WO2015122471A1 - 検査ユニット - Google Patents
検査ユニット Download PDFInfo
- Publication number
- WO2015122471A1 WO2015122471A1 PCT/JP2015/053866 JP2015053866W WO2015122471A1 WO 2015122471 A1 WO2015122471 A1 WO 2015122471A1 JP 2015053866 W JP2015053866 W JP 2015053866W WO 2015122471 A1 WO2015122471 A1 WO 2015122471A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- contact
- probe
- probe holder
- holding
- electrode
- Prior art date
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/54—Testing for continuity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
Definitions
- an electrical connection between the inspection target and a signal processing device that outputs an inspection signal is used.
- a probe unit that accommodates a plurality of contact probes is used.
- the probe unit can be applied to highly integrated and miniaturized inspection objects by narrowing the pitch between contact probes with the progress of high integration and miniaturization of semiconductor integrated circuits and liquid crystal panels in recent years. Possible technologies are progressing.
- packages in which electrodes are disposed on both sides have been used.
- Patent Document 1 when the technique of Patent Document 1 is applied to PoP and a conduction state inspection between two stacked semiconductor packages is performed, a suction block is provided between the two semiconductor packages, and a suction hole of the suction block is secured. Therefore, the inspection cannot be performed with two semiconductor packages arranged in the stacking direction. For this reason, the inspection must be performed in a state where the two semiconductor packages are shifted from the stacking direction, the signal conduction path between the electrodes becomes longer, the inspection tact time becomes longer, and the signal path length There is a problem that the inspection accuracy is lowered due to variations.
- an inspection unit includes two substantially plate-like contact objects, at least one of which has electrodes on both sides, arranged in the stacking direction.
- An inspection unit for inspecting one contact object which is in contact with an electrode provided on the surface of one contact object on one end side in the longitudinal direction and the other contact on the other end side.
- the first contact probe that contacts the electrode of the object and the electrode provided on the back surface of the one contact object on one end side in the longitudinal direction and for inspection on the other end side A second contact probe that comes into contact with the electrode of the substrate that outputs the signal, and a suction holding portion that sucks and holds the one contact object, and a plurality of the first contact probes in a predetermined pattern did A first probe holder for receiving and holding the plurality of second contact probes, a second probe holder for receiving and holding the plurality of second contact probes according to a predetermined pattern, and the first probe holder. And a base portion that holds the other contact object
- FIG. 2 is a partial cross-sectional view showing the configuration of the main part of the inspection unit 1 according to the present embodiment, and is a diagram showing the detailed configuration of the probe 2 accommodated in the probe holder 4.
- the probe 2 (first contact probe) shown in FIG. 2 is for connecting the semiconductor package 100 with the first plunger 21 that contacts the connection electrode 201 of the semiconductor package 200 when the semiconductor packages 100 and 200 are inspected.
- a second plunger 22 that comes into contact with the electrode 101 and a coil spring 23 that is provided between the first plunger 21 and the second plunger 22 and that connects the two first plungers 21 and the second plunger 22 in a telescopic manner. .
- the first plunger 21 and the second plunger 22 and the coil spring 23 constituting the probe 2 have the same axis.
- the coil spring 23 expands and contracts in the axial direction, so that the impact on the connection electrodes of the semiconductor packages 100 and 200 is reduced and the load on the semiconductor packages 100 and 200 is reduced.
- the probe 3 reaches the connection electrode 102 of the semiconductor package 100 via the second plunger 32, the tightly wound portion 33 a, and the first plunger 31.
- the first plunger 31 and the second plunger 32 are conducted through the tightly wound portion of the coil spring 33, so that the electrical signal conduction path can be minimized. Therefore, it is possible to prevent a signal from flowing through the coarsely wound portion of the coil spring 33 during inspection, and to reduce and stabilize the inductance.
- the probe 2 has a similar conduction path.
- the second member 6b is provided on the main surface on the side different from the lamination side of the first member 6a and the hole portion 66, which is a substantially cylindrical hole penetrating in the plate thickness direction, and 2nd groove part 67 which is an annular
- the second groove 67 is provided with an O-ring 400 that ensures hermeticity when connected to an intake pump (not shown).
