WO2016021025A1 - Labeled-component substrate mounting method - Google Patents
Labeled-component substrate mounting method Download PDFInfo
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- WO2016021025A1 WO2016021025A1 PCT/JP2014/070904 JP2014070904W WO2016021025A1 WO 2016021025 A1 WO2016021025 A1 WO 2016021025A1 JP 2014070904 W JP2014070904 W JP 2014070904W WO 2016021025 A1 WO2016021025 A1 WO 2016021025A1
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- label
- mounting
- component
- electronic component
- nozzle
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Definitions
- the present invention relates to a substrate mounting method for components with labels, and is intended to reduce cycle time by efficiently removing labels and components from a component supply device and mounting them on a substrate.
- a label that records a product code, a production lot, and the like as management information related to a mounting object may be attached to the component or the substrate.
- a label holding tape in which a label coated with an adhesive on the back surface is affixed to the surface of the tape is generally used, and a label affixing method using a label feeder or a component mounting machine for that purpose is used.
- the problem to be solved by the present invention relates to a method of mounting a component on a substrate with a label attached to the upper surface of the electronic component, and efficiently using the label and the electronic component supplied from the component supply device on the substrate. By mounting, the cycle time of component mounting is reduced.
- the mounting nozzle adsorbs the label having the adhesive layer formed on the back surface, the adhering the adsorbed label to the upper surface of the electronic component in the component supply device, and the bonding integrated by the pressure bonding.
- a method for mounting a labeled component on a board comprising: adsorbing a label and the electronic component; and moving the label and the electronic component onto a circuit board to mount the label and the electronic component on the substrate.
- the label and the electronic component can be supplied from the feeder and efficiently mounted on the substrate without requiring manual labor and without supplying the electronic component in a tray.
- the electronic component since it is not necessary to separately mount the electronic component and the label on the solder applied to the substrate, there is no possibility that the electronic component is displaced during mounting.
- the time required for the mounting and remounting of electronic components from the back and forth to the substrate can be saved, there is little time loss, so in the substrate mounting process that includes electronic components with labels, the cycle time of component mounting is shortened by repeating this operation. can do.
- the pressure bonding may be performed by pressurizing the mounting nozzle in multiple times to the same location on the upper surface of the label (Claim 2). By pressing the upper surface of the label a plurality of times with the tip of the suction nozzle, the adhesion of the label to the electronic component can be enhanced.
- the mounting nozzle may be temporarily lifted from the mounting component and may be adsorbed again after pressurizing a plurality of different locations on the top surface of the mounting component (Claim 3).
- the suction surface of the mounting nozzle is smaller than the surface of the label, the adhesion of the label to the electronic component can be enhanced by moving the mounting nozzle in the plane direction and applying pressure over the entire surface of the label as much as possible.
- the pressure bonding may include an operation of moving the mounting nozzle in a plane direction while lightly pressing the mounting nozzle against the upper surface of the component (Claim 4). By adhering the adhesive between the label and the electronic component, mutual adhesion can be enhanced.
- FIG. 1 It is a block diagram which shows the control system of this invention. It is a top view which shows the label holding tape supplied with a label feeder. It is a top view which peels and shows the component holding tape supplied with a component feeder. It is a flowchart which shows the main operation
- (A) to (F) are explanatory diagrams showing, in a time series, processes from attaching a label to a component and mounting it on a substrate.
- FIG. 1 is a block diagram showing main components of a component mounter for carrying out the present invention.
- the component mounting machine includes a control device 10, a mounting head 12 that holds the mounting nozzle, a head drive unit 11 that drives the mounting head 12, an IPS camera 13 and a part camera 14 that image components picked up by the mounting nozzle, and a reference position of the board
- a mark camera 15 for imaging a mark, a label feeder 16 for supplying a label, and a component feeder 17 for supplying a component to which the label is attached are provided.
- a storage device 18 for storing production programs, image processing data, and the like, a display device 19 such as a liquid crystal display, an input device 20 such as a keyboard and a mouse, and the like are provided.
- FIG. 2 shows a form of the label holding tape 21 supplied by the label feeder 16.
- labels 23 having an adhesive applied on the back surface are affixed at equal intervals.
- Feed holes 24 penetrating the label holding tape 21 are formed in one row in the longitudinal direction at an equal pitch on one of both side portions parallel to the longitudinal direction of the label holding tape 21.
- the label holding tape 21 is accommodated in the label feeder 16 in a state where it can be pulled out, and its leading end is fed to a label suction position by a tape feeding device (not shown).
- FIG. 3 shows the form of the component holding tape 31 supplied by the component feeder 17.
- one electronic component 32 is accommodated in each of the accommodating recesses 33 formed at equal intervals, and is covered with a cover film (not shown).
- feed holes 34 penetrating the component holding tape 31 are formed in a row at an equal pitch.
- the component holding tape 31 is accommodated in the component feeder 17 in a state where it can be pulled out, and its leading end is fed to a component suction position by a tape feeder (not shown).
- the control device 10 causes the head drive unit 11 to move the mounting head 12 above the label suction unit 64 of the label feeder 16 (S401). Then, the tip of the mounting nozzle 51 held by the mounting head 12 is lowered until it contacts the peel target label.
- the label feeder 16 has a structure in which the label holding tape 21 is bent downward at the suction portion, so that a gap is formed between the label 52 to be peeled off and the tape mount 54 so that the label can be easily peeled off.
