Monoethyl ether acetate, 2-methoxybutyl acetate, 3-methoxybutyl acetate,
- a first polysiloxane coating film is prepared by applying and baking a first coating polysiloxane composition containing a first coating polysiloxane to a resist during or after development.
- a second coating polysiloxane composition containing a second coating polysiloxane different from the first coating polysiloxane is applied and baked to produce a second polysiloxane coating film.
- a polysiloxane composition film is formed in which the resist pattern is filled with the composition.
- the applied coating polysiloxane composition is fired at a heating temperature of 50 to 180 ° C. for 0.5 to 5 minutes, respectively.
- the iso-dense bias of the second polysiloxane coating film is 50 nm or less.
- the iso-dense bias of the second polysiloxane coating film is a portion having the smallest length from the interface on the side in contact with the film of the stepped substrate to the interface on the side of the second polysiloxane coating film in contact with the air. And the difference in film thickness from the largest part.
- the length b shown in FIG. 15 is the Iso-dense bias.
- a is the recess depth of the polysiloxane coating film at the center of the dense space portion
- b is the recess depth of the polysiloxane coating film at the center of the open space portion
- c is used.
- the depth of the initial space in the step substrate, d is a polysiloxane coating film, and e is the step substrate.
- the stepped substrate can be an organic pattern (photoresist pattern, resist underlayer film (coating type, vapor deposition type) pattern functioning as an etching mask for the lower semiconductor substrate, a pattern formed by nanoimprinting, etc.).
- a step (3-1) of exposing the surface of the resist pattern (for example, an organic pattern) by etching back the coating film surface can be included.
- the resist pattern surface and the coating composition surface coincide with each other, and only the resist component is removed from the difference in the gas etching rate between the resist pattern and the coating composition. Will remain, resulting in pattern inversion.
- the resist pattern is exposed by a gas (for example, a fluorine-based gas) that can remove the coating composition.
- step (4) the resist pattern is removed by etching to reverse the pattern.
- dry etching is performed using tetrafluoromethane, perfluorocyclobutane (C 4 F 8 ), perfluoropropane (C 3 F 8 ), trifluoromethane, carbon monoxide, argon, oxygen, nitrogen, sulfur hexafluoride. , Gas such as difluoromethane, nitrogen trifluoride and chlorine trifluoride.
- dry etching is preferably performed with an oxygen-based gas.
- a reverse pattern (reversal pattern) is formed by the polymer for pattern reversal formation (polysiloxane obtained by hydrolyzing and condensing hydrolyzable silane) contained in the coating composition.
- First coating polysiloxane composition comprising first coating polysiloxane
- First coating polysiloxane composition comprising first coating polysiloxane used in the first step of the method for producing a polysiloxane coated substrate according to the present invention Is described below.
- the first coating polysiloxane composition containing the first coating polysiloxane is applied on the patterned organic underlayer film, and at that time, partially on the upper surface of the organic underlayer film
- the silicon hard mask may remain. This is because the polysiloxane composition for the first coating later exposes the upper surface of the organic underlayer film by etchback, so that the polysiloxane for coating and the silicon hard mask are simultaneously removed by etchback.
- the polysiloxane for the first coating usually contains a hydrolysis condensate of a hydrolyzable silane raw material.
- the hydrolyzable silane raw material can contain one or more silanes.
- This hydrolyzable silane is a hydrolyzable condensate of a hydrolyzable silane raw material containing a first hydrolyzable silane having 4 hydrolyzable groups per molecule in a ratio of 0 to 100 mol% in all silanes. More preferably, the proportion of the first hydrolyzable silane having 4 hydrolyzable groups per molecule in the total silane is 0 to 50 mol%, and the total silane has 3 or 2 hydrolysates per molecule.
- a hydrolyzable condensate of a hydrolyzable silane raw material containing the first hydrolyzable silane having a decomposable group in a ratio of 50 (over) to 100 mol% is included.
- the hydrolyzable silane has the formula (1): (In Formula (1), R 1 represents an alkyl group, an aryl group, a halogenated alkyl group, a halogenated aryl group, an alkoxyaryl group, an alkenyl group, or an epoxy group, an acryloyl group, a methacryloyl group, a mercapto group, or a cyano group. And an organic group having an Si—C bond to a silicon atom, R 2 represents an alkoxy group, an acyloxy group, or a halogen group, and a represents an integer of 0 to 2. .
- hydrolyzable silane raw material 0 to 50 mol% of hydrolyzable silane in which a is 0 in formula (1) and a is 1 or 2 in formula (1) in all silanes.
- a certain hydrolyzable silane is contained in a proportion of 50 (over) to 100 mol%.
- the polysiloxane composition for the first coating of the present invention includes a hydrolysis condensate of a hydrolyzable silane raw material as represented by the above formula (1) and a solvent.
- a hydrolysis condensate of a hydrolyzable silane raw material as represented by the above formula (1)
- a solvent for example, acid, water, alcohol, curing catalyst, acid generator, other organic polymer, light-absorbing compound, surfactant and the like can be included.
- the solid content in the first coating polysiloxane composition of the present invention is, for example, 0.1 to 50% by mass, 0.1 to 30% by mass, 0.1 to 25% by mass, 0.5 to 20.0% by mass. Or 1.0 to 10.0% by mass.
- the solid content is obtained by removing the solvent component from all components of the first coating polysiloxane composition.
- the proportion of the hydrolyzable silane, its hydrolyzate, and its hydrolysis condensate in the solid content is 20% by mass or more, for example, 50 to 100% by mass, 60 to 99% by mass, 70 to 99% by mass. It is.
- the concentration of the hydrolyzable silane, its hydrolyzate, and its hydrolysis condensate (polysiloxane) in the composition is 0.5 to 20.0% by mass.
- the coating composition since the coating composition is used after exposure of the resist, the resist is exposed through a mask and filled with the composition during or after development.
- the hydrolyzable silane, its hydrolyzate, and its hydrolysis condensate have a resin component different from that of the resist.
- a new pattern is formed by the hydrolyzed condensate (polysiloxane) filled by selectively removing the resist by dry etching by selecting the gas type.
- hydrolyzable silane, its hydrolyzate, and its hydrolysis condensate can also be used as a mixture thereof. It can be used as a condensate obtained by hydrolyzing a hydrolyzable silane and condensing the obtained hydrolyzate.
- a hydrolysis-condensation product a partial hydrolysis product or a silane compound in which hydrolysis is not completely completed are mixed with the hydrolysis-condensation product, and the mixture can also be used.
- This condensate is a polymer having a polysiloxane structure.
- alkyl group examples include straight-chain or branched alkyl groups having 1 to 10 carbon atoms, such as methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i- Butyl, s-butyl, t-butyl, n-pentyl, 1-methyl-n-butyl, 2-methyl-n-butyl, 3-methyl-n-butyl, 1,1-dimethyl -N-propyl group, 1,2-dimethyl-n-propyl group, 2,2-dimethyl-n-propyl group, 1-ethyl-n-propyl group, n-hexyl, 1-methyl-n-pentyl group, 2-methyl-n-pentyl group, 3-methyl-n-pentyl group, 4-methyl-n-pentyl group, 1,1-dimethyl-n-butyl group, 1,2-dimethyl-n-butyl group, 1,2-
- Cyclic alkyl groups can also be used.
- examples of the cyclic alkyl group having 1 to 10 carbon atoms include cyclopropyl group, cyclobutyl group, 1-methyl-cyclopropyl group, 2-methyl-cyclopropyl group, cyclopentyl group, 1 -Methyl-cyclobutyl group, 2-methyl-cyclobutyl group, 3-methyl-cyclobutyl group, 1,2-dimethyl-cyclopropyl group, 2,3-dimethyl-cyclopropyl group, 1-ethyl-cyclopropyl group, 2- Ethyl-cyclopropyl group, cyclohexyl group, 1-methyl-cyclopentyl group, 2-methyl-cyclopentyl group, 3-methyl-cyclopentyl group, 1-ethyl-cyclobutyl group, 2-ethyl-cyclobutyl group, 3-ethyl-cyclobutyl group 1,2-dimethyl-cyclobutyl group
- alkenyl group examples include alkenyl groups having 2 to 10 carbon atoms such as ethenyl group, 1-propenyl group, 2-propenyl group, 1-methyl-1-ethenyl group, 1-butenyl group and 2-butenyl group.
- aryl group examples include aryl groups having 6 to 20 carbon atoms, such as a phenyl group, o-methylphenyl group, m-methylphenyl group, p-methylphenyl group, o-chlorophenyl group, m- Chlorphenyl group, p-chlorophenyl group, o-fluorophenyl group, p-mercaptophenyl group, o-methoxyphenyl group, p-methoxyphenyl group, p-aminophenyl group, p-cyanophenyl group, ⁇ -naphthyl group , ⁇ -naphthyl group, o-biphenylyl group, m-biphenylyl group, p-biphenylyl group, 1-anthryl group, 2-anthryl group, 9-anthryl group, 1-phenanthryl group, 2-phenanthryl group, 3-phenanthryl group,
- Typical organic groups having the above epoxy group include glycidoxymethyl, glycidoxyethyl, glycidoxypropyl, glycidoxybutyl, epoxycyclohexyl and the like.
- Typical organic groups having the acryloyl group include acryloylmethyl, acryloylethyl, acryloylpropyl and the like.
- Typical organic groups having the methacryloyl group include methacryloylmethyl, methacryloylethyl, methacryloylpropyl and the like.
- Typical examples of the organic group having the mercapto group include ethyl mercapto, butyl mercapto, hexyl mercapto, octyl mercapto and the like.
- Typical organic groups having the cyano group include cyanoethyl, cyanopropyl and the like.
- alkoxy group examples include an alkoxy group having a linear, branched or cyclic alkyl portion having 1 to 20 carbon atoms, such as a methoxy group, an ethoxy group, an n-propoxy group, an i-propoxy group, n -Butoxy group, i-butoxy group, s-butoxy group, t-butoxy group, n-pentyloxy group, 1-methyl-n-butoxy group, 2-methyl-n-butoxy group, 3-methyl-n-butoxy group 1,1-dimethyl-n-propoxy group, 1,2-dimethyl-n-propoxy group, 2,2-dimethyl-n-propoxy group, 1-ethyl-n-propoxy group, n-hexyloxy group, 1- Methyl-n-pentyloxy group, 2-methyl-n-pentyloxy group, 3-methyl-n-pentyloxy group, 4-methyl-n-pentyloxy group, 1,1-dimethyl-n
- acyloxy group examples include the acyloxy groups having 2 to 20 carbon atoms, such as methylcarbonyloxy group, ethylcarbonyloxy group, n-propylcarbonyloxy group, i-propylcarbonyloxy group, n-butyl.
- halogen group examples include fluorine, chlorine, bromine and iodine.
- groups described above also apply to the alkyl group, aryl group, alkoxy group, and halogen group portion in the halogenated alkyl group, halogenated aryl group, and alkoxyaryl group.
- R 1 is preferably a methyl group, or a phenyl group which may be substituted with a halogen group or an alkoxy group.
- the hydrolyzable silane raw material containing 100% by weight of the hydrolyzable silane represented by the formula (1) (wherein a is 1 to 2) in all silanes.
- a coating polysiloxane composition containing a decomposition condensate and a crosslinkable compound having 2 to 6 methoxymethyl groups per molecule can be used.
- the crosslinkable compound having 2 to 6 methoxymethyl groups per molecule include melamine type, substituted urea type, and polymer type thereof.
- a cross-linking agent having a cross-linking substituent, methoxymethylated glycoluril, butoxymethylated glycoluril, methoxymethylated melamine, butoxymethylated melamine, methoxymethylated benzoguanamine, butoxymethylated benzoguanamine, methoxymethylated urea , Butoxymethylated urea, methoxymethylated thiourea, or methoxymethylated thiourea.
- the condensate of these compounds can also be used.
- the addition amount of the crosslinking agent varies depending on the coating solvent used, the base substrate used, the required solution viscosity, the required film shape, etc., but is 0.001 to 80% by mass, preferably based on the total solid content. 0.01 to 50% by mass, more preferably 0.05 to 40% by mass.
