WO2017010343A1 - 導電ペースト、タッチセンサー部材及び導電パターンの製造方法 - Google Patents
導電ペースト、タッチセンサー部材及び導電パターンの製造方法 Download PDFInfo
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- WO2017010343A1 WO2017010343A1 PCT/JP2016/069865 JP2016069865W WO2017010343A1 WO 2017010343 A1 WO2017010343 A1 WO 2017010343A1 JP 2016069865 W JP2016069865 W JP 2016069865W WO 2017010343 A1 WO2017010343 A1 WO 2017010343A1
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- conductive paste
- tin oxide
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- metal particles
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
Definitions
- the present invention relates to a conductive paste, a touch sensor member, and a method for manufacturing a conductive pattern.
- a conductive paste containing inorganic particles whose surface is coated with a conductive material such as an antimony compound is known as a material for forming a lead wiring having excellent connection stability with a transparent electrode pattern (Patent Document). 4).
- the bridge pattern formed of a noble metal such as gold is accompanied by problems such as an increase in manufacturing cost and a decrease in visibility due to metallic luster.
- the present invention is capable of stably forming a contact resistance with a transparent electrode pattern even at a minute contact area, and forming a bridge pattern having excellent pattern accuracy, flexibility and visibility at low cost. It is an object to provide a conductive paste capable of.
- the present invention contains (A) metal particles, (B) a tin compound, (C) a photosensitive component, and (D) a photopolymerization initiator, and the (B) tin compound contains indium tin oxide and antimony-doped oxide.
- a conductive paste selected from the group consisting of tin, phosphorus-doped tin oxide, fluorine-doped tin oxide and tin oxide, and wherein the proportion of the (B) tin compound in the total solid content is 2 to 20% by mass .
- the conductive paste of the present invention contains (A) metal particles, (B) a tin compound, (C) a photosensitive component, and (D) a photopolymerization initiator, and the (B) tin compound contains indium tin oxide, It is selected from the group consisting of antimony-doped tin oxide, phosphorus-doped tin oxide, fluorine-doped tin oxide and tin oxide, and the proportion of the above (B) tin compound in the total solid content is 2 to 20% by mass And
- the conductive paste of the present invention contains (A) metal particles.
- a metal particle means the particle
- the volume average particle diameter of the metal particles is preferably 0.1 ⁇ m or more, and more preferably 0.3 ⁇ m or more. Moreover, 3 micrometers or less are preferable and 1 micrometer or less is more preferable.
- the volume average particle diameter of (A) metal particles is 3 ⁇ m or less, the surface smoothness and dimensional accuracy of the formed conductive pattern are improved.
- the volume average particle diameter of the metal particles is determined by diluting the conductive paste with a solvent in which the resin component is soluble, such as THF (tetrahydrofuron), and centrifuging to precipitate the solid content excluding the resin component.
- a solvent in which the resin component is soluble such as THF (tetrahydrofuron)
- the collected solid content is observed with a scanning electron microscope (SEM) or transmission microscope (TEM), and (A) metal particles are observed, and 100 (A) metal particles are randomly selected as primary particles.
- SEM scanning electron microscope
- TEM transmission microscope
- the proportion of (A) metal particles in the total solid content is preferably 60% by mass or more, and more preferably 70% by mass or more. Moreover, it is preferable that it is 85 mass% or less, and it is more preferable that it is 80 mass% or less.
- the ratio of (A) metal particles is 60% by mass or more, (A) the contact probability between the metal particles is improved, and the specific resistance value of the formed conductive pattern is lowered.
- the ratio of (A) the metal particles is 85% by mass or less, the exposure light at the time of exposure smoothly passes through the coating film of the conductive paste of the present invention, which facilitates fine patterning.
- the total solid content means all components of the conductive paste excluding the solvent.
- the proportion of the metal particles (A) in the total solid content of the conductive paste of the present invention is such that the conductive paste is heated at 60 to 120 ° C. to evaporate the solvent and collect the total solid content.
- the resin component is burned at 400 to 600 ° C. by DTA (differential thermobalance) to determine the ratio of the inorganic solid content in the total solid content, and the remaining inorganic solid content is dissolved in nitric acid or the like, and ICP emission spectroscopic analysis is performed.
- DTA differential thermobalance
- the conductive paste of the present invention comprises (B) a tin compound selected from the group consisting of indium tin oxide, antimony-doped tin oxide, phosphorus-doped tin oxide, fluorine-doped tin oxide and tin oxide in a proportion of 2 to Contains 20% by mass.
- a tin compound selected from the group consisting of indium tin oxide, antimony-doped tin oxide, phosphorus-doped tin oxide, fluorine-doped tin oxide and tin oxide in a proportion of 2 to Contains 20% by mass.
