WO2015098356A1 - 電子部品の製造方法、電子部品 - Google Patents
電子部品の製造方法、電子部品 Download PDFInfo
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- WO2015098356A1 WO2015098356A1 PCT/JP2014/080399 JP2014080399W WO2015098356A1 WO 2015098356 A1 WO2015098356 A1 WO 2015098356A1 JP 2014080399 W JP2014080399 W JP 2014080399W WO 2015098356 A1 WO2015098356 A1 WO 2015098356A1
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- electronic component
- coil
- magnetic material
- composite magnetic
- plate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/255—Magnetic cores made from particles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2847—Sheets; Strips
- H01F27/2852—Construction of conductive connections, of leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/327—Encapsulating or impregnating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F37/00—Fixed inductances not covered by group H01F17/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
- H01F41/0246—Manufacturing of magnetic circuits by moulding or by pressing powder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/06—Coil winding
- H01F41/061—Winding flat conductive wires or sheets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
- H01F41/127—Encapsulating or impregnating
Definitions
- the present invention relates to a method for manufacturing an electronic component used for a power inductor or the like of a power supply circuit, and an electronic component.
- Power inductors used in power circuits are required to be small, low loss, and capable of handling large currents.
- an inductor has been developed that uses a composite magnetic material such as metal magnetic powder having a high saturation magnetic flux density as the magnetic material (for example, Japanese Patent No. 4714797).
- An inductor using a composite magnetic material has an advantage of a large direct current superposition allowable current.
- it is necessary to thin the portion formed of the composite magnetic material.
- the composite magnetic material is peeled off particularly in the portion where the thickness of the composite magnetic material on the side surface of the element is thin, and the yield
- the yield there was a problem that it was difficult to reduce the size.
- the conventional winding structure has a problem that the winding shape is deformed during high pressure molding.
- One or more embodiments of the present invention are to provide an electronic component manufacturing method and an electronic component that have a large self-inductance L and a large allowable current, a high yield, and an easy size reduction.
- Embodiment 1 One or more embodiments of the present invention include a coil forming step of forming a coil with a linear conductor, and a coil fixing step of forming a coil fixing body for fixing the coil with an insulating resin.
- a magnetic body part attaching step for forming a magnetic body portion so as to cover the entire coil fixing body with a composite magnetic material in which magnetic particles and a resin are mixed, and a pressurizing step for pressurizing and molding the whole, And a curing step for curing the magnetic body portion.
- Embodiment 2 One or more embodiments of the present invention are the above-described composite magnetic material formed in a plate shape in the method of manufacturing an electronic component according to Embodiment 1 in which the magnetic body portion attaching step is performed.
- a cover step of further covering with a magnetic material are the above-described composite magnetic material formed in a plate shape in the method of manufacturing an electronic component according to Embodiment 1 in which the magnetic body portion attaching step is performed.
- Embodiment 3 in the method of manufacturing an electronic component of Embodiment 2, at least the steps after the press-fitting step can arrange a plurality of coil fixed bodies side by side.
- Embodiment 4 One or more embodiments of the present invention are characterized in that, in the electronic component manufacturing method of Embodiment 1, the pressurizing step and the curing step are performed simultaneously. It is a manufacturing method of components.
- Embodiment 5 In one or more embodiments of the present invention, a coil fixing body in which a coil formed of a linear conductor is fixed with an insulating resin, and the coil fixing body is covered except for a terminal portion.
- an electronic component comprising a magnetic body portion formed of a composite magnetic material in which magnetic particles and a resin are mixed and cured.
- Embodiment 6 In one or more embodiments of the present invention, in the electronic component of Embodiment 5, the magnetic body portion is a plate-shaped composite material that is the composite magnetic material formed in a plate shape.
- the electronic component is characterized by being formed by curing the plate-like composite magnetic material after the coil fixing body is embedded in the plate-like composite magnetic material in a softened state.
- Embodiment 7 One or more embodiments of the present invention may be any one of Embodiments 1 to 4 in the electronic component of Embodiment 5 or Embodiment 6.
- the electronic component is manufactured by an electronic component manufacturing method.
- One or more embodiments of the present invention include a coil forming step for forming a coil with a linear conductor, a coil fixing step for forming a coil fixing body for fixing the coil with an insulating resin, and a magnetic body.
- Magnetic body part attaching process for forming the magnetic body part so as to cover the entire coil fixed body with a composite magnetic material in which particles and resin are mixed, a pressurizing process for pressurizing the whole body, and curing the magnetic body part Curing step. Therefore, according to one or more embodiments of the present invention, the shape of the coil fixing body can be maintained, so that the magnetic body portion can be firmly solidified by the pressing process and the curing process. Therefore, according to one or more embodiments of the present invention, it is possible to manufacture an electronic component that can be downsized and has a high yield without sacrificing the self-inductance L and the allowable current as compared with the conventional method.
- the coil fixed body is plate-shaped in a state where the plate-shaped composite magnetic material, which is a composite magnetic material formed in a plate shape, is softened.
- a plate-shaped composite magnetic material is used, it is possible to simultaneously manufacture a plurality of electronic components.
- At least the steps after the press-fitting step are performed by fixing a plurality of coils using a plate-shaped composite magnetic material having a size capable of arranging a plurality of coil fixing bodies side by side. Done simultaneously on the body.
- electronic components can be efficiently manufactured.
- the pressing step and the curing step are performed simultaneously. Therefore, according to one or more embodiments of the present invention, an electronic component can be efficiently manufactured and a magnetic body portion can be more firmly formed.
- a coil fixed body in which a coil formed of a linear conductor is fixed with an insulating resin and the coil fixed body are covered except for a terminal portion.
- a magnetic body portion formed of a composite magnetic material obtained by mixing and curing magnetic particles and a resin.
- the coil-fixed body is made into a plate-like composite magnetic material in a state where the plate-like composite magnetic material which is a plate-like composite magnetic material is softened After embedding in the material, the plate-like composite magnetic material is cured. Therefore, in one or more embodiments of the present invention, the magnetic part can be easily formed using a plate-like simple composite magnetic material.
- FIG. 1 is a perspective view showing a first embodiment of an electronic component 10 according to the present invention.
- FIG. 2 is a longitudinal sectional view of the electronic component 10 cut along the line ZZ in FIG. 1.
- 3 is a perspective view for explaining a configuration of a coil fixing body 12.
- FIG. It is a figure which shows the manufacturing process of the electronic component 10 of 1st Embodiment. It is a figure which shows the manufacturing process of the electronic component 10 of 1st Embodiment. It is a figure which shows the manufacturing process of the electronic component 10 of 2nd Embodiment. It is a figure which shows the manufacturing process of the electronic component 10 of 2nd Embodiment.
- FIG. 1 is a perspective view showing a first embodiment of an electronic component 10 according to the present invention.
- FIG. 2 is a longitudinal sectional view of the electronic component 10 taken along the line ZZ in FIG.
- words such as up and down are used for easy understanding, but this up and down refers to the up and down direction in the drawing and does not limit the configuration of the present invention.
- each figure shown below including FIG. 1 is a diagram schematically shown, and the size and shape of each part are appropriately exaggerated for easy understanding.
- specific numerical values, shapes, materials, and the like are shown and described, but these can be changed as appropriate.
- the electronic component 10 is an inductor including a magnetic body portion 11, a coil fixing body 12, and an external terminal 13.
- the magnetic part 11 is formed by curing a composite magnetic material in which magnetic particles and a resin are mixed.
- a composite magnetic material for example, a mixture of iron-based metal magnetic powder and epoxy resin can be used.
- the magnetic body portion 11 is provided so as to fill a portion where the coil fixing body 12 does not exist without a gap.
- the coil fixing body 12 is formed by fixing the winding coil 1 with the insulating resin portion 2.
- FIG. 3 is a perspective view for explaining the configuration of the coil fixing body 12.
- 3A shows the winding coil 1 before being fixed by the insulating resin portion 2
- FIG. 3B shows the coil fixing body 12 in which the winding coil 1 is fixed by the insulating resin portion 2.
- the winding coil 1 is formed by, for example, winding a conducting wire having a flat cross section into two ⁇ windings (outer and outer windings).
- both end portions 1 a of the winding coil 1 extend from the same side surface of the winding coil 1 to both ends of the electronic component 10.
- the insulating resin portion 2 is formed of an insulating resin such as a polyimide resin, an epoxy resin, a phenol resin, or an acrylic resin, and covers the entire surface excluding a part of the winding coil 1 and has an insulating function.
- the winding coil 1 is fixed and the shape as the coil fixing body 12 is maintained.
- FIG.3 (b) the part which attached
- the insulating resin portion 2 is formed, for example, by a technique such as dipping the winding coil 1 into a liquid resin tank. Note that the insulating resin portion 2 is not formed on the front end surface 1 b of the both end portions 1 a of the winding coil 1 in order to establish conduction with the external terminal 13.
- the external terminal 13 is a terminal portion made of a conductive material such as silver or copper so as to be electrically connected to the two tip surfaces 1b of the winding coil 1 at both ends of the electronic component 10.
- 4 and 5 are diagrams showing the manufacturing process of the electronic component 10 of the first embodiment.
- the winding coil 1 is formed from a rectangular wire (coil forming step), and the insulating resin portion 2 is attached and fixed to the formed winding coil 1 to fix the coil.
- the body 12 is produced (coil fixing step).
- a plate-like composite magnetic material 111 that is a material of the magnetic body portion 11 is prepared, and the coil fixing body 12 is set at a predetermined position (FIG. 4A).
- the plate-like composite magnetic material 111 is heated from 70 ° C. to 120 ° C., and the plate-like composite magnetic material 111 is softened.
- the coil-like composite magnetic material 111 is pressed by a press die P to embed the coil fixing body 12 in the plate-like composite magnetic material 111.
- the coil fixing body 12 that has been left uncovered in the second step is disposed so as to be further covered with the softened other plate-like composite magnetic material 111. . And this is pressed by the press die P. Thereby, the upper surface of the coil fixing body 12 can also be covered with the plate-like composite magnetic material 111, and the form shown in FIG.
- external terminals 13 are formed at both ends by dipping a conductive paste such as silver or copper or applying a conductive material such as silver or copper by sputtering or plating.
- a conductive paste such as silver or copper
- a conductive material such as silver or copper by sputtering or plating.
- the external terminal 13 can be formed in an L shape over the bottom surface and the end surface of the magnetic body portion 11, can be formed only on the bottom surface of the magnetic body portion 11, or can be formed in various shapes.
- the steps after the press-fitting step are performed on the plurality of coil fixing bodies 12 using the plate-shaped composite magnetic material 111 having a size that allows the plurality of coil fixing bodies 12 to be arranged side by side. Done at the same time. Thereby, the electronic component 10 can be manufactured efficiently.
- the coil fixing body 12 is first formed, and this is pressed into the plate-shaped composite magnetic material 111 to pressurize and cure the composite magnetic material, thereby manufacturing the electronic component 10. did. Since the coil fixing body 12 is formed by fixing the winding coil 1 with the insulating resin portion 2, the coil fixing body 12 may be bent between the first stage and the second stage of the winding coil 1 by pressurization, or the winding coil 1. The winding coil 1 will not be deformed, for example, by crushed the conductive wire. Therefore, the electronic component 10 of 1st Embodiment can be shape
- the overall size can be reduced by reducing the thickness of the magnetic body portion 11 without reducing the shape of the coil itself.
- the first embodiment even if the self-inductance L and the allowable current of the electronic component 10 are kept large, manufacturing can be performed with good yield, and miniaturization can be easily performed.
- the electronic component 10 of the second embodiment has the same form as the electronic component 10 of the first embodiment, except that the manufacturing method is partially different. Therefore, the same reference numerals are given to the portions that perform the same functions as those in the first embodiment described above, and repeated descriptions are omitted as appropriate.
- 6 and 7 are diagrams illustrating a manufacturing process of the electronic component 10 according to the second embodiment.
- the winding coil 1 is formed from a flat wire (coil forming step), and the insulating resin portion 2 is formed on the formed winding coil 1.
- the coil fixing body 12 is manufactured by attaching and fixing (coil fixing step).
- a plate-like composite magnetic material 111 that is a material of the magnetic part 11 is prepared.
- the thickness of the plate-shaped composite magnetic material 111 prepared here is substantially the same as the height of the coil fixing body 12.
- the plate-like composite magnetic material 111 is heated from 70 ° C. to 120 ° C., and the plate-like composite magnetic material 111 is softened. As shown in FIG. The composite magnetic material 111 is pressed by a press die P to embed the coil fixing body 12 in the plate-shaped composite magnetic material 111. When the embedding is completed, as shown in FIG. 6C, the upper and lower end portions of the coil fixing body 12 are in a state where the amount of the composite magnetic material attached is small or partly exposed.
- the other two softened plate-like composite magnetic materials 111 are arranged above and below the coil fixing body 12 not covered in the second step. Then, the upper and lower sides of the coil fixing body 12 are pressed by a press die P so that the two plate-like composite magnetic materials 111 can be further covered. Thereby, both the upper surface and the lower surface of the coil fixing body 12 can be covered with the plate-like composite magnetic material 111, and the configuration shown in FIG. In the second embodiment, by arranging the plate-like composite magnetic material 111 on both the upper and lower sides, the thickness of the magnetic part 11 (composite magnetic material) formed above and below the coil fixing body 12 can be controlled more accurately. is there.
- the thicknesses of the magnetic body portions 11 on both the upper and lower surfaces can be accurately controlled, and the upper and lower surfaces can be formed to a thickness closer to the limit because the manufacturing variation is reduced. Therefore, according to the manufacturing method of this embodiment, the electronic component 10 can be reduced in size. Note that the pressurization and curing may be performed separately or simultaneously.
- external terminals 13 are formed at both ends by dipping a conductive paste such as silver or copper or applying a conductive material such as silver or copper by sputtering or plating.
- a conductive paste such as silver or copper
- a conductive material such as silver or copper by sputtering or plating.
- the external terminal 13 can be formed in an L shape over the bottom surface and the end surface of the magnetic body portion 11, can be formed only on the bottom surface of the magnetic body portion 11, or can be formed in various shapes.
- the steps after the press-fitting step are performed using the plate-shaped composite magnetic material 111 having a size that allows the plurality of coil fixing bodies 12 to be arranged side by side.
- the coil fixing body 12 is simultaneously performed. Thereby, the electronic component 10 can be manufactured efficiently.
- the coil fixing body 12 is covered and covered by the two plate-like composite magnetic materials 111 from both sides in the cover process. Therefore, the vertical dimension control can be performed more accurately, and the electronic component 10 can be manufactured with a higher yield and a smaller size.
- the winding coil 1 has been described with an example in which the winding coil 1 is ⁇ -wound.
- the winding coil may be a normal winding method in which end portions are drawn out from each of the outer peripheral side and the inner peripheral side.
- the winding coil 1 has been described with an example having a two-stage configuration.
- the winding coil may have four stages or any configuration.
- the winding coil 1 may be formed by winding a conducting wire having a round cross section.
- the insulating resin portion may be formed by spraying resin on the winding coil or by attaching resin to the winding coil by sputtering.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
- Insulating Of Coils (AREA)
Abstract
Description
図1は、本発明による電子部品10の第1実施形態を示す斜視図である。
図2は、電子部品10を図1中のZ-Z線に沿って切断した縦断面図である。
なお、以下の説明において、理解を容易にするために上下等の文言を用いるが、この上下とは、図中における上下方向を指すものであり、本発明の構成を限定するものではない。
また、図1を含め、以下に示す各図は、模式的に示した図であり、各部の大きさ、形状は、理解を容易にするために、適宜誇張して示している。
さらに、以下の説明では、具体的な数値、形状、材料等を示して説明を行うが、これらは、適宜変更することができる。
図3は、コイル固定体12の構成を説明するための斜視図である。図3(a)は、絶縁樹脂部2により固定する前の巻線コイル1を示し、図3(b)は、絶縁樹脂部2により巻線コイル1を固定したコイル固定体12を示している。
図4及び図5は、第1実施形態の電子部品10の製造工程を示す図である。
先ず、図3(a)に示すように、巻線コイル1を平角線から形成し(コイル形成工程)、形成された巻線コイル1に絶縁樹脂部2を付着させて固定して、コイル固定体12を作製する(コイル固定工程)。
次に、磁性体部11の素材である板状複合磁性材料111を用意して、所定の位置にコイル固定体12をセットする(図4(a))。
この状態で、板状複合磁性材料111を70℃から120℃に加温して、板状複合磁性材料111が軟化した状態で、図4(b)に示すように、コイル固定体12を板状複合磁性材料111に対してプレス金型Pによりプレスして、コイル固定体12を板状複合磁性材料111に埋め込む。
次に、図5(c)に示すように、第2工程では覆いきれずに突出して残ったコイル固定体12を、軟化させた他の板状複合磁性材料111によりさらに覆うようにして配置する。そして、これをプレス金型Pによりプレスする。これにより、コイル固定体12の上面も板状複合磁性材料111により覆うことができ、図5(d)に示す形態となる。
次に、図5(d)に示した状態のまま、150℃から200℃に保ちながら全体を加圧(プレス)して成形し(加圧工程)、磁性体部11(複合磁性材料)を硬化させる(硬化工程)。この加圧工程及び硬化工程により磁性体部11が強固に形成されることから、コイル固定体12から外径形状までの距離を、例えば、100μmから200μm程度に薄く形成しても、剥離等が生じず、歩留まりよく製造が可能である。よって、本実施形態の製造方法によれば、電子部品10は、小型化が可能である。なお、加圧と硬化は、別々に行ってもよいし、150℃から200℃に保ちながら全体を加圧して形成する際に、同時に磁性体部11を硬化させてもよい。
最後に、図5(e)に示すように、銀や銅などの導電ペーストをディップしたり、銀や銅などの導電材料をスパッタ、めっきなどで施したりして外部端子13を両端に形成して、電子部品10が完成する。なお、第4工程と第5工程との間に、所定の外径形状に切断する切断工程等を適宜設けることができる。外部端子13は、磁性体部11の底面と端面に渡ってL字状に形成したり、磁性体部11の底面にのみ形成したり様々な形状に形成することができる。
また、第1実施形態によれば、板状複合磁性材料111に対して複数のコイル固定体12を整列配置して同時に複数の電子部品10を製造可能であり、効率よく電子部品10の製造を行うことができる。
第2実施形態の電子部品10は、製造方法が部分的に異なる他は、第1実施形態の電子部品10と同様な形態をしている。よって、前述した第1実施形態と同様の機能を果たす部分には、同一の符号を付して、重複する説明を適宜省略する。
図6及び図7は、第2実施形態の電子部品10の製造工程を示す図である。
先ず、第1実施形態と同様にして、図6(a)に示すように、巻線コイル1を平角線から形成し(コイル形成工程)、形成された巻線コイル1に絶縁樹脂部2を付着させて固定して、コイル固定体12を作製する(コイル固定工程)。
また、磁性体部11の素材である板状複合磁性材料111を用意する。ここで準備する板状複合磁性材料111の厚さは、コイル固定体12の高さと略一致した厚さとしている。
次に、板状複合磁性材料111を70℃から120℃に加温して、板状複合磁性材料111が軟化した状態で、図6(b)に示すように、コイル固定体12を板状複合磁性材料111に対してプレス金型Pによりプレスして、コイル固定体12を板状複合磁性材料111に埋め込む。
埋め込みが完了すると、図6(c)に示すように、コイル固定体12の上下端部は、複合磁性材料の付着量が僅かであるか、一部露出する状態である。
次に、図7(d)に示すように、第2工程では覆いきれていないコイル固定体12の上下それぞれに、軟化させた他の2枚の板状複合磁性材料111を配置する。そして、コイル固定体12の上下をこれら2枚の板状複合磁性材料111によりさらに覆うことができるように、これをプレス金型Pによりプレスする。これにより、コイル固定体12の上面も下面も、板状複合磁性材料111により覆うことができ、図7(e)に示す形態となる。第2実施形態では、上下両側に板状複合磁性材料111を配置することにより、コイル固定体12の上下に形成される磁性体部11(複合磁性材料)の厚さをより正確に制御可能である。
次に、図7(e)に示した状態のまま、150℃から200℃に保ちながら全体を加圧(プレス)して成形し(加圧工程)、磁性体部11(複合磁性材料)を硬化させる(硬化工程)。この加圧工程及び硬化工程により磁性体部11が強固に形成されることから、コイル固定体12から外径形状までの距離を、例えば、100μmから200μm程度に薄く形成しても、剥離等が生じず、歩留まりよく製造が可能である。また、第2実施形態では、上下両面の磁性体部11の厚さも正確に制御できることから、この上下面についても、製造バラツキが減ることから、より限界に近い薄さまで形成が可能である。よって、本実施形態の製造方法によれば、電子部品10は、小型化が可能である。なお、加圧と硬化は、別々に行ってもよいし、同時に行ってもよい。
最後に、図7(f)に示すように、銀や銅などの導電ペーストをディップしたり、銀や銅などの導電材料をスパッタ、めっきなどで施したりして外部端子13を両端に形成して、電子部品10が完成する。なお、第4工程と第5工程との間に、所定の外径形状に切断する切断工程等を適宜設けることができる。外部端子13は、磁性体部11の底面と端面に渡ってL字状に形成したり、磁性体部11の底面にのみ形成したり様々な形状に形成することができる。
以上説明した実施形態に限定されることなく、種々の変形や変更が可能であって、それらも本発明の範囲内である。
1a 両端部
1b 先端面
2 絶縁樹脂部
10 電子部品
11 磁性体部
12 コイル固定体
13 外部端子
111 板状複合磁性材料
P プレス金型
Claims (7)
- 線状の導体によりコイルを形成するコイル形成工程と、
前記コイルを絶縁樹脂により固定するコイル固定体を形成するコイル固定工程と、
磁性体粒子と樹脂とを混合した複合磁性材料により前記コイル固定体の全体を覆うように磁性体部を形成する磁性体部付着工程と、
全体を加圧して成形する加圧工程と、
前記磁性体部を硬化させる硬化工程と、
を備える電子部品の製造方法。 - 請求項1に記載の電子部品の製造方法において、
前記磁性体部付着工程は、
板状に形成された前記複合磁性材料である板状複合磁性材料を軟化させた状態で前記コイル固定体を前記板状複合磁性材料に埋め込む圧入工程と、
前記圧入工程では覆いきれない前記コイル固定体を、軟化させた他の板状複合磁性材料によりさらに覆うカバー工程と、
を備えること、
を特徴とする電子部品の製造方法。 - 請求項2に記載の電子部品の製造方法において、
少なくとも前記圧入工程以降の工程は、複数のコイル固定体を並べて配置可能な大きさの前記板状複合磁性材料を用いて、複数のコイル固定体に対して同時に行われること、
を特徴とする電子部品の製造方法。 - 請求項1に記載の電子部品の製造方法において、
前記加圧工程と前記硬化工程が同時に行われること、
を特徴とする電子部品の製造方法。 - 線状の導体により形成されているコイルを絶縁樹脂により固定したコイル固定体と、
端子部を除いて前記コイル固定体を覆うように磁性体粒子と樹脂とを混合して硬化させた複合磁性材料により形成された磁性体部と、
を備える電子部品。 - 請求項5に記載の電子部品において、
前記磁性体部は、板状に形成された前記複合磁性材料である板状複合磁性材料を軟化させた状態で前記コイル固定体を前記板状複合磁性材料に埋め込んだ後に前記板状複合磁性材料を硬化させることにより形成されていること、
を特徴とする電子部品。 - 請求項5又は請求項6に記載の電子部品において、
請求項1から請求項4までのいずれか1項に記載の電子部品の製造方法により製造されていること、
を特徴とする電子部品。
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JP2017152634A (ja) * | 2016-02-26 | 2017-08-31 | アルプス電気株式会社 | インダクタンス素子 |
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