WO2016029808A1 - 一种led光源发光散热结构及其发光散热方法 - Google Patents

一种led光源发光散热结构及其发光散热方法 Download PDF

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Publication number
WO2016029808A1
WO2016029808A1 PCT/CN2015/087461 CN2015087461W WO2016029808A1 WO 2016029808 A1 WO2016029808 A1 WO 2016029808A1 CN 2015087461 W CN2015087461 W CN 2015087461W WO 2016029808 A1 WO2016029808 A1 WO 2016029808A1
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heat
heat dissipation
dissipating
led
emitting chip
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PCT/CN2015/087461
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English (en)
French (fr)
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蔡鸿
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蔡鸿
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Publication of WO2016029808A1 publication Critical patent/WO2016029808A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems

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  • the invention relates to a light-emitting heat dissipation structure and a light-emitting and heat-dissipating method thereof, in particular to a light-emitting heat dissipation structure for an LED light source and a light-emitting and heat-dissipating method thereof.
  • PCT International Application No. PCT/CN2011/000756 discloses an LED light source and a method of manufacturing the same, which describes an LED component. It can emit light through two sides, thereby avoiding heat accumulation on the bonding surface and the substrate of the conventional LED light source, and the LED elements and the two fluorescent elements are directly connected in a sandwich manner, thereby forming one or more passage openings to thereby pass through.
  • the channel port directs the heat transfer of the LED elements.
  • the structure mainly includes one or more LED light source groups, wherein each of the LED light source groups includes: at least one LED element, wherein the LED element has a first light emitting surface and a second light emitting surface on the reverse side, wherein the The LED element is adapted to provide illumination at an angle greater than 180° by electroluminescence on each of the first illuminating surface and the second illuminating surface; two fluorescent elements, the two fluorescent elements being respectively located at the first of the LED elements a light emitting surface and the second light emitting surface portion to maintain the LED elements in position such that illumination generated by the LEDs respectively passes from the light emitting surface through the two fluorescent elements; and an electronic component, the electrons An element is coupled to the LED element to electrically connect the LED element to a power source.
  • the LED element is sandwiched by the two fluorescent elements to maintain the LED element in position such that the first light emitting surface and the second light emitting surface are directly pressed against the fluorescent element to obtain Supporting and directing heat transfer away from the LED elements, and the LED elements are held within an LED receiving cavity of the gap between the fluorescent elements.
  • the above-mentioned technology is applied to a specific product, and the product has a small volume and good light-emitting effect, and can simultaneously emit light simultaneously in all directions by using one LED light source, but in a specific implementation, since it is only faced by the first light-emitting surface and the second light-emitting surface LED components for heat dissipation, although the idea is better, but in the specific implementation of the heat dissipation effect is not ideal, the heat dissipation is slow and cause the LED components to overheat, in more serious cases will burn the entire LED light source, and this is The main drawbacks of traditional technology.
  • the invention provides an LED light source heat-dissipating structure and a light-emitting and heat-dissipating method thereof, which have good heat dissipation effect, excellent luminescence performance, and can greatly reduce the working temperature of the light source, and this is the main object of the invention.
  • the technical solution adopted by the present invention is: an LED light source emitting heat dissipation structure, the LED light source is an LED double-sided light emitting chip, and the LED double-sided light emitting chip is disposed on a transparent heat dissipation plate, and the transparent heat dissipation plate comprises a transparent heat dissipation substrate and a heat-dissipating conductive film layer, wherein the heat-dissipating conductive film layer is adhered to an outer surface of the transparent heat-dissipating substrate, the transparent heat-dissipating substrate is made of a light-transmitting heat-dissipating material, and the heat-dissipating conductive film layer is made of a heat-dissipating heat-dissipating conductive material
  • the conductive film layer includes a full portion and a window portion.
  • the full portion and the window portion are spaced apart.
  • the LED double-sided light emitting chip is horizontally disposed at the position of the window portion. At this moment, the outer side of the LED double-sided light emitting chip is generated. The light is directly emitted into the external environment, and the light generated by the inner side of the LED double-sided light-emitting chip passes through the window portion and transmits the transparent heat-dissipating substrate to the external environment.
  • the transparent heat-dissipating substrate is glass, and the heat-dissipating conductive film layer is a silver-plated layer.
  • the heat-dissipating conductive film layer is a silver-plated layer
  • the silver-plated layer has a function of light reflection while radiating heat and electricity.
  • a plurality of heat-conducting support wires are disposed on the outer surface of the transparent heat-dissipating substrate and in the window portion, the heat-conducting support wires are the same as the heat-dissipating conductive film layer, each of the strips Both ends of the heat-conducting support wire are connected to the full-filled portion, and the heat-conducting support wire is disposed on a bottom surface of the LED double-sided light-emitting chip, and heat generated by the operation of the LED double-sided light-emitting chip is conducted through the heat-conductive support wire.
  • the transparent heat dissipating substrate and the heat dissipating conductive film layer are simultaneously radiated, and the light emitted by the bottom surface of the LED double-sided light emitting chip passes through a gap between the heat conducting support lines and transmits through the transparent heat dissipating substrate. Go to the external environment.
  • the electrodes on both sides of the bottom surface of the LED double-sided light-emitting chip are electrically connected to the top surface of the full-side portion on both sides of the window portion, and the LED double-sided light-emitting chip working place
  • the generated heat is directly transmitted to the transparent heat dissipating substrate, and the heat is radiated simultaneously.
  • the light emitted from the bottom surface of the LED double-sided light emitting chip passes through the window portion and transmits the transparent heat dissipating substrate to the external environment.
  • the transparent heat dissipation plate is mounted on the heat dissipation frame, and the heat dissipation heat dissipation plate further heats the transparent heat dissipation plate to reduce the operating temperature of the LED double-sided light-emitting chip.
  • the LED light source is a light source of an LED lamp
  • the LED lamp comprises a lamp holder and a lamp cover, wherein the lamp cover is connected to the lamp holder, the transparent heat dissipation plate is annular, and the heat dissipation frame comprises a heat dissipation fixing tube and a heat dissipation plug pipe.
  • the heat dissipating tube is inserted into the lamp holder, and the heat dissipating tube is inserted at the other end of the heat dissipating tube.
  • the transparent heat dissipating plate is interposed between the heat dissipating tube and the heat dissipating tube.
  • the transparent heat sink further dissipates heat through the heat dissipation frame.
  • the heat-dissipating fixed tube is provided with a socket, and the socket extends horizontally to form a first clamping ring
  • the heat-dissipating plug tube includes a cannula and a second horizontal clamping plate, wherein the insertion tube is inserted into the socket of the heat-dissipating fixed tube
  • the transparent heat dissipation plate is sandwiched between the first clamping ring and the second horizontal clamping plate, and the LED double-sided light emitting chip ring is disposed around the transparent heat dissipation plate.
