WO2016188248A1 - 显示基板及其制作方法、显示装置 - Google Patents
显示基板及其制作方法、显示装置 Download PDFInfo
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- WO2016188248A1 WO2016188248A1 PCT/CN2016/079038 CN2016079038W WO2016188248A1 WO 2016188248 A1 WO2016188248 A1 WO 2016188248A1 CN 2016079038 W CN2016079038 W CN 2016079038W WO 2016188248 A1 WO2016188248 A1 WO 2016188248A1
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- layer
- pixel defining
- substrate
- display substrate
- light
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- 239000000758 substrate Substances 0.000 title claims abstract description 225
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000000463 material Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 28
- 230000008569 process Effects 0.000 claims description 15
- 238000000059 patterning Methods 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 201
- 229920002120 photoresistant polymer Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 238000000605 extraction Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/878—Arrangements for extracting light from the devices comprising reflective means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
Definitions
- Embodiments of the present invention relate to a display substrate, a method of fabricating the same, and a display device.
- the OLED (Organic Light Emitting Diode) display has the characteristics of fast response, high contrast, wide viewing angle, etc., and is considered as the next generation display technology.
- An embodiment of the present invention provides a display substrate including: a substrate substrate, a pixel defining layer formed on the substrate substrate, and a light emitting layer located in a sub-pixel region defined by the pixel defining layer, wherein The pixel defining layer includes a reflective layer configured to reflect light emitted by the light emitting layer toward the reflective layer to a light exiting side of the display substrate.
- Another embodiment of the present invention provides a display device including the display substrate described above.
- a further embodiment of the present invention provides a method of fabricating a display substrate, including:
- the pixel defining layer is formed to include a reflective layer configured to reflect light emitted by the light emitting layer toward the reflective layer to a light exiting side of the display substrate.
- FIG. 1 is a schematic structural view of a base substrate of an OLED display provided in the prior art
- FIG. 2 is a schematic structural diagram of a display substrate according to an embodiment of the present invention.
- FIG. 3 is a schematic structural diagram of another display substrate according to an embodiment of the present invention.
- FIG. 4 is a flowchart of a method for fabricating a display substrate according to an embodiment of the present invention.
- FIG. 5 is a flowchart of another method for fabricating a display substrate according to an embodiment of the present invention.
- an OLED display includes a package substrate and a substrate substrate, the substrate substrate including pixel units arranged in an array, as shown in FIG. 1, each of the pixel units includes a red sub-pixel R, a green sub-pixel G, and a blue Sub-pixel B, each sub-pixel includes an anode 10, a light-emitting layer 20, and a cathode 30.
- a pixel defining layer 40 is generally formed between adjacent sub-pixels to prevent light emitted from the light-emitting layers of adjacent sub-pixels from interacting with each other.
- the pixel defining layer 40 is generally formed of a light-transmitting material, and the lateral light emitted by the light-emitting layer is incident into adjacent sub-pixels, for example, the lateral light 21 emitted by the light-emitting layer of the red sub-pixel R shown in FIG. Injecting adjacent green sub-pixels G, which causes light leakage and light color interference, causes the light-emitting rate and color purity of the OLED display device to decrease.
- the opaque material can be used to form the pixel defining layer in the related art
- the inventors have found that the opaque material is generally a material having a low dielectric constant, which causes a decrease in the photoelectric properties of the device, and at the same time, the side from which the luminescent layer emits The absorption of light by the opaque pixel-defining layer still causes a decrease in the light-emitting rate of the OLED display device. Therefore, less opaque materials are used in the related art to form a pixel defining layer. Then, in the case where the light-shielding material is used to form the pixel defining layer, solving the light leakage and the light color interference, thereby improving the light extraction rate and color purity of the OLED display device has become an urgent problem to be solved.
- Embodiments of the present invention provide a display substrate, a method of fabricating the same, and a display device. Including the display
- the display device of the substrate can effectively improve the light leakage and the light color interference problem, and the light extraction rate and color purity of the display device are effectively improved.
- the display substrate includes: a transparent substrate substrate 50, pixel defining layers 40, 40' formed on the transparent substrate substrate 50, and pixel definition.
