WO2017141706A1 - 検査用導電性接触子、および半導体検査装置 - Google Patents
検査用導電性接触子、および半導体検査装置 Download PDFInfo
- Publication number
- WO2017141706A1 WO2017141706A1 PCT/JP2017/003586 JP2017003586W WO2017141706A1 WO 2017141706 A1 WO2017141706 A1 WO 2017141706A1 JP 2017003586 W JP2017003586 W JP 2017003586W WO 2017141706 A1 WO2017141706 A1 WO 2017141706A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive contact
- linear
- vertices
- ridges
- ridge
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
Definitions
- the present invention relates to an inspection apparatus.
- a display device typified by a liquid crystal display device, an EL (Electroluminescence) display device, and the like is also a kind of electronic component, and although it is manufactured on a glass or plastic substrate, many thin films are formed as in a semiconductor integrated circuit. It is formed through a forming process.
- the thin film formation process is performed in an environment where the contamination of foreign matters is highly regulated, it includes several hundreds of processes, so it is difficult to completely prevent substrate and circuit damage and patterning defects. . For this reason, it is necessary to inspect various characteristics of the electronic component to prevent entry of defective products.
- a semiconductor inspection device When inspecting the electrical characteristics of an electronic component, it is generally performed using an inspection device called a semiconductor inspection device.
- the tip of a thin needle electrode called a conductive contact is brought into contact with an electrode or wiring formed on a semiconductor integrated circuit to acquire various electrical information.
- the size of the electrode and the wiring depends on the semiconductor integrated circuit, but if it is small, it is an area of a few hundred tens ⁇ m square. Therefore, in order to perform an inspection with high accuracy, it is important to ensure that the conductive contact is in electrical contact with such a small area electrode or wiring.
- the electrodes and wirings are not necessarily arranged horizontally, and the shape is not limited to a plane.
- a lead terminal extended from the package may have a curved structure.
- a spherical solder ball formed on the package is used as an inspection electrode. For this reason, in order to ensure electrical contact between the electrode or wiring and the conductive contact, conductive contacts having various shapes of end portions are known.
- One of the objects of the present invention is to provide a conductive contact that can reliably achieve electrical contact with a semiconductor integrated circuit to be inspected or an electrode or wiring of an electronic component including the semiconductor integrated circuit.
- One of the objects of the present invention is to provide a conductive contact having excellent durability, for example, durability of an end portion that contacts an electrode or wiring.
- One of the objects of the present invention is to provide a conductive contact that can reduce the need to consider the shape of the electrode or wiring when the conductive contact is installed in the conductive contact unit.
- One of the objects of the present invention is to provide a conductive contact unit including one or two or more conductive contacts, or a semiconductor inspection apparatus including the conductive contact unit.
- One embodiment of the present invention is a conductive contact having a first end and a second end opposite the first end.
- the first end has first to fourth linear ridges and first to fifth vertices, and the first to fourth linear ridges are separated from each other and form a cross. Be placed.
- the first to fourth vertices are on the outer periphery of the first end, and are between the first linear ridge and the second linear ridge, and between the second linear ridge and the third linear ridge, respectively. , Between the third linear ridge and the fourth linear ridge, and between the fourth linear ridge and the first linear ridge.
- the first to fourth linear ridges may be parallel to the radial direction of the conductive contact.
- the first to fourth linear ridges may exist on the same plane as the fifth vertex.
- the fifth vertex may be located at the intersection of the crosses. Alternatively, it may exist on the same plane as the surface formed by the first to fourth vertices, or may exist on a different plane.
- the distance from the fifth vertex to the second end is greater than the distance from each of the first to fourth linear ridges to the second end. It may be small.
- the distance from each of the first to fourth vertices and the second end is determined from each of the first to fourth linear ridges and the second end. It may be smaller than the distance up to.
- Each of the first to fourth linear ridges may be shorter than the radius of the conductive contact.
- the first to fourth vertices may be present on the outer peripheral surface of the conductive contact.
- Each of the first to fourth linear ridges may reach the outer peripheral surface of the conductive contact.
- the first to fourth linear ridges may exist on the same plane as the first to fourth vertices.
- the plane may be parallel to the radial direction.
- One embodiment of the present application is a conductive contact unit having a conductive contact.
- One embodiment of the present invention is a semiconductor inspection apparatus having a conductive contact unit.
