WO2017131360A3 - 희토류 금속 산화물이 첨가된 led 패키지를 적용한 백라이트 유닛 - Google Patents

희토류 금속 산화물이 첨가된 led 패키지를 적용한 백라이트 유닛 Download PDF

Info

Publication number
WO2017131360A3
WO2017131360A3 PCT/KR2017/000291 KR2017000291W WO2017131360A3 WO 2017131360 A3 WO2017131360 A3 WO 2017131360A3 KR 2017000291 W KR2017000291 W KR 2017000291W WO 2017131360 A3 WO2017131360 A3 WO 2017131360A3
Authority
WO
WIPO (PCT)
Prior art keywords
led package
metal oxide
rare earth
earth metal
backlight unit
Prior art date
Application number
PCT/KR2017/000291
Other languages
English (en)
French (fr)
Other versions
WO2017131360A2 (ko
Inventor
류정곤
김영식
고다현
임서영
Original Assignee
주식회사 효성
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 효성 filed Critical 주식회사 효성
Publication of WO2017131360A2 publication Critical patent/WO2017131360A2/ko
Publication of WO2017131360A3 publication Critical patent/WO2017131360A3/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00—Compounds of rare earth metals
    • C01F17/20—Compounds containing only rare earth metals as the metal element
    • C01F17/206—Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00—Compounds of rare earth metals
    • C01F17/20—Compounds containing only rare earth metals as the metal element
    • C01F17/247—Carbonates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Power Engineering (AREA)
  • Geology (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)

Abstract

본 발명은 광 추출 효율이 향상된 LED 패키지의 봉지용 수지와 희토류 금속 산화물이 첨가된 LED 패키지, 이를 적용한 BLU를 제공하기 위한 것이다.
PCT/KR2017/000291 2016-01-29 2017-01-09 희토류 금속 산화물이 첨가된 led 패키지를 적용한 백라이트 유닛 WO2017131360A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2016-0011998 2016-01-29
KR20160011998 2016-01-29

Publications (2)

Publication Number Publication Date
WO2017131360A2 WO2017131360A2 (ko) 2017-08-03
WO2017131360A3 true WO2017131360A3 (ko) 2018-08-02

Family

ID=59398145

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2017/000291 WO2017131360A2 (ko) 2016-01-29 2017-01-09 희토류 금속 산화물이 첨가된 led 패키지를 적용한 백라이트 유닛

Country Status (2)

Country Link
TW (1) TW201739841A (ko)
WO (1) WO2017131360A2 (ko)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008053545A (ja) * 2006-08-25 2008-03-06 Nichia Chem Ind Ltd 発光装置およびその製造方法
KR20080058711A (ko) * 2006-12-22 2008-06-26 주식회사 루멘스 발광다이오드
KR20080077518A (ko) * 2007-02-20 2008-08-25 삼성전기주식회사 백색 발광 장치
JP2015005606A (ja) * 2013-06-20 2015-01-08 スタンレー電気株式会社 光電子デバイス
KR101571974B1 (ko) * 2014-06-12 2015-12-07 주식회사 효성 희토류 금속 산화물 입자를 포함하는 녹색 led 패키지

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008053545A (ja) * 2006-08-25 2008-03-06 Nichia Chem Ind Ltd 発光装置およびその製造方法
KR20080058711A (ko) * 2006-12-22 2008-06-26 주식회사 루멘스 발광다이오드
KR20080077518A (ko) * 2007-02-20 2008-08-25 삼성전기주식회사 백색 발광 장치
JP2015005606A (ja) * 2013-06-20 2015-01-08 スタンレー電気株式会社 光電子デバイス
KR101571974B1 (ko) * 2014-06-12 2015-12-07 주식회사 효성 희토류 금속 산화물 입자를 포함하는 녹색 led 패키지

Also Published As

Publication number Publication date
TW201739841A (zh) 2017-11-16
WO2017131360A2 (ko) 2017-08-03

Similar Documents

Publication Publication Date Title
AR115812A2 (es) Una cerveza sin alcohol o de bajo contenido alcohólico
EP3410508A4 (en) COMPOSITION, PHOSPHORESCENT COMPOUND, AND LIGHT EMITTING ELEMENT
EP3664172A4 (en) COMPOSITION FOR ORGANIC OPTOELECTRONIC DIODE, ORGANIC OPTOELECTRONIC DIODE AND DISPLAY DEVICE
WO2018097665A3 (ko) 코팅 조성물 및 유기 발광 소자
WO2016003202A3 (ko) 유기전기 소자용 화합물, 이를 이용한 유기전기소자 및 그 전자 장치
WO2016171406A3 (ko) 유기 발광 소자
EP3347924A4 (en) PHOSPHORK-CONVERTED WHITE LIGHT-EMITTING DEVICES AND PHOTOLUMINESCENCE COMPOUNDS FOR GENERAL ILLUMINATION AND BACKLIGHTING OF DISPLAYS
WO2014140130A3 (en) Daylight opening surround comprising a light transmitting element
WO2019020602A3 (en) LUMINOPHORE AND COMPOSITION
WO2016175533A3 (ko) 유기전기 소자용 화합물, 이를 이용한 유기전기소자 및 그 전자 장치
MX2015014349A (es) Dispositivo de emision de luz.
WO2013112691A3 (en) Light-emitting dies incorporating wavelength-conversion materials and related methods
EP3329513A4 (en) LIGHT EMITTING DIODE, DISPLAY SUBSTRATE AND DISPLAY DEVICE COMPRISING SAME, AND METHOD FOR MANUFACTURING THE SAME
EP3444841A4 (en) LIGHT EMITTING DEVICE, HOUSING FOR A LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE
GB2531432A (en) Multi-part valve assembly
WO2016024745A3 (ko) 화합물, 이를 포함하는 유기 광전자 소자 및 표시장치
WO2015156580A3 (ko) 유기 화합물 및 이를 포함하는 유기 전계 발광 소자
WO2016068633A3 (ko) 함질소 다환 화합물 및 이를 이용한 유기발광소자
WO2015190867A3 (ko) 유기전기 소자용 화합물, 이를 이용한 유기전기소자 및 그 전자 장치
EP2848410A3 (en) Liquid containing vessel
WO2016075150A3 (de) Optoelektronische vorrichtung, verwendung eines dualen emitters als wellenlängenkonversionsstoff
EP3467581A4 (en) LIGHT EMITTING ASSEMBLY FOR A BACKLIGHT MODULE, BACKLIGHT MODULE AND DISPLAY DEVICE
WO2016141547A8 (en) A polyorganosiloxane and a moisture and radiation curable adhesive composition comprising the same
WO2016195406A3 (ko) 헤테로고리 화합물 및 이를 포함하는 유기 발광 소자
WO2015108301A8 (ko) 축합환 화합물 및 이를 포함한 유기 발광 소자

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17744482

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17744482

Country of ref document: EP

Kind code of ref document: A2