WO2016188248A1 - 显示基板及其制作方法、显示装置 - Google Patents

显示基板及其制作方法、显示装置 Download PDF

Info

Publication number
WO2016188248A1
WO2016188248A1 PCT/CN2016/079038 CN2016079038W WO2016188248A1 WO 2016188248 A1 WO2016188248 A1 WO 2016188248A1 CN 2016079038 W CN2016079038 W CN 2016079038W WO 2016188248 A1 WO2016188248 A1 WO 2016188248A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
pixel defining
substrate
display substrate
light
Prior art date
Application number
PCT/CN2016/079038
Other languages
English (en)
French (fr)
Inventor
崔颖
胡春静
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/321,211 priority Critical patent/US10044001B2/en
Publication of WO2016188248A1 publication Critical patent/WO2016188248A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/856—Arrangements for extracting light from the devices comprising reflective means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/878—Arrangements for extracting light from the devices comprising reflective means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment

Definitions

  • Embodiments of the present invention relate to a display substrate, a method of fabricating the same, and a display device.
  • the OLED (Organic Light Emitting Diode) display has the characteristics of fast response, high contrast, wide viewing angle, etc., and is considered as the next generation display technology.
  • An embodiment of the present invention provides a display substrate including: a substrate substrate, a pixel defining layer formed on the substrate substrate, and a light emitting layer located in a sub-pixel region defined by the pixel defining layer, wherein The pixel defining layer includes a reflective layer configured to reflect light emitted by the light emitting layer toward the reflective layer to a light exiting side of the display substrate.
  • Another embodiment of the present invention provides a display device including the display substrate described above.
  • a further embodiment of the present invention provides a method of fabricating a display substrate, including:
  • the pixel defining layer is formed to include a reflective layer configured to reflect light emitted by the light emitting layer toward the reflective layer to a light exiting side of the display substrate.
  • FIG. 1 is a schematic structural view of a base substrate of an OLED display provided in the prior art
  • FIG. 2 is a schematic structural diagram of a display substrate according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of another display substrate according to an embodiment of the present invention.
  • FIG. 4 is a flowchart of a method for fabricating a display substrate according to an embodiment of the present invention.
  • FIG. 5 is a flowchart of another method for fabricating a display substrate according to an embodiment of the present invention.
  • an OLED display includes a package substrate and a substrate substrate, the substrate substrate including pixel units arranged in an array, as shown in FIG. 1, each of the pixel units includes a red sub-pixel R, a green sub-pixel G, and a blue Sub-pixel B, each sub-pixel includes an anode 10, a light-emitting layer 20, and a cathode 30.
  • a pixel defining layer 40 is generally formed between adjacent sub-pixels to prevent light emitted from the light-emitting layers of adjacent sub-pixels from interacting with each other.
  • the pixel defining layer 40 is generally formed of a light-transmitting material, and the lateral light emitted by the light-emitting layer is incident into adjacent sub-pixels, for example, the lateral light 21 emitted by the light-emitting layer of the red sub-pixel R shown in FIG. Injecting adjacent green sub-pixels G, which causes light leakage and light color interference, causes the light-emitting rate and color purity of the OLED display device to decrease.
  • the opaque material can be used to form the pixel defining layer in the related art
  • the inventors have found that the opaque material is generally a material having a low dielectric constant, which causes a decrease in the photoelectric properties of the device, and at the same time, the side from which the luminescent layer emits The absorption of light by the opaque pixel-defining layer still causes a decrease in the light-emitting rate of the OLED display device. Therefore, less opaque materials are used in the related art to form a pixel defining layer. Then, in the case where the light-shielding material is used to form the pixel defining layer, solving the light leakage and the light color interference, thereby improving the light extraction rate and color purity of the OLED display device has become an urgent problem to be solved.
  • Embodiments of the present invention provide a display substrate, a method of fabricating the same, and a display device. Including the display
  • the display device of the substrate can effectively improve the light leakage and the light color interference problem, and the light extraction rate and color purity of the display device are effectively improved.
  • the display substrate includes: a transparent substrate substrate 50, pixel defining layers 40, 40' formed on the transparent substrate substrate 50, and pixel definition.
  • the light-emitting layer 20 in the sub-pixel region P defined by the layers 40, 40'; the pixel defining layer 40, 40' comprises: a reflective layer 41, 41' configured to direct the light-emitting layer 20 toward the reflective layer 41, 41' Reflected to the light exit side of the display substrate.
  • the reflective layer can reflect the light that the luminescent layer emits toward the reflective layer to the light exiting side of the display substrate, thereby changing the propagation path of the portion of the light.
  • this part of the light is prevented from forming light color interference with adjacent sub-pixels, and on the other hand, the part of the light is redirected to the light-emitting side of the display substrate, so that the part of the light is effectively utilized again, which greatly improves the light leakage problem.
  • the above display substrate is applied to a display device, the light extraction rate and color purity of the display device are effectively improved.
  • the material of the light-emitting layer is not limited in the embodiment of the present invention.
  • the material of the light-emitting layer may be an organic electroluminescent material, and of course, other types of light-emitting materials.
  • the above display substrate can form an OLED display device.
  • the embodiments of the present invention and the drawings are all described by taking an example in which the display substrate can form an OLED display device.
  • the portions from the reflective layers 41, 41' to the light-emitting side of the display substrate are transparent.
  • the reflective layers 41, 41' are convex toward the light exiting side of the display substrate, and the pixel defining layers 40, 40' are formed, for example, in the pixel defining region D.
  • the embodiment of the present invention does not limit the light-emitting side of the display substrate.
  • the light emitting side of the display substrate may be a surface of the display substrate away from the transparent substrate substrate 50, that is, the light of the display substrate is emitted from the upper surface of the display substrate, and the display substrate may form an OLED display of a top emission structure.
  • the apparatus of course, referring to FIG. 3, the light-emitting side of the display substrate may also be a lower surface of the display substrate, that is, light is emitted from a lower surface of the transparent substrate substrate 50, and the display substrate may form an OLED display device of a bottom emission structure.
  • the upper surface of the display substrate refers to the surface away from the transparent substrate. If the display substrate only includes the layer structure in FIG. 2, the upper surface of the display substrate is The upper surface of the cathode 30 and the surface of the upper surface of the pixel defining layer 40 are formed. In another example, the display substrate shown in FIG. 2 can also be packaged. Other layers, such as a protective layer, are included, in which case the upper surface of the display substrate is the upper surface of the protective layer; the lower surface of the display substrate refers to the lower surface of the transparent substrate 50. It can be understood that in the embodiment shown in FIG. 2, the transparent substrate substrate 50 can also be replaced with an opaque substrate substrate.
  • the reflective layer is convex toward the light-emitting side of the display substrate.
  • the light-emitting side of the display substrate is a surface of the display substrate away from the transparent substrate, and the reflective layer is convex toward the light-emitting side of the display substrate, for example, the reflective layer may be along AA'.
