WO2015071969A1 - Large component mounting structure and large component mounting method - Google Patents
Large component mounting structure and large component mounting method Download PDFInfo
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- WO2015071969A1 WO2015071969A1 PCT/JP2013/080633 JP2013080633W WO2015071969A1 WO 2015071969 A1 WO2015071969 A1 WO 2015071969A1 JP 2013080633 W JP2013080633 W JP 2013080633W WO 2015071969 A1 WO2015071969 A1 WO 2015071969A1
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- solder
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- component
- large component
- transfer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Definitions
- the present invention relates to a large component mounting structure in which a large component is soldered to a substrate and a large component mounting method.
- a shield component for protecting an electronic component mounted on a substrate is mounted on the substrate.
- a solder paste is screen-printed on a predetermined portion of a land pattern on an upper surface of a substrate to form a solder print portion, and then the shield component bonding surface is superimposed on the solder print portion of the substrate.
- the large component is mounted on the substrate after alignment, and then the substrate on which the shield component is mounted is carried into a reflow apparatus, and the solder printing portion of the substrate is heated to thereby mount the shield component on the substrate. Reflow soldering is used.
- Patent Document 1 describes that a thin solder coat layer of about 10 to 30 ⁇ m is formed on the surface of the shield component in order to improve the wettability of the molten solder during the reflow process.
- Japanese Patent Application Laid-Open No. H10-228561 describes that a solder chip is mounted at a location where a mounting failure of a shield component may occur due to an insufficient amount of solder only by a solder printing portion of a substrate.
- the solder printing part for soldering the shield part to the substrate is formed by screen printing at the same time as the solder printing part for mounting the other mounting parts.
- the solder printing part to be soldered is also thinner. For this reason, due to the twisting and warping of a large shield component, a mounting failure of the shield component is likely to occur due to insufficient solder amount only at the solder printing portion of the substrate.
- Patent Document 1 the solder chip is mounted only at a portion where the mounting failure of the shield component may occur due to insufficient solder amount only by the solder printing portion of the substrate.
- Such a problem is a problem that occurs in the same manner even when a large component other than the shield component is soldered to the substrate.
- the problem to be solved by the present invention is to provide a large component mounting structure and a large component mounting method capable of realizing improvement in soldering reliability, reduction in manufacturing cost, and improvement in productivity when a large component is soldered to a substrate. That is.
- the present invention provides a large component mounting structure in which a large component is soldered to a substrate, and a solder formed by a printing method on a portion of the mounting surface of the substrate where the large component is soldered
- the printed portion and a solder transfer portion formed by a transfer method are reflow soldered to a portion of the large component to be soldered to the solder printed portion of the substrate.
- a solder transfer portion is formed by a transfer method in a portion of the large component to be soldered to the solder print portion of the substrate, the gap between the solder print portion of the substrate and the large component is transferred by solder transfer. It can be filled with the portion, both can be securely soldered, and the soldering reliability can be improved.
- the solder transfer portion is formed on the large component by the transfer method, a plurality of solder transfer portions to be formed on the large component can be formed efficiently and at the same time, manufacturing cost reduction and productivity improvement can be realized.
- the large component to which the present invention can be applied is not limited to the shield component that protects the electronic component mounted on the substrate, and may be a large component other than the shield component.
- Large shield parts are likely to be twisted and warped, and the gap between the printed circuit board and the solder printing portion tends to be large, so that the effect of applying the present invention is great.
- the solder transfer part it is preferable to form a convex part protruding downward in a part of the large part where the solder transfer part is formed. In this way, it is possible to reliably and easily form the solder transfer portion only on the convex portion of the large component by the transfer method, and the solder transfer portion can be easily formed with high accuracy.
- the large component mounting method of the present invention includes a printing process in which solder is printed on a portion of a mounting surface of a substrate where a large component is to be soldered to form a solder printing portion, and solder printing of the substrate in the large component A step of immersing the part to be joined in the solder in the transfer tank to form a solder transfer part in the part, and aligning the solder transfer part of the large component so as to overlap the solder printing part of the substrate A mounting step of mounting the large component on the substrate, and the substrate on which the large component is mounted is carried into a reflow apparatus, and the solder transfer portion and the solder printing portion are heated to attach the large component to the substrate. And a reflow process for reflow soldering.
- FIGS. 1A to 1D are process diagrams showing a mounting process of a shield component according to an embodiment of the present invention.
- FIG. 2 is a perspective view of the shield component.
