WO2016076538A1 - Collection and dispersion type heatsink - Google Patents

Collection and dispersion type heatsink Download PDF

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Publication number
WO2016076538A1
WO2016076538A1 PCT/KR2015/010746 KR2015010746W WO2016076538A1 WO 2016076538 A1 WO2016076538 A1 WO 2016076538A1 KR 2015010746 W KR2015010746 W KR 2015010746W WO 2016076538 A1 WO2016076538 A1 WO 2016076538A1
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WIPO (PCT)
Prior art keywords
heat
electronic component
heating element
component heating
block
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PCT/KR2015/010746
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French (fr)
Korean (ko)
Inventor
박종웅
권창경
임호연
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가온미디어 주식회사
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Publication of WO2016076538A1 publication Critical patent/WO2016076538A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention is a technique for preventing the occurrence of high heat in the local area of the outer surface of the electronics housing by dispersing and absorbing heat generated by the electronic component heating element installed in the limited internal space of the electronics.
  • the present invention provides a heat absorbing block for heat generated in the electronic component heating element by having a heat absorbing plate having different areas in multiple stages along the length direction of the heat absorbing block and the heat absorbing block in the electronic component heating element installed in the electronic product.
  • the present invention relates to a technique for preventing high heat from occurring locally only on the outer surface of an electronic product in a portion where a heat sink is located by effectively dispersing the heat absorbing plate and collecting heat in the space between the heat absorbing plates.
  • the electronic components installed inside the electronic products tend to be high performance, and high heat is generated in the electronic components (eg, CPU).
  • the electronic components eg, CPU
  • these electronic components generate high heat and exceed a certain critical temperature (eg 80 degrees), they can fail or degrade performance due to the protection mode. Therefore, in order to prevent this, a heat sink is attached to the electronic component in which high heat is generated, and the generated heat is absorbed as a conduction phenomenon and then radiated to the outside by convection.
  • a plurality of through holes are formed in the outer housing of the electronic product so that the heat radiating from the heat sink is smoothly discharged to the outside.
  • less heat is generated, so a small number of small holes need to be formed, but as the heat generation increases due to high performance, many large holes must be formed.
  • FIG. 1 is a view showing a state in which a general heat sink 1 according to the prior art is mounted on an electronic product.
  • a heat generating element 2 such as a central processing unit (CPU) or a signal processing semiconductor is disposed.
  • the heat sink 1 is attached to the heating element 2 in order to absorb and dissipate the heat generated by the heating element 2 to lower the temperature of the heating value 2.
  • the conventional heat sink 1 absorbs heat generated from the heat generating element 2 by conduction phenomenon at the contact surface to lower the temperature of the heat generating element 2, and the absorbed heat outside the heat sink 1 by convection. To diverge. As the heat is dissipated in this way, the air near the heat sink 1 becomes hot. The heated air flows upward in one direction, for example, upward in FIG. 1 by a natural phenomenon.
  • the heat sink 1 absorbs heat, there is no problem such as failure or deterioration in the heating element 2, but the air warmed up by the absorbed heat is gathered to one side by convection.
  • the collected hot air heats a specific area of the housing 3, which causes the housing 3 to be very hot locally. In this state, when the user touches or grabs the electronic product, there is a problem of feeling uncomfortable due to the hot portion.
  • the present invention has been proposed in view of the above-described problems of the prior art, and an object of the present invention is a heat absorption plate having different areas in multiple stages along the length direction of a heat absorption block and a heat absorption block in an electronic component heating element installed in an electronic product.
  • a distributed dispersion heat sink has one surface contacting an electronic component heating element to absorb heat from the electronic component heating element and being laminated in multiple stages in the contact surface direction of the electronic component heating element.
  • the heat absorbing plate positioned on the outermost side of the heat generating element of the plurality of heat absorption plates so that the fixing bolt for fastening the heat absorption block and the plurality of heat absorption plates to the fixing bracket of the limited space where the electronic component heating element is installed. Including at least one is penetrated in a straight line.
  • a trap dispersing heat sink including: a heat absorbing block (100 ′) having one surface thereof in contact with an electronic component heating element to absorb heat from the electronic component heating element; It is formed in the form of a plate penetrated corresponding to the cross-sectional shape of the heat absorbing block, and the multi-stacked parts are spaced apart by a predetermined distance along the length direction of the heat absorbing block away from the heat generating element and inserted into the heat absorbing block. And a plurality of heat absorbing plates 200 ′ formed to gradually increase in area away from the heating element to collect and dissipate heat generated from the electronic component heating element.
  • a trap dispersing heat sink including: a heat absorbing block (100 ′′) whose one surface is in contact with an electronic component heating element and absorbs heat from the electronic component heating element; Formed and protruded in multiple stages along the longitudinal direction of the heat absorbing block away from the electronic component heating element, and are formed to increase in area as they move away from the electronic component heating element to collect and disperse heat generated from the electronic component heating element.
  • Heat absorption plate 200 ";
  • the plurality of heat absorption plates may be asymmetrically disposed separately from the center of the heat absorption block in response to the limited space in which the electronic component heating element is installed.
  • the heat generated from the electronic component heating element is effectively concentrated in the internal space of the electronic device without being concentrated in a specific direction, thereby causing a problem that the external surface of the electronic product in the portion where the heat sink is located is locally heated.
  • FIG. 1 is a schematic illustration of a conventional heat sink mounted on an electronic product.
  • Figure 2 is an exemplary view showing a state in which a distributed collecting heat sink according to the present invention is mounted on an electronic product.
  • FIG. 3 is a side cross-sectional view of a trap dissipation heat sink according to a first embodiment of the present invention
  • Figure 4 is a bottom view of the trap dissipation heat sink according to the first embodiment of the present invention.
  • FIG. 5 is a plan view of a trap dispersing heat sink according to a first embodiment of the present invention.
  • Figure 6 is an exemplary view showing the heat distribution around the heat sink in which heat is dispersed and absorbed in the present invention.
  • FIG. 7 is an exemplary view showing a state in which heat is collected and moved in the present invention.
  • Figure 8 is a comparative example showing the appearance of a good heat distribution on the outer surface of the housing when using the collecting dispersion heat sink according to the present invention.
  • 9 and 10 are comparative examples showing the measurement of the heat generated in the electronics (set-top box) in the case of mounting the collecting and dispersing heat sink of the present invention and the heat sink of the prior art.
  • FIG. 11 is a side cross-sectional view of a trap dispersive heat sink according to a second embodiment of the present invention.
  • FIG. 12 is a side cross-sectional view of a trap dissipation type heat sink according to a third embodiment of the present invention.
  • FIG. 2 is an illustration of a state in which the collection distributed heat sink according to the present invention is mounted on an electronic product.
  • the collecting and dissipating heat sink 10 is attached to the electronic component heating element 20 that generates high heat inside the housing 30 of the electronic product.
  • the collection and dispersion heat sink 10 according to the present invention absorbs and dissipates heat from the electronic component heating element 20, and then efficiently absorbs and dissipates the absorbed heat within a limited space of the housing 30.
  • the capture distribution type heat sink 10 collects and distributes heat absorbed from the electronic component heating element 20 without being driven from either side in the internal space of the housing 30, thereby being transferred to the housing 30 and finally transferred. This reduces the heat experienced by the user. Through this, as in the prior art, a specific portion of the housing adjacent to the heat sink is locally heated to prevent a problem that the user feels uncomfortable when touching the electronic product.
  • 3 to 5 show a side cross-sectional view, a bottom view, and a plan view of a collecting dispersion heat sink according to a first embodiment of the present invention.
  • the collection distributed heat sink according to the first embodiment is mounted in the housing 30 of the electronic product and includes a heat absorption block 100 and a heat absorption plate 200.
  • the heat absorption block 100 is composed of a plurality of stacked on the electronic component heating element 20 in multiple stages. In addition, the heat absorption block 100 at the bottom end contacts one surface of the electronic component heating element 20 to absorb the heat of the electronic component heating element 20 by conduction phenomenon, and conducts the absorbed heat upward. .
  • the heat absorption block 100 is formed in a plate shape as shown in Figs. 3 and 4, the shape may be selected as rectangular, polygonal, circular or the like.
  • the heat absorption block 100 most adjacent to the electronic component heating element 20 may be fixed to the electronic component heating element 20 with a double-sided tape or an adhesive.
  • the heat absorption block 100 may be further bolted to a bracket (not shown) that fixes the electronic component heating element 20 to the housing 30, and may be firmly fixed.
  • the heat absorption block 100 may absorb heat generated from the electronic component heating element 20 by conduction phenomenon and may absorb heat radiated into the space through sidewalls exposed to the space.
  • the heat absorption plate 200 is formed in a plate shape having a larger cross-sectional area than the heat absorption block 100 and is stacked between the heat absorption blocks 100. At this time, it is not necessary to limit that the plurality of heat absorption plates 100 have a wider cross-sectional area than the heat absorption block 100 without any missing. In addition, it is not necessary to limit that the cross-sectional area of the heat absorption block 100 is all constant.
  • the plurality of heat absorption plates 210, 220, 230, and 240 are formed to gradually increase in area as they move away from the electronic component heating element 20. Through this, the surface of the housing 30 can be minimized by locally collecting and dispersing heat absorbed from the electronic component heating element 20 in the space between the plates.
  • the heat absorption plates 210, 220, 230, and 240 emit heat to the surrounding air after absorbing heat from the electronic component heating element 20.
  • a constant temperature deviation occurs in the air in the housing 30, and thus, a constant air flow occurs, thereby causing a heat flow in the corresponding constant direction.
  • the heat flows in a predetermined direction so that the heat is collected at the point where the housing 30 meets, and thus, a specific portion of the housing 30, which is the point where heat is collected, is locally heated.
  • the air warmed up by the heat absorption plates 210, 220, 230, and 240 may not be collected in a certain direction by being blocked by the flow by the wider plate at the upper end.
  • the upper plate eg, 230
  • the heat dissipated by the heat sink 10 of the present invention is collected in the space between the plates and cannot move toward the housing, thereby greatly reducing the heat transferred to the housing 30.
  • the air heated by such heat is not a big problem because it spreads widely around the periphery of the uppermost plate 240. That is, the heat that is transferred between the plate and the heat emitted from the upper portion after being transferred in the vertical direction through the heat absorbing block 100 and scattered widely upwards never accumulates in one place of the housing 30. It is not lost. Therefore, according to the present invention, the phenomenon in which the housing 30 is locally heated is not exhibited.
