WO2016015421A1 - 阵列基板、有机发光二极管显示面板和显示装置 - Google Patents

阵列基板、有机发光二极管显示面板和显示装置 Download PDF

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Publication number
WO2016015421A1
WO2016015421A1 PCT/CN2014/092521 CN2014092521W WO2016015421A1 WO 2016015421 A1 WO2016015421 A1 WO 2016015421A1 CN 2014092521 W CN2014092521 W CN 2014092521W WO 2016015421 A1 WO2016015421 A1 WO 2016015421A1
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layer
array substrate
organic light
emitting diode
display panel
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PCT/CN2014/092521
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English (en)
French (fr)
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王俊然
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京东方科技集团股份有限公司
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes
    • H10K59/80516—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED

Definitions

  • Embodiments of the present invention relate to an array substrate, an organic light emitting diode display panel, and a display device.
  • Organic electroluminescent devices have advantageous characteristics such as active illumination, wide viewing angle, high contrast, and fast response, which are regarded as a new generation of display technology.
  • Organic light-emitting diode (OLED) displays can be fully colorized using WOLED (White Organic Light-Emmitting Diodes) plus COA (Color-filter on Array) or CF (Color) -filter color filter) is implemented.
  • the specific structure may include a manner of bottom emitting WOLED plus COA and a method of top emitting WOLED plus CF.
  • the method of top emitting WOLED plus CF has the advantages of high aperture ratio and simple backplane process.
  • the method of top-emitting WOLED plus CF is because the upper electrode is a transmissive electrode. Whether it is a thin metal layer or a TCO (Transparent Conductive Oxide), the sheet resistance is too large, resulting in a large area. In an OLED display, an IR drop is easily generated to cause uneven brightness of the panel.
  • the auxiliary electrode can be made on the CF cover plate, the spacer is used to overlap the upper electrode to reduce the resistance voltage drop, but in order to achieve a good electrical overlap, the upper electrode and the spacer are between the spacers. The insulating layer cannot exist, resulting in deterioration of water repellency of the display panel, resulting in a decrease in reliability of the panel.
  • Embodiments of the present invention provide an array substrate, an organic light emitting diode display panel, and a display device, which can obtain an array substrate with better water resistance, and can overlap the upper electrode layer by using a spacer to ensure the array substrate The water resistance and reliability of the display panel.
  • At least one embodiment of the present invention provides an array substrate comprising: an array substrate, a structural layer, and an organic light emitting diode layer and a passivation layer disposed on top of the structural layer.
  • the passivation layer covers an edge of the organic light emitting diode layer in the array substrate and a side surface of the structural layer.
  • the outer side of the array substrate may be provided with a flip chip film region or a soft plate solder region, and the passivation layer may be disposed in the organic light emitting diode layer light emitting region and the flip chip region or the soft board Between the weld zones.
  • the passivation layer may be a single layer structure or a multilayer stack structure.
  • the passivation layer may comprise one or a combination of silicon nitride, silicon oxide, aluminum oxide or titanium oxide.
  • Embodiments of the present invention also provide an organic light emitting diode display panel including any of the above array substrates.
  • an upper electrode layer may be formed on the organic light emitting diode layer of the array substrate.
  • the OLED display panel may further include a color filter substrate, wherein the color film substrate comprises a color film substrate, a color film layer is formed on one side of the color film substrate facing the array substrate, and an auxiliary electrode is formed on the color film layer.
  • the color film substrate comprises a color film substrate
  • a color film layer is formed on one side of the color film substrate facing the array substrate
  • an auxiliary electrode is formed on the color film layer.
  • a spacer is formed in the auxiliary electrode layer or a spacer is formed on the color filter layer, and the auxiliary electrode layer on the top of the spacer contacts the upper electrode layer.
  • a first sealant may be filled between the color filter substrate and the array substrate, and the passivation layer may be sealed by the first sealant.
  • the organic light emitting diode display panel may further include: a second encapsulant disposed on a periphery of the first encapsulant for sealing the first encapsulant.
  • the viscosity of the first sealant is less than the viscosity of the second sealant.
  • the organic light emitting diode display panel may further include: a metal trace disposed at a bottom of the spacer and in contact with the auxiliary electrode layer.
  • the metal trace is a metal such as aluminum, molybdenum or silver or an alloy thereof.
