WO2015093249A1 - Carte de câblage - Google Patents

Carte de câblage Download PDF

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Publication number
WO2015093249A1
WO2015093249A1 PCT/JP2014/081390 JP2014081390W WO2015093249A1 WO 2015093249 A1 WO2015093249 A1 WO 2015093249A1 JP 2014081390 W JP2014081390 W JP 2014081390W WO 2015093249 A1 WO2015093249 A1 WO 2015093249A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal plate
hole
conductive material
wiring board
solder
Prior art date
Application number
PCT/JP2014/081390
Other languages
English (en)
Japanese (ja)
Inventor
隆宏 郡司
公教 尾崎
Original Assignee
株式会社 豊田自動織機
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社 豊田自動織機 filed Critical 株式会社 豊田自動織機
Publication of WO2015093249A1 publication Critical patent/WO2015093249A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/033—Punching metal foil, e.g. solder foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire

Definitions

  • This invention relates to the wiring board which connected the metal plate provided in both surfaces of the base material by the interlayer connection part.
  • the substrate (wiring board) described in Patent Document 1 includes a ceramic plate (base material) and metal plates provided on both surfaces of the ceramic plate. A plurality of through holes are formed at the edge of the ceramic plate. Each metal plate is also provided with a through hole that faces the through hole of the ceramic plate. Both metal plates are electrically connected by solder paste in through holes of the metal plate and the ceramic plate.
  • the objective of this invention is providing a wiring board provided with the structure which suppresses that the metal plate of a wiring board peels from a base material.
  • the wiring board according to one aspect of the present invention includes a first metal plate provided on the surface of the base material, and a second metal plate provided on the back surface of the base material.
  • the second metal plate has an adhesive portion bonded to the base material and a non-adhesive portion excluding the adhesive portion, and is an interlayer that conducts the first metal plate and the second metal plate with a conductive material.
  • the first metal plate having a through-hole, and having an interlayer connection portion connecting the first metal plate and the second metal plate with the conductive material inlet and the conductive material entering the through-hole.
  • the non-bonded portion of at least one of the plate and the second metal plate is bent toward the other and the interlayer connection Having Ori bend contained in the conductive material is summarized in that having a flare extending from the through hole in the radial direction of the through hole.
  • the conductive material that joins the first metal plate and the second metal plate expands along the radial direction of the through hole, and forms the expanded portion, whereby the second metal plate is removed from the base material. It becomes difficult to peel. Specifically, even if a force is applied in the direction in which the second metal plate is peeled from the base material (thickness direction of the second metal plate), the spreading portion engages with the second metal plate, and the second The peeling of the metal plate can be suppressed.
  • the first metal plate has a first bent portion that is bent toward the second metal plate, and the second metal plate is bent toward the first metal plate. It is preferable to have a bent portion.
  • the bent portion is provided in both the first metal plate and the second metal plate, the first bent portion and the second bent portion can easily shorten the distance between the portions. For this reason, the resistance value between the first metal plate and the second metal plate can be reduced.
  • the at least one through hole is a plurality of through holes communicating with the conductive material inlet, and the expanded portion is provided in each of the plurality of through holes. According to this, it can suppress more that a 2nd metal plate peels by providing multiple expansion parts.
  • the interlayer connection part is preferably each of a plurality of interlayer connection parts that conducts the first metal plate and the second metal plate. According to this, since the 1st metal plate and the 2nd metal plate are joined by a plurality of interlayer connection parts, it can control more that the 2nd metal plate exfoliates from a substrate.
  • the said electrically-conductive material protrudes from the exposed surface of a said 2nd metal plate. According to this, it is possible to judge by touch whether or not the expanded portion protrudes from the surface opposite to the contact surface. For this reason, it is easy to determine whether or not the expanded portion is formed.
  • the metal plate of the wiring board can be prevented from peeling from the base material.
  • (A) is a partial plan view of the wiring board viewed from the first metal plate
  • (b) is a schematic cross-sectional view of the wiring board taken along line 2b-2b of FIG. 2 (a)
  • (c) is the second metal plate.
  • (A) is a partial plan view of the wiring board of the second embodiment viewed from the first metal plate
  • (b) is a schematic cross-sectional view of the wiring board taken along line 5b-5b of FIG. 5 (a), and (c).
  • the DC-DC converter 10 includes a plurality of electronic components 21 mounted on a wiring board 20.
  • the electronic component 21 is, for example, a diode, a capacitor, a switching element, or the like.
  • the wiring board 20 is configured using a thick copper substrate.
  • the wiring board 20 is a large current substrate capable of flowing a large current.