- p-toluenesulfonic acid as a catalyst for promoting the crosslinking reaction, p-toluenesulfonic acid, trifluoromethanesulfonic acid, pyridinium p-toluenesulfonic acid, salicylic acid, sulfosalicylic acid, citric acid, benzoic acid, hydroxybenzoic acid, naphthalenecarboxylic acid Acidic compounds such as acids or / and thermal acid generators such as 2,4,4,6-tetrabromocyclohexadienone, benzoin tosylate, 2-nitrobenzyl tosylate, and other organic sulfonic acid alkyl esters may be added. I can do it.
- the blending amount is 0.0001 to 20% by mass, preferably 0.0005 to 10% by mass, preferably 0.01 to 3% by mass, based on the total solid content.
- hydrolysis condensate polysiloxane
- the hydrolyzable condensate (polyorganosiloxane) of the hydrolyzable silane raw material can obtain a condensate having a weight average molecular weight of 1,000 to 1,000,000, or 1,000 to 100,000. These molecular weights are molecular weights obtained in terms of polystyrene by GPC analysis.
- GPC measurement conditions are, for example, GPC apparatus (trade name HLC-8220 GPC, manufactured by Tosoh Corporation), GPC column (trade names Shodex KF803L, KF802, KF801, Showa Denko), column temperature is 40 ° C., eluent (elution solvent) Is tetrahydrofuran, the flow rate (flow rate) is 1.0 ml / min, and the standard sample is polystyrene (made by Showa Denko KK).
- hydrolysis of the alkoxysilyl group, acyloxysilyl group, or halogenated silyl group 0.5 to 100 mol, preferably 1 to 10 mol of water is used per mol of the hydrolyzable group.
- a hydrolysis catalyst can be used for hydrolysis, it can also be performed without using a hydrolysis catalyst.
- 0.001 to 10 mol, preferably 0.001 to 1 mol of the hydrolysis catalyst can be used per mol of the hydrolyzable group.
- the reaction temperature during the hydrolysis and condensation is usually 20 to 110 ° C. Hydrolysis may be performed completely or partially. That is, a hydrolyzate or a monomer may remain in the hydrolysis condensate.
- a catalyst can be used for hydrolysis and condensation.
- An acid or a base can be used as the hydrolysis catalyst.
- the hydrolysis catalyst include metal chelate compounds, organic acids, inorganic acids, organic bases, and inorganic bases.
- Examples of the metal chelate compound as the hydrolysis catalyst include triethoxy mono (acetylacetonato) titanium, tri-n-propoxy mono (acetylacetonato) titanium, tri-i-propoxy mono (acetylacetonato) titanium, tri -N-Butoxy mono (acetylacetonato) titanium, tri-sec-butoxy mono (acetylacetonato) titanium, tri-t-butoxy mono (acetylacetonato) titanium, diethoxy bis (acetylacetonato) titanium , Di-n-propoxy bis (acetylacetonato) titanium, di-i-propoxy bis (acetylacetonato) titanium, di-n-butoxy bis (acetylacetonato) titanium, di-sec-butoxy bis (Acetylacetonate) titanium, di-t Butoxy bis (acetylacetonato) titanium, monoethoxy tris (acetylacetonato) titanium
- Organic acids as hydrolysis catalysts are, for example, acetic acid, propionic acid, butanoic acid, pentanoic acid, hexanoic acid, heptanoic acid, octanoic acid, nonanoic acid, decanoic acid, oxalic acid, maleic acid, methylmalonic acid, adipic acid, sebacin Acid, gallic acid, butyric acid, merit acid, arachidonic acid, 2-ethylhexanoic acid, oleic acid, stearic acid, linoleic acid, linolenic acid, salicylic acid, benzoic acid, p-aminobenzoic acid, p-toluenesulfonic acid, benzenesulfone Examples include acid, monochloroacetic acid, dichloroacetic acid, trichloroacetic acid, trifluoroacetic acid, formic acid, malonic acid, sulfonic acid, phthal
- Examples of the inorganic acid as the hydrolysis catalyst include hydrochloric acid, nitric acid, sulfuric acid, hydrofluoric acid, phosphoric acid and the like.
- Organic bases as hydrolysis catalysts include, for example, pyridine, pyrrole, piperazine, pyrrolidine, piperidine, picoline, trimethylamine, triethylamine, monoethanolamine, diethanolamine, dimethylmonoethanolamine, monomethyldiethanolamine, triethanolamine, diazabicyclooctane, diazine.
- Examples include zabicyclononane, diazabicycloundecene, and tetramethylammonium hydroxide.
- the inorganic base include ammonia, sodium hydroxide, potassium hydroxide, barium hydroxide, calcium hydroxide and the like. Of these catalysts, metal chelate compounds, organic acids, and inorganic acids are preferred, and these may be used alone or in combination of two or more.
- organic solvent used in the hydrolysis examples include n-pentane, i-pentane, n-hexane, i-hexane, n-heptane, i-heptane, 2,2,4-trimethylpentane, n-octane, i- Aliphatic hydrocarbon solvents such as octane, cyclohexane and methylcyclohexane; benzene, toluene, xylene, ethylbenzene, trimethylbenzene, methylethylbenzene, n-propylbenzene, i-propylbenzene, diethylbenzene, i-butylbenzene, triethylbenzene, di -Aromatic hydrocarbon solvents such as i-propyl benzene, n-amyl naphthalene, trimethylbenzene; methanol, ethanol, n-
- acetone methyl ethyl ketone, methyl-n-propyl ketone, methyl-n-butyl ketone, diethyl ketone, methyl-i-butyl ketone, methyl-n-pentyl ketone, ethyl-n-butyl ketone, methyl-n-hexyl ketone, di- Ketone solvents such as i-butyl ketone, trimethylnonanone, cyclohexanone, methylcyclohexanone, 2,4-pentanedione, acetonylacetone, diacetone alcohol, acetophenone, and fenchon are preferred from the viewpoint of storage stability of the solution.
- Second coating polysiloxane composition containing second coating polysiloxane The second coating polysiloxane composition containing the second coating polysiloxane used in the first step of the method for producing a polysiloxane coated substrate according to the present invention Is described below.
- the second coating polysiloxane is different from the first coating polysiloxane.
- the second coating polysiloxane contains silanol groups in a proportion of 30 mol% or less with respect to Si atoms, and has a weight average molecular weight of 1,000 to 50,000.
- the proportion of silanol groups can be 5-30 mol%, or 10-30 mol%, or 5-20 mol%, or 10-20 mol%.
- the second coating polysiloxane has the formula (1): (In Formula (1), R 1 represents an alkyl group, an aryl group, a halogenated alkyl group, a halogenated aryl group, an alkoxyaryl group, an alkenyl group, or an epoxy group, an acryloyl group, a methacryloyl group, a mercapto group, or a cyano group.
- a hydrolyzable silane represented by R 2 is an alkoxy group, an acyloxy group, or a halogen group, and a is 1. Contains hydrolysis condensate of raw material.
- alkyl groups, aryl groups, halogenated alkyl groups, halogenated aryl groups, alkoxyaryl groups, alkenyl groups, epoxy groups, acryloyl groups, methacryloyl groups, mercapto groups, cyano groups, alkoxy groups, acyloxy groups, halogen groups, etc. Is as described in the above item “2. First coating polysiloxane composition containing first coating polysiloxane”.
- the polysiloxane for the second coating contains a hydrolyzed condensate of the hydrolyzable silane raw material represented by the above formula (1), and in all the silanes, the a in formula (1) is 1
- the decomposable silane is 100 to 50 mol%, more preferably 95 to 50 mol%
- the hydrolyzable silane in which a is 2 in the formula (1) is 0 to 50 mol%, more preferably 5 to 50 mol%.
- the hydrolyzable silane in which a is 1 in the formula (1) is 95 to 70 mol%
- the hydrolyzable silane in which a is 2 in the formula (1) is 5 to 30 mol%. Including.
- the second coating polysiloxane is a modified polysiloxane having capped silanol groups of polysiloxane obtained by hydrolysis and condensation of a hydrolyzable silane raw material.
- the modified polysiloxane has a ratio of silanol groups to Si atoms of 30 mol% or less, more preferably 20 mol% or less.
- the modified polysiloxane has the formula (1): (In Formula (1), R 1 represents an alkyl group, an aryl group, a halogenated alkyl group, a halogenated aryl group, an alkoxyaryl group, an alkenyl group, or an epoxy group, an acryloyl group, a methacryloyl group, a mercapto group, or a cyano group. R 2 represents an alkoxy group, an acyloxy group, or a halogen group, and a is 0 to 100 mol of hydrolyzable silane.
- hydrolysis condensate of silane raw material More preferably 1 to 100 mol%, and a hydrolyzable silane in which a is 1 in a proportion of 0 to 100 mol%, more preferably 0 to 99 mol%.
- the modified polysiloxane which prepared the ratio of the silanol group by making the silanol group and alcohol in polysiloxane react can be used.
- a silanol group is capped with an alcohol, and a monohydric alcohol can be used as the alcohol.
- These alcohols having 3 to 10 carbon atoms, and branched alcohols can be preferably used rather than linear alcohols.
- 4-methyl-2-pentanol, 1-methoxy-2-propanol, 2-propanol and the like can be used.
- the polysiloxane is contacted with alcohol as a capping agent and reacted at a temperature of 110 to 160 ° C., for example, 150 ° C. for 0.1 to 48 hours, for example, 24 hours to obtain a modified polysiloxane having capped silanol groups.
- the capping agent alcohol can be used as a solvent in the composition applied to the resist pattern.
- the above-mentioned polysiloxane hydrolysis condensate
- a partial hydrolysis product or a silane compound in which hydrolysis is not completely completed are mixed with the hydrolysis-condensation product, and the mixture can also be used.
- This condensate is a polymer having a polysiloxane structure.
- a polysiloxane obtained by hydrolyzing a hydrolyzable silane and condensing it can be dehydrated with an alcohol and an acid, and synthesized using an apparatus that removes generated water from the reaction system.
- an organic acid having an acid dissociation constant (pka) of ⁇ 1 to 5, preferably 4 to 5 can be used.
- the acid can be exemplified by trifluoroacetic acid, maleic acid, benzoic acid, isobutyric acid, acetic acid, etc., among which benzoic acid, isobutyric acid, acetic acid, and the like.
- the acid is preferably an acid having a boiling point of 70 to 160 ° C. Examples thereof include trifluoroacetic acid, isobutyric acid, acetic acid and the like.
- the acid preferably has an acid dissociation constant (pka) of 4 to 5 or a boiling point of 70 to 160 ° C. and has any physical property. That is, those having low acidity or those having high acidity but low boiling point can be used.
- any property can be utilized from the properties of acid dissociation constant and boiling point, but acetic acid having both properties can be preferably used.
- the polysiloxane before modification may be a hydrolytic condensate obtained by hydrolyzing and condensing at least one hydrolyzable silane selected from the group consisting of formula (1).
- the coating polysiloxane composition of the present invention can contain a curing catalyst.
- the curing catalyst functions as a curing catalyst when a coating film containing polyorganosiloxane composed of a hydrolysis condensate is heated and cured.
- ammonium salts, phosphines, phosphonium salts, and sulfonium salts can be used.
- the formula (D-1) (Wherein m represents an integer of 2 to 11, n represents an integer of 2 to 3, R 21 represents an alkyl group or an aryl group, and Y ⁇ represents an anion.)
- the formula (D-7) (Wherein, R 31, R 32, R 33, and R 34 represents an alkyl group or an aryl group, P is a phosphorus atom, Y - represents an anion, and R 31, R 32, R 33 , and R 34 Are each bonded to a phosphorus atom by a CP bond).
- the formula (D-8) (However, R 35 , R 36 , and R 37 are alkyl groups or aryl groups, S is a sulfur atom, Y ⁇ is an anion, and R 35 , R 36 , and R 37 are CS bonds, respectively. And a tertiary sulfonium salt which is bonded to a sulfur atom.
- the compound of the above formula (D-1) is a quaternary ammonium salt derived from an amine, m represents an integer of 2 to 11, and n represents an integer of 2 to 3.
