WO2016080069A1 - インクジェット用光及び熱硬化性接着剤、半導体装置の製造方法及び電子部品 - Google Patents
インクジェット用光及び熱硬化性接着剤、半導体装置の製造方法及び電子部品 Download PDFInfo
- Publication number
- WO2016080069A1 WO2016080069A1 PCT/JP2015/076678 JP2015076678W WO2016080069A1 WO 2016080069 A1 WO2016080069 A1 WO 2016080069A1 JP 2015076678 W JP2015076678 W JP 2015076678W WO 2016080069 A1 WO2016080069 A1 WO 2016080069A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesive
- light
- thermosetting
- compound
- adhesive layer
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 214
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 213
- 239000004065 semiconductor Substances 0.000 title claims description 120
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 150000001875 compounds Chemical class 0.000 claims abstract description 231
- 239000012790 adhesive layer Substances 0.000 claims abstract description 171
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 21
- 239000003999 initiator Substances 0.000 claims abstract description 11
- 229920001187 thermosetting polymer Polymers 0.000 claims description 146
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 87
- -1 2-ethylhexyl Chemical group 0.000 claims description 45
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 26
- 125000003700 epoxy group Chemical group 0.000 claims description 20
- 125000001730 thiiranyl group Chemical group 0.000 claims description 20
- 239000002904 solvent Substances 0.000 claims description 15
- 239000000945 filler Substances 0.000 claims description 14
- 238000010030 laminating Methods 0.000 claims description 9
- 239000010410 layer Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 claims description 5
- 239000006059 cover glass Substances 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 5
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 238000013007 heat curing Methods 0.000 abstract description 2
- 230000001186 cumulative effect Effects 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 description 52
- 239000000758 substrate Substances 0.000 description 25
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 23
- 239000000243 solution Substances 0.000 description 19
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 18
- 238000001723 curing Methods 0.000 description 17
- 229920003986 novolac Polymers 0.000 description 17
- 229920000768 polyamine Polymers 0.000 description 17
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical group CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 12
- 239000000872 buffer Substances 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 12
- 239000000047 product Substances 0.000 description 10
- 125000003367 polycyclic group Chemical group 0.000 description 9
- 239000011800 void material Substances 0.000 description 9
- 230000001588 bifunctional effect Effects 0.000 description 8
- 239000012948 isocyanate Substances 0.000 description 8
- 150000002513 isocyanates Chemical class 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- 239000003505 polymerization initiator Substances 0.000 description 7
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 6
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 6
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 6
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 150000004294 cyclic thioethers Chemical group 0.000 description 6
- ZNNZYHKDIALBAK-UHFFFAOYSA-M potassium thiocyanate Chemical compound [K+].[S-]C#N ZNNZYHKDIALBAK-UHFFFAOYSA-M 0.000 description 6
- 229940116357 potassium thiocyanate Drugs 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000000600 sorbitol Substances 0.000 description 6
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical group C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 5
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000012790 confirmation Methods 0.000 description 5
- 150000004292 cyclic ethers Chemical group 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 5
- 238000003475 lamination Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 229920003192 poly(bis maleimide) Polymers 0.000 description 5
- 229920005862 polyol Polymers 0.000 description 5
- 150000003077 polyols Chemical class 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 4
- 239000005058 Isophorone diisocyanate Substances 0.000 description 4
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 230000000977 initiatory effect Effects 0.000 description 4
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 238000000016 photochemical curing Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- VGTPCRGMBIAPIM-UHFFFAOYSA-M sodium thiocyanate Chemical compound [Na+].[S-]C#N VGTPCRGMBIAPIM-UHFFFAOYSA-M 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 150000003567 thiocyanates Chemical class 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- NCAVPEPBIJTYSO-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate;2-(oxiran-2-ylmethoxymethyl)oxirane Chemical compound C1OC1COCC1CO1.OCCCCOC(=O)C=C NCAVPEPBIJTYSO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Natural products CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical class C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 125000001624 naphthyl group Chemical group 0.000 description 3
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000010349 pulsation Effects 0.000 description 3
- 239000007870 radical polymerization initiator Substances 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- 239000006228 supernatant Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- 150000003585 thioureas Chemical class 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 2
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 2
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- IRNRNPNZAKHEAW-UHFFFAOYSA-N 3-methyl-1,3-benzothiazole-2-thione Chemical compound C1=CC=C2SC(=S)N(C)C2=C1 IRNRNPNZAKHEAW-UHFFFAOYSA-N 0.000 description 2
- WOCGGVRGNIEDSZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical compound C=1C=C(O)C(CC=C)=CC=1C(C)(C)C1=CC=C(O)C(CC=C)=C1 WOCGGVRGNIEDSZ-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- QORUGOXNWQUALA-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 QORUGOXNWQUALA-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Chemical group 0.000 description 2
- 239000002671 adjuvant Substances 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- UMLWXYJZDNNBTD-UHFFFAOYSA-N alpha-dimethylaminoacetophenone Natural products CN(C)CC(=O)C1=CC=CC=C1 UMLWXYJZDNNBTD-UHFFFAOYSA-N 0.000 description 2
- JGCWKVKYRNXTMD-UHFFFAOYSA-N bicyclo[2.2.1]heptane;isocyanic acid Chemical compound N=C=O.N=C=O.C1CC2CCC1C2 JGCWKVKYRNXTMD-UHFFFAOYSA-N 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 150000002357 guanidines Chemical class 0.000 description 2
- 229940083094 guanine derivative acting on arteriolar smooth muscle Drugs 0.000 description 2
- YUWFEBAXEOLKSG-UHFFFAOYSA-N hexamethylbenzene Chemical group CC1=C(C)C(C)=C(C)C(C)=C1C YUWFEBAXEOLKSG-UHFFFAOYSA-N 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Natural products OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 2
- 235000019341 magnesium sulphate Nutrition 0.000 description 2
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- SKECXRFZFFAANN-UHFFFAOYSA-N n,n-dimethylmethanethioamide Chemical compound CN(C)C=S SKECXRFZFFAANN-UHFFFAOYSA-N 0.000 description 2
- IXQGCWUGDFDQMF-UHFFFAOYSA-N o-Hydroxyethylbenzene Natural products CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- UOHMMEJUHBCKEE-UHFFFAOYSA-N prehnitene Chemical compound CC1=CC=C(C)C(C)=C1C UOHMMEJUHBCKEE-UHFFFAOYSA-N 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- OKQKDCXVLPGWPO-UHFFFAOYSA-N sulfanylidenephosphane Chemical compound S=P OKQKDCXVLPGWPO-UHFFFAOYSA-N 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 2
- AMJYHMCHKZQLAY-UHFFFAOYSA-N tris(2-isocyanatophenoxy)-sulfanylidene-$l^{5}-phosphane Chemical compound O=C=NC1=CC=CC=C1OP(=S)(OC=1C(=CC=CC=1)N=C=O)OC1=CC=CC=C1N=C=O AMJYHMCHKZQLAY-UHFFFAOYSA-N 0.000 description 2
- 150000003672 ureas Chemical class 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- DJKGDNKYTKCJKD-BPOCMEKLSA-N (1s,4r,5s,6r)-1,2,3,4,7,7-hexachlorobicyclo[2.2.1]hept-2-ene-5,6-dicarboxylic acid Chemical compound ClC1=C(Cl)[C@]2(Cl)[C@H](C(=O)O)[C@H](C(O)=O)[C@@]1(Cl)C2(Cl)Cl DJKGDNKYTKCJKD-BPOCMEKLSA-N 0.000 description 1
- DLDWUFCUUXXYTB-UHFFFAOYSA-N (2-oxo-1,2-diphenylethyl) 4-methylbenzenesulfonate Chemical compound C1=CC(C)=CC=C1S(=O)(=O)OC(C=1C=CC=CC=1)C(=O)C1=CC=CC=C1 DLDWUFCUUXXYTB-UHFFFAOYSA-N 0.000 description 1
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- XKSUVRWJZCEYQQ-UHFFFAOYSA-N 1,1-dimethoxyethylbenzene Chemical compound COC(C)(OC)C1=CC=CC=C1 XKSUVRWJZCEYQQ-UHFFFAOYSA-N 0.000 description 1
- JWTGRKUQJXIWCV-UHFFFAOYSA-N 1,2,3-trihydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(O)C(O)CO JWTGRKUQJXIWCV-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- WGYZMNBUZFHYRX-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-ol Chemical compound COCC(C)OCC(C)O WGYZMNBUZFHYRX-UHFFFAOYSA-N 0.000 description 1
- UOZNXGJVAWDLQK-UHFFFAOYSA-N 1-(2,3-dimethylphenyl)pyrrole-2,5-dione Chemical compound CC1=CC=CC(N2C(C=CC2=O)=O)=C1C UOZNXGJVAWDLQK-UHFFFAOYSA-N 0.000 description 1
- KPQOXMCRYWDRSB-UHFFFAOYSA-N 1-(2-chlorophenyl)pyrrole-2,5-dione Chemical compound ClC1=CC=CC=C1N1C(=O)C=CC1=O KPQOXMCRYWDRSB-UHFFFAOYSA-N 0.000 description 1
- QYOJZFBQEAZNEW-UHFFFAOYSA-N 1-(2-methylphenyl)pyrrole-2,5-dione Chemical compound CC1=CC=CC=C1N1C(=O)C=CC1=O QYOJZFBQEAZNEW-UHFFFAOYSA-N 0.000 description 1
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 description 1
- AQGZJQNZNONGKY-UHFFFAOYSA-N 1-[4-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=C(N2C(C=CC2=O)=O)C=C1 AQGZJQNZNONGKY-UHFFFAOYSA-N 0.000 description 1
- LYCKDYZIIOVFCX-UHFFFAOYSA-N 1-[[3-[(2,5-dioxopyrrol-1-yl)methyl]phenyl]methyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CC1=CC=CC(CN2C(C=CC2=O)=O)=C1 LYCKDYZIIOVFCX-UHFFFAOYSA-N 0.000 description 1
- MKRBAPNEJMFMHU-UHFFFAOYSA-N 1-benzylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CC1=CC=CC=C1 MKRBAPNEJMFMHU-UHFFFAOYSA-N 0.000 description 1
- JNPCNDJVEUEFBO-UHFFFAOYSA-N 1-butylpyrrole-2,5-dione Chemical compound CCCCN1C(=O)C=CC1=O JNPCNDJVEUEFBO-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- SJLLJZNSZJHXQN-UHFFFAOYSA-N 1-dodecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCN1C(=O)C=CC1=O SJLLJZNSZJHXQN-UHFFFAOYSA-N 0.000 description 1
- ZIKLJUUTSQYGQI-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxypropoxy)propane Chemical compound CCOCC(C)OCC(C)OCC ZIKLJUUTSQYGQI-UHFFFAOYSA-N 0.000 description 1
- LMAUULKNZLEMGN-UHFFFAOYSA-N 1-ethyl-3,5-dimethylbenzene Chemical compound CCC1=CC(C)=CC(C)=C1 LMAUULKNZLEMGN-UHFFFAOYSA-N 0.000 description 1
- FBPVUBVZRPURIU-UHFFFAOYSA-N 1-hexylpyrrole-2,5-dione Chemical compound CCCCCCN1C(=O)C=CC1=O FBPVUBVZRPURIU-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- OEYNWAWWSZUGDU-UHFFFAOYSA-N 1-methoxypropane-1,2-diol Chemical compound COC(O)C(C)O OEYNWAWWSZUGDU-UHFFFAOYSA-N 0.000 description 1
- BAWHYOHVWHQWFQ-UHFFFAOYSA-N 1-naphthalen-1-ylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC2=CC=CC=C12 BAWHYOHVWHQWFQ-UHFFFAOYSA-N 0.000 description 1
- KIKBJYQCJJXCBZ-UHFFFAOYSA-N 1-octylpyrrole-2,5-dione Chemical compound CCCCCCCCN1C(=O)C=CC1=O KIKBJYQCJJXCBZ-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- DABFKTHTXOELJF-UHFFFAOYSA-N 1-propylpyrrole-2,5-dione Chemical compound CCCN1C(=O)C=CC1=O DABFKTHTXOELJF-UHFFFAOYSA-N 0.000 description 1
- 125000001462 1-pyrrolyl group Chemical group [*]N1C([H])=C([H])C([H])=C1[H] 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- CERJZAHSUZVMCH-UHFFFAOYSA-N 2,2-dichloro-1-phenylethanone Chemical compound ClC(Cl)C(=O)C1=CC=CC=C1 CERJZAHSUZVMCH-UHFFFAOYSA-N 0.000 description 1
- GIMQKKFOOYOQGB-UHFFFAOYSA-N 2,2-diethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)(OCC)C(=O)C1=CC=CC=C1 GIMQKKFOOYOQGB-UHFFFAOYSA-N 0.000 description 1
- PTSBFVMVQZLXTA-UHFFFAOYSA-N 2,2-diethylhexane-1,1-diol Chemical compound CCCCC(CC)(CC)C(O)O PTSBFVMVQZLXTA-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- BRKORVYTKKLNKX-UHFFFAOYSA-N 2,4-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC(C(C)C)=C3SC2=C1 BRKORVYTKKLNKX-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- ZJWDJIVISLUQQZ-UHFFFAOYSA-N 2,4-dimethylpentane-1,5-diol Chemical compound OCC(C)CC(C)CO ZJWDJIVISLUQQZ-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- YHYCMHWTYHPIQS-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-methoxyethanol Chemical compound COC(O)COCCO YHYCMHWTYHPIQS-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- HTYFFCPFVMJTKM-UHFFFAOYSA-N 2-(4-chlorophenyl)-1-(diaminomethylidene)guanidine Chemical compound NC(N)=NC(N)=NC1=CC=C(Cl)C=C1 HTYFFCPFVMJTKM-UHFFFAOYSA-N 0.000 description 1
- PUBNJSZGANKUGX-UHFFFAOYSA-N 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=C(C)C=C1 PUBNJSZGANKUGX-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- XFEJHTOVNZKSKW-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;propanoic acid Chemical compound CCC(O)=O.OCC(CO)(CO)COCC(CO)(CO)CO XFEJHTOVNZKSKW-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- DSKYSDCYIODJPC-UHFFFAOYSA-N 2-butyl-2-ethylpropane-1,3-diol Chemical compound CCCCC(CC)(CO)CO DSKYSDCYIODJPC-UHFFFAOYSA-N 0.000 description 1
