WO2015163483A1 - ヒータおよび点火装置 - Google Patents
ヒータおよび点火装置 Download PDFInfo
- Publication number
- WO2015163483A1 WO2015163483A1 PCT/JP2015/062651 JP2015062651W WO2015163483A1 WO 2015163483 A1 WO2015163483 A1 WO 2015163483A1 JP 2015062651 W JP2015062651 W JP 2015062651W WO 2015163483 A1 WO2015163483 A1 WO 2015163483A1
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- WIPO (PCT)
- Prior art keywords
- conductive layer
- heater
- heating resistor
- ceramic
- average particle
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 76
- 239000002245 particle Substances 0.000 claims abstract description 54
- 238000010438 heat treatment Methods 0.000 claims description 49
- 239000000446 fuel Substances 0.000 claims description 7
- 239000007789 gas Substances 0.000 description 8
- 230000020169 heat generation Effects 0.000 description 8
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- 238000010304 firing Methods 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 238000009423 ventilation Methods 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910016006 MoSi Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23Q—IGNITION; EXTINGUISHING-DEVICES
- F23Q7/00—Incandescent ignition; Igniters using electrically-produced heat, e.g. lighters for cigarettes; Electrically-heated glowing plugs
- F23Q7/001—Glowing plugs for internal-combustion engines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/42—Heating elements having the shape of rods or tubes non-flexible
- H05B3/48—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/027—Heaters specially adapted for glow plug igniters
Definitions
- the present invention relates to a heater and an ignition device.
- a heater in which a heating element is provided inside a ceramic body is known as a heater used for a gas range, an in-vehicle heating device, an oil fan heater, or a glow plug of an automobile engine.
- a ceramic heater the ceramic heater disclosed by patent document 1 is mentioned, for example.
- a ceramic heater disclosed in Japanese Unexamined Patent Publication No. 2000-156275 includes a ceramic structure, a heating resistor embedded in the ceramic structure, and a ceramic structure connected to the heating resistor. And a power supply line drawn out on the surface.
- the heater includes a ceramic laminate formed by laminating a plurality of ceramic layers, a belt-like heating resistor provided between the ceramic layers and having both ends drawn to the side surfaces of the ceramic laminate, and the heating resistor between the ceramic layers.
- FIG. 2 is a cross-sectional view of the heater shown in FIG. 1 cut along line AA ′.
- FIG. 2 is a cross-sectional view of the heater shown in FIG. 1 cut along the line BB ′. It is a cross-sectional view showing a modification of the heater. It is a perspective view which shows the ignition device using the heater shown in FIG.
- the heater 10 includes a ceramic laminated body 1 in which a plurality of ceramic layers 11 are laminated, a heating resistor 2 provided between adjacent ceramic layers 11, and a heating resistor 2. And a conductive layer 3 laminated thereon.
- the heater 10 can be used for, for example, a glow plug or a gas range of an automobile engine.
- Ceramic laminate 1 is a member in which heating resistor 2 and conductive layer 3 are embedded. By providing the heating resistor 2 and the conductive layer 3 inside the ceramic laminate 1, the durability of the heating resistor 2 and the conductive layer 3 can be improved.
- the ceramic laminate 1 is, for example, a rod-shaped or plate-shaped member.
- the ceramic laminate 1 is made of ceramics having electrical insulation properties such as insulating ceramics, nitride ceramics or carbide ceramics. Specifically, the ceramic laminate 1 is made of alumina ceramic, silicon nitride ceramic, aluminum nitride ceramic, silicon carbide ceramic, or the like.
- the ceramic laminate 1 made of silicon nitride ceramics can be obtained by the following method. Specifically, for example, 5 to 15% by mass of a rare earth element oxide such as Y 2 O 3 , Yb 2 O 3 or Er 2 O 3 as a sintering aid with respect to silicon nitride as a main component; 5 amount such that the amount of SiO 2 is 1.5 to 5 wt% contained Al 2 O 3 and sintered to 5% by weight is mixed with SiO 2 which is adjusted. Then, the ceramic laminate 1 made of silicon nitride ceramics can be obtained by forming into a predetermined shape and firing at a temperature of 1650 to 1780 ° C. For the firing, for example, hot press firing can be used.
- a rare earth element oxide such as Y 2 O 3 , Yb 2 O 3 or Er 2 O 3
- the length of the ceramic laminate 1 is set to 20 to 100 mm, for example.