- the holder hole 46 includes a small diameter portion 46a having an opening at the lower end surface of the probe holder 4 and a large diameter portion 46b having a diameter larger than the small diameter portion 46a.
- the small diameter portion 46a has a slightly larger diameter than the diameter of the outer periphery of the holding portion 71 excluding the protruding portion 711.
- the large diameter portion 46 b is slightly larger than the diameter of the outer periphery of the coil spring 72 or the diameter formed by the edge of the protruding portion 711.
- each flange portion on the tip end side and the boundary wall surface between the large diameter portion and the small diameter portion of the holder hole may be tapered. Thereby, positioning in the direction perpendicular to the axial direction of the probe when the probe is attached to the holder can be performed more reliably.
- the probes 2 and 3 are not limited to those composed of plungers and coil springs, but may be pogo pins or wire probes that obtain a load by bending a wire into a bow shape. Further, the tightly wound portion and the coarsely wound portion of the coil spring may be reversed. In this case, the lengths of the base end portions of the first and second plungers are preferably opposite. Further, the probe holder can be appropriately changed in accordance with the above-described probe.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
2,3 コンタクトプローブ(プローブ)
4,5 プローブホルダ
6 ベース部
7 吸着保持部
21,31 第1プランジャ
22,32 第2プランジャ
23,33 コイルばね
41,6a 第1部材
42,6b 第2部材
43,44,45,46 ホルダ孔
100,200 半導体パッケージ
101,102,201 接続用電極
300 回路基板
301 電極
Claims (4)
- 少なくとも一方が両面に電極を有する略板状の二つの接触対象物であって、積層方向に並べた前記二つの接触対象物の検査を行う検査ユニットであって、
長手方向の一方の端部側で、一方の接触対象物の表面に設けられた電極と接触するとともに、他方の端部側で他方の接触対象物の電極と接触する第1のコンタクトプローブと、
長手方向の一方の端部側で、前記一方の接触対象物の裏面に設けられた電極と接触するとともに、他方の端部側で検査用の信号を出力する基板の電極と接触する第2のコンタクトプローブと、
前記一方の接触対象物を吸着して保持する吸着保持部を有するとともに、複数の前記第1のコンタクトプローブを所定のパターンにしたがって収容して保持する第1のプローブホルダと、
複数の前記第2のコンタクトプローブを所定のパターンにしたがって収容して保持する第2のプローブホルダと、
前記第1のプローブホルダに積層されるとともに、前記第1のプローブホルダとの積層側で前記他方の接触対象物を保持するベース部と、
を備え、
前記他方の接触対象物と前記第1のプローブホルダとの間には、隙間が形成されていることを特徴とする検査ユニット。 - 前記ベース部には、前記隙間と外部とを連通する流路が形成されていることを特徴とする請求項1に記載の検査ユニット。
- 前記吸着保持部は、
弾性材料を用いて形成され、前記一方の接触対象物を吸引して保持する略筒状をなし、前記隙間に連通する貫通孔が形成された吸着パッドと、
前記吸着パッドの外周を保持するとともに、前記第1のプローブホルダに対して接離自在に取り付けられる保持部と、
前記保持部が前記第1のプローブホルダから離れる方向に付勢するコイルばねと、
を有することを特徴とする請求項1または2に記載の検査ユニット。 - 前記第1のコンタクトプローブは、
前記長手方向の一方の端部側に設けられ、先細な先端形状をなす複数の爪部を有し、前記接触対象物の電極と接触する第1接触部材と、
前記長手方向の他方の端部側に設けられ、先細な先端形状をなす複数の爪部を有し、前記基板の電極と接触する第2接触部材と、
前記第1接触部材と前記第2接触部材との間に設けられ、前記第1および第2接触部材を伸縮自在に連結するコイルばねと、
を有することを特徴とする請求項1~3のいずれか一つに記載の検査ユニット。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015562862A JP6490600B2 (ja) | 2014-02-13 | 2015-02-12 | 検査ユニット |
US15/117,884 US10120011B2 (en) | 2014-02-13 | 2015-02-12 | Test unit |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-025958 | 2014-02-13 | ||