  • At least one of the plurality of heat absorption plates 210, 220, 230, and 240 corresponds to a shape inside the housing 30 in which the electronic component heating element 20 is installed, from the center of the heat absorption block 100. It can be arranged asymmetrically. As such, the present invention may be disposed in consideration of the limitation of the space in which the electronic component heating element 20 is installed in the housing 30 because the heat absorption plate is freely disposed.
  • heat generated from the electronic component heating element 20 may be gradually conducted and distributed through the heat absorption block 100 and the plurality of heat absorption plates 210, 220, 230, and 240.
  • Heat radiated from the electronic component heating element 20 into the air may also be absorbed by the side walls of the heat absorption block 100 or the plurality of heat absorption plates 210, 220, 230, and 240 by a relative temperature difference.
  • heat may be dissipated from the side walls of the heat absorption block 100 and the heat absorption plates 210, 220, 230, and 240 according to the relative temperature difference, and heat may be collected in the space between the heat absorption plates.
  • the heat generated in the electronic component heating element 20 can be effectively collected and evenly distributed in the limited space inside the housing 30 to radiate heat to the large surface of the housing 30, so that the surface of the housing 30 is locally It is possible to prevent the problem of the prior art that is heated to. This advantage is very important given the current trend of miniaturization, slimming and high-end electronics.
  • individual electronic components may be mounted inside the housing 30.
  • all or part of the plurality of heat absorption plates 210, 220, 230, and 240 may be individually asymmetrically disposed from the center of the heat absorption block 100 to define the housing 30. It is possible to effectively dissipate heat in space.
  • a fixing bolt for fastening the heat absorption block 100 and the plurality of heat absorption plates 210, 220, 230, and 240 to a fixing bracket (not shown) in a limited space in which the electronic component heating element 20 is installed may be fastened.
  • At least one of the plurality of heat absorption plates 210, 220, 230, and 240 includes a heat absorption plate 240 positioned on the outermost side of the electronic component heating element 20 so as to penetrate in a straight line to penetrate the h.
  • Figure 6 is an exemplary view showing the heat distribution around the heat sink in the heat dissipation absorbed in the present invention
  • Figure 7 is an exemplary view showing a state that the heat is collected and moved in the present invention
  • Figure 8 is a comparative example showing the appearance that the heat distribution is good on the outer surface of the housing by collecting and dissipating and absorbing heat in the case of using the collecting dispersion heat sink according to the present invention.
  • the electronic device eg, the set-top box
  • the electronic product at a position corresponding to the heat sink 10.
  • the result of measuring the temperature with respect to the outer surface of the housing 30 is shown. Looking at the measured values, the temperature of the center portion is about 71.2 °C, the peripheral portion is about 67.1 ⁇ 68.8 °C based on the heat absorption plate 240 located at the top of the plurality of heat absorption plates (210, 220, 230, 240) Distribution.
  • the heat generated from the electronic component heating element 20 mounted in the electronics housing 30 may be transferred from the heat absorption block 100 and the electronic component heating element 20 corresponding to the specification of the electronic component heating element 20. It can be seen that the heat absorbing plates 210, 220, 230, and 240, which are larger in area, are spaced apart in multiple stages to effectively disperse heat generated in the electronics housing 30.
  • the heat sink having the same size as the cross-sectional area of the electronic component heating element is attached to the electronic component heating element so that only the heat generated from the electronic component heating element is intensively dissipated. Due to the gathering phenomenon, a specific portion of the housing is locally heated, which is very hot.
  • the present invention improves the heat dissipation while dissipating heat to the widest outer surface of the electronics housing, while collecting heat in the space inside the housing, while dissipating heat at a high temperature in the local area of the electronics housing. Is a challenge.
  • a heat sink (10) which, when radiated through a general heat sink, allows the heat of 10 degrees down to the highest temperature portion of the housing of the electronics and dissipates the heat down to another range of the electronics housing. ) Is implemented.
  • the heat sink 10 primarily absorbs the heat generated from the electronic component heating element 20 to the heat absorption block 100 and the heat absorption plate (210, 220, 230, 240) by conduction. Then, it was configured to be collected by the convection into the space between the heat absorption plates (210, 220, 230, 240). As such, the heat absorption plates 210, 220, 230, and 240 may be configured to gradually increase as they move away from the electronic component heating element 20 so that heat collection may occur.
  • 9 and 10 are measured by measuring the heat generated in the electronics (set-top box) in the case of mounting the collecting dispersion heat sink according to the first embodiment of the present invention and in the case of mounting a general heat sink according to the prior art It is a comparative example shown. 9 and 10, the temperature change of the set top box outer surface equipped with the distributed dispersion heat sink according to the first embodiment of the present invention and the set top box outer surface equipped with the conventional heat sink are compared. Take a look.
  • “Surface temperature ( ⁇ 17 ° C.”) means a part that is 17 ° C. or more higher than the outer edge temperature of the set top box where the heat sink is not located when the set top box is operated for a predetermined time.
  • Comparative Example 2 a portion of the set-top box having a temperature higher than 17 ° C. or more than the outer edge temperature of the set-top box is most widely distributed, and thus, it may be understood that the functional deterioration of the individual electronic parts inside the set-top box is concerned.
  • the "first embodiment” has a narrowest distribution of a portion higher than the outer edge temperature of the set-top box by 17 ° C. Individual electronic components inside the set-top box have the lowest probability of functional degradation.
  • the "surface temperature ( ⁇ 18 ° C)" that is, the area where the portion of the set-top box 18 ° C or more higher than the outer edge temperature is also significantly narrower than the "Comparative Examples 1 to 3" Able to know.
  • FIG. 10 an area in which a portion of the surface temperature ( ⁇ 20 ° C.), that is, 20 ° C. or more higher than the outer edge temperature of the set-top box, is generated in the first embodiment, unlike in Comparative Examples 1 to 3.
  • FIG. 10 It can be seen that the effective dispersion of heat is achieved by the trap dissipation heat sink 10 in the set top box.
  • FIG. 11 is a side cross-sectional view of a trap dispersive heat sink according to a second embodiment of the present invention.
  • the trap dispersive heat sink 10 ′ according to the second embodiment of the present invention is mounted inside the housing 30 and includes a heat absorption block 100 ′ and a heat absorption plate 200 ′. It is configured to include.
  • the heat absorption block 100 ′ is connected to one surface of the electronic component heating element 20 to absorb heat from the electronic component heating element 20 and may have a rectangular cross section.
  • the heat absorption block 100 ′ may have a polygon or a circle other than a rectangular shape.
  • the heat absorption block 100 ′ may be fixed to the electronic component heating element 20 with a double-sided tape, and may be bolted to a bracket (not shown) that fixes the electronic component heating element 20 to the housing 30.
  • the heat absorption block 100 ′ may absorb heat generated from the electronic component heating element 20 by conduction, and may absorb heat radiated into the space through sidewalls exposed to the space.
  • the heat absorption plate 200 ′ is formed in a plate shape through which a predetermined portion penetrates corresponding to the cross-sectional shape of the heat absorption block 100 ′, and the length of the heat absorption block 100 ′ is a direction away from the electronic component heating element 20.
  • the predetermined portion penetrated along the direction is stacked in multiple stages spaced apart by a predetermined distance in a state of being fitted into the heat absorption block 100 'to absorb surrounding heat.
  • the portion penetrated through the heat absorption plate 200 'so that the heat absorption block 100' is fitted is referred to as a 'block through portion'.
  • the plurality of heat absorption plates 210 ', 220', 230 ', 240' are formed to gradually increase in area as they move away from the electronic component heating element 20.
  • the temperature difference of each position may be minimized on the surface of the housing 30 on which the electronic component heating element 20 is mounted.
  • the plurality of heat absorption plates 210 ′, 220 ′, 230 ′, and 240 ′ correspond to the center of the heat absorption block 100 ′ corresponding to the structure of the internal space of the housing 30 in which the electronic component heating element 20 is installed. Are arranged asymmetrically from each other. This effectively distributes and absorbs heat in the internal space of the housing 30.
  • FIG. 12 is a side cross-sectional view of a trap dispersive heat sink according to a third embodiment of the present invention.
  • the trap dispersing heat sink 10 ′′ according to the third exemplary embodiment of the present invention is mounted inside the housing 30, and the heat absorbing block 100 ′′ and the heat absorbing plate 200 ′′ may be disposed. It is configured to include.
  • the heat absorption block 100 ′′ is connected to one surface of the electronic component heating element 20 to absorb heat of the electronic component heating element 20 and may have a rectangular cross section.
  • the heat absorption block 100 ′′ may have a polygon or a circle other than a rectangular shape.
  • the heat absorption block 100 ′′ may be fixed to the electronic component heating element 20 with a double-sided tape, and may be bolted to a bracket (not shown) that fixes the electronic component heating element 20 to the housing 30.
  • the heat absorption block 100 ′′ may absorb heat generated from the electronic component heating element 20 by conduction and may absorb heat radiated into the space through sidewalls exposed to the space.
  • the heat absorption plate 200 ′′ protrudes in a plate form from the side wall of the heat absorption block 100 ′′ and is spaced apart a predetermined distance along the length direction of the heat absorption block 100 ′′, which is a direction away from the electronic component heating element 20. It is configured to protrude in multiple stages to absorb ambient heat, that is, the heat absorption plate 200 "may be integrally formed with the heat absorption block 100" in the manufacturing process.
  • the plurality of heat absorption plates 210 ", 220", 230 “, and 240" are configured to gradually increase the plate area as they move away from the electronic component heating element 20, through which heat is applied to the space therebetween. Can be captured. Through such a configuration, by dispersing and absorbing the heat generated from the electronic component heating element 20 in a wide space, the temperature difference of each position may be minimized on the surface of the housing 30 and a phenomenon in which a specific point becomes hot may not occur.
  • the plurality of heat absorption plates 210 ", 220", 230 “, and 240" correspond to the structure of the inner space of the housing 30 in which the electronic component heating element 20 is located. Asymmetrically disposed from each other, it is possible to effectively absorb and absorb heat in a limited space inside the housing 30 in which the electronic component heating element 20 is installed.

Abstract

The present invention relates to a technique for preventing the generation of high-temperature heat in a localized area of an external surface of a housing of an electronic product by dispersing, absorbing and collecting heat emitted from an electronic component heating element installed in a limited inner space of the electronic product. The present invention has the advantage of preventing the heat generated in the electronic component heating element from being concentrated toward a particular direction and of effectively dispersing the heat in the inner space of the electronic product, thereby being capable of solving a problem in the conventional art that the external surface of an electronic product where a heatsink is located becomes hot locally.