- the cross section of the ceramic laminate 1 is set to a square having a thickness of 1 to 6 mm and a width of 2 to 40 mm, for example.
- the heating resistor 2 is a layered member that generates heat when a voltage is applied.
- the heating resistor 2 is provided between the adjacent ceramic layers 11.
- a voltage is applied to the heating resistor 2
- a current flows and the heating resistor 2 generates heat.
- the heat generated by this heat generation is transmitted inside the ceramic laminate 1 and the surface of the ceramic laminate 1 becomes high temperature.
- the heater 10 functions when heat is transferred from the surface of the ceramic laminate 1 to the object to be heated.
- a to-be-heated material which can transmit heat from the surface of the ceramic laminated body 1, the light oil etc. which are supplied into the inside of the diesel engine for motor vehicles, etc. are mentioned, for example.
- the both ends of the heating resistor 2 are drawn out to the side surface on the rear end side of the ceramic laminate 1.
- the heating resistor 2 has a vertical cross section (a cross section parallel to the length direction of the heating resistor 2), for example, a folded shape.
- the heating resistor 2 has two adjacent linear portions and a connecting portion that has an outer periphery and an inner periphery that are substantially semicircular or semi-elliptical and that folds and connects the two linear portions. is doing.
- the heating resistor 2 is folded back near the tip of the ceramic laminate 1.
- the total length of the heating resistor 2 is set to 35 to 100 mm, for example.
- the heating resistor 2 is designed to generate a large amount of heat at the tip side of the ceramic laminate 1.
- the conductive layer 3 is laminated on both ends of the heating resistor 2 on the rear end side of the ceramic laminate 1. Therefore, current flows through the heating resistor 2 and the conductive layer 3 on the rear end side of the ceramic laminate 1. As a result, heat generation of the heating resistor 2 is reduced on the rear end side of the ceramic laminate 1. On the contrary, current flows only through the heating resistor 2 on the tip side of the ceramic laminate 1. As a result, heat generation of the heating resistor 2 is increased on the tip side of the ceramic laminate 1.
- the heating resistor 2 is mainly composed of a carbide such as tungsten (W), molybdenum (Mo), or titanium (Ti), nitride, silicide, or the like.
- a carbide such as tungsten (W), molybdenum (Mo), or titanium (Ti), nitride, silicide, or the like.
- the ceramic laminate 1 is made of silicon nitride ceramic, it is preferable that the main component of the heating resistor 2 is made of tungsten carbide. Thereby, the thermal expansion coefficient of the ceramic laminated body 1 and the thermal expansion coefficient of the heating resistor 2 can be brought close to each other.
- the conductive layer 3 is a member for adjusting the amount of heat generated by the heating resistor 2 at the rear end side of the ceramic laminate 1, that is, in the vicinity of the portion where the heating resistor 2 is drawn to the side surface of the ceramic laminate 1.
- the conductive layer 3 is indicated by a broken line.
- the broken line indicating the conductive layer 3 and the solid line indicating the heating resistor 2 are shifted from each other. Have substantially the same width, and the conductive layer 3 and the heating resistor 2 are laminated so as to have the same width. As shown in FIGS.
- the conductive layer 3 is laminated between the ceramic layers 11 on both ends of the heating resistor 2, and one end is drawn out to the side surface of the ceramic laminate 1. Yes.
- the heat generation on the rear end side of the ceramic laminate 1 can be reduced. . Therefore, the reliability of connection between the external circuit and the heater 10 can be improved.
- the conductive layer 3 has a first conductive layer 31 drawn to the side surface of the ceramic laminate 1 and a second conductive layer 32 adjacent to the first conductive layer 31.
- the first conductive layer 31 and the second conductive layer 32 are composed of a plurality of particles.
- the average particle size of the particles of the first conductive layer 31 is smaller than the average particle size of the particles of the second conductive layer 32.
- the density of the 1st conductive layer 31 can be raised because the 1st conductive layer 31 located in the outer side consists of a particle
- the porosity of the first conductive layer 31 is reduced, it is possible to reduce the outside air from entering the conductive layer 3.
- the portion drawn to the side surface can have a two-layer structure. Therefore, even if a crack occurs in one of the conductive layer 3 or the heating resistor 2, the risk of the crack developing in the other can be reduced.