- AKCRQHGQIJBRMN-UHFFFAOYSA-N 2-chloroaniline Chemical compound NC1=CC=CC=C1Cl AKCRQHGQIJBRMN-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- JVBOHJILWXWANF-UHFFFAOYSA-N 2-cyano-N-(N,N-diethylcarbamimidoyl)acetamide Chemical compound C(C)N(C(NC(CC#N)=O)=N)CC JVBOHJILWXWANF-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- 125000004200 2-methoxyethyl group Chemical group [H]C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- MWDGNKGKLOBESZ-UHFFFAOYSA-N 2-oxooctanal Chemical compound CCCCCCC(=O)C=O MWDGNKGKLOBESZ-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- MHQULXYNBKWNDF-UHFFFAOYSA-N 3,4-dimethylbenzene-1,2-diamine Chemical compound CC1=CC=C(N)C(N)=C1C MHQULXYNBKWNDF-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- ANOPCGQVRXJHHD-UHFFFAOYSA-N 3-[3-(3-aminopropyl)-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]propan-1-amine Chemical compound C1OC(CCCN)OCC21COC(CCCN)OC2 ANOPCGQVRXJHHD-UHFFFAOYSA-N 0.000 description 1
- IWTYTFSSTWXZFU-UHFFFAOYSA-N 3-chloroprop-1-enylbenzene Chemical compound ClCC=CC1=CC=CC=C1 IWTYTFSSTWXZFU-UHFFFAOYSA-N 0.000 description 1
- YAXXOCZAXKLLCV-UHFFFAOYSA-N 3-dodecyloxolane-2,5-dione Chemical compound CCCCCCCCCCCCC1CC(=O)OC1=O YAXXOCZAXKLLCV-UHFFFAOYSA-N 0.000 description 1
- QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 description 1
- ARXVXVOLXMVYIT-UHFFFAOYSA-N 3-methylbutyl 2-(dimethylamino)benzoate Chemical compound CC(C)CCOC(=O)C1=CC=CC=C1N(C)C ARXVXVOLXMVYIT-UHFFFAOYSA-N 0.000 description 1
- RDNPPYMJRALIIH-UHFFFAOYSA-N 3-methylcyclohex-3-ene-1,1,2,2-tetracarboxylic acid Chemical compound CC1=CCCC(C(O)=O)(C(O)=O)C1(C(O)=O)C(O)=O RDNPPYMJRALIIH-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 1
- USWANRSZMQLWTG-UHFFFAOYSA-N 4-(oxiran-2-ylmethoxy)butyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOCC1CO1 USWANRSZMQLWTG-UHFFFAOYSA-N 0.000 description 1
- IGSBHTZEJMPDSZ-UHFFFAOYSA-N 4-[(4-amino-3-methylcyclohexyl)methyl]-2-methylcyclohexan-1-amine Chemical compound C1CC(N)C(C)CC1CC1CC(C)C(N)CC1 IGSBHTZEJMPDSZ-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- XECVXFWNYNXCBN-UHFFFAOYSA-N 4-[(4-aminophenyl)-phenylmethyl]aniline Chemical compound C1=CC(N)=CC=C1C(C=1C=CC(N)=CC=1)C1=CC=CC=C1 XECVXFWNYNXCBN-UHFFFAOYSA-N 0.000 description 1
- ZSQIQUAKDNTQOI-UHFFFAOYSA-N 4-[1-(4-aminophenyl)cyclohexyl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)CCCCC1 ZSQIQUAKDNTQOI-UHFFFAOYSA-N 0.000 description 1
- AJYDKROUZBIMLE-UHFFFAOYSA-N 4-[2-[2-[2-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=CC=C(OC=2C=CC(N)=CC=2)C=1C(C)(C)C1=CC=CC=C1OC1=CC=C(N)C=C1 AJYDKROUZBIMLE-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
- IZSHZLKNFQAAKX-UHFFFAOYSA-N 5-cyclopenta-2,4-dien-1-ylcyclopenta-1,3-diene Chemical group C1=CC=CC1C1C=CC=C1 IZSHZLKNFQAAKX-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- XNCOSPRUTUOJCJ-UHFFFAOYSA-N Biguanide Chemical compound NC(N)=NC(N)=N XNCOSPRUTUOJCJ-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 1
- RUDMETXSMVJPSS-UHFFFAOYSA-N C1=CC=CC1[Ti](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1C=CC=C1 Chemical compound C1=CC=CC1[Ti](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1C=CC=C1 RUDMETXSMVJPSS-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical class C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- SLXAQTAKXHEFEK-UHFFFAOYSA-N Fc1c(F)c(F)c(c(F)c1F)[Ti](C1C=CC=C1)(C1C=CC=C1)c1c(F)c(F)c(F)c(F)c1F Chemical compound Fc1c(F)c(F)c(c(F)c1F)[Ti](C1C=CC=C1)(C1C=CC=C1)c1c(F)c(F)c(F)c(F)c1F SLXAQTAKXHEFEK-UHFFFAOYSA-N 0.000 description 1
- 238000006845 Michael addition reaction Methods 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical class [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- TUVYSBJZBYRDHP-UHFFFAOYSA-N acetic acid;methoxymethane Chemical compound COC.CC(O)=O TUVYSBJZBYRDHP-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 125000005577 anthracene group Chemical group 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 125000004555 carbazol-3-yl group Chemical group C1=CC(=CC=2C3=CC=CC=C3NC12)* 0.000 description 1
- XEVRDFDBXJMZFG-UHFFFAOYSA-N carbonyl dihydrazine Chemical compound NNC(=O)NN XEVRDFDBXJMZFG-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 125000005578 chrysene group Chemical group 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 125000006841 cyclic skeleton Chemical group 0.000 description 1
- VEIOBOXBGYWJIT-UHFFFAOYSA-N cyclohexane;methanol Chemical compound OC.OC.C1CCCCC1 VEIOBOXBGYWJIT-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- VSSAZBXXNIABDN-UHFFFAOYSA-N cyclohexylmethanol Chemical class OCC1CCCCC1 VSSAZBXXNIABDN-UHFFFAOYSA-N 0.000 description 1
- PESYEWKSBIWTAK-UHFFFAOYSA-N cyclopenta-1,3-diene;titanium(2+) Chemical class [Ti+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 PESYEWKSBIWTAK-UHFFFAOYSA-N 0.000 description 1
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 1
- XKLWATAZDMHTSH-UHFFFAOYSA-L cyclopentane;dichlorotitanium Chemical compound Cl[Ti]Cl.[CH]1[CH][CH][CH][CH]1.[CH]1[CH][CH][CH][CH]1 XKLWATAZDMHTSH-UHFFFAOYSA-L 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- ZWLIYXJBOIDXLL-UHFFFAOYSA-N decanedihydrazide Chemical compound NNC(=O)CCCCCCCCC(=O)NN ZWLIYXJBOIDXLL-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- GRGBENNNGZARRZ-UHFFFAOYSA-N dodecanedihydrazide Chemical compound NNC(=O)CCCCCCCCCCC(=O)NN GRGBENNNGZARRZ-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- ORBFAMHUKZLWSD-UHFFFAOYSA-N ethyl 2-(dimethylamino)benzoate Chemical compound CCOC(=O)C1=CC=CC=C1N(C)C ORBFAMHUKZLWSD-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 229940042795 hydrazides for tuberculosis treatment Drugs 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 150000002462 imidazolines Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 150000004658 ketimines Chemical class 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- IVSZLXZYQVIEFR-UHFFFAOYSA-N m-xylene Chemical compound CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 1
- NGGXACLSAZXJGM-UHFFFAOYSA-N n-(diaminomethylidene)acetamide Chemical compound CC(=O)N=C(N)N NGGXACLSAZXJGM-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical compound C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 229940105570 ornex Drugs 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- LXTZRIBXKVRLOA-UHFFFAOYSA-N padimate a Chemical compound CCCCCOC(=O)C1=CC=C(N(C)C)C=C1 LXTZRIBXKVRLOA-UHFFFAOYSA-N 0.000 description 1
- 125000005582 pentacene group Chemical group 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical group C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 1
- CUQCMXFWIMOWRP-UHFFFAOYSA-N phenyl biguanide Chemical compound NC(N)=NC(N)=NC1=CC=CC=C1 CUQCMXFWIMOWRP-UHFFFAOYSA-N 0.000 description 1
- 125000003356 phenylsulfanyl group Chemical group [*]SC1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 150000004714 phosphonium salts Chemical group 0.000 description 1
- 150000003018 phosphorus compounds Chemical group 0.000 description 1
- 125000001388 picenyl group Chemical group C1(=CC=CC2=CC=C3C4=CC=C5C=CC=CC5=C4C=CC3=C21)* 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920001021 polysulfide Chemical class 0.000 description 1
- 239000005077 polysulfide Chemical class 0.000 description 1
- 150000008117 polysulfides Chemical class 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- FZYDVDRIQZXXIW-UHFFFAOYSA-N propanoic acid;prop-2-enoic acid Chemical compound CCC(O)=O.OC(=O)C=C FZYDVDRIQZXXIW-UHFFFAOYSA-N 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 125000005581 pyrene group Chemical group 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003505 terpenes Chemical group 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- 125000005579 tetracene group Chemical group 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 125000005580 triphenylene group Chemical group 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
- C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C09J201/06—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
- C09J201/08—Carboxyl groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/273—Manufacturing methods by local deposition of the material of the layer connector
- H01L2224/2731—Manufacturing methods by local deposition of the material of the layer connector in liquid form
- H01L2224/27312—Continuous flow, e.g. using a microsyringe, a pump, a nozzle or extrusion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/273—Manufacturing methods by local deposition of the material of the layer connector
- H01L2224/2731—Manufacturing methods by local deposition of the material of the layer connector in liquid form
- H01L2224/27318—Manufacturing methods by local deposition of the material of the layer connector in liquid form by dispensing droplets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/278—Post-treatment of the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/29386—Base material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2224/29387—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73215—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7515—Means for applying permanent coating, e.g. in-situ coating
- H01L2224/75151—Means for direct writing
- H01L2224/75155—Jetting means, e.g. ink jet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
- H01L2224/83201—Compression bonding
- H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
- H01L2224/83856—Pre-cured adhesive, i.e. B-stage adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
- H01L2224/83862—Heat curing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
- H01L2224/83874—Ultraviolet [UV] curing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to an inkjet light and a thermosetting adhesive that are applied and used using an inkjet apparatus.
- the present invention also relates to a method for manufacturing a semiconductor device using the adhesive, and an electronic component using the adhesive.
- a paste adhesive is mainly used as a semiconductor element fixing adhesive.
- the supporting members used are also required to be miniaturized.
- paste-like adhesives have problems such as wetting and spreading.
- it is difficult to control the thickness with a paste-like adhesive and as a result, the semiconductor element is tilted, causing problems such as wire bonding defects. For this reason, in recent semiconductor packages, it has become impossible to sufficiently deal with conventional bonding using a paste-like adhesive.
- Patent Document 1 an adhesive sheet having a film-like adhesive layer has been used.
- an adhesive sheet adheresive layer
- a dicing sheet is attached to the other surface of the adhesive layer.
- the semiconductor wafer is separated into pieces with the adhesive layer bonded to obtain a semiconductor element.
- the semiconductor element with the adhesive layer is picked up and joined to the support member.
- a semiconductor device is obtained through assembly processes such as wire bonding and sealing.
- Patent Document 2 discloses an adhesive containing a radiation polymerizable compound, a photoinitiator, and a thermosetting resin.
- a radiation polymerizable compound e.g., a radiation polymerizable compound
- a photoinitiator e.g., a photoinitiator
- a thermosetting resin e.g., a thermosetting resin
- the light quantity is 1000 mJ so that the illuminance at 365 nm is 100 mW / cm 2 , including a photocurable compound, a thermosetting compound, a photopolymerization initiator, and a thermosetting agent.
- the elastic modulus at 25 ° C. of the B-staged adhesive is 5.0 ⁇ 10 2 Pa or more, 8.0 ⁇
- An inkjet light and a thermosetting adhesive that are 10 4 Pa or less are provided.
- the photocurable compound includes a photocurable compound having one photocurable reactive group, and a photocurable compound having two or more photocurable reactive groups. including.
- the photocurable reactive group of the photocurable compound having one photocurable reactive group is a (meth) acryloyl group
- the photocurable reactive group is The photocurable reactive group of the two photocurable compounds is a (meth) acryloyl group.
- the adhesive does not include or includes a light and a thermosetting compound, and the adhesive does not include the light and the thermosetting compound,
- the content of the photocurable compound having two or more photocurable reactive groups in the total 100% by weight of the photocurable compound is 0.1% by weight to 30% by weight, and the adhesive is the light And a thermosetting compound, the photocurable compound having two or more photocurable reactive groups in the total of the photocurable compound and the total of 100% by weight of the light and the thermosetting compound. Is not less than 0.1% by weight and not more than 30% by weight.
- the photocurable compound having one photocurable reactive group contains 2-ethylhexyl (meth) acrylate.
- the thermosetting compound includes a thermosetting compound having an epoxy group or a thiirane group.
- the adhesive includes light and a thermosetting compound.
