WO2017131159A1 - セラミックス材料、静電チャック装置 - Google Patents
セラミックス材料、静電チャック装置 Download PDFInfo
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- WO2017131159A1 WO2017131159A1 PCT/JP2017/002934 JP2017002934W WO2017131159A1 WO 2017131159 A1 WO2017131159 A1 WO 2017131159A1 JP 2017002934 W JP2017002934 W JP 2017002934W WO 2017131159 A1 WO2017131159 A1 WO 2017131159A1
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- sintered body
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Definitions
- the present invention relates to a ceramic material and an electrostatic chuck device.
- This application claims priority based on Japanese Patent Application No. 2016-013843 filed in Japan on January 27, 2016 and Japanese Patent Application No. 2016-0665345 filed on Japan on March 29, 2016. , The contents of which are incorporated herein.
- An electrostatic chuck device that can easily attach and fix a plate-like sample (wafer) to a sample stage and can maintain the wafer at a desired temperature.
- An electrostatic chuck device includes an electrostatic chucking electrode that generates an electrostatic force (Coulomb force) between a base body on which a main surface is placed on a wafer and a wafer placed on the placement surface.
- Coulomb force electrostatic force
- Patent Document 2 proposes a material having a dielectric breakdown strength exceeding 100 kV / mm.
- Al 2 O 3 —SiC which is a ceramic composite sintered body, is known as a material for forming a substrate of an electrostatic chuck device.
- semiconductor technology has been miniaturized and 3D has been advanced, and the use conditions of the semiconductor manufacturing device and the electrostatic chuck device used in the semiconductor manufacturing device become severe. Accordingly, the electrostatic chuck device is required to have higher durability. Therefore, high withstand voltage has been demanded for ceramic materials used in electrostatic chuck devices.
- SiC has a large number of crystal structures, such as a cubic system having a 3C type (zincblende type) crystal structure, a hexagonal system such as 4H type and 6H type, and a wurtzite type. Those having a crystal structure and those having a rhombohedral crystal system and a 15R type crystal structure are mentioned. Among these, those having a 3C type crystal structure are referred to as “ ⁇ -SiC”.
- the inventor examined the substrate that was damaged when the electrostatic chuck device was used. As a result, many of the substrates were damaged starting from ⁇ -SiC crystal grains contained in Al 2 O 3 —SiC constituting the substrate. I understood.
- the ceramic material according to the first embodiment of the present invention is a composite sintered body (ceramic material) of insulating ceramics and silicon carbide, and the crystal grains of the silicon carbide include the insulating material. Crystal grains having a ⁇ -SiC type crystal structure with respect to the entire crystal grains of the silicon carbide, dispersed in the crystal grain boundaries and crystal grains of the main phase formed by sintering the crystalline ceramic grains More than 60% by volume, and the composite sintered body includes pores present at grain boundaries, and the composite sintered body with respect to a virtual true density when the composite sintered body does not include the pores.
- a composite sintered body (ceramic material) for an electrostatic chuck having an apparent density ratio of 97% or more is provided.
- the crystallite diameter determined from the X-ray diffraction result of the silicon carbide crystal grains may be 50 nm or more.
- the crystal grains having the ⁇ -SiC type crystal structure may include a sintered portion.
- the insulating ceramic may be aluminum oxide.
- One embodiment of the present invention is a composite sintered body of aluminum oxide and silicon carbide, and the crystal grains of the silicon carbide include crystal grain boundaries and crystal grains of a main phase formed by sintering the aluminum oxide crystal grains.
- a composite sintered body for an electrostatic chuck in which the ratio (I2 / I3) of the peak (I3) seen at around 8 degrees is 0.01 or less.
- a base body on which the composite sintered body for an electrostatic chuck is used as a forming material, and a main surface is a mounting surface on which a plate-like sample is mounted,
- an electrostatic chuck device comprising an electrostatic chucking electrode provided on the opposite side or inside the substrate.
- the inventor as a ceramic material used for the electrostatic chuck device, has a suitable insulating property that can be used as the electrostatic chuck device and can gradually release charges accumulated by the plasma. It was considered that the durability of the electrostatic chuck device can be improved by using it.
- the ceramic material of the second embodiment of the present invention is A ceramic material satisfying the following (i) and (ii) is provided.
- (I) According to a short-time test specified in JIS C2110-2, a test piece of the ceramic material having a thickness of 0.3 mm was sandwiched between electrodes having the same diameter of 20 mm and measured at a voltage increase rate of 1000 V / second. When the current value flowing through the test piece exceeds 1 ⁇ A, the voltage value is 10 kV / mm or more.
- the current value flowing through the test piece is 0.1 seconds. When measured every time, the current value corresponding to the voltage value 0.1 seconds before the current value is 5 ⁇ A or more with respect to the time when the current value increased over 10 ⁇ A per 0.1 second.
- the structure may be a sintered body.
- a composite sintered body of insulating ceramics and silicon carbide may be used.
- the insulating ceramic may be aluminum oxide.
- the content of metal impurities other than aluminum and silicon may be 1000 ppm or less.
- One embodiment of the present invention is the above ceramic material as a forming material, wherein one main surface is a mounting surface on which a plate-like sample is mounted, and the opposite side of the above-mentioned mounting surface in the substrate, or There is provided an electrostatic chuck device comprising an electrostatic chucking electrode provided inside the substrate.
- the electrostatic chuck apparatus using such a composite sintered body for electrostatic chucks can be provided.
- the second embodiment of the present invention it is possible to provide a ceramic material that is suitably used for an electrostatic chuck device and has excellent durability.
- an electrostatic chuck device using such a ceramic material can be provided.
- Sectional drawing which shows the electrostatic chuck apparatus of this embodiment is a graph showing measurement results of Example 1.
- 6 is a graph showing measurement results of Example 2.
- the graph which shows the measurement result of the comparative example 2. 2 is a SIM image of the composite sintered body of Example 1.
- the ceramic material of the first embodiment of the present invention is a composite sintered body of insulating ceramics and silicon carbide, and the silicon carbide crystal grains are obtained by sintering the insulating ceramic crystal grains. More than 60% by volume of the crystal grains having a ⁇ -SiC type crystal structure are dispersed in one or both of the crystal grain boundaries of the phases and in the crystal grains.
- the composite sintered body includes many pores existing in crystal grain boundaries, and the ratio of the apparent density of the composite sintered body to the virtual true density when the composite sintered body does not include the pores. Is 97% or more.
- the ceramic material of the second embodiment of the present invention satisfies the following (i) and (ii).
- “according to the short time test specified in JIS C2110-2” means that an electrode having the same diameter of 20 mm is used instead of the electrode having a diameter of 25 mm specified in the above standard. Other conditions mean that the above standard is followed.
- Such a ceramic material is suitably used mainly as a material for forming an electrostatic chuck device. Therefore, in the following description, first, each configuration of the electrostatic chuck device according to one embodiment of the present invention to which the ceramic material according to the first and second embodiments of the present invention is applied is described, and then each of the embodiments is described. The ceramic material will be described.
- Ceramic current means that when the value of current flowing through a test piece of ceramic material is measured every 0.1 second, the current value increases by more than 10 ⁇ A per 0.1 second, compared to 0. It refers to the current corresponding to the voltage value one second ago.
- the increase in the current value does not exceed 10 ⁇ A from t1 to t2, and the current from t2 to t3.
- the increment of the value exceeds 10 ⁇ A, it is as follows. That is, the “time when the current value increased over 10 ⁇ A per 0.1 second” is t3, and the “critical current” is the current value corresponding to the voltage value 0.1 second before t3, that is, the current at t2. It is.
- the critical current value is a current value at t2.
- Stand voltage refers to the voltage value when the value of the current flowing through the test piece of ceramic material exceeds 1 ⁇ A.
- regulated about the ceramic material of this embodiment can also be expressed as follows.
- (I) When a test piece of a ceramic material having a thickness of 0.3 mm is sandwiched between electrodes having the same diameter of 20 mm and measured at a voltage increase rate of 1000 V / sec in accordance with a short-time test specified in JIS C2110-2. The withstand voltage of the ceramic material test piece is 10 kV / mm or more.
- the critical current value of the ceramic material test piece is 5 ⁇ A or more.
- “Insulation breakdown” refers to irreversible deterioration of insulation of ceramic materials.
- the test piece releases the charge so that the insulation of the test piece is restored to the state before the test. In this case, it is determined that the dielectric breakdown has not occurred because it does not indicate “irreversible deterioration in insulation”.
- the test piece releases the charge and the insulation of the test piece recovers, but does not recover to the state before the test, the insulation between the state before the test and the state after the charge discharge is performed. It is determined that dielectric breakdown has occurred by the difference in sex.
- “Insulation failure” means that the electrostatic chuck device using the ceramic material of this embodiment as a forming material cannot be used as an electrostatic chuck device as a result of the progress of dielectric breakdown of a member using the ceramic material as a forming material. It refers to the state.
- Discharge of ceramic material refers to discharge generated in space from ceramic material. Discharge that is considered to occur between crystal grains in the ceramic material due to dielectric breakdown in the ceramic material is not included in the discharge of the ceramic material.
- FIG. 1 is a cross-sectional view showing the electrostatic chuck device of this embodiment.
- the electrostatic chuck device 1 according to the present embodiment includes a disc-shaped electrostatic chuck portion 2 having a principal surface (upper surface) side as a mounting surface, and a static electricity provided below the electrostatic chuck portion 2. And a temperature-adjusting base portion 3 having a disk shape with a thickness in a plan view for adjusting the electric chuck portion 2 to a desired temperature.
- the electrostatic chuck portion 2 and the temperature adjusting base portion 3 are bonded to each other via an adhesive layer 8 provided between the electrostatic chuck portion 2 and the temperature adjusting base portion 3.
- an adhesive layer 8 provided between the electrostatic chuck portion 2 and the temperature adjusting base portion 3.
- the electrostatic chuck unit 2 has a mounting plate 11 whose top surface is a mounting surface 11 a on which a plate-like sample W such as a semiconductor wafer is mounted, and a bottom side of the mounting plate 11 that is integrated with the mounting plate 11.
- a support plate 12 that supports the electrode, an electrostatic chucking electrode 13 provided between the mounting plate 11 and the support plate 12, and an insulating material layer 14 that insulates the periphery of the electrostatic chucking electrode 13. is doing.
- the mounting plate 11 and the support plate 12 correspond to the “base” in the present invention.
- the mounting plate 11 and the support plate 12 are disk-shaped members having the same shape of the superimposed surfaces.
- the mounting plate 11 and the support plate 12 are made of a ceramic sintered body having mechanical strength and durability against a corrosive gas and its plasma. The mounting plate 11 and the support plate 12 will be described in detail later.
- a plurality of protrusions 11 b having a diameter smaller than the thickness of the plate sample are formed at predetermined intervals, and these protrusions 11 b support the plate sample W.
