WO2019112400A1 - Heat radiating device for electronic element - Google Patents

Heat radiating device for electronic element Download PDF

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Publication number
WO2019112400A1
WO2019112400A1 PCT/KR2018/015619 KR2018015619W WO2019112400A1 WO 2019112400 A1 WO2019112400 A1 WO 2019112400A1 KR 2018015619 W KR2018015619 W KR 2018015619W WO 2019112400 A1 WO2019112400 A1 WO 2019112400A1
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WO
WIPO (PCT)
Prior art keywords
heat
unit
cover
heat radiating
radiating
Prior art date
Application number
PCT/KR2018/015619
Other languages
French (fr)
Korean (ko)
Inventor
김덕용
양준우
여진수
유창우
박민식
김혜연
Original Assignee
주식회사 케이엠더블유
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 주식회사 케이엠더블유 filed Critical 주식회사 케이엠더블유
Priority to CN201880079396.XA priority Critical patent/CN111788876B/en
Priority to JP2020530655A priority patent/JP7045457B2/en
Priority claimed from KR1020180158227A external-priority patent/KR102147658B1/en
Publication of WO2019112400A1 publication Critical patent/WO2019112400A1/en
Priority to US16/893,394 priority patent/US11266041B2/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a heat dissipating device for an electric component, and more particularly, to a heat dissipating device capable of achieving a light weight of the entire product, To a heat dissipation device for an electric element.
  • the electric field element generates heat during operation, and when the heat in the space in which the electric element is accumulated is accumulated without being radiated to the outside, the operating performance of the electric element can be degraded.
  • FIG. 1 is an exploded perspective view showing a general heat dissipation device of an electric field element according to the related art.
  • a conventional heat dissipating device for a full-field device includes a substrate case 10 for accommodating a printed circuit board 20 on which a full-length device (not shown) is mounted on one surface, And a cover 30 coupled to the substrate case 10 while covering the printed circuit board 20 housed in the cover case 30 and having a plurality of heat dissipating ribs 31 integrally formed on the outer surface thereof.
  • the inner surface of the cover 30 is arranged to be placed on the other surface of the printed circuit board 20, so that heat generated from the electric elements of the printed circuit board 20 is transferred to the inner surface of the cover 30 , And radiates outwardly through a plurality of heat-radiating ribs (31) integrally formed on the outer surface of the cover (30).
  • the outer surface of the unit heat dissipating rib 31 may be formed by finely waving the wavy grooves 32 as shown in Fig. 1 so as to increase the heat dissipating area of the plurality of heat dissipating ribs 31 It is an undesirable solution because the additional processing of the heat radiation area at the fixed portion as described above is limited.
  • the plurality of heat-radiating ribs 31 are formed to be long in the vertical direction so as to flow only in the vertical direction, and spaced apart from each other by a predetermined distance in the lateral direction. There is a limit to performance.
  • Another object of the present invention is to provide a heat dissipation device for an electric component which can improve the heat dissipation performance by designing air to flow into a plurality of radiant heat dissipators in various directions.
  • An embodiment of a heat dissipation device of an electric device includes a printed circuit board on which a plurality of electric elements are mounted, the substrate case having the printed circuit board, And at least one of the heat radiating covers protruding from the outer surface of the heat radiating cover, each of the heat radiating covers extending upwardly inclined, and receives heat generated from the printed circuit board And a plurality of radial heat radiating elements radiating heat to the outside.
  • the plurality of radial heaters may include a plurality of unit heat pipes, one end of which is coupled to the outer surface of the heat radiation cover so as to be partially recessed, and the other end of which is bent toward the one end, And a plurality of heat radiating ribs radially extended radially outward from a part or all of the outer circumferential surface of the other end of each of the plurality of unit heat pipes.
  • a plurality of heat conduction grooves may be formed on the outer surface of the heat dissipation cover to correspond to the number of the plurality of unit heat pipes.
  • the plurality of thermally conductive grooves may be formed such that the heat conductive grooves vertically adjacent to each other are spaced apart from each other by a predetermined distance.
  • the plurality of heat conduction grooves may be formed such that a plurality of rows are formed long in the vertical direction, and the rows adjacent to the right and left sides are spaced apart from each other by a predetermined distance.
  • the plurality of heat conduction grooves and the plurality of unit heat pipes may be arranged so that the height of the heat conduction grooves adjacent to the right and left sides and the unit heat pipes are different from each other.
  • the plurality of heat dissipating ribs formed on the outer circumferential surfaces of the other end portions of the plurality of unit heat pipes may be formed such that the distal end spaced apart from the outer circumferential surface of the other end portion of the unit heat pipe is not upward at least.
  • the plurality of radiant heaters may include a plurality of unit heat pipes coupled to an outer surface of the heat radiating cover so as to surround an outer circumferential surface of one end of the plurality of unit heat pipes not recessed on the outer surface of the heat radiating cover. And a pipe fixing block for fixing the pipe.
  • One end of the plurality of unit heat pipes and the pipe fixing block among the plurality of radial heat radiating elements may be provided at positions corresponding to positions of a plurality of electric elements arranged on the inner surface of the heat radiating cover have.
  • the plurality of radiating ribs may be spaced apart from the outer surface of the radiating cover by a predetermined distance.
  • each of the ends of the plurality of radiating ribs of the plurality of radial heat radiating elements may be formed to have the same distance from the outer surface of the radiating cover.
  • the plurality of unit heat pipes may be filled with a heat transfer fluid which is vaporized by the heat transferred to the heat radiating cover rotor and then transferred to the plurality of heat dissipating ribs and then liquefied.
  • the plurality of unit heat pipes may be located at a lower side than the other end where the heat radiating ribs are provided, at one end coupled to the outer surface of the heat radiating cover.
  • the entire product can be lightened.
  • FIG. 1 is an exploded perspective view showing a general heat dissipation device of an electric field element according to the related art
  • FIG. 2 is a perspective view illustrating an embodiment of a heat dissipation device for electrical components according to the present invention
  • Fig. 3 is an exploded perspective view of Fig. 2,
  • FIG. 4 is a cross-sectional view taken along the line A-A in Fig. 2,
  • Fig. 5 is a perspective view showing a unit radial heat radiator in the configuration of Fig. 2,
  • Fig. 6 is an exploded perspective view of Fig. 5,
  • FIG. 7 is a perspective view showing another embodiment of the heat dissipating device of the electric element according to the present invention.
  • FIG. 8 is an exploded perspective view of FIG. 7,
  • FIG. 9 is a cross-sectional view taken along the line B-B in Fig. 7,
  • FIG. 10 is a cross-sectional view and a partially enlarged perspective view showing still another embodiment of the heat dissipation device for electric field element according to the present invention.
  • Radial heat sink 140 Unit heat pipe
  • FIG. 2 is a perspective view showing an embodiment of a heat dissipation device for electric field elements according to the present invention
  • Fig. 3 is an exploded perspective view of Fig. 2
  • Fig. 4 is a cross-
  • Fig. 6 is an exploded perspective view of Fig. 5.
  • the heat dissipating device 100 includes a plurality of electric elements 125, each of which generates at least one heat during operation, And a circuit board (120).
  • the printed circuit board 120 is limited to being mounted so that a plurality of electric elements 125 are mounted on only one side, but a two-sided type in which the electric elements 125 are mounted on both sides is also a category Of course.
  • the plurality of electric element devices 125 include all the heat generating elements that generate a predetermined heat while being electrically operated.
  • the plurality of electric element devices 125 include a power supply unit (PSU) (Field Programmable Gate Array) device, and the like.
  • PSU power supply unit
  • the device structure that can degrade the performance due to heat generation is also considered.
  • an embodiment of the present invention includes a substrate case 105 (see Figs. 7 and 8) and a substrate case 105 that accommodates the above-described printed circuit board 120, And a heat radiating cover 110 that is in close contact with the other surface of the heat sink 120.
  • the heat dissipation cover 110 also corresponds to the housing of the antenna device. If the heat dissipation cover 110 is configured to protect the antenna elements, the PSU, and the FPGA device mounted on the printed circuit board 120 from the outside and radiate heat to the outside It can be a concept that includes both despite its name.
  • the heat dissipation cover 110 protects the printed circuit board 120 accommodated in the substrate case 105 from the outside and transmits heat generated from the plurality of electric elements 125 mounted on the printed circuit board 120 to the outside It is preferable to be provided with a conductive material. Although not shown in the drawing, a plurality of radiant heaters 130, which will be described later, may be further provided with a plurality of radiating fins formed integrally with the outer surface separately from the radiating cover 110.
  • At least one of the heat dissipating apparatus 100 may include at least one heat radiating cover 110 protruding from the outer surface of the heat radiating cover 110, And a plurality of radial heat dissipators 130 for radiating heat to the outside.
  • the plurality of radial heat radiating bodies 130 may be in direct contact with the heat radiating cover 110 in a state in which the plurality of radiating fins are removed, Respectively.
  • the plurality of radial heat sinks 130 include a plurality of unit heat pipes 140 coupled to the outer surface of the heat dissipation cover 110 and a plurality of heat dissipation ribs 150 formed in each of the plurality of unit heat pipes 140 can do.
  • the plurality of heat dissipating ribs 150 may be formed on the circumferential surface of the unit heat pipe 140, And may be formed to extend radially outwardly, respectively.
  • the plurality of heat dissipating ribs 150 correspond to the heat dissipating ribs 30 integrally formed on the outer surface of the conventional heat dissipating cover 10 shown in FIG. It is possible to improve the effective heat dissipation area because it is manufactured in a smaller space.
  • the flow path of the external air for cooling can be variously formed, It is possible to prevent the stagnation of the flowing air between the sieves 130, thereby maximizing the heat radiation performance.
  • a plurality of radial heat dissipators 130 are proposed to overcome the limit of the detailed processing of the grooves with respect to the unit heat dissipating ribs, It should be noted that the concept of completely eliminating the processing of the groove shape for each of the plurality of heat dissipating ribs 150 is not considered. In this case, it is preferable that the shape of the groove for each of the plurality of heat dissipating ribs 150 is formed in a size or shape as long as the flow stagnation of the air flowing between the plurality of radiant heat emitting bodies 130 does not occur Do.