- the light-emitting layer 20 in the sub-pixel region P defined by the layers 40, 40'; the pixel defining layer 40, 40' comprises: a reflective layer 41, 41' configured to direct the light-emitting layer 20 toward the reflective layer 41, 41' Reflected to the light exit side of the display substrate.
- the reflective layer can reflect the light that the luminescent layer emits toward the reflective layer to the light exiting side of the display substrate, thereby changing the propagation path of the portion of the light.
- this part of the light is prevented from forming light color interference with adjacent sub-pixels, and on the other hand, the part of the light is redirected to the light-emitting side of the display substrate, so that the part of the light is effectively utilized again, which greatly improves the light leakage problem.
- the above display substrate is applied to a display device, the light extraction rate and color purity of the display device are effectively improved.
- the material of the light-emitting layer is not limited in the embodiment of the present invention.
- the material of the light-emitting layer may be an organic electroluminescent material, and of course, other types of light-emitting materials.
- the above display substrate can form an OLED display device.
- the embodiments of the present invention and the drawings are all described by taking an example in which the display substrate can form an OLED display device.
- the portions from the reflective layers 41, 41' to the light-emitting side of the display substrate are transparent.
- the reflective layers 41, 41' are convex toward the light exiting side of the display substrate, and the pixel defining layers 40, 40' are formed, for example, in the pixel defining region D.
- the embodiment of the present invention does not limit the light-emitting side of the display substrate.
- the light emitting side of the display substrate may be a surface of the display substrate away from the transparent substrate substrate 50, that is, the light of the display substrate is emitted from the upper surface of the display substrate, and the display substrate may form an OLED display of a top emission structure.
- the apparatus of course, referring to FIG. 3, the light-emitting side of the display substrate may also be a lower surface of the display substrate, that is, light is emitted from a lower surface of the transparent substrate substrate 50, and the display substrate may form an OLED display device of a bottom emission structure.
- the upper surface of the display substrate refers to the surface away from the transparent substrate. If the display substrate only includes the layer structure in FIG. 2, the upper surface of the display substrate is The upper surface of the cathode 30 and the surface of the upper surface of the pixel defining layer 40 are formed. In another example, the display substrate shown in FIG. 2 can also be packaged. Other layers, such as a protective layer, are included, in which case the upper surface of the display substrate is the upper surface of the protective layer; the lower surface of the display substrate refers to the lower surface of the transparent substrate 50. It can be understood that in the embodiment shown in FIG. 2, the transparent substrate substrate 50 can also be replaced with an opaque substrate substrate.
- the reflective layer is convex toward the light-emitting side of the display substrate.
- the light-emitting side of the display substrate is a surface of the display substrate away from the transparent substrate, and the reflective layer is convex toward the light-emitting side of the display substrate, for example, the reflective layer may be along AA'.
- the direction of the display substrate is convex; in the embodiment shown in FIG. 3, the light-emitting side of the display substrate is the lower surface of the display substrate, and the reflective layer is convex toward the light-emitting side of the display substrate, for example, the reflective layer may be along the BB'
- the direction is convex.
- the reflective layer is for reflecting light emitted from the light-emitting layer toward the reflective layer to the light-emitting side of the display substrate.
- the relative position of the reflective layer and the luminescent layer is not specifically limited in the embodiment of the present invention, as long as the reflective layer can reflect the light emitted from the luminescent layer toward the reflective layer to the light-emitting side of the display substrate.
- the reflective layer 41 may be a plane that protrudes from the light-emitting surface of the light-emitting layer that is away from the light-emitting side of the display substrate. For example, as shown in FIG.
- the reflective layer 41 may be convex in the AA' direction and protrude from the plane of the light-emitting layer 20 away from the light-emitting surface of the light-emitting side of the display substrate, that is, the reflective layer 41 protrudes.
- the reflective layer 41 may also be a plane protruding from the upper surface 202 of the light-emitting layer 20 to further improve the reflectance.
- the reflective layer 41' may be convex in the BB' direction and protrude from the plane of the light-emitting layer 20 away from the light-emitting surface of the light-emitting side of the display substrate, that is, the reflective layer 41' protrudes.
- the plane of the upper surface 202 of the luminescent layer 20 is further selected.
- the reflective layer 41 may also be a plane protruding from the lower surface 201 of the luminescent layer 20 to further improve the reflectivity.
