WO2016023161A1

WO2016023161A1 - Board arrangement device and board arrangement method

Info

Publication number: WO2016023161A1
Application number: PCT/CN2014/084117
Authority: WO
Inventors: 李丰; 彭卫红; 刘克敢; 季辉
Original assignee: 深圳崇达多层线路板有限公司
Priority date: 2014-08-11
Filing date: 2014-08-11
Publication date: 2016-02-18
Also published as: CN104303608B; CN104303608A

Abstract

A board arrangement device and a board arrangement method. The board arrangement device comprises a chassis (40), a board arrangement table (20), an infrared sensor, a fixing clamp (50) and a position line producing piece (10). The board arrangement table (20) is arranged on the chassis (40). The fixing clamp (50) is arranged on the edge of the board arrangement table (20). The position line producing piece (10) is arranged above the board arrangement table (20). Rays emitted by the position line producing piece (10) form a positioning wireframe on the board arrangement table (20). A lifting mechanism (30) that drives the board arrangement table (20) to move up and down is arranged between the chassis (40) and the board arrangement table (20). In the board arrangement, the height of the board arrangement table (20) is lowered upon each lamination of a board layer. The lifting mechanism (30) is arranged to enable a top board layer of the board arrangement table (20) to be lowered to an initial height, so that a phenomenon that the position of each board layer is shifted in the same board disk is prevented, and the PCB lamination quality is improved. As a projector (10) projects the positioning wireframe with the scale on the board arrangement table (20), the lamination center of each board disk can be accurately positioned, so that the lamination centers of different board disks are located on the same line during the lamination of the board disks, and the PCB lamination quality is further improved.

Description

说明书一种排板装置及排板方法技术领域 Description A plate arrangement device and a plate arrangement method

本发明涉及 PCB生产制备技术领域，尤其涉及一种用于各内层电路板排板叠合的排板装置及排板方法。 The present invention relates to the field of PCB production and preparation technology, and in particular, to a board arrangement and a board method for stacking inner layer circuit boards.

背景技术 Background technique

印制电路板是电子元器件的支撑体，为电子元器件提供电气连接。印制电路板的生产工艺流程一般为：开料→内层图形转移→内层蚀刻→层压→钻孔→ 沉铜→整板电镀→外层图形转移→图形电镀→蚀刻→阻焊→表面处理→成型加工等。层压是指通过黏结片（半固化片， PP )把各层线路粘结在一起，从而使离散的多层板压制成所需层数和厚度的一体化多层板。层压工序主要是包括排板和对排好的板进行压合两个步骤。其中，排板即按层叠要求将钢板、铜箔、半固化片和内层板叠放于排板台上，组成一板盘，为层压作准备。目前，排板中使用的排板装置包括底盘、排板台和设于排板台上方的多个一字线激光器，通过激光器在排板台上形成多根交叉光带，由光带形成用于限位排板的定位线框，如图 1和图 2所示。排板时，将板叠放于定位线框内。并且，排板员可根据线路板的尺寸和定位线框来确定每一层的排板数；而对于不同尺寸的板则可通过调整激光器来改变定位线框的大小。由于现有的排板装置的底盘及排板台的高度是固定的，无法上下调节，台面会随叠放板层的增加而上升，每一板盘中各层板的位置会存在一定的偏移，如图 3所示。假设激光角度为 30° ，排板厚度为 35mm，板盘中最上层板与最下层板之间将会出现 20匪的偏移。排放不同尺寸的板时需要调整激光器的角度和位置，以保证板叠放在定位线框内。由于激光器的位置和角度是手动调节的，难以将各板盘的叠放中心准确定位在同一点上，当不同板盘层叠到一起时各板盘的中心不在同一直线上，如图 4所示。板盘中各层板位置的偏移及各板盘的中心不在同一直线上，会使压合时极易出现滑板、白边、起皱等现象，影响压合的品质。 A printed circuit board is a support for electronic components that provides electrical connections to electronic components. The production process of printed circuit board is generally as follows: material opening → inner layer pattern transfer → inner layer etching → lamination → drilling → copper sinking → whole plate plating → outer layer pattern transfer → pattern plating → etching → solder mask → surface Processing → molding processing, etc. Lamination refers to the bonding of layers of wires together by a bonding sheet (prepreg, PP), thereby compressing the discrete multilayer sheets into an integrated multilayer board of the desired number of layers and thickness. The laminating process mainly comprises two steps of arranging the plates and pressing the aligned plates. Among them, the steel plate, the copper foil, the prepreg and the inner layer are stacked on the row table according to the lamination requirements, and a plate is formed to prepare for lamination. At present, the arranging device used in the arranging plate comprises a chassis, a platter table and a plurality of word line lasers arranged above the arranging plate, and a plurality of intersecting optical strips are formed on the arranging table by the laser, and are formed by the optical strip. The positioning wire frame of the limit row plate is shown in Figure 1 and Figure 2. When arranging the plates, stack the plates in the positioning wire frame. Moreover, the row boarder can determine the number of rows of each layer according to the size of the circuit board and the positioning wire frame; and for different sizes of boards, the size of the positioning wire frame can be changed by adjusting the laser. Since the height of the chassis and the row table of the existing row plate device is fixed and cannot be adjusted up and down, the table surface will rise with the increase of the stacking plate layer, and the position of each layer plate in each plate plate will be biased. Move, as shown in Figure 3. Assuming a laser angle of 30° and a plate thickness of 35 mm, a 20 偏移 offset will occur between the uppermost and lowermost plates in the plate. When discharging plates of different sizes, it is necessary to adjust the angle and position of the laser to ensure that the stack is placed in the positioning wire frame. Due to The position and angle of the laser are manually adjusted. It is difficult to accurately position the stacking centers of the plates at the same point. When the different plates are stacked together, the centers of the plates are not in the same line, as shown in FIG. The offset of the position of each layer in the plate and the center of each plate are not on the same straight line, which makes the skateboard, white edge, wrinkle and the like easily occur during pressing, which affects the quality of the pressing.