Description

포집 분산형 히트싱크Capture Distributed Heatsink
본 발명은 전자제품의 한정된 내부 공간에 설치된 전자부품 발열체에서 발열하는 열을 분산 흡수하고 포집함으로써 전자제품 하우징의 외표면 국소 영역에서 고열이 발생하는 것을 방지하는 기술이다.The present invention is a technique for preventing the occurrence of high heat in the local area of the outer surface of the electronics housing by dispersing and absorbing heat generated by the electronic component heating element installed in the limited internal space of the electronics.
더욱 상세하게는, 본 발명은 전자제품 내에 설치된 전자부품 발열체에 열흡수 블록과 열흡수 블록의 길이 방향을 따라 다단으로 다른 면적을 갖는 열흡수 플레이트를 구비하여 전자부품 발열체에서 발생한 열을 열흡수 블록과 열흡수 플레이트에 효과적으로 분산시킨 후 열흡수 플레이트 사이의 공간에 열을 포집함으로써 히트싱크가 위치하는 부분의 전자제품 외표면에만 국소적으로 고열이 발생하는 것을 방지하는 기술에 관한 것이다.More specifically, the present invention provides a heat absorbing block for heat generated in the electronic component heating element by having a heat absorbing plate having different areas in multiple stages along the length direction of the heat absorbing block and the heat absorbing block in the electronic component heating element installed in the electronic product. The present invention relates to a technique for preventing high heat from occurring locally only on the outer surface of an electronic product in a portion where a heat sink is located by effectively dispersing the heat absorbing plate and collecting heat in the space between the heat absorbing plates.
일반적으로 전자제품의 내측에 설치되는 전자부품은 고성능화되어 가는 추세여서 해당 전자부품(예: CPU)에서 고열이 발생하게 된다. 이러한 전자부품에서 고열이 발생하여 특정의 임계온도(예: 80도)를 넘어가게 되면 고장나거나 보호 모드로 인한 성능 저하가 발생한다. 따라서 이를 방지하기 위하여 고열이 발생하는 해당 전자부품에는 히트싱크를 부착하여 그 발생한 열을 전도 현상으로 흡수한 후 대류 현상에 의해 외부로 방열하게 된다.In general, the electronic components installed inside the electronic products tend to be high performance, and high heat is generated in the electronic components (eg, CPU). When these electronic components generate high heat and exceed a certain critical temperature (eg 80 degrees), they can fail or degrade performance due to the protection mode. Therefore, in order to prevent this, a heat sink is attached to the electronic component in which high heat is generated, and the generated heat is absorbed as a conduction phenomenon and then radiated to the outside by convection.
이때, 전자제품의 외부 하우징에는 다수의 통공을 형성하여 히트싱크에서 방열하는 열이 외부로 원활하게 배출되도록 한다. 저성능 전자제품에서는 열이 적게 발생하기에 작은 통공을 소수 형성하면 되지만, 고성능화에 의해 열 발생이 증가함에 따라 큰 통공을 다수 형성해야 한다.In this case, a plurality of through holes are formed in the outer housing of the electronic product so that the heat radiating from the heat sink is smoothly discharged to the outside. In low-performance electronics, less heat is generated, so a small number of small holes need to be formed, but as the heat generation increases due to high performance, many large holes must be formed.
그런데, 방열의 기능적인 면만을 추구하였던 기존의 제품과는 달리 최근의 전자제품(예: 셋톱박스)은 실내 인테리어의 일부로 인식되어 소형, 슬림하게 설계해야 한다는 요구가 커지고 있다. 제품의 고급화를 추구하려면 전자제품의 외부 하우징에 통공을 충분하게 설치하지 못하는데, 이는 제품 내부에서 발생하는 열을 효과적으로 처리하는 데에 큰 장애가 된다.However, unlike conventional products that only pursued the functional aspects of heat dissipation, recent electronic products (eg, set-top boxes) are recognized as part of an interior interior, and the demand for designing them to be small and slim is increasing. The pursuit of higher quality products does not provide sufficient airflow in the exterior housing of electronics, which is a major obstacle to effectively dealing with the heat generated inside the product.
도 1은 종래기술에 따른 일반적인 히트싱크(1)를 전자제품에 장착한 모습을 나타낸 도면이다. 전자제품 내에는 발열체(2), 예컨대 중앙처리장치(CPU)나 신호처리용 반도체가 배치되어 있다. 이러한 발열체(2)가 발생시키는 열을 흡수 및 발산시켜 발열치(2)의 온도를 낮추기 위해서 발열체(2)에 히트싱크(1)를 부착한 모습을 도시하였다.1 is a view showing a state in which a general heat sink 1 according to the prior art is mounted on an electronic product. In the electronic product, a heat generating element 2 such as a central processing unit (CPU) or a signal processing semiconductor is disposed. The heat sink 1 is attached to the heating element 2 in order to absorb and dissipate the heat generated by the heating element 2 to lower the temperature of the heating value 2.
이러한 기존의 히트싱크(1)는 발열체(2)에서 발생하는 열을 접촉면에서 전도 현상에 의해 흡수하여 발열체(2)의 온도를 낮추고, 그 흡수한 열을 대류 현상에 의하여 히트싱크(1) 외부로 발산한다. 이처럼 열이 발산됨에 따라 히트싱크(1) 근처의 공기는 뜨거워지는데 이렇게 뜨거워진 공기는 자연 현상에 의해 한쪽 방향, 예컨대 도 1에서 위쪽으로 흘러서 모이게 된다.The conventional heat sink 1 absorbs heat generated from the heat generating element 2 by conduction phenomenon at the contact surface to lower the temperature of the heat generating element 2, and the absorbed heat outside the heat sink 1 by convection. To diverge. As the heat is dissipated in this way, the air near the heat sink 1 becomes hot. The heated air flows upward in one direction, for example, upward in FIG. 1 by a natural phenomenon.
즉, 히트싱크(1)가 열을 흡수함에 따라 발열체(2)에서 고장이나 성능저하와 같은 문제는 발생하지 않지만, 이렇게 흡수된 열에 의해 뜨겁게 데워진 공기는 대류에 의해 한쪽으로 모이게 된다. 이렇게 모인 뜨거운 공기는 하우징(3)의 특정 영역을 가열하게 되고, 그로 인해 하우징(3)이 국소적으로 매우 뜨거워지는 현상이 발생한다. 이 상태에서 사용자가 전자제품을 만지거나 쥐게 되면 그 뜨거워진 부분으로 인하여 불쾌감을 느끼는 문제점이 있다.That is, as the heat sink 1 absorbs heat, there is no problem such as failure or deterioration in the heating element 2, but the air warmed up by the absorbed heat is gathered to one side by convection. The collected hot air heats a specific area of the housing 3, which causes the housing 3 to be very hot locally. In this state, when the user touches or grabs the electronic product, there is a problem of feeling uncomfortable due to the hot portion.
한편, 전자제품 내부에서 발생하는 열을 좀더 빠르게 배출하기 위하여 랩톱 컴퓨터나 스마트폰을 중심으로 하우징을 금속 재질(예: 알루미늄 합금)로 구성하고 열을 하우징 본체를 통해 발산하려는 시도가 종래에 있었다. 이러한 접근법은 열 발산이라는 측면에서는 매우 효과적이지만 플라스틱 하우징에 비해 제품 단가를 크게 올리기 때문에 가격경쟁이 심한 제품군(예: 셋톱박스, 무선 액세스포인트)에서는 채택하기가 곤란하다.On the other hand, in order to more quickly discharge the heat generated inside the electronics, there has been a conventional attempt to dissipate heat through the housing body of the housing made of a metal material (for example, aluminum alloy) around the laptop computer or smartphone. This approach is very effective in terms of heat dissipation, but it is difficult to adopt in competitively priced products (eg set-top boxes, wireless access points) because it significantly increases product cost compared to plastic housings.
이상과 같이 전자제품의 발열로 인하여 야기되는 복잡한 문제를 해결할 수 있는 기술이 요구된다.As described above, a technology capable of solving a complex problem caused by heat generation of an electronic product is required.
[선행기술문헌][Preceding technical literature]
1. 대한민국 특허출원 10-2008-0004551호 "히트싱크"1. Korean Patent Application No. 10-2008-0004551 "Heat Sink"
2. 대한민국 특허출원 10-2010-0049519호 "공랭식 히트싱크 및 그를 채용한 발광다이오드 램프"2. Korean Patent Application No. 10-2010-0049519 "Air-cooled heat sink and light emitting diode lamp employing it"
3. 대한민국 특허출원 10-2001-0053969호 "적층형 히트싱크"3. Korean Patent Application No. 10-2001-0053969 "Laminated Heat Sink"
본 발명은 상기한 종래기술의 문제점을 감안하여 제안된 것으로, 본 발명의 목적은 전자제품 내에 설치된 전자부품 발열체에 열흡수 블록과 열흡수 블록의 길이 방향을 따라 다단으로 다른 면적을 갖는 열흡수 플레이트를 구비하여 전자부품 발열체에서 발생한 열을 열흡수 블록과 열흡수 플레이트에 효과적으로 분산시킨 후 열흡수 플레이트 사이의 공간에 열을 포집함으로써 히트싱크가 위치하는 부분의 전자제품 외표면에만 국소적으로 고열이 발생하는 것을 방지하는 기술을 제공하는 것이다.The present invention has been proposed in view of the above-described problems of the prior art, and an object of the present invention is a heat absorption plate having different areas in multiple stages along the length direction of a heat absorption block and a heat absorption block in an electronic component heating element installed in an electronic product. By effectively dissipating the heat generated from the electronic component heating element in the heat absorbing block and the heat absorbing plate, and collects heat in the space between the heat absorbing plate, localized high heat only on the outer surface of the electronic product of the portion where the heat sink is located It is to provide a technique to prevent the occurrence.
