JPH0864993A - Electronic part mounting method - Google Patents

Electronic part mounting method

Info

Publication number
JPH0864993A
JPH0864993A JP6198867A JP19886794A JPH0864993A JP H0864993 A JPH0864993 A JP H0864993A JP 6198867 A JP6198867 A JP 6198867A JP 19886794 A JP19886794 A JP 19886794A JP H0864993 A JPH0864993 A JP H0864993A
Authority
JP
Japan
Prior art keywords
sheet
electronic component
electronic part
suction
suction nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6198867A
Other languages
Japanese (ja)
Inventor
Kiyomi Masuko
聖美 益子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6198867A priority Critical patent/JPH0864993A/en
Publication of JPH0864993A publication Critical patent/JPH0864993A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Landscapes

  • Automatic Assembly (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE: To make it possible to perform suction operation with reliability even if an electronic part has grooves or irregularities on the suction side, and thereby improve the efficiency of mounting operation, by previously sticking a sheet, composed of a one-side adhesive tape, to the surface of the electronic part on the suction side, and sucking the sheet surface using a suction nozzle. CONSTITUTION: A sheet 4, or a one-side adhesive tape coated with adhesive on one side, is stuck to the surface 1a to be sucked of an electronic part 1. The suction nozzle 2 of a mounter is brought into contact with the surface of the electronic part 1 over the sheet 4 to transfer it. The suction nozzle 2 sucks the surface of the sheet 4; therefore, it is capable of sucking the electronic part 1 with reliability even if there is grooves on the surface of the part 1 or the surface of the part 1 is uneven. Since the surface of the sheet 4 is flat, no air leakage is caused. This makes it possible to suck an electronic part with reliability and thus properly mount it efficiently.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明はプリント基板等に電子部
品を吸着ノズルで移送し実装する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for transferring and mounting electronic components on a printed circuit board or the like by suction nozzles.

【０００２】[0002]

【従来の技術】一般に電子機器の製造においては、プリ
ント基板に半導体、コンデンサ、抵抗、コイル等の小型
の電子部品を実装機で実装するが、その実装工程におい
て、吸着ノズルで電子部品を吸着して移送している。2. Description of the Related Art Generally, in the manufacture of electronic equipment, small electronic components such as semiconductors, capacitors, resistors and coils are mounted on a printed circuit board by a mounting machine. In the mounting process, the electronic components are sucked by a suction nozzle. Are being transferred.

【０００３】図２はその電子部品１と吸着ノズル２の関
係を示し、吸着ノズル２は電子部品１の一つの面１ａに
対応し、この面１ａに当接して真空吸着により電子部品
１を吸着保持し、図示しないプリント基板の上方の実装
機まで電子部品１を移送し、その後に実装している。FIG. 2 shows the relationship between the electronic component 1 and the suction nozzle 2. The suction nozzle 2 corresponds to one surface 1a of the electronic component 1 and contacts the surface 1a to suck the electronic component 1 by vacuum suction. The electronic component 1 is held, transferred to a mounting machine (not shown) above a printed circuit board, and then mounted.

【０００４】このように電子部品１の移送は、電子部品
１の重量が小さいことから吸着ノズル２による吸着する
方法が至極簡便であり、また、電子部品１の離脱も真空
吸引系路を閉じることにより確実に行なえる。As described above, since the electronic component 1 is transferred by a small weight, the electronic component 1 can be easily adsorbed by the adsorption nozzle 2, and the electronic component 1 can be detached by closing the vacuum suction system passage. Can be done more reliably.

【０００５】[0005]

【発明が解決しようとする課題】ところで電子部品１は
必ずしも吸着に適した平面をもつものばかりではなく、
その機能によっては種々の形状に形成され、たとえば図
１のように面１ａに溝３をもつものもある。このように
溝３あるいは凹凸面をもつものにおいては、吸着ノズル
２で吸着する場合にエアー漏れが生じ、適確に電子部品
を吸着できないという問題があった。The electronic component 1 is not limited to one having a flat surface suitable for suction,
Depending on its function, it is formed into various shapes, for example, there is one having a groove 3 on the surface 1a as shown in FIG. As described above, in the case of having the groove 3 or the uneven surface, there is a problem that air leakage occurs when sucking with the suction nozzle 2, and the electronic component cannot be sucked properly.

【０００６】本発明は前記従来の問題に留意し、ノズル
で吸着するに際しエアー漏れがなく、確実に吸着できる
電子部品の実装方法を提供することを目的とする。The present invention has been made in consideration of the above-mentioned conventional problems, and an object of the present invention is to provide a mounting method of an electronic component which does not leak air when sucked by a nozzle and can be surely sucked.

【０００７】[0007]

【課題を解決するための手段】本発明は前記目的を達成
するため、電子部品の吸着側の面にあらかじめシートを
貼り付け、このシートの面を吸着ノズルで吸着して移送
する電子部品の実装方法とする。In order to achieve the above object, the present invention mounts an electronic component in which a sheet is previously attached to the suction side surface of an electronic component, and the surface of the sheet is sucked and transferred by a suction nozzle. Let's do it.