发明内容 Summary of the invention

本发明针对现有排板装置会导致同一板盘内各层板间出现位置偏移，以及各板盘的叠放中心不在同一直线上而影响压合品质的问题，提供一种可使同一板盘中各层板的位置不偏移，且各板盘的叠放中心可准确定位的排板装置。 The invention solves the problem that the existing plate arrangement device causes positional displacement between the layers in the same plate, and the stacking centers of the plates are not on the same straight line, which affects the pressing quality, and provides the same plate. The position of each layer of the plate is not offset, and the stacking center of each plate can accurately position the plate device.

为实现上述目的，本发明釆用以下技术方案， In order to achieve the above object, the present invention uses the following technical solutions.

一种排板装置，包括底盘、排板台、固定夹和定位线生成件，所述排板台设于底盘上，固定夹设于排板台的边沿，定位线生成件设于排板台上方，定位线生成件发出的光线在排板台上形成定位线框，所述底盘与排板台之间设有一驱动排板台上下移动的升降机构。 A arranging device comprises a chassis, a platter table, a fixing clip and a positioning wire generating member, wherein the arranging plate is arranged on the chassis, and is fixedly clamped on the edge of the arranging plate, and the positioning wire generating member is arranged on the arranging plate Above, the light emitted by the positioning line generating member forms a positioning wire frame on the row table, and a lifting mechanism for driving the plate table to move up and down is disposed between the chassis and the row table.

进一步说，所述的升降机构为丝杆升降机。 Further, the lifting mechanism is a screw lift.

进一步说，所述的定位线生成件为一投影仪。 Further, the positioning line generating component is a projector.

进一步说，所述定位线框由一矩形线框及设于矩形线框内的 X轴刻度线和 y 轴刻度线组成。 Further, the positioning wire frame is composed of a rectangular wire frame and an X-axis tick mark and a y-axis tick mark disposed in the rectangular wire frame.

进一步说，所述的投影仪设于排板台中间的上方。 Further, the projector is disposed above the middle of the row of plates.

进一步说，所述的排板台与投影机的距离为 1800匪。 Further, the distance between the row of plates and the projector is 1800 匪.

应用以上所述排板装置进行排板的方法，包括以下步骤： The method for applying the above-mentioned arranging device to the arranging plate comprises the following steps:

Sl、由定位线生成件发射光线并照射到排板台上形成定位线框，且排板台的高度设为初始高度。优选的，定位线生成件为投影仪，投影仪将定位线框投射到排板台上；所述的定位线框由一矩形线框及设于矩形线框内的 X轴刻度线和 y轴刻度线组成。更优选的，在排板台上形成四个定位线框，且四个定位线框呈两行两列设置。 Sl, the light generated by the positioning line generating component is irradiated onto the row board to form a positioning wire frame, and the height of the row board is set to an initial height. Preferably, the positioning line generating component is a projector, and the projector projects the positioning wire frame onto the row board; the positioning wire frame comprises a rectangular wire frame and an X-axis tick mark disposed in the rectangular wire frame. And y-axis tick marks. More preferably, four positioning wire frames are formed on the row table, and the four positioning wire frames are arranged in two rows and two columns.

