CN114698364A

CN114698364A - Component pressure bonding device and component pressure bonding method

Info

Publication number: CN114698364A
Application number: CN202111471600.2A
Authority: CN
Inventors: 足立聪; 浜田隆二
Original assignee: Panasonic Intellectual Property Management Co Ltd
Current assignee: Panasonic Intellectual Property Management Co Ltd
Priority date: 2020-12-25
Filing date: 2021-11-30
Publication date: 2022-07-01
Also published as: JP2022101997A

Abstract

The present disclosure provides a component crimping device and a component crimping method, which can improve mounting accuracy. The component bonding device (100) is provided with a substrate moving mechanism (31), a bonding tool (34), an imaging unit (39), an imaging moving mechanism (38), and a control unit (2a) which causes the imaging unit to image the end edge of a component (5), after an edge of a component is imaged, an imaging moving mechanism is made to move an imaging range of an imaging part, the imaging part is made to image a 2 nd alignment mark (Mc) of the component, relationship information indicating a positional relationship between the edge of the component and the 2 nd alignment mark is generated and output based on the edge of the component and an imaging result of the 2 nd alignment mark, a substrate moving mechanism is made to move a substrate (3), the imaging part is made to image a 1 st alignment mark (Mb) of the substrate, and pressure contact of the component to the substrate is controlled based on the imaging results of the 1 st alignment mark and the 2 nd alignment mark.

Description

Component pressure welding device and component pressure welding method

Technical Field

The present disclosure relates to a component crimping device and the like that crimps a component to a substrate.

Background

Conventionally, as an electronic component mounting apparatus, there has been provided a component bonding apparatus for bonding an electronic component (hereinafter, simply referred to as a "component") to a substrate such as a liquid crystal panel (see patent document 1). The component pressure bonding device is provided with a punching device for punching components from the film carrier, and the components obtained by conveying the film carrier at a certain pitch and punching are pressure bonded to the liquid crystal panel. Thus, a mounting substrate, which is a substrate to which the component is pressure-bonded, is produced.

Prior art documents

Patent document

Patent document 1: japanese laid-open patent publication No. 7-106796

However, the component pressing device of patent document 1 has a problem that mounting accuracy may be lowered.

Disclosure of Invention

Problems to be solved by the invention

Therefore, the present disclosure provides a component crimping apparatus and the like capable of improving mounting accuracy.

Means for solving the problems

A component pressure bonding device according to an aspect of the present disclosure includes: a substrate moving mechanism for holding the substrate on which the 1 st alignment mark is formed and moving the substrate; a crimping tool that holds and crimps the member on which the 2 nd alignment mark is formed to the substrate; an image pickup unit that picks up an image of an object included in an image pickup range; an imaging moving mechanism that moves an imaging range of the imaging unit; and a control unit that performs control such that: causing the image pickup moving mechanism to execute movement of the image pickup range so that an end edge of the member held by the pressure bonding tool enters the image pickup range, causing the image pickup section to pick up an image with the end edge of the member included in the image pickup range as the object, causing the image pickup moving mechanism to execute movement of the image pickup range so that the 2 nd alignment mark enters the image pickup range after picking up an image of the end edge of the member when the 2 nd alignment mark is not included in the image pickup range, causing the image pickup section to pick up an image with the 2 nd alignment mark included in the image pickup range as the object, and generating and outputting relationship information indicating a positional relationship between the end edge of the member and the 2 nd alignment mark based on the image pickup results of the end edge of the member and the 2 nd alignment mark, causing the substrate moving mechanism to move the substrate so that the 1 st alignment mark enters the imaging range, causing the imaging unit to image the 1 st alignment mark included in the imaging range as the object, and controlling the pressure bonding of the component to the substrate by the substrate moving mechanism and the pressure bonding tool based on the imaging results of the 1 st alignment mark and the 2 nd alignment mark.

The general or specific aspects may be implemented as a system, a method, an integrated circuit, a computer program, or a computer-readable recording medium such as a CD-ROM, or may be implemented as any combination of a system, a method, an integrated circuit, a computer program, and a recording medium. The recording medium may be a nonvolatile recording medium.

Effects of the invention

The component crimping device of the present disclosure can achieve improvement in mounting accuracy.

Further advantages and effects in one mode of the present disclosure will become clear from the description and the accompanying drawings. These advantages and/or effects are provided by the features described in the several embodiments and the description and drawings, respectively, but not necessarily all of them are provided to obtain 1 or more than 1 identical feature.

Drawings

Fig. 1 is a diagram showing a schematic configuration of a component mounting line in the embodiment.

Fig. 2 is a plan view of the component mounting line in the embodiment.

Fig. 3 is a diagram showing a computer provided in the component mounting line in the embodiment and components controlled by the computer.

Fig. 4 is a block diagram showing a structure of the component crimping apparatus in the embodiment.

Fig. 5 is a diagram showing an example of each of a belt member provided with a plurality of components and a part of a substrate in the embodiment.

Fig. 6 is a diagram illustrating a configuration example of a blanking portion of the component supply portion in the embodiment.

Fig. 7 is a diagram illustrating a flow of a component supplied from the component supply portion to the crimping tool via the component moving portion in the embodiment.

Fig. 8 is a diagram showing an example of a process of pressing a member by the pressing tool and the stage of the substrate moving mechanism in the embodiment.

Fig. 9 is a diagram showing an example of relationship information in the embodiment.

Fig. 10 is a diagram showing an example of each of the 1 st camera and the 2 nd camera included in the imaging unit and the imaging movement mechanism in the embodiment.

Fig. 11 is a diagram illustrating a state of the 1 st camera and the component when the component is imaged as viewed from the X-axis direction in the embodiment.

Fig. 12A is a diagram illustrating an imaging example of the 1 st camera in the embodiment.

Fig. 12B is a diagram illustrating an image capturing example of the 2 nd camera in the embodiment.

Fig. 13A is a diagram illustrating an example of image capturing with an edge of a member as an object in the embodiment.

Fig. 13B is a diagram illustrating an example of image capturing with the 2 nd alignment mark as an object in the embodiment.

Fig. 14A is a diagram illustrating another example of image pickup in which an edge of a member is an object in the embodiment.

Fig. 14B is a diagram illustrating another example of image capturing with the 2 nd alignment mark as an object in the embodiment.

Fig. 15 is a flowchart showing the entire processing procedure of the component pressure bonding apparatus according to the embodiment.

Fig. 16 is a flowchart showing details of the positional relationship determination processing in step S13 of fig. 15.

Fig. 17 is a diagram for explaining the timing of the movement of the imaging unit and the imaging range in the embodiment.

Fig. 18 is a diagram showing a configuration example of a part of the image pickup movement mechanism in the modification of the embodiment.

Description of the symbols

1 parts mounting line

2 computer

2a control part

2b storage part

2c display part

3 base plate

4 electrode part

5 parts

6 electrode part

10 substrate carrying-in part

20 attachment part

30 pre-compression joint part

31 substrate moving mechanism

32-component mounting mechanism

33 parts supply part

33a supply reel

33b punched part

33c Movable workbench

33d track

34 crimping tool

35 parts moving part

35a transfer head

35b transfer workbench

36 lower bearing part

37 working table

37a adsorption hole

38 camera shooting moving mechanism

38a optical member

39 image pickup unit

39L 1 st camera

39R 2 nd camera

40 formal pressure-bonding part

50 substrate carrying-out part

60 conveying part

70 band component

91 ACF

100 parts crimping device

DL imaging range

DR imaging range

Mb 1 st alignment mark

Mc 2 nd alignment mark

Detailed Description

(insight underlying the present disclosure)

The present inventors have found that the following problems occur with the component bonding apparatus of patent document 1 described in the section "background art".

With the recent narrowing of the frame of the liquid crystal panel, the punching accuracy of the parts is required to be improved. The punching accuracy is the accuracy of the state of a member including the position of the member punched out from the film carrier. However, it is difficult to maintain the required accuracy only by the mechanical accuracy of the punching device as in patent document 1. Further, if a sensor for confirming the punching state is provided in the punching device in order to maintain the punching accuracy, the punching device may be increased in size. Therefore, if a camera for aligning the position of the component with the substrate is used as the sensor for confirming the punching state, the punching device can be prevented from being enlarged. However, in this case, it is sometimes necessary to move the camera in order to align the component with the substrate. As a result, the accuracy of the positional alignment of the component and the substrate cannot be sufficiently obtained due to the movement of the camera, and the mounting accuracy may be lowered.

In order to solve the above problem, a component bonding apparatus according to one aspect of the present disclosure includes: a substrate moving mechanism for holding the substrate with the 1 st alignment mark and moving the substrate; a crimping tool that holds and crimps the member on which the 2 nd alignment mark is formed to the substrate; an image pickup unit that picks up an image of an object included in an image pickup range; an imaging moving mechanism that moves an imaging range of the imaging unit; and a control unit that performs control such that: causing the image pickup moving mechanism to execute movement of the image pickup range so that an end edge of the member held by the pressure bonding tool enters the image pickup range, causing the image pickup section to pick up an image with the end edge of the member included in the image pickup range as the object, causing the image pickup moving mechanism to execute movement of the image pickup range so that the 2 nd alignment mark enters the image pickup range after picking up an image of the end edge of the member when the 2 nd alignment mark is not included in the image pickup range, causing the image pickup section to pick up an image with the 2 nd alignment mark included in the image pickup range as the object, and generating and outputting relationship information indicating a positional relationship between the end edge of the member and the 2 nd alignment mark based on the image pickup results of the end edge of the member and the 2 nd alignment mark, causing the substrate moving mechanism to move the substrate so that the 1 st alignment mark enters the imaging range, causing the imaging unit to image the 1 st alignment mark included in the imaging range as the object, and controlling the pressure bonding of the component to the substrate by the substrate moving mechanism and the pressure bonding tool based on the imaging results of the 1 st alignment mark and the 2 nd alignment mark. For example, the component pressure bonding apparatus may further include: and a punching portion that sequentially punches the respective members of the plurality of members from a belt member provided with the plurality of members, wherein the pressure bonding tool holds the members punched by the punching portion and is pressure bonded to the substrate.

