WO2017018999A1

WO2017018999A1 - Thermal radiation heat dissipation structure

Info

Publication number: WO2017018999A1
Application number: PCT/US2015/042069
Authority: WO
Inventors: Chi-Hao Chang; Kuan-Ting Wu; Chien-Ting Lin
Original assignee: Hewlett-Packard Development Company, L.P.
Priority date: 2015-07-24
Filing date: 2015-07-24
Publication date: 2017-02-02

Abstract

In one example, a thermal radiation heat dissipation structure for dissipating heat from an electronic device is described. The thermal radiation heat dissipation structure includes a metal substrate of the electronic device. Further, the thermal radiation heat dissipation structure includes a thermal radiation derived powder coating that is disposed on the metal substrate of the electronic device for dissipating heat from the electronic device via thermal radiation, wherein the thermal radiation derived powder coating comprises a resin and thermal radiation materials and wherein the thermal radiation materials include grapheme, and carbon nanotube.

Description

THERMAL RADIATION HEAT DISSIPATION STRUCTURE

BACKGROUND

[0001] The cooling of the electronic devices, such as computing devices and mobile devices and the removal of the heat generated by the semiconductor elements in the electronic devices plays a significant role in electronic industry. For using the heat dissipating means in the high integrate products and multi function applications, various heat dissipating structures with high heat dissipating efficiency have developed.

BRIEF DESCRIPTION OF THE DRAWINGS

[0002] Examples are described in the following detailed description and in reference to the drawings, in which:

[0003] Fig. 1 depicts an example sectional view illustrating thermal radiation heat dissipation structure for an electronic device in accordance with one example of the present application; and

[0004] Fig. 2 depicts another example sectional view illustrating thermal radiation heat dissipation structure for an electronic device in accordance with one example of the present application.

DETAILED DESCRIPTION

[0005] The present specification describes a structure including a thermal radiation derived powder coating formulation disposed on metal substrates of electronic devices for dissipating heat from the electronic devices. The present specification further describes another structure including a putty layer disposed between the metal substrate and the thermal radiation derived powder coating for dissipating heat from the electronic devices. The term "thermal radiation derived powder coating" refers to the powder including both graphene and carbon nanotubes that provides a significantly better heat transfer via z-direction, i.e., in a substantially perpendicular direction to the coated surface/metal substrate. The term carbon nanotube refers to "cylindrical structure made up of carbon atoms".

[0006] Further, the present specification describes the thermal radiation derived powder coating that provides good surface porosity coverage for metal substrates, and more specifically for die casting metal substrates. Furthermore, the thermal radiation derived powder coating offers a significantly high cost/performance value as the thermal releasing technology. In addition, the thermal radiation derived powder coating provides an effective anti-corrosion coating solution for metal substrates. Also, the structure including the thermal radiation derived powder coating may enhance product lifetime for various components included in electronic devices, such as liquid crystal display (LCD) panels, light emitting diodes (LEDs), central processing units (CPUs), batteries and the like. May further reduce the risk of any battery explosion due to overheating and further may alleviate overheating of LCD panels by reducing the LCD panel temperature to below skin temperature of about 40° C or lower. Moreover, the metal substrate structure of electronic devices including the thermal radiation derived powder coating may improve information loading speed and power efficiency.

[0007] In addition, the present specification describes the thermal radiation derived powder coating having no volatile organic compounds (VOCs). Further, graphene in the thermal radiation derived powder coating composition provides a very high aspect ratio of about 50 - 5,000, which can provide a good coverage on high porosity substrate surface by powder coating process. Furthermore, the process of application of the thermal radiation derived powder coating onto the high porosity metal substrate may not result in trapping chemical, which may result in serious corrosion problem in magnesium alloy substrates.

[0008] In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present techniques. It will be apparent, however, to one skilled in the art that the present apparatus, devices and systems may be practiced without these specific details. Reference in the specification to "an example" or similar language means that a particular feature, structure, or characteristic described is included in at least that one example, but not necessarily in other examples.

[0009] Turning now to the figures, Fig. 1 depicts an example sectional view 100 of a thermal radiation heat dissipation structure for an electronic device in accordance with techniques of the present application. As shown in Fig. 1 , over a metal substrate 1 10 of an electronic device, such as a computing device, a laptop, a tablet, a smart phone, or a notebook, a thermal radiation derived powder coating 120 is disposed to dissipate heat from the electronic device via thermal radiation 130. The thermal radiation derived powder coating 120 is applied on to the metal substrate 1 10. Example technique includes establishing an electrostatic charge on thermal radiation powder using an applicator such that the maximum voltage is achieved at the tip of the electrode for applying the thermal radiation derived powder coating 120 onto the metal substrate 1 10. ln one example, the thermal radiation derived coating includes a resin and thermal radiation materials.

[00010] Fig. 2 depicts another example sectional view 200 of a thermal radiation heat dissipation structure for an electronic device in accordance with techniques of the present application.

[00011] Example resin materials are polycarbonate (PC), polyethylene terephthalate (PET), polyethylene terephthalate - glycol (PET-G), poly vinyl chloride (PVC), polyacrylic, polyphenylene sulphide (PPS), thermoplastic polymers, thermoset polymers and the like. Example thermal radiation materials are graphene, carbon nanotube, and the like. In some examples, the thermal radiation derived powder coating includes about or less than 30% by weight of additives, such as aluminum, copper, silver, silicon, gold, diamond, silicon carbide, boron nitride, graphite and/or synthetic thermal conductive materials. Further in some examples, the thermal radiation derived powder coating comprises, by weight about 40% of grapheme, less than or about 3% of carbon nanotube, about 2% of diamond, and about 10% of graphite. In some examples, the thickness of the thermal radiation derived powder coating is in the range of about 5- 60 micrometers (μιη).