- (A) the contact resistance of the formed conductive pattern to the transparent electrode or the like is stable without preventing the contact between the metal particles. Both reduction and fine patterning are achieved.
- the ratio of the (B) tin compound in the total solid content is preferably 7 to 15% by mass.
- the tin compound may be present in the conductive paste as particles consisting of indium tin oxide, antimony-doped tin oxide, phosphorus-doped tin oxide, fluorine-doped tin oxide or tin oxide.
- indium tin oxide, antimony-doped tin oxide, phosphorus-doped tin oxide, fluorine-doped tin oxide or tin oxide is attached to or coated on the surface of particles or cores made of other compounds such as titanium oxide. May be present. However, for particles etc.
- the proportion of the (B) tin compound in the total solid content of the conductive paste of the present invention can be measured in the same manner as the method for obtaining the proportion of (A) metal particles.
- the volume average particle diameter of the (B) tin compound particles or the (B) particles to which the tin compound is adhered is preferably 0.01 to 0.3 ⁇ m, and preferably 0.01 to 0.1 ⁇ m. It is more preferable.
- (B) When the volume average particle diameter of tin compound particles or the like is 0.01 ⁇ m or more, the contact resistance of the formed conductive pattern is further stabilized. On the other hand, when the volume average particle diameter of the B) tin compound particles is 0.3 ⁇ m or less, the contact probability between the metal particles is improved, and the specific resistance value of the formed conductive pattern is lowered.
- the volume average particle diameter of (B) tin compound particles and the like can be measured in the same manner as the volume average particle diameter of (A) metal particles.
- Examples of the shape of the tin compound particles include a spherical shape and a needle shape. In order to effectively reduce the contact resistance of the conductive pattern to be formed, a needle shape is preferable.
- the aspect ratio which is a value obtained by dividing the major axis length of the needle-like (B) tin compound particles by the minor axis length, is preferably 1 to 50.
- the conductive paste of the present invention contains (C) a photosensitive component.
- the photosensitive component refers to a compound having an unsaturated double bond.
- Examples of the compound having an unsaturated double bond include acrylic monomers and acrylic copolymers.
- the acrylic copolymer refers to a copolymer containing an acrylic monomer as a copolymerization component.
- acrylic monomer examples include methyl acrylate, ethyl acrylate (hereinafter “EA”), acrylic acid (hereinafter “AA”), 2-ethylhexyl acrylate, n-butyl acrylate (hereinafter “BA”), i -Butyl acrylate, i-propane acrylate, glycidyl acrylate, N-methoxymethyl acrylamide, N-ethoxymethyl acrylamide, Nn-butoxymethyl acrylamide, N-isobutoxymethyl acrylamide, butoxytriethylene glycol acrylate, dicyclopentanyl acrylate , Dicyclopentenyl acrylate, 2-hydroxyethyl acrylate, isobornyl acrylate, 2-hydroxypropyl acrylate, isodexyl acrylate, isooctyl acrylate , Lauryl acrylate, 2-methoxyethyl acrylate, methoxyethylene glycol acrylate, methoxyd
- Examples of other copolymer components include styrenes such as styrene (hereinafter “St”), p-methylstyrene, o-methylstyrene, m-methylstyrene, ⁇ -methylstyrene, chloromethylstyrene, hydroxymethylstyrene, and the like. , ⁇ -methacryloxypropyltrimethoxysilane or 1-vinyl-2-pyrrolidone.
- an unsaturated acid such as an unsaturated carboxylic acid
- an acrylic copolymer having a carboxyl group or the like that is alkali-soluble can be obtained.
- the unsaturated acid include AA, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetate, and acid anhydrides thereof.
- the acid value of the resulting acrylic copolymer can be adjusted by the amount of the unsaturated acid used as the copolymer component.
- the acid value of the (C) photosensitive component contained in the conductive paste of the present invention is preferably 30 to 250 mgKOH / g in order to obtain appropriate alkali solubility.
- the acid value can be measured according to JIS-K0070 (1992).
- the conductive paste of the present invention contains (C) an acrylic copolymer and an acrylic monomer as a photosensitive component
- the content of the acrylic monomer with respect to 100 parts by mass of the acrylic copolymer is 1 to 100. Part by mass is preferred.
- the crosslinking density after exposure is stabilized and the line width can be stabilized.
- it can prevent that the crosslinking density after exposure does not become high too much, and the cure shrinkage in a curing process is inadequate and electroconductivity is not obtained.
- the conductive paste of the present invention contains (D) a photopolymerization initiator.
- the photopolymerization initiator refers to a compound that generates radicals by absorbing light of a short wavelength such as ultraviolet rays and causing decomposition or hydrogen abstraction reaction.
