CN218388109U - Flatness improving structure of printed circuit board - Google Patents

Abstract

The utility model relates to the technical field of printed circuit boards, in particular to a flatness improving structure of a printed circuit board; the structure comprises a tray, a cover plate and a circuit board assembly, wherein the cover plate is arranged on the tray, a containing area capable of containing the circuit board assembly is formed by enclosing between the tray and the cover plate, a plurality of liftable steel clamp stop blocks are arranged in the tray, and the steel clamp stop blocks are uniformly distributed on the periphery of the circuit board assembly. The utility model discloses be provided with the steel clamp dog of liftable in the tray in the structure, the steel clamp dog distributes around circuit board subassembly, can fix a position circuit board subassembly, prevent that offset from appearing in the coincide in-process, influence the level and smooth effect of circuit board, guarantee the shipment quality of circuit board.

Description

Flatness improving structure of printed circuit board

Technical Field

The utility model relates to a printed circuit board technical field especially relates to a printed circuit board's roughness improves structure.

Background

Along with the rapid development of the refinement and the processing automation of electronic products, the updating and upgrading speed of the electronic products is faster and faster, and particularly, people pursue high-quality experiences such as convenience, lightness, functional diversification and the like on the electronic products, so that a new requirement is provided for the flatness of the printed circuit board. The development process of rigid-flex circuit boards is the leading development trend in the field of circuit board manufacturing industry, and the economy and reliability of the rigid-flex circuit boards are increasingly known and recognized by people. In the manufacturing process, due to the poor stability of the manufacturing process caused by the complex materials and process of the rigid-flex board and other factors, the finished circuit board has a greater risk of unqualified flatness quality, and the quality and the ex-warehouse rate of the product are affected. Therefore, a structure for improving the flatness of a printed wiring board is needed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem, the utility model provides a structure is improved to roughness of printed wiring board, including tray, apron and circuit board components, the apron sets up on the tray, and enclose between the two to close to form and to hold circuit board components's holding region, be provided with the steel clip dog of a plurality of liftable in the tray, each the steel clip dog evenly distributed is in circuit board components around.

Furthermore, one end of the steel clip stop dog is connected with the tray through a spring, and the other end of the steel clip stop dog is higher than the end of the steel clip stop dog connected with the spring.

Further, the initial height of the steel clip stop block is higher than the height of the circuit board assembly.

Further, the lower threshold of the height of the steel clip stop block is lower than the height of the circuit board assembly after pressure transmission.

Further, circuit board assembly includes at least one circuit board, locates each respectively circuit board upper surface and lower surface go up the tool and tool down, it includes the PE membrane to go up the tool, the tool includes from last PE membrane and the steel sheet that sets gradually down, circuit board assembly is close to the both ends of tray and apron all are provided with the kraft paper.

Furthermore, the circuit board assembly comprises a plurality of superposed circuit boards, and a separation film and a buffer pad are sequentially arranged between the adjacent lower jig and the upper jig from top to bottom.

Further, the buffer pad is a silicon-litter rubber pad.

Further, the tray is rectangular, and at least one steel clip stop block is arranged on the longer side of the tray.

Furthermore, a hanging lug is arranged on the outer side of the edge of the tray.

The utility model discloses owing to adopt above technical scheme, make it compare with prior art, have following beneficial effect: the utility model provides a structure is improved to printed circuit board's roughness, simple structure is provided with the clip dog of liftable in the tray, and the clip dog distributes around circuit board subassembly, can fix a position the circuit board subassembly, prevent that offset from appearing in the coincide in-process, influence the level and smooth effect of circuit board, guarantee the shipment quality of circuit board.

Drawings

Fig. 1 is a schematic structural view of the flatness improving structure of the printed circuit board of the present invention;

fig. 2 is a schematic structural view of a tray in the flatness improving structure of the printed circuit board of the present invention;

fig. 3 is a schematic structural view of a circuit board assembly in the flatness improvement structure of the printed circuit board of the present invention.