상기의 목적을 달성하기 위한 본 발명의 제 1 실시예에 따른 포집 분산형 히트싱크는, 일면이 전자부품 발열체에 접촉되어 전자부품 발열체의 열을 흡수하고 전자부품 발열체의 접촉 면 방향으로 다단 적층되는 복수 개의 열흡수 블록(100); 열흡수 블록보다 넓은 단면적의 플레이트 형태로 이루어지고 열흡수 블록 사이마다 적층되며 전자부품 발열체로부터 멀어질수록 점차적으로 면적이 커지게 형성되어 전자부품 발열체에서 발생한 열을 포집 분산하는 복수 개의 열흡수 플레이트(200);를 포함하여 구성된다.According to an embodiment of the present invention, a distributed dispersion heat sink according to a first embodiment of the present invention has one surface contacting an electronic component heating element to absorb heat from the electronic component heating element and being laminated in multiple stages in the contact surface direction of the electronic component heating element. A plurality of heat absorption blocks 100; A plurality of heat absorption plates formed in a plate shape having a larger cross-sectional area than the heat absorption block, stacked between the heat absorption blocks, and gradually increasing in area away from the heat generating electronic component to collect and dissipate heat generated from the heat generating electronic component. 200); including.
이때, 열흡수 블록과 복수 개의 열흡수 플레이트를 전자부품 발열체가 설치된 한정된 공간의 고정 브라켓에 고정하기 위한 고정볼트가 체결될 수 있도록 복수 개의 열흡수 플레이트 중 전자부품 발열체로부터 가장 외곽에 위치한 열흡수 플레이트를 포함하여 적어도 하나 이상이 일직선으로 관통된다.At this time, the heat absorbing plate positioned on the outermost side of the heat generating element of the plurality of heat absorption plates so that the fixing bolt for fastening the heat absorption block and the plurality of heat absorption plates to the fixing bracket of the limited space where the electronic component heating element is installed. Including at least one is penetrated in a straight line.
본 발명의 제 2 실시예에 따른 포집 분산형 히트싱크는, 일면이 전자부품 발열체에 접촉되어 전자부품 발열체의 열을 흡수하는 열흡수 블록(100'); 열흡수 블록의 단면 형상에 대응하여 관통된 플레이트 형태로 이루어지고 전자부품 발열체로부터 멀어지는 열흡수 블록의 길이 방향을 따라 그 관통된 부분이 열흡수 블록에 끼워진 상태로 소정 거리 이격되게 다단 적층되며 전자부품 발열체로부터 멀어질수록 점차적으로 면적이 커지게 형성되어 전자부품 발열체로부터 발생하는 열을 포집 분산하는 복수 개의 열흡수 플레이트(200');를 포함하여 구성된다.According to a second aspect of the present invention, there is provided a trap dispersing heat sink including: a heat absorbing block (100 ′) having one surface thereof in contact with an electronic component heating element to absorb heat from the electronic component heating element; It is formed in the form of a plate penetrated corresponding to the cross-sectional shape of the heat absorbing block, and the multi-stacked parts are spaced apart by a predetermined distance along the length direction of the heat absorbing block away from the heat generating element and inserted into the heat absorbing block. And a plurality of heat absorbing plates 200 ′ formed to gradually increase in area away from the heating element to collect and dissipate heat generated from the electronic component heating element.
본 발명의 제 3 실시예에 따른 포집 분산형 히트싱크는, 일면이 전자부품 발열체에 접촉되어 전자부품 발열체의 열을 흡수하는 열흡수 블록(100"); 열흡수 블록의 측벽으로부터 플레이트 형태로 돌출 형성되고 전자부품 발열체로부터 멀어지는 열흡수 블록의 길이 방향을 따라 소정 거리 이격되게 다단 돌출되며 전자부품 발열체로부터 멀어질수록 점차적으로 면적이 커지게 형성되어 전자부품 발열체로부터 발생하는 열을 포집 분산하는 복수 개의 열흡수 플레이트(200");를 포함하여 구성된다.According to a third aspect of the present invention, there is provided a trap dispersing heat sink including: a heat absorbing block (100 ″) whose one surface is in contact with an electronic component heating element and absorbs heat from the electronic component heating element; Formed and protruded in multiple stages along the longitudinal direction of the heat absorbing block away from the electronic component heating element, and are formed to increase in area as they move away from the electronic component heating element to collect and disperse heat generated from the electronic component heating element. Heat absorption plate 200 ";
한편, 본 발명에서 전자부품 발열체가 설치되는 한정된 공간의 형태에 대응하여 복수 개의 열흡수 플레이트는 열흡수 블록의 중심부로부터 개별적으로 비대칭 배치될 수 있다.Meanwhile, in the present invention, the plurality of heat absorption plates may be asymmetrically disposed separately from the center of the heat absorption block in response to the limited space in which the electronic component heating element is installed.
본 발명에 따르면 전자부품 발열체에서 발생한 열이 특정 방향으로 쏠려 모이지 않고 전자제품 내부 공간에서 효과적으로 분산되도록 함으로써 종래에서의 문제점인 히트싱크가 위치하는 부분의 전자제품 외표면이 국소적으로 뜨거워지는 문제점을 해결할 수 있는 장점이 있다.According to the present invention, the heat generated from the electronic component heating element is effectively concentrated in the internal space of the electronic device without being concentrated in a specific direction, thereby causing a problem that the external surface of the electronic product in the portion where the heat sink is located is locally heated. There is an advantage to solve.
또한, 본 발명에 따르면 전자제품의 하우징 외부 표면이 국소적으로 매우 뜨거워지는 종래의 문제점을 해소하여 해당 제품에 대한 소비자의 선호도와 신뢰도를 향상시킬 수 있는 장점이 있다.In addition, according to the present invention there is an advantage to solve the conventional problem that the housing outer surface of the electronic product is very hot locally to improve the consumer's preference and reliability for the product.
또한, 본 발명에 따르면 전자제품에서 발생하는 열을 효과적으로 처리하게 됨에 따라 고성능 전자제품(예: UHD 지원의 셋톱박스)를 소형, 슬림 타입으로 구성하는 것이 가능해지며 제품 하우징 외부에 통공 형성을 최소화할 수 있어 고급화된 제품 디자인이 가능해지는 장점이 있다.In addition, according to the present invention, by effectively treating the heat generated from electronic products, it is possible to configure high-performance electronic products (such as UHD-supported set-top boxes) in a compact and slim type, and to minimize the formation of air holes outside the product housing. There is an advantage that enables advanced product design.
도 1은 전자제품에 장착된 종래 히트싱크의 개략적인 예시도.1 is a schematic illustration of a conventional heat sink mounted on an electronic product.
도 2는 본 발명에 따른 포집 분산형 히트싱크가 전자제품에 장착된 상태의 예시도.Figure 2 is an exemplary view showing a state in which a distributed collecting heat sink according to the present invention is mounted on an electronic product.
도 3은 본 발명의 제 1 실시예에 따른 포집 분산형 히트싱크의 측단면도.3 is a side cross-sectional view of a trap dissipation heat sink according to a first embodiment of the present invention;
도 4는 본 발명의 제 1 실시예에 따른 포집 분산형 히트싱크의 저면도.Figure 4 is a bottom view of the trap dissipation heat sink according to the first embodiment of the present invention.
도 5는 본 발명의 제 1 실시예에 따른 포집 분산형 히트싱크의 평면도.5 is a plan view of a trap dispersing heat sink according to a first embodiment of the present invention;
도 6은 본 발명에서 열이 분산 흡수되어 히트싱크 주변의 열 분포를 나타낸 예시도.Figure 6 is an exemplary view showing the heat distribution around the heat sink in which heat is dispersed and absorbed in the present invention.
도 7은 본 발명에서 열이 포집되었다가 이동하는 모습을 나타내는 예시도.7 is an exemplary view showing a state in which heat is collected and moved in the present invention.
도 8은 본 발명에 따른 포집 분산형 히트싱크를 사용한 경우에 하우징 외부 표면에 열 분포가 양호해지는 모습을 나타낸 비교 예시도.Figure 8 is a comparative example showing the appearance of a good heat distribution on the outer surface of the housing when using the collecting dispersion heat sink according to the present invention.
도 9와 도 10은 본 발명의 포집 분산형 히트싱크를 장착한 경우와 종래기술의 히트싱크를 장착한 경우에 전자제품(셋톱박스)에서 발생하는 열을 측정하여 나타낸 비교 예시도.9 and 10 are comparative examples showing the measurement of the heat generated in the electronics (set-top box) in the case of mounting the collecting and dispersing heat sink of the present invention and the heat sink of the prior art.
도 11은 본 발명의 제 2 실시예에 따른 포집 분산형 히트싱크의 측단면도.11 is a side cross-sectional view of a trap dispersive heat sink according to a second embodiment of the present invention.
도 12는 본 발명의 제 3 실시예에 따른 포집 분산형 히트싱크의 측단면도.12 is a side cross-sectional view of a trap dissipation type heat sink according to a third embodiment of the present invention.
이하, 도면을 참조하여 본 발명을 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to the drawings.
도 2는 본 발명에 따른 포집 분산형 히트싱크가 전자제품에 장착된 상태의 예시도이다. 전자제품의 하우징(30) 내부에서 고열을 발생시키는 전자부품 발열체(20)에 포집 분산형 히트싱크(10)가 부착된다. 본 발명에 따른 포집 분산형 히트싱크(10)는 전자부품 발열체(20)로부터 열을 분산 흡수한 후, 그 흡수한 열을 하우징(30)의 한정된 공간 내에서 효율적으로 포집 분산한다.Figure 2 is an illustration of a state in which the collection distributed heat sink according to the present invention is mounted on an electronic product. The collecting and dissipating heat sink 10 is attached to the electronic component heating element 20 that generates high heat inside the housing 30 of the electronic product. The collection and dispersion heat sink 10 according to the present invention absorbs and dissipates heat from the electronic component heating element 20, and then efficiently absorbs and dissipates the absorbed heat within a limited space of the housing 30.
본 발명에 따른 포집 분산형 히트싱크(10)는 전자부품 발열체(20)로부터 흡수한 열을 하우징(30) 내부 공간에서 어느 한쪽에서 몰리지 않고 포집 분산시키는데, 이를 통해 하우징(30)에 전달되어 최종적으로 사용자가 체감하는 열이 감소하게 된다. 이를 통해, 종래에서와 같이 히트싱크에 인접된 하우징의 특정 부분이 국소적으로 뜨거워져 전자제품을 만졌을 때 사용자가 불쾌감을 느끼는 문제를 방지할 수 있는 것이다.The capture distribution type heat sink 10 according to the present invention collects and distributes heat absorbed from the electronic component heating element 20 without being driven from either side in the internal space of the housing 30, thereby being transferred to the housing 30 and finally transferred. This reduces the heat experienced by the user. Through this, as in the prior art, a specific portion of the housing adjacent to the heat sink is locally heated to prevent a problem that the user feels uncomfortable when touching the electronic product.
