CN108012456A - A kind of metal shaped cavity inner bottom surface print cream wards off process of tin - Google Patents

A kind of metal shaped cavity inner bottom surface print cream wards off process of tin Download PDF

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Publication number
CN108012456A
CN108012456A CN201810052734.2A CN201810052734A CN108012456A CN 108012456 A CN108012456 A CN 108012456A CN 201810052734 A CN201810052734 A CN 201810052734A CN 108012456 A CN108012456 A CN 108012456A
Authority
CN
China
Prior art keywords
tin
cream
transfer plate
shaped cavity
wards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810052734.2A
Other languages
Chinese (zh)
Inventor
徐晟晨
汪健
刘成
魏子陵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanjing Lijing Sheng Electronics Co Ltd
Original Assignee
Nanjing Lijing Sheng Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanjing Lijing Sheng Electronics Co Ltd filed Critical Nanjing Lijing Sheng Electronics Co Ltd
Priority to CN201810052734.2A priority Critical patent/CN108012456A/en
Publication of CN108012456A publication Critical patent/CN108012456A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3478Applying solder preforms; Transferring prefabricated solder patterns

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Display Devices Of Pinball Game Machines (AREA)

Abstract

The invention discloses a kind of metal shaped cavity inner bottom surface print cream to ward off tin method, it is characterised in that method is:Step 1: make transfer plate according to the flat shape for needing to ward off tin in metal shaped cavity;Step 2: cream is printed on transfer plate;Step 3: the transfer plate upset of printed cream is put into metal shaped cavity, flows back together together with housing, transfer plate is removed after coming out of the stove, complete cavity inner plane and ward off tin.Compared with prior art, the characteristics of present invention process:1st, tin is warded off suitable for bottom print cream in shaped cavity;2nd, production efficiency is high;3rd, print cream wards off that tin thickness is uniform, and uniformity is good;4th, tin amount as needed number, the increase and decrease of aperture area is carried out to web plate and obtains preferably printing cream and wards off tin amount;5th, to irregular face in cavity, print cream can be carried out using polylith transfer plate and wards off tin.

