WO2017028417A1 - 一种基于滚压式的热塑性树脂光转换体贴合封装led的工艺方法 - Google Patents

一种基于滚压式的热塑性树脂光转换体贴合封装led的工艺方法 Download PDF

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WO2017028417A1
WO2017028417A1 PCT/CN2015/097624 CN2015097624W WO2017028417A1 WO 2017028417 A1 WO2017028417 A1 WO 2017028417A1 CN 2015097624 W CN2015097624 W CN 2015097624W WO 2017028417 A1 WO2017028417 A1 WO 2017028417A1
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array
light conversion
roll
rolling
led
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PCT/CN2015/097624
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English (en)
French (fr)
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何锦华
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江苏诚睿达光电有限公司
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Priority to KR1020177036270A priority Critical patent/KR101957870B1/ko
Priority to EP15901619.5A priority patent/EP3300127B1/en
Priority to US15/737,773 priority patent/US10546980B2/en
Priority to PL15901619T priority patent/PL3300127T3/pl
Priority to JP2017567792A priority patent/JP6538889B2/ja
Publication of WO2017028417A1 publication Critical patent/WO2017028417A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Definitions

  • the invention belongs to the technical field of light-converting body packaged LEDs, and in particular relates to a process method for bonding and packaging LEDs based on a rolling type thermoplastic resin light conversion body.
  • LED has the advantages of high brightness, low heat, long life, environmental protection, and renewable utilization. It is called the most promising new generation of green lighting source in the 21st century. At present, although the theoretical life of LED can reach more than 100,000 hours, in actual use, it is subject to various factors such as chip failure, package failure, thermal overstress failure, electrical overstress failure or / and assembly failure. The failure of the package is particularly prominent, which causes the LED to appear prematurely with light decay or light failure, which will hinder the advancement of LED as a new energy-saving illumination source. In order to solve these problems, many scholars in the industry have carried out related research and proposed some improvement measures that can improve LED light efficiency and actual service life.
  • the newly developed flip-chip LED has the advantages of high luminous efficiency, high reliability and easy integration compared with the traditional formal LED, and the packaging material is greatly simplified, such as the gold wire and solid crystal glue of the traditional formal LED package. Materials such as brackets are no longer needed; the packaging process is also greatly simplified. For example, the solid crystal, wire bonding, and even splitting of the traditional LED packaging process are no longer needed, making flip-chip LEDs more and more widely used;
  • most of the existing flip-chip LED packaging technologies use a casting process of a silicone resin-based light conversion body and a flip-chip LED chip, a screen printing process, an upper and lower plate mold process, and a single roll.
  • the pendulum pressing process, etc., these processes and their associated packaging equipment can not solve the pores and thickness unevenness of the silicone resin light-converting body, resulting in low yield of the light-converting packaged LED;
  • the low production efficiency makes the product cost high.
  • Chinese Patent Application No. 201010204860.9 discloses "a method for packaging a flip-chip LED chip", the steps of which include: (a) applying a light conversion body to a surface of an LED chip by screen printing, and baking and curing the light conversion body; (b) fixing the LED chip on the chip substrate to bond the LED chip electrode to the chip substrate electrode; (c) fixing the LED chip and the chip substrate to the bottom of the holder reflector cup; (d) using the wire to fix the wire
  • the positive and negative electrodes of the chip substrate are respectively connected to the positive and negative electrodes of the bracket; (e) the mold or lens is placed on the bracket on which the LED chip and the chip substrate are fixed, and is filled with the silicone; (f) the overall structure is baked and cured.
  • the method improves the uniformity of the coating thickness of the light conversion body by the screen printing process, and improves the uniformity of the distribution of the phosphor particles, the purpose of improving the yield is achieved; however, the following significant deficiencies exist:
  • First, the screen printing The silicone-based light-converting body is coated on the surface of the LED chip, and then is affected by the thermal over-stress during the baking and curing process, and the light-converting body coating layer and the coating surface layer of the LED chip are partially generated to form irregularities.
  • the second is to fill the mold or lens cover with the silica gel and the LED chip package coated with the light conversion body, and then the whole structure is subjected to the thermal overstress during the baking and curing process, or it may cause the mold or the lens cover.
  • the silicone surface layer locally generates bubbles to form uneven ridges. Because it can not solve the influence of thermal overstress during the LED chip packaging process, the LED light effect will inevitably fall. Third, the entire LED chip packaging process is not equipped with an intelligent control system for control, which directly affects the improvement of the yield.
  • Chinese Patent Application No. 201310270747.4 discloses "LEDs coated with a light conversion body layer, a method of manufacturing the same, and an LED device", the solution comprising: an LED arrangement step of arranging LEDs on one surface in a thickness direction of a support sheet; In the method of covering the LED, a light conversion body layer is provided on one surface in the thickness direction of the support sheet, and the light conversion body layer is composed of an active energy ray-curable resin and a light conversion body which are cured by irradiation with active energy rays.
  • Forming the composition Forming the composition; curing step, irradiating the light conversion body layer with the active energy ray to cure the light conversion body layer; and cutting the light conversion body layer corresponding to the LED to obtain the light conversion body including the LED and the coated LED
  • the purpose of this method is to provide an LED device in which a light conversion body is uniformly disposed around an LED to prevent damage, thereby obtaining an LED coated with a light conversion body layer, and an LED having the light conversion body layer coated thereon;
  • the fluorescent resin composition of the light-converting body may cause the localized bubbles of the surface layer of the light-converting body to form uneven ridges due to the influence of the thermal over-stress;
  • the light-converting layer is covered.
  • the LED will still be affected by the thermal overstress, resulting in a decrease in the efficacy of the LED.
  • the third is the comparison of the process in the entire packaging process. It is cumbersome, the production efficiency of packaged LED is not high; the fourth is the upper and lower plate mold process, which will cause the flip chip to be displaced, and no intelligent control system for precise control, which will inevitably lead to a decrease in yield.
  • Ciba 201380027218.X discloses a "resin sheet laminate and a method for producing a semiconductor light-emitting device using the same", wherein the resin sheet laminate is provided with a phosphor-containing resin layer on a substrate.
  • the phosphor-containing resin layer has a plurality of blocks, and the substrate has a longitudinal direction and a width direction, and the plurality of blocks are repeatedly arranged in a row in the longitudinal direction.
  • the object of the invention is to improve the uniformity of color and brightness of the semiconductor light-emitting device to which the phosphor-containing resin layer is attached, the ease of manufacture, the degree of freedom in design, etc., by the resin sheet laminate.
  • the phosphor resin sheet used is a cured phosphor resin sheet, which will not effectively eliminate pores, irregularities or other processing defects which may remain therein; Pressurizing the press tool from the side of the semiconductor light-emitting element will damage the semiconductor light-emitting element.
  • the presence of the bonding layer also reduces the light-emitting efficiency of the LED element; and fourth, the phosphor resin sheet bonded to the light-emitting surface of the semiconductor light-emitting element The substrate is not peeled off, and the light effect is directly affected by the semiconductor light-emitting element; fifth, the phosphor resin layer is repeatedly arranged in the longitudinal direction by a plurality of blocks.
  • a plurality of block configurations of the phosphor resin layer are realized, and the actual operation procedure is cumbersome, which will affect the packaging efficiency of the entire component, and the arrangement error of the plurality of block regions in the position directly affects the subsequent connection between the light-emitting elements.
  • the object of the present invention is to provide a process for laminating encapsulated LEDs based on a rolled thermoplastic resin light-converting body in order to overcome the deficiencies of the prior art.
  • the present invention has the remarkable advantages of continuously rolling and packaging LEDs, and can satisfy the thermoplasticity.
  • the resin light conversion body is required to fit the conditions of the packaged LED, and the production efficiency and the excellent product rate of the industrialized batch LED package are improved.
  • a process for attaching a packaged LED based on a roll-type thermoplastic resin light-converting body according to the present invention characterized in that it comprises at least preparation of a light conversion film, roll forming and cutting of a light conversion film array
  • the basic process of the flow-through continuous process of the roll-on-paste synthesis of the LED package component and the curing process of the LED package component includes the following steps:
  • Step 1 preparation of the light conversion film: obtaining a light conversion film composed of at least a thermoplastic resin and a light conversion material;
  • Step 2 Roll setting and cutting of the light conversion diaphragm array: under vacuum conditions, the light conversion diaphragm described in step 1 is passed through the oppositely aligned first rolling device with bump array and recessed
  • the second rolling device of the groove array performs cooperative rolling shaping and cutting to obtain an array of light conversion films composed of a grooved single-piece light conversion film, and each single-block light in the light conversion film array
  • the conversion film has a slit for dividing the single light conversion film between each other;
  • Step 3 Rolling and bonding of the LED package components: rolling and bonding the array of the light conversion film of step 2 and the LED flip chip array with the carrier film under vacuum conditions And flipping the LED flip-chip in the LED flip chip array into the recess of the monolithic light conversion film of the light conversion film array, thereby obtaining an LED package component;
  • the LED flip chip Refers to a single LED flip chip or LED flip chip assembly; wherein the LED flip chip assembly is composed of two or more single LED flip chips;
  • Step 4 curing molding of the LED package component: curing the LED package component under vacuum condition by using a cooling curing method, so that each single light conversion film attached to the LED flip chip array shrinks Naturally wrapped to obtain the finished LED package components.