이하, 하우징(30) 내에 장착되는 포집 분산형 히트싱크(10)의 구체적인 구성과 이를 통해 하우징(30) 내에서 발생한 열을 효과적으로 포집 분산시키는 기술적 특징을 구체적으로 살펴본다.Hereinafter, the specific configuration of the trap dispersing heat sink 10 mounted in the housing 30 and the technical features of effectively trapping and dispersing heat generated in the housing 30 will be described in detail.
도 3 내지 도 5는 본 발명의 제 1 실시예에 따른 포집 분산형 히트싱크의 측단면도, 저면도, 평면도를 나타낸다. 도 3 내지 도 5를 참조하면, 제 1 실시예에 따른 포집 분산형 히트싱크는 전자제품의 하우징(30) 내에 장착되며 열흡수 블록(100)과 열흡수 플레이트(200)를 구비한다.3 to 5 show a side cross-sectional view, a bottom view, and a plan view of a collecting dispersion heat sink according to a first embodiment of the present invention. 3 to 5, the collection distributed heat sink according to the first embodiment is mounted in the housing 30 of the electronic product and includes a heat absorption block 100 and a heat absorption plate 200.
열흡수 블록(100)은 복수 개로 이루어지며 전자부품 발열체(20) 상에 다단으로 적층된다. 또한, 제일 아래 단의 열흡수 블록(100)은 그 일면이 전자부품 발열체(20)에 접촉하여 전자부품 발열체(20)의 열을 전도 현상에 의해 흡수하고, 그 흡수한 열을 위쪽으로 전도시킨다.The heat absorption block 100 is composed of a plurality of stacked on the electronic component heating element 20 in multiple stages. In addition, the heat absorption block 100 at the bottom end contacts one surface of the electronic component heating element 20 to absorb the heat of the electronic component heating element 20 by conduction phenomenon, and conducts the absorbed heat upward. .
열흡수 블록(100)은 도 3 및 도 4에서와 같이 플레이트 형태로 이루어지는데 그 형태는 장방형, 다각형, 원형 등으로 선택할 수 있다. 전자부품 발열체(20)에 가장 인접하는 열흡수 블록(100)은 전자부품 발열체(20)에 양면 테이프 또는 접착제로 고정될 수 있다. 또한, 바람직하게는 열흡수 블록(100)이 전자부품 발열체(20)를 하우징(30)에 고정하는 브라켓(미도시)에 추가로 볼트 결합되어 견고하게 고정될 수도 있다.The heat absorption block 100 is formed in a plate shape as shown in Figs. 3 and 4, the shape may be selected as rectangular, polygonal, circular or the like. The heat absorption block 100 most adjacent to the electronic component heating element 20 may be fixed to the electronic component heating element 20 with a double-sided tape or an adhesive. Also, preferably, the heat absorption block 100 may be further bolted to a bracket (not shown) that fixes the electronic component heating element 20 to the housing 30, and may be firmly fixed.
열흡수 블록(100)은 전자부품 발열체(20)로부터 발생하는 열을 전도 현상에 의해 흡수할 수 있으며 공간에 노출된 측벽을 통해 공간상으로 복사된 열을 흡수할 수도 있다.The heat absorption block 100 may absorb heat generated from the electronic component heating element 20 by conduction phenomenon and may absorb heat radiated into the space through sidewalls exposed to the space.
열흡수 플레이트(200)는 열흡수 블록(100)보다 넓은 단면적의 플레이트 형태로 이루어지고 열흡수 블록(100) 사이마다 적층된다. 이때, 복수 개의 열흡수 플레이트(100)가 하나도 빠짐없이 열흡수 블록(100)보다 단면적이 넓은 것이라고 제한할 필요는 없다. 또한, 열흡수 블록(100)의 단면적이 모두 일정하다고 제한할 필요도 없다.The heat absorption plate 200 is formed in a plate shape having a larger cross-sectional area than the heat absorption block 100 and is stacked between the heat absorption blocks 100. At this time, it is not necessary to limit that the plurality of heat absorption plates 100 have a wider cross-sectional area than the heat absorption block 100 without any missing. In addition, it is not necessary to limit that the cross-sectional area of the heat absorption block 100 is all constant.
한편, 복수 개의 열흡수 플레이트(210, 220, 230, 240)는 전자부품 발열체(20)로부터 멀어질수록 점차적으로 면적이 커지게 형성된다. 이를 통해, 전자부품 발열체(20)로부터 흡수한 열을 플레이트 사이의 공간에 포집 분산시킴으로써 하우징(30) 표면이 국소적으로 뜨거워지는 것을 최소화시킬 수 있다.Meanwhile, the plurality of heat absorption plates 210, 220, 230, and 240 are formed to gradually increase in area as they move away from the electronic component heating element 20. Through this, the surface of the housing 30 can be minimized by locally collecting and dispersing heat absorbed from the electronic component heating element 20 in the space between the plates.
즉, 열흡수 플레이트(210, 220, 230, 240)는 전자부품 발열체(20)로부터 열을 흡수한 후에 주변 공기에 발산한다. 이렇게 발산된 열에 의해 하우징(30) 내부의 공기에는 일정한 온도 편차가 발생하고 그로 인해 일정한 방향의 공기 흐름이 발생하고, 그에 따라 해당 일정한 방향으로의 열 흐름이 발생하는 것이 일반적이다. 종래 기술에서는 이렇게 일정한 방향에 따라 열이 흘러 하우징(30)과 만나는 지점에서 모이게 되고, 이처럼 열이 모이는 지점인 하우징(30)의 특정 부분이 국소적으로 뜨거워지는 문제점이 있었다.That is, the heat absorption plates 210, 220, 230, and 240 emit heat to the surrounding air after absorbing heat from the electronic component heating element 20. As a result of the heat dissipated, a constant temperature deviation occurs in the air in the housing 30, and thus, a constant air flow occurs, thereby causing a heat flow in the corresponding constant direction. In the prior art, the heat flows in a predetermined direction so that the heat is collected at the point where the housing 30 meets, and thus, a specific portion of the housing 30, which is the point where heat is collected, is locally heated.
하지만, 본 발명에서는 열흡수 플레이트(210, 220, 230, 240)에 의해 덥혀진 공기가 윗단의 더 넓은 플레이트에 의해 흐름에 방해를 받아 일정한 방향으로 모이지 못한다. 즉, 아래 단의 플레이트(예: 220)에 의해 주변 공기가 덥혀져서 팽창되더라도 윗단의 플레이트(예: 230)가 더 넓게 둘러싸고 있기 때문에 그 사이의 공간에 포집되어 있는 것이다. 이처럼 본 발명의 히트싱크(10)가 발산한 열은 플레이트들 사이의 공간에 포집되어 하우징 쪽으로 이동하지 못하며, 그에 따라 하우징(30)까지 전달되는 열이 크게 감소하게 된다.However, in the present invention, the air warmed up by the heat absorption plates 210, 220, 230, and 240 may not be collected in a certain direction by being blocked by the flow by the wider plate at the upper end. In other words, even if the surrounding air is heated and expanded by the lower plate (eg, 220), the upper plate (eg, 230) is enclosed in a wider space, and thus is trapped in the space therebetween. As such, the heat dissipated by the heat sink 10 of the present invention is collected in the space between the plates and cannot move toward the housing, thereby greatly reducing the heat transferred to the housing 30.
또한, 플레이트 사이의 공간에 포집되어 있던 열이 지나치게 많아지는 경우에도 그러한 열에 의해 뜨거워진 공기는 최상단 플레이트(240)의 주변부에 넓게 퍼져 흩어지기 때문에 크게 문제되지 않는다. 즉, 열흡수 블록(100)을 통해 수직 방향으로 전달된 후 그 바로 위쪽에서 발산되는 열과 플레이트 사이에 포집되어 있다가 상방으로 넓게 흩어지는 열이 하우징(30)의 한 곳에서 모이는 일이 결코 벌어지지 않는 것이다. 그에 따라, 본 발명에 따르면 하우징(30)이 국소적으로 뜨거워지는 현상이 나타내지 않게 된다.In addition, even when the heat collected in the space between the plates is excessively large, the air heated by such heat is not a big problem because it spreads widely around the periphery of the uppermost plate 240. That is, the heat that is transferred between the plate and the heat emitted from the upper portion after being transferred in the vertical direction through the heat absorbing block 100 and scattered widely upwards never accumulates in one place of the housing 30. It is not lost. Therefore, according to the present invention, the phenomenon in which the housing 30 is locally heated is not exhibited.
한편, 전자부품 발열체(20)가 설치되는 하우징(30) 내부의 형태에 대응하여 복수 개의 열흡수 플레이트(210, 220, 230, 240)는 적어도 하나 이상이 열흡수 블록(100)의 중심부로부터 개별적으로 비대칭 배치될 수 있다. 이처럼 본 발명은 열흡수 플레이트의 배치가 자유롭기에 하우징(30) 내에서 전자부품 발열체(20)가 설치된 공간의 제한사항을 고려하여 배치될 수 있다.Meanwhile, at least one of the plurality of heat absorption plates 210, 220, 230, and 240 corresponds to a shape inside the housing 30 in which the electronic component heating element 20 is installed, from the center of the heat absorption block 100. It can be arranged asymmetrically. As such, the present invention may be disposed in consideration of the limitation of the space in which the electronic component heating element 20 is installed in the housing 30 because the heat absorption plate is freely disposed.
이때, 전자부품 발열체(20)로부터 발생하는 열은 열흡수 블록(100)과 복수 개의 열흡수 플레이트(210, 220, 230, 240)를 통하여 점차적으로 전도하여 분산될 수 있다. 전자부품 발열체(20)에서 공기 중으로 복사된 열도 상대적인 온도차에 의해 열흡수 블록(100)의 측벽이나 복수 개의 열흡수 플레이트(210, 220, 230, 240)에 흡수될 수 있다. 반대로, 상대적인 온도차에 따라서는 열흡수 블록(100)의 측벽 및 열흡수 플레이트(210, 220, 230, 240)에서 열이 발산되어 열흡수 플레이트 사이의 공간에 열이 포집될 수도 있다.In this case, heat generated from the electronic component heating element 20 may be gradually conducted and distributed through the heat absorption block 100 and the plurality of heat absorption plates 210, 220, 230, and 240. Heat radiated from the electronic component heating element 20 into the air may also be absorbed by the side walls of the heat absorption block 100 or the plurality of heat absorption plates 210, 220, 230, and 240 by a relative temperature difference. On the contrary, heat may be dissipated from the side walls of the heat absorption block 100 and the heat absorption plates 210, 220, 230, and 240 according to the relative temperature difference, and heat may be collected in the space between the heat absorption plates.