- the control device 10 starts suction to the mounting nozzle 51 that has contacted the label 52 (S402), and sucks and raises the label 52 (FIG. 5A).
- Xa indicates the feeding direction of the label holding tape 21, and the tape mount 54 that has finished label adsorption is fed to the lower part of the label feeder 16 through the tape collection hole 53.
- the control device 10 moves the mounting head 12 to above the component suction portion of the component feeder 17 (S403). Then, the label 52 adsorbed by the mounting nozzle 51 is lowered until it comes into contact with the electronic component 57 (FIG. 5B), and the label 52 at the tip of the mounting nozzle 51 is pressed against the upper surface of the electronic component 57 (S404). (FIG. 5 (C)).
- 5B and 5C are front views (cross-sections) showing a state in which the mounting nozzle 51 holding the label 52 is pressure-bonded to the upper surface of the electronic component 57 in the component suction portion 61.
- Xb indicates the feeding direction of the component holding tape 31.
- the crimping operation may be performed by pressurizing the mounting nozzle 51 in a plurality of times at the same location on the upper surface of the label 52. That is, by repeating pressurization, decompression, and pressurization on the upper surface of the label at the tip of the mounting nozzle 51, the adhesion of the label to the electronic component can be enhanced.
- pressure reduction may be merely a momentary weakening of the applied pressure of the mounting nozzle 51, or the suction of the label 52 is temporarily stopped to separate the tip of the mounting nozzle 51 from the upper surface of the label. Also good.
- the pressure bonding operation includes at least one operation of once stopping suction of the label 52 by the mounting nozzle 51, moving the mounting nozzle 51 slightly away from the label 52, moving in the plane direction, and pressurizing the upper surface of the label 52 again.
- This is also an effective means.
- the suction surface of the mounting nozzle 51 is smaller than the upper surface of the label 52, so that the adhesive force between the label 52 and the electronic component 57 is increased by increasing the adhesion area by pressing a plurality of different locations on the label upper surface. Thereby, the label 52 and the electronic component 57 can be integrated and sucked.
- the pressure bonding may include an operation of moving the mounting nozzle 51 in the plane direction while lightly pressing the mounting nozzle 51 against the upper surface of the label 52.
- the adhesive between the label and the electronic component can be blended to improve the mutual adhesion. It is desirable to experimentally determine various conditions such as the pressing force of the mounting nozzle 51 at this time, the moving distance in the plane direction, and the speed.
- the pressurizing operations in a plurality of times, the adhesion between the label 52 and the electronic component 57 can be further increased over the entire surface of the label 52.
- the control device 10 resumes sucking and sucks the label 52 and the electronic component 57 simultaneously. That is, since the label 52 and the electronic component 57 are integrated by the effect of the adhesive, the label 52 and the electronic component 57 are attracted by the mounting nozzle 51 and the mounting nozzle 51 is raised after the crimping operation is completed ( S405) (FIG. 5D).
- control device 10 images the suction state of the label 52 and the electronic component 57 from the side surface direction with the IPS camera 13 (S406), and determines whether or not the suction state is normal (S407). If the crimping operation is not successful, the label 52 and the electronic component 57 are not sufficiently integrated, causing adsorption, or only the label 52 can be adsorbed, or nothing is adsorbed. This is also possible.
- the control device 10 moves the mounting head 12 to the mounting position of the substrate (S408), lowers the mounting nozzle 51, contacts the electronic component 57 with the mounting substrate 59, and puts it on the mounting substrate 59.
- the label 52 and the electronic component 57 are mounted (S409) (FIG. 5E).
- the suction is stopped and the mounting nozzle 51 rises (FIG. 5 (F)).
- Y indicates the direction in which the circuit board is conveyed by the board conveying conveyor 60.
- an abnormality is detected by imaging from the side, the operator is notified of this and urged to respond (S410). Specifically, an alarm sound is generated to display an abnormal state on the display device 19 or display a notification on the mobile device. After confirming the actual product, the operator determines whether to re-mount or discard the component depending on the defective state and takes measures (S411).
- the label and the electronic component can be supplied from the feeder and can be efficiently mounted on the substrate without requiring a manual operation and without supplying the electronic component in a tray.
- the electronic component and the label since it is not necessary to separately mount the electronic component and the label on the solder applied to the substrate, there is no possibility that the electronic component is displaced during mounting.
- the time required for the mounting and remounting of electronic components from the back and forth to the substrate can be saved, there is little time loss, so in the substrate mounting process that includes electronic components with labels, the cycle time of component mounting is shortened by repeating this operation. can do.
- step S402 the control device 10 adsorbs the label 52 as a regular one, but proceeds after confirming from the information displayed on the label 52 in advance whether it is a regular label that matches the production plan. It is also possible. That is, since the management information necessary for production is printed on the surface of the label 52, the ID code printed on the label 52 in advance is read by the mark camera 15, and the information system connected online with the component mounting machine is in accordance with the production plan. It is also possible to proceed to the adsorption of the label after confirming that there is no difference in the label 52. If the label differs from the production plan for some reason, it is possible to avoid erroneously attaching the label to the electronic component. In particular, in the case of electronic parts with limited quantities, it is safe to perform such a prior check because no single piece can be wasted.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Labeling Devices (AREA)
Abstract
In a labeled-component substrate mounting method, duplication of effort of adsorbing and fitting would be required if an electronic component is mounted using a fitting nozzle and then a label is adsorbed and fitted on an upper surface of the electronic component.