  • the finished LED package component described in step 4 can be stretched by the stretching machine to stretch the stretchable carrier film, so that the finished LED package component is divided along the slit after stretching, thereby making A finished single LED package component.
  • the implementation principle of the present invention is: In order to better solve the problems existing in the existing LED flip chip packaging process, the present invention skillfully designs a new process for packaging LEDs based on a rolled thermoplastic resin light conversion body. Rolling and sealing original package of the invention The reason lies in that, on the one hand, under the vacuum condition, the roller is rolled to cause plastic flow in the unevenness in the thermoplastic resin light conversion film, and the pores, irregularities or other processing defects which may remain in the light conversion film are eliminated.
  • the rolled thermoplastic resin light conversion film is plastically deformed during processing to form a desired optimized light conversion body luminescence
  • the surface shape such as arc shape, semi-spherical shape and rectangular shape, improves the light extraction efficiency and light uniformity of the LED package component;
  • the invention is a continuous process flow, which is favorable for satisfying the processing conditions of mass production of LED package components and The specifications are the same, which not only improves the production efficiency of the LED package components, but also improves the color consistency of the finished LED package components, and the superior product rate is greatly improved.
  • the process proposed by the present invention is a new standard process for rolling and packaging LEDs, which overcomes the existing casting process, screen printing process, upper and lower plate mold process and single roll swing process.
  • the method proposed by the invention can effectively eliminate the pores, irregularities and other processing defects which may remain in the light conversion film, thereby significantly improving the color consistency of the finished LED package component, and the invention is prepared by the invention.
  • the yield of LED package components is significantly higher than that of existing similar products.
  • the method of cooperative rolling shaping and cutting proposed by the present invention is effective in ensuring that the fluorescent sheet and the LED chip are packaged and then cut in the conventional process.
  • the dimensional consistency of the individual light conversion diaphragms in the array of light conversion diaphragms ensures the superior yield of the finished LED package components; at the same time, the process is simplified and the production efficiency is greatly improved.
  • the fourth is the roll-shaped and shaped optimized light conversion film proposed by the invention, which improves the light-emitting efficiency and light-emitting uniformity of the LED package component.
  • the synergistic shaping and cutting of the array of light-converting diaphragms proposed by the present invention, and the method of laminating and synthesizing the components of the LED package include various specific embodiments, which can not only overcome the deficiencies of the prior art, but also be suitable for supporting Continuous process equipment system and implementation of intelligent control to meet the production requirements of industrial batch packaging LED, not only significantly improve the production efficiency of industrial batch packaging LED, but also greatly improve the color consistency of finished LED package components, can eliminate traditional LED The light splitting process in the packaging process.
  • the process proposed by the invention is widely applicable to the sealing and packaging process of the thermoplastic resin light-converting body and various power-size LED flip-chips, and fully meets the demand for refined production and processing in the industrial batch packaging LED process.
  • FIG. 1 is a schematic block diagram showing a process of a packaged LED based on a roll-type thermoplastic resin light-converting body according to the present invention.
  • FIG. 2 is a schematic view showing a first flow layout structure of a process method for bonding and packaging LEDs based on a roll-type thermoplastic resin light-converting body according to the present invention.
  • FIG. 3 is a schematic view showing the steps of preparing a light conversion film in the schematic diagram of the first flow layout shown in FIG. 2 of the present invention.
  • FIG. 4 is a schematic view showing the process of shaping and cutting the optical conversion film array and the flip-chip bonding type with the LED in the schematic diagram of the first flow layout structure shown in FIG. 2 of the present invention.
  • FIG. 5A is a schematic structural view of a cutting mode 1 in the shaping and cutting of the optical conversion film array in the first flow layout structure diagram of FIG. 2 according to the present invention.
  • FIG. 5B is a schematic structural view of the cutting mode 2 in the shaping and cutting of the optical conversion film array in the first flow layout structure diagram of FIG. 2 according to the present invention.
  • FIG. 6 is a schematic view showing a second flow layout structure of a process method for bonding and packaging LEDs based on a roll-type thermoplastic resin optical converter according to the present invention.
  • FIG. 7 is a schematic view showing the process of shaping and cutting the optical conversion film array and the flip-chip bonding type with the LED in the second flow layout structure diagram shown in FIG. 6 of the present invention.
  • FIG. 8 is a schematic flow chart showing a third process flow of a method for bonding and packaging LEDs based on a roll-type thermoplastic resin light-converting body according to the present invention.
  • FIG. 9 is a schematic view showing the process of shaping and cutting the optical conversion film array and the flip-chip bonding type with the LED in the schematic diagram of the third flow layout shown in FIG. 8 .
  • FIG. 10 is a schematic view showing a fourth flow layout structure of a method for bonding and packaging LEDs based on a roll-type thermoplastic resin optical converter according to the present invention.
  • FIG. 11A is a schematic view showing the process of shaping and cutting the optical conversion film array in the fourth flow layout structure diagram shown in FIG. 10 of the present invention.
  • FIG. 11B is a schematic view showing the process of forming and cutting the light conversion diaphragm array and the LED flip chip after forming and cutting according to the fourth flow layout structure diagram shown in FIG. 10 .
  • 12A is a schematic plan view showing the structure of a finished LED package component produced by the present invention.
  • 12B is a schematic plan view showing the planar structure of a finished single LED package component obtained by stretching according to the present invention.
  • 13A is a curved LED package component produced by the present invention, wherein 13A-1 is a left view, 13A-2 is a right view, 13A-3 is a bottom view, and 13A-4 is a perspective view.
  • 13B is a semi-circular LED package component produced by the present invention, wherein 13B-1 is a left view, 13B-2 is a right view, 13B-3 is a bottom view, and 13B-4 is a perspective view.
  • 13C is a rectangular LED package component produced by the present invention, wherein 13C-1 is a left view, 13C-2 is a right view, 13C-3 is a bottom view, and 13C-4 is a perspective view.
  • Embodiment 1 Referring to FIG. 1 , FIG. 2 , FIG. 8 and FIG. 10 , a method for bonding a packaged LED based on a roll-type thermoplastic resin light-converting body according to the present invention, which comprises at least a light conversion diaphragm
  • the basic steps of the preparation, the roll forming and cutting of the light conversion diaphragm array, the roll bonding synthesis of the LED package component, and the flow molding process of the LED package component are as follows:
  • Step 1 preparation of the light conversion film: obtaining a light conversion film composed of at least a thermoplastic resin and a light conversion material;
  • Step 2 Roll setting and cutting of the light conversion diaphragm array: under vacuum conditions, the light conversion diaphragm described in step 1 is passed through the oppositely aligned first rolling device with bump array and recessed
  • the second rolling device of the groove array performs cooperative rolling shaping and cutting to obtain an array of light conversion films composed of a grooved single-piece light conversion film, and each single-block light in the light conversion film array
  • the conversion film has a slit for dividing the single light conversion film between each other;
  • Step 3 Rolling and bonding of the LED package components: rolling and bonding the array of the light conversion film of step 2 and the LED flip chip array with the carrier film under vacuum conditions And flipping the LED flip-chip in the LED flip chip array into the recess of the monolithic light conversion film of the light conversion film array, thereby obtaining an LED package component;
  • the LED flip chip Refers to a single LED flip chip or LED flip chip assembly; wherein the LED flip chip assembly is composed of two or more single LED flip chips;
  • Step 4 curing molding of the LED package component: curing the LED package component under vacuum condition by using a cooling curing method, so that each single light conversion film attached to the LED flip chip array shrinks Naturally wrapped to obtain the finished LED package components.
  • the invention is applicable to the production and processing of optoelectronic devices or electronic devices similar to LED flip chip structures.
  • thermoplastic resins having high light transmittance and high temperature resistance can be selected for use in the process of the present invention.
  • the present invention preferably employs a heat distortion temperature at A thermoplastic resin in the range of 120 to 250 ° C; existing quantum dot phosphors and phosphors can be selected for use in the process of the present invention.
  • the mixed slurry used in the present invention does not need to include an adhesive; when it is selected to use the finished LED package component under extreme conditions, it is necessary to further enhance the adhesion between the light conversion body and the LED flip chip.
  • the binder used in the present invention may include a binder.
  • the preparation of the light conversion film of step 1 means that the mixed slurry including at least the thermoplastic resin and the light conversion material is rolled by a smooth double roll under vacuum heating to obtain a light conversion film;
  • the mixed slurry is rolled by a smooth double roll to obtain a light conversion film, which means that the mixed slurry is first roll-formed by a first smooth double-roll rolling press to obtain a crude light conversion film.
  • the formed crude light conversion film is rolled and formed by a second smooth double-roll rolling press to obtain a purified light conversion film; the thickness of the crude light conversion film is 850 ⁇ m.
  • the thickness of the purified light conversion film is 800 ⁇ m or less; the mixed slurry is rolled by a smooth double roll to obtain a light conversion film, which means that the mixed slurry is passed through three or more groups. Two-roll roll forming to obtain a refined light conversion film; the thickness of the refined light conversion film is 200 ⁇ m; the material of the mixed slurry A binder may also be included in the texture. See Figure 3.