- R 21 of this quaternary ammonium salt represents an alkyl group or aryl group having 1 to 18 carbon atoms, preferably 2 to 10 carbon atoms, such as a linear alkyl group such as an ethyl group, a propyl group or a butyl group, a benzyl group, or the like. Cyclohexyl group, cyclohexylmethyl group, dicyclopentadienyl group and the like.
- Anions (Y ⁇ ) include halogen ions such as chlorine ions (Cl ⁇ ), bromine ions (Br ⁇ ), iodine ions (I ⁇ ), carboxylates (—COO—), sulfonates (—SO 3 —). And acid groups such as alcoholate (—O—).
- the compound of the above formula (D-2) is a quaternary ammonium salt represented by R 22 R 23 R 24 R 25 N + Y ⁇ .
- R 22 , R 23 , R 24 and R 25 are an alkyl group or aryl group having 1 to 18 carbon atoms, or a silane compound bonded to a silicon atom by a Si—C bond.
- Anions (Y ⁇ ) include halogen ions such as chlorine ions (Cl ⁇ ), bromine ions (Br ⁇ ), iodine ions (I ⁇ ), carboxylates (—COO—), sulfonates (—SO 3 —), An acid group such as alcoholate (—O—) can be mentioned.
- This quaternary ammonium salt can be obtained commercially, for example, tetramethylammonium acetate, tetrabutylammonium acetate, triethylbenzylammonium chloride, triethylbenzylammonium bromide, trioctylmethylammonium chloride, tributylbenzyl chloride. Examples include ammonium and trimethylbenzylammonium chloride.
- the compound of the above formula (D-3) is a quaternary ammonium salt derived from 1-substituted imidazole
- R 26 and R 27 are an alkyl group or aryl group having 1 to 18 carbon atoms
- R 26 And the total number of carbon atoms of R 27 is preferably 7 or more.
- R 26 can be exemplified by methyl group, ethyl group, propyl group, phenyl group and benzyl group
- R 27 can be exemplified by benzyl group, octyl group and octadecyl group.
- Anions (Y ⁇ ) include halogen ions such as chlorine ions (Cl ⁇ ), bromine ions (Br ⁇ ), iodine ions (I ⁇ ), carboxylates (—COO—), sulfonates (—SO 3 —), An acid group such as alcoholate (—O—) can be mentioned.
- This compound can be obtained as a commercial product.
- imidazole compounds such as 1-methylimidazole and 1-benzylimidazole are reacted with alkyl halides and aryl halides such as benzyl bromide and methyl bromide. Can be manufactured.
- the compound of the above formula (D-4) is a quaternary ammonium salt derived from pyridine
- R 28 is an alkyl or aryl group having 1 to 18 carbon atoms, preferably 4 to 18 carbon atoms,
- Anions (Y ⁇ ) include halogen ions such as chlorine ions (Cl ⁇ ), bromine ions (Br ⁇ ), iodine ions (I ⁇ ), carboxylates (—COO—), sulfonates (—SO 3 —),
- An acid group such as alcoholate (—O—) can be mentioned.
- this compound can be obtained as a commercial product, it is produced, for example, by reacting pyridine with an alkyl halide such as lauryl chloride, benzyl chloride, benzyl bromide, methyl bromide, octyl bromide, or an aryl halide. I can do it.
- alkyl halide such as lauryl chloride, benzyl chloride, benzyl bromide, methyl bromide, octyl bromide, or an aryl halide.
- alkyl halide such as lauryl chloride, benzyl chloride, benzyl bromide, methyl bromide, octyl bromide, or an aryl halide.
- alkyl halide such as lauryl chloride, benzyl chloride, benzyl bromide, methyl bromide, octyl bromide, or an aryl halide.
- the compound of the above formula (D-5) is a quaternary ammonium salt derived from a substituted pyridine represented by picoline and the like, and R 29 is an alkyl group having 1 to 18 carbon atoms, preferably 4 to 18 carbon atoms.
- the aryl group include a methyl group, an octyl group, a lauryl group, and a benzyl group.
- R 30 is an alkyl group having 1 to 18 carbon atoms or an aryl group. For example, in the case of quaternary ammonium derived from picoline, R 30 is a methyl group.
- Anions (Y ⁇ ) include halogen ions such as chlorine ions (Cl ⁇ ), bromine ions (Br ⁇ ), iodine ions (I ⁇ ), carboxylates (—COO—), sulfonates (—SO 3 —), An acid group such as alcoholate (—O—) can be mentioned.
- This compound can also be obtained as a commercial product. For example, a substituted pyridine such as picoline is reacted with an alkyl halide such as methyl bromide, octyl bromide, lauryl chloride, benzyl chloride or benzyl bromide, or an aryl halide. Can be manufactured. Examples of this compound include N-benzylpicolinium chloride, N-benzylpicolinium bromide, N-laurylpicolinium chloride and the like.
- the compound of the above formula (D-6) is a tertiary ammonium salt derived from an amine, m represents an integer of 2 to 11, and n represents an integer of 2 to 3.
- Anions (Y ⁇ ) include halogen ions such as chlorine ions (Cl ⁇ ), bromine ions (Br ⁇ ), iodine ions (I ⁇ ), carboxylates (—COO—), sulfonates (—SO 3 —). And acid groups such as alcoholate (—O—). It can be produced by reacting an amine with a weak acid such as carboxylic acid or phenol. Examples of the carboxylic acid include formic acid and acetic acid.
- the anion (Y ⁇ ) When formic acid is used, the anion (Y ⁇ ) is (HCOO—), and when acetic acid is used, the anion (Y ⁇ ) is (CH 3 COO). -). When phenol is used, the anion (Y ⁇ ) is (C 6 H 5 O—).
- the compound of the above formula (D-7) is a quaternary phosphonium salt having a structure of R 31 R 32 R 33 R 34 P + Y — .
- R 31 , R 32 , R 33 , and R 34 are an alkyl group or aryl group having 1 to 18 carbon atoms, or a silane compound bonded to a silicon atom through a Si—C bond, preferably R 31 to R Among the four substituents of 34 , three are phenyl groups or substituted phenyl groups, and examples thereof include phenyl groups and tolyl groups, and the remaining one is an alkyl group having 1 to 18 carbon atoms, A silane compound bonded to a silicon atom by an aryl group or Si—C bond.
- Anions (Y ⁇ ) include halogen ions such as chlorine ions (Cl ⁇ ), bromine ions (Br ⁇ ), iodine ions (I ⁇ ), carboxylates (—COO—), sulfonates (—SO 3 —). And acid groups such as alcoholate (—O—).
- This compound can be obtained as a commercial product, for example, a halogenated tetraalkylphosphonium such as tetra-n-butylphosphonium halide, tetra-n-propylphosphonium halide, or a trialkylbenzyl halide such as triethylbenzylphosphonium halide.
- Triphenylmonoalkylphosphonium halides such as phosphonium, triphenylmethylphosphonium halide, triphenylethylphosphonium halide, triphenylbenzylphosphonium halide, tetraphenylphosphonium halide, tritolylmonoarylphosphonium halide, or tritolyl monohalogenate Examples thereof include alkylphosphonium (the halogen atom is a chlorine atom or a bromine atom).
- halogens such as triphenylmonoalkylphosphonium halides such as triphenylmethylphosphonium halide, triphenylethylphosphonium halide, triphenylmonoarylphosphonium halides such as triphenylbenzylphosphonium halide, and halogens such as tritolylmonophenylphosphonium halide.
- Preferred is a tolylyl monoarylphosphonium halide, or a tolyl monoalkylphosphonium halide such as a tolyl monomethylphosphonium halide (the halogen atom is a chlorine atom or a bromine atom).
- the phosphines include methylphosphine, ethylphosphine, propylphosphine, isopropylphosphine, isobutylphosphine, phenylphosphine and other first phosphine, dimethylphosphine, diethylphosphine, diisopropylphosphine, diisoamylphosphine, diphenylphosphine and other second phosphine.
- tertiary phosphines such as trimethylphosphine, triethylphosphine, triphenylphosphine, methyldiphenylphosphine and dimethylphenylphosphine.
- the compound of the above formula (D-8) is a tertiary sulfonium salt having a structure of R 35 R 36 R 37 S + Y — .
- R 35 , R 36 , and R 37 are alkyl or aryl groups having 1 to 18 carbon atoms, or silane compounds bonded to silicon atoms through Si—C bonds, preferably 4 of R 35 to R 37 .
- Three of the substituents are phenyl groups or substituted phenyl groups, and examples thereof include phenyl groups and tolyl groups, and the remaining one is an alkyl group having 1 to 18 carbon atoms or an aryl group. It is.
- Anions (Y ⁇ ) include halogen ions such as chlorine ions (Cl ⁇ ), bromine ions (Br ⁇ ), iodine ions (I ⁇ ), carboxylates (—COO—), sulfonates (—SO 3 —). And acid groups such as alcoholate (—O—), maleate anion, and nitrate anion.
- This compound is available as a commercial product.
- halogenated tetraalkylsulfonium such as tri-n-butylsulfonium halide and tri-n-propylsulfonium halide
- trialkylbenzyl halide such as diethylbenzylsulfonium halide.
- Halogenated diphenylmonoalkylsulfonium such as sulfonium, halogenated diphenylmethylsulfonium, halogenated diphenylethylsulfonium, halogenated triphenylsulfonium, (halogen atom is chlorine or bromine atom), tri-n-butylsulfonium carboxylate, tri-n- Tetraalkylphosphonium carboxylates such as propylsulfonium carboxylate and trialkylbenzines such as diethylbenzylsulfonium carboxylate Sulfonium carboxylate, diphenylmethyl sulfonium carboxylate, diphenyl monoalkyl sulfonium carboxylate, triphenylsulfonium carboxylate such as diphenylethyl sulfonium carboxylate. Further, triphenylsulfonium halide and triphenylsulfonium carboxylate can
- a nitrogen-containing silane compound can be added as a curing catalyst.
- the nitrogen-containing silane compound include imidazole ring-containing silane compounds such as N- (3-triethoxysilylpropyl) -4,5-dihydroimidazole.
- the curing catalyst is 0.01 to 10 parts by mass, or 0.01 to 5 parts by mass, or 0.01 to 3 parts by mass with respect to 100 parts by mass of the polyorganosiloxane.
- the nitrogen-containing silane compound is particularly preferable.
- Hydrolyzable silane is hydrolyzed using a catalyst in a solvent to condense, and the resulting hydrolyzed condensate (polymer) simultaneously removes by-product alcohol, used hydrolysis catalyst, and water by distillation under reduced pressure. be able to.
- the acid and base catalyst used for hydrolysis can be removed by neutralization or ion exchange.
- An organic acid, water, alcohol, or a combination thereof can be added to the coating polysiloxane composition of the present invention in order to stabilize the coating polysiloxane composition containing the hydrolysis condensate.
- organic acid examples include oxalic acid, malonic acid, methylmalonic acid, succinic acid, maleic acid, malic acid, tartaric acid, phthalic acid, citric acid, glutaric acid, citric acid, lactic acid, and salicylic acid. Of these, oxalic acid and maleic acid are preferred.
- the organic acid to be added is 0.1 to 5.0 parts by mass with respect to 100 parts by mass of the condensate (polyorganosiloxane). Further, pure water, ultrapure water, ion-exchanged water or the like can be used as the water to be added, and the addition amount can be 1 to 20 parts by mass with respect to 100 parts by mass of the coating polysiloxane composition.
- alcohol to add what is easy to be scattered by the heating after application
- coating is preferable, for example, methanol, ethanol, propanol, isopropanol, a butanol etc. are mentioned.
- the added alcohol can be 1 to 20 parts by mass with respect to 100 parts by mass of the resist underlayer film forming composition.
- the coating polysiloxane composition may contain one or more selected from the group consisting of water, acid, and a curing catalyst.
- the coating polysiloxane composition of the present invention can contain an organic polymer compound, a photoacid generator, a surfactant, and the like, if necessary, in addition to the above components.
- the dry etching rate (amount of decrease in film thickness per unit time), attenuation coefficient, refractive index, etc. of the resist underlayer film formed from the coating polysiloxane composition of the present invention are adjusted. be able to.