  • the plurality of unit heat pipes 140 are vaporized by the heat transmitted from the heat radiating cover 110 to the inside, and when the heat is radiated to the outside by the plural radiating ribs 150, the heat transfer fluid which is liquefied is filled .
  • the heat transfer fluid is vaporized by the heat transmitted from the heat radiation cover 110 at one end 141 of the unit heat pipe 140 and is moved to the upper side of the other end 142 of the unit heat pipe 140, And is a medium that performs heat transfer in such a manner that it is moved outward from the heat radiating cover 110 and then liquefied near the other end 142 of the unit heat pipe 140.
  • the plurality of unit heat pipes 140 are arranged in such a manner that a side of the heat source (one end 141 of the unit heat pipe 140 in the embodiment of the present invention) The other end 142 of the pipe 140). That is, the heat transfer fluid is based on the principle that it moves upward when the temperature is high due to the fluid movement principle.
  • one end of the plurality of unit heat pipes 140 coupled to the outer surface of the heat dissipating cover 110 should be positioned below the other end provided with the plurality of heat dissipating ribs 150.
  • the heat transfer fluid filled in the plurality of unit heat pipes 140 when the heat transfer fluid filled in the plurality of unit heat pipes 140 is vaporized, the heat transfer fluid is moved upward by the fluid movement principle, The heat source is moved to the heat source.
  • the heat conductive grooves 111 in which the one end portion 141 of the plurality of unit heat pipes 140 are coupled to the outer surface of the heat dissipation cover 110 are formed to correspond to the number of the plurality of unit heat pipes 140 And a plurality of them may be formed.
  • a plurality of heat dissipation fins are integrally formed on the outer surface of the heat dissipation cover 110 as described above, a part of the plurality of heat dissipation fins may be removed or removed so as not to interfere with the plurality of unit heat pipes 140 Has already been described.
  • the thermally conductive grooves 111 are formed such that the thermally conductive grooves 111 that are vertically adjacent to each other are spaced apart from each other by a predetermined distance in the vertical direction.
  • the plurality of heat conduction grooves 111 may be formed so as to have a plurality of long lines in the up-and-down direction, while the adjacent heat lines may be spaced apart from each other by a predetermined distance.
  • one end 141 of the plurality of unit heat pipes 140 may be coupled one-to-one. Therefore, since the outside air flows into the space separated in the up-and-down direction and the left-right direction, the flow path of air for heat radiation can be variously designed.
  • the plurality of radial heaters 130 are coupled to the outer surface of the heat radiating cover 110 so that the outer surface of the heat radiating cover 110 is connected to the outer surface of the heat radiating cover 110.
  • the pipe fixing block 160 has a thermal conductive property for collecting the heat of the electrical component 125 transmitted to the outer surface of the heat dissipating cover 110 and effectively transmitting the heat to the one end 141 of the plurality of unit heat pipes 140 It is preferable that it is made of an excellent material.
  • One end 141 of one end 141 of the plurality of unit heat pipes 140 is received in close contact with the heat conduction groove 111 formed on the outer surface of the heat dissipating cover 110, The other side of the outer circumferential surface is accommodated so as to be in close contact with the pipe fixing block 160 so that the heat generated from the electric element 125 is transmitted to the one end portion 141 of the plurality of unit heat pipes 140 as much as possible.
  • One end 141 of the plurality of unit heat pipes 140 and the pipe fixing block 160 among the plurality of radial heat radiating elements 130 constitute a plurality of electric fields disposed on the inner surface of the heat radiating cover 110 It is preferable that they are provided at positions corresponding to the positions of the elements 125, respectively.
  • the plurality of unit heat pipes 140 are arranged such that the heat generated from the electric field elements 125 is not directly transmitted to the pipe fixing block 160 to be transmitted through the medium.
  • the plurality of radiating ribs 150 of the plurality of radial heat sinks 130 are formed such that an end portion of the plurality of radiating ribs 150 located close to the outer surface of the heat radiating cover 110 is spaced apart from the outer surface of the heat radiating cover 110 by a predetermined distance .
  • the plurality of heat dissipating ribs 150 may be formed in a predetermined thickness from the outer surface of the heat dissipating cover 110 by a pipe fixing block 160 provided outside the heat dissipating cover 110, 160 and the ends of the plurality of heat-radiating ribs 150, which are located close to the outer surface of the heat-radiating ribs 160, 160, are spaced apart from each other by a predetermined distance.
  • the heat generated during operation of the electrical component 125 from one side of the printed circuit board 120 on which the electrical component 125 is mounted is transferred to the other side of the printed circuit board 120, To the inner surface of the heat dissipation cover 110 closely arranged on the other surface of the heat dissipation cover 110.
  • the heat transmitted to the inner surface of the heat dissipating cover 110 is transmitted to the outer surface of the heat dissipating cover 110 while the heat is transmitted through the space between the outer surface of the heat dissipating cover 110 and the plurality of heat dissipating ribs 150
  • the remaining heat is supplied to the first ends 141 of the plurality of unit heat pipes 140 through the heat conductive grooves 111 formed on the outer surface of the heat dissipating cover 110 and the pipe fixing block 160, .
  • the heat transfer fluid filled in the plurality of unit heat pipes 140 is vaporized and is moved to the other end 142 of the plurality of unit heat pipes 140 located on the upper side, And is radiated through the ribs 150 in a second order.
  • the vaporized heat transfer fluid is condensed and re-liquefied in the course of heat transfer to the plurality of heat dissipating ribs 150, and is repeatedly vaporized by the heat transferred from the printed circuit board 120 while moving in the gravity direction, The heat generated from the element 125 is dissipated to the outside.
  • the plurality of radial heat radiators 130 are protruded upward with respect to the heat radiating cover 110 so that the upward flow is guided outward by the plurality of radiant heat emitting bodies 130 provided on the upper side even if the radiated air forms a rising air flow, It is possible to prevent the heat radiating performance of the plurality of radial heat radiators 130 provided on the upper side from being lowered by the primary or secondary radiated heat of the plurality of radial heat radiators 130 that are formed.
  • a plurality of radial heat radiating elements 130 adjacent to each other are spaced apart from each other by a predetermined distance so that the heat radiating ribs 150, the inflow amount of the air increases greatly compared with the conventional one, so that the heat radiation performance can be improved.
  • FIG. 7 is a perspective view showing another embodiment of the heat dissipating device of the electric field element according to the present invention
  • FIG. 8 is an exploded perspective view of FIG. 7
  • FIG. 9 is a sectional view taken along line B-B of FIG.
  • a plurality of radiant heat emitting bodies 130 are basically separated from each other by a predetermined distance on the outer surface of the heat radiating cover 110 The same technical features are assumed to be the same.
  • a plurality of heat conduction grooves 111 and a plurality of unit heat pipes 140 are formed on the left and right sides of the heat dissipating device 100 '
  • the adjacent heat conduction grooves 111 and the unit heat pipes 140 may be arranged to have different heights.
  • the plurality of radial heat radiators 130 are arranged in a plurality of rows in the vertical direction, and each radial heat radiator 130 is disposed at a different height from the adjacent heat radiator,
  • the air flow path can be more variously secured.
  • each of the ends of the plurality of heat dissipating ribs 150 among the plurality of radiant heat emitting elements 130 is formed to have the same distance from the outer surface of the heat dissipating cover 110 . That is, each of the front ends of the heat radiating ribs 150 of the plurality of radial heat radiating elements 130 has an advantage in that it is easy to design the exposure to the outside by forming a front end surface parallel to the outer surface of the heat radiating cover 110.
  • a rib protection cover may be separately provided in which a plurality of flow holes through which the air of the heat dissipating ribs 150 flows. It is preferable that the rib protecting cover is manufactured in a suitable form capable of performing a function for preventing breakage during installation by an operator so long as the heat radiation performance is not lowered.
  • FIG. 10 is a cross-sectional view and a partially enlarged perspective view showing still another embodiment of the heat dissipating device 100 of the electric field element according to the present invention.
  • a plurality of heat dissipating ribs (not shown) formed on the outer circumferential surface of the other end portion 142 of the plurality of unit heat pipes 140 150 may be formed such that the distal end spaced apart from the outer circumferential surface of the other end 142 of the unit heat pipe 140 is not at least upward.
  • the outer circumferential surface of the other end 142 of the unit heat pipe 140 refers to an outer circumferential surface of a bar shape arranged with an upward inclination, and the tips of the plurality of heat dissipating ribs 150 are connected to the other end 142 of the unit heat pipe 140, Refers to the end portions of the plurality of heat dissipating ribs 150 farthest from the outer circumferential surface.
  • the tip of the plurality of heat dissipating ribs 150 is formed so as not to be upward from the outer circumferential surface of the plurality of unit heat pipes 140, it means that half of the outer circumferential surface of the other end portion 142 of the plurality of unit heat pipes 140 And a plurality of radiating heaters 130 are provided in a shape that does not include a plurality of radiating ribs 150 in the other half portion will be.
  • Embodiments of the heat dissipation device of the electric field element according to the present invention can be used particularly in an antenna device having an electric field element with high heat generation.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to a heat radiating device for an electronic element, which comprises: a printed circuit board, on one surface of which a plurality of electronic elements is mounted, at least one of the plurality of the electronic elements generating and radiating heat during operation; a board case containing the printed circuit board; a heat radiating cover which covers the board case and has an inner surface being in close contact with the other surface of the printed circuit board; and a plurality of radial heat radiating bodies, at least one of which is disposed to protrude from the outer surface of the heat radiating cover and each of which extends slopingly in the upward direction, receives generated heat from the printed circuit board, and radiates the received heat to the outside thereof. Therefore, the present invention can greatly improve the heat radiating performance by increasing an effective heat radiating area within a limited heat radiating area.

Description

전장소자의 방열 장치Heat dissipation device of electric element
본 발명은 전장소자의 방열 장치(A COOLING APPARATUS FOR ELECTRONIC ELEMENTS)에 관한 것으로서, 보다 상세하게는, 제품 전체의 경량화를 달성하고, 다양한 방향에서의 공기 유동이 가능하게 하여 방열 성능을 향상시킬 수 있는 전장소자의 방열 장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a heat dissipating device for an electric component, and more particularly, to a heat dissipating device capable of achieving a light weight of the entire product, To a heat dissipation device for an electric element.