- the second conductive layer 32 is made of particles having a large average particle diameter, so that the grain boundaries of the particles in the second conductive layer 32 can be reduced, so that the resistance value of the second conductive layer 32 can be reduced. . Thereby, unnecessary heat generation occurring in the conductive layer 3 can be reduced.
- the heater 10 has improved long-term reliability when used under a heat cycle.
- the average particle size of the conductive layer is constant regardless of the part. That is, when the average particle size of the conductive layer is simply reduced, the resistance of the conductive layer itself is increased even if the outside air can be reduced from entering the conductive layer. In this case, unnecessary heat is generated. On the other hand, when the average particle size of the conductive layer is simply increased, it is easy for outside air to enter the conductive layer even if unnecessary heat generation in the conductive layer can be reduced. On the other hand, like the heater 10 described above, the average particle size of the particles of the first conductive layer 31 is made smaller than the average particle size of the particles of the second conductive layer 32, thereby reducing the entry of outside air. Unnecessary heat generation in the conductive layer 3 can be reduced.
- the first conductive layer 31 and the second conductive layer 32 partially overlap as shown in FIG.
- the thermal expansion coefficient of the conductive layer 3 is changed stepwise. Can be made. As a result, it is possible to reduce the possibility that the conductive layer 3 is cracked under a heat cycle.
- the first conductive layer 31 is positioned between the second conductive layer 32 and the heating resistor 2, and the first conductive layer 31 is positioned between the second conductive layer 32 and the heating resistor 2 in the first It is preferable that the conductive layer 31 becomes thinner toward the other end. Thereby, the thermal expansion coefficient of the conductive layer 3 can be changed gently. As a result, it is possible to further reduce the possibility that the conductive layer 3 is cracked under a heat cycle.
- the conductive layer 3 includes only the first conductive layer 31 and the second conductive layer 32.
- the conductive layer 3 may have a portion other than the first conductive layer 31 and the second conductive layer 32.
- the conductive layer 3 may include a third conductive layer 33 in addition to the first conductive layer 31 and the second conductive layer 32.
- the third conductive layer 33 is adjacent to the second conductive layer 32 on the side opposite to the first conductive layer 31.
- the layer used as the third conductive layer 33 is not particularly limited.
- the average particle diameter of the particles of the third conductive layer 33 may be smaller than the average particle diameter of the particles of the second conductive layer 32.
- the grain boundaries of the particles in the third conductive layer 33 increase. Therefore, the resistance value in the third conductive layer 33 can be made larger than the resistance value in the second conductive layer 32.
- the emitted-heat amount of the heating resistor 2 can be changed in steps. Therefore, the temperature of the surface of the heater 10 can be changed stepwise. As a result, generation of a large thermal stress locally in the ceramic laminate 1 can be reduced.
- the first conductive layer 31 to the third conductive layer 33 are made of a metal material having excellent heat resistance such as molybdenum (Mo), tungsten (W), or rhenium (Re), for example.
- MoSi 2 and WSi 2 or the like are used in order to bring the coefficient of thermal expansion close to that of the ceramic laminate 1, it is preferable to mix MoSi 2 and WSi 2 or the like.
- the length of the first conductive layer 31 is set such that the length of the portion along the length direction of the heating resistor 2 is about 2 to 10 mm.
- the thickness of the first conductive layer 31 is set to about 5 to 30 ⁇ m.
- the length of the second conductive layer 32 is set to about 5 to 20 mm at the portion along the length direction of the heating resistor 2.
- the thickness of the second conductive layer 32 is set to about 25 to 75 ⁇ m.
- the particle size of the first conductive layer 31 and the second conductive layer 32 can be adjusted as follows. Specifically, in the case where both the first conductive layer 31 and the second conductive layer 32 are made of W, the first conductive layer 31 and the second conductive layer are made different by changing the particle diameter of the starting W powder.
- the particle size of 32 can be adjusted.
- the average particle size of the W powder used for the first conductive layer 31 may be set to 0.2 ⁇ m
- the average particle size of the W powder used for the second conductive layer 32 may be set to 1.2 ⁇ m.
- the average particle diameter of the first conductive layer 31 can be set to 0.2 to 2 ⁇ m
- the average particle diameter of the second conductive layer 32 can be set to 1.2 to 12 ⁇ m.
- the average particle size of the first conductive layer 31 is preferably less than 1 ⁇ m. Thereby, since it can reduce that external air penetrate
- the porosity of the first conductive layer is preferably less than 20%. Thereby, the approach of the outside air to the first conductive layer 31 can be reduced.
