WO2017098826A1 - 電子制御装置 - Google Patents
電子制御装置 Download PDFInfo
- Publication number
- WO2017098826A1 WO2017098826A1 PCT/JP2016/081654 JP2016081654W WO2017098826A1 WO 2017098826 A1 WO2017098826 A1 WO 2017098826A1 JP 2016081654 W JP2016081654 W JP 2016081654W WO 2017098826 A1 WO2017098826 A1 WO 2017098826A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- control device
- electronic control
- connector
- resin
- control board
- Prior art date
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- 229920005989 resin Polymers 0.000 claims abstract description 86
- 239000011347 resin Substances 0.000 claims abstract description 86
- 238000007789 sealing Methods 0.000 claims abstract description 35
- 239000003566 sealing material Substances 0.000 claims description 8
- 230000029058 respiratory gaseous exchange Effects 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 230000001629 suppression Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000009467 reduction Effects 0.000 abstract description 3
- 238000011946 reduction process Methods 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000000465 moulding Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910017944 Ag—Cu Inorganic materials 0.000 description 3
- 238000004382 potting Methods 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 229910020888 Sn-Cu Inorganic materials 0.000 description 2
- 229910019204 Sn—Cu Inorganic materials 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 230000000241 respiratory effect Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- -1 Polybutylene Terephthalate Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
- B60R16/0239—Electronic boxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/005—Electro-mechanical devices, e.g. switched
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
- B60R16/0238—Electrical distribution centers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
- H05K5/0056—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for protecting electronic components against vibration and moisture, e.g. potting, holders for relatively large capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0069—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R21/00—Arrangements or fittings on vehicles for protecting or preventing injuries to occupants or pedestrians in case of accidents or other traffic risks
- B60R21/01—Electrical circuits for triggering passive safety arrangements, e.g. airbags, safety belt tighteners, in case of vehicle accidents or impending vehicle accidents
- B60R2021/01006—Mounting of electrical components in vehicles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
- H05K5/0052—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by joining features of the housing parts
Definitions
- the present invention relates to an electronic control device such as an engine control unit or an automatic transmission control unit mounted on an automobile, and more particularly to the structure of the electronic control device.
- the electrical and electronic module described in Patent Document 1 includes an electronic circuit board on which an electronic circuit is mounted, a metal base for mounting the electronic circuit board, and a connector, and the electronic circuit board is sealed with a resin. Fill the connector with potting resin or pre-mold resin. Thereby, the deformation
- the alignment plate is fixed to a metal base to prevent the sealing resin from flowing into the connector.
- Patent Document 1 the use of a potting resin filled in the connector increases the cost and the number of production processes. Further, when the alignment plate is used, the alignment plate is deformed by the resin molding pressure, so that the connector terminal may be deformed, and there is a concern about the influence on the reliability.
- An object of the present invention is to provide a highly reliable electronic control device that achieves both cost reduction and simplification of the manufacturing process.
- the present invention includes a control board, a connector having a terminal connected to the control board, and a housing case to which the control board and the connector are fixed.
- the control board is partially sealed with a sealing resin.
- the connector is disposed at a position facing the other part of the control board, and the connector and the sealing resin are separated from each other by the control board and the housing case.
- a highly reliable electronic control device can be manufactured by a low-cost and simple manufacturing process.
- FIG. 1A is a plan view of the electronic control device according to the first embodiment of the present invention
- FIG. 1B is a cross-sectional view taken along the line AA in FIG.
- FIG. 2 is a diagram showing an assembly procedure of the electronic control device according to the first embodiment of the present invention.
- the electronic control device 1 includes a control board 3 on which an electronic component 2 such as a microcomputer is mounted, a housing case 4, and a connector 5.
- the control board 3 is molded with a sealing resin 6. Has been.
- the housing case 4 includes a vehicle fixing portion 4 a for fixing the electronic control device 1 to the vehicle, a connector mounting portion 4 b, a control board mounting portion 4 c, and a frame surrounding the connector 5.
- a body 4d. are integrally formed with the housing case 4.
- the material of the housing case 4 is preferably a metal material having high thermal conductivity, shielding properties, and rigidity, and is aluminum or an aluminum alloy from the viewpoint of mass productivity, weight reduction, heat dissipation, and cost. Good.