- the thermosetting compound includes a thermosetting compound having an epoxy group or a thiirane group, and the light and the thermosetting compound have a (meth) acryloyl group. Includes light and thermosetting compounds.
- the light and thermosetting compound contains 4-hydroxybutyl (meth) acrylate glycidyl ether.
- the viscosity at 25 ° C. and 10 rpm measured in accordance with JIS K2283 is 5 mPa ⁇ s or more and 1600 mPa ⁇ s or less.
- the content of the solvent is 1% by weight or less.
- the content of the filler is 1% by weight or less.
- the above-described ink jet light and thermosetting adhesive are applied onto the surface of a semiconductor element mounting support member or semiconductor element using an ink jet apparatus, and an adhesive layer is formed.
- a method for manufacturing a semiconductor device comprising: a step of laminating semiconductor elements on the opposite surface; and a step of thermally curing the B-staged adhesive layer after the lamination of the semiconductor elements.
- the above-described inkjet light and a thermosetting adhesive are ejected to form an adhesive layer;
- a step of forming a B-staged adhesive layer by proceeding with curing of the adhesive layer by irradiation, and laminating a cover glass on the surface opposite to the semiconductor wafer side of the B-staged adhesive layer.
- the elastic modulus at 25 ° C. of the B-staged adhesive layer is 5.0 ⁇ 10 2 Pa or more and 8.0 ⁇ 10 4 Pa or less. .
- the ink jet device is connected to the ink tank in which the ink jet light and the thermosetting adhesive are stored, and is connected to the ink tank.
- a discharge portion for discharging the light for use and the thermosetting adhesive one end connected to the discharge portion, the other end connected to the ink tank, and the inside for the ink jet light and thermosetting
- the temperature of the circulated ink jet light and the thermosetting adhesive is 40 ° C. or higher and 100 ° C. or lower.
- a first electronic component main body, a second electronic component main body, an adhesive layer connecting the first electronic component main body and the second electronic component main body, and An electronic component is provided in which the adhesive layer is a cured product of the above-described ink jet light and thermosetting adhesive.
- the first electronic component main body is a supporting member or a semiconductor element for mounting a semiconductor element
- the second electronic component main body is a semiconductor element
- the inkjet light and thermosetting adhesive according to the present invention includes a photocurable compound, a thermosetting compound, a photopolymerization initiator, and a thermosetting agent, and the illuminance at 365 nm is 100 mW / cm 2 .
- the elastic modulus at 25 ° C. of the B-staged adhesive is 5.0 ⁇ 10 2 Pa.
- the thickness accuracy of the adhesive layer in which the adhesive is cured when the inkjet light and the thermosetting adhesive according to the present invention are applied using the inkjet apparatus is improved. It can raise and it can make it difficult to produce a void in an adhesive bond layer.
- FIG. 1 is a front cross-sectional view schematically showing an electronic component obtained using an inkjet light and a thermosetting adhesive according to an embodiment of the present invention.
- 2 (a) to 2 (e) are cross-sectional views for explaining each step of the method of manufacturing the electronic component shown in FIG.
- FIG. 3 is a schematic configuration diagram illustrating an example of an ink jet apparatus used in the method of manufacturing the electronic component illustrated in FIG.
- FIG. 4 is a schematic configuration diagram illustrating another example of an ink jet apparatus used in the method of manufacturing an electronic component illustrated in FIG.
- FIG. 5 is a front sectional view schematically showing a modification of the electronic component shown in FIG. FIG.
- FIG. 6 is a front cross-sectional view schematically showing a first modification of an electronic component obtained using the inkjet light and the thermosetting adhesive according to an embodiment of the present invention.
- FIG. 7 is a front cross-sectional view schematically showing a second modification of the electronic component obtained by using the inkjet light and the thermosetting adhesive according to one embodiment of the present invention.
- the inkjet light and thermosetting adhesive according to the present invention are applied and used using an inkjet apparatus.
- the adhesive according to the present invention is different from an adhesive applied by screen printing, an adhesive applied by a dispenser, and the like.
- the adhesive according to the present invention is used after being cured by light irradiation and heating.
- the adhesive according to the present invention is preferably used after being cured by heating and then cured by heating.
- the adhesive according to the present invention is a light and thermosetting adhesive, and has photocurability and thermosetting.
- the adhesive according to the present invention is different from an adhesive in which only photocuring is performed, an adhesive in which only thermosetting is performed, and the like.
- the adhesive according to the present invention includes a photocurable compound (a curable compound that can be cured by light irradiation), a thermosetting compound (a curable compound that can be cured by heating), a photopolymerization initiator, and thermosetting. Agent.
- the adhesive according to the present invention is irradiated with light having an integrated light amount of 1000 mJ / cm 2 so that the illuminance at 365 nm is 100 mW / cm 2 to obtain a B-staged adhesive.
- the elastic modulus at 25 ° C. of this B-staged adhesive is 5.0 ⁇ 10 2 Pa or more and 8.0 ⁇ 10 4 Pa or less.
- the illuminance is a value measured by “UIT-201” manufactured by USHIO.
- the adhesive according to the present invention has the above-described configuration, the adhesive and the thermosetting adhesive according to the present invention are applied using an ink jet apparatus and then cured.
- the thickness accuracy of the cured adhesive layer can be increased.
- voids can be made difficult to occur in the adhesive layer.
- a hygroscopic property and a thermal cycle characteristic can also be made favorable.
- the elastic modulus at 25 ° C. of the B-staged adhesive is preferably 5.0 ⁇ 10 2 Pa or more, more preferably 8.0 ⁇ 10 2 Pa or more, preferably 8.0 ⁇ 10 4 Pa or less, more preferably It is 5.0 ⁇ 10 4 Pa or less.
- the elastic modulus is equal to or higher than the lower limit, the movement of the semiconductor chip or the like hardly occurs.
- the elastic modulus is less than or equal to the above upper limit, the adhesive strength after bonding of semiconductor chips and the like becomes good, and the generation of voids is further suppressed.
- the elastic modulus is measured using a viscoelasticity measuring device ARES manufactured by TA Instruments Inc. at 25 ° C., a measuring plate: a parallel plate having a diameter of 8 mm, and a frequency of 1 Hz.
- the elastic modulus means storage elastic modulus (G ′).
- the viscosity of the adhesive at 25 ° C. and 10 rpm is preferably 3 mPa ⁇ s or more, more preferably 5 mPa ⁇ s or more, even more preferably 10 mPa ⁇ s or more, still more preferably 160 mPa ⁇ s or more, preferably 2000 mPa ⁇ s or less. More preferably, it is 1600 mPa * s or less, More preferably, it is 1500 mPa * s or less.
- the viscosity of the adhesive at 25 ° C. and 10 rpm is 160 mPa ⁇ s or more and 1600 mPa ⁇ s or less. It is particularly preferred.
- the viscosity is measured at 25 ° C. using an E-type viscometer (“TVE22L” manufactured by Toki Sangyo Co., Ltd.) in accordance with JIS K2283.
- E-type viscometer (“TVE22L” manufactured by Toki Sangyo Co., Ltd.) in accordance with JIS K2283.
- the method of manufacturing a semiconductor device includes applying an ink jet light and a thermosetting adhesive to an adhesive layer on a surface of a semiconductor element mounting support member or a semiconductor element using an ink jet device.
- a step of forming the B-staged adhesive layer by proceeding with curing of the adhesive layer by light irradiation, and the supporting member or the semiconductor element side of the B-staged adhesive layer A step of laminating a semiconductor element on the opposite surface, and a step of thermally curing the B-staged adhesive layer after the lamination of the semiconductor element.
- the manufacturing method of the semiconductor device includes a coating step of forming an adhesive layer on the surface of a semiconductor wafer by ejecting the inkjet light and the thermosetting adhesive using an inkjet device.
- a step of forming a B-staged adhesive layer by curing the adhesive layer by light irradiation, and a cover glass on the surface opposite to the semiconductor wafer side of the B-staged adhesive layer. Are laminated to obtain a laminate, a step of thermally curing the B-staged adhesive layer in the laminate, and a step of cutting the laminate after thermosetting.
- the adhesive according to the present invention is used, it is possible to increase the thickness accuracy of the adhesive layer and to make it difficult for voids to occur in the adhesive layer. Therefore, the adhesive according to the present invention can be suitably used in the method for manufacturing a semiconductor device according to the present invention.
- the adhesive is discharged in a state of being heated to 40 ° C. or higher and 100 ° C. or lower when discharged by the inkjet apparatus. From the viewpoint of forming the adhesive layer with higher accuracy and making it more difficult to generate voids in the adhesive layer, it is preferable to apply the ink-jet light and the thermosetting adhesive while circulating them.
- the ink jet device includes an ink tank that stores the adhesive, a discharge unit that is connected to the ink tank and discharges the adhesive, one end is connected to the discharge unit, and the other end It is preferable to have a circulation flow path portion connected to the ink tank and through which the adhesive flows.
- the adhesive When the adhesive is applied, after the adhesive is moved from the ink tank to the discharge part in the ink jet apparatus, the adhesive that has not been discharged from the discharge part is moved into the circulation channel part. Is applied to the ink tank while circulating the adhesive. If the adhesive is applied while being circulated, the effects of the present invention can be obtained more effectively. That is, it is possible to further increase the thickness accuracy of the adhesive layer and to further prevent voids in the adhesive layer.
- a thick adhesive layer can be formed with high accuracy.
- even a multi-layered adhesive layer can be formed finely and with high accuracy.
- FIG. 1 is a front cross-sectional view schematically showing an electronic component obtained by using an inkjet light and a thermosetting adhesive according to an embodiment of the present invention.
- An electronic component 1 shown in FIG. 1 includes a first electronic component body 2, an adhesive layer 3 disposed on the surface of the first electronic component body 2, and a first disposed on the surface of the adhesive layer 3. 2 electronic component main bodies 4.
- the second electronic component body 4 is disposed on the opposite side of the adhesive layer 3 from the first electronic component body 2 side. On the first surface of the adhesive layer 3, the first electronic component body 2 is disposed. On the second surface opposite to the first surface of the adhesive layer 3, the second electronic component body 4 is arranged.
- the adhesive layer 3 is an adhesive layer after light and heat curing, and is a cured adhesive layer (cured product layer).
- the inkjet light and the thermosetting adhesive according to an embodiment of the present invention are used. The ink jet light and the thermosetting adhesive are applied by using an ink jet apparatus, and after being cured by light irradiation, cured by heating to form the adhesive layer 3.
- the electronic component main body includes a circuit board, a semiconductor wafer, a semiconductor wafer after dicing (divided semiconductor wafer, semiconductor element), a cover glass, a capacitor, a diode, a printed board, a flexible printed board, and a glass epoxy.
- a substrate, a glass substrate, etc. are mentioned.
- the electronic component main body may be a support member for mounting a semiconductor element.
- the electronic component main body is preferably a circuit board, a cover glass, a semiconductor wafer, or a semiconductor wafer after dicing.
- the first electronic component body is preferably a support member or a semiconductor element for mounting a semiconductor element, and is preferably a circuit board or a semiconductor element. More preferably, it is a circuit substrate or a semiconductor wafer after dicing. Since the adhesive layer formed with high precision is particularly required, the second electronic component main body is preferably a semiconductor element, and more preferably a dicing semiconductor wafer.
- the first electronic component body is a circuit board or a semiconductor wafer after dicing
- the second electronic component body is a semiconductor wafer after dicing.
- the first electronic component body is a circuit board and the second electronic component body is a semiconductor wafer after dicing.
- the electronic component is preferably an electronic component for a semiconductor device.
- the electronic component preferably includes a semiconductor element, and is preferably a semiconductor device.
- an ink jet light and a thermosetting adhesive are applied on the first electronic component body 2 using an ink jet device 11 to form an adhesive layer 12.
- an adhesive is applied to the entire surface of the first electronic component main body 2. After application, the adhesive droplets mix with each other, resulting in the adhesive layer 12 in the state shown in FIG.
- the ink jet apparatus 11 includes an ink tank 21, a discharge part 22, and a circulation flow path part 23 inside.
- the circulation channel 23 has a buffer tank 23A and a pump 23B in the circulation channel 23.
- the circulation flow path portion 23X may not have a buffer tank and a pump in the circulation flow path portion 23X.
- the circulation channel section preferably has the buffer tank in the circulation channel section, and preferably has the pump.
- the circulation channel section may include a flow meter, a thermometer, a filter, a liquid level sensor, and the like in addition to the buffer tank and the pump in the circulation channel section.
- the ink tank 21 stores the adhesive.
- the adhesive is discharged from the discharge unit 22 (inkjet head).
- the discharge unit 22 includes a discharge nozzle.
- a discharge unit 22 is connected to the ink tank 21.
- the ink tank 21 and the ejection part 22 are connected via a flow path.
- One end of the circulation flow path portion 23 is connected to the ejection portion 22, and the other end is connected to the ink tank 21.
- the adhesive flows inside the circulation channel portion 23.
- the buffer tank 23 ⁇ / b> A or the pump 23 ⁇ / b> B is provided, the buffer tank 23 ⁇ / b> A and the pump 23 ⁇ / b> B are preferably disposed between the ejection unit 22 and the ink tank 21, respectively.
- the buffer tank 23A is disposed closer to the discharge unit 22 than the pump 23B.
- the pump 23B is disposed closer to the ink tank 21 than the buffer tank 23A.
- the adhesive is temporarily stored in the buffer tank 23A.
- Examples of the discharge unit include a thermal type, bubble jet type, electromagnetic valve type, or piezo type inkjet head.
- examples of the circulation flow path section in the discharge section include an end shooter type branching from a common circulation flow path (manifold) to the discharge nozzle and a side shooter type in which ink circulates through the discharge nozzle.
- the inkjet apparatus is an inkjet apparatus using a piezoelectric inkjet head, and the action of the piezoelectric element in the application process. It is preferable to apply the adhesive.
