WO2016143426A1 - Dispositif de circuit intégré sans fil, corps moulé en résine équipé de ce dispositif de circuit intégré sans fil, et dispositif de terminal de communication équipé de ce corps moulé en résine ainsi que procédé de fabrication de ce dispositif de terminal de communication - Google Patents

Dispositif de circuit intégré sans fil, corps moulé en résine équipé de ce dispositif de circuit intégré sans fil, et dispositif de terminal de communication équipé de ce corps moulé en résine ainsi que procédé de fabrication de ce dispositif de terminal de communication Download PDF

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Publication number
WO2016143426A1
WO2016143426A1 PCT/JP2016/053346 JP2016053346W WO2016143426A1 WO 2016143426 A1 WO2016143426 A1 WO 2016143426A1 JP 2016053346 W JP2016053346 W JP 2016053346W WO 2016143426 A1 WO2016143426 A1 WO 2016143426A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
magnetic circuit
wireless
main surface
metal body
Prior art date
Application number
PCT/JP2016/053346
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English (en)
Japanese (ja)
Inventor
直徒 池田
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2017504914A priority Critical patent/JP6222398B2/ja
Priority to CN201690000542.1U priority patent/CN207541648U/zh
Publication of WO2016143426A1 publication Critical patent/WO2016143426A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier

Definitions

  • the present invention relates to a wireless IC device used in a short-range wireless communication apparatus including an RFID (Radio Frequency Identification) tag.
  • RFID Radio Frequency Identification
  • HF band RFID tags are generally card-sized, but small RFID tags with a small occupied area may be required for use in merchandise management.
  • an RFID tag having a magnetic core is known (for example, see Patent Documents 1 and 2).
  • the RFID tag disclosed in Patent Document 1 has an RFIC element and a magnetic core mounted on a circuit board and embedded in a resin insulating layer.
  • an antenna coil is formed on a circuit board and a resin insulating layer.
  • an antenna coil is formed by a resin multilayer substrate, a cavity is formed in the resin multilayer substrate, and a magnetic core is disposed in the cavity.
  • the RFID tag disclosed in Patent Document 1 has a problem that the size of the RFID tag cannot be reduced because the RFIC element, the antenna coil, and the magnetic core are arranged on the circuit board.
  • the RFID tag disclosed in Patent Document 2 forms an antenna coil by laminating a plurality of insulating resin layers having via-hole type interlayer connection conductors and forming connection portions in the thickness direction of the resin multilayer substrate. .
  • the RFID tag disclosed in Patent Document 2 increases the coil diameter of the antenna coil by increasing the number of laminated insulating resin substrates in order to improve the L value of the antenna coil or improve the antenna performance. Yes.
  • the RFID tag of Patent Document 2 has a problem that the configuration becomes complicated when the number of laminated insulating resin substrates is increased.
  • the present invention solves the above problems and provides a wireless IC device that can be miniaturized with a simple configuration, a resin molded body including the wireless IC device, a communication terminal device including the wireless IC device, and a method for manufacturing the same.
  • the purpose is to do.
  • a wireless IC device of one embodiment of the present invention includes: A resin member having a first main surface and a second main surface facing the first main surface; A magnetic circuit board having a wiring conductor pattern; An RFIC element mounted on the wiring conductor pattern of the magnetic circuit board and having a first input / output terminal and a second input / output terminal; An antenna coil having one end connected to the first input / output terminal and the other end connected to the second input / output terminal; With At least a part of the magnetic circuit board is disposed inside the antenna coil as a magnetic core of the antenna coil.
  • the resin molding of one aspect of the present invention is A resin molded body equipped with a wireless IC device,
  • the wireless IC device is: A resin member having a first main surface and a second main surface facing the first main surface; A magnetic circuit board having a wiring conductor pattern; An RFIC element mounted on the wiring conductor pattern of the magnetic circuit board and having a first input / output terminal and a second input / output terminal; An antenna coil having one end connected to the first input / output terminal and the other end connected to the second input / output terminal; With At least a part of the magnetic circuit board is disposed inside the antenna coil as a magnetic core of the antenna coil.
  • a communication terminal device includes: A communication terminal device including a wireless IC device,
  • the wireless IC device is: A resin member having a first main surface and a second main surface facing the first main surface; A magnetic circuit board having a wiring conductor pattern; An RFIC element mounted on the wiring conductor pattern of the magnetic circuit board and having a first input / output terminal and a second input / output terminal; An antenna coil having one end connected to the first input / output terminal and the other end connected to the second input / output terminal; With At least a part of the magnetic circuit board is disposed inside the antenna coil as a magnetic core of the antenna coil.
  • a method for manufacturing a wireless IC device of one embodiment of the present invention includes: Disposing a magnetic circuit board in which an RFIC element having a first input / output terminal and a second input / output terminal is mounted on a wiring conductor pattern on an adhesive layer provided on a pedestal; A step of placing the first metal body and the second metal body upright on the adhesive layer; A step of coating the magnetic circuit board, the first metal body, and the second metal body, which are disposed on the adhesive layer, with a resin member; Forming a second wiring pattern to which the first metal body and the second metal body are connected to the first main surface of the resin member; The base provided with the adhesive layer is removed to connect the first metal body and the second metal body, while connecting the first input / output terminal of the RFIC element and the first metal body, and the RFIC Forming a first wiring pattern connecting a second input / output terminal of an element and the second metal body on a second main surface of the resin member; including.
  • a wireless IC device that can be miniaturized with a simple configuration, a resin molded body including the wireless IC device, a communication terminal device including the wireless IC device, and a manufacturing method thereof.
  • FIG. 1 is a perspective view of a wireless IC device according to a first embodiment of the present invention.
  • 1 is a plan view of a wireless IC device according to a first embodiment of the present invention.
  • 1 is a bottom view of a wireless IC device according to a first embodiment of the present invention.
  • 1 is a schematic configuration diagram of a wireless IC device according to a first embodiment of the present invention.
  • the top view of the circuit board in Embodiment 1 which concerns on this invention 1 is a circuit diagram of a wireless IC device according to a first embodiment of the present invention.
  • FIG. 1 The figure which shows the manufacturing process of the radio
  • Schematic configuration diagram of a wireless IC device according to a second embodiment of the present invention A bottom view of a wireless IC device according to a second embodiment of the present invention.
  • wireless IC device of Embodiment 2 which concerns on this invention The figure which shows the manufacturing process of the radio
  • Schematic configuration diagram of a wireless IC device according to a third embodiment of the present invention A bottom view of a wireless IC device according to a third embodiment of the present invention
  • Schematic configuration diagram of a wireless IC device according to a fourth embodiment of the present invention Schematic configuration diagram of a wireless IC device according to a fourth embodiment of the present invention.
  • Schematic configuration diagram of a wireless IC device according to a fifth embodiment of the present invention A bottom view of a wireless IC device according to a fifth embodiment of the present invention
  • Schematic configuration diagram of a wireless IC device according to a sixth embodiment of the present invention 7 is a perspective view of an article with an RFID tag according to a seventh embodiment of the present invention.
  • FIG. 7 Front view of an article with an RFID tag according to a seventh embodiment of the present invention
  • FIG. 7 shows the manufacturing process of the injection molding of the article
  • a wireless IC device of one embodiment of the present invention includes: A resin member having a first main surface and a second main surface facing the first main surface; A magnetic circuit board having a wiring conductor pattern; An RFIC element mounted on the wiring conductor pattern of the magnetic circuit board and having a first input / output terminal and a second input / output terminal; An antenna coil having one end connected to the first input / output terminal and the other end connected to the second input / output terminal; With At least a part of the magnetic circuit board may be disposed inside the antenna coil as a magnetic core of the antenna coil.
  • the magnetic circuit board is disposed inside the antenna coil, it acts as a magnetic core (magnetic core) of the antenna coil. For this reason, since the L value of the antenna coil or the antenna performance can be improved by the magnetic substrate, the antenna size can be maximized with respect to the device dimensions.
  • the antenna coil is A first wiring pattern formed on the second main surface of the resin member and connected to the first input / output terminal and the second input / output terminal of the RFIC; A second wiring pattern formed on the first main surface of the resin member; A first metal body connecting the first wiring pattern and the second wiring pattern; A second metal body connecting the first wiring pattern and the second wiring pattern; You may have.
  • a portion having a relatively large height in the antenna coil can be formed by the first metal body and the second metal body, so that the electrical reliability of the antenna coil can be improved.
  • the first metal body and the second metal body may be columnar metal pins.
  • This configuration eliminates the need to route complicated wiring on the multilayer board. Further, by using a metal pin as the metal body, the direct current resistance of the first metal body and the second metal body can be reduced, and the electrical characteristics can be improved.
  • the magnetic circuit board is disposed away from the antenna coil,
  • the mounting surface of the magnetic circuit board on which the first input / output terminal and the second input / output terminal of the RFIC element are mounted is disposed so as to face the second main surface of the resin member,
  • the first input / output terminal of the RFIC element is connected to the first wiring pattern via a first conductor extending from the connection terminal of the magnetic circuit board toward the second main surface of the resin member,
  • the second input / output terminal of the RFIC element is connected to the first wiring pattern via a second conductor extending from the connection terminal of the magnetic circuit board toward the second main surface of the resin member. Also good.
  • the second surface of the magnetic circuit board on which the RFIC element is mounted is disposed so as to face the second main surface of the resin member, it is difficult to hinder the formation of the magnetic field of the antenna coil.
  • the second surface of the magnetic circuit board is arranged away from the antenna coil, the RFIC element is unlikely to interfere with the magnetic flux that passes near the antenna coil.
  • the magnetic circuit board has a first surface facing the first main surface of the resin member, and a second surface facing the second main surface of the resin member,
  • the RFIC element may be mounted on the second surface of the magnetic circuit board.
  • the magnetic circuit board has a first surface and a second surface facing the first surface, The second surface of the magnetic circuit board forms at least a part of the second main surface of the resin member;
  • the RFIC element is mounted on the first surface of the magnetic circuit board, The first input / output terminal of the RFIC element is connected to the first wiring pattern via a third conductor extending from the connection terminal of the magnetic circuit board toward the second main surface of the resin member, The second input / output terminal of the RFIC element is connected to the first wiring pattern via a fourth conductor extending from the connection terminal of the magnetic circuit board toward the second main surface of the resin member,
  • the third conductor and the fourth conductor may be provided inside the magnetic circuit board.
  • the magnetic circuit board can be disposed on the second main surface of the resin member, so that the height of the antenna coil can be increased while improving the L value of the antenna coil and the antenna performance. Can be small. Thereby, further miniaturization of the wireless IC device can be realized.
  • the first metal body is connected to a first connection terminal on the magnetic circuit board, and is connected to the first wiring pattern via a first connection conductor provided in the magnetic circuit board,
  • the second metal body may be connected to a second connection terminal on the magnetic circuit board and connected to the first wiring pattern via a second connection conductor provided in the magnetic circuit board.
  • the L value of the antenna coil and the antenna performance can be further improved.
  • a predetermined inductance can be obtained even if the height of the antenna coil is lowered, so that the device can be further downsized.
  • the magnetic circuit board is: A magnetic base layer in which the polycrystalline phase occupies almost the whole; A magnetic auxiliary layer that is disposed on at least one surface of the magnetic base layer and the polycrystalline phase occupies substantially the whole; and Including The polycrystalline phase in the magnetic substrate layer and the polycrystalline phase in the magnetic auxiliary layer have substantially the same crystal structure, The linear expansion coefficient of the magnetic auxiliary layer may be smaller than the linear expansion coefficient of the magnetic base material layer.
  • Each of the first wiring pattern and the second wiring pattern has a plurality of wiring patterns
  • Each of the first metal body and the second metal body has a plurality of metal bodies
  • the antenna coil may be formed in a helical shape having a plurality of loops formed by the first wiring pattern, the second wiring pattern, the first metal body, and the second metal body.
  • an antenna coil having a large number of turns can be easily configured without increasing the size of the wireless IC device.
  • the first metal body and the second metal body each have three or more metal pins,
  • the first metal body and the second metal body may be arranged in the Y-axis direction and arranged in a staggered manner as viewed in the Z-axis direction.
  • the size of the wireless IC device in the Y-axis direction can be reduced even when the number of turns of the coil is increased.
  • the antenna coil includes a plurality of loops having different inner and outer diameters when viewed from the Y-axis direction,
  • the loop located on the opening surface of the antenna coil may be a loop having the largest inner / outer diameter among the plurality of loops.
  • the resin molding of one aspect of the present invention is A resin molded body equipped with a wireless IC device,
  • the wireless IC device is: A resin member having a first main surface and a second main surface facing the first main surface; A magnetic circuit board having a wiring conductor pattern; An RFIC element mounted on the wiring conductor pattern of the magnetic circuit board and having a first input / output terminal and a second input / output terminal; An antenna coil having one end connected to the first input / output terminal and the other end connected to the second input / output terminal; With At least a part of the magnetic circuit board may be disposed inside the antenna coil as a magnetic core of the antenna coil.
  • the antenna coil is A first wiring pattern formed on the second main surface of the resin member and connected to the first input / output terminal and the second input / output terminal of the RFIC; A second wiring pattern formed on the first main surface of the resin member; A first metal body connecting the first wiring pattern and the second wiring pattern; A second metal body connecting the first wiring pattern and the second wiring pattern; You may have.
  • a portion having a relatively large height in the antenna coil can be formed by the first metal body and the second metal body, so that the electrical reliability of the antenna coil can be improved.
  • a communication terminal device includes: A communication terminal device including a wireless IC device,
  • the wireless IC device is: A resin member having a first main surface and a second main surface facing the first main surface; A magnetic circuit board having a wiring conductor pattern; An RFIC element mounted on the wiring conductor pattern of the magnetic circuit board and having a first input / output terminal and a second input / output terminal; An antenna coil having one end connected to the first input / output terminal and the other end connected to the second input / output terminal; With At least a part of the magnetic circuit board may be disposed inside the antenna coil as a magnetic core of the antenna coil.
  • the antenna coil is A first wiring pattern formed on the second main surface of the resin member and connected to the first input / output terminal and the second input / output terminal of the RFIC; A second wiring pattern formed on the first main surface of the resin member; A first metal body connecting the first wiring pattern and the second wiring pattern; A second metal body connecting the first wiring pattern and the second wiring pattern; You may have.
  • a portion having a relatively large height in the antenna coil can be formed by the first metal body and the second metal body, so that the electrical reliability of the antenna coil can be improved.