52、将间隔板放置于排板台上，然后下调排板台的高度，使间隔板的板面下降至初始高度处。优选的，所述的间隔板为钢板。 52. Place the spacer on the pallet, then lower the height of the pallet to lower the panel surface to the initial height. Preferably, the partition plate is a steel plate.

53、在间隔板上依次叠放各板层，且每叠放一板层后均下调排板台的高度，使排板台上顶层的板层的板面下降至初始高度处。具体的，所述依次叠放的各板层为下铜箔层、内层板层和上铜箔层，且内层板层与下铜箔层及上铜箔层间均设有半固化片层。 53. Stacking the layers on the partition plate in turn, and lowering the height of the row of plates after each layer is stacked, so that the plate surface of the top layer on the top of the row is lowered to the initial height. Specifically, each of the layer layers stacked in sequence is a lower copper foil layer, an inner layer layer and an upper copper foil layer, and a prepreg layer is disposed between the inner layer layer and the lower copper foil layer and the upper copper foil layer.

与现有技术相比，本发明的有益效果是：本发明通过在底盘与排板台之间设置升降机构，每叠放一板层即通过升降机构调整一次排板台的高度，使排板台上顶层的板层的板面可下降至初始高度处，从而可避免同一板盘内各板层位置出现偏移的现象，提高 PCB压合品质。通过在排板台的上方设置投影仪，由投影仪投射有刻度的定位线框于排板台上，通过有刻度的定位线框可准确定位板盘的叠放中心，从而可使不同板盘相互层叠时各叠放中心在同一直线上，进一步提高 PCB压合品质。在定位线框中设置 X轴刻度线并在定位线框的中间设置 y轴刻度线，且四个定位线框呈两行两列设置，可便于在排板台上进行多种排板方式的叠放。 Compared with the prior art, the beneficial effects of the present invention are as follows: The present invention provides an elevating mechanism between the chassis and the platoon table, and each stack of slabs is adjusted by the elevating mechanism to adjust the height of the platoon table. The surface of the top layer of the table can be lowered to the initial height, thereby avoiding the phenomenon of offset of the position of each layer in the same plate and improving the quality of the PCB. By setting a projector above the row table, the projector places a scaled positioning wire frame on the row table, and the scaled positioning wire frame can accurately position the stacking center of the plate, so that different plates can be made. When stacked on each other, the stacking centers are on the same line, which further improves the PCB press quality. Set the X-axis tick mark in the positioning line frame and set the y-axis tick mark in the middle of the positioning wire frame, and the four positioning wire frames are arranged in two rows and two columns, which is convenient for performing various rows of plates on the row board. Stacked.

附图说明 DRAWINGS

图 1为现有排板装置的侧视示意图； Figure 1 is a side elevational view of a conventional panel arrangement;

图 2为现有排板装置的俯视示意图； 2 is a schematic plan view of a conventional arranging device;

图 3为现有排板装置的排板台台面升高时产生的位置偏移的示意图；图 4为使用现有排板装置排板组成的板盘叠放在一起的示意图； 3 is a schematic view showing a positional deviation generated when a row of the plate slabs of the conventional arranging device is raised; FIG. 4 is a schematic view showing a stack of plates which are formed by using the arranging plates of the existing arranging device;

图 5为本发明排板装置的结构示意图；图 6为本发明排板装置的侧视图； Figure 5 is a schematic structural view of the plate arranging device of the present invention; Figure 6 is a side view of the plate arranging device of the present invention;

图 7为本发明排板装置的俯视图； Figure 7 is a plan view of the plate arranging device of the present invention;

图 8为本发明排板装置的排板台上四个定位线框的排列示意图； 8 is a schematic view showing the arrangement of four positioning wire frames on the row board of the panel arrangement device of the present invention;

图 9为实施例 1的半固化片层中半固化片的摆放方式的示意图； 9 is a schematic view showing a manner in which a prepreg in the prepreg layer of Embodiment 1 is placed;

图 10为实施例 1中叠好的板盘的截面视图； Figure 10 is a cross-sectional view of the stacked plate in Embodiment 1;

图 11为实施例 1的半固化片层中半固化片的摆放方式的示意图； Figure 11 is a schematic view showing the manner in which the prepreg in the prepreg layer of Example 1 is placed;

图 12为实施例 3的半固化片层中半固化片的摆放方式的示意图； Figure 12 is a schematic view showing the manner in which the prepreg in the prepreg layer of Example 3 is placed;

图 13为实施例 4的半固化片层中半固化片的摆放方式的示意图。 Figure 13 is a schematic view showing the manner in which the prepreg in the prepreg layer of Example 4 is placed.

