WO2015152217A1 - 基板処理装置、デバイス製造方法及び基板処理装置の調整方法 - Google Patents
基板処理装置、デバイス製造方法及び基板処理装置の調整方法 Download PDFInfo
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- WO2015152217A1 WO2015152217A1 PCT/JP2015/060078 JP2015060078W WO2015152217A1 WO 2015152217 A1 WO2015152217 A1 WO 2015152217A1 JP 2015060078 W JP2015060078 W JP 2015060078W WO 2015152217 A1 WO2015152217 A1 WO 2015152217A1
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- Prior art keywords
- substrate
- processing apparatus
- line
- substrate processing
- scanning
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
- G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
Definitions
- the present invention relates to a substrate processing apparatus, a device manufacturing method, and a substrate processing apparatus adjustment method.
- Patent Document 1 a manufacturing apparatus that performs drawing at a predetermined position on a sheet-like medium (substrate) is known as a substrate processing apparatus (see, for example, Patent Document 1).
- the manufacturing apparatus described in Patent Document 1 measures the expansion and contraction of a sheet substrate by detecting an alignment mark on a flexible long sheet substrate that easily expands and contracts in the width direction, and the drawing position ( The machining position is corrected.
- the manufacturing apparatus of Patent Document 1 exposure is performed by switching a spatial modulation element (DMD: Digital Micro mirror Device) while transporting the substrate in the transport direction, and a pattern is drawn on the substrate by a plurality of drawing units.
- DMD Digital Micro mirror Device
- patterns adjacent to each other in the width direction of the substrate are subjected to joint exposure by a plurality of drawing units, but are generated by performing test exposure and development in order to suppress errors in joint exposure.
- the measurement result of the pattern position error at the joint is fed back.
- the feedback process including such operations as test exposure, development, and measurement, depending on the frequency, temporarily stops the production line, reduces the productivity of the product, and wastes the substrate. May occur.
- An aspect of the present invention has been made in view of the above-described problems, and the object thereof is to use a plurality of drawing units, even when the patterns are stitched in the width direction of the substrate and exposed (drawn). It is an object of the present invention to provide a substrate processing apparatus, a device manufacturing method, and a method for adjusting a substrate processing apparatus that can stably and accurately draw a pattern having a large area on a substrate.
- a support surface for supporting a long sheet-like substrate, and reference marks are provided at a plurality of positions on the support surface in the width direction intersecting the longitudinal direction of the substrate.
- a support member provided; a transport device that moves the substrate supported by the support member in the longitudinal direction; and a beam spot beam projected onto the substrate supported by the support surface or the support surface.
- a plurality of drawing units that scan within a range narrower than the dimension in the width direction of the substrate and can draw a predetermined pattern along the drawing lines obtained by the scanning, and each drawing line of the plurality of drawing units
- a drawing apparatus in which the plurality of drawing units are arranged in the width direction of the substrate so that the patterns drawn on the substrate are joined together in the width direction of the substrate as the substrate moves in the longitudinal direction.
- a reflected light detection unit that is provided in each of the plurality of drawing units and detects reflected light reflected from the support surface of the support member or the substrate by projection of the spot light of the beam, and each of the plurality of drawing units
- a measuring device that measures an arrangement relationship of the plurality of drawing lines based on a signal output from the reflected light detection unit when the reference mark of the support member is positioned on the drawing line.
- a processing device is provided.
- the second aspect of the present invention there is provided a device manufacturing method for forming the pattern on the substrate using the substrate processing apparatus according to the first aspect of the present invention.
- a support member provided with a plurality of predetermined predetermined positions on the support surface with discrete or continuous specific reference marks, and a substrate having a predetermined width on the support surface of the support member.
- a conveying device that conveys at a predetermined speed in a longitudinal direction intersecting the width direction, and scanning the spot light of the beam projected on the substrate in the width direction within a range narrower than the width of the substrate.
- a plurality of drawing units capable of drawing a predetermined pattern on the substrate along the obtained drawing line, and the patterns drawn on the substrate by each of the plurality of drawing units are the length of the substrate.
- a substrate processing apparatus adjustment method comprising: a plurality of reflected light detection units that detect reflected light generated from a support surface of the support member by irradiation of the beam from each of the drawing units; A scanning step of moving the support member and the drawing apparatus relative to each other so that the reference mark is provided on the drawing line formed by each of the units, and scanning the reference mark with the spot light of the beam; A detection step of detecting reflected light generated from the reference mark by the beam scanning by the reflected light detection unit and obtaining a detection signal corresponding to the reference mark; and the plurality of drawing based on the detection signal Obtaining adjustment information corresponding to a line arrangement state or mutual arrangement error, and based on the adjustment information, Adjusting the drawing state of the pattern by each of the drawing units, a method of adjusting the substrate processing apparatus
- the beam and the substrate are arranged in a direction crossing the drawing line while main-scanning the spot light of the intensity-modulated beam along a predetermined drawing line on the substrate.
- a substrate processing apparatus that draws a predetermined pattern on the substrate by performing sub-scanning, the supporting member having a supporting surface that supports the substrate, and the substrate supported by the supporting member on the substrate.
- a carrier device that moves in a direction, a pulse laser light source that outputs a pulse beam in an ultraviolet wavelength region at a repetition emission frequency Fz as the beam, and a pulse beam from the pulse laser light source in a pattern to be drawn on the drawing line
- a modulator that modulates the intensity in response
- a scanning optical system that deflects and scans the beam modulated by the modulator in a one-dimensional manner, and projects the deflected and scanned beam toward the substrate.
- a drawing unit including a beam projection optical system that performs the drawing line length LBL, the scanning time over the length LBL of the beam spot light Ts, and the spot light drawing line
- a substrate processing apparatus in which the emission frequency Fz of the pulse laser light source is set so as to satisfy a relationship of Fz ⁇ LBL / (Ts ⁇ Xs), where Xs is a dimension in the along direction.
- a substrate processing apparatus, a device manufacturing method, and a substrate processing apparatus adjustment method can be provided.
- FIG. 1 is a view showing the overall configuration of an exposure apparatus (substrate processing apparatus) according to the first embodiment.
- FIG. 2 is a perspective view showing the arrangement of the main parts of the exposure apparatus of FIG.
- FIG. 3 is a diagram illustrating an arrangement relationship between the alignment microscope and the drawing lines on the substrate.
- FIG. 4 is a view showing the arrangement of the rotating drum and drawing apparatus of the exposure apparatus of FIG.
- FIG. 5 is a plan view showing the arrangement of the main parts of the exposure apparatus of FIG.
- FIG. 6 is a perspective view showing the configuration of the branching optical system of the exposure apparatus shown in FIG.
- FIG. 7 is a view showing the arrangement relationship of a plurality of scanners in the exposure apparatus of FIG. FIG.
- FIG. 8 is a diagram for explaining an optical configuration for eliminating a drawing line shift caused by a tilt of the reflecting surface of the scanner.
- FIG. 9 is a perspective view showing an arrangement relationship among the alignment microscope, the drawing line, and the encoder head on the substrate.
- FIG. 10 is a perspective view showing the surface structure of the rotating drum of the exposure apparatus of FIG.
- FIG. 11 is an explanatory diagram showing a positional relationship between a drawing line and a drawing pattern on the substrate.
- FIG. 12 is an explanatory diagram showing the relationship between the beam spot and the drawing line.
- FIG. 13 is a graph simulating the change in intensity distribution due to the amount of overlap of the beam spots for two pulses obtained on the substrate.
- FIG. 14 is a flowchart relating to the adjustment method of the exposure apparatus of the first embodiment.
- FIG. 15 is an explanatory diagram schematically showing the relationship between the reference pattern of the rotating drum and the drawing line.
- FIG. 16 is an explanatory diagram schematically illustrating a signal output from a photoelectric sensor that receives reflected light from the reference pattern of the rotating drum in a bright field.
- FIG. 17 is an explanatory diagram schematically showing a photoelectric sensor that receives reflected light from the reference pattern of the rotating drum in a dark field.
- FIG. 18 is an explanatory diagram schematically showing a signal output from a photoelectric sensor that receives reflected light from the reference pattern of the rotating drum in a dark field.
- FIG. 19 is an explanatory diagram schematically showing the positional relationship between the reference patterns of the rotating drum.
- FIG. 20 is an explanatory diagram schematically showing the relative positional relationship between a plurality of drawing lines.
- FIG. 21 is an explanatory diagram schematically showing the relationship between the movement distance per unit time of the substrate and the number of drawing lines included in the movement distance.
- FIG. 22 is an explanatory diagram schematically illustrating pulse light synchronized with the system clock of the pulse light source.
- FIG. 23 is a flowchart showing the device manufacturing method of each embodiment.
- FIG. 1 is a view showing the overall configuration of an exposure apparatus (substrate processing apparatus) according to the first embodiment.
- the substrate processing apparatus of the first embodiment is an exposure apparatus EX that performs an exposure process on a substrate P, and the exposure apparatus EX is incorporated in a device manufacturing system 1 that performs various processes on the exposed substrate P to manufacture devices. ing. First, the device manufacturing system 1 will be described.
- the device manufacturing system 1 is a line for manufacturing a flexible display as a device (flexible display manufacturing line). Examples of the flexible display include an organic EL display.
- the device manufacturing system 1 is configured such that a substrate P is fed from a supply roll (not shown) in which a flexible (flexible) long substrate P is wound in a roll shape, and various processes are performed on the fed substrate P. After the substrate is continuously applied, a so-called roll-to-roll system is adopted in which the processed substrate P is wound as a flexible device on a collection roll (not shown).
- a substrate P that is a film-like sheet is sent out from a supply roll, and the substrate P sent out from the supply roll is sequentially processed into a process apparatus U1, an exposure apparatus EX, and a process apparatus.
- a process apparatus U1 an exposure apparatus EX, and a process apparatus.
- U2 The example until it winds up by the collection
- substrate P used as the process target of the device manufacturing system 1 is demonstrated.
- a foil (foil) made of a resin or a metal such as stainless steel or an alloy is used.
- the resin film material include polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Includes one or more.
- the thermal expansion coefficient may be set smaller than a threshold corresponding to the process temperature or the like, for example, by mixing an inorganic filler with a resin film.
- the inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide or the like.
- the substrate P may be a single layer of ultrathin glass having a thickness of about 100 ⁇ m manufactured by a float process or the like, or a laminate in which the above resin film, foil, or the like is bonded to the ultrathin glass. It may be.
- the substrate P thus configured becomes a supply roll by being wound in a roll shape, and this supply roll is mounted on the device manufacturing system 1.
- the device manufacturing system 1 on which the supply roll is mounted repeatedly performs various processes for manufacturing the device on the substrate P sent out from the supply roll in the longitudinal direction. For this reason, a pattern for a plurality of electronic devices (display panel, printed circuit board, etc.) is formed on the processed substrate P in a state in which the patterns are connected at regular intervals in the longitudinal direction. That is, the substrate P sent out from the supply roll is a multi-sided substrate.
- the substrate P is modified and activated in advance by a predetermined pretreatment, or a fine partition structure (concave / convex structure formed by an imprint method) for precise patterning is formed on the surface. You may have done.
- the treated substrate P is recovered as a recovery roll by being wound into a roll.
- the collection roll is attached to a dicing device (not shown).
- the dicing apparatus to which the collection roll is mounted forms a plurality of devices by dividing (dicing) the processed substrate P for each device.
- the dimension in the width direction (short direction) is about 10 cm to 2 m
- the dimension in the length direction (long direction) is 10 m or more.
- substrate P is not limited to an above-described dimension.
- the device manufacturing system 1 includes a process apparatus U1, an exposure apparatus EX, and a process apparatus U2.
- FIG. 1 an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal to each other is shown.
- the X direction is a direction from the process apparatus U1 to the process apparatus U2 through the exposure apparatus EX in the horizontal plane.
- the Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the width direction of the substrate P.
- the Z direction is a direction (vertical direction) orthogonal to the X direction and the Y direction, and the XY plane is parallel to the installation surface E of the production line where the exposure apparatus EX is installed.
- the process apparatus U1 performs a pre-process (pre-process) on the substrate P subjected to the exposure process by the exposure apparatus EX.
- the process apparatus U1 sends the preprocessed substrate P toward the exposure apparatus EX.
- the substrate P sent to the exposure apparatus EX is a substrate (photosensitive substrate) P having a photosensitive functional layer (photosensitive layer) formed on the surface thereof.
- the photosensitive functional layer is applied as a solution on the substrate P and dried to form a layer (film).
- a typical photosensitive functional layer is a photoresist, but as a material that does not require development processing, a photosensitive silane coupling material (SAM) in which the lyophobic property of a portion irradiated with ultraviolet rays is modified, Alternatively, there is a photosensitive reducing material in which a plating reducing group is exposed in a portion that has been irradiated with ultraviolet rays.
- the pattern portion exposed to ultraviolet rays on the substrate P is modified from lyophobic to lyophilic, so that the lyophilic portion
- a conductive ink (ink containing conductive nanoparticles such as silver and copper) is selectively applied thereon to form a pattern layer.
- the plating reducing group is exposed to the pattern portion exposed to the ultraviolet rays on the substrate P. Therefore, the substrate P is immediately exposed to a plating solution containing palladium ions after exposure.
- a pattern layer made of palladium is formed (deposited) by immersing in the substrate for a predetermined time.
- the exposure apparatus EX draws patterns such as various circuits for display panels or various wirings on the substrate P supplied from the process apparatus U1. Although details will be described later, the exposure apparatus EX causes each of the beams LB projected from the respective drawing units UW1 to UW5 to the substrate P (hereinafter also referred to as drawing beam LB) in a predetermined scanning direction. A predetermined pattern is exposed on the substrate P by a plurality of drawing lines LL1 to LL5 obtained by scanning.
- the process device U2 receives the substrate P that has been subjected to the exposure processing by the exposure device EX, and performs post-processing (post-processing) on the substrate P.
- the process apparatus U2 performs a post-bake process, a development process, a cleaning process, a drying process, or the like at a temperature lower than the glass transition temperature of the substrate P.
- the process device U2 performs an electroless plating process, a cleaning process, a drying process, and the like.
- the process apparatus U2 performs a selective application process of liquid ink on the lyophilic portion on the substrate P, a drying process, and the like. Do.
- the device pattern layer is formed on the substrate P through the process apparatus U2.
- FIG. 2 is a perspective view showing the arrangement of the main parts of the exposure apparatus of FIG.
- FIG. 3 is a diagram illustrating an arrangement relationship between the alignment microscope and the drawing lines on the substrate.
- FIG. 4 is a view showing the arrangement of the rotating drum and the drawing apparatus (drawing unit) of the exposure apparatus shown in FIG.
- FIG. 5 is a plan view showing the arrangement of the main parts of the exposure apparatus of FIG.
- FIG. 6 is a perspective view showing the configuration of the branching optical system of the exposure apparatus shown in FIG.
- FIG. 7 is a view showing the arrangement relationship of the scanners in a plurality of drawing units of the exposure apparatus of FIG. FIG.
- FIG. 8 is a diagram for explaining an optical configuration for eliminating a drawing line shift caused by a tilt of the reflecting surface of the scanner.
- FIG. 9 is a perspective view showing an arrangement relationship among the alignment microscope, the drawing line, and the encoder head on the substrate.
- FIG. 10 is a perspective view showing an example of the surface structure of the rotating drum of the exposure apparatus of FIG.
- the exposure apparatus EX is an exposure apparatus that does not use a mask, that is, a so-called maskless drawing exposure apparatus.
- the substrate P is moved at a constant speed in the transport direction (long direction). While continuously transporting, spot light of the drawing beam LB is scanned at high speed in a predetermined scanning direction (width direction of the substrate P), thereby drawing on the surface of the substrate P and forming a predetermined pattern on the substrate P.
- This is a raster-scan direct drawing exposure apparatus.
- the exposure apparatus EX includes a drawing apparatus 11, a substrate transport mechanism 12, alignment microscopes AM1 and AM2, and a control unit 16.
- the drawing apparatus 11 includes a plurality of drawing units UW1 to UW5.