- the upper surface of the light-emitting layer refers to a surface away from the transparent substrate
- the lower surface of the light-emitting layer refers to a surface facing the transparent substrate.
- the layer structure in the sub-pixel region P defined by the pixel defining layer is not limited in the embodiment of the present invention.
- the sub-pixel region may further include the light emitting layer 20 .
- the cathode 30 and the anode 10 under the luminescent layer 20 may form an electric field between the cathode 30 and the anode 10 to drive the luminescent layer 20 to emit light; of course, the positions of the cathode 30 and the anode 10 are not limited thereto, for example, the cathode 30 It may also be located below the luminescent layer 20, and the anode 10 may also be located above the luminescent layer 20, which is not limited herein.
- Embodiments of the present invention provide a display substrate including a substrate substrate, a pixel defining layer formed on the substrate substrate, and a light emitting in a sub-pixel region defined by the pixel defining layer Floor.
- the pixel defining layer includes a reflective layer that is convex toward the light emitting side of the display substrate; and a portion from the reflective layer to the light emitting side of the display substrate is transparent in a region where the pixel defining layer is located.
- the reflective layer can reflect the light 21 emitted from the light-emitting layer toward the reflective layer to the light-emitting side of the display substrate, thereby changing the propagation path of the portion of the light.
- this part of the light is prevented from forming light color interference with adjacent sub-pixels, and on the other hand, the part of the light is redirected to the light-emitting side of the display substrate, so that the part of the light is effectively utilized again, which greatly improves the light leakage problem.
- the light extraction rate and color purity of the display device are effectively improved.
- the material of the reflective layer is metal, and may be, for example, a metal such as copper, aluminum or silver.
- the material of the reflective layer may also be other materials as long as it has the property of reflecting light.
- the display substrate includes: a transparent substrate substrate 50, a pixel defining layer 40 formed on the transparent substrate substrate 50, and a light emitting layer 20 located in the sub-pixel region P defined by the pixel defining layer 40;
- the defining layer 40 includes a reflective layer 41 that is convex toward the light-emitting side of the display substrate, and is configured to reflect light emitted from the light-emitting layer toward the reflective layer to the light-emitting side of the display substrate.
- the pixel defining layer 40 further includes: The protrusion 42 of the area where the pixel defining layer 40 is located serves as a first pixel defining portion, the reflective layer 41 covers all or part of the surface of the protrusion 42 , and the first transparent portion 43 located above the reflective layer 41 serves as a second pixel defining portion; For example, both the first pixel defining portion and the second pixel defining portion are each formed of an insulating material.
- the light-emitting side of the display substrate shown in FIG. 2 is a surface of the display substrate away from the transparent substrate 50.
- the display substrate can form an OLED display device of a top emission structure. It can be understood that in the embodiment shown in FIG. 2, the transparent substrate substrate 50 can also be replaced with an opaque substrate substrate.
- the material of the first transparent portion 43 is not limited in the embodiment of the present invention.
- the first transparent portion 43 may be formed of a transparent material such as a photopolymerizable resin or a thermally polymerizable resin.
- the material for forming the first transparent portion 43 is not particularly limited as long as the first transparent portion is transparent. Yes.
- the reflective layer 41 may cover all of the upper surface of the bumps 42 to increase the reflectance.
- the reflective layer 41 can be a portion of the upper surface that covers the protrusions.
- the protrusions 42 may have various forming methods, which are not limited herein.
- the protrusions 42 may be formed separately, or the protrusions 42 may be formed while forming other layer structures.
- the embodiment of the present invention does not limit the size, shape, and material of the protrusion, and may be determined according to actual conditions.
- a display substrate provided by an embodiment of the present invention includes a substrate substrate, a pixel defining layer formed on the substrate substrate, and a light emitting layer located in a sub-pixel region defined by the pixel defining layer.
- the pixel defining layer includes a reflective layer, and the reflective layer is convex toward the light emitting side of the display substrate, and is configured to reflect light emitted from the light emitting layer toward the reflective layer to the light emitting side of the display substrate; and in the region where the pixel defining layer is located, the reflective layer The portion to the light-emitting side of the display substrate is transparent.
- the pixel defining layer further includes: a protrusion located in a region where the pixel defining layer is located, the reflective layer covers all or part of the protrusion, and a first transparent portion located above the reflective layer; and the light emitting side of the display substrate is the display substrate away from the base substrate s surface.
