WO2016192489A1 - 板卡组件和机柜 - Google Patents

板卡组件和机柜 Download PDF

Info

Publication number
WO2016192489A1
WO2016192489A1 PCT/CN2016/080263 CN2016080263W WO2016192489A1 WO 2016192489 A1 WO2016192489 A1 WO 2016192489A1 CN 2016080263 W CN2016080263 W CN 2016080263W WO 2016192489 A1 WO2016192489 A1 WO 2016192489A1
Authority
WO
WIPO (PCT)
Prior art keywords
cover plate
board
card
card body
heat sink
Prior art date
Application number
PCT/CN2016/080263
Other languages
English (en)
French (fr)
Inventor
王冲
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2016192489A1 publication Critical patent/WO2016192489A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • This document relates to, but is not limited to, the field of electronic device technology.
  • the current high-speed, high-density electronic design requires high heat dissipation for the cabinet system.
  • plug-in type electronic equipment a type of cabinet
  • a board along the board will be formed on the board 2'
  • the heat dissipation wind of the 2' board direction shows the direction of the heat dissipating wind, and the back panel socket 10'. All the heat sink members 1' (i.e., chips) on the card 2' need to be dissipated by the heat dissipating wind.
  • the usual treatment for the problems existing in the related art is to increase the fan speed to increase the wind speed of the heat dissipating wind, and to increase the air flow in the heat dissipating bottleneck region 5' in a disguised manner to accelerate heat dissipation.
  • the increase in fan speed not only increases the power consumption of the device, but also is the main source of equipment noise, which is one of the factors that cause poor feedback in the equipment market.
  • the present invention provides a board assembly capable of effectively improving the heat dissipation efficiency of the heat sink member while keeping the equipment noise low during use.
  • a card assembly comprising: one or more components to be heat sink; a heat sink to be mounted on the board surface a card body; a panel fixed at an edge of the outer edge of the card body and facing the inner surface of the card; and a cover plate mounted on the main body of the card, the cover plate and the opposite surface of the card body are spaced apart
  • the cover member is not between the cover plate and the opposite plate faces of the card body, and the cover plate does not protrude from the panel in a direction perpendicular to the plate body surface.
  • the heat sink member includes a plurality of plates mounted on the upper surface of the card body, and a lower plate edge of the panel is fixed to an outer edge of the card body, and the cover plate is The upper plate surface is lower than the upper plate edge of the panel, and the heat sink member is spaced from the cover plate.
  • the upper plate surface of the cover plate is 1 mm lower than the upper plate edge of the panel.
  • the cover has a thickness of 1 mm.
  • the cover material is made of aluminum, stainless steel, plastic or polyethylene.
  • the cover plate has a wind deflecting slope corresponding to the heat dissipation bottleneck region of the card body
  • the heat dissipating wind that runs between the cover plate and the card body from the inner end of the card body toward the outer end thereof is blown toward the heat sink member at the heat dissipation bottleneck region by the air guiding slope.
  • an opening is formed on the cover plate corresponding to the card body of the card body, and an inner end edge of the opening away from the panel side extends obliquely toward the card body side to form a wind deflector
  • the surface of the air deflector facing the board body is the air guiding slope.
  • the wind deflector is inclined at 45 degrees to the panel side.
  • the card body is provided with a stud, and the cover plate is fixed on the stud.
  • a cabinet includes: a cabinet body; and the board assembly according to any one of the preceding embodiments, wherein an inner end of the card assembly is connected to the cabinet body through a backplane socket.
  • the card component provided by the embodiment of the present invention has at least the following features:
  • the card assembly provided by the embodiment of the invention has a cover plate mounted on the card body, and the cover plate prevents the heat dissipation wind from being lost outward, thereby increasing the wind pressure of the heat dissipation wind between the cover plate and the card body, so that the cover plate
  • the heat sink member is better cooled than the heat sink member.
  • FIG. 1 is a schematic structural view of a board, a heat sink member, a panel, and a backplane socket provided by the related art
  • Figure 2 is a schematic cross-sectional view of the left side of Figure 1;
  • FIG. 3 is a schematic structural view of a card assembly according to an embodiment of the present invention, wherein the cover plate is see-through;
  • FIG. 4 is a left side cross-sectional structural view of the card assembly of FIG. 3.
  • the board assembly provided by the embodiment of the present invention, as shown in FIG. 3 and FIG. 4, is used for a cabinet, comprising: one or more components to be heatsink 1; a card body 2 to which the heat sink component 1 is mounted on the board surface;
  • the outer side of the board body 2 ie, the left end side of the board group body in FIG. 3
  • the inner board surface faces the panel (not shown) of the heat sink member 1; and is mounted on the board body 2
  • the cover plate 4 the cover plate 4 is spaced apart from the two plate faces of the card body 2, and the heat sink member 1 is located between the cover plate 4 and the opposite plate faces of the card body 2, and perpendicular to the board surface of the card body 2
  • the upper cover 4 does not protrude from the panel.
  • the card assembly provided by the embodiment of the invention has a cover plate mounted on the card body, and the cover plate prevents the heat dissipation wind from being lost outward, thereby increasing the wind pressure of the heat dissipation wind between the cover plate and the card body, so that The heat sink member between the cover plate and the card body is better cooled.
  • the ground meets the user's needs.
  • the board component provided by the embodiment of the present invention further has the following features:
  • the heat sink member 1 includes a plurality of plates mounted on the upper surface of the card body 2, and the lower plate edge of the panel is fixed to the outer edge of the card body 2, and the cover plate is fixed.