- Examples of the photoacid generator contained in the coating polysiloxane composition of the present invention include onium salt compounds, sulfonimide compounds, and disulfonyldiazomethane compounds.
- Examples of onium salt compounds include diphenyliodonium hexafluorophosphate, diphenyliodonium trifluoromethanesulfonate, diphenyliodonium nonafluoronormalbutanesulfonate, diphenyliodonium perfluoronormaloctanesulfonate, diphenyliodoniumcamphorsulfonate, bis (4-tert-butylphenyl) iodoniumcamphor.
- Iodonium salt compounds such as sulfonate and bis (4-tert-butylphenyl) iodonium trifluoromethanesulfonate, and triphenylsulfonium hexafluoroantimonate, triphenylsulfonium nonafluoronormal butane sulfonate, triphenylsulfonium camphorsulfonate and triphenylsulfone Sulfonium salt compounds such as trifluoromethane sulfonate and the like.
- sulfonimide compounds include N- (trifluoromethanesulfonyloxy) succinimide, N- (nonafluoronormalbutanesulfonyloxy) succinimide, N- (camphorsulfonyloxy) succinimide and N- (trifluoromethanesulfonyloxy) naphthalimide. Can be mentioned.
- disulfonyldiazomethane compound examples include bis (trifluoromethylsulfonyl) diazomethane, bis (cyclohexylsulfonyl) diazomethane, bis (phenylsulfonyl) diazomethane, bis (p-toluenesulfonyl) diazomethane, and bis (2,4-dimethylbenzenesulfonyl). And diazomethane, and methylsulfonyl-p-toluenesulfonyldiazomethane.
- the ratio is 0.01 to 15 parts by mass, or 0.1 to 10 parts by mass, or 0.5 with respect to 100 parts by mass of the condensate (polyorganosiloxane). ⁇ 1 part by mass.
- the surfactant is effective in suppressing the occurrence of pinholes and installations when the coating polysiloxane composition of the present invention is applied to a substrate.
- the surfactant contained in the coating polysiloxane composition of the present invention include polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene cetyl ether, and polyoxyethylene oleyl ether.
- surfactants may be used alone or in combination of two or more.
- the ratio is 0.0001 to 5 parts by mass, or 0.001 to 1 part by mass, or 0.01 to 1 with respect to 100 parts by mass of the condensate (polyorganosiloxane). Part by mass.
- a rheology adjusting agent, an adhesion aid and the like can be added to the coating polysiloxane composition of the present invention.
- the rheology modifier is effective for improving the fluidity of the underlayer film forming composition.
- the adhesion aid is effective for improving the adhesion between the semiconductor substrate or resist and the lower layer film.
- any solvent can be used as long as it can dissolve the solid content.
- solvents include methyl cellosolve acetate, ethyl cellosolve acetate, propylene glycol, propylene glycol monomethyl ether, propylene glycol monoethyl ether, methyl isobutyl carbinol, propylene glycol monobutyl ether, propylene glycol monomethyl ether acetate, propylene glycol mono Ether ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, toluene, xylene, methyl ethyl ketone, cyclopentanone, cyclohexanone, ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl ethoxyacetate , Ethyl hydroxya
- reaction solution is cooled to room temperature, 100 g of 4-methyl-2-pentanol is added to the reaction solution, and acetone, water, hydrochloric acid, and ethanol as a reaction byproduct are distilled off from the reaction solution under reduced pressure and concentrated.
- a methyl isobutyl carbinol solution of a cohydrolyzed condensate (polymer) was obtained. Solid content concentration was adjusted so that it might become 13 mass% in conversion of the solid residue in 140 degreeC. 20 mg of acetic acid was added to 15 g of the prepared polymer solution. The flask was transferred to an oil bath adjusted to 150 ° C., and reacted for 48 hours under heating and reflux.
- the weight average molecular weight Mw by GPC was 5,300 in terms of polystyrene.
- the obtained polysiloxane was a polysiloxane in which a part of silanol groups was capped with 4-methyl-2-pentanol.
- reaction solution is cooled to room temperature, 19 g of propylene glycol monomethyl ether acetate is added to the reaction solution, and acetone, water, acetic acid, and ethanol as a reaction byproduct are distilled off from the reaction solution under reduced pressure and concentrated to obtain a cohydrolyzate.
- a propylene glycol monomethyl ether acetate solution of the decomposition condensate (polymer) was obtained.
- the solid content concentration was adjusted to 30% by mass in terms of solid residue at 140 ° C.
- 15 g of the prepared polymer solution was transferred to a 100 ml flask and reacted in an oil bath adjusted to 100 ° C. for 12 hours.
- the weight average molecular weight Mw by GPC was 10,000 in terms of polystyrene.
- reaction solution was cooled to room temperature and transferred to a 500 ml separatory funnel.
- separatory funnel To the separatory funnel were added 100 g of ethyl acetate, 34 g of 6N hydrochloric acid and 68 g of ultrapure water, and a liquid separation operation was performed to obtain an ethyl acetate layer.
- 68 g of ultrapure water was added for washing. The washing operation was further repeated once, and the resulting ethyl acetate layer was concentrated under reduced pressure using an evaporator.
- the solid content concentration of the obtained hydrolyzed condensate (polymer) in the ethyl acetate solution was adjusted to 20% by mass in terms of solid residue at 140 ° C.
- the weight average molecular weight Mw by GPC was 4,000 in terms of polystyrene.
- reaction solution is cooled to room temperature, 100 g of 4-methyl-2-pentanol is added to the reaction solution, and acetone, water, hydrochloric acid, and ethanol as a reaction byproduct are distilled off from the reaction solution under reduced pressure and concentrated.
- a 4-methyl-2-pentanol solution of the cohydrolyzed condensate (polymer) was obtained. Solid content concentration was adjusted so that it might become 13 mass% in conversion of the solid residue in 140 degreeC.
- the weight average molecular weight Mw by GPC was 1,400 in terms of polystyrene.
- the silanol group ratio in the polymer was calculated by 1 H NMR. The measurement was performed using JNM-ECA500 (manufactured by JEOL). First, when the integration ratio of the chemical shift values (0.0-0.6 ppm) of methyl protons of triethoxymethylsilane or dimethyldiethoxysilane is taken as a reference, the silanol group is detected as a broad peak at 5-7 ppm. . By comparing the integration ratio of 5-7 ppm, the ratio (mol%) of silanol groups to one Si atom in the polymer was calculated.
- a chemical shift derived from a silane monomer structure other than silanol groups may be detected at 5-7 ppm, so that many silanol groups may be detected apparently. Since the compounding ratio of triethoxymethylsilane or dimethyldiethoxysilane to other constituent silane monomers is already existing, it is detected at 5-7ppm of constituent silane monomers from the integral ratio of triethoxymethylsilane or dimethyldiethoxysilane methyl protons. The integration ratio of the monomer-derived peaks can be estimated.
- the net silanol amount was calculated by subtracting the integral ratio of the constituent silane monomers as described above.
- the amount of silanol of each synthesis example polymer and commercially available polysilsesquioxane resin (product name: SR-13H (manufactured by Konishi Chemical Co., Ltd., Example A4)) calculated by the above method was as follows.
- maleic acid is MA
- N- (3-triethoxysilylpropyl) -4,5-dihydroimidazole is IMIDTEOS
- 4-methyl-2-pentanol is MIBC
- propylene glycol monomethyl ether acetate is PGMEA
- propylene glycol Monoethyl ether was abbreviated as PGEE
- propylene glycol monomethyl ether as PGME
- ultrapure water DIW. Each addition amount was shown in parts by mass.
- the evaluation results using the coating solution of the present invention are shown below.
- the coating polysiloxane compositions in Examples A1 to A4 and Comparative Example A1 were evaluated for planarization as follows. The evaluation results are shown in Table 2.
- the coating polysiloxane compositions of Examples A1 to A4 and Comparative Example A1 were coated on a stepped substrate having a groove depth of 220 nm and a width of 800 nm using a spin coater under the conditions of a rotation speed of 1500 rpm and 60 seconds. Then, it was dried on a hot plate at 110 ° C. for 1 minute to form a polysiloxane coating film.
- the thickness of the polysiloxane coating film was 90 nm. Subsequently, about the obtained polysiloxane coating film, the cross-sectional shape was observed by cross-sectional SEM, and planarization property was evaluated. A groove pattern having a depth of 220 nm and a width of 800 nm is observed, and the film thickness (that is, the length from the interface on the side in contact with the silicon substrate film to the interface on the side in contact with the air of the polysiloxane coating film) is measured with respect to the groove bottom. The film thickness difference between the smallest part and the largest part was measured and the film thickness difference was calculated. The smaller the film thickness difference, the better the flatness.
- the SEM photographs used for the evaluation are shown in FIGS.
- each of the coating polysiloxane compositions of Examples A1 to A3 was applied onto the obtained first polysiloxane coating film, and then dried on a hot plate at 110 ° C. for 1 minute, whereby Comparative Example A1.
- a laminated film formed of two layers of the first polysiloxane coating film and the second polysiloxane coating film of any of Examples A1 to A3 was formed.
- the film thickness of the second polysiloxane coating film was 90 nm
- the film thickness of the laminated film was 180 nm in total with the film thickness of 90 nm of the first polysiloxane coating film of Comparative Example A1 previously applied.
- the cross-sectional shape was observed by cross-sectional SEM, and planarization property was evaluated.
- a groove pattern having a depth of 220 nm and a width of 800 nm was observed, and the film thickness (that is, the length from the interface on the side in contact with the silicon substrate film to the interface on the side in contact with the atmosphere of the second polysiloxane coating film)
- the film thickness difference between the smallest and largest parts was measured and the film thickness difference was calculated. The smaller the film thickness difference, the better the flatness.
- SEM photographs used for the evaluation are shown in FIGS.
- a general acrylic photo-nanoimprint resist was used as the nano-nanoimprint resist. It spin-coated on the quartz substrate, and baked for 1 minute with a 100 degreeC hotplate, and obtained the film for optical nanoimprint.
- NM-0801HB manufactured by Myeongchang Mechanism Co., Ltd.
- the mold used was made of silicon, and the pattern dimension was 500 nm.
- the mold is immersed in Optool (registered trademark) HD (manufactured by Daikin Industries, Ltd.) in advance, treated for 2 hours using a high-temperature and high-humidity device with a temperature of 90 ° C and a humidity of 90RH%, rinsed with pure water, and then air What was dried with was used.
- Optool registered trademark
- HD manufactured by Daikin Industries, Ltd.
- the optical nanoimprinting apparatus was installed in an optical nanoimprinting apparatus with a silicon mold adhered to the optical nanoimprinting coating film.
- Optical nanoimprint is always performed at 23 ° C. under conditions of a) pressurization up to 1,000 N over 10 seconds, b) exposure at 500 mJ / cm 2 using a high-pressure mercury lamp, c) pressure removal over 10 seconds, d) mold And the substrate were separated and released.
- the cross-sectional shape was observed by cross-sectional SEM, and planarization property was evaluated.
- Measure the film thickness that is, the film thickness of the shortest part and the largest part of the length of the polysiloxane coating film from the interface in contact with the quartz substrate film to the interface in contact with the atmosphere of the polysiloxane coating film. It was calculated and the flatness was evaluated as better as the film thickness difference was smaller.
- reaction solution is cooled to room temperature, 100 g of 4-methyl-2-pentanol is added to the reaction solution, and acetone, water, hydrochloric acid, and ethanol as a reaction byproduct are distilled off from the reaction solution under reduced pressure and concentrated.
- a 4-methyl-2-pentanol solution of a cohydrolyzed condensate (polysiloxane) was obtained. Solid content concentration was adjusted so that it might become 13 mass% in conversion of the solid residue in 140 degreeC. 20 mg of acetic acid was added to 15 g of the prepared polymer solution. The flask was transferred to an oil bath adjusted to 150 ° C., and reacted for 24 hours under heating and reflux.
- the weight average molecular weight Mw by GPC was 3,700 in terms of polystyrene.
- the obtained polysiloxane was a polysiloxane in which a part of silanol groups was capped with 4-methyl-2-pentanol.
