WO2015198667A1 - 光送受信器 - Google Patents
光送受信器 Download PDFInfo
- Publication number
- WO2015198667A1 WO2015198667A1 PCT/JP2015/058744 JP2015058744W WO2015198667A1 WO 2015198667 A1 WO2015198667 A1 WO 2015198667A1 JP 2015058744 W JP2015058744 W JP 2015058744W WO 2015198667 A1 WO2015198667 A1 WO 2015198667A1
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- WO
- WIPO (PCT)
- Prior art keywords
- optical
- housing
- conductor
- optical component
- ground
- Prior art date
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- 230000003287 optical effect Effects 0.000 title claims abstract description 145
- 239000004020 conductor Substances 0.000 claims abstract description 38
- 239000012212 insulator Substances 0.000 claims abstract description 33
- 239000006096 absorbing agent Substances 0.000 claims description 9
- 239000013307 optical fiber Substances 0.000 claims description 7
- 208000032365 Electromagnetic interference Diseases 0.000 description 29
- 230000000694 effects Effects 0.000 description 15
- 239000002184 metal Substances 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000000758 substrate Substances 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4283—Electrical aspects with electrical insulation means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0239—Combinations of electrical or optical elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
Definitions
- the present invention relates to an optical transceiver having an EMI (Electro-Magnetic-Interference) countermeasure in an optical transceiver having an optical component whose own ground is integrated with a signal ground.
- EMI Electro-Magnetic-Interference
- An optical transceiver is an interface that is used for optical communication and converts electricity into light.
- an optical transceiver is provided with an optical component having a box-type EML (Electro-absorption Modulated Laser diode) element.
- substrate of an optical transmitter / receiver is connected to the EML element of an optical component via FPC (flexible printed circuit board).
- noise generated from the substrate is radiated into the housing with the FPC as a base point. Therefore, it is necessary to suppress radiation of this noise to the outside.
- noise of 10 GHz or more is generated in the housing.
- noise of 10 GHz or more passes through the optical transmitter / receiver casing (waveguide) without being attenuated, and is thus easily radiated to the outside.
- an optical fiber is connected to the optical connector of the optical component, and the optical connector and the connection port of the optical fiber are each made of metal.
- the metal of the optical connector and the metal of the connection port of the optical fiber function like an antenna and radiate noise to the outside.
- the box-type EML element used in the conventional optical transceiver has a configuration in which its own ground and signal ground are separated by providing a ceramic substrate at the connection portion with the FPC. Thereby, the signal ground and the frame ground can be separated.
- an optical transceiver using a box-type EML element as an EMI countermeasure, an optical component and a housing are in direct physical (electrical) contact with a conductive housing (see, for example, Patent Document 1). In this way, by electrically grounding the optical component and the housing, noise from the FPC can be released to the housing side and noise can be prevented from being radiated to the outside.
- the present invention has been made to solve the above-described problems.
- An object of the present invention is to provide an optical transceiver capable of obtaining EMI characteristics.
- An optical transceiver is an optical transceiver including an optical component housed in a housing and having its own ground integrated with a signal ground, and a conductor electrically connected to the optical component;
- the main surface is disposed along the inner wall of the casing, and a sheet-like insulator that separates the signal ground and the frame ground on the casing side is provided.
- the optical transceiver according to the present invention is an optical transceiver including an optical component housed in a housing and having its own ground integrated with a signal ground, and a conductor electrically connected to the optical component; A main surface is disposed between the conductor and the casing so as to be along the inner wall of the casing, and a sheet-shaped radio wave absorber that separates the signal ground and the frame ground on the casing is provided.
- optical transmitter-receiver which concerns on Embodiment 1 of this invention, it is a figure explaining the difference in the effect at the time of changing the thickness of an insulator. It is a disassembled perspective view which shows the structure of the optical transmitter-receiver which concerns on Embodiment 3 of this invention, and is a figure which shows the assembly process of an optical component. It is a figure which shows the relationship between the frequency of the noise which passes the inside of the housing
- FIG. 1 is an exploded perspective view showing a configuration of an optical transceiver according to Embodiment 1 of the present invention
- FIG. 2 is a side sectional view
- FIG. 3 is an enlarged view showing a portion A of FIG.
- An optical transceiver is an interface that is used for optical communication and converts electricity into light.
- the optical transceiver includes a substrate 2 and an optical component 3 housed in a housing 1 including a case 11 and a cover 12.