  • the upper plate surface of 4 is lower than the upper plate edge of the panel, and the heat sink member 1 is spaced from the cover plate 4 to ensure that the heat dissipation wind can pass between the heat sink member 1 and the cover plate 4, thereby better treating the heat sink member. 1 for heat dissipation.
  • the upper plate surface of the cover plate 4 is lower than the upper plate edge of the panel, so that when the card assembly is mounted on the cabinet, the cover plate 34 does not interfere with the insertion operation, and the normal installation of the card assembly on the cabinet is ensured.
  • the upper plate surface of the cover plate 4 may also be flush with the upper plate edge of the panel, and the purpose of the present application may also be achieved, and details are not described herein, but are within the scope of protection of the present application.
  • the upper plate surface of the cover plate 4 is 1 mm lower than the upper plate edge of the panel, and the cover plate 4 has a thickness of 1 mm.
  • the card assembly provided by the embodiment of the invention has a cover plate mounted on the card body, and the cover plate prevents the heat dissipation wind from being lost outward, thereby increasing the wind pressure of the heat dissipation wind between the cover plate and the card body, so that the cover plate
  • the heat sink member is better cooled than the heat sink member.
  • it is not necessary to increase the rotational speed of the fan which effectively ensures that the noise of the card assembly does not increase during use, and better satisfies the requirements. User's usage needs.
  • the upper plate surface of the cover plate 4 is lower than the upper plate edge of the panel by 2 mm, and the thickness of the cover plate 4 is 1.5 mm; the object of the present application can also be achieved, and the purpose thereof does not deviate from the design of the present invention. The idea is not repeated here, but it should be within the scope of protection of this application.
  • the material of the cover plate 4 is aluminum, stainless steel, plastic, polyethylene, etc., and is preferably aluminum material with better heat dissipation.
  • the heat dissipation bottle neck region 5 corresponding to the card body 2 has a wind guiding slope 6 on the cover plate 4; between the cover plate 4 and the card body 2, from the inner end of the card body 2 to the outside
  • the heat-dissipating wind of the end direction is blown to the heat-receiving member 1 at the heat-dissipating bottleneck region 5 under the action of the air-conducting slope 6, thereby better improving the heat dissipation of the heat-receiving member 1 at the heat-dissipating bottleneck region 5, the heat-receiving member 1 better achieved
  • the purpose of rapid heat dissipation is blown to the heat-receiving member 1 at the heat-dissipating bottleneck region 5.
  • the cover 4 has an opening 7 corresponding to the heat-dissipating bottleneck region 5 of the card body 2, and the inner end of the opening 7 away from the panel side extends obliquely toward the card body 2 to form a wind deflector 8 for guiding the wind.
  • the plate surface of the sub-board 8 facing the card body 2 is a wind guiding bevel 6.
  • the wind deflector 8 is formed by stamping on the cover 4, which can improve the production efficiency and cost of the cover 4, and at the same time ensure the strength of the cover 4.
  • the wind deflector 8 is inclined at 45 degrees to the panel side, and the heat dissipation wind is blown toward the heat sink member 1 by the air deflector 8 to not only take a large amount of heat, but also does not form a vortex here.
  • the heat dissipation of the heat sink member 1 at the heat dissipation bottleneck region 5 is better realized.
  • the air deflector 8 may be inclined to the panel side by 30 degrees, 60 degrees, etc., and the object of the present application may be achieved.
  • the purpose of the present invention is not deviated from the design idea of the present invention, and will not be described herein, but belongs to the present application. Within the scope of protection.
  • the board body 2 is provided with five studs 9, and the cover plate 4 is fixed on the studs 9, and at the inner end side of the card body 2 (the right end side of the card body in Fig. 3) A backplane socket 10 is provided.
  • the cabinet provided by the embodiment of the present invention includes: a cabinet body; and the board component described in any one of the foregoing embodiments.
  • the inner end of the board component is connected to the cabinet body through the backboard socket 10.
  • the cabinet provided in the embodiment of the present invention has all the advantages of the card assembly provided by any of the foregoing embodiments, and details are not described herein again.
  • the card component provided by the embodiment of the present invention has at least the following features:
  • the card assembly provided by the embodiment of the invention has a cover plate mounted on the card body, and the cover plate prevents the heat dissipation wind from being lost outward, thereby increasing the wind pressure of the heat dissipation wind between the cover plate and the card body, so that the cover plate
  • the heat sink member is better cooled than the heat sink member.
  • connection may be a fixed connection, a detachable connection, or an integral connection; it may be directly connected or indirectly connected through an intermediate medium.
  • connection may be a fixed connection, a detachable connection, or an integral connection; it may be directly connected or indirectly connected through an intermediate medium.
  • Embodiments of the present invention implement a card assembly by one or more components to be heat sinked, a card body, one or more panels, and a cover.
  • the cover plate prevents the heat dissipation wind from being dissipated outward, and the purpose of increasing the wind pressure of the heat dissipation wind between the cover plate and the card body is to make the heat sink member between the cover plate and the card body body better dissipate heat, but here In the process, it is not necessary to increase the speed of the fan, which effectively ensures that the noise of the board component does not increase during use, and better meets the user's use requirements.

