JP5967079B2 - 導電ペーストおよび導電パターンの製造方法 - Google Patents
導電ペーストおよび導電パターンの製造方法 Download PDFInfo
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- JP5967079B2 JP5967079B2 JP2013509328A JP2013509328A JP5967079B2 JP 5967079 B2 JP5967079 B2 JP 5967079B2 JP 2013509328 A JP2013509328 A JP 2013509328A JP 2013509328 A JP2013509328 A JP 2013509328A JP 5967079 B2 JP5967079 B2 JP 5967079B2
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- Prior art keywords
- conductive
- weight
- compound
- conductive paste
- acrylate
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- VZTQQYMRXDUHDO-UHFFFAOYSA-N [2-hydroxy-3-[4-[2-[4-(2-hydroxy-3-prop-2-enoyloxypropoxy)phenyl]propan-2-yl]phenoxy]propyl] prop-2-enoate Chemical compound C=1C=C(OCC(O)COC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OCC(O)COC(=O)C=C)C=C1 VZTQQYMRXDUHDO-UHFFFAOYSA-N 0.000 description 3
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Images
Classifications
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- C09D201/00—Coating compositions based on unspecified macromolecular compounds
- C09D201/02—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C09D201/06—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
- C09D201/08—Carboxyl groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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Description
光重合開始剤(D)の添加量としては、酸価が30〜250mgKOH/gの範囲内である化合物(B)100重量部に対し、好ましくは0.05〜30重量部の範囲で添加され、より好ましくは、5〜20重量部である。化合物(B)100重量部に対する光重合開始剤(D)の添加量を5重量部以上とすることにより、特に露光部の硬化密度が増加し、現像後の残膜率を高くすることができる。また、化合物(B)100重量部に対する光重合開始剤(D)の添加量を20重量部以下とすることで、特に光重合開始剤(D)による塗布膜上部での過剰な光吸収を抑制し、導電パターンが逆テーパー形状となり基材との接着性が低下することを抑制することができる。
複合粒子(A)のアスペクト比はSEMもしくはTEM画像から100個の粒子のアスペクト比を求め、その平均値とした。
PETフィルム上に導電ペーストを乾燥厚みが10μmになるように塗布、90℃の乾燥オーブンで5分間乾燥し、一定のラインアンドスペース(L/S)で配列する直線群を1つのユニットとし、L/Sの値が異なる9種類のユニットを有する透光パターンを有するフォトマスクを介して露光、現像、そして130℃で1時間キュアすることによって導電パターンを得た。各ユニットのL/Sの値は500/500、250/250、100/100、50/50、40/40、30/30、25/25、20/20、15/15とした(それぞれライン幅(μm)/間隔(μm)を表す)。パターンを光学顕微鏡により観察し、パターン間に残渣がなく、かつパターン剥がれのない最小のL/Sの値を持つパターンを確認し、この最小のL/Sの値を現像可能なL/Sとした。