  • the auxiliary electrode layer may be a transparent conductive film.
  • the upper electrode layer includes at least one of a silver layer, a magnesium-silver alloy layer, an indium tin oxide layer, an indium zinc oxide layer, and a composite layer on the metal layer covered with a transparent conductive film.
  • Embodiments of the present invention also provide a display device including any of the above-described organic light emitting diode display panels.
  • FIG. 1 is a schematic structural view of an array substrate according to an embodiment of the present invention.
  • FIG. 2 is a schematic view showing the position of a passivation layer according to an embodiment of the present invention
  • 3A is a schematic structural view of an organic light emitting diode display panel according to an embodiment of the present invention.
  • 3B is a schematic structural view of an organic light emitting diode display panel according to another embodiment of the present invention.
  • FIG. 4 is a schematic structural view of an organic light emitting diode display panel according to another embodiment of the present invention.
  • OLED non-light-emitting region OLED non-light-emitting region
  • FIG. 1 is a schematic view showing the structure of an array substrate according to an embodiment of the present invention.
  • an array substrate includes: an array substrate 10, a structural layer 1, an organic light emitting diode layer 6 disposed on the top of the structural layer 1, and a passivation layer 3 covering the array substrate.
  • the first encapsulant is filled between the array substrate and the color filter substrate, and the array substrate includes the array substrate 10, the structural layer 1, and the organic light emitting diode layer 6.
  • Structural layer 1 is not A single layer, but a collection of layers that implement the functionality of the array substrate.
  • the structural layer 1 may include: a gate electrode, a gate insulating layer, an active layer, an etch barrier layer, a source drain layer, a resin insulating layer, a pixel electrode layer (the pixel electrode layer may serve as an anode), and a pixel defining layer, as needed Multiple layers, but are not limited to this.
  • the passivation layer 3 covers the edge of the organic light emitting diode layer 6, forming a non-light emitting region of the organic light emitting diode layer 6, while covering both sides of the structural layer 1.
  • the organic light emitting diode layer is disposed at the passivation layer, that is, the edge of the organic light emitting diode layer is a non-light emitting region, and the rest (where the organic light emitting diode layer is not provided with a passivation layer) may be a light emitting region.
  • the passivation layer 3 By covering the passivation layer 3 on the edge of the organic light emitting diode layer 6 (ie, the non-light emitting region) and the side of the structural layer 1, it is ensured that the full color is achieved by using the WOLED, and the upper electrode layer is overlapped by the spacer 4. At the same time as 18, the probability of moisture infiltrating from the side of the sealing structure is reduced. This ensures that the display panel composed of the array substrate has good water blocking performance and high panel reliability.
  • the outer side of the array substrate 10 is provided with a chip-on-film area (COF) or a soft-plate-welded area (FPC) 8, which is disposed on the anisotropic conductive film (ACF) 9, and the anisotropic conductive film 9 is disposed on the array.
  • COF chip-on-film area
  • FPC soft-plate-welded area
  • ACF anisotropic conductive film
  • the passivation layer 3 is disposed between the light-emitting region 62 of the organic light-emitting diode layer 6 and the flip-chip film region or the soft-plate solder region 8.
  • the passivation layer 3 is between the light-emitting region of the organic light-emitting diode layer 6 and the flip-chip film region or the soft-plate solder region 8, it can be ensured that the passivation layer 3 is in the first encapsulant and does not cover the organic light-emitting diode layer 6. Light emitting area.
  • the passivation layer 3 may be a single layer structure or a multilayer stack structure.
  • the passivation layer 3 may be one or a combination of silicon nitride, silicon oxide, aluminum oxide, and or titanium oxide.
  • another embodiment of the present invention further provides an organic light emitting diode display panel comprising the array substrate of any of the above embodiments.
  • an upper electrode layer 18 may be formed on the organic light emitting diode layer 6 of the array substrate, and the upper electrode layer 18 is a thin electrode layer disposed on the upper surface of the array organic light emitting diode layer 6.
  • the organic light emitting diode display panel may further include a color filter substrate, wherein the color filter substrate includes the color film substrate 2.
  • a color film layer 20 is formed on one side of the color filter substrate 2 facing the array substrate, an auxiliary electrode layer 5 is formed on the color film layer 20, and a spacer 4 is formed in the auxiliary electrode layer 5 (as shown in FIG. 3A).