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本文公开了一种板卡组件和机柜。板卡组件包括：一个或多个待散热器件；板面上安装有待散热器件的板卡本体；固定在板卡本体外板边处、且内板面朝向待散热器件的面板；和安装在板卡本体上的盖板，盖板与板卡本体相对的两板面相间隔，待散热器件处于盖板和板卡本体相对的两板面之间，且垂直于板卡本体板面的方向上盖板不凸出面板。

Description

板卡组件和机柜 技术领域
本文涉及但不限于电子设备技术领域。
背景技术
当前高速率、高密度的电子设计，对机柜***的散热要求较高。如：插箱类电子设备(属于机柜的一种)，以风冷散热为主，如图1和图2所示，无论***的风道如何设计，在板卡2’上都会形成沿板卡2’板面方向(由板卡2’内端向外端)的散热风，如图1和图2示出了散热风的走向、以及背板插座10’。板卡2’上所有待散热器件1’(即：芯片)均需要通过该散热风进行散热。
然而，相邻待散热器件1’之间不可避免的会出现遮挡的问题(即：沿散热风的流动方向，位于后侧的待散热器件1’遮挡位于前侧的待散热器件1’)，而被遮挡的这些待散热器件1’中的某些也不适合安装散热片，这些既被遮挡同时又不适合安装散热片的待散热器件1’处的空气流动就会变得较差而形成散热瓶颈区5’，最终影响***长期可靠工作的稳定性。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
针对相关技术中存在的问题通常采取的处理办法是提高风扇转速、来增加散热风的风速，变相增大散热瓶颈区5’的空气流动，加快散热。而风扇转速的提高不仅仅增加设备的功耗，还是设备噪声主要来源，这也是造成设备市场反映较差的因素之一。
为了解决上述技术问题，本文提供了一种板卡组件，能够在使用过程中保持设备噪声较小的情况下有效提升待散热器件的散热效率。
一种板卡组件，包括：一个或多个待散热器件；板面上安装有待散热器 件的板卡本体；固定在板卡本体外板边处、且内板面朝向待散热器件的面板；和安装在板卡本体上的盖板，盖板与板卡本体相对的两板面相间隔，待散热器件处于盖板和板卡本体相对的两板面之间，且垂直于板卡本体板面的方向上盖板不凸出面板。
可选地，所述待散热器件包括安装在所述板卡本体上板面上的多个，所述面板的下板边与所述板卡本体的外板边相固定，所述盖板的上板面低于所述面板的上板边，所述待散热器件与所述盖板相间隔。
可选地，所述盖板的上板面低于所述面板的上板边1mm。
可选地，所述盖板的厚度为1mm。
可选地，所述盖板的材质为铝、不锈钢、塑料或聚乙烯。
可选地，所述盖板上对应于所述板卡本体的散热瓶颈区处具有导风斜面；
所述盖板和所述板卡本体之间、自所述板卡本体的内端向其外端走向的散热风，在导风斜面的作用下吹向散热瓶颈区处的待散热器件。
可选地，所述盖板上对应所述板卡本体的散热瓶颈区处具有开口，所述开口的远离所述面板侧的内端边向所述板卡本体侧倾斜延伸形成导风子板，所述导风子板的朝向所述板卡本体的板面为所述导风斜面。
可选地，所述导风子板向所述面板侧倾斜45度。
可选地，所述板卡本体上设置有螺柱，所述盖板固定在所述螺柱上。
一种机柜，包括：机柜本体；和上述任一实施例所述的板卡组件，所述板卡组件的内端通过背板插座与所述机柜本体插接相连。
本发明实施例提供的板卡组件与相关技术相比，至少具备如下特点：