  • the direction of the display substrate is convex; in the embodiment shown in FIG. 3, the light-emitting side of the display substrate is the lower surface of the display substrate, and the reflective layer is convex toward the light-emitting side of the display substrate, for example, the reflective layer may be along the BB'
  • the direction is convex.
  • the reflective layer is for reflecting light emitted from the light-emitting layer toward the reflective layer to the light-emitting side of the display substrate.
  • the relative position of the reflective layer and the luminescent layer is not specifically limited in the embodiment of the present invention, as long as the reflective layer can reflect the light emitted from the luminescent layer toward the reflective layer to the light-emitting side of the display substrate.
  • the reflective layer 41 may be a plane that protrudes from the light-emitting surface of the light-emitting layer that is away from the light-emitting side of the display substrate. For example, as shown in FIG.
  • the reflective layer 41 may be convex in the AA' direction and protrude from the plane of the light-emitting layer 20 away from the light-emitting surface of the light-emitting side of the display substrate, that is, the reflective layer 41 protrudes.
  • the reflective layer 41 may also be a plane protruding from the upper surface 202 of the light-emitting layer 20 to further improve the reflectance.
  • the reflective layer 41' may be convex in the BB' direction and protrude from the plane of the light-emitting layer 20 away from the light-emitting surface of the light-emitting side of the display substrate, that is, the reflective layer 41' protrudes.
  • the plane of the upper surface 202 of the luminescent layer 20 is further selected.
  • the reflective layer 41 may also be a plane protruding from the lower surface 201 of the luminescent layer 20 to further improve the reflectivity.
  • the upper surface of the light-emitting layer refers to a surface away from the transparent substrate
  • the lower surface of the light-emitting layer refers to a surface facing the transparent substrate.
  • the layer structure in the sub-pixel region P defined by the pixel defining layer is not limited in the embodiment of the present invention.
  • the sub-pixel region may further include the light emitting layer 20 .
  • the cathode 30 and the anode 10 under the luminescent layer 20 may form an electric field between the cathode 30 and the anode 10 to drive the luminescent layer 20 to emit light; of course, the positions of the cathode 30 and the anode 10 are not limited thereto, for example, the cathode 30 It may also be located below the luminescent layer 20, and the anode 10 may also be located above the luminescent layer 20, which is not limited herein.
  • Embodiments of the present invention provide a display substrate including a substrate substrate, a pixel defining layer formed on the substrate substrate, and a light emitting in a sub-pixel region defined by the pixel defining layer Floor.
  • the pixel defining layer includes a reflective layer that is convex toward the light emitting side of the display substrate; and a portion from the reflective layer to the light emitting side of the display substrate is transparent in a region where the pixel defining layer is located.
  • the reflective layer can reflect the light 21 emitted from the light-emitting layer toward the reflective layer to the light-emitting side of the display substrate, thereby changing the propagation path of the portion of the light.
  • this part of the light is prevented from forming light color interference with adjacent sub-pixels, and on the other hand, the part of the light is redirected to the light-emitting side of the display substrate, so that the part of the light is effectively utilized again, which greatly improves the light leakage problem.
  • the light extraction rate and color purity of the display device are effectively improved.
  • the material of the reflective layer is metal, and may be, for example, a metal such as copper, aluminum or silver.
  • the material of the reflective layer may also be other materials as long as it has the property of reflecting light.
  • the display substrate includes: a transparent substrate substrate 50, a pixel defining layer 40 formed on the transparent substrate substrate 50, and a light emitting layer 20 located in the sub-pixel region P defined by the pixel defining layer 40;
  • the defining layer 40 includes a reflective layer 41 that is convex toward the light-emitting side of the display substrate, and is configured to reflect light emitted from the light-emitting layer toward the reflective layer to the light-emitting side of the display substrate.
  • the pixel defining layer 40 further includes: The protrusion 42 of the area where the pixel defining layer 40 is located serves as a first pixel defining portion, the reflective layer 41 covers all or part of the surface of the protrusion 42 , and the first transparent portion 43 located above the reflective layer 41 serves as a second pixel defining portion; For example, both the first pixel defining portion and the second pixel defining portion are each formed of an insulating material.
  • the light-emitting side of the display substrate shown in FIG. 2 is a surface of the display substrate away from the transparent substrate 50.
  • the display substrate can form an OLED display device of a top emission structure. It can be understood that in the embodiment shown in FIG. 2, the transparent substrate substrate 50 can also be replaced with an opaque substrate substrate.
  • the material of the first transparent portion 43 is not limited in the embodiment of the present invention.
  • the first transparent portion 43 may be formed of a transparent material such as a photopolymerizable resin or a thermally polymerizable resin.
  • the material for forming the first transparent portion 43 is not particularly limited as long as the first transparent portion is transparent. Yes.
  • the reflective layer 41 may cover all of the upper surface of the bumps 42 to increase the reflectance.
  • the reflective layer 41 can be a portion of the upper surface that covers the protrusions.
  • the protrusions 42 may have various forming methods, which are not limited herein.
  • the protrusions 42 may be formed separately, or the protrusions 42 may be formed while forming other layer structures.
  • the embodiment of the present invention does not limit the size, shape, and material of the protrusion, and may be determined according to actual conditions.
  • a display substrate provided by an embodiment of the present invention includes a substrate substrate, a pixel defining layer formed on the substrate substrate, and a light emitting layer located in a sub-pixel region defined by the pixel defining layer.
  • the pixel defining layer includes a reflective layer, and the reflective layer is convex toward the light emitting side of the display substrate, and is configured to reflect light emitted from the light emitting layer toward the reflective layer to the light emitting side of the display substrate; and in the region where the pixel defining layer is located, the reflective layer The portion to the light-emitting side of the display substrate is transparent.
  • the pixel defining layer further includes: a protrusion located in a region where the pixel defining layer is located, the reflective layer covers all or part of the protrusion, and a first transparent portion located above the reflective layer; and the light emitting side of the display substrate is the display substrate away from the base substrate s surface.
  • the reflective layer may reflect the light that the luminescent layer emits toward the reflective layer to the light exiting side of the display substrate, thereby changing the propagation path of the portion of the light.
  • this part of the light is prevented from forming light color interference with adjacent sub-pixels, and on the other hand, the part of the light is redirected to the light-emitting side of the display substrate, so that the part of the light is effectively utilized again, which greatly improves the light leakage problem.
  • the above display substrate is applied to a display device, the light extraction rate and color purity of the display device are effectively improved.
  • the cross section of the protrusion may be semi-elliptical, semi-circular, triangular or trapezoidal. Both the embodiment of the invention and the drawing are illustrated by taking a semi-elliptical shape of the convex cross section as an example.
  • the display substrate further includes: a first transparent layer 51 on the transparent substrate substrate 50.
  • the protrusion 42 is formed on the first transparent layer 51 and is opposite to the first transparent layer 51.