After the label is adsorbed by the fitting nozzle, the label is press-mounted on the upper surface of the electronic component, and the electronic component is also integrally adsorbed as is and moved to the circuit substrate for mounting. In this way, both the electric component and the label can be integrally mounted on the circuit substrate at once without requiring the duplication of effort of mounting the component and attaching the label onto the upper surface thereof, whereby the number of mounting steps can be decreased.
Description
本発明は、ラベル付き部品の基板実装方法に関し、部品供給装置からラベルと部品を効率よく取り出し基板に実装することで、サイクルタイムの短縮を図るものである。
The present invention relates to a substrate mounting method for components with labels, and is intended to reduce cycle time by efficiently removing labels and components from a component supply device and mounting them on a substrate.
従来から、基板に部品実装を行う工程で、装着対象物に関する管理情報として製品コード、生産ロットなどを記録したラベルを部品や基板に貼付することがある。そのようなラベルとしては、裏面に粘着剤が塗布されたラベルがテープの表面に貼り付けられて成るラベル保持テープが一般的であり、そのためのラベルフィーダや部品実装機を用いたラベル貼付方法が知られている（引用文献１）。
Conventionally, in a process of mounting a component on a substrate, a label that records a product code, a production lot, and the like as management information related to a mounting object may be attached to the component or the substrate. As such a label, a label holding tape in which a label coated with an adhesive on the back surface is affixed to the surface of the tape is generally used, and a label affixing method using a label feeder or a component mounting machine for that purpose is used. Known (Cited document 1).
しかし、そのような装置や手法を用いても、基板に実装しようとする電子部品の上面にラベルを実装しようとする場合には種々の問題があった。例えば、部品を基板にリフロー実装した後に、作業者がラベル保持テープからラベルを剥がし部品上面に貼付することは可能であるが、人手を要するとともに相当の工数がかかる。また、平板状の部品トレイから供給する部品にラベル貼付機であらかじめラベルを貼り付けておき、部品実装機で部品を基板に実装する工程でそのラベル付き部品を実装する方法もあるが、フィーダで供給したい部品には対応できない。さらに、部品実装機で部品を基板に装着した後、リフロー半田付け前に、ラベルをその部品上面に装着する方法も考えられるが、部品が印刷後の半田上にあって不安定な状態なため、そこにラベルを貼付しようとすると部品の位置が変動してしまい、結果的に部品の装着不良を生ずるおそれがある。
However, even if such an apparatus or method is used, there are various problems when trying to mount a label on the upper surface of an electronic component to be mounted on a substrate. For example, after the component is reflow-mounted on the substrate, the operator can remove the label from the label holding tape and affix it to the upper surface of the component. There is also a method in which a label is attached in advance to a component to be supplied from a flat component tray, and the component with the label is mounted in a process of mounting the component on a substrate by a component mounting machine. Cannot handle the parts you want to supply. Furthermore, after mounting the component on the board with a component mounting machine, it is possible to mount the label on the top surface of the component before reflow soldering, but the component is on the solder after printing and is in an unstable state. If an attempt is made to affix a label there, the position of the component may fluctuate, and as a result, there is a risk that a component mounting failure will occur.
そこで、本発明が解決しようとする課題は、電子部品の上面にラベルを貼付した状態で部品を基板に実装する方法に関し、部品供給装置から供給されるラベルと電子部品を用いて効率よく基板に実装することで、部品実装のサイクルタイム短縮を図ることである。
Therefore, the problem to be solved by the present invention relates to a method of mounting a component on a substrate with a label attached to the upper surface of the electronic component, and efficiently using the label and the electronic component supplied from the component supply device on the substrate. By mounting, the cycle time of component mounting is reduced.
本発明は、装着ノズルが裏面に粘着層が形成されたラベルを吸着する工程と、吸着した前記ラベルを部品供給装置にある電子部品の上面に圧着する工程と、前記圧着により一体化された前記ラベルと前記電子部品を吸着する工程と、回路基板上に移動して、前記ラベルと前記電子部品を基板上に装着する工程、を含むラベル付き部品の基板実装方法である。
In the present invention, the mounting nozzle adsorbs the label having the adhesive layer formed on the back surface, the adhering the adsorbed label to the upper surface of the electronic component in the component supply device, and the bonding integrated by the pressure bonding. A method for mounting a labeled component on a board, comprising: adsorbing a label and the electronic component; and moving the label and the electronic component onto a circuit board to mount the label and the electronic component on the substrate.
これにより、人手を要することなく、また電子部品をトレイ供給することもなく、フィーダからラベルと電子部品を供給して効率よく基板に実装することができる。また、基板に塗布された半田の上に電子部品とラベルを二度に分けて搭載する必要もないので、装着時に電子部品の位置ずれが生ずるおそれもない。そして、電子部品の吸着から基板への装着の往復による二度手間も省け時間のロスが少ないため、ラベル付き電子部品を含む基板実装工程では、この動作を繰り返すことにより部品実装のサイクルタイムを短縮することができる。
Thus, the label and the electronic component can be supplied from the feeder and efficiently mounted on the substrate without requiring manual labor and without supplying the electronic component in a tray. In addition, since it is not necessary to separately mount the electronic component and the label on the solder applied to the substrate, there is no possibility that the electronic component is displaced during mounting. In addition, since the time required for the mounting and remounting of electronic components from the back and forth to the substrate can be saved, there is little time loss, so in the substrate mounting process that includes electronic components with labels, the cycle time of component mounting is shortened by repeating this operation. can do.