本发明实施例提供的板卡组件，在板卡本体上安装了盖板，盖板阻止散热风向外散失，起到了增加盖板与板卡本体之间散热风的风压的目的，使得盖板与板卡本体之间的待散热器件更好地进行了散热，然而在此过程中并不需要增加风扇的转速，有效保证了板卡组件在使用过程中噪音不会增加，更好地满足了用户的使用需求。
在阅读并理解了附图和详细描述后，可以明白其他方面。
附图说明
图1是相关技术提供的板卡、待散热器件、面板和背板插座相组装后的结构示意图；
图2是图1的左视剖视结构示意图；
图3是本发明一个实施例所述的板卡组件的结构示意图，其中盖板透视；
图4是图3所示板卡组件的左视剖视结构示意图。
其中，图1和图2中附图标记与部件名称之间的对应关系为：
1’待散热器件，2’板卡，3’面板，5’散热瓶颈区，10’背板插座。
图3和图4中附图标记与部件名称之间的对应关系为：
1 待散热器件，2 板卡本体，4 盖板，5 散热瓶颈区，6 导风斜面，7 开口，8 导风子板，9 螺柱，10 背板插座。
具体实施方式
下文中将结合附图对本发明的实施方式进行详细说明。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互任意组合。
下面结合附图描述本发明一些实施例所述的板卡组件和机柜。
本发明实施例提供的板卡组件，如图3和图4所示，用于机柜，包括：一个或多个待散热器件1；板面上安装有待散热器件1的板卡本体2；固定在板卡本体2外板边(即：图3中板卡组本体的左端边)处、且内板面朝向待散热器件1的面板(图中未示出)；和安装在板卡本体2上的盖板4，盖板4与板卡本体2相对的两板面相间隔，待散热器件1处于盖板4和板卡本体2相对的两板面之间，且垂直于板卡本体2板面的方向上盖板4不凸出面板。
本发明实施例提供的板卡组件，在板卡本体上安装了盖板，盖板阻止散热风向外散失，起到了增加盖板与板卡本体之间散热风的风压的目的，使得 盖板与板卡本体之间的待散热器件更好地进行了散热，然而在此过程中并不需要增加风扇的转速，有效保证了板卡组件在使用过程中机柜噪音不会增加，更好地满足了用户的使用需求。
其中，图3和图4中示出了散热风的走向。
另外，本发明实施例提供的板卡组件还具有如下特点：
本发明的一个实施例中，可选地，待散热器件1包括安装在板卡本体2上板面上的多个，面板的下板边与板卡本体2的外板边相固定，盖板4的上板面低于面板的上板边，待散热器件1与盖板4相间隔，保证散热风可在待散热器件1和盖板4之间通过，以此来更好地对待散热器件1进行散热。
盖板4的上板面低于面板的上板边，这样板卡组件在安装于机柜上时，盖板34不会对插装动作进行干涉，保证了板卡组件在机柜上的正常安装。
当然，盖板4的上板面也可以是与面板的上板边平齐，也可实现本申请的目的，在此不再赘述，但应属于本申请的保护范围内。
可选地，盖板4的上板面低于面板的上板边1mm，盖板4的厚度为1mm。本发明实施例提供的板卡组件，在板卡本体上安装了盖板，盖板阻止散热风向外散失，起到了增加盖板与板卡本体之间散热风的风压的目的，使得盖板与板卡本体之间的待散热器件更好地进行了散热，然而在此过程中并不需要增加风扇的转速，有效保证了板卡组件在使用过程中噪音不会增加，更好地满足了用户的使用需求。
当然，也可以是：盖板4的上板面低于面板的上板边2mm，盖板4的厚度为1.5mm等设计形式；也可实现本申请的目的，其宗旨未脱离本发明的设计思想，在此不再赘述，但应属于本申请的保护范围内。
可选地，盖板4的材质为铝、不锈钢、塑料或聚乙烯等，优选为散热性较好的铝材质。