  • a method for manufacturing a wireless IC device of one embodiment of the present invention includes: Disposing a magnetic circuit board in which an RFIC element having a first input / output terminal and a second input / output terminal is mounted on a wiring conductor pattern on an adhesive layer provided on a pedestal; A step of placing the first metal body and the second metal body upright on the adhesive layer; A step of coating the magnetic circuit board, the first metal body, and the second metal body, which are disposed on the adhesive layer, with a resin member; Forming a second wiring pattern to which the first metal body and the second metal body are connected to the first main surface of the resin member; The base provided with the adhesive layer is removed to connect the first metal body and the second metal body, while connecting the first input / output terminal of the RFIC element and the first metal body, and the RFIC Forming a first wiring pattern connecting a second input / output terminal of an element and the second metal body on a second main surface of the resin member; May be included.
  • the wireless IC device can save space and can be miniaturized with a simple configuration.
  • the metal body can be firmly fixed by using the pedestal having the adhesive layer, the wireless IC device can be manufactured by using the metal body having a small width as a part of the antenna coil. Therefore, a wireless IC device including an antenna coil having a high inductance and a large number of turns of the antenna coil can be manufactured.
  • FIG. 1 is a perspective view of wireless IC device 101 according to the first embodiment of the present invention.
  • the X-axis direction indicates the width direction of the wireless IC device 101
  • the Y-axis direction indicates the thickness direction of the wireless IC device 101
  • the Z-axis direction indicates the wireless IC device.
  • the height direction of 101 is shown.
  • FIG. 2 is a plan view of the wireless IC device 101.
  • FIG. 3 is a bottom view of the wireless IC device.
  • FIG. 4 is a schematic configuration diagram of the wireless IC device 101.
  • the wireless IC device 101 includes a resin member 70, a magnetic circuit board 1 embedded in the resin member 70, an RFIC element 61 mounted on the magnetic circuit board 1, and a resin member 70.
  • An antenna coil provided.
  • the antenna coil includes first wiring patterns 20A, 20B, 20C, 20D, 20E, 20F, 20G, first metal bodies 30A, 30B, 30C, 30D, 30E, 30F, and second wiring patterns 50A, 50B, 50C, 50D, 50E, 50F and the second metal bodies 40A, 40B, 40C, 40D, 40E, 40F.
  • the resin member 70 protects the magnetic circuit board 1, the RFIC element 61, the antenna coil, and the like. As shown in FIG. 1, the resin member 70 has a rectangular parallelepiped shape. Specifically, the resin member 70 includes a first main surface VS1, a second main surface VS2 facing the first main surface VS1, and a first side surface connected to the first main surface VS1 and the second main surface VS. VS3, and 2nd side surface VS4 connected with 1st main surface VS1 and 2nd main surface VS.
  • the resin member 70 is made of, for example, an epoxy resin.
  • second wiring patterns 50A, 50B, 50C, 50D, 50E, and 50F extending in the X-axis direction are formed on the first main surface VS1 of the resin member 70.
  • first wiring patterns 20 ⁇ / b> A, 20 ⁇ / b> B, 20 ⁇ / b> C, 20 ⁇ / b> D, 20 ⁇ / b> E, 20 ⁇ / b> F, 20 ⁇ / b> G extending in the X-axis direction are formed on the second main surface VS ⁇ b> 2 of the resin member 70.
  • first metal bodies 30A, 30B, 30C, 30D, 30E, and 30F extending in the Z-axis direction are embedded.
  • second metal bodies 40A, 40B, 40C, 40D, 40E, and 40F extending in the Z-axis direction are embedded.
  • the antenna coil is formed in a six-turn rectangular helical shape by the first wiring patterns 20A to 20G, the first metal bodies 30A to 30F, the second wiring patterns 50A to 50F, and the second metal bodies 40A to 40F. ing.
  • the first wiring patterns 20A to 20G extend in the X-axis direction on the second main surface VS2 of the resin member 70, and the second wiring patterns 50A to 50F are the first main surface of the resin member 70. It extends in the X-axis direction on VS1.
  • the meaning of “extending in the X-axis direction” does not limit that each of the first wiring patterns 20A to 20G is parallel and each of the second wiring patterns 50A to 50F is parallel.
  • the meaning of “extending in the X-axis direction” does not limit that the first wiring patterns 20A to 20G and the second wiring patterns 50A to 50F are parallel.
  • “Extending in the X-axis direction” means, for example, that the extending directions of the first wiring patterns 20A to 20G and the second wiring patterns 50A to 50F are substantially directed in the X-axis direction, that is, substantially extend in the X-axis direction. Including.
  • the first metal bodies 30A to 30F are arranged in the Y-axis direction in the vicinity of the first side surface VS3 of the resin member 70 and extend in the Z-axis direction.
  • the second metal bodies 40A to 40F are arranged in the Y-axis direction in the vicinity of the second side surface VS4 of the resin member 70 and extend in the Z-axis direction.
  • the first metal bodies 30A to 30F and the second metal bodies 40A to 40F are parallel to each other.
  • the first metal bodies 30A to 30F and the second metal bodies 40A to 40F are all, for example, cylindrical metal pins made of Cu.
  • the first metal bodies 30A to 30F and the second metal bodies 40A to 40F are obtained, for example, by cutting a Cu wire having a circular cross section in a predetermined length unit.
  • the cross-sectional shape of these metal pins does not necessarily need to be circular.
  • the aspect ratio (height / bottom diameter) of the metal pin is preferably 5 or more and 30 or less.
  • the first metal bodies 30A to 30F are arranged so as to extend in the normal direction, that is, the Z-axis direction with respect to the second main surface VS2 of the resin member 70, and The first main surface VS1 and the second main surface VS2 are reached.
  • the first ends of the first metal bodies 30A to 30F are connected to the first wiring patterns 20A to 20F.
  • the second ends of the first metal bodies 30A to 30F are connected to the second wiring patterns 50A to 50F.
  • the first end means the end on the second main surface VS2 side of the resin member 70 among the longitudinal ends of the first metal bodies 30A to 30F, and the second end means the first metal body 30A. It means the end on the first main surface VS1 side of the resin member 70 among the ends in the longitudinal direction of ⁇ 30F.
  • the first end of the first metal body 30A is connected to the first wiring pattern 20A.
  • the first end of the first metal body 30B is connected to the first wiring pattern 20B.
  • the first end of the first metal body 30C is connected to the first wiring pattern 20C.
  • the first end of the first metal body 30D is connected to the first wiring pattern 20D.
  • the first end of the first metal body 30E is connected to the first wiring pattern 20E.
  • the first end of the first metal body 30F is connected to the first wiring pattern 20F.
  • the second end of the first metal body 30A is connected to the second wiring pattern 50A.
  • the second end of the first metal body 30B is connected to the second wiring pattern 50B.
  • the second end of the first metal body 30C is connected to the second wiring pattern 50C.
  • the second end of the first metal body 30D is connected to the second wiring pattern 50D.
  • the second end of the first metal body 30E is connected to the second wiring pattern 50E.
  • the second end of the first metal body 30F is connected to the second wiring pattern 50F.
  • the second metal bodies 40A to 40F are arranged so as to extend in the normal direction, that is, the Z-axis direction with respect to the second main surface VS2 of the resin member 70, and The first main surface VS1 and the second main surface VS2 are reached.
  • the third ends of the second metal bodies 40A to 40F are connected to the first wiring patterns 20B to 20G.
  • the fourth ends of the second metal bodies 40A to 40F are connected to the second wiring patterns 50A to 50F.
  • the third end means the end on the second main surface VS2 side of the resin member 70 among the longitudinal ends of the second metal bodies 40A to 40F, and the fourth end means the second metal body 40A. It means the end of the resin member 70 on the first main surface VS1 side among the longitudinal ends of ⁇ 40F.
  • the third end of the second metal body 40A is connected to the first wiring pattern 20B.
  • the third end of the second metal body 40B is connected to the first wiring pattern 20C.
  • the third end of the second metal body 40C is connected to the first wiring pattern 20D.
  • the third end of the second metal body 40D is connected to the first wiring pattern 20E.
  • the third end of the second metal body 40E is connected to the first wiring pattern 20F.
  • the third end of the second metal body 40F is connected to the first wiring pattern 20G.
  • the fourth end of the second metal body 40A is connected to the second wiring pattern 50A.
  • the fourth end of the second metal body 40B is connected to the second wiring pattern 50B.
  • the fourth end of the second metal body 40C is connected to the second wiring pattern 50C.
  • the fourth end of the second metal body 40D is connected to the second wiring pattern 50D.
  • the fourth end of the second metal body 40E is connected to the second wiring pattern 50E.
  • the fourth end of the second metal body 40F is connected to the second wiring pattern 50F.
  • the antenna coil includes first wiring patterns 20A to 20G including a plurality of wiring patterns, second wiring patterns 50A to 50F including a plurality of wiring patterns, first metal bodies 30A to 30F including a plurality of metal pins, A plurality of loops are formed depending on the number of second metal bodies 40A to 40F including a plurality of metal pins.
  • the magnetic circuit board 1 is a magnetic circuit board having a wiring conductor pattern.
  • the magnetic circuit board 1 is made of a sintered ferrite substrate. As shown in FIG. 4, the magnetic circuit board 1 functions as a magnetic core for the antenna coil by being arranged inside the antenna coil, that is, within the coil winding range.
  • the magnetic circuit board 1 includes a first surface PS1 facing the first main surface VS1 side of the resin member 70, and a second surface PS2 facing the second main surface VS2 side of the resin member.
  • Wiring conductor patterns 10A and 10B are formed on the second surface PS2 of the magnetic circuit board 1, and an RFIC element 61, a chip capacitor 62, and the like are mounted thereon.
  • the second surface PS2 that is the mounting surface of the RFIC element 61 tends to hinder the magnetic field of the antenna coil. Therefore, the second surface PS2 of the magnetic circuit board 1 is disposed so as to face the second main surface VS2 of the resin member 70.
  • the second surface PS2 of the magnetic circuit board 1 is preferably arranged in parallel to the winding axis G1 direction of the antenna coil, that is, the Y-axis direction so as not to intersect the winding axis G1 of the antenna coil. More preferably, the second surface PS2 of the magnetic circuit board 1 is disposed so as to be parallel to the second main surface VS2 of the resin member 70.
  • the magnetic circuit board 1 on which the RFIC element 61 is mounted is disposed away from the antenna coil.
  • the magnetic circuit board 1 winds the second surface PS2 on which the RFIC element 61 is mounted more than the second main surface VS2 of the resin member 70. It is preferable to arrange it near the rotation axis G1. More preferably, the RFIC element 61 is mounted in order to reduce the influence on the magnetic field formation of the antenna coil and the thermal influence of the high temperature resin at the time of injection molding when the wireless IC device 101 is built in the resin molding.
  • the second surface PS ⁇ b> 2 is preferably arranged at the center of the wireless IC device 101.
  • the magnetic circuit board 1 is provided with a first conductor 11A and a second conductor 11B in order to electrically connect the RFIC element 61 mounted on the second surface PS2 and the first wiring patterns 20A and 20G. Yes.
  • the first conductor 11A and the second conductor 11B extend from the second surface PS2 of the magnetic circuit board 1 toward the second main surface VS2 of the resin member 70.
  • the resin member 70 extends from the second main surface VS2 in the first main surface VS1 direction, that is, in the Z-axis direction.
  • the first conductor 11A includes the first wiring pattern 20A formed on the second main surface VS2 of the resin member 70 and the wiring conductor pattern formed on the second surface PS2 of the magnetic circuit board 1. 10A.
  • the second conductor 11B connects the first wiring pattern 10G formed on the second main surface VS2 of the resin member 70 and the wiring conductor pattern 10B formed on the second surface PS2 of the magnetic circuit board 1. To do.
  • FIG. 5 is a bottom view of the magnetic circuit board 1, and is a view of the second surface PS2 of the magnetic circuit board 1.
  • FIG. 5 wiring conductor patterns 10 ⁇ / b> A and 10 ⁇ / b> B and NC terminals are formed on the second surface PS ⁇ b> 2 of the magnetic circuit board 1.
  • the wiring conductor patterns 10A and 10B and the NC terminal are patterned by, for example, etching of Cu foil.
  • the wiring conductor patterns 10 ⁇ / b> A and 10 ⁇ / b> B are provided with power supply terminals connected to the first input / output terminal and the second input / output terminal of the RFIC element 61.
  • the wiring conductor patterns 10A and 10B are electrically connected to one end and the other end of the antenna coil via the first conductor 11A and the second conductor 11B extending from the second main surface VS2 of the resin member 70 toward the first main surface VS1, respectively. Connected.
  • the wiring conductor patterns 10A and 10B are provided with connection terminals 12A and 12B for connecting the first conductor 11A and the second conductor 11B.
  • the wiring conductor patterns 10A and 10B are electrically connected to one end and the other end of the antenna coil via the first conductor 11A and the second conductor 11B extending from the second main surface VS2 to the first main surface VS1 of the resin member 70, respectively. Connected.
  • the first wiring pattern 20A of the antenna coil is connected in series to the wiring conductor pattern 10A, while the first wiring pattern 20G is connected in series to the wiring conductor pattern 10B.
  • one end of the first conductor 11A is connected to the first wiring pattern 20A formed on the second main surface VS2 of the resin member 70, and the other end of the first conductor 11A is connected to the magnetic circuit board 1. It is connected to the provided connection terminal 12A.
  • One end of the second conductor 11B is connected to the first wiring pattern 20G formed on the second main surface VS2 of the resin member 70, and the other end of the second conductor 11B is a connection terminal 12B provided on the magnetic circuit board 1. Connected to.
  • the first conductor 11A and the second conductor 11B are, for example, columnar metal pins.
  • the length in the longitudinal direction of the first conductor 11A and the second conductor 11B, that is, the length in the Z direction is longer than the thickness of the surface-mounted components such as the RFIC element 61 and the chip capacitor 62.
  • 11 A of 1st conductors and the 2nd conductor 11B should just be made from the material which has electroconductivity, for example, should just be made from metal materials, such as Cu.
  • the RFIC element 61 is a packaged RFIC chip (bare chip) having a first input / output terminal 61a and a second input / output terminal 61b.
  • the RFIC element 61 is mounted on the second surface PS2 side of the magnetic circuit board 1. More specifically, as shown in FIGS. 4 and 5, the first input / output terminal 61 a of the RFIC element 61 is a power supply terminal of the wiring conductor pattern 10 ⁇ / b> A formed on the second surface PS ⁇ b> 2 side of the magnetic circuit board 1. Connected to.
  • the second input / output terminal 61b is connected to the power supply terminal of the wiring conductor pattern 10B formed on the second surface PS2 side of the magnetic circuit board 1.
  • the RFIC element 61 is also connected to an NC terminal formed on the second surface PS2 side of the magnetic circuit board 1.
  • FIG. 6 is a circuit diagram of the wireless IC device 101.
  • An antenna coil ANT is connected to the RFIC element 61.
  • a chip capacitor 62 is connected in parallel to the antenna coil ANT, and chip capacitors 63 and 64 are connected in series.
  • the LC resonance circuit is configured by the antenna coil ANT, the chip capacitors 62, 63, 64, and the capacitance component of the RFIC element 61 itself.
  • the chip capacitors 62, 63, and 64 constitute a matching circuit for adjusting the frequency.
  • the capacitances of the chip capacitors 62, 63, and 64 are selected so that the resonance frequency of the LC resonance circuit is substantially equal to the communication frequency of the RFID system, for example, 13.56 MHz.
  • plating layers 80A and 80B are provided on the first wiring patterns 20A to 20G and the second wiring patterns 50A to 50F.
  • the plating layers 80A and 80B are formed of a plating film such as Cu.
  • the plating layers 80A and 80B increase the film thickness of the first wiring patterns 20A to 20G and the second wiring patterns 50A to 50F, and reduce the DC resistance component of the coil.
  • the wireless IC device 101 is provided with protective layers 90A and 90B for preventing oxidation on the plating layers 80A and 80B.
  • the protective layers 90A and 90B are formed of a protective resin film such as a solder resist film, for example.
  • the plating layers 80A and 80B and the protective layers 90A and 90B are omitted in order to simplify the description.
  • the “RFID element” may be an RFIC chip itself or an RFIC package in which a matching circuit or the like is integrated with the RFIC chip.