- the housing case 4 may be subjected to a surface treatment such as a roughening treatment or an alumite treatment. As a result, the adhesion between the housing case 4 and the sealing resin 6 is improved, and the sealing resin 6 is difficult to peel off due to environmental temperature changes, stress generated by vibrations, etc., and the reliability of the electronic control device 1 is improved. improves.
- the connector 5 includes a connector terminal 5a for connecting the vehicle-side harness and the control board 3, and a connector housing for aligning and holding the connector terminals 5a at a prescribed pitch. 5b.
- the material of the connector terminal 5a is preferably copper or a copper alloy from the viewpoint of conductivity, miniaturization, and cost.
- PBT Polybutylene Terephthalate
- PA Polyamide
- PPS Polyphenylene Sulfide
- the connector 5 is inserted into the housing case 4 and attached.
- the sealing material 7 which has adhesiveness is apply
- the connector 5 can be fixed to the housing case 4 by using the sealing material 7 having adhesiveness.
- an electronic component 2 such as a microcomputer is mounted on the control board 3.
- the control board 3 a resin wiring board based on glass epoxy resin or the like is used.
- Sn—Cu solder, Sn—Ag—Cu solder, Sn—Ag—Cu -Use lead-free solder such as Bi solder.
- the control board 3 is attached to the housing case 4 and the sub-assembly 10 is assembled.
- the control board 3 is placed on the control board mounting portion 4 c of the housing case 4, and the control board 3 is fixed to the housing case 4 using screws 8.
- the number of fixing points by the screw 8 is preferably 3 or more.
- the sealing material 7 having adhesiveness is applied to the lower end surface (contact portion) of the frame body 4d that contacts the control board 3, and the control board 3 is placed and cured. Thereby, it is possible to reliably prevent the sealing resin 6 from entering the resin unsealed space 9 defined by the control board 3, the housing case 4 and the connector 5, and the connector 5 is isolated from the sealing resin 6.
- the deformation of the connector 5 due to the resin molding pressure can be suppressed.
- the control board 3 by fixing the control board 3 to the housing case 4, deformation of the control board 3 due to the resin molding pressure can be suppressed.
- the resin unsealed space 9 can be formed only by providing the frame 4d in the existing housing case 4 without using additional parts such as a cover.
- the connector 5 is connected to the control board 3 by inserting the connector terminal 5a into the through hole 3a of the control board 3, and lead-free such as Sn-Cu solder, Sn-Ag-Cu solder, Sn-Ag-Cu-Bi solder, etc. This is done by joining with solder.
- the connector 5 may be a surface mount type or a press fit type.
- the sub-assembly 10 is set in a mold 11 for resin sealing.
- the sub-assembly 10 is set on the upper mold 11a which is a movable mold, the upper mold 11a is moved, and is set on the lower mold 11b which is a fixed mold.
- the upper surface of the housing case 4 that is not molded with the sealing resin 6 and the surface of the vehicle fixing portion 4a are configured to be directly pressed by the mold 11 so as not to contact the resin during resin molding.
- the sealing resin 6 may be a thermosetting epoxy resin, an unsaturated polyester resin, or a thermoplastic resin.
- the sealing method is transfer molding, compression molding, injection molding, hot melt, and the physical properties of the sealing resin 6 are a linear expansion coefficient of 10 to 30 ⁇ 10 ⁇ 6 / ° C. and a thermal conductivity of 0.5 to It is good that it is 3 W / mK.
- the electronic components 2a and 2b are mounted in advance on the portions of the control board 3 that are exposed to the unsealed resin space 9 as shown in FIG. It is good to keep.
- the electronic component 2b higher than the housing case 4 is disposed immediately below the connector 5, and the shape of the connector housing 5b is made to be opposite to the shape of the electronic component 2b.
- Examples of the electronic components 2a and 2b arranged in the resin unsealed space 9 include electrolytic capacitors.
- the internal electrolytic solution is usually vaporized and leaks to the outside in a small amount. For this reason, if the electrolytic capacitor is sealed with resin, the vaporized gas accumulates in the vicinity of the electrode of the electrolytic capacitor and may cause a short circuit.