具体实施方式 detailed description

为了更充分理解本发明的技术内容，下面结合具体实施例对本发明的技术方案作进一步介绍和说明。 In order to more fully understand the technical content of the present invention, the technical solutions of the present invention will be further described and illustrated in conjunction with the specific embodiments.

实施例 1 Example 1

本实施例提供的一种排板装置，参照图 5-8，包括一底盘 40、一呈矩形的排板台 20、丝杆升降机 30、红外感应器、八个固定夹 50和一定位线生成件 10。在底盘 40上设置丝杆升降机 30，在丝杆升降机 30上安设一排板台 20，通过丝杆升降机 30可调节排板台 20的高度。在排板台 20的每条边上分别设置两个固定夹 50，当按要求将各板层叠于排板台 20后，用固定夹 50将排板台上已叠好的板层夹紧固定，形成一板盘。在排板台 20的旁边并于排板台 20台面的初始高度处设置一红外感应器，用于感应排板台 20的高度，排板装置则根据红外感应器的信号控制丝杆升降机 30运行，每次调整均使排板台 20上顶层的板层的板面回落至初始高度。当排板台 20上板层的高度高于初始高度而需下调排板台 20的高度时，启动丝杆升降机 30，使排板台 20下降。当红外感应器感应到排板台 20上顶层的板层的板面回落至初始高度时，由排板装置控制丝杆升降机 30 停止运行。在排板台 20中间的上方设置一定位线生成件 10，所述的定位线生成件为投影仪，投影仪与排板台 20的垂直距离为 1800匪。投影仪将光线投射到排板台 20上，在排板台 20上形成四个呈两行两列排列的定位线框，且每个定位线框上均设有一 X轴刻度线和一 y轴刻度线。所述的定位线框呈长方形，在靠近长方形的一长边处设置 X轴刻度线，在定位线框的中间设置 y轴刻度线，如图 8所示。 X轴刻度线和 y轴刻度线的最小刻度为 9匪。 A plate arranging device provided by this embodiment, with reference to FIG. 5-8, includes a chassis 40, a rectangular row plate table 20, a screw lifter 30, an infrared sensor, eight fixing clips 50, and a positioning line. Item 10. A screw jack 30 is disposed on the chassis 40, and a row of pallets 20 is disposed on the screw jacks 30, and the height of the pallets 20 can be adjusted by the screw jacks 30. Two fixing clips 50 are respectively disposed on each side of the row table 20, and after stacking the boards on the row board 20 as required, the stacked board layers on the row board are clamped and fixed by the fixing clips 50. , forming a plate. An infrared sensor is disposed beside the row board 20 and at an initial height of the table 20 table for sensing the height of the row board 20, and the board device controls the screw jack 30 according to the signal of the infrared sensor. Each adjustment causes the plate surface of the top layer of the top plate 20 to fall back to the initial height. When the height of the upper layer on the row table 20 is higher than the initial height and the height of the row 20 is lowered, the screw lift 30 is activated to lower the row 20. When the infrared sensor senses that the plate surface of the top layer on the top plate 20 falls back to the initial height, the screw lift 30 is controlled by the plate arrangement device. Stop running. A positioning line generating member 10 is disposed above the middle of the row table 20, and the positioning line generating member is a projector, and the vertical distance between the projector and the row table 20 is 1800 匪. The projector projects light onto the row table 20, and four positioning wire frames arranged in two rows and two columns are formed on the row table 20, and each of the positioning wire frames is provided with an X-axis tick mark and a y-axis. Tick marks. The positioning wire frame is rectangular, and an X-axis tick mark is arranged near a long side of the rectangle, and a y-axis tick mark is arranged in the middle of the positioning wire frame, as shown in FIG. The minimum scale for the X-axis and y-axis marks is 9匪.