前記圧着は、装着ノズルをラベル上面の同一個所に対して複数回に分けて加圧するものであってもよい（請求項２）。吸着ノズルの先端部でラベル上面を複数回加圧することにより、ラベルの電子部品への密着性を高めることができる。
The pressure bonding may be performed by pressurizing the mounting nozzle in multiple times to the same location on the upper surface of the label (Claim 2). By pressing the upper surface of the label a plurality of times with the tip of the suction nozzle, the adhesion of the label to the electronic component can be enhanced.
前記圧着は、装着ノズルを一旦実装部品から浮かせて実装部品上面の異なる複数個所を加圧したうえで再度吸着するのもよい（請求項３）。一般に装着ノズルの吸着面はラベルの表面より小さいので、装着ノズルを平面方向に移動させてできるだけラベル全面にわたり加圧することにより、ラベルの電子部品への密着性を高めることができる。
In the pressure bonding, the mounting nozzle may be temporarily lifted from the mounting component and may be adsorbed again after pressurizing a plurality of different locations on the top surface of the mounting component (Claim 3). Generally, since the suction surface of the mounting nozzle is smaller than the surface of the label, the adhesion of the label to the electronic component can be enhanced by moving the mounting nozzle in the plane direction and applying pressure over the entire surface of the label as much as possible.
前記圧着は、装着ノズルを部品上面に軽く押し当てながら平面方向に動かす動作を含むものであってもよい（請求項４）。ラベルと電子部品の間にある粘着剤をなじませることで、相互の密着性を高めることができる。
The pressure bonding may include an operation of moving the mounting nozzle in a plane direction while lightly pressing the mounting nozzle against the upper surface of the component (Claim 4). By adhering the adhesive between the label and the electronic component, mutual adhesion can be enhanced.
以下、本発明の実施形態について、ラベルフィーダが供給するラベルを部品フィーダが供給する電子部品（SMT型ICなど）に貼付し、回路基板に実装する例について添付図面を参照しつつ説明する。ただし、図面中の各部の寸法や比率等は必ずしも実際のものと一致するように図示されていない場合がある。
Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings, in which an example in which a label supplied by a label feeder is attached to an electronic component (such as an SMT type IC) supplied by a component feeder and mounted on a circuit board is described. However, the dimensions, ratios, and the like of the respective parts in the drawings are not necessarily illustrated so as to coincide with actual ones.
図１は、本発明を実施するうえでの部品実装機の主要構成要素を示すブロック図である。部品実装機は、制御装置１０、装着ノズルを保持する装着ヘッド１２、装着ヘッド１２を駆動するヘッド駆動部１１、装着ノズルで吸着した部品を撮像するＩＰＳカメラ１３およびパーツカメラ１４、基板の基準位置マークを撮像するマークカメラ１５、ラベルを供給するラベルフィーダ１６、ラベルが貼付される部品を供給する部品フィーダ１７、を備える。また、生産プログラムや画像処理用のデータなどを格納する記憶装置１８、液晶ディスプレイ等の表示装置１９、キーボードやマウスなどの入力装置２０等を備える。
FIG. 1 is a block diagram showing main components of a component mounter for carrying out the present invention. The component mounting machine includes a control device 10, a mounting head 12 that holds the mounting nozzle, a head drive unit 11 that drives the mounting head 12, an IPS camera 13 and a part camera 14 that image components picked up by the mounting nozzle, and a reference position of the board A mark camera 15 for imaging a mark, a label feeder 16 for supplying a label, and a component feeder 17 for supplying a component to which the label is attached are provided. Further, a storage device 18 for storing production programs, image processing data, and the like, a display device 19 such as a liquid crystal display, an input device 20 such as a keyboard and a mouse, and the like are provided.
図２は、ラベルフィーダ１６で供給されるラベル保持テープ２１の形態を示したものである。ラベル保持テープ２１には、裏面に粘着剤が塗布されたラベル２３が等間隔に貼り付けられている。ラベル保持テープ２１の長手方向に平行な両側部の一方には、ラベル保持テープ２１を貫通する送り穴２４が長手方向に一列に等ピッチで形成されている。ラベル保持テープ２１はラベルフィーダ１６に引き出し可能な状態で収容されており、その引き出し端がテープ送り装置（図示せず）によりラベルの吸着位置まで送られる。
FIG. 2 shows a form of the label holding tape 21 supplied by the label feeder 16. On the label holding tape 21, labels 23 having an adhesive applied on the back surface are affixed at equal intervals. Feed holes 24 penetrating the label holding tape 21 are formed in one row in the longitudinal direction at an equal pitch on one of both side portions parallel to the longitudinal direction of the label holding tape 21. The label holding tape 21 is accommodated in the label feeder 16 in a state where it can be pulled out, and its leading end is fed to a label suction position by a tape feeding device (not shown).