- the electrolytic capacitor is generally provided with an explosion-proof valve that vents gas when the internal gas pressure becomes high. However, if the electrolytic capacitor is sealed with resin, the function of the explosion-proof valve does not work and the gas cannot be extracted.
- the connector 5 is isolated from the sealing resin 6 by the frame 4d integrally formed in the housing case 4, thereby suppressing deformation of the connector 5 due to the resin molding pressure, Since the deformation of the terminal can be suppressed, the reliability of the electronic control device 1 can be ensured.
- the resin unsealed space 9 can be formed simply by providing the frame 4d in the existing housing case 4, and a relatively inexpensive electrolytic capacitor can be disposed in the resin unsealed space 9, The cost of the electronic control device 1 can be reduced.
- FIG. 3A is a plan view of the electronic control device according to the present embodiment
- FIG. 3B is a cross-sectional view taken along the line AA in FIG. 3A
- FIG. FIG. 5 is a cross-sectional view taken along the line BB in FIG.
- the electronic control device 1 housing case 4 is provided on the outside of the frame 4 d surrounding the connector 5 so as to protrude from the surface facing the control board 3 of the housing case 4, and is disposed on the control board 3.
- a frame 4e surrounding the electronic component 2c that is not sealed with resin is integrally molded.
- the electronic control device 1 is suitable when the electronic component 2c that is not resin-sealed cannot be disposed directly below the connector 5 due to the restrictions on the component layout on the control board 3.
- FIG. 4A is a plan view of the electronic control device according to the present embodiment
- FIG. 4B is a cross-sectional view taken along the line AA in FIG. 4A
- FIG. FIG. 5 is a cross-sectional view taken along the line BB in FIG.
- the electronic control device 1 according to the present embodiment is provided with a through hole 4 f in the housing case 4 that connects the resin unsealed space 12 in which the electronic component 2 c is disposed to the outside air.
- a breathing filter assembly 13 that does not pass is attached. Therefore, the electronic control device 1 according to the present embodiment cannot place the electronic component 2c that is not resin-sealed directly under the connector 5 due to the restriction of the component layout on the control board 3, and the surrounding environment of the electronic component 2c. It is suitable when it is necessary to maintain the same atmospheric pressure as the outside air.
- the resin unsealed space 12 in which the electronic component 2c is arranged can be maintained at the same atmospheric pressure as the outside air, for example, a sensor or the like for measuring the pressure of the outside air can be mounted on the control board 3.
- the interior of the frame 4e (resin unsealed space) A through-hole 5c for connecting 9) to the outside air is provided in the connector housing 5b, and a breathing filter membrane 14 which allows air to pass therethrough but does not allow water to pass therethrough may be attached by an adhesive or heat welding.
- FIG. 5A is a plan view of the electronic control device according to the present embodiment
- FIG. 5B is a cross-sectional view taken along the line AA in FIG. 5A
- FIG. FIG. 6 is a cross-sectional view taken along the line BB in FIG.
- the frame 4 d is not integrally formed with the housing case 4, and is constituted by another member (hereinafter referred to as “sealing resin intrusion suppressing member”) 15. .
- the sealing resin intrusion suppressing member 15 is attached to the housing case 4, the sealing material 7 is applied to the upper end surface of the sealing resin intrusion suppressing member 15, and is adhered and cured to the lower surface of the housing case 4.
- the sealing material 7 is applied to the lower end surface (contact part) of the sealing resin intrusion suppressing member 15 that comes into contact with the control board 3, and the control board 3 is placed and cured.
- the frame body 4d is not integrally formed with the housing case 4 and is constituted by the sealing resin intrusion suppressing member 15, so that the degree of freedom of the material and shape of the frame body 4d is improved and the design according to the required characteristics is possible. Therefore, the improvement of the reliability of the electronic control apparatus 1 can be expected.
- the frame 4d can be manufactured independently of the housing case 4, it is possible to share the housing case 4 without producing the housing case 4 even in a product model having a different layout of the electronic component 2, and intrusion of sealing resin. It is possible to cope with the model change only by changing the layout of the suppressing member 15. Thereby, cost reduction of the electronic control apparatus 1 can be expected.
- Example of this invention was explained in full detail, this invention is not limited to an above-described Example, Various modifications are included.