- FIG. 1 is a perspective view of a semiconductor inspection apparatus according to an embodiment of the present invention. It is sectional drawing of the electroconductive contactor of one Embodiment of this invention. It is a perspective view of the conductive contact of one embodiment of the present invention. It is sectional drawing of the electroconductive contactor of one Embodiment of this invention. It is sectional drawing of the electroconductive contactor of one Embodiment of this invention. It is a perspective view of the conductive contact of one embodiment of the present invention. It is sectional drawing of the electroconductive contactor of one Embodiment of this invention. It is sectional drawing of the electroconductive contactor of one Embodiment of this invention. It is a perspective view of the conductive contact of one embodiment of the present invention.
- FIG. 1A is a schematic diagram showing a configuration of a semiconductor inspection apparatus according to the first embodiment.
- the semiconductor inspection apparatus 100 includes a conductive contact unit 120 and a conductive contact 110 provided therein.
- the number of the conductive contacts 110 may be one or more, and usually a plurality (for example, several tens to several thousands) of conductive contacts 110 are installed.
- the conductive contact 110 exchanges electric signals with the circuit board 140.
- the circuit board 140 is connected to the tester 150.
- the tester 150 includes units such as a measurement power supply 152, an LCR measurement device 154, and a pulse generator 156.
- FIG. 1B is a schematic cross-sectional view of the conductive contact 110 and the conductive contact unit 120 shown in FIG. 1A.
- the conductive contact 110 is accommodated in the conductive contact unit 120, and the end portion (first end portion 230) is exposed.
- the first end portion 230 comes into contact with the electrode or wiring of the inspection object 170, and the electrical characteristics are measured.
- the inspection object 170 include an integrated circuit formed on a semiconductor substrate and an IC package in which the integrated circuit is packaged. Note that the second end portion opposite to the first end portion 230 is 240.
- the conductive contact unit 120 is formed using an insulator such as resin or ceramic.
- the plurality of conductive contacts 110 are arranged so as to have the same height. Further, the arrangement may be determined according to the electrode to be inspected and the wiring pattern.
- the conductive contact 110 includes a conductive material, for example, a metal such as gold, copper, nickel, palladium, tungsten, or an alloy of the above metals. Alternatively, a conductive material may be included and the surface may be plated using gold or the like.
- the conductive contact 110 has a first plunger 200 and a second plunger 210.
- the first plunger 200 makes electrical contact with the electrode and wiring of the inspection object 170 at its end, that is, the first end 230.
- the first and second plungers 200 and 210 preferably have a columnar shape, and this embodiment will be described as a columnar shape.
- the conductive contact unit 120 is further provided with a coil spring 220.
- the coil spring 220 is axially moved. By expanding and contracting, the impact on the inspection object can be reduced.
- FIG. 2 shows a perspective view of the first end 230 of the conductive contact 110.
- the first end 230 has four linear ridges (first to fourth linear ridges) R1 to R4 and five vertices (first to second) indicated by bold lines in the drawing. Fifth vertex) T1 to T5.
- FIGS. 2 and 3A are schematic cross-sectional views taken along dotted lines A1-A2 and B1-B2 shown in FIG. 2, respectively.
- the first to fourth linear ridges R1 to R4 exist on the same plane and are separated from each other. The direction is parallel to the radial direction of the conductive contact 110 (x-axis direction in the figure). That is, the first to fourth linear ridges R1 to R4 extend radially toward the central axis of the conductive contact parallel to the direction indicated by the y-axis in the drawing.
- the first to fourth linear ridges R1 to R4 are provided so as to form a cross.
- first linear ridge R1 and the third linear ridge R3 are on the same straight line (first straight line), and the second linear ridge R2 and the fourth linear ridge R4 are the same straight line ( The first straight line and the second straight line are orthogonal to each other.
- the angle formed by the first straight line and the second straight line is not limited to a right angle, and can be set to an arbitrary angle.
- the first to fourth vertices T1 to T4 exist on the same plane.
- the plane is parallel to the radial direction of the conductive contact.
- the fifth vertex T5 is also present on the plane. That is, all of the first vertex T1 to the fifth vertex T5 exist on the same plane.
- the fifth vertex T5 includes a straight line (first straight line) passing through the first linear ridge R1 and the third linear ridge R3, a second linear ridge R2, and a fourth linear ridge R4. Exists at the intersection with a straight line passing through (second straight line).