- Examples of (D) photopolymerization initiators include 1,2-octanedione, 1- [4- (phenylthio) -2- (O-benzoyloxime)], 2,4,6-trimethylbenzoyl-diphenylphosphine oxide.
- the content of the photopolymerization initiator (D) with respect to 100 parts by mass of the photosensitive component is preferably 0.05 to 30 parts by mass.
- the content of (D) the photopolymerization initiator with respect to 100 parts by mass of the photosensitive component is 0.05 parts by mass or more, the cured density of the exposed part increases, and the residual film ratio after development is increased. Can do.
- the content of (D) the photopolymerization initiator is 30 parts by mass or less, excessive light absorption at the upper part of the coating film is suppressed, and the adhesiveness to the substrate due to the conductive tape having a reverse taper shape. The decrease can be suppressed.
- the conductive paste of the present invention may contain a sensitizer together with (D) a photopolymerization initiator.
- sensitizer examples include 2,4-diethylthioxanthone, isopropylthioxanthone, 2,3-bis (4-diethylaminobenzal) cyclopentanone, 2,6-bis (4-dimethylaminobenzal) cyclohexanone, 2 , 6-bis (4-dimethylaminobenzal) -4-methylcyclohexanone, Michler's ketone, 4,4-bis (diethylamino) benzophenone, 4,4-bis (dimethylamino) chalcone, 4,4-bis (diethylamino) chalcone P-dimethylaminocinnamylidene indanone, p-dimethylaminobenzylidene indanone, 2- (p-dimethylaminophenylvinylene) isonaphthothiazole, 1,3-bis (4-dimethylaminophenylvinylene) isonaphthothiazole,
- the content of the sensitizer with respect to 100 parts by mass of the photosensitive component is preferably 0.05 to 10 parts by mass.
- Photosensitivity improves fully that content of the sensitizer with respect to 100 mass parts of photosensitive components is 0.05 mass part or more.
- the content of the sensitizer is 10 parts by mass or less, excessive light absorption at the upper part of the coating film is suppressed, and deterioration in adhesion to the substrate due to the conductive pattern having a reverse taper shape is suppressed. be able to.
- the conductive paste of the present invention may contain a solvent.
- the solvent to be used may be appropriately determined according to the solubility of the (C) photosensitive component contained in the conductive paste and the coating method of the conductive paste.
- Examples include -2-propanol, ethylene glycol mono-n-propyl ether, diacetone alcohol, tetrahydrofurfuryl alcohol, diethylene glycol monoethyl ether acetate (hereinafter “DMEA”) or propylene glycol monomethyl ether acetate.
- the conductive paste of the present invention is a non-photosensitive polymer having no unsaturated double bond in the molecule, plasticizer, leveling agent, surfactant, silane coupling agent, as long as the desired properties are not impaired. You may mix
- the non-photosensitive polymer include an epoxy resin, a novolac resin, a phenol resin, a polyimide precursor, or a closed ring polyimide.
- plasticizer examples include dibutyl phthalate, dioctyl phthalate, polyethylene glycol, and glycerin.
- leveling agent examples include a special vinyl polymer or a special acrylic polymer.
- silane coupling agent examples include methyltrimethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, hexamethyldisilazane, 3-methacryloxypropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, and vinyltrimethoxysilane. Methoxysilane is mentioned.
- the conductive paste of the present invention can be prepared using, for example, a dispersing machine or a kneader such as a three-roller, ball mill or planetary ball mill.
- the method for producing a conductive pattern of the present invention includes a coating step of applying the conductive paste of the present invention on a substrate to obtain a coating film, a photolithography process of exposing and developing the coating film to obtain a pattern, and the pattern And a curing step of obtaining a conductive pattern by heating at 100 to 300 ° C.
- the coating step included in the method for producing a conductive pattern of the present invention is a step of coating the conductive paste of the present invention on a substrate to obtain a coating film.
- a substrate to which the conductive paste of the present invention is applied for example, PET film, polyimide film, polyester film, aramid film, epoxy resin substrate, polyetherimide resin substrate, polyetherketone resin substrate, polysulfone resin substrate, glass substrate, A silicon wafer, an alumina substrate, an aluminum nitride substrate, or a silicon carbide substrate can be used.
- a method for applying the conductive paste of the present invention to a substrate for example, spin coating using a spinner, spray coating, roll coating, screen printing, or a blade coater, die coater, calendar coater, meniscus coater or bar coater is used. Applied.
- the obtained coating film may be dried to remove the solvent.
- the method for drying the coating film include an oven, a hot plate, heat drying by infrared irradiation, or vacuum drying.