  • One piece structure thus, protrusions can be formed at the same time as the first transparent layer is formed, which reduces the number of patterning processes and saves costs.
  • the application and the material of the first transparent layer are not limited in the embodiment of the present invention.
  • the first transparent layer may serve as a flat layer to facilitate subsequent formation of other layer structures or films, and may of course play other functions. Depending on the actual situation.
  • the display substrate includes: a transparent substrate substrate 50, a pixel defining layer 40' formed on the transparent substrate substrate 50, and a light emitting layer located in the sub-pixel region P defined by the pixel defining layer 40'.
  • the pixel defining layer 40' includes: a reflective layer 41', the reflective layer 41' is convex toward the light-emitting side of the display substrate, and is used for reflecting the light emitted from the light-emitting layer toward the reflective layer to the light-emitting side of the display substrate;
  • Also including a second transparent layer 52 on the transparent substrate substrate 50, the second transparent The clear layer 52 is formed with a first pixel pixel defining portion 42' in the region D where the pixel defining layer 40 is located, a recess T is formed on the first pixel defining portion 42', and the reflective layer 41' conformally covers all or part of the recess T
  • the surface defining layer 40' further includes a second transparent portion 44 located above the reflective layer 41' as a second pixel
  • the light-emitting side of the display substrate is the lower surface of the transparent substrate, and the display substrate can form an OLED display device having a bottom emission structure.
  • the material for forming the second transparent layer 52 in the embodiment of the present invention is not particularly limited as long as the second transparent layer is transparent.
  • the second transparent layer 52 may be formed of a light transmissive material such as a transparent material such as a photopolymerizable resin or a thermopolymerizable resin.
  • the use and materials of the second transparent layer 52 are not limited in the embodiment of the present invention.
  • the second transparent layer 52 can serve as a flat layer to facilitate subsequent formation of other layer structures or films, and of course can also play other roles, depending on the actual situation.
  • the second transparent layer 52 is, for example, an insulating layer.
  • the reflective layer may cover all of the grooves to increase the reflectance.
  • Embodiments of the invention do not limit the extent to which the reflective layer covers the recess.
  • the reflective layer can be a portion of the surface that covers the recess.
  • the groove may have various forming methods, which are not limited herein.
  • the grooves may be formed while forming other layer structures.
  • the embodiment of the present invention does not limit the size and shape of the groove, and may be determined according to actual conditions.
  • a display substrate provided by an embodiment of the present invention includes a transparent substrate substrate, a pixel defining layer formed on the transparent substrate substrate, and a light emitting layer located in a sub-pixel region defined by the pixel defining layer.
  • the pixel defining layer includes a reflective layer, and the reflective layer is convex toward the light emitting side of the display substrate, and is configured to reflect light emitted from the light emitting layer toward the reflective layer to the light emitting side of the display substrate; and in the region where the pixel defining layer is located, the reflective layer The portion to the light-emitting side of the display substrate is transparent.
  • the display substrate further includes a second transparent layer on the transparent substrate, the second transparent layer is formed with a groove in a region where the pixel defining layer is located, and the reflective layer covers all or part of the groove; the pixel defining layer further includes: a reflective layer The second transparent portion above, the bottom of the second transparent portion is filled in the groove.
  • the light exiting side of the display substrate is a surface of the display substrate away from the transparent substrate.
  • the reflective layer can reflect the light that the luminescent layer emits toward the reflective layer to the light exiting side of the display substrate. Thereby changing the propagation path of this part of the light.
  • this part of the light is prevented from forming light color interference with adjacent sub-pixels, and on the other hand, the part of the light is redirected to the light-emitting side of the display substrate, so that the part of the light is effectively utilized again, which greatly improves the light leakage problem.
  • the above display substrate is applied to a display device, the light extraction rate and color purity of the display device are effectively improved.
  • the cross section of the groove may be semi-elliptical, semi-circular, triangular or trapezoidal.
  • the embodiments of the present invention and the drawings are all described by taking a semi-elliptical cross section of the groove as an example.
  • the embodiment of the invention provides a display device, which comprises the display substrate provided by any of the above embodiments.
  • the display device may be a display device such as an OLED display and any display product or component such as a television, a digital camera, a mobile phone, a tablet computer or the like including the display device, and the display device has a high light extraction rate and color purity.
  • An embodiment of the present invention provides a method for fabricating a display substrate according to the embodiment shown in FIG. 2. Referring to FIG. 4, the method includes:
  • the first transparent layer can serve as a planar layer to facilitate subsequent formation of other layer structures or films.
  • the material of the reflective layer is a metal, and may be, for example, a metal such as copper, aluminum, or silver.
  • the forming material of the first transparent portion may be a light transmissive material such as a photopolymerizable resin or a thermopolymerizable resin.
  • the first transparent layer and the protrusion can be formed by one patterning process, which can reduce the number of patterning and save cost.
  • the patterning process is a process of forming a film into a layer including at least one pattern, and the patterning process generally includes: coating a photoresist on the film, exposing the photoresist using the mask, and then removing the photoresist by using the developer. The photoresist is etched away, the portion of the film that is not covered with the photoresist is etched away, and the remaining photoresist is finally stripped.
  • the one-time patterning process refers to a layer structure process required for one exposure to form.
  • the embodiment of the present invention provides a method for fabricating a display substrate as provided in the embodiment shown in FIG. 3. Referring to FIG. 5, the method includes:
  • the forming material of the second transparent layer may be a light transmissive material such as a photopolymerizable resin or a thermopolymerizable resin, and the second transparent layer may serve as a flat layer to facilitate subsequent formation of other layer structures or films.
  • a reflective layer 41' is formed on the recess T.
  • the material of the reflective layer is a metal, and may be, for example, a metal such as copper, aluminum, or silver.
  • a second transparent portion 44 is formed as a second pixel defining portion in the reflective layer 41', and a bottom portion of the second transparent portion is filled in the recess.
  • the material for forming the second transparent portion 44 may be a light transmissive material such as a photopolymerizable resin or a thermopolymerizable resin.
  • the second transparent layer 44 and the groove T can be formed by one patterning process, which can reduce the number of patterning and save cost.
  • the patterning process is a process of forming a film into a layer including at least one pattern, and the patterning process generally includes: coating a photoresist on the film, exposing the photoresist using the mask, and then removing the photoresist by using the developer. The photoresist is etched away, the portion of the film that is not covered with the photoresist is etched away, and the remaining photoresist is finally stripped.
  • the one-time patterning process refers to a layer structure process required for one exposure to form.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