This eliminates the need to provide a sensor for checking the punching state of the member in the punching portion, and thus the punching portion can be prevented from being enlarged. That is, in the component pressing device according to one aspect of the present disclosure, the imaging portion can be used as a sensor for checking the punching state of the component, and thus the punching portion can be prevented from being increased in size. Specifically, the imaging unit is used to control the pressing of the component against the substrate by the substrate moving mechanism and the pressing tool. For example, in the imaging of the 1 st alignment mark and the 2 nd alignment mark for controlling the alignment of the component and the substrate, an imaging unit is used. In the component pressing device according to one aspect of the present disclosure, the imaging unit is further caused to image the edge of the component, and the relationship information is generated and output, whereby the imaging unit can be used as a sensor for checking the punching state of the component. Therefore, since the punching portion does not need to be provided with a sensor for checking the punching state of the member, the punching portion can be prevented from being enlarged.

Here, in order to confirm the punching state of the component, it is necessary to separately image the end edge of the component and the 2 nd alignment mark, but when it is not possible to simultaneously image them, it is necessary to move the imaging range and to individually image them. In such a case, for example, if the 2 nd alignment mark is imaged first, and then the imaging range is moved to image the edge of the component, the imaging range must be further moved to return to the home position in order to align the component with the substrate to be performed next. In this position alignment, imaging of the 1 st alignment mark is required, and in order to ensure accuracy of the position alignment, it is desirable that the imaging ranges be located at the same position in imaging of the 1 st alignment mark and imaging of the 2 nd alignment mark. However, if the reproducibility of the position is insufficient even if the imaging range is returned to the original position, the accuracy of the position alignment of the component and the substrate is degraded.

Therefore, in the component pressing device according to one aspect of the present disclosure, when the edge of the component and the 2 nd alignment mark cannot be simultaneously imaged, the edge of the component is imaged first, and then the 2 nd alignment mark is imaged. As a result, the imaging range when imaging the 2 nd alignment mark is performed does not need to be moved, and the 1 st alignment mark of the substrate can be brought into the imaging range by moving the substrate, thereby imaging the 1 st alignment mark. Therefore, in the imaging of the 1 st alignment mark and the imaging of the 2 nd alignment mark, the positions of the imaging ranges are equal, and therefore the accuracy of the positional alignment of the component and the substrate can be sufficiently ensured. That is, the mounting accuracy can be improved. As a result, the punching state of the member can be confirmed while suppressing an increase in size of the punching portion, and the mounting accuracy can be improved.

Further, the control unit may control punching of the member from the belt member by the punching unit by outputting the relationship information.

This can automatically maintain the positional relationship between the end edge of the member and the 2 nd alignment mark fixed, and can easily improve the punching accuracy of the member.

Further, the control unit may generate the relationship information indicating a distance between the end edge of the member and the 2 nd alignment mark as the positional relationship, and notify that a defect has occurred in the punching unit when the distance is not within a predetermined allowable range.

This can prompt the operator to check and repair the punched portion, thereby improving punching accuracy.

Further, the imaging moving mechanism may not move the imaging range of the imaging unit during a period from the imaging of the 2 nd alignment mark by the imaging unit to the imaging of the 1 st alignment mark by the imaging unit.

Thus, the positions of the imaging ranges are equal in the imaging of the 1 st alignment mark and the imaging of the 2 nd alignment mark, and therefore, the accuracy of the positional alignment of the component and the substrate can be sufficiently ensured. That is, the mounting accuracy can be improved.

Hereinafter, the embodiments will be specifically described with reference to the drawings.

The embodiments described below are all illustrative or specific examples. The numerical values, shapes, materials, components, arrangement positions and connection manners of the components, steps, and the order of the steps, which are described in the following embodiments, are merely examples, and the present disclosure is not limited thereto. Further, among the components in the following embodiments, components that are not described in an independent claim showing the highest concept will be described as arbitrary components. The drawings are schematic and not necessarily strictly shown. In the drawings, the same structural members are denoted by the same reference numerals. In the following embodiments, substantially the same or similar descriptions are used. For example, substantially the same means not only completely the same but also substantially the same, i.e., including an error of a few% degree, for example. Further, the substantially same meaning is the same within a range where the effect based on the present disclosure can be achieved. The same applies to other expressions using "approximately".

(embodiment mode)

[ schematic Structure of component mounting line ]

Fig. 1 is a diagram showing a schematic configuration of a component mounting line in the present embodiment.

The component mounting line 1 in the present embodiment is a system for producing a mounting substrate by mounting components 5 on a substrate 3 which is a display panel such as a liquid crystal panel or an organic EL (Electro-Luminescence) panel. The component 5 is an electronic component such as a driver circuit, for example. Specifically, as shown in fig. 1, the component mounting line 1 includes a substrate loading portion 10, an attaching portion 20, a pre-pressure bonding portion 30, a main pressure bonding portion 40, and a substrate unloading portion 50. The substrate loading unit 10, the pasting unit 20, the pre-pressure bonding unit 30, the main pressure bonding unit 40, and the substrate unloading unit 50 are connected in this order.

The substrate loading unit 10 receives a rectangular substrate 3 loaded by an operator or another device on the upstream side. Then, the substrate 3 is carried out to the downstream-side bonding section 20.

The bonding section 20 receives the substrate 3 carried out from the substrate carrying-in section 10, and bonds the adhesive members to the plurality of electrode sections 4 located on the periphery of the substrate 3. Then, the substrate 3 with the adhesive member attached thereto is carried out to the pre-compression part 30. Each of the plurality of electrode portions 4 is formed of, for example, a plurality of electrodes.

The pre-compression part 30 receives the substrate 3 carried out of the attachment part 20, and mounts and pressure-bonds the component 5 on a portion of the substrate 3 to which the adhesive member is attached. Then, the substrate 3 to which the component 5 is pressure-bonded is carried out to the main pressure-bonding section 40. In addition, the crimping performed by the pre-crimping portion 30 is also referred to as pre-crimping.

The main pressure-bonding section 40 receives the substrate 3 carried out of the pre-pressure-bonding section 30, and performs main pressure-bonding (also referred to as thermocompression bonding) on the component 5 pre-pressed and bonded to the substrate 3. Then, the substrate 3 subjected to the final pressure bonding is carried out to the substrate carrying-out section 50.

The substrate carrying-out section 50 receives the substrate 3 carried out from the main pressure-bonding section 40. The substrate 3 received by the substrate carry-out section 50 is carried out to the downstream side.

In this manner, the component mounting line 1 performs component mounting work for mounting components 5 on the plurality of electrode portions 4 provided on the periphery of the carried-in substrate 3, respectively, and carries out a mounting substrate as the substrate 3 on which the components 5 are mounted, from the substrate carrying-out portion 50.

[ detailed Structure of component mounting line ]

Fig. 2 is a plan view of the component mounting line 1 in the present embodiment. Specifically, fig. 2 shows the structure of the component mounting line 1 as viewed from above. In the present embodiment, the substrate conveyance direction is referred to as the X-axis direction, the vertical direction is referred to as the Z-axis direction, and the depth direction, which is a direction perpendicular to the X-axis direction and the Z-axis direction, is referred to as the Y-axis direction. The negative side and the positive side in the X-axis direction correspond to the upstream side and the downstream side in the substrate conveyance direction, the negative side and the positive side in the Z-axis direction correspond to the lower side and the upper side in the vertical direction, and the negative side and the positive side in the Y-axis direction correspond to the front side and the rear side, or the front side and the rear side in the depth direction, respectively.

The substrate loading unit 10 includes a base 1a on which the loaded substrate 3 is placed. A table 11 on which the substrate 3 is placed is provided on the base 1a of the substrate loading unit 10. The table 11 is raised and lowered in the Z-axis direction with respect to the base 1 a. Further, a plurality of suction holes 11a are provided on the upper surface of the table 11. The table 11 is configured to vacuum-adsorb and hold the substrate 3 loaded on the table 11 by a suction device such as a pump not shown from the adsorption hole 11a by an operator or another device on the upstream side.

The attachment unit 20 has a function of performing an attachment work (in other words, an attachment process) of attaching an ACF (Anisotropic Conductive Film) as an adhesive member to the electrode portion 4 of the substrate 3. In addition, the ACF is also called an anisotropic conductive adhesive, and is a member for electrically conducting the electrode portion 4 and the component 5 of the substrate 3. The bonding section 20 includes a substrate moving mechanism 21 and a bonding mechanism 22.