- the diameter of the first end portion 230 decreases in the direction toward the distal end. Is provided. That is, the ends of the linear ridges R1 to R4 and the vertices T1 to T4 are all formed inside the cross section of the maximum diameter portion of the first end 230.
- the embodiment of the present invention is not limited to this, for example, the fifth vertex T5. May exist outside the plane formed by the other vertices T1 to T4.
- all of the first to fifth vertices T1 to T5 are present on the same plane as the plane formed by the first to fourth linear ridges R1 to R4.
- the form is not limited to this. For example, only the fifth vertex exists on the same surface as the surface formed by the first to fourth linear ridges R1 to R4, and the other vertex exists outside the surface. May be.
- the diameter of the first end portion 230 decreases as it goes in the distal direction, and linear ridges R1 to R4 and vertices T1 to T5 are formed at the ends thereof.
- the first end portion 230 may maintain a cylindrical shape up to the tip, and linear ridges R1 to R4 and vertices T1 to T5 may be provided at the tip. The embodiment described above will be described later.
- the first end portion 230 having such a shape can be formed using a rotary cutting tool or the like when turning the cylindrical first plunger 200, for example.
- the first to fourth linear ridges R 1 to R 4 are separated from each other, and the length thereof is shorter than the radius of the conductive contact 110. More specifically, the length of each of the first to fourth linear ridges R 1 to R 4 is smaller than the maximum radius of the first plunger 200 including the first end 230. Further, it is preferably 10 ⁇ m or more and 15% or less of the diameter of the tip portion of the first end portion 230. Further, each of the first to fourth linear ridges R 1 to R 4 reaches the outer periphery of the conductive contact 110. That is, each of the first to fourth linear ridges R 1 to R 4 extends from the side surface of the first plunger 200 including the first end 230 toward the central axis.
- the first to fourth vertices T1 to T4 exist on the side surface of the conductive contact 110.
- the first to fourth vertices T ⁇ b> 1 to T ⁇ b> 4 are located on the outer periphery of the first plunger 200 including the first end portion 230.
- the conductive contact 110 having such an end shape can be in contact with an electrode or wiring to be inspected using a plurality of lines as contact parts.
- all of the first to fourth linear ridges R1 to R4 can contribute to electrical contact.
- the fifth vertex T5 is on the same plane as the plane including the first to fourth linear ridges R1 to R4, the fifth vertex T5 is added to the first to fourth linear ridges R1 to R4, The vertex T5 also contributes to electrical contact.
- Patent Documents 1 and 4 and 5 disclose a conductive contact having a plurality of conical or pyramidal contact portions, but in this case, the contact with the electrode and the wiring is a plurality of points. Only done. Therefore, by adopting the end shape of the present embodiment, not only more reliable electrical contact is possible, but also wear or loss of the end of the conductive contact 110 can be prevented or reduced. It is.
- Patent Document 2 discloses a conductive contact having a single linear ridge at the end, but in this case, when contact is made from an oblique direction with respect to the electrode or wiring, only one point is disclosed. Contact. Therefore, by using the terminal shape of the present embodiment, more reliable electrical contact with the inspection object is possible.
- the conductive contact has only a two-fold rotation axis (C2 axis: a rotation axis that gives the same state by rotation of 180 degrees), and therefore, along the central axis Depending on the rotation, the direction in which the linear ridge comes into contact with the electrode and the wiring changes greatly. Therefore, it is necessary to install the conductive contact unit so as to prohibit rotation along the central axis, and the shape of the opening provided in the conductive unit for storing the conductive contact may be, for example, an ellipse or a large number. It needs to be square.
- the conductive contact of this embodiment has a four-fold rotation axis (C4 axis: a rotation axis that gives the same state by rotation of 90 degrees), the influence of the rotation along the central axis of the conductive contact. Therefore, there is no need to consider the rotation along the central axis when installing on the conductive contact unit. Therefore, the shape of the opening can be made circular, and the processability of the conductive contact unit can be improved.
- C4 axis a rotation axis that gives the same state by rotation of 90 degrees
- FIGS. 4, 5A, and 5B are schematic cross-sectional views taken along dotted lines A1-A2 and B1-B2 shown in FIG. 4, respectively.
- the first end 230 of the conductive contact 110 has four linear ridges (first to fourth linear ridges) R1 to R4 and five apexes (first To fifth vertex) T1 to T5.