- the optical component 3 has an EML element 31 containing a semiconductor element (for example, a semiconductor laser element such as a laser diode).
- the substrate 2 is connected to the EML element 31 of the optical component 3 via the FPC 4.
- the optical transceiver is provided with an EMI countermeasure structure 5.
- the EMI countermeasure structure 5 is for suppressing the emission of noise generated from the substrate 2 and emitted from the FPC 4 as a base point to the outside.
- the EMI countermeasure structure 5 includes a conductor 51 and a sheet-like insulator 52. In the example shown in the figure, it is assumed that noise passes along the upper surface side in the housing 1, and the EMI countermeasure structure 5 is provided on the surface (upper surface side in the housing 1) closest to the passing noise in the housing 1. The case where is provided is shown.
- the conductor 51 is electrically connected to the optical component 3.
- a gasket 6 is used as the conductor 51 for regulating the position (vibration suppression) of the optical component 3 in the housing 1.
- the surface of the gasket 6 is plated with nickel or the like.
- the insulator 52 is disposed between the conductor 51 and the housing 1 so that the main surface is along the inner wall of the housing 1 and separates the signal ground and the frame ground on the housing 1 side. Shaped member.
- the insulator 52 is made of, for example, polyester or polyimide. The thickness of the insulator 52 is desirably equal to or less than a quarter wavelength of the noise frequency generated in the housing 1.
- FIG. 4 is a diagram illustrating the effect of the present invention, and is a diagram illustrating the relationship between the frequency of noise generated in the housing 1 and the pass characteristics.
- a broken line indicates a case where the EMI countermeasure structure 5 of the present invention is not provided between the optical component 3 and the housing 1
- a solid line indicates a case where the EMI countermeasure structure 5 of the present invention is provided.
- FIG. 5 is a diagram showing a difference in noise transmission mode in each region (region of the substrate 2, region of the insulator 52, region of the optical component 3 ahead of the insulator 52) in the optical transceiver.
- FIG. 6 is a diagram for explaining the difference in effect when the thickness of the insulator 52 is changed, and is a diagram showing the relationship between the frequency of noise generated in the housing 1 and the pass characteristics.
- a broken line is a figure which shows the case where the thickness of the insulator 52 is 1 mm
- a solid line is a figure which shows the case where the thickness of the insulator 52 is 0.1 mm.
- the noise transmission mode is different in each region, and mismatch occurs at the boundary. Then, the thinner the insulator 52 is (the smaller the wavelength is a quarter wavelength or less of the noise frequency generated in the housing 1), the higher the mismatch rate, and the better the filter effect as shown in FIG. Obtainable.
- the surface of the housing 1 is plated so that a greater filter effect can be obtained.
- the depth of the surface conductor in which the current is 1 / e (about 0.37) times the surface current is called the skin depth, and the skin depth is ⁇ (1 / ( ⁇ f)) [m]. expressed.
- ⁇ is the conductivity of the surface conductor
- ⁇ is the magnetic permeability of the surface conductor
- f is the noise frequency.
- nickel has a higher magnetic permeability than gold, silver, copper, etc., the skin depth is shallow, and the cross-sectional area of the surface conductor through which noise flows is narrowed. An effect can be obtained.
- the surface of the housing 1 of the optical transceiver is plated with nickel, so that new manufacturing steps and costs do not increase.
- the conductor 51 and the sheet-like insulator 52 are arranged between the optical component 3 and the housing 1, the own ground and the signal ground are provided.
- the signal ground and the frame ground can be separated and the EMI characteristics can be obtained.
- the thickness of the insulator 52 is set to a quarter wavelength or less of the noise frequency generated in the housing 1, a greater filter effect can be obtained. Further, by applying a plating treatment to the surface of the housing 1 (particularly with a material having a large surface resistance value such as nickel), a greater filter effect can be obtained.
- the optical transceiver can be configured at a lower cost than when the box-type EML element 31 is used.
- the present invention is not limited to this, and the EMI countermeasure structure 5 of the present invention can be applied to other optical transceivers using the optical component 3 in which its own ground and signal ground are integrated.
- the effect of can be obtained.
- the conventional EMI countermeasure cannot be applied because the signal ground and the frame ground are integrated, but the EMI countermeasure structure 5 of the present invention is applicable and can obtain the same effects as described above. .