- the total thickness including the mounting plate 11, the support plate 12, the electrostatic chucking electrode 13 and the insulating material layer 14, that is, the thickness of the electrostatic chuck portion 2 is, for example, 0.7 mm or more and 5.0 mm or less. is there.
- the thickness of the electrostatic chuck portion 2 is less than 0.7 mm, it is difficult to ensure the mechanical strength of the electrostatic chuck portion 2. If the thickness of the electrostatic chuck part 2 exceeds 5.0 mm, the heat capacity of the electrostatic chuck part 2 increases, the thermal response of the plate-like sample W to be placed deteriorates, and the lateral direction of the electrostatic chuck part Due to the increase in heat transfer, it becomes difficult to maintain the in-plane temperature of the plate-like sample W in a desired temperature pattern.
- the thickness of each part demonstrated here is an example, Comprising: It does not restrict to the said range.
- the electrostatic adsorption electrode 13 is used as an electrostatic chuck electrode for generating electric charges and fixing the plate-like sample W with an electrostatic adsorption force.
- the shape and size of the electrode 13 are appropriately selected depending on the application. Adjusted.
- the electrode 13 for electrostatic adsorption includes an aluminum oxide-tantalum carbide (Al 2 O 3 —Ta 4 C 5 ) conductive composite sintered body, an aluminum oxide-tungsten (Al 2 O 3 —W) conductive composite sintered body, Aluminum oxide-silicon carbide (Al 2 O 3 -SiC) conductive composite sintered body, aluminum nitride-tungsten (AlN-W) conductive composite sintered body, aluminum nitride-tantalum (AlN-Ta) conductive composite sintered body Body, conductive ceramics such as yttrium oxide-molybdenum (Y 2 O 3 -Mo) conductive composite sintered body, or refractory metals such as tungsten (W), tantalum (Ta), molybdenum (Mo), etc. It is preferable.
- the thickness of the electrode 13 for electrostatic attraction is not particularly limited. For example, a thickness of 0.1 ⁇ m or more and 100 ⁇ m or less can be selected, and a thickness of 5 ⁇ m or more and 20 ⁇ m or less is more preferable.
- the thickness of the electrostatic attraction electrode 13 is less than 0.1 ⁇ m, it is difficult to ensure sufficient conductivity.
- the thickness of the electrostatic chucking electrode 13 exceeds 100 ⁇ m, the electrostatic chucking electrode 13 and the mounting plate are placed due to the difference in thermal expansion coefficient between the electrostatic chucking electrode 13 and the mounting plate 11 and the support plate 12. Cracks are likely to enter the joint interface between the plate 11 and the support plate 12.
- the electrostatic chucking electrode 13 having such a thickness can be easily formed by a film forming method such as a sputtering method or a vapor deposition method, or a coating method such as a screen printing method.
- the insulating material layer 14 surrounds the electrostatic attraction electrode 13 to protect the electrostatic attraction electrode 13 from corrosive gas and plasma thereof, and at the boundary between the mounting plate 11 and the support plate 12, that is, electrostatic
- the outer peripheral area other than the adsorption electrode 13 is joined and integrated, and is composed of the same composition or the main component of the same material as that of the mounting plate 11 and the support plate 12 and the same insulating material.
- the temperature adjusting base portion 3 is for adjusting the electrostatic chuck portion 2 to a desired temperature, and has a thick disk shape.
- a liquid-cooled base in which a flow path 3A for circulating a refrigerant is formed is suitable.
- the material constituting the temperature adjusting base 3 is not particularly limited as long as it is a metal excellent in thermal conductivity, conductivity, and workability, or a composite material containing these metals.
- a metal excellent in thermal conductivity, conductivity, and workability or a composite material containing these metals.
- aluminum (Al), aluminum alloy, copper (Cu), copper alloy, stainless steel (SUS) and the like are preferably used. It is preferable that at least the surface of the temperature control base 3 exposed to plasma is anodized or an insulating film such as aluminum oxide (Al 2 O 3 , alumina) is formed.
- aluminum oxide is indicated as “Al 2 O 3 ”.
- the adhesive layer 6 is made of a sheet-like or film-like adhesive resin having heat resistance and insulating properties such as polyimide resin, silicon resin, and epoxy resin.
- the adhesive layer is formed with a thickness of about 5 to 100 ⁇ m, for example.
- the insulating plate 7 is made of a thin plate, sheet or film of a heat-resistant resin such as polyimide resin, epoxy resin, acrylic resin.
- the insulating plate 7 may be an insulating ceramic plate instead of the resin sheet, or may be a sprayed film having an insulating property such as Al 2 O 3 .
- the focus ring 10 is an annular member in plan view that is placed on the peripheral edge of the temperature adjusting base 3.
- the focus ring 10 is made of, for example, a material having electrical conductivity equivalent to that of a wafer placed on the placement surface.
- the electrostatic chucking electrode 13 is connected to a power feeding terminal 15 for applying a DC voltage to the electrostatic chucking electrode 13.
- the power feeding terminal 15 is inserted into a through hole 16 that penetrates the temperature adjusting base 3, the adhesive layer 8, and the support plate 12 in the thickness direction.
- An insulator 15a having an insulating property is provided on the outer peripheral side of the power supply terminal 15, and the power supply terminal 15 is insulated from the metal temperature adjusting base 3 by the insulator 15a.
- the power supply terminal 15 is shown as an integral member, but a plurality of members may be electrically connected to form the power supply terminal 15. Since the power supply terminal 15 is inserted into the temperature adjustment base 3 and the support plate 12 having different thermal expansion coefficients, for example, for the portions inserted into the temperature adjustment base 3 and the support plate 12, respectively. It is good to comprise with a different material.
- the material of the portion (extraction electrode) connected to the electrostatic adsorption electrode 13 and inserted into the support plate 12 is particularly limited as long as it is a conductive material having excellent heat resistance. Although it is not a thing, what the thermal expansion coefficient approximated to the thermal expansion coefficient of the electrode 13 for electrostatic attraction and the support plate 12 is preferable. For example, it is made of a conductive ceramic material such as Al 2 O 3 —TaC.
- the portion of the power supply terminal 15 inserted into the temperature adjusting base 3 is made of a metal material such as tungsten (W), tantalum (Ta), molybdenum (Mo), niobium (Nb), or Kovar alloy. Obviously, a metal material such as tungsten (W), tantalum (Ta), molybdenum (Mo), niobium (Nb), or Kovar alloy. Obviously, a metal material such as tungsten (W), tantalum (Ta), molybdenum (Mo), niobium (Nb), or Kovar alloy. Become.
- These two members may be connected with a silicon-based conductive adhesive having flexibility and electric resistance.
- a heater element 5 is provided on the lower surface side of the electrostatic chuck portion 2.
- the heater element 5 has a thickness of 0.2 mm or less, preferably a nonmagnetic metal thin plate having a constant thickness of about 0.1 mm, for example, a titanium (Ti) thin plate, a tungsten (W) thin plate, a molybdenum (Mo) thin plate.
- Ti titanium
- W tungsten
- Mo molybdenum
- Such a heater element 5 may be provided by bonding a non-magnetic metal thin plate to the electrostatic chuck portion 2 and then processing and molding on the surface of the electrostatic chuck portion 2, and a position different from that of the electrostatic chuck portion 2.
- the heater element 5 may be formed by transfer printing on the surface of the electrostatic chuck portion 2.
- the heater element 5 is adhered and fixed to the bottom surface of the support plate 12 by an adhesive layer 4 made of a sheet-like or film-like silicon resin or acrylic resin having uniform heat resistance and insulation properties.
- the heater element 5 is connected to a power supply terminal 17 for supplying power to the heater element 5.
- the material constituting the power feeding terminal 17 can be the same material as the material constituting the previous power feeding terminal 15.
- the power supply terminals 17 are provided so as to penetrate through the through holes 3 b formed in the temperature adjusting base portion 3.
- a temperature sensor 20 is provided on the lower surface side of the heater element 5.
- the installation hole 21 is formed so as to penetrate the temperature adjusting base portion 3 and the insulating plate 7 in the thickness direction, and the temperature sensor 20 is provided on the uppermost portion of the installation hole 21. is set up. Since it is desirable that the temperature sensor 20 be installed as close to the heater element 5 as possible, the installation hole 21 is formed so as to protrude further toward the adhesive layer 8 from the structure shown in FIG. And the heater element 5 may be brought close to each other.
- the temperature sensor 20 is, for example, a fluorescent light emitting type temperature sensor in which a phosphor layer is formed on the upper surface side of a rectangular parallelepiped transparent body made of quartz glass or the like, and this temperature sensor 20 has translucency and heat resistance. It is bonded to the lower surface of the heater element 5 with a silicon resin adhesive or the like.
- the phosphor layer is made of a material that generates fluorescence in response to heat input from the heater element 5.
- a material for forming the phosphor layer a wide variety of fluorescent materials can be selected as long as the material generates fluorescence in response to heat generation.
- the material for forming the phosphor layer include a fluorescent material to which a rare earth element having an energy order suitable for light emission is added, a semiconductor material such as AlGaAs, a metal oxide such as magnesium oxide, and a mineral such as ruby and sapphire. These materials can be appropriately selected and used.
- the temperature sensor 20 corresponding to the heater element 5 is provided at an arbitrary position in the circumferential direction of the lower surface of the heater element 5 at a position where it does not interfere with the power supply terminal.
- the temperature measuring unit 22 that measures the temperature of the heater element 5 from the fluorescence of these temperature sensors 20 has excitation light for the phosphor layer on the outer side (lower side) of the installation hole 21 of the temperature adjusting base unit 3.
- Excitation unit 23 for irradiating, a fluorescence detector 24 for detecting fluorescence emitted from the phosphor layer, and a control unit for controlling excitation unit 23 and fluorescence detector 24 and calculating the temperature of the main heater based on the fluorescence 25.
- the electrostatic chuck device 1 has a pin insertion hole 28 provided so as to penetrate the temperature adjusting base portion 3 to the mounting plate 11 in the thickness direction thereof.
- the pin insertion hole 28 is inserted with a lift pin for removing the plate-like sample.
- a cylindrical insulator 29 is provided on the inner periphery of the pin insertion hole 28.
- the electrostatic chuck device 1 has a gas hole (not shown) provided so as to penetrate the temperature adjusting base 3 to the mounting plate 11 in the thickness direction thereof.
- the gas hole can adopt the same configuration as that of the pin insertion hole 28, for example.
- a cooling gas for cooling the plate-like sample W is supplied to the gas holes.
- the cooling gas is supplied to the grooves 19 formed between the plurality of protrusions 11 b on the upper surface of the mounting plate 11 through the gas holes, and cools the plate-like sample W.
- the electrostatic chuck device 1 is configured as described above.
- the mounting plate 11 and the support plate 12 of this embodiment are made of a composite sintered body of insulating ceramics and silicon carbide (SiC) as a forming material.
- the material for forming the mounting plate 11 and the support plate 12 is a composite sintered body for electrostatic chuck according to the present invention (hereinafter referred to as a composite sintered body or simply a ceramic material).