  • the LED light source is a light source of an LED lamp
  • the LED lamp includes a lamp holder and a lamp cover, wherein the lamp cover is connected to the lamp holder, the transparent heat dissipation plate is in a plate shape, and the heat dissipation frame is sandwiched on both sides of the transparent heat dissipation plate A plurality of the heat dissipation racks are simultaneously inserted on the lamp holder.
  • the LED light source is a light source of an LED lamp
  • the LED lamp includes a lamp holder and a lamp cover, wherein the lamp cover is connected to the lamp holder, the transparent heat dissipation plate is annular, and the heat dissipation frame is connected in the lamp holder, the LED
  • the double-sided light-emitting chip ring is disposed around the transparent heat-dissipating plate, and the LED double-sided light-emitting chip is covered with a silica gel layer, and the lamp cover is filled with a heat-conducting gas, and the heat-dissipating efficiency of the LED double-sided light-emitting chip can be improved by the heat-conducting gas .
  • the full-charged portion includes a plurality of conductive heat-dissipating portions, and the plurality of conductive heat-dissipating portions are disposed independently of each other, and the plurality of conductive heat-dissipating portions are simultaneously attached to an outer surface of the transparent heat-dissipating substrate, and the illuminating body is disposed at any adjacent two of the conductive heat-dissipating portions Between the portions, the adjacent electrical connecting lines of the illuminants are electrically connected to the conductive heat dissipating portion, so that a plurality of the illuminants are connected in series and connected.
  • the heat-dissipating conductive film layer is further connected to the external heat-dissipating portion, and the heat-dissipating heat-dissipating portion further assists heat dissipation of the heat-dissipating conductive film layer.
  • An LED light source emitting and dissipating method wherein a plurality of the LED double-sided light emitting chips are disposed on a transparent heat dissipating plate, wherein the transparent heat dissipating plate comprises a transparent heat dissipating substrate and a heat dissipating conductive film layer, wherein the heat dissipating conductive film layer is adhered to the transparent heat dissipating substrate
  • the transparent heat dissipation substrate is made of a light-transmissive heat-dissipating material
  • the heat-dissipating conductive film layer is made of a heat-dissipating heat-dissipating conductive material
  • the heat-dissipating conductive film layer is divided into a full-filled portion and a window portion, the full-fill portion and The window is partially spaced, and the LED double-sided light emitting chip is horizontally disposed at the position of the window portion.
  • the light generated by the outer side of the LED double-sided light emitting chip Directly emitted into the external environment, the light generated by the inner side of the LED double-sided light-emitting chip passes through the window portion and transmits through the transparent heat-dissipating substrate to the external environment.
  • the present invention has the beneficial effects that the present invention provides a plurality of the LED double-sided light-emitting chips on a transparent heat-dissipating plate, the heat-dissipating conductive film layer including a full portion and a window portion, and the full-fill portion and the window portion are spaced apart.
  • the LED double-sided light emitting chip is horizontally disposed at the position of the window portion. At this moment, the light generated by the outer side of the LED double-sided light emitting chip is directly emitted into the external environment, and the light generated by the inner side of the LED double-sided light emitting chip passes through.
  • the window portion is transmitted through the transparent heat dissipation substrate to the external environment.
  • the purpose of setting the window portion is also to fully utilize the characteristics of the double-sided illumination of the LED double-sided light-emitting chip, so that the light energy is lost as little as possible.
  • the purpose of providing the heat-dissipating conductive film layer is mainly to utilize the material properties to maximize the heat dissipation of the LED double-sided light-emitting chip, thereby minimizing the operating temperature thereof.
  • FIG. 1 is a schematic structural view of a positive-loading chip of the present invention.
  • FIG. 2 is a schematic structural view of a flip chip according to the present invention.
  • Figure 3 is a schematic view showing the structure of the present invention applied to a luminaire.
  • FIG. 4 is a front view of the light-emitting and heat-dissipating structure of the LED light source of the lamp of FIG.
  • 5, 7, 8, 9, and 10 are schematic structural views of the present invention applied to a luminaire.
  • FIG. 6 is a top view of the LED light source emitting heat dissipation structure of the lamp of FIG. 5.
  • FIG. 11 is a schematic structural view of the LED double-sided light emitting chip of FIG. 10 disposed on a transparent heat dissipation plate.
  • FIG. 12 is a schematic structural view showing the connection of the external heat dissipating portion of the heat dissipating conductive film layer of the present invention.
  • an LED light source illuminating heat-dissipating structure the LED light source is an LED double-sided light-emitting chip, and the applicant of the present invention discloses an LED light source and the PCT International Application No. PCT/CN2011/000756.
  • a technique for manufacturing the same which describes an LED element capable of emitting light through both sides, thereby preventing heat from being concentrated on a bonding surface and a substrate of a conventional LED light source, and directly connecting the LED elements and the two fluorescent elements in a sandwich manner Thereby forming one or more passage openings to thereby achieve heat transfer through the passage openings for guiding the LED elements.
  • the structure mainly includes one or more LED light source groups, wherein each of the LED light source groups includes: at least one LED element, wherein the LED element has a first light emitting surface and a second light emitting surface on the reverse side, wherein the The LED element is adapted to provide illumination at an angle greater than 180° by electroluminescence on each of the first illuminating surface and the second illuminating surface; two fluorescent elements, the two fluorescent elements being respectively located at the first of the LED elements a light emitting surface and the second light emitting surface portion to maintain the LED elements in position such that illumination generated by the LEDs respectively passes from the light emitting surface through the two fluorescent elements; and an electronic component, the electrons An element is coupled to the LED element to electrically connect the LED element to a power source.
  • the LED element is sandwiched by the two fluorescent elements to maintain the LED element in position such that the first light emitting surface and the second light emitting surface are directly pressed against the fluorescent element to obtain Supporting and directing heat transfer away from the LED elements, and the LED elements are held within an LED receiving cavity of the gap between the fluorescent elements.
  • PCT/CN2011/000756 has a small volume and good illumination effect on the product of the invention, and can simultaneously emit light simultaneously in all directions by using one LED light source, but in the specific implementation, since it only passes through the first light emitting surface and the first
  • the second light-emitting device faces the LED element for heat dissipation, but the idea is good, but in the specific implementation, the heat dissipation effect is not ideal, and the heat dissipation is slow, which causes the LED element to overheat.
  • the inventor of the present invention combines the technical features of PCT/CN2011/000756 to improve its heat dissipation mode and apply it to the backlight product of the present invention, so that the backlight product of the present invention has a luminous effect and an operating temperature. All have reached the ideal state, as described below.
  • the LED double-sided light emitting chip has an upper light emitting surface and a lower light emitting surface.
