TWI537567B - Electronic load testing device - Google Patents
Electronic load testing device Download PDFInfo
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- TWI537567B TWI537567B TW103125546A TW103125546A TWI537567B TW I537567 B TWI537567 B TW I537567B TW 103125546 A TW103125546 A TW 103125546A TW 103125546 A TW103125546 A TW 103125546A TW I537567 B TWI537567 B TW I537567B
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Description
本發明係關於一種電子負載測試裝置，特別是一種提升散熱效率的電子負載測試裝置。 The invention relates to an electronic load testing device, in particular to an electronic load testing device for improving heat dissipation efficiency.
電子負載測試裝置包含單通道機種及多通道機種。單通道機種可供單通道形式的待測物測試。多通道機種可供多個單通道形式的待測物測試，或是供多通道形式的待測物測試。因此，對於有多通道測試需求的使用者來說，採用多通道機種的測試成本實際上係少於採用單通道機種的測試成本。 The electronic load test device includes a single channel model and a multi-channel model. The single channel model allows testing of the object under test in a single channel. Multi-channel models can be tested in multiple single-channel test objects or in multi-channel test objects. Therefore, for users with multi-channel testing requirements, the cost of testing with multi-channel models is actually less than the cost of testing with single-channel models.
雙通道機種包含至少二負載電路模組及一散熱片，二負載電路模組將熱傳導至散熱片，以降低二負載電路模組的工作溫度。然而，為了避免二負載電路模組共同接觸散熱片而造成二負電路模組之電路相互干擾，一般會在負載電路模組與散熱片之間夾一層導熱絕緣材質。但不論導熱絕緣材質的導熱係數多好，負載電路與散熱片間隔一絕緣介質的散熱效果就是無法超越負載電路與散熱片直接接觸的散熱效能。 The dual-channel model includes at least two load circuit modules and a heat sink, and the two load circuit modules conduct heat to the heat sink to reduce the operating temperature of the two-load circuit module. However, in order to prevent the two load circuit modules from contacting the heat sink together, the circuit of the two negative circuit modules interferes with each other, and a layer of heat conductive insulation material is generally sandwiched between the load circuit module and the heat sink. However, no matter how good the thermal conductivity of the thermal insulation material is, the heat dissipation effect of the insulating circuit between the load circuit and the heat sink is that the heat dissipation effect of the direct contact between the load circuit and the heat sink cannot be exceeded.
因此，如何提升負載電路模組與散熱片間之熱傳導效能，進而降低負載電路模組的工作溫度將是研發人員應著手的問題之一。 Therefore, how to improve the heat conduction performance between the load circuit module and the heat sink, and thus reduce the operating temperature of the load circuit module will be one of the problems that the researcher should start.
本發明在於提供一種電子負載測試裝置，藉以改善習知負載電路模組與散熱片間透過絕緣片隔開而造成負載電路模組與散熱片間之熱傳導效 果不佳的問題。 The present invention provides an electronic load testing device for improving thermal conduction between a load circuit module and a heat sink by separating a conventional load circuit module from a heat sink through an insulating sheet. Poor problem.
本發明所揭露的電子負載測試裝置，包含一外殼、一連接介面組件、一第一負載電路組件、一第一散熱組件及一絕緣組件。連接介面組件設於外殼並與外殼電性絕緣。第一負載電路組件包含一第一電路板及多個第一負載晶片。第一電路板電性連接於連接介面組件。第一負載晶片電性連接於第一電路板。第一散熱組件位於外殼內，且這些第一負載晶片直接熱接觸於第一散熱組件。第一散熱組件透過絕緣組件結合於外殼，以令第一散熱組件與外殼電性絕緣。 The electronic load testing device disclosed in the present invention comprises a casing, a connection interface component, a first load circuit component, a first heat dissipation component and an insulation component. The connection interface component is disposed on the outer casing and electrically insulated from the outer casing. The first load circuit component includes a first circuit board and a plurality of first load wafers. The first circuit board is electrically connected to the connection interface component. The first load wafer is electrically connected to the first circuit board. The first heat dissipating component is located within the outer casing, and the first load wafers are in direct thermal contact with the first heat dissipating component. The first heat dissipating component is coupled to the outer casing through the insulating component to electrically insulate the first heat dissipating component from the outer casing.