- the above-described embodiments have been described in detail for easy understanding of the present invention, and are not necessarily limited to those having all the configurations described. It is also possible to add a part of the configuration of another embodiment to the configuration of a certain embodiment, and delete a part of the configuration of a certain embodiment or replace it with a part of another embodiment. Is possible.
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- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
Description
Claims (14)
- 制御基板と、該制御基板に接続される端子を有するコネクタと、
前記制御基板と前記コネクタとが固定されるハウジングケースを備え、
前記制御基板は、一部が封止樹脂によって封止され、
前記コネクタは、前記制御基板の他部に対向する位置に配置され、
前記コネクタと前記封止樹脂とは、前記制御基板と前記ハウジングケースとによって隔てられる電子制御装置。 - 制御基板と、該制御基板に接続される端子を有するコネクタと、
前記制御基板と前記コネクタとが固定されるハウジングケースとを備え、
前記制御基板の一部は封止樹脂によって封止され、
前記制御基板の他部と、前記ハウジングケースと、前記コネクタとによって樹脂封止されない樹脂未封止空間が形成される電子制御装置。 - 請求項2に記載の電子制御装置において、
前記樹脂未封止空間に、前記電子部品の一部が実装される電子制御装置。 - ハウジングケース内に制御基板を固定し、前記制御基板とコネクタとを端子で接続し、外部と信号を授受する電子制御装置であって、
前記コネクタと前記制御基板との間に隙間を設けて前記コネクタを前記ハウジングケースに保持するコネクタ保持部と、
前記制御基板と協働して前記隙間への樹脂の浸入を抑制する樹脂侵入抑制部と、を有する電子制御装置。 - 請求項1~3の何れか一項に記載の電子制御装置において、
前記ハウジングケースは、前記コネクタを囲みかつ前記制御基板に当接する第1の枠体を備える電子制御装置。 - 請求項5に記載の電子制御装置において、
前記第1の枠体が、前記ハウジングケースとは別の部材で構成される電子制御装置。 - 請求項4に記載の電子制御装置において、
前記ハウジングケースは、前記第1の枠体の外側で前記制御基板に当接する第2の枠体を備え、
前記ハウジングケースと前記第2の枠体と前記制御基板との間に前記封止樹脂が浸入しない第2の樹脂未封止空間が形成される電子制御装置。 - 請求項7に記載の電子制御装置において、
前記第2の樹脂未封止空間に、前記電子部品の他の一部が実装される電子制御装置。 - 請求項7に記載の電子制御装置において、
前記第1の枠体及び前記第2の枠体と前記制御基板との当接部に、接着性を有するシール材が配置される電子制御装置。 - 請求項6に記載の電子制御装置において、
前記ハウジングケースに、前記第2の樹脂未封止空間を外気と繋げる第1の貫通孔が設けられ、
前記第1の貫通孔に、空気を通すが水を通さない呼吸フィルタ組み品が取り付けられる電子制御装置。 - 請求項8に記載の電子制御装置において、
前記コネクタのコネクタハウジングに、前記樹脂未封止空間を外気と繋げる第2の貫通孔が設けられ、
前記第2の貫通孔に、空気を通すが水を通さない呼吸フィルタ膜が取り付けられる電子制御装置。 - 請求項8に記載の電子制御装置において、
前記樹脂未封止空間に実装された前記一部の電子部品の高さは、前記第2の樹脂未封止空間に実装された前記他の一部の電子部品の高さよりも大きい電子制御装置。 - 請求項11に記載の電子制御装置において、
前記コネクタのコネクタハウジングの形状は、前記第1の樹脂未封止空間に配置された電子部品の形状と相対している電子制御装置。 - 請求項1~3の何れか一項に記載の電子制御装置において、
前記封止樹脂は、熱硬化性を有する樹脂である電子制御装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/060,716 US10501031B2 (en) | 2015-12-10 | 2016-10-26 | Electronic control device |
DE112016004757.6T DE112016004757T5 (de) | 2015-12-10 | 2016-10-26 | Elektronische steuervorrichtung |
CN201680061971.4A CN108293305B (zh) | 2015-12-10 | 2016-10-26 | 电子控制装置 |
JP2017554969A JP6666927B2 (ja) | 2015-12-10 | 2016-10-26 | 電子制御装置 |
US16/689,881 US10829064B2 (en) | 2015-12-10 | 2019-11-20 | Electronic control device |
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JP2015240709 | 2015-12-10 | ||
JP2015-240709 | 2015-12-10 |
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US16/060,716 A-371-Of-International US10501031B2 (en) | 2015-12-10 | 2016-10-26 | Electronic control device |