- a solder printing unit 14 for soldering the shield component 11 is printed on the surface of the land 13 (conductor pattern) formed on the mounting surface of the substrate 12 by a printing method such as screen printing. It is formed with.
- the shield component 11 soldered on the substrate 12 is frame-shaped or protected to protect an electronic component (not shown) mounted on the substrate 12. It is formed in a cover shape (case shape).
- a plurality of convex portions 15 projecting downward are formed at predetermined intervals on the lower end surface of the shield component 11, and the downward projecting dimension of each convex portion 15 is constant. Therefore, when the shield component 11 is not twisted or warped, the lower end surface of each convex portion 15 is positioned in the same plane.
- a solder transfer portion 17 is formed on the lower end surface of each convex portion 15 by a transfer method (dip method).
- solder transfer portion 17 of the shield component 11 With the solder transfer portion 17 of the shield component 11 overlaid on the solder print portion 14 of the substrate 12, the solder transfer portion 17 and the solder print portion 14 are heated and reflowed, and the shield component 11 is reflow soldered to the substrate 12. ing.
- a suction surface portion 18 that is sucked by a suction nozzle (not shown) of a component mounting machine when the shield component 11 is mounted is formed at the position of the center of gravity of the shield component 11 or a position close thereto.
- a screen printing device (not shown) is arranged on the upstream side of the conveyance path of the substrate 12, and one or more component mounting machines (not shown) are arranged on the downstream side thereof.
- a reflow device (not shown) is disposed on the downstream side.
- Each component mounter is set with a component feeder (not shown) such as a tape feeder and a tray feeder for supplying electronic components to be mounted on the substrate 12, and the component mounter for mounting the shield component 11.
- a tray feeder for supplying the shield component 11, a component feeder (not shown) such as a tape feeder, and a transfer device (not shown) for forming the solder transfer portion 17 on the lower end surface of each convex portion 15 on the lower surface of the shield component 11. Z) is set.
- a board 12 put into a component mounting line is carried into a screen printing apparatus (not shown), and a shield part 11 on a mounting surface of the board 12 is soldered. 13, a printing process is performed in which solder paste (cream solder) is screen-printed to form the solder printing unit 14. In this printing process, a solder printing section (not shown) for mounting other mounted components is simultaneously screen-printed.
- solder paste cream solder
- the substrate 12 on which the solder printing unit 14 is formed in this way is conveyed to one or a plurality of component mounting machines arranged on the downstream side of the screen printing apparatus, and the mounted components are sequentially mounted on the substrate 12. .
- the suction surface portion 18 of the shield component 11 supplied by the component supply device is sucked by the suction nozzle (not shown) of the component mounter. Then, the shield component 11 is moved above the transfer tank (transfer table) of the transfer device, and the shield component 11 is lowered by the lowering operation of the suction nozzle, so that each convex portion 15 on the lower surface of the shield component 11 is moved.
- a transfer step of forming the solder transfer portion 17 is performed by immersing the solder in liquid or paste in the transfer tank and attaching the solder to the lower end surface of each convex portion 15.
- the shield component 11 on which the solder transfer portion 17 is formed is moved above the substrate 12 while being attracted to the suction nozzle, and the solder transfer portion 17 of the shield component 11 is moved.
- a mounting process for mounting the shield component 11 on the substrate 12 is performed by positioning so as to overlap the solder printing portion 14 of the substrate 12.
- the board 12 on which the shield component 11 is mounted is carried into a reflow apparatus (not shown), and the solder transfer portion 17 and the solder printing portion 14 are heated to thereby shield the shield.
- a reflow process for reflow soldering the component 11 to the substrate 12 is executed.
- the solder transfer portion 17 is formed by the transfer method on the convex portion 15 to be soldered to the solder print portion 14 of the substrate 12 in the shield component 11.
- the gap between the portion 14 and the convex portion 15 of the shield component 11 can be filled with the solder transfer portion 17, both can be securely soldered, and the soldering reliability can be improved.
- the solder transfer portion 17 is formed on the shield component 11 by the transfer method, the solder transfer portions 17 formed on the shield component 11 can be efficiently formed at a time, thereby reducing manufacturing costs and improving productivity. Can be realized.
- the convex portion 15 protruding downward is formed in the portion of the shield component 11 where the solder transfer portion 17 is to be formed, only the convex portion 15 of the shield component 11 is reliably transferred by the transfer method.
- the solder transfer portion 17 can be easily formed and the solder transfer portion 17 can be easily formed with high accuracy.