The substrate moving mechanism 21 is a mechanism for moving the substrate 3. The substrate moving mechanism 21 includes, for example, an X-axis table movable in the X-axis direction, a Y-axis table movable in the Y-axis direction, a Z-axis table movable in the Z-axis direction, and a table 23. In the substrate moving mechanism 21, an X-axis table, a Y-axis table, a Z-axis table, and a table 23 are provided on the base 1b in this order from below.

The Y-axis table extends in the Y-axis direction and freely moves on the X-axis table along the X-axis direction. The Z-axis table is movable on the Y-axis table in the Y-axis direction, and the table 23 provided on the upper portion is raised and lowered in the Z-axis direction and rotated around the Z-axis.

Further, a plurality of suction holes 23a are provided in the upper surface of the table 23, and the table 23 holds the substrate 3 placed on the upper surface thereof by vacuum suction. In this manner, the substrate moving mechanism 21 moves the substrate 3 in the horizontal plane (specifically, the X-axis direction and the Y-axis direction) while holding the substrate by suction, and moves the substrate up and down in the vertical direction (specifically, the Z-axis direction) and rotates the substrate around the Z-axis.

The sticking mechanism 22 includes, for example, 2 sticking heads arranged in the X-axis direction above the base 1 b. Each of the bonding heads includes a supply unit for supplying an ACF and a bonding tool for bonding the ACF to the substrate 3. The 2 attaching heads attach ACFs at positions corresponding to the plurality of electrode portions 4 on the substrate 3, respectively. Further, the sticking support table is provided at a lower position corresponding to each of the 2 sticking heads.

The pre-pressure bonding section 30 performs a pre-pressure bonding step of mounting the component 5 on a region (i.e., a pressure bonding target portion) of the substrate 3 to which the ACF is attached and performing pre-pressure bonding. The pre-pressure part 30 includes a substrate moving mechanism 31, a component mounting mechanism 32, a component supplying part 33, and a component moving part 35.

The substrate moving mechanism 31 has the same structure as the substrate moving mechanism 21 of the attaching portion 20. Specifically, the substrate moving mechanism 31 has a table 37 that holds the substrate 3. A plurality of suction holes 37a are provided in the upper surface of the table 37. The substrate moving mechanism 31 holds the substrate 3 placed on the stage 37 by vacuum suction through the suction holes 37 a. The substrate moving mechanism 31 has a function of moving the table 37 for holding the substrate 3 by suction in a horizontal plane, moving up and down, and rotating around the Z axis. The substrate moving mechanism 31 moves and rotates the stage 37 to position the ACF-attached region of the substrate 3 to be sucked and held above the lower receiving portion 36 serving as a backup stage of the component mounting mechanism 32. In addition, a 1 st alignment mark described later is formed on the substrate 3. That is, the substrate moving mechanism 31 in the present embodiment holds the substrate 3 on which the 1 st alignment mark is formed, and moves the substrate 3.

The component supply unit 33 is provided to protrude from the rear portion of the base 1b on the rear side (i.e., the Y-axis direction positive side) of the component mounting mechanism 32. For example, the component supply unit 33 includes a supply reel 33a around which a Tape member such as TCP (Tape carrier package) is wound, a punched portion 33b, a movable table 33c, and a rail 33 d. The component supply unit 33 sequentially supplies the components 5 from the tape member by moving these components.

The component moving unit 35 holds the component 5 supplied from the component supply unit 33 and moves the component to the pressure bonding tool 34 included in the component mounting mechanism 32.

The component mounting mechanism 32 is provided on the base 1b, and includes a pressure bonding tool 34 and a lower receiving portion 36.

The lower receiving portion 36 supports a pressure-bonding target portion, which is a predetermined portion of the substrate 3 held by the table 37, from below. The pressure-bonding target portion is a portion where the ACF is attached to the edge of the substrate 3. That is, the lower receiving portion 36 supports the edge of the substrate 3 of the member 5 to be pressed from below the substrate 3.

The pressure welding tool 34 holds the member 5, and presses the member 5 against the substrate 3 held by the table 37. The member 5 is formed with a 2 nd alignment mark described later. That is, the pressure bonding tool 34 in the present embodiment holds the component 5 on which the 2 nd alignment mark is formed, and pressure bonds the component 5 to the substrate 3. Specifically, the crimping tool 34 is raised and lowered in the Z-axis direction, and the component 5 moved by the component moving section 35 is sucked (i.e., picked up) from above. Then, the pressure bonding tool 34 mounts the sucked member 5 on the ACF, presses the lower receiving portion 36 together with the substrate 3, and presses the member 5 against the substrate 3. For example, the crimping tool 34 crimps the component 5 to the substrate 3 in a state of being heated to about 80 ℃. The pre-pressure contact portion 30 may be provided with a mechanism for rotating the direction of the substrate 3 held by the substrate moving mechanism 31 by 90 degrees.

The main press-bonding section 40 performs a main press-bonding step (i.e., a thermocompression bonding step) of main press-bonding (i.e., thermocompression bonding) the component 5, which is pre-pressed to the substrate 3 by the pre-press-bonding section 30, to the substrate 3. Thereby, the electrode portion 4 and the component 5 formed on the substrate 3 are electrically connected via the ACF. The main pressure-bonding section 40 includes a substrate moving mechanism 41 and a pressure-bonding mechanism 42.

The substrate moving mechanism 41 has the same structure as the substrate moving mechanism 21 of the attaching unit 20. Specifically, the substrate moving mechanism 41 has a table 49. A plurality of suction holes 49a are provided in the upper surface of the table 49. The substrate moving mechanism 41 holds the substrate 3 placed on the stage 49 by vacuum suction through the suction holes 49 a. The substrate moving mechanism 41 has a function of moving the table 49 for sucking and holding the substrate 3 in a horizontal plane, moving up and down in the vertical direction, and rotating around the Z axis. The substrate moving mechanism 41 positions the region of the substrate 3 to be sucked and held, to which the component 5 is to be bonded, above the lower receiving portion 46 of the pressure bonding mechanism 42 by the movement and rotation of the table 49.

The pressure bonding mechanism 42 is provided on the base 1b, and includes a pressure bonding tool 43 and a lower receiving portion 46.

The pressure bonding tool 43 is heated, and presses the component 5 of the substrate 3 supported by the lower receiving portion 46 toward the lower receiving portion 46. For example, the crimping tool 43 presses the member 5 in a state of being heated to about 200 ℃. Thereby, the component 5 is formally pressure-bonded, and the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF.

The substrate carrying-out section 50 has a function of holding the substrate 3 carried from the main pressure-bonding section 40 on the table 51 by vacuum suction. The substrate 3 held by the substrate carry-out section 50 is carried out to another device on the downstream side or taken out from the table 51 by an operator.

The table 51 is raised and lowered in the Z-axis direction with respect to the base 1 c. Further, a plurality of suction holes 51a are provided in the upper surface of the table 51, and the table 51 holds the substrate 3 transferred from the main bonding part 40 by vacuum suction on the upper surface thereof.

The conveying unit 60 is a device for conveying the substrate 3. Specifically, the transfer unit 60 has a function of transferring (transferring) the substrate 3 carried into the substrate carrying-in unit 10 to the attaching unit 20, the pre-pressure-bonding unit 30, the main pressure-bonding unit 40, and the substrate carrying-out unit 50 in this order. The conveying unit 60 is disposed in a front region (i.e., on the Y-axis direction negative side) of the sticking unit 20, the pre-pressure-bonding section 30, and the main pressure-bonding section 40.

The transfer unit 60 includes a substrate transfer mechanism 62A, a substrate transfer mechanism 62B, a substrate transfer mechanism 62C, and a substrate transfer mechanism 62D, which are arranged in this order from the upstream side, on a moving base 61 extending in the X-axis direction across the base 1a, the base 1B, and the base 1C.

Each of the substrate transport mechanisms 62A to 62D includes a

base

63 and 1 or more arm units 64. In the present embodiment, a case where each of the substrate transfer mechanisms 62A to 62D includes 2 arm units 64 is exemplified.

The base 63 is provided on the moving base 61 and is movable in the X-axis direction. On the base 63, 2 arm units 64 are provided in a row in the X-axis direction. The arm unit 64 vacuum-adsorbs the substrate 3 from above.

The substrate transport mechanisms 62A to 62D move to the substrate delivery positions of the substrates 3 held by the vacuum suction tables 11, 23, 37, 49, and 51 from above, and receive or deliver the substrates 3 from the tables 11, 23, 37, 49, and 51 that are raised and lowered. For example, the substrate transfer mechanism 62A receives the substrate 3 placed on the table 11 of the substrate loading unit 10 and delivers the substrate to the table 23 of the pasting unit 20. For example, the substrate conveying mechanism 62B receives the substrate 3 from the table 23 of the sticking unit 20 and delivers the substrate to the table 37 of the pre-pressure bonding unit 30. For example, the substrate transport mechanism 62C receives the substrate 3 from the table 37 of the pre-compression bonding section 30 and delivers the substrate to the table 49 of the main bonding section 40. For example, the substrate transport mechanism 62D receives the substrate 3 from the table 49 of the main bonding unit 40 and delivers the substrate to the table 51 of the substrate unloading unit 50.

Fig. 3 is a diagram showing a computer provided in the component mounting line 1 and each component controlled by the computer.