  • the LED double-sided light-emitting chip has six light-emitting surfaces, and includes a plurality of layers which are sequentially overlapped and arranged.
  • the LED double-sided light-emitting chips sequentially overlap and arrange a rigid and transparent base layer, a light-emitting layer and a current dispersion.
  • the flip-chip structure of the LED double-sided light-emitting chip has a simple structure and can define the upper light-emitting surface and the lower light-emitting surface.
  • the specific structure of the LED double-sided light-emitting chip is already in the previous case PCT/CN2011/000756. The disclosure here is no longer exhaustive.
  • the transparent heat-dissipating plate 100 includes a transparent heat-dissipating substrate 110 and a heat-dissipating conductive film layer 120.
  • the heat-dissipating conductive film layer 120 is attached to the transparent heat-dissipating substrate 110. On the surface.
  • the transparent heat dissipation substrate 110 is made of a light-transmitting heat dissipation material such as glass, sapphire or the like.
  • the heat-dissipating conductive film layer 120 is made of a heat-conductive heat-dissipating conductive material such as silver paste.
  • the outer surface of the transparent heat-dissipating substrate 110 needs to be first etched and roughened, and then the heat-dissipating conductive film layer 120 is attached.
  • the method has strong adhesion and good product quality.
  • the heat-dissipating conductive film layer 120 includes a full portion 121 and a window portion 122, and the full portion 121 and the window portion 122 are spaced apart.
  • the LED double-sided light emitting chip is horizontally disposed at the position of the window portion 122. At this moment, the light generated by the outer side of the LED double-sided light emitting chip is directly emitted into the external environment, and the light generated by the inner side of the LED double-sided light emitting chip After passing through the window portion 122 and passing through the transparent heat dissipation substrate 110, it is transmitted to the external environment.
  • the purpose of setting the window portion 122 is also to fully utilize the characteristics of the double-sided illumination of the LED double-sided light-emitting chip, so that the light energy is lost as little as possible.
  • the purpose of providing the heat-dissipating conductive film layer 120 is mainly to utilize the material properties to maximize the heat dissipation of the LED double-sided light-emitting chip, thereby minimizing the operating temperature thereof.
  • the thickness is preferably such that the glass layer is 0.6 mm thick and the silver paste layer is 10 ⁇ m thick.
  • the heat-dissipating conductive film layer 120 is a silver paste
  • the silver paste layer also has a function of light reflection while radiating heat, thereby reflecting light to the direction of the diffusion plate 10 as much as possible.
  • the LED double-sided light-emitting chip can be horizontally disposed at the position of the window portion 122 in both a front and a flip-chip manner.
  • a plurality of heat-conducting support lines 123 are disposed on the outer surface of the transparent heat-dissipating substrate 110 and in the window portion 122.
  • the material of the heat dissipation conductive film layer 120 is the same.
  • Both ends of each of the heat conduction support lines 123 are connected to the full attachment portion 121.
  • the heat-conducting support line 123 is mounted on the bottom surface of the LED double-sided light-emitting chip, and the heat generated by the operation of the LED double-sided light-emitting chip is conducted to the transparent heat-dissipating substrate 110 and the heat-dissipating conductive film layer 120 through the heat-conducting support line 123. And heat dissipation simultaneously.
  • the light emitted from the bottom surface of the LED double-sided light-emitting chip passes through the gap between the plurality of heat-conductive support lines 123 and transmits through the transparent heat-dissipating substrate 110 to be transmitted to the external environment.
  • the width of the thermally conductive support line 123 is preferably five microns.
  • the electrodes on both sides of the bottom surface of the LED double-sided light emitting chip are electrically connected to the top surface of the full portion 121 on both sides of the window portion 122.
  • the heat generated by the operation of the LED double-sided light-emitting chip is directly transmitted to the transparent heat-dissipating substrate 110, and the heat is simultaneously radiated.
  • Light emitted from the bottom surface of the LED double-sided light-emitting chip passes through the window portion 122 and transmits through the transparent heat-dissipating substrate 110 to be transmitted to the external environment.
  • the technology of the present invention can be applied to a wide range of fields, and the LED light source body produced by the technology of the present invention can replace the light source of all LED lamps, and has the advantages of good luminous effect, small volume and low working temperature. ,
  • the transparent heat dissipation plate 100 may be designed in a circular shape, a strip shape or other shapes.
  • the transparent heat dissipation plate 100 is mounted on the heat dissipation frame 200, and further through the heat dissipation frame 200.
  • the transparent heat dissipation plate 100 performs heat conduction to reduce the operating temperature of the LED double-sided light-emitting chip.
  • the heat dissipation frame 200 may be made of metal copper or other heat-dissipating metal.
  • the LED light source is a light source of an LED lamp.
  • the LED lamp includes a lamp holder and a lamp cover.
  • the lamp cover is connected to the lamp holder.
  • the transparent heat dissipation plate 100 is annular.
  • the heat dissipation frame 200 includes a heat dissipation fixing tube 210 and heat dissipation.
  • the insertion tube 220 wherein one end of the heat dissipation fixing tube 210 is inserted into the socket, the heat dissipation socket 220 is inserted at the other end of the heat dissipation fixing tube 210, and the transparent heat dissipation plate 100 is sandwiched between the heat dissipation fixing tube
  • the transparent heat dissipation plate 100 is further dissipated by the heat dissipation frame 200 between the 210 and the heat dissipation socket 220.
  • the heat-dissipating fixed tube 210 is provided with a socket at one end thereof, and the socket extends horizontally to form a first clamping ring 211.
  • the heat-dissipating plug tube 220 includes a cannula 221 and a second horizontal clamping plate 222, wherein the cannula The 221 is inserted in the socket of the heat dissipation fixing tube 210.
  • the transparent heat dissipation plate 100 is interposed between the first clamping ring 211 and the second horizontal clamping plate 222.
  • the LED double-sided light emitting chip ring is disposed on the transparent The heat sink 100 is surrounded.
  • the LED light source is a light source of an LED lamp.
  • the LED lamp includes a lamp holder and a lamp cover.
  • the lamp cover is connected to the lamp holder.
  • the transparent heat dissipation plate 100 has a plate shape, and the heat dissipation frame 200 is sandwiched between the transparent heat dissipation plate. On both sides of the 100, a plurality of the heat dissipation frames 200 are simultaneously inserted on the lamp holder.
  • the LED light source is a light source of an LED lamp.
  • the LED lamp includes a lamp holder and a lamp cover.
  • the lamp cover is connected to the lamp holder.
  • the transparent heat dissipation plate 100 is annular, and the heat dissipation frame 200 is connected.
  • the LED double-sided light emitting chip ring is disposed around the transparent heat dissipation plate 100.
  • the LED double-sided light-emitting chip is covered with a silica gel layer, and the lamp cover is filled with a heat-conducting gas, and the heat-dissipating efficiency of the LED double-sided light-emitting chip can be improved by the heat-conducting gas.