일반적으로, 전장소자는 작동 시 열을 발생시키며, 전장소자가 집적된 공간 내의 열이 외부로 방열되지 않고 축적될 경우 전장소자의 작동 성능이 저하될 수 있다.Generally, the electric field element generates heat during operation, and when the heat in the space in which the electric element is accumulated is accumulated without being radiated to the outside, the operating performance of the electric element can be degraded.
전장소자는, 대부분 기판 케이스의 내부에 구비된 인쇄회로기판에 솔더링 결합되는데, 외부로부터의 보호를 위하여 커버 및 기판 케이스에 의해 밀폐된 공간을 형성하게 된다.Most of the electrical elements are soldered to a printed circuit board provided inside the substrate case, and a closed space is formed by the cover and the substrate case for protection from the outside.
도 1은 종래 기술에 따른 전장소자의 일반적인 방열 장치를 나타낸 분해 사시도이다.1 is an exploded perspective view showing a general heat dissipation device of an electric field element according to the related art.
종래 기술에 따른 전장소자의 일반적인 방열 장치는, 도 1에 도시된 바와 같이, 미도시의 전장소자가 일면에 실장된 인쇄회로기판(20)을 수용하는 기판 케이스(10)와, 기판 케이스(10)에 수용된 인쇄회로기판(20)을 덮으면서 기판 케이스(10)에 결합되고, 외측면에 복수개의 방열 리브(31)가 일체로 형성된 커버(30)를 포함한다.1, a conventional heat dissipating device for a full-field device according to the related art includes a substrate case 10 for accommodating a printed circuit board 20 on which a full-length device (not shown) is mounted on one surface, And a cover 30 coupled to the substrate case 10 while covering the printed circuit board 20 housed in the cover case 30 and having a plurality of heat dissipating ribs 31 integrally formed on the outer surface thereof.
여기서, 커버(30)의 내측면은 인쇄회로기판(20)의 타면에 면접되게 배치됨으로써, 인쇄회로기판(20)의 전장소자들로부터 발생된 열이 커버(30)의 내측면으로 전달된 후, 커버(30)의 외측면에 일체로 형성된 복수개의 방열 리브(31)를 통해 외측으로 방열시킨다.Here, the inner surface of the cover 30 is arranged to be placed on the other surface of the printed circuit board 20, so that heat generated from the electric elements of the printed circuit board 20 is transferred to the inner surface of the cover 30 , And radiates outwardly through a plurality of heat-radiating ribs (31) integrally formed on the outer surface of the cover (30).
그러나, 상기와 같이 구성된 종래 기술에 따른 전장소자의 일반적인 방열 장치는, 작동 시 발열되는 전장소자의 개수가 적을 경우에는 커버(30)의 외측면에 일체로 형성된 복수개의 방열 리브(31)만으로 충분한 방열이 이루어지는 바 문제가 없으나, 전장소자 다수개가 한정된 공간(즉, 기판 케이스(10) 내)에 집약 설치된 경우에는 종래의 방열 리브(31)만으로는 충분한 방열이 이루어지지 않게 되고, 기판 케이스(10) 내측에 열이 축적되어 전장소자의 작동 성능을 저하시키는 문제점이 있다.However, in the general heat dissipating device of the electric field device according to the related art, when the number of electric elements to be heated is small, only a plurality of heat dissipating ribs 31 integrally formed on the outer surface of the cover 30 The heat dissipating ribs 31 do not sufficiently radiate heat when the plurality of electric elements are concentrated in a limited space (i.e., in the substrate case 10) There is a problem in that heat is accumulated inside, which deteriorates the operating performance of the electric element.
상기와 같은 문제점을 해결하기 위해, 복수개의 방열 리브(31)의 방열 면적을 증가시키도록 단위 방열 리브(31)의 외측면을 도 1에 도시된 바와 같은 물결 모양의 그루브(32)를 세밀하게 가공할 수 있으나, 상기와 같이 고정된 부위에서의 방열 면적의 추가 가공은 그 한계가 있으므로 바람직하지 못한 해결책이다.In order to solve the above-described problems, the outer surface of the unit heat dissipating rib 31 may be formed by finely waving the wavy grooves 32 as shown in Fig. 1 so as to increase the heat dissipating area of the plurality of heat dissipating ribs 31 It is an undesirable solution because the additional processing of the heat radiation area at the fixed portion as described above is limited.
또한, 복수개의 방열 리브(31)는, 도 1에 도시된 바와 같이, 외부 공기가 상하 방향으로만 유입되도록 상하로 길게 형성되고, 좌우 방향으로 소정거리 이격되게 형성된 바, 공기 유동성이 저하되어 방열 성능을 높이는데 제한이 있다.As shown in FIG. 1, the plurality of heat-radiating ribs 31 are formed to be long in the vertical direction so as to flow only in the vertical direction, and spaced apart from each other by a predetermined distance in the lateral direction. There is a limit to performance.
본 발명은 상기한 기술적 과제를 해결하기 위하여 안출된 것으로서, 복수개의 방열 리브의 구비에 따른 커버의 중량을 감소시킴으로써 제품 전체의 경량화를 달성할 수 있는 전장소자의 방열 장치를 제공하는 것을 그 목적으로 한다.SUMMARY OF THE INVENTION It is an object of the present invention to provide a heat dissipating device for an electric component capable of reducing the weight of the entire product by reducing the weight of the cover according to the plurality of heat dissipating ribs. do.
또한, 본 발명은 다양한 방향에서 공기가 복수개의 방사상 방열체 내부로 유동 가능하게 설계됨으로써 방열 성능을 향상시킬 수 있는 전장소자의 방열 장치를 제공하는 것을 다른 목적으로 한다.Another object of the present invention is to provide a heat dissipation device for an electric component which can improve the heat dissipation performance by designing air to flow into a plurality of radiant heat dissipators in various directions.
본 발명에 따른 전장소자의 방열 장치의 실시예는, 작동 시 적어도 하나 이상이 발열되는 복수개의 전장소자가 일면에 실장된 인쇄회로기판, 상기 인쇄회로기판을 수용하는 기판 케이스, 상기 기판 케이스를 덮으면서, 내측면이 상기 인쇄회로기판의 타면에 밀착되는 방열 커버 및 적어도 하나 이상이 상기 방열 커버의 외측면에 돌출되게 구비되되 각각 상향 경사지게 연장 형성되고, 상기 인쇄회로기판으로부터 발생된 열을 전달받아 외부로 방열시키는 복수개의 방사상 방열체를 포함한다.An embodiment of a heat dissipation device of an electric device according to the present invention includes a printed circuit board on which a plurality of electric elements are mounted, the substrate case having the printed circuit board, And at least one of the heat radiating covers protruding from the outer surface of the heat radiating cover, each of the heat radiating covers extending upwardly inclined, and receives heat generated from the printed circuit board And a plurality of radial heat radiating elements radiating heat to the outside.
여기서, 상기 복수개의 방사상 방열체는, 일단부는 상기 방열 커버의 외측면에 외주면 일부가 요입되게 결합되고, 타단부는 상기 일단부에 대하여 절곡되어 상향 경사지게 외측으로 연장된 복수개의 단위 히트 파이프 및 상기 복수개의 단위 히트 파이프 각각의 타단부 외주면 일부 또는 전부로부터 반경 방향 외측으로 방사상 연장된 복수개의 방열 리브를 포함할 수 있다.The plurality of radial heaters may include a plurality of unit heat pipes, one end of which is coupled to the outer surface of the heat radiation cover so as to be partially recessed, and the other end of which is bent toward the one end, And a plurality of heat radiating ribs radially extended radially outward from a part or all of the outer circumferential surface of the other end of each of the plurality of unit heat pipes.
또한, 상기 방열 커버의 외측면에는, 상기 복수개의 단위 히트 파이프의 일단부가 요입되게 결합되는 열전도 홈이 상기 복수개의 단위 히트 파이프의 개수에 대응되게 복수개 형성될 수 있다.A plurality of heat conduction grooves may be formed on the outer surface of the heat dissipation cover to correspond to the number of the plurality of unit heat pipes.
또한, 상기 복수개의 열전도 홈은, 상하 방향으로 길게 열을 형성하되, 상하로 인접하는 열전도 홈이 상호 소정거리 이격되게 형성될 수 있다.In addition, the plurality of thermally conductive grooves may be formed such that the heat conductive grooves vertically adjacent to each other are spaced apart from each other by a predetermined distance.
또한, 상기 복수개의 열전도 홈은, 상하 방향으로 길게 복수개의 열을 형성하되, 좌우로 인접하는 열이 상호 소정거리 이격되게 형성될 수 있다.In addition, the plurality of heat conduction grooves may be formed such that a plurality of rows are formed long in the vertical direction, and the rows adjacent to the right and left sides are spaced apart from each other by a predetermined distance.
또한, 상기 복수개의 열전도 홈 및 상기 복수개의 단위 히트 파이프는, 좌우로 인접하는 열전도 홈 및 단위 히트 파이프의 높낮이가 상이하게 배치될 수 있다.In addition, the plurality of heat conduction grooves and the plurality of unit heat pipes may be arranged so that the height of the heat conduction grooves adjacent to the right and left sides and the unit heat pipes are different from each other.
또한, 상기 복수개의 단위 히트 파이프의 타단부 외주면에 각각 형성된 상기 복수개의 방열 리브는, 상기 단위 히트 파이프의 타단부 외주면으로부터 이격된 선단이 적어도 상향되지 않도록 형성될 수 있다.The plurality of heat dissipating ribs formed on the outer circumferential surfaces of the other end portions of the plurality of unit heat pipes may be formed such that the distal end spaced apart from the outer circumferential surface of the other end portion of the unit heat pipe is not upward at least.
또한, 상기 복수개의 방사상 방열체는, 상기 방열 커버의 외측면에 결합되되, 상기 방열 커버의 외측면에 요입되지 않은 상기 복수개의 단위 히트 파이프의 일단부 외주면을 감싸도록 상기 복수개의 단위 히트 파이프를 고정시키는 파이프 고정 블록을 더 포함할 수 있다.The plurality of radiant heaters may include a plurality of unit heat pipes coupled to an outer surface of the heat radiating cover so as to surround an outer circumferential surface of one end of the plurality of unit heat pipes not recessed on the outer surface of the heat radiating cover. And a pipe fixing block for fixing the pipe.