- the circulation channel section preferably includes a pump for transferring the adhesive into the circulation channel section.
- an appropriate pressure is maintained and that pressure fluctuation (pulsation) is small within the range.
- pulsation pressure fluctuation
- a pump or the like it is preferable to provide an attenuator between the pump and the discharge portion in order to suppress pump pulsation.
- an attenuator include a buffer tank in which the adhesive is temporarily stored and a membrane damper.
- the circulation flow path portion includes a buffer tank in which the adhesive is temporarily stored in the circulation flow path portion.
- the temperature of the adhesive can be adjusted by introducing a heater in the ink tank or using a heater in the circulation channel. Is possible.
- the temperature of the adhesive is adjusted by introducing a heater in the ink tank 21 or using a heater in the circulation flow path portions 23 and 23X. It is possible.
- the adhesive that has not been discharged from the discharge unit 22 is allowed to flow through the circulation channel 23.
- the ink tank 21 is moved. Accordingly, it is preferable to apply the adhesive while circulating the adhesive in the application step.
- the adhesive layer 12 is irradiated with light from the first light irradiation unit 13 and the curing of the adhesive layer 12 proceeds.
- First light irradiation step Thereby, the adhesive layer 12 ⁇ / b> A irradiated with light by the first light irradiation unit 13 is formed.
- the adhesive layer 12A is a pre-cured product and is a B-staged adhesive layer. It is preferable that the elastic modulus at 25 ° C. of the B-staged adhesive layer is 5.0 ⁇ 10 2 Pa or more and 8.0 ⁇ 10 4 Pa or less.
- the wavelength or irradiation intensity of light irradiated from the first light irradiation unit 13 and the light irradiated from the second light irradiation unit 14 to be described later may be the same or different. From the viewpoint of further improving the curability of the adhesive layer, it is preferable that the irradiation intensity irradiated from the second light irradiation unit 14 is stronger than the irradiation intensity of the light irradiated from the first light irradiation unit 13.
- “irradiating light to the adhesive layer 12 from the first light irradiation unit 13 to advance the curing of the adhesive layer 12” includes advancing the reaction to obtain a thickened state.
- the light irradiation apparatus is not particularly limited, and examples thereof include a light emitting diode (UV-LED) that generates ultraviolet rays, a metal halide lamp, a high pressure mercury lamp, and an ultrahigh pressure mercury lamp. From the viewpoint of further improving the formation accuracy of the adhesive layer, it is particularly preferable to use a UV-LED for the first light irradiation section.
- UV-LED light emitting diode
- the second light irradiation unit 14 which is different from the first light irradiation unit 13
- the adhesive layer 12A irradiated with light from the light irradiation unit 13 may be irradiated with light to further cure the adhesive layer 12A (second light irradiation step).
- the adhesive layer 12 ⁇ / b> B irradiated with light by the second light irradiation unit 14 is formed.
- the adhesive layer 12B is a pre-cured product and is a B-staged adhesive layer.
- the B-staged adhesive layer after the second light irradiation step and the B-staged adhesive layer after the first light irradiation the B-staged adhesive after the first light irradiation.
- the elastic modulus at 25 ° C. of the surface of the layer is preferably 5.0 ⁇ 10 2 Pa or more and 8.0 ⁇ 10 4 Pa or less.
- the elastic modulus at 25 ° C. of both surfaces of the B-staged adhesive layer after the second light irradiation step and the B-staged adhesive layer after the first light irradiation is 5.0 ⁇ 10 2. It is more preferable to set it to Pa or more and 8.0 ⁇ 10 4 Pa or less.
- the second light irradiation step is preferably performed before the laminating step described later, and is preferably performed before the heating step. From the viewpoint of forming the cured adhesive layer with higher accuracy, the second light irradiation step is preferably performed. However, the second light irradiation step is not necessarily performed, and a laminating step described later may be performed after the first light irradiation step without performing the second light irradiation step.
- the second electronic component body 4 is disposed on the adhesive layer 12B irradiated with light.
- the first electronic component main body 2 and the second electronic component main body 4 are bonded together by applying pressure through the adhesive layer 12B irradiated with light to obtain a primary laminate 1A (lamination step).
- the second electronic component body 4 is disposed on the adhesive layer 12A irradiated with light, and the second light irradiation step is performed.
- the first electronic component body 2 and the second electronic component body 4 are bonded together by applying pressure through the adhesive layer 12A irradiated with light to obtain a primary laminate (lamination step).
- the primary laminate 1A is heated to cure the adhesive layer 12B between the first electronic component body 2 and the second electronic component body 4 to obtain an electronic component. (Heating step). In this way, the electronic component 1 shown in FIG. 1 can be obtained.
- the adhesive layer may be multilayered by repeating the coating step and the first light irradiation step to form a multilayer adhesive layer.
- an electronic component 31 including an adhesive layer 32 in which a plurality of adhesive layers 32A, 32B, and 32C are stacked may be obtained.
- the temperature of the circulating adhesive is preferably from the viewpoint of improving the dischargeability and transportability of the adhesive and forming the cured adhesive layer with higher accuracy. 30 ° C or higher, more preferably 40 ° C or higher, preferably 120 ° C or lower, more preferably 100 ° C or lower.
- the pressure applied at the time of bonding is preferably 0.01 MPa or more, more preferably 0.05 MPa or more, preferably 10 MPa or less, in the above-described lamination step. Preferably it is 8 MPa or less.
- the temperature at the time of bonding is preferably 30 ° C. or higher, more preferably 40 ° C. or higher, preferably 150 ° C. or lower, more preferably, in the laminating step. It is 130 degrees C or less.
- the above adhesive has photocurability and thermosetting.
- the adhesive includes a photocurable compound, a thermosetting compound, a photopolymerization initiator, and a thermosetting agent.
- the adhesive preferably contains light and a thermosetting compound (a curable compound that can be cured by both light irradiation and heating).
- the adhesive preferably contains a curing accelerator.
- the photocurable compound is a compound having a photocurable reactive group.
- the photocurable compound include a curable compound having a (meth) acryloyl group, a curable compound having a vinyl group, and a curable compound having a maleimide group.
- the photocurable reactive group of the photocurable compound is preferably a (meth) acryloyl group, and the photocurable compound is ( It preferably has a (meth) acryloyl group (one or more).
- the photocurable compound only 1 type may be used and 2 or more types may be used together.
- the curable compound having a (meth) acryloyl group means a compound having at least one of a methacryloyl group and an acryloyl group.
- a polyfunctional compound (photoreactive compound) (A1) having two or more photocurable reactive groups may be used, and a monofunctional compound (photoreaction) having one photocurable reactive group. (A2) may be used.
- the photocurable reactive group of the polyfunctional compound (A1) is preferably a (meth) acryloyl group.
- the photocurable reactive group of the monofunctional compound (A2) is preferably a (meth) acryloyl group.
- the adhesive contains, as the photocurable compound, a monofunctional compound (A2) having one (meth) acryloyl group and (meth) acryloyl. It is preferable to include a polyfunctional compound (A1) having two or more groups.
- Examples of the polyfunctional compound (A1) include (meth) acrylic acid adducts of polyhydric alcohols, (meth) acrylic acid adducts of alkylene oxide modified products of polyhydric alcohols, urethane (meth) acrylates, and polyesters (meta ) Acrylates and the like.
- Examples of the polyhydric alcohol include diethylene glycol, triethylene glycol, polyethylene glycol, dipropylene glycol, tripropylene glycol, polypropylene glycol, trimethylol propane, cyclohexane dimethanol, tricyclodecane dimethanol, an alkylene oxide adduct of bisphenol A, and Examples include pentaerythritol.
- the polyfunctional compound (A1) may be a bifunctional (meth) acrylate, a trifunctional methacrylate, or a tetrafunctional or higher (meth) acrylate.
- bifunctional (meth) acrylate examples include 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanedi (meth) acrylate, 1,10- Decanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 2,4-dimethyl-1,5-pentanediol di (meth) acrylate, butylethylpropanediol (meth) acrylate, ethoxylated cyclohexanemethanol di ( (Meth) acrylate, polyethylene glycol di (meth) acrylate, oligoethylene glycol di (meth) acrylate, ethylene glycol di (meth) acrylate, 2-ethyl-2-butylbutanediol di (meth) acrylate, 2-ethyl-2- Butyl
- trifunctional (meth) acrylates include trimethylolpropane tri (meth) acrylate, trimethylolethane tri (meth) acrylate, trimethylolpropane alkylene oxide-modified tri (meth) acrylate, and pentaerythritol tri (meth) acrylate.
- tetrafunctional (meth) acrylate examples include pentaerythritol tetra (meth) acrylate, sorbitol tetra (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, and dipentaerythritol tetra (meth) acrylate propionate. It is done.
- pentafunctional (meth) acrylates examples include sorbitol penta (meth) acrylate and dipentaerythritol penta (meth) acrylate.
- hexafunctional (meth) acrylates examples include dipentaerythritol hexa (meth) acrylate, sorbitol hexa (meth) acrylate, and phosphazene alkylene oxide-modified hexa (meth) acrylate.
- (meth) acrylate indicates acrylate or methacrylate.
- (meth) acryl refers to acryl or methacryl.
- the polyfunctional compound (A1) is preferably a polyfunctional compound (A1) having a polycyclic skeleton or a urethane skeleton and having two or more (meth) acryloyl groups.
- the polyfunctional compound (A1) may have a polycyclic skeleton or a urethane skeleton.
- the polyfunctional compound (A1) is not particularly limited as long as it has a polycyclic skeleton or a urethane skeleton and two or more (meth) acryloyl groups.
- the polyfunctional compound (A1) a conventionally known polyfunctional compound having a polycyclic skeleton or a urethane skeleton and having two or more (meth) acryloyl groups can be used. Since the polyfunctional compound (A1) has two or more (meth) acryloyl groups, the polymerization proceeds and is cured by light irradiation.
- the said polyfunctional compound (A1) only 1 type may be used and 2 or more types may be used together.
- the polyfunctional compound having a polycyclic skeleton and having two or more (meth) acryloyl groups include tricyclodecane dimethanol di (meth) acrylate, isobornyldimethanol di (meth) acrylate, and di And cyclopentenyl dimethanol di (meth) acrylate.
- the said polyfunctional compound (A1) is tricyclodecane dimethanol di (meth) acrylate from a viewpoint of improving the heat-and-moisture resistance of hardened
- the “polycyclic skeleton” in the polyfunctional compound (A1) and the monofunctional compound (A2) described later refers to a structure having a plurality of cyclic skeletons continuously.
- the polycyclic skeleton is a skeleton in which two or more rings are integrated in a form sharing two or more atoms, and has a condensed ring.
- the polycyclic skeleton is not a skeleton in which an alkylene group is present between two rings, for example.
- Examples of the polycyclic skeleton in the polyfunctional compound (A1) and the monofunctional compound (A2) include a polycyclic alicyclic skeleton and a polycyclic aromatic skeleton.
- polycyclic alicyclic skeleton examples include a bicycloalkane skeleton, a tricycloalkane skeleton, a tetracycloalkane skeleton, and an isobornyl skeleton.
- polycyclic aromatic skeleton examples include naphthalene ring skeleton, anthracene ring skeleton, phenanthrene ring skeleton, tetracene ring skeleton, chrysene ring skeleton, triphenylene ring skeleton, tetraphen ring skeleton, pyrene ring skeleton, pentacene ring skeleton, picene ring skeleton and Examples include perylene ring skeletons.
- the photocurable compound preferably contains a photocurable compound having a dicyclopentadiene skeleton.
- the polyfunctional compound having a urethane skeleton and two or more (meth) acryloyl groups is not particularly limited, and can be obtained by, for example, the following method.
- a polyol and a bifunctional or higher functional isocyanate are reacted, and the remaining isocyanate group is further reacted with a (meth) acryl monomer having an alcohol or an acid group.
- 1 mol of trimethylolpropane and 3 mol of isophorone diisocyanate are reacted under a tin-based catalyst.
- the urethane-modified (meth) acrylic compound is obtained by reacting the isocyanate group remaining in the obtained compound with hydroxyethyl acrylate, which is an acrylic monomer having a 2-mol hydroxyl group.
- the polyol is not particularly limited, and examples thereof include ethylene glycol, glycerin, sorbitol, trimethylolpropane, and (poly) propylene glycol.
- the isocyanate is not particularly limited as long as it is bifunctional or higher.
- examples of the isocyanate include isophorone diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, diphenylmethane-4,4′-diisocyanate (MDI), and hydrogenated MDI.
- Polymeric MDI 1,5-naphthalene diisocyanate, norbornane diisocyanate, tolidine diisocyanate, xylylene diisocyanate (XDI), hydrogenated XDI, lysine diisocyanate, triphenylmethane triisocyanate, tris (isocyanatophenyl) thiophosphate, tetramethylxylene Examples thereof include diisocyanate and 1,6,10-undecane triisocyanate.
- the monofunctional compound (A2) include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, i-propyl (meth) acrylate, n-butyl (meth) acrylate, i -Butyl (meth) acrylate, sec-butyl (meth) acrylate, t-butyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, allyl (meth) acrylate, benzyl (meth) acrylate, cyclohexyl (meth) acrylate, phenyl (meth) Chryrate, 2-methoxyethyl
- Examples of the compound having a vinyl group include vinyl ethers, ethylene derivatives, styrene, chloromethylstyrene, ⁇ -methylstyrene, maleic anhydride, dicyclopentadiene, N-vinylpyrrolidone, N-vinylformamide, and the like.
- the compound having a maleimide group is not particularly limited.
- the photocurable compound includes a photocurable compound having two or more photocurable reactive groups. It is preferable.
- the photocurable compound contains a photocurable compound having one photocurable reactive group. It is preferable that it contains a photocurable compound having one photocurable reactive group and a photocurable compound having two or more photocurable reactive groups.