在其它实施方案中，还可使用丝杆升降机 30以外的其它升降机构，只需能准确调节排板台 20的高度即可。 In other embodiments, other lifting mechanisms other than the screw lifter 30 can be used, as long as the height of the pallet table 20 can be accurately adjusted.

生产 PCB的层压工序中，使用本实施例的排板装置进行排板。 In the laminating process for producing a PCB, the arranging device of the present embodiment is used for arranging the plates.

生产 PCB ( 6层板）的层压工序中，排板的步骤如下，并参照图 9-1 : In the lamination process for producing PCB (6-layer board), the steps of the board are as follows, and refer to Figure 9-1:

( 1 )将投影仪打开，并通过投影仪将设有四个定位线框模型的幻灯片投影到排板台上，四个定位线框在排板台上呈两行两列排列，从而构成一总定位线框。 (1) The projector is turned on, and a slide with four positioning wireframe models is projected onto the row table by the projector, and the four positioning wire frames are arranged in two rows and two columns on the row table, thereby forming A total positioning wireframe.

( 2 )在排板台上先叠放 20 张牛皮纸，然后在牛皮纸上叠放钢板并使钢板摆放在总定位线框内，并通过总定位线框上的刻度线将钢板放于总定位线框的中部。然后通过丝杆升降机与红外感应器的配合，将排板台上钢板的高度下调至初始高度（即下调的高度为钢板和牛皮纸的总厚度）。所述的钢板即间隔板。 (2) Stack 20 pieces of kraft paper on the pallet, then stack the steel plates on the kraft paper and place the steel plate in the general positioning wire frame, and place the steel plate in the general positioning through the tick marks on the main positioning wire frame. The middle of the wireframe. Then, by the cooperation of the screw lift and the infrared sensor, the height of the steel plate on the row plate is lowered to the initial height (that is, the height of the down-regulation is the total thickness of the steel plate and the kraft paper). The steel plate is a partition plate.

( 3 )在钢板上按叠放要求叠放铜箔、内层板、钢板和半固化片，且每叠放一板层均下调一次排板台的高度，使排板台上顶层的板层的板面回落到初始高度处。所述的内层板为制作有内层线路的芯板与半固化片按叠构预排后铆合或熔合在一起的板。具体的叠板动作为： (3) Stacking copper foil, inner layer, steel plate and prepreg on the steel plate according to the stacking requirements, and lowering the height of one row of the plates at each stack, so that the top layer of the plate on the plate The face falls back to the initial height. The inner layer board is a board in which the core board and the prepreg which are formed with the inner layer line are pre-arranged and then riveted or fused together. The specific stacking action is:

3-1：在钢板上叠放一张铜箔，形成下铜箔层；通过总定位线框上的刻度线将下铜箔层放于总定位线框的中部，如图 9 所示。然后通过丝杆升降机与红外感应器的配合，下调排板台的高度，使下铜箔层的板面下降至初始高度处。3-1: Lay a piece of copper foil on the steel plate to form a lower copper foil layer; place the lower copper foil layer in the middle of the main positioning wire frame by the tick marks on the general positioning wire frame, as shown in Figure 9. Then through the screw lift and infrared With the cooperation of the inductor, the height of the row of plates is lowered, so that the surface of the lower copper foil layer is lowered to the initial height.

3-2：在下铜箔层上叠放半固化片，形成第一半固化片层；通过总定位线框上的刻度线将第一半固化片层放于总定位线框的中部。然后通过丝杆升降机与红外感应器的配合，下调排板台的高度，使第一半固化片层的板面下降至初始高度处。 3-2: A prepreg is placed on the lower copper foil layer to form a first prepreg layer; the first prepreg layer is placed in the middle of the main positioning wire frame by a tick mark on the general positioning wire frame. Then, by the cooperation of the screw lifter and the infrared sensor, the height of the pallet is lowered, and the surface of the first prepreg is lowered to the initial height.

3-3：在第一半固化片层上叠放一张内层板，形成内层板层；通过总定位线框上的刻度线将内层板层放于总定位线框的中部。然后通过丝杆升降机与红外感应器的配合，下调排板台的高度，使内层板层的板面下降至初始高度处。 3-3: An inner layer is stacked on the first prepreg layer to form an inner layer; the inner layer is placed in the middle of the main positioning frame by a tick mark on the main positioning line frame. Then, by the cooperation of the screw lifter and the infrared sensor, the height of the pallet is lowered, and the panel surface of the inner layer is lowered to the initial height.

