JP5952849B2 - フラックス及びソルダペースト - Google Patents
フラックス及びソルダペースト Download PDFInfo
- Publication number
- JP5952849B2 JP5952849B2 JP2014062417A JP2014062417A JP5952849B2 JP 5952849 B2 JP5952849 B2 JP 5952849B2 JP 2014062417 A JP2014062417 A JP 2014062417A JP 2014062417 A JP2014062417 A JP 2014062417A JP 5952849 B2 JP5952849 B2 JP 5952849B2
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- JP
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- Prior art keywords
- flux
- long
- chain dibasic
- mass
- dibasic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000004907 flux Effects 0.000 title claims description 85
- 229910000679 solder Inorganic materials 0.000 title claims description 71
- 239000000203 mixture Substances 0.000 claims description 78
- 239000002253 acid Substances 0.000 claims description 68
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- 229920001187 thermosetting polymer Polymers 0.000 claims description 26
- 229910045601 alloy Inorganic materials 0.000 claims description 18
- 239000000956 alloy Substances 0.000 claims description 18
- XWVFEDFALKHCLK-UHFFFAOYSA-N 2-methylnonanedioic acid Chemical compound OC(=O)C(C)CCCCCCC(O)=O XWVFEDFALKHCLK-UHFFFAOYSA-N 0.000 claims description 11
- FCEUHAMMXRPAQH-UHFFFAOYSA-N 4,6-bis(methoxycarbonyl)-2,4,6-trimethyltridecanedioic acid Chemical compound OC(=O)C(C)CC(C)(C(=O)OC)CC(C)(C(=O)OC)CCCCCCC(O)=O FCEUHAMMXRPAQH-UHFFFAOYSA-N 0.000 claims description 11
- WWFMNQCTFZQFCL-UHFFFAOYSA-N 4-methoxycarbonyl-2,4-dimethylundecanedioic acid Chemical compound OC(=O)C(C)CC(C)(C(=O)OC)CCCCCCC(O)=O WWFMNQCTFZQFCL-UHFFFAOYSA-N 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 11
- IAZDYDFYNOVSRO-UHFFFAOYSA-N 8,9-bis(methoxycarbonyl)-8,9-dimethylhexadecanedioic acid Chemical compound OC(=O)CCCCCCC(C)(C(=O)OC)C(C)(CCCCCCC(O)=O)C(=O)OC IAZDYDFYNOVSRO-UHFFFAOYSA-N 0.000 claims description 6
- 150000007513 acids Chemical class 0.000 claims description 5
- 239000012190 activator Substances 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 description 25
- 229920000647 polyepoxide Polymers 0.000 description 25
- 230000000052 comparative effect Effects 0.000 description 15
- 238000005476 soldering Methods 0.000 description 13
- 230000003014 reinforcing effect Effects 0.000 description 12
- 239000000758 substrate Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 10
- 238000005304 joining Methods 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 229910044991 metal oxide Inorganic materials 0.000 description 6
- 150000004706 metal oxides Chemical class 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 150000007524 organic acids Chemical group 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 238000012795 verification Methods 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000004359 castor oil Substances 0.000 description 2