PETフィルム上に導電ペーストを乾燥厚みが10μmになるように塗布、90℃の乾燥オーブンで10分間乾燥し、図1に示すパターンの透光部Aを有するフォトマスクを介して露光し、現像そして130℃で1時間乾燥オーブンでキュアすることによって比抵抗率測定用導電性パターンを得た。導電性パターンのライン幅は0.400mm、ライン長さは80mmである。得られたパターンの端部を表面抵抗計でつなぎ、表面抵抗値を測定し、下記の計算式に当てはめて比抵抗率を算出した。なお膜厚の測定は触針式段差計“サーフコム(登録商標)1400”(商品名、(株)東京精密製)を用いて行った。膜厚の測定はランダムに3箇所の位置にて測り、その3点の平均値を膜厚とした。測長は1mm、走査速度は0.3mm/sとした。線幅はパターンを光学顕微鏡でランダムに3箇所の位置を観察し、画像データを解析して得られた3点の平均値を線幅とした。
比抵抗率=表面抵抗値×膜厚×線幅/ライン長
<屈曲性の評価方法>
図2は屈曲性試験に用いたサンプルを模式的に示したものである。縦10mm、横100mmの長方形のPETフィルム(厚み40μm)上に導電ペーストを乾燥厚みが10μmになるように塗布し、90℃の乾燥オーブンで10分間乾燥し、図1に示すパターンの透光部Aを有するフォトマスクを、透光部がサンプル中央になるように配置して露光し、現像、130℃で1時間乾燥オーブンでキュアして導電パターンを形成し、テスターを用いて抵抗値を測定した。その後導電パターンが内側、外側と交互になるように曲げてサンプル短辺Bとサンプル短辺Cを接触させ、元に戻す屈曲動作を100回繰り返した後、再度テスターで抵抗値を測定した。その結果抵抗値の変化量が20%以下であること、且つ導電パターンにクラック、剥がれ、断線などがないものを○とし、そうでないものを×とした。
PETフィルムにITOが全面スパッタされた透明導電フィルム上に導電ペーストを乾燥厚みが10μmになるように塗布し、90℃の乾燥オーブンで10分間乾燥し、図3に示すパターンの透光部Aを有するフォトマスクを介して露光し、現像そして130℃で1時間乾燥オーブンでキュアすることによってITOとの接続信頼性評価サンプルを得た。導電性パターンのライン幅は100μm、ライン間は5mm、端子部は直径2mmの円形である。得られたサンプルの端子部をテスターでつなぎ、初期抵抗を測定した後、85℃、85%RHの恒温恒湿槽“LU−113”(商品名、エスペック(株))に500h投入した。その後、取り出したサンプルの端子部を再度テスターでつなぎ抵抗値を測定し、下記式を用いて抵抗変化率を算出し、1.3以下のものを○、1.3より大きいものは×とした。
抵抗変化率=抵抗値(500h後)/初期抵抗値
実施例、比較例で用いた材料は以下の通りである。
・無機粒子表面にアンチモン含有化合物が被覆されている粒子(A)
ET−300W(商品名、石原産業株式会社製、酸化チタンからなる芯材をアンチモンドープ酸化スズで被覆した複合粒子、アスペクト比1.1、体積平均粒子径0.03〜0.06μm)
ET−500W(商品名、石原産業株式会社製、酸化チタンからなる芯材をアンチモンドープ酸化スズで被覆した複合粒子、アスペクト比1.1、体積平均粒子径0.2〜0.3μm)
FT−1000(商品名、石原産業株式会社製、酸化チタンからなる芯材をアンチモンドープ酸化スズで被覆した複合粒子、アスペクト比12.9、体積平均粒子径0.18μm)
パストラン(登録商標)4410(商品名、三井金属鉱業株式会社製、硫酸バリウムからなる芯材をアンチモンドープ酸化スズで被覆した複合粒子、アスペクト比1.2、体積平均粒子径0.1μm)
・酸価が30〜250mgKOH/gの範囲内である化合物(B)
KAYARAD(登録商標) ASP−010(商品名、日本化薬株式会社製、不飽和二重結合を有さないアクリル系共重合物、酸価46mgKOH/g、ガラス転移温度60℃(DSC測定))
Curalite(登録商標) 2300(商品名、Perstorp社製、ポリエステル系樹脂、酸価229mgKOH/g、ガラス転移温度45℃(DSC測定))
(合成例1)酸価が30〜250mgKOH/gの範囲内である化合物 B−1