- the drawing apparatus 11 includes a plurality of drawing units UW1 to UW5 on a part of the substrate P that is conveyed in a state of being closely supported above the outer peripheral surface of the cylindrical rotary drum DR that is also a part of the substrate conveying mechanism 12.
- the substrate transport mechanism 12 transports the substrate P transported from the process device U1 in the previous process to the process device U2 in the subsequent process at a predetermined speed.
- the alignment microscopes AM1 and AM2 detect an alignment mark or the like formed in advance on the substrate P in order to relatively align (align) the pattern to be drawn on the substrate P with the substrate P.
- a control unit 16 including a computer, a microcomputer, a CPU, an FPGA, and the like controls each unit of the exposure apparatus EX and causes each unit to execute a process.
- the control unit 16 may be a part or all of a host control device that controls the device manufacturing system 1. Moreover, the control part 16 is controlled by a high-order control apparatus.
- the host control device may be another device such as a host computer that manages the production line.
- the exposure apparatus EX includes an apparatus frame 13 that supports at least a part of the drawing apparatus 11 and the substrate transport mechanism 12 (such as a rotating drum DR), and the apparatus frame 13 includes a rotating drum.
- Rotating beam spot light SP position detecting mechanism (such as an encoder head shown in FIGS. 4 and 9) for detecting the rotational angle position and rotational speed of DR, the displacement in the direction of the rotating shaft, and the like, and FIG. 1 (or FIGS. 3 and 9).
- a light source device CNT that emits ultraviolet laser light (pulse light) as a drawing beam LB is provided as shown in FIGS.
- the exposure apparatus EX distributes the drawing beam LB emitted from the light source device CNT to each of the plurality of drawing units UW1 to UW5 constituting the drawing apparatus 11 with a substantially uniform light amount (illuminance).
- the exposure apparatus EX is stored in a temperature control chamber EVC.
- the temperature control chamber EVC is installed on the installation surface (floor surface) E of the manufacturing plant via passive or active vibration isolation units SU1, SU2.
- the anti-vibration units SU1, SU2 are provided on the installation surface E, and reduce vibration from the installation surface E.
- the temperature control chamber EVC suppresses a shape change due to the temperature of the substrate P transported inside by keeping the inside at a predetermined temperature.
- the substrate transport mechanism 12 of the exposure apparatus EX includes an edge position controller EPC, a driving roller DR4, a tension adjusting roller RT1, a rotating drum (cylindrical drum) DR, a tension adjusting roller RT2, and a driving roller in order from the upstream side in the transport direction of the substrate P. It has DR6 and drive roller DR7.
- the edge position controller EPC adjusts the position in the width direction (Y direction) of the substrate P transported from the process apparatus U1.
- the edge position controller EPC moves the substrate P so that the end portion (edge) position in the width direction of the substrate P sent from the process apparatus U1 is within a range of about ⁇ 10 ⁇ m to several tens ⁇ m with respect to the target position. By slightly moving in the width direction, the position of the substrate P in the width direction is corrected.
- the nip-type driving roller DR4 rotates while sandwiching both front and back surfaces of the substrate P conveyed from the edge position controller EPC, and sends the substrate P downstream in the conveyance direction, thereby directing the substrate P toward the rotating drum DR. Transport.
- the rotary drum DR supports a portion of the substrate P that is subjected to pattern exposure in close contact with a cylindrical outer peripheral surface having a constant radius from a rotation center line (rotation axis) AX2 extending in the Y direction. By rotating around, the substrate P is transported in the longitudinal direction.
- shafts Sf2 coaxial with the rotation center line AX2 are provided on both sides of the rotation drum DR, and the shaft part Sf2 is as shown in FIG.
- the device frame 13 is pivotally supported via a bearing.
- Rotational torque from a drive source (not shown) (such as a motor or a reduction gear mechanism) is given to the shaft portion Sf2.
- a plane including the rotation center line AX2 and parallel to the YZ plane is defined as a center plane p3.
- the two sets of tension adjusting rollers RT1 and RT2 give a predetermined tension to the substrate P which is wound around and supported by the rotary drum DR.
- the two sets of nip type driving rollers DR6, DR7 are arranged at a predetermined interval in the transport direction of the substrate P, and give a predetermined slack (play) DL to the exposed substrate P.
- the drive roller DR6 rotates while sandwiching the upstream side of the substrate P to be transported, and the drive roller DR7 rotates while sandwiching the downstream side of the substrate P to be transported to direct the substrate P toward the process apparatus U2. Transport.
- the substrate transport mechanism 12 adjusts the position of the substrate P transported from the process apparatus U1 in the width direction by the edge position roller EPC.
- the substrate transport mechanism 12 transports the substrate P, whose position in the width direction has been adjusted, to the tension adjustment roller RT1 by the driving roller DR4, and transports the substrate P that has passed through the tension adjustment roller RT1 to the rotary drum DR.
- the substrate transport mechanism 12 transports the substrate P supported by the rotary drum DR toward the tension adjustment roller RT2 by rotating the rotary drum DR.
- the substrate transport mechanism 12 transports the substrate P transported to the tension adjustment roller RT2 to the drive roller DR6, and transports the substrate P transported to the drive roller DR6 to the drive roller DR7. Then, the substrate transport mechanism 12 transports the substrate P toward the process apparatus U2 while giving a slack DL to the substrate P by the driving roller DR6 and the driving roller DR7.
- the apparatus frame 13 of the exposure apparatus EX will be described. 2 is an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal to each other, and is an orthogonal coordinate system similar to that in FIG.
- the apparatus frame 13 includes, in order from the lower side in the Z direction, a main body frame 21, a three-point seat 22 as a support mechanism, a first optical surface plate 23, a moving mechanism 24, and a second mechanism frame. And an optical surface plate 25.
- the main body frame 21 is a part that is installed on the installation surface E via the vibration isolation units SU1, SU2.
- the main body frame 21 rotatably supports (supports) the rotating drum DR and the tension adjusting rollers RT1 (not shown) and RT2.
- the first optical surface plate 23 is provided on the upper side in the vertical direction of the rotary drum DR, and is installed on the main body frame 21 via a three-point seat 22.
- the three-point seat 22 supports the first optical surface plate 23 at three support points, and the position (height position) in the Z direction at each support point can be adjusted. For this reason, the three-point seat 22 can adjust the inclination of the surface of the first optical surface plate 23 with respect to the horizontal plane to a predetermined inclination.
- the position between the main body frame 21 and the three point seats 22 can be adjusted in the X direction and the Y direction within the XY plane.
- the space between the main body frame 21 and the three point seats 22 is fixed (rigid state) in the XY plane.
- the second optical surface plate 25 is provided above the first optical surface plate 23 in the vertical direction, and is installed on the first optical surface plate 23 via the moving mechanism 24.
- the surface of the second optical surface plate 25 is parallel to the surface of the first optical surface plate 23.
- the moving mechanism 24 moves to the first optical surface plate 23 around a predetermined rotation axis I extending in the vertical direction while keeping the surface surfaces of the first optical surface plate 23 and the second optical surface plate 25 in parallel.
- the second optical surface plate 25 can be finely rotated finely.
- the rotation range is, for example, about ⁇ several hundred milliradians with respect to the reference position, and is structured such that the angle can be set with a resolution of 1 to several milliradians.
- the moving mechanism 24 moves the second optical surface plate 25 in the X direction with respect to the first optical surface plate 23 while keeping the surface surfaces of the first optical surface plate 23 and the second optical surface plate 25 parallel to each other.
- a mechanism for precisely and finely shifting in at least one of the Y direction and the rotational axis I can be finely displaced from the reference position in the X or Y direction with a resolution of the order of ⁇ m.
- the rotation axis I extends in the vertical direction in the central plane p3 at the reference position, and is a predetermined point in the surface of the substrate P (the drawing surface curved along the circumferential surface) wound around the rotary drum DR. (The midpoint of the width direction of the board
- the light source device CNT is installed on the main body frame 21 of the device frame 13.
- the light source device CNT emits a laser beam as a drawing beam LB projected onto the substrate P.
- the light source device CNT includes a light source that emits light in a predetermined wavelength range suitable for exposure of the photosensitive functional layer on the substrate P and having a strong photoactive action in the ultraviolet range.
- a laser light source that uses YAG third harmonic laser light (wavelength 355 nm) and continuously oscillates or pulse oscillates at about several KHz to several hundreds of MHz can be used.
- the light source device CNT includes a laser light generation unit CU1 and a wavelength conversion unit CU2.
- the laser light generation unit CU1 includes a laser light source OSC and fiber amplifiers FB1 and FB2.
- the laser beam generator CU1 emits the fundamental wave laser beam Ls.
- the fiber amplifiers FB1 and FB2 amplify the fundamental laser beam Ls with an optical fiber.
- the laser beam generation unit CU1 causes the amplified fundamental wave laser beam Lr to enter the wavelength conversion unit CU2.
- the wavelength conversion unit CU2 is provided with a wavelength conversion optical element, a dichroic mirror, a polarization beam splitter, a prism, and the like.
- a laser beam having a wavelength of 355 nm, which is a third harmonic laser ( The drawing beam LB) is taken out.
- the light source device CNT generates a drawing beam LB having a wavelength of 355 nm as pulsed light of about several KHz to several hundred MHz by pulsing the laser light source OSC that generates seed light in synchronization with a system clock or the like.
- the emission time of one pulse of laser light (Lr or LB) that is finally output can be set to the picosecond order by the pulse driving mode of the laser light source OSC. .
- the light source examples include a lamp light source such as a mercury lamp having a bright line (g line, h line, i line, etc.) in the ultraviolet region, a laser diode having an oscillation peak in the ultraviolet region having a wavelength of 450 nm or less, and a light emitting diode (LED).
- a gas laser light source such as a KrF excimer laser beam (wavelength 248 nm), an ArF excimer laser beam (wavelength 193 nm), or an XeCl excimer laser (wavelength 308 nm) that oscillates far ultraviolet light (DUV light) can be used.
- a lamp light source such as a mercury lamp having a bright line (g line, h line, i line, etc.) in the ultraviolet region
- LED light emitting diode
- a gas laser light source such as a KrF exci
- the drawing beam LB emitted from the light source device CNT is projected onto the substrate P via the polarization beam splitter PBS provided in each of the drawing units UW1 to UW5, as will be described later.
- the polarization beam splitter PBS reflects a light beam that becomes S-polarized linearly polarized light and transmits a light beam that becomes P-polarized linearly polarized light.
- the drawing beam LB incident on the polarization beam splitter PBS is a linearly polarized light (S-polarized light).
- the laser beam has a high energy density, it is possible to appropriately ensure the illuminance of the light beam projected onto the substrate P.
- the drawing apparatus 11 is a so-called multi-beam drawing apparatus 11 using a plurality of drawing units UW1 to UW5.
- the drawing apparatus 11 branches a plurality of drawing beams LB emitted from the light source device CNT into a plurality of drawing beams LB (for example, 5 in the first embodiment) on the substrate P as shown in FIG. Are focused on a very small spot light (diameter of several ⁇ m) along the drawing lines LL1 to LL5.
- the drawing apparatus 11 stitches the patterns drawn on the substrate P by each of the plurality of drawing lines LL1 to LL5 in the width direction of the substrate P.
- a plurality of drawing lines LL1 to LL5 spot light scanning trajectories formed on the substrate P by scanning a plurality of drawing beams LB by the drawing apparatus 11 will be described with reference to FIG.
- the plurality of drawing lines LL1 to LL5 are arranged in two rows in the circumferential direction of the rotary drum DR with the center plane p3 interposed therebetween.
- odd-numbered first drawing lines LL1, third drawing lines LL3, and fifth drawing lines LL5 are arranged in parallel to the Y axis.
- even-numbered second drawing lines LL2 and fourth drawing lines LL4 are arranged in parallel to the Y axis.
- Each of the drawing lines LL1 to LL5 is formed substantially in parallel along the width direction (Y direction) of the substrate P, that is, along the rotation center line AX2 of the rotary drum DR, and is shorter than the length of the substrate P in the width direction. Yes. More precisely, each of the drawing lines LL1 to LL5 is such that when the substrate P is transported at the reference speed by the substrate transport mechanism 12, the pattern splicing error obtained by the plurality of drawing lines LL1 to LL5 is minimized.
- the rotation center line AX2 of the rotary drum DR may be tilted by a predetermined angle with respect to the extending direction (axial direction or width direction).
- the odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 are arranged at a predetermined interval in the direction of the center line AX2 of the rotary drum DR. Further, the even-numbered second drawing line LL2 and fourth drawing line LL4 are arranged at a predetermined interval in the direction of the center line AX2 of the rotary drum DR. At this time, the second drawing line LL2 is arranged between the first drawing line LL1 and the third drawing line LL3 in the direction of the center line AX2. Similarly, the third drawing line LL3 is disposed between the second drawing line LL2 and the fourth drawing line LL4 in the direction of the center line AX2.
- the fourth drawing line LL4 is disposed between the third drawing line LL3 and the fifth drawing line LL5 in the direction of the center line AX2.
- the first to fifth drawing lines LL1 to LL5 are arranged so as to cover the entire width in the width direction (axial direction) of the exposure region A7 drawn on the substrate P.
- the scanning direction of the spot light of the drawing beam LB scanned along the odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 is a one-dimensional direction and is the same direction. ing.
- the scanning direction of the spot light of the drawing beam LB scanned along the even-numbered second drawing line LL2 and fourth drawing line LL4 is a one-dimensional direction and is the same direction.
- the scanning direction ( ⁇ Y direction) of the LB spot light is opposite to the direction shown by the arrow in FIG.
- each of the drawing units UW1 to UW5 has the same configuration, and the odd numbered drawing unit and the even numbered drawing unit are rotated by 180 ° in the XY plane so as to face each other, and the drawing units UW1 to UW5 are arranged.
- the rotating polygon mirror serving as the beam scanner provided in is rotated in the same direction. Therefore, when viewed from the transport direction of the substrate P, the drawing start positions of the odd-numbered drawing lines LL3 and LL5 and the drawing start positions of the even-numbered drawing lines LL2 and LL4 are equal to or less than the radial dimension of the spot light with respect to the Y direction.
- the drawing end positions of the odd-numbered drawing lines LL1 and LL3 and the drawing end positions of the even-numbered drawing lines LL2 and LL4 are equal to or less than the radial dimension of the spot light with respect to the Y direction. Are adjacent (or coincident) with each other.
- each of the odd-numbered drawing lines LL1, LL3, LL5 is arranged in a line in the width direction of the substrate P so as to be substantially parallel to the rotation center line AX2 of the rotary drum DR on the substrate P.
- the even-numbered drawing lines LL2 and LL4 are arranged in a line in the width direction of the substrate P so as to be substantially parallel to the rotation center line AX2 of the rotary drum DR on the substrate P.
- the drawing apparatus 11 includes a plurality of drawing units UW1 to UW5 described above, a branch optical system SL that branches the drawing beam LB from the light source device CNT and guides it to the drawing units UW1 to UW5, and calibration detection for performing calibration.
- System 31 The drawing apparatus 11 includes a plurality of drawing units UW1 to UW5 described above, a branch optical system SL that branches the drawing beam LB from the light source device CNT and guides it to the drawing units UW1 to UW5, and calibration detection for performing calibration.
- the branching optical system SL branches the drawing beam LB emitted from the light source device CNT into a plurality of parts, and guides the plurality of branched drawing beams LB toward the plurality of drawing units UW1 to UW5.
- the branch optical system SL includes a first optical system 41 that branches the drawing beam LB emitted from the light source device CNT into two, and a second optical system that receives one of the drawing beams LB branched by the first optical system 41. 42 and a third optical system 43 on which the other drawing beam LB branched by the first optical system 41 enters.
- the first optical system 41 of the branch optical system SL is provided with a beam shifter mechanism 44 that two-dimensionally shifts the drawing beam LB in a plane orthogonal to the traveling axis of the drawing beam LB.
- the third optical system 43 is provided with a beam shifter mechanism 45 that laterally shifts the drawing beam LB two-dimensionally.
- a part on the light source device CNT side is installed on the main body frame 21, while another part on the drawing units UW1 to UW5 side is installed on the second optical surface plate 25.