3-4：在内层板层上叠放半固化片，形成第二半固化片层；通过总定位线框上的刻度线将第二半固化片层放于总定位线框的中部。然后通过丝杆升降机与红外感应器的配合，下调排板台的高度，使第二半固化片层的板面下降至初始高度处。 3-4: The prepreg is stacked on the inner ply to form the second prepreg; the second prepreg is placed in the middle of the main positioning frame by the tick marks on the main positioning wire frame. Then, by the cooperation of the screw lift and the infrared sensor, the height of the pallet is lowered, and the surface of the second prepreg is lowered to the initial height.

3-5：在第二半固化片层上叠放一张铜箔，形成上铜箔层；通过总定位线框上的刻度线将上铜箔层放于总定位线框的中部。然后通过丝杆升降机与红外感应器的配合，下调排板台的高度，使上铜箔层的板面下降至初始高度处。 3-5: Lay a piece of copper foil on the second prepreg layer to form a copper foil layer; place the upper copper foil layer in the middle of the main positioning wire frame by the tick marks on the general positioning wire frame. Then, by the cooperation of the screw lifter and the infrared sensor, the height of the row plate is lowered, and the surface of the upper copper foil layer is lowered to the initial height.

3-6：在上铜箔层上叠放钢板，使钢板摆放在总定位线框内，并通过总定位线框上的刻度线将钢板放于总定位线框的中部。然后通过丝杆升降机与红外感应器的配合，将排板台上钢板的高度下调至初始高度。 3-6: Lay the steel plates on the upper copper foil layer, place the steel plate in the main positioning wire frame, and place the steel plate in the middle of the main positioning wire frame through the tick marks on the general positioning wire frame. Then, by the screw jack and the infrared sensor, the height of the steel plate on the pallet is lowered to the initial height.

( 4 )重复步骤 3，直至排版台上的板层总厚度达到设计要求。 (4) Repeat step 3 until the total thickness of the ply on the typesetting table meets the design requirements.

( 5 )用排板台四周的八个固定夹将排板台上叠放好的各板层夹紧固定，形成一板盘，如图 10所示。 (5) Clamp and fix the layers of the plates stacked on the row of plates with eight fixing clips around the row of plates, forming a plate, as shown in Figure 10.

使用上述的排板装置和排板方法制作多个板盘，然后将板盘移至压炉并根据现有的热压工艺进行压合，制得多层板并记为 dl。热压过程中，温度和压力随时间逐渐变化的情况如下表所示，总时长为 280m i n: A plurality of plates were fabricated using the above-described plate arrangement and panel method, and then the trays were moved to a press furnace and pressed according to an existing hot pressing process to make a multi-layer board and recorded as dl. Temperature and pressure during hot pressing The gradual change of force over time is shown in the table below, with a total duration of 280m in:

实施例 2 Example 2

本实施例与实施例 1基本相同，不同之处在于：在排板过程的步骤（3 ) 的 3-2中，在下铜箔层上的两边对称叠放半固化片，形成第一半固化片层；并通过总定位线框上的刻度线将第一半固化片层放于总定位线框的中部，如图 11所示。然后参照实施例 1的 3-3至 3-6的步骤及步骤（ 4 )、 ( 5 ), 分别在第一半固化片层上依次叠放内层板层、第二半固化片层和上铜箔层，从而使所形成的内层板层设有两块对称放置的内层板。 This embodiment is basically the same as Embodiment 1, except that in the step (3) of the arranging process (3), the prepreg is symmetrically stacked on both sides of the lower copper foil layer to form the first prepreg layer; The tick marks on the general positioning wireframe place the first prepreg layer in the middle of the main positioning wire frame, as shown in FIG. Then, referring to the steps 3 and 3-6 of the first embodiment, and the steps (4) and (5), the inner layer, the second prepreg layer and the upper copper foil layer are sequentially stacked on the first prepreg layer. Thereby, the formed inner layer is provided with two symmetrically placed inner sheets.

使用实施例 1 的排板装置和及本实施例的排板方法制作多个板盘，然后将板盘移至压炉并釆用与实施例 1 相同的热压工艺进行压合，制得多层板，记为 d2。 A plurality of plates were fabricated using the plate arranging device of Example 1 and the arranging method of the present embodiment, and then the plates were moved to a press furnace and pressed by the same hot pressing process as in Example 1, The laminate, recorded as d2.