- 235000019438 castor oil Nutrition 0.000 description 2
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- OWEYKIWAZBBXJK-UHFFFAOYSA-N 1,1-Dichloro-2,2-bis(4-hydroxyphenyl)ethylene Chemical compound C1=CC(O)=CC=C1C(=C(Cl)Cl)C1=CC=C(O)C=C1 OWEYKIWAZBBXJK-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- BATCUENAARTUKW-UHFFFAOYSA-N 4-[(4-hydroxyphenyl)-diphenylmethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 BATCUENAARTUKW-UHFFFAOYSA-N 0.000 description 1
- UMPGNGRIGSEMTC-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)-3,3,5-trimethylcyclohexyl]phenol Chemical compound C1C(C)CC(C)(C)CC1(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 UMPGNGRIGSEMTC-UHFFFAOYSA-N 0.000 description 1
- IJWIRZQYWANBMP-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-propan-2-ylphenyl)propan-2-yl]-2-propan-2-ylphenol Chemical compound C1=C(O)C(C(C)C)=CC(C(C)(C)C=2C=C(C(O)=CC=2)C(C)C)=C1 IJWIRZQYWANBMP-UHFFFAOYSA-N 0.000 description 1
- PVFQHGDIOXNKIC-UHFFFAOYSA-N 4-[2-[3-[2-(4-hydroxyphenyl)propan-2-yl]phenyl]propan-2-yl]phenol Chemical compound C=1C=CC(C(C)(C)C=2C=CC(O)=CC=2)=CC=1C(C)(C)C1=CC=C(O)C=C1 PVFQHGDIOXNKIC-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 241000132023 Bellis perennis Species 0.000 description 1
- -1 Bi Ni Inorganic materials 0.000 description 1
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 1
- HTVITOHKHWFJKO-UHFFFAOYSA-N Bisphenol B Chemical compound C=1C=C(O)C=CC=1C(C)(CC)C1=CC=C(O)C=C1 HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 1
- GIXXQTYGFOHYPT-UHFFFAOYSA-N Bisphenol P Chemical compound C=1C=C(C(C)(C)C=2C=CC(O)=CC=2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 GIXXQTYGFOHYPT-UHFFFAOYSA-N 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
- 235000005633 Chrysanthemum balsamita Nutrition 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- ZFVMWEVVKGLCIJ-UHFFFAOYSA-N bisphenol AF Chemical compound C1=CC(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C=C1 ZFVMWEVVKGLCIJ-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 150000002460 imidazoles Chemical group 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 150000004714 phosphonium salts Chemical group 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
(1)2−メチルノナン二酸を30〜60質量%
(2)4−(メトキシカルボニル)−2,4−ジメチルウンデカン二酸を8〜20質量%
(3)4,6−ビス(メトキシカルボニル)−2,4,6−トリメチルトリデカン二酸を8〜20質量%
(4)8,9−ビス(メトキシカルボニル)−8,9−ジメチルヘキサデカン二酸を15〜30質量%
(1)2−メチルノナン二酸を30〜60質量%
(2)4−(メトキシカルボニル)−2,4−ジメチルウンデカン二酸を8〜20質量%
(3)4,6−ビス(メトキシカルボニル)−2,4,6−トリメチルトリデカン二酸を8〜20質量%
(4)8,9−ビス(メトキシカルボニル)−8,9−ジメチルヘキサデカン二酸を15〜30質量%
(2)4−(メトキシカルボニル)−2,4−ジメチルウンデカン二酸
(3)4,6−ビス(メトキシカルボニル)−2,4,6−トリメチルトリデカン二酸
(4)8,9−ビス(メトキシカルボニル) −8,9−ジメチルヘキサデカン二酸
(2)8〜20%
(3)8〜20%