  • the traditional LED lamp is close to the white candle, the heat cannot be dissipated immediately because the chip is wrapped with silica gel.
  • the original light performance of the original chip can reach 180 lm or more due to the high working temperature, which can only reach 120 lm.
  • the invention overcomes the shortcomings of the conventional technology, and utilizes the above structure to dissipate heat by directly contacting the heat-dissipating silicone coating surface with the heat-conducting gas.
  • the chip of the invention is connected by a silver layer, and the heat generated by the chip PN junction can be first. Time is exported by the silver layer.
  • the heat-dissipating conductive film layer 120 is also coated with a high heat radiation material to enhance the heat dissipation effect.
  • the full-side portion 121 includes a plurality of conductive heat-dissipating portions 124 , and the plurality of conductive heat-dissipating portions 124 are disposed independently of each other, and the plurality of conductive heat-dissipating portions 124 are simultaneously attached to the transparent heat-dissipating substrate 110 .
  • the outer surface On the outer surface.
  • the illuminant 31 is disposed between any two adjacent conductive heat dissipating portions 124.
  • the electrical connection lines of the adjacent illuminants 31 are electrically connected to the conductive heat dissipating portion 124, respectively, so that a plurality of the illuminants 31 are connected in series. Connection relationship. That is to say, when a plurality of the conductive heat dissipating portions 124 are used for heat dissipation and at the same time they are connected to the conductive connection, the structure can be used for the modules of various lamps without additional heat sinks.
  • the heat-dissipating conductive film layer 120 is further connected to the external heat-dissipating portion 125, and the heat-dissipating heat-dissipating portion 125 further assists the heat-dissipating conductive film layer to dissipate heat.
  • a high-thermal bonding or soldering method may be employed, and a soldering method is preferred.
  • the LED lamp described above may also be a lamp of various forms as shown in FIGS. 5 to 9.
  • a method for illuminating and dissipating heat of an LED light source a plurality of the LED double-sided light-emitting chips are disposed on a transparent heat-dissipating plate 100, wherein the transparent heat-dissipating plate 100 includes a transparent heat-dissipating substrate 110 and a heat-dissipating conductive film layer 120, wherein The heat dissipation conductive film layer 120 is attached to the outer surface of the transparent heat dissipation substrate 110.
  • the transparent heat dissipation substrate 110 is made of a light-transmitting heat dissipation material such as glass, sapphire or the like.
  • the heat-dissipating conductive film layer 120 is made of a heat-conductive heat-dissipating conductive material such as silver paste.
  • the outer surface of the transparent heat-dissipating substrate 110 needs to be first etched and roughened, and then the heat-dissipating conductive film layer 120 is attached.
  • the method has strong adhesion and good product quality.
  • the heat dissipation conductive film layer 120 is divided into a full portion 121 and a window portion 122, and the full portion 121 and the window portion 122 are spaced apart.
  • the LED double-sided light emitting chip is horizontally disposed at the position of the window portion 122. At this moment, the light generated by the outer side of the LED double-sided light emitting chip is directly emitted into the external environment, and the inner side of the LED double-sided light emitting chip is generated. Light passes through the window portion 122 and passes through the transparent heat dissipation substrate 110 and is transmitted to the external environment.
  • the purpose of setting the window portion 122 is also to fully utilize the characteristics of the double-sided illumination of the LED double-sided light-emitting chip, so that the light energy is lost as little as possible.
  • the purpose of providing the heat-dissipating conductive film layer 120 is mainly to utilize the material properties to maximize the heat dissipation of the LED double-sided light-emitting chip, thereby minimizing the operating temperature thereof.
  • the thickness is preferably such that the glass layer is 0.6 mm thick and the silver paste layer is 10 ⁇ m thick.
  • the heat-dissipating conductive film layer 120 is a silver paste
  • the silver paste layer also has a function of light reflection while radiating heat, thereby reflecting light to the direction of the diffusion plate 10 as much as possible.
  • the LED double-sided light-emitting chip can be horizontally disposed at the position of the window portion 122 in both a front and a flip-chip manner.
  • a plurality of heat-conducting support lines 123 are disposed on the outer surface of the transparent heat-dissipating substrate 110 and in the window portion 122, and the heat-conductive support lines 123 and the heat-dissipating conductive film layer 120 are disposed.
  • the materials are the same. Both ends of each of the heat conduction support lines 123 are connected to the full attachment portion 121.
  • the heat-conducting support line 123 is mounted on the bottom surface of the LED double-sided light-emitting chip, and the heat generated by the operation of the LED double-sided light-emitting chip is conducted to the transparent heat-dissipating substrate 110 and the heat-dissipating conductive film layer 120 through the heat-conducting support line 123. And heat dissipation simultaneously.
  • the light emitted from the bottom surface of the LED double-sided light-emitting chip passes through the gap between the plurality of heat-conductive support lines 123 and transmits through the transparent heat-dissipating substrate 110 to be transmitted to the external environment.
  • the width of the thermally conductive support line 123 is preferably five microns.
  • the electrodes on both sides of the bottom surface of the LED double-sided light emitting chip are electrically connected to the top surface of the full portion 121 on both sides of the window portion 122.
  • the heat generated by the operation of the LED double-sided light-emitting chip is directly transmitted to the transparent heat-dissipating substrate 110, and the heat is simultaneously radiated.
  • Light emitted from the bottom surface of the LED double-sided light-emitting chip passes through the window portion 122 and transmits through the transparent heat-dissipating substrate 110 to be transmitted to the external environment.
  • the transparent heat dissipation plate 100 may be designed in a circular shape, a strip shape or other shapes.
  • the transparent heat dissipation plate 100 is mounted on the heat dissipation frame 200, and further through the heat dissipation frame 200.
  • the transparent heat dissipation plate 100 performs heat conduction to reduce the operating temperature of the LED double-sided light-emitting chip.
  • the heat dissipation frame 200 may be made of metal copper or other heat-dissipating metal.