- the photocurable reactive group is preferably a group containing a polymerizable unsaturated double bond, and more preferably a (meth) acryloyl group.
- the photocurable compound having one photocurable reactive group preferably contains 2-ethylhexyl (meth) acrylate.
- the content of the photocurable compound is preferably 10% by weight or more, more preferably 20% by weight or more, in 100% by weight of the adhesive. Preferably it is 80 weight% or less, More preferably, it is 70 weight% or less. From the viewpoint of further increasing the thickness accuracy of the adhesive layer and further making it difficult for voids to be generated in the adhesive layer, the content of the photocurable compound in 100% by weight of the adhesive is 10% by weight or more, It is particularly preferable that it is 80% by weight or less.
- the photocurable compound described above is used when the adhesive does not contain the light and thermosetting compounds described below.
- the photocurable property is 100% by weight.
- the content of the photocurable compound having two or more reactive groups is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, preferably 100% by weight (total amount) or less, more preferably 30% by weight. Hereinafter, it is further preferably 20% by weight or less.
- the photocurable compound described above is used when the adhesive does not contain the light and thermosetting compounds described below.
- the photocurable property is 100% by weight.
- the content of the photocurable compound having one reactive group is preferably 1% by weight or more, more preferably 10% by weight or more, preferably 100% by weight (total amount) or less, more preferably 99% by weight or less, still more preferably. 90% by weight or less.
- the adhesive contains light and a thermosetting compound. It is preferable.
- the light and thermosetting compounds include compounds having various photocurable functional groups (photocurable reactive groups) and various thermosetting functional groups. From the viewpoint of forming the cured adhesive layer with higher accuracy, the photocurable reactive group of the light and thermosetting compound is preferably a (meth) acryloyl group.
- the light and thermosetting compound preferably has a (meth) acryloyl group and a cyclic ether group or a cyclic thioether group, and (meth) It preferably has an acryloyl group and a cyclic ether group, and preferably has a (meth) acryloyl group and an epoxy group.
- the light and thermosetting compound may have a cyclic thioether group. As for the said light and a thermosetting compound, only 1 type may be used and 2 or more types may be used together.
- the light and thermosetting compound is not particularly limited, and examples thereof include a compound having a (meth) acryloyl group and an epoxy group, a partial (meth) acrylate of an epoxy compound, and a urethane-modified (meth) acryl epoxy compound.
- Examples of the compound having the (meth) acryloyl group and the epoxy group include glycidyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate glycidyl ether.
- the partial (meth) acrylated product of the epoxy compound can be obtained by reacting an epoxy compound and (meth) acrylic acid in the presence of a catalyst according to a conventional method.
- the epoxy compound that can be used for the partial (meth) acrylate of the epoxy compound include novolac-type epoxy compounds and bisphenol-type epoxy compounds.
- the novolak type epoxy compound include a phenol novolak type epoxy compound, a cresol novolak type epoxy compound, a biphenyl novolak type epoxy compound, a trisphenol novolak type epoxy compound, a dicyclopentadiene novolak type epoxy compound, and the like.
- the bisphenol type epoxy compound examples include a bisphenol A type epoxy compound, a bisphenol F type epoxy compound, a 2,2′-diallyl bisphenol A type epoxy compound, a hydrogenated bisphenol type epoxy compound, and a polyoxypropylene bisphenol A type epoxy compound. Can be mentioned.
- an epoxy compound having a desired acrylate ratio can be obtained.
- the blending amount of the carboxylic acid with respect to 1 equivalent of epoxy group is preferably 0.1 equivalent or more, more preferably 0.2 equivalent or more, preferably 0.7 equivalent or less, more preferably 0.5 equivalent or less.
- the urethane-modified (meth) acrylic epoxy compound is obtained, for example, by the following method.
- a polyol and a bifunctional or higher functional isocyanate are reacted, and the remaining isocyanate group is reacted with a (meth) acryl monomer having an acid group and glycidol.
- a (meth) acryl monomer having a hydroxyl group in a bifunctional or higher isocyanate and glycidol may be reacted without using a polyol.
- the urethane-modified (meth) acryl epoxy compound can be obtained by reacting glycidol with a (meth) acrylate monomer having an isocyanate group.
- urethane-modified (meth) acrylic epoxy compound is obtained by reacting the isocyanate group remaining in the obtained compound with hydroxyethyl acrylate which is an acrylic monomer having a hydroxyl group and glycidol which is an epoxy having a hydroxyl group.
- the polyol is not particularly limited, and examples thereof include ethylene glycol, glycerin, sorbitol, trimethylolpropane, and (poly) propylene glycol.
- the isocyanate is not particularly limited as long as it is bifunctional or higher.
- examples of the isocyanate include isophorone diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, diphenylmethane-4,4′-diisocyanate (MDI), and hydrogenated MDI.
- Polymeric MDI 1,5-naphthalene diisocyanate, norbornane diisocyanate, tolidine diisocyanate, xylylene diisocyanate (XDI), hydrogenated XDI, lysine diisocyanate, triphenylmethane triisocyanate, tris (isocyanatophenyl) thiophosphate, tetramethylxylene Examples thereof include diisocyanate and 1,6,10-undecane triisocyanate.
- the compound having the (meth) acryloyl group and the cyclic thioether group can be obtained, for example, by converting the epoxy group of the compound having the (meth) acryloyl group and the epoxy group into a cyclic thioether group.
- a solution containing the compound having the (meth) acryloyl group and the epoxy group is continuously or intermittently added to the first solution containing the sulfurizing agent, and then the sulfurizing agent is added.
- the method of further adding the 2nd solution containing continuously or intermittently is preferable.
- the epoxy group can be converted into a cyclic thioether group.
- sulfurizing agent examples include thiocyanates, thioureas, phosphine sulfide, dimethylthioformamide, N-methylbenzothiazole-2-thione, and the like.
- thiocyanates examples include sodium thiocyanate, potassium thiocyanate, and sodium thiocyanate.
- the light and thermosetting compound preferably includes 4-hydroxybutyl (meth) acrylate glycidyl ether, and includes 4-hydroxybutyl acrylate glycidyl ether. It is more preferable.
- the content of the light and thermosetting compound is preferably 0.5% by weight or more, more preferably 1% in 100% by weight of the adhesive. % By weight or more, preferably 80% by weight or less, more preferably 70% by weight or less.
- the total content of the photocurable compound and the light and thermosetting compound is preferably 10% in 100% by weight of the adhesive. % Or more, more preferably 20% by weight or more, preferably 80% by weight or less, more preferably 70% by weight or less.
- thermosetting compound examples include a thermosetting compound having a cyclic ether group, a thermosetting compound having a thiirane group, and the like. From the viewpoint of forming a cured adhesive layer with higher accuracy, the thermosetting compound is preferably a thermosetting compound having a cyclic ether group or a thiirane group, and a heat having an epoxy group or a thiirane group. A curable compound is more preferable, a thermosetting compound having a cyclic ether group is also preferable, and a thermosetting compound (epoxy compound) having an epoxy group is particularly preferable.
- the thermosetting compound may be a thermosetting compound having a thiirane group.
- thermosetting compound is a thermosetting compound having an epoxy group or a thiirane group, and the light and the thermosetting compound are (meth) A light and thermosetting compound having an acryloyl group is preferred.
- the said thermosetting compound only 1 type may be used and 2 or more types may be used together.
- the epoxy compound is not particularly limited, and examples thereof include novolac type epoxy compounds and bisphenol type epoxy compounds.
- the novolak type epoxy compound include a phenol novolak type epoxy compound, a cresol novolak type epoxy compound, a biphenyl novolak type epoxy compound, a trisphenol novolak type epoxy compound, a dicyclopentadiene novolak type epoxy compound, and the like.
- the bisphenol type epoxy compound include a bisphenol A type epoxy compound, a bisphenol F type epoxy compound, a 2,2′-diallyl bisphenol A type epoxy compound, a hydrogenated bisphenol type epoxy compound, and a polyoxypropylene bisphenol A type epoxy compound. Can be mentioned.
- examples of the epoxy compound include a cycloaliphatic epoxy compound and glycidylamine.
- the thermosetting compound having the thiirane group can be obtained, for example, by converting the epoxy group of the epoxy compound having the epoxy group into a thiirane group.
- a solution containing an epoxy compound having an epoxy group is continuously or intermittently added to a first solution containing a sulfurizing agent, and then a second solution containing a sulfurizing agent is added.
- the method of further adding continuously or intermittently is preferable.
- the epoxy group can be converted into a thiirane group.
- sulfurizing agent examples include thiocyanates, thioureas, phosphine sulfide, dimethylthioformamide, N-methylbenzothiazole-2-thione, and the like.
- thiocyanates examples include sodium thiocyanate, potassium thiocyanate, and sodium thiocyanate.
- thermosetting compound preferably has an aromatic skeleton.
- the content of the thermosetting compound is preferably 10% by weight or more, more preferably 20% by weight or more, in 100% by weight of the adhesive. Preferably it is 80 weight% or less, More preferably, it is 70 weight% or less.
- photopolymerization initiator examples include a photoradical polymerization initiator and a photocationic polymerization initiator.
- the photopolymerization initiator is preferably a photoradical polymerization initiator.
- the said photoinitiator only 1 type may be used and 2 or more types may be used together.
- the photo radical polymerization initiator is not particularly limited.
- the photo radical polymerization initiator is a compound for generating radicals upon light irradiation and initiating a radical polymerization reaction.
- Specific examples of the photo radical polymerization initiator include, for example, benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; 2-hydroxy-2-methyl-1-phenyl-propan-1-one
- An acetophenone compound such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone; 2-methyl-1- [4- ( Methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, 2-benzyl-2-di
- a photopolymerization initiation assistant may be used together with the photoradical polymerization initiator.
- the photopolymerization initiation assistant include N, N-dimethylaminobenzoic acid ethyl ester, N, N-dimethylaminobenzoic acid isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine, and triethanolamine.
- Photopolymerization initiation assistants other than these may be used.
- the said photoinitiation adjuvant only 1 type may be used and 2 or more types may be used together.
- a titanocene compound such as CGI-784 (manufactured by Ciba Specialty Chemicals) having absorption in the visible light region may be used to promote the photoreaction.
- the photocationic polymerization initiator is not particularly limited, and examples thereof include sulfonium salts, iodonium salts, metallocene compounds, and benzoin tosylate. As for the said photocationic polymerization initiator, only 1 type may be used and 2 or more types may be used together.
- the content of the photopolymerization initiator is preferably 0.1% by weight or more, more preferably 0.2% by weight or more, preferably 10% by weight or less, more preferably 5% by weight or less. It is.
- thermosetting agent examples include organic acids, amine compounds, amide compounds, hydrazide compounds, imidazole compounds, imidazoline compounds, phenol compounds, urea compounds, polysulfide compounds, and acid anhydrides.
- a modified polyamine compound such as an amine-epoxy adduct may be used as the thermosetting agent.
- Thermosetting agents other than these may be used. As for the said thermosetting agent, only 1 type may be used and 2 or more types may be used together.
- the above amine compound means a compound having one or more primary to tertiary amino groups.
- examples of the amine compound include (1) aliphatic polyamines, (2) alicyclic polyamines, (3) aromatic polyamines, (4) hydrazides, and (5) guanidine derivatives.
- epoxy compound-added polyamine reaction product of epoxy compound and polyamine
- Michael addition polyamine reaction product of ⁇ , ⁇ -unsaturated ketone and polyamine
- Mannich addition polyamine condensate of polyamine, formalin and phenol
- thiourea Adducts such as addition polyamine (reaction product of thiourea and polyamine) and ketone-capped polyamine (reaction product of ketone compound and polyamine [ketimine]) may also be used.
- Examples of the (1) aliphatic polyamine include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, and diethylaminopropylamine.
- Examples of (2) alicyclic polyamines include mensendiamine, isophoronediamine, N-aminoethylpiperazine, 3,9-bis (3-aminopropyl) -2,4,8,10-tetraoxaspiro (5, 5) Undecane adduct, bis (4-amino-3-methylcyclohexyl) methane, bis (4-aminocyclohexyl) methane and the like.
- Examples of the (3) aromatic polyamine include m-phenylenediamine, p-phenylenediamine, o-xylenediamine, m-xylenediamine, p-xylenediamine, 4,4-diaminodiphenylmethane, 4,4-diaminodiphenylpropane, 4,4-diaminodiphenylsulfone, 4,4-diaminodicyclohexane, bis (4-aminophenyl) phenylmethane, 1,5-diaminonaphthalene, 1,1-bis (4-aminophenyl) cyclohexane, 2,2- Bis [(4-aminophenoxy) phenyl] propane, bis [4- (4-aminophenoxy) phenyl] sulfone, 1,3-bis (4-aminophenoxy) benzene, 4,4-methylene-bis (2-chloro) Aniline) and 4,4
- Examples of (4) hydrazide include carbodihydrazide, adipic acid dihydrazide, sebacic acid dihydrazide, dodecanedioic acid dihydrazide, and isophthalic acid dihydrazide.
- guanidine derivatives include dicyandiamide, 1-o-tolyldiguanide, ⁇ -2,5-dimethylguanide, ⁇ , ⁇ -diphenyldiguanide, ⁇ , ⁇ -bisguanylguanidinodiphenyl ether, p-chlorophenyldiguanide, Examples include ⁇ , ⁇ -hexamethylenebis [ ⁇ - (p-chlorophenol)] diguanide, phenyldiguanide oxalate, acetylguanidine, and diethylcyanoacetylguanidine.
- Examples of the phenol compound include polyhydric phenol compounds.