- the first optical system 41 includes a half-wave plate 51, a polarizing mirror (polarizing beam splitter) 52, a beam diffuser 53, a first reflecting mirror 54, a first relay lens 55, and a second relay lens 56. , A beam shifter mechanism 44, a second reflection mirror 57, a third reflection mirror 58, a fourth reflection mirror 59, and a first beam splitter 60. 4 and 5, it is difficult to understand the positional relationship between these members, and therefore, description will be made with reference to the perspective view of FIG. 6.
- the drawing beam LB emitted from the light source device CNT in the + X direction is incident on the half-wave plate 51.
- the half-wave plate 51 is rotatable in the incident surface of the drawing beam LB.
- the polarization direction of the drawing beam LB incident on the half-wave plate 51 is a predetermined polarization direction corresponding to the rotational position (angle) of the half-wave plate 51.
- the drawing beam LB that has passed through the half-wave plate 51 is incident on the polarizing mirror 52.
- the polarization mirror 52 transmits a light component in a predetermined polarization direction included in the drawing beam LB, while reflecting a light component in the other polarization direction in the + Y direction. Therefore, the intensity of the drawing beam LB reflected by the polarizing mirror 52 can be adjusted according to the rotational position of the half-wave plate 51 by the cooperation of the half-wave plate 51 and the polarizing mirror 52.
- a part (unnecessary light component) of the drawing beam LB transmitted through the polarizing mirror 52 is irradiated to a beam diffuser (light trap) 53.
- the beam diffuser 53 absorbs a part of the light component of the incident drawing beam LB and suppresses the leakage of the light component to the outside. Further, when adjusting various optical systems through which the drawing beam LB passes, the beam diffuser 53 absorbs many light components of the drawing beam LB because the power is too strong and dangerous if the laser power remains at its maximum. In addition, it is also used to change the rotational position (angle) of the half-wave plate 51 to greatly attenuate the power of the drawing beam LB toward the drawing units UW1 to UW5.
- the drawing beam LB reflected by the polarizing mirror 52 in the + Y direction is reflected by the first reflecting mirror 54 in the + X direction, enters the beam shifter mechanism 44 via the first relay lens 55 and the second relay lens 56, The second reflection mirror 57 is reached.
- the first relay lens 55 converges the drawing beam LB (substantially parallel light beam) from the light source device CNT to form a beam waist, and the second relay lens 56 makes the drawing beam LB diverged after convergence into a parallel light beam again.
- the beam shifter mechanism 44 includes two parallel flat plates (quartz) arranged along the traveling direction (+ X direction) of the drawing beam LB, and one of the parallel flat plates is a Y-axis.
- the other plane parallel plate is provided so as to be inclined around an axis parallel to the Z axis.
- the drawing beam LB is laterally shifted in the ZY plane and emitted from the beam shifter mechanism 44 in accordance with the inclination angle of each parallel plane plate.
- the drawing beam LB is reflected in the ⁇ Y direction by the second reflecting mirror 57, reaches the third reflecting mirror 58, is reflected in the ⁇ Z direction by the third reflecting mirror 58, and reaches the fourth reflecting mirror 59. .
- the drawing beam LB is reflected in the + Y direction by the fourth reflecting mirror 59 and enters the first beam splitter 60.
- the first beam splitter 60 reflects a part of the light amount component of the drawing beam LB in the ⁇ X direction and guides it to the second optical system 42, and guides the remaining light amount component of the drawing beam LB to the third optical system 43.
- the drawing beam LB guided to the second optical system 42 is distributed to the three drawing units UW1, UW3, UW5, and the drawing beam LB guided to the third optical system 43 is further ahead. Is distributed to the two drawing units UW2 and UW4. Therefore, the first beam splitter 60 preferably has a ratio of reflectance to transmittance at the light splitting surface of 3: 2 (reflectance 60%, transmittance 40%), but it is not always necessary. It may be 1: 1.
- the third reflection mirror 58 and the fourth reflection mirror 59 are provided on the rotation axis I of the moving mechanism 24 at a predetermined interval. That is, the center line of the drawing beam LB (parallel light beam) reflected by the third reflection mirror 58 and directed to the fourth reflection mirror 59 is set to coincide with the rotation axis I (coaxial).
- the configuration up to the light source device CNT including the third reflection mirror 58 (the portion surrounded by the two-dot chain line on the upper side in the Z direction in FIG. 4) is installed on the main body frame 21 side, while the fourth reflection mirror.
- a configuration including a plurality of drawing units UW1 to UW5 including 59 (a portion surrounded by a two-dot chain line on the lower side in the Z direction in FIG. 4) is installed on the second optical surface plate 25 side. Therefore, even if the first optical surface plate 23 and the second optical surface plate 25 rotate relative to each other by the moving mechanism 24, the third reflection mirror 58 and the fourth reflection mirror so that the drawing beam LB passes coaxially with the rotation axis I.
- the optical path of the drawing beam LB from the fourth reflection mirror 59 to the first beam splitter 60 is not changed. Therefore, even if the second optical surface plate 25 is rotated with respect to the first optical surface plate 23 by the moving mechanism 24, the drawing beam LB emitted from the light source device CNT installed on the main body frame 21 side is used as the second optical surface plate. It is possible to suitably and stably guide the plurality of drawing units UW1 to UW5 installed on the surface plate 25 side.
- the second optical system 42 branches and guides one drawing beam LB branched by the first beam splitter 60 of the first optical system 41 toward odd-numbered drawing units UW1, UW3, UW5 described later.
- the second optical system 42 includes a fifth reflection mirror 61, a second beam splitter 62, a third beam splitter 63, and a sixth reflection mirror 64.
- the drawing beam LB reflected in the ⁇ X direction by the first beam splitter 60 of the first optical system 41 is reflected in the ⁇ Y direction by the fifth reflecting mirror 61 and enters the second beam splitter 62.
- a part of the drawing beam LB incident on the second beam splitter 62 is reflected in the ⁇ Z direction and guided to one drawing unit UW5 having an odd number (see FIG. 5).
- the drawing beam LB transmitted through the second beam splitter 62 is incident on the third beam splitter 63.
- a part of the drawing beam LB incident on the third beam splitter 63 is reflected in the ⁇ Z direction, and is guided to one odd-numbered drawing unit UW3 (see FIG. 5).
- the drawing beam LB transmitted through the third beam splitter 63 is reflected in the ⁇ Z direction by the sixth reflecting mirror 64 and guided to one odd-numbered drawing unit UW1 (see FIG. 5).
- the drawing beam LB irradiated to the odd-numbered drawing units UW1, UW3, UW5 is slightly inclined with respect to the ⁇ Z direction.
- the ratio of the reflectance and transmittance of the second beam splitter 62 is 1: 2
- the ratio of the reflectance and transmittance of the third beam splitter 63 is 1: 1. It is better to approach.
- the third optical system 43 branches the other drawing beam LB branched by the first beam splitter 60 of the first optical system 41 toward even-numbered drawing units UW2 and UW4 described later.
- the third optical system 43 includes a seventh reflection mirror 71, a beam shifter mechanism 45, an eighth reflection mirror 72, a fourth beam splitter 73, and a ninth reflection mirror 74.
- the drawing beam LB transmitted in the + Y direction by the first beam splitter 60 of the first optical system 41 is reflected in the + X direction by the seventh reflection mirror 71, passes through the beam shifter mechanism 45, and enters the eighth reflection mirror 72.
- the beam shifter mechanism 45 is composed of two parallel plane plates (quartz) that can be tilted similarly to the beam shifter mechanism 44, and the drawing beam LB traveling in the + X direction toward the eighth reflecting mirror 72 is laterally moved in the ZY plane. Shift.
- the drawing beam LB reflected in the ⁇ Y direction by the eighth reflecting mirror 72 is incident on the fourth beam splitter 73.
- a part of the drawing beam LB irradiated on the fourth beam splitter 73 is reflected in the ⁇ Z direction and guided to one even-numbered drawing unit UW4 (see FIG. 5).
- the drawing beam LB that has passed through the fourth beam splitter 73 is reflected in the ⁇ Z direction by the ninth reflecting mirror 74 and guided to one even-numbered drawing unit UW2.
- the drawing beam LB irradiated to the even-numbered drawing units UW2 and UW4 is slightly inclined with respect to the ⁇ Z direction.
- the drawing beam LB from the light source device CNT is branched into a plurality of parts toward the plurality of drawing units UW1 to UW5.
- the first beam splitter 60, the second beam splitter 62, the third beam splitter 63, and the fourth beam splitter 73 have the same beam intensity of the drawing beam LB irradiated to the plurality of drawing units UW1 to UW5.
- the reflectance is set to an appropriate reflectance according to the number of branches of the drawing beam LB.
- the beam shifter mechanism 44 is disposed between the second relay lens 56 and the second reflection mirror 57.
- the beam shifter mechanism 44 can finely adjust all the positions of the drawing lines LL1 to LL5 formed on the substrate P on the order of ⁇ m within the drawing surface of the substrate P.
- the beam shifter mechanism 45 finely draws even-numbered second drawing lines LL2 and fourth drawing lines LL4 on the drawing surface of the substrate P in the ⁇ m order among the drawing lines LL1 to LL5 formed on the substrate P. Can be adjusted.
- a plurality of drawing units UW1 to UW5 will be described with reference to FIG. 4, FIG. 5, and FIG.
- the plurality of drawing units UW1 to UW5 are arranged in two rows in the circumferential direction of the rotary drum DR with the center surface p3 interposed therebetween.
- the plurality of drawing units UW1 to UW5 have the first drawing on the side where the first, third, and fifth drawing lines LL1, LL3, and LL5 are arranged (the ⁇ X direction side in FIG. 5) across the center plane p3.
- a unit UW1, a third drawing unit UW3, and a fifth drawing unit UW5 are arranged.
- the first drawing unit UW1, the third drawing unit UW3, and the fifth drawing unit UW5 are arranged at a predetermined interval in the Y direction.
- the plurality of drawing units UW1 to UW5 are arranged on the side where the second and fourth drawing lines LL2 and LL4 are arranged (+ X direction side in FIG. 5) with the center plane p3 interposed therebetween.
- Four drawing units UW4 are arranged.
- the second drawing unit UW2 and the fourth drawing unit UW4 are arranged at a predetermined interval in the Y direction. At this time, as shown in FIG. 2 or FIG. 5, the second drawing unit UW2 is located between the first drawing unit UW1 and the third drawing unit UW3 in the Y direction.
- the third drawing unit UW3 is located between the second drawing unit UW2 and the fourth drawing unit UW4 in the Y direction.
- the fourth drawing unit UW4 is located between the third drawing unit UW3 and the fifth drawing unit UW5 in the Y direction.
- the first drawing unit UW1, the third drawing unit UW3, the fifth drawing unit UW5, the second drawing unit UW2, and the fourth drawing unit UW4 have a center plane p3 as viewed from the Y direction. It is arranged symmetrically in the center.
- the configuration of the optical system in each of the drawing units UW1 to UW5 will be described with reference to FIG. Since the drawing units UW1 to UW5 have the same configuration, the first drawing unit UW1 (hereinafter simply referred to as the drawing unit UW1) will be described as an example.
- the drawing unit UW1 shown in FIG. 4 includes an optical deflector 81, a polarization beam splitter PBS, and a quarter wavelength plate so as to scan the spot light of the drawing beam LB along the drawing line LL1 (first drawing line LL1). 82, a scanner 83, a bending mirror 84, an f- ⁇ lens system 85, and a Y magnification correcting optical member (lens group) 86B including a cylindrical lens 86.
- a calibration detection system 31 is provided adjacent to the deflection beam splitter PBS.
- an acousto-optic element (AOM: Acousto Optic Modulator) is used.
- the AOM generates an ON state in which the first-order diffracted light of the incident drawing beam is generated in a predetermined diffraction angle direction and OFF that does not generate the first-order diffracted light depending on whether or not a diffraction grating is generated by ultrasonic waves (high-frequency signals) inside It is an optical switching element that switches to a state.
- the control unit 16 shown in FIG. 1 switches the projection / non-projection of the drawing beam LB onto the substrate P at high speed by switching the optical deflector 81 to ON / OFF. Specifically, one of the drawing beams LB distributed by the branch optical system SL is irradiated to the optical deflector 81 through the relay lens 91 with a slight inclination with respect to the ⁇ Z direction. When the optical deflector 81 is switched OFF, the drawing beam LB goes straight in an inclined state and is shielded by a light shielding plate 92 provided at the end after passing through the optical deflector 81.
- the drawing beam LB (first-order diffracted light) is deflected in the ⁇ Z direction, passes through the optical deflector 81, and is above the Z direction of the optical deflector 81. Irradiation is performed on the polarization beam splitter PBS provided. Therefore, when the optical deflector 81 is switched ON, the spot light of the drawing beam LB is projected onto the substrate P, and when the optical deflector 81 is switched OFF, the spot light of the drawing beam LB is applied to the substrate P. Not projected.
- the drawing beam LB (first-order diffracted light) emitted from the optical deflector 81 diverges. Therefore, a relay lens 93 that returns the diverging drawing beam LB to a parallel light beam is provided after the optical deflector 81.
- the polarization beam splitter PBS reflects the drawing beam LB irradiated from the optical deflector 81 through the relay lens 93.
- the drawing beam LB emitted from the polarization beam splitter PBS is a quarter wavelength plate 82, a scanner 83 (rotating polygon mirror), a bending mirror 84, an f- ⁇ lens system 85, a Y magnification correcting optical member 86B, and a cylindrical lens.
- the light is condensed on the substrate P as scanning spot light.
- the polarization beam splitter PBS is projected onto the outer peripheral surface of the substrate P or the rotating drum DR below it in cooperation with the quarter wavelength plate 82 provided between the polarization beam splitter PBS and the scanner 83. Since the reflected light of the drawing beam LB moves backward in the order of the Y magnification correcting optical member 86B, the cylindrical lens 86, the f- ⁇ lens system 85, the bending mirror 84, and the scanner 83, the reflected light is transmitted. be able to.
- the drawing beam LB irradiated from the optical deflector 81 to the polarization beam splitter PBS is a laser beam that becomes S-polarized linearly polarized light and is reflected by the polarization beam splitter PBS.
- the drawing beam LB reflected by the polarization beam splitter PBS passes through the quarter-wave plate 82, the scanner 83, the bending mirror 84, the f- ⁇ lens system 85, the Y magnification correcting optical member 86B, and the cylindrical lens 86. Then, the spot light of the drawing beam LB irradiated onto the substrate P and condensed on the substrate P is circularly polarized.
- the reflected light from the substrate P travels backward through the transmission path of the drawing beam LB and passes through the quarter-wave plate 82 again, thereby becoming laser light that becomes P-polarized linearly polarized light. It becomes. For this reason, the reflected light reaching the polarization beam splitter PBS from the substrate P (or the rotating drum DR) is transmitted through the polarization beam splitter PBS and irradiated to the photoelectric sensor 31Cs of the calibration detection system 31 via the relay lens 94.
- the polarization beam splitter PBS is an optical splitter arranged between the scanning optical system including the scanner 83 and the calibration detection system 31. Since the calibration detection system 31 shares a part of the optical transmission system of the drawing beam LB to the substrate P, it becomes an easy and compact optical system.
- the scanner 83 includes a reflection mirror 96, a rotating polygon mirror (rotating polygonal mirror) 97, and an origin detector 98.
- the drawing beam LB parallel light beam
- the rotating polygon mirror 97 includes a rotating shaft 97a extending in the Z direction and a plurality of reflecting surfaces 97b formed around the rotating shaft 97a.
- the rotating polygon mirror 97 rotates the rotation axis 97a in a predetermined rotation direction so that the reflection angle of the drawing beam LB (the beam whose intensity is modulated by the optical deflector 81) irradiated to the reflection surface 97b is changed to the XY plane.
- the reflected drawing beam LB is collected into spot light by the bending mirror 84, the f- ⁇ lens system 85, and the second cylindrical lens 86 (and the Y magnification correcting optical member 86B).
- the light is scanned along the drawing line LL1 (similarly, LL2 to LL5) on the substrate P.