- silicon carbide is indicated as “SiC”.
- Examples of the insulating ceramic contained in the composite sintered body according to the first embodiment of the present invention include Al 2 O 3 , yttrium oxide (Y 2 O 3 ), aluminum nitride (AlN), and silicon nitride (Si 3 N 4 ).
- a double oxide which is an oxide containing two or more kinds of metal ions may be used.
- Examples of such a double oxide include yttrium, aluminum, and garnet (YAG: 3Y 2 O 3 .5Al 2 O 3 ).
- Al 2 O 3 is particularly suitable for the composite sintered body of the present embodiment because it is inexpensive, excellent in heat resistance and corrosion resistance, and the mechanical properties of the composite sintered body are also good.
- yttrium oxide (Y 2 O 3 ) can also be used when it is desired to use insulating ceramics having a small aluminum content. Further, when it is desired to further improve the corrosion resistance as compared with Al 2 O 3 , Y 2 O 3 , yttrium aluminum garnet (YAG: 3Y 2 O 3 .5Al 2 O 3 ) or the like can also be used.
- SiC contained in the composite sintered body includes crystal grains having an ⁇ -SiC type crystal structure (hereinafter referred to as ⁇ -SiC grains) and crystal grains having a ⁇ -SiC type crystal structure (hereinafter referred to as ⁇ -SiC grains). And have.
- ⁇ -SiC grains crystal grains having an ⁇ -SiC type crystal structure
- ⁇ -SiC grains crystal grains having a ⁇ -SiC type crystal structure
- SiC crystal grains are present in the crystal grain boundaries and in the crystal grains of the main phase formed by sintering Al 2 O 3 crystal grains, which are insulating ceramics. Is distributed.
- the SiC content in the composite sintered body is preferably 4% by volume to 23% by volume, more preferably 5% by volume to 20% by volume, and more preferably 6% by volume to 12% by volume. More preferably, it is% or less.
- the reason why the SiC content is within the above range is that when the SiC content is less than 4% by volume, the amount of SiC is too small relative to the insulating ceramics, and the electrostatic capacitance due to the addition of SiC. This is because it is difficult to obtain the effect of improving adsorption / desorption characteristics and thermal conductivity when used as a chuck. On the other hand, when the content of the conductive particles exceeds 23% by mass, the amount of the conductive particles is too much with respect to the insulating material, and it is difficult to obtain a withstand voltage characteristic necessary for use as an electrostatic chuck. Because.
- the average particle size of the insulating ceramic in the composite sintered body is preferably 2 ⁇ m or less.
- the average particle diameter of the Al 2 O 3 particles exceeds 2 ⁇ m, when the substrate of the electrostatic chuck device is produced using this composite sintered body, the upper surface of the substrate on which the plate-like sample is placed is It becomes easy to be etched by plasma. Therefore, sputter marks are formed on the upper surface of the base material, which may cause contamination of an adsorbed object such as a silicon wafer.
- the SiC particles in the composite sintered body preferably contain 0.001% by volume or more of fine SiC particles of 0.04 ⁇ m or less, and more preferably contain 1% by volume or more with respect to the entire composite sintered body. .
- an average interval at which SiC particles of 0.04 ⁇ m or less are present is 1.5 ⁇ m or less. Therefore, when the average particle diameter of the insulating ceramic particles is 2 ⁇ m or less, one or more SiC particles of 0.04 ⁇ m or less exist for one insulating ceramic particle.
- the composite sintered body contains fine SiC particles, when the composite sintered body is used as a constituent member of an electrostatic chuck device, electrical characteristics such as adsorption characteristics and dielectric characteristics can be obtained. The effect to improve is acquired.
- the SiC particles in the composite sintered body preferably have a particle diameter D10 having a cumulative volume percentage of 10% by volume in the volume particle size distribution of the SiC particles of 0.2 ⁇ m or less.
- the particle diameter is calculated with the same set of sintered crystal grains.
- the particle diameter D90 having a cumulative volume percentage of 90% by volume in the volume particle size distribution of the SiC particles is preferably 2 ⁇ m or less.
- the ratio of D10 to D90 (D90 / D10) is preferably 3.0 or more.
- the ratio of D50 to D90 (D90 / D50) is preferably 1.4 or more.
- the dielectric breakdown of the electrostatic chuck device using the composite sintered body as a constituent material can be gently advanced. Therefore, before or during use of the electrostatic chuck apparatus using the composite sintered body as a constituent material, the insulation is gently broken by measuring the current or electric resistance flowing through the constituent member. This can be detected, and a sign of dielectric breakdown can be detected. Therefore, it can be set as the composite sintered compact which can estimate dielectric breakdown in advance.
- the content of metal impurities in the composite sintered body is preferably 1000 ppm or less, and more preferably 100 ppm or less.
- each metal impurity rate of SiC and insulating ceramics contained in a composite sintered compact shall be 1000 ppm or less, and it is more preferable to set it as 100 ppm or less.
- the metal impurity is 1000 ppm or less because the possibility of contaminating the semiconductor wafer is reduced and the temperature dependency of the electric resistance of the electrostatic chuck is reduced.
- the withstand voltage of the composite sintered body is preferably 5 kV / mm or more, more preferably 8 kV / mm or more, and further preferably 10 kV / mm or more.
- the composite sintered body having a withstand voltage of 5 kV / mm or more is used as a constituent member of a Coulomb force type electrostatic chuck device, it can be used without dielectric breakdown when a voltage is applied.
- the composite sintered body constituting the substrate of the present embodiment contains more than 60 volume% of ⁇ -SiC grains with respect to the whole SiC crystal grains. That is, the content of ⁇ -SiC grains is less than 40% by volume with respect to the entire SiC crystal grains.
- the content of ⁇ -SiC grains with respect to the entire SiC crystal grains is preferably 80% by volume or more, more preferably 90% by volume or more, and still more preferably 95% by volume or more. That is, the content of ⁇ -SiC grains is preferably 20% by volume or less, more preferably 10% by volume or less, and still more preferably 5% by volume or less with respect to the entire SiC crystal grains. .
- ⁇ -SiC When comparing ⁇ -SiC and ⁇ -SiC, ⁇ -SiC is more thermodynamically stable. Therefore, it is known that ⁇ -SiC undergoes phase transition to ⁇ -SiC due to various factors.
- phase transition from ⁇ -SiC to ⁇ -SiC occurs at about 1750 ° C or higher.
- Conventionally known Al 2 O 3 —SiC is a cause of low durability because ⁇ -SiC is phase-transformed into ⁇ -SiC during sintering as a result of sintering at high temperature to densify the sintered body. A lot of ⁇ -SiC.
- the phase transition from ⁇ -SiC to ⁇ -SiC is suppressed by manufacturing by the manufacturing method described later, and the ratio of ⁇ -SiC is set to 60.
- the volume is controlled to be more than% by volume. Thereby, it can be set as the composite sintered compact for electrostatic chucks with high durability when used in a plasma processing apparatus as an electrostatic chuck.
- ⁇ -SiC when the composite sintered body contains a large amount of ⁇ -SiC, ⁇ -SiC has a lower electrical conductivity than ⁇ -SiC, so that local heat generation when a minute current flows in the sintered body is increased, resulting in insulation. It may be easy to destroy. Further, when the composite sintered body contains a large amount of ⁇ -SiC, the electric charge tends to accumulate in the composite sintered body due to the plasma irradiation, and it becomes easy to discharge. As a result, it is conceivable that the battery breaks with discharge.
- ⁇ -SiC has higher conductivity than ⁇ -SiC. Therefore, by controlling the ratio of ⁇ -SiC to be more than 60% by volume, it is possible to add SiC to the composite sintered body. The effect of improving electrical characteristics such as adsorption / desorption characteristics and dielectric constant is enhanced. By improving the adsorption / desorption characteristics, it is considered that there is an effect of improving durability because it is used as an electrostatic chuck and wear between the wafer and the substrate when the wafer is detached is reduced.
- the proportion of 4H form ⁇ -SiC contained in the entire SiC is preferably 30% by volume or less, more preferably 20% by volume or less, and more preferably 10% by volume.
- the following is preferable. This is because 4H-type SiC becomes a P-type semiconductor due to the presence of Al or the like, and the conductivity of SiC is further reduced.
- the proportion of 6H-type ⁇ -SiC contained in the entire SiC is preferably 20% by volume or less, more preferably 10% by volume or less, and more preferably 5% by volume.
- 6H-type SiC is less conductive than ⁇ -SiC.
- the 6H-type SiC crystal grains have a larger aspect ratio than the 4H-type SiC crystal grains, it is easy to form a conductive path. Therefore, when 6H-type SiC is present, the electrical characteristics and resistance of the composite sintered body are reduced by the amount of conductive path formed by 6H-type SiC, which has lower conductivity than when only 4H-type SiC is present. Plasma properties are reduced.
- the analysis of the SiC crystal form ( ⁇ -SiC, ⁇ -SiC) in the composite sintered body is performed by measuring the powder X-ray diffraction intensity and using the method of Ruska (J. Mater. Sci., 14, 2013-2017 (1979))).
- X x / (x + y + z)
- Y y / (x + y + z)
- Z z / (x + y + z)
- I1 / I3 is preferably 0.02 or less, and 4H type ⁇ -SiC contained in the whole SiC.
- I1 / I3 is preferably made 0.01 or less.
- the I3 peak in the X-ray diffraction pattern is a peak that appears in common in ⁇ -SiC and ⁇ -SiC in the case of SiC. Therefore, it can be said that the I3 peak corresponds to the total amount of SiC.
- the I1 peak in the X-ray diffraction pattern is a peak observed in 4H type SiC. Therefore, the I1 peak can be said to be a peak corresponding to the amount of 4H-type SiC among ⁇ -SiC.
- the composite sintered body includes pores existing in the grain boundaries, and the ratio of the apparent density of the composite sintered body to the virtual true density when the composite sintered body does not include pores is 97% or more. Is preferably densified, more preferably 98% or more. In the composite sintered body, as the raw material powder is sintered, the amount of pores is reduced and the apparent density approaches 100%. This is because it is preferable that the ratio is 97% or more because corrosion resistance to plasma (plasma resistance) is improved.
- the crystallite diameter determined from the X-ray diffraction result of the SiC crystal grains is preferably 50 nm or more. Further, the crystallite diameter of SiC is preferably 200 nm or less, and more preferably 100 nm or less.
- the crystallite diameter obtained from the X-ray diffraction result is obtained as an average crystal grain size contained in the composite sintered body.
- the crystallite diameter of SiC is such a value, pores and defects between SiC particles gathered at the grain boundaries can be reduced, so that the density can be increased.
- the crystallite diameter of SiC is such a value, it is possible to improve the durability of the composite sintered body to plasma, the characteristics of particle detachment, the generation of particles, and the like.
- the composite sintered body constituting the substrate of the present embodiment preferably includes a portion where ⁇ -SiC particles are sintered.