- the reflective layer may reflect the light that the luminescent layer emits toward the reflective layer to the light exiting side of the display substrate, thereby changing the propagation path of the portion of the light.
- this part of the light is prevented from forming light color interference with adjacent sub-pixels, and on the other hand, the part of the light is redirected to the light-emitting side of the display substrate, so that the part of the light is effectively utilized again, which greatly improves the light leakage problem.
- the above display substrate is applied to a display device, the light extraction rate and color purity of the display device are effectively improved.
- the cross section of the protrusion may be semi-elliptical, semi-circular, triangular or trapezoidal. Both the embodiment of the invention and the drawing are illustrated by taking a semi-elliptical shape of the convex cross section as an example.
- the display substrate further includes: a first transparent layer 51 on the transparent substrate substrate 50.
- the protrusion 42 is formed on the first transparent layer 51 and is opposite to the first transparent layer 51.
- One piece structure thus, protrusions can be formed at the same time as the first transparent layer is formed, which reduces the number of patterning processes and saves costs.
- the application and the material of the first transparent layer are not limited in the embodiment of the present invention.
- the first transparent layer may serve as a flat layer to facilitate subsequent formation of other layer structures or films, and may of course play other functions. Depending on the actual situation.
- the display substrate includes: a transparent substrate substrate 50, a pixel defining layer 40' formed on the transparent substrate substrate 50, and a light emitting layer located in the sub-pixel region P defined by the pixel defining layer 40'.
- the pixel defining layer 40' includes: a reflective layer 41', the reflective layer 41' is convex toward the light-emitting side of the display substrate, and is used for reflecting the light emitted from the light-emitting layer toward the reflective layer to the light-emitting side of the display substrate;
- Also including a second transparent layer 52 on the transparent substrate substrate 50, the second transparent The clear layer 52 is formed with a first pixel pixel defining portion 42' in the region D where the pixel defining layer 40 is located, a recess T is formed on the first pixel defining portion 42', and the reflective layer 41' conformally covers all or part of the recess T
- the surface defining layer 40' further includes a second transparent portion 44 located above the reflective layer 41' as a second pixel
- the light-emitting side of the display substrate is the lower surface of the transparent substrate, and the display substrate can form an OLED display device having a bottom emission structure.
- the material for forming the second transparent layer 52 in the embodiment of the present invention is not particularly limited as long as the second transparent layer is transparent.
- the second transparent layer 52 may be formed of a light transmissive material such as a transparent material such as a photopolymerizable resin or a thermopolymerizable resin.
- the use and materials of the second transparent layer 52 are not limited in the embodiment of the present invention.
- the second transparent layer 52 can serve as a flat layer to facilitate subsequent formation of other layer structures or films, and of course can also play other roles, depending on the actual situation.
- the second transparent layer 52 is, for example, an insulating layer.
- the reflective layer may cover all of the grooves to increase the reflectance.
- Embodiments of the invention do not limit the extent to which the reflective layer covers the recess.
- the reflective layer can be a portion of the surface that covers the recess.
- the groove may have various forming methods, which are not limited herein.
- the grooves may be formed while forming other layer structures.
- the embodiment of the present invention does not limit the size and shape of the groove, and may be determined according to actual conditions.
- a display substrate provided by an embodiment of the present invention includes a transparent substrate substrate, a pixel defining layer formed on the transparent substrate substrate, and a light emitting layer located in a sub-pixel region defined by the pixel defining layer.
- the pixel defining layer includes a reflective layer, and the reflective layer is convex toward the light emitting side of the display substrate, and is configured to reflect light emitted from the light emitting layer toward the reflective layer to the light emitting side of the display substrate; and in the region where the pixel defining layer is located, the reflective layer The portion to the light-emitting side of the display substrate is transparent.
- the display substrate further includes a second transparent layer on the transparent substrate, the second transparent layer is formed with a groove in a region where the pixel defining layer is located, and the reflective layer covers all or part of the groove; the pixel defining layer further includes: a reflective layer The second transparent portion above, the bottom of the second transparent portion is filled in the groove.
- the light exiting side of the display substrate is a surface of the display substrate away from the transparent substrate.