- the origin detector 98 detects the origin of the drawing beam LB scanned along the drawing line LL1 (similarly, LL2 to LL5) of the substrate P.
- the origin detector 98 is disposed on the opposite side of the reflecting mirror 96 with the drawing beam LB reflected by each reflecting surface 97b interposed therebetween.
- the photoelectric detector is illustrated as the origin detector 98 for simplicity of explanation, but actually, the detection beam is projected toward the reflecting surface 97b of the rotating polygon mirror 97 on which the drawing beam LB is projected.
- a detection light source such as an LED or a semiconductor laser is provided, and the origin detector 98 photoelectrically detects the reflected light of the detection beam on the reflecting surface 97b through a thin slit.
- the origin detector 98 outputs a pulse signal representing the origin always before a timing at which the spot light is irradiated to the drawing start position of the drawing lines LL1 (LL2 to LL5) on the substrate P. It is set to be.
- the drawing beam LB emitted from the scanner 83 to the bending mirror 84 is reflected in the ⁇ Z direction by the bending mirror 84 and enters the f- ⁇ lens system 85 and the cylindrical lens 86 (and the Y magnification correcting optical member 86B). .
- each reflecting surface 97b of the rotating polygon mirror 97 is not strictly parallel to the center line of the rotating shaft 97a but is slightly tilted (tilted), it is caused by the spot light projected on the substrate P.
- the drawing lines (LL1 to LL5) are blurred in the X direction on the substrate P for each reflecting surface 97b. Therefore, by using the two cylindrical lenses 95 and 86 with reference to FIG. 8, the blurring of the drawing lines LL1 to LL5 in the X direction with respect to the surface tilt of each reflecting surface 97b of the rotating polygon mirror 97 is reduced. Or explain that it can be resolved.
- FIG. 8 shows a state in which the optical paths of the cylindrical lens 95, the scanner 83, the f- ⁇ lens system 85, and the cylindrical lens 86 are expanded on the XY plane, and the right side of FIG. 8 expands the optical path in the XZ plane. Shows how it was done.
- the reflecting surface 97b to which the drawing beam LB of the rotating polygon mirror 97 is irradiated is arranged so as to be the entrance pupil position (front focal position) of the f- ⁇ lens system 85.
- the incident angle of the drawing beam LB incident on the f- ⁇ lens system 85 becomes ⁇ p with respect to the rotational angle ⁇ p / 2 of the rotating polygon mirror 97, and the substrate P (irradiated surface is proportional to the incident angle ⁇ p).
- the image height position of the spot light projected on is determined. Further, by setting the reflecting surface 97b to the front focal position of the f- ⁇ lens system 85, the drawing beam LB projected onto the substrate P is telecentric at any position on the drawing line (the main part of the drawing beam that becomes spot light). The light beam is always parallel to the optical axis AXf of the f- ⁇ lens system 85).
- the two cylindrical lenses 95 and 86 function as parallel flat glass having zero refractive power (power) in a plane (XY plane) perpendicular to the rotation axis 97a of the rotating polygon mirror 97.
- the lens In the Z direction (in the XZ plane) in which the rotation shaft 97a extends, the lens functions as a convex lens having a constant positive refractive power.
- the drawing beam LB (substantially parallel light beam) incident on the first cylindrical lens 95 has a circular shape of about several millimeters, but the focal position of the cylindrical lens 95 in the XZ plane is rotated via the reflection mirror 96.
- a slit-shaped spot light having a beam width of several mm in the XY plane and converged in the Z direction extends in the rotation direction on the reflection surface 97b and is condensed. To do.
- the drawing beam LB reflected by the reflecting surface 97b of the rotating polygon mirror 97 is a parallel light beam in the XY plane, but becomes a divergent light beam in the XZ plane (the direction in which the rotating shaft 97a extends), and the f- ⁇ lens system 85. Is incident on. Therefore, the drawing beam LB immediately after exiting the f- ⁇ lens system 85 is almost a parallel light beam in the XZ plane (the direction in which the rotation shaft 97a extends), but due to the action of the second cylindrical lens 86.
- the spot light is also condensed in the transport direction of the substrate P perpendicular to the direction in which the drawing lines LL1 to LL5 extend. As a result, a small circular spot light is projected on each drawing line on the substrate P.
- the cylindrical lens 86 By providing the cylindrical lens 86, the reflecting surface 97b of the rotating polygon mirror 97 and the substrate P (irradiated surface) are optically set in an image conjugate relationship within the XZ plane as shown on the right side of FIG. Can do. Therefore, even if each reflecting surface 97b of the rotating polygon mirror 97 has a tilt error with respect to the non-scanning direction (direction in which the rotating shaft 97a extends) orthogonal to the scanning direction of the drawing beam LB, the drawing line on the substrate P The positions (LL1 to LL5) do not shift in the non-scanning direction of the spot light (the transport direction of the substrate P). As described above, by providing the cylindrical lenses 95 and 86 before and after the rotating polygon mirror 97, it is possible to configure a surface tilt correction optical system of the polygon reflecting surface with respect to the non-scanning direction.
- the scanners 83 of the plurality of drawing units UW1 to UW5 have a symmetric configuration with respect to the center plane p3.
- three scanners 83 corresponding to the drawing units UW1, UW3, UW5 are arranged on the upstream side in the rotation direction of the rotary drum DR (the ⁇ X direction side in FIG. 7), and the drawing units UW2,
- Two scanners 83 corresponding to UW4 are arranged on the downstream side in the rotation direction of the rotary drum DR (the + X direction side in FIG. 7).
- the three upstream scanners 83 and the two downstream scanners 83 are arranged to face each other across the center plane p3.
- the three upstream scanners 83 and the two downstream scanners 83 are in an arrangement relationship rotated by 180 ° about the rotation axis I (Z axis). For this reason, for example, when the rotating polygon mirror 97 is irradiated with the drawing beam LB while the three upstream rotating polygon mirrors 97 rotate counterclockwise, the drawing beam LB reflected by the rotating polygon mirror 97 is drawn. Scanning is performed in a predetermined scanning direction (for example, + Y direction in FIG. 7) from the start position to the drawing end position.
- a predetermined scanning direction for example, + Y direction in FIG. 7
- the drawing beam LB reflected by the rotating polygon mirror 97 is changed to the drawing start position. Is scanned in the scanning direction (for example, the ⁇ Y direction in FIG. 7) opposite to the upstream three rotating polygon mirrors 97 from the drawing end position to the drawing end position.
- the axis of the drawing beam LB reaching the substrate P from the odd-numbered drawing units UW1, UW3, UW5 is in a direction coinciding with the installation direction line Le1. That is, the installation orientation line Le1 is a line connecting the odd-numbered drawing lines LL1, LL3, LL5 and the rotation center line AX2 in the XZ plane.
- the axis of the drawing beam LB reaching the substrate P from the even-numbered drawing units UW2 and UW4 is in a direction that coincides with the installation orientation line Le2.
- the installation orientation line Le2 is a line connecting the even-numbered drawing lines LL2 and LL4 and the rotation center line AX2 in the XZ plane. For this reason, each traveling direction (principal ray) of the drawing beam LB projected as spot light on the substrate P is set so as to be directed to the rotation center line AX2 of the rotating drum DR.
- the Y magnification correcting optical member 86B is arranged between the f- ⁇ lens system 85 and the substrate P.
- the Y magnification correcting optical member 86B can enlarge or reduce the drawing lines LL1 to LL5 formed by the respective drawing units UW1 to UW5 isotropically by a minute amount in the Y direction.
- a transparent parallel flat plate (quartz) having a certain thickness covering each of the drawing lines LL1 to LL5 is mechanically bent (bending) in the direction in which the drawing line extends to multiply the drawing line in the Y direction.
- a mechanism for changing the (scanning length) or a mechanism for changing the magnification (scanning length) in the Y direction of the drawing line by moving a part of the three lens systems of the convex lens, the concave lens, and the convex lens in the optical axis direction. Etc. can be used.
- the drawing apparatus 11 configured as described above draws a predetermined pattern on the substrate P by controlling each unit by the control unit 16. That is, the control unit 16 performs ON / OFF modulation of the optical deflector 81 based on CAD information of a pattern to be drawn on the substrate P during the period in which the drawing beam LB projected on the substrate P is scanned in the scanning direction. By doing so, the drawing beam LB is deflected, and a pattern is drawn on the photosensitive layer of the substrate P. Further, the control unit 16 synchronizes the scanning direction of the drawing beam LB that scans along the drawing line LL1 and the movement in the transport direction of the substrate P due to the rotation of the rotary drum DR, so that the drawing line in the exposure region A7 is synchronized. A predetermined pattern is drawn on the portion corresponding to LL1.
- the alignment microscopes AM1 and AM2 detect an alignment mark formed in advance on the substrate P, or a reference mark or reference pattern formed on the rotary drum DR.
- the alignment mark of the substrate P and the reference mark or reference pattern of the rotating drum DR are simply referred to as a mark.
- the alignment microscopes AM1 and AM2 are used to align (align) the substrate P and a predetermined pattern drawn on the substrate P, and to calibrate the rotary drum DR and the drawing device 11.
- the alignment microscopes AM1 and AM2 are provided upstream of the drawing lines LL1 to LL5 formed by the drawing device 11 in the rotation direction of the rotary drum DR (the conveyance direction of the substrate P). Further, the alignment microscope AM1 is arranged on the upstream side in the rotation direction of the rotary drum DR as compared with the alignment microscope AM2.
- the alignment microscopes AM1 and AM2 project the illumination light onto the substrate P or the rotating drum DR, and at the same time, an objective lens system GA (a representative lens of the alignment microscope AM2 in FIG. 9) serving as a detection probe for entering the light generated by the mark.
- Imaging system GD (represented in FIG. 9) that captures a mark image (bright field image, dark field image, fluorescent image, etc.) received through the objective lens system GA with a two-dimensional CCD, CMOS, etc.
- the illumination light for alignment is light in a wavelength region that has little sensitivity to the photosensitive layer on the substrate P, for example, light having a wavelength of about 500 to 800 nm.
- Alignment microscopes AM1 are provided in a plurality (for example, three) in a line in the Y direction (width direction of the substrate P). Similarly, a plurality of (for example, three) alignment microscopes AM2 are provided in a line in the Y direction (the width direction of the substrate P). That is, a total of six alignment microscopes AM1 and AM2 are provided.
- FIG. 3 shows the arrangement of the objective lens systems GA1 to GA3 of the three alignment microscopes AM1 among the objective lens systems GA of the six alignment microscopes AM1 and AM2 for easy understanding.
- the observation regions (detection positions) Vw1 to Vw3 on the substrate P (or the outer peripheral surface of the rotary drum DR) by the objective lens systems GA1 to GA3 of the three alignment microscopes AM1 are, as shown in FIG. 3, the rotation center line AX2 and They are arranged at predetermined intervals in the parallel Y direction.
- the optical axes La1 to La3 of the objective lens systems GA1 to GA3 passing through the centers of the observation regions Vw1 to Vw3 are all parallel to the XZ plane.
- observation regions Vw4 to Vw6 on the substrate P (or the outer peripheral surface of the rotating drum DR) by the objective lens systems GA of the three alignment microscopes AM2 are Y parallel to the rotation center line AX2, as shown in FIG. Arranged at predetermined intervals in the direction.
- the optical axes La4 to La6 of each objective lens system GA passing through the centers of the observation regions Vw4 to Vw6 are all parallel to the XZ plane.
- the observation areas Vw1 to Vw3 and the observation areas Vw4 to Vw6 are arranged at a predetermined interval in the rotation direction of the rotary drum DR.
- the mark observation areas Vw1 to Vw6 by the alignment microscopes AM1 and AM2 are set to a range of, for example, about 500 to 200 ⁇ m square on the substrate P and the rotating drum DR.
- the optical axes La1 to La3 of the alignment microscope AM1 that is, the optical axes La1 to La3 of the objective lens system GA, are set in the same direction as the installation orientation line Le3 extending in the radial direction of the rotary drum DR from the rotation center line AX2.
- the installation direction line Le3 is a line connecting the observation regions Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2 when viewed in the XZ plane of FIG.
- the optical axes La4 to La6 of the alignment microscope AM2 are set in the same direction as the installation direction line Le4 extending in the radial direction of the rotary drum DR from the rotation center line AX2.
- the installation direction line Le4 is a line connecting the observation areas Vw4 to Vw6 of the alignment microscope AM2 and the rotation center line AX2 when viewed in the XZ plane of FIG.
- the angle formed by the center plane p3 and the installation orientation line Le3 is the same as that of the center plane p3. It is larger than the angle formed by the installation orientation line Le4.
- an exposure area A7 drawn by each of the five drawing lines LL1 to LL5 is arranged at a predetermined interval in the X direction.
- a plurality of alignment marks Ks1 to Ks3 (hereinafter abbreviated as marks) for alignment are formed in a cross shape, for example.
- the mark Ks1 is provided in the peripheral area on the ⁇ Y side of the exposure area A7 at a constant interval in the X direction, and the mark Ks3 is fixed in the peripheral area on the + Y side of the exposure area A7 in the X direction. Provided at intervals. Further, the mark Ks2 is provided at the center in the Y direction in a blank area between two exposure areas A7 adjacent in the X direction.
- the marks Ks1 are sequentially captured while the substrate P is being sent in the observation region Vw1 of the objective lens system GA1 of the alignment microscope AM1 and in the observation region Vw4 of the objective lens system GA of the alignment microscope AM2. Formed. Further, the mark Ks3 is sequentially captured while the substrate P is being sent in the observation region Vw3 of the objective lens system GA3 of the alignment microscope AM1 and in the observation region Vw6 of the objective lens system GA of the alignment microscope AM2. Formed. Further, the marks Ks2 are sequentially captured while the substrate P is being sent in the observation region Vw2 of the objective lens system GA2 of the alignment microscope AM1 and in the observation region Vw5 of the objective lens system GA of the alignment microscope AM2. It is formed so that.
- the alignment microscopes AM1 and AM2 on both sides in the Y direction of the rotating drum DR constantly observe or detect the marks Ks1 and Ks3 formed on both sides in the width direction of the substrate P. be able to.
- the center alignment microscope AM1 and AM2 in the Y direction of the rotary drum DR is a mark formed in a blank portion between the exposure areas A7 drawn on the substrate P. Ks2 can always be observed or detected.
- the exposure apparatus EX is a so-called multi-beam type drawing apparatus
- a plurality of patterns drawn on the substrate P are drawn in the Y direction by the drawing lines LL1 to LL5 of the plurality of drawing units UW1 to UW5. Therefore, calibration is required to keep the joining accuracy of the plurality of drawing units UW1 to UW5 within an allowable range.
- the relative positional relationship of the observation areas Vw1 to Vw6 of the alignment microscopes AM1 and AM2 with respect to the respective drawing lines LL1 to LL5 of the plurality of drawing units UW1 to UW5 needs to be precisely determined by the baseline management. Calibration is also necessary for the baseline management.
- the exposure apparatus EX uses a rotating drum DR having a reference mark or a reference pattern on the outer peripheral surface.
- the rotary drum DR has scale portions GPa and GPb that constitute a part of a rotational position detection mechanism 14 described later, on both ends of the outer peripheral surface thereof, as in FIGS.
- the rotary drum DR is provided with engraved restriction bands CLa and CLb having narrow grooves by concave grooves or convex rims on the inner sides of the scale parts GPa and GPb.
- the width in the Y direction of the substrate P is set to be smaller than the interval in the Y direction between the two regulation bands CLa and CLb, and the substrate P is sandwiched between the regulation bands CLa and CLb on the outer peripheral surface of the rotary drum DR. It is supported in close contact with the inner region.
- the rotating drum DR has a plurality of line patterns RL1 (line patterns) inclined at +45 degrees with respect to the rotation center line AX2 and ⁇ 45 with respect to the rotation center line AX2 on the outer peripheral surface sandwiched between the regulation bands CLa and CLb.
- a mesh-like reference pattern (which can also be used as a reference mark) RMP is provided in which a plurality of line patterns RL2 (line patterns) inclined at degrees are repeatedly engraved at a constant pitch (period) Pf1, Pf2. Note that the widths of the line patterns RL1 and RL2 are LW.