1-a tray; 11-hanging a lug; 2-cover plate; 3-a circuit board assembly; 31-a circuit board; 32. 33-PE film; 34-a steel plate; 35-kraft paper; 36-a separation membrane; 37-a cushion pad; 4-a steel clamp stop block; 5-a spring.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person skilled in the art without creative work belong to the scope of protection of the present invention based on the embodiments of the present invention. In the drawings, the size and relative sizes of certain features may be exaggerated for clarity.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected" and "connected" are to be construed broadly, e.g., as meaning a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; the term "connected" refers to a connection between two elements or an interaction between two elements, and the term is used in the present invention to be understood as a specific meaning for those skilled in the art.

In the description of the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "center", "horizontal", "vertical", "top", "bottom", "inner", "outer", and the like are used in the orientation or positional relationship shown in the drawings, only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be considered as limiting the present invention.

Furthermore, in the description of the present invention, the terms "first" and "second" are used merely for descriptive distinction and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

As shown in the attached drawings 1 and 2, the utility model provides a structure is improved to roughness of printed wiring board, including tray 1, apron 2 and circuit board subassembly 3, apron 2 sets up on the tray 1, and enclose between the two and close and form and can hold circuit board subassembly 3's holding area, tray 1 are provided with the recess, and circuit board subassembly 3 can arrange in this recess, and apron 2 is the flat board, be provided with the steel clamp dog 4 of a plurality of liftable in the tray 1, each steel clamp dog 4 evenly distributed is in around circuit board subassembly 3, steel clamp dog 4 can reciprocate under the effect of external force, and steel clamp dog 4 evenly sets up around circuit board subassembly 3, plays spacing effect, avoids circuit board subassembly 3 in the in-process of coincide, appears landing or the phenomenon that the position is cheap, influences circuit board flattening effect.

In an optimized implementation mode, one end of the steel clip stop block 4 is connected with the tray 1 through a spring 5, the height of the other end of the steel clip stop block is higher than that of the end connected with the spring 5, the bottom end of the spring 5 is connected with the tray 1, the top end of the spring 5 is connected with the steel clip stop block 4, preferably, a base is arranged on the tray 1, and the bottom end of the spring 5 is connected with the base; in this embodiment, the spring 5 is disposed at one end of the steel clip stopper 4, and of course, the spring 5 may be disposed at the middle position of the steel clip stopper 4.

In some embodiments, two or more springs 5 are connected below the steel clip stop block 4, the elastic direction of the springs 5 is vertical, and the steel clip stop block 4 ascends and descends in the vertical direction under the action of external force, can be compressed downwards along with the circuit board assembly 3 in the pressure transmission and leveling process, and limits the circuit board assembly 3, so that the situation that the positions of the layers deviate to influence the leveling quality is avoided.

Optimize the embodiment, the initial height of steel clamp dog 4 is higher than circuit board assembly 3's height, and is concrete, and when spring 5 was in the natural state, the height of the higher one end of steel clamp dog 4 was higher than circuit board assembly 3's height, preferably, tray 1 is the rectangle, and tray 1 all is provided with all around steel clamp dog 4, the longer one side of tray 1 are provided with at least one steel clamp dog 4, and in this embodiment, the longer one side of tray 1 is provided with the steel clamp dog 4 of two symmetric distributions, and the higher one end of steel clamp dog 4 sets up towards the outside, can be better carry on spacingly to circuit board assembly 3.

In a specific implementation mode, the circuit board assembly 3 is placed in the tray 1 and covered with the cover plate 2, an external force is applied to the cover plate 2, the steel clip stop block 4 is firstly extruded to move downwards in the downward movement process of the cover plate 2, the circuit board assembly 3 can also move downwards under the action of the external force, and then the circuit board is leveled.

The flatness improvement structure in this embodiment can be used for leveling at least one circuit board, and is particularly suitable for leveling a plurality of circuit boards in a laminated manner, and can adjust the flatness of the plurality of circuit boards simultaneously, thereby improving the working efficiency, the circuit board assembly comprises an upper jig and a lower jig which are respectively arranged on the upper surface and the lower surface of each circuit board 31, the upper jig comprises a PE film 32, the lower jig comprises a PE film 33 and a steel plate 34 which are sequentially arranged from top to bottom, the PE film is preferably a teflon PE film, the steel plate is preferably a mirror steel plate, kraft paper 35 is respectively arranged at two ends of the circuit board assembly close to the tray 1 and the cover plate 2, when the plurality of circuit boards are stacked, a separation film 36 and a buffer pad 37 are sequentially arranged between the adjacent lower jig and the upper jig from top to bottom, and the buffer pad 37 is preferably a silicon gel pad.