이를 통해, 전자부품 발열체(20)에 발생한 열은 하우징(30) 내부의 한정된 공간에서 효과적으로 포집되고 골고루 분산되어 하우징(30)의 넓은 표면으로 방열될 수 있기 때문에 하우징(30)의 표면이 국소적으로 가열되는 종래기술의 문제점을 방지할 수 있다. 이러한 장점은 전자제품이 소형화, 슬림화, 고급화되는 현재의 트랜드를 감안할 때 매우 중요하다.Through this, the heat generated in the electronic component heating element 20 can be effectively collected and evenly distributed in the limited space inside the housing 30 to radiate heat to the large surface of the housing 30, so that the surface of the housing 30 is locally It is possible to prevent the problem of the prior art that is heated to. This advantage is very important given the current trend of miniaturization, slimming and high-end electronics.
한편, 하우징(30)의 내측에는 전자부품 발열체(20) 외에도 개별 전자부품들이 실장될 수 있다. 이들 개별 전자부품들의 위치를 고려하여 복수 개의 열흡수 플레이트(210, 220, 230, 240)의 전부 또는 일부가 열흡수 블록(100)의 중심부로부터 개별적으로 비대칭적으로 배치되어 하우징(30)의 한정된 공간에서 열의 분산을 효과적으로 수행할 수 있다.Meanwhile, in addition to the electronic component heating element 20, individual electronic components may be mounted inside the housing 30. In consideration of the positions of these individual electronic components, all or part of the plurality of heat absorption plates 210, 220, 230, and 240 may be individually asymmetrically disposed from the center of the heat absorption block 100 to define the housing 30. It is possible to effectively dissipate heat in space.
그리고, 열흡수 블록(100)과 복수 개의 열흡수 플레이트(210, 220, 230, 240)를 전자부품 발열체(20)가 설치된 한정된 공간의 고정 브라켓(미도시)에 고정하기 위한 고정볼트가 체결될 수 있도록 복수 개의 열흡수 플레이트(210, 220, 230, 240) 중 전자부품 발열체(20)로부터 가장 외곽에 위치한 열흡수 플레이트(240)를 포함하여 적어도 하나 이상이 일직선으로 관통되어 관통부(h)를 구성한다.In addition, a fixing bolt for fastening the heat absorption block 100 and the plurality of heat absorption plates 210, 220, 230, and 240 to a fixing bracket (not shown) in a limited space in which the electronic component heating element 20 is installed may be fastened. At least one of the plurality of heat absorption plates 210, 220, 230, and 240 includes a heat absorption plate 240 positioned on the outermost side of the electronic component heating element 20 so as to penetrate in a straight line to penetrate the h. Configure
도 6은 본 발명에서 열이 분산 흡수되어 히트싱크 주변의 열 분포를 나타낸 예시도이고, 도 7은 본 발명에서 열이 포집되었다가 이동하는 모습을 나타내는 예시도이다. 또한, 도 8은 본 발명에 따른 포집 분산형 히트싱크를 사용한 경우에 열이 포집 및 분산 흡수되어 하우징 외부 표면에 열 분포가 양호해지는 모습을 나타낸 비교 예시도이다.Figure 6 is an exemplary view showing the heat distribution around the heat sink in the heat dissipation absorbed in the present invention, Figure 7 is an exemplary view showing a state that the heat is collected and moved in the present invention. In addition, Figure 8 is a comparative example showing the appearance that the heat distribution is good on the outer surface of the housing by collecting and dissipating and absorbing heat in the case of using the collecting dispersion heat sink according to the present invention.
도 6 내지 도 8을 참조하면, 본 발명에 따른 히트싱크(10)를 장착한 상태로 전자제품(예: 셋톱박스)을 소정 시간 동작시킨 이후에 히트싱크(10)에 대응하는 위치의 전자제품 하우징(30) 외부 표면에 대해 온도를 측정한 결과를 나타낸다. 그 측정된 값을 살펴보면 복수 개의 열흡수 플레이트(210, 220, 230, 240) 중 가장 상부에 위치하는 열흡수 플레이트(240)을 기준으로 중앙부는 대략 71.2℃, 주변부는 대략 67.1 ~ 68.8℃의 온도 분포를 나타내었다.6 to 8, after the electronic device (eg, the set-top box) is operated for a predetermined time with the heat sink 10 according to the present invention mounted thereon, the electronic product at a position corresponding to the heat sink 10. The result of measuring the temperature with respect to the outer surface of the housing 30 is shown. Looking at the measured values, the temperature of the center portion is about 71.2 ℃, the peripheral portion is about 67.1 ~ 68.8 ℃ based on the heat absorption plate 240 located at the top of the plurality of heat absorption plates (210, 220, 230, 240) Distribution.
즉, 열흡수 플레이트(210, 220, 230, 240) 중 가장 상부에 위치하는 열흡수 플레이트(240)에 대응하는 전자제품의 하우징(30) 외표면에서 3℃ 정도의 오차 범위로 균일한 온도 분포를 나타냄을 알 수 있다.That is, uniform temperature distribution with an error range of about 3 ° C. on the outer surface of the housing 30 of the electronic product corresponding to the heat absorption plate 240 positioned at the top of the heat absorption plates 210, 220, 230, and 240. It can be seen that.
상세하게 기술하면, 전자제품 하우징(30) 내에 실장된 전자부품 발열체(20)에서 발생하는 열이 전자부품 발열체(20)의 규격에 대응하는 열흡수 블록(100)과 전자부품 발열체(20)로부터 멀어질수록 면적이 넓어지는 열흡수 플레이트(210, 220, 230, 240)를 다단으로 이격되게 배치하여 전자제품 하우징(30) 내에서 발생한 열을 효과적으로 넓게 분산함을 알 수 있다.In detail, the heat generated from the electronic component heating element 20 mounted in the electronics housing 30 may be transferred from the heat absorption block 100 and the electronic component heating element 20 corresponding to the specification of the electronic component heating element 20. It can be seen that the heat absorbing plates 210, 220, 230, and 240, which are larger in area, are spaced apart in multiple stages to effectively disperse heat generated in the electronics housing 30.
그러나, 기존에는 전자부품 발열체의 단면적과 동일한 규격의 히트싱크를 전자부품 발열체에 부착하여 전자부품 발열체에서 발생한 열을 집중적으로 방열하는 것에만 치우진 나머지, 열이 특정 방향으로 흘러 하우징과 만나는 지점에서 모여드는 현상에 의해 하우징의 특정 부분이 국소적으로 가열되어 매우 뜨거워지는 문제점이 있었다.However, in the past, the heat sink having the same size as the cross-sectional area of the electronic component heating element is attached to the electronic component heating element so that only the heat generated from the electronic component heating element is intensively dissipated. Due to the gathering phenomenon, a specific portion of the housing is locally heated, which is very hot.
이렇게 기존과 같이 전자제품 하우징의 국소 영역에서 고열로 방열되는 문제에 대해 본 발명은 열을 하우징 내부의 공간에 포집하는 한편, 전자제품 하우징의 최대한 넓은 외표면으로 열을 분산하면서 방열할 수 있도록 개선하는 것이 해결 과제이다. 구체적으로는 일반적인 히트싱크를 통해 방열될 때 전자제품의 하우징에서 가장 높은 온도를 나타내는 부분에 대해 대략 10℃를 다운시키고 다운시킨 열을 전자제품 하우징의 다른 범위로 분산시킬 수 있도록 하는 히트싱크(10)를 구현하는 것이다.As described above, the present invention improves the heat dissipation while dissipating heat to the widest outer surface of the electronics housing, while collecting heat in the space inside the housing, while dissipating heat at a high temperature in the local area of the electronics housing. Is a challenge. Specifically, a heat sink (10) which, when radiated through a general heat sink, allows the heat of 10 degrees down to the highest temperature portion of the housing of the electronics and dissipates the heat down to another range of the electronics housing. ) Is implemented.
이를 위해, 본 발명에 따른 히트싱크(10)는 전자부품 발열체(20)에서 발생된 열을 전도에 의해 열흡수 블록(100)과 열흡수 플레이트(210, 220, 230, 240)로 일차 흡수한 후, 대류에 의해 열흡수 플레이트(210, 220, 230, 240) 사이의 공간으로 포집할 수 있도록 구성하였다. 이처럼 열 포집이 이루어질 수 있도록 열흡수 플레이트(210, 220, 230, 240)는 전자부품 발열체(20)로부터 멀어질수록 점차적으로 커지도록 구성하는 것이다.To this end, the heat sink 10 according to the present invention primarily absorbs the heat generated from the electronic component heating element 20 to the heat absorption block 100 and the heat absorption plate (210, 220, 230, 240) by conduction. Then, it was configured to be collected by the convection into the space between the heat absorption plates (210, 220, 230, 240). As such, the heat absorption plates 210, 220, 230, and 240 may be configured to gradually increase as they move away from the electronic component heating element 20 so that heat collection may occur.
종래의 히트싱크에서는 이러한 열 포집 작용이 결여되어 있기에 대류 작용에 의해 열이 위쪽으로 모이게 되어 해당 하우징 부분이 뜨겁게 데워지는 문제점이 있었던 것이다.In the conventional heat sink, such a heat trapping action is lacking, so that the heat is collected upward by the convection action, thereby causing a problem in that the housing portion is warmed up.
이와 같은 구성을 통하여 본 발명에서는 열 포집 및 분산 작용이 발생하며, 그로 인하여 전자제품의 하우징(30) 내에서 히트싱크(10)에 인접하는 국소 영역이 높은 온도로 가열되는 일이 발생하지 않는다. Through such a configuration, heat collection and dissipation actions occur in the present invention, whereby a local region adjacent to the heat sink 10 is not heated to a high temperature in the housing 30 of the electronic product.
종래기술에서는 국소적으로 고온이 됨에 따라 해당 지점에 배치된 전자부품의 기능이 저하되거나 사용연한이 단축되는 문제점도 있었으나 본 발명에서는 그와 같은 문제점이 발생하지 않는다.In the prior art, there is a problem in that the function of the electronic component disposed at a corresponding point is degraded or the service life is shortened as the temperature is locally high, but such a problem does not occur in the present invention.