エチルアクリレート(EA)/メタクリル酸2−エチルヘキシル(2−EHMA)/スチレン(St)/アクリル酸(AA)の共重合体(共重合比率:20重量部/40重量部/20重量部/15重量部)にグリシジルメタクリレート(GMA)を5重量部付加反応させたもの
窒素雰囲気の反応容器中にジエチレングリコールモノエチルエーテルアセテート150gを仕込みオイルバスを用いて80℃まで昇温した。これに、エチルアクリレート20g、メタクリル酸2−エチルヘキシル40g、スチレン20g、アクリル酸15g、2,2’−アゾビスイソブチロニトリル0.8gおよびジエチレングリコールモノエチルエーテルアセテート10gからなる混合物を1時間かけて滴下した。滴下終了後、さらに6時間重合反応を行った。その後、ハイドロキノンモノメチルエーテル1gを添加して重合反応を停止した。引き続きグリシジルメタクリレート5g、トリエチルベンジルアンモニウムクロライド1gおよびジエチレングリコールモノエチルエーテルアセテート10gからなる混合物を0.5時間かけて滴下した。滴下終了後、さらに2時間付加反応を行った。得られた反応溶液をメタノールで精製することで未反応不純物を除去し、さらに24時間真空乾燥することで化合物B−1を得た。得られた化合物B−1の酸価は103mgKOH/g、式(1)より求めたガラス転移温度は21.7℃であった。
(合成例2)酸価が30〜250mgKOH/gの範囲である化合物 B−2
エチレンオキサイド変性ビスフェノールAジアクリレートFA−324A(製品名、日立化成工業株式会社製)/EA/AAの共重合体(共重合比率:50重量部/10重量部/15重量部)にグリシジルメタクリレート(GMA)を5重量部付加反応させたもの
窒素雰囲気の反応容器中にジエチレングリコールモノエチルエーテルアセテート150gを仕込みオイルバスを用いて80℃まで昇温した。これに、エチレンオキサイド変性ビスフェノールAジアクリレートFA−324Aを50g、エチルアクリレート20g、アクリル酸15g、2,2’−アゾビスイソブチロニトリル0.8gおよびジエチレングリコールモノエチルエーテルアセテート10gからなる混合物を1時間かけて滴下した。滴下終了後、さらに6時間重合反応を行った。その後、ハイドロキノンモノメチルエーテル1gを添加して重合反応を停止した。引き続きグリシジルメタクリレート5g、トリエチルベンジルアンモニウムクロライド1gおよびジエチレングリコールモノエチルエーテルアセテート10gからなる混合物を0.5時間かけて滴下した。滴下終了後、さらに2時間付加反応を行った。得られた反応溶液をメタノールで精製することで未反応不純物を除去し、さらに24時間真空乾燥することで化合物B−2を得た。得られた化合物B−2の酸価は96mgKOH/g、式(1)より求めたガラス転移温度は19.9℃であった。
(合成例3)エポキシエステル3000A(共栄社化学(株)製、分子量:476.7、ビスフェノールA骨格を有する)/メタクリル酸2−エチルヘキシル(2−EHMA)/スチレン(St)/アクリル酸(AA)の共重合体(共重合比率:20重量部/40重量部/20重量部/15重量部)にグリシジルメタクリレート(GMA)を5重量部付加反応させたもの
窒素雰囲気の反応容器中にジエチレングリコールモノエチルエーテルアセテート150gを仕込みオイルバスを用いて80℃まで昇温した。これに、エポキシエステル3000A20g、メタクリル酸2−エチルヘキシル40g、スチレン20g、アクリル酸15g、2,2’−アゾビスイソブチロニトリル0.8gおよびジエチレングリコールモノエチルエーテルアセテート10gからなる混合物を1時間かけて滴下した。滴下終了後、さらに6時間重合反応を行った。その後、ハイドロキノンモノメチルエーテル1gを添加して重合反応を停止した。引き続きグリシジルメタクリレート5g、トリエチルベンジルアンモニウムクロライド1gおよびジエチレングリコールモノエチルエーテルアセテート10gからなる混合物を0.5時間かけて滴下した。滴下終了後、さらに2時間付加反応を行った。得られた反応溶液をメタノールで精製することで未反応不純物を除去し、さらに24時間真空乾燥することで化合物B−3を得た。得られた化合物B−3の酸価は98mgKOH/g、DSC測定から得られたガラス転移温度は43.2℃であった。
(合成例4)エポキシエステル70PA(共栄社化学(株)製、分子量:332.4、脂肪鎖型エポキシアクリレート)/メタクリル酸2−エチルヘキシル(2−EHMA)/スチレン(St)/アクリル酸(AA)の共重合体(共重合比率:20重量部/40重量部/20重量部/15重量部)にグリシジルメタクリレート(GMA)を5重量部付加反応させたもの