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Abstract

一种LED光源发光散热结构及其发光散热方法， LED光源为LED双面发光芯片（A），若干LED双面发光芯片（A）设置在透明散热板（100）上，透明散热板（100）包括透明散热基板（110）以及散热导电薄膜层（120），其中，散热导电薄膜层（120）附着在透明散热基板（110）的外表面上，散热导电薄膜层（120）包括满附部分（121）以及窗口部分（122），满附部分（121）以及窗口部分（122）间隔设置，LED双面发光芯片（A）水平设置在窗口部分（122）位置处，LED双面发光芯片（A）外侧面所产生的光线直接发射到外部环境中，而LED双面发光芯片内侧面所产生的光线通过窗口部分（122）并透过透明散热基板（110）后透射到外部环境中。

Description

一种LED光源发光散热结构及其发光散热方法 技术领域
本发明涉及一种发光散热结构及其发光散热方法，特别是指一种针对LED光源的发光散热结构及其发光散热方法。
背景技术
众所周知，为了有效运转，传统的LED光源需要有效的散热装置来散热，PCT国际申请号为PCT/CN2011/000756中公开了一种LED光源及其制造方法的技术，其记载了一种LED元件，其能通过两侧面发光，从而避免热量聚集在结传统LED光源的结合面和基片上，其LED元件与两荧光元件以三明治的方式直接连接，从而形成一个或多个通道口以藉此达到通过该通道口导引LED元件的热传递。
其结构主要包括一个或多个LED光源组，其中每所述LED光源组包括：至少一LED元件，其中所述LED元件具有一第一发光面和在反面的一第二发光面，其中所述LED元件适于在每所述第一发光面和所述第二发光面通过电致发光提供大于180°角度的照明；两荧光元件，所述两荧光元件分别位于所述LED元件的所述第一发光面和所述第二发光面上部以保持所述LED元件就位，从而使所述LED产生的照明分别从所述发光面出发经过所述两荧光元件；和一电子元件，所述电子元件与所述LED元件藕接以将所述LED元件电连接于一电源。
所述LED元件被所述两荧光元件以三明治方式夹在中间从而保持所述LED元件就位，以使所述第一发光面和所述第二发光面直接压向所述荧光元件上以得到支撑并导引热传递离开所述LED元件，并且所述LED元件被保持在所述荧光元件之间空隙的一LED容纳腔内。
上述的技术应用到具体产品上其产品具有体积小发光效果好，能够利用一个LED光源同时向各个方向同时发光，但是在具体实施的时候，由于其只是通过第一发光面和第二发光面对LED元件进行散热，其思路虽然较好，但是在具体实施的时候存在散热效果不理想，热量散发较慢而引发LED元件过热的情况，更严重的情况下会烧毁整个LED光源，而此是为传统技术的主要缺点。
发明内容
本发明提供一种LED光源发光散热结构及其发光散热方法，其结构散热效果好，发光性能优异，并且能够大幅度降低光源工作温度，而此为本发明的主要目的。
本发明所采取的技术方案是：一种LED光源发光散热结构，该LED光源为LED双面发光芯片，若干该LED双面发光芯片设置在透明散热板上，该透明散热板包括透明散热基板以及散热导电薄膜层，其中，该散热导电薄膜层附着在该透明散热基板的外表面上，该透明散热基板由透光散热材料制成，该散热导电薄膜层由导热散热导电材料制成，该散热导电薄膜层包括满附部分以及窗口部分，该满附部分以及该窗口部分间隔设置，该LED双面发光芯片水平设置在该窗口部分位置处，此刻，该LED双面发光芯片外侧面所产生的光线直接发射到外部环境中，而该LED双面发光芯片内侧面所产生的光线通过该窗口部分并透过该透明散热基板后透射到外部环境中。
该透明散热基板为玻璃，该散热导电薄膜层为镀银层，该散热导电薄膜层为镀银层的时候，镀银层在散热导电的同时也具备光反射的作用。
在正装该LED双面发光芯片的时候，在该透明散热基板的外表面上并且于该窗口部分中设置有若干条导热支撑线，该导热支撑线与该散热导电薄膜层的材料相同，每一条该导热支撑线的两端部都与该满附部分相连接，该导热支撑线架设在该LED双面发光芯片的底面上，该LED双面发光芯片工作所产生的热量通过该导热支撑线传导至该透明散热基板以及该散热导电薄膜层上，并同步进行散热，该LED双面发光芯片的底面所发出的光线通过若干条该导热支撑线之间的间隙并透过该透明散热基板后透射到外部环境中。
在倒装该LED双面发光芯片的时候，该LED双面发光芯片的底面两侧的电极搭设电连接在该窗口部分两侧的该满附部分顶面上，该LED双面发光芯片工作所产生的热量直接传导至该透明散热基板上，并同步进行散热，该LED双面发光芯片的底面所发出的光线通过该窗口部分并透过该透明散热基板后透射到外部环境中。
该透明散热板被架设在散热架上，通过该散热架进一步对该透明散热板进行导热散热以降低该LED双面发光芯片的工作温度。
该LED光源为一LED灯具的光源，该LED灯具包括灯座以及灯罩，其中，该灯罩连接在该灯座上，该透明散热板为环状，该散热架包括散热固定管以及散热插接管，其中，该散热固定管一端插设在该灯座中，该散热插接管插设在该散热固定管的另外一端，该透明散热板被夹设在该散热固定管与该散热插接管之间，通过该散热架对该透明散热板进一步散热。
该散热固定管一端设置有插口，该插口水平向四周延伸形成第一夹环，该散热插接管包括插管以及第二水平夹板，其中，该插管插设在该散热固定管的该插口中，该透明散热板被夹设在该第一夹环与该第二水平夹板之间，该LED双面发光芯片环设在该透明散热板四周。
该LED光源为一LED灯具的光源，该LED灯具包括灯座以及灯罩，其中，该灯罩连接在该灯座上，该透明散热板为板状，该散热架夹设在该透明散热板两侧，若干该散热架同时插设在该灯座上。
该LED光源为一LED灯具的光源，该LED灯具包括灯座以及灯罩，其中，该灯罩连接在该灯座上，该透明散热板为环状，该散热架连接在该灯座中，该LED双面发光芯片环设在该透明散热板四周，该LED双面发光芯片上包裹有硅胶层，在该灯罩中灌充有导热气体，通过该导热气体能够提升该LED双面发光芯片的散热效率。
该满附部分包括若干导电散热部分，若干该导电散热部分彼此独立设置，若干该导电散热部分同时附着在该透明散热基板的外表面上，该发光体设置在任意相邻的两个该导电散热部分之间，相邻的该发光体的电连接线分别与该导电散热部分电连接，从而使若干该发光体形成串联并连接关系。
该散热导电薄膜层还与外接散热部分相连接，通过该外接散热部分进一步辅助该散热导电薄膜层散热。