  • a spacer 4 is formed on the color filter layer 20 (as shown in FIG. 3B), and the auxiliary electrode layer 5 on the top of the spacer 4 contacts the upper electrode layer 18 of the array substrate as shown in FIG. 3A.
  • FIG. 3A shows that the first encapsulant 15 can be filled between the color filter substrate 2 and the array substrate, and the passivation layer 3 is sealed by the first encapsulant 15.
  • FIG. 3A illustrates an organic light emitting diode display panel according to another embodiment of the present invention, which may further include a second encapsulant 16 disposed on the periphery of the first encapsulant 15 for sealing the first encapsulant 15.
  • the viscosity of the first sealant 15 may be less than the viscosity of the second sealant 16.
  • sealant may be, for example, a first sealant or a first sealant and Second sealant.
  • the second sealant is disposed outside the first sealant to further ensure the sealing performance of the display panel, and the surface uniformity of the first sealant can be improved. Moreover, since the first sealant directly contacts the organic light emitting diode layer 6, the organic light emitting diode layer 6 is damaged due to the tension of the contact surface during the curing process. By setting the viscosity of the first sealant to be smaller than the viscosity of the second sealant, it can be ensured that the contact surface of the first sealant and the organic light emitting diode layer 6 has only a small tension during the curing process, thereby reducing the organic light emitting diode layer. 6 damage. At the same time, the second sealant adopts a relatively large viscosity, which can ensure strong water repellency to the outside and improve the overall sealing performance.
  • a metal trace 7 may be added to the structure of FIG. 3A.
  • the organic light emitting diode display panel may further include a metal trace 7 disposed at the bottom of the spacer 4 and in contact with the auxiliary electrode layer 5. .
  • the metal trace 7 may be made of a metal such as aluminum, molybdenum or silver or an alloy thereof.
  • the conductivity of the auxiliary electrode layer 5 can be increased, and the resistance drop of the front surface of the OLED display panel can be lowered.
  • the auxiliary electrode layer 5 is a transparent conductive film, and can be made of an oxide of a metal such as In, Sn, Zn, and Cd and a composite multi-oxide thin film material thereof, such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide). .