- the composite sintered body having such a portion shows that ⁇ -SiC grains were sintered without causing a phase transition from ⁇ -SiC to ⁇ -SiC during sintering.
- ⁇ -SiC particles By sintering ⁇ -SiC particles, SiC particles that are not dispersed into a single particle but remain aggregated and SiC segregated during the sintering process exist between adjacent SiC particles. Can reduce pores and defects. Therefore, the density of the composite sintered body can be increased. Further, by sintering the ⁇ -SiC particles, the durability of the composite sintered body against plasma can be enhanced. Also, by sintering the ⁇ -SiC grains, it is possible to suppress the detachment of particles and the generation of particles.
- SiC sintered at the grain boundaries of the insulating particles in the sintering process has a shape that matches the grain boundaries of the insulating particles in the sintering process, so that the density can be increased. In addition, defects at the boundary between the insulating particles and the SiC particles can be reduced.
- the electrical resistance between the SiC particles is lower than when the SiC particles are in contact with each other without being sintered. Therefore, the electrical characteristics of the composite sintered body can be improved.
- the ceramic material (composite sintered body for electrostatic chuck) of the second embodiment of the present invention will be described in detail.
- the base material of the electrostatic chuck device of the present embodiment is made of a ceramic material that satisfies the following (i) and (ii).
- (I) According to a short-time test specified in JIS C2110-2, a test piece of the ceramic material having a thickness of 0.3 mm was sandwiched between electrodes having the same diameter of 20 mm and measured at a voltage increase rate of 1000 V / second. When the current value flowing through the test piece exceeds 1 ⁇ A, the voltage value is 10 kV / mm or more.
- the current value flowing through the test piece is 0.1 seconds.
- the current value corresponding to the voltage value 0.1 seconds before the current value is 5 ⁇ A or more with respect to the time when the current value increased over 10 ⁇ A per 0.1 second.
- the ceramic material of the present embodiment satisfies the requirement (ii)
- the ceramic material is charged to the ceramic material without discharging in the electrostatic chuck device using the ceramic material of the present embodiment as a forming material. Charge can be released. Therefore, it is possible to extend the period until insulation failure occurs.
- the withstand voltage of the test piece according to the above (i) is more preferably 20 kV / mm or more.
- the electrostatic chuck has sufficient durability at a voltage for attracting the sample.
- the withstand voltage of the test piece according to the above (i) is preferably 80 kV / mm or less, and more preferably 60 kV / mm or less.
- the withstand voltage is 80 kV / mm or less, when electric charges are accumulated in the ceramic material used in the electrostatic chuck device by being exposed to plasma, the potential of the ceramic material is difficult to increase and electric discharge is difficult to occur.
- the critical current value of the test piece according to (ii) is more preferably 10 ⁇ A or more, and further preferably 30 ⁇ A or more. By increasing the critical current value, durability when used as an electrostatic chuck can be further increased.
- the ceramic material of the present embodiment preferably has a characteristic that the current continuously increases until the current value exceeds 50 ⁇ A when the withstand voltage test of the test piece according to (i) is performed, and the current value is 100 ⁇ A. More preferably, the current continuously increases until the value exceeds.
- the reliability of the ceramic material can be further increased by widening the range of the current value in which the current continuously increases.
- a ceramic sintered body may be processed into a flat plate shape and satisfy the above characteristics (i) and (ii). After forming an electrode, you may use what was formed by thermal spray coating. Among them, a method using a sintered body is preferable because defects such as pores can be reduced and quality stability such as electrical characteristics and strength can be improved.
- the ceramic material only insulating ceramics may be used, and a material that satisfies the above characteristics (i) and (ii) by adding a conductivity imparting material that reacts with Al 2 O 3 such as TiO 2 to form a compound;
- the electrical characteristics may be adjusted as follows.
- the ceramic material is preferably a composite of insulating ceramics and conductive particles.
- Insulating ceramics include Al 2 O 3 , yttrium oxide (Y 2 O 3 ), aluminum nitride (AlN), silicon nitride (Si 3 N 4 ), mullite (3Al 2 O 3 .2SiO 2 ), magnesium oxide (MgO).
- a double oxide which is an oxide containing two or more kinds of metal ions may be used.
- Examples of such a double oxide include yttrium, aluminum, and garnet (YAG: 3Y 2 O 3 .5Al 2 O 3 ).
- Al 2 O 3 is particularly suitable for the composite sintered body of the present embodiment because it is inexpensive, excellent in heat resistance and corrosion resistance, and the mechanical properties of the composite sintered body are also good.
- yttrium oxide (Y 2 O 3 ) can also be used when it is desired to use insulating ceramics having a small aluminum content. Further, when it is desired to further improve the corrosion resistance as compared with Al 2 O 3 , Y 2 O 3 , yttrium aluminum garnet (YAG: 3Y 2 O 3 .5Al 2 O 3 ) or the like can also be used.
- the conductive particles include conductive ceramic particles such as conductive silicon carbide (SiC) particles, refractory metal particles such as molybdenum (Mo) particles, tungsten (W) particles, and tantalum (Ta) particles, and carbon (C) particles. It is preferable that it is 1 type, or 2 or more types selected from the group of these.
- SiC particles are preferable as the conductive particles.
- a composite sintered body of SiC particles and Al 2 O 3 particles is preferable because the temperature dependence of electrical characteristics is small.
- the composite sintered body of SiC particles and Al 2 O 3 particles has excellent corrosion resistance against halogen gas, is excellent in heat resistance and thermal shock resistance, and has a risk of damage due to thermal stress even when used at high temperatures. It is preferable because it is small.
- SiC has a large number of crystal structures, such as a cubic system having a 3C type (zincblende type) crystal structure, a hexagonal system such as 4H type and 6H type, and a wurtzite type. Those having a crystal structure and those having a rhombohedral crystal system and a 15R type crystal structure are mentioned. Among these, those having a 3C type crystal structure are referred to as “ ⁇ -SiC”. All other crystal structures are referred to as “ ⁇ -SiC”.
- SiC particles it is preferable to use SiC particles having a ⁇ -type crystal structure as a raw material because of excellent conductivity.
- SiC particles it is preferable to use SiC particles having a ⁇ -type crystal structure as a raw material because of excellent conductivity.
- SiC particles SiC particles obtained by various methods such as a plasma CVD method, a precursor method, a thermal carbon reduction method, and a laser pyrolysis method can be used.
- a plasma CVD method a precursor method
- a thermal carbon reduction method a thermal carbon reduction method
- a laser pyrolysis method a method for converting SiC particles into SiC particles.
- SiC contained in the composite sintered body includes crystal grains having an ⁇ -SiC type crystal structure (hereinafter referred to as ⁇ -SiC grains) and crystal grains having a ⁇ -SiC type crystal structure (hereinafter referred to as ⁇ -SiC grains). And have.
- ⁇ -SiC grains crystal grains having an ⁇ -SiC type crystal structure
- ⁇ -SiC grains crystal grains having a ⁇ -SiC type crystal structure
- SiC crystal grains are present in the crystal grain boundaries and in the crystal grains of the main phase formed by sintering Al 2 O 3 crystal grains, which are insulating ceramics. Is distributed.
- the SiC content in the composite sintered body is preferably 4% by volume to 23% by volume, more preferably 5% by volume to 20% by volume, and more preferably 6% by volume to 12% by volume. More preferably, it is% or less.
- the reason why the SiC content is within the above range is that when the SiC content is less than 4% by volume, the amount of SiC is too small relative to the insulating ceramics, and the electrostatic capacitance due to the addition of SiC. This is because it is difficult to obtain the effect of improving adsorption / desorption characteristics and thermal conductivity when used as a chuck. On the other hand, when the content of the conductive particles exceeds 23% by mass, the amount of the conductive particles is too much with respect to the insulating material, and it is difficult to obtain a withstand voltage characteristic necessary for use as an electrostatic chuck. Because.
- the average particle size of the insulating ceramic in the composite sintered body is preferably 2 ⁇ m or less.
- the average particle diameter of the Al 2 O 3 particles exceeds 2 ⁇ m, when the substrate of the electrostatic chuck device is produced using this composite sintered body, the upper surface of the substrate on which the plate-like sample is placed is It becomes easy to be etched by plasma. Therefore, sputter marks are formed on the upper surface of the base material, which may cause contamination of an adsorbed object such as a silicon wafer.
- the SiC particles in the composite sintered body preferably contain 0.001% by volume or more of fine SiC particles of 0.04 ⁇ m or less, and more preferably contain 1% by volume or more with respect to the entire composite sintered body. .
- an average interval at which SiC particles of 0.04 ⁇ m or less are present is 1.5 ⁇ m or less. Therefore, when the average particle diameter of the insulating ceramic particles is 2 ⁇ m or less, one or more SiC particles of 0.04 ⁇ m or less exist for one insulating ceramic particle.
- the composite sintered body contains fine SiC particles, when the composite sintered body is used as a constituent member of an electrostatic chuck device, electrical characteristics such as adsorption characteristics and dielectric characteristics can be obtained. The effect to improve is acquired.
- the SiC particles in the composite sintered body preferably have a particle diameter D10 having a cumulative volume percentage of 10% by volume in the volume particle size distribution of the SiC particles of 0.2 ⁇ m or less.
- the particle diameter is calculated with the same set of sintered crystal grains.
- the particle diameter D90 having a cumulative volume percentage of 90% by volume in the volume particle size distribution of the SiC particles is preferably 2 ⁇ m or less.
- the ratio of D10 to D90 (D90 / D10) is preferably 3.0 or more.
- the ratio of D50 to D90 (D90 / D50) is preferably 1.4 or more.
- the dielectric breakdown of the electrostatic chuck device using the composite sintered body as the material for forming the constituent member can be gently advanced.
- the content of metal impurities in the composite sintered body is preferably 1000 ppm or less, and more preferably 100 ppm or less.
- each metal impurity rate of SiC and insulating ceramics contained in a composite sintered compact shall be 1000 ppm or less, and it is more preferable to set it as 100 ppm or less.
- the metal impurity is 1000 ppm or less, the possibility of contaminating the semiconductor wafer is reduced, and the temperature dependency of the electrical resistance of the electrostatic chuck device is preferably reduced.
- SiC contained in the composite sintered body includes crystal grains having an ⁇ -SiC type crystal structure (hereinafter referred to as ⁇ -SiC grains) and crystal grains having a ⁇ -SiC type crystal structure (hereinafter referred to as ⁇ -SiC grains). And have.
- the composite sintered body constituting the substrate of the present embodiment contains more than 60 volume% of ⁇ -SiC grains with respect to the entire SiC crystal grains. That is, the content of ⁇ -SiC grains is less than 40% by volume with respect to the entire SiC crystal grains.
- the content of ⁇ -SiC grains with respect to the entire SiC crystal grains is preferably 80% by volume or more, more preferably 90% by volume or more, and still more preferably 95% by volume or more. That is, the content of ⁇ -SiC grains is preferably 20% by volume or less, more preferably 10% by volume or less, and still more preferably 5% by volume or less with respect to the entire SiC crystal grains. .