根據上述本發明所揭露的電子負載測試裝置，對於單通道機種來說，因散熱組件係與外殼電性絕緣，故負載晶片與散熱組件間無需絕緣片隔開，使得負載晶片可直接熱接觸於散熱組件，進而提升負載電路組件與散熱組件間之熱傳導效能，以及降低負載電路模組的工作溫度。 According to the electronic load testing device disclosed in the above invention, for the single-channel model, since the heat dissipating component is electrically insulated from the outer casing, the insulating wafer is not required to be separated between the supporting wafer and the heat dissipating component, so that the load wafer can be directly thermally contacted. The heat sink component further enhances the heat transfer performance between the load circuit component and the heat sink component, and reduces the operating temperature of the load circuit module.
再者，因負載組件能直接熱接觸於散熱組件，故負載組件可直接鎖附於散熱組件上。如此一來，除了可少掉絕緣片的成本外，更無需額外設置複雜的夾持構件來將負載晶片固定於散熱組件上。 Moreover, since the load component can directly contact the heat dissipating component, the load component can be directly locked to the heat dissipating component. In this way, in addition to the cost of reducing the insulation sheet, it is not necessary to additionally provide a complicated clamping member to fix the load wafer to the heat dissipation assembly.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理，並且提供本發明的專利申請範圍更進一步的解釋。 The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the invention, and to provide a further explanation of the scope of the invention.
10‧‧‧電子負載測試裝置 10‧‧‧Electronic load test device
100‧‧‧外殼 100‧‧‧ Shell
110‧‧‧第一殼體 110‧‧‧First housing
120‧‧‧第二殼體 120‧‧‧second housing
200‧‧‧連接介面組件 200‧‧‧Connecting interface components
210‧‧‧第一電連接埠組 210‧‧‧First electrical connection group
220‧‧‧第二電連接埠組 220‧‧‧Second electrical connection group
300‧‧‧第一負載電路組件 300‧‧‧First load circuit assembly
310‧‧‧第一電路板 310‧‧‧First board
311‧‧‧第一電性接點組 311‧‧‧First electrical contact group
320‧‧‧第一負載晶片 320‧‧‧First load wafer
400‧‧‧第二負載電路組件 400‧‧‧Second load circuit assembly
410‧‧‧第二電路板 410‧‧‧Second circuit board
411‧‧‧第二電性接點組 411‧‧‧Second electrical contact group
420‧‧‧第二負載晶片 420‧‧‧Second load wafer
500‧‧‧第一散熱組件 500‧‧‧First heat sink assembly
510‧‧‧第一板件 510‧‧‧ first board
520‧‧‧第二板件 520‧‧‧Second board
521‧‧‧表面 521‧‧‧ surface
530‧‧‧第一鰭片 530‧‧‧First fin
500’‧‧‧第一散熱組件 500’‧‧‧First heat sink
510’‧‧‧第一板件 510’‧‧‧ first board
520’‧‧‧第二板件 520’‧‧‧Second board
530’‧‧‧第三板件 530’‧‧‧ third board
540’‧‧‧第一鰭片 540’‧‧‧First Fin
600‧‧‧第二散熱組件 600‧‧‧Second heat sink
610‧‧‧第三板件 610‧‧‧ third board
620‧‧‧第四板件 620‧‧‧Fourth plate
621‧‧‧表面 621‧‧‧ surface
630‧‧‧第二鰭片 630‧‧‧second fin
600’‧‧‧第二散熱組件 600’‧‧‧Second heat sink
610’‧‧‧第四板件 610'‧‧‧ fourth board
620’‧‧‧第五板件 620'‧‧‧ fifth board
630’‧‧‧第六板件 630'‧‧‧ sixth board
640’‧‧‧第二鰭片 640'‧‧‧second fin
710‧‧‧第一控制電路組件 710‧‧‧First control circuit assembly
720‧‧‧第二控制電路組件 720‧‧‧Second control circuit assembly
800‧‧‧絕緣組件 800‧‧‧Insulation components
810‧‧‧第一絕緣墊 810‧‧‧First insulation mat
820‧‧‧第二絕緣墊 820‧‧‧Second insulation mat
830‧‧‧第一絕緣架 830‧‧‧First insulation frame
840‧‧‧第二絕緣架 840‧‧‧Second insulation frame
900‧‧‧風扇 900‧‧‧fan
第1圖為根據本發明第一實施例所述之電子負載測試裝置的立體示意圖。 1 is a perspective view of an electronic load testing device according to a first embodiment of the present invention.