図３は、部品フィーダ１７で供給される部品保持テープ３１の形態を示したものである。部品保持テープ３１は、等間隔で形成された収容凹部３３に１個ずつの電子部品３２が収容され、カバーフィルム（図示せず）で覆われている。部品保持テープ３１の長手方向に平行な両側の被支持部の一方には、部品保持テープ３１を貫通する送り穴３４が一列に等ピッチで形成されている。部品保持テープ３１は部品フィーダ１７に引き出し可能な状態で収容されており、その引き出し端がテープ送り装置（図示せず）により部品の吸着位置まで送られる。
FIG. 3 shows the form of the component holding tape 31 supplied by the component feeder 17. In the component holding tape 31, one electronic component 32 is accommodated in each of the accommodating recesses 33 formed at equal intervals, and is covered with a cover film (not shown). On one of the supported parts on both sides parallel to the longitudinal direction of the component holding tape 31, feed holes 34 penetrating the component holding tape 31 are formed in a row at an equal pitch. The component holding tape 31 is accommodated in the component feeder 17 in a state where it can be pulled out, and its leading end is fed to a component suction position by a tape feeder (not shown).
図４と図５を用いて本発明の実装方法を説明する。まず、制御装置１０は、ヘッド駆動部１１により、装着ヘッド１２をラベルフィーダ１６のラベル吸着部６４の上方へ移動させる（S４０１）。そして、装着ヘッド１２が保持する装着ノズル５１の先端部が剥離対象ラベルに接触するまで下降させる。ラベルフィーダ１６は、吸着部でラベル保持テープ２１を下方に湾曲させることで、剥離対象となるラベル５２とテープ台紙５４の間に隙間ができ、ラベルを剥離し易くなる構造になっている。制御装置１０は、ラベル５２に接触した装着ノズル５１に対し吸引を開始し（S４０２）、ラベル５２を吸着し上昇させる（図５（A））。この結果、装着ノズル５１の先端部に、粘着部６３を下向きにしたラベル５２が保持された状態となる。Xaはラベル保持テープ２１の送り方向を示し、ラベル吸着を終えたテープ台紙５４はテープ回収孔５３を通じてラベルフィーダ１６の下部に送られる。
The mounting method of the present invention will be described with reference to FIGS. First, the control device 10 causes the head drive unit 11 to move the mounting head 12 above the label suction unit 64 of the label feeder 16 (S401). Then, the tip of the mounting nozzle 51 held by the mounting head 12 is lowered until it contacts the peel target label. The label feeder 16 has a structure in which the label holding tape 21 is bent downward at the suction portion, so that a gap is formed between the label 52 to be peeled off and the tape mount 54 so that the label can be easily peeled off. The control device 10 starts suction to the mounting nozzle 51 that has contacted the label 52 (S402), and sucks and raises the label 52 (FIG. 5A). As a result, the label 52 with the adhesive portion 63 facing downward is held at the tip of the mounting nozzle 51. Xa indicates the feeding direction of the label holding tape 21, and the tape mount 54 that has finished label adsorption is fed to the lower part of the label feeder 16 through the tape collection hole 53.
次に、制御装置１０は、装着ヘッド１２を部品フィーダ１７の部品吸着部上方へ移動させる（S４０３）。そして、装着ノズル５１が吸着するラベル５２を電子部品５７に接触するまで下降させ（図５（B））、装着ノズル５１の先端部にあるラベル５２を電子部品５７の上面に圧着させる（S４０４）（図５（C））。図５（B）、（C）はラベル５２を保持した装着ノズル５１を部品吸着部６１にある電子部品５７の上面に圧着させる様子を示す正面図（断面）である。この際、ラベル５２と電子部品５７の間の粘着剤による接着力を高めるために、圧着状態を適当な時間保持するのが望ましい。この適当な時間は実験的に有効とされる値を用いるのがよい。なお、Xbは部品保持テープ３１の送り方向を示し、電子部品５７の吸着を終えると部品保持テープ３１は次の電子部品５７が部品吸着部６１に来るように送られる。
Next, the control device 10 moves the mounting head 12 to above the component suction portion of the component feeder 17 (S403). Then, the label 52 adsorbed by the mounting nozzle 51 is lowered until it comes into contact with the electronic component 57 (FIG. 5B), and the label 52 at the tip of the mounting nozzle 51 is pressed against the upper surface of the electronic component 57 (S404). (FIG. 5 (C)). 5B and 5C are front views (cross-sections) showing a state in which the mounting nozzle 51 holding the label 52 is pressure-bonded to the upper surface of the electronic component 57 in the component suction portion 61. FIG. At this time, in order to increase the adhesive force of the adhesive between the label 52 and the electronic component 57, it is desirable to hold the pressure-bonded state for an appropriate time. It is preferable to use a value that is experimentally valid for this appropriate time. Xb indicates the feeding direction of the component holding tape 31. When the electronic component 57 is sucked, the component holding tape 31 is sent so that the next electronic component 57 comes to the component suction portion 61.
前記圧着動作は、装着ノズル５１をラベル５２の上面の同一個所に複数回に分けて加圧するものであってもよい。すなわち装着ノズル５１の先端部でラベル上面に対し加圧、減圧、加圧を繰り返すことにより、ラベルの電子部品への密着性を高めることができる。かかる減圧は、瞬間的に装着ノズル５１の加圧力を弱めるだけであってもよいし、あるいはラベル５２の吸引を一時的に止めて装着ノズル５１の先端部をラベル上面から離間させるものであってもよい。
The crimping operation may be performed by pressurizing the mounting nozzle 51 in a plurality of times at the same location on the upper surface of the label 52. That is, by repeating pressurization, decompression, and pressurization on the upper surface of the label at the tip of the mounting nozzle 51, the adhesion of the label to the electronic component can be enhanced. Such pressure reduction may be merely a momentary weakening of the applied pressure of the mounting nozzle 51, or the suction of the label 52 is temporarily stopped to separate the tip of the mounting nozzle 51 from the upper surface of the label. Also good.