- ⁇ -SiC When comparing ⁇ -SiC and ⁇ -SiC, ⁇ -SiC is more thermodynamically stable.
- phase transition from ⁇ -SiC to ⁇ -SiC occurs at about 1750 ° C or higher.
- Conventionally known Al 2 O 3 —SiC is a cause of low durability because ⁇ -SiC is phase-transformed into ⁇ -SiC during sintering as a result of sintering at high temperature to densify the sintered body. A lot of ⁇ -SiC.
- the phase transition from ⁇ -SiC to ⁇ -SiC is suppressed by manufacturing by the manufacturing method described later, and the ratio of ⁇ -SiC is set to 60.
- the volume is controlled to be more than% by volume.
- phase transition from ⁇ -SiC to ⁇ -SiC occurs at about 1750 ° C or higher.
- Conventionally known Al 2 O 3 —SiC is sintered at a high temperature in order to densify the sintered body. As a result, ⁇ -SiC undergoes phase transition to ⁇ -SiC during sintering, and contains a large amount of ⁇ -SiC. It was.
- the phase transition from ⁇ -SiC to ⁇ -SiC is suppressed by manufacturing by the manufacturing method described later, and the ratio of ⁇ -SiC is set to 60.
- the volume is controlled to be more than% by volume.
- the following can be considered as a cause of such a phenomenon.
- the reason why a characteristic having a high critical current value can be obtained by increasing the ratio of ⁇ -SiC to more than 60% by volume is considered that the conductivity of ⁇ -SiC is lower than that of ⁇ -SiC.
- ⁇ -SiC generates a larger amount of heat when the same current flows than ⁇ -SiC. Therefore, in the conventional composite sintered body, when a current flows by applying a voltage, the calorific value of ⁇ -SiC is large, and the sample melts in a minute region around ⁇ -SiC, and the current value increases rapidly. Insulation failure.
- ⁇ -SiC when the composite sintered body contains a large amount of ⁇ -SiC, ⁇ -SiC has a lower electrical conductivity than ⁇ -SiC, so that local heat generation occurs when a minute current flows in the sintered body.
- the proportion of 4H form ⁇ -SiC contained in the entire SiC is preferably 30% by volume or less, more preferably 20% by volume or less, and more preferably 10% by volume.
- the following is preferable. This is because 4H-type SiC becomes a P-type semiconductor due to the presence of Al or the like, and the conductivity of SiC is further reduced.
- the proportion of 6H-type ⁇ -SiC contained in the entire SiC is preferably 20% by volume or less, more preferably 10% by volume or less, and more preferably 5% by volume.
- 6H-type SiC is less conductive than ⁇ -SiC.
- the 6H-type SiC crystal grains have a larger aspect ratio than the 4H-type SiC crystal grains, it is easy to form a conductive path. Therefore, when 6H-type SiC is present, the electrical characteristics and resistance of the composite sintered body are reduced by the amount of conductive path formed by 6H-type SiC, which has lower conductivity than when only 4H-type SiC is present. Plasma properties are reduced.
- the analysis of the SiC crystal form ( ⁇ -SiC, ⁇ -SiC) in the composite sintered body is performed by measuring the powder X-ray diffraction intensity and using the method of Ruska (J. Mater. Sci., 14, 2013-2017 (1979))).
- X x / (x + y + z)
- Y y / (x + y + z)
- Z z / (x + y + z)
- I1 / I3 is preferably 0.02 or less, and 4H type ⁇ -SiC contained in the whole SiC.
- I1 / I3 is preferably made 0.01 or less.
- the I3 peak in the X-ray diffraction pattern is a peak that appears in common in ⁇ -SiC and ⁇ -SiC in the case of SiC.
- the I1 peak in the X-ray diffraction pattern is a peak observed in 4H type SiC. Therefore, the I1 peak can be said to be a peak corresponding to the amount of 4H-type SiC among ⁇ -SiC.
- the composite sintered body includes pores existing in the grain boundaries, and the ratio of the apparent density of the composite sintered body to the virtual true density when the composite sintered body does not include pores is 97% or more. Is preferably densified, more preferably 98% or more. In the composite sintered body, as the raw material powder is sintered, the amount of pores is reduced and the apparent density approaches 100%. This is because it is preferable that the ratio is 97% or more because corrosion resistance to plasma (plasma resistance) is improved.
- the crystallite diameter determined from the X-ray diffraction result of the SiC crystal grains is preferably 50 nm or more. Further, the crystallite diameter of SiC is preferably 200 nm or less, and more preferably 100 nm or less.
- the crystallite diameter obtained from the X-ray diffraction result is obtained as an average crystal grain size contained in the composite sintered body.
- the crystallite diameter of SiC is such a value, pores and defects between SiC particles gathered at the grain boundaries can be reduced, so that the density can be increased.
- the crystallite diameter of SiC is such a value, it is possible to improve the durability of the composite sintered body against plasma, the characteristics of particle detachment, the generation of particles, and the like.
- the composite sintered body constituting the substrate of the present embodiment preferably includes a portion where ⁇ -SiC particles are sintered.
- the composite sintered body having such a portion shows that ⁇ -SiC grains were sintered without causing a phase transition from ⁇ -SiC to ⁇ -SiC during sintering.
- ⁇ -SiC particles By sintering ⁇ -SiC particles, SiC particles that are not dispersed into a single particle but remain aggregated and SiC segregated during the sintering process exist between adjacent SiC particles. Can reduce pores and defects. Therefore, the density of the composite sintered body can be increased. Further, by sintering the ⁇ -SiC particles, the durability of the composite sintered body against plasma can be enhanced. Further, by sinter the ⁇ -SiC grains, it is possible to suppress the detachment of particles and the generation of particles.
- SiC sintered at the grain boundaries of the insulating particles during the sintering process has a shape that matches the grain boundaries of the insulating particles during the sintering process, so that the density can be increased. In addition, defects at the boundary between the insulating particles and the SiC particles can be reduced.
- the electrical resistance between the SiC particles is lower than when the SiC particles are in contact with each other without being sintered. Therefore, the electrical characteristics of the composite sintered body can be improved.
- the ceramic material and the electrostatic chuck device of the first embodiment and the second embodiment of the present invention are configured as described above.
- the method for producing a composite sintered body according to the present embodiment includes mixing a raw material powder of an insulating material, a raw material powder of conductive particles, and a dispersion medium to form a composite powder, and the composite powder is 1 MPa or more and 100 MPa or less.
- the composite sintered body is fired under pressure.
- the sintering conditions include a first sintering step in which the insulating particles are sintered at a temperature lower than the phase transition temperature of the SiC particles, and a temperature at which the SiC particles are sintered higher than the first sintering step. And a second sintering step of sintering the mixed particles.
- the insulating ceramic particles those having a sintering temperature lower than the phase transition temperature at which the ⁇ -SiC type crystal structure transitions to the ⁇ -SiC type crystal structure are used.
- description will be made assuming that Al 2 O 3 particles are used as the insulating ceramic.
- ⁇ -SiC particles are used as the SiC particles.
- the ⁇ -SiC particles those having a metal impurity amount of 100 ppm or less are preferably used, and those having 10 ppm or less are more preferably used.
- content of Al, Fe, and B is 1 ppm or less, respectively.
- Such high-purity SiC particles can be produced by a CVD method or a laser pyrolysis method.
- ⁇ -SiC particles having a metal impurity amount of 100 ppm or less phase transition from ⁇ -SiC to ⁇ -SiC can be suppressed. Further, when an electrostatic chuck device using a composite sintered body is used in the plasma process, metal contamination on the plate-like sample (wafer) can be suppressed.
- the SiC particles contain a large amount of nitrogen atoms as long as silicon nitride is not generated.
- the metal impurities contained in the SiC particles are small and the nitrogen content of the SiC particles is increased, the nitrogen atoms serve as electron donors, and the conductivity of the SiC particles can be increased. Further, the phase transition from ⁇ -SiC to ⁇ -SiC can be suppressed.
- SiC particles containing particles having a particle diameter of 50 nm or less preferably 10% by volume or more, more preferably 40% or more.
- SiC particles having a fine particle diameter the number of particles when the same volume is added increases, so that the effect of suppressing the grain growth of insulating particles can be enhanced by the pinning effect.
- SiC particles having a fine particle diameter fine SiC particles are included in the composite sintered body, and the SiC particles easily come into contact with each other in the composite sintered body. Therefore, when the composite sintered body is used as a constituent member of the electrostatic chuck device, electrical characteristics such as adsorption characteristics and dielectric characteristics can be improved.
- an Al 2 O 3 powder having an average particle diameter of 1 ⁇ m or less is preferably used as the Al 2 O 3 raw material powder.
- the reason is that in the SiC—Al 2 O 3 composite sintered body obtained by using the Al 2 O 3 powder having an average particle diameter exceeding 1 ⁇ m, the average particle of the Al 2 O 3 particles in the composite sintered body The diameter exceeds 2 ⁇ m.
- the base material of the electrostatic chuck device is produced using this SiC—Al 2 O 3 composite sintered body, the upper surface of the base material on the side on which the plate-like sample is placed is easily etched by plasma. Therefore, sputter marks are formed on the upper surface of the base material, which may cause contamination of an object to be adsorbed such as a silicon wafer.
- a high-purity powder as the Al 2 O 3 raw material powder, and it is more preferable to use a powder having a purity of 99.99% or more.
- high-purity Al 2 O 3 it is possible to reduce the influence of impurities dissolved in SiC and promote the phase transition to ⁇ -SiC, and to reduce the phase transition to ⁇ -SiC.
- the metal impurity contained in the composite sintered body can be made 1000 ppm or less, and contamination of the semiconductor wafer can be reduced.
- the use of high-purity Al 2 O 3 has the effect of reducing the temperature dependence of the electrical resistance of the electrostatic chuck device.
- the method for mixing the insulating particles and the SiC particles is not particularly limited, but it is preferable that the dispersion treatment is performed in a dispersion medium using a dispersing machine such as an ultrasonic homogenizer, a bead mill, or an ultra-high pressure pulverizer.
- a dispersing machine such as an ultrasonic homogenizer, a bead mill, or an ultra-high pressure pulverizer.
- the dispersion medium, the dispersant, and the dispersion treatment conditions are appropriately selected and mixed uniformly.
- the distribution of the SiC particle should just be the distribution of the secondary particle diameter which the single particle aggregated.
- Insulating particles and SiC particles dispersed in the dispersion medium are made into composite particles using a drying device such as a spray dryer.
- the sintering conditions include a first sintering step in which only the insulating particles are sintered at a temperature lower than the phase transition temperature of the SiC particles, and higher than the first sintering step, and the SiC particles are sintered. It is preferable to have a second sintering step of sintering the mixed particles at a temperature.
- the first sintering step it is preferable to sinter under the condition that the relative density of the sintered body is densified to 95% or more when the first sintering step is completed.