窒素雰囲気の反応容器中にジエチレングリコールモノエチルエーテルアセテート150gを仕込みオイルバスを用いて80℃まで昇温した。これに、エポキシエステル70PA20g、メタクリル酸2−エチルヘキシル40g、スチレン20g、アクリル酸15g、2,2’−アゾビスイソブチロニトリル0.8gおよびジエチレングリコールモノエチルエーテルアセテート10gからなる混合物を1時間かけて滴下した。滴下終了後、さらに6時間重合反応を行った。その後、ハイドロキノンモノメチルエーテル1gを添加して重合反応を停止した。引き続きグリシジルメタクリレート5g、トリエチルベンジルアンモニウムクロライド1gおよびジエチレングリコールモノエチルエーテルアセテート10gからなる混合物を0.5時間かけて滴下した。滴下終了後、さらに2時間付加反応を行った。得られた反応溶液をメタノールで精製することで未反応不純物を除去し、さらに24時間真空乾燥することで化合物B−4を得た。得られた化合物B−4の酸価は96mgKOH/g、DSC測定から得られたガラス転移温度は23.5℃であった。
(合成例5)反応容器にエポキシエステル3000A(共栄社化学(株)製、分子量:476.7、ビスフェノールA骨格を有する)200g、反応用溶媒としてジエチレングリコールモノエチルエーテルアセテート500g、熱重合禁止剤として2−メチルハイドロキノンを0.5g、カルボキシル基を有するジオール化合物としてジヒドロキシプロピオン酸(分子量:106.1)75g加え、45℃に昇温させた。この溶液にヘキサメチレンジイソシアネート(分子量:168.2)84.1g加え、反応温度が50℃を超えないように徐々に滴下した。滴下終了後、温度を80℃に上昇させ、赤外吸収スペクトル測定法により、2250cm−1付近の吸収がなくなるまで6時間反応させた。この溶液に分子中にグリシジルメタクリレート(分子量:142.2)165g添加後、95℃に昇温し、6時間反応させることで化合物B−5を得た。得られた化合物B−5の51.2重量%の樹脂溶液を得た。得られた化合物B−5の酸価は89mgKOH/g、DSC測定から得られたガラス転移温度は27.2℃であった。
・導電性フィラー(C)
表1に記載の材料、体積平均粒子径のものを用いた。なお、体積平均粒子径は以下の方法により求めた。
・光重合開始剤(D)
IRGACURE(登録商標)369(商品名、チバジャパン株式会社製)
<体積平均粒子径の測定>
HORIBA社製動的光散乱式粒度分布計により、導電性フィラー(C)の体積平均粒子径を測定した。
・モノマー:ライトアクリレートBP−4EA(共栄社化学株式会社製)
・溶剤:ジエチレングリコールモノエチルエーテルアセテート(東京化成工業株式会社製)
・無機粒子を含まないアンチモン含有化合物および導電性酸化スズ粒子
SN−100P(商品名、石原産業株式会社製)
FS−10P(商品名、石原産業株式会社製)
T−1(商品名、三菱マテリアル電子化成株式会社製)
(実施例1)
100mLクリーンボトルに化合物B−1を10.0g、光重合開始剤IRGACURE(登録商標)369(チバジャパン株式会社製)を0.50g、ジエチレングリコールモノエチルエーテルアセテートを5.0gいれ、“あわとり錬太郎”(登録商標;商品名、ARE−310、株式会社シンキー社製)で混合し、樹脂溶液15.5g(固形分67.7重量%)を得た。
表1に示す組成の導電ペーストを実施例1と同様の方法で製造し、評価結果を表2に示した。
表1に示す組成の導電ペーストを実施例1と同様の方法で製造し、評価結果を表2に示した。
B、C サンプル短辺
D 導電パターン
E PETフィルム
Claims (1)
- 無機材料からなる芯材表面をアンチモン含有化合物で被覆してなる複合粒子(A)、酸価が30〜250mgKOH/gの範囲であるポリマー(B)、導電性フィラー(C)を含み、該アンチモン含有化合物がアンチモンドープ酸化スズである導電ペーストを基板上に塗布し、露光し、現像した後に100℃以上300℃以下の温度でキュアすることを特徴とする導電パターンの製造方法。
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WO2015040908A1 (ja) * | 2013-09-20 | 2015-03-26 | 東洋紡株式会社 | 感光性導電ペースト、導電性薄膜、電気回路、及びタッチパネル |