また、前記圧着動作は、一旦装着ノズル５１によるラベル５２の吸引を停止し、装着ノズル５１をラベル５２から少し離間させ、平面方向に移動して再度ラベル５２上面を加圧する動作を少なくとも１回以上行うのも有効な手段となる。一般に装着ノズル５１の吸着面はラベル５２の上面より小さいので、ラベル上面の異なる複数個所を加圧して接着面積を増やすことで、ラベル５２と電子部品５７の間の接着力を増すためである。これにより、ラベル５２と電子部品５７を一体化して吸着することが可能となる。
Further, the pressure bonding operation includes at least one operation of once stopping suction of the label 52 by the mounting nozzle 51, moving the mounting nozzle 51 slightly away from the label 52, moving in the plane direction, and pressurizing the upper surface of the label 52 again. This is also an effective means. In general, the suction surface of the mounting nozzle 51 is smaller than the upper surface of the label 52, so that the adhesive force between the label 52 and the electronic component 57 is increased by increasing the adhesion area by pressing a plurality of different locations on the label upper surface. Thereby, the label 52 and the electronic component 57 can be integrated and sucked.
さらに、前記圧着は、装着ノズル５１をラベル５２の上面に軽く押し当てながら平面方向に移動させる動作を含むものであってもよい。この動作でラベルと電子部品の間にある粘着剤をなじませることで、相互の密着性を高めることができる。このときの装着ノズル５１の押圧力や平面方向の移動距離、速度など諸条件は実験的に求めるのが望ましい。また、前記複数回に分けて加圧する動作を組合わせることで、さらにラベル５２の全面にわたりラベル５２と電子部品５７の間の密着性を高めることができる。
Further, the pressure bonding may include an operation of moving the mounting nozzle 51 in the plane direction while lightly pressing the mounting nozzle 51 against the upper surface of the label 52. By this operation, the adhesive between the label and the electronic component can be blended to improve the mutual adhesion. It is desirable to experimentally determine various conditions such as the pressing force of the mounting nozzle 51 at this time, the moving distance in the plane direction, and the speed. In addition, by combining the pressurizing operations in a plurality of times, the adhesion between the label 52 and the electronic component 57 can be further increased over the entire surface of the label 52.
その後、制御装置１０は、装着ノズル５１が吸引を停止していた場合は吸引を再開し、ラベル５２と電子部品５７を同時に吸着する。即ち、ラベル５２と電子部品５７は粘着剤の効果で一体化されているので、前記圧着作業が完了した後、装着ノズル５１でラベル５２と電子部品５７を吸着して装着ノズル５１を上昇させる（S４０５）（図５（D））。
Thereafter, when the mounting nozzle 51 has stopped sucking, the control device 10 resumes sucking and sucks the label 52 and the electronic component 57 simultaneously. That is, since the label 52 and the electronic component 57 are integrated by the effect of the adhesive, the label 52 and the electronic component 57 are attracted by the mounting nozzle 51 and the mounting nozzle 51 is raised after the crimping operation is completed ( S405) (FIG. 5D).
そして、制御装置１０は、IPSカメラ１３でラベル５２と電子部品５７の吸着状態を側面方向から撮像し（S４０６）、吸着状態が正常であるか否かを判定する（S４０７）。前記圧着作業が不良であった場合には、ラベル５２と電子部品５７の一体化が十分でなく吸着立ちを起こしていたり、またはラベル５２のみしか吸着できていなかったり、あるいはまったく何も吸着されない場合も起こりうるからである。
Then, the control device 10 images the suction state of the label 52 and the electronic component 57 from the side surface direction with the IPS camera 13 (S406), and determines whether or not the suction state is normal (S407). If the crimping operation is not successful, the label 52 and the electronic component 57 are not sufficiently integrated, causing adsorption, or only the label 52 can be adsorbed, or nothing is adsorbed. This is also possible.
吸着状態に異常がなければ、制御装置１０は装着ヘッド１２を基板の装着位置に移動させ（S４０８）、装着ノズル５１を下降し、電子部品５７を実装基板５９に接触させ、実装基板５９上にラベル５２と電子部品５７を装着する（S４０９）（図５（E））。そして、吸引を停止し、装着ノズル５１は上昇する（図５（F））。Yは基板搬送コンベア６０による回路基板の搬送方向を示す。
If there is no abnormality in the suction state, the control device 10 moves the mounting head 12 to the mounting position of the substrate (S408), lowers the mounting nozzle 51, contacts the electronic component 57 with the mounting substrate 59, and puts it on the mounting substrate 59. The label 52 and the electronic component 57 are mounted (S409) (FIG. 5E). Then, the suction is stopped and the mounting nozzle 51 rises (FIG. 5 (F)). Y indicates the direction in which the circuit board is conveyed by the board conveying conveyor 60.