- the difference from the first embodiment is that although the fifth vertex T5 exists on the same plane as the first to fourth linear ridges R1 to R4, the first to fourth vertices T1 to T4 are Are on different planes. More specifically, the fifth vertex T5 includes a straight line (first straight line), a second straight ridge R2, and a fourth straight line passing through the first straight ridge R1 and the third straight ridge R3.
- the first to fourth vertices T1 to T4 exist at positions closer to the second end portion 240, though they exist at the intersections of the straight lines passing through the ridge R4. That is, the first to fourth vertices T1 to T4 exist at lower positions along the y-axis in the drawing. Except for the configuration described above, the second embodiment is the same as the first embodiment, and a detailed description thereof is omitted.
- the conductive contact 110 having such an end shape also includes four lines and one line by a plurality of lines by the first to fourth linear ridges and the fifth vertex T5.
- a point can be contacted with an electrode or wiring to be inspected as a contact site. Therefore, it is possible not only to make more reliable electrical contact, but also to prevent or reduce wear and loss of the end of the conductive contact 110.
- the terminal shape of the present embodiment also has a C4 axis, it is possible to reduce the necessity of considering the rotation along the central axis when installing the conductive contact unit. The workability of the can be improved.
- a spherical solder ball when used as an inspection electrode, electrical contact is possible in various contact modes, depending on its size. For example, electrical contact is possible using one point in the first linear ridge R1, the first vertex T1, and the fifth vertex T5. Therefore, more reliable electrical contact with the electrode or wiring to be inspected is possible.
- FIGS. 6, 7A, and 7B are schematic cross-sectional views taken along dotted lines A1-A2 and B1-B2 shown in FIG. 6, respectively.
- the first end 230 of the conductive contact 110 has four linear ridges (first to fourth linear ridges) R1 to R4, and five It has vertices (first to fifth vertices) T1 to T5.
- the difference from the first and second embodiments is that the first to fifth vertices T1 to T5 exist on the same plane, but the plane includes the first to fourth linear ridges R1 to R4. Are located on different planes and are closer to the second end 240. That is, with respect to the y-axis direction, the first to fifth vertices exist at positions lower than the first to fourth linear ridges R1 to R4.
- the second embodiment is the same as the first embodiment, and a detailed description thereof is omitted.
- the conductive contact 110 having such an end shape is also an electrode to be inspected by using a plurality of lines of the first to fourth linear ridges as four contact points. And can be in contact with wiring. Therefore, it is possible not only to make more reliable electrical contact, but also to prevent or reduce wear and loss of the end of the conductive contact 110.
- the terminal shape of the present embodiment also has a C4 axis, it is possible to reduce the necessity of considering the rotation along the central axis when installing the conductive contact unit. The workability of the can be improved.
- FIGS. 8, 9A, and 9B are schematic cross-sectional views taken along dotted lines A1-A2 and B1-B2 shown in FIG. 4, respectively. Note that a description of the same configuration as in the first to third embodiments is omitted.
- the first end 230 of the conductive contact 110 has four linear ridges (first to fourth linear ridges) R1 to R4 and five apexes. (First to fifth vertices) T1 to T5.
- the first to fourth linear ridges R1 to R4 and the first to fifth vertices T1 to T5 exist on the same plane.
- the difference between the conductive contact 110 according to the present embodiment and that according to the first embodiment is that, in the latter case, the diameter of the first end portion 230 decreases in the direction of the distal end, and the straight ridges R1 to R4 are further formed. And vertices T1 to T5 are provided.
- the diameter of the first end 230 is constant, and linear ridges R1 to R4 and vertices T1 to T5 are provided at the tip.
- the conductive contact 110 having such an end shape is also formed by a plurality of lines formed by the first to fourth linear ridges and the first to fifth vertices T1 to T5.
- One straight line and five points can be used as contact parts to contact an electrode or wiring to be inspected. Therefore, it is possible not only to make more reliable electrical contact, but also to prevent or reduce wear and loss of the end of the conductive contact 110.
- the terminal shape of the present embodiment also has a C4 axis, it is possible to reduce the necessity of considering the rotation along the central axis when installing the conductive contact unit. The workability of the can be improved.