Description

A kind of metal shaped cavity inner bottom surface print cream wards off process of tin
Technical field
The present invention relates to one kind print cream to ward off tin method, and a kind of specific metal shaped cavity inner bottom surface print cream wards off tin method.
Background technology
As what electronic product maked rapid progress weeds out the old and bring forth the new, in order to solve heat dissipation problem, there is the big work(of various products The direct butt welding in bottom in rate device or pcb board meeting cavity.How to make butt welding fine, this just prints cream to metal shaped cavity inner bottom surface Ward off process of tin and propose new requirement.
Now current technique mainly has:1st, the spot printing soldering paste on cavity, 2, in PCB to face of weld upper web plate Printing Paste, 3rd, put with U-shaped mesh sheet and printed in the cavity.1st kind of method inefficiency;Second method is not suitable in shaped cavity Print cream is carried out, can't resolve cavity or bubble at high proportion that the welding assisted agent residuals after soldering paste melts are brought;The 3rd kind of U-shaped net of method Piece deformation is larger, and tension force is inadequate, it is difficult to the uniformity of control print cream amount.
The content of the invention
The technical problems to be solved by the invention are in view of the deficiency of the prior art, and to provide a kind of efficiency The Special-Shaped Surface being used in cavity high, that print cream amount uniformity is good carries out entirety and uniformly applies the method that tin cream wards off tin.
In order to solve the above technical problems, the present invention adopts the following technical scheme that:
A kind of metal shaped cavity inner bottom surface print cream wards off tin method, it is characterised in that method is:
Step 1: make transfer plate according to the flat shape for needing to ward off tin in metal shaped cavity;
Step 2: cream is printed on transfer plate;
Step 3: the transfer plate upset of printed cream is put into metal shaped cavity, flows back together with housing, removed after coming out of the stove together Transfer plate, completes cavity inner plane and wards off tin.
The material of the transfer plate is artificial compound stone or titanium alloy.
Transfer plate print cream is carried out using web plate.
The transfer plate cleans after each, then reuses next time.
The reflux technique of step 3 is:
4-13 warm area is arranged to, the temperature value of warm area is 130~300(℃).
Reflux technique is:
One warm area, two warm area three-temperature-zone four-temperature region five warm areas, six warm area, seven warm area, eight warm area
140±5 150±5 170±5 190±5 240±5 280±5 280±5 280±5(℃)
Mobile speed is 50 ± 10cm/min.
The reflux technique of step 3 is:
One warm area, two warm area three-temperature-zone four-temperature region five warm areas, six warm area, seven warm area, eight warm area
140 150 170 190 240 280 280 280(℃)
Mobile speed is 50 cm/min.
Compared with prior art, the characteristics of present invention process:1st, tin is warded off suitable for bottom print cream in shaped cavity;2nd, produce It is efficient;3rd, print cream wards off that tin thickness is uniform, and uniformity is good;4th, tin amount as needed number, aperture area is carried out to web plate Increase and decrease and obtain preferably printing cream and ward off tin amount;5th, to irregular face in cavity, print cream can be carried out using polylith transfer plate and is warded off Tin.
Brief description of the drawings
Fig. 1 is flow chart of the method for the present invention;
Fig. 2 is the structure diagram of the special-shaped metal cavity of embodiment one;
Fig. 3 is one pcb board of embodiment print cream schematic diagram;
Fig. 4 is the structure diagram of the special-shaped metal cavity of embodiment two;
Wherein:1st, metal outer wall;2nd, square protrusion;3rd, circular protrusion;4th, tin plane is warded off;5th, the square hollow-out part of transfer plate;6、 Transfer plate circle hollow-out part;7th, cream part is printed;8th, rest;9th, bolt hole;10th, metal grid is kept off.
Embodiment
Below in conjunction with the accompanying drawings, elaborate to the present invention:
Embodiment one
Name of product:Communication module one, structure are provided with square in the cavity as shown in Figure 1, including metal outer wall 1 and cavity 2 and circular protrusion 3 are protruded, the plane of the square protrusion 2 of removing and circular protrusion 3 is to ward off tin plane 4 in cavity.
Present invention process flow is as shown in Figure 1, include the following steps:
Step 1: making transfer plate according to the shape for warding off tin plane 4 of metal shaped cavity, the material of transfer plate uses artificial conjunction It is not easy to ward off the material of tin into stone or titanium alloy etc..The structure of transfer plate is as shown in figure 3, including square 5 He of hollow-out part of transfer plate Transfer plate circle hollow-out part 6, the square 5 corresponding direction protrusion 2 of hollow-out part of transfer plate, transfer plate circle hollow-out part 6 correspond to Circular protrusions 3.
Step 2: print cream is carried out using printing machine on transfer plate;
Step 3: the transfer plate upset of printed cream is put into metal shaped cavity, enters together in reflow ovens together with housing and return Stream, removes transfer plate after coming out of the stove, complete cavity bottom and ward off tin.
The reflux temperature of reflow ovens is set:
One warm area, two warm area three-temperature-zone four-temperature region five warm areas, six warm area, seven warm area, eight warm area
150 150 170 190 240 280 280 280(℃)
Mobile speed is 50 cm/min.
Embodiment two
Name of product:Communication module two, structure have two print cream as shown in figure 4, including metal outer wall 1 and inner cavity in interior intracavitary Part 7, one of them is located at the upper end of inner cavity, and 7 region of print cream part is provided with metal grid gear 10, another print cream part 7 are located at center in inner cavity.
Present invention process flow is as shown in Figure 1, include the following steps:
Step 1: making transfer plate according to the tin face shape of warding off of metal shaped cavity, the material of transfer plate uses artificial compound stone Or titanium alloy etc. is not easy to ward off the material of tin.
Step 2: print cream is carried out using printing machine on transfer plate;
Step 3: the transfer plate upset of printed cream is put into metal shaped cavity, enters together in reflow ovens together with housing and return Stream, removes transfer plate after coming out of the stove, complete cavity bottom and ward off tin.
The reflux temperature of reflow ovens is set:
One warm area, two warm area three-temperature-zone four-temperature region five warm areas, six warm area, seven warm area, eight warm area
140 140 160 180 210 250 260 260(℃)
Mobile speed is 45 cm/min.