もし、側面方向からの撮像で異常を検出した場合は、作業者にその旨通知し対応を促す（S４１０）。具体的にはアラーム音を鳴らせ表示装置１９に異常状態を表示したり、モバイル装置に通知表示をしたりする。作業者は現物確認のうえ、不良状態により再実装か部品廃棄かを判断し対処する（S４１１）。
If an abnormality is detected by imaging from the side, the operator is notified of this and urged to respond (S410). Specifically, an alarm sound is generated to display an abnormal state on the display device 19 or display a notification on the mobile device. After confirming the actual product, the operator determines whether to re-mount or discard the component depending on the defective state and takes measures (S411).
以上で1件のラベル付き電子部品の基板実装を終了する。複数の作業が必要な場合は上記工程を繰り返すことになる。なお、本実施例では電子部品の場合を例に挙げたが、コネクタや端子など表面実装型の機構部品であってもよい。
This completes the board mounting of one labeled electronic component. When a plurality of operations are required, the above process is repeated. In the present embodiment, the case of an electronic component has been described as an example, but a surface mount type mechanical component such as a connector or a terminal may be used.
本発明により、人手を要することなく、また電子部品をトレイ供給することもなく、フィーダからラベルと電子部品を供給して効率よく基板に実装することができる。また、基板に塗布された半田の上に電子部品とラベルを二度に分けて搭載する必要もないので、装着時に電子部品の位置ずれが生ずるおそれもない。そして、電子部品の吸着から基板への装着の往復による二度手間も省け時間のロスが少ないため、ラベル付き電子部品を含む基板実装工程では、この動作を繰り返すことにより部品実装のサイクルタイムを短縮することができる。
According to the present invention, the label and the electronic component can be supplied from the feeder and can be efficiently mounted on the substrate without requiring a manual operation and without supplying the electronic component in a tray. In addition, since it is not necessary to separately mount the electronic component and the label on the solder applied to the substrate, there is no possibility that the electronic component is displaced during mounting. In addition, since the time required for the mounting and remounting of electronic components from the back and forth to the substrate can be saved, there is little time loss, so in the substrate mounting process that includes electronic components with labels, the cycle time of component mounting is shortened by repeating this operation. can do.
ところで、ステップS４０２で、制御装置１０はラベル５２を正規のものとして吸着したが、事前にラベル５２に表示された情報から生産計画に合致した正規のラベルであるか否かを確認してから進めることも可能である。即ち、ラベル５２表面には生産に必要な管理情報が印刷されているので、あらかじめマークカメラ１５でラベル５２に印刷されたIDコードを読み取り、部品実装機とオンライン接続された情報システムに生産計画どおりのラベル５２に相違ないか確認をとったうえでラベルの吸着に進むこともできる。もし仮に何らかの事情で生産計画どおりのラベルと異なっていた場合には、誤ってラベルを電子部品に貼付するのを回避することができる。特に数量が限定される電子部品のような場合は1個たりとも無駄にできないので、そのような事前確認を行うのが安全である。
By the way, in step S402, the control device 10 adsorbs the label 52 as a regular one, but proceeds after confirming from the information displayed on the label 52 in advance whether it is a regular label that matches the production plan. It is also possible. That is, since the management information necessary for production is printed on the surface of the label 52, the ID code printed on the label 52 in advance is read by the mark camera 15, and the information system connected online with the component mounting machine is in accordance with the production plan. It is also possible to proceed to the adsorption of the label after confirming that there is no difference in the label 52. If the label differs from the production plan for some reason, it is possible to avoid erroneously attaching the label to the electronic component. In particular, in the case of electronic parts with limited quantities, it is safe to perform such a prior check because no single piece can be wasted.
以上、本発明の好ましい実施例について説明したが、本発明は係る特定の実施例に限定されるものではなく、特許請求の範囲に記載された本発明の要旨の範囲内で種々の変形、変更が可能である。
The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the specific embodiments, and various modifications and changes can be made within the scope of the present invention described in the claims. Is possible.
２１ ラベル保持テープ
２２、５４ テープ台紙
２３、５２ ラベル
２４、３４ 送り穴
３１、５８ 部品保持テープ
３２、５７ 電子部品
３３、６２ 収容凹部
３５ テープ
５１ 装着ノズル
５３ テープ回収孔
５６ テープガイド
５９ 実装基板
６０ 基板搬送コンベア
６１ 部品吸着部
６３ 粘着部（ラベル裏面）
６４ ラベル吸着部
Xa、Xb テープ送り方向
Y 基板搬送方向 21 Label holding tape 22, 54 Tape mount 23, 52 Label 24, 34 Feed hole 31, 58 Component holding tape 32, 57 Electronic component 33, 62 Containing recess 35 Tape 51 Mounting nozzle 53 Tape recovery hole 56 Tape guide 59 Mounting substrate 60 Substrate conveyor 61 Component adsorption part 63 Adhesive part (label back)
64 Label adsorption part
Xa, Xb Tape feed direction
Y Board transfer direction
２２、５４ テープ台紙
２３、５２ ラベル
２４、３４ 送り穴
３１、５８ 部品保持テープ
３２、５７ 電子部品
３３、６２ 収容凹部
３５ テープ
５１ 装着ノズル
５３ テープ回収孔
５６ テープガイド
５９ 実装基板
６０ 基板搬送コンベア
６１ 部品吸着部
６３ 粘着部（ラベル裏面）
６４ ラベル吸着部
Xa、Xb テープ送り方向
Y 基板搬送方向 21
64 Label adsorption part
Xa, Xb Tape feed direction
Y Board transfer direction
Claims (4)
- 装着ノズルが裏面に粘着層が形成されたラベルを吸着する工程と、
吸着した前記ラベルを部品供給装置にある実装部品の上面に圧着する工程と、
前記圧着により一体化された前記ラベルと前記実装部品を吸着する工程と、
回路基板上に移動して、前記ラベルと前記実装部品を基板上に装着する工程と、
を含むラベル付き部品の基板実装方法。 A process in which the mounting nozzle adsorbs a label having an adhesive layer formed on the back surface;
Crimping the adsorbed label on the upper surface of the mounted component in the component supply device;
Adsorbing the label and the mounting component integrated by the crimping;
Moving onto the circuit board and mounting the label and the mounting component on the board;
A method for mounting a labeled component on a board. - 前記圧着が、装着ノズルをラベル上面の同一個所を複数回に分けて加圧する動作を含むものであることを特徴とする請求項１記載のラベル付き部品の基板実装方法。 2. The method of mounting a component with a label according to claim 1, wherein the pressure bonding includes an operation of pressing the mounting nozzle at the same location on the upper surface of the label in a plurality of times.