  • thermoplastic resin selected in the step 1 has a melting temperature of 180 to 320 ° C; and the optimum thermoplastic resin has a melting temperature of 240 to 280 ° C.
  • the temperature of the mixed slurry in the step 1 is 180 to 320 ° C; the temperature of the optimum mixed slurry is 240 to 280 ° C.
  • the light conversion material in the step 1 is a quantum dot phosphor, and the light conversion film is a quantum dot phosphor film.
  • the light conversion material in the step 1 is a phosphor, and the light conversion film is a phosphor film.
  • step 2 the first rolling device with the bump array and the second rolling device with the groove array are cooperatively roll-shaped and cut, which means that the convexity is aligned by the opposite direction.
  • the first rolling device of the block array and the second rolling device with the groove array perform simultaneous roll setting and cutting, that is, the rolling setting and the rolling cutting are performed simultaneously, and the two functions are realized at one time.
  • the simultaneous rolling shaping and cutting by the first rolling device with the bump array and the second rolling device with the groove array in step 2 means that the light conversion film is passed through Forming rolling with a first rolling device having an array of bumps and a second rolling device having an array of grooves, thereby obtaining an array of light conversion diaphragms composed of a single monolithic light conversion diaphragm; And a knife edge is formed on the outer circumference of the bump of the bump array or/and the outer edge of the groove of the groove array, and the light conversion film is formed into a slit by rolling and shaping. Cutting, thereby forming a slit for dividing the monolithic light conversion film.
  • the simultaneous rolling shaping and cutting by the first rolling device with the bump array and the second rolling device with the groove array in step 2 means that the light conversion film is passed through Two-roll rolling devices with a bump array and a groove array, respectively, are simultaneously roll-formed and cut; the first rolling device with a bump array has bumps in the two-roll rolling device a first single roller of the array, the second rolling device with an array of grooves being a second single roller with an array of grooves in the two-roll rolling device; the first with a bump array A knife edge is provided on the outer circumference of the bump of a single roller or on the outer edge of the groove of the second single roller of the groove array. See Figures 5A and 5B.
  • Step 2 simultaneous rolling shaping and cutting by a first rolling device with a bump array and a second rolling device with a groove array, which means that the light conversion film is passed through The first single roller of the bump array and the second planar conveyor with the array of grooves simultaneously perform roll shaping and cutting; wherein: the first rolling device with the array of bumps has a bump array a first single roller, the second rolling device with an array of grooves is a second planar conveying device with an array of grooves; the outer periphery of the bump of the first single roller with the array of bumps Or the edge of the groove of the second planar conveying device with the groove array is provided with a knife edge.
  • Step 2 simultaneous rolling shaping and cutting by a first rolling device with a bump array and a second rolling device with a groove array, which means that the light conversion film is passed through The first planar transfer device of the bump array and the second single roller with the groove array are simultaneously roll-formed and cut; wherein: the first rolling device with the bump array is a bump array a first planar transfer device, the second rolling device with an array of grooves is a second single roller with an array of grooves; the outer periphery of the bump of the first planar transfer device with the array of bumps Or the edge of the groove of the second single roller of the grooved array is provided with a knife edge.
  • the single-piece light-converting diaphragm in the light-converting diaphragm array composed of the grooved monolithic light conversion diaphragm has an outer shape of an arc shape, a semi-spherical shape or a rectangular shape.
  • the temperature for performing cooperative roll forming and cutting in step 2 is 120 to 250 °C.
  • the temperature for cooperative roll setting and cutting as described in step 2 is preferably 120 ° C; if the thermoplastic resin is modified polymethyl methacrylate (M-PMMA) The temperature for performing cooperative roll setting and cutting as described in step 2 is preferably 200 ° C; if the thermoplastic resin is modified polycarbonate (M-PC), the temperature optimization of the cooperative roll setting and cutting is carried out in step 2. 250 ° C;
  • the depth of the slit in the step 2 is 50 to 100% of the thickness of the purified light conversion film; the depth of the optimum slit is 70 to 80% of the thickness of the purified light conversion film.
  • the width of the slit in step 2 is within 20 ⁇ m.
  • the width of the edge of the edge provided on the outer circumference of the projection or the outer edge of the groove in the roll forming and cutting according to the present invention determines the slit width in step 2, preferably 15 ⁇ m.
  • the length, width and height of the groove in the array of light conversion diaphragms composed of the grooved monolithic light conversion diaphragm are as follows:
  • the LED flip chip has a length, a width, and a high size of 1.01 to 1.05 times.
  • the length, width and height of the grooves in the array of light conversion diaphragms composed of the grooved monolithic light conversion diaphragm of the present invention depend on the shrinkage rate of the selected thermoplastic resin, preferably LED flip chip 1.02 times longer, wider and taller.
  • the step of the rolling bonding means that the array of the light conversion diaphragms is disposed on the fourth single roller with the groove array or the fourth planar conveying device with the groove array, and the carrier film is provided.
  • the LED flip chip array of the chip is disposed on a third single roller having a smooth surface or a third planar transfer device having a smooth surface, thereby causing the LED flip chip array to be LED flip chip is fitted into a recess of a single light conversion diaphragm embedded in the array of light conversion diaphragms to obtain an LED package component; a device for placing an array of light conversion diaphragms and a device for placing an LED flip chip array At least one of them is a single roller.
  • step 3 the temperature of the rolling bonding is 120 to 250 ° C; and the optimum rolling bonding temperature is 180 to 220 ° C.
  • the carrier film in the LED flip chip array with the carrier film of step 3 is a stretchable carrier film.
  • the material of the stretchable carrier film of step 3 is one of high temperature resistant polyester or polydimethylsiloxane or polyvinyl chloride.
  • the cooling and solidifying method in the step 4 is a gradient cooling curing method or a uniform cooling curing method; wherein:
  • the temperature gradient of the gradient cooling curing method means that the temperature of the LED package component is cooled to room temperature along a plurality of gradients, and the temperature curing time is 3 to 10 minutes, and the time of each cooling and curing phase is adjustable;
  • the method for uniformly cooling and solidifying refers to uniformly lowering the temperature of the LED package component to room temperature, and cooling and curing for 3 to 10 minutes.
  • the light conversion diaphragm When the light conversion diaphragm is simultaneously roll-cut by a first single roller with a bump array and a second single roller with an array of grooves, and passes through a second single roller with an array of grooves
  • the process of rolling and packaging the LEDs with the third single roller of the smooth surface of the LED flip-chip array with the carrier film is shown in FIG. 4, and the process flow layout is shown in FIG. 2.
  • the fourth single roller with the array of grooves and the second single roller with the array of grooves are the same device.
  • the finished LED package component described in step 4 can be stretched and stretched by the stretching machine through the stretching machine, so that the finished LED package component is divided along the slit after stretching. Thereby, a finished single LED package component is obtained.
  • a finished single LED package component is obtained. Referring to Figures 12A and 12B; the resulting shape of the finished single LED package component is shown in Figures 13A, 13B and 13C.
  • the invention discloses a process method for bonding and packaging LEDs based on a rolling type thermoplastic resin light-converting body, which is widely applicable to a bonding and packaging process of a thermoplastic resin optical converter and various power-sized LED flip chips.
  • Embodiment 2 An equipment system for coating and packaging LEDs based on a roll-type thermoplastic resin light-converting body according to the present invention, which comprises rolling and shaping a light conversion film to form a light conversion film Collaborative roll shaping and cutting apparatus for an array and a roll bonding apparatus for pressing the array of light conversion diaphragms with an LED flip chip array; the synergistic roll shaping and cutting apparatus and the rolling The bonding device sequentially constitutes a coordinated process equipment; wherein: the cooperative rolling shaping and cutting device comprises a first rolling device with a bump array and a second rolling with a groove array arranged in opposite directions Device; said rolling fit a fourth rolling device having an array of grooves and a third rolling device having a rolling surface; wherein:
  • a knife edge is formed on the outer circumference of the bump of the bump array of the first rolling device or the outer edge of the groove of the groove array of the second rolling device in the cooperative rolling shaping and cutting device; 5A, shown in Figure 5B.
  • the first rolling device with a bump array is a first single roller with a bump array or a first planar conveyor with a bump array; the second rolling with a groove array
  • the device is a second single roller with a grooved array or a second planar conveyor with a grooved array; the first rolling device with a bump array and a second rolling device with an array of grooves At least one is a single roller.
  • the groove shape of the groove array in the second single roller or the grooved array of the second planar transfer device is arcuate, semi-spherical or rectangular.
  • the shape of the bump of the bump array is the same as the shape of the flip chip, and the bump length, width, and height are They are 1.01 to 1.05 times the length, width and height of the flip chip.
  • the fourth rolling device with the groove array in the rolling bonding device is a fourth single roller with a groove array or a fourth planar conveying device with a groove array;
  • the third rolling device in the rolling bonding device is a third single roller of a smooth surface or a third planar conveying device of a smooth surface; at least one of the fourth rolling device and the third rolling device One is a single roller;
  • the groove shape of the groove array in the fourth single roll or fourth plane transfer device is the same as the groove shape of the groove array in the second single roll or second plane transfer device.