[00012] Example metal substrate of electronic devices are aluminum, magnesium, lithium, zinc, titanium, niobium, stainless, copper, metal alloy, and the like. The formulation of thermal radiation derived powder coating including graphene and carbon nanotube provides a significantly better heat transfer in the z-axis direction as shown in Fig. 1 .

[00013] The thermal radiation heat dissipation structure shown in Fig. 2 is similar to the thermal radiation heat dissipation structure shown in Fig. 1 , except a putty layer 210 is disposed between the metal substrate 1 10 and the thermal radiation derived powder coating 120 to enhance heat dissipation via thermal radiation 130.

[00014] Example putty layer materials include epoxy, silicone, and borax. Further, exemplary borax materials are sodium borate, sodium tetraborate, disodium tetraborate, a salt of boric acid and the like. In some examples, the metal substrate is an outside cover of the electronic device and/or a semiconductor element of the electronic device. Exemplary electronic device is a computing device, a laptop, a tablet, a smart phone, a notebook, and the like. Exemplary semiconductor elements housed in the electronic device is a central processing unit (CPU), LCD panel, LED, battery or any other such heat generating component/device. [00015] In this manner, the present application discloses structures for dissipating heat generated from electronic components housed in electronic devices.

[00016] The foregoing describes novel structures for dissipating heat from electronic devices. While the above application has been shown and described with reference to the foregoing examples, it should be understood that other forms, details, and implementations may be made without departing from the spirit and scope of this application.

Claims

WHAT IS CLAIMED IS:

1. A thermal radiation heat dissipation structure for an electronic device, comprising: a metal substrate of the electronic device; and

a thermal radiation derived powder coating disposed on the metal substrate of the electronic device for dissipating heat from the electronic device via thermal radiation, wherein the thermal radiation derived powder coating comprises a resin and thermal radiation materials.

2. The thermal radiation heat dissipation structure of claim 1 , wherein the resin comprises materials selected from the group consisting of polycarbonate (PC), polyethylene terephthalate (PET), polyethylene terephthalate - glycol (PET-G), poly vinyl chloride (PVC), polyacrylic, polyphenylene sulphide (PPS), thermoset polymers and thermoplastic polymers.

3. The thermal radiation heat dissipation structure of claim 1 , wherein the thermal radiation materials comprise materials selected from the group consisting of graphene, and carbon nanotube.

4. The thermal radiation heat dissipation structure of claim 3, wherein the thermal radiation derived powder coating comprises about 30% or less by weight of additives selected from the group consisting of aluminum, copper, silver, silicon, gold, diamond, silicon carbide, boron nitride, graphite and synthetic thermally conductive materials.

5. The thermal radiation heat dissipation structure of claim 3, wherein the thermal radiation derived powder coating comprises, by weight less than or about 40% of graphene, less than or about 3% of carbon nanotube, about 2% of diamond and about 10% of graphite.

6. The thermal radiation heat dissipation structure of claim 1 , wherein the thermal radiation derived powder coating having a thickness of about 5-60 micrometers (μιη).

7. The thermal radiation heat dissipation structure of claim 1 , wherein the metal substrate of the electronic device comprises materials selected from the group consisting of aluminum, magnesium, lithium, zinc, titanium, niobium, stainless, copper, and metal alloy.

8. The thermal radiation heat dissipation structure of claim 1 , wherein the metal substrate is an outside cover of the electronic device and/or a semiconductor element of the electronic device.

9. A thermal radiation heat dissipation structure for an electronic device, comprising: a metal substrate of the electronic device;

a putty layer disposed on the metal substrate of the electronic device; and a thermal radiation derived powder coating disposed on the putty layer for dissipating heat from the electronic device via the putty layer and thermal radiation, wherein the thermal radiation derived powder coating comprises a resin and thermal radiation materials.

10. The thermal radiation heat dissipation structure of claim 9, wherein the putty layer comprises materials selected from the group consisting of epoxy, silicone, and borax.

1 1. The thermal radiation heat dissipation structure of claim 9, wherein the electronic device is a computing device, a laptop, a tablet, a smart phone, or a notebook.

12. An electronic device, comprising:

a metal substrate; and

a thermal radiation derived powder coating disposed on the metal substrate for dissipating heat from the electronic device via thermal radiation, wherein the thermal radiation derived powder coating comprises a resin and thermal radiation materials, and wherein the thermal radiation derived powder coating comprises, by weight less than or about 40% of graphene, less than or about 3% of carbon nanotube, about 2% of diamond and about 10% of graphite.

13. The electronic device of claim 12, wherein the resin comprises materials selected from the group consisting of polycarbonate (PC), polyethylene terephthalate (PET), polyethylene terephthalate - glycol (PET-G), poly vinyl chloride (PVC), thermoset polymers, polyacrylic, polyphenylene sulphide (PPS) and thermoplastic polymers.

14. The electronic device of claim 12, wherein the thermal radiation materials comprise materials selected from the group consisting of graphene, and carbon nanotube.

15. The electronic device of claim 14, wherein the thermal radiation derived powder coating comprise about 30% or less by weight of additives selected from the group consisting of aluminum, copper, silver, silicon, gold, diamond, silicon carbide, boron nitride, graphite and synthetic thermal conductive materials.