또한, 상기 복수개의 방사상 방열체의 구성 중 상기 복수개의 단위 히트 파이프의 일단부 및 상기 파이프 고정 블록은, 상기 방열 커버의 내측면에 배치된 복수개의 전장소자의 위치에 대응되는 위치에 구비될 수 있다.One end of the plurality of unit heat pipes and the pipe fixing block among the plurality of radial heat radiating elements may be provided at positions corresponding to positions of a plurality of electric elements arranged on the inner surface of the heat radiating cover have.
또한, 상기 복수개의 방사상 방열체의 구성 중 상기 복수개의 방열 리브는 상기 방열 커버의 외측면과 소정 거리 이격되게 형성될 수 있다.The plurality of radiating ribs may be spaced apart from the outer surface of the radiating cover by a predetermined distance.
또한, 상기 복수개의 방사상 방열체의 구성 중 상기 복수개의 방열 리브의 선단 각각은 상기 방열 커버의 외측면에 대하여 동일한 이격 거리를 갖도록 형성될 수 있다.In addition, each of the ends of the plurality of radiating ribs of the plurality of radial heat radiating elements may be formed to have the same distance from the outer surface of the radiating cover.
또한, 상기 복수개의 단위 히트 파이프는, 내부에 상기 방열 커버로터 전달되는 열에 의하여 기화되었다가 상기 복수개의 방열 리브로 열을 전달한 후 액화되는 열전달 유체가 충진되도록 구비될 수 있다.The plurality of unit heat pipes may be filled with a heat transfer fluid which is vaporized by the heat transferred to the heat radiating cover rotor and then transferred to the plurality of heat dissipating ribs and then liquefied.
또한, 상기 복수개의 단위 히트 파이프는, 상기 방열 커버의 외측면에 결합된 일단부가 상기 복수개의 방열 리브가 구비된 타단부보다 하측에 위치될 수 있다.In addition, the plurality of unit heat pipes may be located at a lower side than the other end where the heat radiating ribs are provided, at one end coupled to the outer surface of the heat radiating cover.
본 발명에 따른 전장소자의 방열 장치의 실시예에 따르면 다음과 같은 다양한 효과를 달성할 수 있다.According to the embodiment of the heat dissipating device of the electric field element according to the present invention, the following various effects can be achieved.
첫째, 종래의 복수개의 방열 리브 대비 동일한 방열 면적을 형성하는 복수개의 방사상 방열체로 대체함으로써 제품 전체의 경량화를 도모할 수 있는 효과를 가진다.First, by replacing a plurality of radial heat radiators that form the same heat radiating area as a plurality of conventional heat radiating ribs, the entire product can be lightened.
둘째, 외부 공기가 다양한 경로 및 다양한 방향으로 복수개의 방사상 방열체 내부로 유동될 수 있으므로 방열 성능을 향상시킬 수 있는 효과를 가진다.Second, since the outside air can flow into a plurality of radial heaters in various directions and in various directions, it is possible to improve heat radiation performance.
셋째, 복수개의 방사상 방열체가 외측으로 상향 경사지게 배치됨으로써 하부로부터의 방열 공기가 상측의 방사상 방열체에 미치는 영향을 최소화함으로써 전체적으로 균일한 방열이 가능하도록 하는 효과를 가진다.Thirdly, since the plurality of radial heat dissipators are disposed upwardly inclined to the outside, the effect of the radiant air from the lower part on the radial heat radiator on the upper side is minimized, thereby achieving an overall uniform heat dissipation.
도 1은 종래 기술에 따른 전장소자의 일반적인 방열 장치를 나타낸 분해 사시도이고,1 is an exploded perspective view showing a general heat dissipation device of an electric field element according to the related art,
도 2는 본 발명에 따른 전장소자의 방열 장치의 일 실시예를 나타낸 사시도이며,FIG. 2 is a perspective view illustrating an embodiment of a heat dissipation device for electrical components according to the present invention,
도 3은 도 2의 분해 사시도이고,Fig. 3 is an exploded perspective view of Fig. 2,
도 4는 도 2의 A-A선을 따라 취한 단면도이며,4 is a cross-sectional view taken along the line A-A in Fig. 2,
도 5는 도 2의 구성 중 단위 방사상 방열체를 나타낸 사시도이고,Fig. 5 is a perspective view showing a unit radial heat radiator in the configuration of Fig. 2,
도 6은 도 5의 분해 사시도이며,Fig. 6 is an exploded perspective view of Fig. 5,
도 7은 본 발명에 따른 전장소자의 방열 장치의 다른 실시예를 나타낸 사시도이고,7 is a perspective view showing another embodiment of the heat dissipating device of the electric element according to the present invention,
도 8은 도 7의 분해 사시도이며,FIG. 8 is an exploded perspective view of FIG. 7,
도 9는 도 7의 B-B선을 따라 취한 단면도이고,9 is a cross-sectional view taken along the line B-B in Fig. 7,
도 10은 본 발명에 따른 전장소자의 방열 장치의 또 다른 실시예를 나타낸 단면도 및 일부 확대 사시도이다.10 is a cross-sectional view and a partially enlarged perspective view showing still another embodiment of the heat dissipation device for electric field element according to the present invention.
<부호의 설명><Description of Symbols>
100: 방열 장치 105: 기판 케이스100: heat sink 105: substrate case
110: 방열 커버 111: 열전도 홈110: heat dissipation cover 111: heat conduction groove
120: 인쇄회로기판 125: 전장소자120: printed circuit board 125: full-field element
130,130': 방사상 방열체 140: 단위 히트 파이프130, 130 ': Radial heat sink 140: Unit heat pipe
141: 일단부 142: 타단부141: one end portion 142: the other end portion
150: 방열 리브 160: 파이프 고정 블록150: heat radiating rib 160: pipe fixing block
이하, 본 발명의 일부 실시예들을 예시적인 도면을 통해 상세하게 설명한다. 각 도면의 구성요소들에 참조부호를 부가함에 있어서, 동일한 구성요소들에 대해서는 비록 다른 도면상에 표시되더라도 가능한 한 동일한 부호를 가지도록 하고 있음에 유의해야 한다. 또한, 본 발명을 설명함에 있어, 관련된 공지 구성 또는 기능에 대한 구체적인 설명이 본 발명의 요지를 흐릴 수 있다고 판단되는 경우에는 그 상세한 설명을 생략한다.Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. It should be noted that, in adding reference numerals to the constituent elements of the drawings, the same constituent elements are denoted by the same reference symbols as possible even if they are shown in different drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.
명세서 전체에서, 어떤 부분이 어떤 구성요소를 '포함', ' 구비'한다고 할 때, 이는 특별히 반대되는 기재가 없는 한 다른 구성요소를 제외하는 것이 아니라 다른 구성요소를 더 포함할 수 있는 것을 의미한다. 명세서에서 사용된 "전장소자"는 그 작동 시 발열이 되는 '발열소자'를 의미하는 바, 동일한 개념으로 혼용하여 사용할 수 있다.Throughout the specification, when an element is referred to as being "comprising" or "comprising", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise . As used herein, the term "electric field element" means a &quot; heating element &quot;
도 2는 본 발명에 따른 전장소자의 방열 장치의 일 실시예를 나타낸 사시도이고, 도 3은 도 2의 분해 사시도이며, 도 4는 도 2의 A-A선을 따라 취한 단면도이고, 도 5는 도 2의 구성 중 단위 방사상 방열체를 나타낸 사시도이며, 도 6은 도 5의 분해 사시도이다.2 is a perspective view showing an embodiment of a heat dissipation device for electric field elements according to the present invention, Fig. 3 is an exploded perspective view of Fig. 2, Fig. 4 is a cross- Fig. 6 is an exploded perspective view of Fig. 5. Fig.
본 발명에 따른 전장소자의 방열 장치의 일 실시예(100)는, 도 2 내지 도 6에 참조된 바와 같이, 작동 시 적어도 하나 이상이 발열되는 복수개의 전장소자(125)가 일면에 실장된 인쇄회로기판(120)을 포함한다.As shown in FIGS. 2 to 6, the heat dissipating device 100 according to the present invention includes a plurality of electric elements 125, each of which generates at least one heat during operation, And a circuit board (120).
여기서, 인쇄회로기판(120)은, 일면에만 복수개의 전장소자(125)가 실장되도록 구비되는 것으로 한정하여 설명하나, 양면 모두에 전장소자(125)가 실장되는 양면형도 본 발명의 권리범위의 범주에 해당될 수 있음은 당연하다.Here, the printed circuit board 120 is limited to being mounted so that a plurality of electric elements 125 are mounted on only one side, but a two-sided type in which the electric elements 125 are mounted on both sides is also a category Of course.
한편, 복수개의 전장소자(125)는, 전기적으로 동작하면서 소정의 열을 발생시키는 모든 발열소자를 포함하는 개념으로서, 대표적으로, 안테나 장치에 설치되는 파워 서플라이 유닛(PSU, Power Supply Unit) 및 FPGA(Field Programmable Gate Array) 소자 등을 들 수 있고, 그 외에 열 발생으로 인하여 성능이 저하될 수 있는 소자 구성도 포함한다고 볼 것이다.On the other hand, the plurality of electric element devices 125 include all the heat generating elements that generate a predetermined heat while being electrically operated. Representatively, the plurality of electric element devices 125 include a power supply unit (PSU) (Field Programmable Gate Array) device, and the like. In addition, the device structure that can degrade the performance due to heat generation is also considered.
한편, 본 발명의 일 실시예는, 상술한 인쇄회로기판(120)을 수용하는 기판 케이스(105)(도 7 및 도 8 참조) 및 기판 케이스(105)를 덮으면서, 내측면이 인쇄회로기판(120)의 타면에 밀착되는 방열 커버(110)를 더 포함할 수 있다. 여기서의 방열 커버(110) 또한 안테나 장치의 하우징에 대응되는 구성으로서, 인쇄회로기판(120)에 실장된 안테나 소자들, PSU 및 FPGA 소자를 외부로부터 보호함과 동시에 외부로 방열할 수 있는 구성이라면 그 명칭 여하에 불구하고 모두 포함하는 개념일 수 있다.On the other hand, an embodiment of the present invention includes a substrate case 105 (see Figs. 7 and 8) and a substrate case 105 that accommodates the above-described printed circuit board 120, And a heat radiating cover 110 that is in close contact with the other surface of the heat sink 120. Here, the heat dissipation cover 110 also corresponds to the housing of the antenna device. If the heat dissipation cover 110 is configured to protect the antenna elements, the PSU, and the FPGA device mounted on the printed circuit board 120 from the outside and radiate heat to the outside It can be a concept that includes both despite its name.