  • the second rolling device in the cooperative roll forming and cutting device and the fourth rolling device in the rolling bonding device are the same device having a dual function.
  • the first rolling device is a first single roller with a bump array
  • the second rolling device is a second single roller with a groove array
  • the third rolling device is a smooth third single roller.
  • the fourth rolling device is a second single roller with a grooved array, see FIG. 4; in this example, a fourth single roller with an array of grooves and a first with a groove array
  • the two single rollers are the same device.
  • the first rolling device is a first single roller with a bump array
  • the second rolling device is a second single roller with a groove array
  • the third rolling device is a smooth third single roller.
  • the fourth rolling device is the fourth single roller with the groove array, see FIG.
  • the first rolling device is a first single roller with a bump array
  • the second rolling device is a second planar conveying device with a groove array
  • the third rolling device is a smooth third single roller.
  • the fourth rolling device is a second planar conveyor with a grooved array, see Figure 9; in this example, a fourth planar conveyor with a groove array and a second plane with a groove array
  • the transfer device is the same device.
  • the first rolling device is the first single roller of the bump array
  • the second rolling device is the second single roller with the groove array
  • the third rolling device is the smooth third sliding roller
  • the four rolling device is the fourth planar transfer device of the groove array, see Figs. 11A and 11B.
  • the flat conveyor is a device that supports a planar conveyor belt by two or more rollers and drives forward, wherein at least one of the rollers is driven by the motor.
  • the equipment system further includes a temperature-lowering curing device for producing a finished LED package component; the temperature-lowering curing device is a process equipment located at a rear end of the rolling bonding device.
  • the equipment system further includes a temperature-lowering curing device for producing a finished LED package component; the temperature-lowering curing device is a process equipment located at a rear end of the rolling bonding device.
  • the temperature-lowering curing device is a tunnel type multi-temperature zone device including a temperature regulating component and a conveyor channel.
  • the equipment system further includes a two-roll rolling press device for preparing a light conversion diaphragm; the two-roll rolling press device is a process device located at a front end of the cooperative rolling shaping and cutting device;
  • the two-roll rolling press device comprises a first smooth double-roll rolling press, and the first smooth double-roll rolling press comprises a rolling surface which is oppositely aligned and rolled into a smooth surface.
  • the single roller A1 and the smooth surface of the rolling surface are the smooth single roller A2.
  • the two-roll rolling press device further includes a second smooth double-roll rolling press machine, wherein the second smooth double-roll rolling press comprises a light having a rolling surface that is oppositely aligned and rolled.
  • the surface single roller B1 and the smooth surface single roller B2 whose rolling surface is a smooth surface; see FIG.
  • the double roll spacing of the A double roll rolling press is 850 ⁇ m or less; the double roll pitch of the B double roll rolling press is 800 ⁇ m or less.
  • the equipment system further includes a melt blending apparatus for mixing at least a thermoplastic resin and a light converting material, the melt blending apparatus being a process equipment located at a front end of the twin roll rolling press.
  • the melt blending device, the two-roll rolling press device, the cooperative rolling setting and cutting device, the rolling bonding device and the cooling and curing device are sequentially coordinated to form a continuous process equipment of a flow type. See Figure 2, Figure 6, Figure 8, and Figure 10.
  • the invention relates to an equipment system based on a rolling type thermoplastic resin phosphor-bonded package LED, which is widely applicable to various new processes of various thermoplastic resin light conversion bodies and various power LED flip chip bonding packages.