另外，可选地，盖板4上对应于板卡本体2的散热瓶颈区5处具有导风斜面6；盖板4和板卡本体2之间、自板卡本体2的内端向其外端走向的散热风，在导风斜面6的作用下吹向散热瓶颈区5处的待散热器件1，更好地提升了散热瓶颈区5处的待散热器件1的散热性，该待散热器件1更好地实现 了快速散热的目的。
可选地，盖板4上对应板卡本体2的散热瓶颈区5处具有开口7，开口7的远离面板侧的内端边向板卡本体2侧倾斜延伸形成导风子板8，导风子板8的朝向板卡本体2的板面为导风斜面6。
可选地，导风子板8在盖板4上采用冲压的方式制成，这样可以提升盖板4的生产效率及成本，同时也能够保证盖板4的强度。
当然，导风子板8和盖板4之间采用焊接相连等方式也可实现本申请的目的，其宗旨未脱离本发明的设计思想，在此不再赘述，但应属于本申请的保护范围内。
可选地，导风子板8向面板侧倾斜45度，散热风在导风子板8的作用下吹向待散热器件1，不仅带走了大量的热量，还不会在此处形成涡流，更好地实现了对散热瓶颈区5处的待散热器件1进行散热。
当然，导风子板8向面板侧倾斜也可以是30度、60度等，均可实现本申请的目的，其宗旨未脱离本发明的设计思想，在此不再赘述，但应属于本申请的保护范围内。
再者，板卡本体2上设置有五个螺柱9，盖板4固定在螺柱9上，而且，在板卡本体2的内端边(图3中板卡本体的右端边)处还设置有背板插座10。
本发明实施例提供的机柜，包括：机柜本体；和上述任一实施例所述的板卡组件，板卡组件的内端通过背板插座10与机柜本体插接相连。
本发明实施例提供的机柜具有上述任一实施例提供的板卡组件的全部优点，在此不再赘述。
本发明实施例提供的板卡组件与相关技术相比，至少具备如下特点：
本发明实施例提供的板卡组件，在板卡本体上安装了盖板，盖板阻止散热风向外散失，起到了增加盖板与板卡本体之间散热风的风压的目的，使得盖板与板卡本体之间的待散热器件更好地进行了散热，然而在此过程中并不需要增加风扇的转速，有效保证了板卡组件在使用过程中噪音不会增加，更好地满足了用户的使用需求。
在本申请的描述中，术语“安装”、“相连”、“连接”、“固定”等 均应做广义理解，例如，“连接”可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是直接相连，也可以通过中间媒介间接相连。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本说明书的描述中，术语“一个实施例”、“一些实施例”、“具体实施例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或实例。而且，描述的具体特征、结构、材料或特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
虽然本发明所揭露的实施方式如上，但所述的内容仅为便于理解本发明而采用的实施方式，并非用以限定本发明。任何本发明所属领域内的技术人员，在不脱离本发明所揭露的精神和范围的前提下，可以在实施的形式及细节上进行任何的修改与变化，但本发明的专利保护范围，仍须以所附的权利要求书所界定的范围为准。
工业实用性
本发明实施例通过一个或多个待散热器件、一个板卡本体、一个或多个面板和一个盖板实现了板卡组件。盖板阻止散热风向外散失，起到了增加盖板与板卡本体之间散热风的风压的目的，使得盖板与板卡本体之间的待散热器件更好地进行了散热，然而在此过程中并不需要增加风扇的转速，有效保证了板卡组件在使用过程中噪音不会增加，更好地满足了用户的使用需求。