As shown in fig. 3, the component mounting line 1 includes a computer 2. The computer 2 is communicably connected to, for example, the sticking portion 20, the pre-pressure-bonding portion 30, the main pressure-bonding portion 40, the conveying portion 60, and the like through, for example, control lines, and controls these respective portions. The computer 2 includes a control unit 2a, a storage unit 2b, and a display unit 2 c.

The display unit 2c displays images, characters, and the like, and is configured by, for example, a liquid crystal display, a plasma display, an organic EL (Electro-Luminescence) display, and the like. The display unit 2c is not limited to these displays.

The storage section 2b stores various data necessary for component mounting work such as the size of the substrate 3, the type of the component 5 mounted on the substrate 3, the mounting position, the mounting direction, and the timing of transferring the substrate 3, and a control program executed by the control section 2 a. The storage unit 2b is implemented by, for example, a ROM (Read Only Memory), a RAM (Random Access Memory), or the like.

The control unit 2a controls the substrate moving mechanism 21 of the bonding unit 20, the substrate moving mechanism 31 of the pre-pressure bonding unit 30, the substrate moving mechanism 41 of the main pressure bonding unit 40, and the conveying unit 60, and performs a substrate transfer operation of transferring the substrate 3 between the respective units to the next step. The transfer of the substrate 3 from the upstream side to the downstream side in the substrate transfer operation is performed synchronously between the respective portions.

For example, the control unit 2a controls the attachment unit 20 to change the orientation and position of the substrate 3 held by the substrate moving mechanism 21, changes the intervals between the plurality of attachment heads by the head moving motor, and causes the attachment unit 20 to perform the attachment operation of attaching the ACF to the substrate 3 by the attachment mechanism 22.

Further, for example, the control section 2a controls the pre-compression section 30. That is, the controller 2a changes the orientation and position of the substrate 3 held by the substrate moving mechanism 31, and causes the component mounting mechanism 32 to perform the preliminary press-bonding of the component 5 to the substrate 3. At this time, the control section 2a may correct or change the position of the substrate 3 based on the result of the imaging performed by the imaging section 39 provided in the pre-compression section 30. The imaging range of the imaging unit 39 is moved by the imaging moving mechanism 38. The controller 2a controls the component supply unit 33 and the component moving unit 35 to move the component 5 supplied from the component supply unit 33 toward the component mounting mechanism 32.

For example, the controller 2a controls the main pressure-bonding unit 40 to change the orientation and position of the substrate 3 held by the substrate moving mechanism 41, and causes the pressure-bonding mechanism 42 to perform main pressure-bonding on the component 5 to be pressure-bonded to the substrate 3.

The control unit 2a controls the display unit 2c to display images, characters, and the like on the display unit 2 c.

The control unit 2a is realized by, for example, a control program stored in the storage unit 2b for controlling each unit and each mechanism of the component mounting line 1, and a processor such as a cpu (central Processing unit) for executing the control program.

[ Structure of component crimping apparatus ]

Fig. 4 is a block diagram showing the structure of the component crimping apparatus 100 in the present embodiment.

The component pressure bonding apparatus 100 is constituted by the pre-compression section 30 in the component mounting line 1 and the control section 2a of the computer 2.

Specifically, the component bonding apparatus 100 includes a control unit 2a, a component supply unit 33, a component moving unit 35, a bonding tool 34, a lower receiving unit 36, a substrate moving mechanism 31, an imaging moving mechanism 38, and a 1 st camera 39L and a 2 nd camera 39R.

The imaging unit 39 is composed of a 1 st camera 39L and a 2 nd camera 39R. The 1 st camera 39L and the 2 nd camera 39R each image an object included in the imaging range. The imaging movement mechanism 38 moves the imaging ranges of the 1 st camera 39L and the 2 nd camera 39R, respectively. The imaging movement mechanism 38 moves the imaging ranges of the 1 st camera 39L and the 2 nd camera 39R to adjust the distance between the imaging ranges. Further, the imaging movement mechanism 38 moves the imaging ranges of the 1 st camera 39L and the 2 nd camera 39R in the Y axis direction. In addition, the distance between their imaging ranges is also referred to as the optical system pitch or the camera pitch. For example, the imaging movement mechanism 38 in the present embodiment moves the 1 st camera 39L and the 2 nd camera 39R to move their imaging ranges.

The controller 2a controls the substrate moving mechanism 31, the component supplying unit 33, the pressure bonding tool 34, the component moving unit 35, the imaging moving mechanism 38, and the 1 st camera 39L and the 2 nd camera 39R.

[ supply of parts ]

Fig. 5 is a view showing an example of each of the tape member provided with the plurality of components 5 and a part of the substrate 3.

As shown in fig. 5 (a), the belt member 70 includes a plurality of components 5. These plurality of members 5 are arranged in the longitudinal direction of the belt member 70, and are provided at positions spaced apart from each other by a predetermined interval. The belt member 70 is a member in which a plurality of members 5 are mounted on a flexible resin film, and is also called a film carrier. For example, the belt member 70 is a TCP. A TCP or COF (Chip on Film) in a single Chip state is punched out from the tape member 70 as the component 5. A plurality of sprocket holes 71 aligned in a row along the longitudinal direction of the belt member 70 are formed at both ends of the belt member 70 in the width direction.

The member 5 is formed with an electrode portion 6 including a plurality of electrodes and a pair of second alignment marks Mc. The material of the component 5 is not particularly limited, but is, for example, a resin such as polyimide.

Each electrode included in the electrode portion 6 is a conductive member such as a metal provided on the surface of the member 5. The plurality of electrodes are arranged in line, for example, along the width direction of the belt member 70.

The pair of 2 nd alignment marks Mc are marks for acquiring the positional relationship between the substrate 3 and the component 5, respectively. For example, the pair of 2 nd alignment marks Mc are each a cross-shaped mark and are arranged so as to sandwich the electrode portion 6 along the width direction of the belt member 70.

As shown in fig. 5 (b), an electrode portion 4 including a plurality of electrodes and a pair of 1 st alignment marks Mb are formed on the substrate 3. Each electrode included in the electrode portion 4 is a conductive member such as a metal provided on the surface of the substrate 3. The plurality of electrodes are arranged in line, for example, along the X-axis direction.

The pair of 1 st alignment marks Mb are marks for acquiring the positional relationship between the substrate 3 and the component 5. For example, the pair of 1 st alignment marks Mb are each a cross-shaped mark and are arranged so as to sandwich the electrode portion 4 along the X-axis direction. The ACF 91 described above is attached to the electrode portion 4.

Fig. 6 is a diagram illustrating a configuration example of the punched portion 33b of the component supply portion 33. The punching portion 33b sequentially punches the plurality of components 5 from the belt member 70 while conveying the belt member 70 at a constant pitch. For example, the punching portion 33b includes a sprocket 331 that engages with a sprocket hole 71 provided in the belt member 70, a motor 332 that rotates and drives the sprocket 331, a punch 333 that punches the component 5 out of the belt member 70, and a die 334. The motor 332 is controlled by the control unit 2a to rotate the drive sprocket 331 to transport the belt members 70 at a predetermined pitch. In addition, the motor 332 can finely adjust the conveying amount of the belt member 70. The component 5 punched out of the belt member 70 by the punching portion 33b is placed on the movable table 33 c.

Fig. 7 is a diagram illustrating a flow of the member 5 supplied from the member supply portion 33 to the crimping tool 34 via the member moving portion 35.

The component supply unit 33 includes a punched portion 33b, a supply reel 33a, a Cover Tape (Cover Tape) recovery portion 336, a winding portion 335, a movable table 33c, and a rail 33 d.

The tape member 70 is wound around the supply reel 33 a. The leading end side of the tape member 70 is drawn out from the supply reel 33a by the punched portion 33b in a tensioned manner. The cover tape recovery portion 336 recovers the cover tape 72 peeled off from the tape member 70. The winding portion 335 winds and collects the remaining portion of the tape member 70. The remainder of the tape member 70 is the remainder after stripping the cover tape 72 from the tape member 70 and blanking the parts 5. The movable table 33c receives and holds the member 5 punched by the punched portion 33b from the punched portion 33b, and moves along the rail 33 d.

The component moving unit 35 includes a transfer head 35a and a transfer table 35 b. The transfer head 35a receives the component 5 held on the movable table 33c moving along the rail 33d from the movable table 33 c. Then, the transfer head 35a moves toward the pressure bonding tool 34 while sucking and holding the component 5. The transfer table 35b receives the component 5 sucked and held by the transfer head 35a from the transfer head 35a moved to the pressure bonding tool 34 side. The transfer table 35b that has received the component 5 moves below the pressure bonding tool 34.

The pressure bonding tool 34 holds the component 5 placed on the transfer table 35b by suction. Here, the imaging unit 39 configured by the 1 st camera 39L and the 2 nd camera 39R described above images the member 5 held by the pressure bonding tool 34 via the lower receiving unit 36. Further, the imaging unit 39 images the edge of the substrate 3 held on the table 37 of the substrate moving mechanism 31 via the lower receiving unit 36. The table 37 performs position alignment of the component 5 and the substrate 3 based on the result of imaging of the edge of the component 5 and the substrate 3, respectively. Then, the crimping tool 34 crimps the component 5 with respect to the substrate 3 after the position alignment.

As described above, the component supply section 33 of the component pressure bonding device 100 in the present embodiment includes the punching section 33b that sequentially punches out each of the plurality of components 5 from the belt member 70 in which the plurality of components 5 are provided. The pressure bonding tool 34 holds the member 5 punched out by the punching portion 33b, and pressure bonds the member 5 to the substrate 3.