- the triplexer type optical component 3 having three CAN type elements is used.
- the number of elements is not limited to this, and any type of optical component 3 may be used, and the EMI countermeasure structure 5 of the present invention is applicable.
- the conductor 51 gasket 6
- the conductor 51 gasket 6
- the present invention is not limited to this, and the conductor 51 divided into a plurality according to the difference in height at each part of the optical component 3 may be used.
- the EMI countermeasure structure 5 is provided only on the surface (upper surface side in the housing 1) closest to the noise passing through the housing 1 in the housing 1 is shown.
- the EMI countermeasure structure 5 including the conductor 51 and the sheet-like insulator 52 may be provided on the other surface of the housing 1.
- Embodiment 2 the case where the conductor 51 and the sheet-like insulator 52 are disposed between the optical component 3 and the housing 1 has been described.
- the sheet-like insulator 52 may be replaced with a sheet-like wave absorber 53.
- the thickness of the radio wave absorber 53 is desirably equal to or less than a quarter wavelength of the noise frequency generated in the housing 1, similarly to the insulator 52 of the first embodiment.
- the radio wave absorber 53 instead of the insulator 52, the noise absorption effect by the radio wave absorber 53 can be obtained in addition to the effect in the first embodiment, and the EMI characteristics are further improved.
- Embodiment 3 FIG.
- the signal ground and the frame ground are separated by disposing the conductor 51 and the sheet-like insulator 52 (or the radio wave absorber 53) between the optical component 3 and the housing 1.
- a configuration for obtaining EMI characteristics is shown.
- Embodiment 3 shows a configuration for preventing noise generated in the housing 1 from being emitted from the optical connector 32 of the optical component 3.
- FIG. 7 is an exploded perspective view showing the configuration of the optical transceiver according to Embodiment 3 of the present invention, and shows the assembly process of the optical component 3.
- the substrate 2, the FPC 4, and the EMI countermeasure structure 5 are the same as those in the first and second embodiments, and illustration and description thereof are omitted.
- the optical component 3 has an optical connector 32 to which an optical fiber (not shown) is connected.
- a second insulator 33 that insulates the main body portion of the optical component 3 and the optical connector 32 is provided between the main body portion of the optical component 3 and the optical connector 32.
- the case 11 of the housing 1 is provided with ribs 13 for holding the receptacle 34 of the optical component 3 and for regulating the position of the optical component 3.
- a conductive first elastic member 35 for electrically connecting the receptacle 34 to the rib 13 of the case 11 is wound around the receptacle 34 of the optical connector 32. Further, on the upper side of the receptacle 34 held by the rib 13, there is a metal member 7 electrically connected to the receptacle 34 via the first elastic member 35 by being inserted across both side surfaces of the rib 13. Is provided.
- a conductive second elastic member 8 that electrically connects the metal member 7 and the cover 12 of the housing 1 is provided on the upper side of the metal member 7.
- the rib 13, the first and second elastic members 35, 8 and the metal member 7 constitute a second conductor that electrically connects the receptacle 34 of the optical connector 32 and the housing 1.
- FIG. 7 shows a case where the receptacle 34 and the housing 1 are configured to be electrically connected without a gap, but it is sufficient that at least four or more points are connected.
- the optical component 3 When the optical component 3 is assembled to the housing 1, first, as shown in FIGS. 7A and 7B, the optical component 3 is accommodated in the case 11 and the first elastic member 35 is interposed therebetween.
- the receptacle 34 is electrically connected to the rib 13.
- the metal member 7 is inserted with the both side surfaces of the rib 13 being sandwiched, so that the receptacle 34 is electrically connected to the metal member 7 via the first elastic member 35.
- the second elastic member 8 is disposed on the metal member 7 and the cover 12 is attached, so that the metal member 7 is electrically connected to the cover 12.
- the main body portion of the optical component 3 and the optical connector 32 are insulated by the second insulator 33, and the receptacle 34 and the housing of the optical connector 32 are insulated by the second conductor. Since at least four or more points are electrically connected to the body 1, in addition to the effects in the first and second embodiments, the noise generated in the housing 1 is prevented from being radiated from the optical connector 32. Can do.
- the configuration of the third embodiment is effective when the main body of the optical component 3 needs to be electrically separated from the housing 1.
- the present invention is not limited to this configuration, and the second conductor may be configured to electrically connect the receptacle 34 of the optical connector 32 and the housing 1 without a gap.