  • the invention has been verified by trial and error and has achieved satisfactory trial results.

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Abstract

一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，包括至少由光转换膜片的准备、光转换膜片阵列的定形和裁切、LED封装体元件的滚压贴合成型和LED封装体元件的固化成型工序构建的流程式连续工艺。具有连续滚压贴合封装LED的显著优点，能够满足热塑性树脂光转换体贴合封装LED的条件需要，提高工业化批量LED封装的生产效率和优品率。

Description

一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法 技术领域
本发明属于光转换体封装LED技术领域，特别是涉及一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法。
背景技术
LED具有高亮度、低热量、长寿命、环保、可再生利用等优点，被称为21世纪最有发展前景的新一代绿色照明光源。目前，虽然LED的理论寿命可以达到100000小时以上，然而在实际使用中，因为受到芯片失效、封装失效、热过应力失效、电过应力失效或/和装配失效等多种因素的制约，其中以封装失效尤为突出，而使得LED过早地出现光衰或光失效的现象，这将阻碍LED作为新型节能型照明光源的前进步伐。为了解决这些问题，业界许多学者已开展了相关研究，并且提出了一些能够提高LED光效和实际使用寿命的改进措施。如近几年新发展起来的倒装LED与传统的正装LED相比，具有高光效、高可靠性和易于集成的优点，并且封装材料大幅简化，如传统正装LED封装的金线、固晶胶、支架等材料都不再需要；封装工艺流程也大幅简化，如传统正装LED封装工艺的固晶、焊线，甚至是分光等都不再需要，使得倒装LED得到越来越广泛的应用；但同时也要看到，现有倒装LED封装技术大多采用的是有机硅树脂类的光转换体与倒装LED芯片贴合的流延工艺、丝网印刷工艺、上下平板模工艺、单辊摆压工艺等，这些工艺及其相配套的封装装备均不能很好地解决有机硅树脂类光转换体存在的气孔、厚薄不均等瑕疵，造成光转换体封装LED的良品率低；同时还因生产效率低，使得产品成本居高不下。
中国专利申请201010204860.9公开了“一种倒装LED芯片的封装方法”，其步骤包括：(a)通过丝网印刷把光转换体涂覆于LED芯片表面，并对光转换体进行烘烤固化；(b)把LED芯片固定在芯片基板上，使LED芯片电极与芯片基板电极键合；(c)把LED芯片和芯片基板固定在支架反射杯的杯底；(d)利用导线将已固定的芯片基板的正负电极分别与支架的正负电极连接；(e)将封模或透镜盖在固定有LED芯片和芯片基板的支架上，并充满硅胶；(f)整体结构进行烘烤固化。该方法虽然通过丝网印刷工艺来提高光转换体涂覆厚度的均匀性，提高荧光粉颗粒分布的均匀性，以达到提高良品率的目的；但还存在以下明显不足：一是丝网印刷把有机硅树脂类的光转换体涂覆于LED芯片表面，之后在烘烤固化过程中因受热过应力影响，还是会导致光转换体涂层与LED芯片的涂覆面层局部产生气泡而形成凹凸不平的瑕疵；二是将封模或透镜盖充满硅胶与涂覆有光转换体的LED芯片封装，之后整体结构进行烘烤固化过程中因受热过应力影响，还是会导致封模或透镜盖中的硅胶面层局部产生气泡而形成凹凸不平的瑕疵。因不能解决LED芯片封装过程中受热过应力的影响，必然会导致LED光效下降；三是整个LED芯片封装工艺未配备智能控制***进行控制，直接影响良品率的提升。
中国专利申请201310270747.4公开了“被覆有光转换体层的LED、其制造方法以及LED装置”，该方案包括：LED配置工序，在支撑片的厚度方向的一个面上配置LED；层配置工序，以被覆LED的方式在支撑片的厚度方向的一个面上配置光转换体层，所述光转换体层由含有通过活性能量射线的照射而固化的活性能量射线固化性树脂以及光转换体的荧光树脂组合物形成；固化工序，对光转换体层照射活性能量射线，使光转换体层固化；裁切工序，与LED对应地裁切光转换体层，从而得到具备LED、和被覆LED的光转换体层的被覆有光转换体层的LED；以及LED剥离工序，在裁切工序之后，将被覆有光转换体层的LED从支撑片剥离。该方法的目的在于提供光转换体均匀配置在LED的周围以防损伤，从而得到被覆有光转换体层的LED、以及具备该被覆有光转换体层的LED的LED装置；但还存在以下明显不足：一是光转换体的荧光树脂组合物在固化过程中，因受热过应力影响，还是会导致光转换体面层的局部产生气泡而形成凹凸不平的瑕疵；二是覆有光转换体层的LED，仍然会受到热过应力影响，导致LED使用中出现光效下降；三是整个封装工艺中的工序比较 繁琐，封装LED的生产效率不高；四是上下平板模工艺，会导致倒装芯片发生位移，且又无智能控制***进行精确控制，必然造成良品率降低。
中国专利申请：201380027218.X公开了“树脂片材层合体及使用其的半导体发光元件的制造方法”，该方案所述树脂片材层合体是在基材上设置有含荧光体树脂层，所述含荧光体树脂层具有多个区块，基材具有长度方向和宽度方向，所述多个区块在长度方向上重复配置成列。虽然该方案的发明目的在于，通过所述树脂片材层合体，提高贴附有含荧光体树脂层的半导体发光元件的颜色和亮度的均匀性、制造的容易性、设计的自由度等，但还存在以下明显不足：一是采用的荧光体树脂片材为固化的荧光体树脂片材，将无法有效消除其中可能残留的气孔、凹凸不平或其它加工瑕疵等；二是在粘接工序中，将加压工具自半导体发光元件侧向进行加压，将会损伤半导体发光元件；三是采用荧光体树脂层中含粘接剂粘接工艺，较难清除被粘接后的半导体发光元件中的残留物，粘接过程易产生气孔，会造成良品率降低，同时，粘接层的存在还降低了LED元件的出光效率；四是与半导体发光元件的发光面粘接的荧光体树脂片材的基材没有被剥离，合直接影响半导体发光元件的光效；五是荧光体树脂层以多个区块在长度方向上重复配置成列的方式呈现，然而实现该荧光体树脂层的多个区块配置，实际操作程序繁琐，将影响整个元件的封装效率，多个块区在位置上的布置差错会直接影响后续与发光元件之间的贴合的精确度，而多个区块之间在大小与厚度方面如果再不满足一致性的要求，则可能会导致严重的产品一致性问题。
综上所述，如何克服现有技术所存在的不足已成为当今于光转换体封装LED技术领域中亟待解决的重大难题之一。
发明内容
本发明的目的是为克服现有技术的不足而提供一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，本发明具有连续滚压贴合封装LED的显著优点，能够满足热塑性树脂光转换体贴合封装LED的条件需要，提高工业化批量LED封装的生产效率和优品率。
根据本发明提出的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，它包括至少由光转换膜片的准备、光转换膜片阵列的滚压定形和裁切、LED封装体元件的滚压贴合成型和LED封装体元件的固化成型工序构建的流程式连续工艺，其基本步骤包括如下：
步骤1，光转换膜片的准备：获取至少包括热塑性树脂和光转换材料所组成的光转换膜片；
步骤2，光转换膜片阵列的滚压定形和裁切：在真空条件下，将步骤1所述的光转换膜片通过相向对准的带有凸块阵列的第一滚压装置与带有凹槽阵列的第二滚压装置，进行协同滚压定形和裁切，得到由带凹槽的单块光转换膜片所组成的光转换膜片阵列，该光转换膜片阵列中的各单块光转换膜片相互之间带有用于分割单块光转换膜片的切缝；
步骤3，LED封装体元件的滚压贴合成型：在真空条件下，将步骤2所述光转换膜片阵列与带有载体膜片的LED倒装芯片阵列进行相向对准的滚压贴合，使所述LED倒装芯片阵列中的LED倒装芯片贴合嵌入所述光转换膜片阵列的单块光转换膜片的凹槽中，从而得到LED封装体元件；所述LED倒装芯片是指单个LED倒装芯片或LED倒装芯片组件；其中，所述LED倒装芯片组件由两个或两个以上的单个LED倒装芯片组合而成；
步骤4，LED封装体元件的固化成型：在真空条件下，采用降温固化方式，将所述LED封装体元件进行固化，使得贴合在LED倒装芯片阵列上的各单块光转换膜片收缩而自然包裹，从而得到成品LED封装体元件。
根据需要，可将步骤4所述成品LED封装体元件，再通过拉伸机对其可拉伸载体膜片进行拉伸，使得成品LED封装体元件在拉伸后即沿切缝分割，从而制得成品单颗LED封装体元件。
本发明的实现原理是：为了更好地解决现有LED倒装芯片封装工艺中所存在的问题，本发明巧妙地设计了基于滚压式的热塑性树脂光转换体贴合封装LED的新工艺。本发明的滚压贴合封装原 理在于：一方面，在真空条件下，利用辊轮滚压使热塑性树脂光转换膜片中的凹凸不平之处产生塑性流动，消除光转换膜片中可能残留的气孔、凹凸不平或其他加工瑕疵等，从而得到无气孔、平整以及厚度均匀的精制光转换膜片；另一方面，被滚压的热塑树脂光转换膜片在加工中可塑性变形，形成所需的最优化的光转换体发光面形状，如弧形、半圆球形和矩形等，提高了LED封装体元件的出光效率和出光均匀性；再者本发明为连续化工艺流程，有利于满足批量生产LED封装体元件的加工条件和规格尺寸完全一致，不仅提高了LED封装体元件的生产效率，同时提高了成品LED封装体元件的光色一致性，优品率大幅提升。
本发明与现有技术相比其显著的优点在于：
一是本发明提出的工艺方法是一种滚压贴合封装LED的新制式工艺，它克服了现有流延工艺、丝网印刷工艺、上下平板模工艺和单辊摆压工艺等老制式工艺所存在的贴合封装LED的出光效率、优品率和生产效率明显不足的问题；本发明能够满足热塑性树脂光转换体贴合封装LED的流程式连续工艺的需要，从而提高工业化批量LED封装的生产效率和优品率。
二是本发明提出的工艺方法能够有效的消除光转换膜片中可能残留的气孔、凹凸不平以及其它加工瑕疵等，从而显著地提高成品LED封装体元件的光色一致性，本发明制得的LED封装体元件的优品率比现有同类产品有明显提高。