- the reference pattern RMP is an oblique pattern (an oblique lattice pattern) that is uniform over the entire surface so that the frictional force, the tension of the substrate P, and the like do not change at the portion where the substrate P and the outer peripheral surface of the rotary drum DR are in contact with each other.
- the line patterns RL1 and RL2 are not necessarily inclined at 45 degrees, and may be a vertical and horizontal mesh pattern in which the line pattern RL1 is parallel to the Y axis and the line pattern RL2 is parallel to the X axis.
- the line patterns RL1 and RL2 may be crossed at an angle that results in a rhombus.
- the rotational position detection mechanism 14 optically detects the rotational position of the rotary drum DR, and an encoder system using, for example, a rotary encoder is applied.
- the rotational position detection mechanism 14 includes a scale measuring unit GPa, GPb provided at both ends of the rotating drum DR, and a plurality of encoder heads EN1, EN2, EN3, EN4 facing each of the scale units GPa, GPb. It is. 4 and 9, only four encoder heads EN1, EN2, EN3, and EN4 that face the scale part GPa are shown, but similar encoder heads EN1, EN2, EN3, and EN4 face the scale part GPb. Arranged.
- the rotational position detection mechanism 14 includes displacement meters YN1, YN2, YN3, and YN4 that can detect a shake (a slight displacement in the Y direction in which the rotational center line AX2 extends) at both ends of the rotational drum DR.
- the scales of the scale parts GPa and GPb are respectively formed in an annular shape over the entire circumferential direction of the outer peripheral surface of the rotary drum DR.
- the scale parts GPa and GPb are diffraction gratings in which concave or convex grating lines are formed at a constant pitch (for example, 20 ⁇ m) in the circumferential direction of the outer peripheral surface of the rotary drum DR, and are configured as incremental scales. For this reason, the scale parts GPa and GPb rotate integrally with the rotary drum DR around the rotation center line AX2.
- the substrate P is configured to be wound inside the scale portions GPa and GPb at both ends of the rotary drum DR, that is, inside the regulation bands CLa and CLb.
- the outer peripheral surfaces of the scale portions GPa and GPb and the outer peripheral surface of the portion of the substrate P wound around the rotary drum DR are on the same plane (same radius from the center line AX2).
- the outer peripheral surfaces of the scale portions GPa and GPb may be made higher by the thickness of the substrate P in the radial direction than the outer peripheral surface for winding the substrate of the rotary drum DR.
- the outer peripheral surfaces of the scale portions GPa and GPb formed on the rotary drum DR can be set to have substantially the same radius as the outer peripheral surface of the substrate P. Therefore, the encoder heads EN1, EN2, EN3, and EN4 can detect the scale portions GPa and GPb at the same radial position as the drawing surface on the substrate P wound around the rotary drum DR. The Abbe error caused by the difference in the radial direction of the rotating system can be reduced.
- Encoder heads EN1, EN2, EN3, and EN4 are respectively disposed around the scale portions GPa and GPb as viewed from the rotation center line AX2, and are located at different positions in the circumferential direction of the rotary drum DR.
- the encoder heads EN1, EN2, EN3, EN4 are connected to the control unit 16.
- the encoder heads EN1, EN2, EN3, and EN4 project measurement light beams toward the scale portions GPa and GPb, and photoelectrically detect the reflected light beams (diffracted light), thereby causing the scale portions GPa and GPb in the circumferential direction.
- a detection signal (for example, a two-phase signal having a phase difference of 90 degrees) corresponding to the position change is output to the control unit 16.
- the control unit 16 interpolates and digitally processes the detection signal with a counter circuit (not shown), thereby changing the angular change of the rotating drum DR, that is, the change in the circumferential position of the outer peripheral surface with submicron resolution. It can be measured.
- the controller 16 can also measure the transport speed of the substrate P from the change in the angle of the rotary drum DR.
- the encoder head EN1 is disposed on the installation direction line Le1.
- the installation azimuth line Le1 is a line connecting the projection area (reading position) of the measurement light beam onto the scale part GPa (GPb) by the encoder head EN1 and the rotation center line AX2 in the XZ plane.
- the installation direction line Le1 is a line connecting the drawing lines LL1, LL3, LL5 and the rotation center line AX2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN1 and the rotation center line AX2 and the line connecting the drawing lines LL1, LL3, LL5 and the rotation center line AX2 are the same azimuth line.
- the encoder head EN2 is disposed on the installation orientation line Le2.
- the installation orientation line Le2 is a line connecting the projection area (reading position) of the measurement light beam on the scale part GPa (GPb) by the encoder head EN2 and the rotation center line AX2 in the XZ plane.
- the installation direction line Le2 is a line connecting the drawing lines LL2 and LL4 and the rotation center line AX2 in the XZ plane. From the above, the line connecting the reading position of the encoder head EN2 and the rotation center line AX2 and the line connecting the drawing lines LL2, LL4 and the rotation center line AX2 are the same azimuth line.
- the encoder head EN3 is disposed on the installation direction line Le3.
- the installation azimuth line Le3 is a line connecting the projection area (reading position) of the measurement light beam onto the scale part GPa (GPb) by the encoder head EN3 and the rotation center line AX2 in the XZ plane.
- the installation orientation line Le3 is a line connecting the observation areas Vw1 to Vw3 of the substrate P by the alignment microscope AM1 and the rotation center line AX2 in the XZ plane.
- the line connecting the reading position of the encoder head EN3 and the rotation center line AX2 and the line connecting the observation areas Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2 have the same orientation when viewed in the XZ plane. It is a line.
- the encoder head EN4 is arranged on the installation direction line Le4.
- the installation azimuth line Le4 is a line connecting the projection area (reading position) of the measurement light beam onto the scale part GPa (GPb) by the encoder head EN4 and the rotation center line AX2 in the XZ plane.
- the installation direction line Le4 is a line connecting the observation areas Vw4 to Vw6 of the substrate P by the alignment microscope AM2 and the rotation center line AX2 in the XZ plane.
- the line connecting the reading position of the encoder head EN4 and the rotation center line AX2 and the line connecting the observation areas Vw4 to Vw6 of the alignment microscope AM2 and the rotation center line AX2 have the same orientation when viewed in the XZ plane. It is a line.
- installation directions (angle directions in the XZ plane with the rotation center line AX2 as the center) of the encoder heads EN1, EN2, EN3, EN4 are represented by installation direction lines Le1, Le2, Le3, Le4, as shown in FIG.
- a plurality of drawing units UW1 to UW5 and encoder heads EN1 and EN2 are arranged so that the installation orientation lines Le1 and Le2 are at an angle ⁇ ⁇ ° with respect to the center plane p3.
- the installation azimuth line Le1 and the installation azimuth line Le2 are such that the encoder head EN1 and the encoder head EN2 are installed in a spatially non-interfering state around the scale of the scale part GPa (GPb).
- Displacement meters YN1, YN2, YN3, and YN4 are respectively arranged around the scale portion GPa or GPb as viewed from the rotation center line AX2, and are in different positions in the circumferential direction of the rotary drum DR.
- the displacement meters YN1, YN2, YN3, YN4 are connected to the control unit 16.
- the displacement meters YN1, YN2, YN3, and YN4 can reduce the Abbe error by detecting the displacement at a position as close to the radial direction as possible with respect to the drawing surface on the substrate P wound around the rotary drum DR.
- the displacement gauges YN1, YN2, YN3, and YN4 project a measurement light beam toward one of both ends of the rotary drum DR, and photoelectrically detect the reflected light beam (or diffracted light), thereby detecting the rotation drum DR.
- a detection signal corresponding to a change in position of both ends in the Y direction (width direction of the substrate P) is output to the control unit 16.
- the control unit 16 digitally processes the detection signal by a measurement circuit (not shown) (a counter circuit, an interpolation circuit, etc.), thereby substituting the displacement change in the Y direction of the rotating drum DR (and the substrate P) with submicron resolution. Can be measured.
- the control unit 16 can also measure the swing of the rotating drum DR from one change at both ends of the rotating drum DR.
- the displacement gauges YN1, YN2, YN3, and YN4 may be one of the four, but for measurement of the rotation of the rotating drum DR, if there are three or more of the four, both end portions of the rotating drum DR. It is possible to grasp the movement (dynamic inclination change, etc.) of one of the surfaces.
- the control unit 16 can constantly measure marks and patterns on the substrate P (or marks on the rotary drum DR) by the alignment microscopes AM1 and AM2, the displacement meters YN1, YN2, YN3, and YN4 are omitted. May be.
- control unit 16 detects the rotation angle positions of the scale units (rotating drums DR) GPa and GPb by the encoder heads EN1 and EN2, and based on the detected rotation angle positions, the odd-numbered and even-numbered drawing units UW1. -Drawing by UW5. That is, the control unit 16 performs ON / OFF modulation of the optical deflector 81 based on CAD information of a pattern to be drawn on the substrate P during the period in which the drawing beam LB projected on the substrate P is scanned in the scanning direction. However, by performing the ON / OFF modulation timing by the optical deflector 81 based on the detected rotation angle position, the pattern can be accurately drawn on the photosensitive layer of the substrate P.
- control unit 16 rotates the scale units GPa and GPb (rotary drum DR) detected by the encoder heads EN3 and EN4 when the alignment marks Ks1 to Ks3 on the substrate P are detected by the alignment microscopes AM1 and AM2.
- the control unit 16 rotates the scale units GPa and GPb (rotating drum DR) detected by the encoder heads EN3 and EN4 when the reference pattern RMP on the rotating drum DR is detected by the alignment microscopes AM1 and AM2.
- the alignment microscopes AM1 and AM2 can precisely measure the rotation angle position (or circumferential position) of the rotary drum DR at the moment when the mark is sampled in the observation regions Vw1 to Vw6.
- the exposure apparatus EX based on the measurement result, the substrate P and a predetermined pattern drawn on the substrate P are aligned (aligned), and the rotary drum DR and the drawing apparatus 11 are calibrated. To do.
- the actual sampling corresponds to the position of the mark on the substrate P and the position of the reference pattern RMP on the rotating drum DR in which the rotational angle position of the rotating drum DR measured by the encoder heads EN3 and EN4 is roughly known in advance.
- the image information output from the imaging systems GD of the alignment microscopes AM1 and AM2 is written into the image memory or the like at a high speed when the angular position is reached. That is, the image information output from each imaging system GD is sampled using the rotation angle position of the rotary drum DR measured by the encoder heads EN3 and EN4 as a trigger.
- the mark on the substrate P and the reference pattern RMP on the rotary drum DR are moved in one direction with respect to the observation regions Vw1 to Vw6, when sampling the image information output from each imaging system GD, It is desirable to use a CCD or CMOS image sensor having a high shutter speed. Along with this, it is necessary to increase the luminance of the illumination light that illuminates the observation regions Vw1 to Vw6, and it is conceivable to use a strobe light, a high-intensity LED, or the like as the illumination light source of the alignment microscopes AM1 and AM2.
- FIG. 11 is an explanatory diagram showing a positional relationship between a drawing line and a drawing pattern on the substrate.
- the drawing units UW1 to UW5 draw the patterns PT1 to PT5 by scanning the spot light of the drawing beam LB along the drawing lines LL1 to LL5.
- the drawing start positions OC1 to OC5 of the drawing lines LL1 to LL5 are the drawing start ends PTa of the patterns PT1 to PT5.
- the drawing end positions EC1 to EC5 of the drawing lines LL1 to LL5 become the drawing end PTb of the patterns PT1 to PT5.
- the drawing end PTb is joined to the drawing end PTb of the pattern PT2.
- the drawing start end PTa of the pattern PT2 is joined to the drawing start end PTa of the pattern PT3
- the drawing end PTb of the pattern PT3 is joined to the drawing end PTb of the pattern PT4
- the drawing start end PTa of the pattern PT4 is joined to the drawing start end PTa of the pattern PT5.
- the patterns PT1 to PT5 drawn on the substrate P are joined together in the width direction of the substrate P as the substrate P moves in the longitudinal direction, and the device pattern is drawn on the entire large exposure area A7.
- FIG. 12 is an explanatory diagram showing the relationship between the spot light of the drawing beam and the drawing line.
- the drawing lines LL1 and LL2 of the drawing units UW1 and UW2 will be described as a representative. The same applies to the drawing lines LL3 to LL5 of the drawing units UW3 to UW5, and the description thereof will be omitted.
- the beam spot light SP of the drawing beam LB moves along the drawing lines LL1 and LL2 on the substrate P along the drawing lines LL1 and LL2 from the drawing start positions OC1 and OC2 to the drawing end positions EC1 and EC2. Scanned by length LBL.
- the drawing lines LL1 and LL2 are constant in the X direction on the substrate P.
- Move (sub-scan) at a pitch is set to a distance CXs that is approximately 1 ⁇ 2 of the diameter Xs of the spot light SP, but is not limited thereto.
- the spot lights SP adjacent in the X direction are overlapped and exposed at a distance CXs that is 1 ⁇ 2 of the diameter Xs (or other overlapping distance may be used).
- the beam spot light SP shot at the drawing end position EC1 of the drawing line LL1 and the beam spot light SP shot at the drawing end position EC2 of the drawing line LL2 move in the longitudinal direction of the substrate P (ie, sub-scanning). ),
- the drawing start position OC1 and the drawing end position EC1 of the drawing line LL1, and the drawing start position OC2 of the drawing line LL2 and the drawing so as to be spliced in the width direction (Y direction) of the substrate P with the overlapping distance CXs.
- An end position EC2 is set.
- the spot light SP is occupied by 2 rows ⁇ 2 columns (a total of four spot lights aligned in both main scanning and sub scanning directions).
- the line width pattern can be exposed satisfactorily.
- the drawing on the drawing lines (LL1 to LL5) by the rotating polygon mirror 97 is performed.
- the number of scanning of the spot light SP (drawing beam LB) can be set to 1666.66. This means that patterns of 1666 or more drawing lines can be drawn on the substrate P in the transport direction (X direction) per second.
- the drawing line LL1 shown in FIG. 12 (the same applies to LL2 to LL5) in the X direction (the transport direction of the substrate P).
- the pitch (distance CXs) can be about 3 ⁇ m.
- the pattern drawing resolution R in the main scanning direction (Y direction), together with the effective diameter Xs of the spot light SP and the scanning frequency Fms, is that of the acousto-optic element (AOM) constituting the optical deflector 81.
- AOM acousto-optic element
- an acoustooptic element (AOM) of the optical deflector 81 having a maximum response frequency Fss of 100 MHz is used, and the ON / OFF switching time is set to 10 nsec. .
- the resolution R is halved to 1.5 ⁇ m.
- the conveyance speed of the substrate P by the rotation of the rotary drum DR is halved.
- the rotational speed of the rotating polygon mirror 97 may be increased.
- a resist having a resist sensitivity Sr of about 30 mj / cm 2 is used for a resist used in photolithography.
- the transmittance ⁇ Ts of the optical system is 0.5 (50%)
- the effective scanning period in one reflecting surface 97b of the rotating polygon mirror 97 is about 1/3
- the drawing line length LBL is 30 mm
- the drawing units UW1 to UW1 ⁇ Assuming that the number Nuw of UW5 is 5 and the transport speed Vp of the substrate P by the rotating drum DR is 5 mm / s (300 mm / min), the necessary laser power Pw of the light source device CNT can be estimated as the following equation.
- the required laser power Pw of the light source device CNT can be estimated by the following equation.
- a light source device CNT having a beam output of about 3 to 5 W is required to perform exposure at the same speed.
- the transport speed Vp of the substrate P due to the rotation of the rotating drum DR is reduced to 30/80 from the initial value of 5 mm / s, the beam output becomes 1.4. It is also possible to perform exposure with a light source device of about 1.9 W.
- the length LBL of the drawing line is set to 30 mm, and the resolution determined by the light switching by the spot diameter Xs of the beam spot light SP and the acoustooptic element (AOM) of the optical deflector 81 (in the minimum grid for specifying the beam position, (Corresponding to one pixel) If Xg is equal to 3 ⁇ m, the rotation time of the rotating polygon mirror 97 when the rotation speed of the 10-side rotating polygon mirror 97 is 10,000 rpm is 3/500 seconds.