- 前記圧着が、装着ノズルをラベル上面の異なる複数個所を加圧する動作を含むものであることを特徴とする請求項１または２記載のラベル付き部品の基板実装方法。 3. The method of mounting a labeled component on a substrate according to claim 1, wherein the pressure bonding includes an operation of pressing a mounting nozzle at a plurality of different locations on the upper surface of the label.
- 前記圧着が、装着ノズルを部品上面に押し当てながら平面方向に移動させる動作を含むことを特徴とする請求項１記載のラベル付き部品の基板実装方法。 2. The method of mounting a labeled component on a substrate according to claim 1, wherein the pressure bonding includes an operation of moving the mounting nozzle in a planar direction while pressing the mounting nozzle against the upper surface of the component.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016539757A JP6479015B2 (en) | 2014-08-07 | 2014-08-07 | Board mounting method for labeled components |
| PCT/JP2014/070904 WO2016021025A1 (en) | 2014-08-07 | 2014-08-07 | Labeled-component substrate mounting method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2014/070904 WO2016021025A1 (en) | 2014-08-07 | 2014-08-07 | Labeled-component substrate mounting method |
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| WO2016021025A1 true WO2016021025A1 (en) | 2016-02-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2014/070904 WO2016021025A1 (en) | 2014-08-07 | 2014-08-07 | Labeled-component substrate mounting method |
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| JP (1) | JP6479015B2 (en) |
| WO (1) | WO2016021025A1 (en) |
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| JPH05221439A (en) * | 1992-02-12 | 1993-08-31 | Toshiba Corp | Labeling device for electronic component |
| JPH11273816A (en) * | 1998-03-20 | 1999-10-08 | Fujitsu Ltd | Semiconductor component and semiconductor mounting device |
| JP2003078298A (en) * | 2001-07-30 | 2003-03-14 | Hewlett Packard Co <Hp> | Bolster plate, mounting method for integrated circuit chip and computer-readable form |
| JP2010027661A (en) * | 2008-07-15 | 2010-02-04 | Fuji Mach Mfg Co Ltd | Method for mounting electronic component of electronic component mounting unit, and electronic component mounting unit |
| JP2011258875A (en) * | 2010-06-11 | 2011-12-22 | Hitachi High-Tech Instruments Co Ltd | Method for mounting component of component mounting device and component mounting device |
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| JP2013115229A (en) * | 2011-11-29 | 2013-06-10 | Panasonic Corp | Component mounting method and component mounting system |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0864993A (en) * | 1994-08-24 | 1996-03-08 | Matsushita Electric Ind Co Ltd | Electronic part mounting method |
| JP3976372B2 (en) * | 1997-06-18 | 2007-09-19 | 富士機械製造株式会社 | Barcode label feeder and apparatus equipped with the same |
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2014
- 2014-08-07 JP JP2016539757A patent/JP6479015B2/en active Active
- 2014-08-07 WO PCT/JP2014/070904 patent/WO2016021025A1/en active Application Filing
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| JPH05221439A (en) * | 1992-02-12 | 1993-08-31 | Toshiba Corp | Labeling device for electronic component |
| JPH11273816A (en) * | 1998-03-20 | 1999-10-08 | Fujitsu Ltd | Semiconductor component and semiconductor mounting device |
| JP2003078298A (en) * | 2001-07-30 | 2003-03-14 | Hewlett Packard Co <Hp> | Bolster plate, mounting method for integrated circuit chip and computer-readable form |
| JP2010027661A (en) * | 2008-07-15 | 2010-02-04 | Fuji Mach Mfg Co Ltd | Method for mounting electronic component of electronic component mounting unit, and electronic component mounting unit |
| JP2011258875A (en) * | 2010-06-11 | 2011-12-22 | Hitachi High-Tech Instruments Co Ltd | Method for mounting component of component mounting device and component mounting device |
| JP2012222035A (en) * | 2011-04-05 | 2012-11-12 | Fuji Mach Mfg Co Ltd | Method and device for mounting electronic component |
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| Publication number | Publication date |
|---|---|
| JP6479015B2 (en) | 2019-03-06 |
| JPWO2016021025A1 (en) | 2017-06-22 |
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