第2圖為第1圖之外部分解示意圖。 Figure 2 is a partial schematic diagram of the outside of Figure 1.
第3圖為第1圖之內部分解示意圖。 Figure 3 is a schematic diagram of the internal decomposition of Figure 1.
第4圖為第1圖之剖面示意圖。 Figure 4 is a schematic cross-sectional view of Figure 1.
第5圖為根據本發明第二實施例所述之電子負載測試裝置的剖面示意圖。 Fig. 5 is a schematic cross-sectional view showing an electronic load testing device according to a second embodiment of the present invention.
第6圖為根據本發明第三實施例所述之電子負載測試裝置的剖面示意圖。 Figure 6 is a cross-sectional view showing an electronic load testing device according to a third embodiment of the present invention.
請參照第1圖至第3圖。第1圖為根據本發明第一實施例所述之電子負載測試裝置的立體示意圖。第2圖為第1圖之外部分解示意圖。第3圖為第1圖之內部分解示意圖。 Please refer to Figures 1 to 3. 1 is a perspective view of an electronic load testing device according to a first embodiment of the present invention. Figure 2 is a partial schematic diagram of the outside of Figure 1. Figure 3 is a schematic diagram of the internal decomposition of Figure 1.
本實施例之電子負載測試裝置10為雙通道機種，最多可供二台電源供應器(未繪示)進行電子負載測試。電子負載測試裝置10包含一外殼100、一連接介面組件200、一第一負載電路組件300、一第二負載電路組件400、一第一散熱組件500、一第二散熱組件600、一第一控制電路組件710、一第二控制電路組件720、一風扇900及一絕緣組件800。 The electronic load testing device 10 of this embodiment is a two-channel model, and can be used for electronic load testing by up to two power supplies (not shown). The electronic load testing device 10 includes a housing 100, a connection interface assembly 200, a first load circuit assembly 300, a second load circuit assembly 400, a first heat dissipation assembly 500, a second heat dissipation assembly 600, and a first control. The circuit component 710, a second control circuit component 720, a fan 900, and an insulation component 800.
外殼100例如為金屬製成。外殼100包含彼此相組的一第一殼體110及一第二殼體120。本實施例之外殼100為兩件式的設計僅為了提升組裝便利性，但並不以此為限，在其他實施例中，外殼100也可以是一件式的設計。 The outer casing 100 is made of, for example, metal. The outer casing 100 includes a first housing 110 and a second housing 120 that are grouped with each other. The two-piece design of the outer casing 100 of the present embodiment is only for improving the assembly convenience, but is not limited thereto. In other embodiments, the outer casing 100 may also be a one-piece design.
連接介面組件200設於外殼100並與外殼100電性絕緣。連接介面組件200具有一第一電連接埠組210及一第二電連接埠組220。第一電連接埠組210及第二電連接埠組220可分別供相異二電源供應器電性插接。此外，連接介面組件200上例如設有操作按鍵及顯示屏。操作按鍵用來進行檢測模式切換，而顯示屏用來供使用者檢視檢測結果。 The connection interface assembly 200 is disposed on the housing 100 and electrically insulated from the housing 100. The connection interface assembly 200 has a first electrical connection set 210 and a second electrical connection set 220. The first electrical connection group 210 and the second electrical connection group 220 are respectively electrically connected to the different power supply. In addition, the connection interface assembly 200 is provided with, for example, an operation button and a display screen. The operation button is used to switch the detection mode, and the display is used for the user to view the detection result.
第一負載電路組件300包含一第一電路板310及多個第一負載晶片320。第一電路板310具有一第一電性接點組311。第一電路板310之第一 電性接點組311電性連接於連接介面組件200之第一電連接埠組210。這些第一負載晶片320電性連接於第一電路板310。第一負載晶片320例如為功率電晶體。 The first load circuit assembly 300 includes a first circuit board 310 and a plurality of first load wafers 320. The first circuit board 310 has a first electrical contact group 311. First of the first circuit board 310 The electrical contact group 311 is electrically connected to the first electrical connection group 210 of the connection interface assembly 200. The first load wafers 320 are electrically connected to the first circuit board 310. The first load wafer 320 is, for example, a power transistor.