  • the upper electrode layer may include at least one of the following: a silver layer, a magnesium-silver alloy layer, an indium tin oxide layer, an indium zinc oxide layer, and a composite layer on the metal layer covered with a transparent conductive film.
  • Another embodiment of the present invention further provides a display device, which may include the organic light emitting diode display panel of any of the above embodiments.
  • the display device of the embodiment of the present invention may be, for example, an electronic paper, a mobile phone, a watch, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, or the like, and any product or component having a display function.
  • the full color can be realized by using the WOLED, and the electrodes are overlapped by the spacer, and the display panel has good electrical conductivity and water blocking performance, and the high panel is trusted. degree.
  • organic light emitting diode display panel of the embodiment of the present invention may further include other structures and components according to actual needs, and the organic light emitting diode display panel manufacturing method may further include other steps and details, but only Regardless of the improvement of the present invention, it will not be described herein.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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Abstract

一种阵列基板、有机发光二极管显示面板和显示装置。该阵列基板包括：阵列基底（10）、结构层（1）、布设于结构层（1）顶部的有机发光二极管层（6）、钝化层（3），该钝化层（3）覆盖于阵列基板中有机发光二极管层（6）的非发光区以及结构层（1）的侧面。该阵列基板可以使得显示面板具有良好的导电性能和阻水性能，以及较高的面板信赖度。

Description

阵列基板、有机发光二极管显示面板和显示装置 技术领域
本发明的实施例涉及一种阵列基板、有机发光二极管显示面板和显示装置。
背景技术
有机电致发光器件具有主动发光、视角宽、对比度高及响应速度快等有利特性，其被视为新一代的显示技术。
有机发光二极管(即OLED)显示器全彩化可以利用WOLED(White Organic Light-Emmitting Diodes,白色有机发光二极管)加上COA(Color-filter on Array，彩色滤光片与阵列基板集成)或CF(Color-filter彩色滤光片)的方式实现。例如，具体结构可以包括底发射WOLED加上COA的方式和顶发射WOLED加上CF的方式。顶发射WOLED加上CF的方式具有高开口率及背板制程较简易等优点。
但顶发射WOLED加上CF的方式由于上电极为穿透式电极，无论是用薄金属层还是TCO(Transparent Conductive Oxide，透明导电氧化物薄膜)，均因片电阻值过大，导致制作大面积OLED显示器时，容易产生电阻压降(IR Drop)而使面板发光亮度不均。虽然可以将辅助电极做在CF盖板上，利用隔垫物(Spacer)方式搭接在上电极以减少电阻压降，但是为了达到良好的电性搭接，上电极与隔垫物之间便不能存在绝缘层，从而导致显示面板的阻水性变差，造成面板的信赖性降低。
发明内容
本发明的实施例提供一种阵列基板、有机发光二极管显示面板和显示装置，可以获得较好阻水性的阵列基板，可以在采用隔垫物方式搭接上电极层的同时，保证具有该阵列基板的显示面板的阻水性能和信赖度。
