WO2015146473A1 - フラックス及びソルダペースト - Google Patents
フラックス及びソルダペースト Download PDFInfo
- Publication number
- WO2015146473A1 WO2015146473A1 PCT/JP2015/055781 JP2015055781W WO2015146473A1 WO 2015146473 A1 WO2015146473 A1 WO 2015146473A1 JP 2015055781 W JP2015055781 W JP 2015055781W WO 2015146473 A1 WO2015146473 A1 WO 2015146473A1
- Authority
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- WIPO (PCT)
- Prior art keywords
- long
- flux
- dibasic acid
- chain dibasic
- chain
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
Definitions
- the present invention relates to a flux capable of fixing an object to be joined with a flux residue, and a solder paste in which a flux and a solder alloy are mixed.
- the flux used for soldering removes the metal oxides present on the metal surface of the solder alloy and the object to be soldered, and allows the movement of metal elements at the boundary between them. Has the effect of For this reason, by performing soldering using a flux, an intermetallic compound can be formed between the solder alloy and the metal surface of the object to be joined, and a strong joint can be obtained.
- the component of the flux contains a component that does not decompose or evaporate by heating of soldering, and remains as a flux residue around the soldering site after soldering.
- thermosetting resin In the technology for fixing the object to be joined with the flux residue, it is necessary to remove the metal oxide and improve the solder wettability so that the flux function is not hindered by the addition of thermosetting resin to the flux. In addition, it is necessary to generate a flux residue with a thermosetting resin so that an object to be bonded can be fixed with the flux residue.
- the present invention has been made to solve such a problem, and can improve the wettability of the solder by removing the metal oxide formed on the metal surface of the solder alloy and the soldering object. And it aims at providing the solder paste by which the flux which enabled the joining target object to be fixed with a flux residue, and the flux and the solder alloy were mixed.
- thermosetting resin By adding a thermosetting resin to the flux, the thermosetting resin is cured by heating at the time of soldering to cure the flux residue, and the soldered object to be joined and the object to be joined are flux residue. It can be fixed with.
- the flux to which the thermosetting resin is added has the first long-chain dibasic acid having an alkyl group in the side chain, the alkyl group and the alkoxycarbonyl group in the side chain, and both end carboxyl groups.
- a long-chain dibasic acid mixture containing one or more second long-chain dibasic acids having 8 or more carbon atoms in the sandwiched main chain curing of the thermosetting resin is inhibited.
- the present inventors have found that the function of the flux for removing the metal oxide is not hindered by the addition of the thermosetting resin, and the wettability of the solder is improved.
- the present invention provides a thermosetting resin, a first long-chain dibasic acid having an alkyl group in a side chain added as a curing agent and an activator for curing the thermosetting resin, and a side chain.
- the long-chain dibasic acid mixture is preferably a mixture containing one or more long-chain dibasic acids having two or more alkoxycarbonyl groups as the second long-chain dibasic acid. .
- the alkoxycarbonyl group is preferably a methoxycarbonyl group.
- the long-chain dibasic acid mixture is a compound having the composition shown in the following (1), (2), (3) or (4), or two or more of these compounds in a predetermined ratio.
- a mixed mixture is preferable.
- 2-methylnonanedioic acid (2) 4- (methoxycarbonyl) -2,4-dimethylundecanedioic acid (3) 4,6-bis (methoxycarbonyl) -2,4,6-trimethyltridecanedioic acid (4) 8,9-bis (methoxycarbonyl) -8,9-dimethylhexadecanedioic acid
- the ratio of the said long-chain dibasic acid mixture shown to (1), (2), (3) and (4) is as follows.
- “%” is “% by mass” unless otherwise specified. (1) 30-60% (2) 8-20% (3) 8-20% (4) 15-30%
- the content of the thermosetting resin is preferably 30 to 70%, and the content of the long-chain dibasic acid mixture is preferably 20 to 60%.
- 0.1 to 40% of a solvent may be added to the flux.
- the present invention provides a first long-chain dibasic acid having an alkyl group in a side chain added as a thermosetting resin, a curing agent for curing the thermosetting resin and an activator, and a side chain.