实施例 3 Example 3

本实施例与实施例 1基本相同，不同之处在于：在排板过程的步骤（3 ) 的 3-2中，在下铜箔层上等距平行放置三份半固化片，形成第一半固化片层；并通过总定位线框上的刻度线将第一半固化片层放于总定位线框的中部，如图 12所示。然后参照实施例 1的 3-3至 3-6的步骤及步骤（ 4 )、 ( 5 ), 分别在第一半固化片层上依次叠放内层板层、第二半固化片层和上铜箔层，从而使所形成的内层板层设有三块等距平行放置的内层板。 This embodiment is basically the same as Embodiment 1, except that: in the step 3-2 of the step (3) of the arranging process, three prepregs are placed in parallel on the lower copper foil layer to form a first prepreg layer; The first prepreg layer is placed in the middle of the main positioning wire frame by the tick marks on the general positioning wire frame, as shown in FIG. Then, referring to the steps 3 and 3-6 of the first embodiment, and the steps (4) and (5), the inner layer, the second prepreg layer and the upper copper foil layer are sequentially stacked on the first prepreg layer. Thereby, the formed inner layer is provided with three inner layers which are placed in equal parallel.

使用实施例 1 的排板装置和及本实施例的排板方法制作多个板盘，然后将板盘移至压炉并釆用与实施例 1 相同的热压工艺进行压合，制得多层板，记为 d 3。 A plurality of plates were fabricated using the plate arranging device of Example 1 and the arranging method of the present embodiment, and then the plates were moved to a press furnace and pressed by the same hot pressing process as in Example 1, Laminate, recorded as d 3.

实施例 4 Example 4

本实施例与实施例 1基本相同，不同之处在于：在排板过程的步骤（3 ) 的 3-2中，在下铜箔层上呈 "田" 字形放置四份半固化片，形成第一半固化片层；并通过总定位线框上的刻度线将第一半固化片层放于总定位线框的中部，如图 1 3所示。然后参照实施例 1的 3-3至 3-6的步骤及步骤（ 4 )、 ( 5 ), 分别在第一半固化片层上依次叠放内层板层、第二半固化片层和上铜箔层，从而使所形成的内层板层设有四块呈 "田" 字形放置的内层板。 This embodiment is basically the same as the first embodiment except that: in the step 3-2 of the step (3) of the arranging process, four prepregs are placed in a "field" shape on the lower copper foil layer to form a first prepreg layer. And place the first prepreg layer in the middle of the main positioning wire frame by the tick marks on the general positioning wire frame, as shown in Figure 13. Then, referring to the steps 3 and 3-6 of the first embodiment, and the steps (4) and (5), the inner layer, the second prepreg layer and the upper copper foil layer are sequentially stacked on the first prepreg layer. Thus, the formed inner layer is provided with four inner sheets placed in a "field" shape.

使用实施例 1 的排板装置和及本实施例的排板方法制作多个板盘，然后将板盘移至压炉并釆用与实施例 1 相同的热压工艺进行压合，制得多层板，记为 d4。 A plurality of plates were fabricated using the plate arranging device of Example 1 and the arranging method of the present embodiment, and then the plates were moved to a press furnace and pressed by the same hot pressing process as in Example 1, The laminate, recorded as d4.

比较例 Comparative example

釆用如背景技术中所述的现有的排板装置（如图 1和图 2所示）进行排板制作多个板盘，然釆用实施例 1 所述的热压工艺进行压合，制得多层板，记为 d5 ( 6层板）。 Using a conventional arranging device as shown in the prior art (as shown in FIGS. 1 and 2) to form a plurality of slabs, and then press-fitting using the hot pressing process described in Embodiment 1, Make a multi-layer board, denoted as d5 (6-layer board).

由实施例 1-4和比较例制得的多层板 dl-d5的压合效果如下表所示。

The pressing effect of the multilayer board dl-d5 obtained in Examples 1-4 and Comparative Examples is shown in the following table.

本发明用投影仪取代六个激光器，可降低排板装置的成本，成本可降低 72%。并且设有定位线框模型的幻灯片是固定的，使用同一幻灯片就可适应多种叠放方式的排板需求，不需手动调整定位线框，从而可显著减少位置偏差并提高生产效率。以上所述仅以实施例来进一步说明本发明的技术内容，以便于读者更容易理解，但不代表本发明的实施方式仅限于此，任何依本发明所做的技术延伸或再创造，均受本发明的保护。 The invention replaces six lasers with a projector, which can reduce the cost of the panel device, and the cost can be reduced by 72%. Moreover, the slide with the positioning wireframe model is fixed, and the same slide can be used to adapt to the arrangement of a plurality of stacked plates, without manually adjusting the positioning wire frame, thereby significantly reducing positional deviation and improving production efficiency. The above description is only for the purpose of further illustrating the technical content of the present invention in order to facilitate the understanding of the reader, but the embodiment of the present invention is not limited thereto, and any technology extension or re-creation according to the present invention is subject to Protection of the invention.