本发明的至少一个实施例提供一种阵列基板，其包括：阵列基底、结构层和布设于所述结构层顶部的有机发光二极管层和钝化层。所述钝化层覆盖于所述阵列基板中有机发光二极管层的边缘以及所述结构层的侧面。
例如，所述阵列基底的外侧可设置有覆晶薄膜区或软板焊接区，所述钝化层设可置于所述有机发光二极管层发光区和所述覆晶薄膜区或所述软板焊接区之间。
例如，所述钝化层可为单层结构或多层堆叠结构。
例如，所述钝化层可包括氮化硅、氧化硅、氧化铝或氧化钛中的一种或其组合。
本发明的实施例还提出了一种有机发光二极管显示面板，其包括上述任一阵列基板。
例如，在所述有机发光二极管显示面板中，所述阵列基板的有机发光二极管层上可形成有上电极层。
例如，所述有机发光二极管显示面板还可包括彩膜基板，其中，所述彩膜基板包括彩膜基底，彩膜基底面向阵列基板的一面形成有彩膜层，彩膜层上形成有辅助电极层，辅助电极层中形成有隔垫物或所述彩膜层上形成有隔垫物，隔垫物顶部的辅助电极层接触所述上电极层。
例如，所述彩膜基板和所述阵列基板之间可填充有第一密封剂，所述钝化层层可被所述第一密封剂密封。
例如，所述有机发光二极管显示面板还可包括：第二密封剂，其设置于所述第一密封剂***，用于密封所述第一密封剂。
例如，所述第一密封剂的粘度小于所述第二密封剂的粘度。
例如，所述有机发光二极管显示面板还可包括：金属走线，其设置于所述隔垫物底部，且与所述辅助电极层相接触。
例如，所述金属走线为铝、钼或银等金属或其合金。
例如，所述辅助电极层可为透明导电薄膜。
例如，所述上电极层包括以下至少一种：银层、镁银合金层、氧化铟锡层、氧化铟锌层、金属层上覆盖有透明导电薄膜的复合层。
本发明的实施例还提供了一种显示装置，其包括上述任一有机发光二极管显示面板。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作 简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1示出了本发明一个实施例的阵列基板的结构示意图；
图2示出了本发明一个实施例的钝化层位置示意图；
图3A示出了本发明一个实施例的有机发光二极管显示面板的结构示意图；
图3B示出了本发明另一实施例的有机发光二极管显示面板的结构示意图；
图4示出了本发明另一个实施例的有机发光二极管显示面板的结构示意图。
附图标记：
1-结构层；10-阵列基底；2-彩膜基底；20-彩膜层；3-钝化层；4-隔垫物；5-辅助电极层；6-有机发光二极管层；7-金属走线；8-覆晶薄膜区或软板焊接区；9-异向导电胶膜；11-结构层的侧面；15-第一密封剂；16-第二密封剂；61-有机发光二极管层的边缘(OLED非发光区)；62-有机发光二极管层的发光区。
具体实施方式
为了能够更清楚地理解本发明的上述目的、特征和优点，下面结合附图和具体实施方式对本发明进行进一步的详细描述。需要说明的是，在不冲突的情况下，本申请的实施例及实施例中的特征可以相互组合。
在下面的描述中阐述了很多具体细节以便于充分理解本发明，但是，本发明还可以采用其他不同于在此描述的其他方式来实施。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。
图1示出了本发明一个实施例的阵列基板的结构示意图。
如图1所示，本发明一个实施例的阵列基板包括：阵列基底10、结构层1、布设于结构层1顶部的有机发光二极管层6，并且还包括钝化层3，其覆盖于阵列基板中有机发光二极管层6的边缘61，以及结构层1的侧面11。
需要说明的是，例如在阵列基板和彩膜基板之间充满了第一密封剂，阵列基板包含阵列基底10、结构层1和有机发光二极管层6。结构层1并不是 单一的一层，而是为了实现阵列基板功能的各层的集合。
根据需要，该结构层1可以包括：栅极、栅极绝缘层、有源层、刻蚀阻挡层、源漏层、树脂绝缘层、像素电极层(像素电极层可以作为阳极)、像素界定层等多个层，但并不限于此。钝化层3则覆盖于有机发光二极管层6的边缘，形成有机发光二极管层6的非发光区域，同时覆盖结构层1的两个侧面。有机发光二极管层设置钝化层处，即有机发光二极管层的边缘，为非发光区，而其余处(有机发光二极管层未设置钝化层处)可以为发光区。通过在有机发光二极管层6的边缘(即非发光区)以及结构层1的侧面覆盖钝化层3，可以保证在采用WOLED实现全彩化，并以隔垫物4的方式搭接上电极层18的同时，降低从密封结构侧边渗入的水分的几率。这保证由该阵列基板构成的显示面板具有良好的阻水性能以及较高的面板信赖度。
图2仅画出了阵列基底10一侧的覆晶薄膜区或软板焊接区8，阵列基底10的另一侧也可以设置有覆晶薄膜区或软板焊接区8。例如，阵列基底10的外侧设置有覆晶薄膜区(COF)或软板焊接区(FPC)8，其布设于异向导电胶膜(ACF)9之上，异向导电胶膜9设置于阵列基底10上。此时，钝化层3设置于有机发光二极管层6的发光区62和覆晶薄膜区或软板焊接区8之间。
因为钝化层3处于有机发光二极管层6的发光区和覆晶薄膜区或软板焊接区8之间，可以保证钝化层3处于第一密封剂内，并且不覆盖有机发光二极管层6的发光区。
例如，钝化层3可为单层结构或多层堆叠结构。
例如，钝化层3可为氮化硅、氧化硅、氧化铝和或氧化钛中的一种或其组合。
如图3A和图3B所示，本发明另一实施例还提供一种有机发光二极管显示面板，其包括上述任一实施例的阵列基板。
例如，阵列基板的有机发光二极管层6上可形成有上电极层18，上电极层18为布设于阵列有机发光二极管层6上表面的一层薄电极层。
例如，有机发光二极管显示面板还可包括彩膜基板，其中，彩膜基板包括彩膜基底2。彩膜基底2面向阵列基板的一面形成有彩膜层20，彩膜层20上形成有辅助电极层5，辅助电极层5中形成有隔垫物4(如图3A所示)， 或彩膜层20上形成有隔垫物4(如图3B所示)，隔垫物4顶部的辅助电极层5接触阵列基板的上电极层18，如图3A所示。