一种LED光源发光散热方法，将若干该LED双面发光芯片设置在透明散热板上，该透明散热板包括透明散热基板以及散热导电薄膜层，其中，该散热导电薄膜层附着在该透明散热基板的外表面上，该透明散热基板由透光散热材料制成，该散热导电薄膜层由导热散热导电材料制成，将该散热导电薄膜层区分为满附部分以及窗口部分，该满附部分以及该窗口部分间隔设置，将该LED双面发光芯片水平设置在该窗口部分位置处，此刻，该LED双面发光芯片外侧面所产生的光线 直接发射到外部环境中，而该LED双面发光芯片内侧面所产生的光线通过该窗口部分并透过该透明散热基板后透射到外部环境中。
本发明的有益效果为：本发明将若干该LED双面发光芯片设置在透明散热板上，该散热导电薄膜层包括满附部分以及窗口部分，该满附部分以及该窗口部分间隔设置。该LED双面发光芯片水平设置在该窗口部分位置处，此刻，该LED双面发光芯片外侧面所产生的光线直接发射到外部环境中，而该LED双面发光芯片内侧面所产生的光线通过该窗口部分并透过该透明散热基板后透射到外部环境中。设置该窗口部分的目的也正是为了充分利用该LED双面发光芯片双面发光的特点，使光能尽少损失。另外，设置该散热导电薄膜层的目的主要是为了利用其材料特性最大可能的为该LED双面发光芯片进行散热，最大程度的降低其工作温度。
附图说明
图1为本发明正装芯片的结构示意图。
图2为本发明倒装芯片的结构示意图。
图3为本发明应用到灯具中的结构示意图。
图4为图3灯具LED光源发光散热结构的主视图。
图5、7、8、9、10为本发明应用到灯具中的结构示意图。
图6为图5灯具LED光源发光散热结构的俯视图。
图11为图10灯具LED双面发光芯片设置在透明散热板上的结构示意图。
图12为本发明散热导电薄膜层外接散热部分相连接的结构示意图。
具体实施方式
如图1至9所示，一种LED光源发光散热结构，该LED光源为LED双面发光芯片，本发明的申请人在PCT国际申请号为PCT/CN2011/000756中公开了一种LED光源及其制造方法的技术，其记载了一种LED元件，其能通过两侧面发光，从而避免热量聚集在结传统LED光源的结合面和基片上，其LED元件与两荧光元件以三明治的方式直接连接，从而形成一个或多个通道口以藉此达到通过该通道口导引LED元件的热传递。其结构主要包括一个或多个LED光源组，其中每所述LED光源组包括：至少一LED元件，其中所述LED元件具有一第一发光面和在反面的一第二发光面，其中所述LED元件适于在每所述第一发光面和所述第二发光面通过电致发光提供大于180°角度的照明；两荧光元件，所述两荧光元件分别位于所述LED元件的所述第一发光面和所述第二发光面上部以保持所述LED元件就位，从而使所述LED产生的照明分别从所述发光面出发经过所述两荧光元件；和一电子元件，所述电子元件与所述LED元件藕接以将所述LED元件电连接于一电源。所述LED元件被所述两荧光元件以三明治方式夹在中间从而保持所述LED元件就位，以使所述第一发光面和所述第二发光面直接压向所述荧光元件上以得到支撑并导引热传递离开所述LED元件，并且所述LED元件被保持在所述荧光元件之间空隙的一LED容纳腔内。
PCT/CN2011/000756的技术应用到本发明的产品上具有体积小发光效果好，能够利用一个LED光源同时向各个方向同时发光，但是在具体实施的时候，由于其只是通过第一发光面和第二发光面对LED元件进行散热，其思路虽然较好，但是在具体实施的时候存在散热效果不理想，热量散发较慢而引发LED元件过热的情况。
本发明的发明人结合PCT/CN2011/000756的技术特点同时对其散热方式进行改进，并应用到本发明的背光源产品中，从而使本发明的背光源产品无论在发光效果还是在工作温度方面都达到了理想的状态，具体描述如下。
该LED双面发光芯片具有上发光面以及下发光面。该LED双面发光芯片具有六个发光面，并且包括复数层有序地重叠和排列，该LED双面发光芯片依次序地重叠和排列一刚性并且透明的基底层，一发光层和一电流分散层，该LED双面发光芯片的倒装结构，其结构简单，并能够定义出该上发光面以及该下发光面，该LED双面发光芯片的具体结构在前案PCT/CN2011/000756中已经公开这里不再累述。
若干该LED双面发光芯片A设置在透明散热板100上，该透明散热板100包括透明散热基板110以及散热导电薄膜层120，其中，该散热导电薄膜层120附着在该透明散热基板110的外表面上。
该透明散热基板110由透光散热材料制成，比如，玻璃、蓝宝石等。
该散热导电薄膜层120由导热散热导电材料制成，比如，银浆。
在具体将该散热导电薄膜层120附着在该透明散热基板110的外表面上的时候，需要首先对该透明散热基板110的外表面进行腐蚀粗糙，而后将该散热导电薄膜层120附着上，这种方式附着力强，产品质量佳。
该散热导电薄膜层120包括满附部分121以及窗口部分122，该满附部分121以及该窗口部分122间隔设置。
该LED双面发光芯片水平设置在该窗口部分122位置处，此刻，该LED双面发光芯片外侧面所产生的光线直接发射到外部环境中，而该LED双面发光芯片内侧面所产生的光线通过该窗口部分122并透过该透明散热基板110后透射到外部环境中。
设置该窗口部分122的目的也正是为了充分利用该LED双面发光芯片双面发光的特点，使光能尽少损失。
另外，设置该散热导电薄膜层120的目的主要是为了利用其材料特性最大可能的为该LED双面发光芯片进行散热，最大程度的降低其工作温度。
当该透明散热基板110为玻璃，该散热导电薄膜层120为银浆的时候优选厚度为，玻璃层零点六毫米厚，银浆层十微米厚。
另外，该散热导电薄膜层120为银浆的时候，银浆层在散热导电的同时也具备光反射的作用，从而尽最大可能将光线反射到该扩散板10方向。
该LED双面发光芯片能够以正装以及倒装两种方式水平设置在该窗口部分122位置处。
如图1所示，在正装该LED双面发光芯片的时候，在该透明散热基板110的外表面上并且于该窗口部分122中设置有若干条导热支撑线123，该导热支撑线123与该散热导电薄膜层120的材料相同。
每一条该导热支撑线123的两端部都与该满附部分121相连接。
该导热支撑线123架设在该LED双面发光芯片的底面上，该LED双面发光芯片工作所产生的热量通过该导热支撑线123传导至该透明散热基板110以及该散热导电薄膜层120上，并同步进行散热。
该LED双面发光芯片的底面所发出的光线通过若干条该导热支撑线123之间的间隙并透过该透明散热基板110后透射到外部环境中。
该导热支撑线123的宽度优选五微米。
如图2所示，在倒装该LED双面发光芯片的时候，该LED双面发光芯片的底面两侧的电极搭设电连接在该窗口部分122两侧的该满附部分121顶面上。