도 9와 도 10은 본 발명의 제 1 실시예에 따른 포집 분산형 히트싱크를 장착한 경우와 종래기술에 따른 일반적인 히트싱크를 장착한 경우에 전자제품(셋톱박스)에서 발생하는 열을 측정하여 나타낸 비교 예시도이다. 도 9와 도 10을 참조하여 본 발명의 제 1 실시예에 따른 포집 분산형 히트싱크가 장착된 셋톱박스 외표면의 온도변화와 종래기술의 히트싱크가 장착된 셋톱박스 외표면의 온도변화를 비교하여 살펴본다.9 and 10 are measured by measuring the heat generated in the electronics (set-top box) in the case of mounting the collecting dispersion heat sink according to the first embodiment of the present invention and in the case of mounting a general heat sink according to the prior art It is a comparative example shown. 9 and 10, the temperature change of the set top box outer surface equipped with the distributed dispersion heat sink according to the first embodiment of the present invention and the set top box outer surface equipped with the conventional heat sink are compared. Take a look.
먼저, 도 9를 참조하면 셋톱박스에 일반적인 히트싱크가 장착된 "비교예 1 내지 3"과 본 발명의 제 1 실시예에 따른 포집 분산형 히트싱크가 장착된 "제 1 실시예"가 표시되어 있다.First, referring to FIG. 9, "Comparative Examples 1 to 3" in which a set heat box is mounted, and "First Embodiment" in which a distributed distributed heat sink according to the first embodiment of the present invention are mounted are shown. have.
"표면 온도(△17℃)"는 셋톱박스가 소정 시간 동작했을 때 히트싱크가 위치하지 않는 셋톱박스의 외곽테두리 온도보다 17℃ 이상 높은 부분을 의미하는 것이다.“Surface temperature (Δ17 ° C.”) means a part that is 17 ° C. or more higher than the outer edge temperature of the set top box where the heat sink is not located when the set top box is operated for a predetermined time.
비교 실험에서는 셋톱박스 외표면 중 히트싱크로부터 가장 먼 셋톱박스의 외곽테두리와 히트싱크와 인접하는 셋톱박스의 외표면에 온도감지센서를 복수 개 부착하였다. 해당 포인트에서 온도감지센서들이 측정한 값들로부터 셋톱박스 외표면에서 위치에 따른 온도 분포를 확인할 수 있다.In the comparative experiment, a plurality of temperature sensors were attached to the outer edges of the set top box and the outer surface of the set top box adjacent to the heat sink. From the values measured by the temperature sensors at that point, you can see the temperature distribution along the location on the outer surface of the set-top box.
"비교예 1 내지 3"과 "제 1 실시예"에서 온도감지센서가 온도를 센싱하는 부분은 셋톱박스의 외표면에서 동일한 위치로 하여 실험하였다.In "Comparative Examples 1 to 3" and "First Example", the temperature sensing part of the temperature sensor was experimented with the same position on the outer surface of the set top box.
상세하게, "비교예 2"에서 셋톱박스의 외곽테두리 온도보다 17℃ 이상 높은 부분이 가장 넓게 분포하여 해당 위치에서 셋톱박스 내측의 개별 전자부품에 기능 저하가 우려됨을 알 수 있다.In detail, in Comparative Example 2, a portion of the set-top box having a temperature higher than 17 ° C. or more than the outer edge temperature of the set-top box is most widely distributed, and thus, it may be understood that the functional deterioration of the individual electronic parts inside the set-top box is concerned.
이어서, "비교예 3"와 "비교예 1"의 순서로 셋톱박스의 외곽테두리 온도보다 17℃ 이상 높은 부분이 넓게 분포하여 해당 위치에서 셋톱박스 내측의 개별 전자부품에 기능 저하가 우려됨을 알 수 있다.Subsequently, in the order of "Comparative Example 3" and "Comparative Example 1", the portions of the set-top box that are 17 ° C or higher than the outer edge temperature of the set-top box are widely distributed. have.
이에 반해, 본 발명의 제 1 실시예에 따른 포집 분산형 히트싱크가 장착된 셋톱박스로서 "제 1 실시예"는 셋톱박스의 외곽테두리 온도보다 17℃ 이상 높은 부분이 가장 좁게 분포하여 해당 위치에서 셋톱박스 내측의 개별 전자부품에 기능 저하 가능성이 가장 낮음을 확인할 수 있다.On the contrary, as the set-top box equipped with the collecting and dissipating heat sink according to the first embodiment of the present invention, the "first embodiment" has a narrowest distribution of a portion higher than the outer edge temperature of the set-top box by 17 ° C. Individual electronic components inside the set-top box have the lowest probability of functional degradation.
또한, "표면 온도(△18℃)" 즉, 셋톱박스의 외곽테두리 온도보다 18℃ 이상 높은 부분이 발생하는 영역도 "제 1 실시예"가 "비교예 1 내지 3"보다 확연히 좁게 분포함을 알 수 있다.In addition, the "surface temperature (Δ18 ° C)", that is, the area where the portion of the set-top box 18 ° C or more higher than the outer edge temperature is also significantly narrower than the "Comparative Examples 1 to 3" Able to know.
도 10을 참조하면 "표면 온도(△20℃)" 즉, 셋톱박스의 외곽테두리 온도보다 20℃ 이상 높은 부분이 발생하는 영역은 "비교예 1 내지 3"와는 달리 "제 1 실시예"에서는 거의 나타나지 않아 셋톱박스 내에서 포집 분산형 히트싱크(10)에 의해 열의 효과적인 분산이 이루어짐을 알 수 있다.Referring to FIG. 10, an area in which a portion of the surface temperature (Δ20 ° C.), that is, 20 ° C. or more higher than the outer edge temperature of the set-top box, is generated in the first embodiment, unlike in Comparative Examples 1 to 3. FIG. It can be seen that the effective dispersion of heat is achieved by the trap dissipation heat sink 10 in the set top box.
도 11은 본 발명의 제 2 실시예에 따른 포집 분산형 히트싱크의 측단면도이다. 도 11을 참조하면, 본 발명의 제 2 실시예에 따른 포집 분산형 히트싱크(10')는 하우징(30)의 내측에 실장되며 열흡수 블록(100')과 열흡수 플레이트(200')를 포함하여 구성된다.11 is a side cross-sectional view of a trap dispersive heat sink according to a second embodiment of the present invention. Referring to FIG. 11, the trap dispersive heat sink 10 ′ according to the second embodiment of the present invention is mounted inside the housing 30 and includes a heat absorption block 100 ′ and a heat absorption plate 200 ′. It is configured to include.
열흡수 블록(100')은 전자부품 발열체(20)의 일면에 연결되어 전자부품 발열체(20)의 열을 흡수하며 단면이 장방형으로 이루어질 수 있으며, 장방형 이외의 다각형 또는 원형으로 구성될 수도 있다. 열흡수 블록(100')은 전자부품 발열체(20)에 양면 테이프로 고정될 수 있으며 전자부품 발열체(20)를 하우징(30)에 고정하는 브라켓(미도시)에 볼트 결합될 수도 있다.The heat absorption block 100 ′ is connected to one surface of the electronic component heating element 20 to absorb heat from the electronic component heating element 20 and may have a rectangular cross section. The heat absorption block 100 ′ may have a polygon or a circle other than a rectangular shape. The heat absorption block 100 ′ may be fixed to the electronic component heating element 20 with a double-sided tape, and may be bolted to a bracket (not shown) that fixes the electronic component heating element 20 to the housing 30.
열흡수 블록(100')은 전자부품 발열체(20)로부터 발생하는 열을 전도에 의해 흡수할 수 있으며 공간에 노출된 측벽을 통해 공간상으로 복사된 열을 흡수할 수도 있다.The heat absorption block 100 ′ may absorb heat generated from the electronic component heating element 20 by conduction, and may absorb heat radiated into the space through sidewalls exposed to the space.
열흡수 플레이트(200')는 열흡수 블록(100')의 단면 형상에 대응하여 소정 부분이 관통된 플레이트 형태로 이루어지고 전자부품 발열체(20)로부터 멀어지는 방향인 열흡수 블록(100')의 길이 방향을 따라 관통된 소정 부분이 열흡수 블록(100')에 끼워진 상태로 소정 거리 이격되게 다단 적층되어 주변 열을 흡수하도록 구성된다. 이때, 열흡수 블록(100')이 끼워지도록 열흡수 플레이트(200')에 관통된 부분을 '블록관통부'라고 부른다.The heat absorption plate 200 ′ is formed in a plate shape through which a predetermined portion penetrates corresponding to the cross-sectional shape of the heat absorption block 100 ′, and the length of the heat absorption block 100 ′ is a direction away from the electronic component heating element 20. The predetermined portion penetrated along the direction is stacked in multiple stages spaced apart by a predetermined distance in a state of being fitted into the heat absorption block 100 'to absorb surrounding heat. At this time, the portion penetrated through the heat absorption plate 200 'so that the heat absorption block 100' is fitted is referred to as a 'block through portion'.
여기서, 복수 개의 열흡수 플레이트(210', 220', 230', 240')는 전자부품 발열체(20)로부터 멀어질수록 점차적으로 면적이 커지게 형성된다. 이를 통해 하우징(30) 내부에 설치된 전자부품 발열체(20)에서 발생한 열을 넓게 분산시키면서 흡수함으로써 전자부품 발열체(20)를 실장하는 하우징(30) 표면에서 위치별 온도차를 최소화시킬 수 있다.Here, the plurality of heat absorption plates 210 ', 220', 230 ', 240' are formed to gradually increase in area as they move away from the electronic component heating element 20. As a result, by dispersing and dissipating heat generated in the electronic component heating element 20 installed inside the housing 30, the temperature difference of each position may be minimized on the surface of the housing 30 on which the electronic component heating element 20 is mounted.
또한, 복수 개의 열흡수 플레이트(210', 220', 230', 240')는 전자부품 발열체(20)가 설치되는 하우징(30) 내부 공간의 구조에 대응하여 열흡수 블록(100')의 중심부로부터 각각 비대칭적으로 배치된다. 이를 통해 하우징(30)의 내부 공간에서 열을 효과적으로 분산 흡수하도록 한다.In addition, the plurality of heat absorption plates 210 ′, 220 ′, 230 ′, and 240 ′ correspond to the center of the heat absorption block 100 ′ corresponding to the structure of the internal space of the housing 30 in which the electronic component heating element 20 is installed. Are arranged asymmetrically from each other. This effectively distributes and absorbs heat in the internal space of the housing 30.