  • An “RFID tag” has an RFIC element and an antenna coil connected to the RFIC element, and uses non-contact information to read and write data in a built-in memory using radio waves (electromagnetic waves) or magnetic fields. Defined as medium. That is, the wireless IC device of this embodiment is configured as an RFID tag.
  • the RFIC element 61 includes, for example, an HF band high-frequency wireless IC chip for the HF band RFID system.
  • the wireless IC device 101 is provided, for example, on an article to be managed. By bringing the wireless IC device 101 attached to the article, that is, the RFID tag, close to the reader / writer device, the antenna coil of the wireless IC device 101 and the antenna coil of the RFID reader / writer device are magnetically coupled. Thereby, RFID communication is performed between the RFID tag and the reader / writer device.
  • FIG. 7 is a cross-sectional view of the wireless IC device of the first embodiment.
  • FIG. 8 is a cross-sectional view of the wireless IC device of the second embodiment.
  • the wireless IC device of the first embodiment and the wireless IC device of the second embodiment are different in the arrangement of the first metal bodies 30A to 30F and the second metal bodies 40A to 40F.
  • the plurality of first metal bodies 30A to 30F and the plurality of second metal bodies 40A to 40F are arranged in the Y-axis direction and are staggered when viewed in the Z-axis direction. (Zigzag alignment).
  • the rectangular helical antenna coil includes two types of loops having different inner and outer diameters. A loop including the first metal body 30A and the second metal body 40A, a loop including the first metal body 30C and the second metal body 40C, a loop including the first metal body 30D and the second metal body 40D, the first Each opening width of the loop including the metal body 30F and the second metal body 40F is Ww.
  • the opening width of each of the loop including the first metal body 30B and the second metal body 40B and the loop including the first metal body 30E and the second metal body 40E is Wn. And Wn ⁇ Ww.
  • the opening width of any loop is the same as W.
  • the loops at the two opening positions of the rectangular helical antenna coil that is, the loop including the first metal body 30A and the second metal body 40A, and the first metal body 30F and the second metal body 40F.
  • the inner and outer diameters of the loops including are larger loops of the two types of loops.
  • a loop including the second metal body 40A at the three end positions is referred to as a “first loop”.
  • a loop including the second metal body 40F is referred to as a “second loop”.
  • the inner and outer diameters of the first loop and the second loop are loops having a larger inner and outer diameter among the two types of loops.
  • Example 7 and 8 the broken line is a conceptual diagram of the magnetic flux in and out of the rectangular helical antenna coil.
  • the substantial inner and outer diameters of the loops at the two opening surface positions of the rectangular helical antenna coil are smaller than the opening width W of the loop. Further, the magnetic flux tends to leak from the gap between adjacent metal bodies.
  • the inner and outer diameters of the loops at the two opening positions of the rectangular helical antenna coil are the loops having a larger inner and outer diameter of the two types of loops.
  • the substantial coil opening through which the magnetic flux enters and exits is larger than that of the second embodiment. Further, the magnetic flux is difficult to leak from the gap between adjacent metal bodies.
  • the antenna coil can be magnetically coupled with a relatively wide positional relationship with respect to the communication partner antenna. That is, when forming a helical antenna coil having three or more turns, it is preferable to dispose the metal body so that the loop area on both ends in the Y-axis direction, which is the coil axis, becomes large.
  • the rectangular helical antenna coil may include three or more types of loops having different inner and outer diameters. Even in such a case, the inner and outer diameters of the loops at the two opening surface positions of the antenna coil may be loops having the largest inner and outer diameters among the plural types of loops.
  • FIGS. 9A to 9H are diagrams sequentially showing the manufacturing process of the wireless IC device 101.
  • FIG. 9A to 9H are diagrams sequentially showing the manufacturing process of the wireless IC device 101.
  • a magnetic circuit board 1 is prepared. Specifically, the wiring conductor patterns 10A and 10B are formed on the second surface PS2 of the magnetic circuit board 1. Further, on the second surface PS2 of the magnetic circuit board 1, a power supply terminal and NC terminal for mounting an RFIC element and the like, a land for mounting chip capacitors 62, 63 and 64, a first conductor 11A and a second conductor Connection terminals 12A and 12B for connecting the conductor 11B are formed. Further, a lead pattern or the like for connecting these power supply terminals, lands, and connection terminals 12A and 12B is formed on the second surface PS2 of the magnetic circuit board 1 (see FIG. 5).
  • the RFIC element 61, the chip capacitors 62, 63, 64, the first conductor 11A, and the second conductor 11B are respectively connected to the wiring conductor patterns 10A, 10B of the magnetic circuit board 1 through conductive bonding materials such as solder.
  • solder paste is printed on the wiring conductor patterns 10A and 10B on the second surface PS2 of the magnetic circuit board 1, and each component is mounted by a mounter, and then these components are soldered by a reflow process.
  • the RFIC element 61, the chip capacitors 62, 63, 64, the first conductor 11A, and the second conductor 11B are electrically connected to the magnetic circuit board 1 and structurally joined.
  • the magnetic circuit board 1 is, for example, a ferrite board.
  • the wiring conductor patterns 10A and 10B, the lands, and the connection terminals 12A are obtained by patterning a copper foil.
  • the magnetic circuit board 1 may be one in which a thick film pattern is formed on a ferrite substrate.
  • the cross-sectional dimensions of the wiring conductor patterns 10A and 10B are 18 ⁇ m ⁇ 100 ⁇ m. After performing these patterning, it is preferable to increase the total film thickness to 40 to 50 ⁇ m by plating with Cu or the like.
  • the RFIC element 61 is a packaged RFIC chip for an RFID tag.
  • the chip capacitors 62, 63, 64 are, for example, multilayer ceramic chip components.
  • the magnetic circuit board 1, the first metal bodies 30A to 30F, and the second metal bodies 40A to 40F are arranged on the adhesive layer 2 of the base 3 having the adhesive layer 2, respectively.
  • the magnetic circuit board 1 is disposed on the pedestal 3 with the first conductor 11A and the second conductor 11B standing on the adhesive layer 2 with the second surface PS2 side being the adhesive layer 2 side.
  • the first metal bodies 30A to 30F and the second metal bodies 40A to 40F are arranged on the pedestal 3 with the first end side and the third end side, which are one end sides, respectively, facing the adhesive layer 2 side.
  • the magnetic circuit board 1, the first metal bodies 30A to 30F, and the second metal bodies 40A to 40F are mounted in a state of being firmly fixed to the base 3.
  • the magnetic circuit board 1 may be fixed to the adhesive layer 2 by a support member made of the same material as the resin member 70, for example.
  • the adhesive layer 2 is, for example, an adhesive resin.
  • the first metal bodies 30A to 30F and the second metal bodies 40A to 40F are Cu metal pins, respectively.
  • these metal pins have a cylindrical shape with a diameter of about 0.3 mm and a length of about 7 mm, for example.
  • the metal pins are not limited to those containing Cu as the main component, but those containing Cu as the main component are preferable in terms of conductivity and workability.
  • the resin member 70 is formed to the height of the first metal bodies 30A to 30F and the second metal bodies 40A to 40F. Specifically, an epoxy resin or the like is applied to a predetermined height.
  • the predetermined height is at least the height of the first metal bodies 30A to 30F and the second metal bodies 40A to 40F.
  • the first metal bodies 30A to 30F and the second metal bodies 40A to 40F are coated with the resin member 70.
  • the first main surface VS1 of the resin member 70 is planarly polished, whereby the second ends of the first metal bodies 30A to 30F and the second metal bodies 40A to 40F. The fourth end of is exposed.
  • the resin member 70 may be provided by applying a liquid resin, or may be provided by stacking semi-cured sheet-like resins.
  • the second ends of the first metal bodies 30A to 30F and the fourth ends of the second metal bodies 40A to 40F are exposed to the first main surface VS1 of the resin member 70.
  • Wiring patterns 50A to 50F are formed (see FIG. 3). Specifically, the second wiring patterns 50A to 50F are formed on the first main surface VS1 of the resin member 70 by screen printing a conductive paste. Thereby, the second wiring patterns 50A to 50F are connected to the second ends of the first metal bodies 30A to 30F and the fourth ends of the second metal bodies 40A to 40F.
  • the base 3 having the adhesive layer 2 is removed from the resin member 70, and the first ends of the first metal bodies 30A to 30F are formed on the second main surface VS2 of the resin member 70, and The third ends of the two metal bodies 40A to 40F and the one ends of the first conductor 11A and the second conductor 11B are exposed.
  • the pedestal 3 is removed from the resin member 70, and the adhesive layer 2 and the resin member 70 are polished planarly, whereby the first end of the first metal bodies 30A to 30F and the second metal body The third ends 40A to 40F and the one ends of the first conductor 11A and the second conductor 11B are exposed to the second main surface VS2 of the resin member 70.
  • the first end of the first metal bodies 30A to 30F and the second main surface VS2 of the resin member 70 where the third ends of the second metal bodies 40A to 40F are exposed are Wiring patterns 20A to 20G are formed (see FIG. 2).
  • the first wiring patterns 20A to 20G are formed on the second main surface VS2 of the resin member 70 by screen printing a conductive paste.
  • the first wiring patterns 20A to 20G are connected to the first ends of the first metal bodies 30A to 30F and the third ends of the second metal bodies 40A to 40F.
  • the first wiring patterns 20A and 20G are connected to one ends of the first conductor 11A and the second conductor 11B, respectively.
  • the first wiring patterns 20A to 20G and the second wiring patterns 50A to 50F are formed by forming a conductor film such as a Cu film on the second main surface VS2 and the first main surface VS1 of the resin member 70 by a plating method or the like, respectively. This may be formed by patterning by forming a photoresist film and etching.
  • plating layers 80A and 80B are formed on the first wiring patterns 20A to 20G and the second wiring patterns 50A to 50F. Further, the protective layers 90A and 90B are formed on the plating layers 80A and 80B on the formation surfaces of the first wiring patterns 20A to 20G and the second wiring patterns 50A to 50F.
  • the plating layer is formed by plating with Cu or the like.
  • an Au plating film may be further formed on the surface of a plating film such as Cu.
  • the element body at this stage is one in which the first wiring patterns 20A to 20G and the second wiring patterns 50A to 50F are exposed on the outer surface. Therefore, the thickness of the first wiring patterns 20A to 20G and the second wiring patterns 50A to 50F can be selectively increased by immersing this element body in the plating solution. For example, in the wireless IC device 101, the thickness of the first wiring patterns 20A to 20G can be increased as compared with the thickness of the wiring conductor patterns 10A and 10B.
  • the protective layers 90A and 90B are protective resin films for preventing oxidation, such as solder resist films.
  • the wireless IC device 101 according to Embodiment 1 can provide the following effects.
  • the wireless IC device 101 According to the wireless IC device 101 according to the first embodiment, space can be saved by mounting the RFIC element 61 and the like on the magnetic circuit board 1. In addition, since the antenna coil is not mounted on the magnetic circuit board 1, the size of the wireless IC device 101 can be reduced with a simple configuration.
  • the magnetic circuit board 1 functions as a magnetic core of the antenna coil, the L value of the antenna coil and the antenna performance can be improved. For this reason, in the wireless IC device 101, an antenna coil having a predetermined inductance value can be obtained without increasing the size of the antenna coil. In the wireless IC device 101, a predetermined inductance can be obtained even if the height of the antenna coil is lowered.
  • the magnetic field coupling with the communication partner antenna can be enhanced by the magnetic flux collecting effect of the magnetic circuit board 1.
  • the RFIC element 61 is mounted on the magnetic circuit board 1, it is possible to suppress hindrance to the formation of the magnetic field of the antenna coil by the RFIC element. For example, it is possible to suppress noise due to input / output of a digital signal of the RFIC element 61 from interfering with the magnetic field formation of the antenna coil. Further, interference with the RFIC element 61 due to the magnetic field of the antenna coil can be reduced.
  • the magnetic circuit board 1 is embedded in the resin member 70 apart from the antenna coil. For this reason, a space is provided between the magnetic circuit board 1 and the resin member 70 on the second surface PS2 side of the magnetic circuit board 1. According to the wireless IC device 101, this space can be used effectively, and for example, a mounting component such as an RFIC element 61 or a capacitor can be mounted on the second surface PS2 side of the magnetic circuit board 1. For this reason, miniaturization of the wireless IC device 101 can be realized. In addition, mounting components can be mounted on both the first surface PS1 and the second surface PS2 of the magnetic circuit board 1.
  • the RFIC element 61 is unlikely to interfere with the magnetic flux passing near the antenna coil.
  • the second surface PS2 which is the mounting surface of the RFIC element 61, is disposed closer to the winding axis G1 than the second main surface VS2 of the resin member 70 when viewed from the direction of the winding axis G1 of the antenna coil. Further, the interference of the magnetic field of the antenna coil by the RFIC element 61 can be further reduced.
  • a part of the antenna coil can be formed by a metal pin in a portion having a relatively large height dimension.
  • a plurality of base material layers having interlayer connection conductors are stacked to have a height.
  • the number of connection portions can be reduced. Therefore, according to the wireless IC device 101, the electrical characteristics of the antenna coil can be improved.
  • the wireless IC device 101 it is not necessary to form a coil on the multilayer substrate, and it is not necessary to route complicated wiring. Therefore, the wireless IC device 101 has a relatively large height dimension, and can easily realize a coil structure with a high degree of freedom in designing the coil opening size. In addition, since the resistance of the antenna coil can be reduced, a wireless IC device that is highly sensitive and can be reduced in size can be obtained.
  • the first metal bodies 30A to 30F and the second metal bodies 40A to 40F are composed of columnar metal pins.
  • the direct current resistance component of the metal pin itself can be made sufficiently smaller than the DCR of a conductor film such as a sintered metal body by firing of a conductive paste or a thin film metal body by etching of a conductive thin film. Therefore, the wireless IC device 101 having an antenna coil having a high Q value, that is, a low loss can be provided.
  • the first wiring patterns 20A to 20G and the second wiring patterns 50A to 50F extending in the X-axis direction are made thicker by forming a plating film of Cu or the like.
  • the DC resistance component can be further reduced.
  • capacitors 62, 63 and 64 connected to the RFIC element 61 are provided, a circuit for matching the RFIC element and the antenna coil or setting a resonance frequency can be easily configured, and an external circuit can be eliminated or simplified. be able to.
  • the entire wireless IC device 101 is protected. Is robust.
  • the solder connection portion of the surface mount chip component is protected against a high temperature resin that flows during injection molding.
  • the resin flowing at the time of injection molding for example, instantaneously becomes a high temperature of 300 ° C. or more, but the RFIC element itself is embedded in the resin member 70, and the RFIC element and the magnetic circuit board 1 Since the joining portion is also embedded in the resin member, the reliability of the RFIC element and further the wireless IC device is not impaired.
  • the RFIC element 61 is not exposed to the outside of the wireless IC device 101, the protection function of the RFIC element 61 is enhanced, and an increase in size caused by mounting the RFIC element 61 outside can be avoided. Further, the reliability of the connection portion of the RFIC element 61 to the magnetic circuit board 1 is increased. As a result, it is possible to realize a highly heat-resistant wireless IC device that can be incorporated in a resin molded product such as plastic, that is, can withstand high temperatures during injection molding. Particularly, in the wireless IC device 101 according to the first embodiment, the magnetic circuit board 1 on which the RFIC element 61 is mounted is separated from the surface of the resin member 70. For this reason, when a resin molded product such as plastic containing the wireless IC device 101 is manufactured by injection molding, the heat of the resin at the time of injection molding is difficult to be transmitted to the magnetic circuit board 1. Risk can be reduced.