提供一种显示基板及其制作方法、显示装置。其中显示基板包括：衬底基板(50)、形成在所述衬底基板(50)上的像素界定层(40、40')、位于所述像素界定层(40、40')所限定的子像素区域(P)中的发光层(20)。其中，所述像素界定层(40、40')包括：反射层(41、41')，构造为将所述发光层(20)射向所述反射层(41、41')的光反射到所述显示基板的出光侧。采用该显示基板的显示装置不仅能够有效改善漏光以及光色干扰问题，而且出光率和色纯度均得到有效提高。

Description

显示基板及其制作方法、显示装置 技术领域
本发明实施例涉及一种显示基板及其制作方法、显示装置。
背景技术
OLED(Organic Light Emitting Diode，有机发光二极管)显示器具有反应速度快、对比度高、视角广等特点，被认为是下一代显示技术。
发明内容
本发明的一实施例提供一种显示基板，包括：衬底基板、形成在所述衬底基板上的像素界定层、位于所述像素界定层所限定的子像素区域中的发光层，其中，所述像素界定层包括：反射层，构造为将所述发光层射向所述反射层的光反射到所述显示基板的出光侧。
本发明的另一实施例提供一种显示装置，该显示装置包括上述所述的显示基板。
本发明的又一实施例提供了一种显示基板的制作方法，包括：
在衬底基板上的像素限定区域形成像素定义层以在衬底基板上限定子像素区域；
在子像素区域中形成发光层；
其中，所述像素界定层形成为包括反射层，所述反射层构造为将所述发光层射向所述反射层的光反射到所述显示基板的出光侧。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有技术中提供的一种OLED显示器的衬底基板的结构示意图；
图2为本发明实施例提供的一种显示基板的结构示意图；
图3为本发明实施例提供的另一种显示基板的结构示意图；
图4为本发明实施例提供的一种显示基板的制作方法的流程图；
图5为本发明实施例提供的另一种显示基板的制作方法的流程图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
在本发明的描述中，需要理解的是，术语“上”、“下”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
在一相关技术中，OLED显示器包括封装基板和衬底基板，衬底基板包括阵列排布的像素单元，如图1所示，每个像素单元包括红色子像素R、绿色子像素G和蓝色子像素B，每个子像素均包括阳极10、发光层20、阴极30。通常在相邻子像素之间形成有像素界定层40以防止相邻子像素的发光层发出的光互相影响。然而，像素界定层40一般由透光材料形成，则发光层发出的侧向光会射入相邻的子像素中，例如图1所示红色子像素R的发光层发出的侧向光21会射入相邻的绿色子像素G，这会导致漏光以及光色干扰，造成OLED显示器件的出光率和色纯度下降。
尽管在相关技术中可以采用不透光材料形成像素界定层，然而，发明人发现不透光材料一般为具有低介电常数的材料，会造成元件的光电性质下降，同时，发光层发出的侧向光被该不透光的像素界定层吸收，仍造成OLED显示器件的出光率降低。因此相关技术中较少采用不透光材料形成像素界定层。那么，在采用透光材料形成像素界定层的情况下，解决漏光以及光色干扰，进而提高OLED显示器件的出光率和色纯度成了亟待解决的问题。
本发明的实施例提供一种显示基板及其制作方法、显示装置。包括该显 示基板的显示装置能够有效改善漏光以及光色干扰问题，该显示装置的出光率和色纯度均得到有效提高。
本发明实施例提供了一种显示基板，参考图2-3所示，该显示基板包括：透明衬底基板50、形成在透明衬底基板50上的像素界定层40、40’、位于像素界定层40、40’所限定的子像素区域P中的发光层20；像素界定层40、40’包括：反射层41、41’，构造为将发光层20射向反射层41、41’的光反射到显示基板的出光侧。
本发明的实施例提供了的显示基板中，反射层可以将发光层射向反射层的光反射到显示基板的出光侧，从而改变这部分光的传播路径。一方面避免这部分光对相邻子像素形成光色干扰，另一方面这部分光重新射向显示基板的出光侧，使得这部分光再次得到有效利用，极大改善了漏光问题。将上述显示基板应用到显示装置中，显示装置的出光率和色纯度均得到有效提高。
上述显示基板中，本发明实施例对于发光层的材料不作限定，例如发光层的材料可以是有机电致发光型材料，当然还可以是其他类型的发光材料。当发光层的材料为有机电致发光型材料时，上述显示基板可以形成OLED显示装置。本发明实施例以及附图均以显示基板能够形成OLED显示装置为例进行说明。
在像素界定层40、40’包所在区域内，从反射层41、41’到显示基板的出光侧的部分是透明的。
反射层41、41’朝向显示基板的出光侧呈凸起状，像素界定层40、40’例如形成在像素界定区域D中。
上述显示基板中，本发明实施例对于显示基板的出光侧不作限定。例如，参考图2所示，显示基板的出光侧可以是显示基板远离透明衬底基板50的表面，即显示基板的光从显示基板的上表面发出，该显示基板可以形成顶发射结构的OLED显示装置；当然，参考图3所示，显示基板的出光侧还可以是显示基板的下表面，即光从透明衬底基板50的下表面发出，该显示基板可以形成底发射结构的OLED显示装置。这里需要说明的是，本发明实施例以及附图中，显示基板的上表面指的是远离透明衬底基板的表面，若显示基板仅包含图2中的层结构，则显示基板的上表面是阴极30的上表面和像素界定层40的上表面所组成的表面。在另一示例中，图2所示的显示基板上还可以包 含其他层，例如保护层，此时，显示基板的上表面为保护层的上表面；显示基板的下表面指的是透明衬底基板50的下表面。可以理解的是，在图2所示的实施例中，透明衬底基板50也可替换为不透明衬底基板。
另外，反射层朝向显示基板的出光侧呈凸起状。例如，在图2所示实施例中，显示基板的出光侧为显示基板远离透明衬底基板的表面，则反射层朝向显示基板的出光侧呈凸起状例如是指反射层可以是沿AA′方向呈凸起状；在图3所示实施例中，显示基板的出光侧为显示基板的下表面，则反射层朝向显示基板的出光侧呈凸起状例如是指反射层可以是沿BB′方向呈凸起状。
上述显示基板中，反射层用于将发光层射向反射层的光反射到显示基板的出光侧。本发明实施例对于反射层和发光层的相对位置不作具体限定，只要满足反射层可以将发光层射向反射层的光反射到显示基板的出光侧即可。例如，反射层41可以是凸出于发光层中远离显示基板的出光侧的发光面所在的平面。例如，参考图2所示，反射层41可以是沿AA′方向呈凸起状，且凸出于发光层20中远离显示基板的出光侧的发光面所在的平面，即反射层41凸出于发光层20的下表面201所在的平面，进一步可选的，反射层41还可以是凸出于发光层20的上表面202所在的平面以进一步提高反射率。
参考图3所示，反射层41’可以是沿BB′方向呈凸起状，且凸出于发光层20中远离显示基板的出光侧的发光面所在的平面，即反射层41’凸出于发光层20的上表面202所在的平面，进一步可选的，反射层41还可以是凸出于发光层20的下表面201所在的平面以进一步提高反射率。这里需要说明的是，本发明实施例以及附图中，发光层的上表面指的是远离透明衬底基板的表面，发光层的下表面指的是面对透明衬底基板的表面。
上述显示基板中，本发明实施例对于像素界定层所限定的子像素区域P内的层结构不作限定，例如参考图2和图3所示，该子像素区域还可以包括位于发光层20之上的阴极30以及位于发光层20之下的阳极10，阴极30和阳极10之间可以形成电场以驱动发光层20发光；当然，阴极30和阳极10的位置并不限定于此，例如，阴极30还可以位于发光层20之下、阳极10还可以位于发光层20之上，这里不作限定。
本发明的实施例提供了一种显示基板，该显示基板包括衬底基板、形成在衬底基板上的像素界定层、位于像素界定层所限定的子像素区域中的发光 层。像素界定层包括反射层，反射层朝向显示基板的出光侧呈凸起状；在像素界定层所在区域内，从反射层到显示基板的出光侧的部分是透明的。这样，参考图2和3所示，反射层可以将发光层射向反射层的光21反射到显示基板的出光侧，从而改变这部分光的传播路径。一方面避免这部分光对相邻子像素形成光色干扰，另一方面这部分光重新射向显示基板的出光侧，使得这部分光再次得到有效利用，极大改善了漏光问题。将上述显示基板应用到显示装置中，显示装置的出光率和色纯度均得到有效提高。
可选的，为了提高反射率从而增强反射效果，上述显示基板中，反射层的材料为金属，例如可以是铜、铝、银等金属。当然，反射层的材料还可以是其他材料，只要具有反射光的特性即可。
下面将进一步基于图2和3所示的显示基板，说明本发明实施例提供的显示基板的其他方面的特征。