[ crimping of parts ]

Fig. 8 is a diagram showing an example of the step of pressing the component 5 by the pressing tool 34 and the table 37 of the substrate moving mechanism 31.

First, as shown in fig. 8 (a), the transfer table 35b conveys the member 5 toward the pressure bonding tool 34 and the lower receiving portion 36. Next, as shown in fig. 8 (b), the transfer table 35b is stopped below the pressure bonding tool 34, that is, between the pressure bonding tool 34 and the lower receiving portion 36. Next, as shown in fig. 8 (c), the crimping tool 34 is lowered, and the member 5 is held. Thereby, the component 5 is delivered from the transfer table 35b to the pressure bonding tool 34. Then, as shown in fig. 8 (d), the pressure bonding tool 34 is raised while holding the member 5.

Next, as shown in fig. 8 (e), the transfer table 35b having the component 5 delivered thereto is retracted from below the pressure bonding tool 34. Then, as shown in fig. 8 (f), the imaging unit 39 images the component 5. In this imaging, the edge of the component 5 and the 2 nd alignment mark Mc are imaged. The imaging result is used to confirm the punching accuracy of the component 5 by the punching portion 33 b. Further, the imaging result of the 2 nd alignment mark Mc is used for the positional alignment of the component 5 and the substrate 3. The pressure bonding tool 34 may lower the member 5 to the focal position of the imaging unit 39 or its vicinity. The imaging unit 39 may change the focal position. Next, as shown in fig. 8 (g), when the pressure bonding tool 34 is lowered, the pressure bonding tool 34 is raised, and the table 37 holding the substrate 3 is moved. As shown in fig. 8 (h), if the edge of the substrate 3 reaches below the pressure bonding tool 34 by the movement of the table 37, the table 37 is lowered. Thereby, the edge of the substrate 3 is supported from below by the lower receiving portion 36. At this time, the imaging unit 39 images the 1 st alignment mark Mb formed on the substrate 3. Then, the table 37 adjusts the position of the substrate 3 based on the imaging results of the 1 st alignment mark Mb and the 2 nd alignment mark Mc. That is, the alignment of the component 5 and the substrate 3 is performed.

Next, as shown in fig. 8 (i), the pressure bonding tool 34 starts to descend in order to mount the component 5 to the edge of the substrate 3. Then, as shown in fig. 8 (j), the pressing tool 34 presses the member 5 against the edge of the substrate 3. As a result, the component 5 is pre-pressed against the substrate 3, and the electrode portions 6 of the component 5 and the electrode portions 4 of the substrate 3 are electrically conducted through the ACF 91 attached to the substrate 3. Thereafter, as shown in fig. 8 (k), the pressure bonding tool 34 is raised, and the substrate 3 to which the component 5 is pre-pressed is carried out by moving the table 37.

[ relationship information ]

The control unit 2a in the present embodiment generates and outputs relationship information indicating punching accuracy of the component 5 based on the result of imaging of the component 5 by the imaging unit 39 in the situation shown in fig. 8 (f).

Fig. 9 is a diagram showing an example of the relationship information.

In the relationship information, the positional relationship between the pair of 2 nd alignment marks Mc and the edge of the member 5 positioned around the 2 nd alignment mark Mc is expressed as the punching accuracy of the member 5 for each of the pair of 2 nd alignment marks Mc. Specifically, the relationship information expresses the distance between the end edge of the component 5 and the 2 nd alignment mark Mc as a positional relationship. More specifically, the relationship information indicates the distance XL and the distance YL of the 2 nd alignment mark Mc for the positive side in the X-axis direction and the distance XR and the distance YR of the 2 nd alignment mark Mc for the negative side in the X-axis direction.

The distance XL is a distance between the 2 nd alignment mark Mc on the positive side in the X-axis direction and the cutting line of the component 5 along the Y-axis direction closest to the 2 nd alignment mark Mc. The distance YL is a distance between the 2 nd alignment mark Mc on the X-axis direction positive side and the cutting line of the component 5 along the X-axis direction closest to the 2 nd alignment mark Mc.

The cut line is one side of the member 5 generated by punching the member 5 by the punching portion 33 b. The edge of the member 5 around the 2 nd alignment mark Mc located on the positive side in the X-axis direction is formed by a cut line located on the negative side in the Y-axis direction and extending in the X-axis direction and a cut line located on the positive side in the X-axis direction and extending in the Y-axis direction.

Similarly, the distance XR is a distance between the 2 nd alignment mark Mc on the X-axis direction negative side and the cut line of the component 5 along the Y-axis direction closest to the 2 nd alignment mark Mc. The distance YR is a distance between the 2 nd alignment mark Mc on the X-axis direction negative side and the cutting line of the component 5 along the X-axis direction closest to the 2 nd alignment mark Mc. The edge of the member 5 around the 2 nd alignment mark Mc located on the negative side in the X-axis direction is formed by a cut line located on the negative side in the Y-axis direction and extending in the X-axis direction and a cut line located on the negative side in the X-axis direction and extending in the Y-axis direction.

Such relationship information is fed back to the blanking portion 33b, for example. That is, the control unit 2a in the present embodiment controls the punching of the member 5 from the belt member 70 by the punching unit 33b by outputting the relationship information.

For example, when the distance YL and the distance YR deviate from the reference distance, the punching portion 33b shifts the punching position of the component 5 in the longitudinal direction of the belt member 70 so that the distances approach the reference distance. Alternatively, the punching portion 33b adjusts the punching interval of the member 5. When one of the distance XL and the distance XR is shorter than the reference distance and the other is longer than the reference distance, the punching portion 33b shifts the punching position of the component 5 in the width direction of the belt member 70 so that the distances approach the reference distance.

[ details of imaging by the imaging unit ]

Fig. 10 is a diagram showing an example of each of the 1 st camera 39L and the 2 nd camera 39R included in the imaging unit 39 and the imaging moving mechanism 38 in the present embodiment.

The 1 st camera 39L and the 2 nd camera 39R are disposed below the lower receiving portion 36, and capture an image upward in the Z-axis direction. The 1 st camera 39L and the 2 nd camera 39R are arranged in the X-axis direction.

The imaging movement mechanism 38 moves the imaging ranges of the 1 st camera 39L and the 2 nd camera 39R by moving them, for example. The imaging movement mechanism 38 changes the distance between the 1 st camera 39L and the 2 nd camera 39R, that is, the camera pitch, by moving the cameras in the X axis direction. Further, the imaging movement mechanism 38 moves the 1 st camera 39L and the 2 nd camera 39R in the Y axis direction.

When the component 5 is imaged, the pressure bonding tool 34 holds the component 5 by suction in a state in which the electrode portion 6 including a plurality of electrodes formed on the component 5 and the pair of 2 nd alignment marks Mc arranged to sandwich the electrode portion 6 face downward. The pair of 2 nd alignment marks Mc are disposed to face the lower receiving portion 36.

The 1 st camera 39L and the 2 nd camera 39R pick up images of the pair of 2 nd alignment marks Mc of the member 5 and 2 end edges of the member 5 from below via the 2 through portions h1 of the lower receiving portion 36. The 2 through portions h1 are holes that are arranged in the X axis direction and open on the upper surface of the lower receiving portion 36, for example, and penetrate the lower receiving portion 36 in the Z axis direction. The 1 st camera 39L images the 2 nd alignment mark Mc on the X-axis direction positive side of the component 5 and the edge of the component 5 positioned around the 2 nd alignment mark Mc via the through portion h1 on the X-axis direction positive side. The 2 nd camera 39R images the 2 nd alignment mark Mc on the X-axis direction negative side of the component 5 and the edge of the component 5 positioned around the 2 nd alignment mark Mc through the X-axis direction negative side penetration portion h 1. Further, although the through portion h1 in the present embodiment is a hole, it may be a groove recessed toward the Y axis direction positive side, or may be formed of a member having translucency such as glass.

When imaging the substrate 3, the edge of the substrate 3 held by the table 37 is arranged above the lower receiving portion 36. Further, on the upper surface of the edge portion, an electrode portion 4 formed of a plurality of electrodes and a pair of 1 st alignment marks Mb arranged to sandwich the electrode portion 4 are formed. Further, an ACF 91 is attached to the upper surface of the edge portion so as to cover the electrode portion 4.

The 1 st camera 39L and the 2 nd camera 39R pick up images of the pair of 1 st alignment marks Mb of the substrate 3 from below via the 2 through parts h1 of the lower receiving part 36. Further, the portion of the substrate 3 where the pair of 1 st alignment marks Mb are formed has optical transparency. Therefore, the 1 st alignment mark Mb formed on the upper surface of the substrate 3 is imaged through the portion having the light transmittance. The 1 st camera 39L captures an image of the 1 st alignment mark Mb on the X-axis direction positive side of the substrate 3 via the X-axis direction positive side penetration portion h 1. The 2 nd camera 39R captures the 1 st alignment mark Mb on the X-axis direction negative side of the substrate 3 via the X-axis direction negative side penetration portion h 1.

Fig. 11 is a diagram showing a state of the 1 st camera 39L and the component 5 when the component 5 is imaged as viewed from the X-axis direction.