第二負載電路組件400包含一第二電路板410及多個第二負載晶片420。第二電路板410電性連接於連接介面組件200，第二電路板410具有一第二電性接點組411。第二電路板410之第二電性接點組411電性連接於連接介面組件200之第二電連接埠組220。這些第二負載晶片420電性連接於第二電路板410。第二負載晶片420例如為功率電晶體。 The second load circuit assembly 400 includes a second circuit board 410 and a plurality of second load wafers 420. The second circuit board 410 is electrically connected to the connection interface component 200, and the second circuit board 410 has a second electrical contact group 411. The second electrical contact group 411 of the second circuit board 410 is electrically connected to the second electrical connection group 220 of the connection interface assembly 200. The second load wafers 420 are electrically connected to the second circuit board 410. The second load wafer 420 is, for example, a power transistor.
第一散熱組件500位於外殼100內。第一散熱組件500包含一第一板件510、一第二板件520及多個第一鰭片530。第二板件520連接於第一板件510以令第一板件510與第二板件520構成L形。這些第一鰭片530連接於第二板件520，並沿第一板件510之一延伸方向延伸，也就是說這些第一鰭片530與第一板件510平行。此外，第一板件510之壁面可具有凹凸結構，以增加第一散熱組件500的散熱效果。在本實施例中，第一電路板310平行於第一板件510，並裝設於第一板件510遠離這些第一鰭片530之一側。這些第一負載晶片320直接熱接觸並電性連接於第二板件520背向這些第一鰭片530之一表面521。 The first heat dissipation assembly 500 is located within the outer casing 100. The first heat dissipation component 500 includes a first plate member 510 , a second plate member 520 , and a plurality of first fins 530 . The second plate member 520 is coupled to the first plate member 510 such that the first plate member 510 and the second plate member 520 form an L shape. The first fins 530 are connected to the second plate 520 and extend along one of the extending directions of the first plate member 510, that is, the first fins 530 are parallel to the first plate member 510. In addition, the wall surface of the first plate member 510 may have a concave-convex structure to increase the heat dissipation effect of the first heat dissipation assembly 500. In this embodiment, the first circuit board 310 is parallel to the first board member 510 and is disposed on a side of the first board member 510 away from the first fins 530. The first load wafers 320 are directly in thermal contact and are electrically connected to the surface 521 of the second plate 520 facing away from the first fins 530 .
第二散熱組件600包含一第三板件610、一第四板件620及多個第二鰭片630。第四板件620連接於第三板件610以令第三板件610與第四板件620構成L形。這些第二鰭片630連接於第四板件620，並沿第三板件610之一延伸方向延伸，也就是說這些第二鰭片630與第三板件610平行。此外，第三板件610之壁面可具有凹凸結構，以增加第一散熱組件500的散熱效果。 The second heat dissipation assembly 600 includes a third plate member 610 , a fourth plate member 620 , and a plurality of second fins 630 . The fourth plate member 620 is coupled to the third plate member 610 such that the third plate member 610 and the fourth plate member 620 form an L shape. The second fins 630 are connected to the fourth plate member 620 and extend along one of the extending directions of the third plate member 610, that is, the second fins 630 are parallel to the third plate member 610. In addition, the wall surface of the third plate member 610 may have a concave-convex structure to increase the heat dissipation effect of the first heat dissipation assembly 500.
第二散熱組件600位於第一散熱組件500旁，且第一板件510 平行於第三板件610、第二板件520平行於第四板件620，以及第一板件510、第二板件520、第三板件610及第四板件620共同環繞這些第一鰭片530與這些第二鰭片630。 The second heat dissipation component 600 is located beside the first heat dissipation component 500, and the first plate component 510 Parallel to the third plate member 610, the second plate member 520 is parallel to the fourth plate member 620, and the first plate member 510, the second plate member 520, the third plate member 610, and the fourth plate member 620 collectively surround the first Fin 530 and these second fins 630.
此外，請參閱第4圖。第4圖為第1圖之剖面示意圖。第一板件510與第四板件620保持一第一間距D1。第二板件520與第三板件610保持一第二間距D2。這些第一鰭片530與這些第二鰭片630保持一第三間距D3。第一間距D1、第二間距D2及第三間距D3皆大於等於3毫米(mm)。也就是說，第一散熱組件500與第二散熱組件600的間距至少大於等於3毫米(mm)，以符合安全規範。 In addition, please refer to Figure 4. Figure 4 is a schematic cross-sectional view of Figure 1. The first plate 510 and the fourth plate 620 maintain a first spacing D1. The second plate 520 and the third plate 610 maintain a second spacing D2. The first fins 530 maintain a third spacing D3 with the second fins 630. The first pitch D1, the second pitch D2, and the third pitch D3 are each greater than or equal to 3 millimeters (mm). That is, the distance between the first heat dissipation component 500 and the second heat dissipation component 600 is at least 3 millimeters (mm) or more to comply with safety regulations.