- a spherical solder ball when used as an inspection electrode, electrical contact is possible in various contact modes, depending on its size. For example, electrical contact is possible using one point in the first linear ridge R1, the first vertex T1, and the fifth vertex T5. Therefore, more reliable electrical contact with the electrode or wiring to be inspected is possible.
- the durability test of the conductive contact 110 shown in the second embodiment and the result are described.
- the durability test was performed by installing the conductive contact 110 shown in FIG. 4 on the conductive contact unit 120 and pressing the metal plate plated with solder from the top with the conductive contact 110. This operation was repeated, and the shape of the first end 230 of the conductive contact 110 was observed with a scanning electron microscope (SEM), and the amount of wear at the tip was measured (Sample 1).
- SEM scanning electron microscope
- a similar test was performed on a conductive contact (sample 2) having four apexes at the tip but no linear ridge as shown in FIG.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
<1.半導体検査装置の構成>
図1Aは第1実施形態に係る本発明の半導体検査装置の構成を示す模式図である。半導体検査装置100は、導電性接触子ユニット120と、それに備えられた導電性接触子110を有する。導電性接触子110は1つ以上であればよく、通常複数(例えば数十から数千)の導電性接触子110が設置される。導電性接触子110は回路基板140との間で電気信号の授受を行う。なお図1Aでは、回路基板140はテスタ150と接続される。テスタ150には計測電源152やLCR測定器154、パルス発生器156などのユニットが含まれる。
図2に導電性接触子110の第1の端部230の斜視図を示す。図2に示すように第1の端部230には、図中、太線で示される4つの直線状リッジ(第1から第4の直線状リッジ)R1からR4、および5つの頂点(第1から第5の頂点)T1からT5を有している。
本実施形態では、第1実施形態とは異なる末端形状を有する導電性接触子について、図4、図5A、図5Bを用いて説明する。図4は導電性接触子110の第1の端部230の斜視図、図5Aと図5Bはそれぞれ、図4で示した点線A1-A2とB1-B2における断面模式図である。
本実施形態では、第1および第2実施形態とは異なる末端形状を有する導電性接触子について、図6、図7A、図7Bを用いて説明する。図6は導電性接触子110の第1の端部230の斜視図、図7Aと図7Bはそれぞれ、図6で示した点線A1-A2とB1-B2における断面模式図である。
本実施形態では、第1乃至第3実施形態とは異なる末端形状を有する導電性接触子について、図8、図9A、図9Bを用いて説明する。図8は導電性接触子110の第1の端部230の斜視図、図9Aと図9Bはそれぞれ、図4で示した点線A1-A2とB1-B2における断面模式図である。なお、第1乃至第3実施形態と同じ構成に関しての記述は省略する。
Claims (12)
- 第1の端部と、
前記第1の端部と対向する第2の端部とを有し、
前記第1の端部は、第1から第4の直線状リッジと第1から第5の頂点を有し、
前記第1から第4の直線状リッジは互いに隔たれ、かつ十字を形成するように配置され、
前記第1から第4の頂点は前記第1の端部の外周にあり、それぞれ前記第1の直線状リッジと前記第2の直線状リッジの間、前記第2の直線状リッジと前記第3の直線状リッジの間、前記第3の直線状リッジと前記第4の直線状リッジの間、前記第4の直線状リッジと前記第1の直線状リッジの間に設けられる、導電性接触子。 - 前記第1から第4の直線状リッジは、前記導電性接触子の半径の方向に対して平行である、請求項1に記載の導電性接触子。
- 前記第1から第4の直線状リッジは、前記第5の頂点と同一平面上に存在する、請求項1に記載の導電性接触子。
- 前記第5の頂点は前記十字の交点に位置する、請求項1に記載の導電性接触子。
- 前記第5の頂点は、前記第1から第4の頂点が形成する面と異なる平面上に存在する、請求項1に記載の導電性接触子。
- 前記導電性接触子の軸に平行な方向において、前記第1から第4の頂点の各々と前記第2の端部までの距離は、前記第1から第4の直線状リッジの各々と前記第2の端部までの距離よりも小さい、請求項1に記載の導電性接触子。
- 前記第1から第4の直線状リッジの各々は、前記導電性接触子の半径よりも短い、請求項1に記載の導電性接触子。
- 前記第1から第4の直線状リッジの各々は、前記導電性接触子の外周に達する、請求項1に記載の導電性接触子。
- 前記第1から第4の直線状リッジは、前記第1から第4の頂点と同一平面上に存在し、
前記平面は前記導電性接触子の半径の方向に平行である、請求項1に記載の導電性接触子。 - 前記第5の頂点は、前記第1から第4の頂点が形成する面上に存在する、請求項1に記載の導電性接触子。
- 請求項1に記載の前記導電性接触子を有する導電性接触子ユニット。
- 請求項11に記載の前記導電性接触子ユニットを有する半導体検査装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/576,605 US10274517B2 (en) | 2016-02-15 | 2017-02-01 | Conductive probe for inspection and semiconductor inspection device |