- the large component to which the present invention can be applied is not limited to the shield component as in the above embodiment, and may be a large component other than the shield component.
- the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention, such as changing the shape of the shield component (large component) or changing the number of solder transfer portions 17. Needless to say, this can be done.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
In the cases of soldering a shielded component (11), i.e., a large component, on a mounting surface of a substrate (12), firstly, a solder-printed section (14) is formed by printing a solder paste on a land (13) to which the shielded component is to be soldered, said land being a part of the mounting surface of the substrate, a protruding section (15) of the shielded component is immersed in a liquid-state or paste-state solder in a transfer tank, said protruding section being to be bonded to the solder-printed section of the substrate, and a solder-transferred section (17) is formed on a lower end surface of the protruding section. Then, the solder-transferred section of the shielded component is aligned such that the solder-transferred section overlaps the solder-printed section of the substrate, and the shielded component is mounted on the substrate. Then, the substrate having the shielded component mounted thereon is carried into a reflow apparatus, the solder-transferred section and the solder-printed section are heated, and the shielded component is soldered to the substrate by reflow soldering.
Description
本発明は、基板に大型部品を半田付けした大型部品実装構造及び大型部品実装方法に関する発明である。
The present invention relates to a large component mounting structure in which a large component is soldered to a substrate and a large component mounting method.
特許文献1(特開2010-272774号公報)に記載されているように、基板上に実装された電子部品を保護するシールド部品(シールドケース)を該基板に実装するようにしたものがある。この特許文献1のシールド部品の実装方法は、基板の上面のランドパターンの所定部位に半田ペーストをスクリーン印刷して半田印刷部を形成した後、シールド部品の接合面を基板の半田印刷部に重ね合わせるように位置合わせして該大型部品を該基板に搭載し、その後、シールド部品が搭載された基板をリフロー装置内に搬入して該基板の半田印刷部を加熱して該シールド部品を該基板にリフロー半田付けするようにしている。
As described in Japanese Patent Application Laid-Open No. 2010-272774, there is a device in which a shield component (shield case) for protecting an electronic component mounted on a substrate is mounted on the substrate. In this method of mounting a shield component of Patent Document 1, a solder paste is screen-printed on a predetermined portion of a land pattern on an upper surface of a substrate to form a solder print portion, and then the shield component bonding surface is superimposed on the solder print portion of the substrate. The large component is mounted on the substrate after alignment, and then the substrate on which the shield component is mounted is carried into a reflow apparatus, and the solder printing portion of the substrate is heated to thereby mount the shield component on the substrate. Reflow soldering is used.
更に、この特許文献1には、シールド部品の表面に、リフロー処理時の溶融半田の濡れ性を良くするために、10~30μm程度の薄い半田コート層を形成することが記載されている。また、この特許文献1には、基板の半田印刷部だけでは、半田量不足によってシールド部品の実装不良が発生する可能性のある箇所に、半田チップを実装することが記載されている。
Further, Patent Document 1 describes that a thin solder coat layer of about 10 to 30 μm is formed on the surface of the shield component in order to improve the wettability of the molten solder during the reflow process. Japanese Patent Application Laid-Open No. H10-228561 describes that a solder chip is mounted at a location where a mounting failure of a shield component may occur due to an insufficient amount of solder only by a solder printing portion of a substrate.
ところで、シールド部品を基板に半田付けする半田印刷部は、他の搭載部品を実装する半田印刷部と同時にスクリーン印刷されて形成されるため、近年の搭載部品の超小型化に伴い、シールド部品を半田付けする半田印刷部も薄くなっている。このため、大型のシールド部品のひねりや反り等により、基板の半田印刷部だけでは半田量不足によってシールド部品の実装不良が発生しやすい状況となっている。
By the way, the solder printing part for soldering the shield part to the substrate is formed by screen printing at the same time as the solder printing part for mounting the other mounting parts. The solder printing part to be soldered is also thinner. For this reason, due to the twisting and warping of a large shield component, a mounting failure of the shield component is likely to occur due to insufficient solder amount only at the solder printing portion of the substrate.
この場合、特許文献1では、基板の半田印刷部だけでは、半田量不足によってシールド部品の実装不良が発生する可能性のある箇所に、半田チップを実装するようになっているが、半田チップは、高価であり、コストアップする欠点がある。
In this case, in Patent Document 1, the solder chip is mounted only at a portion where the mounting failure of the shield component may occur due to insufficient solder amount only by the solder printing portion of the substrate. There are drawbacks that are expensive and costly.
また、シールド部品を半田付けする半田印刷部上にディスペンサ等で半田を追加塗布する方法もあるが、1枚の基板には、シールド部品を半田付けする半田印刷部が複数箇所に存在するため、複数箇所の半田印刷部上にディスペンサ等で半田を追加塗布する作業に時間がかかり、その分、サイクルタイムが長くなって生産性が低下する欠点がある。
In addition, there is a method of additionally applying solder with a dispenser or the like on the solder printing part for soldering the shield part, but since one board has solder printing parts for soldering the shield part at a plurality of locations, There is a drawback that it takes time to additionally apply solder on a plurality of solder printing portions with a dispenser or the like, and the cycle time becomes longer and the productivity is lowered accordingly.
このような課題は、シールド部品以外の大型部品を基板に半田付けする場合でも、同様に生じる課題である。
Such a problem is a problem that occurs in the same manner even when a large component other than the shield component is soldered to the substrate.
そこで、本発明が解決しようとする課題は、大型部品を基板に半田付けする場合の半田付け信頼性向上、製造コスト低減及び生産性向上を実現できる大型部品実装構造及び大型部品実装方法を提供することである。
Therefore, the problem to be solved by the present invention is to provide a large component mounting structure and a large component mounting method capable of realizing improvement in soldering reliability, reduction in manufacturing cost, and improvement in productivity when a large component is soldered to a substrate. That is.
上記課題を解決するために、本発明は、基板に大型部品を半田付けした大型部品実装構造において、前記基板の実装面のうちの前記大型部品を半田付けする部分に印刷法で形成された半田印刷部と、前記大型部品のうちの前記基板の半田印刷部に半田付けされる部分に転写法で形成された半田転写部とをリフロー半田付けしたことを特徴とするものである。この構成では、大型部品のうちの基板の半田印刷部に半田付けされる部分に転写法で半田転写部が形成されているため、基板の半田印刷部と大型部品との間の隙間を半田転写部で埋めることができて、両者を確実に半田付けすることができ、半田付け信頼性を向上できる。しかも、大型部品に転写法で半田転写部を形成するため、大型部品に形成する複数箇所の半田転写部を一括して能率良く形成することができ、製造コスト低減及び生産性向上を実現できる。
In order to solve the above problems, the present invention provides a large component mounting structure in which a large component is soldered to a substrate, and a solder formed by a printing method on a portion of the mounting surface of the substrate where the large component is soldered The printed portion and a solder transfer portion formed by a transfer method are reflow soldered to a portion of the large component to be soldered to the solder printed portion of the substrate. In this configuration, since a solder transfer portion is formed by a transfer method in a portion of the large component to be soldered to the solder print portion of the substrate, the gap between the solder print portion of the substrate and the large component is transferred by solder transfer. It can be filled with the portion, both can be securely soldered, and the soldering reliability can be improved. In addition, since the solder transfer portion is formed on the large component by the transfer method, a plurality of solder transfer portions to be formed on the large component can be formed efficiently and at the same time, manufacturing cost reduction and productivity improvement can be realized.
本発明を適用可能な大型部品は、基板上に実装された電子部品を保護するシールド部品に限定されず、シールド部品以外の大型部品であっても良い。大型のシールド部品は、ひねりや反りが生じやすく、基板の半田印刷部との間の隙間が大きくなる傾向があるため、本発明を適用する効果が大きい。
The large component to which the present invention can be applied is not limited to the shield component that protects the electronic component mounted on the substrate, and may be a large component other than the shield component. Large shield parts are likely to be twisted and warped, and the gap between the printed circuit board and the solder printing portion tends to be large, so that the effect of applying the present invention is great.
また、本発明は、大型部品のうちの半田転写部を形成する部分に、下向きに突出する凸状部を形成すると良い。このようにすれば、転写法で大型部品の凸状部のみに確実に且つ容易に半田転写部を形成でき、半田転写部を精度良く形成しやすくなる。
Further, in the present invention, it is preferable to form a convex part protruding downward in a part of the large part where the solder transfer part is formed. In this way, it is possible to reliably and easily form the solder transfer portion only on the convex portion of the large component by the transfer method, and the solder transfer portion can be easily formed with high accuracy.
本発明の大型部品実装方法は、基板の実装面のうちの大型部品を半田付けする部分に半田を印刷して半田印刷部を形成する印刷工程と、前記大型部品のうちの前記基板の半田印刷部に接合される部分を転写槽内の半田に浸して当該部分に半田転写部を形成する転写工程と、前記大型部品の半田転写部を前記基板の半田印刷部に重ね合わせるように位置合わせして該大型部品を該基板に搭載する搭載工程と、前記大型部品が搭載された前記基板をリフロー装置内に搬入して前記半田転写部及び前記半田印刷部を加熱して該大型部品を該基板にリフロー半田付けするリフロー工程とを実行するようにすれば良い。
The large component mounting method of the present invention includes a printing process in which solder is printed on a portion of a mounting surface of a substrate where a large component is to be soldered to form a solder printing portion, and solder printing of the substrate in the large component A step of immersing the part to be joined in the solder in the transfer tank to form a solder transfer part in the part, and aligning the solder transfer part of the large component so as to overlap the solder printing part of the substrate A mounting step of mounting the large component on the substrate, and the substrate on which the large component is mounted is carried into a reflow apparatus, and the solder transfer portion and the solder printing portion are heated to attach the large component to the substrate. And a reflow process for reflow soldering.
以下、本発明を実施するための形態をシールド部品の実装構造及び実装方法に適用して具体化した一実施例を説明する。
Hereinafter, an embodiment in which a mode for carrying out the present invention is applied to a mounting structure and a mounting method of a shield part will be described.
まず、シールド部品11の実装構造を説明する。
図1(d)に示すように、基板12の実装面に形成されたランド13(導体パターン)の表面には、シールド部品11を半田付けするための半田印刷部14がスクリーン印刷等の印刷法で形成されている。 First, the mounting structure of theshield component 11 will be described.
As shown in FIG. 1D, asolder printing unit 14 for soldering the shield component 11 is printed on the surface of the land 13 (conductor pattern) formed on the mounting surface of the substrate 12 by a printing method such as screen printing. It is formed with.
図1(d)に示すように、基板12の実装面に形成されたランド13(導体パターン)の表面には、シールド部品11を半田付けするための半田印刷部14がスクリーン印刷等の印刷法で形成されている。 First, the mounting structure of the
As shown in FIG. 1D, a
一方、図1(d)及び図2に示すように、基板12上に半田付けされるシールド部品11は、基板12上に実装された電子部品(図示せず)を保護するために枠状又はカバー状(ケース状)に形成されている。このシールド部品11の下端面には、下向きに突出する複数の凸状部15が所定の間隔で形成され、各凸状部15の下方への突出寸法が一定となっている。従って、シールド部品11にひねりや反りが無い状態では、各凸状部15の下端面が同一平面内に位置するようになっている。各凸状部15の下端面には、それぞれ半田転写部17が転写法(ディップ法)で形成されている。
On the other hand, as shown in FIGS. 1D and 2, the shield component 11 soldered on the substrate 12 is frame-shaped or protected to protect an electronic component (not shown) mounted on the substrate 12. It is formed in a cover shape (case shape). A plurality of convex portions 15 projecting downward are formed at predetermined intervals on the lower end surface of the shield component 11, and the downward projecting dimension of each convex portion 15 is constant. Therefore, when the shield component 11 is not twisted or warped, the lower end surface of each convex portion 15 is positioned in the same plane. A solder transfer portion 17 is formed on the lower end surface of each convex portion 15 by a transfer method (dip method).
シールド部品11の半田転写部17が基板12の半田印刷部14上に重ね合わされた状態で半田転写部17及び半田印刷部14が加熱されてリフローされ、シールド部品11が基板12にリフロー半田付けされている。
With the solder transfer portion 17 of the shield component 11 overlaid on the solder print portion 14 of the substrate 12, the solder transfer portion 17 and the solder print portion 14 are heated and reflowed, and the shield component 11 is reflow soldered to the substrate 12. ing.
尚、シールド部品11のうちの重心位置又はそれに近い位置には、該シールド部品11の実装時に部品実装機の吸着ノズル(図示せず)で吸着する吸着面部18が形成されている。
Note that a suction surface portion 18 that is sucked by a suction nozzle (not shown) of a component mounting machine when the shield component 11 is mounted is formed at the position of the center of gravity of the shield component 11 or a position close thereto.
次に、図1(a)乃至(d)を用いてシールド部品11の実装方法を説明する。
使用する部品実装ラインは、基板12の搬送経路の上流側にスクリーン印刷装置(図示せず)が配置され、その下流側に1台又は複数台の部品実装機(図示せず)が配置され、その下流側にリフロー装置(図示せず)が配置されている。各部品実装機には、それぞれ基板12に実装する電子部品を供給するテープフィーダ、トレイフィーダ等の部品供給装置(図示せず)がセットされ、更に、シールド部品11を実装する部品実装機には、シールド部品11を供給するトレイフィーダ、テープフィーダ等の部品供給装置(図示せず)と、シールド部品11下面の各凸状部15の下端面に半田転写部17を形成する転写装置(図示せず)がセットされている。 Next, a method for mounting theshield component 11 will be described with reference to FIGS.
In the component mounting line to be used, a screen printing device (not shown) is arranged on the upstream side of the conveyance path of thesubstrate 12, and one or more component mounting machines (not shown) are arranged on the downstream side thereof. A reflow device (not shown) is disposed on the downstream side. Each component mounter is set with a component feeder (not shown) such as a tape feeder and a tray feeder for supplying electronic components to be mounted on the substrate 12, and the component mounter for mounting the shield component 11. , A tray feeder for supplying the shield component 11, a component feeder (not shown) such as a tape feeder, and a transfer device (not shown) for forming the solder transfer portion 17 on the lower end surface of each convex portion 15 on the lower surface of the shield component 11. Z) is set.
使用する部品実装ラインは、基板12の搬送経路の上流側にスクリーン印刷装置(図示せず)が配置され、その下流側に1台又は複数台の部品実装機(図示せず)が配置され、その下流側にリフロー装置(図示せず)が配置されている。各部品実装機には、それぞれ基板12に実装する電子部品を供給するテープフィーダ、トレイフィーダ等の部品供給装置(図示せず)がセットされ、更に、シールド部品11を実装する部品実装機には、シールド部品11を供給するトレイフィーダ、テープフィーダ等の部品供給装置(図示せず)と、シールド部品11下面の各凸状部15の下端面に半田転写部17を形成する転写装置(図示せず)がセットされている。 Next, a method for mounting the
In the component mounting line to be used, a screen printing device (not shown) is arranged on the upstream side of the conveyance path of the
まず、図1(a)に示すように、部品実装ラインに投入した基板12をスクリーン印刷装置(図示せず)に搬入して、基板12の実装面のうちのシールド部品11を半田付けするランド13に、半田ペースト(クリーム半田)をスクリーン印刷して半田印刷部14を形成する印刷工程を実行する。この印刷工程では、他の搭載部品を実装する半田印刷部(図示せず)も同時にスクリーン印刷される。
First, as shown in FIG. 1A, a board 12 put into a component mounting line is carried into a screen printing apparatus (not shown), and a shield part 11 on a mounting surface of the board 12 is soldered. 13, a printing process is performed in which solder paste (cream solder) is screen-printed to form the solder printing unit 14. In this printing process, a solder printing section (not shown) for mounting other mounted components is simultaneously screen-printed.
このようにして半田印刷部14が形成された基板12は、スクリーン印刷装置の下流側に配置された1台又は複数台の部品実装機に搬送され、該基板12に搭載部品が順次実装される。
The substrate 12 on which the solder printing unit 14 is formed in this way is conveyed to one or a plurality of component mounting machines arranged on the downstream side of the screen printing apparatus, and the mounted components are sequentially mounted on the substrate 12. .
シールド部品11を実装する部品実装機では、図1(b)に示すように、部品供給装置により供給されるシールド部品11の吸着面部18を該部品実装機の吸着ノズル(図示せず)で吸着して、該シールド部品11を転写装置の転写槽(転写テーブル)の上方へ移動させ、該吸着ノズルの下降動作により該シールド部品11を下降させて該シールド部品11下面の各凸状部15を該転写槽内の液状又はペースト状の半田に浸して、各凸状部15の下端面に半田を付着させて、半田転写部17を形成する転写工程を実行する。
In the component mounter for mounting the shield component 11, as shown in FIG. 1B, the suction surface portion 18 of the shield component 11 supplied by the component supply device is sucked by the suction nozzle (not shown) of the component mounter. Then, the shield component 11 is moved above the transfer tank (transfer table) of the transfer device, and the shield component 11 is lowered by the lowering operation of the suction nozzle, so that each convex portion 15 on the lower surface of the shield component 11 is moved. A transfer step of forming the solder transfer portion 17 is performed by immersing the solder in liquid or paste in the transfer tank and attaching the solder to the lower end surface of each convex portion 15.