(4)15〜30%
(a)評価方法
Cu板上にフラックスを塗布し、Cu板上に塗布したフラックス上にはんだボールを搭載し、リフローを行った後、はんだ濡れ広がり径を測定した。リフロー工程は、ピーク温度を250℃に設定したリフロー装置を用いて、40℃から1秒毎に3.5℃ずつ220℃まで温度を上昇させていき、220℃に達した後、220℃以上の温度で55秒間加熱処理を行った。はんだボールの組成は96.5Sn-3.0Ag-0.5Cu、直径は0.3mmである。
(b)判定基準
○:はんだの広がり径が0.45mm以上
×:はんだの広がり径が0.45mm未満
(2)補強効果の検証について
(a)評価方法
基板にフラックスを供給し、基板に供給したフラックス上にはんだボールを搭載し、リフローを行った後、測定用工具を使用してはんだボール及びフラックス残渣を基板からせん断するシェア試験と称される試験を行い、せん断に必要な力を測定した。試験機には、デイジ・ジャパン株式会社製のシリーズ4000を使用した。シェア試験において測定されるせん断に必要な力をシェア強度と称する。はんだボールの組成は96.5Sn-3.0Ag-0.5Cu、直径は0.3mmである。
(b)判定基準
○:シェア強度4N以上
×:シェア強度4N未満
Claims (5)
- 熱硬化性の樹脂と、
前記熱硬化性の樹脂を硬化させる硬化剤及び活性剤として添加される長鎖二塩基酸混合物とを含み、
前記長鎖二塩基酸混合物は、以下の(1)、(2)、(3)及び(4)に示す組成の長鎖二塩基酸を混合した混合物であり、
(1)、(2)、(3)及び(4)に示す前記長鎖二塩基酸の比率は、前記長鎖二塩基酸混合物全体の比率を100質量%とした場合、以下の通りである
ことを特徴とするフラックス。
(1)2−メチルノナン二酸を30〜60質量%
(2)4−(メトキシカルボニル)−2,4−ジメチルウンデカン二酸を8〜20質量%
(3)4,6−ビス(メトキシカルボニル)−2,4,6−トリメチルトリデカン二酸を8〜20質量%
(4)8,9−ビス(メトキシカルボニル)−8,9−ジメチルヘキサデカン二酸を15〜30質量% - 前記フラックス中の熱硬化性の前記樹脂の含有量を30〜40質量%、前記フラックス中の前記長鎖二塩基酸混合物の含有量を20〜60質量%とした
ことを特徴とする請求項1に記載のフラックス。 - 前記フラックス中に0.1〜40質量%の溶剤を添加した
ことを特徴とする請求項1又は2に記載のフラックス。 - 熱硬化性の樹脂と、熱硬化性の前記樹脂を硬化させる硬化剤及び活性剤として添加される長鎖二塩基酸混合物とを含み、
前記長鎖二塩基酸混合物が以下の(1)、(2)、(3)及び(4)に示す組成の長鎖二塩基酸を混合した混合物であり、(1)、(2)、(3)及び(4)に示す前記長鎖二塩基酸の比率が、前記長鎖二塩基酸混合物全体の比率を100質量%とした場合、以下の通りであるフラックスと、
はんだ合金粉末が混合された
ことを特徴とするソルダペースト。
(1)2−メチルノナン二酸を30〜60質量%
(2)4−(メトキシカルボニル)−2,4−ジメチルウンデカン二酸を8〜20質量%
(3)4,6−ビス(メトキシカルボニル)−2,4,6−トリメチルトリデカン二酸を8〜20質量%
(4)8,9−ビス(メトキシカルボニル)−8,9−ジメチルヘキサデカン二酸を15〜30質量% - 前記フラックス中の熱硬化性の前記樹脂の含有量を30〜40質量%、前記フラックス中の前記長鎖二塩基酸混合物の含有量を20〜60質量%とした
ことを特徴とする請求項4に記載のソルダペースト。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014062417A JP5952849B2 (ja) | 2014-03-25 | 2014-03-25 | フラックス及びソルダペースト |
US15/128,231 US9902022B2 (en) | 2014-03-25 | 2015-02-27 | Flux and solder paste |
CN201580016031.9A CN106132629B (zh) | 2014-03-25 | 2015-02-27 | 助焊剂及焊膏 |
PCT/JP2015/055781 WO2015146473A1 (ja) | 2014-03-25 | 2015-02-27 | フラックス及びソルダペースト |
KR1020167029054A KR101712787B1 (ko) | 2014-03-25 | 2015-02-27 | 플럭스 및 솔더 페이스트 |
EP15770209.3A EP3124167B1 (en) | 2014-03-25 | 2015-02-27 | Flux and solder paste |
TW104106780A TWI596154B (zh) | 2014-03-25 | 2015-03-04 | Flux and solder paste |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014062417A JP5952849B2 (ja) | 2014-03-25 | 2014-03-25 | フラックス及びソルダペースト |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015182125A JP2015182125A (ja) | 2015-10-22 |
JP2015182125A5 JP2015182125A5 (ja) | 2016-03-31 |
JP5952849B2 true JP5952849B2 (ja) | 2016-07-13 |
Family
ID=54195004
Family Applications (1)
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JP (1) | JP5952849B2 (ja) |
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JP5962832B1 (ja) * | 2015-09-18 | 2016-08-03 | 千住金属工業株式会社 | フラックス |