- reaction solution is cooled to room temperature, 100 g of 4-methyl-2-pentanol is added to the reaction solution, and acetone, water, hydrochloric acid, and ethanol as a reaction byproduct are distilled off from the reaction solution under reduced pressure and concentrated.
- a methyl isobutyl carbinol solution of a cohydrolyzed condensate (polysiloxane) was obtained. Solid content concentration was adjusted so that it might become 13 mass% in conversion of the solid residue in 140 degreeC. 20 mg of acetic acid was added to 15 g of the prepared polymer solution. The flask was transferred to an oil bath adjusted to 150 ° C., and reacted for 48 hours under heating and reflux.
- the weight average molecular weight Mw by GPC was 5,300 in terms of polystyrene.
- the obtained polysiloxane was a polysiloxane in which a part of silanol groups was capped with 4-methyl-2-pentanol.
- reaction solution is cooled to room temperature, 100 g of 2-propanol is added to the reaction solution, acetone, water and hydrochloric acid, and ethanol as a reaction byproduct are distilled off from the reaction solution under reduced pressure and concentrated to perform cohydrolytic condensation.
- a 2-propanol solution of the product (polysiloxane) was obtained. Solid content concentration was adjusted so that it might become 13 mass% in conversion of the solid residue in 140 degreeC. 20 mg of acetic acid was added to 15 g of the prepared polymer solution. The flask was transferred to an oil bath adjusted to 150 ° C. and reacted for 12 hours under heating and reflux. The weight average molecular weight Mw by GPC was 6,000 in terms of polystyrene.
- the obtained polysiloxane was a polysiloxane in which a part of silanol groups was capped with 2-propanol.
- reaction solution is cooled to room temperature, 100 g of 1-methoxy-2-propanol is added to the reaction solution, acetone, water and hydrochloric acid, and ethanol as a reaction byproduct are distilled off from the reaction solution under reduced pressure and concentrated.
- a 1-methoxy-2-propanol solution of the cohydrolyzed condensate (polysiloxane) was obtained. Solid content concentration was adjusted so that it might become 13 mass% in conversion of the solid residue in 140 degreeC. 20 mg of acetic acid was added to 15 g of the prepared polymer solution. The flask was transferred to an oil bath adjusted to 150 ° C. and reacted for 12 hours under heating and reflux.
- the weight average molecular weight Mw by GPC was 4,000 in terms of polystyrene.
- the obtained polysiloxane was a polysiloxane in which a part of silanol groups was capped with 1-methoxy-2-propanol.
- reaction solution is cooled to room temperature, 100 g of 4-methyl-2-pentanol is added to the reaction solution, and acetone, water, hydrochloric acid, and ethanol as a reaction byproduct are distilled off from the reaction solution under reduced pressure and concentrated.
- a 4-methyl-2-pentanol solution of a cohydrolyzed condensate (polysiloxane) was obtained. Solid content concentration was adjusted so that it might become 13 mass% in conversion of the solid residue in 140 degreeC.
- the weight average molecular weight Mw by GPC was 1,400 in terms of polystyrene.
- the obtained polysiloxane was a polysiloxane in which a part of silanol groups was capped with 4-methyl-2-pentanol.
- the polymer solutions obtained in Synthesis Examples B1 to B4 and Comparative Synthesis Example B1 were diluted with 1-methoxy-2-propanol, 2-propanol or 1-methoxy-2-propanol to obtain a coating solution.
- the polymer content shown in Table 5 is not a polymer solution but a solid content obtained by removing the solvent from the polymer solution. The content ratio of each component is expressed in parts by mass.
- 4-methyl-2-pentanol, 2-propanol, and 1-methoxy-2-propanol are abbreviated as MIBC, IPA, and PGME, respectively.
- the evaluation results using the coating solution of the present invention are shown below. [Flatability of coating liquid (Evaluation of flatness on Si substrate)]
- the coating polysiloxane compositions in Examples B1 to B4 and Comparative Example B1 were evaluated for planarization as follows. The evaluation results are shown in Table 6.
- a groove pattern having a depth of 220 nm and a width of 800 nm is observed, and the film thickness, that is, the shortest part and the largest part of the length from the interface on the side in contact with the substrate film to the interface on the side in contact with the atmosphere of the polysiloxane coating film
- the film thickness at the location was measured, the film thickness difference was calculated, and the smaller the film thickness difference, the better the flatness.
- SEM photographs used for the evaluation are shown in FIGS.
- the mold is immersed in Optool (registered trademark) HD (manufactured by Daikin Industries, Ltd.) in advance, treated for 2 hours using a high-temperature and high-humidity device with a temperature of 90 ° C and a humidity of 90RH%, rinsed with pure water, and then air What was dried with was used.
- Optool registered trademark
- HD manufactured by Daikin Industries, Ltd.
- the silicon nanomold was adhered to the coating film for optical nanoimprinting, and the optical nanoimprinting apparatus was installed.
- Optical nanoimprint is always performed at 23 ° C. under conditions of a) pressurization up to 1,000 N over 10 seconds, b) exposure at 500 mJ / cm 2 using a high-pressure mercury lamp, c) pressure removal over 10 seconds, d)
- the mold and the substrate were separated and released in a sequence.
- the coating polysiloxane compositions in Examples B1 to B4 and Comparative Example B1 were evaluated for planarization as follows. The evaluation results are shown in Table 7.
- Each of the coating polysiloxane compositions of Examples B1 to B4 and Comparative Example B1 (coating composition) was applied onto the nanoimprint substrate using a spin coater under the conditions of a rotation speed of 1,500 rpm and 60 seconds. Then, it was dried on a hot plate at 110 ° C. for 1 minute to form a polysiloxane coating film with a coating polysiloxane composition (coating composition).
- the film thickness of the polysiloxane coating film by the coating polysiloxane composition was 120 nm.
- the cross-sectional shape was observed by cross-sectional SEM, and planarization property was evaluated.