- the reflective layer can reflect the light that the luminescent layer emits toward the reflective layer to the light exiting side of the display substrate. Thereby changing the propagation path of this part of the light.
- this part of the light is prevented from forming light color interference with adjacent sub-pixels, and on the other hand, the part of the light is redirected to the light-emitting side of the display substrate, so that the part of the light is effectively utilized again, which greatly improves the light leakage problem.
- the above display substrate is applied to a display device, the light extraction rate and color purity of the display device are effectively improved.
- the cross section of the groove may be semi-elliptical, semi-circular, triangular or trapezoidal.
- the embodiments of the present invention and the drawings are all described by taking a semi-elliptical cross section of the groove as an example.
- the embodiment of the invention provides a display device, which comprises the display substrate provided by any of the above embodiments.
- the display device may be a display device such as an OLED display and any display product or component such as a television, a digital camera, a mobile phone, a tablet computer or the like including the display device, and the display device has a high light extraction rate and color purity.
- An embodiment of the present invention provides a method for fabricating a display substrate according to the embodiment shown in FIG. 2. Referring to FIG. 4, the method includes:
- the first transparent layer can serve as a planar layer to facilitate subsequent formation of other layer structures or films.
- the material of the reflective layer is a metal, and may be, for example, a metal such as copper, aluminum, or silver.
- the forming material of the first transparent portion may be a light transmissive material such as a photopolymerizable resin or a thermopolymerizable resin.
- the first transparent layer and the protrusion can be formed by one patterning process, which can reduce the number of patterning and save cost.
- the patterning process is a process of forming a film into a layer including at least one pattern, and the patterning process generally includes: coating a photoresist on the film, exposing the photoresist using the mask, and then removing the photoresist by using the developer. The photoresist is etched away, the portion of the film that is not covered with the photoresist is etched away, and the remaining photoresist is finally stripped.
- the one-time patterning process refers to a layer structure process required for one exposure to form.
- the embodiment of the present invention provides a method for fabricating a display substrate as provided in the embodiment shown in FIG. 3. Referring to FIG. 5, the method includes:
- the forming material of the second transparent layer may be a light transmissive material such as a photopolymerizable resin or a thermopolymerizable resin, and the second transparent layer may serve as a flat layer to facilitate subsequent formation of other layer structures or films.
- a reflective layer 41' is formed on the recess T.
- the material of the reflective layer is a metal, and may be, for example, a metal such as copper, aluminum, or silver.
- a second transparent portion 44 is formed as a second pixel defining portion in the reflective layer 41', and a bottom portion of the second transparent portion is filled in the recess.
- the material for forming the second transparent portion 44 may be a light transmissive material such as a photopolymerizable resin or a thermopolymerizable resin.
- the second transparent layer 44 and the groove T can be formed by one patterning process, which can reduce the number of patterning and save cost.
- the patterning process is a process of forming a film into a layer including at least one pattern, and the patterning process generally includes: coating a photoresist on the film, exposing the photoresist using the mask, and then removing the photoresist by using the developer. The photoresist is etched away, the portion of the film that is not covered with the photoresist is etched away, and the remaining photoresist is finally stripped.
- the one-time patterning process refers to a layer structure process required for one exposure to form.