JP2017130623A (ja) * | 2016-01-22 | 2017-07-27 | 株式会社村田製作所 | 充填用ペースト材料、それを用いたビアホール導体の製造方法および多層基板の製造方法 |
JP2017183571A (ja) * | 2016-03-31 | 2017-10-05 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP6536503B2 (ja) * | 2016-07-12 | 2019-07-03 | 千住金属工業株式会社 | フラックス |
JP6399242B1 (ja) | 2018-01-17 | 2018-10-03 | 千住金属工業株式会社 | フラックス及びソルダペースト |
EP3834982A4 (en) * | 2018-08-10 | 2021-12-22 | Koki Company Limited | FLUX AND SOLDER PASTE |
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US6971163B1 (en) | 1998-04-22 | 2005-12-06 | Dow Corning Corporation | Adhesive and encapsulating material with fluxing properties |
GB9808587D0 (en) * | 1998-04-22 | 1998-06-24 | Craig Hugh P | Adhesive and encapsulating material with fluxing properties |
JP4504481B2 (ja) * | 1998-11-26 | 2010-07-14 | 岡村製油株式会社 | 長鎖二塩基酸組成物及びこれを用いる電解液 |
JP3849842B2 (ja) * | 1999-10-05 | 2006-11-22 | Tdk株式会社 | はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール、電子回路装置、及び、はんだ付け方法 |
TW527253B (en) | 1999-10-05 | 2003-04-11 | Tdk Corp | Soldering flux, soldering paste and soldering process |
JP2001219294A (ja) * | 1999-12-03 | 2001-08-14 | Tdk Corp | 熱硬化性はんだ付け用フラックスおよびはんだ付け方法 |
AU2403601A (en) | 1999-12-27 | 2001-07-09 | Sumitomo Bakelite Company Limited | Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device |
JP3791403B2 (ja) * | 2000-12-04 | 2006-06-28 | 富士電機ホールディングス株式会社 | 鉛フリーハンダ対応無洗浄用フラックスおよびこれを含有するハンダ組成物 |
JP3888573B2 (ja) * | 2001-06-29 | 2007-03-07 | 富士電機ホールディングス株式会社 | ハンダ組成物 |
JP3702418B2 (ja) | 2002-03-07 | 2005-10-05 | 株式会社 東京第一商興 | ソルダペースト用フラックス及びソルダペースト |
WO2006064849A1 (ja) | 2004-12-15 | 2006-06-22 | Tamurakaken Corporation | 導電性接着剤、これを用いた導電部及び電子部品モジュール |
WO2007018288A1 (ja) * | 2005-08-11 | 2007-02-15 | Senju Metal Industry Co., Ltd. | 鉛フリーソルダペーストとその応用 |
JP5760170B2 (ja) * | 2010-11-30 | 2015-08-05 | パナソニックIpマネジメント株式会社 | はんだペースト |
US8070043B1 (en) | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Curable flux composition and method of soldering |
US8430295B2 (en) | 2011-09-30 | 2013-04-30 | Rohm And Haas Electronic Materials Llc | Curable flux composition and method of soldering |
US20150035175A1 (en) | 2012-02-24 | 2015-02-05 | Hitachi Chemical Company, Ltd. | Adhesive for semiconductor, fluxing agent, manufacturing method for semiconductor device, and semiconductor device |
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EP3124167B1 (en) | 2019-05-08 |
JP2015182125A (ja) | 2015-10-22 |
EP3124167A1 (en) | 2017-02-01 |
CN106132629A (zh) | 2016-11-16 |
KR101712787B1 (ko) | 2017-03-06 |
TWI596154B (zh) | 2017-08-21 |
EP3124167A4 (en) | 2017-09-20 |
CN106132629B (zh) | 2017-10-13 |
TW201602219A (zh) | 2016-01-16 |
KR20160133558A (ko) | 2016-11-22 |
US20170190005A1 (en) | 2017-07-06 |
US9902022B2 (en) | 2018-02-27 |
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