- the relative density at the stage when the first sintering process is completed is confirmed by preparing the sintered body taken out after performing only the first sintering process, and the displacement of the press machine of the pressure sintering apparatus. It can be calculated from the total value.
- the sintering temperature in the first sintering step is preferably 1300 ° C. or higher and 1700 ° C. or lower, and more preferably 1400 ° C. or higher and 1700 ° C. or lower. Moreover, in order to fully sinter, it is preferable to hold for 1 hour or more. While the phase transition temperature from ⁇ -SiC to ⁇ -SiC is about 1800 ° C., for example, the mixed particles are heated at 1650 ° C. for 4 hours to be sintered. At that time, the press pressure of the sintered body is preferably 20 MPa or more, and more preferably 30 MPa or more.
- the insulating ceramic particles Al 2 O 3 particles
- SiC particles gather in the crystal grain boundaries and crystal grains of the main phase formed by sintering Al 2 O 3 crystal grains.
- the press pressure of the sintered body is not increased between room temperature and 1000 ° C., and is increased at a pressure increase rate of 1 MPa / min or less until the first sintering step is completed, so as to reach the maximum pressure. It is preferable.
- the sintering conditions such as the relationship between the temperature and the press pressure and the pressurization speed in the temperature range in which the sintering proceeds, the particle size distribution of SiC when the composite sintered body is obtained can be controlled.
- the mixed particles are sintered at a temperature higher than the sintering temperature of the first sintering step and at which SiC sintering proceeds.
- the sintering temperature is preferably 1750 ° C. or higher and 1900 ° C. or lower.
- the mixed particles are heated and sintered at 1780 ° C. for 4 hours.
- the press pressure of the sintered body is preferably 20 MPa or more, and more preferably 30 MPa or more. Thereby, sintering of Al 2 O 3 particles further proceeds.
- ⁇ -SiC grains are likely to undergo phase transition to ⁇ -SiC during the process of grain rearrangement and grain growth accompanying sintering.
- a part of the first phase is sintered in advance to densify the whole, and the SiC particles are sintered with Al 2 O 3 crystal grains. They are gathered locally in a narrow area such as within a grain. Then, even when the SiC particles are sintered in the second sintering step, there is only a small amount of SiC particles around the SiC particles, so even if the SiC particles are sintered, the particles of the SiC particles It is thought that the phase transition accompanying growth can be suppressed.
- the press pressure is sufficiently transmitted to the SiC particles, so that the pressure has an effect of suppressing the phase transition and the transition to ⁇ -SiC is suppressed.
- the Al 2 O 3 densification makes it difficult for the aluminum in the Al 2 O 3 to be dissolved in SiC, and the transition to ⁇ -SiC, which is a 4H phase, is suppressed.
- the press pressure of the composite sintered body is set to 20 MPa or more until the temperature of the sintered body becomes 1600 ° C. or lower. It is preferable to hold, more preferably 30 MPa or more. If the press pressure is continuously applied until the temperature is lower than the temperature at which the phase transition occurs, the transition to ⁇ -SiC can be prevented by the effect of the pressure suppressing the phase transition.
- the press pressure of the composite sintered body is preferably released in the temperature range of 1300 ° C. or higher and 1700 ° C. or lower, preferably 1400 ° C. or higher and 1600 ° C. or lower. If the sintered compact is cooled with a press pressure applied until it becomes less than 1300 ° C., the resulting composite sintered compact has a large residual stress and may be easily damaged.
- a composite sintered body for an electrostatic chuck having the above-described configuration, a composite sintered body for an electrostatic chuck (ceramic material) having excellent durability can be obtained.
- Example 1 The ⁇ -type SiC powder having an average particle size of 0.04 ⁇ m was weighed so that the volume of Al 2 O 3 powder having an average particle size of 0.1 ⁇ m was 10% by volume and 90% by volume, and these SiC powder and Al 2 O 3 powder were Dispersion treatment was carried out in an aqueous solvent with a ball mill for 5 hours. The obtained dispersion was dried at 200 ° C. using a spray dryer to obtain a composite powder of Al 2 O 3 and SiC.
- the obtained mixed powder was molded, and then heated to 1300 ° C. at 10 ° C./min without applying pressure in an argon atmosphere. Thereafter, the press pressure was increased at 0.2 MPa / min while the temperature rising rate was maintained at 10 ° C./min. When the temperature reached 1650 ° C., the press pressure became 7 MPa. Further, when the temperature was kept at 1650 ° C. and the pressure was continuously increased, the press pressure became 40 MPa when the holding time passed 165 minutes. Thereafter, the first sintering step was completed when the holding time at 1650 ° C. became 4 hours with the press pressure kept at 40 MPa.
- the temperature was increased from 1650 ° C. to 1880 ° C., which is the holding temperature in the first sintering step, at 5 ° C./min. .
- the 2nd sintering process was performed by hold
- heating of the sintering furnace was terminated while maintaining the press pressure on the compact obtained in the second sintering step at 40 MPa at a temperature of 1880 ° C., and the sintering furnace was cooled to 1500 ° C.
- the molded body obtained in the second sintering step was cooled to room temperature, and the ceramic material (composite sintered body) of Example 1 was obtained.
- Example 2 The time at which the press pressure in the first firing step reaches 25 MPa and 25 MPa is 90 minutes after the start of holding at 1650 ° C., the holding temperature in the second firing step is 1780 ° C., and the press conditions in the second firing step are 25 MPa.
- a ceramic material (composite sintered body) of Example 2 was obtained in the same manner as Example 1 except that.
- Example 3 A ceramic material (composite sintered body) of Example 3 was obtained in the same manner as Example 1 except that the holding temperature in the second firing step was 1780 ° C.
- Example 1 After the mixed powder obtained by the method of Example 1 was molded, the temperature was raised to 1300 ° C. at 10 ° C./min without applying pressure in an argon atmosphere. Thereafter, the press pressure was increased at 0.2 MPa / min while the temperature rising rate was maintained at 10 ° C./min. The press pressure when reaching 1780 ° C. was 9.6 MPa, and the press pressure at 1880 ° C. was 11.6 MPa.
- Comparative Example 2 A commercially available 99.6% pure Al 2 O 3 sintered body (AR-996, manufactured by Aszac Co., Ltd.) was used as the ceramic material (sintered body) of Comparative Example 2.
- the crystal phase was identified by the powder X-ray diffraction method using an X-ray diffractometer (manufactured by PANalytical, model name X′Pert PRO MPD).
- the ratio of the SiC crystal form was determined using the calculated value of the theoretical intensity of the diffraction line and the measured value of the X-ray diffraction intensity, and the crystal phase was identified using a method for solving the simultaneous equations.
- Ruska was used as the calculated value of the relationship between the crystal form of SiC and the theoretical intensity of the diffraction line (J. Mater. Sci., 14, 2013-2017 (1979)).
- the detection limit of 4H type ⁇ -SiC is about 10%.
- the detection limit of 4H type ⁇ -SiC is about 5%.
- the density of the composite sintered body was determined by the Archimedes method with the theoretical density of SiC being 3.21 and the theoretical density of Al 2 O 3 being 4.0.
- Table 1 shows the production conditions of the ceramic materials for Examples 1 and 2 and Comparative Examples 1 and 2.
- Example 2 to 5 are graphs showing the measurement results of Examples 1 and 2 and Comparative Examples 1 and 2, respectively.
- Example 1 as the voltage increased, the current value continuously increased until it exceeded 150 ⁇ A.
- Example 2 the current value continuously increased until the current value reached 77 ⁇ A, and then the current value increased rapidly after 0.1 seconds to 150 ⁇ A or more, and the high-voltage power supply to which the voltage was applied was shut off. .
- Comparative Example 1 the current value increased continuously until it reached 4.5 ⁇ A, and after 0.1 second, the current value increased rapidly to 150 ⁇ A or more, and the high-voltage power supply to which the voltage was applied was shut off.
- Comparative Example 2 after the current value reached 0.8 ⁇ A, the current value suddenly increased after 0.1 seconds to 150 ⁇ A or more, and the high-voltage power supply to which the voltage was applied was cut off.
- Table 2 shows the evaluation results for Examples 1 and 2 and Comparative Examples 1 and 2. The values of critical current and withstand voltage shown in Table 2 were read from the graphs shown in FIGS.
- the ceramic materials of Examples 1 and 2 both had a critical current value exceeding 5 ⁇ A and a withstand voltage of 5 ⁇ A or more. Therefore, it can be judged that the ceramic materials of Examples 1 and 2 are excellent in durability.
- the ceramic materials of Comparative Examples 1 and 2 had a withstand voltage of 5 ⁇ A or more, but the critical current value was less than 5 ⁇ A. Therefore, in the ceramic materials of Comparative Examples 1 and 2, it can be determined that the electric charge charged in the ceramic material cannot be discharged before the ceramic material is discharged, and the period until the insulation failure is shortened.
- the electrostatic chuck device using the ceramic material (composite sintered body) of Examples 1 to 3 has no problems such as poor insulation of the composite sintered body even after 1000 hours of use, and has high durability. I understood.
- the electrostatic chuck device using the ceramic material (sintered body) of Comparative Example 2 could not be used due to discharge in the electrostatic chuck device.
- FIG. 6 is a SIM (Scanning Ion Microscope, Scanning Ion Microscope) image of the ceramic material (composite sintered body) of Example 1, and the surface exposed by scraping the surface of the ceramic material by a focused ion beam device by 500 nm. It is a statue.
- the SiC contrast is the place where the contrast of the photograph is dark. As can be seen from the figure, SiC particles grown larger than the particle diameter of the raw material (0.04 ⁇ m) were observed. Moreover, the particle shape of the SiC particles was indefinite. Moreover, what formed the neck in the boundary between SiC particles was observed, and it was confirmed that SiC particles are sintering.