- a long-chain dibasic acid having one or more second long-chain dibasic acids having an alkyl group and an alkoxycarbonyl group and having a main chain of 8 or more carbon atoms sandwiched between both carboxyl groups A solder paste characterized in that a flux containing a mixture and a solder alloy powder are mixed.
- the content of the thermosetting resin is 30 to 40% and the content of the long-chain dibasic acid mixture is 20 to 60%.
- the flux has a thermosetting resin, a first long-chain dibasic acid having an alkyl group in the side chain, an alkyl group and an alkoxycarbonyl group in the side chain, and sandwiched between carboxyl groups at both ends.
- a long-chain dibasic acid mixture containing one or more second long-chain dibasic acids having 8 or more carbon atoms in the main chain is added to the metal surface of the solder alloy and the object to be joined. The generated metal oxide is removed, and the wettability of the solder is improved.
- the flux residue is cured by curing the thermosetting resin by heating at the time of soldering, and the object to be bonded is fixed to the bonded object by the cured flux residue.
- the flux of the present embodiment includes an epoxy resin that is a thermosetting resin, a first long-chain dibasic acid having an alkyl group in a side chain that is added as a curing agent and an activator for curing the epoxy resin, A long chain having one or more second long-chain dibasic acids having an alkyl group and an alkoxycarbonyl group in the side chain and having a main chain of 8 or more carbon atoms sandwiched between the carboxyl groups at both ends And a dibasic acid mixture.
- the flux of this Embodiment contains the hardening castor oil which provides thixotropy, and the hardening accelerator of an epoxy resin.
- the epoxy resin content in the flux is 30-40%
- the long-chain dibasic acid mixture content is 20-60%
- the solvent content is 7-37%
- the balance is hardened castor oil.
- a curing accelerator was used.
- the flux of the present embodiment is mixed with solder alloy powder to produce a solder paste.
- the solder paste of the present embodiment is generated by mixing the flux having the above-described composition and the solder alloy powder having a composition of 96.5Sn-3.0Ag-0.5Cu (each numerical value is mass%) in this example.
- the solder paste is applied to the electrodes of the substrate that is the object to be joined, and the electronic component that is the object to be joined, for example, a semiconductor chip, is placed on the substrate to which the solder paste is applied with the position of the electrodes aligned.
- the solder paste is heated, so that the solder alloy in the solder paste is melted and cured, and the electrode of the semiconductor chip and the electrode of the substrate are joined by solder. Further, the flux in the solder paste is cured, so that the semiconductor chip electrode, the substrate electrode, and the solder are fixed by the flux residue.
- the epoxy resin is cured at a predetermined temperature to cure the flux residue. Moreover, an epoxy resin has adhesiveness with a joining thing and a joining target object. As a result, the epoxy resin in the flux is mainly cured, so that the semiconductor chip electrode that is the bonding target and the substrate electrode that is the bonding object, and the solder are fixed by the cured flux residue.
- Typical epoxy resins include bisphenol type epoxy resins, and bisphenol types include bisphenol A type, bisphenol AP type, bisphenol AF type, bisphenol B type, bisphenol BP type, bisphenol C type, bisphenol E type, bisphenol F type. Type, bisphenol G type, bisphenol M type, bisphenol S type, bisphenol P type, bisphenol PH type, bisphenol TMC type, bisphenol Z type and the like. In this example, bisphenol A type was used.
- the long chain dibasic acid mixture improves the wettability of the solder by removing the oxide on the surface of the joining object.
- the long-chain dibasic acid mixture accelerates the curing of the epoxy resin and gives the cured flux residue a predetermined softness.
- the long-chain dibasic acid mixture preferably contains one or more long-chain dibasic acids having two or more alkoxycarbonyl groups as the second long-chain dibasic acid.
- the mixture is a mixture of
- preferable ratios as a mixture of the long-chain dibasic acid mixture shown in the above (1), (2), (3) and (4) are as follows when the ratio of the whole mixture is 100%. .
- a curing accelerator may be added for the purpose of shortening the curing time.