  • the magnetic circuit board 1 can be protected by embedding the magnetic circuit board 1 in the resin member 70.
  • the high-temperature injection molding resin does not directly contact the magnetic circuit board 1.
  • the wireless IC device 101 is excellent in heat resistance.
  • first wiring patterns 20A to 20G and the second wiring patterns 50A to 50F may be screen-printed or patterned on the surface of the resin member 70, the formation thereof is easy. Further, the first wiring patterns 20A to 20G can be easily connected to the first metal bodies 30A to 30F and the second metal bodies 40A to 40F, and the first wiring bodies 50A to 50F to the first metal bodies 30A to 30F and the first metal bodies 30A to 30F can be easily connected. Connection to the two metal bodies 40A to 40F is easy. Furthermore, the connection between the first conductor 11A and the second conductor 11B of the magnetic circuit board 1 and the first wiring patterns 20A and 20G can be facilitated.
  • the RFIC element 61 is connected to the antenna coil via the wiring conductor patterns 10A and 10B, the first conductor 11A, and the second conductor 11B formed on the second surface PS2 of the magnetic circuit board 1. Therefore, it becomes easy to form a bridge pattern.
  • the RFIC element 61 may be directly connected to the first conductor 11A and the second conductor 11B.
  • the RFIC element 61 is connected to the first conductor 11A and the second conductor 11B via the wiring conductor patterns 10A and 10B for routing, so that the RFIC element 61 can be placed at an arbitrary position on the second surface PS2 of the magnetic circuit board 1.
  • the first conductor 11A and the second conductor 11B can be formed.
  • the RFIC element 61 may be directly connected to the first conductor 11A and the second conductor 11B.
  • the substantial opening diameter of the antenna coil is large, communication can be performed in a relatively wide positional relationship with the antenna of the communication partner.
  • the first metal bodies 30A to 30F and the second metal bodies 40A to 40F are arranged in a staggered manner in the arrangement direction at least at the ends in the coil axis direction, thereby increasing the number of metal bodies and increasing the number of turns.
  • the size of the wireless IC device 101 can be reduced.
  • the following effects can be obtained.
  • the method of manufacturing the wireless IC device 101 according to the first embodiment it is possible to save space, reduce the size with a simple configuration, and have excellent electrical characteristics such as a large coil opening area and a low DC resistance.
  • the wireless IC device 101 having high robustness and high heat resistance can be easily manufactured.
  • the first metal bodies 30A to 30F and the second metal bodies 40A to 40F can be firmly fixed by using the pedestal 3 having the adhesive layer 2, so that it is smaller.
  • a width metal body can be used for the antenna coil. Therefore, an antenna coil having a large inductance and a high inductance can be manufactured.
  • the coil opening area can be further increased by using a metal body having a relatively large height and a small width.
  • the first metal bodies 30A to 30F and the second metal bodies 40A to 40F have columnar side portions that are the first side surface VS3 and the second side surface VS4 of the resin member 70.
  • the present invention is not limited to this configuration.
  • the side portions of the first metal bodies 30A to 30F and the second metal bodies 40A to 40F may be partially exposed from the first side surface VS3 and the second side surface VS4 of the resin member 70.
  • first metal bodies 30A to 30F and the second metal bodies 40A to 40F in the first embodiment have been described by taking cylindrical Cu pins as an example, they are not limited thereto.
  • a stud-shaped balance or the like may be used.
  • the first metal bodies 30A to 30F and the second metal bodies 40A to 40F according to the first embodiment will be described with respect to a configuration in which the first metal bodies 30A to 30F and the second metal bodies 40A to 40F are respectively arranged in the Y-axis direction and arranged in a zigzag pattern as viewed in the Z-axis direction.
  • the first metal bodies 30A to 30F and the second metal bodies 40A to 40F may be arranged in a line.
  • the magnetic circuit board 1 has been described as being disposed closer to the winding axis G1 than the second main surface VS2 of the resin member 70 when viewed from the direction of the winding axis G1 of the antenna coil. It is not limited to this.
  • at least a part of the magnetic circuit board 1 may be positioned inside the antenna coil and function as a magnetic core.
  • the magnetic field directivity of the antenna coil can be changed using the magnetic flux collecting effect of the magnetic core.
  • the magnetic circuit board 1 may be disposed close to the first main surface VS1.
  • the RFIC element 61 in the first embodiment the RFIC chip packaged has been described, but the present invention is not limited to this.
  • the RFIC element 61 may be a bare chip RFIC.
  • the RFIC has an Au electrode terminal and is connected to a power supply terminal on which the Au plating film of the magnetic circuit board 1 is printed by ultrasonic bonding.
  • the wireless IC device 101 In the wireless IC device 101 according to the first embodiment, the example in which the matching circuit is configured using the three capacitors of the chip capacitors 62, 63, and 64 has been described. However, the present invention is not limited to this. In the wireless IC device 101, it is only necessary that at least one capacitor is connected in parallel to the antenna coil as a capacitor for setting the resonance frequency.
  • the resin member 70 according to Embodiment 1 may be configured to include magnetic powder such as ferrite powder. According to this configuration, since the resin member 70 has magnetism, the overall size required to obtain an antenna coil having a predetermined inductance can be reduced. Further, when the resin member 70 has magnetism, the side portions of the first metal bodies 30A to 30F and the second metal bodies 40A to 40F may be exposed from the side surface of the resin member 70. With such a configuration, the magnetic field spreads to the surface of the resin member 70 from which the first metal bodies 30A to 30F and the second metal bodies 40A to 40F are exposed, and communication in these directions is also possible.
  • magnetic powder such as ferrite powder
  • the RFIC element 61 and the capacitors 62, 63, and 64 have been described as being mounted on the second surface PS2 side of the magnetic circuit board 1, but the present invention is not limited to this.
  • the magnetic circuit board 1 may be mounted with a mounting component on the first surface PS1, or may be mounted on both the first surface PS1 and the second surface PS2.
  • the present invention is not limited to this.
  • the first conductor 11 ⁇ / b> A and the second conductor 11 ⁇ / b> B may be a balance on a stud formed on the magnetic circuit board 1, or created by growing plating when forming the plating layer 80. It may be a thing.
  • the magnetic circuit board 1 in the first embodiment has been described by taking a sintered ferrite substrate as an example, but is not limited thereto.
  • the magnetic circuit board 1 may be a circuit board having a magnetic material, and may be made of a magnetic material.
  • the first metal bodies 30A to 30F and the second metal bodies 40A to 40F forming part of the antenna coil are metal pins
  • the present invention is not limited to this.
  • the first metal bodies 30A to 30F and the second metal bodies 40A to 40F may be metal bodies that are metalized by filling a plurality of through holes provided in the resin member 70 with a conductive paste.
  • the first metal bodies 30A to 30F and the second metal bodies 40A to 40F may be metal bodies (through-hole plating) in which plating films are formed in a plurality of through holes provided in the resin member 70.
  • first metal bodies 30A to 30F and the second metal bodies 40A to 40F can be formed by patterning a metal film obtained by printing a conductive paste on the side surface of the resin member 70 or a metal film formed on the side surface of the resin member 70. The metal body formed by doing may be sufficient.
  • FIG. 10 shows a schematic configuration of the wireless IC device 102 according to the second embodiment.
  • FIG. 11 is a bottom view of the wireless IC device 102 according to the second embodiment.
  • differences from the first embodiment will be mainly described.
  • the same or equivalent components as those in the first embodiment will be described with the same reference numerals.
  • descriptions overlapping with those in the first embodiment are omitted.
  • the wireless IC device 102 has the magnetic circuit board 1 disposed on the second main surface VS ⁇ b> 2 of the resin member 70 as compared with the wireless IC device 101 according to the first embodiment. Is different.
  • the second surface PS2 of the magnetic circuit board 1 forms part of the second main surface VS of the resin member 70, and the third conductor 11C and the fourth conductor 4C. The difference is that the conductor 11D is provided inside the magnetic circuit board 1.
  • the magnetic circuit board 1 of the wireless IC device 102 is disposed on the second main surface VS2 of the resin member 70, and the second surface PS2 of the magnetic circuit board 1 is a part of the second main surface VS2 of the resin member 70. Is forming. As shown in FIG. 11, on the second surface PS2 of the magnetic circuit board 1, a part of the first wiring patterns 20A to 20G is formed.
  • the first surface PS1 of the magnetic circuit board 1 On the first surface PS1 of the magnetic circuit board 1, wiring conductor patterns 10A and 10B, power supply terminals, NC terminals, connection terminals, and the like are formed, and an RFIC element 61, a capacitor 62, and the like are mounted.
  • the first surface PS1 When viewed from the winding axis G1 direction of the antenna coil, that is, the Y-axis direction, the first surface PS1 is disposed closer to the winding axis than the second surface PS2. That is, in the wireless IC device 102, the mounting surface of the RFIC element 61 on the first surface PS1 located closer to the winding axis G1 than the second surface PS2 when viewed from the winding axis G1 direction of the antenna coil. Is forming.
  • a third conductor 11C and a fourth conductor 11D are provided inside the magnetic circuit board 1.
  • the third conductor 11C electrically connects the wiring conductor pattern 10A formed on the first surface PS1 and the first wiring pattern 20A formed on the second surface PS2.
  • the fourth conductor 11D electrically connects the wiring conductor pattern 10B formed on the first surface PS1 and the first wiring pattern 20G formed on the second surface PS2.
  • the third conductor 11C and the fourth conductor 11D are via conductors made by firing an Ag-based conductive paste.
  • the third conductor 11C and the fourth conductor 11D are connected to the first input / output terminal 61a and the second input / output terminal 61b of the RFIC element 61 by being connected to the wiring conductor patterns 10A and 10B via the connection terminals. .
  • FIGS. 12A to 12J are diagrams sequentially illustrating the manufacturing process of the wireless IC device 101.
  • FIG. 12A to 12J are diagrams sequentially illustrating the manufacturing process of the wireless IC device 101.
  • conductor holes 111A and 111B for forming the third conductor 11C and the fourth conductor 11D in the unfired magnetic material 110 are formed.
  • the magnetic material 110 is, for example, a ferrite sheet.
  • the conductor holes 111A and 111B are filled with an Ag-based conductive paste. Further, an Ag-based conductive paste for forming the wiring conductor patterns 10A and 10B is printed on the first surface PS1 of the magnetic material 110. Thereafter, the magnetic material 110 is fired at a temperature of 800 to 1000 ° C. After firing, a magnetic circuit board 1 having wiring conductor patterns 10A and 10B formed on the first surface PS1 and third conductors 11C and fourth conductors 11D provided therein is obtained through a temperature lowering process. It is done.
  • the surface mounted components such as the RFIC element 61 and the capacitor 62 are mounted on the wiring conductor patterns 10A and 10B formed on the first surface PS1 side of the magnetic circuit board 1 through the conductive bonding material. Is done.
  • the conductive bonding material for example, Sn—Ag solder is used. Each component is mounted by a mounter and then soldered by a reflow process.
  • the RFIC element 61 is a packaged RFIC chip for an RFID tag.
  • the chip capacitors 62, 63, 64 are, for example, multilayer ceramic chip components.
  • the magnetic circuit board 1, the first metal bodies 30A to 30F, and the second metal bodies 40A to 40F are arranged on the adhesive layer 2 of the base 3 having the adhesive layer 2, respectively.
  • the magnetic circuit board 1 is disposed on the pedestal 3 with the second surface PS2 side facing the adhesive layer 2 side.
  • the first metal bodies 30A to 30F and the second metal bodies 40A to 40F are mounted on the pedestal 3 with the first end side and the third end side, which are one end sides, facing the adhesive layer 2, respectively.
  • the magnetic circuit board 1, the first metal bodies 30A to 30F, and the second metal bodies 40A to 40F are arranged in a state of being firmly fixed to the base 3.
  • the magnetic circuit board 1 may be fixed to the adhesive layer 2 by a support member made of the same material as the resin member 70, for example.
  • the resin member 70 is formed to the height of the first metal bodies 30A to 30F and the second metal bodies 40A to 40F. Specifically, an epoxy resin or the like is applied to a predetermined height.
  • the predetermined height is at least the height of the first metal bodies 30A to 30F and the second metal bodies 40A to 40F.
  • the first metal bodies 30A to 30F and the second metal bodies 40A to 40F are coated with the resin member 70.
  • the first main surface VS1 of the resin member 70 is planarly polished, whereby the second end, which is the other end side of the first metal bodies 30A to 30F, and the second end The fourth end which is the other end side of the metal bodies 40A to 40F is exposed.
  • the second end of the first metal bodies 30A to 30F and the second main body VS1 of the resin member 70 where the fourth ends of the second metal bodies 40A to 40F are exposed are Wiring patterns 50A to 50F are formed (see FIG. 3).
  • the second wiring patterns 50A to 50F are formed on the first main surface VS1 of the resin member 70 by screen printing a conductive paste.
  • the second wiring patterns 50A to 50F are connected to the second ends of the first metal bodies 30A to 30F and the fourth ends of the second metal bodies 40A to 40F.
  • the pedestal 3 having the adhesive layer 2 is removed from the resin member 70, and the first ends of the first metal bodies 30A to 30F are formed on the second main surface VS2 of the resin member 70.
  • the third ends of the two metal bodies 40A to 40F and the one ends of the third conductor 11C and the fourth conductor 11D are exposed.
  • the pedestal 3 is removed from the resin member 70, and the adhesive layer 2, the resin member 70, and the magnetic circuit board 1 are planarly polished, so that the first ends of the first metal bodies 30A to 30F
  • the third ends of the second metal bodies 40A to 40F and the one ends of the third conductor 11C and the fourth conductor 11D are exposed to the second main surface VS2 of the resin member 70.
  • First wiring patterns 20A to 20G are formed on the second main surface VS2 of 70 and the second surface PS2 of the magnetic circuit board 1 (see FIG. 11). Specifically, the first wiring patterns 20A to 20G are formed by screen-printing a conductive paste on the second main surface VS2 of the resin member 70 and the second surface PS2 of the magnetic circuit board 1. Thereby, the first wiring patterns 20A to 20G are connected to the first ends of the first metal bodies 30A to 30F and the third ends of the second metal bodies 40A to 40F. The first wiring patterns 20A and 20G are connected to one ends of the third conductor 11C and the fourth conductor 11D, respectively.
  • the first wiring patterns 20A to 20G and the second wiring patterns 50A to 50F are formed by forming a conductor film such as a Cu film on the second main surface VS2 and the first main surface VS1 of the resin member 70 by a plating method or the like, respectively. This may be formed by patterning by forming a photoresist film and etching.
  • plating layers 80A and 80B are formed on the first wiring patterns 20A to 20G and the second wiring patterns 50A to 50F. Further, the protective layers 90A and 90B are formed on the plating layers 80A and 80B on the formation surfaces of the first wiring patterns 20A to 20G and the second wiring patterns 50A to 50F.
  • the wireless IC device 102 according to Embodiment 2 can provide the following effects.