三是本发明提出的协同滚压定形和裁切的方式，即滚压定形与裁切同时进行，与传统工艺中将荧光片与LED芯片封装后再进行裁切的工序相比，既有效地保证了光转换膜片阵列中单个光转换膜片的尺寸一致性，从而保证了成品LED封装体元件的优品率；同时又简化了工艺过程，大大提高了生产效率。
四是本发明提出的经滚压定形的优形化光转换膜片，提高了LED封装体元件的出光效率和出光均匀性。
五是本发明提出的光转换膜片阵列的协同定形和裁切、LED封装体元件的贴合成型工艺方法包括了多种具体实施方案，不仅能够克服现有工艺技术的不足，而且还适于配套连续化工艺装备***及实施智能控制，以满足工业化批量封装LED的生产要求，既显著提高工业化批量封装LED的生产效率，又使得成品LED封装体元件的光色一致性大幅提升，可革除传统LED封装工艺中分光工艺。
六是本发明提出的工艺方法广泛适用于热塑性树脂光转换体与各种功率大小LED倒装芯片的贴合封装工艺，完全满足工业化批量封装LED过程中对产品生产加工实施精细化的需求。
附图说明
图1为本发明提出的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法的流程方框示意图。
图2为本发明提出的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法的第一种流程布局结构示意图。
图3为本发明图2所示第一种流程布局结构示意图中光转换膜片的准备的工序示意图。
图4为本发明图2所示第一种流程布局结构示意图中光转换膜片阵列的定形和裁切以及与LED倒装芯片贴合成型的工序示意图。
图5A为本发明图2所示第一种流程布局结构示意图中光转换膜片阵列的定形和裁切中的裁切方式1的结构示意图。
图5B为本发明图2所示第一种流程布局结构示意图中光转换膜片阵列的定形和裁切中的裁切方式2的结构示意图。
图6为本发明提出的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法的第二种流程布局结构示意图。
图7为本发明图6所示第二种流程布局结构示意图中光转换膜片阵列的定形和裁切以及与LED倒装芯片贴合成型的工序示意图。
图8为本发明提出的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法的第三种流程布局流程示意图。
图9为本发明图8所示第三种流程布局流程示意图中光转换膜片阵列的定形和裁切以及与LED倒装芯片贴合成型的工序示意图。
图10为本发明提出的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法的第四种流程布局结构示意图。
图11A为本发明图10所示第四种流程布局结构示意图中光转换膜片阵列的定形和裁切的工序示意图。
图11B为本发明图10所示第四种流程布局结构示意图中定形和裁切后的光转换膜片阵列与LED倒装芯片贴合成型的工序示意图。
图12A为本发明制得的成品LED封装体元件的平面结构示意图。
图12B为本发明拉伸制得的成品单颗LED封装体元件的平面结构示意图。
图13A为本发明制得的弧形LED封装体元件，其中13A-1为左视图，13A-2为右视图，13A-3为仰视图，13A-4为立体图。
图13B为本发明制得的半圆形LED封装体元件，其中13B-1为左视图，13B-2为右视图，13B-3为仰视图，13B-4为立体图。
图13C为本发明制得的矩形LED封装体元件,其中13C-1为左视图，13C-2为右视图，13C-3为仰视图，13C-4为立体图。
本发明附图中的编号说明如下：
1-1 熔融共混装置；
2-1 第一光面双辊滚压压合机的光面单辊轮A1。
2-2 第一光面双辊滚压压合机的光面单辊轮A2。
2-3 第二光面双辊滚压压合机的光面单辊轮B1。
2-4 第二光面双辊滚压压合机的光面单辊轮B2。
2-5 混合浆料。
2-6 粗制光转换膜片。
2-7 精制光转换膜片。
3-1 带有凸块阵列的第一单辊轮。
3-2 带有凹槽阵列的第二单辊轮。
3-3 光面的第三单辊轮。
3-4 带有凹槽阵列的第四单辊轮。
3-5 带有凹槽阵列的第二平面传送装置。
3-6 带有凹槽阵列的第四平面传送装置。
4-1 第一单辊轮上的凸块。
4-2 第二单辊轮上的凹槽。
4-3 凸块外周刀口。
4-4 带有凹槽的单块光转换膜片。
4-5 LED倒装芯片。
4-6 载体膜片。
4-7 LED封装体元件。
4-8 凹槽外沿刀口。
4-9 第四单辊轮上的凹槽。
5 固化装置。
6-1 LED倒装芯片缓冲辊。
6-2 第一缓冲辊轮。
6-3 第二缓冲辊轮。
7 收卷辊。
具体实施方式
下面将结合附图和实施例对本发明的具体实施方式作进一步的详细说明。
实施例1：参见图1、图2、图8和图10所示，本发明提出的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，它包括至少由光转换膜片的准备、光转换膜片阵列的滚压定形和裁切、LED封装体元件的滚压贴合成型和LED封装体元件的固化成型工序构建的流程式连续工艺，其基本步骤包括如下：
步骤1，光转换膜片的准备：获取至少包括热塑性树脂和光转换材料所组成的光转换膜片；
步骤2，光转换膜片阵列的滚压定形和裁切：在真空条件下，将步骤1所述的光转换膜片通过相向对准的带有凸块阵列的第一滚压装置与带有凹槽阵列的第二滚压装置，进行协同滚压定形和裁切，得到由带凹槽的单块光转换膜片所组成的光转换膜片阵列，该光转换膜片阵列中的各单块光转换膜片相互之间带有用于分割单块光转换膜片的切缝；
步骤3，LED封装体元件的滚压贴合成型：在真空条件下，将步骤2所述光转换膜片阵列与带有载体膜片的LED倒装芯片阵列进行相向对准的滚压贴合，使所述LED倒装芯片阵列中的LED倒装芯片贴合嵌入所述光转换膜片阵列的单块光转换膜片的凹槽中，从而得到LED封装体元件；所述LED倒装芯片是指单个LED倒装芯片或LED倒装芯片组件；其中，所述LED倒装芯片组件由两个或两个以上的单个LED倒装芯片组合而成；
步骤4，LED封装体元件的固化成型：在真空条件下，采用降温固化方式，将所述LED封装体元件进行固化，使得贴合在LED倒装芯片阵列上的各单块光转换膜片收缩而自然包裹，从而得到成品LED封装体元件。
特别需要说明的是：
本发明适用于对与LED倒装芯片结构类同的光电器件或电子器件的生产和加工。
凡透光率高、耐温性好的现有热塑性树脂均可选择用于本发明的工艺方法，为了满足普通LED封装体元件在使用时的回流焊温度条件，本发明优选采用热变形温度在120～250℃范围内的热塑性树脂；现有量子点荧光体、荧光粉均可选择用于本发明的工艺方法。
通常情况下，本发明采用的混合浆料中不需要包括粘接剂；当选择在极端条件下使用成品LED封装体元件，需要进一步增强光转换体与LED倒装芯片之间的粘接力时，本发明采用的混合浆料中可以包括粘接剂。
本发明提出的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法的进一步优选方案如下：
步骤1所述光转换膜片的准备，是指在真空加热的条件下，将至少包括热塑性树脂和光转换材料的混合浆料通过光面双辊滚压，从而得到光转换膜片；其中：所述混合浆料通过光面双辊滚压，从而制得光转换膜片，是指首先将混合浆料通过第一光面双辊滚压压合机滚压成型，制得粗制光转换膜片；然后再将成型后的粗制光转换膜片通过第二光面双辊滚压压合机滚压成型，制得精制光转换膜片；所述粗制光转换膜片的厚度为850μm以内；精制光转换膜片的厚度为800μm以内；所述混合浆料通过光面双辊滚压，从而制得光转换膜片，是指将所述混合浆料通过三组或三组以上的双辊滚压成型，制得精制的光转换膜片；该精制光转换膜片的厚度为200μm以内；所述混合浆料的材 质中还可包括粘接剂。参见图3所示。
步骤1所选择的热塑性树脂的熔融温度为180～320℃；最佳热塑性树脂的熔融温度为240～280℃。
步骤1所述混合浆料的温度为180～320℃；最佳混合浆料的温度为240～280℃。
步骤1所述光转换材料为量子点荧光体，所述光转换膜片为量子点荧光体膜片。
步骤1所述光转换材料为荧光粉，所述光转换膜片为荧光体膜片。
步骤2所述通过相向对准的带有凸块阵列的第一滚压装置与带有凹槽阵列的第二滚压装置进行协同滚压定形和裁切，是指通过相向对准的带有凸块阵列的第一滚压装置与带有凹槽阵列的第二滚压装置进行同时滚压定形和裁切，即滚压定形与滚压裁切同时进行，两个功能一次实现。
步骤2所述通过相向对准的带有凸块阵列的第一滚压装置与带有凹槽阵列的第二滚压装置进行同时滚压定形和裁切，是指将所述光转换膜片通过带有凸块阵列的第一滚压装置与带有凹槽阵列的第二滚压装置进行定形滚压，从而得到由带凹槽的单块光转换膜片所组成的光转换膜片阵列；且所述凸块阵列的凸块外周上或/和所述凹槽阵列的凹槽外沿上设有刀口，在滚压定形的同时对所述光转换膜片进行形成切缝的滚压裁切，从而形成用于分割所述单块光转换膜片的切缝。
步骤2所述通过相向对准的带有凸块阵列的第一滚压装置与带有凹槽阵列的第二滚压装置进行同时滚压定形和裁切，是指将所述光转换膜片通过分别带有凸块阵列和凹槽阵列的双辊滚压装置同时进行滚压定形和裁切；所述带有凸块阵列的第一滚压装置为所述双辊滚压装置中带有凸块阵列的第一单辊轮，所述带有凹槽阵列的第二滚压装置为所述双辊滚压装置中带有凹槽阵列的第二单辊轮；所述带凸块阵列的第一单辊轮的凸块外周上或者所述带凹槽阵列的第二单辊轮的凹槽外沿上设有刀口。参见图5A和图5B所示。
步骤2通过相向对准的带有凸块阵列的第一滚压装置与带有凹槽阵列的第二滚压装置进行同时滚压定形和裁切，是指将所述光转换膜片通过带有凸块阵列的第一单辊轮和带有凹槽阵列的第二平面传送装置同时进行滚压定形和裁切；其中：所述带有凸块阵列的第一滚压装置为带有凸块阵列的第一单辊轮，所述带有凹槽阵列的第二滚压装置为带有凹槽阵列的第二平面传送装置；所述带凸块阵列的第一单辊轮的凸块外周上或者所述带凹槽阵列的第二平面传送装置的凹槽外沿上设有刀口。
步骤2通过相向对准的带有凸块阵列的第一滚压装置与带有凹槽阵列的第二滚压装置进行同时滚压定形和裁切，是指将所述光转换膜片通过带有凸块阵列的第一平面传送装置和带有凹槽阵列的第二单辊轮同时进行滚压定形和裁切；其中：所述带有凸块阵列的第一滚压装置为带有凸块阵列的第一平面传送装置，所述带有凹槽阵列的第二滚压装置为带有凹槽阵列的第二单辊轮；所述带凸块阵列的第一平面传送装置的凸块外周上或者所述带凹槽阵列的第二单辊轮的凹槽外沿上设有刀口。
步骤2所述由带凹槽的单块光转换膜片所组成的光转换膜片阵列中的单块光转换膜片的外形形状为弧形、半圆球形或矩形。