- the heat drying temperature is generally 50 to 80 ° C., and the heat drying time is generally 1 minute to several hours.
- the film thickness of the coating film obtained in the coating process may be appropriately determined depending on the coating method, the total solid content concentration or the viscosity of the conductive paste, and the like.
- the thickness of the coating film after drying is preferably 0.1 to 50 ⁇ m.
- the photolithographic process included in the method for producing a conductive pattern of the present invention is a process for obtaining a pattern by exposing and developing the coating film obtained in the coating process.
- i-line (365 nm), h-line (405 nm) or g-line (436 nm) of a mercury lamp is preferable.
- a desired pattern can be obtained by removing unexposed portions with a developer.
- the developer used for alkali development include tetramethylammonium hydroxide, diethanolamine, diethylaminoethanol, sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, triethylamine, diethylamine, methylamine, dimethylamine, and dimethyl acetate.
- An aqueous solution of aminoethyl, dimethylaminoethanol, dimethylaminoethyl methacrylate, cyclohexylamine, ethylenediamine or hexamethylenediamine may be mentioned.
- polar solvents such as N-methyl-2-pyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, dimethyl sulfoxide or ⁇ -butyrolactone, alcohols such as methanol, ethanol or isopropanol, ethyl lactate
- esters such as propylene glycol monomethyl ether acetate, ketones such as cyclopentanone, cyclohexanone, isobutyl ketone or methyl isobutyl ketone, or a surfactant may be added.
- Examples of the developer for organic development include N-methyl-2-pyrrolidone, N-acetyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, dimethyl sulfoxide or hexamethylphosphoryl
- Examples thereof include polar solvents such as amides or mixed solutions of these polar solvents and methanol, ethanol, isopropyl alcohol, xylene, water, methyl carbitol or ethyl carbitol.
- a development method for example, a method of spraying a developer onto the surface of the coating film while leaving or rotating the substrate, a method of immersing the substrate in the developer, or a substrate being immersed in the developer
- the method of applying an ultrasonic wave is mentioned.
- the pattern obtained in the development process may be rinsed with a rinse solution.
- a rinse solution examples include water or an aqueous solution in which an alcohol such as ethanol or isopropyl alcohol or an ester such as ethyl lactate or propylene glycol monomethyl ether acetate is added to water.
- the curing process included in the method for producing a conductive pattern of the present invention is a process for obtaining a conductive pattern by heating the pattern obtained in the photolithography process at 100 to 300 ° C.
- Cure is a heating method in which the resin component in the conductive pattern is intentionally left. When the weight reduction rate of the conductive pattern after curing is 5% or less, sufficient adhesion to the substrate can be obtained.
- Examples of the curing method include heat drying using an oven, inert oven or hot plate, heat drying using an electromagnetic wave such as an infrared heater, or vacuum drying.
- Cure temperature must be 100-300 ° C. 120 to 180 ° C. is preferable. When the curing temperature is less than 100 ° C., the volume shrinkage of the pattern does not increase, and the specific resistance of the resulting conductive pattern does not become sufficiently low. On the other hand, when the curing temperature exceeds 300 ° C., a conductive pattern cannot be formed on a substrate having low heat resistance.
- [(B) tin compound] SN-100P (antimony-doped tin oxide; manufactured by Ishihara Sangyo Co., Ltd.) ⁇ T-1 (antimony-doped tin oxide; manufactured by Mitsubishi Materials Corporation) FS-10P (antimony-doped tin oxide, needle-shaped powder with an aspect ratio of 20 to 30; manufactured by Ishihara Sangyo Co., Ltd.) ⁇ E-ITO (Indium Tin Oxide; manufactured by Mitsubishi Materials Corporation) ⁇ SP-2 (Phosphorus-doped tin oxide; manufactured by Mitsubishi Materials Corporation) ⁇ S-2000 (tin oxide; manufactured by Mitsubishi Materials Corporation) ET-300W (Titanium oxide coated with antimony-doped tin oxide (antimony-doped tin oxide content: 18% by mass); manufactured by Ishihara Sangyo Co., Ltd.) FT-1000 (titanium oxide coated with antimony-doped tin oxide (antimony-doped tin oxide
- the reaction solution obtained was purified with methanol to remove unreacted impurities, and further dried under vacuum for 24 hours to obtain an acrylic copolymer (C-1).
- the acid value of the obtained acrylic copolymer (C-1) was 103 mgKOH / g.
- Example 1 In a 100 mL clean bottle, put 10.0 g of acrylic copolymer (C-1), 2.0 g of light acrylate BP-4EA, 0.60 g of IRGACURE 369 and 6.0 g of DMEA. It was mixed with “Tori Rentaro” (ARE-310; manufactured by Sinky Corporation) to obtain 18.6 g of a resin solution (total solid content: 67.7% by mass).