  • the magnetic circuit board 1 is disposed on the second main surface VS2 of the resin member 70, and a part of the second main surface VS2 of the resin member 70 is formed by the second surface PS2. is doing. Further, the magnetic circuit board 1 is formed on the second surface PS2 and the wiring conductor patterns 10A and 10B formed on the first surface PS1 by providing the third conductor 11C and the fourth conductor 11D therein. The first wiring patterns 20A and 20G are connected. With such a configuration, it is possible to reduce the height of the antenna coil while improving the L value of the antenna coil, and thus the size of the wireless IC device 102 can be reduced.
  • the bonding portion between the magnetic circuit board 1 and the mounting component can be more easily compared to the first embodiment. It can be arranged closer to the winding axis G1 of the antenna coil than the second main surface VS2 of the resin member 70.
  • the mounting surface of the RFIC element 61 tends to block the magnetic field formed by the antenna coil. Therefore, when viewed from the winding axis (Y-axis) direction of the antenna coil, the mounting surface of the RFIC element 61 is formed on the first surface PS1 that is closer to the winding axis G1 than the second surface PS2.
  • the mounting components such as the RFIC element 61 and the like can be disposed closer to the winding axis G1 than in the first embodiment. Thermal properties can be enhanced.
  • wireless IC device 102 that can reduce the height of the antenna coil and reduce the size while improving the L value of the antenna coil can be easily obtained. Can be manufactured. Further, since the third conductor 11C and the fourth conductor 11D can be formed when the magnetic circuit board 1 is manufactured, the manufacturing process can be simplified.
  • the wireless IC device 103 has a second surface PS2 of the magnetic circuit board 1 that is a second main member of the resin member 70 as compared with the wireless IC device 102 according to the second embodiment. The difference is that the entire surface VS2 is formed.
  • the first metal bodies 30A to 30F and the second metal bodies 40A to 40F are provided on the first surface PS1 of the magnetic circuit board 1, and the first connection conductors 13A to 13F and the first connection conductors 13A to 13F.
  • the two connection conductors 14A to 14F are different in that they are connected to the first wiring patterns 20A to 20G, respectively.
  • the second surface PS2 forms the entire second main surface VS2 of the resin member 70.
  • a plurality of first connection terminals 15A to 15F and a plurality of second connection terminals 16A to 16F are provided on the second surface PS2 of the magnetic circuit board 1.
  • a plurality of first connection conductors 13A to 13F and a plurality of second connection conductors 14A to 14F connected to the first wiring patterns 20A to 20G are provided.
  • the first metal bodies 30A to 30F and the second metal bodies 40A to 40F are respectively connected to the first connection conductors 13A to 13F and the second connection conductors 14A to 14A through the first connection terminals 15A to 15F and the second connection terminals 16A to 16F. 14F.
  • first wiring patterns 20A to 20G are formed on the second surface PS2 of the magnetic circuit board 1.
  • the first metal bodies 30A to 30F and the second metal bodies 40A to 40F are provided on the first surface PS1 of the magnetic circuit board 1. Specifically, the first ends of the first metal bodies 30A to 30F are connected to the first connection terminals 15A to 15F provided on the first surface PS1 of the magnetic circuit board 1. The third ends of the second metal bodies 40A to 40F are connected to the second connection terminals 16A to 16F provided on the first surface PS1 of the magnetic circuit board 1.
  • connection between the first metal bodies 30A to 30F and the first connection terminals 15A to 15F and the connection between the second metal bodies 40A to 40F and the second connection terminals 16A to 16F are performed via conductive bonding materials.
  • conductive bonding material for example, Sn—Ag solder is used.
  • a part of the magnetic circuit board 1 functions as a magnetic core of the antenna coil. Therefore, if at least a part of the magnetic circuit board 1 is disposed inside the antenna coil, the magnetic circuit board 1 exhibits a function as a magnetic core of the antenna coil.
  • the wireless IC device 103 according to Embodiment 3 can provide the following effects.
  • the second surface PS2 of the magnetic circuit board 1 forms the entire second main surface VS2 of the resin member 70.
  • the first metal bodies 30A to 30F and the second metal bodies 40A to 40F provided on the first surface PS1 of the magnetic circuit board 1 connect the first connection conductors 13A to 13F and the second connection conductors 14A to 14F. And are electrically connected to the first wiring patterns 20A to 20G.
  • the L value of the antenna coil and the antenna performance can be further improved without increasing the size of the magnetic circuit board 1.
  • a predetermined inductance can be obtained even if the height of the antenna coil is lowered, and thus the device can be further downsized.
  • a portion of the magnetic circuit board 1 located inside the antenna coil functions as a magnetic core of the antenna coil, and magnetic coupling with the communication partner antenna is achieved by the magnetic collection effect of this portion. Can be increased.
  • FIG. 15 shows a schematic configuration of the wireless IC device 104 according to the fourth embodiment.
  • the same or equivalent components as those in the first embodiment will be described with the same reference numerals.
  • descriptions overlapping with those in the first embodiment are omitted.
  • the magnetic circuit board 1A according to the fourth embodiment is provided with a magnetic auxiliary layer 1b at the inner center of the first surface PS1, the second surface PS2, and the magnetic circuit board 1A, respectively.
  • a magnetic substrate layer 1a is provided therebetween.
  • the magnetic base material layer 1a and the magnetic auxiliary layer 1b are made of a material in which the polycrystalline phase occupies almost the whole.
  • the polycrystalline phase in the magnetic substrate layer 1a and the polycrystalline phase in the magnetic auxiliary layer 1b have substantially the same crystal structure, and the linear expansion coefficient ⁇ 2 of the magnetic auxiliary layer 1b is It is smaller than the linear expansion coefficient ⁇ 1 of the magnetic substrate layer 1a.
  • the polycrystalline phase in the magnetic substrate layer 1a and the polycrystalline phase in the magnetic auxiliary layer 1b are polycrystalline phases made of ferrite.
  • the magnetic base material layer 1a and the magnetic auxiliary layer 1b are obtained by firing at the same time.
  • the ferrite constituting the magnetic auxiliary layer 1b is preferably a low-permeability ferrite.
  • the magnetic permeability is 30 or less.
  • the low-permeability magnetic auxiliary layer 1b is, for example, Fe—Ni—Zn—Cu based ferrite.
  • the ferrite constituting the magnetic auxiliary layer 1b is made by firing a mixture of ferric oxide, zinc oxide, nickel oxide, and copper oxide in a predetermined ratio. Thereby, the ferrite which comprises the magnetic body layer of low magnetic permeability has the characteristics that the magnetic permeability at 1 MHz is 20, for example, and the linear expansion coefficient ⁇ 2 is 9.5.
  • the internal stress generated in the magnetic base material layer 1a can be relaxed by arranging the magnetic auxiliary layer 1b also in the magnetic base material layer 1a.
  • the magnetic auxiliary layer 1b may be disposed on both surfaces of the first surface PS1 and the second surface PS2 of the magnetic circuit board 1A, and a plurality of magnetic auxiliary layers 1b may be provided inside the magnetic circuit board 1A. Since the magnetic base material layer 1a disposed inside the magnetic circuit board 1A is likely to generate internal stress that causes cracks, the magnetic auxiliary layer 1b is disposed inside the magnetic circuit board 1A. Thus, the internal stress can be relaxed.
  • the magnetic auxiliary layer 1b is Fe—Ni—Zn—Cu based ferrite, but is not limited to this.
  • the ferrite composing the magnetic auxiliary layer 1b may be Fe—Zn—Cu based ferrite. This ferrite is made, for example, by firing a mixture of ferric oxide, zinc oxide, and copper oxide in a predetermined ratio.
  • the ferrite which comprises the magnetic body auxiliary layer 1b has the characteristics that the magnetic permeability at 1 MHz is 1.0 and the linear expansion coefficient ⁇ 2 is 9.0, for example.
  • the magnetic auxiliary layer 1b may be a layer having a permeability equivalent to or higher than that of the magnetic base layer 1a.
  • FIG. 16 shows a schematic configuration of the wireless IC device 105 according to the fifth embodiment.
  • FIG. 17 is a circuit diagram of the wireless IC device 105 according to the fifth embodiment.
  • FIG. 18 is a bottom view of wireless IC device 105 of the fifth embodiment.
  • differences from the first embodiment will be mainly described.
  • the same or equivalent components as those in the first embodiment will be described with the same reference numerals.
  • descriptions overlapping with those in the first embodiment are omitted.
  • wiring conductor patterns 10 ⁇ / b> A and 10 ⁇ / b> B are formed on the first surface PS ⁇ b> 1 of the magnetic circuit board 1 of the wireless IC device 105.
  • wiring conductor patterns 10C and 10D and a fifth conductor 11E are formed on the second surface PS2 of the magnetic circuit board 1.
  • a sixth conductor 11 ⁇ / b> F is provided inside the magnetic circuit board 1.
  • the wiring conductor pattern 10B formed on the second surface PS2 is the second main of the resin member 70 via the fifth conductor 11E extending from the second main surface VS2 of the resin member 70 in the direction of the first main surface VS1.
  • the input / output terminal P1 formed on the surface VS2 is connected.
  • the RW module includes an RW-IC element 5, a low-pass filter (hereinafter referred to as “LPF”) 6, a matching circuit 7, and an antenna coil ANT.
  • LPF low-pass filter
  • the LPF 6 passes only a low frequency component below a predetermined frequency from the differential signal output from the RW-IC element 5 and outputs a transmission signal to the antenna coil ANT. This suppresses unnecessary harmonic components from being radiated from the antenna coil ANT.
  • the LPF 6 includes capacitors 65, 66, and 67 and coils 68 and 69.
  • the matching circuit 7 including the capacitors 62, 63, and 64 and the antenna coil ANT are the same as those in the first embodiment, the description thereof is omitted.
  • the RW-IC element 5 and the matching circuit capacitor are mounted on the second surface PS2 side of the magnetic circuit board 1.
  • a capacitor and a coil for LPF 6 are mounted on the first surface PS1 side of the magnetic circuit board 1.
  • the input / output terminals P1 and P2 of the RW-IC element 5 have been described in the vicinity of the center of the second main surface VS2 of the resin member 70, but the present invention is not limited to this.
  • the input / output terminals P1 and P2 may be arranged at arbitrary positions. With such a configuration, the degree of freedom in design is improved.
  • the wireless IC device 106 of the sixth embodiment is different from the wireless IC device 102 of the second embodiment in that it includes a sealing resin layer 140 and a magnetic block 141.
  • the wireless IC device 106 forms a sealing resin layer 140 on the first surface PS1 side of the magnetic circuit board 1 and arranges a magnetic block 141 on the sealing resin layer 140. ing. Further, the magnetic circuit board 1, the sealing resin layer 140, and the magnetic block 141 are embedded in the resin member 70 and disposed inside the antenna coil.
  • the sealing resin layer 140 seals surface mount components such as the RFIC 61 and the chip capacitor 62 mounted on the first surface PS1 of the magnetic circuit board 1 with a resin.
  • the sealing resin layer 140 is made of, for example, a thermosetting resin such as an epoxy resin.
  • the magnetic body block 141 is disposed on the sealing resin layer 140.
  • the magnetic body block 141 has a rectangular parallelepiped shape, and is made of, for example, ferrite.
  • the magnetic block 141 is disposed inside the antenna coil, and acts as a magnetic core (magnetic core) for the antenna coil together with the magnetic circuit board 1.
  • the wireless IC device 106 according to Embodiment 6 can provide the following effects.
  • the surface-mounted component is protected by sealing the surface-mounted component mounted on the first surface PS1 side of the magnetic circuit board 1 with the sealing resin layer 40. be able to.
  • FIG. 20 is a perspective view of an article 301 with an RFID tag according to the seventh embodiment.
  • FIG. 21 is a front view of an RFID-tagged article 301 according to Embodiment 7.
  • the RFID tag-equipped article 301 is a resin molded body incorporating an RFID tag, and is, for example, a toy such as a miniature car made by resin molding.
  • the RFID-tagged article 301 includes the wireless IC device 101 of the first embodiment. In Embodiment 7, the wireless IC device 101 is used as an RFID tag.
  • the wireless IC device 101 is embedded in the resin molded body 201 and is not exposed to the outside of the article 301.
  • the wireless IC device 101 is embedded in the bottom of the toy.
  • the bottom of the toy corresponds to the vicinity of the upper surface of the RFID-tagged article 301 from the viewpoint of FIG.
  • the winding axis of the antenna coil of the wireless IC device 101 faces the normal direction to the bottom surface of a toy such as a miniature car. Therefore, the reader / writer device communicates with the wireless IC device 101 by making the bottom surface of the toy face the reading unit of the reader / writer device. Thus, the reader / writer device or the host device connected to the reader / writer device performs a predetermined process.
  • an injection mold 401 for the resin molded body 201 is prepared, and the wireless IC device 101 is fixed in the injection mold 401.
  • the wireless IC device 101 is fixed in the injection mold 401 by a support member made of the same resin as the injection molding resin 402, for example.
  • the injection-molded resin 402 is filled into the injection-molding mold 401 from the gate, and the resin molded body 201 is molded, whereby the RFID-tagged article 301 is manufactured.
  • the wireless IC device 101 is robust. And the solder connection part of a surface mounting chip component is protected with respect to the resin 402 for injection molding which flows with high heat at the time of injection molding.
  • the coating is melted by heat during injection molding, and the Cu wires are short-circuited. For this reason, it is difficult to use a conventional ordinary wire-wound coil component as an antenna coil.
  • the magnetic circuit board 1 of the wireless IC device 101 is disposed closer to the winding axis G1 than the second main surface VS2 of the resin member 70 when viewed from the direction of the winding axis G1 of the antenna coil. That is, since the magnetic circuit board 1 of the wireless IC device 101 is disposed at a certain distance from the outer edge of the resin member 70 that is in contact with the high-temperature injection molding resin 402, it is not easily affected by heat.
  • the seventh embodiment it is possible to provide the RFID tag-equipped article 301 having excellent electrical and thermal characteristics that can be communicated with a reader / writer device or the like.
  • FIG. 23 is a perspective view of an article 302 with an RFID tag according to the eighth embodiment.
  • FIG. 24 is a cross-sectional view of the article 302 with an RFID tag.
  • FIG. 25 is a partially enlarged view of FIG.
  • the RFID tag-equipped article 302 is a communication terminal device equipped with an RFID tag, for example, a portable electronic device such as a smartphone.
  • the RFID-tagged article 302 includes a wireless IC device 101 and a booster antenna 120 having a resonance frequency.
  • the lower casing 202 is on the upper surface side of the article 302 with the RFID tag, and the upper casing 203 is on the lower surface side.
  • a circuit board 200, a wireless IC device 101, and a booster antenna 120 having a resonance frequency are provided in a space surrounded by the lower housing 202 and the upper housing 203.
  • the wireless IC device 101 is arranged so that the magnetic flux is linked to the antenna coil and the booster antenna 120. That is, the wireless IC device 107 and the booster antenna 120 are arranged so that the antenna coil of the wireless IC device 101 is magnetically coupled to the coil of the booster antenna 120. Note that broken lines in FIG. 25 conceptually represent magnetic fluxes that contribute to the magnetic field coupling.
  • FIG. 26 is a perspective view of the booster antenna 120.
  • FIG. 27 is a circuit diagram of the booster antenna 120.
  • the first coil pattern 121 and the second coil pattern 122 are conductors patterned in a rectangular spiral shape, and are patterned so as to be capacitively coupled in a state where current flows in the same direction in plan view.
  • the A stray capacitance is formed between the first coil pattern 121 and the second coil pattern 122.
  • An LC resonance circuit is configured by the inductance of the first coil pattern 121 and the second coil pattern 122 and the capacitance of the stray capacitance.
  • the resonance frequency of the LC resonance circuit is substantially equal to the communication frequency of the RFID system.
  • the communication frequency is, for example, the 13.56 MHz band.
  • Embodiment 7 and Embodiment 8 although the article
  • an article provided with the wireless IC device of Embodiments 2 to 6 may be used.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)
  • Support Of Aerials (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