步骤2所述进行协同滚压定形和裁切的温度为120～250℃。
如热塑性树脂采用聚甲基丙烯酸甲酯(PMMA)时，步骤2所述进行协同滚压定形和裁切的温度优选为120℃；如热塑性树脂采用改性聚甲基丙烯酸甲酯(M-PMMA)时，步骤2所述进行协同滚压定形和裁切的温度优选为200℃；如热塑性树脂采用改性聚碳酸酯(M-PC)时，步骤2所述进行协同滚压定形和裁切的温度优选为250℃；
步骤2所述切缝的深度为所述精制光转换膜片厚度的50～100％；最佳切缝的深度为所述精制光转换膜片厚度的为70～80％。
步骤2所述切缝的宽度为20μm以内。
本发明所述滚压定形和裁切中凸块外周或凹槽外沿上所设刀口的刀口宽度决定了步骤2所述切缝宽度，优选为15μm。
步骤2所述由带凹槽的单块光转换膜片所组成的光转换膜片阵列中的凹槽的长、宽、高尺寸为 LED倒装芯片长、宽、高尺寸的1.01～1.05倍。
本发明所述由带凹槽的单块光转换膜片所组成的光转换膜片阵列中的凹槽的长、宽、高尺寸取决于所选热塑性树脂的收缩率，优选为LED倒装芯片长、宽、高尺寸的1.02倍。
步骤3所述滚压贴合，是指将所述光转换膜片阵列设置于带凹槽阵列的第四单辊轮或者带有凹槽阵列的第四平面传送装置上，将带有载体膜片的LED倒装芯片阵列设置于辊面为光面的第三单辊轮或者平面为光面的第三平面传送装置上进行滚压贴合，由此使得所述LED倒装芯片阵列中的LED倒装芯片贴合嵌入所述光转换膜片阵列的单块光转换膜片的凹槽中，从而得到LED封装体元件；放置光转换膜片阵列的装置和放置LED倒装芯片阵列的装置中至少有一个为单辊轮。
步骤3所述滚压贴合的温度为120～250℃；最佳的滚压贴合温度为180～220℃。
步骤3所述带有载体膜片的LED倒装芯片阵列中的载体膜为可拉伸载体膜。
步骤3所述可拉伸载体膜片的材质为耐高温聚酯或聚二甲基硅氧烷、聚氯乙烯中的一种。
步骤4所述降温固化方式为梯度降温固化的方式或均匀降温固化方式；其中：
所述梯度降温固化方式的温度梯度为，是指将LED封装体元件的温度沿多个梯度降温至室温，降温固化的时间为3～10min，每个降温固化阶段的时间多少可调；
所述均匀降温固化的方式，是指将LED封装体元件的温度均匀降温至室温，降温固化的时间为3～10min。
需要进一步说明的是，所述的协同滚压定形和裁切工序与所述滚压贴合工序的具体实施方式包括如下：
当光转换膜片通过带有凸块阵列的第一单辊轮和带有凹槽阵列的第二单辊轮进行同时滚压定形裁切，并通过带有凹槽阵列的第二单辊轮与带有载体膜片的LED倒装芯片阵列的光面的第三单辊轮进行滚压贴合封装LED的工艺参见图4所示，工艺流程布局参见图2所示。在本例中，带有凹槽阵列的第四单辊轮和带有凹槽阵列的第二单辊轮为同一装置。
当光转换膜片通过带有凸块阵列的第一单辊轮和带有凹槽阵列的第二单辊轮进行同时滚压定形裁切，并通过带有凹槽阵列的第四单辊轮与带有载体膜片的LED倒装芯片阵列的光面的第三单辊轮进行滚压贴合封装LED的工艺参见图7所示，工艺流程布局参见图6所示。
当光转换膜片通过带有凸块阵列的第一单辊轮和带有凹槽阵列的第二平面传送装置进行同时滚压定形裁切，并通过带有凹槽阵列的第二平面传送装置与带有载体膜片的LED倒装芯片阵列的光面的第三单辊轮进行滚压贴合封装LED的工艺参见图9所示，工艺流程布局参见图8所示。在本例中，带有凹槽阵列的第四平面传送装置和带有凹槽阵列的第二平面传送装置为同一装置。
当光转换膜片通过带有凸块阵列的第一单辊轮和带有凹槽阵列的第二单辊轮进行同时滚压定形裁切，并通过带有凹槽阵列的第四平面传送装置与带有载体膜片的LED倒装芯片阵列的光面的第三单辊轮进行滚压贴合封装LED的工艺参见图11A和图11B所示，工艺流程布局参见图10所示。
根据需要，可将步骤4所述成品LED封装体元件，再通过拉伸机对其可拉伸载体膜片进行拉伸扩膜，使得成品LED封装体元件在拉伸后即沿切缝分割，从而制得成品单颗LED封装体元件。参见图12A和12B所示；得到的成品单颗LED封装体元件的形状，参见图13A、图13B和图13C所示。
本发明提出的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，广泛适用于热塑性树脂光转换体与各种功率大小的LED倒装芯片的贴合封装工艺。
实施例2：本发明提出的一种基于滚压式的热塑性树脂光转换体贴合封装LED的装备***，它包括用于对光转换膜片进行滚压定形和滚压裁切形成光转换膜片阵列的协同滚压定形和裁切装置和用于将所述光转换膜片阵列与LED倒装芯片阵列进行压合的滚压贴合装置；所述协同滚压定形和裁切装置与所述滚压贴合装置依次构成协同联动的工序装备；其中：所述协同滚压定形和裁切装置包括相向对准设置的带有凸块阵列的第一滚压装置与带有凹槽阵列的第二滚压装置；所述滚压贴合装 置包括相向对准设置的带有凹槽阵列的第四滚压装置与滚压面为光面的第三滚压装置；其中：
所述协同滚压定形和裁切装置中第一滚压装置的凸块阵列的凸块外周上或/和所述第二滚压装置的凹槽阵列的凹槽外沿上设有刀口；参见图5A、图5B所示。
所述带有凸块阵列的第一滚压装置为带有凸块阵列的第一单辊轮或带有凸块阵列的第一平面传送装置；所述带有凹槽阵列的第二滚压装置为带凹槽阵列的第二单辊轮或带凹槽阵列的第二平面传送装置；所述带有凸块阵列的第一滚压装置与带有凹槽阵列的第二滚压装置中至少一个为单辊轮。
所述带凹槽阵列的第二单辊轮或带凹槽阵列的第二平面传送装置中凹槽阵列的凹槽形状为弧形、半圆球形或矩形。
所述带有凸块阵列的第一单辊轮或带凸块阵列的第一平面传送装置中，凸块阵列的凸块的形状与倒装芯片形状相同，且凸块长、宽、高尺寸分别为倒装芯片的长、宽、高尺寸的1.01～1.05倍。
所述滚压贴合装置中带有凹槽阵列的第四滚压装置为带凹槽阵列的第四单辊轮或带凹槽阵列的第四平面传送装置；
所述滚压贴合装置中的第三滚压装置为光面的第三单辊轮或光面平面的第三平面传送装置；所述第四滚压装置和第三滚压装置中至少有一个为单辊轮；
所述第四单辊轮或第四平面传送装置中凹槽阵列的凹槽形状与所述第二单辊轮或第二平面传送装置中的凹槽阵列的凹槽形状相同。
所述协同滚压定形和裁切装置中的第二滚压装置与所述滚压贴合装置中的第四滚压装置为具有双重功能的同一装置。
需要进一步说明的是，所述协同滚压定形和裁切装置与所述滚压贴合装置的具体实施方式包括如下：
当第一滚压装置为带凸块阵列的第一单辊轮，第二滚压装置为带凹槽阵列的第二单辊轮，第三滚压装置为光面的第三单辊轮，第四滚压装置为带凹槽阵列的第二单辊轮时，参见图4所示；在本例中，带有凹槽阵列的第四单辊轮和带有带有凹槽阵列的第二单辊轮为同一装置。
当第一滚压装置为带凸块阵列的第一单辊轮，第二滚压装置为带凹槽阵列的第二单辊轮，第三滚压装置为光面的第三单辊轮，第四滚压装置为带凹槽阵列的第四单辊轮时，参见图6所示。
当第一滚压装置为带凸块阵列的第一单辊轮，第二滚压装置为带凹槽阵列的第二平面传送装置，第三滚压装置为光面的第三单辊轮，第四滚压装置为带凹槽阵列的第二平面传送装置时，参见图9所示；在本例中，带有凹槽阵列的第四平面传送装置和带有凹槽阵列的第二平面传送装置为同一装置。
当第一滚压装置为凸块阵列的第一单辊轮，第二滚压装置为带凹槽阵列的第二单辊轮，第三滚压装置为光面的第三单辊轮，第四滚压装置为凹槽阵列的第四平面传送装置时，参见图11A和图11B所示。
所述平面传送装置为由两个或两个以上辊轮承托平面传送带并传动前行的装置，其中至少一个辊轮被电机驱动。
所述装备***还包括用于制得成品LED封装体元件的降温固化装置；该降温固化装置为位于所述滚压贴合装置后端的工序装备。
所述装备***还包括用于制得成品LED封装体元件的降温固化装置；该降温固化装置为位于所述滚压贴合装置后端的工序装备。
所述降温固化装置为包括设有温度调控部件和传送带通道的隧道式多温区装置。
所述装备***还包括用于制备光转换膜片的双辊滚压压合装置；该双辊滚压压合装置为位于所述协同滚压定形和裁切装置前端的工序装置；
所述双辊滚压压合装置包括第一光面双辊滚压压合机，该第一光面双辊滚压压合机包括相向对准滚压的滚压面为光面的光面单辊轮A1与滚压面为光面的光面单辊轮A2。
所述双辊滚压压合装置还包括第二光面双辊滚压压合机，该第二光面双辊滚压压合机包括相向对准滚压的滚压面为光面的光面单辊轮B1与滚压面为光面的光面单辊轮B2；参见图3所示。
所述A双辊滚压压合机的双辊间距为850μm以内；B双辊滚压压合机的双辊间距为800μm以内。
所述装备***还包括用于将至少包含热塑性树脂和光转换材料混合的熔融共混装置，该熔融共混装置为位于所述双辊滚压压合装置前端的工序装备。
所述熔融共混装置、双辊滚压压合装置、协同滚压定形和裁切装置、滚压贴合装置和降温固化装置依次协同联动，构成流程式的连续工序装备。参见图2、图6、图8和图10所示。
本发明提出的一种基于滚压式的热塑性树脂荧光体贴合封装LED的装备***，广泛适用于各种热塑性树脂光转换体与各种功率LED倒装芯片贴合封装的新工艺。
本发明的具体实施方式中凡未涉到的说明属于本领域的公知技术，可参考公知技术加以实施。
本发明经反复试验验证，取得了满意的试用效果。
以上具体实施方式及实施例是对本发明提出的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法技术思想的具体支持，不能以此限定本发明的保护范围，凡是按照本发明提出的技术思想，在本技术方案基础上所做的任何等同变化或等效的改动，均仍属于本发明技术方案保护的范围。

Claims (28)

  1. 一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，包括至少由光转换膜片的准备、光转换膜片阵列的滚压定形和裁切、LED封装体元件的滚压贴合成型和LED封装体元件的固化成型工序构建的流程式连续工艺，其基本步骤包括如下：
    步骤1，光转换膜片的准备：获取至少包括热塑性树脂和光转换材料所组成的光转换膜片；
    步骤2，光转换膜片阵列的滚压定形和裁切：在真空条件下，将步骤1所述的光转换膜片通过相向对准的带有凸块阵列的第一滚压装置与带有凹槽阵列的第二滚压装置，进行协同滚压定形和裁切，得到由带凹槽的单块光转换膜片所组成的光转换膜片阵列，该光转换膜片阵列中的各单块光转换膜片相互之间带有用于分割单块光转换膜片的切缝；