- the curing accelerator include phenol compounds, tertiary amines, quaternary ammonium salts, quaternary phosphonium salts, imidazoles, organic acid metal salts, Lewis acids, and the like.
- a solvent may be added to the flux of the present application for viscosity adjustment and dissolution of the additive.
- the powder of Sn—Ag—Cu composition is used in this example, but the present application is not limited to the above composition, and powder of other composition may be used.
- Sn-based alloys containing Sn as a main component there are Sn-based alloys containing Sn as a main component, Bi-based alloys containing Bi as a main component, In alloys containing In as a main component, and each of these alloys includes Ag, Cu, In, Bi Ni, Ge, Ga, Co, Fe, Sb, P, Zn, Al, Ti, etc. may be added by selecting one or more elements not contained in the elements.
- the fluxes of Examples and Comparative Examples were prepared with the compositions shown in Table 1 below, and the solder wettability and the reinforcing effect were verified.
- the composition rate in Table 1 is the mass% in a flux composition.
- Examples 1 to 3 a mixture of long-chain dibasic acid mixtures in which the long-chain dibasic acid mixtures shown in (1), (2), (3) and (4) described above were mixed at a predetermined ratio was prepared. Were added at the ratios shown in Table 1 below.
- Comparative Example 1 the long-chain dibasic acid mixture added in each Example was not added.
- Comparative Example 2 the long-chain dibasic acid mixture was added in an amount less than the amount specified in each Example.
- Comparative Example 3 the long-chain dibasic acid mixture was added in an amount greater than the amount specified in each Example.
- Comparative Example 4 the addition amount of the long-chain dibasic acid mixture was the same as that in Example 1, and no epoxy resin was added.
- Comparative Example 5 a long-chain dibasic acid mixture was not added, and adipic acid was added as an organic acid by a roll method.
- Example 2 in which 20% of the long-chain dibasic acid mixture, 40% of the epoxy resin, and other compounds were added in the ratios shown in Table 1, the spread diameter of the solder was 0.46 mm and the shear strength was 4.26 N. It can be seen that even in Example 2, good solder wettability and a reinforcing effect can be obtained.
- Example 3 in which 60% of the long-chain dibasic acid mixture, 30% of the epoxy resin, and other compounds were added at the ratios shown in Table 1, the solder spread diameter was 0.52 mm and the shear strength was 4.19N. In Example 3, it can be seen that good solder wettability and reinforcing effect can be obtained.
- the addition of the long-chain dibasic acid mixture to the flux improves the shear strength and provides a reinforcing effect, but increases the addition amount of the long-chain dibasic acid mixture and relatively decreases the addition amount of the epoxy resin It can be seen that the share strength tends to decrease.
- the ratio of the long-chain dibasic acid mixture is 40%, the same as in Example 1, and the flux of Comparative Example 4 with no epoxy resin added has a solder spread diameter of 0.54 mm and a shear strength of 3.08 N. It can be seen that the diameter satisfies the desired conditions and solder wettability is obtained, but the shear strength is low and the desired reinforcing effect cannot be obtained.
- the content of the epoxy resin is set to 30 to 40% and the content of the long-chain dibasic acid mixture is set to 20 to 60%.
- the flux of the present invention may be applied to a conductive adhesive.
- the conductive adhesive is used to knead the flux and conductive metal powder and bond them at a temperature lower than the melting point of the metal powder. Unlike the solder paste, the conductive adhesive becomes conductive as the resin hardens by heating. When the metal powders are in close contact with each other, the circuit board and various electronic components are joined without melting the conductive metal powder.
- the present invention is applied to a flux in which a substrate and an electronic component can be fixed with a flux residue.