L'invention fournit un dispositif de circuit intégré sans fil qui permet une miniaturisation selon une configuration simple, et l'invention présente également un corps moulé en résine équipé de ce dispositif de circuit intégré sans fil, et un dispositif de terminal de communication équipé de ce corps moulé en résine ainsi qu'un procédé de fabrication de ce dispositif de terminal de communication. Le dispositif de circuit intégré sans fil de l'invention est équipé : d'un élément en résine qui possède une première face principale, et une seconde face principale s'opposant à la première face principale ; d'une carte de circuit imprimé de corps magnétique qui possède un motif conducteur de câblage ; d'un élément de circuit intégré radio fréquence qui est monté sur ledit motif conducteur de câblage de ladite carte de circuit imprimé de corps magnétique, et qui est équipé d'une première borne entrée/sortie et d'une seconde borne entrée/sortie ; et d'une bobine d'antenne qui est agencée sur ledit élément de résine, et dont une extrémité est connectée à ladite première borne entrée/sortie et l'autre extrémité est connectée à ladite seconde borne entrée/sortie. Au moins une partie de ladite carte de circuit imprimé de corps magnétique est disposée côté interne de ladite bobine d'antenne, en tant que corps magnétique de ladite bobine d'antenne.
PCT/JP2016/053346 2015-03-06 2016-02-04 Dispositif de circuit intégré sans fil, corps moulé en résine équipé de ce dispositif de circuit intégré sans fil, et dispositif de terminal de communication équipé de ce corps moulé en résine ainsi que procédé de fabrication de ce dispositif de terminal de communication WO2016143426A1 (fr)