この後、図1(c)に示すように、半田転写部17が形成されたシールド部品11を吸着ノズルに吸着したまま基板12の上方へ移動させて、該シールド部品11の半田転写部17を基板12の半田印刷部14に重ね合わせるように位置合わせして該シールド部品11を該基板12に搭載する搭載工程を実行する。
Thereafter, as shown in FIG. 1C, the shield component 11 on which the solder transfer portion 17 is formed is moved above the substrate 12 while being attracted to the suction nozzle, and the solder transfer portion 17 of the shield component 11 is moved. A mounting process for mounting the shield component 11 on the substrate 12 is performed by positioning so as to overlap the solder printing portion 14 of the substrate 12.
この後、図1(d)に示すように、シールド部品11が搭載された基板12をリフロー装置(図示せず)内に搬入して半田転写部17及び半田印刷部14を加熱して該シールド部品11を該基板12にリフロー半田付けするリフロー工程を実行する。
Thereafter, as shown in FIG. 1 (d), the board 12 on which the shield component 11 is mounted is carried into a reflow apparatus (not shown), and the solder transfer portion 17 and the solder printing portion 14 are heated to thereby shield the shield. A reflow process for reflow soldering the component 11 to the substrate 12 is executed.
以上説明した本実施例では、シールド部品11のうちの基板12の半田印刷部14に半田付けされる凸状部15に転写法で半田転写部17が形成されているため、基板12の半田印刷部14とシールド部品11の凸状部15との間の隙間を半田転写部17で埋めることができて、両者を確実に半田付けすることができ、半田付け信頼性を向上できる。しかも、シールド部品11に転写法で半田転写部17を形成するため、シールド部品11に形成する複数箇所の半田転写部17を一括して能率良く形成することができ、製造コスト低減及び生産性向上を実現できる。
In the present embodiment described above, the solder transfer portion 17 is formed by the transfer method on the convex portion 15 to be soldered to the solder print portion 14 of the substrate 12 in the shield component 11. The gap between the portion 14 and the convex portion 15 of the shield component 11 can be filled with the solder transfer portion 17, both can be securely soldered, and the soldering reliability can be improved. In addition, since the solder transfer portion 17 is formed on the shield component 11 by the transfer method, the solder transfer portions 17 formed on the shield component 11 can be efficiently formed at a time, thereby reducing manufacturing costs and improving productivity. Can be realized.
しかも、本実施例では、シールド部品11のうちの半田転写部17を形成する部分に、下向きに突出する凸状部15を形成したので、転写法でシールド部品11の凸状部15のみに確実に且つ容易に半田転写部17を形成でき、半田転写部17を精度良く形成しやすくなる利点がある。
In addition, in this embodiment, since the convex portion 15 protruding downward is formed in the portion of the shield component 11 where the solder transfer portion 17 is to be formed, only the convex portion 15 of the shield component 11 is reliably transferred by the transfer method. In addition, there is an advantage that the solder transfer portion 17 can be easily formed and the solder transfer portion 17 can be easily formed with high accuracy.
尚、本発明を適用可能な大型部品は、上記実施例のようなシールド部品に限定されず、シールド部品以外の大型部品であっても良い。部品が大型になるほど、ひねりや反りが生じやすく、基板12の半田印刷部14との間の隙間が大きくなる傾向があるため、本発明を適用する効果が大きい。
The large component to which the present invention can be applied is not limited to the shield component as in the above embodiment, and may be a large component other than the shield component. The larger the component, the easier it is to twist and warp, and the gap between the printed circuit board 12 and the solder printing section 14 tends to increase, so the effect of applying the present invention is great.
その他、本発明は、上記実施例に限定されず、シールド部品(大型部品)の形状を変更したり、半田転写部17の個数を変更しても良い等、要旨を逸脱しない範囲内で種々変更して実施できることは言うまでもない。
In addition, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention, such as changing the shape of the shield component (large component) or changing the number of solder transfer portions 17. Needless to say, this can be done.