参考图2所示，该显示基板包括：透明衬底基板50、形成在透明衬底基板50上的像素界定层40、位于像素界定层40所限定的子像素区域P中的发光层20；像素界定层40包括：反射层41，反射层41朝向显示基板的出光侧呈凸起状，用于将发光层射向反射层的光反射到显示基板的出光侧；像素界定层40还包括：位于像素界定层40所在区域的凸起42作为第一像素限定部分，反射层41覆盖凸起42的全部或部分表面，以及位于反射层41之上的第一透明部43作为第二像素限定部分；例如，第一像素限定部分和第二像素限定部分均为均由绝缘材料形成。
图2所示的显示基板的出光侧为显示基板远离透明衬底基板50的表面。该显示基板可以形成顶发射结构的OLED显示装置。可以理解的是，在图2所示的实施例中，透明衬底基板50也可替换为不透明衬底基板。
上述显示基板中，本发明实施例对于第一透明部43的材料不作限定。例如，第一透明部43可以是由透明材料例如光可聚合树脂或热可聚合树脂等透光材料形成.这里对于第一透明部43的形成材料不作具体限定，只要满足第一透明部是透明的即可。
上述显示基板中，反射层41可以是覆盖凸起42的全部上表面，可以增加反射率。在另一示例中，反射层41可以是覆盖凸起的一部分上表面。本发明实施例以及附图均以反射层覆盖凸起的全部为例进行说明。
上述显示基板中，凸起42可以有多种形成方法，这里不作限定。例如可以是单独形成凸起42，还可以是在形成其他层结构的同时形成凸起42。另外，本发明实施例对于凸起的大小、形状和材料也不作限定，可以根据实际情况而定。
本发明的实施例提供的显示基板包括衬底基板、形成在衬底基板上的像素界定层、位于像素界定层所限定的子像素区域中的发光层。像素界定层包括反射层，反射层朝向显示基板的出光侧呈凸起状，用于将发光层射向反射层的光反射到显示基板的出光侧；在像素界定层所在区域内，从反射层到显示基板的出光侧的部分是透明的。像素界定层还包括：位于像素界定层所在区域的凸起，反射层覆盖凸起的全部或部分，以及位于反射层之上的第一透明部；显示基板的出光侧为显示基板远离衬底基板的表面。
在上述实施例中，反射层可以将发光层射向反射层的光反射到显示基板的出光侧，从而改变这部分光的传播路径。一方面避免这部分光对相邻子像素形成光色干扰，另一方面这部分光重新射向显示基板的出光侧，使得这部分光再次得到有效利用，极大改善了漏光问题。将上述显示基板应用到显示装置中，显示装置的出光率和色纯度均得到有效提高。
可选的，为了方便制作，凸起的横截面可以为半椭圆形、半圆形、三角形或梯形，本发明实施例以及附图均以凸起的横截面为半椭圆形为例进行说明。
可选的，参考图2所示，上述显示基板还包括：位于透明衬底基板50上的第一透明层51，凸起42形成在第一透明层51上、且与第一透明层51为一体结构。这样在形成第一透明层的同时可以形成凸起，减少了构图工艺次数，节约了成本。需要说明的是，本发明实施例对于第一透明层的用途和材料不作限定，例如第一透明层可以作为平坦层以利于后续形成其他层结构或者薄膜，当然还可以起到其他作用，可以根据实际情况而定。
再次参考图3所示，该显示基板包括：透明衬底基板50、形成在透明衬底基板50上的像素界定层40’、位于像素界定层40’所限定的子像素区域P中的发光层20；像素界定层40’包括：反射层41’，反射层41’朝向显示基板的出光侧呈凸起状，用于将发光层射向反射层的光反射到显示基板的出光侧；显示基板还包括位于透明衬底基板50上的第二透明层52，第二透 明层52在像素界定层40所在区域D形成有第一像素像素限定部分42’，第一像素限定部分42’上形成有凹槽T，反射层41’共形覆盖凹槽T的全部或部分表面；像素界定层40’还包括：位于反射层41’之上的第二透明部44作为第二像素限定部分。第二透明部44的底部填充在凹槽T内。该显示基板的出光侧为透明衬底基板的下表面。
上述显示基板中，显示基板的出光侧为透明衬底基板的下表面，则该显示基板可以形成底发射结构的OLED显示装置。
上述显示基板中，本发明实施例对于第二透明层52的形成材料不作特别限定，只要满足第二透明层是透明的即可。。例如，第二透明层52可以是由透明材料例如光可聚合树脂或热可聚合树脂等透光材料形成。另外，对于第二透明层52的用途和材料本发明实施例不作限定。例如第二透明层52可以作为平坦层以利于后续形成其他层结构或者薄膜，当然还可以起到其他作用，可以根据实际情况而定。第二透明层52例如为绝缘层。
上述显示基板中，反射层可以是覆盖凹槽的全部以增加反射率。本发明实施例不限制反射层覆盖凹槽的程度。在另一示例中反射层可以是覆盖凹槽的一部分表面。本发明实施例以及附图均以反射层覆盖凹槽的全部为例进行说明。
上述显示基板中，凹槽可以有多种形成方法，这里不作限定。例如可以是在形成其他层结构的同时形成凹槽。另外，本发明实施例对于凹槽的大小、形状也不作限定，可以根据实际情况而定。
本发明的实施例提供的显示基板包括透明衬底基板、形成在透明衬底基板上的像素界定层、位于像素界定层所限定的子像素区域中的发光层。像素界定层包括反射层，反射层朝向显示基板的出光侧呈凸起状，用于将发光层射向反射层的光反射到显示基板的出光侧；在像素界定层所在区域内，从反射层到显示基板的出光侧的部分是透明的。显示基板还包括位于透明衬底基板上的第二透明层，第二透明层在像素界定层所在区域形成有凹槽，反射层覆盖凹槽的全部或部分；像素界定层还包括：位于反射层之上的第二透明部，第二透明部的底部填充在凹槽内。显示基板的出光侧为显示基板远离透明衬底基板的表面。
这样，反射层可以将发光层射向反射层的光反射到显示基板的出光侧， 从而改变这部分光的传播路径。一方面避免这部分光对相邻子像素形成光色干扰，另一方面这部分光重新射向显示基板的出光侧，使得这部分光再次得到有效利用，极大改善了漏光问题。将上述显示基板应用到显示装置中，显示装置的出光率和色纯度均得到有效提高。
可选的，为了方便制作，凹槽的横截面可以为半椭圆形、半圆形、三角形或梯形，本发明实施例以及附图均以凹槽的横截面为半椭圆形为例进行说明。
本发明实施例提供了一种显示装置，该显示装置包括上述任一实施例提供的显示基板。该显示装置可以为OLED显示器等显示器件以及包括这些显示器件的电视、数码相机、手机、平板电脑等任何具有显示功能的产品或者部件，该显示装置具有较高的出光率和色纯度。
本发明实施例提供了一种如图2所示实施例提供的显示基板的制作方法，参考图4所示，该方法包括：
S401、在衬底基板上形成第一透明层，在第一透明层上方且在像素界定区域D中形成第一像素限定部分42，其中，所述第一像素限定部分形成为朝向所述显示基板的出光侧的凸起。
例如，第一透明层可以作为平坦层以利于后续形成其他层结构或者薄膜。
S402、在凸起上形成反射层，
例如，反射层的材料为金属，例如可以是铜、铝、银等金属。
S403、在衬底基板上对应凸起的位置处形成第一透明部，且第一透明部覆盖凸起以及反射层。
例如，第一透明部的形成材料可以是光可聚合树脂或热可聚合树脂等透光材料。
可选的，第一透明层和凸起可以通过一次构图工艺形成，这样可以减少构图次数，节约成本。例如，构图工艺是将薄膜形成包括至少一个图案的层的工艺，构图工艺通常包括：在薄膜上涂覆光刻胶，利用掩膜板对光刻胶进行曝光，再利用显影液将需去除的光刻胶冲蚀掉，再刻蚀掉未覆盖光刻胶的薄膜部分，最后将剩下的光刻胶剥离。本发明所有实施例中，一次构图工艺是指经过一次曝光形成所需要的层结构工艺。
本发明实施例提供了一种如如图3所示实施例提供的显示基板的制作方法，参考图5所示，该方法包括：
S501、在透明衬底基板上形成第二透明层52，在第二透明层52上所述像素界定区域D内形成第一像素限定部分42’，其中，所述第一像素限定部分42’形成为具有凹槽T形成凹槽。
例如，第二透明层的形成材料可以是光可聚合树脂或热可聚合树脂等透光材料，第二透明层可以作为平坦层以利于后续形成其他层结构或者薄膜。
S502、在凹槽T上形成反射层41’。
例如，反射层的材料为金属，例如可以是铜、铝、银等金属。
S503、在反射层41’形成第二透明部44作为第二像素限定部分，第二透明部的底部填充在凹槽内。
例如，第二透明部44的形成材料可以是光可聚合树脂或热可聚合树脂等透光材料。
可选的，第二透明层44和凹槽T可以通过一次构图工艺形成，这样可以减少构图次数，节约成本。例如，构图工艺是将薄膜形成包括至少一个图案的层的工艺，构图工艺通常包括：在薄膜上涂覆光刻胶，利用掩膜板对光刻胶进行曝光，再利用显影液将需去除的光刻胶冲蚀掉，再刻蚀掉未覆盖光刻胶的薄膜部分，最后将剩下的光刻胶剥离。本发明所有实施例中，一次构图工艺是指经过一次曝光形成所需要的层结构工艺。
虽然上文中已经用一般性说明及具体实施方式，对本发明实施例作了详尽的描述，但在本发明实施例基础上，可以对之作一些修改或改进，这对本领域技术人员而言是显而易见的。因此，在不偏离本发明精神的基础上所做的这些修改或改进，均属于本发明要求保护的范围。
本申请要求于2015年5月28日递交的中国专利申请第201510283539.7号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (19)