- the invention of the present application can be freely combined with each embodiment, modified with any component in each embodiment, or omitted with any component in each embodiment. .
- An optical transceiver includes an optical component housed in a housing and having its own ground integrated with a signal ground, a conductor electrically connected to the optical component, and the conductor and the housing.
- the main surface is arranged along the inner wall of the casing, and the sheet-like insulator that separates the signal ground and the frame ground on the casing side is configured, so that EMI characteristics can be obtained, Suitable for optical communication.
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Abstract
Description
特に、伝送速度が10Gbpsの10GEPONに対応した光送受信器では、筐体内に10GHz以上のノイズが発生する。そして、10GHz以上のノイズは、図8に示すように、光送受信器の筐体(導波管)内で減衰されずに通過するため、外部に放射されやすい。なお図8では、図示する導波管(管内幅a=6mm、管内高さb=15mm、全長L=100mm)内をノイズが伝送する場合の通過特性を示している。
そして、ボックスタイプのEML素子を用いた光送受信器では、EMI対策として、光部品及び筐体を導電性ハウジングに物理的(電気的)に直接接触させている(例えば特許文献1参照)。このように、光部品と筐体とを電気的に接地させることで、FPCからのノイズを筐体側に逃がし、ノイズが外部に放射されることを抑制できる。
一方、上記のような光送受信器では、伝送速度の高速化に伴い、コストの低減が求められている。そこで、ボックスタイプのEML素子に代えて、より安価なCANタイプのEML素子を用いることが検討されている。しかしながら、現状のCANタイプのEML素子では、表面が金属で覆われ、また、ボックスタイプのようなセラミック基板は設けられていない。そのため、EMI対策として、従来のように光部品と光送受信器の筐体とを電気的に接地してしまうと、光部品を介してシグナルグランドとフレームグランドとが一体となってしまい、装置の仕様違反となってしまう。よって、従来のようなEMI対策を行うことができないという課題があった。
実施の形態1.
図1はこの発明の実施の形態1に係る光送受信器の構成を示す分解斜視図であり、図2は側断面図であり、図3は図2のA部を示す拡大図である。
光送受信器は、光通信に用いられ、電気を光に変換するインタフェースである。図1~3に示すように、光送受信器には、ケース11及びカバー12から成る筐体1内に、基板2及び光部品3が収納されている。光部品3は、半導体素子(例えばレーザダイオード等の半導体レーザ素子)を内蔵するEML素子31を有している。そして、光部品3のEML素子31には、基板2がFPC4を介して接続されている。
図4は本発明の効果を説明する図であり、筐体1内で発生したノイズの周波数と通過特性との関係を示す図である。図4において、破線は光部品3と筐体1との間に本発明のEMI対策構造5を設けなかった場合を示し、実線は本発明のEMI対策構造5を設けた場合を示す図である。この図4から、本発明のEMI対策構造5を設けることで、筐体1内を通過するノイズを抑制できることがわかる。なお、この抑制量は、光送受信器に求められるEMI特性として十分な量である。その結果、ノイズが外部に放射されることを抑制できる。
図5に矢印で示すように、光送受信器内では、各領域でノイズの伝送モードが異なり、その境界で不整合を起こす。そして、絶縁体52の厚みが薄いほど(筐体1内で発生するノイズ周波数の4分の1波長以下であるほど)不整合の割合が高くなり、図6に示すように良好なフィルタ効果を得ることができる。