- Examples of the polyhydric phenol compound include phenol, cresol, ethylphenol, butylphenol, octylphenol, bisphenol A, tetrabromobisphenol A, bisphenol F, bisphenol S, 4,4′-biphenylphenol, naphthalene skeleton-containing phenol novolac resin, Examples thereof include a xylylene skeleton-containing phenol novolak resin, a dicyclopentadiene skeleton-containing phenol novolak resin, and a fluorene skeleton-containing phenol novolak resin.
- Examples of the acid anhydride include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, dodecyl succinic anhydride, chlorendic acid, pyromellitic anhydride, Examples include benzophenone tetracarboxylic acid anhydride, methylcyclohexene tetracarboxylic acid anhydride, trimellitic anhydride, and polyazeline acid anhydride.
- the content of the thermosetting agent is preferably 1% by weight or more, more preferably 5% by weight or more, preferably 60% by weight or less, more preferably 50% by weight or less.
- curing accelerator examples include tertiary amines, imidazoles, quaternary ammonium salts, quaternary phosphonium salts, organometallic salts, phosphorus compounds, urea compounds, and the like.
- the content of the curing accelerator is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, preferably 10% by weight or less, more preferably 5% by weight or less. is there.
- the adhesive does not contain or contains a solvent.
- the said adhesive agent may contain the solvent and does not need to contain it. From the viewpoint of further increasing the thickness accuracy of the adhesive layer and further making it difficult for voids to be generated in the adhesive layer, the lower the solvent content in the adhesive, the better.
- Examples of the solvent include water and organic solvents. Among these, an organic solvent is preferable from the viewpoint of further improving the removability of the residue.
- Examples of the organic solvent include alcohols such as ethanol, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene, cellosolve, methyl cellosolve, butyl cellosolve, carbitol, and methylcarbitol.
- glycol ethers such as tripropylene glycol monomethyl ether, ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol A
- the content of the solvent in 100% by weight of the adhesive is preferably 5% by weight or less, more preferably 1% by weight or less, and further preferably 0.5% by weight or less. It is.
- the adhesive does not contain or contains a filler.
- the adhesive may or may not contain a filler. From the viewpoint of further increasing the thickness accuracy of the adhesive layer and further making it difficult for voids to occur in the adhesive layer, the smaller the filler content in the adhesive, the better. Furthermore, the smaller the filler content in the adhesive, the lower the occurrence of ejection failure by the ink jet apparatus.
- filler examples include silica, talc, clay, mica, hydrotalcite, alumina, magnesium oxide, aluminum hydroxide, aluminum nitride, and boron nitride.
- the content of the filler in 100% by weight of the adhesive is preferably 5% by weight or less, more preferably 1% by weight or less, and further preferably 0.5% by weight or less. It is.
- the adhesive may contain other components. Although it does not specifically limit as another component, Adhesion adjuvants, such as a coupling agent, a pigment, dye, a leveling agent, an antifoamer, a polymerization inhibitor, etc. are mentioned.
- FIG. 6 is a front cross-sectional view schematically showing a first modification of an electronic component obtained by using the inkjet light and the thermosetting adhesive according to an embodiment of the present invention.
- the semiconductor device 71 shown in FIG. 6 is an electronic component.
- the semiconductor device 71 includes a substrate 53A, an adhesive layer 72, and a first semiconductor wafer 73.
- the substrate 53A has a first connection terminal 53a on the upper surface.
- the first semiconductor wafer 73 has connection terminals 73a on the upper surface.
- the substrate 53A is formed in the same manner as the substrate 53 described later except that the second connection terminal 53b is not provided.
- a first semiconductor wafer 73 is laminated on the substrate 53A via an adhesive layer 72.
- the adhesive layer 72 is formed by photocuring and thermosetting the adhesive.
- the adhesive layer 72 is a cured product of the above adhesive.
- the first semiconductor wafer 73 has connection terminals 73a on the upper surface.
- a wiring 74 is drawn from the connection terminal 73a. By the wiring 74, the connection terminal 73a and the first connection terminal 53a are electrically connected.
- FIG. 7 is a front cross-sectional view schematically showing a second modification of the electronic component obtained using the inkjet light and the thermosetting adhesive according to one embodiment of the present invention.
- the semiconductor device 51 shown in FIG. 7 is an electronic component.
- the semiconductor device 51 includes a laminated structure 52.
- the laminated structure 52 includes a substrate 53, an adhesive layer 54, and a second semiconductor wafer 55 laminated on the substrate 53 via the adhesive layer 54.
- a second semiconductor wafer 55 is disposed on the substrate 53.
- the second semiconductor wafer 55 is indirectly laminated.
- the substrate 53 is larger than the second semiconductor wafer 55 in plan view.
- the substrate 53 has a region projecting laterally from the second semiconductor wafer 55.
- the adhesive layer 54 is formed, for example, by curing a curable composition.
- the curable composition layer using the curable composition before hardening may have adhesiveness.
- a curable composition sheet may be used.
- the substrate 53 has a first connection terminal 53a on the upper surface.
- the second semiconductor wafer 55 has connection terminals 55a on the upper surface.
- a wiring 56 is drawn from the connection terminal 55a.
- One end of the wiring 56 is connected to a connection terminal 55 a provided on the second semiconductor wafer 55.
- the other end of the wiring 56 is connected to a first connection terminal 53 a provided on the substrate 53.
- the wiring 56 is preferably a bonding wire.
- the first semiconductor wafer 62 is laminated on the second semiconductor wafer 55 in the laminated structure 52 via the adhesive layer 61.
- the adhesive layer 61 is formed by photocuring and thermosetting the adhesive.
- the adhesive layer 61 is a cured product of the above adhesive.
- the substrate 53 has a second connection terminal 53b on the upper surface.
- the first semiconductor wafer 62 has connection terminals 62a on the upper surface.
- a wiring 63 is drawn from the connection terminal 62a. One end of the wiring 63 is connected to a connection terminal 62 a provided on the first semiconductor wafer 62. The other end of the wiring 63 is connected to a second connection terminal 53 b provided on the substrate 53.
- the connection terminal 62 a and the second connection terminal 53 b are electrically connected by the wiring 63.
- the other end of the wiring 63 may be connected to a connection terminal other than the second connection terminal 53b.
- the wiring 63 is preferably a bonding wire.
- the adhesive layer 61 is obtained by discharging a liquid adhesive having photocurability and thermosetting property from the ink jet device onto the second semiconductor wafer 55 to form the adhesive layer 61. Can do.
- the semiconductor device 71 is obtained by forming an adhesive layer 72 on the substrate 53A by ejecting a liquid adhesive having photocurability and thermosetting property from the ink jet device. be able to.
- a second solution in which 20 g of potassium thiocyanate was dissolved in a solution containing 100 mL of pure water and 100 mL of ethanol was prepared.
- the obtained second solution was added to the obtained epoxy compound-containing mixed solution at a rate of 5 mL / min, and then stirred for 30 minutes.
- a second solution in which 20 g of potassium thiocyanate is dissolved in a solution containing 100 mL of pure water and 100 mL of ethanol is further prepared, and the second solution is further added to the container at a rate of 5 mL / min. And stirred for 30 minutes. Thereafter, the temperature in the container was cooled to 10 ° C., and stirred for 2 hours to be reacted.
- Example 1 (Preparation of adhesive A) 2 parts by weight of tricyclodecane dimethanol diacrylate (“IRR-214K” manufactured by Daicel Ornex Co., Ltd.) as a photocurable compound, 11 parts by weight of lauryl acrylate (“LA” manufactured by Kyoeisha Chemical Co., Ltd.), light and thermosetting 41 parts by weight of 4-hydroxybutyl acrylate glycidyl ether (“4HBAGE” manufactured by Nippon Kasei Co., Ltd.) as the compound, 20 parts by weight of bisphenol A type epoxy resin (“YD-127” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) as the thermosetting compound, 20 parts by weight of an acid anhydride having a terpene skeleton (“YH306” manufactured by Mitsubishi Chemical Co., Ltd.) as a thermosetting agent, 1 part by weight of DBU-octylate (“UCAT SA-102” manufactured by San Apro) as a curing accelerator, and light 2-Benzyl
- Adhesives B to S were prepared in the same manner as in the preparation of the adhesive A, except that the components shown in Table 1 below were added in the amounts shown in Tables 2 and 3 below.
- Viscosity exceeds 1600 mPa ⁇ s
- B Viscosity exceeds 1000 mPa ⁇ s
- C Viscosity exceeds 500 mPa ⁇ s, 1000 mPa ⁇ s or less
- D Viscosity is 160 mPa ⁇ s or more, 500 mPa ⁇ s or less
- E Viscosity is 5 mPa ⁇ s or more and less than 160 mPa ⁇ s
- Viscosity is less than 5 mPa ⁇ s
- an adhesive layer having a thickness of 30 ⁇ m was formed and photocured in the second light irradiation step (ultra-high pressure mercury lamp, 100 mW / cm 2 , 10 seconds).
- a die-bonding apparatus was used to laminate a silicon bare chip as a semiconductor chip (vertical 10 mm ⁇ width 10 mm ⁇ thickness 80 ⁇ m) at 110 ° C. and 0.2 MPa, thereby obtaining a laminate. .
- After stacking the silicon bare chips it was confirmed using an optical microscope (“Digital Microscope VH-Z100” manufactured by Keyence Corporation) that the protrusion of the adhesive layer was less than 100 ⁇ m.
- the obtained laminated body was put in an oven at 160 ° C. and heated for 3 hours to be thermally cured, thereby obtaining 90 semiconductor devices (laminated structure).
- the voids of the adhesive layer in the obtained semiconductor device were observed and evaluated according to the following criteria.
- a cold cycle test was conducted in which the process of holding at 5 minutes and then lowering the temperature to ⁇ 50 ° C. was 1 cycle. Take out the semiconductor device after 250, 500 and 1000 cycles, and observe the peeling of the adhesive layer of the semiconductor device using an ultrasonic exploration imaging device (“mi-scope hyper II” manufactured by Hitachi Construction Machinery Finetech). The evaluation was based on the following criteria.
- the details of the blending components used are shown in Table 1 below, and the compositions and results are shown in Tables 2 and 3 below.
- the blending unit of the blending component is parts by weight.
- the integrated light amount is 1000 mJ / cm 2 in the entire adhesive layer at the B stage.
- the same evaluation was performed for light irradiation. As a result, the same results as those shown in Tables 1 and 2 were obtained.
- Adhesive layer (after heating) DESCRIPTION OF SYMBOLS 51,71 ...