Claims (10)

  1. 一种板卡组件，包括：一个或多个待散热器件(1)；板面上安装有待散热器件(1)的板卡本体(2)；
    固定在板卡本体(2)外板边处、且内板面朝向待散热器件(1)的面板；和
    安装在板卡本体(2)上的盖板(4)，盖板(4)与板卡本体(2)相对的两板面相间隔，待散热器件(1)处于盖板(4)和板卡本体(2)相对的两板面之间，且垂直于板卡本体(2)板面的方向上盖板(4)不凸出面板。
  2. 根据权利要求1所述的板卡组件，其中，所述待散热器件(1)包括安装在所述板卡本体(2)上板面上的多个，所述面板的下板边与所述板卡本体(2)的外板边相固定，所述盖板(4)的上板面低于所述面板的上板边，所述待散热器件(1)与所述盖板(4)相间隔。
  3. 根据权利要求2所述的板卡组件，其中，所述盖板(4)的上板面低于所述面板的上板边1mm。
  4. 根据权利要求2所述的板卡组件，其中，所述盖板(4)的厚度为1mm。
  5. 根据权利要求2所述的板卡组件，其中，所述盖板(4)的材质为铝、不锈钢、塑料或聚乙烯。
  6. 根据权利要求1至5中任一项所述的板卡组件，其中，所述盖板(4)上对应于所述板卡本体(2)的散热瓶颈区(5)处具有导风斜面(6)；
    所述盖板(4)和所述板卡本体(2)之间、自所述板卡本体(2)的内端向其外端走向的散热风，在导风斜面(6)的作用下吹向散热瓶颈区(5)处的待散热器件(1)。
  7. 根据权利要求6所述的板卡组件，其中，所述盖板(4)上对应所述板卡本体(2)的散热瓶颈区(5)处具有开口(7)，所述开口(7)的远离所述面板侧的内端边向所述板卡本体(2)侧倾斜延伸形成导风子板(8)，所述导风子板(8)的朝向所述板卡本体(2)的板面为所述导风斜面(6)。
  8. 根据权利要求7所述的板卡组件，其中，所述导风子板(8)向所述面板侧倾斜45度。
  9. 根据权利要求1至5中任一项所述的板卡组件，其中，所述板卡本体(2)上设置有螺柱(9)，所述盖板(4)固定在所述螺柱(9)上。
  10. 一种机柜，包括：
    机柜本体；和
    如权利要求1至9中任一项所述的板卡组件，所述板卡组件的内端通过背板插座(10)与所述机柜本体插接相连。
PCT/CN2016/080263 2015-06-01 2016-04-26 板卡组件和机柜 WO2016192489A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510294241.6A CN106304767A (zh) 2015-06-01 2015-06-01 板卡组件和机柜本体
CN201510294241.6 2015-06-01