As shown in fig. 11, the 1 st camera 39L images the member 5 positioned above the lower receiving portion 36 from below the lower receiving portion 36 through the penetrating portion h1 of the lower receiving portion 36. The 2 nd camera 39R also captures the component 5 through the through portion h1 of the lower receiving portion 36 in the same manner.

Fig. 12A and 12B are diagrams illustrating imaging examples of the 1 st camera 39L and the 2 nd camera 39R, respectively.

In the example shown in fig. 12A (a) and (b), the 2 nd alignment mark Mc on the X-axis direction positive side of the member 5 and the edge of the member 5 positioned around the 2 nd alignment mark Mc are included in the imaging range DL of the 1 st camera 39L. In this case, the 1 st camera 39L simultaneously images the 2 nd alignment mark Mc and the edge of the component 5. By this image pickup, image pickup data as an image of the 2 nd alignment mark Mc and the edge of the member 5 is generated. Then, as shown in fig. 12A (a), the control unit 2A recognizes the position of the edge of the member 5 from the image data, and further, as shown in fig. 12A (b), recognizes the position of the 2 nd alignment mark Mc.

Similarly, in the example shown in fig. 12B (a) and (B), the 2 nd alignment mark Mc on the X-axis direction negative side of the component 5 and the edge of the component 5 positioned around the 2 nd alignment mark Mc are included in the imaging range DR of the 2 nd camera 39R. In this case, the 2 nd camera 39R simultaneously captures the 2 nd alignment mark Mc and the edge of the component 5. By this image pickup, image pickup data as an image of the 2 nd alignment mark Mc and the edge of the member 5 is generated. Then, as shown in fig. 12B (a), the control unit 2a recognizes the position of the edge of the member 5 from the image data, and further, as shown in fig. 12B (B), recognizes the position of the 2 nd alignment mark Mc.

Here, both the 2 nd alignment mark Mc and the edge of the member 5 may not be included in the imaging ranges DL and DR. For example, when the distance between the end edge of the component 5 and the 2 nd alignment mark Mc is long, both the 2 nd alignment mark Mc and the end edge of the component 5 cannot be included in the imaging ranges DL and DR, respectively. In this case, the imaging movement mechanism 38 in the present embodiment moves the imaging range DL of the 1 st camera 39L and the imaging range DR of the 2 nd camera 39R. Then, the control unit 2a first causes the 1 st camera 39L and the 2 nd camera 39R to image the 2 edges of the component 5, and then causes the 1 st camera 39L and the 2 nd camera 39R to image the pair of 2 nd alignment marks Mc.

Fig. 13A is a diagram illustrating an example of image pickup in which the edge of the member 5 is an object. Fig. 13B is a diagram illustrating an example of image capturing with the 2 nd alignment mark Mc as an object.

As described above, both the 2 nd alignment mark Mc and the edge of the member 5 may not be included in the imaging range DL of the 1 st camera 39L. In this case, first, as shown in fig. 13A (a), the control unit 2a controls the imaging movement mechanism 38 to move the imaging range DL so that the edge of the member 5 comes within the imaging range DL. Then, as shown in fig. 13A (b), the control unit 2a causes the 1 st camera 39L to image the edge of the member 5 before imaging the 2 nd alignment mark Mc. As a result, the 1 st camera 39L generates image data as an image of the edge of the member 5.

After the image of the edge of the component 5 is captured, the control unit 2a controls the image pickup moving mechanism 38 to move the image pickup range DL to the negative side in the X-axis direction, as shown in fig. 13B (a). Thereby, the 2 nd alignment mark Mc of the component 5 is included in the imaging range DL. Then, as shown in fig. 13B (B), the control unit 2a causes the 1 st camera 39L to capture an image of the 2 nd alignment mark Mc. As a result, the 1 st camera 39L generates image data as an image of the 2 nd alignment mark Mc.

The control unit 2a recognizes the position of the edge of the component 5 in the imaging range DL from the imaging data of the edge of the component 5 shown in fig. 13A (b). Further, the control unit 2a recognizes the position of the 2 nd alignment mark Mc in the imaging range DL from the imaging data of the 2 nd alignment mark Mc shown in fig. 13B (B). Then, the control portion 2a determines the positional relationship between the edge of the member 5 and the 2 nd alignment mark Mc based on the position of the edge of the member 5, the position of the 2 nd alignment mark Mc, the moving direction of the imaging range DL, and the moving distance. The control unit 2a generates relationship information (XL, YL) indicating the positional relationship.

The control unit 2a also executes the same processing as the processing for image capturing shown in fig. 13A and 13B for the image capturing range DR of the 2 nd camera 39R. Thereby, relationship information (XR, YR) is generated.

Fig. 14A is a diagram illustrating another example of image pickup with the edge of the member 5 as an object. Fig. 14B is a diagram illustrating another example of image capturing with the 2 nd alignment mark Mc as an object.

In the same way as the example shown in fig. 13A, when both the 2 nd alignment mark Mc and the edge of the component 5 cannot be included in the imaging range DL, first, as shown in fig. 14A (a), the control portion 2a brings the edge of the component 5 into the imaging range DL. Next, as shown in fig. 14A (b), the control unit 2a causes the 1 st camera 39L to capture an image of the edge of the component 5. As a result, the 1 st camera 39L generates image data as an image of the edge of the member 5.

After imaging the edge of the component 5, the control unit 2a controls the imaging movement mechanism 38 to move the imaging range DL to the Y-axis direction positive side as shown in fig. 14B (a). Thereby, the 2 nd alignment mark Mc of the component 5 is included in the imaging range DL. Then, as shown in fig. 14B (B), the control unit 2a causes the 1 st camera 39L to capture an image of the 2 nd alignment mark Mc. As a result, the 1 st camera 39L generates imaging data as an image of the 2 nd alignment mark Mc.

[ Process flow of component bonding apparatus ]

Fig. 15 is a flowchart showing the entire processing steps of the component crimping apparatus 100 in the present embodiment.

The punching portion 33b included in the component supply portion 33 of the component pressure bonding apparatus 100 performs a punching process of punching the component 5 from the belt member 70 (step S11). The punched member 5 is moved to the crimping tool 34 side by the member moving portion 35.

Next, the pressure bonding tool 34 sucks and holds the component 5 supplied from the component supply unit 33 (step S12). Then, the control unit 2a executes a positional relationship determination process in which the image pickup unit 39 is caused to pick up an image of the member 5 held by the pressure bonding tool 34 to determine the positional relationship between the end edge of the member 5 and the 2 nd alignment mark Mc (step S13). In step S13, the image pickup unit 39 picks up the image of the component 5 to generate image pickup data in which the pair of 2 nd alignment marks Mc formed on the component 5 are picked up.

Then, the control unit 2a determines whether or not the positional relationship is within the allowable range (step S14). Here, if it is determined that the positional relationship is within the allowable range (yes at step S14), the controller 2a feeds back the positional relationship to the punching process (step S15). That is, the control unit 2a outputs the relationship information indicating the positional relationship to the punching portion 33b of the component supply unit 33, thereby causing the punching portion 33b to adjust the position at which the component 5 is punched by the punching portion 33 b.

Then, the controller 2a controls the substrate moving mechanism 31 to move the substrate 3 toward the lower receiving portion 36 without changing the positions of the imaging range DL and the imaging range DR of the imaging unit 39 set at the end of the process of step S13. The controller 2a moves the substrate 3 to bring the pair of first alignment marks Mb of the substrate 3 into the imaging range DL and the imaging range DR, respectively (step S16). That is, the control unit 2a causes the substrate moving mechanism 31 to move the substrate 3 so that the pair of 1 st alignment marks Mb enter the imaging range DL and the imaging range DR, respectively.

Next, the control unit 2a causes the imaging unit 39 to image a pair of 1 st alignment marks Mb included in the imaging range DL and the imaging range DR as objects (step S17). That is, the 1 st camera 39L images the 1 st alignment mark Mb included in the imaging range DL, and the 2 nd camera 39R images the 1 st alignment mark Mb included in the imaging range DR. Thereby, image data in which the pair of 1 st alignment marks Mb are respectively captured is generated.

Next, the control unit 2a causes the substrate moving mechanism 31 to perform position adjustment of the substrate 3 based on the pair of 2 nd alignment marks Mc of the component 5 and the pair of 1 st alignment marks Mb of the substrate 3 (step S18). That is, the control unit 2a recognizes the position of the 1 st alignment mark Mb from the image pickup data of the 1 st alignment mark Mb, and recognizes the position of the 2 nd alignment mark Mc from the image pickup data of the 2 nd alignment mark Mc. Then, the table 37 of the substrate moving mechanism 31 holding the substrate 3 adjusts the position of the substrate 3 so that the pair of 2 nd alignment marks Mc and the pair of 1 st alignment marks Mb overlap by the control of the control unit 2 a. Thereby, the alignment of the component 5 and the substrate 3 is performed. Then, the control unit 2a lowers the pressure bonding tool 34 to press the member 5 against the edge of the substrate 3 supported by the lower receiving portion 36 (step S19). That is, the control unit 2a controls the pressure bonding of the component 5 to the substrate 3 by the substrate moving mechanism 31 and the pressure bonding tool 34 based on the imaging results of the pair of 1 st alignment marks Mb and the pair of 2 nd alignment marks Mc.