JP2017539049A JP6243584B1 (ja) | 2016-02-15 | 2017-02-01 | 検査用導電性接触子、および半導体検査装置 |
SG11201709953TA SG11201709953TA (en) | 2016-02-15 | 2017-02-01 | Conductive probe for inspection and semiconductor inspection device |
PH12017502189A PH12017502189A1 (en) | 2016-02-15 | 2017-11-29 | Conductive probe for inspection and semiconductor inspection device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016-026041 | 2016-02-15 | ||
JP2016026041 | 2016-02-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2017141706A1 true WO2017141706A1 (ja) | 2017-08-24 |
Family
ID=59626041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2017/003586 WO2017141706A1 (ja) | 2016-02-15 | 2017-02-01 | 検査用導電性接触子、および半導体検査装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10274517B2 (ja) |
JP (1) | JP6243584B1 (ja) |
PH (1) | PH12017502189A1 (ja) |
SG (1) | SG11201709953TA (ja) |
TW (1) | TWI629484B (ja) |
WO (1) | WO2017141706A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018084438A (ja) * | 2016-11-21 | 2018-05-31 | 株式会社エンプラス | 電気接触子及び電気部品用ソケット |
KR102212346B1 (ko) * | 2019-12-17 | 2021-02-04 | 주식회사 제네드 | 프로브 핀 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5896259U (ja) * | 1981-12-22 | 1983-06-30 | 富士通株式会社 | 接触ピン |
US4417206A (en) * | 1981-03-09 | 1983-11-22 | Virginia Panel Corporation | Electrical contact probe and method of manufacturing |
JPS6179273U (ja) * | 1984-10-29 | 1986-05-27 | ||
JPH10214649A (ja) * | 1997-01-30 | 1998-08-11 | Yokowo Co Ltd | スプリングコネクタおよび該スプリングコネクタを用いた装置 |
JP2013130516A (ja) * | 2011-12-22 | 2013-07-04 | Yamaichi Electronics Co Ltd | コンタクトプローブ及びそれを備えた半導体素子用ソケット |
JP2014085207A (ja) * | 2012-10-23 | 2014-05-12 | Renesas Electronics Corp | 半導体装置テスト用プローブピン |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4174148A (en) * | 1977-12-16 | 1979-11-13 | Amerace Corporation | Electrical terminal clamp assembly |
US4571540A (en) | 1983-09-14 | 1986-02-18 | Virginia Panel Corporation | Electrical contact probe |
JP2000329789A (ja) | 1999-03-12 | 2000-11-30 | Sony Chem Corp | 針状接点プローブ |
US6759858B2 (en) * | 1999-10-20 | 2004-07-06 | Intel Corporation | Integrated circuit test probe having ridge contact |
US8253430B2 (en) * | 2005-04-22 | 2012-08-28 | Hewlett-Packard Development Company | Circuit board testing using a probe |
JP2008157904A (ja) | 2006-12-25 | 2008-07-10 | Shuichi Ikeda | 電気テスト用接触子 |
JP2009198238A (ja) | 2008-02-20 | 2009-09-03 | Totoku Electric Co Ltd | プローブ針及びその製造方法 |
WO2011071082A1 (ja) * | 2009-12-11 | 2011-06-16 | 日本発條株式会社 | コンタクトプローブ |
JP5597108B2 (ja) * | 2010-11-29 | 2014-10-01 | 株式会社精研 | 接触検査用治具 |
JP5783715B2 (ja) | 2010-12-20 | 2015-09-24 | ユニテクノ株式会社 | 検査用コンタクトプローブ |
JPWO2013018809A1 (ja) | 2011-08-02 | 2015-03-05 | 日本発條株式会社 | プローブユニット |
-
2017
- 2017-02-01 JP JP2017539049A patent/JP6243584B1/ja active Active
- 2017-02-01 SG SG11201709953TA patent/SG11201709953TA/en unknown
- 2017-02-01 US US15/576,605 patent/US10274517B2/en active Active
- 2017-02-01 WO PCT/JP2017/003586 patent/WO2017141706A1/ja active Application Filing