すなわち、ノイズは、筐体1の表面に形成された表面導体を伝送する。そして、その際のノイズの電流密度は、表面導体の表面では大きく、表面から離れると小さくなる(表皮効果)。また、電流が表面の電流の1/e(約0.37)倍となる表面導体の断面方向の深さを表皮深さと呼び、表皮深さは√(1/(πσμf))[m]で表される。なお、σは表面導体の導電率、μは表面導体の透磁率、fはノイズの周波数である。そして、ニッケルは、金、銀、銅等に比べて透磁率が高いため、表皮深さが浅く、ノイズが流れる表面導体の断面積が狭くなるので、ノイズの通過損失が大きくなり、より大きなフィルタ効果を得ることができる。
なお、通常、光送受信器の筐体1の表面にはニッケルによるメッキ処理が施されているため、新たな製造工程及びコストが増えることはない。
また、筐体1の表面に(特にニッケルのような表面抵抗値の大きい材質により)メッキ処理を施すことで、より大きなフィルタ効果を得ることができる。
例えば、トリプレクサ型の光部品3において、EML素子31がボックスタイプであり当該EML素子31側で自身のグランドとシグナルグランドとを分離できる場合であっても、他の素子でグランド分離を行えない場合がある。このような場合、従来のEMI対策ではシグナルグランドとフレームグランドとが一体になってしまうため適用できないが、本発明のEMI対策構造5は適用可能であり、上記と同様の効果を得ることができる。
実施の形態1では、光部品3と筐体1との間に導電体51とシート状の絶縁体52を配置した場合について示した。それに対し、シート状の絶縁体52をシート状の電波吸収体53に置き換えてもよい。なお、電波吸収体53の厚みは、実施の形態1の絶縁体52と同様に、筐体1内で発生するノイズ周波数の4分の1波長以下であることが望ましい。このように、絶縁体52に代えて電波吸収体53を用いることで、実施の形態1における効果に加え、電波吸収体53によるノイズ吸収効果も得られるため、さらにEMI特性が向上する。
実施の形態1,2では、光部品3と筐体1との間に導電体51とシート状の絶縁体52(又は電波吸収体53)を配置することで、シグナルグランドとフレームグランドとを分離し、かつEMI特性を得る構成について示した。それに対し、実施の形態3では、筐体1内で発生したノイズが光部品3の光コネクタ32から放射されることを防ぐための構成について示す。
図7はこの発明の実施の形態3に係る光送受信器の構成を示す分解斜視図であり、光部品3の組み立て工程を示す図である。なお図7に示す光送受信器において、基板2、FPC4及びEMI対策構造5は実施の形態1,2の構成と同一であり、その図示及び説明は省略する。
このリブ13、第1,2の弾性部材35,8及び金属部材7は、光コネクタ32のレセプタクル34と筐体1とを電気的に接続する第2の導電体を構成する。なお図7では、レセプタクル34と筐体1とを電気的に隙間なく接続するように構成した場合を示しているが、少なくとも4点以上接続されていればよい。
Claims (10)
- 筐体に収納され、自身のグランドがシグナルグランドと一体である光部品を備えた光送受信器において、
前記光部品に電気的に接続された導電体と、
前記導電体と前記筐体との間に主面が当該筐体内壁に沿うように配置され、前記シグナルグランドと当該筐体側のフレームグランドとを分離するシート状の絶縁体と
を備えたことを特徴とする光送受信器。 - 前記絶縁体の厚みは、前記筐体内で発生するノイズ周波数の4分の1波長以下である
ことを特徴とする請求項1記載の光送受信器。 - 筐体に収納され、自身のグランドがシグナルグランドと一体である光部品を備えた光送受信器において、
前記光部品に電気的に接続された導電体と、
前記導電体と前記筐体との間に主面が当該筐体内壁に沿うように配置され、前記シグナルグランドと当該筐体側のフレームグランドとを分離するシート状の電波吸収体と
を備えたことを特徴とする光送受信器。 - 前記電波吸収体の厚みは、前記筐体内で発生するノイズ周波数の4分の1波長以下である
ことを特徴とする請求項3記載の光送受信器。 - 前記筐体はメッキ処理が施された
ことを特徴とする請求項1記載の光送受信器。 - 前記筐体はメッキ処理が施された
ことを特徴とする請求項3記載の光送受信器。 - 前記導電体は、前記筐体内において前記光部品の位置規制を行うガスケットである
ことを特徴とする請求項1記載の光送受信器。 - 前記導電体は、前記筐体内において前記光部品の位置規制を行うガスケットである
ことを特徴とする請求項3記載の光送受信器。 - 前記光部品は、光ファイバが接続される光コネクタを有し、
前記光部品の本体部と前記光コネクタとを絶縁する第2の絶縁体と、
前記光コネクタのレセプタクルと前記筐体とを電気的に少なくとも4点以上接続する第2の導電体とを備えた
ことを特徴とする請求項1記載の光送受信器。 - 前記光部品は、光ファイバが接続される光コネクタを有し、
前記光部品の本体部と前記光コネクタとを絶縁する第2の絶縁体と、
前記光コネクタのレセプタクルと前記筐体とを電気的に少なくとも4点以上接続する第2の導電体とを備えた
ことを特徴とする請求項3記載の光送受信器。
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