Publications (1)

Publication Number Publication Date
WO2016192489A1 true WO2016192489A1 (zh) 2016-12-08

Family

ID=57440184

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/080263 WO2016192489A1 (zh) 2015-06-01 2016-04-26 板卡组件和机柜

Country Status (2)

Country Link
CN (1) CN106304767A (zh)
WO (1) WO2016192489A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115275840A (zh) * 2022-08-18 2022-11-01 广州市霸业电气自动化成套设备有限公司 一种基于风光互补供电技术的新能源配电箱

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030095381A1 (en) * 2001-11-19 2003-05-22 Lee Mario J. Electronic card cooling
US20040100773A1 (en) * 2002-11-21 2004-05-27 Hoffman Mark S. Circuit board cover with exhaust apertures for cooling electronic components
CN101212892A (zh) * 2006-12-27 2008-07-02 日本电气株式会社 插接件和电子装置
CN201156862Y (zh) * 2008-01-28 2008-11-26 鸿富锦精密工业（深圳）有限公司 具有导风板的网络设备

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202232012U (zh) * 2011-09-14 2012-05-23 中国北车股份有限公司大连电力牵引研发中心 散热器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030095381A1 (en) * 2001-11-19 2003-05-22 Lee Mario J. Electronic card cooling
US20040100773A1 (en) * 2002-11-21 2004-05-27 Hoffman Mark S. Circuit board cover with exhaust apertures for cooling electronic components
CN101212892A (zh) * 2006-12-27 2008-07-02 日本电气株式会社 插接件和电子装置
CN201156862Y (zh) * 2008-01-28 2008-11-26 鸿富锦精密工业（深圳）有限公司 具有导风板的网络设备

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115275840A (zh) * 2022-08-18 2022-11-01 广州市霸业电气自动化成套设备有限公司 一种基于风光互补供电技术的新能源配电箱
CN115275840B (zh) * 2022-08-18 2023-06-13 广州市霸业电气自动化成套设备有限公司 一种基于风光互补供电技术的新能源配电箱

Also Published As

Publication number Publication date
CN106304767A (zh) 2017-01-04

Similar Documents

Publication Publication Date Title
US9795066B2 (en) Inverter
CN100562238C (zh) 散热装置
JP6526067B2 (ja) 放熱装置
US7826224B2 (en) Fan and fan assembly
US8363401B2 (en) Air guiding device and heat dissipation system having same
TW201228579A (en) Electronic device and heat dissipation device thereof
US8982555B2 (en) Electronic device having passive cooling
WO2014183702A1 (zh) 用于强制风冷型机柜的导风插箱及强制风冷型机柜
US20160192538A1 (en) Heat dissipation device and electronic device
WO2016192489A1 (zh) 板卡组件和机柜
TWI421025B (zh) 散熱裝置
CN110149781A (zh) 散热装置及设有其的电器设备
CN207424777U (zh) 一种散热机箱
US10643923B2 (en) Case and electronic device having the same
CN204994210U (zh) 一种带有垂直风道的散热器
TWM499745U (zh) 散熱器模組及散熱器
CN208387189U (zh) 散热装置
CN207399734U (zh) 一种内置功放模块散热器
TW201835520A (zh) 散熱鰭片組
WO2023161445A1 (en) Heat sink
US20150248148A1 (en) Air duct, cooling module, and electronic device
TWI511656B (zh) 伺服模組
JP3140904U (ja) 放熱フィン
TWM602201U (zh) 散熱鰭片結構
JP2013214771A (ja) 電子部品冷却構造

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16802412

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16802412

Country of ref document: EP

Kind code of ref document: A1