CN105531626B (zh) * | 2013-09-25 | 2020-01-14 | 东丽株式会社 | 感光性遮光糊剂和接触式传感器用层叠图案的制造方法 |
JP6019214B2 (ja) * | 2013-10-25 | 2016-11-02 | 三井金属鉱業株式会社 | 導電性粒子及びその製造方法 |
KR102324621B1 (ko) * | 2014-01-22 | 2021-11-11 | 도요보 가부시키가이샤 | 레이저 에칭 가공용 도전성 페이스트, 도전성 박막, 도전성 적층체 |
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JP2016132679A (ja) * | 2015-01-15 | 2016-07-25 | ナガセケムテックス株式会社 | 導電層形成用組成物、導電積層体、電磁波シールド部材及び立体形状を有する導電積層体の製造方法 |
WO2016171083A1 (ja) | 2015-04-21 | 2016-10-27 | 東レ株式会社 | 導電パターン形成部材の製造方法 |
JP6729378B2 (ja) * | 2015-07-10 | 2020-07-22 | 東レ株式会社 | 導電ペースト、タッチセンサー部材及び導電パターンの製造方法 |
WO2018053839A1 (zh) * | 2016-09-26 | 2018-03-29 | 深圳市柔宇科技有限公司 | 触摸传感器及其制作方法 |
CN106971789A (zh) * | 2017-03-18 | 2017-07-21 | 苏州思创源博电子科技有限公司 | 一种透明金属导电薄膜的制备方法 |
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TWI233769B (en) * | 1998-11-26 | 2005-06-01 | Kansai Paint Co Ltd | Method of forming conductive pattern |
US7157507B2 (en) * | 1999-04-14 | 2007-01-02 | Allied Photochemical, Inc. | Ultraviolet curable silver composition and related method |
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JP2002323756A (ja) * | 2001-04-25 | 2002-11-08 | Kansai Paint Co Ltd | ネガ型感エネルギー線性ペースト及びそれを使用したパターン形成方法 |
US20030151028A1 (en) * | 2002-02-14 | 2003-08-14 | Lawrence Daniel P. | Conductive flexographic and gravure ink |
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JP2006143809A (ja) * | 2004-11-17 | 2006-06-08 | Kansai Paint Co Ltd | 水性塗料及び塗膜形成方法 |
JP4983150B2 (ja) * | 2006-04-28 | 2012-07-25 | 東洋インキScホールディングス株式会社 | 導電性被膜の製造方法 |
US7678296B2 (en) * | 2006-05-04 | 2010-03-16 | E. I. Du Pont De Nemours And Company | Black conductive thick film compositions, black electrodes, and methods of forming thereof |
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JP5169501B2 (ja) * | 2008-06-03 | 2013-03-27 | 藤倉化成株式会社 | 電極用導電性ペーストおよび透明タッチパネル |
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