- Semiconductor device 52 ... Laminated structure 53, 53A ... Board
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
上記光硬化性化合物は、光硬化性反応基を有する化合物である。上記光硬化性化合物としては、(メタ)アクリロイル基を有する硬化性化合物、ビニル基を有する硬化性化合物及びマレイミド基を有する硬化性化合物等が挙げられる。硬化した接着剤層をより一層高精度に形成する観点からは、上記光硬化性化合物の上記光硬化性反応基は、(メタ)アクリロイル基であることが好ましく、上記光硬化性化合物は、(メタ)アクリロイル基(1個以上)を有することが好ましい。上記光硬化性化合物は、1種のみが用いられてもよく、2種以上が併用されてもよい。
接着剤層の厚み精度をより一層高め、更に接着剤層にボイドをより一層生じ難くし、冷熱サイクル等の信頼性を向上させる観点からは、上記接着剤は、光及び熱硬化性化合物を含むことが好ましい。上記光及び熱硬化性化合物としては、各種の光硬化性官能基(光硬化性反応基)と各種の熱硬化性官能基とを有する化合物が挙げられる。硬化した接着剤層をより一層高精度に形成する観点からは、上記光及び熱硬化性化合物の上記光硬化性反応基は、(メタ)アクリロイル基であることが好ましい。硬化した接着剤層をより一層高精度に形成する観点からは、上記光及び熱硬化性化合物は、(メタ)アクリロイル基と環状エーテル基又は環状チオエーテル基とを有することが好ましく、また(メタ)アクリロイル基と環状エーテル基とを有することが好ましく、(メタ)アクリロイル基とエポキシ基とを有することが好ましい。上記光及び熱硬化性化合物は、環状チオエーテル基を有していてもよい。上記光及び熱硬化性化合物は、1種のみが用いられてもよく、2種以上が併用されてもよい。
上記熱硬化性化合物としては、環状エーテル基を有する熱硬化性化合物、及びチイラン基を有する熱硬化性化合物等が挙げられる。硬化した接着剤層をより一層高精度に形成する観点からは、上記熱硬化性化合物は、環状エーテル基又はチイラン基を有する熱硬化性化合物であることが好ましく、エポキシ基又はチイラン基を有する熱硬化性化合物であることがより好ましく、また環状エーテル基を有する熱硬化性化合物であることも好ましく、エポキシ基を有する熱硬化性化合物(エポキシ化合物)であることが特に好ましい。上記熱硬化性化合物は、チイラン基を有する熱硬化性化合物であってもよい。硬化した接着剤層をより一層高精度に形成する観点からは、上記熱硬化性化合物が、エポキシ基又はチイラン基を有する熱硬化性化合物であり、上記光及び熱硬化性化合物が、(メタ)アクリロイル基を有する光及び熱硬化性化合物であることが好ましい。上記熱硬化性化合物は、1種のみが用いられてもよく、2種以上が併用されてもよい。
上記光重合開始剤としては、光ラジカル重合開始剤及び光カチオン重合開始剤等が挙げられる。上記光重合開始剤は、光ラジカル重合開始剤であることが好ましい。上記光重合開始剤は、1種のみが用いられてもよく、2種以上が併用されてもよい。
上記熱硬化剤としては、有機酸、アミン化合物、アミド化合物、ヒドラジド化合物、イミダゾール化合物、イミダゾリン化合物、フェノール化合物、ユリア化合物、ポリスルフィッド化合物及び酸無水物等が挙げられる。上記熱硬化剤として、アミン-エポキシアダクトなどの変性ポリアミン化合物を用いてもよい。これら以外の熱硬化剤を用いてもよい。上記熱硬化剤は、1種のみが用いられてもよく、2種以上が併用されてもよい。
上記硬化促進剤としては、第三級アミン、イミダゾール、第四級アンモニウム塩、第四級ホスホニウム塩、有機金属塩、リン化合物及び尿素系化合物等が挙げられる。
上記接着剤は溶剤を含まないか又は含む。上記接着剤は、溶剤を含んでいてもよく、含んでいなくてもよい。接着剤層の厚み精度をより一層高め、更に接着剤層にボイドをより一層生じ難くする観点からは、上記接着剤における溶剤の含有量は少ないほどよい。
上記接着剤はフィラーを含まないか又は含む。上記接着剤は、フィラーを含んでいてもよく、含んでいなくてもよい。接着剤層の厚み精度をより一層高め、更に接着剤層にボイドをより一層生じ難くする観点からは、上記接着剤におけるフィラーの含有量は少ないほどよい。さらに、上記接着剤におけるフィラーの含有量が少ないほど、インクジェット装置による吐出不良の発生が抑えられる。
上記接着剤は、他の成分を含んでいてもよい。他の成分としては特に限定されないが、カップリング剤等の接着助剤、顔料、染料、レベリング剤、消泡剤、及び重合禁止剤等が挙げられる。
以下、本発明の一実施形態に係るインクジェット用光及び熱硬化性接着剤を用いて得られる電子部品の他の具体例について説明する。
攪拌機、冷却機及び温度計を備えた2Lの反応機内に、エタノール250mLと、純水250mLと、チオシアン酸カリウム20gとを加え、チオシアン酸カリウムを溶解させ、第1の溶液を調製した。その後、容器内の温度を20~25℃の範囲内に保持した。次に、20~25℃に保持された容器内の第1の溶液を攪拌しながら、ビスフェノールA型エポキシ樹脂160gを5mL/分の速度で滴下した。滴下後、30分間さらに攪拌し、エポキシ化合物含有混合液を得た。次に、純水100mLと、エタノール100mLとを含む溶液に、チオシアン酸カリウム20gを溶解させた第2の溶液を用意した。得られたエポキシ化合物含有混合液に、得られた第2の溶液を5mL/分の速度で添加した後、30分攪拌した。攪拌後、純水100mLとエタノール100mLとを含む溶液に、チオシアン酸カリウム20gを溶解させた第2の溶液をさらに用意し、該第2の溶液を5mL/分の速度で容器内にさらに添加し、30分間攪拌した。その後、容器内の温度を10℃に冷却し、2時間攪拌し、反応させた。次に、容器内に飽和食塩水100mLを加え、10分間攪拌した。攪拌後、容器内にトルエン300mLをさらに加え、10分間攪拌した。その後、容器内の溶液を分液ロートに移し、2時間静置し、溶液を分離させた。分液ロート内の下方の溶液を排出し、上澄み液を取り出した。取り出された上澄み液にトルエン100mLを加え、攪拌し、2時間静置した。更に、トルエン100mLをさらに加え、攪拌し、2時間静置した。次に、トルエンが加えられた上澄み液に、硫酸マグネシウム50gを加え、5分間攪拌した。攪拌後、ろ紙により硫酸マグネシウムを取り除いて、溶液を分離した。真空乾燥機を用いて、分離された溶液を80℃で減圧乾燥することにより、残存している溶剤を除去した。このようにして、エポキシ基がチイラン基に置換されたチイラン基を有する25℃で液状の化合物(A)を得た。
チイラン基を有する化合物(A)の合成において、ビスフェノールA型エポキシ樹脂を4-ヒドロキシブチルアクリレートグリシジルエーテルに変更したこと以外は同様の操作を行い、エポキシ基がチイラン基に置換されたチイラン基を有する25℃で液状の化合物(B)を得た。
(接着剤Aの調製)
光硬化性化合物としてトリシクロデカンジメタノールジアクリレート(ダイセル・オルネクス社製「IRR-214K」)2重量部、ラウリルアクリレート(共栄社化学社製「L-A」)11重量部、光及び熱硬化性化合物として4-ヒドロキシブチルアクリレートグリシジルエーテル(日本化成社製「4HBAGE」)41重量部、熱硬化性化合物としてビスフェノールA型エポキシ樹脂(新日鐵住金化学社製「YD-127」)20重量部、熱硬化剤としてテルペン骨格を有する酸無水物(三菱化学社製「YH306」)20重量部、硬化促進剤としてDBU-オクチル酸塩(サンアプロ社製「UCAT SA-102」)1重量部、及び光重合開始剤として2-ベンジル-2-ジメチルアミノ-1-(4-モルフォリノフェニル)-ブタノン-1(BASF社製「IRGACURE369」)5重量部を均一に混合し、接着剤Aを得た。
(接着剤B~Pの調製)
下記の表1に示す成分を下記の表2,3に示す配合量で配合したこと以外は上記接着剤Aの調製と同様にして、接着剤B~Sを調製した。
(接着剤の25℃及び10rpmでの粘度)
JIS K2283に準拠して、E型粘度計(東機産業社製「TVE22L」)を用いて、25℃及び10rpmでの接着剤の粘度を測定した。粘度を下記の基準で評価した。
A:粘度が1600mPa・sを超える
B:粘度が1000mPa・sを超え、1600mPa・s以下
C:粘度が500mPa・sを超え、1000mPa・s以下
D:粘度が160mPa・s以上、500mPa・s以下
E:粘度が5mPa・s以上、160mPa・s未満
F:粘度が5mPa・s未満
厚みが20μmになるように基材の上にスピンコーターで接着剤を塗布した。この塗布物に対して、25℃で、照度計(ウシオ電機社製「UIT-201」)で測定した365nmでの照度が100mW/cm2になるように調節した露光装置(超高圧水銀ランプ、オーク製作所社製、「JL-4300-3」)を用いて10秒間光を照射した(積算光量1000mJ/cm2)。得られたBステージ化サンプルについて、ティー・エイ・インスツルメント社製の粘弾性測定装置ARESを用いて、25℃、測定プレート:直径8mmの平行プレート及び周波数1Hzの条件で弾性率の測定を行った。
配線の段差が5μmあるBGA基板(厚み0.3mm、市販のソルダーレジストが塗布されている、縦10mm×横10mmの半導体チップが置かれる場所が5行×16列で90か所設けられている)を用意した。上述した本発明の一実施形態に係る電子部品の製造方法に従って、図2(a)~(e)に示す各工程を経て、接着剤層を形成した。上記接着剤を70℃で循環させながら、塗布する上記塗布工程と、上記第1の光照射工程(365nmを主波長とするUV-LEDランプ、100mW/cm2、0.1秒)とを繰り返して、厚み30μmの接着剤層を形成し、第2の光照射工程(超高圧水銀ランプ、100mW/cm2、10秒)で光硬化させた。その後、接着剤層上に、ダイボンド装置を用いて、半導体チップ(縦10mm×横10mm×厚み80μm)に見立てたシリコンベアチップを110℃で0.2MPaの条件で積層して、積層体を得た。シリコンベアチップを積層した後、光学顕微鏡(キーエンス社製「デジタルマイクロスコープVH-Z100」)を用いて接着剤層のはみ出しが100μm未満であることを確認した。得られた積層体を160℃のオーブン内に入れ、3時間加熱することで、熱硬化させることにより、90個の半導体装置(積層構造体)を得た。
○○:ボイドがほとんど観察されなかった
○:ボイドがわずかに観察された(使用上問題がない)
×:ボイドが観察された(使用上問題あり)
光学顕微鏡(キーエンス社製「デジタルマイクロスコープVH-Z100」)を用いて、ボイドの確認の評価で得られた半導体装置における半導体チップの移動を観察し、下記の基準で評価した。なお、半導体チップが移動している場合に、接着剤層の厚み精度が悪いことを確認した。
○:半導体チップの移動がほとんど観察されなかった(移動距離が20μm未満)
×:半導体チップの移動が観察された(移動距離が20μm以上)
ボイドの確認の評価で得られた半導体装置(90個)を85℃及び湿度85RH%に168時間放置して吸湿させた。その後、半田リフロー炉(プレヒート150℃×100秒、リフロー[最高温度260℃])に5サイクル通過させた。その吸湿リフロー試験を行った半導体装置を液槽式熱衝撃試験機(ESPEC社製「TSB-51」)を用いて、-55℃で5分間保持した後、150℃まで昇温し、150℃で5分間保持した後-50℃まで降温する過程を1サイクルとする冷熱サイクル試験を実施した。250サイクル、500サイクル及び1000サイクル後に半導体装置を取り出し、超音波探査映像装置(日立建機ファインテック社製「mi-scope hyper II」)を用いて、半導体装置の接着剤層の剥離を観察し、下記の基準で評価した。
○○:剥離していない
○:わずかに剥離している(使用上問題がない)
×:大きく剥離している(使用上問題あり)
1A…一次積層体
2…第1の電子部品本体
3…接着剤層(加熱後)
4…第2の電子部品本体
11,11X…インクジェット装置
12…接着剤層
12A…第1の光照射部により光が照射された接着剤層
12B…第2の光照射部により光が照射された接着剤層
13…第1の光照射部
14…第2の光照射部
21…インクタンク
22…吐出部
23,23X…循環流路部
23A…バッファタンク
23B…ポンプ
31…電子部品
32…多層の接着剤層(加熱後)
32A,32B,32C…接着剤層(加熱後)
51,71…半導体装置
52…積層構造体
53,53A…基板
53a…第1の接続端子
53b…第2の接続端子
54,61,72…接着剤層
55…第2の半導体ウェハ
55a,73a…接続端子
56,63,74…配線
62,73…第1の半導体ウェハ
62a…接続端子
Claims (19)
- 光硬化性化合物と、熱硬化性化合物と、光重合開始剤と、熱硬化剤とを含み、
365nmでの照度が100mW/cm2になるように積算光量1000mJ/cm2の光を接着剤に照射してBステージ化接着剤を得たときに、前記Bステージ化接着剤の25℃での弾性率が5.0×102Pa以上、8.0×104Pa以下である、インクジェット用光及び熱硬化性接着剤。 - 前記光硬化性化合物が、光硬化性反応基を1個有する光硬化性化合物と、光硬化性反応基を2個以上有する光硬化性化合物とを含む、請求項1に記載のインクジェット用光及び熱硬化性接着剤。
- 前記光硬化性反応基を1個有する光硬化性化合物の前記光硬化性反応基が(メタ)アクリロイル基であり、
前記光硬化性反応基を2個有する光硬化性化合物の前記光硬化性反応基が(メタ)アクリロイル基である、請求項2に記載のインクジェット用光及び熱硬化性接着剤。 - 光及び熱硬化性化合物を含まないか又は含み、
接着剤が前記光及び熱硬化性化合物を含まない場合には、前記光硬化性化合物の全体100重量%中、前記光硬化性反応基を2個以上有する光硬化性化合物の含有量が0.1重量%以上、30重量%以下であり、
接着剤が前記光及び熱硬化性化合物を含む場合には、前記光硬化性化合物の全体と、前記光及び熱硬化性化合物との合計100重量%中、前記光硬化性反応基を2個以上有する光硬化性化合物の含有量が0.1重量%以上、30重量%以下である、請求項2又は3に記載のインクジェット用光及び熱硬化性接着剤。 - 前記光硬化性反応基を1個有する光硬化性化合物が、2-エチルヘキシル(メタ)アクリレートを含む、請求項2~4のいずれか1項に記載のインクジェット用光及び熱硬化性接着剤。
- 前記熱硬化性化合物が、エポキシ基又はチイラン基を有する熱硬化性化合物を含む、請求項1~5のいずれか1項に記載のインクジェット用光及び熱硬化性接着剤。
- 光及び熱硬化性化合物を含む、請求項1~6のいずれか1項に記載のインクジェット用光及び熱硬化性接着剤。
- 前記熱硬化性化合物が、エポキシ基又はチイラン基を有する熱硬化性化合物を含み、
前記光及び熱硬化性化合物が、(メタ)アクリロイル基を有する光及び熱硬化性化合物を含む、請求項7に記載のインクジェット用光及び熱硬化性接着剤。 - 前記光及び熱硬化性化合物が、4-ヒドロキシブチル(メタ)アクリレートグリシジルエーテルを含む、請求項7又は8に記載のインクジェット用光及び熱硬化性接着剤。
- JIS K2283に準拠して測定された25℃及び10rpmでの粘度が5mPa・s以上、1600mPa・s以下である、請求項1~9のいずれか1項に記載のインクジェット用光及び熱硬化性接着剤。
- 溶剤を含まないか又は含み、
接着剤が前記溶剤を含む場合には、前記溶剤の含有量が1重量%以下である、請求項1~10のいずれか1項に記載のインクジェット用光及び熱硬化性接着剤。 - フィラーを含まないか又は含み、
接着剤が前記フィラーを含む場合には、前記フィラーの含有量が1重量%以下である、請求項1~11のいずれか1項に記載のインクジェット用光及び熱硬化性接着剤。 - 半導体素子搭載用の支持部材又は半導体素子の表面上に、インクジェット装置を用いて、請求項1~12のいずれか1項に記載のインクジェット用光及び熱硬化性接着剤を塗布して、接着剤層を形成する塗布工程と、
光の照射により前記接着剤層の硬化を進行させて、Bステージ化接着剤層を形成する工程と、
前記Bステージ化接着剤層の前記支持部材又は前記半導体素子側とは反対の表面上に、半導体素子を積層する工程と、
前記半導体素子の積層後に、前記Bステージ化接着剤層を熱硬化させる工程とを備える、半導体装置の製造方法。 - 半導体ウェハの表面上に、インクジェット装置を用いて、請求項1~12のいずれか1項に記載のインクジェット用光及び熱硬化性接着剤を吐出して、接着剤層を形成する塗布工程と、
光の照射により前記接着剤層の硬化を進行させて、Bステージ化接着剤層を形成する工程と、
前記Bステージ化接着剤層の前記半導体ウェハ側とは反対の表面上に、カバーガラスを積層して、積層体を得る工程と、
前記積層体における前記Bステージ化接着剤層を熱硬化させる工程と、
熱硬化後に前記積層体を切断する工程とを備える、半導体装置の製造方法。 - 前記Bステージ化接着剤層の25℃での弾性率を5.0×102Pa以上、8.0×104Pa以下にする、請求項13又は14に記載の半導体装置の製造方法。
- 前記インクジェット装置が、前記インクジェット用光及び熱硬化性接着剤が貯留されるインクタンクと、前記インクタンクと接続されておりかつ前記インクジェット用光及び熱硬化性接着剤が吐出される吐出部と、一端が前記吐出部に接続されており、他端が前記インクタンクに接続されており、かつ内部を前記インクジェット用光及び熱硬化性接着剤が流れる循環流路部とを有し、
前記塗布工程において、前記インクジェット装置内で、前記インクジェット用光及び熱硬化性接着剤を前記インクタンクから前記吐出部に移動させた後に、前記吐出部から吐出されなかった前記インクジェット用光及び熱硬化性接着剤を、前記循環流路部内を流して前記インクタンクに移動させることにより、前記インクジェット用光及び熱硬化性接着剤を循環させながら、塗布する、請求項13~15のいずれか1項に記載の半導体装置の製造方法。 - 循環されている前記インクジェット用光及び熱硬化性接着剤の温度が40℃以上、100℃以下である、請求項16に記載の半導体装置の製造方法。
- 第1の電子部品本体と、第2の電子部品本体と、前記第1の電子部品本体と前記第2の電子部品本体とを接続している接着剤層とを備え、