- Measure the film thickness that is, the film thickness of the shortest part and the largest part of the length from the interface on the side in contact with the substrate film to the interface on the side in contact with the air of the polysiloxane coating film, and calculate the film thickness difference The smaller the film thickness difference, the better the flatness.
- Examples B1 to B4 a flat film having a film thickness difference of 30 nm or less, for example, about 5 to 30 nm can be formed.
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Abstract
Description
[1] 段差基板上に、第一被覆用ポリシロキサンを含む第一被覆用ポリシロキサン組成物を塗布・焼成して第一ポリシロキサン被覆膜を作成する第一工程、さらに第一ポリシロキサン被覆膜の上に、第一被覆用ポリシロキサンとは異なる第二被覆用ポリシロキサンを含む第二被覆用ポリシロキサン組成物を塗布・焼成して第二ポリシロキサン被覆膜を作成する第二工程を経て製造される、ポリシロキサン被覆基板の製造方法であって、
上記第二ポリシロキサン被覆膜のIso-denseバイアスが50nm以下であり、
上記第一被覆用ポリシロキサンが、全シラン中、一分子あたり4つの加水分解性基を有する第一加水分解性シランを0~100モル%となる割合で含む加水分解性シラン原料の加水分解縮合物を含み、
上記第二被覆用ポリシロキサンが、Si原子に対し、シラノール基を30モル%以下の割合で含み、且つ重量平均分子量が1,000~50,000である、該製造方法。
[2] 上記第一被覆用ポリシロキサンが、
式(1):
(式(1)中、R1はアルキル基、アリール基、ハロゲン化アルキル基、ハロゲン化アリール基、アルコキシアリール基、アルケニル基、又はエポキシ基、アクリロイル基、メタクリロイル基、メルカプト基、もしくはシアノ基を有する有機基で且つSi-C結合によりケイ素原子と結合しているものであり、R2はアルコキシ基、アシルオキシ基、又はハロゲン基を示し、aは0~2の整数を示す。)で示され、aが0である加水分解性シランを0~50モル%、及び
式(1)で示され、aが1又は2である加水分解性シランを50(超)~100モル%
となる割合で含む加水分解性シラン原料の加水分解縮合物を含む、[1]に記載の製造方法。
[3] 上記第二被覆用ポリシロキサンが、式(1):
(式(1)中、R1はアルキル基、アリール基、ハロゲン化アルキル基、ハロゲン化アリール基、アルコキシアリール基、アルケニル基、又はエポキシ基、アクリロイル基、メタクリロイル基、メルカプト基、もしくはシアノ基を有する有機基で且つSi-C結合によりケイ素原子と結合しているものであり、R2はアルコキシ基、アシルオキシ基、又はハロゲン基を示し、aは1を示す。)で示される加水分解性シランを含む加水分解性シラン原料の加水分解縮合物を含む、[1]又は[2]に記載の製造方法。
[4] 上記第二被覆用ポリシロキサンが、
上記式(1)で示され、aが1である加水分解性シランを100~50モル%、好ましくは95~50モル%、及び、
上記式(1)で示され、aが2である加水分解性シランを0~50モル%、好ましくは5~50モル%
となる割合で含む加水分解性シラン原料の加水分解縮合物を含む、[3]に記載の製造方法。
[5] 上記第二被覆用ポリシロキサンが、加水分解性シラン原料を加水分解して縮合したポリシロキサンのシラノール基をキャッピングした変性ポリシロキサンであって、該変性ポリシロキサンはSi原子に対するシラノール基の割合が20モル%以下であり、
該変性ポリシロキサンが式(1):
(式(1)中、R1はアルキル基、アリール基、ハロゲン化アルキル基、ハロゲン化アリール基、アルコキシアリール基、アルケニル基、又はエポキシ基、アクリロイル基、メタクリロイル基、メルカプト基、もしくはシアノ基を有する有機基で且つSi-C結合によりケイ素原子と結合しているものであり、R2はアルコキシ基、アシルオキシ基、又はハロゲン基を示し、aは0である加水分解性シランを0~100モル%、好ましくは1~100モル%及び、aが1である加水分解性シランを0~100モル%、好ましくは0~99モル%となる割合で含むものである。)で示される加水分解性シラン原料の加水分解縮合物を含むものである、[1]に記載の製造方法。
[6] 段差基板上に、第一被覆用ポリシロキサンを含む第一被覆用ポリシロキサン組成物を塗布・焼成して第一ポリシロキサン被覆膜を作成する第一工程、及び第一被覆用ポリシロキサンとは異なる第二被覆用ポリシロキサンを含む第一ポリシロキサン被覆膜の上に、第二被覆用ポリシロキサン組成物を塗布・焼成して第二ポリシロキサン被覆膜を作成する第二工程を含む、段差基板上のポリシロキサン膜を平坦化する方法。
[7] 有機パターン基板上に、第一被覆用ポリシロキサンを含む第一被覆用ポリシロキサン組成物を塗布・焼成して第一ポリシロキサン被覆膜を作成する第一工程、さらに第一被覆用ポリシロキサンとは異なる第二被覆用ポリシロキサンを含む第一ポリシロキサン被覆膜の上に、第二被覆用ポリシロキサン組成物を塗布・焼成して第二ポリシロキサン被覆膜を作成する第二工程を経て製造されるポリシロキサン被覆基板を、エッチバックし有機パターンを露出させる工程、さらに該有機パターンをエッチング除去してパターンを反転させる工程を含む、半導体装置の製造方法。
さらに、この手法ではレジストの膜厚は薄いので高アスペクト比の反転パターンは得られない。しかし、本発明では被加工基板上のフォトレジストパターンと比較しアスペクト比の大きな段差基板を用いてパターンの反転を行うことができ、その結果高アスペクト比の反転パターンが得られる。本発明では、アスペクト比の大きな有機下層膜のパターン間への埋め込みが可能であるために、特定のポリシロキサン系組成物による被覆が有効である。
以下本発明の半導体基板の平坦化方法を含む半導体装置の製造方法の一例を以下に説明する。また、概要を図14に示す。
なお、本発明にいう段差基板としては、例えば、半導体デバイス又はMEMSデバイス向けのウエハが挙げられる。例えば、(1)ボッシュ法もしくはアルカリ水により段差が形成されたシリコンウエハで、片面にこの段差を有するもの、(2)同様にシリコンウエハとシリコンウエハの間にシリコン酸化膜が存在しるSOI(Silicon on Insulator)ウエハで、片面段差を有するもの、(3)ガリウムヒ素基板で、片面に段差形状を有するもの、(4)シリコンウエハ上に金属・絶縁膜が形成されていて、片面に段差形状を有するものなどが例示される。
上記組成物は粗と密なレイアウトを有するレジストパターン上に被覆されるものである。上記組成物は被覆される前のレジストパターンが、ナノインプリントで形成されたものを用いることができる。
工程(1)に用いられるフォトレジストとしては露光に使用される光に感光するものであれば特に限定はない。ネガ型フォトレジスト及びポジ型フォトレジストのいずれも使用できる。ノボラック樹脂と1,2-ナフトキノンジアジドスルホン酸エステルとからなるポジ型フォトレジスト、酸により分解してアルカリ溶解速度を上昇させる基を有するバインダーと光酸発生剤からなる化学増幅型フォトレジスト、酸により分解してフォトレジストのアルカリ溶解速度を上昇させる低分子化合物とアルカリ可溶性バインダーと光酸発生剤とからなる化学増幅型フォトレジスト、及び酸により分解してアルカリ溶解速度を上昇させる基を有するバインダーと酸により分解してフォトレジストのアルカリ溶解速度を上昇させる低分子化合物と光酸発生剤からなる化学増幅型フォトレジストなどがある。例えば、シプレー社製商品名APEX-E、住友化学工業(株)製商品名PAR710、及び信越化学工業(株)製商品名SEPR430等が挙げられる。また、例えば、Proc.SPIE,Vol.3999,330-334(2000)、Proc.SPIE,Vol.3999,357-364(2000)、やProc.SPIE,Vol.3999,365-374(2000)に記載されているような、含フッ素原子ポリマー系フォトレジストを挙げることができる。
工程(2)において、所定のマスクを通して露光が行なわれる。露光には、KrFエキシマレーザー(波長248nm)、ArFエキシマレーザー(波長193nm)及びEUV(波長13.5nm)等を使用することができる。露光後、必要に応じて露光後加熱(post exposure bake)を行なうこともできる。露光後加熱は、加熱温度70℃~150℃、加熱時間0.3~10分間から適宜、選択された条件で行われる。次いで、現像液によって現像が行なわれる。これにより、例えばポジ型フォトレジストが使用された場合は、露光された部分のフォトレジストが除去され、フォトレジストのパターンが形成される。
工程(3)として、現像中又は現像後のレジストに、第一被覆用ポリシロキサンを含む第一被覆用ポリシロキサン組成物を塗布・焼成して第一ポリシロキサン被覆膜を作製し、第一ポリシロキサン被覆膜の上に、第一被覆用ポリシロキサンとは異なる第二被覆用ポリシロキサンを含む第二被覆用ポリシロキサン組成物を塗布・焼成して第二ポリシロキサン被覆膜を作製することにより、該レジストのパターン間を該組成物で埋め込んだポリシロキサン組成物膜を形成する。塗布された被覆用ポリシロキサン組成物の焼成はそれぞれ、加熱温度50~180℃で0.5~5分間行われる。第二ポリシロキサン被覆膜のIso-denseバイアスは50nm以下とする。なお、第二ポリシロキサン被覆膜のIso-denseバイアスとは、上記段差基板の膜と接する側の界面から第二ポリシロキサン被覆膜の大気と接する側の界面までの長さの最も小さい箇所と最も大きい箇所との膜厚差をいう。具体的には、図15で表されるbの長さがIso-denseバイアスである。図中、aは密のスペース部の中心でのポリシロキサン被覆膜の凹み深さであり、bはオープンスペース部の中心でのポリシロキサン被覆膜の凹み深さであり、cは使用した段差基板における当初のスペースの深さであり、dはポリシロキサン被覆膜であり、eは段差基板である。また、段差基板は有機パターン(フォトレジストパターン、下層半導体基板のエッチングマスクとして機能するレジスト下層膜(塗布型、蒸着型)パターン、ナノインプリントにて形成されたパターン等)基板とすることができる。
工程(4)ではレジストパターンをエッチング除去してパターンを反転させる。工程(4)において、ドライエッチングはテトラフルオロメタン、パーフルオロシクロブタン(C4F8)、パーフルオロプロパン(C3F8)、トリフルオロメタン、一酸化炭素、アルゴン、酸素、窒素、六フッ化硫黄、ジフルオロメタン、三フッ化窒素及び三フッ化塩素等のガスを用いて行われる。特に酸素系のガスによりドライエッチングが行われることが好ましい。
本発明に係るポリシロキサン被覆基板の製造方法の第一工程において使用する第一被覆用ポリシロキサンを含む第一被覆用ポリシロキサン組成物について以下に説明する。
(式(1)中、R1はアルキル基、アリール基、ハロゲン化アルキル基、ハロゲン化アリール基、アルコキシアリール基、アルケニル基、又はエポキシ基、アクリロイル基、メタクリロイル基、メルカプト基、もしくはシアノ基を有する有機基で且つSi-C結合によりケイ素原子と結合しているものであり、R2はアルコキシ基、アシルオキシ基、又はハロゲン基を示し、aは0~2の整数を示す。)で示される。
本発明ではレジストの露光後に用いられる塗布用組成物であるため、マスクを通じてレジストの露光し現像中又は現像後に上記組成物で充填される。
これにより後のドライエッチング工程で、ガス種の選定により、レジストを選択的にドライエッチング除去して充填した加水分解縮合物(ポリシロキサン)による新たなパターンが形成される。
本発明に係るポリシロキサン被覆基板の製造方法の第一工程において使用する第二被覆用ポリシロキサンを含む第二被覆用ポリシロキサン組成物について以下に説明する。
(式(1)中、R1はアルキル基、アリール基、ハロゲン化アルキル基、ハロゲン化アリール基、アルコキシアリール基、アルケニル基、又はエポキシ基、アクリロイル基、メタクリロイル基、メルカプト基、もしくはシアノ基を有する有機基で且つSi-C結合によりケイ素原子と結合しているものであり、R2はアルコキシ基、アシルオキシ基、又はハロゲン基を示し、aは1を示す。)で示される加水分解性シラン原料の加水分解縮合物を含む。
ここで、アルキル基、アリール基、ハロゲン化アルキル基、ハロゲン化アリール基、アルコキシアリール基、アルケニル基、エポキシ基、アクリロイル基、メタクリロイル基、メルカプト基、シアノ基、アルコキシ基、アシルオキシ基、ハロゲン基等については、上記項目「2.第一被覆用ポリシロキサンを含む第一被覆用ポリシロキサン組成物」に述べたとおりである。
さらに好ましくは、式(1)中aが1である加水分解性シランを95~70モル%及び、式(1)中aが2である加水分解性シランを5~30モル%となる割合で含む。
(式(1)中、R1はアルキル基、アリール基、ハロゲン化アルキル基、ハロゲン化アリール基、アルコキシアリール基、アルケニル基、又はエポキシ基、アクリロイル基、メタクリロイル基、メルカプト基、もしくはシアノ基を有する有機基で且つSi-C結合によりケイ素原子と結合しているものであり、R2はアルコキシ基、アシルオキシ基、又はハロゲン基を示し、aは0である加水分解性シランを0~100モル%、より好ましくは1~100モル%及び、aが1である加水分解性シランを0~100モル%、より好ましくは0~99モル%となる割合で含むものである。)で示される加水分解性シラン原料の加水分解縮合物を含む。
例えば、4-メチル-2-ペンタノール、1-メトキシ-2-プロパノール、2-プロパノール等を用いることができる。
そして上述のポリシロキサン(加水分解縮合物)は、加水分解性シラン、又はその加水分解物を混合物として用いることもできる。加水分解縮合物を得る際に加水分解が完全に完了しない部分加水分解物やシラン化合物が加水分解縮合物に混合されて、その混合物を用いることもできる。この縮合物はポリシロキサン構造を有するポリマーである。