- ARE-310 manufactured by Sinky Corporation
- the conductive paste 1 was applied by screen printing so that the coating thickness after drying was as shown in Table 3, and the obtained coating film was applied in a drying oven at 100 ° C. for 10 minutes. Dried.
- a photomask having a straight line group arranged in a certain line and space hereinafter referred to as “L / S”
- L / S a photomask having a straight line group arranged in a certain line and space
- the exposure was performed using an exposure apparatus (PEM-6M; manufactured by Union Optics Co., Ltd.) with an exposure of 200 mJ / cm 2 (wavelength 365 nm conversion), and the development was performed with a 0.25% by mass Na 2 CO 3 solution.
- the substrate was immersed for 30 seconds, and then rinsed with ultrapure water.
- the conductive paste 1 was applied by screen printing so that the coating thickness after drying was as shown in Table 3, and the obtained coating film was applied in a drying oven at 100 ° C. for 10 minutes. Dried. The dried coating film was exposed and developed through a photomask having 100 translucent patterns 106 shown in FIG. 3 to obtain a pattern. Thereafter, the obtained pattern was cured in a drying oven at 140 ° C. for 1 hour to obtain a conductive pattern for measuring specific resistivity. The line width of the obtained conductive pattern was 0.40 mm, and the line length was 80 mm. The exposure and development conditions were the same as in the patterning evaluation method.
- the film thickness can be measured using a stylus step meter such as Surfcom (registered trademark) 1400 (manufactured by Tokyo Seimitsu Co., Ltd.). More specifically, the film thickness at 10 positions selected at random is measured with a stylus step meter (measurement length: 1 mm, scanning speed: 0.3 mm / sec), and the average value thereof is obtained. Can be calculated.
- the line width can be calculated by observing the line widths at 10 positions selected at random with an optical microscope, analyzing the image data, and obtaining an average value thereof.
- Specific resistivity resistance value ⁇ film thickness ⁇ line width / line length (1).
- the specific resistivity was calculated, and when 100% or more of the 100 specific resistivities were out of the range of the average value ⁇ 20%, C was determined. did.
- the average value is less than 100 ⁇ ⁇ cm, S, 100 ⁇ ⁇ cm or more and less than 150 ⁇ ⁇ cm, A, 150 ⁇ ⁇ cm or more and less than 200 ⁇ ⁇ cm, B, 200 ⁇ ⁇ cm or more. The case of was determined as C.
- the evaluation results are shown in Table 3.
- the coating film thickness after drying the conductive paste 1 is as shown in Table 3 on a 100 ⁇ m thick PET film in which ITO (Indium Tin Oxide) is patterned into strips having a width of 50 ⁇ m, 100 ⁇ m, and 200 ⁇ m. It apply
- the line widths of the obtained conductive patterns 109 were all 15 ⁇ m.
- the resistance values between the terminal portions AB, AC, AD, and AE of the conductive pattern 109 were measured with a resistance meter (RM3544; manufactured by HIOKI), and the contact resistance was calculated by a TLM (Transmission Line Model) method.
- contact resistance was calculated, and a case where 10% or more of the 100 specific resistivities were out of the range of the average value ⁇ 20% was determined as C. For other cases, the case where the average value was 1.5 k ⁇ or less was determined as S.
- a contact resistance value measurement member was obtained using a PET film patterned in a strip shape with a width of 100 ⁇ m in the same manner as described above, and the contact resistance was calculated. .
- a contact resistance value measurement member was obtained using a PET film patterned with a strip of ITO having a width of 200 ⁇ m. Was calculated. When 10% or more of 100 specific resistivities are out of the range of the average value ⁇ 20%, it is determined as C, and for other cases, the average value is 1.5 k ⁇ or less as B and 1.5 k ⁇ . When it exceeded, it was determined as C.
- Table 3 The evaluation results are shown in Table 3.
- Example 2 to 26 A conductive paste having the composition shown in Table 1 or 2 was produced in the same manner as in Example 1 and evaluated in the same manner. The evaluation results are shown in Table 3.