Abstract
Description
本願は、2016年1月27日に、日本に出願された特願2016-013843号、及び2016年3月29日に、日本に出願された特願2016-065345号に基づき優先権を主張し、その内容をここに援用する。
下記(i)および(ii)を満たすセラミックス材料を提供する。
(i)JIS C2110-2で規定する短時間試験に準じ、0.3mmの厚さ前記セラミックス材料の試験片を同径の直径20mmの電極で挟持し、電圧上昇速度1000V/秒にて測定したとき、前記試験片に流れる電流値が1μAを超えたときの電圧値が10kV/mm以上
(ii)上記(i)と同条件で行う試験において、前記試験片に流れる電流値を0.1秒ごとに測定したとき、電流値が0.1秒あたり10μAを超えて増加した時間に対し、前記時間の0.1秒前の電圧値に対応する電流値が5μA以上
本発明のその2の実施形態のセラミックス材料は、下記(i)および(ii)を満たす。
(i)JIS C2110-2で規定する短時間試験に準じ、0.3mmの厚さ前記セラミックス材料の試験片を同径の直径20mmの電極で挟持し、電圧上昇速度1000V/秒にて測定したとき、前記試験片に流れる電流値が1μAを超えたときの電圧値が10kV/mm以上
(ii)上記(i)と同条件で行う試験において、前記試験片に流れる電流値を0.1秒ごとに測定したとき、電流値が0.1秒あたり10μAを超えて増加した時間に対し、前記時間の0.1秒前の電圧値に対応する電流値が5μA以上
「臨界電流」とは、セラミックス材料の試験片に流れる電流値を0.1秒ごとに測定したとき、電流値が0.1秒あたり10μAを超えて増加した時間に対し、前記時間の0.1秒前の電圧値に対応する電流のことを指す。
(i)JIS C2110-2で規定する短時間試験に準じ、0.3mmの厚さセラミックス材料の試験片を同径の直径20mmの電極で挟持し、電圧上昇速度1000V/秒にて測定したとき、セラミックス材料の試験片の耐電圧が10kV/mm以上
(ii)上記(i)と同条件で行う試験において、セラミックス材料の試験片の臨界電流値が5μA以上
以下、図1を参照しながら、本実施形態に係る静電チャック装置について説明する。なお、以下の全ての図面においては、図面を見やすくするため、各構成要素の寸法や比率などは適宜異ならせてある。
以下、順に説明する。
静電チャック部2は、上面を半導体ウエハ等の板状試料Wを載置する載置面11aとした載置板11と、この載置板11と一体化され該載置板11の底部側を支持する支持板12と、これら載置板11と支持板12との間に設けられた静電吸着用電極13および静電吸着用電極13の周囲を絶縁する絶縁材層14と、を有している。載置板11および支持板12は、本発明における「基体」に該当する。
温度調節用ベース部3は、静電チャック部2を所望の温度に調整するためのもので、厚みのある円板状のものである。この温度調節用ベース部3としては、例えば、その内部に冷媒を循環させる流路3Aが形成された液冷ベース等が好適である。
フォーカスリング10は、温度調節用ベース部3の周縁部に載置される平面視円環状の部材である。フォーカスリング10は、例えば、載置面に載置されるウエハと同等の電気伝導性を有する材料を形成材料としている。このようなフォーカスリング10を配置することにより、ウエハの周縁部においては、プラズマに対する電気的な環境をウエハと略一致させることができ、ウエハの中央部と周縁部とでプラズマ処理の差や偏りを生じにくくすることができる。
静電吸着用電極13には、静電吸着用電極13に直流電圧を印加するための給電用端子15が接続されている。給電用端子15は、温度調節用ベース部3、接着剤層8、支持板12を厚み方向に貫通する貫通孔16の内部に挿入されている。給電用端子15の外周側には、絶縁性を有する碍子15aが設けられ、この碍子15aにより金属製の温度調節用ベース部3に対し給電用端子15が絶縁されている。
静電チャック装置1は、以上のような構成となっている。
本実施形態の載置板11および支持板12は、絶縁性セラミックスと炭化ケイ素(SiC)との複合焼結体を形成材料としている。載置板11および支持板12の形成材料は、本発明における静電チャック用複合焼結体(以下、複合焼結体又は単にセラミックス材料)である。以下、本明細書においては、炭化ケイ素を「SiC」として示す。
本発明のその1の実施形態の複合焼結体に含まれる絶縁性セラミックスとしては、Al2O3、酸化イットリウム(Y2O3)、窒化アルミニウム(AlN)、窒化ケイ素(Si3N4)、ムライト(3Al2O3・2SiO2)、酸化マグネシウム(MgO)、フッ化マグネシウム(MgF2)酸化ハフニウム(HfO2)、酸化スカンジウム(Sc2O3)、酸化ネオジム(Nd2O3)、酸化ニオブ(Nb2O5)、酸化サマリウム(Sm2O3)、酸化イッテルビウム(Yb2O3)、酸化エルビウム(Er2O3)、酸化セリウム(CeO2)の群から選択された1種のみからなる酸化物、または2種以上を混合してなる混合物を例示することができる。
また、SiC粒子の体積粒度分布における累積体積百分率が90体積%の粒子径D90は、2μm以下であることが好ましい。
また、D90に対するD10の比(D90/D10)は、3.0以上であることが好ましい。
また、D90に対するD50の比(D90/D50)は1.4以上であることが好ましい。
SiC粒子の粒子径をこれらの範囲とすることで、複合焼結体を構成部材の形成材料とした静電チャック装置の絶縁破壊を穏やかに進行させることができる。そのため、上記複合焼結体を構成部材の形成材料とした静電チャック装置の使用前または使用中に、当該構成部材に流れる電流または電気抵抗を測定することにより、緩やかに絶縁が破られていることを検出することができ、絶縁破壊の予兆を検出することができる。したがって、絶縁破壊を事前に予測することができる複合焼結体とすることが出来る。
6H形のSiCは、β-SiCに比べて導電性が小さい。また、6H形のSiCの結晶粒は、4H形のSiCの結晶粒と比べてアスペクト比が大きいため、導電パスを形成しやすい。そのため、6H形のSiCが存在する場合、4H形のSiCのみが存在する場合と比べ、導電性が小さい6H形のSiCによる導電パスが形成される分だけ複合焼結体の電気的特性や耐プラズマ性が低下する。
I1=9.9y
I2=19.4z
I3=100.0x+25.1y+59.2z
X=x/(x+y+z)、 Y=y/(x+y+z)、 Z=z/(x+y+z)
次に、本発明のその2の実施形態のセラミックス材料(静電チャック用複合焼結体)について、詳述する。
上述したように、本実施形態の静電チャック装置の基体は、下記(i)および(ii)を満たすセラミックス材料を形成材料としている。
(i)JIS C2110-2で規定する短時間試験に準じ、0.3mmの厚さ前記セラミックス材料の試験片を同径の直径20mmの電極で挟持し、電圧上昇速度1000V/秒にて測定したとき、前記試験片に流れる電流値が1μAを超えたときの電圧値が10kV/mm以上
(ii)上記(i)と同条件で行う試験において、前記試験片に流れる電流値を0.1秒ごとに測定したとき、電流値が0.1秒あたり10μAを超えて増加した時間に対し、前記時間の0.1秒前の電圧値に対応する電流値が5μA以上
連続的に電流が増加する電流値の範囲を広くすることで、セラミックス材料の信頼性をより高くすることができる。
また、SiC粒子の体積粒度分布における累積体積百分率が90体積%の粒子径D90は、2μm以下であることが好ましい。
また、D90に対するD10の比(D90/D10)は、3.0以上であることが好ましい。
また、D90に対するD50の比(D90/D50)は1.4以上であることが好ましい。
β-SiCの比率を60体積%より多くすることで臨界電流値が高い特性が得られる理由は、α-SiCの導電性がβ-SiCの導電性に比べて低いためと考えられる。α-SiCではβ-SiCに比べ同じ電流が流れた際の発熱量が大きい。そのため、従来の複合焼結体では、電圧印加により電流が流れた際に、α-SiCにおける発熱量が大きく、α-SiC周囲の微小領域において試料の溶融が起こり、急激に電流値が増加して絶縁不良となる。
6H形のSiCは、β-SiCに比べて導電性が小さい。また、6H形のSiCの結晶粒は、4H形のSiCの結晶粒と比べてアスペクト比が大きいため、導電パスを形成しやすい。そのため、6H形のSiCが存在する場合、4H形のSiCのみが存在する場合と比べ、導電性が小さい6H形のSiCによる導電パスが形成される分だけ複合焼結体の電気的特性や耐プラズマ性が低下する。
I1=9.9y
I2=19.4z
I3=100.0x+25.1y+59.2z
X=x/(x+y+z)、 Y=y/(x+y+z)、 Z=z/(x+y+z)
次に、本発明のその1及びその2の実施形態に係るセラミックス材料の製造方法の一実施形態について説明する。ここでは、セラミックス材料が酸化アルミニウムとSiCとの複合焼結体であることとして説明する。
その際、焼結体のプレス圧は、20MPa以上であることが好ましく、30MPa以上であることがより好ましい。これにより、SiC粒子が相転移することなく、絶縁性セラミックス粒子(Al2O3粒子)が焼結して緻密化される。また、Al2O3結晶粒が焼結してなる主相の結晶粒界および結晶粒内に、SiC粒子が集まる。
平均粒子径0.04μmのβ型SiC粉末を10体積%と、平均粒子径0.1μmのAl2O3粉末が90体積%となるように秤量し、これらSiC粉末及びAl2O3粉末を水系溶媒中で、ボールミルにて5時間分散処理した。得られた分散液を、スプレードライヤーを用いて200℃にて乾燥し、Al2O3とSiCの複合粉末を得た。
第1焼成工程のプレス圧を25MPa、25MPaに到達した時間が1650℃での保持開始後から90分後であり、第2焼成工程の保持温度を1780℃、第2焼成工程のプレス条件を25MPaとしたこと以外は実施例1と同様にして、実施例2のセラミックス材料(複合焼結体)を得た。
第2焼成工程の保持温度を1780℃としたこと以外は実施例1と同様にして、実施例3のセラミックス材料(複合焼結体)を得た。
実施例1の方法で得られた混合粉末を成形した後、アルゴン雰囲気下、圧力を加えることなく10℃/分で1300℃まで昇温した。その後、昇温速度を10℃/分と維持したままプレス圧を0.2MPa/分で昇圧した。なお、1780℃到達時点でのプレス圧は9.6MPaであり、1880℃でのプレス圧は11.6MPaであった。
市販の純度99.6%のAl2O3焼結体(アスザック社製、AR-996)を、比較例2のセラミックス材料(焼結体)として用いた。
X線回折装置(PANalytial社製、機種名X’Pert PRO MPD)を用い、粉末X線回折法により、結晶相の同定を行った。
得られた実施例1,2、比較例1,2の板状試験片を用い、JIS C2110-2に準拠して、JIS C2110-2で規定する短時間試験を行った。
具体的には、得られた実施例1,2、比較例1,2の板状試験片を、直径20mmの電極で挟持し、厚さ方向に直流電圧を印加した。印加する電圧を1000V/秒(3.3kV/(mm・秒))の速度で昇圧しながら、電流値を測定した。電流値は0.05秒間隔で測定した。なお、0.05秒間隔で測定している電流値が瞬間的に増加し、0.05秒後には0.1秒前の測定値の2倍以下の値となる場合はノイズとみなし、評価に使用しなかった。
測定においては、電流が150μA以上となった場合に印加電圧を遮断することとした。
実施例1では電圧の増加に伴い、電流値は150μAを超えるまで連続的に増加した。
実施例2では電流値が77μAに達するまで連続的に電流値が増加した後、0.1秒後に急激に電流値が増加して150μA以上となり、電圧を印加している高電圧電源が遮断した。
比較例1では電流値が4.5μAに達するまで連続的に増加した後、0.1秒後に急激に電流値が増加して150μA以上となり、電圧を印加している高電圧電源が遮断した。
比較例2では電流値が0.8μAに達した後、0.1秒後に急激に電流値が増加して150μA以上となり、電圧を印加している高電圧電源が遮断した。
実施例1,2、比較例1,2で作製したセラミックス材料(複合焼結体)を使用して基体(載置板および支持板)を作製し、静電チャック装置を製造した。製造した静電チャック装置をプラズマエッチング装置内で1000時間使用することで、耐久性評価を行った。評価結果を表3に示す。
Claims (11)
- 絶縁性セラミックスと炭化ケイ素との複合焼結体であり、
前記炭化ケイ素の結晶粒は、前記絶縁性セラミックスの結晶粒が焼結してなる主相の結晶粒界と結晶粒内とのいずれか一方または両方に分散しており、
前記炭化ケイ素の結晶粒の全体に対して、β-SiC型の結晶構造を有する結晶粒を60体積%より多く含み、
前記複合焼結体は、結晶粒界に存在する気孔を含み、
前記複合焼結体が前記気孔を含まないとしたときの仮想真密度に対する、前記複合焼結体の見掛け密度の割合は97%以上であるセラミックス材料。 - 前記β-SiC型の結晶構造を有する結晶粒同士が焼結した部分を含む請求項1に記載のセラミックス材料。