前記接着剤層が、請求項1~12のいずれか1項に記載のインクジェット用光及び熱硬化性接着剤の硬化物である、電子部品。 - 前記第1の電子部品本体が半導体素子搭載用の支持部材又は半導体素子であり、
前記第2の電子部品本体が半導体素子である、請求項18に記載の電子部品。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015548085A JP6002857B1 (ja) | 2014-11-17 | 2015-09-18 | インクジェット用光及び熱硬化性接着剤、半導体装置の製造方法及び電子部品 |
EP15860929.7A EP3222692B1 (en) | 2014-11-17 | 2015-09-18 | Inkjet photo- and heat-curable adhesive, semiconductor device manufacturing method, and electronic part |
CN201580013146.2A CN106103633B (zh) | 2014-11-17 | 2015-09-18 | 喷墨用光及热固化性粘接剂、半导体装置的制造方法及电子部件 |
KR1020197021888A KR102325678B1 (ko) | 2014-11-17 | 2015-09-18 | 잉크젯용 광 및 열경화성 접착제, 반도체 장치의 제조 방법 및 전자 부품 |
US15/322,606 US20170158922A1 (en) | 2014-11-17 | 2015-09-18 | Inkjet photo- and heat-curable adhesive, semiconductor device manufacturing method, and electronic part |
KR1020167021347A KR102177435B1 (ko) | 2014-11-17 | 2015-09-18 | 잉크젯용 광 및 열경화성 접착제, 반도체 장치의 제조 방법 및 전자 부품 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-232996 | 2014-11-17 | ||
JP2014232996 | 2014-11-17 | ||
JP2015-144911 | 2015-07-22 | ||
JP2015144911 | 2015-07-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016080069A1 true WO2016080069A1 (ja) | 2016-05-26 |
Family
ID=56013629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2015/076678 WO2016080069A1 (ja) | 2014-11-17 | 2015-09-18 | インクジェット用光及び熱硬化性接着剤、半導体装置の製造方法及び電子部品 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20170158922A1 (ja) |
EP (1) | EP3222692B1 (ja) |
JP (3) | JP6002857B1 (ja) |
KR (2) | KR102325678B1 (ja) |
CN (1) | CN106103633B (ja) |
TW (1) | TWI647294B (ja) |
WO (1) | WO2016080069A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017066170A (ja) * | 2015-09-28 | 2017-04-06 | 積水化学工業株式会社 | 電子部品の製造方法 |
WO2022203033A1 (ja) * | 2021-03-26 | 2022-09-29 | 積水化学工業株式会社 | インクジェット用接着剤、電子部品の製造方法及び電子部品 |
JP7514643B2 (ja) | 2020-03-30 | 2024-07-11 | 株式会社Adeka | 組成物、硬化物、硬化物の製造方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5969726B1 (ja) | 2015-01-22 | 2016-08-17 | 積水化学工業株式会社 | インクジェット用接着剤、半導体装置の製造方法及び電子部品 |
JP6416327B1 (ja) * | 2017-06-06 | 2018-10-31 | 太陽インキ製造株式会社 | インクジェット用硬化性組成物セット、硬化物、その製造方法、プリント配線板およびファンアウト型のウェハレベルパッケージ |
JP6995580B2 (ja) | 2017-11-17 | 2022-01-14 | 日本航空電子工業株式会社 | 光部品の生産方法及びタッチセンサを具備する製品の生産方法 |
WO2023176778A1 (ja) * | 2022-03-16 | 2023-09-21 | 積水化学工業株式会社 | 硬化性樹脂組成物及び半導体部品の製造方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007004569A1 (ja) * | 2005-07-05 | 2007-01-11 | Hitachi Chemical Company, Ltd. | 感光性接着剤組成物、並びにこれを用いて得られる接着フィルム、接着シート、接着剤層付半導体ウェハ、半導体装置及び電子部品 |
JP2007258425A (ja) * | 2006-03-23 | 2007-10-04 | Sumitomo Bakelite Co Ltd | 半導体用接着剤、これを用いた半導体装置および半導体装置の製造方法 |
JP2010264689A (ja) * | 2009-05-15 | 2010-11-25 | Riso Kagaku Corp | インクジェット記録装置及びインクジェット記録方法 |
WO2011058996A1 (ja) * | 2009-11-13 | 2011-05-19 | 日立化成工業株式会社 | 接着剤組成物、それを用いた半導体装置及びその製造方法 |
WO2011058998A1 (ja) * | 2009-11-13 | 2011-05-19 | 日立化成工業株式会社 | 液状半導体用接着剤組成物、半導体装置及び半導体装置の製造方法 |
WO2013154314A1 (ko) * | 2012-04-10 | 2013-10-17 | (주)엘지하우시스 | 반경화 감압 점착필름 |
WO2015076235A1 (ja) * | 2013-11-19 | 2015-05-28 | 積水化学工業株式会社 | 電子部品の製造方法及び電子部品 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03192178A (ja) | 1989-12-21 | 1991-08-22 | Nitto Denko Corp | ダイボンディング用接着シート |
JP2008117997A (ja) * | 2006-11-07 | 2008-05-22 | Seiko Epson Corp | 電子基板の製造方法 |
JP2009147231A (ja) * | 2007-12-17 | 2009-07-02 | Hitachi Chem Co Ltd | 実装方法、半導体チップ、及び半導体ウエハ |
JP5009229B2 (ja) * | 2008-05-22 | 2012-08-22 | 富士フイルム株式会社 | インクジェット記録装置 |
WO2011058999A1 (ja) * | 2009-11-13 | 2011-05-19 | 日立化成工業株式会社 | フィルム状接着剤の製造方法、接着シート並びに半導体装置及びその製造方法 |
JP2012039379A (ja) | 2010-08-06 | 2012-02-23 | Canon Inc | 画像処理装置 |
WO2012039379A1 (ja) * | 2010-09-22 | 2012-03-29 | 積水化学工業株式会社 | インクジェット用硬化性組成物及び電子部品の製造方法 |
JP2014012770A (ja) * | 2012-07-04 | 2014-01-23 | Nitto Denko Corp | 透明粘接着剤層付透明飛散防止部材 |
JP6250265B2 (ja) * | 2012-03-16 | 2017-12-20 | リンテック株式会社 | 接着剤組成物、接着シートおよび半導体装置の製造方法 |
CN104685010B (zh) * | 2012-09-27 | 2016-08-17 | 积水化学工业株式会社 | 喷墨用固化性组合物及电子零件的制造方法 |
JP2014075215A (ja) * | 2012-10-03 | 2014-04-24 | Sekisui Chem Co Ltd | 絶縁材料、多層フィルム、積層体、接続構造体、積層体の製造方法及び接続構造体の製造方法 |
US11220604B2 (en) * | 2013-11-06 | 2022-01-11 | Sekisui Chemical Co., Ltd. | Method for manufacturing cured film, method for manufacturing electronic component, and electronic component |
-
2015
- 2015-09-18 KR KR1020197021888A patent/KR102325678B1/ko active IP Right Grant
- 2015-09-18 KR KR1020167021347A patent/KR102177435B1/ko active IP Right Grant
- 2015-09-18 WO PCT/JP2015/076678 patent/WO2016080069A1/ja active Application Filing
- 2015-09-18 JP JP2015548085A patent/JP6002857B1/ja active Active
- 2015-09-18 US US15/322,606 patent/US20170158922A1/en not_active Abandoned
- 2015-09-18 EP EP15860929.7A patent/EP3222692B1/en active Active
- 2015-09-18 CN CN201580013146.2A patent/CN106103633B/zh active Active
- 2015-11-09 TW TW104136906A patent/TWI647294B/zh active
-
2016
- 2016-08-19 JP JP2016161145A patent/JP2017025325A/ja active Pending
-
2019
- 2019-07-01 JP JP2019123029A patent/JP7007334B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007004569A1 (ja) * | 2005-07-05 | 2007-01-11 | Hitachi Chemical Company, Ltd. | 感光性接着剤組成物、並びにこれを用いて得られる接着フィルム、接着シート、接着剤層付半導体ウェハ、半導体装置及び電子部品 |
JP2007258425A (ja) * | 2006-03-23 | 2007-10-04 | Sumitomo Bakelite Co Ltd | 半導体用接着剤、これを用いた半導体装置および半導体装置の製造方法 |
JP2010264689A (ja) * | 2009-05-15 | 2010-11-25 | Riso Kagaku Corp | インクジェット記録装置及びインクジェット記録方法 |
WO2011058996A1 (ja) * | 2009-11-13 | 2011-05-19 | 日立化成工業株式会社 | 接着剤組成物、それを用いた半導体装置及びその製造方法 |
WO2011058998A1 (ja) * | 2009-11-13 | 2011-05-19 | 日立化成工業株式会社 | 液状半導体用接着剤組成物、半導体装置及び半導体装置の製造方法 |
WO2013154314A1 (ko) * | 2012-04-10 | 2013-10-17 | (주)엘지하우시스 | 반경화 감압 점착필름 |
WO2015076235A1 (ja) * | 2013-11-19 | 2015-05-28 | 積水化学工業株式会社 | 電子部品の製造方法及び電子部品 |
Non-Patent Citations (1)
Title |
---|
See also references of EP3222692A4 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017066170A (ja) * | 2015-09-28 | 2017-04-06 | 積水化学工業株式会社 | 電子部品の製造方法 |
JP7514643B2 (ja) | 2020-03-30 | 2024-07-11 | 株式会社Adeka | 組成物、硬化物、硬化物の製造方法 |
WO2022203033A1 (ja) * | 2021-03-26 | 2022-09-29 | 積水化学工業株式会社 | インクジェット用接着剤、電子部品の製造方法及び電子部品 |
Also Published As
Publication number | Publication date |
---|---|
JP2019183165A (ja) | 2019-10-24 |
EP3222692A4 (en) | 2018-07-04 |
KR102325678B1 (ko) | 2021-11-12 |
KR20170081131A (ko) | 2017-07-11 |
JP7007334B2 (ja) | 2022-01-24 |
JP2017025325A (ja) | 2017-02-02 |
CN106103633B (zh) | 2023-11-17 |
JP6002857B1 (ja) | 2016-10-05 |
KR20190090881A (ko) | 2019-08-02 |
TWI647294B (zh) | 2019-01-11 |
EP3222692B1 (en) | 2023-07-12 |
KR102177435B1 (ko) | 2020-11-11 |
EP3222692A1 (en) | 2017-09-27 |
JPWO2016080069A1 (ja) | 2017-04-27 |
CN106103633A (zh) | 2016-11-09 |
US20170158922A1 (en) | 2017-06-08 |
TW201623497A (zh) | 2016-07-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5986698B1 (ja) | インクジェット用接着剤、半導体装置の製造方法及び電子部品 | |
JP7007334B2 (ja) | インクジェット用光及び熱硬化性接着剤、半導体装置の製造方法及び電子部品 | |
WO2015076235A1 (ja) | 電子部品の製造方法及び電子部品 | |
JP6411184B2 (ja) | インクジェット用光及び熱硬化性接着剤、半導体装置の製造方法及び電子部品の製造方法 | |
JP6391545B2 (ja) | インクジェット用接着剤、半導体装置の製造方法及び電子部品 | |
JP6325905B2 (ja) | インクジェット用光及び熱硬化性接着剤、電子部品の製造方法及び電子部品 | |
JP6329102B2 (ja) | インクジェット用組成物、半導体装置の製造方法、電子部品及び電子部品の製造方法 | |
US20240234226A9 (en) | Curable composition for inkjet and air cavity formation, electronic component, and method for manufacturing electronic component | |
JP6391543B2 (ja) | 電子部品の製造方法 | |
JP2017069465A (ja) | 電子部品の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENP | Entry into the national phase |
Ref document number: 2015548085 Country of ref document: JP Kind code of ref document: A |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 15860929 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20167021347 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 201580013146.2 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 15322606 Country of ref document: US |
|
REEP | Request for entry into the european phase |
Ref document number: 2015860929 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2015860929 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |