JP6490600B2 - 検査ユニット - Google Patents
検査ユニット Download PDFInfo
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- JP6490600B2 JP6490600B2 JP2015562862A JP2015562862A JP6490600B2 JP 6490600 B2 JP6490600 B2 JP 6490600B2 JP 2015562862 A JP2015562862 A JP 2015562862A JP 2015562862 A JP2015562862 A JP 2015562862A JP 6490600 B2 JP6490600 B2 JP 6490600B2
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- contact
- probe
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- holding
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- Prior art date
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- 238000007689 inspection Methods 0.000 title claims description 80
- 239000000523 sample Substances 0.000 claims description 102
- 210000000078 claw Anatomy 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 5
- 239000013013 elastic material Substances 0.000 claims description 3
- 238000001179 sorption measurement Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 description 62
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000011796 hollow space material Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
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- 230000002250 progressing effect Effects 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/54—Testing for continuity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
2,3 コンタクトプローブ(プローブ)
4,5 プローブホルダ
6 ベース部
7 吸着保持部
21,31 第1プランジャ
22,32 第2プランジャ
23,33 コイルばね
41,6a 第1部材
42,6b 第2部材
43,44,45,46 ホルダ孔
100,200 半導体パッケージ
101,102,201 接続用電極
300 回路基板
301 電極
Claims (4)
- 少なくとも一方が両面に電極を有する略板状の二つの接触対象物であって、積層方向に並べた前記二つの接触対象物の検査を行う検査ユニットであって、
長手方向の一方の端部側で、一方の接触対象物の表面に設けられた電極と接触するとともに、他方の端部側で他方の接触対象物の電極と接触する第1のコンタクトプローブと、
長手方向の一方の端部側で、前記一方の接触対象物の裏面に設けられた電極と接触するとともに、他方の端部側で検査用の信号を出力する基板の電極と接触する第2のコンタクトプローブと、
前記一方の接触対象物を吸着して保持する吸着保持部を有するとともに、複数の前記第1のコンタクトプローブを所定のパターンにしたがって収容して保持する第1のプローブホルダと、
複数の前記第2のコンタクトプローブを所定のパターンにしたがって収容して保持する第2のプローブホルダと、
前記第1のプローブホルダに積層されるとともに、前記第1のプローブホルダとの積層側で前記他方の接触対象物を保持するベース部と、
を備え、
前記他方の接触対象物と前記第1のプローブホルダとの間には、隙間が形成されていることを特徴とする検査ユニット。 - 前記ベース部には、前記隙間と外部とを連通する流路が形成されていることを特徴とする請求項1に記載の検査ユニット。
- 前記吸着保持部は、
弾性材料を用いて形成され、前記一方の接触対象物を吸引して保持する略筒状をなし、前記隙間に連通する貫通孔が形成された吸着パッドと、
前記吸着パッドの外周を保持するとともに、前記第1のプローブホルダに対して接離自在に取り付けられる保持部と、
前記保持部が前記第1のプローブホルダから離れる方向に付勢するコイルばねと、
を有することを特徴とする請求項1または2に記載の検査ユニット。 - 前記第1のコンタクトプローブは、
前記長手方向の一方の端部側に設けられ、先細な先端形状をなす複数の爪部を有し、前記一方の接触対象物の電極と接触する第1接触部材と、
前記長手方向の他方の端部側に設けられ、先細な先端形状をなす複数の爪部を有し、前記他方の接触対象物の電極と接触する第2接触部材と、
前記第1接触部材と前記第2接触部材との間に設けられ、前記第1および第2接触部材を伸縮自在に連結するコイルばねと、
を有することを特徴とする請求項1〜3のいずれか一つに記載の検査ユニット。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014025958 | 2014-02-13 | ||
JP2014025958 | 2014-02-13 | ||
PCT/JP2015/053866 WO2015122471A1 (ja) | 2014-02-13 | 2015-02-12 | 検査ユニット |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2015122471A1 JPWO2015122471A1 (ja) | 2017-03-30 |
JP6490600B2 true JP6490600B2 (ja) | 2019-03-27 |
Family
ID=53800211
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015562862A Active JP6490600B2 (ja) | 2014-02-13 | 2015-02-12 | 検査ユニット |
Country Status (4)
Country | Link |
---|---|
US (1) | US10120011B2 (ja) |
JP (1) | JP6490600B2 (ja) |
TW (1) | TWI563259B (ja) |
WO (1) | WO2015122471A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109219753A (zh) * | 2016-05-31 | 2019-01-15 | 日本电产理德股份有限公司 | 接触导电辅助具及检查装置 |
CN107861013B (zh) * | 2017-10-23 | 2020-12-22 | 金华市智甄通信设备有限公司 | 一种制备手电极的治具及方法 |
TWI633315B (zh) * | 2018-03-09 | 2018-08-21 | 宇瞻科技股份有限公司 | 自動化測試裝置 |
CN114270201B (zh) * | 2019-08-29 | 2024-05-14 | Hrl实验室有限责任公司 | 小间距集成刀刃临时结合微结构 |
CN113053774A (zh) * | 2019-12-27 | 2021-06-29 | 迪科特测试科技(苏州)有限公司 | 探测装置 |
US11562984B1 (en) | 2020-10-14 | 2023-01-24 | Hrl Laboratories, Llc | Integrated mechanical aids for high accuracy alignable-electrical contacts |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3741927B2 (ja) | 2000-03-31 | 2006-02-01 | 日本電気株式会社 | 半導体チップ又はパッケージ検査装置及びその検査方法 |
JP3714344B2 (ja) | 2003-10-14 | 2005-11-09 | Jsr株式会社 | 回路基板検査装置 |
JP4767147B2 (ja) * | 2005-11-16 | 2011-09-07 | パナソニック株式会社 | 検査装置および検査方法 |
TWM361020U (en) | 2009-02-10 | 2009-07-11 | Chipsip Technology Co Ltd | Test tool |
JP2011089891A (ja) * | 2009-10-22 | 2011-05-06 | Micronics Japan Co Ltd | 電気的接続装置及びこれを用いる試験装置 |
JP5621313B2 (ja) | 2010-05-14 | 2014-11-12 | セイコーエプソン株式会社 | 電子部品検査装置及び電子部品搬送方法 |
SG11201401212TA (en) * | 2011-10-07 | 2014-09-26 | Nhk Spring Co Ltd | Probe unit |
TWI447414B (zh) | 2012-06-07 | 2014-08-01 | 矽品精密工業股份有限公司 | 測試裝置及測試方法 |
-
2015
- 2015-02-12 US US15/117,884 patent/US10120011B2/en active Active
- 2015-02-12 JP JP2015562862A patent/JP6490600B2/ja active Active
- 2015-02-12 WO PCT/JP2015/053866 patent/WO2015122471A1/ja active Application Filing
- 2015-02-13 TW TW104104993A patent/TWI563259B/zh active
Also Published As
Publication number | Publication date |
---|---|
JPWO2015122471A1 (ja) | 2017-03-30 |
WO2015122471A1 (ja) | 2015-08-20 |
TW201534930A (zh) | 2015-09-16 |
US20170010315A1 (en) | 2017-01-12 |
US10120011B2 (en) | 2018-11-06 |
TWI563259B (en) | 2016-12-21 |
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