JP2014025958 | 2014-02-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2015122471A1 true WO2015122471A1 (ja) | 2015-08-20 |
Family
ID=53800211
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2015/053866 WO2015122471A1 (ja) | 2014-02-13 | 2015-02-12 | 検査ユニット |
Country Status (4)
Country | Link |
---|---|
US (1) | US10120011B2 (ja) |
JP (1) | JP6490600B2 (ja) |
TW (1) | TWI563259B (ja) |
WO (1) | WO2015122471A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107861013A (zh) * | 2017-10-23 | 2018-03-30 | 上海斐讯数据通信技术有限公司 | 一种制备手电极的治具及方法 |
TWI633315B (zh) * | 2018-03-09 | 2018-08-21 | 宇瞻科技股份有限公司 | 自動化測試裝置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109219753A (zh) * | 2016-05-31 | 2019-01-15 | 日本电产理德股份有限公司 | 接触导电辅助具及检查装置 |
CN114270201B (zh) * | 2019-08-29 | 2024-05-14 | Hrl实验室有限责任公司 | 小间距集成刀刃临时结合微结构 |
CN113053774A (zh) * | 2019-12-27 | 2021-06-29 | 迪科特测试科技(苏州)有限公司 | 探测装置 |
US11562984B1 (en) | 2020-10-14 | 2023-01-24 | Hrl Laboratories, Llc | Integrated mechanical aids for high accuracy alignable-electrical contacts |
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JP2007163463A (ja) * | 2005-11-16 | 2007-06-28 | Matsushita Electric Ind Co Ltd | 検査装置および検査方法 |
JP2011242149A (ja) * | 2010-05-14 | 2011-12-01 | Seiko Epson Corp | 電子部品検査装置及び電子部品搬送方法 |
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JP3741927B2 (ja) | 2000-03-31 | 2006-02-01 | 日本電気株式会社 | 半導体チップ又はパッケージ検査装置及びその検査方法 |
JP3714344B2 (ja) | 2003-10-14 | 2005-11-09 | Jsr株式会社 | 回路基板検査装置 |
TWM361020U (en) | 2009-02-10 | 2009-07-11 | Chipsip Technology Co Ltd | Test tool |
JP2011089891A (ja) * | 2009-10-22 | 2011-05-06 | Micronics Japan Co Ltd | 電気的接続装置及びこれを用いる試験装置 |
SG11201401212TA (en) * | 2011-10-07 | 2014-09-26 | Nhk Spring Co Ltd | Probe unit |
TWI447414B (zh) | 2012-06-07 | 2014-08-01 | 矽品精密工業股份有限公司 | 測試裝置及測試方法 |
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2015
- 2015-02-12 US US15/117,884 patent/US10120011B2/en active Active
- 2015-02-12 JP JP2015562862A patent/JP6490600B2/ja active Active
- 2015-02-12 WO PCT/JP2015/053866 patent/WO2015122471A1/ja active Application Filing
- 2015-02-13 TW TW104104993A patent/TWI563259B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2007163463A (ja) * | 2005-11-16 | 2007-06-28 | Matsushita Electric Ind Co Ltd | 検査装置および検査方法 |
JP2011242149A (ja) * | 2010-05-14 | 2011-12-01 | Seiko Epson Corp | 電子部品検査装置及び電子部品搬送方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107861013A (zh) * | 2017-10-23 | 2018-03-30 | 上海斐讯数据通信技术有限公司 | 一种制备手电极的治具及方法 |
CN107861013B (zh) * | 2017-10-23 | 2020-12-22 | 金华市智甄通信设备有限公司 | 一种制备手电极的治具及方法 |
TWI633315B (zh) * | 2018-03-09 | 2018-08-21 | 宇瞻科技股份有限公司 | 自動化測試裝置 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2015122471A1 (ja) | 2017-03-30 |
TW201534930A (zh) | 2015-09-16 |
JP6490600B2 (ja) | 2019-03-27 |
US20170010315A1 (en) | 2017-01-12 |
US10120011B2 (en) | 2018-11-06 |
TWI563259B (en) | 2016-12-21 |
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