在本實施例中，第三板件610平行於第二電路板410，且第三板件610位於第二電路板410與這些第二鰭片630之間。這些第二負載晶片420直接熱接觸並電性連接於第四板件620背向這些第二鰭片630之一表面621。 In the present embodiment, the third plate member 610 is parallel to the second circuit board 410, and the third plate member 610 is located between the second circuit board 410 and the second fins 630. The second load wafers 420 are directly in thermal contact and electrically connected to the surface 621 of the fourth plate 620 facing away from the second fins 630.
第一控制電路組件710裝設於第一負載電路組件300。第二控制電路組件720裝設於第一控制電路組件710，且第一控制電路組件710位於第一負載電路組件300與第二控制電路組件720之間。此外，第一控制電路組件710及第二控制電路組件720分別可透過傳輸線(未繪示)電性連接於第一負載電路組件300及第二負載電路組件400。 The first control circuit component 710 is mounted to the first load circuit component 300. The second control circuit component 720 is disposed in the first control circuit component 710, and the first control circuit component 710 is located between the first load circuit component 300 and the second control circuit component 720. In addition, the first control circuit component 710 and the second control circuit component 720 are respectively electrically connected to the first load circuit component 300 and the second load circuit component 400 through a transmission line (not shown).
絕緣組件800包含多個第一絕緣墊810、多個第二絕緣墊820、一第一絕緣架830及一第二絕緣架840。各第一絕緣墊810結合於第二板件520與外殼100之間，以及各第二絕緣墊820結合於第四板件620與外殼100之間，以令第一散熱組件500與第二散熱組件600組裝於外殼100上，且第一散熱組件500與第二散熱組件600皆與外殼100電性絕緣。 The insulating component 800 includes a plurality of first insulating pads 810, a plurality of second insulating pads 820, a first insulating frame 830, and a second insulating frame 840. Each of the first insulating pads 810 is coupled between the second plate member 520 and the outer casing 100, and each of the second insulating pads 820 is coupled between the fourth plate member 620 and the outer casing 100 to dissipate the first heat dissipating component 500 and the second heat dissipating component. The assembly 600 is assembled on the outer casing 100, and the first heat dissipation assembly 500 and the second heat dissipation assembly 600 are electrically insulated from the outer casing 100.
第一絕緣架830裝設於第一散熱組件500與第二散熱組件600之一側，且第二絕緣架840組裝於第一散熱組件500與第二散熱組件600之另一側，以進一步固定第一散熱組件500與第二散熱組件600的相對位置。 The first insulating frame 830 is disposed on one side of the first heat dissipating component 500 and the second heat dissipating component 600, and the second insulating frame 840 is assembled on the other side of the first heat dissipating component 500 and the second heat dissipating component 600 for further fixing. The relative position of the first heat dissipation component 500 and the second heat dissipation component 600.
值得注意的是，本實施例之第一絕緣墊810與第二絕緣墊820的數量各為多個，但並不以此為限，在其他實施例中，第一絕緣墊810與第二絕緣墊820的數量也可以各為一個。另外，在其他實施例中，也可以無第一絕緣架830及第二絕緣架840，或僅擇一裝設。 It should be noted that the number of the first insulating pad 810 and the second insulating pad 820 of the embodiment is multiple, but not limited thereto. In other embodiments, the first insulating pad 810 is insulated from the second. The number of pads 820 may also be one each. In addition, in other embodiments, the first insulating frame 830 and the second insulating frame 840 may be omitted, or only one device may be installed.
風扇900位於外殼100內，並用以產生一氣流吹向第一散熱組件500及第二散熱組件600，以進行強制散熱。 The fan 900 is located in the outer casing 100 and is configured to generate an airflow to the first heat dissipation component 500 and the second heat dissipation component 600 for forced heat dissipation.