  1. 一种显示基板，包括：衬底基板、形成在所述衬底基板上的像素界定层、位于所述像素界定层所限定的子像素区域中的发光层，其中，所述像素界定层包括：反射层，构造为将所述发光层射向所述反射层的光反射到所述显示基板的出光侧。
  2. 根据权利要求1所述的显示基板，其中，所述像素界定层的在所述反射层与所述出光侧之间的部分是透明的。
  3. 根据权利要求1或2所述的显示基板，其中，所述反射层朝向所述显示基板的出光侧呈凸起状。
  4. 根据权利要求1至3中任一项所述的显示基板，其中，所述反射层的材料为金属。
  5. 根据权利要求1至4中任一项所述的显示基板，还包括位于所述子像素区域中的阳极层和阴极层，所述发光层位于所述阳极层与所述阴极层之间。
  6. 根据权利要求1至5中任一项所述的显示基板，其中，所述反射层与所述阳极层、所述阴极层以及所述发光层物理及电性分离。
  7. 根据权利要求1至6中任一项所述的显示基板，其中，所述像素界定层还包括：位于所述反射层之下的第一像素定义部分，以及位于所述反射层之上的第二像素定义部分。
  8. 根据权利要求7中任一项所述的显示基板，其中，所述显示基板的出光侧为所述显示基板远离所述衬底基板的表面，所述第一像素定义部分形成为朝向所述显示基板的出光侧的凸起，所述反射层共形覆盖所述凸起的全部或部分表面。
  9. 根据权利要求8所述的显示基板，其中，所述凸起的横截面为半椭圆形、半圆形、三角形或梯形。
  10. 根据权利要求7所述的显示基板，其中，所述衬底基板为是透明的，所述显示基板的出光侧为所述衬底基板的下表面；所述第一像素定义部分形成为具有凹槽，所述反射层共形覆盖所述凹槽的全部或部分表面；所述第二像素定义部分的底部填充在所述凹槽内。
  11. 根据权利要求10所述的显示基板，其中，所述凹槽的横截面为半椭 圆形、半圆形、三角形或梯形。
  12. 根据权利要求7至11中任一项所述的显示基板，其中，所述第一像素定义部分和所述第二像素定义部分均为透明的。
  13. 根据权利要求7至12中任一项所述的显示基板，还包括：位于所述衬底基板上的第一透明层，所述第一像素定义部分形成在所述第一透明层上、且与所述第一透明层为一体结构。
  14. 一种显示装置，其中，包括权利要求1至13任一项所述的显示基板。
  15. 一种显示基板的制作方法，包括：
    在衬底基板上的像素限定区域形成像素定义层以在衬底基板上限定子像素区域；
    在子像素区域中形成发光层；
    其中，所述像素界定层形成为包括反射层，所述反射层构造为将所述发光层射向所述反射层的光反射到所述显示基板的出光侧。
  16. 根据权利要求15所述的制作方法，其中，所述在衬底基板上的像素限定区域形成像素定义层以在衬底基板上限定子像素区域，包括：
    在衬底基板上的像素限定区域形成透明层，
    在所述透明层上的所述像素界定区域内形成第一像素限定部分，其中，所述第一像素限定部分形成为朝向所述显示基板的出光侧的凸起；
    在所述凸起上形成反射层；
    在所述反射层上方形成透明的第二像素定义部分，且所述第二像素定义部分覆盖所述凸起以及所述反射层。
  17. 根据权利要求16所述的制作方法，其中，所述第一透明层和所述凸起通过一次构图工艺形成。
  18. 根据权利要求15所述的制作方法，其中，所述在衬底基板上的像素限定区域形成像素定义层以在衬底基板上限定子像素区域，包括：
    在衬底基板上形成透明层，
    在所述透明层上所述像素界定区域内形成第一像素限定部分，其中，所述第一像素限定部分形成为具有一凹槽；
    在所述凹槽上形成反射层；
    在所述反射层上方形成透明的第二像素定义部分，所述第二像素定义部 分的底部填充在所述凹槽内。
  19. 根据权利要求18所述的制作方法，其中，所述透明层和具有所述凹槽的第一像素限定部分通过一次构图工艺形成。
PCT/CN2016/079038 2015-05-28 2016-04-12 显示基板及其制作方法、显示装置 WO2016188248A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/321,211 US10044001B2 (en) 2015-05-28 2016-04-12 Display substrate and manufacturing method therefor, and display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510283539.7A CN104979375A (zh) 2015-05-28 2015-05-28 一种显示基板及其制作方法、显示装置
CN201510283539.7 2015-05-28