该LED双面发光芯片工作所产生的热量直接传导至该透明散热基板110上，并同步进行散热。
该LED双面发光芯片的底面所发出的光线通过该窗口部分122并透过该透明散热基板110后透射到外部环境中。
最后需要强调的是，本发明的技术可以应用在相当广泛的领域，利用本发明的技术生产的LED光源体可以替换所有LED灯具的光源，同时具有发光效果好、体积小、工作温度低的特点，
在具体实施的时候，该透明散热板100整体可以设计成圆形、条形或者其他形状，在具体实施的时候，该透明散热板100被架设在散热架200上，通过该散热架200进一步对该透明散热板100进行导热散热以降低该LED双面发光芯片的工作温度，该散热架200可以由金属铜或者其他散热金属制成。
该LED光源为一LED灯具的光源，该LED灯具包括灯座以及灯罩，其中，该灯罩连接在该灯座上，该透明散热板100为环状，该散热架200包括散热固定管210以及散热插接管220，其中，该散热固定管210一端插设在该灯座中，该散热插接管220插设在该散热固定管210的另外一端，该透明散热板100被夹设在该散热固定管210与该散热插接管220之间，通过该散热架200对该透明散热板100进一步散热。
在具体实施的时候，该散热固定管210一端设置有插口，该插口水平向四周延伸形成第一夹环211，该散热插接管220包括插管221以及第二水平夹板222，其中，该插管221插设在该散热固定管210的该插口中，该透明散热板100被夹设在该第一夹环211与该第二水平夹板222之间，该LED双面发光芯片环设在该透明散热板100四周。
该LED光源为一LED灯具的光源，该LED灯具包括灯座以及灯罩，其中，该灯罩连接在该灯座上，该透明散热板100为板状，该散热架200夹设在该透明散热板100两侧，若干该散热架200同时插设在该灯座上。
如图10所示，该LED光源为一LED灯具的光源，该LED灯具包括灯座以及灯罩，其中，该灯罩连接在该灯座上，该透明散热板100为环状，该散热架200连接在该灯座中，该LED双面发光芯片环设在该透明散热板100四周。
该LED双面发光芯片上包裹有硅胶层，在该灯罩中灌充有导热气体，通过该导热气体能够提升该LED双面发光芯片的散热效率。
传统的这种LED灯具虽然接近白烛灯但是由于芯片被硅胶包裹着所以热量不能既即时散发，原本芯片背面可以出光初始光效能达到180lm以上的由于工作温度高只能达到120lm左右。
本发明克服传统技术的缺点利用上述的结构通过一个能够将热量导出硅胶包裹面直接和导热气体接触的方式进行散热，另外本发明的芯片是通过银层连接，芯片PN结产生的热量能够第一时间被银层导出来。
在具体实施的时，该散热导电薄膜层120上还涂覆有高热辐射材料以提升散热效果。
如图10、11所示，在具体实施的时候，该满附部分121包括若干导电散热部分124，若干该导电散热部分124彼此独立设置，若干该导电散热部分124同时附着在该透明散热基板110的外表面上。
该发光体31设置在任意相邻的两个该导电散热部分124之间，相邻的该发光体31的电连接线分别与该导电散热部分124电连接，从而使若干该发光体31形成串联连接关系。也就是说，通过若干该导电散热部分124在进行散热的时候，同时其到导电连接的作用，此种结构在不需另外加散热器的情况下，可以用于各种灯具的模组。
如图12所示，该散热导电薄膜层120还与外接散热部分125相连接，通过该外接散热部分125进一步辅助该散热导电薄膜层散热。
在将该散热导电薄膜层120与该外接散热部分125连接的时候可以采用高导热粘接或者焊接的方式，其中优选焊接方式。
另外，上述的该LED灯具还可以为如图5到图9的各种形式造型的灯具。
如图1至9所示，一种LED光源发光散热方法，将若干该LED双面发光芯片设置在透明散热板100上，该透明散热板100包括透明散热基板110以及散热导电薄膜层120，其中，该散热导电薄膜层120附着在该透明散热基板110的外表面上。该透明散热基板110由透光散热材料制成，比如，玻璃、蓝宝石等。该散热导电薄膜层120由导热散热导电材料制成，比如，银浆。
在具体将该散热导电薄膜层120附着在该透明散热基板110的外表面上的时候，需要首先对该透明散热基板110的外表面进行腐蚀粗糙，而后将该散热导电薄膜层120附着上，这种方式附着力强，产品质量佳。
将该散热导电薄膜层120区分为满附部分121以及窗口部分122，该满附部分121以及该窗口部分122间隔设置。
将该LED双面发光芯片水平设置在该窗口部分122位置处，此刻，该LED双面发光芯片外侧面所产生的光线直接发射到外部环境中，而该LED双面发光芯片内侧面所产生的光线通过该窗口部分122并透过该透明散热基板110后透射到外部环境中。
设置该窗口部分122的目的也正是为了充分利用该LED双面发光芯片双面发光的特点，使光能尽少损失。另外，设置该散热导电薄膜层120的目的主要是为了利用其材料特性最大可能的为该LED双面发光芯片进行散热，最大程度的降低其工作温度。
当该透明散热基板110为玻璃，该散热导电薄膜层120为银浆的时候优选厚度为，玻璃层零点六毫米厚，银浆层十微米厚。另外，该散热导电薄膜层120为银浆的时候，银浆层在散热导电的同时也具备光反射的作用，从而尽最大可能将光线反射到该扩散板10方向。
该LED双面发光芯片能够以正装以及倒装两种方式水平设置在该窗口部分122位置处。
在正装该LED双面发光芯片的时候，在该透明散热基板110的外表面上并且于该窗口部分122中设置有若干条导热支撑线123，该导热支撑线123与该散热导电薄膜层120的材料相同。每一条该导热支撑线123的两端部都与该满附部分121相连接。
该导热支撑线123架设在该LED双面发光芯片的底面上，该LED双面发光芯片工作所产生的热量通过该导热支撑线123传导至该透明散热基板110以及该散热导电薄膜层120上，并同步进行散热。
该LED双面发光芯片的底面所发出的光线通过若干条该导热支撑线123之间的间隙并透过该透明散热基板110后透射到外部环境中。
该导热支撑线123的宽度优选五微米。
在倒装该LED双面发光芯片的时候，该LED双面发光芯片的底面两侧的电极搭设电连接在该窗口部分122两侧的该满附部分121顶面上。该LED双面发光芯片工作所产生的热量直接传导至该透明散热基板110上，并同步进行散热。该LED双面发光芯片的底面所发出的光线通过该窗口部分122并透过该透明散热基板110后透射到外部环境中。
在具体实施的时候，该透明散热板100整体可以设计成圆形、条形或者其他形状，在具体实施的时候，该透明散热板100被架设在散热架200上，通过该散热架200进一步对该透明散热板100进行导热散热以降低该LED双面发光芯片的工作温度，该散热架200可以由金属铜或者其他散热金属制成。