방열 커버(110)는, 기판 케이스(105) 내부로 수용된 인쇄회로기판(120)을 외부로부터 보호하면서도 인쇄회로기판(120)에 실장된 복수개의 전장소자(125)로부터 발생되는 열을 외측으로 전달하는 역할을 하도록 전도성 재질로 구비됨이 바람직하다. 방열 커버(110)의 외측에는 도면에 도시되지 않았으나, 후술하는 복수개의 방사상 방열체(130)는 별개로 외측면과 일체로 형성된 복수개의 방열 핀이 더 구비될 수 있다.The heat dissipation cover 110 protects the printed circuit board 120 accommodated in the substrate case 105 from the outside and transmits heat generated from the plurality of electric elements 125 mounted on the printed circuit board 120 to the outside It is preferable to be provided with a conductive material. Although not shown in the drawing, a plurality of radiant heaters 130, which will be described later, may be further provided with a plurality of radiating fins formed integrally with the outer surface separately from the radiating cover 110.
아울러, 본 발명에 따른 전장소자의 방열 장치의 일 실시예(100)는, 적어도 하나 이상이 방열 커버(110)의 외측면에 돌출되게 구비되되 각각 상향 경사지게 연장 형성되고, 인쇄회로기판(120)으로부터 발생된 열을 전달받아 외부로 방열시키는 복수개의 방사상 방열체(130)를 더 포함할 수 있다.At least one of the heat dissipating apparatus 100 according to the present invention may include at least one heat radiating cover 110 protruding from the outer surface of the heat radiating cover 110, And a plurality of radial heat dissipators 130 for radiating heat to the outside.
이와 같은, 복수개의 방사상 방열체(130)는, 방열 커버(110)의 외측면에 복수개의 방열 핀이 일체로 형성된 경우, 복수개의 방열 핀이 제거된 상태의 방열 커버(110) 부분에 직접 접촉되도록 배치될 수 있다.When the plurality of radiating fins 130 are integrally formed on the outer surface of the heat radiating cover 110, the plurality of radial heat radiating bodies 130 may be in direct contact with the heat radiating cover 110 in a state in which the plurality of radiating fins are removed, Respectively.
복수개의 방사상 방열체(130)는, 방열 커버(110)의 외측면에 결합된 복수개의 단위 히트 파이프(140) 및 복수개의 단위 히트 파이프(140) 각각에 형성된 복수개의 방열 리브(150)를 포함할 수 있다.The plurality of radial heat sinks 130 include a plurality of unit heat pipes 140 coupled to the outer surface of the heat dissipation cover 110 and a plurality of heat dissipation ribs 150 formed in each of the plurality of unit heat pipes 140 can do.
복수개의 방열 리브(150)는, 도 5에 참조된 바와 같이, 단위 히트 파이프(140)가 원형의 단면을 가지도록 구비된 경우, 단위 히트 파이프(140)의 길이방향을 중심으로 하는 원주면에서 각각 방사상 외측으로 연장되게 형성될 수 있다.5, when the unit heat pipe 140 has a circular cross section, the plurality of heat dissipating ribs 150 may be formed on the circumferential surface of the unit heat pipe 140, And may be formed to extend radially outwardly, respectively.
이와 같은 복수개의 방열 리브(150)는, 도 1에 도시된 종래의 방열 커버(10)의 외측면에 일체로 형성된 방열 리브(30)와 대응되는 구성으로서, 종래의 방열 리브(30)의 면적과 동일한 면적을 가지도록 형성할 경우 더 작은 공간 내에서 제작되는 바, 유효 방열 면적을 향상시킬 수 있다.The plurality of heat dissipating ribs 150 correspond to the heat dissipating ribs 30 integrally formed on the outer surface of the conventional heat dissipating cover 10 shown in FIG. It is possible to improve the effective heat dissipation area because it is manufactured in a smaller space.
아울러, 복수개의 방열 리브(150) 각각은 그 형성 방향이 단위 히트 파이프(140) 각각을 중심으로 방사상으로 형성된 바, 냉각을 위한 외부 공기의 유동 경로가 다양하게 형성될 수 있으므로, 복수개의 방사상 방열체(130) 사이에서 유동 공기가 정체되는 현상을 방지할 수 있으므로 방열 성능이 극대화될 수 있다.In addition, since the plurality of heat dissipating ribs 150 are formed radially with respect to each unit heat pipe 140, the flow path of the external air for cooling can be variously formed, It is possible to prevent the stagnation of the flowing air between the sieves 130, thereby maximizing the heat radiation performance.
본 발명의 일 실시예에 따른 전장소자의 방열 장치에서는, 종래의 문제점인 단위 방열 리브에 대한 그루브의 세밀 가공의 한계점을 극복하기 위하여 복수개의 방사상 방열체(130)라는 신규 구조를 제안하고 있으나, 복수개의 방열 리브(150) 각각에 대한 그루브 형상의 가공을 완전 배제하는 개념은 아님에 주의하여 한다. 이때, 복수개의 방열 리브(150) 각각에 대한 그루브의 형상 가공은 상술한 바와 같이 복수개의 방사상 방열체(130) 사이를 유동하는 공기의 유동 정체가 발생하지 않는 한도의 크기 또는 형상으로 형성됨이 바람직하다.In the heat dissipating device of the electric device according to the embodiment of the present invention, a plurality of radial heat dissipators 130 are proposed to overcome the limit of the detailed processing of the grooves with respect to the unit heat dissipating ribs, It should be noted that the concept of completely eliminating the processing of the groove shape for each of the plurality of heat dissipating ribs 150 is not considered. In this case, it is preferable that the shape of the groove for each of the plurality of heat dissipating ribs 150 is formed in a size or shape as long as the flow stagnation of the air flowing between the plurality of radiant heat emitting bodies 130 does not occur Do.
한편, 복수개의 단위 히트 파이프(140)는, 내부에 방열 커버(110)로부터 전달되는 열에 의하여 기화되었다가 복수개의 방열 리브(150)에 의하여 열이 외부로 방열될 경우 액화되는 열전달 유체가 충진될 수 있다.Meanwhile, the plurality of unit heat pipes 140 are vaporized by the heat transmitted from the heat radiating cover 110 to the inside, and when the heat is radiated to the outside by the plural radiating ribs 150, the heat transfer fluid which is liquefied is filled .
여기서, 열전달 유체는, 단위 히트 파이프(140)의 일단부(141)에서 방열 커버(110)로부터 전달된 열에 의해 기화되어 단위 히트 파이프(140)의 타단부(142)인 상측으로 이동되면서 열을 방열 커버(110)로부터 외측으로 이동시킨 후 단위 히트 파이프(140)의 타단부(142) 근처에서 액화되는 것이 반복되는 방식으로 열전달을 수행하는 매체이다.Here, the heat transfer fluid is vaporized by the heat transmitted from the heat radiation cover 110 at one end 141 of the unit heat pipe 140 and is moved to the upper side of the other end 142 of the unit heat pipe 140, And is a medium that performs heat transfer in such a manner that it is moved outward from the heat radiating cover 110 and then liquefied near the other end 142 of the unit heat pipe 140.
따라서, 복수개의 단위 히트 파이프(140)는, 열원에 구비된 측(본 발명의 실시예의 경우 단위 히트 파이프(140)의 일단부(141))은 방열되는 측(본 발명의 실시예의 경우 단위 히트 파이프(140)의 타단부(142))보다 더 낮은 위치에 구비되어야 한다. 즉, 열전달 유체는, 유체 이동 원리에 의해 고온일 경우 상측으로 이동하는 원리를 이용한 것이다.Accordingly, the plurality of unit heat pipes 140 are arranged in such a manner that a side of the heat source (one end 141 of the unit heat pipe 140 in the embodiment of the present invention) The other end 142 of the pipe 140). That is, the heat transfer fluid is based on the principle that it moves upward when the temperature is high due to the fluid movement principle.
그러므로, 복수개의 단위 히트 파이프(140)는, 방열 커버(110)의 외측면에 결합된 일단부가 복수개의 방열 리브(150)가 구비된 타단부보다 하측에 위치되어야 한다.Therefore, one end of the plurality of unit heat pipes 140 coupled to the outer surface of the heat dissipating cover 110 should be positioned below the other end provided with the plurality of heat dissipating ribs 150.
이하, 본 발명의 실시예에서 복수개의 단위 히트 파이프(140)의 내부에 충진된 열전달 유체가 기화 시에는 유체 이동 원리에 의하여 상측으로 이동한 후 열전달이 이루어진 다음 액화 시 중력에 의하여 다시 하방에 구비된 열원으로 이동되는 구조를 채택한 것으로 한정하여 설명한다.Hereinafter, in the embodiment of the present invention, when the heat transfer fluid filled in the plurality of unit heat pipes 140 is vaporized, the heat transfer fluid is moved upward by the fluid movement principle, The heat source is moved to the heat source.
한편, 방열 커버(110)의 외측면에는, 복수개의 단위 히트 파이프(140)의 일단부(141)가 요입되게 결합되는 열전도 홈(111)이 복수개의 단위 히트 파이프(140)의 개수에 대응되게 복수개 형성될 수 있다. 여기서, 방열 커버(110)의 외측면에 상술한 바와 같이 복수개의 방열 핀이 일체로 형성된 경우, 복수개의 단위 히트 파이프(140)와 간섭되지 않도록 일부의 복수개의 방열 핀이 제거되거나 삭제될 수 있음은 이미 설명하였다.The heat conductive grooves 111 in which the one end portion 141 of the plurality of unit heat pipes 140 are coupled to the outer surface of the heat dissipation cover 110 are formed to correspond to the number of the plurality of unit heat pipes 140 And a plurality of them may be formed. Here, when a plurality of heat dissipation fins are integrally formed on the outer surface of the heat dissipation cover 110 as described above, a part of the plurality of heat dissipation fins may be removed or removed so as not to interfere with the plurality of unit heat pipes 140 Has already been described.