  • the wiring board 20 has a first metal plate 31 (for example, a copper plate) on the front surface 22a of the insulating substrate 22 as a base material, and a second metal plate 41 (for example, a copper plate) on the back surface 22b of the insulating substrate 22. .
  • the insulating substrate 22 is, for example, a glass epoxy resin substrate.
  • the first metal plate 31 and the second metal plate 41 are bonded to the insulating substrate 22 with an adhesive.
  • the first metal plate 31 and the second metal plate 41 are patterned into a desired shape to form a current path.
  • the first metal plate 31 and the second metal plate 41 themselves function as a coil or the like, so that the DC-DC converter 10 is configured. Yes.
  • the first metal plate 31 and the second metal plate 41 are connected by a solder 26 as a conductive material.
  • the solder 26 has a small contact area between the first metal plate 31 and the second metal plate 41 with respect to the narrow portions of the metal plates 31, 41, that is, the insulating substrate 22, and is easily peeled from the insulating substrate 22. It is provided in the place.
  • the solder 26 penetrates through the insulating substrate 22 and connects the first metal plate 31 and the second metal plate 41 to each other.
  • the insulating substrate 22 is provided with a base material through hole 24 penetrating in the thickness direction.
  • the first metal plate 31 is provided with a conductive material inlet 32 that faces the base material through hole 24 and penetrates in the thickness direction.
  • the diameter of the conductive material inlet 32 is smaller than the diameter of the base material through hole 24.
  • the periphery of the conductive material inlet 32 is bent toward the base material through-hole 24, so that the first metal plate 31 has a second metal plate side (from the front surface side to the back surface side of the insulating substrate 22). A first bent portion 33 that is bent toward the side is formed.
  • the portion facing the base material through hole 24 is a non-adhesive portion that is not in contact with the insulating substrate 22. That is, the 1st bending part 33 turns into a non-bonding part.
  • a part other than the first bent part 33 is an adhesive part bonded to the insulating substrate 22.
  • the second metal plate 41 is provided with a second bent portion 42 that is bent toward the first metal plate side (from the back surface side to the front surface side of the insulating substrate 22).
  • the second bent portion 42 is provided to face the base material through hole 24, and protrudes toward the base material through hole 24.
  • the second bent portion 42 is inserted into the base material through hole 24 and the conductive material inlet 32.
  • the second bent portion 42 covers the inner surface of the base material through hole 24 together with the first bent portion 33.
  • the second metal plate 41 is provided with an inspection through hole 43 as at least one through hole penetrating in the thickness direction so as to face the base material through hole 24.
  • the inspection through hole 43 communicates with the base material through hole 24.
  • four inspection through holes 43 are provided for a set of one base material through hole 24 and one conductive material inlet 32, and are positioned so as to surround the second bent portion 42. ing.
  • the inner peripheral surface of the inspection through-hole 43 is a rough surface and has fine unevenness (not shown).
  • Interlayer connection that electrically connects the first metal plate 31 and the second metal plate 41 by electrically connecting the first bent portion 33 and the second bent portion 42 by the solder 26.
  • Part C1 is configured.
  • the solder 26 is filled in each of the conductive material inlet 32, the base material through hole 24, and the inspection through hole 43, and includes the first bent portion 33 and the second bent portion 42, and the interlayer connection portion C1. Is configured. Thereby, the solder 26 is also filled between the first bent portion 33 and the second bent portion 42, and the first bent portion 33 and the second bent portion 42 are joined, Electrical connection is made via solder 26.
  • the inspection through hole 43 faces the substrate through hole 24 and penetrates in the thickness direction of the second metal plate 41, so that the solder 26 is exposed to the outside of the second metal plate 41. Therefore, by visually recognizing the solder 26 facing the inspection through hole 43, it is possible to confirm the joining state of the first metal plate 31 and the second metal plate 41 by the solder 26.
  • the solder 26 has an expanded portion 27 that extends from the periphery of the inspection through hole 43 along the radial direction of the inspection through hole 43.
  • the expanded portion 27 protrudes from the exposed surface 41a which is the surface opposite to the insulating substrate side in the second metal plate 41, and extends outside the peripheral edge of the inspection through hole 43 along the exposed surface 41a. Yes.
  • the expanded portion 27 protrudes from the inspection through hole 43.
  • the solder 26 has an engaging portion 29 formed by wetting and spreading along the surface 31 a of the first metal plate 31 at the peripheral portion of the conductive material inlet 32.
  • the exposed surface 41 a is the outermost surface of the second metal plate 41 or the wiring board 20.
  • the expanded portion 27 is an end portion of the solder 26, and is preferably a lower end portion.
  • the engaging portion 29 engages at least with the inclined surface of the first bent portion 33 included in the surface 31 a of the first metal plate 31.