- 前記炭化ケイ素の結晶粒のX線回折結果から求めた結晶子径は、50nm以上である請求項1または2に記載のセラミックス材料。
- 前記絶縁性セラミックスが酸化アルミニウムである請求項1から3のいずれか1項に記載のセラミックス材料。
- 酸化アルミニウムと炭化ケイ素との複合焼結体であり、
前記炭化ケイ素の結晶粒は、前記酸化アルミニウムの結晶粒が焼結してなる主相の結晶粒界および結晶粒内に分散しており、
前記複合焼結体の表面にCuKα線を照射して得たX線回折パターンにおいて、2θ=33.7度付近に見られるピーク(I1)と、2θ=35.8度付近に見られるピーク(I3)の比率(I1/I3)が0.05以下であり、
前記X線回折パターンにおいて、2θ=34.1度付近に見られるピーク(I2)と、2θ=35.8度付近に見られるピーク(I3)の比率(I2/I3)が0.01以下であるセラミックス材料。 - 下記(i)および(ii)を満たすセラミックス材料。
(i)JIS C2110-2で規定する短時間試験に準じ、0.3mmの厚さ前記セラミックス材料の試験片を同径の直径20mmの電極で挟持し、電圧上昇速度1000V/秒にて測定したとき、前記試験片に流れる電流値が1μAを超えたときの電圧値が10kV/mm以上
(ii)上記(i)と同条件で行う試験において、前記試験片に流れる電流値を0.1秒ごとに測定したとき、電流値が0.1秒あたり10μAを超えて増加した時間に対し、前記時間の0.1秒前の電圧値に対応する電流値が5μA以上 - 焼結体である請求項6に記載のセラミックス材料。
- 絶縁性セラミックスと炭化ケイ素との複合焼結体である請求項7に記載のセラミックス材料。
- 前記絶縁性セラミックスが酸化アルミニウムである請求項8に記載のセラミックス材料。
- アルミニウムおよびケイ素以外の金属不純物含有量が、1000ppm以下である請求項9に記載のセラミックス材料。
- 請求項1から10のいずれか1項に記載のセラミックス材料を形成材料とし、一主面が板状試料を載置する載置面である基体と、
前記基体において前記載置面とは反対側、または前記基体の内部に設けられた静電吸着用電極と、を備える静電チャック装置。
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Cited By (4)
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6121965A (ja) * | 1984-07-11 | 1986-01-30 | イビデン株式会社 | アルミナ質焼結体とその製造方法 |
JPS6121964A (ja) * | 1984-07-11 | 1986-01-30 | イビデン株式会社 | アルミナ質焼結体とその製造方法 |
JPH04322904A (ja) * | 1991-01-21 | 1992-11-12 | Sandvik Ab | 酸化物系セラミック切削インサート及びその製造方法 |
JPH05178657A (ja) * | 1991-12-03 | 1993-07-20 | Sumitomo Cement Co Ltd | アルミナ基複合焼結体とその製造方法 |
JPH05295352A (ja) * | 1992-04-20 | 1993-11-09 | Noritake Co Ltd | Al2O3複合セラミック研摩材料、工具材料及びその製法 |
JPH06219828A (ja) * | 1993-01-27 | 1994-08-09 | Chichibu Cement Co Ltd | ムライト・炭化珪素複合セラミックスの製造方法 |
JPH08267305A (ja) * | 1995-03-31 | 1996-10-15 | Ngk Spark Plug Co Ltd | 複合セラミックス工具、皮膜付き複合セラミックス工具及びそれらの製造方法 |
JPH09283606A (ja) * | 1996-04-08 | 1997-10-31 | Sumitomo Osaka Cement Co Ltd | 静電チャック |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1236853A (en) * | 1975-12-03 | 1988-05-17 | Frederick G. Stroke | SUBMICRON .beta. SILICON CARBIDE POWDER AND SINTERED ARTICLES OF HIGH DENSITY PREPARED THEREFROM |
JP2525974B2 (ja) * | 1991-03-26 | 1996-08-21 | 日本碍子株式会社 | 半導体ウエハ―加熱装置 |
JP4261631B2 (ja) * | 1998-03-11 | 2009-04-30 | 京セラ株式会社 | セラミック焼結体の製造方法 |
JP4744855B2 (ja) | 2003-12-26 | 2011-08-10 | 日本碍子株式会社 | 静電チャック |
JP5363132B2 (ja) * | 2008-02-13 | 2013-12-11 | 日本碍子株式会社 | 酸化イットリウム材料、半導体製造装置用部材及び酸化イットリウム材料の製造方法 |
EP2540688B1 (en) * | 2010-02-24 | 2019-03-20 | Kyocera Corporation | Silicon carbide sintered body and sliding component using the same, and protective body |
JP5972630B2 (ja) | 2011-03-30 | 2016-08-17 | 日本碍子株式会社 | 静電チャックの製法 |
JP6032022B2 (ja) * | 2013-01-16 | 2016-11-24 | 住友大阪セメント株式会社 | 誘電体材料 |
JP6155922B2 (ja) * | 2013-07-12 | 2017-07-05 | 住友大阪セメント株式会社 | 静電チャック装置 |
-
2017
- 2017-01-27 CN CN201780008108.7A patent/CN108495829B/zh active Active
- 2017-01-27 KR KR1020187022183A patent/KR20180108637A/ko active Search and Examination
- 2017-01-27 JP JP2017511963A patent/JP6237954B1/ja active Active
- 2017-01-27 WO PCT/JP2017/002934 patent/WO2017131159A1/ja active Application Filing
- 2017-01-27 US US16/072,750 patent/US11387132B2/en active Active
- 2017-07-10 JP JP2017134914A patent/JP6432649B2/ja active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6121965A (ja) * | 1984-07-11 | 1986-01-30 | イビデン株式会社 | アルミナ質焼結体とその製造方法 |
JPS6121964A (ja) * | 1984-07-11 | 1986-01-30 | イビデン株式会社 | アルミナ質焼結体とその製造方法 |
JPH04322904A (ja) * | 1991-01-21 | 1992-11-12 | Sandvik Ab | 酸化物系セラミック切削インサート及びその製造方法 |
JPH05178657A (ja) * | 1991-12-03 | 1993-07-20 | Sumitomo Cement Co Ltd | アルミナ基複合焼結体とその製造方法 |
JPH05295352A (ja) * | 1992-04-20 | 1993-11-09 | Noritake Co Ltd | Al2O3複合セラミック研摩材料、工具材料及びその製法 |
JPH06219828A (ja) * | 1993-01-27 | 1994-08-09 | Chichibu Cement Co Ltd | ムライト・炭化珪素複合セラミックスの製造方法 |
JPH08267305A (ja) * | 1995-03-31 | 1996-10-15 | Ngk Spark Plug Co Ltd | 複合セラミックス工具、皮膜付き複合セラミックス工具及びそれらの製造方法 |
JPH09283606A (ja) * | 1996-04-08 | 1997-10-31 | Sumitomo Osaka Cement Co Ltd | 静電チャック |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20200106180A (ko) * | 2018-02-20 | 2020-09-11 | 엔지케이 인슐레이터 엘티디 | 복합 소결체, 반도체 제조 장치 부재 및 복합 소결체의 제조 방법 |
CN111712475A (zh) * | 2018-02-20 | 2020-09-25 | 日本碍子株式会社 | 复合烧结体、半导体制造装置部件及复合烧结体的制造方法 |
JPWO2019163710A1 (ja) * | 2018-02-20 | 2021-03-04 | 日本碍子株式会社 | 複合焼結体、半導体製造装置部材および複合焼結体の製造方法 |
KR102432509B1 (ko) * | 2018-02-20 | 2022-08-12 | 엔지케이 인슐레이터 엘티디 | 복합 소결체, 반도체 제조 장치 부재 및 복합 소결체의 제조 방법 |
JP7227954B2 (ja) | 2018-02-20 | 2023-02-22 | 日本碍子株式会社 | 複合焼結体、半導体製造装置部材および複合焼結体の製造方法 |
US11837488B2 (en) | 2018-02-20 | 2023-12-05 | Ngk Insulators, Ltd. | Composite sintered body, semiconductor manufacturing apparatus member, and method of manufacturing composite sintered body |
WO2019182107A1 (ja) * | 2018-03-22 | 2019-09-26 | 住友大阪セメント株式会社 | 複合焼結体、静電チャック部材、静電チャック装置および複合焼結体の製造方法 |
CN111886213A (zh) * | 2018-03-22 | 2020-11-03 | 住友大阪水泥股份有限公司 | 复合烧结体、静电卡盘部件、静电卡盘装置及复合烧结体的制造方法 |
JPWO2019182107A1 (ja) * | 2018-03-22 | 2021-01-07 | 住友大阪セメント株式会社 | 複合焼結体、静電チャック部材、静電チャック装置および複合焼結体の製造方法 |
US11345639B2 (en) | 2018-03-22 | 2022-05-31 | Sumitomo Osaka Cement Co., Ltd. | Composite sintered body, electrostatic chuck member, electrostatic chuck device, and method for producing composite sintered body |
WO2023068159A1 (ja) * | 2021-10-18 | 2023-04-27 | 日本特殊陶業株式会社 | アルミナ質焼結体、および静電チャック |
WO2024004778A1 (ja) * | 2022-06-29 | 2024-01-04 | 住友大阪セメント株式会社 | 半導体製造装置用部材及び静電チャック装置 |
Also Published As
Publication number | Publication date |
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CN108495829B (zh) | 2021-09-14 |
JP6432649B2 (ja) | 2018-12-05 |
JP2017206436A (ja) | 2017-11-24 |
US20190043746A1 (en) | 2019-02-07 |
US11387132B2 (en) | 2022-07-12 |
KR20180108637A (ko) | 2018-10-04 |
JPWO2017131159A1 (ja) | 2018-02-01 |
CN108495829A (zh) | 2018-09-04 |
JP6237954B1 (ja) | 2017-11-29 |
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