值得注意的是，在本實施例中，因第一散熱組件500與第二散熱組件600係絕緣於外殼100，且第一散熱組件500與第二散熱組件600彼此絕緣，故負載晶片可直接熱接觸並鎖附於散熱組件上。也就是說，負載晶片與散熱組件間無需額外透過絕緣片隔開及額外的組裝件將負載晶片固定於散熱組件上。因此，本實施例之電子負載測試裝置10，除了能夠減少絕緣片與負載晶片固定架的成本外，更因為負載晶片係直接熱接觸於散熱組件而能夠增加散熱組件與負載晶片間的熱傳導效能，進而使第一散熱組件500與第二散熱組件600可盡可能地驅散電子負載測試時負載晶片所發出之熱量。 It should be noted that, in this embodiment, since the first heat dissipation component 500 and the second heat dissipation component 600 are insulated from the outer casing 100, and the first heat dissipation component 500 and the second heat dissipation component 600 are insulated from each other, the load wafer can be directly heated. Contact and lock on the heat sink assembly. That is to say, there is no need for additional separation between the load wafer and the heat dissipating component through the insulating sheet and additional assembly to fix the load wafer to the heat dissipating component. Therefore, in addition to reducing the cost of the insulating sheet and the load wafer holder, the electronic load testing device 10 of the present embodiment can increase the heat conduction performance between the heat dissipation component and the load wafer because the load wafer is directly in thermal contact with the heat dissipation component. In turn, the first heat dissipating component 500 and the second heat dissipating component 600 can dissipate as much heat as possible from the load wafer during the electronic load test.
上述之電子負載測試裝置10為雙通道機種，但並不以此為限，在其他實施例中，電子負載測試裝置10也可以為單通道機種。請參閱第5圖。第5圖為根據本發明第二實施例所述之電子負載測試裝置的剖面示意圖。本實施例與上述第1圖之實施例相似，故僅針對相異處進行說明。 The above-mentioned electronic load testing device 10 is a two-channel model, but is not limited thereto. In other embodiments, the electronic load testing device 10 may also be a single-channel model. Please refer to Figure 5. Fig. 5 is a schematic cross-sectional view showing an electronic load testing device according to a second embodiment of the present invention. This embodiment is similar to the embodiment of Fig. 1 described above, and therefore only the differences will be described.
本實施例之電子負載測試裝置10為單通道機種，故相較於第1 圖之實施例，本實施例之電子負載測試裝置10並無需設置第二負載電路組件400、第二控制電路組件720。詳細來說，本實施例之第一負載電路組件300包含一第一電路板310及多個第一負載晶片320，各第一負載晶片320分別設置於第一電路板310之相對兩側，且分別直接熱接觸於第一散熱組件500與第二散熱組件600。由於電子負載測試裝置10僅具有單一負載電路組件，故第一散熱組件500與第二散熱組件600可相接觸，並不會有電路干擾的問題產生。也就是說，於單通道的實施例中，並不用銑掉部分第二板件520與部分第四板件620來讓第一散熱組件500與第二散熱組件600保持間距。 The electronic load testing device 10 of the present embodiment is a single-channel model, so compared to the first In the embodiment of the figure, the electronic load testing device 10 of the embodiment does not need to provide the second load circuit component 400 and the second control circuit component 720. In detail, the first load circuit assembly 300 of the present embodiment includes a first circuit board 310 and a plurality of first load chips 320. The first load chips 320 are respectively disposed on opposite sides of the first circuit board 310, and The first heat dissipation component 500 and the second heat dissipation component 600 are directly in thermal contact with each other. Since the electronic load testing device 10 has only a single load circuit component, the first heat dissipation component 500 and the second heat dissipation component 600 can be in contact with each other without a problem of circuit interference. That is to say, in the single-channel embodiment, the portion of the second plate member 520 and the portion of the fourth plate member 620 are not milled to keep the first heat dissipating component 500 and the second heat dissipating component 600 at a distance.
值得注意的是，本實施例之第一散熱組件500同樣透過第一絕緣墊810絕緣地裝設於外殼100上，故負載晶片與散熱組件間同樣無需絕緣片隔開，使得負載晶片同樣可直接熱接觸於散熱組件而能夠增加散熱組件與負載晶片間的熱傳導效能，進而使第一散熱組件500與第二散熱組件600可盡可能地驅散電子負載測試時負載晶片所發出之熱量。 It should be noted that the first heat dissipating component 500 of the embodiment is also insulatively mounted on the outer casing 100 through the first insulating pad 810. Therefore, the insulating chip is not required to be separated between the load wafer and the heat dissipating component, so that the load wafer can also be directly The thermal contact with the heat dissipating component can increase the heat transfer performance between the heat dissipating component and the load cell, thereby allowing the first heat dissipating component 500 and the second heat dissipating component 600 to dissipate as much heat as possible from the load wafer during the electronic load test.