例如，图3A示出了彩膜基底2和阵列基板之间可填充有第一密封剂15，钝化层3被第一密封剂15密封。例如，图3A示出了本发明另一实施例的有机发光二极管显示面板，其还可包括第二密封剂16，其设置于第一密封剂15***，用于密封第一密封剂15。
例如，第一密封剂15的粘度可小于第二密封剂16的粘度。
图3A中仅示出了彩膜基底2和阵列基板之间一侧填充密封剂的情形，另一侧也填充密封剂，此处的密封剂例如可指第一密封剂或者第一密封剂和第二密封剂。
在第一密封剂外侧设置第二密封剂，可以进一步保障显示面板的密封性能，而且可以提高第一密封剂的表面均匀度。而且由于第一密封剂直接接触有机发光二极管层6，在固化过程中，会由于接触面的张力对有机发光二极管层6造成损伤。通过将第一密封剂的粘度设置为小于第二密封剂的粘度，可以保证固化过程中第一密封剂与有机发光二极管层6的接触面仅具有较小的张力，从而减小有机发光二极管层6的损伤。同时，第二密封剂采用较大的粘度，可以保证对外界具有较强的阻水性，提高整体密封性能。
如图4所示，针对图3A的结构可添加金属走线7，例如，有机发光二极管显示面板还可以包括金属走线7，其设置于隔垫物4底部，且与辅助电极层5相接触。
例如，金属走线7可采用铝、钼或银等金属或其合金制成。
通过在隔垫物4的底部设置金属走线7，可以增加辅助电极层5的导电性，并降低有机发光二极管显示面板正面的电阻压降。
例如，辅助电极层5为透明导电薄膜，可以由In、Sn、Zn和Cd等金属的氧化物及其复合多元氧化物薄膜材料制成，例如ITO(氧化铟锡)或IZO(氧化铟锌)。
例如，上电极层可包括以下至少一种：银层、镁银合金层、氧化铟锡层、氧化铟锌层、金属层上覆盖有透明导电薄膜的复合层。
本发明的另一实施例还提供一种显示装置，其可包括上述任一实施例的有机发光二极管显示面板。
本发明实施例的显示装置例如可以为：电子纸、手机、手表、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
考虑到相关技术中，在采用隔垫物方式搭接电极时，难以保证显示面板的阻水性能和面板的信赖度。通过本发明实施例的技术方案，能够在采用WOLED实现全彩化，并以隔垫物方式搭接电极的同时，保证显示面板的具有良好的导电性能和阻水性能，以及较高的面板信赖度。
另外，本领域技术人员应该知道，根据实际需要，本发明的实施例的有机发光二极管显示面板还可以包括其他的结构和部件，有机发光二极管显示面板制造方法还可以包括其他的步骤和细节，只是与本发明的改进之处无关，在此不再赘述。
以上所述仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。
本专利申请要求于2014年7月28日递交的中国专利申请第201410363074.1号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (14)

  1. 一种阵列基板，其包括：阵列基底、结构层和布设于所述结构层顶部的有机发光二极管层和钝化层，
    其中，所述钝化层覆盖于所述阵列基板中有机发光二极管层的边缘以及所述结构层的侧面。
  2. 根据权利要求1所述的阵列基板，其中，所述阵列基底的外侧设置有覆晶薄膜区或软板焊接区，所述钝化层设置于所述有机发光二极管层的发光区和所述覆晶薄膜区或所述软板焊接区之间。
  3. 根据权利要求1或2所述的阵列基板，其中，所述钝化层为单层结构或多层堆叠结构。
  4. 根据权利要求1至3任一项所述的阵列基板，其中，所述钝化层包括氮化硅、氧化硅、氧化铝或氧化钛中的一种或其组合。
  5. 一种有机发光二极管显示面板，其包括权利要求1至4中任一项所述的阵列基板。
  6. 根据权利要求5所述的有机发光二极管显示面板，其中，所述阵列基板的有机发光二极管层上形成有上电极层。
  7. 根据权利要求6所述的有机发光二极管显示面板，还包括彩膜基板，
    其中，所述彩膜基板包括彩膜基底，所述彩膜基底面向所述阵列基板的一面形成有彩膜层，所述彩膜层上形成有辅助电极层，所述辅助电极层中形成有隔垫物或所述彩膜层上形成有隔垫物，所述隔垫物顶部的辅助电极层接触所述上电极层。
  8. 根据权利要求7所述的有机发光二极管显示面板，其中，所述彩膜基板和所述阵列基板之间填充有第一密封剂，所述钝化层被所述第一密封剂密封。
  9. 根据权利要求8所述的有机发光二极管显示面板，还包括：
    第二密封剂，其设置于所述第一密封剂***，用于密封所述第一密封剂。
  10. 根据权利要求9所述的有机发光二极管显示面板，其中，所述第一密封剂的粘度小于所述第二密封剂的粘度。
  11. 根据权利要求7至10任一项所述的有机发光二极管显示面板，还包 括：
    金属走线，其设置于所述隔垫物底部，且与所述辅助电极层相接触。
  12. 根据权利要求7至11中任一项所述的有机发光二极管显示面板，其中，所述辅助电极层为透明导电薄膜。
  13. 根据权利要求7至12中任一项所述的有机发光二极管显示面板，其中，所述上电极层包括以下至少一种：
    银层、镁银合金层、氧化铟锡层、氧化铟锌层、金属层上覆盖有透明导电薄膜的复合层。
  14. 一种显示装置，其包括权利要求5至13中任一项所述的有机发光二极管显示面板。
PCT/CN2014/092521 2014-07-28 2014-11-28 阵列基板、有机发光二极管显示面板和显示装置 WO2016015421A1 (zh)

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