Publications (1)

Publication Number Publication Date
WO2016188248A1 true WO2016188248A1 (zh) 2016-12-01

Family

ID=54275715

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/079038 WO2016188248A1 (zh) 2015-05-28 2016-04-12 显示基板及其制作方法、显示装置

Country Status (3)

Country Link
US (1) US10044001B2 (zh)
CN (1) CN104979375A (zh)
WO (1) WO2016188248A1 (zh)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104979375A (zh) * 2015-05-28 2015-10-14 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示装置
KR102631461B1 (ko) * 2016-10-26 2024-01-30 엘지디스플레이 주식회사 발광 영역 및 반사 영역을 포함하는 디스플레이 장치
CN106848095A (zh) * 2017-01-24 2017-06-13 上海天马微电子有限公司 一种有机电致发光显示面板及其制备方法和电子设备
TWI658583B (zh) * 2017-06-14 2019-05-01 友達光電股份有限公司 畫素陣列及其製造方法
CN109119437B (zh) * 2017-06-23 2021-09-28 京东方科技集团股份有限公司 像素界定层及制造方法、显示基板及制造方法、显示面板
CN109713007A (zh) * 2017-10-25 2019-05-03 京东方科技集团股份有限公司 阵列基板及其制备方法、显示面板、显示装置
KR102522110B1 (ko) * 2017-11-29 2023-04-13 엘지디스플레이 주식회사 유기발광 표시장치
CN108172600B (zh) * 2017-12-29 2020-01-17 深圳市华星光电半导体显示技术有限公司 用于woled显示器的彩膜基板及woled显示器
CN108110038B (zh) * 2018-01-02 2021-06-25 上海天马微电子有限公司 有机发光显示面板和显示装置
CN108232031A (zh) * 2018-01-03 2018-06-29 深圳市华星光电技术有限公司 Oled显示器件及制备方法
CN108305891A (zh) * 2018-02-12 2018-07-20 上海天马微电子有限公司 一种显示面板及其制造方法、显示装置
US10658621B2 (en) * 2018-04-09 2020-05-19 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. OLED panel and manufacturing method thereof and OLED display
CN109037476A (zh) * 2018-07-26 2018-12-18 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示装置
CN109326222A (zh) * 2018-09-28 2019-02-12 合肥鑫晟光电科技有限公司 一种显示基板及其制备方法、调节方法、显示装置
CN109346621B (zh) * 2018-10-18 2021-07-30 武汉天马微电子有限公司 一种显示面板及显示装置
CN109346506A (zh) 2018-10-25 2019-02-15 京东方科技集团股份有限公司 一种阵列基板及其制备方法、显示面板
TWI680573B (zh) * 2018-11-02 2019-12-21 友達光電股份有限公司 顯示面板及其畫素結構
CN109841754A (zh) * 2019-03-06 2019-06-04 深圳市华星光电半导体显示技术有限公司 Oled显示面板
CN110212004A (zh) 2019-06-14 2019-09-06 京东方科技集团股份有限公司 一种像素界定层、有机发光二极管显示面板和制作方法
CN110429203A (zh) * 2019-07-24 2019-11-08 昆山维信诺科技有限公司 一种显示基板、显示面板、显示装置及显示基板制备方法
CN110600508B (zh) * 2019-08-22 2021-12-24 武汉华星光电半导体显示技术有限公司 一种显示面板和显示装置
CN110504387B (zh) * 2019-08-30 2023-01-13 京东方科技集团股份有限公司 一种显示基板及其制作方法和显示装置
CN110610975B (zh) * 2019-09-23 2022-04-08 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置
CN111029482B (zh) * 2019-12-17 2021-01-01 深圳市华星光电半导体显示技术有限公司 一种显示面板及显示装置
CN111129271B (zh) * 2019-12-23 2021-08-03 深圳市华星光电半导体显示技术有限公司 显示面板以及显示装置
CN111403623A (zh) 2020-03-26 2020-07-10 武汉华星光电半导体显示技术有限公司 一种显示面板及其制备方法
CN113451524A (zh) * 2020-03-27 2021-09-28 京东方科技集团股份有限公司 显示装置、显示面板及其制造方法
CN112133734B (zh) * 2020-09-29 2022-08-30 湖北长江新型显示产业创新中心有限公司 显示面板及显示装置
CN112599705B (zh) * 2020-12-14 2024-04-19 京东方科技集团股份有限公司 显示面板及其制备方法
CN112599581A (zh) * 2020-12-14 2021-04-02 北京维信诺科技有限公司 显示面板及其制备方法、显示装置
US20230163264A1 (en) * 2020-12-26 2023-05-25 BOE MLED Technology Co., Ltd. Display substrate and method for manufacturing the same, and display apparatus
CN113066830B (zh) * 2021-03-16 2022-07-01 京东方科技集团股份有限公司 一种显示面板及其制备方法、显示装置
CN112952025A (zh) * 2021-03-31 2021-06-11 京东方科技集团股份有限公司 显示基板及显示装置
CN113611225B (zh) * 2021-08-19 2023-03-21 业成科技（成都）有限公司 光学显示器结构

