CN108012505A - A kind of heat sink prepared using grapheme material - Google Patents
A kind of heat sink prepared using grapheme material Download PDFInfo
- Publication number
- CN108012505A CN108012505A CN201711286244.0A CN201711286244A CN108012505A CN 108012505 A CN108012505 A CN 108012505A CN 201711286244 A CN201711286244 A CN 201711286244A CN 108012505 A CN108012505 A CN 108012505A
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- CN
- China
- Prior art keywords
- dissipating layer
- heat
- heat dissipating
- graphene
- heat sink
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Abstract
The invention discloses a kind of heat sink prepared using grapheme material, including graphene heat dissipating layer, mucigel is compounded with one end face of the graphene heat dissipating layer, the material of mucigel is heat conductive silica gel, and the heat conducting material being made of graphene heat dissipating layer and mucigel is overlapped into the circular roll of multilayer.Graphene heat dissipating layer has excellent heat conductivility, also there is the plasticity as organic plastics, and also special hot property, chemical stability, can be coated in the grade of the surface of solids some good processing performances, heat sink material prepared by this graphene heat dissipating layer can be widely used on fever electronic equipment or device, and when use fits in graphene heat dissipating layer on electronic device, it is easy to use, it is applied widely.
Description
Technical field
The present invention relates to heat sink material field, and in particular to a kind of heat sink prepared using grapheme material.
Background technology
With the development of large scale integrated circuit and encapsulation technology, electronic product also develops to thin, light, small direction so that
Electronic product surface temperature is also constantly raising, and environment of the component also there is an urgent need to a relative low temperature could be transported reliably
OK, otherwise can reduce the service life of electronic component, therefore the heat dissipation of electronic product becomes a very distinct issues.
Existing market portioned product carries out heat conduction and heat radiation, especially copper and aluminium by metal class, although the thermal conductivity factor of copper
For (398W/mK), but weight is big, the application for limiting it such as oxidizable, and the thermal conductivity factor of aluminium is not high (237W/mK),
It is difficult to meets the needs of existing product is to heat conduction and heat radiation.The natural graphite material and artificial synthesized graphite material used at present
Heat dissipation of the heat dissipation film made of material to electronic product has certain improvement.
The chemical composition of heat conductivity graphite material (Thermal Flexible Graphite sheet) is mainly single carbon
(C) element, is a kind of native element metal mineral.Film high-molecular compound can obtain graphite under high temperature and pressure chemically
Change film, because carbon is nonmetalloid, but has the conduction of metal material, heat conductivility, also has as organic modeling
The same plasticity of material, and also special hot property, chemical stability, lubrication and can coated in the surface of solids etc. one
A little good processing performances, therefore, conductive graphite communicate, illumination, many fields such as aviation and defence and military are all obtained in electronics
It is widely applied.
Graphite heat conducting material provides a high performance unique solution of synthesis to thermal management industry.Conductive graphite
Material solves to bring new technology using the industrial emissions field increasingly extensive to demand by a series of different thermal managements
The hot graphite material product of scheme provides the innovation new technology of electronics industry thermal management.Conductive graphite is by mitigating device weight
More excellent heat conductivility is provided in the case of amount, conductive graphite Cooling Solution is the brand-new application scheme of thermal design.Lead
Hot graphite effectively solves the thermal design problem of electronic equipment.
The content of the invention
To be solved by this invention is the deficiencies in the prior art, and it is an object of the present invention to provide a kind of utilize grapheme material to prepare
Heat sink.
The present invention is achieved through the following technical solutions：
A kind of heat sink prepared using grapheme material, including graphene heat dissipating layer, the one of the graphene heat dissipating layer
Mucigel is compounded with a end face.
Preferred solution, the material of the mucigel is heat conductive silica gel.
Preferred solution, the heat conducting material being made of graphene heat dissipating layer and mucigel are overlapped into the circle of multilayer
Volume.
Preferred solution, the thickness of the heat conductive silica gel is 20-60 μm.
Preferred solution, the area of the mucigel are greater than or equal to the area of the graphene heat dissipating layer.
Preferred solution, the thickness of the graphene heat dissipating layer is 25-300 μm.
Preferred solution, the graphene heat dissipating layer are to contain one kind in graphite, carbon fiber, carbon black and carbon nanotubes or more
The graphene heat dissipating layer of kind above material composition.
Compared with prior art, the present invention have the following advantages and advantages：Graphene heat dissipating layer has excellent
Heat conductivility, also has the plasticity as organic plastics, and also special hot property, chemical stability, can apply
In some good processing performances of the grade of the surface of solids, heat sink material prepared by this graphene heat dissipating layer can be widely used in
Generate heat on electronic equipment or device, when use fits in graphene heat dissipating layer on electronic device, easy to use, is applicable in model
Enclose wide.
Brief description of the drawings
Attached drawing described herein is used for providing further understanding the embodiment of the present invention, forms one of the application
Point, do not form the restriction to the embodiment of the present invention.In the accompanying drawings：
Fig. 1 is a kind of structure diagram of heat sink prepared using grapheme material of the present invention.
Mark and corresponding parts title in attached drawing：
1- graphene heat dissipating layers, 2- mucigels.