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Abstract
Description
表1及び2に記載の体積平均粒子径の銀粒子。
・SN-100P(アンチモンドープ酸化スズ;石原産業株式会社製)
・T-1(アンチモンドープ酸化スズ;三菱マテリアル株式会社製)
・FS-10P(アンチモンドープ酸化スズ、アスペクト比20~30の針状粉末;石原産業株式会社製)
・E-ITO(インジウムスズ酸化物;三菱マテリアル株式会社製)
・SP-2(リンドープ酸化スズ;三菱マテリアル株式会社製)
・S-2000(酸化スズ;三菱マテリアル株式会社製)
・ET-300W(アンチモンドープ酸化スズで被覆された酸化チタン(アンチモンドープ酸化スズ含有率18質量%);石原産業株式会社製)
・FT-1000(アンチモンドープ酸化スズで被覆された酸化チタン(アンチモンドープ酸化スズ含有率15質量%);石原産業株式会社製)。
・ライトアクリレートBP-4EA(アクリル系モノマー;共栄社化学株式会社製)
(合成例1) EA/メタクリル酸2-エチルヘキシル(以下、「2-EHMA」)/St/AAのアクリル系共重合体(共重合比率(質量部):20/40/20/15)に、グリシジルメタクリレート(以下、「GMA」)を5質量部付加反応させたもの
窒素雰囲気の反応容器中に、150gのDMEAを仕込み、オイルバスを用いて80℃まで昇温した。これに、20gのEA、40gの2-EHMA、20gのSt、15gのAA、0.8gの2,2’-アゾビスイソブチロニトリル及び10gのDMEAからなる混合物を、1時間かけて滴下した。滴下終了後、さらに6時間重合反応を行った。その後、1gのハイドロキノンモノメチルエーテルを添加して、重合反応を停止した。引き続き、5gのGMA、1gのトリエチルベンジルアンモニウムクロライド及び10gのDMEAからなる混合物を、0.5時間かけて滴下した。滴下終了後、さらに2時間付加反応を行った。得られた反応溶液をメタノールで精製することで未反応不純物を除去し、さらに24時間真空乾燥することで、アクリル系共重合体(C-1)を得た。得られたアクリル系共重合体(C-1)の酸価は103mgKOH/gであった。
エチレンオキサイド変性ビスフェノールAジアクリレート(FA-324A;日立化成工業株式会社製)/EA/AAのアクリル系共重合体(共重合比率(質量部):50/10/15)にGMAを5質量部付加反応させたもの
窒素雰囲気の反応容器中に、150gのDMEAを仕込み、オイルバスを用いて80℃まで昇温した。これに、50gのエチレンオキサイド変性ビスフェノールAジアクリレートFA-324A、20gのEA、15gのAA、0.8gの2,2’-アゾビスイソブチロニトリル及び10gのDMEAからなる混合物を、1時間かけて滴下した。滴下終了後、さらに6時間重合反応を行った。その後、1gのハイドロキノンモノメチルエーテルを添加して、重合反応を停止した。引き続き、5gのGMA、1gのトリエチルベンジルアンモニウムクロライド及び10gのDMEAからなる混合物を、0.5時間かけて滴下した。滴下終了後、さらに2時間付加反応を行った。得られた反応溶液をメタノールで精製することで未反応不純物を除去し、さらに24時間真空乾燥することで、アクリル系共重合体(C-2)を得た。得られたアクリル系共重合体(C-2)の酸価は96mgKOH/gであった。
(合成例3)
EA/2-EHMA/BA/N-メチロールアクリルアミド/AAのアクリル系共重合体(共重合比率(質量部):20/40/20/5/15)
窒素雰囲気の反応容器中に、150gのDMEAを仕込み、オイルバスを用いて80℃まで昇温した。これに、20gのEA、40gの2-EHMA、20gのBA、5gのN-メチロールアクリルアミド、15gのAA、0.8gの2,2’-アゾビスイソブチロニトリル及び10gのDMEAからなる混合物を、1時間かけて滴下した。滴下終了後、さらに6時間重合反応を行った。その後、1gのハイドロキノンモノメチルエーテルを添加して、重合反応を停止した。得られた反応溶液をメタノールで精製することで未反応不純物を除去し、さらに24時間真空乾燥することで、アクリル系共重合体(C-3)を得た。得られたアクリル系共重合体(C-3)の酸価は103mgKOH/gであった。
・IRGACURE 369(チバジャパン株式会社製)
[溶剤]
DMEA(東京化成工業株式会社製)。
100mLクリーンボトルに、10.0gのアクリル系共重合体(C-1)、2.0gのライトアクリレートBP-4EA、0.60gのIRGACURE 369及び6.0gのDMEAを入れ、自転公転ミキサー“あわとり錬太郎”(ARE-310;株式会社シンキー社製)で混合して、18.6gの樹脂溶液(全固形分67.7質量%)を得た。