此外，本實施例之第一散熱組件500之外形同樣為「L形」係為了便於組裝。詳細來說，因第一板件510之長度夠長，故第一電路板310可直接鎖附於第一板件510。 In addition, the first heat dissipating component 500 of the present embodiment has an outer shape of an "L shape" for ease of assembly. In detail, since the length of the first plate member 510 is long enough, the first circuit board 310 can be directly locked to the first plate member 510.
上述散熱組件之外形略近似於「L形」，但並不以此為限，在其他實施例中，散熱組件之外形亦可為其他幾何形狀。舉例來說，請參閱第6圖。第6圖為根據本發明第三實施例所述之電子負載測試裝置的剖面示意圖。本實施例與上述第1圖之實施例相似，故僅針對相異處進行說明。 The outer shape of the heat dissipating component is slightly similar to the "L shape", but is not limited thereto. In other embodiments, the outer shape of the heat dissipating component may be other geometric shapes. For example, see Figure 6. Figure 6 is a cross-sectional view showing an electronic load testing device according to a third embodiment of the present invention. This embodiment is similar to the embodiment of Fig. 1 described above, and therefore only the differences will be described.
在本實施例中，第一散熱組件500’包含一第一板件510’、一第二板件520’、一第三板件530’及多個第一鰭片540’。第一板件510’與第三板件 530’分別連接於第二板件520’之相對兩側以構成n形。這些第一鰭片540連接於第二板件520’，並沿第一板件510’之一延伸方向延伸。第一板件510’位於第一電路板310與這些第一鰭片540’之間。這些第一負載晶片320熱接觸並電性連接於第二板件520’背向這些第一鰭片540’之一表面521’。 In this embodiment, the first heat dissipating component 500' includes a first plate member 510', a second plate member 520', a third plate member 530', and a plurality of first fins 540'. First plate 510' and third plate 530' are respectively connected to opposite sides of the second plate member 520' to constitute an n-shape. These first fins 540 are coupled to the second panel 520' and extend in a direction in which one of the first panels 510' extends. The first plate 510' is located between the first circuit board 310 and the first fins 540'. The first load wafers 320 are in thermal contact and electrically connected to the surface 521' of the second plate 520' facing away from the first fins 540'.
第二散熱組件600’包含一第四板件610’、一第五板件620’、一第六板件630’及多個第二鰭片640’。第四板件610’與第六板件630’分別連接於第五板件620’之相對兩側以構成n形。這些第二鰭片640’連接於第五板件620’，並沿第四板件610’之一延伸方向延伸。第二散熱組件600’位於第一散熱組件500’旁，且第一板件510’、第二板件520’、第三板件530’、第四板件610’、第五板件620’及第六板件630’共同環繞這些第一鰭片540’與這些第二鰭片640’。第一板件510’與第四板件610’、第二板件520’與第五板件620’及第一鰭片540’與第二鰭片640’皆保持一間距，此間距大於等於3毫米(mm)，以符合電子負載測試裝置10的安全規範。 The second heat dissipating component 600' includes a fourth plate member 610', a fifth plate member 620', a sixth plate member 630', and a plurality of second fins 640'. The fourth plate member 610' and the sixth plate member 630' are respectively coupled to opposite sides of the fifth plate member 620' to constitute an n-shape. These second fins 640' are coupled to the fifth panel 620' and extend in a direction in which one of the fourth panels 610' extends. The second heat dissipation component 600 ′ is located beside the first heat dissipation component 500 ′, and the first panel 510 ′, the second panel 520 ′, the third panel 530 ′, the fourth panel 610 ′, and the fifth panel 620 ′′ And the sixth plate 630' collectively surrounds the first fins 540' and the second fins 640'. The first plate 510 ′ and the fourth plate 610 ′, the second plate 520 ′ and the fifth plate 620 ′, and the first fin 540 ′ and the second fin 640 ′ are all kept at a distance greater than or equal to 3 mm (mm) to comply with the safety specifications of the electronic load test device 10.