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Abstract
Description
(1)2-メチルノナン二酸
(2)4-(メトキシカルボニル)-2,4-ジメチルウンデカン二酸
(3)4,6-ビス(メトキシカルボニル)-2,4,6-トリメチルトリデカン二酸
(4)8,9-ビス(メトキシカルボニル) -8,9-ジメチルヘキサデカン二酸
(1)30~60%
(2)8~20%
(3)8~20%
(4)15~30%
(2)4-(メトキシカルボニル)-2,4-ジメチルウンデカン二酸
(3)4,6-ビス(メトキシカルボニル)-2,4,6-トリメチルトリデカン二酸
(4)8,9-ビス(メトキシカルボニル) -8,9-ジメチルヘキサデカン二酸
(2)8~20%
(3)8~20%
(4)15~30%
(a)評価方法
Cu板上にフラックスを塗布し、Cu板上に塗布したフラックス上にはんだボールを搭載し、リフローを行った後、はんだ濡れ広がり径を測定した。リフロー工程は、ピーク温度を250℃に設定したリフロー装置を用いて、40℃から1秒毎に3.5℃ずつ220℃まで温度を上昇させていき、220℃に達した後、220℃以上の温度で55秒間加熱処理を行った。はんだボールの組成は96.5Sn-3.0Ag-0.5Cu、直径は0.3mmである。
(b)判定基準
○:はんだの広がり径が0.45mm以上
×:はんだの広がり径が0.45mm未満
(2)補強効果の検証について
(a)評価方法
基板にフラックスを供給し、基板に供給したフラックス上にはんだボールを搭載し、リフローを行った後、測定用工具を使用してはんだボール及びフラックス残渣を基板からせん断するシェア試験と称される試験を行い、せん断に必要な力を測定した。試験機には、デイジ・ジャパン株式会社製のシリーズ4000を使用した。シェア試験において測定されるせん断に必要な力をシェア強度と称する。はんだボールの組成は96.5Sn-3.0Ag-0.5Cu、直径は0.3mmである。
(b)判定基準
○:シェア強度4N以上
×:シェア強度4N未満
Claims (9)
- 熱硬化性の樹脂と、
前記熱硬化性の樹脂を硬化させる硬化剤及び活性剤として添加される側鎖にアルキル基を有する第1の長鎖二塩基酸と、側鎖にアルキル基とアルコキシカルボニル基とを有し、かつ両端カルボキシル基に挟まれた主鎖の炭素数が8以上の第2の長鎖二塩基酸を1種又はそれ以上含有する、長鎖二塩基酸混合物を含む
ことを特徴とするフラックス。 - 前記第2の長鎖二塩基酸として、アルコキシカルボニル基を2個又はそれ以上有する長鎖二塩基酸を1種又はそれ以上含有する前記長鎖二塩基酸混合物を含む請求項1に記載のフラックス。
- 前記アルコキシカルボニル基がメトキシカルボニル基である長鎖二塩基酸混合物を含むことを特徴とする請求項1又は2に記載のフラックス。
- 前記長鎖二塩基酸混合物は、以下の(1)、(2)、(3)あるいは(4)に示す組成の化合物の何れか、または、これら化合物の2つ以上を所定の比率で混合した混合物である
ことを特徴とする請求項3に記載のフラックス。
(1)2-メチルノナン二酸
(2)4-(メトキシカルボニル)-2,4-ジメチルウンデカン二酸
(3)4,6-ビス(メトキシカルボニル)-2,4,6-トリメチルトリデカン二酸
(4)8,9-ビス(メトキシカルボニル) -8,9-ジメチルヘキサデカン二酸 - (1)、(2)、(3)及び(4)に示す前記長鎖二塩基酸混合物の比率は、以下の通りである
ことを特徴とする請求項4に記載のフラックス。
(1)30~60%
(2)8~20%
(3)8~20%
(4)15~30% - 熱硬化性の前記樹脂の含有量を30~70%、前記長鎖二塩基酸混合物の含有量を20~60%とした
ことを特徴とする請求項1から請求項5に記載のフラックス。 - 前記フラックス中に0.1~40%の溶剤を添加したことを特徴とする請求項1から請求項6に記載のフラックス。
- 熱硬化性の樹脂、熱硬化性の前記樹脂を硬化させる硬化剤及び活性剤として添加される側鎖にアルキル基を有する第1の長鎖二塩基酸と、側鎖にアルキル基とアルコキシカルボニル基とを有し、かつ両端カルボキシル基に挟まれた主鎖の炭素数が8以上の第2の長鎖二塩基酸を1種又はそれ以上含有する、長鎖二塩基酸混合物を含むフラックスと、
はんだ合金粉末が混合された
ことを特徴とするソルダペースト。 - 熱硬化性の前記樹脂の含有量を30~40%、前記長鎖二塩基酸混合物の含有量を20~60%とした
ことを特徴とする請求項8に記載のソルダペースト。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/128,231 US9902022B2 (en) | 2014-03-25 | 2015-02-27 | Flux and solder paste |
CN201580016031.9A CN106132629B (zh) | 2014-03-25 | 2015-02-27 | 助焊剂及焊膏 |
KR1020167029054A KR101712787B1 (ko) | 2014-03-25 | 2015-02-27 | 플럭스 및 솔더 페이스트 |
EP15770209.3A EP3124167B1 (en) | 2014-03-25 | 2015-02-27 | Flux and solder paste |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-062417 | 2014-03-25 | ||