Claims (7)

1. a kind of metal shaped cavity inner bottom surface print cream wards off tin method, it is characterised in that method is:
Step 1: make transfer plate according to the flat shape for needing to ward off tin in metal shaped cavity;
Step 2: cream is printed on transfer plate;
Step 3: the transfer plate upset of printed cream is put into metal shaped cavity, flows back together with housing, removed after coming out of the stove together Transfer plate, completes cavity inner plane and wards off tin.
2. metal shaped cavity inner bottom surface print cream according to claim 1 wards off tin method, it is characterised in that the transfer plate Material be artificial compound stone or titanium alloy.
3. metal shaped cavity inner bottom surface according to claim 1 print cream wards off tin method, it is characterised in that using web plate into Row transfer plate prints cream.
4. metal shaped cavity inner bottom surface print cream according to claim 1 wards off tin method, it is characterised in that the transfer plate Clean, then reuse next time after each.
5. tin method is warded off according to any metal shaped cavity inner bottom surface print cream of claim 1-4, it is characterised in that step Three reflux technique is:
4-13 warm area is arranged to, the temperature value of warm area is 130~300(℃).
6. metal shaped cavity inner bottom surface print cream according to claim 5 wards off tin method, it is characterised in that reflux technique For:
One warm area, two warm area three-temperature-zone four-temperature region five warm areas, six warm area, seven warm area, eight warm area
140±5 150±5 170±5 190±5 240±5 280±5 280±5 280±5(℃)
Mobile speed is 50 ± 10cm/min.
7. metal shaped cavity inner bottom surface print cream according to claim 6 wards off tin method, it is characterised in that reflux technique For:
One warm area, two warm area three-temperature-zone four-temperature region five warm areas, six warm area, seven warm area, eight warm area
1 40 150 170 190 240 280 280 280(℃)
Mobile speed is 50 cm/min.
CN201810052734.2A 2018-01-19 2018-01-19 A kind of metal shaped cavity inner bottom surface print cream wards off process of tin Pending CN108012456A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810052734.2A CN108012456A (en) 2018-01-19 2018-01-19 A kind of metal shaped cavity inner bottom surface print cream wards off process of tin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810052734.2A CN108012456A (en) 2018-01-19 2018-01-19 A kind of metal shaped cavity inner bottom surface print cream wards off process of tin

Publications (1)

Publication Number Publication Date
CN108012456A true CN108012456A (en) 2018-05-08

Family

ID=62050567

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810052734.2A Pending CN108012456A (en) 2018-01-19 2018-01-19 A kind of metal shaped cavity inner bottom surface print cream wards off process of tin

Country Status (1)

Country Link
CN (1) CN108012456A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111168183A (en) * 2020-01-06 2020-05-19 北京新雷能科技股份有限公司 Welding method for components in cavity product
CN111251706A (en) * 2020-01-16 2020-06-09 西安微电子技术研究所 Method for printing pre-tinning on inner surface of bottom of shell

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101292577A (en) * 2005-08-22 2008-10-22 恩德莱斯和豪瑟尔两合公司 Method for soldering smd components, printed circuit board and reflow soldering furnace therefor
CN102396297A (en) * 2009-02-13 2012-03-28 千住金属工业株式会社 Solder bump formation on a circuit board using a transfer sheet
US20130175330A1 (en) * 2012-01-05 2013-07-11 DunAn Microstaq, Inc Method For Making A Solder Joint
CN103920956A (en) * 2013-01-11 2014-07-16 无锡华润安盛科技有限公司 Reflow process welding method
WO2015071969A1 (en) * 2013-11-13 2015-05-21 富士機械製造株式会社 Large component mounting structure and large component mounting method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101292577A (en) * 2005-08-22 2008-10-22 恩德莱斯和豪瑟尔两合公司 Method for soldering smd components, printed circuit board and reflow soldering furnace therefor
CN102396297A (en) * 2009-02-13 2012-03-28 千住金属工业株式会社 Solder bump formation on a circuit board using a transfer sheet
US20130175330A1 (en) * 2012-01-05 2013-07-11 DunAn Microstaq, Inc Method For Making A Solder Joint
CN103920956A (en) * 2013-01-11 2014-07-16 无锡华润安盛科技有限公司 Reflow process welding method
WO2015071969A1 (en) * 2013-11-13 2015-05-21 富士機械製造株式会社 Large component mounting structure and large component mounting method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111168183A (en) * 2020-01-06 2020-05-19 北京新雷能科技股份有限公司 Welding method for components in cavity product
CN111251706A (en) * 2020-01-16 2020-06-09 西安微电子技术研究所 Method for printing pre-tinning on inner surface of bottom of shell

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Application publication date: 20180508