【０００８】[0008]

【作用】上記方法において、電子部品の吸着面は溝ある
いは凹凸があるにもかかわらず、貼り付けたシートによ
って平らな吸着面が形成され、吸着ノズルは確実に電子
部品を吸着移送できることとなる。In the above method, even though the suction surface of the electronic component has grooves or irregularities, a flat suction surface is formed by the attached sheet, and the suction nozzle can reliably suck and transfer the electronic component.

【０００９】[0009]

【実施例】以下本発明の一実施例を図１を参照して説明
する。図において１は電子部品、２は吸着ノズル、３は
電子部品１の一つの面１ａに形成した溝である。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. In the figure, 1 is an electronic component, 2 is a suction nozzle, and 3 is a groove formed on one surface 1 a of the electronic component 1.

【００１０】本実施例の特徴は、移送作業に供する前記
電子部品１における吸着側となる面１ａに、シート４を
貼り付けたことにある。なお、このシート４は片面に粘
着剤をもついわゆる片面粘着テープであってもよく、要
は作業後に剥がしやすいシートが好ましい。The feature of this embodiment is that the sheet 4 is attached to the surface 1a on the suction side of the electronic component 1 used for the transfer operation. The sheet 4 may be a so-called single-sided adhesive tape having an adhesive on one side, and in short, a sheet that is easily peeled off after working is preferable.

【００１１】このようにシート４を貼りつけた電子部品
１の前記シート４の面に吸着ノズル２を当接し、そして
吸着して実装機に移送する。ここで電子部品１の面１ａ
に溝３が形成されていても、吸着ノズル２はシート４の
面を吸着するので、前記電子部品１に溝３あるいは凹凸
表面があっても、これらに関係なく吸着ができ、もちろ
ん、シート４は平らな面をもつのでエアー漏れがなく、
確実な吸着ができるものであり、電子部品の実装作業を
適切に、かつ効率よく行うことができる。The suction nozzle 2 is brought into contact with the surface of the sheet 4 of the electronic component 1 to which the sheet 4 has been attached in this manner, and the suction nozzle 2 is sucked and transferred to the mounting machine. Here, the surface 1a of the electronic component 1
Even if the groove 3 is formed in the sheet, the suction nozzle 2 sucks the surface of the sheet 4, so that even if the electronic component 1 has the groove 3 or the uneven surface, the suction can be performed regardless of these. Has a flat surface, so there is no air leakage,
Since it is possible to reliably suck the electronic component, the mounting work of the electronic component can be appropriately and efficiently performed.

【００１２】[0012]

【発明の効果】前記実施例の説明より明らかなように、
本発明は移送作業に供する電子部品の吸着側の面にシー
トを貼りつけ、このシートを吸着ノズルで吸着して移送
するものであるので、電子部品の吸着側の面に溝あるい
は凹凸があっても、これらに関係なく確実な吸着動作が
得られ、実装作業の効率を向上させることができる。As is clear from the description of the above embodiment,
According to the present invention, a sheet is attached to the suction side surface of an electronic component to be used for transfer work, and this sheet is sucked and transferred by a suction nozzle. Also, regardless of these, a reliable suction operation can be obtained, and the efficiency of the mounting work can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例の電子部品実装方法を説明す
るための斜視図FIG. 1 is a perspective view for explaining an electronic component mounting method according to an embodiment of the present invention.

【図２】従来の電子部品実装方法を説明するための斜視
図FIG. 2 is a perspective view for explaining a conventional electronic component mounting method.

【符号の説明】[Explanation of symbols]

１ 電子部品 ２ 吸着ノズル ３ 溝 ４ シート 1 Electronic component 2 Suction nozzle 3 Groove 4 Sheet

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 電子部品の吸着側の面にあらかじめシー
トを貼り付け、前記シートの面を吸着ノズルで吸着して
移送する電子部品実装方法。1. A method of mounting an electronic component, wherein a sheet is previously attached to a suction-side surface of an electronic component, and the surface of the sheet is sucked and transferred by a suction nozzle. 【請求項２】 シートは片面粘着テープよりなる請求項
１記載の電子部品実装方法。2. The electronic component mounting method according to claim 1, wherein the sheet is a single-sided adhesive tape.
JP6198867A 1994-08-24 1994-08-24 Electronic part mounting method Pending JPH0864993A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6198867A JPH0864993A (en) 1994-08-24 1994-08-24 Electronic part mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6198867A JPH0864993A (en) 1994-08-24 1994-08-24 Electronic part mounting method

Publications (1)

Publication Number Publication Date
JPH0864993A true JPH0864993A (en) 1996-03-08

Family

ID=16398250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6198867A Pending JPH0864993A (en) 1994-08-24 1994-08-24 Electronic part mounting method

Country Status (1)

Country Link
JP (1) JPH0864993A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2016021025A1 (en) * 2014-08-07 2017-06-22 富士機械製造株式会社 Board mounting method for labeled components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2016021025A1 (en) * 2014-08-07 2017-06-22 富士機械製造株式会社 Board mounting method for labeled components

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