- 2017-02-10 TW TW106104521A patent/TWI629484B/zh active
- 2017-11-29 PH PH12017502189A patent/PH12017502189A1/en unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4417206A (en) * | 1981-03-09 | 1983-11-22 | Virginia Panel Corporation | Electrical contact probe and method of manufacturing |
JPS5896259U (ja) * | 1981-12-22 | 1983-06-30 | 富士通株式会社 | 接触ピン |
JPS6179273U (ja) * | 1984-10-29 | 1986-05-27 | ||
JPH10214649A (ja) * | 1997-01-30 | 1998-08-11 | Yokowo Co Ltd | スプリングコネクタおよび該スプリングコネクタを用いた装置 |
JP2013130516A (ja) * | 2011-12-22 | 2013-07-04 | Yamaichi Electronics Co Ltd | コンタクトプローブ及びそれを備えた半導体素子用ソケット |
JP2014085207A (ja) * | 2012-10-23 | 2014-05-12 | Renesas Electronics Corp | 半導体装置テスト用プローブピン |
Also Published As
Publication number | Publication date |
---|---|
SG11201709953TA (en) | 2018-01-30 |
US20180238932A1 (en) | 2018-08-23 |
PH12017502189B1 (en) | 2018-06-11 |
JP6243584B1 (ja) | 2017-12-06 |
JPWO2017141706A1 (ja) | 2018-02-22 |
TWI629484B (zh) | 2018-07-11 |
US10274517B2 (en) | 2019-04-30 |
TW201802479A (zh) | 2018-01-16 |
PH12017502189A1 (en) | 2018-06-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5607934B2 (ja) | プローブユニット | |
US10649005B2 (en) | Contact terminal, inspection jig, and inspection device | |
US10877085B2 (en) | Inspection jig and inspection device | |
JPWO2012067126A1 (ja) | コンタクトプローブおよびプローブユニット | |
KR20100072076A (ko) | 프로브 카드 | |
JP6243584B1 (ja) | 検査用導電性接触子、および半導体検査装置 | |
JP2007218840A (ja) | プローブ、プローブカード及び検査装置 | |
JPWO2013018809A1 (ja) | プローブユニット | |
CN101275984B (zh) | 半导体检查装置 | |
JP7023276B2 (ja) | プローブ、プローブユニット、およびプローブユニットを備える半導体検査装置 | |
KR102195561B1 (ko) | 전기적 접속 장치 | |
KR20050083184A (ko) | 반도체 검사용 프로브 카드 | |
JP6873780B2 (ja) | 導電性接触子、導電性接触子ユニット、および導電性接触子ユニットを備える半導体検査装置 | |
WO2012067125A1 (ja) | プローブユニット | |
TWI737765B (zh) | 用於晶圓測試接觸件之堆疊立柱凸塊接觸及其相關方法 | |
JP2007067008A (ja) | 半導体検査のプローブ方法 | |
KR20050013435A (ko) | 원하는 분석 위치를 용이하게 찾을 수 있는 반도체 소자 | |
US20230043715A1 (en) | Probe, probe device, and inspection method | |
TWI435084B (zh) | 檢測針腳及應用其之檢測裝置 | |
US20240186194A1 (en) | Test element group for metal routing layer and manufacturing method thereof | |
JP2010091314A (ja) | 基板検査治具及び検査用プローブ | |
KR100911975B1 (ko) | 적층형 프로브 | |
KR101397257B1 (ko) | 인쇄회로기판 및 이의 검사 장치 | |
KR101074167B1 (ko) | 프로브 조립체 | |
TWI640781B (zh) | 檢測用接觸件及具有該接觸件的檢測夾具與檢測用接觸件的製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENP | Entry into the national phase |
Ref document number: 2017539049 Country of ref document: JP Kind code of ref document: A |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 17752969 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 15576605 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12017502189 Country of ref document: PH |
|
WWE | Wipo information: entry into national phase |
Ref document number: 11201709953T Country of ref document: SG |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 17752969 Country of ref document: EP Kind code of ref document: A1 |