Claims (13)

  1. 一种LED光源发光散热结构，其特征在于：该LED光源为LED双面发光芯片，若干该LED双面发光芯片设置在透明散热板上，该透明散热板包括透明散热基板以及散热导电薄膜层，其中，该散热导电薄膜层附着在该透明散热基板的外表面上，该透明散热基板由透光散热材料制成，该散热导电薄膜层由导热散热导电材料制成，
    该散热导电薄膜层包括满附部分以及窗口部分，该满附部分以及该窗口部分间隔设置，该LED双面发光芯片水平设置在该窗口部分位置处，此刻，该LED双面发光芯片外侧面所产生的光线直接发射到外部环境中，而该LED双面发光芯片内侧面所产生的光线通过该窗口部分并透过该透明散热基板后透射到外部环境中。
  2. 如权利要求1所述的一种LED光源发光散热结构，其特征在于：该透明散热基板为玻璃，该散热导电薄膜层为镀银层，该散热导电薄膜层为镀银层的时候，镀银层在散热导电的同时也具备光反射的作用。
  3. 如权利要求1所述的一种LED光源发光散热结构，其特征在于：在正装该LED双面发光芯片的时候，在该透明散热基板的外表面上并且于该窗口部分中设置有若干条导热支撑线，该导热支撑线与该散热导电薄膜层的材料相同，每一条该导热支撑线的两端部都与该满附部分相连接，该导热支撑线架设在该LED双面发光芯片的底面上，该LED双面发光芯片工作所产生的热量通过该导热支撑线传导至该透明散热基板以及该散热导电薄膜层上，并同步进行散热，该LED双面发光芯片的底面所发出的光线通过若干条该导热支撑线之间的间隙并透过该透明散热基板后透射到外部环境中。
  4. 如权利要求1所述的一种LED光源发光散热结构，其特征在于：在倒装该LED双面发光芯片的时候，该LED双面发光芯片的底面两侧的电极搭设电连接在该窗口部分两侧的该满附部分顶面上，该LED双面发光芯片工作所产生的热量直接传导至该透明散热基板上，并同步进行散热，该LED双面发光芯片的底面所发出的光线通过该窗口部分并透过该透明散热基板后透射到外部环境中。
  5. 如权利要求1至4任意一项所述的一种LED光源发光散热结构，其特征在于：该透明散热板被架设在散热架上，通过该散热架进一步对该透明散热板进行导热散热以降低该LED双面发光芯片的工作温度。
  6. 如权利要求5所述的一种LED光源发光散热结构，其特征在于：该LED光源为一LED灯具的光源，该LED灯具包括灯座以及灯罩，其中，该灯罩连接在该灯座上，该透明散热板为环状，该散热架包括散热固定管以及散热插接管，其中，该散热固定管一端插设在该灯座中，该散热插接管插设在该散热固定管的另外一端，该透明散热板被夹设在该散热固定管与该散热插接管之间，通过该散热架对该透明散热板进一步散热。
  7. 如权利要求6所述的一种LED光源发光散热结构，其特征在于：该散热固定管一端设置有插口，该插口水平向四周延伸形成第一夹环，该散热插接管包括插管以及第二水平夹板，其中，该插管插设在该散热固定管的该插口中，该透明散热板被夹设在该第一夹环与该第二水平夹板之间，该LED双面发光芯片环设在该透明散热板四周。
  8. 如权利要求5所述的一种LED光源发光散热结构，其特征在于：该LED光源为一LED灯具的光源，该LED灯具包括灯座以及灯罩，其中，该灯罩连接在该灯座上，该透明散热板为板状，该散热架夹设在该透明散热板两侧，若干该散热架同时插设在该灯座上。
  9. 一种LED光源发光散热方法，其特征在于：将若干该LED双面发光芯片设置在透明散热板上，该透明散热板包括透明散热基板以及散热导电薄膜层，其中，该散热导电薄膜层附着在该透明散热基板的外表面上，该透明散热基板由透光散热材料制成，该散热导电薄膜层由导热散热导电材料制成，
    将该散热导电薄膜层区分为满附部分以及窗口部分，该满附部分以及该窗口部分间隔设置，
    将该LED双面发光芯片水平设置在该窗口部分位置处，此刻，该LED双面发光芯片外侧面所产生的光线直接发射到外部环境中，而该LED双面发光芯片内侧面所产生的光线通过该窗口部分并透过该透明散热基板后透射到外部环境中。
  10. 如权利要求9所述的一种LED光源发光散热方法，其特征在于：将该散热导电薄膜层附着在该透明散热基板的外表面上的时候，需要首先对该透明散热基板的外表面进行钝化，而后将该散热导电薄膜层附着上，
    该LED双面发光芯片能够以正装以及倒装两种方式水平设置在该窗口部分位置处，在正装该LED双面发光芯片的时候，在该透明散热基板的外表面上并且于该窗口部分中设置有若干条导热支撑线，该导热支撑线与该散热导电薄膜层的材料相同，每一条该导热支撑线的两端部都与该满附部分相连接，该导热支撑线架设在该LED双面发光芯片的底面上，该LED双面发光芯片工作所产生的热量通过该导热支撑线传导至该透明散热基板以及该散热导电薄膜层上，并同步进行散热，该LED双面发光芯片的底面所发出的光线通过若干条该导热支撑线之间的间隙并透过该透明散热基板后透射到外部环境中，
    在倒装该LED双面发光芯片的时候，该LED双面发光芯片的底面两侧的电极搭设电连接在该窗口部分两侧的该满附部分顶面上，该LED双面发光芯片工作所产生的热量直接传导至该透明散热基板上，并同步进行散热，该LED双面发光芯片的底面所发出的光线通过该窗口部分并透过该透明散热基板后透射到外部环境中，该透明散热板被架设在散热架上，通过该散热架进一步对该透明散热板进行导热散热以降低该LED双面发光芯片的工作温度，该散热架由金属制成。
  11. 如权利要求5所述的一种LED光源发光散热结构，其特征在于：该LED光源为一LED灯具的光源，该LED灯具包括灯座以及灯罩，其中，该灯罩连接在该灯座上，该透明散热板为环状，该散热架连接在该灯座中，该LED双面发光芯片环设在该透明散热板四周，该LED双面发光芯片上包裹有硅胶层，在该灯罩中灌充有导热气体，通过该导热气体能够提升该LED双面发光芯片的散热效率。
  12. 如权利要求1或11所述的一种LED光源发光散热结构，其特征在于：该满附部分包括若干导电散热部分，若干该导电散热部分彼此独立设置，若干该导电散热部分同时附着在该透明散热基板的外表面上，该发光体设置在任意相邻的两个该导电散热部分之间，相邻的该发光体的电连接线分别与该导电散热部分电连接，从而使若干该发光体形成串联并连接关系。
  13. 如权利要求1所述的一种LED光源发光散热结构，其特征在于：该散热导电薄膜层还与外接散热部分相连接，通过该外接散热部分进一步辅助该散热导电薄膜层散热。
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