  • the expanded portion 27 and the engaging portion 29 are coupled to the solder 26 that fills the base material through hole 24.
  • the solder 26 filling the base material through hole 24 functions as an embedded block embedded in the insulating substrate 22.
  • the first metal plate 31 and the second metal plate 41 are formed by punching.
  • the conductive material inlet 32 may be formed simultaneously with the punching, or the conductive material inlet 32 may be formed separately from the punching.
  • the inspection through hole 43 may be formed simultaneously with the punching, or the inspection through hole 43 may be formed separately from the punching.
  • the 1st bending part 33 and the 2nd bending part 42 are formed with a press.
  • the first metal plate 31 is bonded to the front surface 22 a of the insulating substrate 22 with an adhesive
  • the second metal plate 41 is bonded to the back surface 22 b of the insulating substrate 22 with an adhesive.
  • the first bent portion 33 is inserted into the base material through hole 24 of the insulating substrate 22, and the second bent portion 42 is positioned so as to be inserted into the conductive material inlet 32 of the first metal plate 31. I do.
  • solder paste 28 is applied to the conductive material inlet 32 and its periphery in the first metal plate 31.
  • the application of the solder paste 28 is performed in a state where an area other than the application area of the solder paste 28 in the base material through hole 24 is covered with a metal mask. That is, the surface 31a of the first metal plate 31 opposite to the contact surface with the insulating substrate 22 is flat, and a smooth copper plate surface without unevenness is secured, and the solder paste 28 is printed in a desired region. can do.
  • the solder paste 28 is also applied to the arrangement area of the electronic component 21.
  • the fluidity of the solder paste 28 increases, and the fluid solder flows into the conductive material inlet 32, the base material through hole 24, and the inspection through hole 43.
  • the conductive material inlet 32 is an inlet for inserting the solder 26 (conductive material) between the layers.
  • the solder 26 conductive material
  • the hardened solder fills the inside of the substrate through-hole 24 with the hardened solder 26, and forms an expanded portion 27 on the exposed surface 41 a of the second metal plate 41.
  • the expanded portion 27 is provided in all the inspection through holes 43.
  • the solder 26 wets and spreads on the surface 31a of the first metal plate 31 at the peripheral portion of the conductive material inlet 32, and the engaging portion 29 is engaged with the surface 31a.
  • the application amount of the solder paste 28 is determined by factors such as the speed of the squeegee, the viscosity of the solder paste 28, and the diameter of the inspection through hole 43.
  • the diameter of the inspection through hole 43 is determined by the type of the solder paste 28 and the like. If the diameter of the inspection through hole 43 is too large, the solder will fall from the inspection through hole 43 without wetting and spreading the exposed surface 41a of the second metal plate 41, and if it is too small, the solder will not flow into the inspection through hole 43. .
  • the diameter of the inspection through hole 43 is preferably set to about 0.5 mm to 1.5 mm, for example.
  • Whether or not the conductive material inlet 32, the base material through hole 24, and the inspection through hole 43 are filled with the solder 26 can be determined depending on whether or not the expanded portion 27 is formed. When the expanded portion 27 is not visible, it can be seen that the inspection through-hole 43 is not sufficiently filled with the solder 26.
  • action of the wiring board 20 of this embodiment is demonstrated. Even if a force for peeling from the insulating substrate 22 acts on the first metal plate 31 and the second metal plate 41, the expanded portion 27 is engaged with the exposed surface 41 a of the second metal plate 41. At the same time, since the engaging portion 29 is engaged with the surface 31 a of the first metal plate 31, the first metal plate 31 and the second metal plate 41 are not easily separated from the insulating substrate 22. That is, the expanded portion 27 and the engaging portion 29 serve as anchors, and the first metal plate 31 and the second metal plate 41 are prevented from peeling from the insulating substrate 22.
  • An engaging portion 29 that engages with the first bent portion 33 is provided on the surface 31 a of the first metal plate 31, and the exposed surface 41 a of the second metal plate 41 is engaged with the second metal plate 41.
  • the first metal plate 31 is provided with a first bent portion 33, and the second metal plate 41 is provided with a second bent portion 42. For this reason, the distance between the first metal plate 31 and the second metal plate 41 can be easily shortened, and the resistance value of the solder 26 can be reduced. For this reason, there is little loss of electric power.
  • a plurality of solders 26 are provided. For this reason, it is possible to further suppress the first metal plate 31 and the second metal plate 41 from being peeled off from the insulating substrate 22 by increasing the engagement strength by the spread portion 27 at a plurality of locations.
  • the expanded portion 27 protrudes from the exposed surface 41a. For this reason, it can be determined by touch whether or not the expanded portion 27 is formed. Moreover, it can be visually recognized whether the expansion part 27 was formed.