11…シールド部品(大型部品)、12…基板、13…ランド、14…半田印刷部、15…凸状部、17…半田転写部、18…吸着面部
11 ... Shield part (large part), 12 ... Substrate, 13 ... Land, 14 ... Solder printing part, 15 ... Convex part, 17 ... Solder transfer part, 18 ... Adsorption surface part
Claims (4)
- 基板に大型部品を半田付けした大型部品実装構造において、
前記基板の実装面のうちの前記大型部品を半田付けする部分に印刷法で形成された半田印刷部と、前記大型部品のうちの前記基板の半田印刷部に半田付けされる部分に転写法で形成された半田転写部とをリフロー半田付けしたことを特徴とする大型部品実装構造。 In a large component mounting structure in which large components are soldered to the board,
A solder printing portion formed by a printing method on a portion of the mounting surface of the substrate to which the large component is soldered, and a transfer method on a portion of the large component to be soldered to the solder printing portion of the substrate. A large component mounting structure characterized by reflow soldering the formed solder transfer section. - 前記大型部品は、基板上に実装された電子部品を保護するシールド部品であることを特徴とする請求項1に記載の大型部品実装構造。 2. The large component mounting structure according to claim 1, wherein the large component is a shield component that protects an electronic component mounted on a substrate.
- 前記大型部品のうちの前記半田転写部を形成する部分に、下向きに突出する凸状部が形成されていることを特徴とする請求項1又は2に記載の大型部品実装構造。 3. A large component mounting structure according to claim 1, wherein a convex portion projecting downward is formed in a portion of the large component where the solder transfer portion is formed.
- 基板に大型部品を半田付けする大型部品実装方法において、
前記基板の実装面のうちの前記大型部品を半田付けする部分に半田を印刷して半田印刷部を形成する印刷工程と、
前記大型部品のうちの前記基板の半田印刷部に接合される部分を転写槽内の半田に浸して当該部分に半田転写部を形成する転写工程と、
前記大型部品の半田転写部を前記基板の半田印刷部に重ね合わせるように位置合わせして該大型部品を該基板に搭載する搭載工程と、
前記大型部品が搭載された前記基板をリフロー装置内に搬入して前記半田転写部及び前記半田印刷部を加熱して該大型部品を該基板にリフロー半田付けするリフロー工程と
を含むことを特徴とする大型部品実装方法。 In the large component mounting method of soldering large components to the board,
A printing step of forming a solder printing portion by printing solder on a portion of the mounting surface of the substrate to which the large component is soldered;
A transfer step of immersing a portion of the large part to be bonded to the solder printing portion of the substrate in the solder in the transfer tank to form a solder transfer portion in the portion;
A mounting step of mounting the large component on the substrate by aligning the solder transfer portion of the large component with the solder printing portion of the substrate;
A reflow step of carrying in the reflow apparatus the substrate on which the large component is mounted and reflow soldering the large component to the substrate by heating the solder transfer unit and the solder printing unit. Large component mounting method.
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008072036A (en) * | 2006-09-15 | 2008-03-27 | Matsushita Electric Ind Co Ltd | Electronic component mounting apparatus and mounting method thereof |
JP2008072037A (en) * | 2006-09-15 | 2008-03-27 | Matsushita Electric Ind Co Ltd | Electronic component mounting system and mounting method thereof |
JP2010245561A (en) * | 2010-07-13 | 2010-10-28 | Fujitsu Media Device Kk | Method of manufacturing electronic component |
JP2012028432A (en) * | 2010-07-21 | 2012-02-09 | Murata Mfg Co Ltd | Electronic component |
JP2013197565A (en) * | 2012-03-23 | 2013-09-30 | Murata Mfg Co Ltd | Composite module and method of manufacturing the same |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3655743B2 (en) * | 1997-12-25 | 2005-06-02 | 松下電器産業株式会社 | Method of soldering electronic parts to film substrate |
JP2001102738A (en) * | 1999-09-30 | 2001-04-13 | Matsushita Electric Ind Co Ltd | Soldering method for surface-mounting electronic component |
-
2013
- 2013-11-13 JP JP2015547316A patent/JP6319812B2/en active Active
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008072036A (en) * | 2006-09-15 | 2008-03-27 | Matsushita Electric Ind Co Ltd | Electronic component mounting apparatus and mounting method thereof |
JP2008072037A (en) * | 2006-09-15 | 2008-03-27 | Matsushita Electric Ind Co Ltd | Electronic component mounting system and mounting method thereof |
JP2010245561A (en) * | 2010-07-13 | 2010-10-28 | Fujitsu Media Device Kk | Method of manufacturing electronic component |
JP2012028432A (en) * | 2010-07-21 | 2012-02-09 | Murata Mfg Co Ltd | Electronic component |
JP2013197565A (en) * | 2012-03-23 | 2013-09-30 | Murata Mfg Co Ltd | Composite module and method of manufacturing the same |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108012456A (en) * | 2018-01-19 | 2018-05-08 | 南京利景盛电子有限公司 | A kind of metal shaped cavity inner bottom surface print cream wards off process of tin |
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