US16/689,881 Continuation US10829064B2 (en) | 2015-12-10 | 2019-11-20 | Electronic control device |
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WO2017098826A1 true WO2017098826A1 (ja) | 2017-06-15 |
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Cited By (5)
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JP2019016689A (ja) * | 2017-07-06 | 2019-01-31 | 株式会社ケーヒン | 電子制御装置及び同製造方法 |
JP2019067970A (ja) * | 2017-10-03 | 2019-04-25 | 三菱電機株式会社 | 半導体装置 |
JP2019110149A (ja) * | 2017-12-15 | 2019-07-04 | 株式会社ケーヒン | 電子制御装置 |
JP2020135991A (ja) * | 2019-02-15 | 2020-08-31 | 住友電装株式会社 | 回路基板用コネクタ |
JP7494612B2 (ja) | 2020-07-16 | 2024-06-04 | 住友ベークライト株式会社 | モジュール |
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CN108293305B (zh) * | 2015-12-10 | 2020-06-26 | 日立汽车***株式会社 | 电子控制装置 |
DE102016203718A1 (de) * | 2016-03-08 | 2017-09-14 | Zf Friedrichshafen Ag | Steuergerät |
JP6838787B2 (ja) * | 2016-12-22 | 2021-03-03 | 日立Astemo株式会社 | 電子制御装置 |
CN108934132B (zh) * | 2017-05-25 | 2021-08-06 | 法雷奥汽车内部控制(深圳)有限公司 | 印刷电路板组件及其封装方法和机动车辆 |
JP6930653B2 (ja) * | 2018-02-23 | 2021-09-01 | 住友電装株式会社 | 電気接続箱 |
IT201800005001A1 (it) * | 2018-05-02 | 2019-11-02 | Sistema di attuazione tira-cavo per freno di stazionamento, freno di stazionamento e relativo metodo di sblocco di un freno di stazionamento | |
JP7050643B2 (ja) * | 2018-10-10 | 2022-04-08 | 三菱電機株式会社 | 半導体装置 |
DE102018218434A1 (de) * | 2018-10-29 | 2020-04-30 | Bühler Motor GmbH | Elektronikmodul, Pumpenantrieb mit diesem Elektronikmodul |
EP4236640A1 (de) * | 2022-02-23 | 2023-08-30 | Siemens Aktiengesellschaft | Halterung für eine leiterplatte |
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- 2016-10-26 DE DE112016004757.6T patent/DE112016004757T5/de active Pending
- 2016-10-26 WO PCT/JP2016/081654 patent/WO2017098826A1/ja active Application Filing
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JP2019016689A (ja) * | 2017-07-06 | 2019-01-31 | 株式会社ケーヒン | 電子制御装置及び同製造方法 |
JP7053177B2 (ja) | 2017-07-06 | 2022-04-12 | 日立Astemo株式会社 | 電子制御装置及び同製造方法 |
JP2019067970A (ja) * | 2017-10-03 | 2019-04-25 | 三菱電機株式会社 | 半導体装置 |
JP2019110149A (ja) * | 2017-12-15 | 2019-07-04 | 株式会社ケーヒン | 電子制御装置 |
JP7105061B2 (ja) | 2017-12-15 | 2022-07-22 | 日立Astemo株式会社 | 電子制御装置 |
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JP7494612B2 (ja) | 2020-07-16 | 2024-06-04 | 住友ベークライト株式会社 | モジュール |
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US10829064B2 (en) | 2020-11-10 |
US20180354434A1 (en) | 2018-12-13 |
CN108293305B (zh) | 2020-06-26 |
JP6666927B2 (ja) | 2020-03-18 |
JPWO2017098826A1 (ja) | 2018-05-24 |
DE112016004757T5 (de) | 2018-07-05 |
US10501031B2 (en) | 2019-12-10 |
CN108293305A (zh) | 2018-07-17 |
US20200086812A1 (en) | 2020-03-19 |
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