- the pulse emission frequency Fz of the light source device CNT is preferably at least twice (for example, 100 MHz) the maximum response frequency Fss (for example, 50 MHz) of the acousto-optic element (AOM) of the optical deflector 81.
- the drive signal for switching the acousto-optic element (AOM) of the optical deflector 81 to the ON state / OFF state transitions while the acousto-optic element (AOM) transits from the ON state to the OFF state or from the OFF state to the ON state. It is preferable to control the light source device CNT so as to synchronize with a clock signal that oscillates at the pulse emission frequency Fz so that no pulse emission occurs during this time.
- the horizontal axis in FIG. 13 represents the drawing position of the spot light SP in the Y direction along the drawing line or the X direction along the transport direction of the substrate P, or the size of the spot light SP, and the vertical axis represents a single spot.
- This represents a relative intensity value obtained by standardizing the peak intensity of the light SP to 1.0.
- the intensity distribution of the single spot light SP is assumed to be J1, and the description will be made assuming a Gaussian distribution.
- the intensity distribution J1 of the single spot light SP has a diameter of 3 ⁇ m with an intensity of 1 / e 2 with respect to the peak intensity.
- the intensity distributions J2 to J6 are simulations of integrated intensity distributions (profiles) obtained on the substrate P when the two pulses of the spot light SP are irradiated with the positions shifted in the main scanning direction or the sub-scanning direction. The results are shown, and the positional shift amounts (interval distances) are varied.
- the intensity distribution J5 indicates a case where two pulses of the spot light SP are shifted by the same distance as the diameter of 3 ⁇ m, and the intensity distribution J4 indicates that the distance between the two pulses of the spot light SP is 2.
- the intensity distribution J3 indicates a case where the distance between the two pulses of the spot light SP is 1.5 ⁇ m.
- the highest hump shape is obtained, and at the position of the midpoint between the two spot lights, a normalized intensity of only about 0.3 is obtained.
- the spot light SP having a diameter of 3 ⁇ m is irradiated at intervals of 1.5 ⁇ m, the integrated profile does not have a conspicuous distribution in the profile, and is the midpoint between the two spot lights. It is almost flat across the position.
- the intensity distribution J2 indicates an integrated profile when the interval distance of the spot light SP for two pulses is 0.75 ⁇ m
- the intensity distribution J6 indicates the intensity of the single spot light SP.
- An integration profile when the full width at half maximum (FWHM) of the distribution J1 is set to 1.78 ⁇ m is shown.
- Such an optimal distance CXs is the pulse emission frequency Fz of the light source device CNT and the scanning speed or scanning time Ts of the spot light SP along the drawing line (the rotational speed of the rotating polygon mirror 97) in the main scanning direction.
- the sub-scanning direction can be set by adjusting at least one of the drawing line scanning frequency Fms (the rotational speed of the rotating polygon mirror 97) and the moving speed of the substrate P in the X direction. Can be set.
- the spot light in the main scanning direction is finely adjusted by finely adjusting the pulse emission frequency Fz of the light source device CNT.
- the ratio between the SP distance CXs and the spot light diameter Xs (dimension) can be adjusted to an optimum range.
- the light source device CNT has a pulse emission frequency Fz with a relationship of Fz> LBL / (Ts ⁇ Xs).
- Fz LBL / (Ts ⁇ CXs)
- the pulse emission frequency Fz of the light source device CNT is 100 MHz
- the rotating polygon mirror 97 is rotated at 10,000 rpm with 10 surfaces
- the effective spot light defined by 1 / e 2 or full width at half maximum (FWHM)
- FWHM full width at half maximum
- CXs 1.5 ⁇ m
- the light source device CNT of a pulse laser light source that combines the fiber amplifiers FB1 and FB2 and the wavelength conversion element of the wavelength conversion unit CU2 is used.
- pulsed light having such a high oscillation frequency can be easily obtained.
- FIG. 14 is a flowchart relating to the adjustment method of the exposure apparatus of the first embodiment.
- FIG. 15 is an explanatory diagram schematically showing the relationship between the reference pattern of the rotating drum and the drawing line.
- FIG. 16 is an explanatory diagram schematically illustrating a signal output from a photoelectric sensor that receives reflected light from the reference pattern of the rotating drum in a bright field.
- the controller 16 rotates the rotary drum DR as shown in FIG. 15 for calibration to grasp the positional relationship between the plurality of drawing units UW1 to UW5.
- the rotating drum DR may transport the substrate P that is light-transmitting to the extent that the drawing beam LB can be transmitted.
- the reference pattern RMP is integral with the outer peripheral surface of the rotary drum DR.
- an arbitrary reference pattern RMP1 moves with the movement of the outer peripheral surface of the rotary drum DR.
- the reference pattern RMP1 passes through the drawing lines LL1, LL3, LL5 and then passes through the drawing lines LL2, LL4.
- the control unit 16 scans the drawing beams LB of the drawing units UW1, UW3, and UW5.
- the control unit 16 scans the drawing beam LB of the drawing units UW2 and UW4 (step S1). Therefore, the reference pattern RMP1 is a reference for grasping the positional relationship between the drawing units UW1 to UW5.
- the photoelectric sensor 31Cs (FIG. 4) of the calibration detection system 31 described above detects reflected light from the reference pattern RMP1 via the f- ⁇ lens system 85 and the scanning optical system including the scanner 83.
- the photoelectric sensor 31Cs is connected to the control unit 16, and the control unit 16 detects a detection signal of the photoelectric sensor 31Cs (step S2).
- the drawing units UW1 to UW5 scan a plurality of rows of the plurality of drawing beams LB in a predetermined scanning direction for each of the drawing lines LL1 to LL5.
- the drawing units UW1 to UW5 use the drawing beam LB from the drawing start position OC1 in the direction (Y direction) along the rotation center line AX2 of the rotary drum DR described above.
- the first column scan SC1 is performed for LBL (see FIG. 12).
- the drawing units UW1 to UW5 draw the drawing beam LB from the drawing start position OC1 in the direction (Y direction) along the rotation center line AX2 of the rotary drum DR described above (see FIG. 12). Only the second column scan SC2 is performed.
- the drawing units UW1 to UW5 draw the drawing beam LB from the drawing start position OC1 in the direction (Y direction) along the rotation center line AX2 of the rotary drum DR described above (see FIG. 12). Only the third column scan SC3 is performed.
- the control unit 16 scans the drawing beam LB along the first row scan SC1 while the rotary drum DR is stationary, and then rotates the rotary drum DR by ⁇ P1 so as to be stationary. Even if the drawing beam LB is scanned along the scanning SC2, and the rotating drum DR is rotated again by ⁇ P2 to be stationary and the drawing beam LB is scanned along the third row scanning SC3, the respective parts are operated in this order. Good.
- the intersection portions Cr1 and Cr2 of the two line patterns RL1 and RL2 formed on the outer peripheral surface of the rotating drum DR are smaller than the length LBL of the drawing line described above. Is set. For this reason, when the drawing beam LB of the first column scan SC1, the second column scan SC2, and the third column scan SC3 is projected, at least the intersection portions Cr1 and Cr2 are irradiated with the drawing beam LB.
- the line patterns RL1 and RL2 are formed as irregularities on the surface of the rotary drum DR.
- the reflected light generated when the drawing beam LB is projected onto the line patterns RL1 and RL2 partially causes a difference in reflection intensity.
- the line patterns RL1 and RL2 are concave portions on the surface of the rotary drum DR
- the drawing beam LB is projected onto the line patterns RL1 and RL2
- the reflection is reflected by the line patterns RL1 and RL2.
- Light is received by the photoelectric sensor 31Cs in a bright field.
- the control unit 16 detects the edge position pscl of the reference pattern RMP based on the output signal from the photoelectric sensor 31Cs. For example, the control unit 16 obtains the first column scanning position data Dsc1 and the center value mpscl of the edge position pscl of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs during the first column scanning SC1.
- the control unit 16 obtains the first column scanning position data Dsc1 and the center value mpscl of the edge position pscl of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs during the first column scanning SC1.
- control unit 16 determines the second column scanning position data Dsc2 and the center value mpscl of the edge position pscl of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs during the second column scanning SC2.
- the control unit 16 stores the third column scanning position data Dsc3 and the center value mpscl of the edge position pscl of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs during the third column scanning SC3. To do.
- the control unit 16 intersects each other from the first column scanning position data Dsc1, the second column scanning position data Dsc2, the third column scanning position data Dsc3, and the center value mpscl of the edge positions pscl of the plurality of reference patterns RMP.
- the coordinate positions of the intersections Cr1 and Cr2 of the line patterns RL1 and RL2 are obtained by calculation.
- the control unit 16 can also calculate the relationship between the intersection points Cr1 and Cr2 of the two line patterns RL1 and RL2 that intersect each other and the drawing start position OC1.
- control unit 16 determines the relationship between the intersections Cr1 and Cr2 of the two line patterns RL1 and RL2 that intersect each other and the drawing start positions OC2 to OC5 (see FIG. 11). It can be calculated.
- the above-described center value mpscl may be obtained from the peak value of the signal output from the photoelectric sensor 31Cs.
- FIG. 17 is an explanatory diagram schematically showing a photoelectric sensor that receives reflected light from the reference pattern of the rotating drum in a dark field.
- FIG. 18 is an explanatory diagram schematically showing a signal output from a photoelectric sensor that receives reflected light from the reference pattern of the rotating drum in a dark field. As shown in FIG.
- a light shielding member 31f having a ring-shaped light transmission portion is disposed between the relay lens 94 and the photoelectric sensor 31Cs.
- the photoelectric sensor 31Cs receives edge scattered light or diffracted light among the reflected light reflected by the line patterns RL1 and RL2.
- the photoelectric sensor 31Cs receives edge scattered light or diffracted light among the reflected light reflected by the line patterns RL1 and RL2.
- the photoelectric sensor 31Cs is connected to the line patterns RL1 and RL2. The reflected light reflected at is received in the dark field.
- the control unit 16 detects the edge position pscdl of the reference pattern RMP based on the signal output from the photoelectric sensor 31Cs. For example, the control unit 16 obtains the first column scanning position data Dsc1 and the center value mpscdl of the edge position pscdl of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs during the first column scanning SC1.
- the control unit 16 determines the second column scanning position data Dsc2 and the center value mpscdl of the edge position pscdl of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs during the second column scanning SC2.
- the control unit 16 determines the second column scanning position data Dsc2 and the center value mpscdl of the edge position pscdl of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs during the second column scanning SC2.
- the control unit 16 stores the third column scanning position data Dsc3 and the center value mpscdl of the edge position pscdl of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs during the third column scanning SC3. .
- the control unit 16 intersects each other from the first column scanning position data Dsc1, the second column scanning position data Dsc2, the third column scanning position data Dsc3, and the center value mpscdl of the edge positions pscdl of the plurality of reference patterns RMP. Intersections Cr1 and Cr2 of the line patterns RL1 and RL2 are obtained by calculation. As a result, the control unit 16 obtains the relationship between the coordinate position of the intersections Cr1 and Cr2 of the two line patterns RL1 and RL2 intersecting each other and the drawing start position OC1 by calculation.
- control unit 16 can also calculate the relationship between the intersections Cr1 and Cr2 of the two line patterns RL1 and RL2 that intersect each other and the drawing start positions OC2 to OC5. .
- the photoelectric sensor 31Cs receives the reflected light reflected by the line patterns RL1 and RL2 in the dark field, the accuracy of the edge positions pscdl of the plurality of reference patterns RMP can be improved.
- the control unit 16 obtains adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement error from the detection signal detected in step S2 (step S1). S3).
- FIG. 19 is an explanatory diagram schematically showing the positional relationship between the reference patterns of the rotating drum.
- FIG. 20 is an explanatory diagram schematically showing the relative positional relationship between a plurality of drawing lines. As described above, the odd-numbered first drawing line LL1, the third drawing line LL3, and the fifth drawing line LL5 are arranged. As shown in FIG. 19, the first drawing line LL1, the third drawing line LL3, and the fifth drawing line LL5 are arranged.
- the control unit 16 For each drawing line LL5, the control unit 16 stores in advance the reference distance PL between the detected intersections Cr1. Similarly, the control unit 16 stores in advance the reference distance PL between the intersection points Cr1 detected for each of the second drawing line LL2 and the fourth drawing line LL4. The control unit 16 also stores in advance the reference distance ⁇ PL between the intersection points Cr1 detected for each of the second drawing line LL2 and the third drawing line LL3. Furthermore, the control unit 16 also stores in advance the reference distance ⁇ PL between the intersection points Cr1 detected for each of the fourth drawing line LL4 and the fifth drawing line LL5.
- the control unit 16 can grasp the positional relationship between the drawing start position OC1 of the first drawing line LL1 based on a signal from the origin detector 98 (see FIG. 7). The distance BL1 between the intersection point Cr1 and the drawing start position OC1 can be obtained. Further, since the drawing start position OC3 of the third drawing line LL3 can be detected by the origin detector 98, the control unit 16 can obtain the distance BL3 between the intersection part Cr1 and the drawing start position OC3.
- the control unit 16 obtains a positional relationship between the drawing start position OC1 and the drawing start position OC3 based on the distance BL1, the distance BL3, and the reference distance PL, and performs a drawing beam that scans along the drawing lines LL1 and LL3.
- An inter-origin distance ⁇ OC13 between the LB origins can be stored.
- the control unit 16 can obtain the distance BL5 between the intersection part Cr1 and the drawing start position OC5.
- control unit 16 obtains the positional relationship between the drawing start position OC3 and the drawing start position OC5 based on the distance BL3, the distance BL5, and the reference distance PL, and performs a drawing beam that scans along the drawing lines LL3 and LL5.
- An inter-origin distance ⁇ OC35 between the LB origins can be stored.
- the control unit 16 can obtain the distance BL2 between the intersection part Cr1 and the drawing start position OC2. Further, since the drawing start position OC4 of the fourth drawing line LL4 can be detected by the origin detector 98, the control unit 16 can obtain the distance BL4 between the intersection part Cr1 and the drawing start position OC4. Therefore, the control unit 16 obtains the positional relationship between the drawing start position OC2 and the drawing start position OC4 based on the distance BL2, the distance BL4, and the reference distance PL, and draws the drawing beam that scans along the drawing lines LL2 and LL4.
- the inter-origin distance ⁇ OC24 between the LB origins can be stored.
- the control unit 16 easily draws the drawing beam that is scanned along the drawing lines LL1 and LL2.
- the inter-origin distance ⁇ OC12 between the LB origins can be stored.
- the exposure apparatus EX can obtain the mutual positional relationship between the individual origins (drawing start points) of the plurality of drawing units UW1 to UW5.
- control unit 16 detects an error in which the drawing start position OC2 and the drawing start position OC3 are joined from the reference distance ⁇ PL between the intersection points Cr1 detected in the second drawing line LL2 and the third drawing line LL3. be able to. Furthermore, an error in which the drawing start position OC4 and the drawing start position OC5 are joined can be detected from the reference distance ⁇ PL between the intersection points Cr1 detected in the fourth drawing line LL4 and the fifth drawing line LL5. .
- the two intersections Cr1 and Cr2 are detected between the drawing start positions OC1 to OC5 and the drawing end positions EC1 to EC5 of the drawing lines LL1 to LL5. Thereby, the scanning direction from the drawing start positions OC1 to OC5 to the drawing end positions EC1 to EC5 can be detected. As a result, the control unit 16 can detect an angular error with respect to the direction (Y direction) along which the drawing lines LL1 to LL5 are along the center line AX2.
- the control unit 16 obtains adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement errors for the reference pattern RMP1 described above.
- the reference pattern RMP including the reference pattern RMP1 is a mesh-like reference pattern that is repeatedly engraved with a constant pitch (period) Pf1, Pf2. Therefore, the control unit 16 obtains adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement errors for the reference pattern RMP repeated at the pitches Pf1 and Pf2. Information related to the relative positional deviation of the drawing lines LL1 to LL5 is calculated. As a result, the control unit 16 can further improve the accuracy of the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement error.