열전도 홈(111)은, 상하 방향으로 길게 열(Line)을 형성하되, 상하로 인접하는 열전도 홈(111)이 상호 소정거리 이격되게 형성됨이 바람직하다. 아울러, 복수개의 열전도 홈(111)은, 상하 방향으로 길게 복수개의 열(Line)을 형성하되 좌우로 인접하는 열이 상호 소정거리 이격되게 형성될 수 있다.It is preferable that the thermally conductive grooves 111 are formed such that the thermally conductive grooves 111 that are vertically adjacent to each other are spaced apart from each other by a predetermined distance in the vertical direction. In addition, the plurality of heat conduction grooves 111 may be formed so as to have a plurality of long lines in the up-and-down direction, while the adjacent heat lines may be spaced apart from each other by a predetermined distance.
이와 같이 배치된 복수개의 열전도 홈(111) 각각에는, 상술한 복수개의 단위 히트 파이프(140)의 일단부(141)가 1대1 결합될 수 있다. 따라서, 상하 방향 및 좌우 방향으로 이격된 공간으로 외기가 유동되므로, 방열을 위한 공기의 유동 경로가 다양하게 설계될 수 있다.In each of the plurality of heat conduction grooves 111 thus arranged, one end 141 of the plurality of unit heat pipes 140 may be coupled one-to-one. Therefore, since the outside air flows into the space separated in the up-and-down direction and the left-right direction, the flow path of air for heat radiation can be variously designed.
한편, 본 발명에 따른 전장소자의 방열 장치의 일 실시예(100)에서, 복수개의 방사상 방열체(130)는, 방열 커버(110)의 외측면에 결합되되, 방열 커버(110)의 외측면에 요입되지 않은 복수개의 단위 히트 파이프(140)의 일단부(141) 외주면을 감싸도록 복수개의 단위 히트 파이프(140)를 고정시키는 파이프 고정 블록(160)을 더 포함할 수 있다.The plurality of radial heaters 130 are coupled to the outer surface of the heat radiating cover 110 so that the outer surface of the heat radiating cover 110 is connected to the outer surface of the heat radiating cover 110. [ And a pipe fixing block 160 for fixing the plurality of unit heat pipes 140 so as to surround the outer circumferential surface of the one end 141 of the plurality of unit heat pipes 140 that are not inserted into the unit heat pipes 140.
파이프 고정 블록(160)은, 방열 커버(110)의 외측면으로 전달된 전장소자(125)의 열을 집열하여 복수개의 단위 히트 파이프(140)의 일단부(141)에 효과적으로 전달되도록 하는 열전도성이 우수한 재질로 구비됨이 바람직하다.The pipe fixing block 160 has a thermal conductive property for collecting the heat of the electrical component 125 transmitted to the outer surface of the heat dissipating cover 110 and effectively transmitting the heat to the one end 141 of the plurality of unit heat pipes 140 It is preferable that it is made of an excellent material.
복수개의 단위 히트 파이프(140)의 일단부(141) 외주면 일측은 방열 커버(110)의 외측면에 형성된 열전도 홈(111)에 밀착되게 수용되고, 복수개의 단위 히트 파이프(140)의 일단부(141) 외주면 타측은 파이프 고정 블록(160)에 밀착되게 수용 배치됨으로써, 전장소자(125)로부터 발생된 열을 가능한 한 많이 복수개의 단위 히트 파이프(140)의 일단부(141)로 전달시키게 된다.One end 141 of one end 141 of the plurality of unit heat pipes 140 is received in close contact with the heat conduction groove 111 formed on the outer surface of the heat dissipating cover 110, The other side of the outer circumferential surface is accommodated so as to be in close contact with the pipe fixing block 160 so that the heat generated from the electric element 125 is transmitted to the one end portion 141 of the plurality of unit heat pipes 140 as much as possible.
한편, 복수개의 방사상 방열체(130)의 구성 중 복수개의 단위 히트 파이프(140)의 일단부(141) 및 파이프 고정 블록(160)은, 방열 커버(110)의 내측면에 배치된 복수개의 전장소자(125)의 위치에 각각 대응되는 위치에 구비됨이 바람직하다.One end 141 of the plurality of unit heat pipes 140 and the pipe fixing block 160 among the plurality of radial heat radiating elements 130 constitute a plurality of electric fields disposed on the inner surface of the heat radiating cover 110 It is preferable that they are provided at positions corresponding to the positions of the elements 125, respectively.
복수개의 단위 히트 파이프(140)는, 각각의 전장소자(125)로부터 발생된 열을 직접적으로 전달받지는 않으나 위치 상 최소 열 유동 경로를 통해 전장소자(125)로부터 발생된 열이 파이프 고정 블록(160)을 매개로 전달되도록 하기 위함이다.The plurality of unit heat pipes 140 are arranged such that the heat generated from the electric field elements 125 is not directly transmitted to the pipe fixing block 160 to be transmitted through the medium.
한편, 복수개의 방사상 방열체(130)의 구성 중 복수개의 방열 리브(150)는, 방열 커버(110)의 외측면과 가깝게 위치한 단부가 적어도 방열 커버(110)의 외측면과 소정 거리 이격되게 형성되는 것이 바람직하다. 아울러, 복수개의 방열 리브(150)는, 방열 커버(110)의 외측에 구비된 파이프 고정 블록(160)에 의하여 방열 커버(110)의 외측면으로부터 소정의 두께가 형성된 경우에는, 파이프 고정 블록(160)의 외측면과 가깝게 위치한 복수개의 방열 리브(150)의 단부와의 사이가 소정 거리 이격되도록 형성되는 것이 바람직하다.The plurality of radiating ribs 150 of the plurality of radial heat sinks 130 are formed such that an end portion of the plurality of radiating ribs 150 located close to the outer surface of the heat radiating cover 110 is spaced apart from the outer surface of the heat radiating cover 110 by a predetermined distance . The plurality of heat dissipating ribs 150 may be formed in a predetermined thickness from the outer surface of the heat dissipating cover 110 by a pipe fixing block 160 provided outside the heat dissipating cover 110, 160 and the ends of the plurality of heat-radiating ribs 150, which are located close to the outer surface of the heat-radiating ribs 160, 160, are spaced apart from each other by a predetermined distance.
이는, 방열 커버(110)의 외측면 또는 파이프 고정 블록(160)의 외측면으로 전달된 열이 상기 이격된 공간을 통하여 외측으로 직접 방열되도록 하기 위함이다.This is because the heat transmitted to the outer surface of the heat dissipating cover 110 or the outer surface of the pipe fixing block 160 is directly radiated outward through the spaced space.
상기와 같이 구성되는 본 발명에 따른 전장소자의 방열 장치의 일 실시예(100)의 방열 과정을 첨부된 도면(특히, 도 2 내지 도 6)을 참조하여 간략하게 설명하면 다음과 같다.Hereinafter, the heat dissipation process of the heat dissipating device 100 according to an embodiment of the present invention will be described with reference to the accompanying drawings (particularly, FIGS. 2 to 6).
먼저, 전장소자(125)가 실장된 인쇄회로기판(120)의 일면으로부터 전장소자(125)의 작동 시 발생된 열은 인쇄회로기판(120)의 타면으로 전달된 후, 인쇄회로기판(120)의 타면에 밀착 배치된 방열 커버(110)의 내측면으로 전달된다.The heat generated during operation of the electrical component 125 from one side of the printed circuit board 120 on which the electrical component 125 is mounted is transferred to the other side of the printed circuit board 120, To the inner surface of the heat dissipation cover 110 closely arranged on the other surface of the heat dissipation cover 110.
그리고, 방열 커버(110)의 내측면으로 전달된 열은 방열 커버(110)의 외측면으로 전달되면서 방열 커버(110)의 외측면과 복수개의 방열 리브(150) 사이의 이격 공간을 통하여 열을 1차 방열함은 물론, 잔여 열은 방열 커버(110)의 외측면에 형성된 열전도 홈(111) 및 파이프 고정 블록(160)을 통해 복수개의 단위 히트 파이프(140)의 일단부(141) 각각에 전달된다.The heat transmitted to the inner surface of the heat dissipating cover 110 is transmitted to the outer surface of the heat dissipating cover 110 while the heat is transmitted through the space between the outer surface of the heat dissipating cover 110 and the plurality of heat dissipating ribs 150 The remaining heat is supplied to the first ends 141 of the plurality of unit heat pipes 140 through the heat conductive grooves 111 formed on the outer surface of the heat dissipating cover 110 and the pipe fixing block 160, .
그러면, 복수개의 단위 히트 파이프(140) 내측에 충진된 열전달 유체가 기화되면서 상대적으로 상측에 위치한 복수개의 단위 히트 파이프(140)의 타단부(142)로 이동되면서, 그 외주면에 구비된 복수개의 방열 리브(150)를 통해 2차로 방열시킨다.The heat transfer fluid filled in the plurality of unit heat pipes 140 is vaporized and is moved to the other end 142 of the plurality of unit heat pipes 140 located on the upper side, And is radiated through the ribs 150 in a second order.
이때, 기화된 열전달 유체는 복수개의 방열 리브(150)로 열전달 하는 과정에서 응축되어 다시 액화됨과 동시에 중력 방향으로 이동하면서 다시 인쇄회로기판(120)으로부터 전달된 열에 의해 기화되는 것을 반복함으로써 신속하게 전장소자(125)로부터 발생된 열을 외부로 방열하게 된다.At this time, the vaporized heat transfer fluid is condensed and re-liquefied in the course of heat transfer to the plurality of heat dissipating ribs 150, and is repeatedly vaporized by the heat transferred from the printed circuit board 120 while moving in the gravity direction, The heat generated from the element 125 is dissipated to the outside.