Further, in step S14, if it is determined that the positional relationship is not within the allowable range (no in step S14), the control section 2a prohibits the pressure contact of the component 5 held by the pressure contact tool 34 with the substrate 3 (step S20). At this time, the control portion 2a may stop punching the member 5 by the punching portion 33 b. Then, the control unit 2a notifies that a failure has occurred in the punching portion 33b of the component supply unit 33 (step S21). For example, the control unit 2a causes the display unit 2c to display a message or a warning for notifying the occurrence of the malfunction, thereby notifying the occurrence of the malfunction.

Specifically, when the distance indicated by the relationship information is not within the predetermined allowable range, the control unit 2a notifies that a failure has occurred in the punching unit 33 b. More specifically, when the distance YL and the distance YR indicated by the relationship information are shorter than the allowable range or longer than the allowable range, the control unit 2a notifies the occurrence of a malfunction. In addition, when the difference between the distance YL and the distance YR is not within the allowable range, the control unit 2a may notify the occurrence of a failure. Further, the control unit 2a may notify the occurrence of a malfunction when either one of the distance XL and the distance XR indicated by the relationship information is shorter than the allowable range and the other is longer than the allowable range.

The control unit 2a causes the 1 st camera 39L and the 2 nd camera 39R to take images of the component 5 (step S131). Thereby, the 1 st camera 39L and the 2 nd camera 39R generate image data of the component 5, respectively. Then, the control unit 2a determines whether or not both the edge of the determination member 5 and the 2 nd alignment mark Mc are included in the imaging range DL of the 1 st camera 39L and the imaging range DR of the 2 nd camera 39R, respectively, based on these imaging data (step S132).

Here, if it is determined that both the edge of the component 5 and the 2 nd alignment mark Mc are included in the imaging range DL and the imaging range DR (yes in step S132), the control section 2a generates the above-described relationship information (step S133). That is, the control unit 2a determines the positional relationship (XL, YL) between the edge of the component 5 and the 2 nd alignment mark Mc captured in the imaging data of the 1 st camera 39L. Similarly, the control unit 2a determines the positional relationship (XR, YR) between the edge of the component 5 and the 2 nd alignment mark Mc captured in the imaging data of the 2 nd camera 39R. Then, the control unit 2a generates relationship information (XL, YL), (XR, YR) indicating the specified positional relationship.

On the other hand, if it is determined that both the edge of the component 5 and the 2 nd alignment mark Mc are not included in the imaging range DL and the imaging range DR (no in step S132), the control unit 2a moves the imaging range DL and the imaging range DR by the imaging movement mechanism 38 (step S134). That is, the control unit 2a causes the imaging movement mechanism 38 to move the imaging range DL and the imaging range DR so that the edge of the component 5 held by the pressure bonding tool 34 enters the imaging range DL and the imaging range DR, respectively. Then, the control unit 2a causes the 1 st camera 39L and the 2 nd camera 39R to take images of the end edges of the member 5 included in the image taking range DL and the image taking range DR, respectively, as objects (step S135). Thus, the 1 st camera 39L and the 2 nd camera 39R each generate image pickup data for picking up an edge of the component 5.

In step S134, the 1 st camera 39L and the 2 nd camera 39R can continue to move their imaging ranges while imaging images until the edges of the component 5 enter the imaging ranges DL and DR, respectively. In this case, steps S134 and S135 are executed simultaneously. Although the process of step S134 is executed immediately when a negative determination is made in step S132, it may not be executed immediately. For example, when a negative determination is made in step S132, the control unit 2a controls the image pickup movement mechanism 38 to move the image pickup range DL and the image pickup range DR, and repeatedly executes the processing in steps S131 and S132. Further, the process of step S134 may be executed when the affirmative determination is not made in step S132 even if the predetermined number of times of repeated execution in step S132. That is, the process of step S134 may be executed when both the edge of the component 5 and the 2 nd alignment mark Mc cannot be brought into each of the imaging range DL and the imaging range DR. Note that, when it is known in advance that the end edge of the component 5 and the 2 nd alignment mark Mc cannot be simultaneously imaged based on the specifications of the component 5, the 1 st camera 39L, and the 2 nd camera 39R, the process of step S134 may be executed without performing the processes of steps S131 and S132.

Next, the control unit 2a moves the imaging range DL and the imaging range DR by the imaging movement mechanism 38 (step S137). That is, the control unit 2a moves the imaging range DL and the imaging range DR so that the 2 nd alignment mark Mc of the component 5 enters the imaging range DL and the imaging range DR, respectively. In other words, when the pair of 2 nd alignment marks Mc are not included in the imaging range DL and the imaging range DR, respectively, after the end edge of the component 5 is imaged, the control unit 2a causes the imaging movement mechanism 38 to move the imaging range DL and the imaging range DR so that the pair of 2 nd alignment marks Mc enter the imaging range DL and the imaging range DR, respectively. Then, the control unit 2a causes the 1 st camera 39L and the 2 nd camera 39R to take an image of the 2 nd alignment mark Mc included in the image taking range DL and the image taking range DR, respectively, as an object (step S138). Thereby, the 1 st camera 39L and the 2 nd camera 39R each generate imaging data for imaging the 2 nd alignment mark Mc.

In step S137, the 1 st camera 39L and the 2 nd camera 39R may continue to move their imaging ranges while imaging images until the 2 nd alignment mark Mc enters the imaging range DL and the imaging range DR, respectively. In this case, steps S137 and S138 are executed simultaneously.

After the imaging in step S138, the control unit 2a generates the above-described relationship information (step S133). At this time, the control section 2a uses the image data generated in step S135 and taken to the edge of the component 5 and the image data generated in step S138 and taken to the 2 nd alignment mark Mc. For example, the control unit 2a recognizes the position of the edge of the component 5 captured in the imaging data generated in step S135 by the 1 st camera 39L, that is, recognizes the position of the edge in the imaging range DL. Further, the control section 2a recognizes the position of the 2 nd alignment mark Mc captured in the image pickup data generated in step S137 by the 1 st camera 39L, that is, recognizes the position of the 2 nd alignment mark Mc in the image pickup range DL. Then, the control unit 2a determines the positional relationship between the edge of the member 5 and the 2 nd alignment mark Mc based on the recognized position of the edge of the member 5, the position of the 2 nd alignment mark Mc, and the moving distance and the moving direction of the imaging range DL moved in step S137.

In this manner, in step S133, the control unit 2a generates and outputs relationship information indicating the positional relationship between the edge of the component 5 and the 2 nd alignment mark Mc based on the imaging results of the edge of the component 5 and the 2 nd alignment mark Mc. The relation information generated in step S133 is used, for example, for feedback control of the position of punching of the component 5 by the punching portion 33b, notification of a failure of the punching portion 33b, and the like.

As described above, in the present embodiment, it is not necessary to provide the punched portion 33b with a sensor for checking the punched state of the member 5, and the size increase of the punched portion 33b can be suppressed. That is, in the component pressure bonding apparatus 100 according to the present embodiment, the imaging portion 39 can be used as a sensor for checking the punching state of the component 5, and thus the punching portion 33b can be prevented from being increased in size. Specifically, the imaging unit 39 controls the pressure bonding of the component 5 to the substrate 3 by the substrate moving mechanism 31 and the pressure bonding tool 34. The imaging unit 39 is used, for example, to image the 1 st alignment mark Mb and the 2 nd alignment mark Mc for controlling the alignment of the component 5 and the substrate 3. In the component pressure bonding apparatus 100 according to the present embodiment, the imaging unit 39 is also used as a sensor for checking the punching state of the component 5 by imaging the edge of the component 5 and generating and outputting the relationship information by the imaging unit 39. Therefore, it is not necessary to specially provide the punching portion 33b with a sensor for checking the punching state of the member 5, and therefore, the punching portion 33b can be prevented from being enlarged.

Here, in order to confirm the punching state of the component 5, it is necessary to separately image the end edge of the component 5 and the 2 nd alignment mark Mc, but when it is not possible to simultaneously image them, it is necessary to move the imaging range DL and the imaging range DR and to individually image them. In such a case, for example, a step of capturing an image of the 2 nd alignment mark Mc first and then capturing an image of the edge of the part 5 by moving the imaging range DL and the imaging range DR is assumed. However, in this step, in order to align the component 5 with the substrate 3 to be performed next, the imaging range DL and the imaging range DR must be moved further to return to the home positions. In this position alignment, imaging of the 1 st alignment mark Mb is required. In order to ensure the accuracy of the alignment in the imaging of the 1 st alignment mark Mb and the imaging of the 2 nd alignment mark Mc, the imaging range DL and the imaging range DR are desirably located at the same position. However, if the reproducibility of the position is insufficient even if the imaging range DL and the imaging range DR are each returned to the original position, the accuracy of the position alignment of the component 5 and the substrate 3 is degraded.

However, in the component pressure bonding apparatus 100 according to the present embodiment, when the edge of the component 5 and the 2 nd alignment mark Mc cannot be simultaneously imaged, the edge of the component 5 is imaged first, and then the 2 nd alignment mark Mc is imaged.

Fig. 17 is a diagram for explaining the timing at which the imaging unit 39 and the imaging range move in the component bonding apparatus 100 according to the present embodiment.