- the average particle diameter of the conductive layer 3 can be confirmed, for example, by the following method. Specifically, after the heater 10 is cut with a diamond cutter in a plane perpendicular to the conductive layer 3 passing through the conductive layer 3, the surface is polished with diamond powder. Then, what is necessary is just to observe the 1st conductive layer 31 and the 2nd conductive layer 32 using a scanning electron microscope or a metal microscope. More specifically, arbitrary five straight lines are drawn on the image obtained by the scanning electron microscope or the metal microscope. And the average value of the distance for 10 particles crossing these five straight lines is obtained. By dividing this average value by 10 which is the number of particles, the average particle diameter can be obtained. Further, the average particle diameter may be calculated using an image analyzer (manufactured by Nireco: LUZEX-FS). The above image analysis apparatus can also be used when measuring the porosity of the first conductive layer 31.
- the heater 10 is used, for example, as an ignition device 100 as shown in FIG.
- the ignition device 100 includes a heater 10 and a flow path 20 through which gaseous fuel flows through the heater 10.
- the flow path 20 is comprised by the ventilation pipe 22 which has the gas valve 21 and the jet nozzle 23, for example.
- the gas valve 21 has a function of controlling the flow rate of the gaseous fuel. Examples of the gaseous fuel supplied from the gas valve 21 include natural gas or propane gas.
- the ventilation pipe 22 ejects the gaseous fuel supplied from the gas valve 21 toward the heater 10 from the ejection port 23. And it can ignite by heating the heater 10 with respect to the gaseous fuel currently injected. Since the ignition device 100 includes the heater 10 with improved long-term reliability, the stability of ignition of gaseous fuel is improved.
- Ceramic laminate 11 Ceramic layer 2: Heating resistor 3: Conductive layer 31: First conductive layer 32: Second conductive layer 10: Heater 20: Channel 21: Gas valve 22: Ventilation pipe 23: Jet outlet 100: Ignition device
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Resistance Heating (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201580012328.8A CN106105384B (zh) | 2014-04-25 | 2015-04-27 | 加热器以及点火装置 |
EP15782910.2A EP3136819B1 (en) | 2014-04-25 | 2015-04-27 | Heater and ignition device |
JP2016515248A JP6027289B2 (ja) | 2014-04-25 | 2015-04-27 | ヒータおよび点火装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-090911 | 2014-04-25 | ||
JP2014090911 | 2014-04-25 |
Publications (1)
Publication Number | Publication Date |
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WO2015163483A1 true WO2015163483A1 (ja) | 2015-10-29 |
Family
ID=54332639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2015/062651 WO2015163483A1 (ja) | 2014-04-25 | 2015-04-27 | ヒータおよび点火装置 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP3136819B1 (zh) |
JP (1) | JP6027289B2 (zh) |
CN (1) | CN106105384B (zh) |
WO (1) | WO2015163483A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020027047A1 (ja) * | 2018-07-31 | 2020-02-06 | 京セラ株式会社 | ヒータ |
Families Citing this family (1)
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JP2022544996A (ja) * | 2019-08-19 | 2022-10-24 | エスシーピー ホールディングス,アン アシュームド ビジネス ネーム オブ ナイトライド イグナイターズ,リミティド ライアビリティ カンパニー | セラミックヒーター付き熱作動式ガスバルブ |
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EP2763498B1 (en) * | 2011-09-29 | 2016-08-03 | Kyocera Corporation | Heater and glow plug provided with same |
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2015
- 2015-04-27 CN CN201580012328.8A patent/CN106105384B/zh active Active
- 2015-04-27 EP EP15782910.2A patent/EP3136819B1/en active Active
- 2015-04-27 WO PCT/JP2015/062651 patent/WO2015163483A1/ja active Application Filing
- 2015-04-27 JP JP2016515248A patent/JP6027289B2/ja active Active
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JPWO2020027047A1 (ja) * | 2018-07-31 | 2021-03-11 | 京セラ株式会社 | ヒータ |
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JPWO2015163483A1 (ja) | 2017-04-20 |
CN106105384A (zh) | 2016-11-09 |
EP3136819A4 (en) | 2017-12-27 |
CN106105384B (zh) | 2019-08-02 |
JP6027289B2 (ja) | 2016-11-16 |
EP3136819B1 (en) | 2020-05-06 |
EP3136819A1 (en) | 2017-03-01 |
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