- control unit 16 performs a process of adjusting the drawing state (step S4).
- the control unit 16 includes adjustment information (calibration information) corresponding to the arrangement state of the drawing lines LL1 to LL5 or mutual arrangement errors, and scale units (rotary drum DR) GPa, GPb detected by the encoder heads EN1, EN2.
- the drawing positions by the odd-numbered and even-numbered drawing units UW1 to UW5 are adjusted on the basis of the rotation angle position.
- the encoder heads EN1 and EN2 can detect the feed amount of the substrate P based on the scale units (rotating drums DR) GPa and GPb described above.
- FIG. 21 is an explanatory diagram schematically showing the relationship between the movement distance per unit time of the substrate and the number of drawing lines included in the movement distance, as in FIG.
- the encoder heads EN1 and EN2 can detect and store the movement distance ⁇ X of the substrate P per unit time.
- the alignment microscopes AM1 and AM2 may sequentially detect the plurality of alignment marks Ks1 to Ks3 and obtain and store the movement distance ⁇ X.
- a plurality of drawing lines LL1 by the drawing unit UW1 are drawn by the beam lines SPL1, SPL2, and SPL3 of the beam spot light SP, and the spot diameter Xs of each beam spot light SP is Scanning is performed so as to overlap in the X direction (and Y direction) at about 1/2.
- the beam spot light SP on the drawing end PTb side of the drawing line LL1 and the beam spot light SP on the drawing end PTb side of the drawing line LL2 are the width of the substrate P as the substrate P moves in the longitudinal direction. It will be spliced in the direction with the overlap distance CXs.
- the control unit 16 decreases the X-direction distance CXs between the beam lines SPL1, SPL2, and SPL3, and decreases the X-direction drawing magnification. Can be adjusted as follows.
- the control unit 16 detects the scale units (rotating drums DR) GPa and GPb using the adjustment information (calibration information) corresponding to the arrangement state of the drawing lines LL1 to LL5 or the mutual arrangement error and the encoder heads EN1 and EN2.
- the control unit 16 can adjust the drawing position in the X direction by the odd-numbered and even-numbered drawing units UW1 to UW5.
- FIG. 22 is an explanatory diagram schematically illustrating pulsed light that is emitted in synchronization with the system clock of the pulsed light source.
- the drawing line LL2 will be described with reference to FIG. 21, but the same applies to the drawing lines LL1 and LL3 to LL5.
- the light source device CNT can shoot the beam spot light SP in synchronization with the pulse signal wp as the system clock SQ.
- the temporal pulse interval ⁇ wp corresponds to the interval distance CXs in the main scanning direction of the spot light SP for each pulse on the drawing line LL2.
- the control unit 16 scans the beam spot light SP of the drawing beam LB by the length LBL of the drawing line along the drawing line LL2 on the substrate P.
- the control unit 16 While the drawing beam LB scans along the drawing line LL2, the control unit 16 partially changes the cycle of the system clock SQ to increase or decrease the pulse interval ⁇ wp at an arbitrary position in the drawing line LL2. It has a function to let you. For example, when the original system clock SQ is 100 MHz, the control unit 16 partially outputs the system clock SQ at a certain time interval (cycle), for example, 101 MHz (or 99 MHz) while scanning the drawing line length LBL. ). As a result, the number of beam spot lights SP in the drawing line length LBL increases or decreases. In other words, the control unit 16 partially increases / decreases the duty of the system clock SQ at a predetermined time interval (one or more) while scanning for the length LBL of the drawing line.
- a predetermined time interval one or more
- the interval of the beam spot light SP generated by the light source CNT changes by the change of the pulse interval ⁇ wp, and the overlapping distance CXs between the beam spot lights SP changes.
- the distance between the drawing start end PTa and the drawing end PTb in the Y direction apparently expands and contracts.
- the drawing line length LBL is 30 mm
- the drawing line length LBL is divided into 11 equal parts, and the pulse interval ⁇ wp of the system clock SQ is increased or decreased by one at every drawing length (periodic interval) of about 3 mm.
- the increase / decrease amount of the pulse interval ⁇ wp is a range in which the integrated profile (intensity distribution) is not greatly deteriorated due to a change in the interval distance CXs between two adjacent spot lights SP, for example, a reference interval distance If CSx is 50% of the diameter Xs (3 ⁇ m) of the spot light, it is set to about ⁇ 15%.
- the spot light for one pulse has a diameter at each of the 10 discrete points in the drawing line of length LBL.
- the position is shifted so as to extend in the main scanning direction by 10% of Xs.
- the length LBL of the drawing line after drawing extends by 3 ⁇ m with respect to 30 mm.
- the pattern drawn on the substrate P is enlarged by 0.01% (100 ppm) in the Y direction. As a result, even when the substrate P is expanded and contracted in the Y direction, the drawing pattern can be expanded and contracted in the Y direction and exposed.
- the control unit 16 of the exposure apparatus EX of the present embodiment includes a system clock SQ generation circuit, which generates a source clock signal with a constant pulse interval ⁇ wp as the system clock SQ.
- a time shift unit that increases or decreases the time until the next one clock pulse of the system clock SQ is generated when the original clock signal is input and counted for the preset number of pulses.
- the number of portions where the pulse interval ⁇ wp of the system clock SQ is increased or decreased is roughly determined by the magnification correction ratio (ppm) in the Y direction of the pattern to be drawn.
- ppm magnification correction ratio
- the pulse beam output from the light source device CNT of the pulse laser in response to the system clock SQ in which the pulse interval ⁇ wp is partially increased or decreased in this way is commonly supplied to each of the drawing units UW1 to UW5.
- the patterns drawn on each of the drawing lines LL1 to LL5 are expanded and contracted at the same ratio in the Y direction. Accordingly, as described with reference to FIG. 12 (or FIG. 11), in order to maintain the splicing accuracy between the drawing lines adjacent in the Y direction, the drawing start positions OC1 to OC5 (or the drawing lines) of the drawing lines LL1 to LL5.
- the drawing timing is corrected so that the end positions EC1 to EC5) shift in the Y direction.
- ON / OFF switching of the optical deflector (AOM) 81 shown in FIG. 4 is performed in response to a serial bit string (arrangement of bit values “0” or “1”) transmitted as drawing data.
- the transmission of the bit value may be synchronized with the pulse signal wp (FIG. 22) of the system clock SQ in which the pulse interval ⁇ wp is partially increased or decreased.
- one bit value is sent to the drive circuit of the optical deflector (AOM) 81 until one pulse signal wp is generated and the next pulse signal wp is generated.
- the optical deflector (AOM) 81 may be switched from the OFF state to the ON state.
- control unit 16 is capable of detecting displacement information YN1, YN2 capable of detecting adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement errors, and shakes at both ends of the rotating drum DR. Based on the information detected by YN3, YN3, YN4, the drawing positions in the Y direction by the odd-numbered and even-numbered drawing units UW1 to UW5 are adjusted so as to cancel the errors in the Y direction caused by the swing of the rotary drum DR. can do.
- control unit 16 detects displacement information YN1 and YN2 that can detect adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement errors, and shakes at both ends of the rotating drum DR. , YN3, and YN4 based on the information detected by the odd-numbered and even-numbered drawing units UW1 to UW5 (drawing) so as to cancel the error in the Y direction caused by the swing of the rotating drum DR.
- the line length LBL can be changed.
- the control unit 16 also adjusts the substrate P based on adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement errors and information detected by the alignment microscopes AM1 and AM2.
- adjustment information calibration information
- the drawing position in the X direction or Y direction by the odd-numbered and even-numbered drawing units UW1 to UW5 can be adjusted so as to cancel the error in the X direction or the Y direction.
- the exposure apparatus EX includes a plurality of drawing lines LL1 to LL5 formed on the substrate P by the drawing beams LB from the plurality of drawing units UW1 to UW5.
- a moving mechanism 24 is included as a shift correction mechanism that shifts the second optical surface plate 25 with respect to the first optical surface plate 23 within the drawing surface about the rotation axis I that is a predetermined point. Due to the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement error, the whole of the plurality of drawing lines LL1 to LL5 has an error with respect to at least one of the X direction and the Y direction.
- the control unit 16 performs drive control on the drive unit of the moving mechanism 24 so that the shift amount cancels the error, and moves the second optical surface plate 25 in the X direction and the Y direction. It can be shifted to at least one.
- the fourth reflecting mirror 59 shown in FIG. 6 is displaced in the X direction or the Y direction by the shift amount.
- the displacement of the fourth reflecting mirror 59 in the Y direction causes a shift in the Z direction when the drawing beam LB coming from the third reflecting mirror 58 is reflected in the + Y direction. Therefore, the shift movement in the Z direction is corrected by the beam shifter mechanism 44 in the first optical system 41.
- the beam LB is maintained so as to pass through the correct optical path with respect to the second optical system 42 and the third optical system 43 after the fourth reflecting mirror 59.
- the plurality of drawing lines LL1 to LL5 are arranged in the X direction and the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement error.
- the control unit 16 controls the beam shifter mechanism 44 so as to achieve a shift amount that cancels the error, and forms it on the substrate P.
- the drawn lines LL1 to LL5 can be slightly shifted in the X and Y directions.
- the odd number of the plurality of drawing lines LL1 to LL5 according to the arrangement state of the plurality of drawing lines LL1 to LL5 or the adjustment information (calibration information) corresponding to the mutual arrangement error.
- the control unit 16 instructs the beam shifter mechanism 45 so that the shift amount cancels the error.
- the even-numbered drawing lines LL2 and LL4 formed on the substrate P are slightly shifted in the X and Y directions, and the odd-numbered drawing lines LL1, LL3, and LL5 formed on the substrate P The relative positional relationship of can be finely adjusted.
- the control unit 16 can also adjust the Y magnification of the drawing units UW1 to UW5. For example, the image height of the telecentric f- ⁇ lens included in the f- ⁇ lens system 85 is proportional to the incident angle.
- the control unit 16 when adjusting only the Y magnification of the drawing unit UW1, the control unit 16 is based on the adjustment information (calibration information) and information detected by the displacement meters YN1, YN2, YN3, YN4 or the alignment microscopes AM1, AM2.
- the Y magnification can be adjusted by individually adjusting the focal length f of the f- ⁇ lens system 85.
- Such an adjustment mechanism is, for example, combined with one or more of a bending plate for magnification correction, a magnification correction mechanism for a telecentric f- ⁇ lens, and a herbing (tiltable parallel flat glass) for shift adjustment. Also good.
- the interval distance CXs of each spot light SP (pulse light) drawn in synchronization with the system clock SQ is slightly changed. It is possible to change (the amount of overlap between adjacent spot lights is slightly shifted), and as a result, the Y magnification can be adjusted.
- the exposure apparatus EX includes a plurality of drawing lines LL1 to LL5 formed on the substrate P by the drawing beams LB from the plurality of drawing units UW1 to UW5.
- a moving mechanism 24 is included as a rotating mechanism that rotates the second optical surface plate 25 relative to the first optical surface plate 23 within the drawing surface around the rotation axis I that is a predetermined point.
- the plurality of drawing lines LL1 to LL5 have an angle error with respect to the Y direction based on the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement error, control is performed.
- the unit 16 can rotate the second optical surface plate 25 by performing drive control on the drive unit of the moving mechanism 24 so that the rotation amount cancels the angle error.
- each of the drawing lines LL1 to LL5 can be slightly rotated (tilted) individually on the substrate P. Since the beam LB scanned by the rotating polygon mirror 97 is imaged (condensed) along the generatrix of the cylindrical lens 86 in the non-scanning direction, each drawing line LL1 is rotated by the rotation of the cylindrical lens 86 about the optical axis AXf. It is possible to rotate (tilt) LL5.
- the exposure apparatus EX of the first embodiment may perform at least one of the drawing position adjustment processing by the control device in step S4 described above. Further, the exposure apparatus EX of the first embodiment may perform processing by combining the above-described drawing position adjustment processing by the control device in step S4.
- the exposure apparatus EX of the first embodiment does not require test exposure to suppress the joint error between the patterns PT1 to PT5 adjacent in the width direction (Y direction) of the substrate P. Or the number of times is drastically reduced. For this reason, the exposure apparatus EX of the first embodiment can shorten the calibration work that takes time such as the test exposure, the drying and development process, and the confirmation of the exposure result. And the exposure apparatus EX of 1st Embodiment can suppress the waste of the board
- the exposure apparatus EX of the first embodiment can acquire adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement errors at an early stage.
- the exposure apparatus EX corrects in advance based on adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement errors, so that the X direction or Y It is possible to easily correct each component such as shift, rotation, and magnification in the direction. And the exposure apparatus EX of 1st Embodiment can raise the precision which carries out a superposition exposure on the board
- adjustment information calibration information
- the optical deflector 81 includes an acousto-optic element and the drawing beam LB is spot-scanned by the rotating polygon mirror 97.
- DMD Digital Micro mirror
- a pattern may be drawn using a device) or SLM (spatial light modulator).
- the photoelectric sensor 31Cs of the calibration detection system 31 is not a reference pattern (which can also be used as a reference mark) RMP but reflected light (scattered) of the alignment marks Ks1 to Ks3 on the substrate P.
- the alignment marks Ks1 to Ks3 are arranged at positions on the substrate P in the Y direction passing through any of the drawing lines LL1 to LL5 of the plurality of drawing units UW1 to UW5.
- the control unit 16 detects the edge positions of the alignment marks Ks1 to Ks3 based on the signal output from the photoelectric sensor 31Cs. As in the first embodiment, the control unit 16 adjusts information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or mutual arrangement errors from the detection signal detected by the photoelectric sensor 31Cs. Can be requested.
- the control unit 16 determines the substrate P.
- the drawing position in the X direction or Y direction by the odd-numbered and even-numbered drawing units UW1 to UW5 can be adjusted so as to cancel the error in the X direction or the Y direction.
- the spot light SP of the drawing beam LB is projected onto the alignment marks Ks1 to Ks3, the photosensitive layer on the alignment marks Ks1 to Ks3 may be exposed, and the alignment marks Ks1 to Ks3 may be crushed in a subsequent process. It is preferable to provide a plurality of alignment marks Ks1 to Ks3, and the alignment microscopes AM1 and AM2 read the alignment marks Ks1 to Ks3 that were not crushed by exposure.
- the vicinity of the alignment marks Ks1 to Ks3 that may be destroyed by exposure is scanned with the spot light SP of the drawing beam LB, and the alignment marks Ks1 to Ks3 that are not desired to be destroyed by exposure are scanned.
- Data for turning on / off the optical deflector (AOM) 81 can be included in the pattern drawing data so that the spot light SP is not irradiated in the vicinity. This makes it possible to acquire calibration information in almost real time and to read the alignment marks Ks1 to Ks3 (positions of the substrate P) while exposing with the drawing beam LB.
- the exposure apparatus EX of the second embodiment does not require test exposure for suppressing splicing errors, or the number of times is drastically reduced.
- the exposure apparatus EX of the second embodiment measures error information such as the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement relationship while pattern exposure is performed on the substrate P, and adjustment information corresponding thereto. (Calibration information) can be acquired early (almost in real time). Therefore, in the exposure apparatus EX of the second embodiment, correction and adjustment are performed so as to maintain a predetermined accuracy while exposing the device pattern based on error information or adjustment information (calibration information) measured early.
- the exposure apparatus EX of the second embodiment can maintain a high overlay accuracy when performing overlay exposure on the substrate P.
- FIG. 23 is a flowchart showing the device manufacturing method of each embodiment.
- step S201 the function / performance design of a display panel using a self-luminous element such as an organic EL is performed, and necessary circuit patterns and wiring patterns are designed by CAD or the like.
- step S202 a supply roll on which a flexible substrate P (resin film, metal foil film, plastic, or the like) serving as a base material of the display panel is wound is prepared.
- the roll-shaped substrate P prepared in step S202 has a surface modified as necessary, a base layer (for example, fine irregularities formed by an imprint method) previously formed, and light sensitivity.
- the functional film or transparent film (insulating material) previously laminated may be used.
- a backplane layer composed of electrodes, wiring, insulating film, TFT (thin film semiconductor), etc. constituting the display panel device is formed on the substrate P, and an organic EL or the like is laminated on the backplane.
