WO2015096665A1 - Pcb板涨缩补偿方法 - Google Patents

Pcb板涨缩补偿方法 Download PDF

Info

Publication number
WO2015096665A1
WO2015096665A1 PCT/CN2014/094348 CN2014094348W WO2015096665A1 WO 2015096665 A1 WO2015096665 A1 WO 2015096665A1 CN 2014094348 W CN2014094348 W CN 2014094348W WO 2015096665 A1 WO2015096665 A1 WO 2015096665A1
Authority
WO
WIPO (PCT)
Prior art keywords
area
pcb board
pcb
contraction
expansion
Prior art date
Application number
PCT/CN2014/094348
Other languages
English (en)
French (fr)
Inventor
任小浪
陈蓓
曾志军
Original Assignee
广州兴森快捷电路科技有限公司
深圳市兴森快捷电路科技股份有限公司
宜兴硅谷电子科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 广州兴森快捷电路科技有限公司, 深圳市兴森快捷电路科技股份有限公司, 宜兴硅谷电子科技有限公司 filed Critical 广州兴森快捷电路科技有限公司
Publication of WO2015096665A1 publication Critical patent/WO2015096665A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion

Definitions

  • the invention relates to a PCB board manufacturing technology, in particular to a PCB board expansion and contraction compensation method.
  • PCB boards printed circuit boards
  • the shrinkage control is a difficult process.
  • manufacturers will increase the overall PCB board.
  • the compensation is reduced, but the PCB board shrinkage deviation produced by this method is large, resulting in low precision of the PCB board.
  • the present invention overcomes the defects of the prior art, and provides a PCB board expansion and contraction compensation method, which aims to reduce the shrinkage deviation of the PCB board and improve the manufacturing precision thereof.
  • a PCB board expansion and contraction compensation method includes the following steps:
  • the subsequent operations are partitioned.
  • the outermost layer of the PCB is used as a reference surface, and the longitudinal direction is set to the X direction, the width direction is the Y direction, and the two reference targets are disposed on each of the regions, and the coordinate values and Y directions of the two reference targets in the X direction are preferably The coordinate values are different.
  • the outermost layer of the PCB is used as a reference surface, and the longitudinal direction is set to the X direction, the width direction is the Y direction, and three reference targets are set in each region, and the coordinate values and Y directions of the three reference targets in the X direction are preferably The coordinate values are not all the same.
  • the outermost layer of the PCB is used as a reference surface, and the longitudinal direction is set to the X direction, the width direction is the Y direction, and three or more reference targets are provided in each region, and the coordinate values of the reference targets in the X direction are Y.
  • the coordinate values of the directions are not all the same.
  • reference targets are disposed on each of the regions, and four reference targets are disposed at the edges of the respective regions.
  • the reference target on each of the regions is disposed on a certain layer or layers of the PCB.
  • the production files of the same process after the area compensation are merged into one total file storage.
  • the above PCB board expansion and contraction compensation method divides the PCB board before pressing into a plurality of regions, and sets at least two reference targets on each region, and measures the actual position of the reference target on each region of the pressed PCB board, and Compared with the theoretical position, the shrinkage value of different areas of the PCB is obtained, and the PCB shrinkage is different in different positions. By dividing the measurement, the shrinkage deviation of the PCB can be greatly reduced. The ups and downs of each area will be compensated for the subsequent steps, reducing the production error of subsequent processes, thereby improving the manufacturing precision of the PCB.
  • FIG. 1 is a flowchart of a method for compensating for shrinkage and contraction of a PCB according to an embodiment of the present invention
  • FIG. 2 is a PCB board divided into multiple regions according to an embodiment of the present invention.
  • a PCB board expansion and contraction compensation method includes the following steps:
  • S400 Perform partition compensation for subsequent operations according to the ups and downs of each region.
  • the above PCB board expansion and contraction compensation method divides the PCB board before pressing into a plurality of regions, and sets at least two reference targets on each region, and measures the actual position of the reference target on each region of the pressed PCB board, and Compared with the theoretical position, the shrinkage value of different areas of the PCB is obtained, and the PCB shrinkage is different in different positions. By dividing the measurement, the shrinkage deviation of the PCB can be greatly reduced. The ups and downs of each area will be compensated for the subsequent steps, reducing the production error of subsequent processes, thereby improving the manufacturing precision of the PCB.
  • the outermost layer of the PCB board 100 before pressing is used as a reference surface, and the longitudinal direction is set to the X direction, the width direction is the Y direction, and four references are set in each area.
  • the coordinate values of the X directions of the respective reference targets and the coordinate values of the Y directions are not all the same.
  • the four reference targets 110 can determine a range, and it is convenient to determine the ups and downs of the area of the PCB after pressing.
  • the main parameters of the expansion and contraction are: position deviation, angular deviation, dimensional deviation, and the conversion of the expansion and contraction value is mainly passed.
  • the X-Ray quadratic element compares the measured actual position of the four reference targets 110 with the theoretical position, and can also be realized by an optical quadratic element, an optical/mechanical three-dimensional measuring instrument, and then according to the expansion and contraction values of the respective regions.
  • the subsequent processes are divided into zones.
  • the subsequent processes include drill belt, outer layer graphics, milling belt, V-CUT, etc.
  • the compensation rules for compensation in subsequent processes in each region are currently available in the industry. It is widely used in the linear compensation principle of CCD drilling machine and secondary element measuring instrument to compensate the displacement amount, angle and size of subsequent processes in each area. It can be realized by X-Ray secondary element measuring instrument, PC or manual operation.
  • the PCB board 100 is divided into nine areas, and there are two main methods for dividing the PCB board 100 into one area: one is to divide the network format in the X and Y directions, and each area after the division is the same size and as much as possible.
  • the area is small, but the divided area needs to be able to set the reference target 110, usually 2 to 4 inches. 2.
  • the area is divided according to the control requirements of each part of the PCB board. The shape and size of each area after division are determined according to actual needs. .
  • the shape of the reference target 110 may be set to a circular shape, a circular shape, an elliptical shape, a cross shape, a rectangular shape, an equilateral triangle shape, a m-shaped shape, and other angle-symmetric patterns to facilitate determination of the center of the reference target 110, thereby facilitating accurate measurement of the reference.
  • the reference target 110 may be a pattern added on the edge of each area of the PCB, or a pattern that can be used as a target on a certain layer of the PCB or a base layer may be used as a reference target.
  • the production files are combined into one total file storage.
  • the basic principle flow includes: setting the unified zero position ⁇ merging the reference target and the process file to be compensated ⁇ dividing the area to be compensated according to the reference target ⁇ compensating the process production files of each area ⁇ merging the process production files of each area and generating the total file ⁇ The number is saved. In this way, by importing the total file into the corresponding device, it is convenient to perform subsequent processes such as drill tape, outer layer graphics, milling tape, V-CUT, and the like.
  • four reference targets 110 are disposed on each of the regions, and four reference targets 110 are disposed at the edges of the respective regions. In this way, the range determined by the four reference targets 110 is consistent with the size of the pre-divided area, so that subsequent compensation for each area is facilitated.
  • the reference target 110 on each of the regions is disposed on a certain layer or layers of the PCB board 100. Because the PCB board is usually multi-layered, its layers have different requirements for the control of the shrinkage and precision. If the accuracy of a layer is high, the reference target 110 can be set on the layer to obtain the value of the layer. The earth reduces the shrinkage deviation of the layer, thereby improving the production precision of the subsequent process on the layer, and the reference target 110 can also be set on some layers.
  • the outermost layer of the PCB is used as a reference surface, and the length direction is set to the X direction, the width direction is the Y direction, and two reference targets are set in each area, and the coordinate values of the two reference targets in the X direction, Y
  • the coordinate values of the directions are different, that is, the two reference targets are not required to be in the same lateral or longitudinal straight line, so that the line connecting the two reference targets is determined as the diagonal of the region, so that the range of the region can be determined, which is convenient. Subsequent compensation for each area.
  • the outermost layer of the PCB is used as a reference surface, and the length direction is set to the X direction, the width direction is the Y direction, and three reference targets are set in each area, and the coordinate values of the three reference targets in the X direction, Y
  • the coordinate values of the directions are not all the same, that is, the three reference targets are not in the same lateral or longitudinal straight line, so that the connection of the three reference targets can be used to roughly determine the range of the region, so as to facilitate subsequent compensation for each region.
  • the problem of subsequent processing and poor image alignment accuracy caused by inconsistent expansion and contraction of different positions of PCB boards of different specifications, different batches and different serial numbers can be realized, and the hole to the conductor and the contour contour can be effectively improved.
  • the process capability of cell pattern, solder mask alignment, V-CUT line to cell pattern can greatly expand the application of PCB board in high-level, precision lines, small pitch and other fields.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

一种PCB板涨缩补偿方法，包括如下步骤：将PCB板（100）划分为多个区域；在各区域上设置至少两个基准靶标（110）；将PCB板（100）压合后测量其各区域上基准靶标（110）的实际位置，并与理论位置进行比对，换算出各区域的涨缩值。PCB在其不同位置的涨缩是不一致的，通过分区测量，能极大地降低PCB板的涨缩偏差，通过得出的各区域的涨缩值，对后续各工序进行分区补偿，降低后续工序的生产误差，从而提高PCB板的制造精度。

Description

PCB板涨缩补偿方法 技术领域
本发明涉及PCB板制造技术，特别涉及一种PCB板涨缩补偿方法。
背景技术
随着电子行业的发展，印制电路板，简称PCB板，精度要求越来越高，对于PCB板制造而言，涨缩控制则是其工艺难点，通常各生产厂家会对PCB板进行整体涨缩补偿，但是这种方法生产出的PCB板涨缩偏差较大，导致PCB板精度低。
发明内容
基于此，本发明在于克服现有技术的缺陷，提供一种PCB板涨缩补偿方法，旨在降低PCB板的涨缩偏差，提高其制造精度。
其技术方案如下：
一种PCB板涨缩补偿方法，包括如下步骤：
将PCB板划分为多个区域；
在各区域上设置至少两个基准靶标；
将PCB板压合后测量其各区域上基准靶标的实际位置，并与理论位置进行比对，换算出各区域的涨缩值；
根据各区域的涨缩值，对后续各工序进行分区补偿。
优选的，以PCB板最外层为基准面，设定其长度方向为X向，宽度方向为Y向，在各区域上设置两个基准靶标，两个基准靶标X向的坐标值、Y向的坐标值均不相同。
优选的，以PCB板最外层为基准面，设定其长度方向为X向，宽度方向为Y向，在各区域上设置三个基准靶标，三个基准靶标X向的坐标值、Y向的坐标值不全相同。
优选的，以PCB板最外层为基准面，设定其长度方向为X向，宽度方向为Y向，在各区域上设置三个以上的基准靶标，各基准靶标X向的坐标值、Y向的坐标值不全相同。
优选的，在各区域上均设置四个基准靶标，四个基准靶标设置在各区域边缘。
优选的，各区域上的基准靶标设置在所述PCB板的某一层或者某几层上。
优选的，上述步骤中根据各区域的涨缩值，对后续各工序进行分区补偿后，将按区域补偿后的同一工序的生产文件合并成一个总文件存储。
下面对前述技术方案的优点或原理进行说明：
上述PCB板涨缩补偿方法，将压合前的PCB板划分为多个区域，并在各区域上设置至少两个基准靶标，测量压合后的PCB板各区域上基准靶标的实际位置，并与理论位置进行比对，从而得出PCB板不同区域的涨缩值，PCB在其不同位置的涨缩是不一致的，通过分区测量，能极大地降低PCB板的涨缩偏差，通过得出的各区域的涨缩值，对后续各工序进行分区补偿，降低后续工序的生产误差，从而提高PCB板的制造精度。
附图说明
图1为本发明实施例所述的PCB板涨缩补偿方法的流程图；
图2为本发明实施例所述的划分为多个区域的PCB板。
具体实施方式
下面结合附图对本发明的实施例进行详细说明：
如图1所示，一种PCB板涨缩补偿方法，包括如下步骤：
S100：将PCB板划分为多个区域；
S200：在各区域上设置至少两个基准靶标；
S300：将PCB板压合后测量其各区域上基准靶标的实际位置，并与理论位置进行比对，换算出各区域的涨缩值；
S400：根据各区域的涨缩值，对后续各工序进行分区补偿。
上述PCB板涨缩补偿方法，将压合前的PCB板划分为多个区域，并在各区域上设置至少两个基准靶标，测量压合后的PCB板各区域上基准靶标的实际位置，并与理论位置进行比对，从而得出PCB板不同区域的涨缩值，PCB在其不同位置的涨缩是不一致的，通过分区测量，能极大地降低PCB板的涨缩偏差，通过得出的各区域的涨缩值，对后续各工序进行分区补偿，降低后续工序的生产误差，从而提高PCB板的制造精度。
如图2所示，本实施例中，以压合前的PCB板100最外层为基准面，设定其长度方向为X向，宽度方向为Y向，在各区域上设置了四个基准靶标110，各基准靶标X向的坐标值、Y向的坐标值不全相同。这样四个基准靶标110能确定一个范围，便于确定压合后的PCB板该区域的涨缩值，涨缩值主要参数有：位置偏差、角度偏差、尺寸偏差，涨缩值的换算主要是通过X-Ray二次元将测量到的四个基准靶标110的实际位置与理论位置进行比对得出，也可以通过光学二次元、光学/机械三次元测量仪实现，然后根据各区域的涨缩值，按照一定的补偿规则对后续各工序进行分区补偿，后续各工序包括钻带、外层图形、铣带、V-CUT等，各区域后续工序进行补偿的补偿规则为目前行业内已有的、广泛应用于CCD钻机、二次元测量仪的线性补偿原则，补偿各区域后续工序的位移量、角度、尺寸大小，可通过X-Ray二次元测量仪、PC机或者手工操作实现。
本实施例将PCB板100分为九个区域，对PCB板100进行区域划分的方法主要有两种：一、为X、Y两方向网格式划分，划分后的每个区域大小相同且尽可能面积小，但划分出的区域需能设定基准靶标110，通常在2～4inch；二、根据PCB板各部分涨缩精度控制要求不同而划分区域，划分后各区域形状及尺寸根据实际需求确定。基准靶标110的形状可以设置成圆形、圆环形、椭圆形、十字架形、矩形、正三角形、米字型及其余角度对称图形，以便于确定该基准靶标110的中心，从而方便准确测量基准靶标110的实际位置。所述基准靶标110可以是在PCB板上各区域边缘添加的图形，也可以选用PCB板某一层或某基层上现有的可作为标靶的图形作为基准靶标。
为方便对PCB板100后续工序进行操作，减少工作强度，上述步骤中根据各区域的涨缩值，对后续各工序进行分区补偿后，将按区域补偿后的同一工序的 生产文件合并成一个总文件存储。其实现基本原理流程包含：设置统一零位→合并基准靶标与待补偿工序文件→根据基准靶标对待补偿工序划分区域→补偿各区域的工序生产文件→合并各区域的工序生产文件并生成总文件→编号保存。这样通过将总文件导入对应的设备中，就能方便执行后续工序如钻带、外层图形、铣带、V-CUT等。
本实施例中，在各区域上均设置了四个基准靶标110，四个基准靶标110设置在各区域边缘。这样使四个基准靶标110确定的范围与预先划分的区域大小一致，便于后续对各区域进行补偿。
各区域上的基准靶标110设置在所述PCB板100的某一层或者某几层上。因为PCB板通常为多层，其各层对涨缩精度控制要求各有不同，若某层的精度要求高，则可在该层上设置基准靶标110，得出该层的涨缩值，极大地降低该层的涨缩偏差，从而提高该层上后续工艺的生产精度，也可以在某几层上均设置基准靶标110。
参照图2，以PCB板最外层为基准面，设定其长度方向为X向，宽度方向为Y向，在各区域上设置两个基准靶标，两个基准靶标X向的坐标值、Y向的坐标值均不相同，即要求两个基准靶标不在同一横向或纵向直线上，这样通过两个基准靶的连线，确定为该区域的对角线，从而可以确定该区域的范围，便于后续对各区域进行补偿。
参照图2，以PCB板最外层为基准面，设定其长度方向为X向，宽度方向为Y向，在各区域上设置三个基准靶标，三个基准靶标X向的坐标值、Y向的坐标值不全相同，即要求三个基准靶标不在同一横向或纵向直线上，这样通过三个基准靶的连线，从而可以大致确定该区域的范围，便于后续对各区域进行补偿。
通过本实施例，可以实现不同规格型号、不同批次、不同序号的PCB板的不同位置涨缩不一致导致的后续工序加工及图像对位精度差的问题，能有效提升孔到导体、外形轮廓到单元图形、阻焊对准度、V-CUT线到单元图形等方面的工艺能力，能大大拓展PCB板在高层、精密线路、小间距等领域的应用。
以上所述实施例仅表达了本发明的具体实施方式，其描述较为具体和详细， 但并不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。

Claims (7)

  1. 一种PCB板涨缩补偿方法，其特征在于，包括如下步骤：
    将PCB板划分为多个区域；
    在各区域上设置至少两个基准靶标；
    将PCB板压合后测量其各区域上基准靶标的实际位置，并与理论位置进行比对，换算出各区域的涨缩值；
    根据各区域的涨缩值，对后续各工序进行分区补偿。
  2. 根据权利要求1所述的PCB板涨缩补偿方法，其特征在于，以PCB板最外层为基准面，设定其长度方向为X向，宽度方向为Y向，在各区域上设置两个基准靶标，两个基准靶标X向的坐标值、Y向的坐标值均不相同。
  3. 根据权利要求1所述的PCB板涨缩补偿方法，其特征在于，以PCB板最外层为基准面，设定其长度方向为X向，宽度方向为Y向，在各区域上设置三个基准靶标，三个基准靶标X向的坐标值、Y向的坐标值不全相同。
  4. 根据权利要求1所述的PCB板涨缩补偿方法，其特征在于，以PCB板最外层为基准面，设定其长度方向为X向，宽度方向为Y向，在各区域上设置三个以上的基准靶标，各基准靶标X向的坐标值、Y向的坐标值不全相同。
  5. 根据权利要求4所述的PCB板涨缩补偿方法，其特征在于，在各区域上均设置四个基准靶标，四个基准靶标设置在各区域边缘。
  6. 根据权利要求1～5任一项所述的PCB板涨缩补偿方法，其特征在于，各区域上的基准靶标设置在所述PCB板的某一层或者某几层上。
  7. 根据权利要求6所述的PCB板涨缩补偿方法，其特征在于，上述步骤中根据各区域的涨缩值，对后续各工序进行分区补偿后，将按区域补偿后的同一工序的生产文件合并成一个总文件存储。
PCT/CN2014/094348 2013-12-24 2014-12-19 Pcb板涨缩补偿方法 WO2015096665A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201310722470.4A CN103747617B (zh) 2013-12-24 2013-12-24 Pcb板涨缩补偿方法
CN201310722470.4 2013-12-24

Publications (1)

Publication Number Publication Date
WO2015096665A1 true WO2015096665A1 (zh) 2015-07-02

Family

ID=50504586

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/094348 WO2015096665A1 (zh) 2013-12-24 2014-12-19 Pcb板涨缩补偿方法

Country Status (2)

Country Link
CN (1) CN103747617B (zh)
WO (1) WO2015096665A1 (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109657265A (zh) * 2018-10-31 2019-04-19 惠州市金百泽电路科技有限公司 一种pcb板线路和钻孔自动涨缩的方法
CN112272449A (zh) * 2020-10-20 2021-01-26 惠州市特创电子科技有限公司 线路板生产***及涨缩分板装置
CN113115518A (zh) * 2021-04-13 2021-07-13 生益电子股份有限公司 涨缩平移方法
CN114554698A (zh) * 2022-03-31 2022-05-27 深圳市大族数控科技股份有限公司 Pcb板加工方法、pcb板以及pcb板钻孔方法
CN115859895A (zh) * 2023-03-03 2023-03-28 惠科股份有限公司 Pcb分段预缩方法、装置、设备及计算机可读存储介质

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103747617B (zh) * 2013-12-24 2017-02-15 广州兴森快捷电路科技有限公司 Pcb板涨缩补偿方法
CN104582277B (zh) * 2014-07-31 2017-12-01 江苏博敏电子有限公司 印制线路板的一种涨缩委工方法
CN104270889B (zh) * 2014-09-28 2017-06-13 广州兴森快捷电路科技有限公司 局部高精度印制线路板及其制备方法
CN104251687B (zh) * 2014-10-11 2017-05-03 盐城工学院 一种基于镜面图像处理的零件表面平整度检测方法
CN104918424B (zh) * 2015-07-03 2018-01-12 深圳市迅捷兴科技股份有限公司 具有不同厚度芯板的电路板尺寸稳定方法
CN105382344A (zh) * 2015-11-16 2016-03-09 景旺电子科技(龙川)有限公司 一种灯条板的锣板方法
CN105632941B (zh) * 2016-02-02 2018-06-22 广州兴森快捷电路科技有限公司 一种基于涨缩过程控制的封装基板的生产加工方法
CN106052618A (zh) * 2016-07-18 2016-10-26 广州兴森快捷电路科技有限公司 Pcb与焊盘中心距离的测量方法及应用该方法的测量装置
CN106659001A (zh) * 2016-11-21 2017-05-10 深圳市五株科技股份有限公司 多层pcb涨缩测量补偿方法
CN106793521B (zh) * 2016-12-30 2020-03-27 广州兴森快捷电路科技有限公司 电路板的钻孔或铣型工程文件制作方法及***
CN108541141B (zh) * 2018-04-12 2020-02-18 江苏博敏电子有限公司 一种导通孔层与电路图形层的分区对位方法
CN108668444B (zh) * 2018-06-25 2020-03-06 广州兴森快捷电路科技有限公司 涨缩控制方法、加工方法和***、计算机存储介质和设备
CN109362178A (zh) * 2018-10-16 2019-02-19 欣强电子（清远）有限公司 一种硅麦克风pcb板的vop制作方法
CN109362190A (zh) * 2018-10-17 2019-02-19 欣强电子（清远）有限公司 一种无孔对位镭射机双面加工工艺
CN109635313B (zh) * 2018-10-26 2023-11-14 广州美维电子有限公司 一种生成pcb涨缩工具图纸的方法及装置
CN109714896B (zh) * 2018-11-23 2021-03-19 广州广合科技股份有限公司 一种改善多层印制电路大拼板内套板局部形变的方法
CN111299842B (zh) * 2018-12-11 2022-04-05 深圳市百柔新材料技术有限公司 高精度激光雕刻阻焊层的方法
CN110896594A (zh) * 2019-09-30 2020-03-20 宜兴硅谷电子科技有限公司 一种无Pin定位自动涨缩钻孔生产方法
CN110722018A (zh) * 2019-10-21 2020-01-24 广东正业科技股份有限公司 一种精度矫正方法及其装置
CN112770499A (zh) * 2019-11-06 2021-05-07 珠海方正科技高密电子有限公司 电路板的加工处理方法和装置
TWI724705B (zh) 2019-12-20 2021-04-11 財團法人工業技術研究院 工作件之設計圖像的補償方法及處理系統
CN111031685B (zh) * 2019-12-25 2022-06-21 深圳市景旺电子股份有限公司 一种高频天线pcb板的制造方法
CN111629510A (zh) * 2020-05-29 2020-09-04 珠海新业电子科技有限公司 一种控制面板涨缩的方法
CN111992752B (zh) * 2020-10-27 2021-01-26 维嘉数控科技（苏州）有限公司 基于钻带分割的钻孔控制方法、装置及钻孔设备
CN112069764A (zh) * 2020-11-11 2020-12-11 维嘉数控科技（苏州）有限公司 一种电路板标记方法和电路板加工钻机
CN112895691B (zh) * 2021-01-18 2022-08-23 景旺电子科技(珠海)有限公司 印刷网版及其制作方法
CN112888173B (zh) * 2021-01-19 2023-10-31 珠海杰赛科技有限公司 一种pcb板的加工成型工艺
CN113532316B (zh) * 2021-07-05 2023-01-20 深圳市先地图像科技有限公司 一种能同时检测多块pcb板形位偏差的装置及检测方法
TWI773431B (zh) * 2021-07-12 2022-08-01 國立陽明交通大學 利用非線性模型預測電路板變形誤差之偏移位置補償系統及其補償方法
CN113784520B (zh) * 2021-08-26 2023-04-28 景旺电子科技(龙川)有限公司 电路板钻孔方法及电路板
CN114760778A (zh) * 2022-03-22 2022-07-15 广州美维电子有限公司 基于多层pcb的分区对位方法及用于多层pcb的分区对位装置
CN114885501B (zh) * 2022-04-06 2023-12-29 广东喜珍电路科技有限公司 一种线性控制pcb锣板精度的方法
CN114900997A (zh) * 2022-05-07 2022-08-12 深圳市大族数控科技股份有限公司 Pcb板制造方法、pcb板钻孔方法及pcb板制造***
CN115112086B (zh) * 2022-05-30 2023-06-02 广州广芯封装基板有限公司 一种线路板的涨缩测试方法
CN115421331A (zh) * 2022-08-19 2022-12-02 柏承科技(昆山)股份有限公司 一种小板件大排版定位加工方法
CN116933719B (zh) * 2023-09-15 2023-12-22 北京燧原智能科技有限公司 自适应封装基板预缩方法、装置、电子设备及存储介质

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5113579A (en) * 1989-06-30 1992-05-19 Semicon Components, Inc. Method of manufacturing hybrid integrated circuit
TW591988B (en) * 2003-05-30 2004-06-11 Au Optronics Corp Printed circuit board with compensation of heat expansion effect
CN103179812A (zh) * 2013-04-18 2013-06-26 梅州市志浩电子科技有限公司 高多阶hdi印刷电路板的制作方法
CN103747617A (zh) * 2013-12-24 2014-04-23 广州兴森快捷电路科技有限公司 Pcb板涨缩补偿方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6581202B1 (en) * 2000-11-10 2003-06-17 Viasystems Group, Inc. System and method for monitoring and improving dimensional stability and registration accuracy of multi-layer PCB manufacture
CN101489353B (zh) * 2008-01-16 2011-11-16 富葵精密组件(深圳)有限公司 板材尺寸的设计方法
CN101668389B (zh) * 2009-09-04 2012-05-09 东莞美维电路有限公司 高对准度印制线路板的制作方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5113579A (en) * 1989-06-30 1992-05-19 Semicon Components, Inc. Method of manufacturing hybrid integrated circuit
TW591988B (en) * 2003-05-30 2004-06-11 Au Optronics Corp Printed circuit board with compensation of heat expansion effect
CN103179812A (zh) * 2013-04-18 2013-06-26 梅州市志浩电子科技有限公司 高多阶hdi印刷电路板的制作方法
CN103747617A (zh) * 2013-12-24 2014-04-23 广州兴森快捷电路科技有限公司 Pcb板涨缩补偿方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109657265A (zh) * 2018-10-31 2019-04-19 惠州市金百泽电路科技有限公司 一种pcb板线路和钻孔自动涨缩的方法
CN109657265B (zh) * 2018-10-31 2023-06-09 惠州市金百泽电路科技有限公司 一种pcb板线路和钻孔自动涨缩的方法
CN112272449A (zh) * 2020-10-20 2021-01-26 惠州市特创电子科技有限公司 线路板生产***及涨缩分板装置
CN113115518A (zh) * 2021-04-13 2021-07-13 生益电子股份有限公司 涨缩平移方法
CN114554698A (zh) * 2022-03-31 2022-05-27 深圳市大族数控科技股份有限公司 Pcb板加工方法、pcb板以及pcb板钻孔方法
CN115859895A (zh) * 2023-03-03 2023-03-28 惠科股份有限公司 Pcb分段预缩方法、装置、设备及计算机可读存储介质

Also Published As

Publication number Publication date
CN103747617A (zh) 2014-04-23
CN103747617B (zh) 2017-02-15

Similar Documents

Publication Publication Date Title
WO2015096665A1 (zh) Pcb板涨缩补偿方法
CN102036511B (zh) 一种多层电路板制造芯板尺寸非线性变化分类补偿方法
CN105278261B (zh) 一种激光直写曝光机内层对位精度的测量方法
CN104270889A (zh) 局部高精度印制线路板及其制备方法
US20060253270A1 (en) Model for modifying drill data to predict hole locations in a panel structure
JPH02143544A (ja) 目合せ用バーニヤパターンを備えた半導体装置
CN203708641U (zh) 高孔位精度要求的线路板及其实现装置
CN102248288A (zh) 一种fpc板插头识别定位方法
CN108925066A (zh) 一种多层板层间偏移检测方法及检测***
CN104764415A (zh) 桥梁钢结构三维测量检测***及测量方法
CN109884862A (zh) 三维存储器曝光***中套刻偏差的补偿装置及方法
CN107218909B (zh) 一种在发动机叶片上贴应变片的方法
US20130075135A1 (en) Printed circuit board and manufacturing method thereof
WO2022127622A1 (zh) 一种二次钻孔工艺
CN115666125A (zh) 基于机器视觉的贴片机xy平台定位误差检测与补偿方法
CN105094051B (zh) 运动平台***的平面定位补偿方法
CN103200779B (zh) 一种印制电路板间距拉伸方法
CN111128829B (zh) 对准方法及校准方法
CN105072824A (zh) 一种嵌入式线路板的制作方法
CN103246152B (zh) 确定覆盖误差的方法和动态控制中间掩模位置的控制***
CN207197407U (zh) 一种用于测量X‑Ray钻孔机的钻孔精度的治具
CN113115518B (zh) 涨缩平移方法
CN115112058A (zh) 电路板层间偏移检测结构及偏移量测量方法
CN111505910A (zh) 套刻标记的对位方法
CN113124804B (zh) 一种骨架外形尺寸测量方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14874410

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC

122 Ep: pct application non-entry in european phase

Ref document number: 14874410

Country of ref document: EP

Kind code of ref document: A1