  • the solder 26 Since the inspection through-hole 43 is filled with the solder 26, the solder 26 enters the fine irregularities of the inspection through-hole 43. Similarly, the solder 26 is filled in the conductive material inlet 32. Therefore, the bonding strength of the solder 26 to the first metal plate 31 and the second metal plate 41 is increased by the anchor effect of the solder 26 on the inner peripheral surface of the conductive material inlet 32 and the inner peripheral surface of the inspection through hole 43. It can raise and can suppress that the 1st metal plate 31 and the 2nd metal plate 41 peel from the insulated substrate 22 more.
  • the first metal plate 31 and the second metal plate 41 are peeled off from the insulating substrate 22 by providing the solder 26 in a narrow portion of the first metal plate 31 and the second metal plate 41.
  • the easy part can be reinforced with the solder 26 to further prevent the first metal plate 31 and the second metal plate 41 from being separated from the insulating substrate 22.
  • the expanded portion 27 is provided in all the inspection through holes 43. For this reason, it can suppress more that the 1st metal plate 31 and the 2nd metal plate 41 peel from the insulated substrate 22.
  • FIG. 1st metal plate 31 and the 2nd metal plate 41 peel from the insulated substrate 22.
  • the surface 31 a of the first metal plate 31 can be flat except for the first bent portion 33. For this reason, it is easy to mount the electronic component 21 on the first metal plate 31.
  • Four inspection through-holes 43 are formed for the conductive material inlet 32, and the solder 26 provided in each inspection through-hole 43 has an expanded portion 27. For this reason, it can suppress that the 2nd metal plate 41 peels with the some expansion part 27, and can suppress peeling of the 2nd metal plate 41 more.
  • a large current for example, 120 A
  • 120 A A large current
  • 120 A can be passed between the layers by the interlayer connection C1 that connects the first metal plate 31 and the second metal plate 41.
  • the wiring board 90 of this embodiment has solder 26 on the periphery of the insulating substrate 22.
  • the first metal plate 71 is provided with a first bent portion 72 that is bent so as to cover the periphery of the insulating substrate 22.
  • the first bent portion 72 is a non-adhesive portion that extends from the periphery of the insulating substrate 22 to a region that does not face the insulating substrate 22.
  • the second metal plate 81 is provided with a second bent portion 82 that bends so as to cover the periphery of the insulating substrate 22 together with the first bent portion 72.
  • An inspection through-hole 43 that penetrates in the thickness direction of the second metal plate 81 is provided at the base end of the second bent portion 82.
  • the solder 26 is filled between the first bent portion 72 and the second bent portion 82 and the inspection through hole 43, whereby the first bent portion 72 and the second bent portion 82 are filled. Further, the interlayer connection C2 is constituted by the solder 26.
  • the solder 26 has a spreading portion 27 that spreads outside the outer shape of the inspection through-hole 43 on the exposed surface 81 a of the second metal plate 81. Similarly, the solder 26 has an engaging portion 29 on the surface 71 a of the first metal plate 71.
  • the first bent portion 72 and the second bent portion 82 are connected to each other.
  • solder paste 28 is applied.
  • the subsequent steps are the same as those in the first embodiment, and are therefore omitted.
  • the bent portion only needs to be provided on either one of the first metal plate 31 and the second metal plate 41, and the first bent portion 33 and the second bent portion 42 It is sufficient that only one of them is provided.
  • the number of inspection through holes 43 may be changed. A single inspection through hole 43 may be provided in each solder 26. Only one solder 26 may be provided on the wiring boards 20 and 90.
  • the first metal plates 31 and 71 and the second metal plates 41 and 81 may be members made of other metals such as an aluminum plate.
  • the expansion part 27 of embodiment is a hemispherical protrusion which protrudes from the through-hole 43 for a test
  • the shape of the expansion part 27 is not limited.
  • the expanding portion 27 may be a protrusion having a flat top portion.
  • the spreading part 27 may be in the form of a thin film that spreads wet outside the opening edge of the inspection through-hole 43. The formation of the thin film-like spread portion can be judged visually rather than by touch.
  • the spreading portion 27 may be provided on at least one solder 26 among the plurality of solders 26. O Low melting point metals other than solder may be used as the conductive material.
  • the shape of the substrate through hole 24, the conductive material inlet 32, and the inspection through hole 43 may be any shape such as a circular shape or a square shape. -The engaging part 29 does not need to be provided.
  • the inspection through hole 43 may be formed by drilling, etching, or the like. O Gas generated during soldering can be removed from the inspection through hole 43.
  • the conductive material may be other than the solder 26. For example, silver paste may be used.
  • the interlayer connection portions C1 and C2 may be provided in a portion where the bonding strength is strong (a portion where the contact area of the metal plates 31 and 41 with the insulating substrate 22 is large).
  • the adhesive does not have to be applied, and an adhesive layer that becomes an adhesive by heating is formed in advance on the surface of the insulating substrate, and the adhesive layer may be liquefied by heating.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