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Abstract
Description
Claims (19)
- 一种显示基板,包括:衬底基板、形成在所述衬底基板上的像素界定层、位于所述像素界定层所限定的子像素区域中的发光层,其中,所述像素界定层包括:反射层,构造为将所述发光层射向所述反射层的光反射到所述显示基板的出光侧。
- 根据权利要求1所述的显示基板,其中,所述像素界定层的在所述反射层与所述出光侧之间的部分是透明的。
- 根据权利要求1或2所述的显示基板,其中,所述反射层朝向所述显示基板的出光侧呈凸起状。
- 根据权利要求1至3中任一项所述的显示基板,其中,所述反射层的材料为金属。
- 根据权利要求1至4中任一项所述的显示基板,还包括位于所述子像素区域中的阳极层和阴极层,所述发光层位于所述阳极层与所述阴极层之间。
- 根据权利要求1至5中任一项所述的显示基板,其中,所述反射层与所述阳极层、所述阴极层以及所述发光层物理及电性分离。
- 根据权利要求1至6中任一项所述的显示基板,其中,所述像素界定层还包括:位于所述反射层之下的第一像素定义部分,以及位于所述反射层之上的第二像素定义部分。
- 根据权利要求7中任一项所述的显示基板,其中,所述显示基板的出光侧为所述显示基板远离所述衬底基板的表面,所述第一像素定义部分形成为朝向所述显示基板的出光侧的凸起,所述反射层共形覆盖所述凸起的全部或部分表面。
- 根据权利要求8所述的显示基板,其中,所述凸起的横截面为半椭圆形、半圆形、三角形或梯形。
- 根据权利要求7所述的显示基板,其中,所述衬底基板为是透明的,所述显示基板的出光侧为所述衬底基板的下表面;所述第一像素定义部分形成为具有凹槽,所述反射层共形覆盖所述凹槽的全部或部分表面;所述第二像素定义部分的底部填充在所述凹槽内。
- 根据权利要求10所述的显示基板,其中,所述凹槽的横截面为半椭 圆形、半圆形、三角形或梯形。
- 根据权利要求7至11中任一项所述的显示基板,其中,所述第一像素定义部分和所述第二像素定义部分均为透明的。
- 根据权利要求7至12中任一项所述的显示基板,还包括:位于所述衬底基板上的第一透明层,所述第一像素定义部分形成在所述第一透明层上、且与所述第一透明层为一体结构。
- 一种显示装置,其中,包括权利要求1至13任一项所述的显示基板。
- 一种显示基板的制作方法,包括:在衬底基板上的像素限定区域形成像素定义层以在衬底基板上限定子像素区域;在子像素区域中形成发光层;其中,所述像素界定层形成为包括反射层,所述反射层构造为将所述发光层射向所述反射层的光反射到所述显示基板的出光侧。
- 根据权利要求15所述的制作方法,其中,所述在衬底基板上的像素限定区域形成像素定义层以在衬底基板上限定子像素区域,包括:在衬底基板上的像素限定区域形成透明层,在所述透明层上的所述像素界定区域内形成第一像素限定部分,其中,所述第一像素限定部分形成为朝向所述显示基板的出光侧的凸起;在所述凸起上形成反射层;在所述反射层上方形成透明的第二像素定义部分,且所述第二像素定义部分覆盖所述凸起以及所述反射层。
- 根据权利要求16所述的制作方法,其中,所述第一透明层和所述凸起通过一次构图工艺形成。
- 根据权利要求15所述的制作方法,其中,所述在衬底基板上的像素限定区域形成像素定义层以在衬底基板上限定子像素区域,包括:在衬底基板上形成透明层,在所述透明层上所述像素界定区域内形成第一像素限定部分,其中,所述第一像素限定部分形成为具有一凹槽;在所述凹槽上形成反射层;在所述反射层上方形成透明的第二像素定义部分,所述第二像素定义部 分的底部填充在所述凹槽内。
- 根据权利要求18所述的制作方法,其中,所述透明层和具有所述凹槽的第一像素限定部分通过一次构图工艺形成。
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Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104979375A (zh) * | 2015-05-28 | 2015-10-14 | 京东方科技集团股份有限公司 | 一种显示基板及其制作方法、显示装置 |
KR102631461B1 (ko) * | 2016-10-26 | 2024-01-30 | 엘지디스플레이 주식회사 | 발광 영역 및 반사 영역을 포함하는 디스플레이 장치 |
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TWI658583B (zh) * | 2017-06-14 | 2019-05-01 | 友達光電股份有限公司 | 畫素陣列及其製造方法 |
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CN109713007A (zh) * | 2017-10-25 | 2019-05-03 | 京东方科技集团股份有限公司 | 阵列基板及其制备方法、显示面板、显示装置 |
KR102522110B1 (ko) * | 2017-11-29 | 2023-04-13 | 엘지디스플레이 주식회사 | 유기발광 표시장치 |
CN108172600B (zh) * | 2017-12-29 | 2020-01-17 | 深圳市华星光电半导体显示技术有限公司 | 用于woled显示器的彩膜基板及woled显示器 |
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US10658621B2 (en) * | 2018-04-09 | 2020-05-19 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | OLED panel and manufacturing method thereof and OLED display |
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CN112599581A (zh) * | 2020-12-14 | 2021-04-02 | 北京维信诺科技有限公司 | 显示面板及其制备方法、显示装置 |
US20230163264A1 (en) * | 2020-12-26 | 2023-05-25 | BOE MLED Technology Co., Ltd. | Display substrate and method for manufacturing the same, and display apparatus |