한편, 본 발명에 따른 전장소자의 방열 장치의 일 실시예(100)는, 하측에 위치된 복수개의 방사상 방열체(130)로부터 방열이 이루어질 경우, 상술한 바와 같이, 상기 복수개의 방사상 방열체(130) 전부가 방열 커버(110)에 대하여 상향 경사지게 돌출 형성됨으로써 방열된 공기가 상승 기류를 형성하더라도 상측에 구비된 복수개의 방사상 방열체(130)에 의하여 상승 기류가 외측으로 유도되기 때문에 하측에 구비된 복수개의 방사상 방열체(130)의 1차 또는 2차 방열된 열에 의해 상대적으로 상측에 구비된 복수개의 방사상 방열체(130)의 방열 성능을 저하시키는 것을 방지할 수 있다.In an embodiment of the heat dissipating device 100 for electric field elements according to the present invention, when heat is radiated from a plurality of radial heat radiators 130 located on the lower side, as described above, the plurality of radial heat radiators 130 are protruded upward with respect to the heat radiating cover 110 so that the upward flow is guided outward by the plurality of radiant heat emitting bodies 130 provided on the upper side even if the radiated air forms a rising air flow, It is possible to prevent the heat radiating performance of the plurality of radial heat radiators 130 provided on the upper side from being lowered by the primary or secondary radiated heat of the plurality of radial heat radiators 130 that are formed.
아울러, 본 발명에 따른 전장소자의 방열 장치의 일 실시예(100)는, 인접하는 복수개의 방사상 방열체(130)가 각각 소정거리 이격되게 배치됨으로써, 외기가 다양한 유동 경로를 형성하면서 방열 리브(150)로 유동됨에 따라 공기의 유입량이 종래 대비 크게 증가함으로써 방열 성능이 향상될 수 있다.In addition, in an embodiment of a heat dissipating device 100 according to the present invention, a plurality of radial heat radiating elements 130 adjacent to each other are spaced apart from each other by a predetermined distance so that the heat radiating ribs 150, the inflow amount of the air increases greatly compared with the conventional one, so that the heat radiation performance can be improved.
도 7은 본 발명에 따른 전장소자의 방열 장치의 다른 실시예를 나타낸 사시도이고, 도 8은 도 7의 분해 사시도이며, 도 9는 도 7의 B-B선을 따라 취한 단면도이다.FIG. 7 is a perspective view showing another embodiment of the heat dissipating device of the electric field element according to the present invention, FIG. 8 is an exploded perspective view of FIG. 7, and FIG. 9 is a sectional view taken along line B-B of FIG.
본 발명에 따른 전장소자의 방열 장치의 다른 실시예(100')는, 기본적으로 상술한 일 실시예 대비 복수개의 방사상 방열체(130)가 방열 커버(110)의 외측면에 각각 소정거리 이격되게 배치된 기술적 특징을 동일한 것을 전제로 한다.In another embodiment 100 'of the heat dissipating device of the electric field element according to the present invention, a plurality of radiant heat emitting bodies 130 are basically separated from each other by a predetermined distance on the outer surface of the heat radiating cover 110 The same technical features are assumed to be the same.
따라서, 이하에서 개시하는 본 발명에 따른 전장소자의 방열 장치의 다른 실시예(100')는, 상술한 일 실시예와 구별되는 기술적 구성을 위주로 설명하기로 한다.Therefore, another embodiment (100 ') of the heat dissipating device of the electric field element according to the present invention will be described below focusing on a technical structure different from the above-described one embodiment.
본 발명에 따른 전장소자의 방열 장치의 다른 실시예(100')는, 도 7 내지 도 9에 참조된 바와 같이, 복수개의 열전도 홈(111) 및 복수개의 단위 히트 파이프(140)는, 좌우로 인접하는 열전도 홈(111) 및 단위 히트 파이프(140)의 높낮이가 상이하게 배치되도록 구비될 수 있다.7 to 9, a plurality of heat conduction grooves 111 and a plurality of unit heat pipes 140 are formed on the left and right sides of the heat dissipating device 100 ' The adjacent heat conduction grooves 111 and the unit heat pipes 140 may be arranged to have different heights.
즉, 복수개의 방사상 방열체(130)는 상하 방향으로 길게 열을 형성하되, 복수개의 열로 배치되고, 각각의 방사상 방열체(130)는 그 인접하는 방열체와는 높낮이가 상이하게 배치됨으로써, 외부 공기의 유동 경로를 더 다양하게 확보할 수 있는 이점을 가진다.That is, the plurality of radial heat radiators 130 are arranged in a plurality of rows in the vertical direction, and each radial heat radiator 130 is disposed at a different height from the adjacent heat radiator, The air flow path can be more variously secured.
아울러, 본 발명의 다른 실시예는, 복수개의 방사상 방열체(130)의 구성 중 복수개의 방열 리브(150)의 선단 각각이, 방열 커버(110)의 외측면에 대하여 동일한 이격 거리를 갖도록 형성될 수 있다. 즉, 복수개의 방사상 방열체(130)의 방열 리브(150) 선단 각각은, 방열 커버(110)의 외측면과 평행된 선단면을 형성함으로써 외부로의 노출 설계가 용이한 이점을 가진다.Another embodiment of the present invention is such that each of the ends of the plurality of heat dissipating ribs 150 among the plurality of radiant heat emitting elements 130 is formed to have the same distance from the outer surface of the heat dissipating cover 110 . That is, each of the front ends of the heat radiating ribs 150 of the plurality of radial heat radiating elements 130 has an advantage in that it is easy to design the exposure to the outside by forming a front end surface parallel to the outer surface of the heat radiating cover 110.
아울러, 도면에 도시되지 않았으나, 본 발명의 일 실시예 및 다른 실시예의 경우, 상술한 복수개의 방열 리브(150)가 외부로 노출되게 설치되는 바, 외부 이물질의 부착 등의 우려가 있으므로, 복수개의 방열 리브(150)의 공기가 유동되는 유동 홀이 다수개 형성된 리브 보호 커버가 별도로 구비될 수 있다. 리브 보호 커버는, 방열 성능이 저하되지 않는 한도에서 작업자에 의한 설치 시 파손 방지를 위한 기능을 수행할 수 있는 적합한 형태로 제작됨이 바람직하다.In addition, although not shown in the drawings, in the case of one embodiment and another embodiment of the present invention, since the plurality of heat dissipating ribs 150 are installed so as to be exposed to the outside, A rib protection cover may be separately provided in which a plurality of flow holes through which the air of the heat dissipating ribs 150 flows. It is preferable that the rib protecting cover is manufactured in a suitable form capable of performing a function for preventing breakage during installation by an operator so long as the heat radiation performance is not lowered.
도 10은 본 발명에 따른 전장소자의 방열 장치(100)의 또 다른 실시예를 나타낸 단면도 및 일부 확대 사시도이다.10 is a cross-sectional view and a partially enlarged perspective view showing still another embodiment of the heat dissipating device 100 of the electric field element according to the present invention.
본 발명에 따른 전장소자의 방열 장치(100)의 또 다른 실시예는, 도 10에 참조된 바와 같이, 복수개의 단위 히트 파이프(140)의 타단부(142) 외주면에 각각 형성된 복수개의 방열 리브(150)는, 단위 히트 파이프(140)의 타단부(142) 외주면으로부터 이격된 선단이 적어도 상향되지 않도록 형성될 수 있다. 여기서, 단위 히트 파이프(140)의 타단부(142) 외주면은 상향 경사지게 배치된 봉 형태의 외주면을 의미하고, 복수개의 방열 리브(150)의 선단은 단위 히트 파이프(140)의 타단부(142) 외주면으로부터 가장 멀리 떨어진 복수개의 방열 리브(150)의 끝 부분을 지칭한다.10, a plurality of heat dissipating ribs (not shown) formed on the outer circumferential surface of the other end portion 142 of the plurality of unit heat pipes 140 150 may be formed such that the distal end spaced apart from the outer circumferential surface of the other end 142 of the unit heat pipe 140 is not at least upward. Here, the outer circumferential surface of the other end 142 of the unit heat pipe 140 refers to an outer circumferential surface of a bar shape arranged with an upward inclination, and the tips of the plurality of heat dissipating ribs 150 are connected to the other end 142 of the unit heat pipe 140, Refers to the end portions of the plurality of heat dissipating ribs 150 farthest from the outer circumferential surface.
즉, 복수개의 방열 리브(150)의 선단이 복수개의 단위 히트 파이프(140)의 외주면으로부터 상향되지 않도록 형성된다는 의미는 복수개의 단위 히트 파이프(140)의 타단부(142) 외주면 중 절반 부분(하측을 향하는 부분)에만 복수개의 방열 리브(150)를 구비하고, 나머지 절반 부위(상측을 향하는 부분)에는 복수개의 방열 리브(150)를 구비하지 않는 형상으로 복수개의 방사상 방열체(130)를 구비하는 것이다.That is to say that the tip of the plurality of heat dissipating ribs 150 is formed so as not to be upward from the outer circumferential surface of the plurality of unit heat pipes 140, it means that half of the outer circumferential surface of the other end portion 142 of the plurality of unit heat pipes 140 And a plurality of radiating heaters 130 are provided in a shape that does not include a plurality of radiating ribs 150 in the other half portion will be.
이 경우, 도 10에 참조된 바와 같이, 한정된 면적을 가진 방열 커버(110)의 외측면에 보다 많은 개수의 방사상 방열체(130)를 근접 또는 밀접하게 설치할 수 있으므로, 방열 성능을 더욱 향상시키는 이점을 추가할 수 있다.In this case, as shown in FIG. 10, since a larger number of radial heat radiating elements 130 can be installed close to or close to the outer surface of the heat radiating cover 110 having a limited area, advantages Can be added.
이상, 본 발명에 따른 전장소자의 방열 장치의 실시예들을 첨부된 도면을 참조하여 상세하게 설명하였다. 그러나, 본 발명의 실시예가 반드시 상술한 실시예들에 의하여 한정되는 것은 아니고, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의한 다양한 변형 및 균등한 범위에서의 실시가 가능함은 당연하다고 할 것이다. 그러므로, 본 발명의 진정한 권리범위는 후술하는 청구범위에 의하여 정해진다고 할 것이다.The embodiments of the heat dissipating device of the electric field element according to the present invention have been described in detail with reference to the accompanying drawings. It should be understood, however, that the embodiments of the present invention are not necessarily limited to the above-described embodiments, and that various modifications and equivalents may be made by those skilled in the art to which the present invention pertains will be. Therefore, it is to be understood that the true scope of the present invention is defined by the following claims.
본 발명에 따른 전장소자의 방열 장치의 실시예들은, 특히 발열이 높은 전장소자를 구비한 안테나 장치에 사용될 수 있다.Embodiments of the heat dissipation device of the electric field element according to the present invention can be used particularly in an antenna device having an electric field element with high heat generation.