    步骤3，LED封装体元件的滚压贴合成型：在真空条件下，将步骤2所述光转换膜片阵列与带有载体膜片的LED倒装芯片阵列进行相向对准的滚压贴合，使所述LED倒装芯片阵列中的LED倒装芯片贴合嵌入所述光转换膜片阵列的单块光转换膜片的凹槽中，从而得到LED封装体元件；所述LED倒装芯片是指单个LED倒装芯片或LED倒装芯片组件；其中，所述LED倒装芯片组件由两个或两个以上的单个LED倒装芯片组合而成；
    步骤4，LED封装体元件的固化成型：在真空条件下，采用降温固化方式，将所述LED封装体元件进行固化，使得贴合在LED倒装芯片阵列上的各单块光转换膜片收缩而自然包裹，从而得到成品LED封装体元件。
  2. 根据权利要求1所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，步骤1所述光转换膜片的准备，是指在真空加热的条件下，将至少包括热塑性树脂和光转换材料的混合浆料通过光面双辊滚压，从而得到光转换膜片。
  3. 根据权利要求2所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，所述混合浆料通过光面双辊滚压，从而制得光转换膜片，是指首先将混合浆料通过第一光面双辊滚压压合机滚压成型，制得粗制光转换膜片；然后再将成型后的粗制光转换膜片通过第二光面双辊滚压压合机滚压成型，制得精制光转换膜片。
  4. 根据权利要求3所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，所述粗制光转换膜片的厚度为850μm以内；精制光转换膜片的厚度为800μm以内。
  5. 根据权利要求2所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，所述混合浆料通过光面双辊滚压，从而制得光转换膜片，是指将所述混合浆料通过三组或三组以上的双辊滚压成型，制得精制的光转换膜片；该精制光转换膜片的厚度为800μm以内。
  6. 根据权利要求4或5所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，步骤1所述混合浆料的温度为180～320℃。
  7. 根据权利要求4或5所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，步骤1所述混合浆料的温度为240～280℃。
  8. 根据权利要求7所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，步骤1所述光转换材料为量子点荧光体，所述光转换膜片为量子点荧光体膜片。
  9. 根据权利要求7所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，步骤1所述光转换材料为荧光粉，所述光转换膜片为荧光体膜片。
  10. 根据权利要求9所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，所述混合浆料的材质中包括粘接剂。
  11. 根据权利要求1、4、5或10任一项所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，步骤2所述通过相向对准的带有凸块阵列的第一滚压装置与带有凹槽阵列的第二滚压装置进行协同滚压定形和裁切，是指通过相向对准的带有凸块阵列的第一滚压装置与带有凹槽阵列的第二滚压装置进行同时滚压定形和裁切，即滚压定形与滚压裁切同时进行，两个功能一次实现。
  12. 根据权利要求11所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，步骤2所述通过相向对准的带有凸块阵列的第一滚压装置与带有凹槽阵列的第二滚压装置进行同时滚压定形和裁切，是指将所述光转换膜片通过带有凸块阵列的第一滚压装置与带有凹槽阵列的第二滚压装置进行滚压定形，从而得到由带凹槽的单块光转换膜片所组成的光转换膜片阵列；
    且所述凸块阵列的凸块外周上或/和所述凹槽阵列的凹槽外沿上设有刀口，在滚压定形的同时对所述光转换膜片进行形成切缝的滚压裁切，从而形成用于分割所述单块光转换膜片的切缝。
  13. 根据权利要求12所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，步骤2所述通过相向对准的带有凸块阵列的第一滚压装置与带有凹槽阵列的第二滚压装置进行同时滚压定形和裁切，是指将所述光转换膜片通过带有凸块阵列的第一单辊轮和带有凹槽阵列的第二单辊轮同时进行滚压定形和裁切；所述带有凸块阵列的第一滚压装置为带有凸块阵列的第一单辊轮，所述带有凹槽阵列的第二滚压装置为带有凹槽阵列的第二单辊轮；所述带凸块阵列的第一单辊轮的凸块外周上或者所述带凹槽阵列的第二单辊轮的凹槽外沿上设有刀口。
  14. 根据权利要求12所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，步骤2通过相向对准的带有凸块阵列的第一滚压装置与带有凹槽阵列的第二滚压装置进行同时滚压定形和裁切，是指将所述光转换膜片通过带有凸块阵列的第一单辊轮和带有凹槽阵列的第二平面传送装置同时进行滚压定形和裁切；其中：所述带有凸块阵列的第一滚压装置为带有凸块阵列的第一单辊轮，所述带有凹槽阵列的第二滚压装置为带有凹槽阵列的第二平面传送装置；所述带凸块阵列的第一单辊轮的凸块外周上或者所述带凹槽阵列的第二平面传送装置的凹槽外沿上设有刀口。
  15. 根据权利要求12所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，步骤2通过相向对准的带有凸块阵列的第一滚压装置与带有凹槽阵列的第二滚压装置进行同时滚压定形和裁切，是指将所述光转换膜片通过带有凸块阵列的第一平面传送装置和带有凹槽阵列的第二单辊轮同时进行滚压定形和裁切；其中：所述带有凸块阵列的第一滚压装置为带有凸块阵列的第一平面传送装置，所述带有凹槽阵列的第二滚压装置为带有凹槽阵列的第二单辊轮；所述带凸块阵列的第一平面传送装置的凸块外周上或者所述带凹槽阵列的第二单辊轮的凹槽外沿上设有刀口。
  16. 根据权利要求13-15任一所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，步骤2所述由带凹槽的单块光转换膜片所组成的光转换膜片阵列中的单块光转换膜片的外形形状为弧形、半圆球形或矩形。
  17. 根据权利要求16所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，步骤2所述进行协同滚压定形和裁切的温度为120～250℃。
  18. 根据权利要求17任一所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，步骤2所述切缝的深度为所述精制光转换膜片厚度的50～100％。
  19. 根据权利要求17所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，步骤2所述切缝的深度为所述精制光转换膜片厚度的为70～80％。
  20. 根据权利要求17所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，步骤2所述切缝的宽度为20μm以内。
  21. 根据权利要求20所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，步骤2所述由带凹槽的单块光转换膜片所组成的光转换膜片阵列中的凹槽的长、宽、高尺寸为LED倒装芯片长、宽、高尺寸的1.01～1.05倍。
  22. 根据权利要求1、13-15或21任一项所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于：
    步骤3所述滚压贴合，是指将所述光转换膜片阵列设置于带凹槽阵列的第四单辊轮或者带有凹槽阵列的第四平面传送装置上，将带有载体膜片的LED倒装芯片阵列设置于辊面为光面的第三单辊轮或者平面为光面的第三平面传送装置上进行滚压贴合，由此使得所述LED倒装芯片阵列中的LED倒装芯片贴合嵌入所述光转换膜片阵列的单块光转换膜片的凹槽中，从而得到LED封装体元件；放置光转换膜片阵列的装置和放置LED倒装芯片阵列的装置中至少有一个为单辊轮。
  23. 根据权利要求22所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，步骤3所述滚压贴合的温度为120～250℃。
  24. 根据权利要求1或23所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于：
    步骤4所述降温固化方式为梯度降温固化的方式或均匀降温固化方式；
    所述梯度降温固化方式的温度梯度为，是指将LED封装体元件的温度沿多个梯度降温至室温，降温固化的时间为3-10min，每个降温固化阶段的时间多少可调；
    所述均匀降温固化的方式，是指将LED封装体元件的温度均匀降温至室温，降温固化的时间为3-10min。
  25. 根据权利要求1所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，步骤3所述带有载体膜片的LED倒装芯片阵列中的载体膜片为可拉伸载体膜片。
  26. 根据权利要求24所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，步骤3所述带有载体膜片的LED倒装芯片阵列中的载体膜片为可拉伸载体膜片。
  27. 根据权利要求25-26任一项所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，步骤3所述可拉伸载体膜片的材质为耐高温聚酯或聚二甲基硅氧烷、聚氯乙烯中的一种。
  28. 根据权利要求27所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，将步骤4所述成品LED封装体元件，再通过拉伸机对其可拉伸载体膜片进行拉伸扩膜，使得成品LED封装体元件在拉伸后即沿切缝分割，从而制得成品单颗LED封装体元件。
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