도 12는 본 발명의 제 3 실시예에 따른 포집 분산형 히트싱크의 측단면도이다. 도 12를 참조하면, 본 발명의 제 3 실시예에 따른 포집 분산형 히트싱크(10")는 하우징(30)의 내측에 실장되며 열흡수 블록(100")과 열흡수 플레이트(200")를 포함하여 구성된다.12 is a side cross-sectional view of a trap dispersive heat sink according to a third embodiment of the present invention. Referring to FIG. 12, the trap dispersing heat sink 10 ″ according to the third exemplary embodiment of the present invention is mounted inside the housing 30, and the heat absorbing block 100 ″ and the heat absorbing plate 200 ″ may be disposed. It is configured to include.
열흡수 블록(100")은 전자부품 발열체(20)의 일면에 연결되어 전자부품 발열체(20)의 열을 흡수하며 단면이 장방형으로 이루어질 수 있으며, 장방형 이외의 다각형 또는 원형으로 구성될 수도 있다. 열흡수 블록(100")은 전자부품 발열체(20)에 양면 테이프로 고정될 수 있으며 전자부품 발열체(20)를 하우징(30)에 고정하는 브라켓(미도시)에 볼트 결합될 수도 있다.The heat absorption block 100 ″ is connected to one surface of the electronic component heating element 20 to absorb heat of the electronic component heating element 20 and may have a rectangular cross section. The heat absorption block 100 ″ may have a polygon or a circle other than a rectangular shape. The heat absorption block 100 ″ may be fixed to the electronic component heating element 20 with a double-sided tape, and may be bolted to a bracket (not shown) that fixes the electronic component heating element 20 to the housing 30.
열흡수 블록(100")은 전자부품 발열체(20)로부터 발생하는 열을 전도에 의해 흡수할 수 있으며 공간에 노출된 측벽을 통해 공간상으로 복사된 열을 흡수할 수도 있다.The heat absorption block 100 ″ may absorb heat generated from the electronic component heating element 20 by conduction and may absorb heat radiated into the space through sidewalls exposed to the space.
열흡수 플레이트(200")는 열흡수 블록(100")의 측벽으로부터 플레이트 형태로 돌출 형성되고 전자부품 발열체(20)로부터 멀어지는 방향인 열흡수 블록(100")의 길이 방향을 따라 소정 거리 이격되게 다단 돌출되어 주변 열을 흡수하도록 구성된다. 즉, 열흡수 플레이트(200")는 열흡수 블록(100")과 제작과정에서 일체로 형성될 수 있다.The heat absorption plate 200 ″ protrudes in a plate form from the side wall of the heat absorption block 100 ″ and is spaced apart a predetermined distance along the length direction of the heat absorption block 100 ″, which is a direction away from the electronic component heating element 20. It is configured to protrude in multiple stages to absorb ambient heat, that is, the heat absorption plate 200 "may be integrally formed with the heat absorption block 100" in the manufacturing process.
여기서, 복수 개의 열흡수 플레이트(210", 220", 230", 240")는 전자부품 발열체(20)로부터 멀어질수록 점차적으로 플레이트 면적이 커지도록 구성되어 있으며 이를 통해 그 사이의 공간에 열을 포집할 수 있다. 이러한 구성을 통하여 전자부품 발열체(20)로부터 발생하는 열을 넓은 공간에서 분산 흡수함으로써 하우징(30) 표면에서 위치별 온도차를 최소화하고 특정 지점이 뜨거워지는 현상이 발생하지 않도록 할 수 있다.Here, the plurality of heat absorption plates 210 ", 220", 230 ", and 240" are configured to gradually increase the plate area as they move away from the electronic component heating element 20, through which heat is applied to the space therebetween. Can be captured. Through such a configuration, by dispersing and absorbing the heat generated from the electronic component heating element 20 in a wide space, the temperature difference of each position may be minimized on the surface of the housing 30 and a phenomenon in which a specific point becomes hot may not occur.
또한, 복수 개의 열흡수 플레이트(210", 220", 230", 240")는 전자부품 발열체(20)가 위치하는 하우징(30) 내부 공간의 구조에 대응하여 열흡수 블록(100")의 중심부로부터 각각 비대칭적으로 배치된다. 이를 통해 전자부품 발열체(20)가 설치되어 있는 하우징(30) 내부의 한정된 공간에서 열을 효과적으로 분산 흡수할 수 있게 되는 것이다.In addition, the plurality of heat absorption plates 210 ", 220", 230 ", and 240" correspond to the structure of the inner space of the housing 30 in which the electronic component heating element 20 is located. Asymmetrically disposed from each other, it is possible to effectively absorb and absorb heat in a limited space inside the housing 30 in which the electronic component heating element 20 is installed.

Claims (5)

  1. 일면이 전자부품 발열체에 접촉되어 상기 전자부품 발열체의 열을 흡수하고 상기 전자부품 발열체의 접촉면 방향으로 다단 적층되는 복수 개의 열흡수 블록(100);A plurality of heat absorption blocks (100) whose one surface is in contact with the electronic component heating element to absorb heat from the electronic component heating element and is stacked in multiple stages in the direction of the contact surface of the electronic component heating element;
    상기 열흡수 블록보다 넓은 단면적의 플레이트 형태로 이루어지고 상기 열흡수 블록 사이마다 적층되고 상기 전자부품 발열체로부터 멀어질수록 점차적으로 면적이 커지게 형성되어 상기 전자부품 발열체에서 발생한 열을 포집 분산하며 상기 열흡수 블록의 중심부로부터 개별적으로 비대칭 배치되는 복수 개의 열흡수 플레이트(200);It is formed in the form of a plate having a larger cross-sectional area than the heat absorbing block and is stacked between the heat absorbing blocks, and gradually increases in area as it moves away from the heat generating electronic component, thereby collecting and dispersing heat generated in the heat generating electronic component. A plurality of heat absorption plates 200 asymmetrically disposed separately from the center of the absorption block;
    를 포함하여 구성되는 포집 분산형 히트싱크.Capture distributed heatsink configured to include.
  2. 청구항 1에 있어서,The method according to claim 1,
    상기 열흡수 블록과 상기 복수 개의 열흡수 플레이트를 상기 전자부품 발열체가 설치된 한정된 공간의 고정 브라켓에 고정하기 위한 고정볼트가 체결될 수 있도록 상기 복수 개의 열흡수 플레이트 중 상기 전자부품 발열체로부터 가장 외곽에 위치한 상기 열흡수 플레이트를 포함하여 적어도 하나 이상이 일직선으로 관통되는 것을 특징으로 하는 포집 분산형 히트싱크.The heat absorbing block and the plurality of heat absorption plates positioned on the outermost side of the plurality of heat absorption plates to the fixing bolt for fastening the fixing bolt for fixing the fixed bracket in a limited space in which the electronic component heating element is installed At least one trap including the heat-absorbing plate penetrates in a straight line, characterized in that the distributed dispersion heat sink.
  3. 일면이 전자부품 발열체에 접촉되어 상기 전자부품 발열체의 열을 흡수하는 열흡수 블록(100');A heat absorption block (100 ') having one surface in contact with the electronic component heating element to absorb heat from the electronic component heating element;
    상기 열흡수 블록의 단면 형상에 대응하여 소정 부분에 블록관통부가 형성된 플레이트 형태로 이루어지고 상기 전자부품 발열체로부터 멀어지는 상기 열흡수 블록의 길이 방향을 따라 상기 블록관통부가 상기 열흡수 블록에 끼워진 상태로 소정 거리 이격되게 다단 적층되고 상기 전자부품 발열체로부터 멀어질수록 점차적으로 면적이 커지게 형성되어 상기 전자부품 발열체로부터 발생하는 열을 포집 분산하며 상기 열흡수 블록의 중심부로부터 개별적으로 비대칭 배치되는 복수 개의 열흡수 플레이트(200');The block penetrating portion is formed in a plate shape corresponding to a cross-sectional shape of the heat absorbing block, and the block penetrating portion is inserted into the heat absorbing block along a length direction of the heat absorbing block away from the electronic component heating element. A plurality of heat absorbers are stacked in a plurality of steps spaced apart from each other, and gradually increase in area as they move away from the electronic component heating element to collect and disperse heat generated from the electronic component heating element, and are arranged asymmetrically from the center of the heat absorption block. Plate 200 ';
    를 포함하여 구성되는 포집 분산형 히트싱크.Capture distributed heatsink configured to include.
  4. 일면이 전자부품 발열체에 접촉되어 상기 전자부품 발열체의 열을 흡수하는 열흡수 블록(100");A heat absorption block (100 ") having one surface in contact with the electronic component heating element to absorb heat from the electronic component heating element;
    상기 열흡수 블록의 측벽으로부터 플레이트 형태로 돌출 형성되고 상기 전자부품 발열체로부터 멀어지는 상기 열흡수 블록의 길이 방향을 따라 소정 거리 이격되게 다단 돌출되고 상기 전자부품 발열체로부터 멀어질수록 점차적으로 면적이 커지게 형성되어 상기 전자부품 발열체로부터 발생하는 열을 포집 분산하며 상기 열흡수 블록의 중심부로부터 개별적으로 비대칭 배치되는 복수 개의 열흡수 플레이트(200");Protrudingly formed in the form of a plate from the side wall of the heat absorbing block and protruded in multiple stages along the longitudinal direction of the heat absorbing block away from the electronic component heating element, and gradually increases in area as it moves away from the electronic component heating element. A plurality of heat absorbing plates (200 ") configured to collect and dissipate heat generated from the electronic component heating elements and are arranged asymmetrically from a central portion of the heat absorbing block;
    를 포함하여 구성되는 포집 분산형 히트싱크.Capture distributed heatsink configured to include.
  5. 청구항 1 내지 4 중 어느 하나의 항에 있어서,The method according to any one of claims 1 to 4,
    상기 전자부품 발열체가 설치되는 한정된 공간의 형태에 대응하여 상기 복수 개의 열흡수 플레이트는 상기 열흡수 블록의 중심부로부터 개별적으로 비대칭 배치된 것을 특징으로 하는 포집 분산형 히트싱크.The plurality of heat absorption plates are asymmetrically disposed separately from the center of the heat absorption block in accordance with the form of the limited space in which the electronic component heating element is installed.
PCT/KR2015/010746 2014-11-16 2015-10-13 Collection and dispersion type heatsink WO2016076538A1 (en)

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