根據上述本發明所揭露的電子負載測試裝置，對於單通道機種來說，因散熱組件係與外殼電性絕緣，故負載晶片與散熱組件間無需絕緣片隔開，使得負載晶片可直接熱接觸於散熱組件，進而提升負載電路組件與散熱組件間之熱傳導效能，以及降低負載電路模組的工作溫度。 According to the electronic load testing device disclosed in the above invention, for the single-channel model, since the heat dissipating component is electrically insulated from the outer casing, the insulating wafer is not required to be separated between the supporting wafer and the heat dissipating component, so that the load wafer can be directly thermally contacted. The heat sink component further enhances the heat transfer performance between the load circuit component and the heat sink component, and reduces the operating temperature of the load circuit module.
此外，對於雙通道機種來說，除因各散熱組件係與外殼電性絕緣外，各散熱組件更保持一間距而彼此電性絕緣，故負載晶片亦可直接熱接觸於散熱組件，進而提升負載電路組件與散熱組件間之熱傳導效能，以及降低負載電路模組的工作溫度。 In addition, for the dual-channel model, in addition to being electrically insulated from the heat-dissipating component and the outer casing, the heat-dissipating components are electrically insulated from each other at a distance, so that the load wafer can also directly contact the heat-dissipating component, thereby lifting the load. The heat transfer performance between the circuit components and the heat sink components, as well as the operating temperature of the load circuit module.
再者，因負載組件能直接熱接觸於散熱組件，故負載組件可直 接鎖附於散熱組件上。如此一來，除了可少掉絕緣片的成本外，更無需額外設置複雜的夾持構件來將負載晶片固定於散熱組件上。 Furthermore, since the load component can directly contact the heat dissipating component, the load component can be straight The lock is attached to the heat sink assembly. In this way, in addition to the cost of reducing the insulation sheet, it is not necessary to additionally provide a complicated clamping member to fix the load wafer to the heat dissipation assembly.
雖然本發明的實施例揭露如上所述，然並非用以限定本發明，任何熟習相關技藝者，在不脫離本發明的精神和範圍內，舉凡依本發明申請範圍所述的形狀、構造、特徵及數量當可做些許的變更，因此本發明的專利保護範圍須視本說明書所附的申請專利範圍所界定者為準。 Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, configurations, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.
110‧‧‧第一殼體 110‧‧‧First housing
120‧‧‧第二殼體 120‧‧‧second housing
300‧‧‧第一負載電路組件 300‧‧‧First load circuit assembly
310‧‧‧第一電路板 310‧‧‧First board
320‧‧‧第一負載晶片 320‧‧‧First load wafer
400‧‧‧第二負載電路組件 400‧‧‧Second load circuit assembly
410‧‧‧第二電路板 410‧‧‧Second circuit board
420‧‧‧第二負載晶片 420‧‧‧Second load wafer
500‧‧‧第一散熱組件 500‧‧‧First heat sink assembly
510‧‧‧第一板件 510‧‧‧ first board
520‧‧‧第二板件 520‧‧‧Second board
521‧‧‧表面 521‧‧‧ surface
530‧‧‧第一鰭片 530‧‧‧First fin
600‧‧‧第二散熱組件 600‧‧‧Second heat sink
610‧‧‧第三板件 610‧‧‧ third board
620‧‧‧第四板件 620‧‧‧Fourth plate
621‧‧‧表面 621‧‧‧ surface
630‧‧‧第二鰭片 630‧‧‧second fin
710‧‧‧第一控制電路組件 710‧‧‧First control circuit assembly
720‧‧‧第二控制電路組件 720‧‧‧Second control circuit assembly
810‧‧‧第一絕緣墊 810‧‧‧First insulation mat
820‧‧‧第二絕緣墊 820‧‧‧Second insulation mat
Claims (10)
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| TW103125546A TWI537567B (en) | 2014-07-25 | 2014-07-25 | Electronic load testing device |
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| TW103125546A TWI537567B (en) | 2014-07-25 | 2014-07-25 | Electronic load testing device |
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| TWI537567B true TWI537567B (en) | 2016-06-11 |
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| TWI819193B (en) * | 2019-03-25 | 2023-10-21 | 日商辰巳菱機股份有限公司 | Load testing apparatus, insulated frame of load testing apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI819193B (en) * | 2019-03-25 | 2023-10-21 | 日商辰巳菱機股份有限公司 | Load testing apparatus, insulated frame of load testing apparatus |
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