Embodiment
For the object, technical solutions and advantages of the present invention are more clearly understood, with reference to embodiment and attached drawing, to this
Invention is described in further detail, and exemplary embodiment of the invention and its explanation are only used for explaining the present invention, do not make
For limitation of the invention.
Embodiment
As shown in Figure 1, a kind of heat sink prepared using grapheme material of the present invention, including graphene heat dissipating layer 1, it is described
Mucigel 2 is compounded with one end face of graphene heat dissipating layer 1, the material of the mucigel 2 is heat conductive silica gel.Dissipated by graphene
Thermosphere 1 and the heat conducting material overlap wrapping that mucigel 2 forms are into circular roll.Facilitate the processing and storage of heat conducting material.Lead
The thickness of hot silica gel is preferably 20 μm, and the effect for accelerating heat dissipation can be played under conditions of not inharmonious degree.Heat conductive silica gel has
Remarkable cold-and-heat resistent alternation performance, ageing-resistant performance and electrical insulation capability.And with excellent moisture-proof, antidetonation, Inverter fed motor, anti-leakage
Electrical property and chemical mediator-resitant property.Sustainable use -60~280 DEG C and retention property.Heat conductive silica gel has high thermal conductivity, pole
Good thermal conductivity, good electric exhausted property, wider temperature in use, good stability in use, relatively low denseness are applied with good
Work performance.The area of mucigel 2 be equal to the graphene heat dissipating layer 1 area, make graphene heat dissipating layer 1 by mucigel 2 with
The surface of heater fully connects, while the effect of heat conductive silica gel is exactly the sky filled up between graphene heat dissipating layer 1 and heater
Gap, make use of the heat-sinking capability of graphene heat dissipating layer 1 to greatest extent.
Preferred embodiment scheme, the thickness of the graphene heat dissipating layer 1 is 25-300 μm.
Preferred embodiment scheme, the graphene heat dissipating layer 1 are containing in graphite, carbon fiber, carbon black and carbon nanotubes
The graphene heat dissipating layer 1 of one or more above material compositions.Ratio no spy of the present invention for graphene and carbon-based material
Different limitation, makes choice according to specific implementation situation.
Above-described embodiment, has carried out the purpose of the present invention, technical solution and beneficial effect further
Describe in detail, it should be understood that the foregoing is merely the embodiment of the present invention, be not intended to limit the present invention
Protection domain, within the spirit and principles of the invention, any modification, equivalent substitution, improvement and etc. done, should all include
Within protection scope of the present invention.
Claims (7)
- A kind of 1. heat sink prepared using grapheme material, it is characterised in that：Including graphene heat dissipating layer, the graphene dissipates Mucigel is compounded with one end face of thermosphere.
- A kind of 2. heat sink prepared using grapheme material according to claim 1, it is characterised in that the mucigel Material be heat conductive silica gel.
- 3. a kind of heat sink prepared using grapheme material according to claim 1, it is characterised in that described by graphite The heat conducting material of alkene heat dissipating layer and mucigel composition is overlapped into the circular roll of multilayer.
- A kind of 4. heat sink prepared using grapheme material according to claim 2, it is characterised in that the thermal conductive silicon The thickness of glue is 20-60 μm.
- A kind of 5. heat sink prepared using grapheme material according to claim 2, it is characterised in that the mucigel Area be greater than or equal to the graphene heat dissipating layer area.
- A kind of 6. heat sink prepared using grapheme material according to claim 1, it is characterised in that the graphene The thickness of heat dissipating layer is 25-300 μm.
- A kind of 7. heat sink prepared using grapheme material according to claim 1, it is characterised in that the graphene Heat dissipating layer is the graphene heat dissipation containing one or more above materials composition in graphite, carbon fiber, carbon black and carbon nanotubes Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711286244.0A CN108012505A (en) | 2017-12-07 | 2017-12-07 | A kind of heat sink prepared using grapheme material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711286244.0A CN108012505A (en) | 2017-12-07 | 2017-12-07 | A kind of heat sink prepared using grapheme material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108012505A true CN108012505A (en) | 2018-05-08 |
Family
ID=62057485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711286244.0A Withdrawn CN108012505A (en) | 2017-12-07 | 2017-12-07 | A kind of heat sink prepared using grapheme material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108012505A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112322258A (en) * | 2020-12-08 | 2021-02-05 | 福建永安市永清石墨烯研究院有限公司 | Graphene heat-conducting silica gel sheet and preparation method thereof |
| CN113573555A (en) * | 2021-07-27 | 2021-10-29 | 歌尔光学科技有限公司 | Heat-conducting plastic sheet, preparation method thereof and electronic equipment |
-
2017
- 2017-12-07 CN CN201711286244.0A patent/CN108012505A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112322258A (en) * | 2020-12-08 | 2021-02-05 | 福建永安市永清石墨烯研究院有限公司 | Graphene heat-conducting silica gel sheet and preparation method thereof |
| CN112322258B (en) * | 2020-12-08 | 2022-01-28 | 福建永安市永清石墨烯研究院有限公司 | Graphene heat-conducting silica gel sheet and preparation method thereof |
| CN113573555A (en) * | 2021-07-27 | 2021-10-29 | 歌尔光学科技有限公司 | Heat-conducting plastic sheet, preparation method thereof and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180508 |
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| WW01 | Invention patent application withdrawn after publication |