CN113066830B (zh) * | 2021-03-16 | 2022-07-01 | 京东方科技集团股份有限公司 | 一种显示面板及其制备方法、显示装置 |
CN112952025A (zh) * | 2021-03-31 | 2021-06-11 | 京东方科技集团股份有限公司 | 显示基板及显示装置 |
CN113611225B (zh) * | 2021-08-19 | 2023-03-21 | 业成科技(成都)有限公司 | 光学显示器结构 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103681769A (zh) * | 2013-12-24 | 2014-03-26 | 京东方科技集团股份有限公司 | 显示装置、有机电致发光器件及其制作方法 |
CN103915482A (zh) * | 2014-03-27 | 2014-07-09 | 京东方科技集团股份有限公司 | 一种有机电致发光显示面板、其制作方法及显示装置 |
US20140217431A1 (en) * | 2013-02-05 | 2014-08-07 | Sony Corporation | Display device, method for manufacturing the same, and electronic device |
CN104282844A (zh) * | 2013-07-08 | 2015-01-14 | 上海和辉光电有限公司 | 有机发光结构及其制造方法及有机发光组件 |
CN104979375A (zh) * | 2015-05-28 | 2015-10-14 | 京东方科技集团股份有限公司 | 一种显示基板及其制作方法、显示装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI227570B (en) * | 2003-12-11 | 2005-02-01 | South Epitaxy Corp | Light-emitting diode packaging structure |
US7535163B2 (en) | 2006-02-22 | 2009-05-19 | Tpo Displays Corp. | System for displaying images including electroluminescent device and method for fabricating the same |
TW200834962A (en) * | 2007-02-08 | 2008-08-16 | Touch Micro System Tech | LED array package structure having Si-substrate and method of making the same |
JP2012043583A (ja) * | 2010-08-17 | 2012-03-01 | Sony Corp | 表示装置およびその製造方法 |
US8497143B2 (en) * | 2011-06-21 | 2013-07-30 | Cofan Usa, Inc. | Reflective pockets in LED mounting |
US9178123B2 (en) * | 2012-12-10 | 2015-11-03 | LuxVue Technology Corporation | Light emitting device reflective bank structure |
KR102111974B1 (ko) * | 2013-07-03 | 2020-05-19 | 삼성디스플레이 주식회사 | 유기발광 표시 장치 및 이의 제조 방법 |
KR102080008B1 (ko) * | 2013-07-12 | 2020-02-24 | 삼성디스플레이 주식회사 | 유기발광표시장치 및 그 제조방법 |
CN104466022B (zh) * | 2014-12-17 | 2019-01-18 | 昆山国显光电有限公司 | 一种有机发光二极管显示器件及其制备方法 |
CN104465706A (zh) * | 2014-12-17 | 2015-03-25 | 上海天马有机发光显示技术有限公司 | 一种有机发光显示装置及其制作方法 |
-
2015
- 2015-05-28 CN CN201510283539.7A patent/CN104979375A/zh active Pending
-
2016
- 2016-04-12 WO PCT/CN2016/079038 patent/WO2016188248A1/zh active Application Filing
- 2016-04-12 US US15/321,211 patent/US10044001B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140217431A1 (en) * | 2013-02-05 | 2014-08-07 | Sony Corporation | Display device, method for manufacturing the same, and electronic device |
CN104282844A (zh) * | 2013-07-08 | 2015-01-14 | 上海和辉光电有限公司 | 有机发光结构及其制造方法及有机发光组件 |
CN103681769A (zh) * | 2013-12-24 | 2014-03-26 | 京东方科技集团股份有限公司 | 显示装置、有机电致发光器件及其制作方法 |
CN103915482A (zh) * | 2014-03-27 | 2014-07-09 | 京东方科技集团股份有限公司 | 一种有机电致发光显示面板、其制作方法及显示装置 |
CN104979375A (zh) * | 2015-05-28 | 2015-10-14 | 京东方科技集团股份有限公司 | 一种显示基板及其制作方法、显示装置 |
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