Claims (13)

  1. 작동 시 적어도 하나 이상이 발열되는 복수개의 전장소자가 일면에 실장된 인쇄회로기판;A printed circuit board on which a plurality of electric elements are mounted, the at least one of which is heated during operation;
    상기 인쇄회로기판을 수용하는 기판 케이스;A substrate case for receiving the printed circuit board;
    상기 기판 케이스를 덮으면서, 내측면이 상기 인쇄회로기판의 타면에 밀착되는 방열 커버; 및A heat dissipation cover in which an inner surface of the heat dissipation unit is in close contact with the other surface of the printed circuit board while covering the substrate case; And
    적어도 하나 이상이 상기 방열 커버의 외측면에 돌출되게 구비되되 각각 상향 경사지게 연장 형성되고, 상기 인쇄회로기판으로부터 발생된 열을 전달받아 외부로 방열시키는 복수개의 방사상 방열체; 를 포함하는 전장소자의 방열 장치.A plurality of radial heat dissipating members protruding upward from the outer surface of the heat radiating cover, each of the plurality of radial heat radiating members being extended upwardly to receive heat generated from the printed circuit board and dissipate heat to the outside; And a heat dissipation device for dissipating heat.
  2. 청구항 1에 있어서,The method according to claim 1,
    상기 복수개의 방사상 방열체는,Wherein the plurality of radial heat dissipators comprise:
    일단부는 상기 방열 커버의 외측면에 외주면 일부가 요입되게 결합되고, 타단부는 상기 일단부에 대하여 절곡되어 상향 경사지게 외측으로 연장된 복수개의 단위 히트 파이프; 및A plurality of unit heat pipes, one end of which is coupled to an outer surface of the heat radiating cover so as to be partially recessed, and the other end of which is bent toward the one end and extends outwardly inclined upward; And
    상기 복수개의 단위 히트 파이프 각각의 타단부 외주면 일부 또는 전부로부터 반경 방향 외측으로 방사상 연장된 복수개의 방열 리브; 를 포함하는 전장소자의 방열 장치.A plurality of heat dissipating ribs radially extending radially outward from a part or all of the outer circumferential surface of the other end of each of the plurality of unit heat pipes; And a heat dissipation device for dissipating heat.
  3. 청구항 2에 있어서,The method of claim 2,
    상기 방열 커버의 외측면에는, 상기 복수개의 단위 히트 파이프의 일단부가 요입되게 결합되는 열전도 홈이 상기 복수개의 단위 히트 파이프의 개수에 대응되게 복수개 형성된 전장소자의 방열 장치.Wherein a plurality of heat conduction grooves are formed in the outer side surface of the heat dissipation cover so that one end of the plurality of unit heat pipes is coupled with the heat transfer grooves so as to correspond to the number of the plurality of unit heat pipes.
  4. 청구항 3에 있어서,The method of claim 3,
    상기 복수개의 열전도 홈은, 상하 방향으로 길게 열을 형성하되, 상하로 인접하는 열전도 홈이 상호 소정거리 이격되게 형성된 전장소자의 방열 장치.Wherein the plurality of thermally conductive grooves are formed to be long in the vertical direction, and the adjacent thermally conductive grooves are spaced apart from each other by a predetermined distance.
  5. 청구항 3에 있어서,The method of claim 3,
    상기 복수개의 열전도 홈은, 상하 방향으로 길게 복수개의 열을 형성하되, 좌우로 인접하는 열이 상호 소정거리 이격되게 형성된 전장소자의 방열 장치.Wherein the plurality of heat conduction grooves have a plurality of rows arranged vertically in the vertical direction, and the rows adjacent to each other are spaced apart from each other by a predetermined distance.
  6. 청구항 3 내지 청구항 5 중 어느 한 항에 있어서,The method according to any one of claims 3 to 5,
    상기 복수개의 열전도 홈 및 상기 복수개의 단위 히트 파이프는, 좌우로 인접하는 열전도 홈 및 단위 히트 파이프의 높낮이가 상이하게 배치되는 전장소자의 방열 장치.Wherein the plurality of heat conduction grooves and the plurality of unit heat pipes are disposed so that the left and right adjacent heat conduction grooves and the unit heat pipes have different heights.
  7. 청구항 2에 있어서,The method of claim 2,
    상기 복수개의 단위 히트 파이프의 타단부 외주면에 각각 형성된 상기 복수개의 방열 리브는, 상기 단위 히트 파이프의 타단부 외주면으로부터 이격된 선단이 적어도 상향되지 않도록 형성된 전장소자의 방열 장치.Wherein the plurality of heat dissipating ribs formed on the outer circumferential surface of the other end of the plurality of unit heat pipes are formed so that the tip end of the unit heat pipe spaced apart from the outer circumferential surface of the other end portion is not at least upward.
  8. 청구항 2에 있어서,The method of claim 2,
    상기 복수개의 방사상 방열체는, 상기 방열 커버의 외측면에 결합되되, 상기 방열 커버의 외측면에 요입되지 않은 상기 복수개의 단위 히트 파이프의 일단부 외주면을 감싸도록 상기 복수개의 단위 히트 파이프를 고정시키는 파이프 고정 블록; 을 더 포함하는 전장소자의 방열 장치.The plurality of radiant heaters may be fixed to the outer surface of the heat dissipation cover by fixing the plurality of unit heat pipes so as to surround the outer circumferential surface of one end of the plurality of unit heat pipes not recessed on the outer surface of the heat dissipation cover Pipe fixing block; Further comprising: a heat dissipation device for heat dissipating the electric field.
  9. 청구항 8에 있어서,The method of claim 8,
    상기 복수개의 방사상 방열체의 구성 중 상기 복수개의 단위 히트 파이프의 일단부 및 상기 파이프 고정 블록은, 상기 방열 커버의 내측면에 배치된 복수개의 전장소자의 위치에 대응되는 위치에 구비되는 전장소자의 방열 장치.One end of the plurality of unit heat pipes and the pipe fixing block among the plurality of radial heat radiating elements may include a plurality of electric elements arranged at positions corresponding to positions of a plurality of electric elements arranged on the inner surface of the heat radiating cover, Heat sink.
  10. 청구항 2에 있어서,The method of claim 2,
    상기 복수개의 방사상 방열체의 구성 중 상기 복수개의 방열 리브는 상기 방열 커버의 외측면과 소정 거리 이격되게 형성된 전장소자의 방열 장치.Wherein the heat radiating ribs of the plurality of radial heat radiating elements are spaced apart from the outer surface of the heat radiating cover by a predetermined distance.
  11. 청구항 2에 있어서,The method of claim 2,
    상기 복수개의 방사상 방열체의 구성 중 상기 복수개의 방열 리브의 선단 각각은 상기 방열 커버의 외측면에 대하여 동일한 이격 거리를 갖도록 형성된 전장소자의 방열 장치.Wherein the plurality of radial heat radiating elements are formed so that the tip ends of the plurality of radiating ribs have the same distance from the outer surface of the heat radiating cover.
  12. 청구항 2 내지 청구항 5 및 청구항 7 내지 청구항 11 중 어느 한 항에 있어서,The method according to any one of claims 2 to 5 and claims 7 to 11,
    상기 복수개의 단위 히트 파이프는, 내부에 상기 방열 커버로부터 전달되는 열에 의하여 기화되었다가 상기 복수개의 방열 리브로 열을 전달한 후 액화되는 열전달 유체가 충진되도록 구비된 전장소자의 방열 장치.Wherein the plurality of unit heat pipes are filled with a heat transfer fluid which is vaporized by heat transmitted from the heat radiating cover to heat the inside of the plurality of unit heat pipes, and then heat is transferred to the plurality of heat dissipating ribs.
  13. 청구항 12에 있어서,The method of claim 12,
    상기 복수개의 단위 히트 파이프는, 상기 방열 커버의 외측면에 결합된 일단부가 상기 복수개의 방열 리브가 구비된 타단부보다 하측에 위치되는 전장소자의 방열 장치. Wherein one end of the plurality of unit heat pipes is coupled to an outer surface of the heat radiating cover and the other end of the unit heat pipe is located below the other end of the heat radiating rib.
PCT/KR2018/015619 2017-12-08 2018-12-10 Heat radiating device for electronic element WO2019112400A1 (en)

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CN201880079396.XA CN111788876B (en) 2017-12-08 2018-12-10 Heat sink for electronic element
JP2020530655A JP7045457B2 (en) 2017-12-08 2018-12-10 Heat dissipation device for electrical elements
US16/893,394 US11266041B2 (en) 2017-12-08 2020-06-04 Cooling apparatus for electronic element

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KR10-2017-0168698 2017-12-08
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KR1020180158227A KR102147658B1 (en) 2017-12-08 2018-12-10 A cooling apparatus for electronic elements
KR10-2018-0158227 2018-12-10

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JPH07283564A (en) * 1994-04-05 1995-10-27 Hitachi Ltd Electronic device
JPH1154680A (en) * 1997-07-30 1999-02-26 Hitachi Ltd Heat sink and electronic device using the same
US6807059B1 (en) * 1998-12-28 2004-10-19 James L. Dale Stud welded pin fin heat sink
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US20170194751A1 (en) * 2015-12-31 2017-07-06 Foxconn Interconnect Technology Limited Plug connecetor with a metallic enclosure having heat sink member thereon

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JPH07283564A (en) * 1994-04-05 1995-10-27 Hitachi Ltd Electronic device
JPH1154680A (en) * 1997-07-30 1999-02-26 Hitachi Ltd Heat sink and electronic device using the same
US6807059B1 (en) * 1998-12-28 2004-10-19 James L. Dale Stud welded pin fin heat sink
KR20140126438A (en) * 2013-04-23 2014-10-31 주식회사 그린와이드 Hybrid radiationg pipe and Heatsink module
US20170194751A1 (en) * 2015-12-31 2017-07-06 Foxconn Interconnect Technology Limited Plug connecetor with a metallic enclosure having heat sink member thereon

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Publication number Priority date Publication date Assignee Title
CN114071964A (en) * 2021-11-16 2022-02-18 北京华电力拓能源科技有限公司 Mining explosion-proof and intrinsically safe 5G wireless base station heat dissipation device
CN114071964B (en) * 2021-11-16 2024-05-31 北京华电力拓能源科技有限公司 Mining explosion-proof and intrinsically safe 5G wireless base station heat abstractor

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