変性ポリシロキサンは、加水分解性シランを加水分解し縮合したポリシロキサンをアルコールと酸で脱水処理し、反応系外に生成水を除去する装置で合成したものを用いることができる。
また、酸は、70~160℃の沸点を有する酸が好ましい。例えば、トリフルオロ酢酸、イソ酪酸、酢酸等が挙げられる。
上記の酸は、酸解離定数(pka)が4~5であるか、又は沸点が70~160℃であるか、いずれかの物性を有するものが好ましい。即ち、酸性度が弱いものか、又は酸性度は強くても沸点が低いものを用いることができる。
そして、酸としては酸解離定数、沸点の性質からいずれの性質を利用することも可能であるが、両方の性質を持つ酢酸は好ましく用いることができる。
第一被覆用ポリシロキサン組成物及び第二被覆用ポリシロキサン組成物に共通して含まれていても良い成分について以下に説明する。なお、簡単のために「第一」、「第二」という接頭辞を省き、単に「被覆用ポリシロキサン組成物」と称することとする。
(但し、mは2~11、nは2~3の整数を、R21はアルキル基又はアリール基を、Y-は陰イオンを示す。)で示される構造を有する第4級アンモニウム塩、
式(D-2):
(但し、R22、R23、R24及びR25はアルキル基又はアリール基を、Nは窒素原子を、Y-は陰イオンを示し、且つR22、R23、R24、及びR25はそれぞれC-N結合により窒素原子と結合されているものである)で示される構造を有する第4級アンモニウム塩、
式(D-3):
(但し、R26及びR27はアルキル基又はアリール基を、Y-は陰イオンを示す)の構造を有する第4級アンモニウム塩、
式(D-4):
(但し、R28はアルキル基又はアリール基を、Y-は陰イオンを示す)の構造を有する第4級アンモニウム塩、
式(D-5):
(但し、R29及びR30はアルキル基又はアリール基を、Y-は陰イオンを示す)の構造を有する第4級アンモニウム塩、
式(D-6):
(但し、mは2~11、nは2~3の整数を、Hは水素原子を、Y-は陰イオンを示す)の構造を有する第3級アンモニウム塩が上げられる。
(但し、R31、R32、R33、及びR34はアルキル基又はアリール基を、Pはリン原子を、Y-は陰イオンを示し、且つR31、R32、R33、及びR34はそれぞれC-P結合によりリン原子と結合されているものである)で示される第4級ホスホニウム塩が上げられる。
(但し、R35、R36、及びR37はアルキル基又はアリール基を、Sは硫黄原子を、Y-は陰イオンを示し、且つR35、R36、及びR37はそれぞれC-S結合により硫黄原子と結合されているものである)で示される第3級スルホニウム塩が上げられる。
テトラエトキシシラン22.2g(30mol%)、メチルトリエトキシシラン44.4g(70mol%)およびアセトン100gを500mlのフラスコに入れ、そのフラスコ内の混合溶液をマグネチックスターラーにて撹拌しながら、0.01mol/Lの塩酸21.2gをその混合溶液に滴下した。滴下後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で4時間反応させた。その後、反応溶液を室温まで冷却し、その反応溶液に4-メチル-2-ペンタノールを100g加え、アセトン、水及び塩酸、並びに反応副生物であるエタノールを反応溶液から減圧留去し濃縮して、共加水分解縮合物(ポリマー)のメチルイソブチルカルビノール溶液を得た。固形分濃度は140℃における固形残物換算で13質量%となるように調整した。
作成したポリマー溶液15gに対し酢酸を20mg加えた。150℃に調整されたオイルバスにフラスコを移し、加温還流下で48時間反応させた。GPCによる重量平均分子量Mwはポリスチレン換算で5,300であった。得られたポリシロキサンは、シラノール基の一部が4-メチル-2-ペンタノールでキャッピングされたポリシロキサンであった。
ビニルトリメトキシシラン30.0g(80mol%)、ジメチルジエトキシシラン7.5g(20mol%)およびプロピレングリコールモノメチルエーテルアセテート56gを300mlのフラスコに入れ、そのフラスコ内の混合溶液をマグネチックスターラーにて撹拌しながら、0.01mol/Lの酢酸16.4gをその混合溶液に滴下した。滴下後、95℃に調整されたオイルバスにフラスコを移し、24時間反応させた。その後、反応溶液を室温まで冷却し、その反応溶液にプロピレングリコールモノメチルエーテルアセテートを19g加え、アセトン、水及び酢酸、並びに反応副生物であるエタノールを反応溶液から減圧留去し濃縮して、共加水分解縮合物(ポリマー)のプロピレングリコールモノメチルエーテルアセテート溶液を得た。固形分濃度は140℃における固形残物換算で30質量%となるように調整した。
作成したポリマー溶液15gを100mlフラスコに移し、100℃に調整されたオイルバス中で12時間反応させた。GPCによる重量平均分子量Mwはポリスチレン換算で10,000であった。
35質量%のテトラエチルアンモニウムヒドロキシド水溶液17.0g、2-プロパノール27.4g、テトラヒドロフラン54.8gを200mlナスフラスコに入れ、そのフラスコ内の混合溶液をマグネチックスターラーにて撹拌しながら、ビニルトリメトキシシラン9.0g(30mol%)、メチルトリエトキシシラン25.3g(70mol%)を滴下した。滴下後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で4時間反応させた。その後、反応溶液を室温まで冷却して500mlの分液ロートに移した。分液ロートに酢酸エチル100g、6規定塩酸34g、超純水68gを加え、分液操作を行い、酢酸エチル層を得た。得られた酢酸エチル層に68gの超純水を加え、洗浄を行った。洗浄操作をさらに1度繰り返し、得られた酢酸エチル層をエバポレーターにより減圧濃縮した。得られた加水分解縮合物(ポリマー)の酢酸エチル溶液の固形分濃度は140℃における固形残物換算で20質量%となるように調整した。GPCによる重量平均分子量Mwはポリスチレン換算で4,000であった。
テトラエトキシシラン53.9g(50mol%)、メチルトリエトキシシラン46.1g(50mol%)およびアセトン100gを500mlのフラスコに入れ、そのフラスコ内の混合溶液をマグネチックスターラーにて撹拌しながら、0.01mol/Lの塩酸32.6gをその混合溶液に滴下した。滴下後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で4時間反応させた。その後、反応溶液を室温まで冷却し、その反応溶液に4-メチル-2-ペンタノールを100g加え、アセトン、水及び塩酸、並びに反応副生物であるエタノールを反応溶液から減圧留去し濃縮して、共加水分解縮合物(ポリマー)の4-メチル-2-ペンタノール溶液を得た。固形分濃度は140℃における固形残物換算で13質量%となるように調整した。GPCによる重量平均分子量Mwはポリスチレン換算で1,400であった。
ポリマー中のシラノール基比率は1H NMRにて算出した。測定はJNM-ECA500(JEOL製)を用いて行った。まずトリエトキシメチルシランまたはジメチルジエトキシシランのメチルプロトンの化学シフト値(0.0-0.6ppm)の積分比を取り基準とした場合、シラノール基は5-7ppmでブロードなピークとして検出される。この5-7ppmの積分比を比較することで、ポリマー中のSi原子1個に対するシラノール基の比率(モル%)を算出した。
また一部ポリマーによっては5-7ppmにシラノール基以外のシランモノマー構造に由来する化学シフトが検出されてしまうことがあるため、見かけ上、シラノール基が多く検出されてしまうことがある。トリエトキシメチルシランまたはジメチルジエトキシシランとその他の構成シランモノマーの配合比率が既存であるため、トリエトキシメチルシランまたはジメチルジエトキシシランメチルプロトンの積分比から、構成シランモノマーの5-7ppmで検出されるモノマー由来ピークの積分比を見積もることができる。シラノール基と同一の化学シフトの範囲に化学シフトを持つシランモノマーを加える場合は、上記のようにして構成シランモノマーの積分比分を差し引くことで正味のシラノール量を算出した。
上記方法で算出された各合成例ポリマーおよび市販のポリシルセスキオキサン樹脂(製品名:SR―13H(小西化学製, 実施例A4))のシラノール量は下記のようになった。
上記合成例A1~A3及び比較合成例A1で得られたポリマー並びに上記SR―13Hの各々と、酸、硬化触媒、溶媒、超純水とを表1に示す割合で混合し、塗布膜形成組成物をそれぞれ調製した。表1中のポリマーの添加割合はポリマー溶液の添加量ではなく、ポリマー自体の添加量を示した。表1中でマレイン酸はMA、N-(3-トリエトキシシリプロピル)-4,5-ジヒドロイミダゾールはIMIDTEOS、4-メチル-2-ペンタノールはMIBC、プロピレングリコールモノメチルエーテルアセテートはPGMEA、プロピレングリコールモノエチルエーテルはPGEE、プロピレングリコールモノメチルエーテルはPGME、超純水はDIWと略した。各添加量は質量部で示した。
〔塗布液の平坦化性(Si基板上での平坦化性評価)〕
実施例A1~A4、比較例A1における各被覆用ポリシロキサン組成物について、下記のように平坦化性評価を行った。その評価結果を表2に示す。
溝の深さ220nm、幅800nmの段差基板上に、スピンコーターを用いて、回転数1500rpm、60秒間の条件にて、実施例A1~A4、比較例A1の各被覆用ポリシロキサン組成物を塗布し、その後110℃のホットプレート上で1分間乾燥することにより、ポリシロキサン被覆膜を形成した。ポリシロキサン被覆膜の膜厚は90nmとした。次いで、得られたポリシロキサン被覆膜について、断面SEMにより断面の形状を観察し平坦化性を評価した。深さ220nm、幅800nmの溝パターンを観察し、溝底部を基準として膜厚(すなわち、シリコン基板の膜と接する側の界面からポリシロキサン被覆膜の大気と接する側の界面までの長さ)の最も小さい箇所と最も大きい箇所の膜厚を測定し、膜厚差を算出し、膜厚差が少ないものほど平坦化性が良好と評価した。また評価に使用したSEM写真を図1~5に記載する。
実施例A1~A3、比較例A1における各被覆用ポリシロキサン組成物について、下記のように2度塗布工程でそれぞれの塗布液を塗布し、平坦化性評価を行った。その評価結果を表3に示す。
溝の深さ220nm、幅800nmの段差基板上に、スピンコーターを用いて、回転数1,500rpm、60秒間の条件にて、比較例A1の被覆用ポリシロキサン組成物を塗布し、その後160℃のホットプレート上で1分間乾燥することにより、第一ポリシロキサン被覆膜を形成した。第一ポリシロキサン被覆膜の膜厚は90nmとした。次いで、得られた第一ポリシロキサン被覆膜上に実施例A1~A3の各被覆用ポリシロキサン組成物を塗布し、その後110℃のホットプレート上で1分間乾燥することにより、比較例A1の第一ポリシロキサン被覆膜および実施例A1~A3のいずれかの第二ポリシロキサン被覆膜の2層から形成される積層膜を形成した。第二ポリシロキサン被覆膜の膜厚は90nmとし、積層膜の膜厚は先に塗布した比較例A1の第一ポリシロキサン被覆膜の膜厚90nmと合わせて合計180nmとした。作成した積層膜について、断面SEMにより断面の形状を観察し平坦化性を評価した。深さ220nm、幅800nmの溝パターンを観察し、溝底部を基準として膜厚(すなわち、シリコン基板の膜と接する側の界面から第二ポリシロキサン被覆膜の大気と接する側の界面までの長さ)の最も小さい箇所と最も大きい箇所の膜厚を測定し、膜厚差を算出し、膜厚差が少ないものほど平坦化性が良好と評価した。また評価に使用したSEM写真を図6~8に記載する。
次に、ナノナノインプリントによりパターニングされた基板上での平坦化性を評価した。
ナノナノインプリント用レジストは一般的なアクリル系光ナノインプリント用レジストを用いた。石英基板上にスピンコートし、100℃のホットプレートで1分間仮焼成を行い、光ナノインプリント用被膜を得た。
ナノナノインプリント装置は、NM-0801HB(明昌機構株式会社製)を使用した。
用いたモールドはシリコン製であり、パターン寸法は500nmとした。モールドは事前にオプツール(登録商標)HD(ダイキン工業株式会社製)に浸漬し、温度が90℃、湿度が90RH%の高温高湿装置を用いて2時間処理し、純水でリンス後、エアーで乾燥させたものを使用した。
実施例A1、A5、A6および比較例A1における各被覆用ポリシロキサン組成物について、下記のように平坦化性評価を行った。その評価結果を表4に示す。
前述のナノインプリント基板上に、スピンコーターを用いて、回転数1,500rpm、60秒間の条件にて、実施例A1およびA2並びに比較例A1の各被覆用ポリシロキサン組成物を塗布し、その後110℃のホットプレート上で1分間乾燥することにより、ポリシロキサン被覆膜を形成した。ポリシロキサン被覆膜の膜厚は120nmとした。次いで、得られたポリシロキサン被覆膜について、断面SEMにより断面の形状を観察し平坦化性を評価した。膜厚、すなわち、石英基板の膜と接する側の界面からポリシロキサン被覆膜の大気と接する側の界面までの長さの最も小さい箇所と最も大きい箇所の膜厚を測定し、膜厚差を算出し、膜厚差が少ないものほど平坦化性が良好と評価した。
テトラエトキシシラン53.9g(50mol%)、メチルトリエトキシシラン46.1g(50mol%)およびアセトン100gを500mlのフラスコに入れ、そのフラスコ内の混合溶液をマグネチックスターラーにて撹拌しながら、0.01mol/Lの塩酸32.6gをその混合溶液に滴下した。滴下後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で4時間反応させた。その後、反応溶液を室温まで冷却し、その反応溶液に4-メチル-2-ペンタノールを100g加え、アセトン、水及び塩酸、並びに反応副生物であるエタノールを反応溶液から減圧留去し濃縮して、共加水分解縮合物(ポリシロキサン)の4-メチル-2-ペンタノール溶液を得た。固形分濃度は140℃における固形残物換算で13質量%となるように調整した。
作成したポリマー溶液15gに対し酢酸を20mg加えた。150℃に調整されたオイルバスにフラスコを移し、加温還流下で24時間反応させた。GPCによる重量平均分子量Mwはポリスチレン換算で3,700であった。得られたポリシロキサンはシラノール基の一部が4-メチル-2-ペンタノールでキャッピングされたポリシロキサンであった。