As shown in fig. 17, in the component pressure bonding apparatus 100 according to the present embodiment, the edge of the component 5 is imaged first, and then the 2 nd alignment mark Mc is imaged. During the imaging, the 1 st camera 39L and the 2 nd camera 39R, i.e., the imaging range DL and the imaging range DR move. However, during the imaging of the 2 nd alignment mark Mc and the imaging of the 1 st alignment mark Mb, the position adjustment of the table 37 as the position alignment of the component 5 and the substrate 3 can be performed without moving the 1 st camera 39L and the 2 nd camera 39R. This is because the edge of the member 5 is imaged before the 2 nd alignment mark Mc. That is, in the present embodiment, the 1 st alignment mark Mb can be imaged without moving the imaging range DL and the imaging range DR in which the 2 nd alignment mark Mc is imaged. Specifically, the 1 st alignment mark Mb of the substrate 3 can be brought into their imaging ranges by moving the substrate 3 without moving the imaging range DL and the imaging range DR to image the 1 st alignment mark Mb. Therefore, in the imaging of the 1 st alignment mark Mb and the imaging of the 2 nd alignment mark Mc, the positions of the imaging range DL and the imaging range DR are equal to each other. Therefore, the accuracy of the positional alignment of the component 5 and the substrate 3 can be sufficiently ensured. That is, the mounting accuracy can be improved. As a result, the punching state of the member 5 can be confirmed while suppressing an increase in size of the punching portion 33b, and the mounting accuracy can be improved.

The control unit 2a in the present embodiment controls punching from the member 5 of the belt member 70 by the punching unit 33b by outputting the relation information. This can automatically maintain the positional relationship between the end edge of the member 5 and the 2 nd alignment mark Mc to be fixed, and can easily improve the punching accuracy of the member 5.

The control unit 2a in the present embodiment generates relationship information indicating a distance between the end edge of the member 5 and the 2 nd alignment mark Mc as a positional relationship, and when the distance is longer than a threshold value, notifies that a defect has occurred in the punching portion 33 b. This can prompt the operator to check and repair the punched portion 33b, thereby improving punching accuracy.

(modification example)

In the above embodiment, the imaging movement mechanism 38 can move the 1 st camera 39L and the 2 nd camera 39R to move the imaging range DL and the imaging range DR. However, the imaging movement mechanism 38 may move the imaging range DL and the imaging range DR without moving the 1 st camera 39L and the 2 nd camera 39R.

Fig. 18 is a diagram showing a configuration example of a part of the image pickup movement mechanism 38 in the present modification.

As shown in fig. 18 (a) and (b), the image pickup moving mechanism 38 in the present modification includes an optical member 38a including a lens, a mirror, or the like. The imaging movement mechanism 38 does not move the 1 st camera 39L and the 2 nd camera 39R, but moves the optical member 38a upward as shown in fig. 18 (a), for example. This causes the imaging range DL and the imaging range DR to move in the X-axis direction, thereby widening the camera pitch. Alternatively, the imaging movement mechanism 38 does not move the 1 st camera 39L and the 2 nd camera 39R, but moves the optical member 38a downward as shown in fig. 18 (b), for example. This causes the imaging range DL and the imaging range DR to move in the X-axis direction, thereby narrowing the camera pitch.

In this manner, in the present modification, the imaging range DL and the imaging range DR can be simultaneously and easily moved in the X-axis direction by the movement of the optical member 38 a.

(other modification example)

As described above, the component pressure bonding apparatus according to one or more embodiments has been described based on the above-described embodiment and the modification, but the present disclosure is not limited to the embodiment and the modification. Various modifications that may occur to those skilled in the art may be made to the embodiments and the modifications described above, and the embodiments constructed by combining the constituent elements in the embodiments and the modifications may be included within the scope of the present disclosure, as long as the modifications do not depart from the spirit of the present disclosure.

For example, in the above-described embodiment and this modification, the shape of each of the 1 st alignment mark Mb and the 2 nd alignment mark Mc is a cross shape, but the shape is not limited to this shape, and other shapes may be used.

In the above-described embodiment and the modification, the substrate 3 is a display panel, and the pre-press bonding and the main press bonding members 5 are formed on the display panel, but the substrate 3 may be a substrate other than the display panel.

In the above-described embodiment and this modification, the 2 nd alignment mark Mc is imaged and then the 1 st alignment mark Mb is imaged. However, the 1 st alignment mark Mb and the 2 nd alignment mark Mc may be simultaneously imaged.

In the above-described embodiment and this modification, the control unit 2a notifies the punching unit 33b of the occurrence of a failure by displaying a message, a warning, or the like notifying the occurrence of a failure on the display unit 2 c. In this case, the control unit 2a may display the distance XL, the distance XR, the distance YL, and the distance YR indicated in the relationship information on the display unit 2c, or may display the numerical value for adjusting the punching portion 33b according to the distance on the display unit 2 c.

In the above-described embodiment and the modification, all or part of the components of the computer 2 may be configured by dedicated hardware, or may be realized by executing software programs suitable for the respective components. Each component may be realized by a program execution Unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a Hard Disk Drive (HDD) or a semiconductor memory. For example, the program executing section causes the pre-compression section 30 to execute each step included in the flowcharts shown in fig. 15 and 16.

Further, the constituent elements of the computer 2 may be constituted by 1 or more electronic circuits. The 1 or more electronic circuits may be general-purpose circuits or dedicated circuits, respectively. The 1 or more electronic circuits may include, for example, a semiconductor device, an IC (Integrated Circuit), or an LSI (Large Scale Integration). The IC or LSI may be integrated into 1 chip or may be integrated into a plurality of chips. Here, although it is referred to as an IC or an LSI, the term may be changed depending on the degree of Integration, and may be referred to as a system LSI (Very Large Scale Integration), a VLSI (Very Large Scale Integration), or an ULSI (Ultra Large Scale Integration). In addition, an FPGA (Field Programmable Gate Array) programmed after the LSI is manufactured can also be used for the same purpose.

Industrial applicability

The present disclosure can be used for a component pressure bonding device provided in a component mounting line or the like for mounting a component on a display panel, for example.

Claims

1. A component pressure welding device is provided with:

a substrate moving mechanism for holding the substrate on which the 1 st alignment mark is formed and moving the substrate;

a crimping tool that holds and crimps the member on which the 2 nd alignment mark is formed to the substrate;

an image pickup unit that picks up an image of an object included in an image pickup range;

an imaging moving mechanism that moves an imaging range of the imaging unit; and

a control part for controlling the operation of the display device,

the control unit performs the following control:

causing the imaging movement mechanism to execute movement of the imaging range so that the end edge of the member held by the crimping tool enters the imaging range,

causing the image pickup section to pick up an image with an edge of the member included in the image pickup range as the object,

in the case where the 2 nd alignment mark is not included in the imaging range,

after the end edge of the member is imaged, causing the imaging movement mechanism to execute movement of the imaging range so that the 2 nd alignment mark enters the imaging range,

causing the image pickup section to pick up an image of the 2 nd alignment mark included in the image pickup range as the object,

generating and outputting relationship information indicating a positional relationship between the end edge of the member and the 2 nd alignment mark based on the imaging results of the end edge of the member and the 2 nd alignment mark,

causing the substrate moving mechanism to execute movement of the substrate so that the 1 st alignment mark enters the imaging range,

causing the image pickup section to pick up an image of the 1 st alignment mark included in the image pickup range as the object,

and controlling the pressing of the component against the substrate by the substrate moving mechanism and the pressing tool based on the imaging results of the 1 st alignment mark and the 2 nd alignment mark.

2. The component crimping apparatus according to claim 1,

the component pressure-bonding device further includes: a blanking portion that sequentially blanks respective members of the plurality of members from a belt member provided with the plurality of members,

the crimping tool holds a member punched out by the punching portion and is crimped to the substrate.

3. The component crimping apparatus according to claim 2, wherein,

the control unit further controls punching of the component from the belt member by the punching unit by outputting the relationship information.

4. The component crimping apparatus according to claim 2, wherein,

the control unit further generates the relationship information indicating a distance between the end edge of the member and the 2 nd alignment mark as the positional relationship, and notifies that a defect has occurred in the punching unit when the distance is not within a predetermined allowable range.

5. The component crimping apparatus according to any one of claims 1 to 4,

the imaging moving mechanism does not move the imaging range of the imaging unit during a period from when the imaging unit performs imaging of the 2 nd alignment mark to when the imaging unit performs imaging of the 1 st alignment mark.

6. A component press-bonding method for press-bonding a component to a substrate by a component press-bonding device,

the component pressure welding device is provided with:

a control part for controlling the operation of the display device,

in the method for crimping a member as described above,

the image pickup moving mechanism moves the image pickup range so that the end edge of the member enters the image pickup range,

the image pickup section picks up an image of an edge of the member included in the image pickup range as the object,

in the case where the 2 nd alignment mark is not included in the imaging range,

after the end edge of the member is imaged, the imaging moving mechanism moves the imaging range so that the 2 nd alignment mark enters the imaging range,

the image pickup section picks up an image of the 2 nd alignment mark included in the image pickup range as the object,

the control unit generates and outputs relationship information indicating a positional relationship between the edge of the component and the 2 nd alignment mark based on the respective imaging results of the edge of the component and the 2 nd alignment mark,

the substrate moving mechanism moves the substrate so that the 1 st alignment mark enters the imaging range,

the image pickup section picks up an image of the 1 st alignment mark included in the image pickup range as the object,

the control unit controls the pressing of the component against the substrate by the substrate moving mechanism and the pressing tool based on the imaging results of the 1 st alignment mark and the 2 nd alignment mark.