Priority Applications (2)

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JP2017504914A JP6222398B2 (ja) 2015-03-06 2016-02-04 無線ｉｃデバイス、それを備えた樹脂成型体、それを備えた通信端末装置、及びその製造方法
CN201690000542.1U CN207541648U (zh) 2015-03-06 2016-02-04 无线ic设备、具备该无线ic设备的树脂成型体和通信终端装置

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Application Number Priority Date Filing Date Title
JP2015-045173 2015-03-06
JP2015045173 2015-03-06

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WO2016143426A1 true WO2016143426A1 (fr) 2016-09-15

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PCT/JP2016/053346 WO2016143426A1 (fr) 2015-03-06 2016-02-04 Dispositif de circuit intégré sans fil, corps moulé en résine équipé de ce dispositif de circuit intégré sans fil, et dispositif de terminal de communication équipé de ce corps moulé en résine ainsi que procédé de fabrication de ce dispositif de terminal de communication

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Cited By (3)

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Publication number Priority date Publication date Assignee Title
JP2016219059A (ja) * 2015-03-06 2016-12-22 株式会社村田製作所 無線ｉｃデバイス、それを備えた樹脂成型体、それを備えた通信端末装置
CN108879083A (zh) * 2017-05-09 2018-11-23 昌泽科技有限公司 芯片信号元件的制作方法
WO2024076309A1 (fr) * 2022-10-07 2024-04-11 Orica International Pte Ltd Dispositif électronique

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WO2009145218A1 (fr) * 2008-05-28 2009-12-03 株式会社村田製作所 Dispositif à circuit intégré sans fil et composant pour dispositif à circuit intégré sans fil
JP2010258913A (ja) * 2009-04-27 2010-11-11 Murata Mfg Co Ltd 結合基板、電磁結合モジュール及び無線ｉｃデバイス
JP2014093675A (ja) * 2012-11-05 2014-05-19 Murata Mfg Co Ltd コイルアンテナ

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Publication number Priority date Publication date Assignee Title
WO2009145218A1 (fr) * 2008-05-28 2009-12-03 株式会社村田製作所 Dispositif à circuit intégré sans fil et composant pour dispositif à circuit intégré sans fil
JP2010258913A (ja) * 2009-04-27 2010-11-11 Murata Mfg Co Ltd 結合基板、電磁結合モジュール及び無線ｉｃデバイス
JP2014093675A (ja) * 2012-11-05 2014-05-19 Murata Mfg Co Ltd コイルアンテナ

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016219059A (ja) * 2015-03-06 2016-12-22 株式会社村田製作所 無線ｉｃデバイス、それを備えた樹脂成型体、それを備えた通信端末装置
CN108879083A (zh) * 2017-05-09 2018-11-23 昌泽科技有限公司 芯片信号元件的制作方法
CN108879083B (zh) * 2017-05-09 2020-05-26 昌泽科技有限公司 芯片信号元件的制作方法
WO2024076309A1 (fr) * 2022-10-07 2024-04-11 Orica International Pte Ltd Dispositif électronique

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