As shown in fig. 3, the circuit board assembly 3 is used for leveling a plurality of circuit boards 31, the circuit board assembly 3 is placed in the tray 1 in a laminating manner, kraft paper 35 is placed on the tray 1, then a steel plate 34 is placed, the kraft paper 35 can prevent the steel plate 34 from being scratched, then a PE film 33 is placed on the steel plate 34 to achieve the effects of filling, leveling and preventing board surface contamination, the circuit boards 31 to be pressed and leveled are placed in order on the upper surfaces of the PE films 33, the head of the circuit boards 31 is placed in order with the head facing upwards, the surfaces of the PE films 33 are fully paved, a PE film 32 is placed on the circuit boards 31 to achieve the effects of filling, leveling and preventing board surface contamination, a cushion 37 is placed on the upper surfaces of the PE films 32 to achieve the effects of pressure buffering and filling, a separation film 36 is placed on the cushion 37 to prevent contamination, the cushion 37 or the steel plate 34 is placed on the separation film 36 to prevent contamination, a PE film 33 is placed on the steel plate 34, a PE film 31 to be pressed and a circuit board 31 is placed on the circuit board 35, the circuit boards 35 are placed on the top, and the circuit boards 35 are stacked, and the circuit boards 2 are pressed and leveled, and the circuit boards are placed.

Further, the flatness improvement structure in the embodiment can be used on a press conveyor, the stacked tray 1 can be placed on the press conveyor for segmented pressing and leveling, and the outer side of the edge of the tray 1 is provided with a hanging lug 11 for being installed on the press conveyor; the flatness of the circuit board after pressure transmission leveling is greatly improved, the retest flatness can be reduced by more than 5 microns on average, and the shipment quality of the circuit board is ensured.

And those not described in detail in this specification are well within the skill of those in the art.

It will be appreciated by those skilled in the art that the invention can be embodied in many other specific forms without departing from the spirit or scope of the invention. Although the embodiments of the present invention have been described, it is to be understood that the present invention should not be limited to such embodiments, and that changes and modifications can be made by one skilled in the art within the spirit and scope of the present invention as defined by the appended claims.

Claims (9)

1. The utility model provides a roughness of printed circuit board improves structure, its characterized in that, includes tray, apron and circuit board assembly, the apron sets up on the tray, and enclose between the two and close and form and can hold circuit board assembly's holding region, be provided with a plurality of liftable steel clamp dogs in the tray, each steel clamp dog evenly distributed is in circuit board assembly's all around.

2. The flatness-improving structure of a printed wiring board according to claim 1, wherein one end of the clip stopper is connected to the tray by a spring, and the other end has a height higher than that of the end connected to the spring.

3. The flatness-improving structure of a printed wiring board according to claim 1, wherein an initial height of the clip stopper is higher than a height of the wiring board assembly.

4. A flatness improving structure of a printed wiring board according to claim 3, wherein a lower threshold of a height of said clip stopper is lower than a height of said board assembly after pressure transmission.

5. The flatness improving structure of a printed wiring board according to claim 1, wherein said circuit board assembly includes at least one circuit board, an upper jig and a lower jig respectively provided on an upper surface and a lower surface of each of said circuit boards, said upper jig includes a PE film, said lower jig includes a PE film and a steel plate sequentially provided from top to bottom, and kraft papers are provided at both ends of said circuit board assembly near said tray and said cover plate.

6. The flatness improvement structure of the printed wiring board according to claim 5, wherein the wiring board assembly includes a plurality of stacked wiring boards, and a separation film and a cushion pad are sequentially provided between the adjacent lower jig and the upper jig from top to bottom.

7. The flatness improving structure of a printed wiring board according to claim 6, wherein said cushion pad is a silicon-litter pad.

8. The flatness improvement structure of a printed wiring board according to claim 1, wherein said tray is rectangular, and at least one of said clip stoppers is provided on a longer side of said tray.

9. The flatness improving structure of a printed wiring board according to claim 1, wherein a lug is provided outside an edge of the tray.

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