- a light emitting layer (display pixel portion) is formed by the self light emitting element (step S203).
- the exposure apparatus EX described in each of the previous embodiments is used, and a photosensitive silane coupling material is applied instead of the conventional photolithography process in which the photoresist layer is exposed and developed.
- the substrate P is diced for each display panel device continuously manufactured on the long substrate P by a roll method, and a protective film (environmental barrier layer) or a color filter is formed on the surface of each display panel device.
- a device is assembled by pasting sheets or the like (step S204).
- an inspection process is performed to determine whether the display panel device functions normally or satisfies desired performance and characteristics (step S205).
- a display panel flexible display
- An electronic device created on a flexible long sheet substrate is not limited to a display panel, but a flexible wiring network as a harness (wiring bundle) for connection between various electronic components mounted on automobiles, trains, etc. It may be.
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Abstract
Description
図1は、第1実施形態の露光装置(基板処理装置)の全体構成を示す図である。第1実施形態の基板処理装置は、基板Pに露光処理を施す露光装置EXであり、露光装置EXは、露光後の基板Pに各種処理を施してデバイスを製造するデバイス製造システム1に組み込まれている。先ず、デバイス製造システム1について説明する。
デバイス製造システム1は、デバイスとしてのフレキシブル・ディスプレーを製造するライン(フレキシブル・ディスプレー製造ライン)である。フレキシブル・ディスプレーとしては、例えば有機ELディスプレー等がある。このデバイス製造システム1は、可撓性(フレキシブル)の長尺の基板Pをロール状に巻回した図示しない供給用ロールから、該基板Pが送り出され、送り出された基板Pに対して各種処理を連続的に施した後、処理後の基板Pを可撓性のデバイスとして図示しない回収用ロールに巻き取る、いわゆるロール・ツー・ロール(Roll to Roll)方式となっている。第1実施形態のデバイス製造システム1では、フィルム状のシートである基板Pが供給用ロールから送り出され、供給用ロールから送り出された基板Pが、順次、プロセス装置U1、露光装置EX、プロセス装置U2を経て、回収用ロールに巻き取られるまでの例を示している。ここで、デバイス製造システム1の処理対象となる基板Pについて説明する。
続いて、図1から図10を参照して、露光装置EXについて説明する。図2は、図1の露光装置の主要部の配置を示す斜視図である。図3は、基板上でのアライメント顕微鏡と描画ラインとの配置関係を示す図である。図4は、図1の露光装置の回転ドラム及び描画装置(描画ユニット)の構成を示す図である。図5は、図1の露光装置の主要部の配置を示す平面図である。図6は、図1の露光装置の分岐光学系の構成を示す斜視図である。図7は、図1の露光装置の複数の描画ユニット内の走査器の配置関係を示す図である。図8は、走査器の反射面の倒れによる描画ラインのずれを解消する為の光学構成を説明する図である。図9は、基板上でのアライメント顕微鏡と描画ラインとエンコーダヘッドとの配置関係を示す斜視図である。図10は、図1の露光装置の回転ドラムの表面構造の一例を示す斜視図である。
次に、第2実施形態の露光装置EXについて説明する。なお、第2実施形態では、第1実施形態と重複する記載を避けるべく、第1実施形態と異なる部分についてのみ説明し、第1実施形態と同様の構成要素については、第1実施形態と同じ符号を付して説明する。
次に、図23を参照して、デバイス製造方法について説明する。図23は、各実施形態のデバイス製造方法を示すフローチャートである。
11 描画装置
12 基板搬送機構
13 装置フレーム
14 回転位置検出機構
16 制御部
23 第1光学定盤
24 移動機構
25 第2光学定盤
31 キャリブレーション検出系
31Cs 光電センサー
31f 遮光部材
73 第4ビームスプリッタ
81 光偏向器
83 走査器
96 反射ミラー
97 回転ポリゴンミラー
97a 回転軸
97b 反射面
98 原点検出器
AM1,AM2 アライメント顕微鏡
DR 回転ドラム
EN1,EN2,EN3,EN4 エンコーダヘッド
EX 露光装置
I 回転軸
LL1~LL5 描画ライン
PBS 偏向ビームスプリッタ
UW1~UW5 描画ユニット
Claims (26)
- 長尺のシート状の基板を支持する支持面を有し、前記基板の長尺方向と交差する幅方向に関する前記支持面上の複数位置に基準マークが設けられた支持部材と、
該支持部材で支持された前記基板を前記長尺方向に移動させる搬送装置と、
前記支持面で支持された前記基板または前記支持面にビームのスポット光を投射しつつ、前記基板の幅方向の寸法よりも狭い範囲で走査し、該走査で得られる描画ラインに沿って所定のパターンが描画可能な複数の描画ユニットを含み、該複数の描画ユニットの各描画ラインによって前記基板上に描画されるパターン同士が前記基板の長尺方向への移動に伴って前記基板の幅方向に継ぎ合わされるように、前記複数の描画ユニットを前記基板の幅方向に配置した描画装置と、
前記複数の描画ユニットの各々に設けられ、前記ビームのスポット光の投射によって前記支持部材の支持面または前記基板から反射する反射光を検出する反射光検出部と、
前記複数の描画ユニットの各々による前記描画ライン上に、前記支持部材の前記基準マークが位置したときに前記反射光検出部から出力される信号に基づいて、前記複数の描画ラインの配置関係を計測する計測装置と、
を備える基板処理装置。 - 前記支持部材は、前記基板の幅方向に延びた中心線から一定半径で湾曲した円筒状の外周面の一部で前記基板を支持し、前記中心線の回りに回転することにより、前記基板を前記長尺方向に搬送する回転ドラムである、請求項1に記載の基板処理装置。
- 前記複数の描画ユニットは、前記基板上で互いに継ぎ合わされるパターンを描画する隣り合った描画ユニットの一方を奇数番とし他方を偶数番としたとき、該奇数番の描画ユニットの各々による奇数番の描画ラインと、前記偶数番の描画ユニットの各々による偶数番の描画ラインとが、前記回転ドラムの外周面の周方向に一定の角度間隔で位置するように配置される、請求項2に記載の基板処理装置。
- 前記奇数番の描画ラインの各々は、前記基板上で前記回転ドラムの回転の中心線とほぼ平行になるように、前記基板の幅方向に一列に配置され、前記偶数番の描画ラインの各々は、前記基板上で前記回転ドラムの回転の中心線とほぼ平行になるように、前記基板の幅方向に一列に配置される、請求項3に記載の基板処理装置。
- さらに、前記中心線から所定半径の周方向に形成された目盛を有し、前記回転ドラムと共に回転するように設けられたスケール部と、該スケール部の目盛を読み取り、前記基板の移動量または移動位置に応じた位置情報を出力するエンコーダヘッドとを備え、
前記搬送装置は、前記基板の長尺方向への搬送と連携するように前記エンコーダヘッドから出力される前記位置情報に基づいて前記回転ドラムを回転させる、請求項2から4のいずれか1項に記載の基板処理装置。 - 前記計測装置は、前記ビームのスポット光が前記支持部材の基準マークを走査したときに、前記複数の描画ユニットの各々の反射光検出部から出力される信号と、前記エンコーダヘッドから出力される位置情報とに基づいて、前記複数の描画ラインの相対的な位置関係に関わる情報を演算して記憶する制御部を備える、請求項5に記載の基板処理装置。
- 前記制御部は、前記複数の基準マークが前記回転ドラムの周方向へ移動する間に、前記描画ラインに沿った前記ビームのスポット光の複数回走査の各々により、前記反射光検出部から出力される複数の信号に基づいて、前記複数の描画ラインの相対的な位置関係の偏差に関わる情報を演算する、請求項6に記載の基板処理装置。
- 前記基板は、前記ビームに対して透過性を有し、前記反射光検出部は、前記ビームのスポット光が前記支持部材の支持面上の前記基準マークを直接照射したときに生じる反射光に応じた信号、または前記ビームが前記基板を透過して前記基準マークを照射したときに生じる反射光に応じた信号を出力する、請求項2から4のいずれか1項に記載の基板処理装置。
- さらに、前記ビームを出力するレーザ光源を備え、
前記複数の描画ユニットの各々は、前記レーザ光源からのビームを一次元に偏向走査する走査光学系と、該偏向走査されたビームを前記基板上または前記支持部材の支持面上で前記スポット光に集光するように投射するビーム投射光学系とを備え、
前記反射光検出部は、前記基板または前記支持部材の支持面からの反射光を、前記ビーム投射光学系と前記走査光学系とを介して光電検出するための光電センサーと、該光電センサーと前記走査光学系との間の光路中に配置される光分割器とを含む、請求項1から6のいずれか1項に記載の基板処理装置。 - 前記走査光学系は、前記レーザ光源からのビームを一方向に偏向走査する回転多面鏡を含み、
前記ビーム投射光学系は、前記回転多面鏡で偏向走査された前記ビームを前記描画ライン上に導くf-θレンズと、前記f-θレンズと前記支持部材との間に設けられ、前記描画ラインが延びる方向とほぼ平行な母線を有し、該母線と直交する方向に前記ビームを集光するシリンドリカルレンズとを備える、請求項9に記載の基板処理装置。 - 前記複数の描画ユニットの各々は、レーザ光源からのビームを一次元に偏向走査する走査光学系と、該偏向走査されたビームを前記ビームとして前記基板または前記回転ドラムの外周面に向けて投射するビーム投射光学系と、該ビーム投射光学系と前記回転ドラムとの間に設けられ、前記描画ラインが延びる方向とほぼ平行な母線を有し、該母線と直交する方向に前記ビームを集光するシリンドリカルレンズとを備える、請求項2から4のいずれか1項に記載の基板処理装置。
- 前記基準マークは、前記回転ドラムの外周面上の前記中心線が延びる方向に所定の間隔で複数設けられ、該所定間隔は、前記複数の描画ラインの長さよりも小さく設定される、請求項2から11のいずれか1項に記載の基板処理装置。
- 前記基準マークは、前記回転ドラムの外周面上に形成される互いに交差する2本のラインパターンの交点部で構成される、請求項12に記載の基板処理装置。
- 前記複数の描画ユニットの各々から前記基板または前記回転ドラムの外周面に投射される前記ビームは、前記回転ドラムの回転の中心線に向かうように配置される、請求項2から13のいずれか1項に記載の基板処理装置。
- 前記反射光検出部は、前記基板または前記支持部材の支持面で発生する前記反射光を、明視野または暗視野で受光する光電センサーを備え、該光電センサーから出力される信号に基づいて、前記基準マークのエッジ位置を検出する、請求項1から8のいずれか1項に記載の基板処理装置。
- 前記描画ラインの長さをLBL、前記ビームの前記長さLBLに渡る走査時間をTs、前記描画ライン上に形成される前記スポット光の前記走査方向のスポット寸法をXsとしたとき、前記レーザ光源は、繰り返し発光周波数Fzが、Fz≧LBL/(Ts・Xs)を満たすパルスレーザ光源である、請求項7または10に記載の基板処理装置。
- 請求項1から請求項16のいずれか1項に記載の基板処理装置を用いて前記基板に前記パターンを形成する、デバイス製造方法。
- 離散または連続する特定の基準マークを、支持面上の予め定められた複数の位置に備える支持部材と、
前記支持部材の支持面で所定幅の基板を支えながら、前記幅の方向と交差した長尺方向に所定速度で搬送する搬送装置と、
前記基板に投射されるビームのスポット光を前記基板の幅よりも狭い範囲で前記幅方向に走査して得られる描画ラインに沿って、所定のパターンを前記基板上に描画可能な複数の描画ユニットを備え、
前記複数の描画ユニットの各々によって前記基板上に描画されるパターン同士が、前記基板の前記長尺方向への搬送に伴って前記基板の幅方向に継ぎ合わされるように、互いに前記幅方向に隣り合う前記描画ラインを前記長尺方向に所定の間隔で離して配置した描画装置と、
前記複数の描画ユニットの各々からの前記ビームの照射によって、前記支持部材の支持面から発生する反射光を検出する複数の反射光検出部と、を備える基板処理装置の調整方法であって、
前記複数の描画ユニットの各々によって形成される前記描画ライン上に、前記基準マークがもたらされるように、前記支持部材と前記描画装置を相対的に移動させ、前記基準マークを前記ビームのスポット光で走査する走査ステップと、
前記ビームの走査によって前記基準マークから発生する反射光を、前記反射光検出部によって検出し、前記基準マークに応じた検出信号を得る検出ステップと、
前記検出信号に基づいて前記複数の描画ラインの配置状態または相互の配置誤差に対応する調整情報を求めるステップと、を含み、
前記調整情報に基づいて、前記複数の描画ユニットの各々による前記パターンの描画状態を調整する、基板処理装置の調整方法。 - 前記基板処理装置は、さらに前記支持部材の支持面の移動量に応じた位置変位情報を出力する移動計測機構を備え、
前記調整情報を求めるステップは、前記検出ステップで検出された前記検出信号と、前記移動計測機構から出力される前記位置変位情報とに基づいて、前記複数の描画ユニットの各々によって形成される前記描画ラインの相互の位置関係または位置誤差を前記調整情報として演算する演算ステップを含む、請求項18に記載の基板処理装置の調整方法。 - 前記基板処理装置の前記支持部材は、前記基板の幅方向に延びた中心線から一定半径で湾曲した円筒状の外周面の一部で前記基板を支持し、前記中心線の回りに回転することにより、前記基板を前記長尺方向に搬送する回転ドラムである、請求項19に記載の基板処理装置の調整方法。
- 前記基準マークは、前記回転ドラムの外周面上の前記中心線が延びる方向に所定の間隔で複数設けられ、該所定間隔は、前記複数の描画ラインの長さよりも小さく設定される、請求項20に記載の基板処理装置の調整方法。
- 前記基準マークは、前記回転ドラムの外周面上に形成される互いに交差する2本のラインパターンの交点部で構成される、請求項21に記載の基板処理装置の調整方法。
- 強度変調されたビームのスポット光を基板上で所定の描画ラインに沿って主走査しつつ、前記描画ラインと交差した方向に前記ビームと前記基板とを副走査することによって、前記基板上に所定のパターンを描画する基板処理装置であって、
前記基板を支持する支持面を有する支持部材と、
該支持部材で支持された前記基板を前記副走査の方向に移動させる搬送装置と、
前記ビームとして、繰り返し発光周波数Fzで紫外波長域のパルスビームを出力するパルスレーザ光源と、
該パルスレーザ光源からのパルスビームを前記描画ライン上に描画すべきパターンに応じて強度変調する変調器と、該変調器で変調されたビームを一次元に偏向走査する走査光学系と、該偏向走査されたビームを前記基板に向けて投射するビーム投射光学系とを備えた描画ユニットと、を備え、
前記描画ラインの長さをLBL、前記ビームのスポット光の前記長さLBLに渡る走査時間をTs、前記スポット光の前記描画ラインに沿った方向の寸法をXsとしたとき、前記パルスレーザ光源の発光周波数Fzを、Fz≧LBL/(Ts・Xs)の関係を満たすように設定する、基板処理装置。 - 前記パルスレーザ光源は、光ファイバーによる増幅器と波長変換素子とを含む、請求項23に記載の基板処理装置。
- 前記変調器は、前記パルスビームを前記走査光学系に入射させる状態と非入射の状態とに切り替える光スイッチング素子を含み、該光スイッチング素子の上限の変調周波数と前記パルスレーザ光源の発光周波数Fzを整数倍の関係に設定する、請求項24に記載の基板処理装置。
- 前記基板処理装置は、前記発光周波数Fzで前記パルスビームが出力されるように、前記パルスレーザ光源に周波数Fzのクロック信号を与えるクロック発生回路を備え、該クロック発生回路は、前記長さLBLに渡る前記走査時間Tsの間の1ヶ所、又は離散的な複数ヶ所の各々で、前記クロック信号のうちの連続した2つのクロックパルスの時間的な間隔を、前記周波数Fzでのクロックパルスの時間的な間隔に対して増減させる、請求項23~25のいずれか1項に記載の基板処理装置。
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