テトラエトキシシラン22.2g(30mol%)、メチルトリエトキシシラン44.4g(70mol%)およびアセトン100gを500mlのフラスコに入れ、そのフラスコ内の混合溶液をマグネチックスターラーにて撹拌しながら、0.01mol/Lの塩酸21.2gをその混合溶液に滴下した。滴下後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で4時間反応させた。その後、反応溶液を室温まで冷却し、その反応溶液に4-メチル-2-ペンタノールを100g加え、アセトン、水及び塩酸、並びに反応副生物であるエタノールを反応溶液から減圧留去し濃縮して、共加水分解縮合物(ポリシロキサン)のメチルイソブチルカルビノール溶液を得た。固形分濃度は140℃における固形残物換算で13質量%となるように調整した。
作成したポリマー溶液15gに対し酢酸を20mg加えた。150℃に調整されたオイルバスにフラスコを移し、加温還流下で48時間反応させた。GPCによる重量平均分子量Mwはポリスチレン換算で5,300であった。得られたポリシロキサンはシラノール基の一部が4-メチル-2-ペンタノールでキャッピングされたポリシロキサンであった。
テトラエトキシシラン22.2g(30mol%)、メチルトリエトキシシラン44.4g(70mol%)およびアセトン100gを500mlのフラスコに入れ、そのフラスコ内の混合溶液をマグネチックスターラーにて撹拌しながら、0.01mol/Lの塩酸21.2gをその混合溶液に滴下した。滴下後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で4時間反応させた。その後、反応溶液を室温まで冷却し、その反応溶液に2-プロパノールを100g加え、アセトン、水及び塩酸、並びに反応副生物であるエタノールを反応溶液から減圧留去し濃縮して、共加水分解縮合物(ポリシロキサン)の2-プロパノール溶液を得た。固形分濃度は140℃における固形残物換算で13質量%となるように調整した。
作成したポリマー溶液15gに対し酢酸を20mg加えた。150℃に調整されたオイルバスにフラスコを移し、加温還流下で12時間反応させた。GPCによる重量平均分子量Mwはポリスチレン換算で6,000であった。得られたポリシロキサンはシラノール基の一部が2-プロパノールでキャッピングされたポリシロキサンであった。
テトラエトキシシラン22.2g(30mol%)、メチルトリエトキシシラン44.4g(70mol%)およびアセトン100gを500mlのフラスコに入れ、そのフラスコ内の混合溶液をマグネチックスターラーにて撹拌しながら、0.01mol/Lの塩酸21.2gをその混合溶液に滴下した。滴下後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で4時間反応させた。その後、反応溶液を室温まで冷却し、その反応溶液に1-メトキシ-2-プロパノールを100g加え、アセトン、水及び塩酸、並びに反応副生物であるエタノールを反応溶液から減圧留去し濃縮して、共加水分解縮合物(ポリシロキサン)の1-メトキシ-2-プロパノール溶液を得た。固形分濃度は140℃における固形残物換算で13質量%となるように調整した。
作成したポリマー溶液15gに対し酢酸を20mg加えた。150℃に調整されたオイルバスにフラスコを移し、加温還流下で12時間反応させた。GPCによる重量平均分子量Mwはポリスチレン換算で4,000であった。得られたポリシロキサンはシラノール基の一部が1-メトキシ-2-プロパノールでキャッピングされたポリシロキサンであった。
テトラエトキシシラン53.9g(50mol%)、メチルトリエトキシシラン46.1g(50mol%)およびアセトン100gを500mlのフラスコに入れ、そのフラスコ内の混合溶液をマグネチックスターラーにて撹拌しながら、0.01mol/Lの塩酸32.6gをその混合溶液に滴下した。滴下後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で4時間反応させた。その後、反応溶液を室温まで冷却し、その反応溶液に4-メチル-2-ペンタノールを100g加え、アセトン、水及び塩酸、並びに反応副生物であるエタノールを反応溶液から減圧留去し濃縮して、共加水分解縮合物(ポリシロキサン)の4-メチル-2-ペンタノール溶液を得た。固形分濃度は140℃における固形残物換算で13質量%となるように調整した。GPCによる重量平均分子量Mwはポリスチレン換算で1,400であった。得られたポリシロキサンはシラノール基の一部が4-メチル-2-ペンタノールでキャッピングされたポリシロキサンであった。
ポリマー中のシラノール基比率、および4-メチル-2-ペンタノール、1-メトキシ-2-プロパノールおよび2-プロパノールのキャッピング比率は1H NMRにて算出した。測定はJNM-ECA500(JEOL製)を用いて行った。まずトリエトキシメチルシランのメチルプロトンの化学シフト値(0.0-0.3ppm)の積分比を取り基準とした。4-メチル-2-ペンタノール、1-メトキシ-2-プロパノールおよび2-プロパノールのメチンプロトンの化学シフト値は3.8ppm付近に検出されるが、シラノール基との脱水縮合反応によりケイ素原子と結合を形成した場合、すなわちシラノール基に対してキャッピング反応が起こった場合、メチンプロトンの化学シフト値が4.2ppm付近に移動する。4.2ppm付近に移動したメチンプロトンの積分比を測定し、先に測定したトリエトキシメチルシランのメチルプロトンの積分比を比較することで、ポリマー中のケイ素原子1個に対する4-メチル-2-ペンタノール、1-メトキシ-2-プロパノールおよび2-プロパノールのキャッピング比率を算出した。
上記合成例B1~合成例B4及び比較合成例B1で得られたポリマー溶液を1-メトキシ-2-プロパノール、2-プロパノールまたは1-メトキシ-2-プロパノールにて希釈し、塗布液を得た。表5に示すポリマーの含有割合は、ポリマー溶液ではなく、ポリマー溶液から溶剤を除いた固形分の含有割合を示す。各成分の含有割合は質量部で表す。表5中では、4-メチル-2-ペンタノール、2-プロパノール、1-メトキシ-2-プロパノールをそれぞれMIBC、IPA、PGMEと略記する。
〔塗布液の平坦化性(Si基板上での平坦化性評価)〕
実施例B1~B4、比較例B1における各被覆用ポリシロキサン組成物について、下記のように平坦化性評価を行った。その評価結果を表6に示す。
次に、ナノナノインプリントによりパターニングされた基板上での平坦化性を評価した。
(ナノインプリント用光硬化レジストの準備)
ナノナノインプリント用レジストは一般的なアクリル系光ナノインプリント用レジストを用いた。石英基板上にスピンコートし、100℃のホットプレートで1分間仮焼成を行い、光ナノインプリント用被膜を得た。
(光ナノインプリント)
ナノナノインプリント装置は、NM-0801HB(明昌機構株式会社製)を使用した。
用いたモールドはシリコン製であり、パターン寸法は500nmとした。モールドは事前にオプツール(登録商標)HD(ダイキン工業株式会社製)に浸漬し、温度が90℃、湿度が90RH%の高温高湿装置を用いて2時間処理し、純水でリンス後、エアーで乾燥させたものを使用した。
実施例B1~B4、比較例B1における各被覆用ポリシロキサン組成物について、下記のように平坦化性評価を行った。その評価結果を表7に示す。
前述のナノインプリント基板上に、スピンコーターを用いて、回転数1,500rpm、60秒間の条件にて、実施例B1~B4、比較例B1の各被覆用ポリシロキサン組成物(塗布組成物)を塗布し、その後110℃のホットプレート上で1分間乾燥することにより、被覆用ポリシロキサン組成物(塗布組成物)によるポリシロキサン被覆膜を形成した。被覆用ポリシロキサン組成物によるポリシロキサン被覆膜の膜厚は120nmとした。次いで、得られたポリシロキサン被覆膜について、断面SEMにより断面の形状を観察し平坦化性を評価した。膜厚、すなわち、基板の膜と接する側の界面からポリシロキサン被覆膜の大気と接する側の界面までの長さの最も小さい箇所と最も大きい箇所の膜厚を測定し、膜厚差を算出し、膜厚差が少ないものほど平坦化性が良好と評価した。
2:有機下層膜
3:レジスト組成物
4:第一ポリシロキサン被覆膜
5:第二ポリシロキサン被覆膜
a:密のスペース部の中心でのポリシロキサン被覆膜の凹み深さ
b:オープンスペース部の中心でのポリシロキサン被覆膜の凹み深さ
c:使用した段差基板における当初のスペースの深さ
d:ポリシロキサン被覆膜
e:段差基板
Claims (7)
- 段差基板上に、第一被覆用ポリシロキサンを含む第一被覆用ポリシロキサン組成物を塗布・焼成して第一ポリシロキサン被覆膜を作成する第一工程、さらに第一ポリシロキサン被覆膜の上に、第一被覆用ポリシロキサンとは異なる第二被覆用ポリシロキサンを含む第二被覆用ポリシロキサン組成物を塗布・焼成して第二ポリシロキサン被覆膜を作成する第二工程を経て製造される、ポリシロキサン被覆基板の製造方法であって、
上記第二ポリシロキサン被覆膜のIso-denseバイアスが50nm以下であり、
上記第一被覆用ポリシロキサンが、全シラン中、一分子あたり4つの加水分解性基を有する第一加水分解性シランを0~100モル%となる割合で含む加水分解性シラン原料の加水分解縮合物を含み、
上記第二被覆用ポリシロキサンが、Si原子に対し、シラノール基を30モル%以下の割合で含み、且つ重量平均分子量が1,000~50,000である、該製造方法。 - 上記第一被覆用ポリシロキサンが、
式(1):
(式(1)中、R1はアルキル基、アリール基、ハロゲン化アルキル基、ハロゲン化アリール基、アルコキシアリール基、アルケニル基、又はエポキシ基、アクリロイル基、メタクリロイル基、メルカプト基、もしくはシアノ基を有する有機基で且つSi-C結合によりケイ素原子と結合しているものであり、R2はアルコキシ基、アシルオキシ基、又はハロゲン基を示し、aは0~2の整数を示す。)で示され、aが0である加水分解性シランを0~50モル%、及び
式(1)で示され、aが1又は2である加水分解性シランを50(超)~100モル%
となる割合で含む加水分解性シラン原料の加水分解縮合物を含む、請求項1に記載の製造方法。 - 上記第二被覆用ポリシロキサンが、
上記式(1)で示され、aが1である加水分解性シランを100~50モル%、及び、
上記式(1)で示され、aが2である加水分解性シランを0~50モル%
となる割合で含む加水分解性シラン原料の加水分解縮合物を含む、請求項3に記載の製造方法。 - 上記第二被覆用ポリシロキサンが、加水分解性シラン原料を加水分解して縮合したポリシロキサンのシラノール基をキャッピングした変性ポリシロキサンであって、該変性ポリシロキサンはSi原子に対するシラノール基の割合が30モル%以下であり、
該変性ポリシロキサンが式(1):
(式(1)中、R1はアルキル基、アリール基、ハロゲン化アルキル基、ハロゲン化アリール基、アルコキシアリール基、アルケニル基、又はエポキシ基、アクリロイル基、メタクリロイル基、メルカプト基、もしくはシアノ基を有する有機基で且つSi-C結合によりケイ素原子と結合しているものであり、R2はアルコキシ基、アシルオキシ基、又はハロゲン基を示し、aは0である加水分解性シランを0~100モル%及び、aが1である加水分解性シランを0~100モル%となる割合で含むものである。)で示される加水分解性シラン原料の加水分解縮合物を含むものである、請求項1に記載の製造方法。 - 段差基板上に、第一被覆用ポリシロキサンを含む第一被覆用ポリシロキサン組成物を塗布・焼成して第一ポリシロキサン被覆膜を作成する第一工程、及び第一被覆用ポリシロキサンとは異なる第二被覆用ポリシロキサンを含む第一ポリシロキサン被覆膜の上に、第二被覆用ポリシロキサン組成物を塗布・焼成して第二ポリシロキサン被覆膜を作成する第二工程を含む、段差基板上のポリシロキサン膜を平坦化する方法。
- 有機パターン基板上に、第一被覆用ポリシロキサンを含む第一被覆用ポリシロキサン組成物を塗布・焼成して第一ポリシロキサン被覆膜を作成する第一工程、さらに第一被覆用ポリシロキサンとは異なる第二被覆用ポリシロキサンを含む第一ポリシロキサン被覆膜の上に、第二被覆用ポリシロキサン組成物を塗布・焼成して第二ポリシロキサン被覆膜を作成する第二工程を経て製造されるポリシロキサン被覆基板を、エッチバックし有機パターンを露出させる工程、さらに該有機パターンをエッチング除去してパターンを反転させる工程を含む、半導体装置の製造方法。
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WO2019126156A1 (en) * | 2017-12-19 | 2019-06-27 | Honeywell International Inc. | Crack-resistant polysiloxane dielectric planarizing compositions, methods and films |
US11015082B2 (en) | 2017-12-19 | 2021-05-25 | Honeywell International Inc. | Crack-resistant polysiloxane dielectric planarizing compositions, methods and films |
TWI690774B (zh) * | 2018-01-30 | 2020-04-11 | 日商旭化成股份有限公司 | 感光性樹脂積層體及抗蝕劑圖案之製造方法 |
JP2020096168A (ja) * | 2018-09-21 | 2020-06-18 | 日産化学株式会社 | 固体撮像素子用平坦化膜形成樹脂組成物 |
JP7319588B2 (ja) | 2018-09-21 | 2023-08-02 | 日産化学株式会社 | 固体撮像素子用平坦化膜形成樹脂組成物 |
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JP6835062B2 (ja) | 2021-02-24 |
KR20180118636A (ko) | 2018-10-31 |
CN108885997A (zh) | 2018-11-23 |
JPWO2017145808A1 (ja) | 2018-12-13 |
TWI707400B (zh) | 2020-10-11 |
US20190051518A1 (en) | 2019-02-14 |
US10910220B2 (en) | 2021-02-02 |
CN108885997B (zh) | 2023-06-02 |
TW201802944A (zh) | 2018-01-16 |
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