L'invention porte sur une carte de câblage (20), comprenant un substrat isolant (22), une première couche métallique (31), une deuxième couche métallique (41) et un élément de liaison intercouche (C1). Chaque couche métallique comporte une partie recourbée (33, 42) pénétrant au moins partiellement dans un trou traversant (24) ménagé dans le substrat isolant (22). La deuxième couche métallique (41) comporte des trous traversants d'inspection (43). Une soudure (26) joignant les parties recourbées (33, 42) des couches métalliques respectives comporte des parties en empiètement (27) qui empiètent depuis les trous traversants d'inspection (43) dans leur direction radiale.
PCT/JP2014/081390 2013-12-19 2014-11-27 Carte de câblage WO2015093249A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013262695A JP5807670B2 (ja) 2013-12-19 2013-12-19 配線板
JP2013-262695 2013-12-19

Publications (1)

Publication Number Publication Date
WO2015093249A1 true WO2015093249A1 (fr) 2015-06-25

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PCT/JP2014/081390 WO2015093249A1 (fr) 2013-12-19 2014-11-27 Carte de câblage

Country Status (3)

Country Link
JP (1) JP5807670B2 (fr)
TW (1) TW201540145A (fr)
WO (1) WO2015093249A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3052855B2 (ja) * 1996-10-21 2000-06-19 日本電気株式会社 配線基板
JP2002026520A (ja) * 2000-07-06 2002-01-25 Matsushita Electric Ind Co Ltd 多層配線基板及びその製造方法
JP2004311786A (ja) * 2003-04-08 2004-11-04 Shinko Electric Ind Co Ltd 配線基板、多層配線基板、配線基板の製造方法及び多層配線基板の製造方法
JP2005032901A (ja) * 2003-07-10 2005-02-03 Fcm Kk 導電性シート
JP2009253080A (ja) * 2008-04-08 2009-10-29 Sumitomo Electric Ind Ltd プリント配線板
WO2012161218A1 (fr) * 2011-05-26 2012-11-29 株式会社 豊田自動織機 Carte de circuits et procédé de fabrication d'une carte de circuits

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3052855B2 (ja) * 1996-10-21 2000-06-19 日本電気株式会社 配線基板
JP2002026520A (ja) * 2000-07-06 2002-01-25 Matsushita Electric Ind Co Ltd 多層配線基板及びその製造方法
JP2004311786A (ja) * 2003-04-08 2004-11-04 Shinko Electric Ind Co Ltd 配線基板、多層配線基板、配線基板の製造方法及び多層配線基板の製造方法
JP2005032901A (ja) * 2003-07-10 2005-02-03 Fcm Kk 導電性シート
JP2009253080A (ja) * 2008-04-08 2009-10-29 Sumitomo Electric Ind Ltd プリント配線板
WO2012161218A1 (fr) * 2011-05-26 2012-11-29 株式会社 豊田自動織機 Carte de circuits et procédé de fabrication d'une carte de circuits

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JP2015119097A (ja) 2015-06-25
TW201540145A (zh) 2015-10-16
JP5807670B2 (ja) 2015-11-10

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