JP2014062417A JP5952849B2 (ja) | 2014-03-25 | 2014-03-25 | フラックス及びソルダペースト |
Publications (1)
Publication Number | Publication Date |
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WO2015146473A1 true WO2015146473A1 (ja) | 2015-10-01 |
Family
ID=54195004
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2015/055781 WO2015146473A1 (ja) | 2014-03-25 | 2015-02-27 | フラックス及びソルダペースト |
Country Status (7)
Country | Link |
---|---|
US (1) | US9902022B2 (ja) |
EP (1) | EP3124167B1 (ja) |
JP (1) | JP5952849B2 (ja) |
KR (1) | KR101712787B1 (ja) |
CN (1) | CN106132629B (ja) |
TW (1) | TWI596154B (ja) |
WO (1) | WO2015146473A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017047694A1 (ja) * | 2015-09-18 | 2017-03-23 | 千住金属工業株式会社 | フラックス |
US9972591B2 (en) * | 2016-03-31 | 2018-05-15 | Renesas Electronics Corporation | Method of manufacturing semiconductor device |
JP6399242B1 (ja) * | 2018-01-17 | 2018-10-03 | 千住金属工業株式会社 | フラックス及びソルダペースト |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017130623A (ja) * | 2016-01-22 | 2017-07-27 | 株式会社村田製作所 | 充填用ペースト材料、それを用いたビアホール導体の製造方法および多層基板の製造方法 |
JP6536503B2 (ja) * | 2016-07-12 | 2019-07-03 | 千住金属工業株式会社 | フラックス |
EP3834982A4 (en) * | 2018-08-10 | 2021-12-22 | Koki Company Limited | FLUX AND SOLDER PASTE |
Citations (6)
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- 2015-02-27 WO PCT/JP2015/055781 patent/WO2015146473A1/ja active Application Filing
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WO2019142772A1 (ja) * | 2018-01-17 | 2019-07-25 | 千住金属工業株式会社 | フラックス及びソルダペースト |
JP2019122994A (ja) * | 2018-01-17 | 2019-07-25 | 千住金属工業株式会社 | フラックス及びソルダペースト |
US11376694B2 (en) | 2018-01-17 | 2022-07-05 | Senju Metal Industry Co., Ltd. | Flux and solder paste |
Also Published As
Publication number | Publication date |
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EP3124167B1 (en) | 2019-05-08 |
JP2015182125A (ja) | 2015-10-22 |
EP3124167A1 (en) | 2017-02-01 |
CN106132629A (zh) | 2016-11-16 |
KR101712787B1 (ko) | 2017-03-06 |
TWI596154B (zh) | 2017-08-21 |
JP5952849B2 (ja) | 2016-07-13 |
EP3124167A4 (en) | 2017-09-20 |
CN106132629B (zh) | 2017-10-13 |
TW201602219A (zh) | 2016-01-16 |
KR20160133558A (ko) | 2016-11-22 |
US20170190005A1 (en) | 2017-07-06 |
US9902022B2 (en) | 2018-02-27 |
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