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103681769A (zh) * 2013-12-24 2014-03-26 京东方科技集团股份有限公司 显示装置、有机电致发光器件及其制作方法
CN103915482A (zh) * 2014-03-27 2014-07-09 京东方科技集团股份有限公司 一种有机电致发光显示面板、其制作方法及显示装置
US20140217431A1 (en) * 2013-02-05 2014-08-07 Sony Corporation Display device, method for manufacturing the same, and electronic device
CN104282844A (zh) * 2013-07-08 2015-01-14 上海和辉光电有限公司 有机发光结构及其制造方法及有机发光组件
CN104979375A (zh) * 2015-05-28 2015-10-14 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI227570B (en) * 2003-12-11 2005-02-01 South Epitaxy Corp Light-emitting diode packaging structure
US7535163B2 (en) 2006-02-22 2009-05-19 Tpo Displays Corp. System for displaying images including electroluminescent device and method for fabricating the same
TW200834962A (en) * 2007-02-08 2008-08-16 Touch Micro System Tech LED array package structure having Si-substrate and method of making the same
JP2012043583A (ja) * 2010-08-17 2012-03-01 Sony Corp 表示装置およびその製造方法
US8497143B2 (en) * 2011-06-21 2013-07-30 Cofan Usa, Inc. Reflective pockets in LED mounting
US9178123B2 (en) * 2012-12-10 2015-11-03 LuxVue Technology Corporation Light emitting device reflective bank structure
KR102111974B1 (ko) * 2013-07-03 2020-05-19 삼성디스플레이 주식회사 유기발광 표시 장치 및 이의 제조 방법
KR102080008B1 (ko) * 2013-07-12 2020-02-24 삼성디스플레이 주식회사 유기발광표시장치 및 그 제조방법
CN104466022B (zh) * 2014-12-17 2019-01-18 昆山国显光电有限公司 一种有机发光二极管显示器件及其制备方法
CN104465706A (zh) * 2014-12-17 2015-03-25 上海天马有机发光显示技术有限公司 一种有机发光显示装置及其制作方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140217431A1 (en) * 2013-02-05 2014-08-07 Sony Corporation Display device, method for manufacturing the same, and electronic device
CN104282844A (zh) * 2013-07-08 2015-01-14 上海和辉光电有限公司 有机发光结构及其制造方法及有机发光组件
CN103681769A (zh) * 2013-12-24 2014-03-26 京东方科技集团股份有限公司 显示装置、有机电致发光器件及其制作方法
CN103915482A (zh) * 2014-03-27 2014-07-09 京东方科技集团股份有限公司 一种有机电致发光显示面板、其制作方法及显示装置
CN104979375A (zh) * 2015-05-28 2015-10-14 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示装置

Also Published As

Publication number Publication date
US10044001B2 (en) 2018-08-07
US20170194602A1 (en) 2017-07-06
CN104979375A (zh) 2015-10-14

Similar Documents

Publication Publication Date Title
WO2016188248A1 (zh) 显示基板及其制作方法、显示装置
US11997871B2 (en) Organic light-emitting diode display panel, method for preparing the same, and display device
KR101739771B1 (ko) 유기발광 표시장치 및 그 제조방법
US10573842B2 (en) Organic electroluminescent device, method for manufacturing the same and display device
US10205121B2 (en) Organic electroluminescent display panel and display apparatus
TWI692135B (zh) 有機發光顯示裝置
TWI637657B (zh) 有機發光二極體顯示器
JP6284346B2 (ja) 有機ｅｌ表示装置
US11502143B2 (en) Method of formimg a display device comprising a reflective cup-shaped pixel defining
WO2019000904A1 (zh) Oled显示基板及其制作方法、显示装置
WO2016082341A1 (zh) 有机电致发光器件、其制备方法以及显示装置
KR20170052467A (ko) 유기발광 표시장치
WO2016167354A1 (ja) 有機エレクトロルミネッセンス装置
WO2016031679A1 (ja) 有機エレクトロルミネッセンス装置、有機エレクトロルミネッセンス装置の製造方法、照明装置、および表示装置
KR102387859B1 (ko) 유기 발광 표시 장치 및 그 제조 방법
JP2016081562A (ja) 表示装置、表示装置の製造方法および電子機器
JP2010244693A (ja) 有機ｅｌ装置および有機ｅｌ装置の製造方法、ならびに電子機器
KR102345872B1 (ko) 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법
US11563064B2 (en) Array substrate, display device, and method for fabricating an array substrate
JP2019185887A (ja) 発光装置、表示装置および撮像装置
TW201415620A (zh) 有機發光二極體顯示器及其製造方法
US9502689B2 (en) Organic light emitting display and method of manufacturing the same
JP2024045452A (ja) 表示装置、および電子機器
WO2016043175A1 (ja) 有機エレクトロルミネッセンス装置および有機エレクトロルミネッセンス装置の製造方法
CN111697162A (zh) 显示面板及其制备方法、显示装置

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 15321211

Country of ref document: US

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16799137

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16799137

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 30/04/2018)

122 Ep: pct application non-entry in european phase

Ref document number: 16799137

Country of ref document: EP

Kind code of ref document: A1