厚さ100μmのPETフィルム上に、導電ペースト1を乾燥後の塗布膜厚が表3記載のとおりになるようにスクリーン印刷法で塗布し、得られた塗布膜を100℃の乾燥オーブンで10分間乾燥した。一定のラインアンドスペース(以下、「L/S」)で配列された直線群すなわち透光パターンを1つのユニットとし、L/Sの値が異なる3種類のユニットをそれぞれ有するフォトマスクを介して、乾燥後の塗布膜を露光及び現像して、L/Sの値が異なる3種類のパターンをそれぞれ得た。その後、得られた3種類のパターンを140℃で1時間、いずれも乾燥オーブンでキュアして、L/Sの値が異なる3種類の導電パターンをそれぞれ得た。なお、フォトマスクが有する各ユニットのL/Sの値は、20/20、15/15、10/10とした(それぞれライン幅(μm)/間隔(μm)を表す)。得られた導電パターンを光学顕微鏡で観察し、パターン間に残渣がなく、かつパターン剥がれのないL/Sの値が最小の導電パターンを確認し、そのL/Sの値が10/10の場合をS、15/15の場合をA、20/20の場合をB、20/20で導電パターンが形成できない場合をC、とそれぞれ判定した。評価結果を表3に示す。なお、露光は露光装置(PEM-6M;ユニオン光学株式会社製)を用いて露光量200mJ/cm2(波長365nm換算)で全線露光を行い、現像は0.25質量%のNa2CO3溶液に基板を30秒浸漬させた後、超純水によるリンス処理を施して行った。
厚さ100μmのPETフィルム上に、導電ペースト1を乾燥後の塗布膜厚が表3記載のとおりになるようにスクリーン印刷法で塗布し、得られた塗布膜を100℃の乾燥オーブンで10分間乾燥した。図3に示す透光パターン106を100個有するフォトマスクを介して、乾燥後の塗布膜を露光及び現像して、パターンを得た。その後、得られたパターンを140℃で1時間、乾燥オーブンでキュアして、比抵抗率測定用の導電パターンを得た。得られた導電パターンの線幅は0.40mmであり、ライン長は80mmであった。なお、露光及び現像の条件は、上記パターニング性の評価方法と同様とした。
比抵抗率 = 抵抗値×膜厚×線幅/ライン長 ・・・ (1)。
ITO(インジウムスズ酸化物)が、幅50μm、100μm、200μmの帯状にパターニングされた厚さ100μmのPETフィルム上に、導電ペースト1を乾燥後の塗布膜厚が表3記載のとおりになるようにスクリーン印刷法で塗布し、得られた塗布膜を100℃の乾燥オーブンで10分間乾燥した。図4に示す透光パターン107を有するフォトマスクを介して、乾燥後の塗布膜を露光及び現像して、パターンを得た。その後、得られたパターンを140℃で1時間、乾燥オーブンでキュアして、図5に示すような、基板110上にITOパターン108と導電パターン109とが形成された、接触抵抗値測定用の部材を得た。なお、露光及び現像の条件は、上記パターニング性の評価方法と同様とした。
比抵抗率測定用の評価と同様の方法で導電パターンを形成した、図6に示す部材を用意し、抵抗計で導電パターン106の抵抗値を測定した。その後、導電パターン106が内側、外側、内側・・・と交互になるように曲率半径5mmで180度折り曲げては元に戻す屈曲動作を1000回繰り返してから、再度抵抗値を測定し、抵抗値の変化率(%)を算出した。抵抗値の変化率が20%以下であり、かつ、導電パターン106にクラック、剥がれおよび断線が生じていない場合をA、それ以外をC、と判定した。評価結果を表3に示す。
表1又は2に示す組成の導電ペーストを実施例1と同様の方法で製造し、同様の評価をした。評価結果を表3に示す。
表2に示す組成の導電ペーストを実施例1と同様の方法で製造し、同様の評価をした。なお、パターニング性の評価がCの判定のものについては、その他の評価を実施しなかった。評価結果を表3に示す。
101 透明電極パターン
102 透明電極パターン
103 絶縁材
104 ブリッジパターン
105 引き回し配線
106 透光パターン
107 透光パターン
108 ITOパターン
109 導電パターン
110 PETフィルム
111 PETフィルム
Claims (9)
- (A)金属粒子、(B)スズ化合物、(C)感光性成分及び(D)光重合開始剤を含有し、
前記(B)スズ化合物は、インジウムスズ酸化物、アンチモンドープ酸化スズ、リンドープ酸化スズ、フッ素ドープ酸化スズ及び酸化スズからなる群から選ばれ、かつ、
全固形分に占める前記(B)スズ化合物の割合が、2~20質量%である、導電ペースト。 - 前記(B)スズ化合物がインジウムスズ酸化物である、請求項1記載の導電ペースト
- 前記(A)金属粒子の体積平均粒子径が、0.1~3.0μmである、請求項1又は2に記載の導電ペースト。
- 前記(B)スズ化合物の体積平均粒子径が、0.01~0.3μmである、請求項1~3のいずれか一項記載の導電ペースト。
- 全固形分に占める前記(A)金属粒子の割合が、60~85質量%である、請求項1~4のいずれか一項記載の導電ペースト。
- 前記(A)金属粒子が、金、銀及び銅からなる群から選ばれる金属の粒子である、請求項1~5のいずれか一項記載の導電ペースト。
- 透明電極パターン、及び、請求項1~6のいずれか一項記載の導電ペーストを用いて形成された導電パターンを備える、タッチセンサー部材。
- 前記透明電極パターンが、互いに独立した複数の透明電極パターンを組み合わせてなり、前記複数の透明電極パターン同士が、前記導電パターンにより接続されている、請求項7記載のタッチセンサー部材。
- 請求項1~6のいずれか一項記載の導電ペーストを基板上に塗布して塗布膜を得る、塗布工程と、前記塗布膜を露光及び現像してパターンを得る、フォトリソ工程と、
前記パターンを100~300℃で加熱して導電パターンを得る、キュア工程と、を備える、導電パターンの製造方法。