Claims

权利要求书 Claim

1、一种排板装置，包括底盘、排板台、固定夹和定位线生成件，所述排板台设于底盘上，固定夹设于排板台的边沿，定位线生成件设于排板台上方，定位线生成件发出的光线在排板台上形成定位线框，其特征在于：所述底盘与排板台之间设有一驱动排板台上下移动的升降机构。 1. A arranging device, comprising a chassis, a platter, a fixing clip and a positioning wire generating member, wherein the arranging plate is arranged on the chassis, and is fixedly clamped on the edge of the arranging plate, and the positioning wire generating member is arranged in the row Above the pallet, the light emitted by the positioning line generating member forms a positioning wire frame on the row board, and is characterized in that: a lifting mechanism for driving the board table up and down is arranged between the chassis and the row board.

2、根据权利要求 1所述一种排板装置，其特征在于，所述的升降机构为丝杆升降机。 2. A panel arrangement according to claim 1, wherein said lifting mechanism is a screw lift.

3、根据权利要求 1所述一种排板装置，其特征在于，所述的定位线生成件为一投影仪。 3. A panel arrangement according to claim 1, wherein said positioning line generating member is a projector.

4、根据权利要求 3所述一种排板装置，其特征在于，所述的投影仪设于排板台中间的上方。 4. A panel arrangement according to claim 3, wherein said projector is disposed above the middle of the row of pallets.

5、根据权利要求 4所述一种排板装置，其特征在于，所述的排板台与投影机的巨离为 1800mm。 5. A panel arrangement according to claim 4, wherein the row of the trays and the projector are 1800 mm apart.

6、根据权利要求 3所述一种排板装置，其特征在于，所述定位线框由一矩形线框及设于矩形线框内的 X轴刻度线和 y轴刻度线组成。 6. The panel arrangement according to claim 3, wherein the positioning wire frame comprises a rectangular wire frame and an X-axis graduation line and a y-axis graduation line disposed in the rectangular wire frame.

7、一种排板方法，其特征在于，包括以下步骤： 7. A method of arranging boards, comprising the steps of:

51、由定位线生成件发射光线并照射到排板台上形成定位线框，且排板台的高度设为初始高度； 51. The positioning line generating component emits light and illuminates the row board to form a positioning wire frame, and the height of the row board is set to an initial height;

52、将间隔板放置于排板台上，然后下调排板台的高度，使间隔板的板面下降至初始高度处； 52. Place the partition plate on the row board, and then lower the height of the row board to lower the board surface of the partition board to the initial height;

53、在间隔板上依次叠放各板层，且每叠放一板层后均下调排板台的高度，使排板台上顶层的板层的板面下降至初始高度处。 53. Stacking the layers on the partition plate in turn, and lowering the height of the row of plates after each layer is stacked, so that the plate surface of the top layer on the top of the row is lowered to the initial height.

8、根据权利要求 7所述一种排板方法，其特征在于，步骤 S 3中，所述依次叠放的各板层为下铜箔层、内层板层和上铜箔层，且内层板层与下铜箔层及上铜箔层间均设有半固化片层。 8. The method of arranging a board according to claim 7, wherein in step S3, the The sub-stacked layers are a lower copper foil layer, an inner layer layer and an upper copper foil layer, and a prepreg layer is disposed between the inner layer layer and the lower copper foil layer and the upper copper foil layer.

9、根据权利要求 8所述一种排板方法，其特征在于，所述定位线框由一矩形线框及设于矩形线框内的 X轴刻度线和 y轴刻度线组成。 9. The arranging method according to claim 8, wherein the positioning wire frame is composed of a rectangular wire frame and an X-axis tick mark and a y-axis tick mark provided in the rectangular wire frame.

10、根据权利要求 9所述一种排板方法，其特征在于，所述步骤 S1中，排板台上形成四个定位线框，四个定位线框呈两行两列设置。 The arranging method according to claim 9, wherein in the step S1, four positioning wire frames are formed on the row board, and the four positioning wire frames are arranged in two rows and two columns.