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009295325A (ja) * | 2008-06-03 | 2009-12-17 | Fujikura Kasei Co Ltd | 電極用導電性ペーストおよび透明タッチパネル |
WO2014103325A1 (ja) * | 2012-12-28 | 2014-07-03 | 東洋インキScホールディングス株式会社 | 感光性導電性インキ及びその硬化物、並びに導電パターン付き積層体 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100232024A1 (en) * | 2006-06-09 | 2010-09-16 | Dai Nippon Toryo Co., Ltd | Composition for transparent electroconductive film formation, transparent electroconductive film, and display |
CN101842854B (zh) * | 2007-10-31 | 2013-10-30 | 住友金属矿山株式会社 | 柔性透明导电膜及使用柔性透明导电膜的柔性功能性元件 |
US8221958B2 (en) * | 2008-05-30 | 2012-07-17 | E.I. Du Pont De Nemours And Company | Photosensitive paste and sintered layer |
WO2010003138A1 (en) * | 2008-07-03 | 2010-01-07 | Ajjer Llc | Novel electrochromic materials, devices and applications of the same |
JP5236400B2 (ja) * | 2008-09-04 | 2013-07-17 | 太陽ホールディングス株式会社 | 導電ペーストおよびそれを用いた電極 |
JP2012048949A (ja) * | 2010-08-26 | 2012-03-08 | Hitachi Maxell Ltd | 金担持粒子及びその製造方法、並びにその金担持粒子を用いた導電性膜及びその製造方法 |
KR20140115316A (ko) * | 2012-01-19 | 2014-09-30 | 도레이 카부시키가이샤 | 도전 페이스트 및 도전 패턴의 제조 방법 |
JP2013156949A (ja) | 2012-01-31 | 2013-08-15 | Kyocera Display Corp | タッチパネル |
KR20130108696A (ko) | 2012-03-26 | 2013-10-07 | 문현철 | 인터넷으로 송출되는 텔레비젼을 통한 개인 맞춤형 서비스제공 시스템 |
JP5928453B2 (ja) * | 2012-03-28 | 2016-06-01 | 東レ株式会社 | 感光性導電ペーストおよび導電パターンの製造方法 |
JP2013246723A (ja) | 2012-05-28 | 2013-12-09 | Mitsubishi Paper Mills Ltd | 静電容量型タッチパネル用光透過性電極 |
JP2013254360A (ja) | 2012-06-07 | 2013-12-19 | Kyocera Display Corp | タッチパネル |
US8647815B1 (en) * | 2012-07-26 | 2014-02-11 | E I Du Pont De Nemours And Company | Method of manufacturing copper electrode |
US9099215B2 (en) * | 2013-01-21 | 2015-08-04 | E I Du Pont De Nemours And Company | Method of manufacturing non-firing type electrode |
-
2016
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009295325A (ja) * | 2008-06-03 | 2009-12-17 | Fujikura Kasei Co Ltd | 電極用導電性ペーストおよび透明タッチパネル |
WO2014103325A1 (ja) * | 2012-12-28 | 2014-07-03 | 東洋インキScホールディングス株式会社 | 感光性導電性インキ及びその硬化物、並びに導電パターン付き積層体 |
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TWI689564B (zh) | 2020-04-01 |
KR20180028415A (ko) | 2018-03-16 |
JP6729378B2 (ja) | 2020-07-22 |
JPWO2017010343A1 (ja) | 2018-04-26 |
US20180164911A1 (en) | 2018-06-14 |
KR102370118B1 (ko) | 2022-03-04 |
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